WO2022137219A1 - Method and device for tracking lot in semiconductor post-processing system - Google Patents

Method and device for tracking lot in semiconductor post-processing system Download PDF

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Publication number
WO2022137219A1
WO2022137219A1 PCT/IB2021/062322 IB2021062322W WO2022137219A1 WO 2022137219 A1 WO2022137219 A1 WO 2022137219A1 IB 2021062322 W IB2021062322 W IB 2021062322W WO 2022137219 A1 WO2022137219 A1 WO 2022137219A1
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Prior art keywords
lot
semiconductor
tracking
processing facility
server
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PCT/IB2021/062322
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French (fr)
Korean (ko)
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이금렬
배진우
장남일
이현철
남준식
이준형
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하나 마이크론㈜
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Publication of WO2022137219A1 publication Critical patent/WO2022137219A1/en

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    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Programme-control systems
    • G05B19/02—Programme-control systems electric
    • G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS], computer integrated manufacturing [CIM]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
    • Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]

Definitions

  • the present invention relates to a semiconductor post-processing system, and more particularly, to a LOT tracking method and apparatus in a semiconductor post-processing system.
  • the pre-process is the process of processing the semiconductor original plate (wafer), and the post-process is the operation of cutting and electrically connecting the wafer.
  • the post-process is an assembly process and is again divided into a front-end process and a back-end process.
  • the front-end process consists largely of cutting, gluing, and wire bonding.
  • a process including lead sealing, mold, and glob top method as a covering process), trimming forming, (solder plating), marking (marking information of product function, date of manufacture, manufacturer, etc.), testing, tape and reel, etc. is made of
  • the conventional semiconductor post-process has a problem in that LOT tracking for semiconductor process equipment is inefficient, and research on this is in progress, but it is insufficient.
  • the present invention was created to solve the above problems, and an object of the present invention is to provide a LOT tracking method and apparatus in a semiconductor post-processing system.
  • Another object of the present invention is to provide a method and apparatus for executing a process execution command of an article to a first semiconductor processing facility and a second semiconductor processing facility according to a LOT.
  • a method of operating a server for LOT tracking in a semiconductor post-processing system includes (a) measuring data from each of the first semiconductor process equipment and the second semiconductor process equipment. receiving; (b) determining a LOT for articles for the first semiconductor processing facility and the second semiconductor processing facility using the measurement data; and (c) executing a process execution command of the article to the first semiconductor processing facility and the second semiconductor processing facility according to the determined LOT.
  • the step (c) may include executing a process execution command of the article to the first semiconductor processing facility according to the determined LOT.
  • the step (c) comprises: splitting the LOT for the article using the measurement data; and executing a process execution command of the article to the second semiconductor processing facility according to the divided LOT.
  • the method of operating a server for tracking LOT in the semiconductor post-processing system may further include, after step (c), merging the divided LOT.
  • a server device for LOT tracking in a semiconductor post-processing system includes: a communication unit configured to receive measurement data from each of a first semiconductor process facility and a second semiconductor process facility; and determining a LOT for the articles for the first semiconductor processing equipment and the second semiconductor processing equipment by using the measurement data, and the articles for the first semiconductor processing equipment and the second semiconductor processing equipment according to the determined LOT It may include; a control unit for performing a process execution command of the.
  • control unit may perform a process execution command of the article to the first semiconductor processing facility according to the determined LOT.
  • control unit may split the LOT for the article by using the measurement data, and perform a process execution command of the article for the second semiconductor processing facility according to the divided LOT have.
  • the controller may merge the divided LOT.
  • an efficient LOT tracking process may be performed by executing a process execution command of an article for the first semiconductor processing facility and the second semiconductor processing facility according to the LOT.
  • FIG. 1 is a diagram illustrating a semiconductor post-processing system according to an embodiment of the present invention.
  • FIG. 2 is a view showing an example of arrangement of equipment in a line composed of heterogeneous parallel equipment according to an embodiment of the present invention.
  • FIG. 3 is a diagram illustrating an example of intelligent LOT tracking according to an embodiment of the present invention.
  • FIG. 4 is a diagram illustrating an example of tag data of intelligent LOT tracking according to an embodiment of the present invention.
  • FIG. 5 is a diagram illustrating a method of operating a server for LOT tracking in a semiconductor post-processing system according to an embodiment of the present invention.
  • FIG. 6 is a diagram illustrating a functional configuration of a server for LOT tracking in a semiconductor post-processing system according to an embodiment of the present invention.
  • FIG. 1 is a diagram illustrating a semiconductor post-processing system 100 according to an embodiment of the present invention.
  • the semiconductor post-processing system 100 may include at least one semiconductor process facility 110 and a server 120 .
  • the semiconductor processing facility 110 may perform a semiconductor post-process.
  • the semiconductor processing facility 110 may perform various semiconductor post-processes such as cutting, chip bonding, metal connection, molding, and testing.
  • the semiconductor processing facility 110 may include a wire bonding (WB) facility and a die attach (DA) facility, but is not limited thereto, and may include various semiconductor post-processing facilities. have.
  • WB wire bonding
  • DA die attach
  • the semiconductor process equipment 110 may collect equipment data for the semiconductor process equipment 110 and transmit the collected equipment data to the edge IoT gateway through a facility communication method.
  • the facility communication method may include a SEMI Equipment Communications Standards (SECS) communication method and a Generic Equipment Model (GEM) communication method.
  • SECS SEMI Equipment Communications Standards
  • GEM Generic Equipment Model
  • the edge IoT gateway may transmit the received facility data to the server 120 .
  • the semiconductor processing facility 110 may transmit log data to the server 120 through the edge IoT gateway.
  • the log data may include data such as product information, recipe, lot, and alarm of the semiconductor process facility 110 .
  • the server 120 may perform dynamic scheduling for process performance assignment of the semiconductor process facility 110 .
  • the server 120 may acquire process data and allocate a process execution command to the at least one semiconductor process facility 110 based on the process data.
  • the semiconductor process facility 110 to which the process execution command has been assigned is loaded with an article, that is, a material, and may produce a product by performing a semiconductor post-process using the article.
  • FIG. 2 is a view showing an example of arrangement of equipment in a line composed of heterogeneous parallel equipment according to an embodiment of the present invention.
  • a process for stacking articles having various characteristics may be performed to produce the MCP.
  • the transport of goods to the semiconductor process facility 110 is performed in units of lots, and the shape and quantity of LOTs for each process may be different.
  • Goods, ie, materials, put into the semiconductor process facility 110 are packaged in a wafer (w/f) state, that is, until they are made into products, Merge and Split of LOT are performed 4 times (eg, : BG, DA, WB, Mold process) or more can be performed.
  • Some products go through all the packaging processes once, and MCP products can be repeatedly performed by re-entering the DA (die attach)-WB (wire bonding) process section for multilayer lamination.
  • DA die attach
  • WB wire bonding
  • the server 120 may determine the input priority of LOT and allocate process equipment, and through this, may manage the production index.
  • the heterogeneous parallel equipment may include a first semiconductor process facility 210 and a second semiconductor process facility 215 .
  • the first semiconductor process facility 210 may include a DA facility
  • the second semiconductor process facility 215 may include a WB facility.
  • the server 120 may perform a WB process scheduling algorithm.
  • the process scheduling algorithm can maximize TA and equipment efficiency by considering heterogeneous parallel equipment, alternative machines, and fixture constraints.
  • the scheduling algorithm for reducing TA for semiconductor packaging lines and increasing facility utilization rate is the product stacking order, corresponding process time, remaining process time, remaining number of processes, first process input time, delivery date, and remaining window time (Window Time). ), the number of available facilities, and the progress of the Split Lot process.
