WO2022126937A1 - Drawer-type high-density fpga cloud platform case - Google Patents

Drawer-type high-density fpga cloud platform case Download PDF

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Publication number
WO2022126937A1
WO2022126937A1 PCT/CN2021/085808 CN2021085808W WO2022126937A1 WO 2022126937 A1 WO2022126937 A1 WO 2022126937A1 CN 2021085808 W CN2021085808 W CN 2021085808W WO 2022126937 A1 WO2022126937 A1 WO 2022126937A1
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fpga
drawer
cloud platform
chassis
power supply
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PCT/CN2021/085808
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French (fr)
Chinese (zh)
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张科
于磊
王亚洲
常轶松
赵然
陈明宇
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中国科学院计算技术研究所
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Publication of WO2022126937A1 publication Critical patent/WO2022126937A1/en

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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/14Mounting supporting structure in casing or on frame or rack
    • H05K7/1485Servers; Data center rooms, e.g. 19-inch computer racks
    • H05K7/1487Blade assemblies, e.g. blade cases or inner arrangements within a blade
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/14Mounting supporting structure in casing or on frame or rack
    • H05K7/1485Servers; Data center rooms, e.g. 19-inch computer racks
    • H05K7/1488Cabinets therefor, e.g. chassis or racks or mechanical interfaces between blades and support structures
    • H05K7/1489Cabinets therefor, e.g. chassis or racks or mechanical interfaces between blades and support structures characterized by the mounting of blades therein, e.g. brackets, rails, trays
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/14Mounting supporting structure in casing or on frame or rack
    • H05K7/1485Servers; Data center rooms, e.g. 19-inch computer racks
    • H05K7/1488Cabinets therefor, e.g. chassis or racks or mechanical interfaces between blades and support structures
    • H05K7/1491Cabinets therefor, e.g. chassis or racks or mechanical interfaces between blades and support structures having cable management arrangements

