WO2022120765A1 - 一种实时超声刺激电信号记录芯片及其制备方法 - Google Patents

一种实时超声刺激电信号记录芯片及其制备方法 Download PDF

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WO2022120765A1
WO2022120765A1 PCT/CN2020/135475 CN2020135475W WO2022120765A1 WO 2022120765 A1 WO2022120765 A1 WO 2022120765A1 CN 2020135475 W CN2020135475 W CN 2020135475W WO 2022120765 A1 WO2022120765 A1 WO 2022120765A1
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chip
electrical signal
real
photoresist
ultrasonic stimulation
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PCT/CN2020/135475
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English (en)
French (fr)
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孟龙
周伟
郑海荣
牛丽丽
林争荣
彭本贤
乌玛儒可
崔英健
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中国科学院深圳先进技术研究院
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Priority to PCT/CN2020/135475 priority Critical patent/WO2022120765A1/zh
Publication of WO2022120765A1 publication Critical patent/WO2022120765A1/zh
Priority to US18/332,697 priority patent/US20230314377A1/en

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    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61N—ELECTROTHERAPY; MAGNETOTHERAPY; RADIATION THERAPY; ULTRASOUND THERAPY
    • A61N7/00—Ultrasound therapy
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/02—Analysing fluids
    • G01N29/022—Fluid sensors based on microsensors, e.g. quartz crystal-microbalance [QCM], surface acoustic wave [SAW] devices, tuning forks, cantilevers, flexural plate wave [FPW] devices
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
    • H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
    • H03H3/08—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of resonators or networks using surface acoustic waves
    • H03H3/10—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of resonators or networks using surface acoustic waves for obtaining desired frequency or temperature coefficient
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02535—Details of surface acoustic wave devices
    • H03H9/02543—Characteristics of substrate, e.g. cutting angles
    • H03H9/02574—Characteristics of substrate, e.g. cutting angles of combined substrates, multilayered substrates, piezoelectrical layers on not-piezoelectrical substrate
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/25—Constructional features of resonators using surface acoustic waves
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B2562/00—Details of sensors; Constructional details of sensor housings or probes; Accessories for sensors
    • A61B2562/12—Manufacturing methods specially adapted for producing sensors for in-vivo measurements
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61N—ELECTROTHERAPY; MAGNETOTHERAPY; RADIATION THERAPY; ULTRASOUND THERAPY
    • A61N7/00—Ultrasound therapy
    • A61N2007/0004—Applications of ultrasound therapy
    • A61N2007/0021—Neural system treatment
    • A61N2007/0026—Stimulation of nerve tissue

Definitions

  • the invention belongs to the technical field of nerve regulation, and in particular relates to a real-time ultrasonic stimulation electrical signal recording chip and a preparation method thereof.
  • Neuromodulation is the excitation, inhibition or regulation of neurons or nerve signal transduction in adjacent or distant parts of the central nervous system, peripheral nervous system and autonomic nervous system through implantable or non-implantable technology, electrical or chemical action It is a biomedical engineering technology that can improve the quality of life of patients and improve neurological function.
  • Ultrasound neuromodulation is a neuromodulation method proposed in recent years. It can non-invasively penetrate the skull to regulate the nerve nuclei of the brain. It has received extensive attention in the treatment of Parkinson's, epilepsy and other diseases.
  • ultrasound neuromodulation The mechanism is not clear. Nerve signal is an electrical signal, and the signal is transmitted on the nerve as a potential change, so the recording of the electrical signal can effectively characterize the response of neurons under the action of ultrasound, so as to study the mechanism of ultrasound neural regulation.
  • the current commercial ultrasonic transducers are bulky and difficult to be compatible with electrophysiological methods, such as calcium imaging, patch clamp and other electrical signal recording methods.
  • the sound field of traditional ultrasonic transducers is not uniform, and the recorded neurons are subjected to ultrasonic waves.
  • the stimulation energy is heavily dependent on its relative position to the transducer, making the results difficult to reproduce. Therefore, it is necessary to develop a chip with uniform ultrasonic energy, easy operation, and real-time recording of neuronal electrical signals under ultrasonic stimulation.
  • the present invention provides a preparation method of a real-time ultrasonic stimulation electrical signal recording chip. real-time recording.
  • Another object of the present invention is to provide a real-time ultrasonic stimulation electrical signal recording chip prepared by the above preparation method.