  • the WB process when comparing the DA process and the WB process, takes a lot of time to process one lot compared to the DA process. In order to balance the work between the two processes, the lot is temporarily stored in the WB process. can be divided into . If the tasks of the divided lot cannot be finished at the same time, a delay may occur.
  • the server 120 may configure the scheduling procedure according to various priorities.
  • FIG. 3 is a diagram illustrating an example of intelligent LOT tracking according to an embodiment of the present invention.
  • the server 120 may perform a semiconductor post-process specialized start-end process.
  • the server 120 may process a lot start/end (Start/End) using a tracking tag attached to a magazine.
  • the start can be carried out when the first magazine of the lot is inserted. Ending can be done when the last magazine of the lot is removed. Lot termination can be performed after the magazine is ejected by receiving the EAP signal.
  • the server 120 may check the semiconductor process equipment 110 and reflect it as an error when it deviates from a set limit.
  • the server 120 may perform intelligent lot tracking product information processing.
  • the server 120 may input and process the Lot ID split in Run to the tracking of the magazine containing the PCB Lot.
  • the server 120 may automatically perform a start process on the MES computer when the magazine is put into Load and Unload.
  • the server 120 may perform the tracking of the magazine of unloading the Lot ID input to the tracking of the magazine containing the PCB.
  • the Lot ID entered in the tracking of the magazine containing the PCB can be deleted.
  • the lot can be automatically terminated in the entire MES.
  • Lot termination can be processed after the magazine is ejected by receiving a signal from EAP. If it exceeds the set limit by checking C/V, error can be processed.
  • the server 120 may configure a load port (Port) for intelligent lot tracking.
  • Port load port
  • the server 120 may instruct a magazine inserting operation for intelligent lot tracking.
  • the server 120 may configure a load port of the tracking tag information.
  • the server 120 may instruct the corresponding process magazine input through intelligent lot tracking load port communication.
  • the lot may recall the start history through the Delete History.
  • the server 120 visualizes the screen configuration to be processed by the user terminal, and may perform error processing when an empty magazine (no Lot ID on tracking) is loaded.
  • the server 120 may configure an unload port for intelligent lot tracking.
  • the server 120 may instruct a magazine inserting operation for intelligent lot tracking.
  • the server 120 may configure an unload port of the tracking tag information.
  • the server 120 may discharge the corresponding process magazine with intelligent lot-tracking unload port communication.
  • the loaded magazine is judged to be an abnormal magazine and removed, the lot can be treated as a starting state if one of the magazines has a problem for data standards. There may be finished magazines through the unload port.
  • the lot can recall the start history through the delete history, but when it is recalled, the number of jobs to be systematically processed and the number of jobs to be actually processed are it may not fit
  • FIG. 4 is a diagram illustrating an example of tag data 400 of intelligent LOT tracking according to an embodiment of the present invention.
  • the tag data 400 may include a UID, a magazine ID, and a LoT ID.
  • UID can be composed of 8 bytes unique value managed inside lot tracking.
  • Magazine ID can be configured by classifying magazines in the manufacturing site by type and type. For example, a magazine ID can use up to 20 bytes.
  • Lot ID can use up to 25 bytes and can include PCB Lot and Production Lot ID.
  • the tag data 400 can be used for identification when the tag is damaged by barcode printing the UID on the back or front of the action tag for intelligent lot tracking.
  • FIG. 5 is a diagram illustrating an operation method of the server 120 for LOT tracking in a semiconductor post-processing system according to an embodiment of the present invention.
  • measurement data is received from each of the first semiconductor process equipment 210 and the second semiconductor process equipment 215 .
  • the measurement data may include process data, equipment data, sensor data, and log data for each of the first semiconductor process equipment 210 and the second semiconductor process equipment 215 .
  • Step S503 is a step of determining a LOT for articles for the first semiconductor process equipment 210 and the second semiconductor process equipment 215 by using the measurement data.
  • Step S505 is a step of executing a process execution command of the article to the first semiconductor process equipment 210 and the second semiconductor process equipment 215 according to the LOT. That is, according to the LOT, the processing command of the article for the first semiconductor processing equipment 210 and the second semiconductor processing equipment 215 is transmitted to the first semiconductor processing equipment 210 and the second semiconductor processing equipment 215 . can do.
  • an input control command of the article to the first semiconductor process equipment 210 and the second semiconductor process equipment 215 may be performed according to the LOT.
  • an article processing execution command to the first semiconductor processing facility 210 may be performed according to the determined LOT.
  • the LOT of the article may be split using the measurement data, and a process execution command of the article may be performed to the second semiconductor processing facility 215 according to the divided LOT. Thereafter, the divided LOT may be merged.
  • FIG. 6 is a diagram illustrating a functional configuration of the server 120 for LOT tracking in a semiconductor post-processing system according to an embodiment of the present invention.
  • the server 120 may include a communication unit 610 , a control unit 620 , and a storage unit 630 .
  • the communication unit 610 may receive measurement data from each of the first semiconductor process equipment 210 and the second semiconductor process equipment 215 .
  • the communication unit 610 may include at least one of a wired communication module and a wireless communication module. All or part of the communication unit 610 may be referred to as a 'transmitter', 'receiver', or 'transceiver'.
  • the controller 620 determines a LOT for articles for the first semiconductor process equipment 210 and the second semiconductor process equipment 215 by using the measurement data, and the first semiconductor process equipment 210 according to the determined LOT. and a second semiconductor processing facility 215 to perform a process execution command of the article.
  • control unit 620 may include at least one processor or microprocessor, or may be a part of the processor. Also, the controller 620 may be referred to as a communication processor (CP). The controller 620 may control the operation of the server 120 according to various embodiments of the present disclosure.
  • CP communication processor
  • the storage unit 630 may store measurement data. In one embodiment, the storage unit 630 may store the LOT for the article.
  • the storage unit 630 may be configured as a volatile memory, a non-volatile memory, or a combination of a volatile memory and a non-volatile memory. In addition, the storage unit 630 may provide stored data according to the request of the control unit 620 .
  • the server 120 may include a communication unit 610 , a control unit 620 , and a storage unit 630 .
  • the server 120 is not essential to the configurations illustrated in FIG. 6 , and thus may be implemented to have more or fewer configurations than those illustrated in FIG. 6 .
  • At least one step may be omitted or added in each figure described herein, may be performed in the reverse order, or may be performed simultaneously.

Abstract

The present invention relates to a method and device for tracking a lot in a semiconductor post-processing system. An operating method of a server for tracking a lot in a semiconductor post-processing system according to one embodiment of the present invention may comprise the steps of: (a) receiving measurement data from each of a first semiconductor processing facility and a second semiconductor processing facility; (b) determining a lot for an article with respect to the first semiconductor processing facility and the second semiconductor processing facility by using the measurement data; and (c) executing a process execution command of the article with respect to the first semiconductor processing facility and the second semiconductor processing facility according to the determined lot.

Description

반도체 후공정 시스템에서 LOT 추적 방법 및 장치LOT tracking method and device in semiconductor post-processing system
본 발명은 반도체 후공정 시스템에 관한 것으로, 더욱 상세하게는 반도체 후공정 시스템에서 LOT 추적 방법 및 장치에 관한 것이다.The present invention relates to a semiconductor post-processing system, and more particularly, to a LOT tracking method and apparatus in a semiconductor post-processing system.
일반적으로, 반도체를 만들기 위해서는 여러 공정 과정을 거쳐야 하는데, 크게는 전공정과 후공정으로 나뉜다.In general, in order to make a semiconductor, it is necessary to go through several processes, and it is largely divided into a pre-process and a post-process.
