WO2022116120A1

WO2022116120A1 - Pressure detection module and electronic device

Info

Publication number: WO2022116120A1
Application number: PCT/CN2020/133710
Authority: WO
Inventors: 黄瑞朗; 蔡军; 徐兴浪; 肖鹏
Original assignee: 深圳市汇顶科技股份有限公司
Priority date: 2020-12-03
Filing date: 2020-12-03
Publication date: 2022-06-09

Abstract

A pressure detection module (10) provided on an inner surface of a housing (20) of an electronic device. The pressure detection module (10) comprises a first electrode (101) and a second electrode (102). A first surface of the first electrode (101) is fixed to an inner surface of a force input region of the housing (20); the two ends of a second surface of the first electrode (101) are respectively fixed onto the two ends of a first surface of the second electrode (102); and a compressible insulating layer is provided between the second surface of the first electrode (101) and the first surface of the second electrode (102), so that the first electrode (101) and the second electrode (102) form a capacitor. The force input region of the housing (20) drives, according to received external pressure, the first electrode (101) to move toward the direction of the second electrode (102) to cause the capacitance between the first electrode (101) and the second electrode (102) to change, so as to determine a pressure detection result for the external pressure. The pressure detection module (10) can implement pressure detection by merely being mounted on the inner surface of the force input region of the housing (20), without using a bracket, and the thickness of the pressure detection module (10) is small, thereby facilitating the mounting of other components inside an electronic device. The present invention also relates to an electronic device.

Description

Pressure detection module and electronic equipment

technical field

The present application relates to the field of electronic technology, and in particular, to a pressure detection module and an electronic device.

Background technique

Electronic devices such as earphones can detect whether they are pressed through the pressure detection module installed inside, so as to perform operation control corresponding to the pressing. For example, the pressure detection module installed in the earphone determines whether the earphone is pressed, so as to control the playback of music in the earphone. The pressure detection module is usually installed in a small space of an electronic device. How to reduce the internal space of the electronic device occupied by the pressure detection module, especially the thickness of the electronic device, has become an urgent technical problem to be solved.

SUMMARY OF THE INVENTION

In view of this, one of the technical problems solved by the embodiments of the present application is to provide a pressure detection module and an electronic device to partially or completely solve the technical problems existing in the prior art.

In a first aspect, an embodiment of the present application provides a pressure detection module, the pressure detection module is disposed on the inner surface of a casing of an electronic device, and the pressure detection module includes: a first electrode and a second electrode; The first surface of the first electrode is fixed on the inner surface of the force input area of the casing, the two ends of the second surface of the first electrode are respectively fixed on the two ends of the first surface of the second electrode, and A compressible insulating layer is provided between the second surface of the first electrode and the first surface of the second electrode so that the first electrode and the second electrode form a capacitance; the force input area of the housing is based on the received The external pressure drives the first electrode to move in the direction of the second electrode, so that the capacitance between the first electrode and the second electrode changes, so as to determine the pressure detection result of the external pressure.

In a second aspect, an embodiment of the present application provides an electronic device, wherein a housing of the electronic device has at least one pressure detection module as described above.

In the pressure detection module and the electronic device provided by the embodiments of the present application, since the first surface of the first electrode included in the pressure detection module is fixed on the inner surface of the force input area of the casing, the two ends of the second surface of the first electrode are They are respectively fixed on both ends of the first surface of the second electrode, and there is a compressible insulating layer between the second surface of the first electrode and the first surface of the second electrode. When the force input area of the casing receives the external pressure, it drives the first electrode to move in the direction of the second electrode, and the pressure detection result of the external pressure is determined by the change of the capacitance between the first electrode and the second electrode. Therefore, the pressure detection module of the embodiment of the present application only needs to be installed on the inner surface of the force input area of the casing to realize pressure detection, without the need for a bracket and the thickness of the pressure detection module is small, thereby facilitating the installation of other components inside the electronic device.