Definitions

  • the invention relates to the field of computer architecture and FPGA (Field Programmable Gate Array) heterogeneous acceleration, in particular to a cloud platform server based on a programmable gate array.
  • FPGA Field Programmable Gate Array
  • FPGA has gradually become one of the application solutions considered in various fields of computer due to its advantages of high energy efficiency, parallel computing and multiple programming, especially in media compression, encryption and decryption, AI, big data processing and other fields, FPGA solutions are more traditional CPU and GPU can often achieve several times or even dozens of times of energy efficiency improvement. Due to this trend, the FPGA cloud platform came into being.
  • the FPGA chassis is to the FPGA cloud platform what the commercial standard x86 chassis is to the cloud computing platform.
  • the FPGA chassis is mainly based on a standard x86 server, supplemented by an FPGA hardware card in the form of a PCIe interface on the x86 motherboard inside the chassis.
  • power supplies, fans, motherboards, and service boards are usually placed on the same layer or on the same plane.
  • the modules are generally placed in front of each other and connected by cables. Such an organizational structure complicates chassis assembly.
  • the circuit board components in the chassis are mostly composed of an x86 server motherboard (control board) and multiple FPGA node boards (service boards).
  • the FPGA node board is inserted into the x86 server control board through the gold finger of the PCIe interface. data interaction.
  • the FPGA cloud platform chassis can deploy no more than 8 FPGA nodes according to its own chassis size and the number of PCIe interfaces of the motherboard x86 server, so the FPGA node resources that can provide services in a single chassis are limited.
  • the existing cloud computing framework and commercial x86 server chassis if a large-scale deployment is carried out, a large number of x86 servers are required to carry FPGA node boards, which leads to higher deployment costs and lower utilization of physical space in the computer room. Therefore, in this traditional FPGA cloud platform chassis mode, it is difficult for FPGA nodes to be deployed on a large scale and at high density.
  • the current commercial FPGA cloud platforms usually provide x86 servers and FPGA nodes as resources to cloud users. Users can develop their own application software in the x86 server, and can also complete the development of FPGA acceleration logic in the x86 server. This method will result in waste of resources and increased cost for users who only need FPGA resources.
  • the existing FPGA node boards are managed and configured through the x86 server motherboard in the chassis. Users must first access the x86 server, and then start the relevant processes in the x86 server to manage and configure the FPGA node boards. Configuration, flexibility is not strong.
  • the invention effectively reduces the cost of FPGA cloud platform chassis deployment and maintenance; in the limited space chassis, the deployment density of FPGA node boards is greatly improved; since x86 servers are not used as FPGA nodes Management boards, which can save more economic costs when deploying large-scale FPGA nodes;
  • the FPGA node boards in the chassis can be managed and configured more reasonably and efficiently, and the resource utilization efficiency of the cloud platform can be improved.
  • the present invention proposes a drawer-type high-density FPGA cloud platform chassis, which includes:
  • a switch module located at the bottom of the chassis, a power supply module located above the switch module, and a drawer structure located above the power supply module;
  • the drawer structure is provided with a control board and an FPGA node board, and the FPGA node board is plugged into the control board through a preset interface;
  • the power transmission end of the power supply module is electrically connected to the power input interface of the switch module and the control board, and the network switch interface of the switch module is connected to the network interface of the FPGA node board, and is used to exchange the communication between the FPGA node boards. data.
  • the drawer structure further includes a cooling fan, and a handle for loading and unloading is installed at the rear of the drawer structure.
  • the FPGA node board further has a PCIe interface, and the FPGA node board can be connected to the x86 server through the PCIe interface.
  • the power supply module includes an electronic power supply module for backup power supply.
  • the chassis is a standard 5U server chassis.
  • the inner side of the side wall of the chassis is provided with a slide rail, which is connected to the drawer structure through the slide rail.
  • the power supply module of the FPGA node board card is connected to the power take-off clip of the control board card through a power supply copper bar.
  • the drawer-type high-density FPGA cloud platform chassis further includes a restraint device for fixing the FPGA node board, and the restraint device includes: an opening mesh plate located on one side of the FPGA node board, located on the other side of the FPGA node board.
  • the front panel on one side, the cover above the FPGA node board.
  • the chassis includes a plurality of the drawer structures arranged side by side on the power supply module.
  • control board controls and manages the FPGA node board through the preset interface and monitors the working state of the board in real time.
  • the present invention has the advantages that the present invention will greatly increase the deployable density of the FPGA node boards in the FPGA cloud platform chassis. Reduce the wiring cost in the chassis, simplify the assembly complexity, and reduce the maintenance difficulty. By using the self-developed control management system, it provides users with a more comprehensive and convenient development environment. Real-time monitoring of the chassis and board status and reduce unnecessary wiring, improve the reliability of the FPGA cloud platform chassis.
  • Fig. 1 is the overall structure diagram of the present invention
  • Fig. 2 is the internal structure diagram of the single drawer structure of the present invention.
  • Figure 3 is a side view of the present invention.
  • FIG. 4 is a partial view of the chassis of the present invention.
  • the present invention effectively reduces the deployment and maintenance costs of the FPGA cloud platform chassis 1; the stacking layout and the double-drawer structure can greatly improve the deployment of the FPGA node board 8 in a limited chassis space Density; through the control management system designed in "a cloud platform computing system and its application method” (application number 201810532745.0) and “a method, device and system for implementing an FPGA server” (application number 202010019013.9), more efficient Manage and configure FPGA node boards, providing users with a convenient, fast and cheaper FPGA resource usage environment.
  • a cloud platform computing system and its application method application number 201810532745.0
  • a method, device and system for implementing an FPGA server application number 202010019013.9
  • the technical difficulty of the present invention lies in how to realize the deployment of high-density FPGA nodes in the limited cloud platform chassis space, and how to effectively manage, configure and use the high-density FPGA nodes in the chassis.
  • this application includes the following key points:
  • the integrated drawer structure track is shown in Figure 4.
  • the drawer structure 2 When the drawer structure 2 is installed, first put down along the vertical part of the track 13, and then push it inward along the horizontal part of the track 13.
  • the rails 13 are located on both sides of the inner wall of the chassis 1 .
  • the drawer structure 2 has all the working elements (control board 6, high-density business board, cooling fan 12, etc.), and can work as an independent system after external power supply; technical effect: easy to use and fast to assemble;
  • Key point 2 Stacked structure layout, the drawer structure 2, power supply module 3, and 100G switching module 4 in the chassis 1 are arranged up and down, saving the depth space of the chassis 1;
  • Technical effect efficient use of space and increase the node density in the chassis 1;
  • Key point 3 Independent control and management unit, through the control board 6 to complete the control and management of the FPGA node board 8 and real-time monitoring of the working status of the board; technical effect: rational allocation of resources, monitoring board status;
  • Key point 4 The design of the preset interface 10, the status information, control information and debugging interface of the FPGA node board 8 can be interacted with through the preset interface 10; technical effect: Simplify the internal wiring of the chassis 1.
  • the chassis 1 is composed of a double drawer structure 2 , a power supply module 3 and a 100G switching module 4 respectively from top to bottom.
  • the two drawer structures 2 have the same structure, and are mainly used for placing high-density service boards and their cooling systems, and two handles 5 are installed at the rear for loading and unloading.
  • the power supply module 3 is composed of three sub-power supply modules and adopts a dual-use and one-standby mode for power supply.
  • the 100G switching module 4 is placed at the bottom of the chassis 1 for data interaction between the FPGA node boards 8 .
  • the power supply module 3 needs to supply power to the control board 6 and the FPGA node board 8. They are both located on the upper part of the chassis 1. Placing it in the middle will be closer to the board, which can shorten the length of the power supply copper bar 14.
  • the exchange module 4 is mainly connected with the network interface of the FPGA node board 8, and is used for data interaction between the FPGA node boards 8.
  • each drawer structure 2 constitutes a small system with independent heat dissipation and management methods.
  • the chassis 1 only needs to provide the power supply module 3 for the drawer structure 2, which is convenient for maintenance. , the replacement is simple, the assembly and disassembly are easy, the power supply module 3 is connected to the power taking clip of the control board 6 of the drawer structure 2 through the power supply copper bar 14, and the specific form is shown in Figure 4.
  • the FPGA node board 8 in the drawer structure 2 also has a standard PCIe x16 interface. This interface is used for control management and data interaction of the board. The FPGA node board 8 can directly use this interface. It is plugged into the common x86 server on the market and has strong compatibility.
  • the drawer structure 2 integrates a control board 6 inside, and the FPGA node board 8 is inserted into the control board 6 through a preset interface 10 .
  • the preset interface 10 also integrates an Ethernet channel (which can support Gigabit, 10 Gigabit and higher-speed networks), monitoring and management channels, configuration and debugging channels, etc. Card power supply, monitoring, configuration debugging and other functions.
  • the control board 6 may also be additionally equipped with a PCIe switch chip and reserve multiple PCIe interfaces for PCIe data exchange between the FPGA node boards.
  • the FPGA node board can be plugged into the preset interface and the PCIe interface at the same time, and the drawer structure 2 does not need manual wiring, and has high reliability.
  • the drawer structure 2 only needs to provide a network interface to the outside, so as to realize the management and use of the resources of the FPGA node board 8.
  • the control board 6 integrates an intelligent management system, which can monitor the temperature, power consumption and other information in the chassis 1 in real time, and automatically trigger the safety mechanism when the limit is exceeded.
  • the intelligent management system can dynamically schedule 8 resources of the FPGA node board to provide users with a safe and reliable use environment. Structurally, the control board 6 can also play the role of supporting the FPGA node board 8 .
  • the left side has the opening mesh board 11 on the chassis 1
  • the right side has the front panel 7 of the FPGA node board 8, and the PCIe interface and The preset interface 10 can be supported, and the cover plate 9 is fixed above the board card, and the structure is firm.
  • Each drawer structure 2 has its own independent cooling system fan 12, and the cooling air ducts are unobstructed.
  • the control board 6 does not have a high-performance CPU, so there is no need to think too much about the heat dissipation of the control board 6.
  • Two drawer structures 2 are placed in the chassis 1. When the two-stage fans 12 work together to dissipate heat, the heat dissipation performance is improved.
  • the key point of the present invention is that the density of the FPGA node board 8 in the limited space in the chassis is greatly improved through two integrated drawer structures.
  • the drawer structure 2 itself has a way of dissipating heat and supplying power to the FPGA node board 8, which can be separated from the
  • the chassis 1 works alone (external power supply is required), and the control board 6 in the drawer structure 2 and the FPGA node board 8 are interconnected through a custom gold finger (preset interface 10), which removes a large number of power supply modules 3 inside the traditional chassis and management network wiring for easy installation and commissioning.
  • the present invention can deploy 32 high-performance FPGA node boards 8 with full height and three-quarter length in a standard 5U server chassis.
  • the chassis 1 can be adjusted to a single-drawer or multi-drawer structure 2 according to the actual requirements of the number of boards or the physical size of the FPGA boards. For example, if the lateral dimension of the FPGA board is shorter, the drawer structure 2 can also be shortened accordingly. Then, multiple (greater than or equal to three) drawer structures 2 can be placed in succession in a standard server chassis, thereby improving the physical space utilization of the server rack to a greater extent.
  • the invention provides a drawer-type high-density FPGA cloud platform chassis, comprising: a switch module located at the bottom of the chassis, a power supply module located on the switch module, and a drawer structure located on the power supply module; the drawer structure is provided with a control board card and an FPGA node The board, the FPGA node board is plugged into the control board through a preset interface; the power transmission end of the power supply module is electrically connected to the switching module and the power input interface of the control board, and the network switching interface of the switching module is connected to the network of the FPGA node board.
  • the interfaces are connected to exchange data between the FPGA node boards.
  • the present invention will greatly improve the deployable density of the FPGA node boards in the FPGA cloud platform chassis.