전공정은 반도체 원판(웨이퍼)을 가공하는 과정이고 후공정은 웨이퍼를 절단하고 전기적으로 연결하는 작업이다.The pre-process is the process of processing the semiconductor original plate (wafer), and the post-process is the operation of cutting and electrically connecting the wafer.
후공정은 조립공정으로서 다시 프론트엔드 공정과 백엔드 공정으로 나뉘는데, 프론트엔드 공정은 크게는 절단, 접착, 와이어 결합 등으로 이루어지며, 백엔드 공정은 인캡슐레이션(와이어 본딩된 반도체를 보호하기 위해 뚜껑을 씌우는 공정으로서 리드 실링, 몰드, 글롭 탑 방식이 있음), 트리밍 포밍, (솔더플레이팅), 마킹(제품의 기능, 제조연월일, 제조자 등의 정보 마킹), 테스트, 테이프 엔 릴 등을 포함하는 공정으로 이루어진다.The post-process is an assembly process and is again divided into a front-end process and a back-end process. The front-end process consists largely of cutting, gluing, and wire bonding. A process including lead sealing, mold, and glob top method as a covering process), trimming forming, (solder plating), marking (marking information of product function, date of manufacture, manufacturer, etc.), testing, tape and reel, etc. is made of
다만, 종래의 반도체 후공정은 반도체 공정 설비에 대한 LOT 추적이 비효율적인 문제점이 있어, 이에 대한 연구가 진행되고 있으나 미흡한 실정이다.However, the conventional semiconductor post-process has a problem in that LOT tracking for semiconductor process equipment is inefficient, and research on this is in progress, but it is insufficient.
본 발명은 전술한 문제점을 해결하기 위하여 창출된 것으로, 반도체 후공정 시스템에서 LOT 추적 방법 및 장치를 제공하는 것을 그 목적으로 한다.The present invention was created to solve the above problems, and an object of the present invention is to provide a LOT tracking method and apparatus in a semiconductor post-processing system.
또한, 본 발명은, LOT에 따라 제1 반도체 공정 설비 및 제2 반도체 공정 설비에 대한 물품의 공정 수행 명령을 수행하기 위한 방법 및 장치를 제공하는 것을 그 목적으로 한다.Another object of the present invention is to provide a method and apparatus for executing a process execution command of an article to a first semiconductor processing facility and a second semiconductor processing facility according to a LOT.
본 발명의 목적들은 이상에서 언급한 목적들로 제한되지 않으며, 언급되지 않은 또 다른 목적들은 아래의 기재로부터 명확하게 이해될 수 있을 것이다.Objects of the present invention are not limited to the objects mentioned above, and other objects not mentioned will be clearly understood from the description below.
상기한 목적들을 달성하기 위하여, 본 발명의 일 실시예에 따른 반도체 후공정 시스템에서 LOT 추적을 위한 서버의 동작 방법은, (a) 제1 반도체 공정 설비 및 제2 반도체 공정 설비 각각으로부터 측정 데이터를 수신하는 단계; (b) 상기 측정 데이터를 이용하여 상기 제1 반도체 공정 설비 및 제2 반도체 공정 설비에 대한 물품에 대한 LOT를 결정하는 단계; 및 (c) 상기 결정된 LOT에 따라 상기 제1 반도체 공정 설비 및 제2 반도체 공정 설비에 대한 상기 물품의 공정 수행 명령을 수행하는 단계;를 포함할 수 있다.In order to achieve the above objects, a method of operating a server for LOT tracking in a semiconductor post-processing system according to an embodiment of the present invention includes (a) measuring data from each of the first semiconductor process equipment and the second semiconductor process equipment. receiving; (b) determining a LOT for articles for the first semiconductor processing facility and the second semiconductor processing facility using the measurement data; and (c) executing a process execution command of the article to the first semiconductor processing facility and the second semiconductor processing facility according to the determined LOT.
실시예에서, 상기 (c) 단계는, 상기 결정된 LOT에 따라 상기 제1 반도체 공정 설비에 대한 상기 물품의 공정 수행 명령을 수행하는 단계;를 포함할 수 있다. In an embodiment, the step (c) may include executing a process execution command of the article to the first semiconductor processing facility according to the determined LOT.
실시예에서, 상기 (c) 단계는, 상기 측정 데이터를 이용하여 상기 물품에 대한 LOT를 분할(Split)하는 단계; 및 상기 분할된 LOT에 따라 상기 제2 반도체 공정 설비에 대한 상기 물품의 공정 수행 명령을 수행하는 단계;를 포함할 수 있다. In an embodiment, the step (c) comprises: splitting the LOT for the article using the measurement data; and executing a process execution command of the article to the second semiconductor processing facility according to the divided LOT.
실시예에서, 상기 반도체 후공정 시스템에서 LOT 추적을 위한 서버의 동작 방법은, 상기 (c) 단계 이후에, 상기 분할된 LOT을 병합(Merge)하는 단계;를 더 포함할 수 있다. In an embodiment, the method of operating a server for tracking LOT in the semiconductor post-processing system may further include, after step (c), merging the divided LOT.
실시예에서, 반도체 후공정 시스템에서 LOT 추적을 위한 서버 장치는, 제1 반도체 공정 설비 및 제2 반도체 공정 설비 각각으로부터 측정 데이터를 수신하는 통신부; 및 상기 측정 데이터를 이용하여 상기 제1 반도체 공정 설비 및 제2 반도체 공정 설비에 대한 물품에 대한 LOT를 결정하고, 상기 결정된 LOT에 따라 상기 제1 반도체 공정 설비 및 제2 반도체 공정 설비에 대한 상기 물품의 공정 수행 명령을 수행하는 제어부;를 포함할 수 있다. In an embodiment, a server device for LOT tracking in a semiconductor post-processing system includes: a communication unit configured to receive measurement data from each of a first semiconductor process facility and a second semiconductor process facility; and determining a LOT for the articles for the first semiconductor processing equipment and the second semiconductor processing equipment by using the measurement data, and the articles for the first semiconductor processing equipment and the second semiconductor processing equipment according to the determined LOT It may include; a control unit for performing a process execution command of the.
실시예에서, 상기 제어부는, 상기 결정된 LOT에 따라 상기 제1 반도체 공정 설비에 대한 상기 물품의 공정 수행 명령을 수행할 수 있다. In an embodiment, the control unit may perform a process execution command of the article to the first semiconductor processing facility according to the determined LOT.
실시예에서, 상기 제어부는, 상기 측정 데이터를 이용하여 상기 물품에 대한 LOT를 분할(Split)하고, 상기 분할된 LOT에 따라 상기 제2 반도체 공정 설비에 대한 상기 물품의 공정 수행 명령을 수행할 수 있다. In an embodiment, the control unit may split the LOT for the article by using the measurement data, and perform a process execution command of the article for the second semiconductor processing facility according to the divided LOT have.
실시예에서, 상기 제어부는, 상기 분할된 LOT을 병합(Merge)할 수 있다. In an embodiment, the controller may merge the divided LOT.
상기한 목적들을 달성하기 위한 구체적인 사항들은 첨부된 도면과 함께 상세하게 후술될 실시예들을 참조하면 명확해질 것이다.Specific details for achieving the above objects will become clear with reference to the embodiments to be described in detail below in conjunction with the accompanying drawings.
그러나, 본 발명은 이하에서 개시되는 실시예들에 한정되는 것이 아니라, 서로 다른 다양한 형태로 구성될 수 있으며, 본 발명의 개시가 완전하도록 하고 본 발명이 속하는 기술 분야에서 통상의 지식을 가진 자(이하, "통상의 기술자")에게 발명의 범주를 완전하게 알려주기 위해서 제공되는 것이다.However, the present invention is not limited to the embodiments disclosed below, it may be configured in various different forms, and those of ordinary skill in the art to which the present invention belongs ( Hereinafter, "a person skilled in the art") is provided to fully inform the scope of the invention.