Description of drawings

Hereinafter, some specific embodiments of the embodiments of the present application will be described in detail by way of example and not limitation with reference to the accompanying drawings. The same reference numbers in the figures designate the same or similar parts or parts. It will be understood by those skilled in the art that the drawings are not necessarily to scale. In the attached picture:

1 is a structural diagram of a pressure detection module provided by an embodiment of the application;

2 is a structural diagram of another pressure detection module provided by an embodiment of the present application;

3 is a structural diagram of yet another pressure detection module provided by an embodiment of the present application;

4 is a structural diagram of yet another pressure detection module provided by an embodiment of the present application;

5 is a structural diagram of yet another pressure detection module provided by an embodiment of the present application;

6 is a structural diagram of yet another pressure detection module provided by an embodiment of the present application;

7 is a structural diagram of yet another pressure detection module provided by an embodiment of the present application;

8 is a structural diagram of yet another pressure detection module provided by an embodiment of the present application;

9 is a structural diagram of yet another pressure detection module provided by an embodiment of the present application;

10 is a structural diagram of yet another pressure detection module provided by an embodiment of the application;

FIG. 11 is a schematic diagram of the installation of an earphone according to an embodiment of the application;

FIG. 12 is a schematic diagram of the internal structure of an earphone according to an embodiment of the application;

FIG. 13 is a schematic diagram of installation of another earphone according to an embodiment of the present application.

Detailed ways

In order to solve the above problems, the embodiments of the present application provide a pressure detection module and an electronic device, and the specific implementation of the embodiments of the present application will be further described below with reference to the accompanying drawings of the embodiments of the present invention.

An embodiment of the present application provides a pressure detection module. As shown in FIG. 1 , FIG. 1 is a structural diagram of a pressure detection module provided by the first embodiment of the present application. The pressure detection module 10 is disposed on the inner surface of the casing 20 of the electronic device. The pressure detection module 10 includes a first electrode 101 and a second electrode 102 .

The first surface of the first electrode 101 is fixed on the inner surface of the force input area of the casing 20, the two ends of the second surface of the first electrode 101 are respectively fixed on the two ends of the first surface of the second electrode 102, and the first A compressible insulating layer is provided between the second surface of the electrode 101 and the first surface of the second electrode 102 so that the first electrode and the second electrode form a capacitance.

The force input area of the housing 20 drives the first electrode 101 to move in the direction of the second electrode 102 according to the received external pressure, so as to change the capacitance between the first electrode 101 and the second electrode 102 to determine the pressure against the external pressure Test results.

Specifically, the force input area of the housing 20 is an area of any shape, the force input area can use any sign to indicate that the user can apply pressure in this area, and the position of the center of the force input area corresponds to the position of the center of the first electrode, so that the user can The external pressure exerted by the force input area drives the first electrode to move in the direction of the second electrode.

When the force input area of the housing 20 receives external force and deforms, the center of the force input area deforms the most, and the inner surface corresponding to the center of the force input area is the center of the first electrode 101 . When the force input area of the casing 20 receives an external force, the first electrode 101 fixed to the casing 20 deforms with the deformation of the casing 20 , and the center of the first electrode 101 deforms the most. Since both ends of the first electrode 101 and the second electrode 102 are fixed, disposed opposite to each other and have a compressible insulating layer, the second electrode 102 follows the deformation and displacement of the two ends fixed to the first electrode 101 . Since the center deformation displacement of the first electrode 101 is greater than the deformation displacement of both ends, the compressible insulating layer between the first electrode 101 and the second electrode 102 is changed, so that the space between the first electrode 101 and the second electrode 102 is changed. The change of the capacitance, the pressure detection result of the external pressure can be determined according to the change of the capacitance.

Specifically, the two ends of the second surface of the first electrode 101 and the two ends of the first surface of the second electrode 102 refer to the ends or positions close to the ends.

The pressure detection module of the embodiment of the present application only needs to be installed on the inner surface of the force input area of the housing to realize pressure detection, without the need for a bracket and the thickness of the pressure detection module is small, which facilitates the installation of other components inside the electronic device, and facilitates the installation of other components inside the electronic device. Reduce the interference effect of pressure detection module and other electronic components in miniaturized electronic equipment.