  • a preparation method of a real-time ultrasonic stimulation electrical signal recording chip comprising the following steps:
  • interdigitated electrodes are fabricated on the piezoelectric substrate to obtain a surface acoustic wave chip, specifically:
  • the photoresist is patterned on the piezoelectric substrate by photolithography, and then a metal layer is formed on the patterned piezoelectric substrate by magnetron sputtering, and the photoresist is removed to obtain a surface acoustic wave chip.
  • the S1 is specifically:
  • the prepared film is covered on the photoresist for exposure, and then developed with a developing solution to pattern the photoresist;
  • S13, sputtering magnetron sputtering is performed on the patterned piezoelectric substrate to form a metal layer to obtain a piezoelectric substrate for growing electrodes;
  • the photoresist in the S11 is a positive photoresist AZ5214, and the spin coating conditions are: rotation speed 3000rpm, time 30s;
  • the film is a film
  • the developer is mif300.
  • the S2 is specifically:
  • S21, sputtering make an insulating protective layer on the surface acoustic wave chip obtained in S1 by sputtering;
  • treatment spin-coating a photoresist on the insulating protective layer, cover the prepared film on the photoresist for exposure, then use a developer to develop and etch to form a recording electrode, and obtain A chip that combines interdigital electrodes and recording electrodes.
  • the photoresist in S22 is a negative photoresist SUN1300; the spin coating conditions are: the rotation speed is 3000 rpm and the time is 30 s; the film is a film.
  • the insulating protective layer is selected from at least one of silicon dioxide, photoresist, polyimide, and silicon nitride, that is, any one of the above materials is used to prepare the insulating protective layer. invention.
  • the S3 prepares the PDMS channel, specifically:
  • the PDMS cavity mold is produced by a three-dimensional printing method.
  • the specific process of bonding the PDMS cavity and the chip in the S4 is:
  • Plasma treatment is performed on the PDMS channel and the chip, and then the two are bonded, and baked at 80° C. for 20 minutes to obtain a real-time ultrasonic stimulation electrical signal recording chip;
  • the conditions of the plasma treatment are: power 150W, time 70s.
  • the piezoelectric substrate in S1 is a lithium niobate substrate, a zinc oxide substrate or an aluminum nitride substrate that is polished on both sides at 128°YX.
  • the present invention also protects the real-time ultrasonic stimulation electrical signal recording chip prepared by the above preparation method.
  • the present invention combines the interdigital electrodes with the recording electrodes, that is, the interdigital electrodes that generate surface acoustic wave ultrasound are combined with the multi-channel recording electrodes, so as to realize the real-time recording of multi-channel electrical signals under ultrasonic stimulation, and to realize the neural loop.
  • Real-time recording of electrical signals of multiple neurons to study the mechanism of ultrasonic neural regulation from the neural circuit; and the chip of the present invention does not increase in size compared with commercial multi-channel recording electrodes, which effectively avoids the excessive volume of traditional transducers. Large, incompatible with multi-channel recording electrodes;
  • the relative positions of the interdigital electrodes and the neuron cells at the recording electrode positions are fixed, so that under the same parameters, the cells receive the same energy, which ensures the repeatability of the experiment and the recording of neuron electrical signals. accuracy;
  • neuronal cells or brain slices can be placed in the PDMS cavity for culture, long-term ultrasonic stimulation and electrical signal recording can be realized, and the effect of ultrasonic long-term effects can be studied.
  • Fig. 1 is a preparation process diagram of a surface acoustic wave chip in a preparation method of a real-time ultrasonic stimulation electrical signal recording chip provided in Embodiment 1 of the present invention
  • (a) is the glue coating process on the piezoelectric substrate;
  • (b) is the exposure and development process;
  • (c) is the sputtering process;
  • (d) is the process of obtaining a surface acoustic wave chip after removing the glue;
  • Fig. 2 is a preparation process diagram of a chip combining interdigital electrodes and recording electrodes in a preparation method of a real-time ultrasonic stimulation electrical signal recording chip provided in Embodiment 1 of the present invention
  • (a) is the process of sputtering the insulating protective layer;
  • (b) is the process of gluing, exposure and development;
  • (c) is the etching process;
  • FIG. 3 is a diagram of a preparation process of bonding a PDMS cavity and a chip in a preparation method of a real-time ultrasonic stimulation electrical signal recording chip provided by the present invention 1.