본 발명의 일 실시예에 의하면, LOT에 따라 제1 반도체 공정 설비 및 제2 반도체 공정 설비에 대한 물품의 공정 수행 명령을 수행함으로써, 효율적인 LOT 추적 프로세스를 수행할 수 있다. According to an embodiment of the present invention, an efficient LOT tracking process may be performed by executing a process execution command of an article for the first semiconductor processing facility and the second semiconductor processing facility according to the LOT.
본 발명의 효과들은 상술된 효과들로 제한되지 않으며, 본 발명의 기술적 특징들에 의하여 기대되는 잠정적인 효과들은 아래의 기재로부터 명확하게 이해될 수 있을 것이다.Effects of the present invention are not limited to the above-described effects, and potential effects expected by the technical features of the present invention will be clearly understood from the following description.
도 1은 본 발명의 일 실시예에 따른 반도체 후공정 시스템을 도시한 도면이다.1 is a diagram illustrating a semiconductor post-processing system according to an embodiment of the present invention.
도 2는 본 발명의 일 실시예에 따른 이기종 병렬장비로 구성된 라인에서의 설비 배치의 예를 도시한 도면이다.2 is a view showing an example of arrangement of equipment in a line composed of heterogeneous parallel equipment according to an embodiment of the present invention.
도 3은 본 발명의 일 실시예에 따른 지능형 LOT 추적의 예를 도시한 도면이다.3 is a diagram illustrating an example of intelligent LOT tracking according to an embodiment of the present invention.
도 4는 본 발명의 일 실시예에 따른 지능형 LOT 추적의 태그 데이터의 예를 도시한 도면이다.4 is a diagram illustrating an example of tag data of intelligent LOT tracking according to an embodiment of the present invention.
도 5는 본 발명의 일 실시예에 따른 반도체 후공정 시스템에서 LOT 추적을 위한 서버의 동작 방법을 도시한 도면이다.5 is a diagram illustrating a method of operating a server for LOT tracking in a semiconductor post-processing system according to an embodiment of the present invention.
도 6은 본 발명의 일 실시예에 따른 반도체 후공정 시스템에서 LOT 추적을 위한 서버의 기능적 구성을 도시한 도면이다.6 is a diagram illustrating a functional configuration of a server for LOT tracking in a semiconductor post-processing system according to an embodiment of the present invention.
본 발명은 다양한 변경을 가할 수 있고, 여러 가지 실시예들을 가질 수 있는 바, 특정 실시예들을 도면에 예시하고 이를 상세히 설명하고자 한다. Since the present invention can have various changes and can have various embodiments, specific embodiments are illustrated in the drawings and described in detail.
청구범위에 개시된 발명의 다양한 특징들은 도면 및 상세한 설명을 고려하여 더 잘 이해될 수 있을 것이다. 명세서에 개시된 장치, 방법, 제법 및 다양한 실시예들은 예시를 위해서 제공되는 것이다. 개시된 구조 및 기능상의 특징들은 통상의 기술자로 하여금 다양한 실시예들을 구체적으로 실시할 수 있도록 하기 위한 것이고, 발명의 범위를 제한하기 위한 것이 아니다. 개시된 용어 및 문장들은 개시된 발명의 다양한 특징들을 이해하기 쉽게 설명하기 위한 것이고, 발명의 범위를 제한하기 위한 것이 아니다.Various features of the invention disclosed in the claims may be better understood upon consideration of the drawings and detailed description. The apparatus, methods, preparations, and various embodiments disclosed herein are provided for purposes of illustration. The disclosed structural and functional features are intended to enable those skilled in the art to specifically practice the various embodiments, and are not intended to limit the scope of the invention. The disclosed terms and sentences are for the purpose of easy-to-understand descriptions of various features of the disclosed invention, and are not intended to limit the scope of the invention.
본 발명을 설명함에 있어서, 관련된 공지기술에 대한 구체적인 설명이 본 발명의 요지를 불필요하게 흐릴 수 있다고 판단되는 경우, 그 상세한 설명을 생략한다.In describing the present invention, if it is determined that a detailed description of a related known technology may unnecessarily obscure the gist of the present invention, the detailed description thereof will be omitted.
이하, 본 발명의 일 실시예에 따른 반도체 후공정 시스템에서 LOT 추적 방법 및 장치를 설명한다.Hereinafter, a LOT tracking method and apparatus in a semiconductor post-processing system according to an embodiment of the present invention will be described.
도 1은 본 발명의 일 실시예에 따른 반도체 후공정 시스템(100)을 도시한 도면이다.1 is a diagram illustrating a semiconductor post-processing system 100 according to an embodiment of the present invention.
도 1을 참고하면, 반도체 후공정 시스템(100)은 적어도 하나의 반도체 공정 설비(110) 및 서버(120)를 포함할 수 있다. Referring to FIG. 1 , the semiconductor post-processing system 100 may include at least one semiconductor process facility 110 and a server 120 .
반도체 공정 설비(110)는 반도체 후공정을 수행할 수 있다. 예를 들어, 반도체 공정 설비(110)는 절단, 칩접착, 금속 연결, 성형, 테스트 등의 다양한 반도체 후공정을 수행할 수 있다. The semiconductor processing facility 110 may perform a semiconductor post-process. For example, the semiconductor processing facility 110 may perform various semiconductor post-processes such as cutting, chip bonding, metal connection, molding, and testing.
예를 들어, 반도체 공정 설비(110)는 와이어 본딩(wire bonding, WB) 설비 및 다이 어태치(die attach, DA) 설비를 포함할 수 있으나, 이에 제한되지 않고 다양한 반도체 후공정 설비를 포함할 수 있다. For example, the semiconductor processing facility 110 may include a wire bonding (WB) facility and a die attach (DA) facility, but is not limited thereto, and may include various semiconductor post-processing facilities. have.
또한, 반도체 공정 설비(110)는 반도체 공정 설비(110)에 대한 설비 데이터를 수집하고, 수집된 설비 데이터를 설비 통신 방식을 통해 엣지 IoT 게이트웨이에게 송신할 수 있다. In addition, the semiconductor process equipment 110 may collect equipment data for the semiconductor process equipment 110 and transmit the collected equipment data to the edge IoT gateway through a facility communication method.
예를 들어, 설비 통신 방식은 SECS(SEMI Equipment Communications Standards) 통신 방식 및 GEM(Generic Equipment Model) 통신 방식을 포함할 수 있다. For example, the facility communication method may include a SEMI Equipment Communications Standards (SECS) communication method and a Generic Equipment Model (GEM) communication method.
엣지 IoT 게이트웨이는 전달받은 설비 데이터를 서버(120)에게 송신할 수 있다. The edge IoT gateway may transmit the received facility data to the server 120 .
일 실시예에서, 반도체 공정 설비(110)는 엣지 IoT 게이트웨이를 통해 로그 데이터를 서버(120)에게 송신할 수 있다. 예를 들어, 로그데이터는 반도체 공정 설비(110)의 제품정보, 레시피, 롯트(Lot), 알람(Alarm) 등의 데이터를 포함할 수 있다. In an embodiment, the semiconductor processing facility 110 may transmit log data to the server 120 through the edge IoT gateway. For example, the log data may include data such as product information, recipe, lot, and alarm of the semiconductor process facility 110 .
서버(120)는 반도체 공정 설비(110)의 공정 수행 할당을 위한 동적 스케줄링을 수행할 수 있다. 예를 들어, 서버(120)는 공정 데이터를 획득하고, 공정 데이터에 기반하여 적어도 하나의 반도체 공정 설비(110)에게 공정 수행 명령을 할당할 수 있다. The server 120 may perform dynamic scheduling for process performance assignment of the semiconductor process facility 110 . For example, the server 120 may acquire process data and allocate a process execution command to the at least one semiconductor process facility 110 based on the process data.