In a specific implementation of the first embodiment of the present application, referring to FIG. 2 , the pressure detection module 10 further includes: a first circuit board 103 , the first surface of the first circuit board 103 is fixed on the inner surface of the force input area of the housing, the first circuit board 103 The second surface of the circuit board 103 is fixed to the first surface of the first electrode 101 .

The arrangement of the first circuit board 103 of the present application simplifies the circuit structure of the pressure detection module of the present application, facilitates manufacture and further saves the internal space of the electronic device.

Specifically, in order to simplify the manufacturing process of the pressure detection module and facilitate the installation of the pressure detection module in the electronic equipment, the first circuit board 103 is a flexible printed circuit board, which can be more conducive to arranging the pressure detection module in a relatively small interior space. In a small electronic device, for example, it is convenient to arrange the pressure detection module in the rod portion of the earphone with a small internal space, and the thickness of the first circuit board 103 is usually 0.12 mm.

In a specific implementation of the embodiment of the present application, referring to FIG. 3 , the pressure detection module 10 further includes: a first adhesive layer 105 .

The first surface of the first circuit board 103 is fixed to the inner surface of the force input area of the housing 20 by the first adhesive layer 105 .

In the embodiment of the present application, the first circuit board is adhered to the inner surface of the force input area of the housing 20 through the first adhesive layer, which makes the installation easier.

Specifically, the first adhesive layer 105 is a layered structure in which both upper and lower surfaces have adhesive force, so as to easily realize the adhesion between the first circuit board and the inner surface of the force input area of the housing.

For easier and lower cost installation, the first adhesive layer is a double-sided tape.

In order to achieve the adhesion effect of the first adhesive layer and reduce the thickness of the first adhesive layer as much as possible, so as to occupy a smaller internal space of the electronic device, the thickness of the double-sided adhesive tape is less than or equal to 0.15 mm.

In order to reduce the thickness of the first adhesive layer as much as possible while achieving the adhesion effect, the thickness of the double-sided adhesive tape is 0.1 mm.

In another specific implementation of the embodiment of the present application, referring to FIG. 4 , the first surface of the first circuit board 103 further has at least one touch sensor 30 .

Since the first surface of the first circuit board in the embodiment of the present application has at least one touch sensor, and the second surface is fixed on the first surface of the first electrode, both the touch sensor and the first electrode are installed on the first circuit board in the embodiment of the present application On the other hand, the first electrode for detecting pressure and the touch sensor for detecting touch can both be located on the same side of the casing and at the same position on the same side (that is, the casing where the force input area is located), so that the first circuit board can pass The force input area of the housing simultaneously senses the user's touch and the pressure exerted by the user. Its structure is simple, the installation process can also be simplified, and the simple structure and simplified process can further improve product consistency and improve product yield. . The embodiments of the present application can further save the internal space of the electronic device and facilitate the installation of other internal components.

Specifically, the length of the first circuit board is less than or equal to 10 mm, so as to better enable at least one touch sensor on the first circuit board to realize touch sensing.

In yet another specific implementation of the present application, referring to FIG. 5 , the pressure detection module 10 further includes: a second adhesive layer 106 , and the second adhesive layer 106 includes two adhesive members having the same preset height.

The two ends of the second surface of the first electrode 101 and the two ends of the first surface of the second electrode 102 are respectively fixed by two adhesive members, and the two adhesive members make the second surface of the first electrode 101 and the second electrode 102 The height of the compressible insulating layer between the first surfaces is a predetermined height.

In the embodiment of the present application, the second surface of the first electrode and the two ends of the first surface of the second electrode are fixed by adhesive members having the same preset height, and the middle is compressible due to the preset height of the two adhesive members. Insulation. In the embodiment of the present application, the fixing of the first electrode and the second electrode is simply realized by the adhesive members having the same preset height, and a compressible insulating layer is provided between the first electrode and the second electrode. In the embodiment of the present application, the adhesive members have the same preset height, so that the distances between the different positions of the first electrode and the second electrode are consistent, which can also improve the consistency of the pressure detection module and improve the accuracy of signal detection, avoiding The reason is that the distance between the two electrodes in the same pressure detection module is inconsistent due to the manufacturing process, or the distance between the two electrodes of different pressure detection modules is inconsistent.

