WO2022113851A1 - Container provided with rfid module and method for manufacturing container provided with rfid module - Google Patents

Container provided with rfid module and method for manufacturing container provided with rfid module Download PDF

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Publication number
WO2022113851A1
WO2022113851A1 PCT/JP2021/042274 JP2021042274W WO2022113851A1 WO 2022113851 A1 WO2022113851 A1 WO 2022113851A1 JP 2021042274 W JP2021042274 W JP 2021042274W WO 2022113851 A1 WO2022113851 A1 WO 2022113851A1
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WO
WIPO (PCT)
Prior art keywords
container
antenna
rfid module
pattern
film
Prior art date
Application number
PCT/JP2021/042274
Other languages
French (fr)
Japanese (ja)
Inventor
亮平 大森
登 加藤
浩和 矢▲崎▼
幹子 齋藤
Original Assignee
株式会社村田製作所
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社村田製作所 filed Critical 株式会社村田製作所
Priority to JP2022549685A priority Critical patent/JP7243931B2/en
Publication of WO2022113851A1 publication Critical patent/WO2022113851A1/en
Priority to US18/301,592 priority patent/US20230259735A1/en

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Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773—Antenna details
    • G06K19/07777—Antenna details the antenna being of the inductive type
    • G06K19/07779—Antenna details the antenna being of the inductive type the inductive antenna being a coil
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D25/00—Details of other kinds or types of rigid or semi-rigid containers
    • B65D25/20—External fittings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D5/00—Rigid or semi-rigid containers of polygonal cross-section, e.g. boxes, cartons or trays, formed by folding or erecting one or more blanks made of paper
    • B65D5/42—Details of containers or of foldable or erectable container blanks
    • B65D5/44—Integral, inserted or attached portions forming internal or external fittings
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/0772—Physical layout of the record carrier
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q19/00—Combinations of primary active antenna elements and units with secondary devices, e.g. with quasi-optical devices, for giving the antenna a desired directional characteristic
    • H01Q19/02—Details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q9/00—Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
    • H01Q9/02—Non-resonant antennas
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q9/00—Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
    • H01Q9/04—Resonant antennas
    • H01Q9/16—Resonant antennas with feed intermediate between the extremities of the antenna, e.g. centre-fed dipole