공정 수행 명령을 할당 받은 반도체 공정 설비(110)는 물품, 즉, 자재가 로딩(loading)되며, 물품을 이용하여 반도체 후공정을 수행하여 제품을 생산할 수 있다. The semiconductor process facility 110 to which the process execution command has been assigned is loaded with an article, that is, a material, and may produce a product by performing a semiconductor post-process using the article.
도 2는 본 발명의 일 실시예에 따른 이기종 병렬장비로 구성된 라인에서의 설비 배치의 예를 도시한 도면이다.2 is a view showing an example of arrangement of equipment in a line composed of heterogeneous parallel equipment according to an embodiment of the present invention.
도 2를 참고하면, 패키징 제품(Multi-Chip Package, MCP) 및 제조 측면에서, MCP를 생산하기 위해서 다양한 특성의 물품(예: 칩(Chip))을 적층하기 위한 공정이 수행될 수 있다. Referring to FIG. 2 , in terms of a packaging product (Multi-Chip Package, MCP) and manufacturing, a process for stacking articles (eg, chips) having various characteristics may be performed to produce the MCP.
이 경우, 반도체 공정 설비(110)로의 물품의 운반은 로트(LOT) 단위로 수행되며, 공정별 LOT의 형태 및 운반 수량이 다를 수 있다. In this case, the transport of goods to the semiconductor process facility 110 is performed in units of lots, and the shape and quantity of LOTs for each process may be different.
반도체 공정 설비(110)에 투입된 물품, 즉, 자재는 웨이퍼(w/f) 상태에서 패키징(Package), 즉, 제품으로 만들어지기까지 LOT의 병합(Merge)과 분할(Split)이 4회(예: BG, DA, WB, Mold 공정) 이상 수행될 수 있다.Goods, ie, materials, put into the semiconductor process facility 110 are packaged in a wafer (w/f) state, that is, until they are made into products, Merge and Split of LOT are performed 4 times (eg, : BG, DA, WB, Mold process) or more can be performed.
일부 제품은 패키징의 모든 공정을 한 번씩 거치며, MCP 제품은 다층 적층을 위해 DA(die attach)-WB(wire bonding) 공정구간에 재투입(Re-enter)되어 반복 수행될 수 있다. Some products go through all the packaging processes once, and MCP products can be repeatedly performed by re-entering the DA (die attach)-WB (wire bonding) process section for multilayer lamination.
공정에서의 재투입과 이기종 병렬장비를 고려하는 경우, 서버(120)는 LOT의 투입 우선순위를 결정하고 공정 설비를 배정할 수 있으며, 이를 통해, 생산지표를 관리할 수 있다. When re-input in the process and heterogeneous parallel equipment are considered, the server 120 may determine the input priority of LOT and allocate process equipment, and through this, may manage the production index.
여기서, 이기종 병렬장비는 제1 반도체 공정 설비(210) 및 제2 반도체 공정 설비(215)를 포함할 수 있다. 예를 들어, 제1 반도체 공정 설비(210)는 DA 설비를 포함하고, 제2 반도체 공정 설비(215)는 WB 설비를 포함할 수 있다. Here, the heterogeneous parallel equipment may include a first semiconductor process facility 210 and a second semiconductor process facility 215 . For example, the first semiconductor process facility 210 may include a DA facility, and the second semiconductor process facility 215 may include a WB facility.
일 실시예에서, 서버(120)는 WB 공정 스케줄링 알고리즘을 수행할 수 있다. In one embodiment, the server 120 may perform a WB process scheduling algorithm.
예를 들어, 공정 스케줄링 알고리즘은 이기종 병렬장비, 대체기계, 치공구 제약 등을 고려하여 TA, 장비효율을 극대화 시킬 수 있다. For example, the process scheduling algorithm can maximize TA and equipment efficiency by considering heterogeneous parallel equipment, alternative machines, and fixture constraints.
예를 들어, 반도체 패키징 라인의 TA 감소와 설비 가동률 증가를 위한 스케줄링 알고리즘은 제품의 적층 차수, 해당 공정 시간, 잔여 공정 시간, 잔여 공정 수, 첫 공정 투입 시간, 납기 일자, 잔여 윈도우 시간(Window Time), 가용 설비 수, 스플릿(Split) Lot 공정 진척 등에 기반하여 수행될 수 있다. For example, the scheduling algorithm for reducing TA for semiconductor packaging lines and increasing facility utilization rate is the product stacking order, corresponding process time, remaining process time, remaining number of processes, first process input time, delivery date, and remaining window time (Window Time). ), the number of available facilities, and the progress of the Split Lot process.
DA-WB 공정 라인에서, WB 공정에 투입되기 위해서는 모든 Lot는 사전 공정으로 플라즈마 공정을 거치게 되는데, 플라즈마 공정을 통한 제품의 세척(Clean) 상태가 유지되는 시간 (Window Time) 내에 물품이 WB 공정에 투입되지 못하면 다시 플라즈마 공정을 수행해야 하는 낭비가 발생할 수 있다.In the DA-WB process line, in order to be put into the WB process, all lots are subjected to a plasma process in advance. If it is not input, waste of having to perform the plasma process again may occur.
일 실시예에서, DA 공정과 WB 공정을 비교했을 때, 하나의 Lot를 가공하는데 걸리는 시간은 DA 공정에 비교하여 WB 공정이 많이 소요되므로, 두 공정 간 작업의 균형을 위해서 WB 공정에서는 Lot가 일시적으로 분할되어 투입될 수 있다. 분할된 Lot의 작업이 동시에 끝나지 못하는 경우 지연시간이 발생할 수 있다. In one embodiment, when comparing the DA process and the WB process, the WB process takes a lot of time to process one lot compared to the DA process. In order to balance the work between the two processes, the lot is temporarily stored in the WB process. can be divided into . If the tasks of the divided lot cannot be finished at the same time, a delay may occur.
일 실시예에서, 서버(120)는 다양한 우선순위에 따라 스케줄링 절차를 구성할 수 있다In one embodiment, the server 120 may configure the scheduling procedure according to various priorities.
도 3은 본 발명의 일 실시예에 따른 지능형 LOT 추적의 예를 도시한 도면이다.3 is a diagram illustrating an example of intelligent LOT tracking according to an embodiment of the present invention.
도 3을 참고하면, 서버(120)는 반도체 후공정 특화 시작(Start)-종료(End) 프로세스를 수행할 수 있다. Referring to FIG. 3 , the server 120 may perform a semiconductor post-process specialized start-end process.
서버(120)는 매거진(Magazine)에 부착되어 있는 추적 태그(Tracking Tag)를 이용하여 Lot 시작/종료(Start/End)를 처리할 수 있다. The server 120 may process a lot start/end (Start/End) using a tracking tag attached to a magazine.
시작은 Lot의 첫 번째 매거진을 투입 시 진행될 수 있다. 종료는 Lot의 마지막 매거진 제거 시 진행될 수 있다. Lot 종료는 EAP의 신호를 받아 매거진이 배출된 이후에 진행될 수 있다.The start can be carried out when the first magazine of the lot is inserted. Ending can be done when the last magazine of the lot is removed. Lot termination can be performed after the magazine is ejected by receiving the EAP signal.
서버(120)는 반도체 공정 설비(110)를 체크하여 셋업된 한계점(Limit)을 벗어날 경우 오차(Error)로 반영할 수 있다. The server 120 may check the semiconductor process equipment 110 and reflect it as an error when it deviates from a set limit.
일 실시예에서, 서버(120)는 지능형 Lot 추적 생산물 정보처리를 수행할 수 있다. In one embodiment, the server 120 may perform intelligent lot tracking product information processing.