Specifically, in order to facilitate installation and manufacture, two adhesive members are respectively located at two ends of the first surface of the second electrode 102 , and the sides of the two adhesive members are connected to the sides of the first electrode 101 and the second electrode 102 . the sides are flush. The embodiment of the present application can further enable the pressure detection module in the limited space of the electronic device to accurately realize pressure sensing, and reduce the thickness of the pressure detection module as much as possible, and reduce the influence of the pressure detection module on other components in the electronic device .

The two adhesive parts are parts with adhesive force on both upper and lower surfaces. Therefore, the adhesive member in the embodiment of the present application can fix the first electrode and the second electrode with a compressible insulating layer therebetween.

Specifically, in order to further simplify the manufacturing process and improve the sensitive detection of the capacitance change between the first electrode and the second electrode, the compressible insulating layer is an air gap.

Specifically, in order to realize the fixing of the first electrode and the second electrode more simply and at low cost, the two adhesive members are double-sided tapes. Therefore, the embodiment of the present application simplifies the manufacturing process and improves the consistency and yield of products.

In order to realize the change of the compressible insulating layer of the first electrode and the second electrode, the change of the compressible insulating layer can reflect the external pressure and minimize the thickness of the compressible insulating layer between the first electrode and the second electrode, so as to occupy a smaller interior of the electronic device. space, the preset height is greater than or equal to 0.1 mm and less than or equal to 0.4 mm. In this way, it can not only ensure the detected pressure signal reaches a certain amount of signal, so as to avoid the failure of the detected signal or the weak detected signal to affect the accuracy of the detected pressure, but also reduce the volume and thickness of the pressure detection module, simplify the manufacturing process and improve product consistency and yield.

In order to achieve better pressure sensing and fixation of the first electrode and the second electrode, the preset height is 0.2 mm.

In yet another specific implementation of the present application, referring to FIG. 6 , the pressure detection module further includes: a second circuit board 104 . The first surface of the second circuit board 104 is fixed to the second surface of the second electrode 102 .

The arrangement of the second circuit board 104 of the present application simplifies the circuit structure of the pressure detection module of the present application, facilitates manufacture and further saves the internal space of the electronic device.

Specifically, in order to simplify the manufacturing process of the pressure detection module and facilitate the installation of the pressure detection module in the electronic equipment, the second circuit board 104 is a flexible printed circuit board, which can be more conducive to arranging the pressure detection module in a relatively small interior space. In a small electronic device, for example, it is convenient to arrange the pressure detection module in the rod portion of the earphone with a small internal space, and the thickness of the second circuit board 104 is usually 0.12 mm.

In yet another specific implementation of the present application, referring to FIG. 7 , the pressure detection module 10 further includes: a second reinforcing plate 107 , and the second reinforcing plate 107 is fixed on the second surface of the second circuit board 104 .

In the embodiment of the present application, the second reinforcing plate is arranged on the second surface of the second circuit board, so that the second circuit board is more closely attached to the second surface of the second electrode, and the supporting effect of the second reinforcing plate is It also makes the second electrode have better flatness.

Specifically, the second reinforcing plate 107 is a steel plate.

In yet another specific implementation of the present application, referring to FIG. 8 , the pressure detection module further includes: a second reinforcing pressing layer 108 , and the second reinforcing plate 107 is fixed to the second circuit board 104 through the second reinforcing pressing layer 108 . on the second surface.

In the embodiment of the present application, the second reinforcing plate is fixed on the second surface of the second circuit board through the second reinforcing pressing layer, which improves the fit and flatness between the second reinforcing plate and the second circuit board.

In order to achieve the reinforcement effect and at the same time reduce the thickness of the second reinforcement plate and the second reinforcement pressure layer as much as possible, so as to occupy a smaller internal space of the electronic equipment, the thickness of the second reinforcement plate and the second reinforcement pressure layer can be reduced as much as possible. The total thickness is less than or equal to 0.15 mm.

In order to achieve the best reinforcement effect while minimizing the thickness of the second reinforcement plate and the second reinforcement pressure-bonding layer, the total thickness of the second reinforcement plate and the second reinforcement pressure-bonding layer is 0.15 mm.