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • General Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
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Abstract

Provided is a drawer-type high-density FPGA cloud platform case, comprising: an exchange module located at the bottom of the case, a power supply module located on the exchange module, and a drawer structure located on the power supply module, wherein a control board card and FPGA node board cards are arranged in the drawer structure, and the FPGA node board cards are inserted into the control board card by means of preset interfaces; a power transmission end of the power supply module is electrically connected to the exchange module and a power input interface of the control board card; and a network exchange interface of the exchange module is connected to network interfaces of the FPGA node board cards and used for carrying out data interaction between the FPGA node board cards. By means of the present invention, the deployment density of the FPGA node board cards in the FPGA cloud platform case is greatly improved, thereby reducing the wiring cost, mounting and dismounting complexity and maintenance difficulty in the case; a comprehensive and convenient development environment is provided for a user by using a control and management system which is independently researched and developed; and the case and the state of the board cards are monitored in real time, and the number of manually connected wires is reduced by means of the preset interfaces, thereby improving the reliability of the FPGA cloud platform case.

Description

一种抽屉式高密度FPGA云平台机箱A drawer-type high-density FPGA cloud platform chassis 技术领域technical field
本发明涉及计算机体系结构以及FPGA(现场可编程门阵列)异构加速领域,特别涉及一种基于可编程门阵列的云平台服务器。The invention relates to the field of computer architecture and FPGA (Field Programmable Gate Array) heterogeneous acceleration, in particular to a cloud platform server based on a programmable gate array.
背景技术Background technique
近年来FPGA因其高能效、并行计算和可多次编程等优势,逐渐成为计算机各领域考虑的应用方案之一,尤其在媒体压缩、加解密、AI、大数据处理等领域,FPGA方案较传统CPU和GPU,往往可达到几倍甚至几十倍的能效提升。由于这样的趋势,FPGA云平台应运而生。In recent years, FPGA has gradually become one of the application solutions considered in various fields of computer due to its advantages of high energy efficiency, parallel computing and multiple programming, especially in media compression, encryption and decryption, AI, big data processing and other fields, FPGA solutions are more traditional CPU and GPU can often achieve several times or even dozens of times of energy efficiency improvement. Due to this trend, the FPGA cloud platform came into being.
FPGA机箱之于FPGA云平台,就像商用标准x86机箱之于云计算平台。作为FPGA云平台的核心硬件组件,FPGA机箱主要以标准的x86服务器为基础、辅以机箱内部x86主板上的PCIe接口形式FPGA硬件插卡。在传统的FPGA云平台机箱内部,电源、风扇、主板、业务板卡等通常放置于同一层或同一平面之上。各模块一般前后放置,并通过线缆连接。这样的组织结构使得机箱装配较为复杂。机箱内的电路板卡组件多是由一块x86服务器主板(控制板卡)以及多块FPGA节点板卡(业务板卡)组成,FPGA节点板卡通过PCIe接口的金手指插入到x86服务器控制板卡中进行数据交互。通常情况下FPGA云平台机箱据自身机箱尺寸以及主板x86服务器PCIe的接口数量,可部署的FPGA节点数量不会超过8个,所以单机箱内可提供服务的FPGA节点资源受限。在现有云计算框架和商用x86服务器机箱的双重限制下,如果进行大规模部署,则需要大量的x86服务器承载FPGA节点板卡,从而导致部署成本提高,机房物理空间利用率降低。因此,在这种传统的FPGA云平台机箱模式下,FPGA节点很难进行大规模、高密度的部署。The FPGA chassis is to the FPGA cloud platform what the commercial standard x86 chassis is to the cloud computing platform. As the core hardware component of the FPGA cloud platform, the FPGA chassis is mainly based on a standard x86 server, supplemented by an FPGA hardware card in the form of a PCIe interface on the x86 motherboard inside the chassis. Inside the traditional FPGA cloud platform chassis, power supplies, fans, motherboards, and service boards are usually placed on the same layer or on the same plane. The modules are generally placed in front of each other and connected by cables. Such an organizational structure complicates chassis assembly. The circuit board components in the chassis are mostly composed of an x86 server motherboard (control board) and multiple FPGA node boards (service boards). The FPGA node board is inserted into the x86 server control board through the gold finger of the PCIe interface. data interaction. Usually, the FPGA cloud platform chassis can deploy no more than 8 FPGA nodes according to its own chassis size and the number of PCIe interfaces of the motherboard x86 server, so the FPGA node resources that can provide services in a single chassis are limited. Under the dual constraints of the existing cloud computing framework and commercial x86 server chassis, if a large-scale deployment is carried out, a large number of x86 servers are required to carry FPGA node boards, which leads to higher deployment costs and lower utilization of physical space in the computer room. Therefore, in this traditional FPGA cloud platform chassis mode, it is difficult for FPGA nodes to be deployed on a large scale and at high density.
此外,目前的商用FPGA云平台通常是将x86服务器与FPGA节点作为一种资源提供给云端用户。用户可以在x86服务器中开发自己的应用软件,也可以在x86服务器中完成FPGA加速逻辑的开发。这种方式对于仅需要FPGA资源的用户将造成资源浪费和成本增加。In addition, the current commercial FPGA cloud platforms usually provide x86 servers and FPGA nodes as resources to cloud users. Users can develop their own application software in the x86 server, and can also complete the development of FPGA acceleration logic in the x86 server. This method will result in waste of resources and increased cost for users who only need FPGA resources.
第三,现有FPGA节点板卡是通过机箱内的x86服务器主板进行管理和配 置,用户必须要先访问x86服务器,然后在x86服务器中启动相关进程才可对FPGA节点板卡进行对应的管理和配置,灵活性不强。Third, the existing FPGA node boards are managed and configured through the x86 server motherboard in the chassis. Users must first access the x86 server, and then start the relevant processes in the x86 server to manage and configure the FPGA node boards. Configuration, flexibility is not strong.
按现有云平台机箱x86+业务板卡的架构,单机箱内无法进行高密度FPGA节点部署。According to the architecture of the existing cloud platform chassis x86+ service board, high-density FPGA node deployment cannot be performed in a single chassis.
针对现有的FPGA云平台机箱,机箱安装时板卡供电及数据交互多通过线缆连接,各模块及板卡分立安装,装配难度较大,维护起来不够灵活。For the existing FPGA cloud platform chassis, when the chassis is installed, the power supply and data interaction of the boards are mostly connected by cables, and the modules and boards are installed separately, which is difficult to assemble and inflexible to maintain.