일 실시예에서, 서버(120)는 PCB Lot이 담긴 매거진의 추적에는 실행(Run)에서 분할(Split)된 Lot ID를 입력 처리할 수 있다. In one embodiment, the server 120 may input and process the Lot ID split in Run to the tracking of the magazine containing the PCB Lot.
일 실시예에서, 서버(120)는 로드(Load)와 언로드(Unload)에 매거진을 투입시키면 MES 전산상에 자동으로 시작 처리를 수행할 수 있다. In one embodiment, the server 120 may automatically perform a start process on the MES computer when the magazine is put into Load and Unload.
일 실시예에서, 서버(120)는 PCB가 담겨있던 매거진의 추적에 입력되어 있던 Lot ID를 언로드의 매거진의 추적 진행을 수행할 수 있다. In one embodiment, the server 120 may perform the tracking of the magazine of unloading the Lot ID input to the tracking of the magazine containing the PCB.
PCB가 담겨있던 매거진의 추적에 입력되어 있던 Lot ID는 삭제 처리될 수 있다. The Lot ID entered in the tracking of the magazine containing the PCB can be deleted.
Lot에 해당하는 PCB 매거진이 모두 투입되고 D/A Out 매거진 수량만큼 매거진이 언로드에서 배출되면 MES 전상에서 Lot은 자동으로 종료될 수 있다. When all of the PCB magazines corresponding to the lot are put in and the magazines are discharged from the unload as much as the number of D/A Out magazines, the lot can be automatically terminated in the entire MES.
Lot 종료는 EAP의 신호를 받아 매거진이 배출된 이후에 처리될 수 있다. C/V를 체크하여 셋업된 한계점을 벗어날 경우 오차 처리될 수 있다. Lot termination can be processed after the magazine is ejected by receiving a signal from EAP. If it exceeds the set limit by checking C/V, error can be processed.
일 실시예에서, 서버(120)는 지능형 Lot 추적을 위한 로드 포트(Port)를 구성할 수 있다. In one embodiment, the server 120 may configure a load port (Port) for intelligent lot tracking.
일 실시예에서, 서버(120)는 지능형 Lot 추적을 위한 매거진 투입 동작을 지시할 수 있다. In one embodiment, the server 120 may instruct a magazine inserting operation for intelligent lot tracking.
일 실시예에서, 서버(120)는 추적 태그 정보의 로드 포트를 구성할 수 있다. In one embodiment, the server 120 may configure a load port of the tracking tag information.
일 실시예에서, 서버(120)는 지능형 Lot 추적 로드 포트 통신으로써 해당 공정 매거진 투입을 지시할 수 있다. In one embodiment, the server 120 may instruct the corresponding process magazine input through intelligent lot tracking load port communication.
반도체 공정 설비(110) 문제 등으로 매거진을 언로딩했다가 다시 로딩할 경우, Lot은 삭제이력(Delete History)를 통하여 시작 이력을 다시 불러올 수 있다. When the magazine is unloaded and then reloaded due to a problem in the semiconductor process facility 110 , the lot may recall the start history through the Delete History.
이미 추적 태그 상에 Lot ID가 지워져 있어 다시 메뉴얼로 입력 처리를 수행할 수 있다.Since Lot ID has already been erased on the tracking tag, input processing can be performed manually again.
일 실시예에서, 서버(120)는 사용자 단말에서 처리할 수 있도록 화면구성을 시각화하며, 빈 매거진(추적 상에 Lot ID 없음) 이 로딩되었을 경우 에러 처리를 수행할 수 있다. In one embodiment, the server 120 visualizes the screen configuration to be processed by the user terminal, and may perform error processing when an empty magazine (no Lot ID on tracking) is loaded.
일 실시예에서, 서버(120)는 지능형 Lot 추적을 위한 언로드 포트를 구성할 수 있다. In one embodiment, the server 120 may configure an unload port for intelligent lot tracking.
일 실시예에서, 서버(120)는 지능형 Lot 추적을 위한 매거진 투입 동작을 지시할 수 있다. In one embodiment, the server 120 may instruct a magazine inserting operation for intelligent lot tracking.
일 실시예에서, 서버(120)는 추적 태그 정보의 언로드 포트를 구성할 수 있다. In one embodiment, the server 120 may configure an unload port of the tracking tag information.
일 실시예에서, 서버(120)는 지능형 Lot-추적 언로드 포트 통신으로써 해당 공정 매거진을 배출 처리할 수 있다. In one embodiment, the server 120 may discharge the corresponding process magazine with intelligent lot-tracking unload port communication.
로딩된 매거진이 정상적이지 않은 매거진으로 판정되어 제거할 경우, 데이터 기준을 위해 여러 매거진 중에 하나의 매거진이 문제를 일으켰을 경우 Lot은 시작상태로 처리할 수 있다. 언로드 포트를 통해 작업 완료된 매거진이 존재할 수 있다. If the loaded magazine is judged to be an abnormal magazine and removed, the lot can be treated as a starting state if one of the magazines has a problem for data standards. There may be finished magazines through the unload port.
Lot은 삭제 이력(Delete History)를 통하여 시작 이력을 다시 불러올 수 있으나, 다시 불러왔을 경우 물리적으로는 이미 작업완료 처리된 매거진이 존재하기 때문에 시스템적으로 처리할 작업수량과 실제 처리해야 하는 작업 수량이 맞지 않을 수 있다. The lot can recall the start history through the delete history, but when it is recalled, the number of jobs to be systematically processed and the number of jobs to be actually processed are it may not fit
빈 매거진(동작 태그 상에 Lot ID 없음)이 로딩되었을 경우 데이터 정합상 에러 처리를 수행할 수 있다. When an empty magazine (without Lot ID on the action tag) is loaded, error processing can be performed for data matching.
도 4는 본 발명의 일 실시예에 따른 지능형 LOT 추적의 태그 데이터(400)의 예를 도시한 도면이다.4 is a diagram illustrating an example of tag data 400 of intelligent LOT tracking according to an embodiment of the present invention.
도 4를 참고하면, 태그 데이터(400)는 UID, 매거진(Magazine) ID 및 LoT ID를 포함할 수 있다. Referring to FIG. 4 , the tag data 400 may include a UID, a magazine ID, and a LoT ID.
UID는 Lot 추적 내부에서 관리하는 8Byte 고유 값으로 구성될 수 있다. UID can be composed of 8 bytes unique value managed inside lot tracking.
매거진 ID는 제조현장 내의 매거진을 종류별, 유형(Type)별로 구분하여 ID를 구성할 수 있다. 예를 들어, 매거진 ID는 최대 20 바이트(Byte)를 사용할 수 있다.Magazine ID can be configured by classifying magazines in the manufacturing site by type and type. For example, a magazine ID can use up to 20 bytes.
Lot ID는 최대 25 바이트를 사용할 수 있으며 PCB Lot, 생산 Lot ID를 포함할 수 있다. Lot ID can use up to 25 bytes and can include PCB Lot and Production Lot ID.
일 실시예에서, 태그 데이터(400)는 지능형 Lot 추적을 위한 동작 태그(Action Tag)의 후면 혹은 전면에 UID를 바코드 프린트(Barcode Print)하여 태그 손상 시 식별용으로 사용할 수 있다. In one embodiment, the tag data 400 can be used for identification when the tag is damaged by barcode printing the UID on the back or front of the action tag for intelligent lot tracking.
도 5는 본 발명의 일 실시예에 따른 반도체 후공정 시스템에서 LOT 추적을 위한 서버(120)의 동작 방법을 도시한 도면이다.5 is a diagram illustrating an operation method of the server 120 for LOT tracking in a semiconductor post-processing system according to an embodiment of the present invention.