  • This embodiment provides a method for preparing a real-time ultrasonic stimulation electrical signal recording chip, as shown in Figures 1 to 3, including the following steps:
  • the piezoelectric substrate 1 is a 128°YX double-sided polished lithium niobate substrate
  • S13, sputtering magnetron sputtering is performed on the patterned piezoelectric substrate 1 to form a metal layer with a thickness of 200 nm, as shown in Figure 1(c), to obtain a piezoelectric substrate for growing electrodes;
  • an insulating protective layer 4 that is, a silicon dioxide layer, is fabricated on the chip obtained in S1, and the insulating protective layer 4 is processed to form a recording electrode, as shown in FIG. 2, the interdigital electrode and the recording electrode are combined. , that is, a chip comprising a combination of interdigital electrodes and recording electrodes 3;
  • the solvent part is the position of the recording electrode, as shown in Figure 2(b); and
  • the insulating protective layer on the surface of the chip is etched by the etching method, and the protective layer at the position without photoresist is etched to obtain the etched insulating protective layer 5, and the recording electrode is exposed for recording electrical signals. , as shown in Figure 2(c);
  • the chip made by S2 and the PDMS cavity 6 made in S3 are subjected to plasma treatment, the power of the plasma treatment is 150W, the duration is 70s, and then the PDMS cavity 6 is attached to the chip for bonding, 80 °C Bake in an oven for 20 min to obtain the real-time ultrasonic stimulation electrical signal recording chip fabricated for the experiment as shown in FIG. 3 .
  • This embodiment also provides a real-time ultrasonic stimulation electrical signal recording chip prepared by the above preparation method.
  • the real-time ultrasonic stimulation electrical signal recording chip and its preparation method in this embodiment are the same as those in Embodiment 1, except that the piezoelectric substrate in S1 is a zinc oxide substrate during preparation in this embodiment.
  • the real-time ultrasonic stimulation electrical signal recording chip and its preparation method in this embodiment are the same as those in Embodiment 1, except that the piezoelectric substrate in S1 is an aluminum nitride substrate during preparation in this embodiment.
  • the real-time ultrasonic stimulation electrical signal recording chip and its preparation method in this embodiment are the same as those in Embodiment 1, except that the insulating protective layer in S2 is photoresist during preparation in this embodiment.
  • the real-time ultrasonic stimulation electrical signal recording chip and its preparation method in this embodiment are the same as those in Embodiment 1, except that the insulating protective layer in S2 is polyimide during preparation in this embodiment.
  • the real-time ultrasonic stimulation electrical signal recording chip and its preparation method in this embodiment are the same as those in Embodiment 1, except that the insulating protective layer in S2 is silicon nitride during preparation in this embodiment.
  • the specific processes in the above-mentioned embodiments of the present invention such as spin coating time, thickness, baking time, photoresist, developer, film, etc., are only used to explain the embodiments, and do not limit the present invention;
  • the specific conditions such as spin coating time and thickness of the present invention can be adjusted according to actual needs.
  • Other specific conditions conforming to the preparation method of the present invention are applicable to the present invention, and the preparation method and/or preparation method of the present invention can be used to obtain the present invention.
  • the real-time ultrasonic stimulation electrical signal recording chip belongs to the protection scope of the present invention.