In another specific embodiment of the present application, it can be applied to the embodiment with the first circuit board and without the first adhesive layer. Referring to FIG. 9 , the pressure detection module further includes: a first reinforcing plate 109 , the first reinforcing plate 109 is fixed on the first surface of the first circuit board 103 .

In this embodiment of the present application, the first reinforcing plate is disposed on the first surface of the first circuit board, so that the pressure detection module can be disposed inside the casing of the electronic device as a whole, so that the pressure detection module provided in this embodiment can It is suitable for electronic devices whose casings cannot be disassembled, for example, which is suitable for earphones in which the pull rod is a cylindrical integral structure, which can improve the convenience of installation of the pressure detection module on the electronic device. The supporting function of the first reinforcing plate also enables the first circuit board to have better flatness.

Therefore, when the pressure detection module without the first reinforcing plate is installed in the pull rod (ie, the rod portion of the headset) of electronic equipment such as headphones, the outer shell of the pull rod can be disassembled, that is, the shell of the pull rod is divided into an upper shell and the lower casing, the pressure detection module is first arranged inside the lower casing of the tie rod, and then the upper casing of the tie rod is fastened on the lower casing. For the pressure detection module with the first reinforcing plate, since the strength of the first reinforcing plate is increased, it is not necessary to disassemble the shell of the tie rod, and the whole can be directly arranged inside the cylindrical shell.

Specifically, the first reinforcing plate is made of insulating material, so that the pressure detection module provided by the embodiment of the present application can realize pressure detection and touch detection at the same time.

In yet another specific implementation of the present application, referring to FIG. 10 , the pressure detection module 10 further includes: a first reinforcing pressing layer 110 , and the first reinforcing plate 109 is fixed to the first circuit board 103 through the first reinforcing pressing layer 110 on the first surface.

In the embodiment of the present application, the first reinforcing plate is fixed on the first surface of the first circuit board through the first reinforcing pressing layer, which improves the adhesion between the first reinforcing plate and the first surface of the first circuit board. fit and flatness.

In order to achieve the reinforcing effect and at the same time reduce the thickness of the first reinforcing plate and the first reinforcing pressing layer as much as possible, so as to occupy a smaller internal space of the electronic device, the thickness of the first reinforcing plate and the first reinforcing pressing layer can be reduced as much as possible. The total thickness is less than or equal to 0.2 mm.

In order to achieve the best reinforcing effect and minimize the thickness of the first reinforcing plate and the first reinforcing pressing layer, the total thickness of the first reinforcing plate and the first reinforcing pressing layer is 0.2 mm.

In yet another specific embodiment of the present application, the embodiment of the present application provides an electronic device, and the housing of the electronic device has the pressure detection module in any of the above embodiments.

In the embodiment of the present application, the thickness of the casing is less than or equal to 1 mm. Therefore, the present embodiment can reduce the weight of the casing as much as possible while satisfying the strength of the casing.

Specifically, the electronic devices include: wireless Bluetooth headsets, smart glasses, and the like. The pressure detection module of the embodiment of the present application is installed in the pull rod of the wireless Bluetooth headset or smart glasses, and the pull rod is a rod-shaped part connected to the earpiece or the lens.

Specifically, the electronic device is an earphone or smart glasses, and the pressure detection module is detachably disposed inside the casing of the pull rod of the earphone or smart glasses.

Exemplarily, referring to FIGS. 11 and 12 , when the electronic device is a wireless Bluetooth headset, the pressure detection module 10 is arranged in the pull rod 40 .

In addition, referring to FIG. 11 and FIG. 12 , the pressure detection module is detachably arranged in the pull rod 40 .

Optionally, the pressure detection module is detachably arranged in the middle of the pull rod 40 . It is convenient for the replacement and maintenance of the pressure detection module.