用户无法直接对FPGA节点板卡进行相关配置及应用,若有需求访问FPGA节点板卡,需通过x86服务器才可实现。Users cannot directly configure and apply the FPGA node board. If there is a need to access the FPGA node board, it can only be achieved through an x86 server.
在机箱内部FPGA节点板卡相互之间的数据交互无法直接进行。The data interaction between the FPGA node boards inside the chassis cannot be carried out directly.
发明公开Invention Disclosure
本发明针对现有云平台架构的缺点,有效降低FPGA云平台机箱部署以及维护的成本;在有限空间的机箱内,大幅度提升FPGA节点板卡的部署密度;由于没有使用x86服务器作为FPGA节点的管理板卡,在进行大规模FPGA节点部署时能够节省更多的经济成本;Aiming at the shortcomings of the existing cloud platform architecture, the invention effectively reduces the cost of FPGA cloud platform chassis deployment and maintenance; in the limited space chassis, the deployment density of FPGA node boards is greatly improved; since x86 servers are not used as FPGA nodes Management boards, which can save more economic costs when deploying large-scale FPGA nodes;
使用自主研发的控制管理系统,能够更合理、高效的管理配置机箱内的FPGA节点板卡,提高云平台的资源使用效率。Using the self-developed control management system, the FPGA node boards in the chassis can be managed and configured more reasonably and efficiently, and the resource utilization efficiency of the cloud platform can be improved.
针对现有技术的不足,本发明提出一种抽屉式高密度FPGA云平台机箱,其中包括:In view of the deficiencies of the prior art, the present invention proposes a drawer-type high-density FPGA cloud platform chassis, which includes:
位于该机箱底部的交换模块和位于该交换模块之上的供电模块以及位于该供电模块之上的抽屉结构;A switch module located at the bottom of the chassis, a power supply module located above the switch module, and a drawer structure located above the power supply module;
该抽屉结构内设有控制板卡和FPGA节点板卡,该FPGA节点板卡通过预设接口插接于该控制板卡;The drawer structure is provided with a control board and an FPGA node board, and the FPGA node board is plugged into the control board through a preset interface;
该供电模块的输电端电性连接该交换模块和该控制板卡的电源输入接口,该交换模块的网络交换接口与该FPGA节点板卡的网络接口相连,用于交互FPGA节点板卡之间的数据。The power transmission end of the power supply module is electrically connected to the power input interface of the switch module and the control board, and the network switch interface of the switch module is connected to the network interface of the FPGA node board, and is used to exchange the communication between the FPGA node boards. data.
所述的抽屉式高密度FPGA云平台机箱,其中该抽屉结构内还包括散热风扇,该抽屉结构的尾部安装有用于装卸的把手。In the drawer-type high-density FPGA cloud platform chassis, the drawer structure further includes a cooling fan, and a handle for loading and unloading is installed at the rear of the drawer structure.
所述的抽屉式高密度FPGA云平台机箱,其中该FPGA节点板卡还具有PCIe接口,该FPGA节点板卡可通过该PCIe接口连接x86服务器。In the drawer-type high-density FPGA cloud platform chassis, the FPGA node board further has a PCIe interface, and the FPGA node board can be connected to the x86 server through the PCIe interface.
所述的抽屉式高密度FPGA云平台机箱,其中该供电模块包括用于备用供 电的子供电模块。In the drawer-type high-density FPGA cloud platform chassis, the power supply module includes an electronic power supply module for backup power supply.
所述的抽屉式高密度FPGA云平台机箱,其中该机箱为标准5U服务器机箱。In the drawer-type high-density FPGA cloud platform chassis, the chassis is a standard 5U server chassis.
所述的抽屉式高密度FPGA云平台机箱,其中该机箱侧壁内侧设有滑轨轨道,通过该滑轨轨道与该抽屉结构相连。In the drawer-type high-density FPGA cloud platform chassis, the inner side of the side wall of the chassis is provided with a slide rail, which is connected to the drawer structure through the slide rail.
所述的抽屉式高密度FPGA云平台机箱,其中该FPGA节点板卡供电模块通过供电铜排连接到该控制板卡的取电夹。In the drawer-type high-density FPGA cloud platform chassis, the power supply module of the FPGA node board card is connected to the power take-off clip of the control board card through a power supply copper bar.
所述的抽屉式高密度FPGA云平台机箱,其中还包括固定该FPGA节点板卡的约束装置,该约束装置包括:位于该FPGA节点板卡一侧的开口网板,位于该FPGA节点板卡另一侧的前面板,位于该FPGA节点板卡上方的盖板。The drawer-type high-density FPGA cloud platform chassis further includes a restraint device for fixing the FPGA node board, and the restraint device includes: an opening mesh plate located on one side of the FPGA node board, located on the other side of the FPGA node board. The front panel on one side, the cover above the FPGA node board.
所述的抽屉式高密度FPGA云平台机箱,其中该机箱内包括并排置于该供电模块之上的多个该抽屉结构。In the drawer-type high-density FPGA cloud platform chassis, the chassis includes a plurality of the drawer structures arranged side by side on the power supply module.
所述的抽屉式高密度FPGA云平台机箱,其中该控制板卡通过该预设接口对该FPGA节点板卡进行控制和管理并对板卡的工作状态的实时监测。In the drawer-type high-density FPGA cloud platform chassis, the control board controls and manages the FPGA node board through the preset interface and monitors the working state of the board in real time.
由以上方案可知,本发明的优点在于:本发明将使得FPGA云平台机箱内的FPGA节点板卡可部署密度大幅度提高。降低机箱内的布线成本,简化组装复杂度,减少维护难度。通过使用自主研发的控制管理系统,为用户提供一个更全面、更便捷的开发环境。对机箱及板卡状态实时监控并减少不必要的接线,提高FPGA云平台机箱的可靠性。It can be seen from the above solutions that the present invention has the advantages that the present invention will greatly increase the deployable density of the FPGA node boards in the FPGA cloud platform chassis. Reduce the wiring cost in the chassis, simplify the assembly complexity, and reduce the maintenance difficulty. By using the self-developed control management system, it provides users with a more comprehensive and convenient development environment. Real-time monitoring of the chassis and board status and reduce unnecessary wiring, improve the reliability of the FPGA cloud platform chassis.
附图简要说明Brief Description of Drawings
图1为本发明整体结构图;Fig. 1 is the overall structure diagram of the present invention;
图2为本发明单个抽屉结构的内部构造图;Fig. 2 is the internal structure diagram of the single drawer structure of the present invention;
图3为本发明侧视图;Figure 3 is a side view of the present invention;
图4为本发明机箱的局部图。FIG. 4 is a partial view of the chassis of the present invention.
实现本发明的最佳方式Best Mode for Carrying Out the Invention