도 5를 참고하면, S501 단계는, 제1 반도체 공정 설비(210) 및 제2 반도체 공정 설비(215) 각각으로부터 측정 데이터를 수신하는 단계이다. 예를 들어, 측정 데이터는, 제1 반도체 공정 설비(210) 및 제2 반도체 공정 설비(215) 각각에 대한 공정 데이터, 설비 데이터, 센서 데이터 및 로그 데이터를 포함할 수 있다. Referring to FIG. 5 , in operation S501 , measurement data is received from each of the first semiconductor process equipment 210 and the second semiconductor process equipment 215 . For example, the measurement data may include process data, equipment data, sensor data, and log data for each of the first semiconductor process equipment 210 and the second semiconductor process equipment 215 .
S503 단계는, 측정 데이터를 이용하여 제1 반도체 공정 설비(210) 및 제2 반도체 공정 설비(215)에 대한 물품에 대한 LOT를 결정하는 단계이다. Step S503 is a step of determining a LOT for articles for the first semiconductor process equipment 210 and the second semiconductor process equipment 215 by using the measurement data.
S505 단계는, LOT에 따라 제1 반도체 공정 설비(210) 및 제2 반도체 공정 설비(215)에 대한 상기 물품의 공정 수행 명령을 수행하는 단계이다. 즉, LOT에 따라 제1 반도체 공정 설비(210) 및 제2 반도체 공정 설비(215)에 대한 상기 물품의 공정 수행 명령을 제1 반도체 공정 설비(210) 및 제2 반도체 공정 설비(215)에게 송신할 수 있다. Step S505 is a step of executing a process execution command of the article to the first semiconductor process equipment 210 and the second semiconductor process equipment 215 according to the LOT. That is, according to the LOT, the processing command of the article for the first semiconductor processing equipment 210 and the second semiconductor processing equipment 215 is transmitted to the first semiconductor processing equipment 210 and the second semiconductor processing equipment 215 . can do.
일 실시예에서, LOT에 따라 제1 반도체 공정 설비(210) 및 제2 반도체 공정 설비(215)에 대한 상기 물품의 투입 제어 명령을 수행할 수 있다. In an embodiment, an input control command of the article to the first semiconductor process equipment 210 and the second semiconductor process equipment 215 may be performed according to the LOT.
일 실시예에서, 상기 결정된 LOT에 따라 제1 반도체 공정 설비(210)에 대한 물품의 공정 수행 명령을 수행할 수 있다. In an embodiment, an article processing execution command to the first semiconductor processing facility 210 may be performed according to the determined LOT.
일 실시에에서, 측정 데이터를 이용하여 물품에 대한 LOT를 분할(Split)하고, 상기 분할된 LOT에 따라 제2 반도체 공정 설비(215)에 대한 물품의 공정 수행 명령을 수행할 수 있다. 이후, 상기 분할된 LOT을 병합(Merge)할 수 있다. In an embodiment, the LOT of the article may be split using the measurement data, and a process execution command of the article may be performed to the second semiconductor processing facility 215 according to the divided LOT. Thereafter, the divided LOT may be merged.
도 6은 본 발명의 일 실시예에 따른 반도체 후공정 시스템에서 LOT 추적을 위한 서버(120)의 기능적 구성을 도시한 도면이다.6 is a diagram illustrating a functional configuration of the server 120 for LOT tracking in a semiconductor post-processing system according to an embodiment of the present invention.
도 6을 참고하면, 서버(120)는 통신부(610), 제어부(620) 및 저장부(630)를 포함할 수 있다.Referring to FIG. 6 , the server 120 may include a communication unit 610 , a control unit 620 , and a storage unit 630 .
통신부(610)는 제1 반도체 공정 설비(210) 및 제2 반도체 공정 설비(215) 각각으로부터 측정 데이터를 수신할 수 있다. The communication unit 610 may receive measurement data from each of the first semiconductor process equipment 210 and the second semiconductor process equipment 215 .
일 실시예에서, 통신부(610)는 유선 통신 모듈 및 무선 통신 모듈 중 적어도 하나를 포함할 수 있다. 통신부(610)의 전부 또는 일부는 '송신부', '수신부' 또는 '송수신부(transceiver)'로 지칭될 수 있다.In an embodiment, the communication unit 610 may include at least one of a wired communication module and a wireless communication module. All or part of the communication unit 610 may be referred to as a 'transmitter', 'receiver', or 'transceiver'.
제어부(620)는 측정 데이터를 이용하여 제1 반도체 공정 설비(210) 및 제2 반도체 공정 설비(215)에 대한 물품에 대한 LOT를 결정하고, 상기 결정된 LOT에 따라 제1 반도체 공정 설비(210) 및 제2 반도체 공정 설비(215)에 대한 상기 물품의 공정 수행 명령을 수행할 수 있다. The controller 620 determines a LOT for articles for the first semiconductor process equipment 210 and the second semiconductor process equipment 215 by using the measurement data, and the first semiconductor process equipment 210 according to the determined LOT. and a second semiconductor processing facility 215 to perform a process execution command of the article.
일 실시예에서, 제어부(620)는 적어도 하나의 프로세서 또는 마이크로(micro) 프로세서를 포함하거나, 또는, 프로세서의 일부일 수 있다. 또한, 제어부(620)는 CP(communication processor)라 지칭될 수 있다. 제어부(620)는 본 발명의 다양한 실시예에 따른 서버(120)의 동작을 제어할 수 있다. In one embodiment, the control unit 620 may include at least one processor or microprocessor, or may be a part of the processor. Also, the controller 620 may be referred to as a communication processor (CP). The controller 620 may control the operation of the server 120 according to various embodiments of the present disclosure.
저장부(630)는 측정 데이터를 저장할 수 있다. 일 실시예에서, 저장부(630)는 물품에 대한 LOT을 저장할 수 있다. The storage unit 630 may store measurement data. In one embodiment, the storage unit 630 may store the LOT for the article.
일 실시예에서, 저장부(630)는 휘발성 메모리, 비휘발성 메모리 또는 휘발성 메모리와 비휘발성 메모리의 조합으로 구성될 수 있다. 그리고, 저장부(630)는 제어부(620)의 요청에 따라 저장된 데이터를 제공할 수 있다.In an embodiment, the storage unit 630 may be configured as a volatile memory, a non-volatile memory, or a combination of a volatile memory and a non-volatile memory. In addition, the storage unit 630 may provide stored data according to the request of the control unit 620 .
도 6을 참고하면, 서버(120)는 통신부(610), 제어부(620) 및 저장부(630)를 포함할 수 있다. 본 발명의 다양한 실시 예들에서 서버(120)는 도 6에 설명된 구성들이 필수적인 것은 아니어서, 도 6에 설명된 구성들보다 많은 구성들을 가지거나, 또는 그보다 적은 구성들을 가지는 것으로 구현될 수 있다.Referring to FIG. 6 , the server 120 may include a communication unit 610 , a control unit 620 , and a storage unit 630 . In various embodiments of the present invention, the server 120 is not essential to the configurations illustrated in FIG. 6 , and thus may be implemented to have more or fewer configurations than those illustrated in FIG. 6 .
이상의 설명은 본 발명의 기술적 사상을 예시적으로 설명한 것에 불과한 것으로, 통상의 기술자라면 본 발명의 본질적인 특성이 벗어나지 않는 범위에서 다양한 변경 및 수정이 가능할 것이다.The above description is merely illustrative of the technical spirit of the present invention, and various changes and modifications may be made by those skilled in the art without departing from the essential characteristics of the present invention.
본 명세서에 개시된 다양한 실시예들은 순서에 관계없이 수행될 수 있으며, 동시에 또는 별도로 수행될 수 있다. The various embodiments disclosed herein may be performed out of order, and may be performed simultaneously or separately.