Referring to FIG. 8 , the first surface of the first circuit board 103 is fixed to the inner surface of the force input area of the wireless Bluetooth headset housing 20 through the first adhesive layer 105 , and the first surface of the first circuit board 103 also has at least one touch sensor 30. The second surface of the first circuit board 103 is fixed to the first surface of the first electrode 101 , and both ends of the second surface of the first electrode 101 are respectively fixed by two adhesive members with a preset height of the second adhesive layer 106 . On both ends of the first surface of the second electrode 102 and between the second surface of the first electrode 101 and the first surface of the second electrode 102 there is a compressible insulating layer with a preset height, the second electrode 102 The second surface is fixed on the first surface of the second circuit board 104 . The second reinforcing plate 107 is fixed on the second surface of the second circuit board 104 through the second reinforcing pressing layer 108 .

The force input area of the earphone shell 20 drives the first electrode 101 to move in the direction of the second electrode 102 according to the received external pressure, so that the capacitance between the first electrode 101 and the second electrode 102 changes, so as to determine the response to the external pressure. Pressure test results.

Specifically, the first adhesive layer is a double-sided tape, and the thickness of the double-sided tape is 0.1 mm. The thickness of the first circuit board 103 and/or the second circuit board 104 is 0.12 mm. In this embodiment, the height of the compressible insulating layers of the first electrode and the second electrode is set to be 0.2 mm. The sum of the thicknesses of the second reinforcing plate and the second reinforcing pressing layer is 0.15 mm.

Since the pressure detection module is usually arranged between the bracket inside the wireless Bluetooth earphone casing and the inner surface of the casing, the thickness of the pressure detection module is about 1.5 mm, and the present application can reduce the thickness of the pressure detection module to 0.8 mm, Thus, the internal space of the wireless Bluetooth headset is saved, a bracket is not required, a larger space is provided for the motherboard installation, and the antenna installation is also facilitated, and the interference of the pressure detection module to the antenna is avoided.

Since the first surface of the first circuit board in the embodiment of the present application has at least one touch sensor, and the second surface is fixed on the first surface of the first electrode, the touch sensor and the first electrode are respectively installed on the first circuit board in the embodiment of the present application On both surfaces, the user's touch and user-applied pressure can be simultaneously sensed through the force input area of the housing. The embodiment of the present application further saves the internal space of the electronic device and facilitates the installation of other internal components.

In another specific embodiment of the present application, referring to FIG. 10 , the pressure detection module 10 further includes: a first reinforcing plate 109 , and the first reinforcing plate 109 is fixed to the first circuit through the first reinforcing and pressing layer 110 on the first surface of the board 103 .

Therefore, referring to FIG. 13 , the pressure detection module 10 with the first reinforcing plate is suitable for being non-removably installed inside the casing of the pull rod 40 of the wireless Bluetooth headset as a whole, and the pull rod 40 does not need to be disassembled, which is convenient for installation, replacement and maintenance .

Specifically, the sum of the thicknesses of the first reinforcing plate and the first reinforcing pressing layer is 0.2 mm.

It should also be noted that the terms "comprising", "comprising" or any other variation thereof are intended to encompass a non-exclusive inclusion such that a process, method, article or device comprising a series of elements includes not only those elements, but also Other elements not expressly listed, or inherent to such a process, method, article of manufacture or apparatus are also included. Without further limitation, an element qualified by the phrase "comprising a" does not preclude the presence of additional identical elements in the process, method, article of manufacture, or device that includes the element.

Each embodiment in this specification is described in a progressive manner, and the same and similar parts between the various embodiments may be referred to each other, and each embodiment focuses on the differences from other embodiments. In particular, as for the system embodiments, since they are basically similar to the method embodiments, the description is relatively simple, and for related parts, please refer to the partial descriptions of the method embodiments.

The above are only examples of the present application, and are not intended to limit the present application. Various modifications and variations of this application are possible for those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included within the scope of the claims of the present application.