本发明针对现有云平台架构的缺点,有效降低FPGA云平台机箱1部署以及维护的成本;使用堆叠式布局、双抽屉结构可在有限的机箱空间内,大幅度提升FPGA节点板卡8的部署密度;通过“一种云端平台计算系统及其应用方法”(申请号201810532745.0)和“一种实现FPGA服务器的方法、装置和系统”(申请号202010019013.9)中设计的控制管理系统,能够更高效的管理 配置FPGA节点板卡,给用户提供一个方便快捷、价格更低廉的FPGA资源使用环境。Aiming at the shortcomings of the existing cloud platform architecture, the present invention effectively reduces the deployment and maintenance costs of the FPGA cloud platform chassis 1; the stacking layout and the double-drawer structure can greatly improve the deployment of the FPGA node board 8 in a limited chassis space Density; through the control management system designed in "a cloud platform computing system and its application method" (application number 201810532745.0) and "a method, device and system for implementing an FPGA server" (application number 202010019013.9), more efficient Manage and configure FPGA node boards, providing users with a convenient, fast and cheaper FPGA resource usage environment.
本发明的技术难点在于,如何在有限的云平台机箱空间内实现高密度FPGA节点的部署,如何有效对机箱内高密度FPGA节点的管理、配置及使用。具体来说本申请包括以下关键点:The technical difficulty of the present invention lies in how to realize the deployment of high-density FPGA nodes in the limited cloud platform chassis space, and how to effectively manage, configure and use the high-density FPGA nodes in the chassis. Specifically, this application includes the following key points:
关键点1:一体化的抽屉结构轨道见图4,抽屉结构2安装时先沿轨道13垂直的部分向下放,然后再沿轨道13水平部分向里推。轨道13位于机箱1内壁两侧。抽屉结构2内部有一切工作的要素(控制板卡6、高密度业务板卡、散热风扇12等),外接电源后可作为一个独立的系统自行工作;技术效果:使用方便,装配快捷;Key point 1: The integrated drawer structure track is shown in Figure 4. When the drawer structure 2 is installed, first put down along the vertical part of the track 13, and then push it inward along the horizontal part of the track 13. The rails 13 are located on both sides of the inner wall of the chassis 1 . The drawer structure 2 has all the working elements (control board 6, high-density business board, cooling fan 12, etc.), and can work as an independent system after external power supply; technical effect: easy to use and fast to assemble;
关键点2:堆叠式结构布局,将机箱1内抽屉结构2、供电模块3、100G交换模块4上下排布,节省机箱1的深度空间;技术效果:高效利用空间,提高机箱1内节点密度;Key point 2: Stacked structure layout, the drawer structure 2, power supply module 3, and 100G switching module 4 in the chassis 1 are arranged up and down, saving the depth space of the chassis 1; Technical effect: efficient use of space and increase the node density in the chassis 1;
关键点3:独立的控制管理单元,通过控制板卡6完成对FPGA节点板卡8的控制和管理并对板卡的工作状态的实时监测;技术效果:合理分配资源,监控板卡状态;Key point 3: Independent control and management unit, through the control board 6 to complete the control and management of the FPGA node board 8 and real-time monitoring of the working status of the board; technical effect: rational allocation of resources, monitoring board status;
关键点4:预设接口10设计,FPGA节点板卡8的状态信息、控制信息及调试接口均可通过预设接口10交互;技术效果:简化机箱1内部连线。Key point 4: The design of the preset interface 10, the status information, control information and debugging interface of the FPGA node board 8 can be interacted with through the preset interface 10; technical effect: Simplify the internal wiring of the chassis 1.
为让本发明的上述特征和效果能阐述的更明确易懂,下文特举实施例,并配合说明书附图作详细说明如下。In order to make the above-mentioned features and effects of the present invention more clearly and comprehensible, embodiments are given below, and detailed descriptions are given below in conjunction with the accompanying drawings.
如图1和图3所示,整个机箱1以堆叠式结构布局,合理利用机箱1的深度空间使其容纳两个抽屉结构2,实现更高密度的FPGA节点板卡8部署。机箱1整体从上至下分别是双抽屉结构2、供电模块3以及100G交换模块4。如图2所示,两个抽屉结构2构造相同,主要用于放置高密度的业务板卡及其散热系统,尾部安装了两个把手5用于装卸。供电模块3由三个子供电模块组成采用两用一备方式供电,两个子供电模块工作,另外一个子供电模块备用。100G交换模块4放置在机箱1的最底部,用于FPGA节点板卡8之间的数据交互。供电模块3需要给控制板卡6和FPGA节点板卡8供电它们都位于机箱1的上部,将其置于中间会离板卡更近,可缩短供电铜排14的长度。交换模块4主要是和FPGA节点板卡8的网络接口连接,用于FPGA节点板卡8之间的数据交 互。As shown in FIG. 1 and FIG. 3 , the entire chassis 1 is laid out in a stacked structure, and the depth space of the chassis 1 is reasonably utilized to accommodate two drawer structures 2 , thereby realizing the deployment of higher-density FPGA node boards 8 . The chassis 1 is composed of a double drawer structure 2 , a power supply module 3 and a 100G switching module 4 respectively from top to bottom. As shown in Figure 2, the two drawer structures 2 have the same structure, and are mainly used for placing high-density service boards and their cooling systems, and two handles 5 are installed at the rear for loading and unloading. The power supply module 3 is composed of three sub-power supply modules and adopts a dual-use and one-standby mode for power supply. Two sub-power supply modules work, and the other sub-power supply module is standby. The 100G switching module 4 is placed at the bottom of the chassis 1 for data interaction between the FPGA node boards 8 . The power supply module 3 needs to supply power to the control board 6 and the FPGA node board 8. They are both located on the upper part of the chassis 1. Placing it in the middle will be closer to the board, which can shorten the length of the power supply copper bar 14. The exchange module 4 is mainly connected with the network interface of the FPGA node board 8, and is used for data interaction between the FPGA node boards 8.
目前机箱1内部可放置两个一体化的抽屉结构2,每个抽屉结构2构成一个小系统,有独立的散热和管理方式,机箱1只需为抽屉结构2提供供电模块3即可,维护方便,更换简单,装卸容易,供电模块3通过供电铜排14连接到抽屉结构2的控制板卡6的取电夹上,具体形式如图4所示。抽屉结构2内的FPGA节点板卡8除了自身的预设接口外还带有标准的PCIe x16接口,该接口用于对板卡的控制管理及数据交互,FPGA节点板卡8可通过该接口直接插在目前市面上通用的x86服务器上,兼容性强。At present, two integrated drawer structures 2 can be placed inside the chassis 1. Each drawer structure 2 constitutes a small system with independent heat dissipation and management methods. The chassis 1 only needs to provide the power supply module 3 for the drawer structure 2, which is convenient for maintenance. , the replacement is simple, the assembly and disassembly are easy, the power supply module 3 is connected to the power taking clip of the control board 6 of the drawer structure 2 through the power supply copper bar 14, and the specific form is shown in Figure 4. In addition to its own preset interface, the FPGA node board 8 in the drawer structure 2 also has a standard PCIe x16 interface. This interface is used for control management and data interaction of the board. The FPGA node board 8 can directly use this interface. It is plugged into the common x86 server on the market and has strong compatibility.