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Abstract

一种实时超声刺激电信号记录芯片的制备方法，该制备方法包括以下步骤：S1，在压电基底(1)上制作叉指电极，得到声表面波芯片，并制作记录电极和电极引线；S2，在S1得到的芯片上制作绝缘保护层(4)，并对绝缘保护层(4)处理形成记录电极，得到将叉指电极和记录电极结合的芯片；S3，制备PDMS腔道(6)；S4，将S3制备的PDMS腔道(6)与S2得到的芯片键合，得到实时超声刺激电信号记录芯片。通过将产生声表面波超声的叉指电极与多通道记录电极结合，实现了超声刺激下多通道电信号的实时记录，能够实现神经环路上多个神经元电信号的实时记录，有效解决了传统换能器由于体积过大，与多通道记录电极不兼容的问题。

Description

一种实时超声刺激电信号记录芯片及其制备方法 技术领域
本发明属于神经调控技术领域，具体涉及一种实时超声刺激电信号记录芯片及其制备方法。
背景技术
长期以来，运动性障碍、疼痛、癫痫、帕金森病、精神疾病和心绞痛等精神类疾病严重影响着人类的健康和生活质量。尽管不断有新的抗精神病药物被应用于临床，但是，仍然有相当一部分病人对药物治疗不敏感或疗效不满意。神经调控治疗方法属于近年来较为热门的治疗方法，对多种神经类疾病具有良好的治疗效果，发展速度较快。
神经调控是通过植入性或非植入性技术、电或化学作用方式，对中枢神经系统、周围神经系统和自主神经系统邻近或远隔部位神经元或神经信号转导发挥兴奋、抑制或调节作用，从而达到改善患者生活质量、提高神经功能之目的的生物医学工程技术。
超声神经调控是近些年提出的一种神经调控手段，其可以无创的穿透颅骨对大脑的神经核团进行调控，在治疗帕金森、癫痫等疾病方面受到了广泛的关注，然而超声神经调控的机制并不清晰。神经信号是一种电信号，信号在神经上传递时表现为电位变化，所以对电信号的记录可以有效的表征超声作用下神经元的反应从而对超声神经调控的机制进行研究。然而目前商用超声换能器体积巨大，很难和电生理手段，例如钙成像、膜片钳等电信号记录手段相兼容，并且传统超 声换能器的声场不均匀，被记录神经元受到的超声刺激能量严重依赖于其与换能器的相对位置，使得结果难以重复。所以开发一种超声能量均匀，易于操作，并且可以实现超声刺激下神经元电信号实时记录的芯片十分必要。
发明内容
有鉴于此，本发明针对上述问题，提供一种实时超声刺激电信号记录芯片的制备方法，通过将叉指电极和记录电极结合的芯片，并键合PDMS腔道，实现了超声刺激下电信号的实时记录。
本发明的另一个目的是提供采用上述制备方法制备得到的实时超声刺激电信号记录芯片。
本发明所采用的技术方案是：
一种实时超声刺激电信号记录芯片的制备方法，包括以下步骤：
S1，在压电基底上制作叉指电极，得到声表面波芯片并制作记录电极和电极引线；
S2，在所述S1得到的芯片上制作绝缘保护层，并对所述绝缘保护层处理形成记录电极，得到将叉指电极和记录电极结合的芯片；
S3，制备PDMS腔道；
S4，将所述S3制备的PDMS腔道与所述S2得到的芯片键合，得到实时超声刺激电信号记录芯片。
优选地，所述S1中在压电基底上制作叉指电极，得到声表面波芯片，具体为：
在所述压电基底上通过光刻将光刻胶进行图形化，再通过磁控溅 射在所述图形化的压电基底上形成金属层，去除光刻胶，得到声表面波芯片。
优选地，所述S1具体为：
S11，涂胶：在所述压电基底表面旋涂厚度为1-5μm的光刻胶，并加热；
S12，曝光和显影：将制作好的胶片覆盖于所述光刻胶上进行曝光，然后采用显影液进行显影，以对光刻胶进行图形化；
S13，溅射：对所述图形化的压电基底进行磁控溅射，形成金属层，得到生长电极的压电基底；
S14，去胶：将所述S13得到的生长电极的压电基底于丙酮溶液中进行超声波清洗，剥离光刻胶，得到声表面波芯片。
优选地，所述S11中光刻胶为正光刻胶AZ5214，所述旋涂条件为：转速3000rpm，时间30s；
所述S12中胶片为菲林片，所述显影液为mif300。
优选地，所述S2具体为：
S21，溅射：在所述S1得到的声表面波芯片上通过溅射的方法制作绝缘保护层；
S22，处理：在所述绝缘保护层上旋涂光刻胶，将制作好的胶片覆盖于所述光刻胶上进行曝光，然后采用显影液进行显影，并进行刻蚀，形成记录电极，得到将叉指电极和记录电极结合的芯片。
优选地，所述S22中光刻胶为负光刻胶SUN1300；所述旋涂条件为：转速3000rpm，时间30s；所述胶片为菲林片。