Claims

A pressure detection module is characterized in that, the pressure detection module is arranged on the inner surface of a casing of an electronic device, and the pressure detection module comprises: a first electrode and a second electrode;

The first surface of the first electrode is fixed on the inner surface of the force input area of the casing, and the two ends of the second surface of the first electrode are respectively fixed on the two ends of the first surface of the second electrode , and there is a compressible insulating layer between the second surface of the first electrode and the first surface of the second electrode so that the first electrode and the second electrode form a capacitance;

The force input area of the casing drives the first electrode to move in the direction of the second electrode according to the received external pressure, so that the capacitance between the first electrode and the second electrode changes to determine The pressure detection result of the external pressure.
The pressure detection module according to claim 1, wherein the pressure detection module further comprises: a first circuit board,

The first surface of the first circuit board is fixed to the inner surface of the force input area of the housing, and the second surface of the first circuit board is fixed to the first surface of the first electrode.
The pressure detection module according to claim 2, wherein the first circuit board is a flexible printed circuit board.
The pressure detection module according to claim 2, wherein the first surface of the first circuit board further has at least one touch sensor.
The pressure detection module according to claim 4, wherein the length of the first circuit board is less than or equal to 10 mm.
The pressure detection module according to claim 2, wherein the pressure detection module further comprises: a first adhesive layer,

The first surface of the first circuit board is fixed to the inner surface of the force input area of the housing by the first adhesive layer.
The pressure detection module according to claim 6, wherein the first adhesive layer is a layered structure with adhesive force on both upper and lower surfaces.
The pressure detection module according to claim 7, wherein the first adhesive layer is a double-sided tape.
The pressure detection module according to claim 8, wherein the thickness of the double-sided adhesive tape is less than or equal to 0.15 mm.
The pressure detection module according to claim 1, wherein the pressure detection module further comprises: a second adhesive layer, the second adhesive layer comprising two adhesive pieces having the same preset height,

The two ends of the second surface of the first electrode and the two ends of the first surface of the second electrode are respectively fixed by the two adhesive parts, and the two adhesive parts make the second surface of the first electrode The height of the compressible insulating layer between the surface and the first surface of the second electrode is the predetermined height.
The pressure detection module according to claim 10, wherein the two adhering parts are respectively located at two ends of the first surface of the second electrode, and the sides of the two adhering parts are connected to the The sides of the first electrode are flush with the sides of the second electrode.
The pressure detection module according to claim 11, wherein the two adhering parts are parts with adhesive force on both upper and lower surfaces.
The pressure detection module according to claim 12, wherein the two adhesive members are double-sided tapes.
The pressure detection module according to claim 13, wherein the preset height is greater than or equal to 0.1 mm and less than or equal to 0.4 mm.
The pressure detection module according to claim 14, wherein the preset height is 0.2 mm.
The pressure detection module according to claim 1, wherein the pressure detection module further comprises: a second circuit board,

The first surface of the second circuit board is fixed to the second surface of the second electrode.
The pressure detection module according to claim 16, wherein the second circuit board is a flexible printed circuit board.
The pressure detection module according to claim 16, wherein the pressure detection module further comprises: a second reinforcing plate,

The second reinforcing plate is fixed on the second surface of the second circuit board.
The pressure detection module according to claim 18, wherein the pressure detection module further comprises: a second reinforcement pressing layer,

The second reinforcing plate is fixed on the second surface of the second circuit board through the second reinforcing pressing layer.
The pressure detection module according to claim 19, wherein the total thickness of the second reinforcing plate and the second reinforcing pressing layer is less than or equal to 0.15 mm.
The pressure detection module according to claim 1, wherein the compressible insulating layer is an air gap.
The pressure detection module according to any one of claims 2 to 5 and 10 to 21, wherein the pressure detection module further comprises: a first reinforcing plate,

The first reinforcing plate is fixed on the first surface of the first circuit board.
The pressure detection module according to claim 22, wherein the pressure detection module further comprises: a first reinforcing and pressing layer,

The first reinforcing plate is fixed on the first surface of the first circuit board through the first reinforcing pressing layer.
The pressure detection module according to claim 23, wherein the total thickness of the first reinforcing plate and the first reinforcing and pressing layer is less than or equal to 0.2 mm.
An electronic device, characterized in that, a housing of the electronic device has at least one pressure detection module in any one of claims 1-24.
The electronic device according to claim 25, wherein the thickness of the casing is less than or equal to 1 mm.
The electronic device according to claim 25, wherein the electronic device is an earphone or smart glasses, and the pressure detection module is detachably arranged inside a casing of a lever of the earphone or smart glasses.
The electronic device according to claim 27, wherein the pressure detection module is detachably disposed in the middle of the pull rod.