抽屉结构2内部集成了控制板卡6,FPGA节点板卡8通过预设接口10插在控制板卡6上。预设接口10除了为FPGA节点板卡8提供电源外,还集成了以太网通路(可支持支持千兆、万兆及更高速率网络)、监测管理通路、配置调试通路等,实现对FPGA板卡的供电、监测、配置调试等功能。控制板卡6上也可另配备PCIe交换芯片并预留出多个PCIe接口,用于FPGA节点板卡之间的PCIe数据交换。FPGA节点板卡可同时插在预设接口以及PCIe接口上,抽屉结构2内部无需手动连线,可靠性高。抽屉结构2对外仅需提供网络接口,即可实现对FPGA节点板卡8资源的管理及使用。The drawer structure 2 integrates a control board 6 inside, and the FPGA node board 8 is inserted into the control board 6 through a preset interface 10 . In addition to providing power for the FPGA node board 8, the preset interface 10 also integrates an Ethernet channel (which can support Gigabit, 10 Gigabit and higher-speed networks), monitoring and management channels, configuration and debugging channels, etc. Card power supply, monitoring, configuration debugging and other functions. The control board 6 may also be additionally equipped with a PCIe switch chip and reserve multiple PCIe interfaces for PCIe data exchange between the FPGA node boards. The FPGA node board can be plugged into the preset interface and the PCIe interface at the same time, and the drawer structure 2 does not need manual wiring, and has high reliability. The drawer structure 2 only needs to provide a network interface to the outside, so as to realize the management and use of the resources of the FPGA node board 8.
控制板卡6集成智能管理系统,可实时监测机箱1内的温度、功耗等信息,超过限额后会自动触发安全机制。智能管理系统可动态调度FPGA节点板卡8资源,为用户提供安全可靠的使用环境。结构上控制板卡6亦可起到支撑FPGA节点板卡8的作用。The control board 6 integrates an intelligent management system, which can monitor the temperature, power consumption and other information in the chassis 1 in real time, and automatically trigger the safety mechanism when the limit is exceeded. The intelligent management system can dynamically schedule 8 resources of the FPGA node board to provide users with a safe and reliable use environment. Structurally, the control board 6 can also play the role of supporting the FPGA node board 8 .
FPGA节点板卡8安装时上下左右四个方向均有约束对其固定,左侧有机箱1上的开口网板11位置,右侧有FPGA节点板卡8的前面板7,下方的PCIe接口及预设接口10都可支撑,板卡上方有盖板9固定,结构牢固。When the FPGA node board 8 is installed, there are constraints to fix it in four directions. The left side has the opening mesh board 11 on the chassis 1, the right side has the front panel 7 of the FPGA node board 8, and the PCIe interface and The preset interface 10 can be supported, and the cover plate 9 is fixed above the board card, and the structure is firm.
每个抽屉结构2都有自己独立的散热系统风扇12,散热风道通畅,控制板卡6没有高性能CPU,不用过多考虑控制板卡6的散热问题,机箱1内放置两个抽屉结构2时两级风扇12共同工作散热,提升散热性能。Each drawer structure 2 has its own independent cooling system fan 12, and the cooling air ducts are unobstructed. The control board 6 does not have a high-performance CPU, so there is no need to think too much about the heat dissipation of the control board 6. Two drawer structures 2 are placed in the chassis 1. When the two-stage fans 12 work together to dissipate heat, the heat dissipation performance is improved.
本发明的关键点在于通过两个一体化的抽屉式结构大幅度提高了机箱内有限空间的FPGA节点板卡8密度,抽屉结构2自身有散热及给FPGA节点板卡8供电的方式,可脱离机箱1单独工作(需外接电源),抽屉结构2内的控制板卡6与FPGA节点板卡8通过自定义的金手指(预设接口10)互连,去除了 传统机箱内部大量的供电模块3和管理网络布线,便于安装和调试。The key point of the present invention is that the density of the FPGA node board 8 in the limited space in the chassis is greatly improved through two integrated drawer structures. The drawer structure 2 itself has a way of dissipating heat and supplying power to the FPGA node board 8, which can be separated from the The chassis 1 works alone (external power supply is required), and the control board 6 in the drawer structure 2 and the FPGA node board 8 are interconnected through a custom gold finger (preset interface 10), which removes a large number of power supply modules 3 inside the traditional chassis and management network wiring for easy installation and commissioning.
本发明目前可在一个标准的5U服务器机箱内部署32块高性能的全高四分之三长的FPGA节点板卡8。At present, the present invention can deploy 32 high-performance FPGA node boards 8 with full height and three-quarter length in a standard 5U server chassis.
机箱1可以根据板卡数量的实际需求或FPGA板卡的物理尺寸,调整为单抽屉或多抽屉结构2。举例来讲,如果FPGA板卡的横向尺寸较短,则抽屉结构2也可以相应缩短。那么在一个标准服务器机箱内可以前后连续放置多个(大于或等于三个)抽屉结构2,从而更大程度提高服务器机架的物理空间利用率。The chassis 1 can be adjusted to a single-drawer or multi-drawer structure 2 according to the actual requirements of the number of boards or the physical size of the FPGA boards. For example, if the lateral dimension of the FPGA board is shorter, the drawer structure 2 can also be shortened accordingly. Then, multiple (greater than or equal to three) drawer structures 2 can be placed in succession in a standard server chassis, thereby improving the physical space utilization of the server rack to a greater extent.
工业应用性Industrial applicability
本发明提出一种抽屉式高密度FPGA云平台机箱,包括:位于机箱底部的交换模块和位于交换模块上的供电模块以及位于供电模块上的抽屉结构;抽屉结构内设有控制板卡和FPGA节点板卡,FPGA节点板卡通过预设接口插接于控制板卡;供电模块的输电端电性连接交换模块和控制板卡的电源输入接口,交换模块的网络交换接口与FPGA节点板卡的网络接口相连,用于交互FPGA节点板卡之间的数据。本发明将使得FPGA云平台机箱内的FPGA节点板卡可部署密度大幅度提高。降低机箱内的布线成本、装卸复杂度和维护难度。通过使用自主研发的控制管理系统,为用户提供一个全面、便捷的开发环境。对机箱及板卡状态实时监控并通过预设接口减少手工接线数量,提高FPGA云平台机箱的可靠性。The invention provides a drawer-type high-density FPGA cloud platform chassis, comprising: a switch module located at the bottom of the chassis, a power supply module located on the switch module, and a drawer structure located on the power supply module; the drawer structure is provided with a control board card and an FPGA node The board, the FPGA node board is plugged into the control board through a preset interface; the power transmission end of the power supply module is electrically connected to the switching module and the power input interface of the control board, and the network switching interface of the switching module is connected to the network of the FPGA node board. The interfaces are connected to exchange data between the FPGA node boards. The present invention will greatly improve the deployable density of the FPGA node boards in the FPGA cloud platform chassis. Reduce wiring costs, loading and unloading complexity and maintenance difficulty within the chassis. By using the self-developed control management system, it provides users with a comprehensive and convenient development environment. Real-time monitoring of the status of the chassis and board cards, reducing the number of manual wiring through the preset interface, and improving the reliability of the FPGA cloud platform chassis.