具体实施中，所述绝缘保护层选自二氧化硅、光刻胶、聚酰亚胺、氮化硅中的至少一种，即采用上述材料中的任意一种制备绝缘保护层均适用于本发明。
优选地，所述S3制备PDMS腔道，具体为：
制作PDMS腔道模具，在所述PDMS腔道模具中浇铸PDMS，待所述PDMS固化后剥离，得到PDMS腔道；
其中，所述PDMS腔道模具通过三维打印方法制作。
优选地，所述S4中将PDMS腔道与芯片进行键合的具体过程为：
将所述PDMS腔道和所述芯片进行等离子处理，然后将两者进行键合，并于80℃烘烤20min，得到实时超声刺激电信号记录芯片；
其中，所述等离子处理的条件为：功率150W，时间70s。
优选地，所述S1中压电基底为128°YX双面抛光的铌酸锂基底、氧化锌基底或者氮化铝基底。
本发明还保护通过上述制备方法制备得到的实时超声刺激电信号记录芯片。
本发明的有益效果是：
1、本发明将叉指电极与记录电极结合，也就是将产生声表面波超声的叉指电极与多通道记录电极结合，实现了超声刺激下多通道电信号的实时记录，能够实现神经环路上多个神经元电信号的实时记录，从神经环路上对超声神经调控机制进行研究；并且本发明的芯片与商用的多通道记录电极相比尺寸并无增加，有效避免了传统换能器体积过大，与多通道记录电极不兼容的问题；
2、本发明的芯片中叉指电极与记录电极位置的神经元细胞的相对位置固定，使得相同参数下，细胞受到的能量相同，确保了实验的可重复性，保证了神经元电信号记录的准确性；
3、通过PDMS腔道的设置，能够将神经元细胞或者脑片放置在PDMS腔道内培养，可以实现长时程的超声刺激和电信号的记录，可以研究超声长时间作用的效果。
附图说明
图1为本发明实施例1提供的一种实时超声刺激电信号记录芯片的制备方法中声表面波芯片的制备过程图；
图中：(a)为在压电基底涂胶过程；(b)为曝光和显影过程；(c)为溅射过程；(d)为去胶后得到声表面波芯片的过程；
图2为本发明实施例1提供的一种实时超声刺激电信号记录芯片的制备方法中将叉指电极和记录电极结合的芯片的制备过程图；
图中：(a)为溅射绝缘保护层的过程；(b)为涂胶、曝光和显影过程；(c)为刻蚀过程；
图3为本发明1提供的一种实时超声刺激电信号记录芯片的制备方法中PDMS腔道与芯片键合的制备过程图。
图中：1、压电基底；2、光刻胶；3、叉指电极和记录电极的结合；4、绝缘保护层；5、被刻蚀后的绝缘保护层；6、PDMS腔道。
具体实施方式
为了使本发明的目的、技术方案及优点更加清楚明白，以下结合实施例，对本发明进行进一步详细说明。应当理解，此处所描述的具 体实施例仅仅用以解释本发明，并不用于限定本发明。
实施例1
本实施例提供了一种实时超声刺激电信号记录芯片的制备方法，如图1-图3所示，包括以下步骤：
S1，在压电基底1上制作叉指电极，得到声表面波芯片，并制作记录电极和电极引线；
具体为：
S11，涂胶：在完全清晰清洗干净的所述压电基底1表面，将正光刻胶AZ5214以3000rpm旋涂30s，得到图1(a)所示的厚度为1-5μm的光刻胶2，并于65℃加热板上烘烤3min；
其中，所述压电基底1为128°YX双面抛光的铌酸锂基底；
S12，曝光和显影：将制作好的菲林片覆盖在图1(a)所示的光刻胶2上面进行曝光，有图案部分不透光，无图案部分透光，有光透过的部分会固化；再采用mif300进行显影的时候固化部分被溶解，非固化部分不会被溶解，显影形成如图1(b)所示的图形；
S13，溅射：对所述图形化的压电基底1进行磁控溅射，形成厚度为200nm的金属层，如图1(c)所示，得到生长电极的压电基底；
S14，去胶：将所述S13得到的生长电极的压电基底于丙酮溶液中进行超声波清洗，剥离光刻胶，如图1(d)所示，得到声表面波芯片。
S2，在所述S1得到的芯片上制作绝缘保护层4，即二氧化硅层，并对所述绝缘保护层4处理形成记录电极，如图2所示，得到将叉指 电极和记录电极结合，即包括叉指电极和记录电极的结合3的芯片；
具体为：
S21，溅射：对已经制备好的芯片进行清洗，通过溅射的方法制备绝缘保护层4，如图2(a)所示；
S22，处理：在完全清洗干净的芯片的表面，将负光刻胶SUN1300以3000rpm旋涂30s，然后将制作好的菲林片覆盖在上面进行曝光，有图案部分不透光，无图案部分透光，有光透过的部分会固化，进行显影的时候固化部分不被溶解，非固化部分不被溶解，通过菲林片的设计，溶剂部分为记录电极位置，如图2(b)所示；并通过刻蚀的方法对芯片表面绝缘保护层进行刻蚀，没有光刻胶的位置保护层被刻蚀，得到被刻蚀后的绝缘保护层5，记录电极显现出来，用于对电信号进行记录，如图2(c)所示；