일 실시예에서, 본 명세서에서 설명되는 각 도면에서 적어도 하나의 단계가 생략되거나 추가될 수 있고, 역순으로 수행될 수도 있으며, 동시에 수행될 수도 있다. In one embodiment, at least one step may be omitted or added in each figure described herein, may be performed in the reverse order, or may be performed simultaneously.
본 명세서에 개시된 실시예들은 본 발명의 기술적 사상을 한정하기 위한 것이 아니라, 설명하기 위한 것이고, 이러한 실시예들에 의하여 본 발명의 범위가 한정되는 것은 아니다.The embodiments disclosed in the present specification are not intended to limit the technical spirit of the present invention, but to illustrate, and the scope of the present invention is not limited by these embodiments.
본 발명의 보호범위는 청구범위에 의하여 해석되어야 하며, 그와 동등한 범위 내에 있는 모든 기술 사상은 본 발명의 권리범위에 포함되는 것으로 이해되어야 한다.The protection scope of the present invention should be interpreted by the claims, and all technical ideas within the scope equivalent thereto should be understood to be included in the scope of the present invention.

Claims (8)

  1. (a) 제1 반도체 공정 설비 및 제2 반도체 공정 설비 각각으로부터 측정 데이터를 수신하는 단계; (a) receiving measurement data from each of the first semiconductor processing facility and the second semiconductor processing facility;
    (b) 상기 측정 데이터를 이용하여 상기 제1 반도체 공정 설비 및 제2 반도체 공정 설비에 대한 물품에 대한 LOT를 결정하는 단계; 및 (b) determining a LOT for articles for the first semiconductor processing facility and the second semiconductor processing facility using the measurement data; and
    (c) 상기 결정된 LOT에 따라 상기 제1 반도체 공정 설비 및 제2 반도체 공정 설비에 대한 상기 물품의 공정 수행 명령을 수행하는 단계;(c) executing a process execution command of the article to the first semiconductor processing facility and the second semiconductor processing facility according to the determined LOT;
    를 포함하는,containing,
    반도체 후공정 시스템에서 LOT 추적을 위한 서버의 동작 방법. A method of operating a server for LOT tracking in a semiconductor post-processing system.
  2. 제1항에 있어서,The method of claim 1,
    상기 (c) 단계는, Step (c) is,
    상기 결정된 LOT에 따라 상기 제1 반도체 공정 설비에 대한 상기 물품의 공정 수행 명령을 수행하는 단계; performing a process execution command of the article to the first semiconductor processing facility according to the determined LOT;
    를 포함하는,containing,
    반도체 후공정 시스템에서 LOT 추적을 위한 서버의 동작 방법. A method of operating a server for LOT tracking in a semiconductor post-processing system.
  3. 제2항에 있어서,3. The method of claim 2,
    상기 (c) 단계는, Step (c) is,
    상기 측정 데이터를 이용하여 상기 물품에 대한 LOT를 분할(Split)하는 단계; 및 splitting the LOT for the article by using the measurement data; and
    상기 분할된 LOT에 따라 상기 제2 반도체 공정 설비에 대한 상기 물품의 공정 수행 명령을 수행하는 단계;performing a process execution command of the article to the second semiconductor processing facility according to the divided LOT;
    를 포함하는,containing,
    반도체 후공정 시스템에서 LOT 추적을 위한 서버의 동작 방법. A method of operating a server for LOT tracking in a semiconductor post-processing system.
  4. 제3항에 있어서,4. The method of claim 3,
    상기 (c) 단계 이후에, After step (c),
    상기 분할된 LOT을 병합(Merge)하는 단계;merging the divided LOT;
    를 더 포함하는,further comprising,
    반도체 후공정 시스템에서 LOT 추적을 위한 서버의 동작 방법. A method of operating a server for LOT tracking in a semiconductor post-processing system.
  5. 제1 반도체 공정 설비 및 제2 반도체 공정 설비 각각으로부터 측정 데이터를 수신하는 통신부; 및a communication unit configured to receive measurement data from each of the first semiconductor process equipment and the second semiconductor process equipment; and
    상기 측정 데이터를 이용하여 상기 제1 반도체 공정 설비 및 제2 반도체 공정 설비에 대한 물품에 대한 LOT를 결정하고,determining a LOT for articles for the first semiconductor processing facility and the second semiconductor processing facility by using the measurement data;
    상기 결정된 LOT에 따라 상기 제1 반도체 공정 설비 및 제2 반도체 공정 설비에 대한 상기 물품의 공정 수행 명령을 수행하는 제어부;a control unit configured to perform a process execution command of the article to the first semiconductor processing facility and the second semiconductor processing facility according to the determined LOT;
    를 포함하는,containing,
    반도체 후공정 시스템에서 LOT 추적을 위한 서버 장치. Server device for LOT tracking in semiconductor post-processing systems.
  6. 제5항에 있어서,6. The method of claim 5,
    상기 제어부는,The control unit is
    상기 결정된 LOT에 따라 상기 제1 반도체 공정 설비에 대한 상기 물품의 공정 수행 명령을 수행하는,performing a process execution command of the article to the first semiconductor processing facility according to the determined LOT;
    반도체 후공정 시스템에서 LOT 추적을 위한 서버 장치. Server device for LOT tracking in semiconductor post-processing systems.
  7. 제6항에 있어서,7. The method of claim 6,
    상기 제어부는,The control unit is
    상기 측정 데이터를 이용하여 상기 물품에 대한 LOT를 분할(Split)하고,Split the LOT for the article using the measurement data,
    상기 분할된 LOT에 따라 상기 제2 반도체 공정 설비에 대한 상기 물품의 공정 수행 명령을 수행하는,performing a process execution command of the article to the second semiconductor processing facility according to the divided LOT;
    반도체 후공정 시스템에서 LOT 추적을 위한 서버 장치. Server device for LOT tracking in semiconductor post-processing systems.
  8. 제7항에 있어서,8. The method of claim 7,
    상기 제어부는,The control unit is
    상기 분할된 LOT을 병합(Merge)하는,Merging the divided LOT,
    반도체 후공정 시스템에서 LOT 추적을 위한 서버 장치. Server device for LOT tracking in semiconductor post-processing systems.
PCT/IB2021/062322 2020-12-24 2021-12-27 Method and device for tracking lot in semiconductor post-processing system WO2022137219A1 (en)

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2743908B2 (en) * 1996-04-02 1998-04-28 日本電気株式会社 Semiconductor device manufacturing equipment
KR20010048193A (en) * 1999-11-25 2001-06-15 윤종용 System for fabricating semiconductor device
JP2010010253A (en) * 2008-06-25 2010-01-14 Sharp Corp Semiconductor manufacturing process management system
JP4828831B2 (en) * 2005-01-18 2011-11-30 パナソニック株式会社 Manufacturing method of semiconductor device
KR20170091536A (en) * 2016-02-01 2017-08-09 코니악 게엠베하 Method and apparatus for evaluating a semiconductor manufacturing process

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2743908B2 (en) * 1996-04-02 1998-04-28 日本電気株式会社 Semiconductor device manufacturing equipment
KR20010048193A (en) * 1999-11-25 2001-06-15 윤종용 System for fabricating semiconductor device
JP4828831B2 (en) * 2005-01-18 2011-11-30 パナソニック株式会社 Manufacturing method of semiconductor device
JP2010010253A (en) * 2008-06-25 2010-01-14 Sharp Corp Semiconductor manufacturing process management system
KR20170091536A (en) * 2016-02-01 2017-08-09 코니악 게엠베하 Method and apparatus for evaluating a semiconductor manufacturing process

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