Claims (10)

  1. 一种抽屉式高密度FPGA云平台机箱,其特征在于,包括:A drawer-type high-density FPGA cloud platform chassis, characterized in that it includes:
    位于该机箱底部的交换模块和位于该交换模块之上的供电模块以及位于该供电模块之上的抽屉结构;A switch module located at the bottom of the chassis, a power supply module located above the switch module, and a drawer structure located above the power supply module;
    该抽屉结构内设有控制板卡和FPGA节点板卡,该FPGA节点板卡通过预设接口插接于该控制板卡;The drawer structure is provided with a control board and an FPGA node board, and the FPGA node board is plugged into the control board through a preset interface;
    该供电模块的输电端电性连接该交换模块和该控制板卡的电源输入接口,该交换模块的网络交换接口与该FPGA节点板卡的网络接口相连,用于交互FPGA节点板卡之间的数据。The power transmission end of the power supply module is electrically connected to the power input interface of the switch module and the control board, and the network switch interface of the switch module is connected to the network interface of the FPGA node board, and is used to exchange the communication between the FPGA node boards. data.
  2. 如权利要求1所述的抽屉式高密度FPGA云平台机箱,其特征在于,该抽屉结构内还包括散热风扇,该抽屉结构的尾部安装有用于装卸的把手。The drawer-type high-density FPGA cloud platform chassis of claim 1, wherein the drawer structure further includes a cooling fan, and a handle for loading and unloading is installed at the rear of the drawer structure.
  3. 如权利要求1所述的抽屉式高密度FPGA云平台机箱,其特征在于,该FPGA节点板卡还具有PCIe接口,该FPGA节点板卡可通过该PCIe接口连接x86服务器。The drawer-type high-density FPGA cloud platform chassis according to claim 1, wherein the FPGA node board further has a PCIe interface, and the FPGA node board can be connected to the x86 server through the PCIe interface.
  4. 如权利要求1所述的抽屉式高密度FPGA云平台机箱,其特征在于,该供电模块包括用于备用供电的子供电模块。The drawer-type high-density FPGA cloud platform chassis of claim 1, wherein the power supply module includes a sub-power supply module for backup power supply.
  5. 如权利要求1所述的抽屉式高密度FPGA云平台机箱,其特征在于,该机箱为标准5U服务器机箱。The drawer-type high-density FPGA cloud platform chassis of claim 1, wherein the chassis is a standard 5U server chassis.
  6. 如权利要求1所述的抽屉式高密度FPGA云平台机箱,其特征在于,该机箱侧壁内侧设有滑轨轨道,通过该滑轨轨道与该抽屉结构相连。The drawer-type high-density FPGA cloud platform chassis according to claim 1, wherein a slide rail track is provided on the inner side of the side wall of the chassis, and the slide rail track is connected to the drawer structure.
  7. 如权利要求1所述的抽屉式高密度FPGA云平台机箱,其特征在于,该FPGA节点板卡供电模块通过供电铜排连接到该控制板卡的取电夹。The drawer-type high-density FPGA cloud platform chassis according to claim 1, wherein the power supply module of the FPGA node board card is connected to the power take-off clip of the control board card through a power supply copper bar.
  8. 如权利要求1所述的抽屉式高密度FPGA云平台机箱,其特征在于,还包括固定该FPGA节点板卡的约束装置,该约束装置包括:位于该FPGA节点板卡一侧的开口网板,位于该FPGA节点板卡另一侧的前面板,位于该FPGA节点板卡上方的盖板。The drawer-type high-density FPGA cloud platform chassis according to claim 1, further comprising a constraining device for fixing the FPGA node board, the constraining device comprising: an opening mesh plate located on one side of the FPGA node board, The front panel on the other side of the FPGA node board, and the cover above the FPGA node board.
  9. 如权利要求1所述的抽屉式高密度FPGA云平台机箱,其特征在于,该机箱内包括并排置于该供电模块之上的多个该抽屉结构。The drawer-type high-density FPGA cloud platform chassis of claim 1, wherein the chassis includes a plurality of the drawer structures arranged side by side on the power supply module.
  10. 如权利要求1所述的抽屉式高密度FPGA云平台机箱,其特征在于,该控制板卡通过该预设接口对该FPGA节点板卡进行控制和管理并对板卡的工作状态的实时监测。The drawer-type high-density FPGA cloud platform chassis according to claim 1, wherein the control board controls and manages the FPGA node board through the preset interface and monitors the working state of the board in real time.
PCT/CN2021/085808 2020-12-15 2021-04-07 Drawer-type high-density fpga cloud platform case WO2022126937A1 (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115442207A (en) * 2022-07-29 2022-12-06 中电科思仪科技股份有限公司 Hardware operation and maintenance management system based on BMC + SoC + network switching module