S3，制备PDMS腔道6；
具体为：
S31，通过3D打印PDMS腔道模具；
S32，浇铸PDMS：将PDMS的A胶与B胶按质量比10:1进行配比，混合均匀，倒入模具中，抽真空除去PDMS中的气泡，最后将培养皿放在80℃烘箱内30min，使PDMS固化；
S33，剥离：将PDMS腔道6剥离出来；
S4，将所述S3制备的PDMS腔道6与所述S2得到的芯片键合，得到实时超声刺激电信号记录芯片。
具体为：将所述S2制作好的芯片和S3制作的PDMS腔道6进 行等离子处理，等离子处理的功率为150W，持续时间70s，然后将PDMS腔道6贴在芯片上进行键合，80℃烘箱中烘烤20min，得到图3所示制作好的用于实验的实时超声刺激电信号记录芯片。
本实施例还提供通过上述制备方法制备得到的实时超声刺激电信号记录芯片。
实施例2
本实施例的实时超声刺激电信号记录芯片及其制备方法与实施例1相同，不同的是本实施例制备时S1中压电基底为氧化锌基底。
实施例3
本实施例的实时超声刺激电信号记录芯片及其制备方法与实施例1相同，不同的是本实施例制备时S1中压电基底为氮化铝基底。
实施例4
本实施例的实时超声刺激电信号记录芯片及其制备方法与实施例1相同，不同的是本实施例制备时S2中绝缘保护层为光刻胶。
实施例5
本实施例的实时超声刺激电信号记录芯片及其制备方法与实施例1相同，不同的是本实施例制备时S2中绝缘保护层为聚酰亚胺。
实施例6
本实施例的实时超声刺激电信号记录芯片及其制备方法与实施例1相同，不同的是本实施例制备时S2中绝缘保护层为氮化硅。
具体实施中，本发明上述实施例中的具体过程，例如旋涂时间、厚度、烘烤时间、光刻胶、显影液、胶片等均仅仅用于解释实施例， 并不对本发明进行限定；即本发明的旋涂时间、厚度等具体条件根据实际需要调整即可，符合本发明的制备方法的其他具体条件均适用于本发明，且能够使用本发明的制备方法和/或制备得到本发明的实时超声刺激电信号记录芯片均属于本发明的保护范围。
以上所述，仅为本发明较佳的具体实施方式，但本发明的保护范围并不局限于此，任何熟悉本技术领域的技术人员在本发明揭露的技术范围内，可轻易想到的变化或替换，都应涵盖在本发明的保护范围之内。因此，本发明的保护范围应该以权利要求的保护范围为准。

Claims (10)

  1. 一种实时超声刺激电信号记录芯片的制备方法，其特征在于，包括以下步骤：
    S1，在压电基底上制作叉指电极，得到声表面波芯片,并制作记录电极和电极引线；
    S2，在所述S1得到的芯片上制作绝缘保护层，并对所述绝缘保护层处理形成记录电极，得到将叉指电极和记录电极结合的芯片；
    S3，制备PDMS腔道；
    S4，将所述S3制备的PDMS腔道与所述S2得到的芯片键合，得到实时超声刺激电信号记录芯片。
  2. 根据权利要求1所述的一种实时超声刺激电信号记录芯片的制备方法，其特征在于，所述S1中在压电基底上制作叉指电极，得到声表面波芯片，具体为：
    在所述压电基底上通过光刻将光刻胶进行图形化，再通过磁控溅射在所述图形化的压电基底上形成金属层，去除光刻胶，得到声表面波芯片。
  3. 根据权利要求2所述的一种实时超声刺激电信号记录芯片的制备方法，其特征在于，所述S1具体为：
    S11，涂胶：在所述压电基底表面旋涂厚度为1-5μm的光刻胶，并加热；
    S12，曝光和显影：将制作好的胶片覆盖于所述光刻胶上进行曝光，然后采用显影液进行显影，以对光刻胶进行图形化；
    S13，溅射：对所述图形化的压电基底进行磁控溅射，形成金属层，得到生长电极的压电基底；
    S14，去胶：将所述S13得到的生长电极的压电基底于丙酮溶液中进行超声波清洗，剥离光刻胶，得到声表面波芯片。
  4. 根据权利要求3所述的一种实时超声刺激电信号记录芯片的制备方法，其特征在于，所述S11中光刻胶为正光刻胶AZ5214，所述旋涂条件为：转速3000rpm，时间30s；
    所述S12中胶片为菲林片，所述显影液为mif300。
  5. 根据权利要求1所述的一种实时超声刺激电信号记录芯片的制备方法，其特征在于，所述S2具体为：
    S21，溅射：在所述S1得到的声表面波芯片上通过溅射的方法制作绝缘保护层；
    S22，处理：在所述绝缘保护层上旋涂光刻胶，将制作好的胶片覆盖于所述光刻胶上进行曝光，然后采用显影液进行显影，并进行刻蚀，形成记录电极，得到将叉指电极和记录电极结合的芯片。