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112512262A (en) * 2020-12-15 2021-03-16 中国科学院计算技术研究所 Drawer type high-density FPGA cloud platform case

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN203520283U (en) * 2013-10-18 2014-04-02 纬创资通股份有限公司 Extraction type frame and server
CN204180403U (en) * 2014-09-23 2015-02-25 安徽四创电子股份有限公司 IP multi-media processing cabinet and device
CN206042618U (en) * 2016-08-22 2017-03-22 苏州博思得电气有限公司 Power module mounting structure , power supply cabinet and medical equipment
US20190339747A1 (en) * 2018-05-02 2019-11-07 Wiwynn Corporation Power distribution board, modular chassis system and operating method thereof
CN112512262A (en) * 2020-12-15 2021-03-16 中国科学院计算技术研究所 Drawer type high-density FPGA cloud platform case

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN203520283U (en) * 2013-10-18 2014-04-02 纬创资通股份有限公司 Extraction type frame and server
CN204180403U (en) * 2014-09-23 2015-02-25 安徽四创电子股份有限公司 IP multi-media processing cabinet and device
CN206042618U (en) * 2016-08-22 2017-03-22 苏州博思得电气有限公司 Power module mounting structure , power supply cabinet and medical equipment
US20190339747A1 (en) * 2018-05-02 2019-11-07 Wiwynn Corporation Power distribution board, modular chassis system and operating method thereof
CN112512262A (en) * 2020-12-15 2021-03-16 中国科学院计算技术研究所 Drawer type high-density FPGA cloud platform case

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115442207A (en) * 2022-07-29 2022-12-06 中电科思仪科技股份有限公司 Hardware operation and maintenance management system based on BMC + SoC + network switching module
CN115442207B (en) * 2022-07-29 2024-01-26 中电科思仪科技股份有限公司 Hardware operation and maintenance management system based on BMC+SoC+network switching module

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