  6. 根据权利要求5所述的一种实时超声刺激电信号记录芯片的制备方法，其特征在于，所述S22中光刻胶为负光刻胶SUN1300；所述旋涂条件为：转速3000rpm，时间30s；所述胶片为菲林片。
  7. 根据权利要求1所述的一种实时超声刺激电信号记录芯片的制备方法，其特征在于，所述S3制备PDMS腔道，具体为：
    制作PDMS腔道模具，在所述PDMS腔道模具中浇铸PDMS，待所述PDMS固化后剥离，得到PDMS腔道；
    其中，所述PDMS腔道模具通过三维打印方法制作。
  8. 根据权利要求1所述的一种实时超声刺激电信号记录芯片的制备方法，其特征在于，所述S4中将PDMS腔道与芯片进行键合的具体过程为：
    将所述PDMS腔道和所述芯片进行等离子处理，然后将两者进行键合，并于80℃烘烤20min，得到实时超声刺激电信号记录芯片；
    其中，所述等离子处理的条件为：功率150W，时间70s。
  9. 根据权利要求1～8任一项所述的一种实时超声刺激电信号记录芯片的制备方法，其特征在于，所述S1中压电基底为128°YX双面抛光的铌酸锂基底、氧化锌基底或者氮化铝基底。
  10. 根据权利要求1～9任一项所述的制备方法制备得到的实时超声刺激电信号记录芯片。
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Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20130101604A (ko) * 2012-02-03 2013-09-16 한국과학기술원 마이크로컨트롤러 기반의 신경 자극용 다채널 실시간 피드백 시스템
US20160271427A1 (en) * 2015-03-16 2016-09-22 Cornell University Electro-ultrasonic devices for nerve stimulation and treatment
CN106037723A (zh) * 2016-05-17 2016-10-26 西安交通大学 用于经颅超声神经刺激的脑部电生理信号记录装置及方法
CN106390306A (zh) * 2016-09-06 2017-02-15 深圳先进技术研究院 一种超声神经调控系统
US20170108926A1 (en) * 2015-10-20 2017-04-20 The San Diego University Research Foundation Apparatus and method of implantable bidirectional wireless neural recording and stimulation
CN109985672A (zh) * 2017-12-29 2019-07-09 深圳先进技术研究院 一种微流控芯片、装置、系统、控制及制备方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20130101604A (ko) * 2012-02-03 2013-09-16 한국과학기술원 마이크로컨트롤러 기반의 신경 자극용 다채널 실시간 피드백 시스템
US20160271427A1 (en) * 2015-03-16 2016-09-22 Cornell University Electro-ultrasonic devices for nerve stimulation and treatment
US20170108926A1 (en) * 2015-10-20 2017-04-20 The San Diego University Research Foundation Apparatus and method of implantable bidirectional wireless neural recording and stimulation
CN106037723A (zh) * 2016-05-17 2016-10-26 西安交通大学 用于经颅超声神经刺激的脑部电生理信号记录装置及方法
CN106390306A (zh) * 2016-09-06 2017-02-15 深圳先进技术研究院 一种超声神经调控系统
CN109985672A (zh) * 2017-12-29 2019-07-09 深圳先进技术研究院 一种微流控芯片、装置、系统、控制及制备方法

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