Definitions

  • the present invention comprises a container equipped with an RFID module, particularly a container equipped with an RFID module and an RFID module using RFID (Radio Frequency Identification) technology for non-contact data communication by an induced electromagnetic field or radio waves. Regarding the manufacturing method of the container.
  • RFID Radio Frequency Identification
  • RFID tags which are a wireless communication device, to the container.
  • RFID tags along with RFIC (Radio-Frequency Integrated Circuit), have a metal material such as an antenna pattern formed on an insulating substrate such as a paper material or a resin material.
  • RFIC Radio-Frequency Integrated Circuit
  • Patent Document 1 proposes a configuration in which an RFID tag compatible with a metal formed in a part of a container is attached.
  • the package disclosed in Patent Document 1 imparts a metallic luster to the package body by printing a metal layer on the package body using an ink containing metal particles.
  • Patent Document 1 a space for mounting the RFID tag in which the RFID chip and the antenna pattern are integrated on the outer surface of the container is required. Therefore, when forming a pattern in the RFID tag mounting space, the pattern had to be printed again on the RFID tag.
  • An object of the present invention is to provide a container having an RFID module capable of suppressing a reduction in design and improving manufacturing efficiency, and a method for manufacturing a container having an RFID module.
  • the container of one aspect of the present invention is a container provided with an RFID module, which is an insulating base material forming the outer shape of the container, a first antenna film and a second antenna film formed on the first main surface of the base material. It comprises an antenna pattern having an antenna film.
  • the RFID module includes an RFIC element, a filter circuit for transmitting a current due to an electromagnetic wave having a unique resonance frequency which is a communication frequency to the RFIC element, and first and second electrodes connected to the filter circuit.
  • the first electrode of the RFID module and the first antenna film are electrically connected, and the second electrode of the RFID module and the second antenna film are electrically connected.
  • the sheet resistance of each of the first antenna film and the second antenna film is 0.5 ⁇ / ⁇ or more.
  • an antenna pattern having a first antenna film and a second antenna film is printed on the first main surface of an insulating base material forming the outer shape of the container, and an RFIC element and an RFIC element are used.
  • An RFID module including a filter circuit that transmits a current generated by an electromagnetic wave having a unique resonance frequency, which is a communication frequency, to an RFID element and first and second electrodes connected to the filter circuit, a first electrode, a first antenna film, and the like.
  • the 2nd antenna and the 2nd antenna film are attached to the 1st antenna film and the 2nd antenna film so as to be electrically connected to each other, and the sheet resistance of each of the 1st antenna film and the 2nd antenna film is 0.5 ⁇ . / ⁇ or more.
  • a container having an RFID module capable of suppressing a reduction in design and improving manufacturing efficiency, and a method for manufacturing a container having an RFID module.
  • FIG. 5a is a plan view of the conductor pattern formed on the upper surface of the substrate of the RFID module
  • FIG. 5b is a plan view of the conductor pattern formed on the lower surface of the substrate.
  • One aspect of the container according to the present invention is a container provided with an RFID module, which is an insulating base material forming the outer shape of the container, a first antenna film formed on the first main surface of the base material, and a first surface. It comprises an antenna pattern having two antenna films.
  • the RFID module includes an RFIC element, a filter circuit for transmitting a current due to an electromagnetic wave having a unique resonance frequency which is a communication frequency to the RFIC element, and first and second electrodes connected to the filter circuit.
  • the first electrode of the RFID module and the first antenna film are electrically connected, and the second electrode of the RFID module and the second antenna film are electrically connected.
  • the sheet resistance of each of the first antenna film and the second antenna film is 0.5 ⁇ / ⁇ or more.
  • the container of this embodiment can form a pattern by using the antenna pattern formed on the base material of the container, the RFID module is attached to the container while suppressing the reduction of the degree of freedom in design. Can be done. Further, since the RFID module has a filter circuit, it is possible to supply electric power to the RFID by utilizing the eddy current generated in the antenna pattern.
  • the filter circuit may be an LC parallel resonant circuit. As a result, a current having a frequency matching the RFIC can be passed through the RFIC.
  • the filter circuit has a coil formed on the substrate, and the coil may be covered with a protective layer. As a result, the dielectric constant of the coil can be fixed, and it is possible to prevent the influence of the dielectric material in the container.
  • the coil of the filter circuit may have a figure eight shape. As a result, the magnetic field of the coil can be made difficult to leak to the outside, and the inductance value of the coil can be made difficult to change due to an external factor.
  • the thickness of the first antenna film and the second antenna film may be 0.1 ⁇ m or more and 3 ⁇ m or less. Even in this configuration, since the RFID module has a filter circuit, the eddy current generated in the first antenna film and the second antenna film can be used to flow through the RFID.
  • the antenna pattern may be a part of the pattern formed on the base material. By forming a part of the pattern formed on the base material as an antenna pattern, it is possible to prevent the design of the container from being reduced.
  • a print film may be formed on the antenna pattern.
  • the outer surface of the container can be designed differently from the antenna pattern.
  • the container equipped with the RFID module may be a prefabricated box.
  • the base material is a flap continuous with the first surface for connecting the first surface and the second surface having the first main surface, which are the side surfaces of the box, and the first surface and the second surface by an adhesive layer.
  • the antenna pattern may be formed on the flap, and the RFID module may be arranged on the flap.
  • the container may contain a metal article or an article containing water. Communication is possible because the change in permittivity due to metal articles and articles containing moisture is reduced.
  • the container contains a metal article or an article containing water, and a space is formed above the metal article or the article containing water in the container so as to overlap the space in a side view.
  • the antenna film may be arranged, and the second antenna film may be arranged so as to overlap with the metal article or the article containing water.
  • an antenna pattern having a first antenna film and a second antenna film is printed on the first main surface of an insulating base material forming the outer shape of the container, and the RFIC element is used.
  • An RFID module including a filter circuit that transmits a current generated by an electromagnetic wave having a unique resonance frequency, which is a communication frequency, to an RFID element and first and second electrodes connected to the filter circuit, the first electrode and the first antenna film.
  • the second antenna and the second antenna film are attached to the first antenna film and the second antenna film so as to be electrically connected to each other, and the sheet resistance of the first antenna film and the second antenna film is 0. It is 5 ⁇ / ⁇ or more.
  • the RFID module since the pattern can be formed by using the antenna pattern formed on the base material of the container, the RFID module suppresses the reduction of the degree of freedom of design in the container. Can be attached to the container. Further, since the RFID module has a filter circuit, it is possible to supply electric power to the RFID by utilizing the eddy current generated in the antenna pattern.
  • a pattern may be printed on the first main surface of the base material.
  • the antenna pattern can be formed as a part of the pattern, and the reduction in the degree of freedom in design can be suppressed.
  • the antenna pattern may be printed on the first main surface of the base material and the pattern may be printed in the same printing process. Since the first antenna film and the second antenna film of the antenna pattern can be formed continuously with the printing on the base material of the container, it is possible to improve the manufacturing efficiency of printing the pattern of the container 1 and forming the antenna pattern. can.
  • the antenna pattern may be printed on the first main surface by gravure printing or offset printing. As a result, the antenna pattern can be formed at high speed.
  • the electrical length of the antenna pattern and the conductor pattern is longer than the physical length.
  • the electrical length is a length considering the shortening or extension of the wavelength due to the relative permittivity and the parasitic reactance component.
  • FIG. 1 is an overall perspective view of a container 1 having an RFID module 5 according to an embodiment of the present invention.
  • FIG. 2 is a developed view of the container 1 in FIG.
  • the container 1 of the present embodiment includes a base material 3, an antenna pattern 7 formed on the first main surface 3s of the base material 3, and an RFID module 5 mounted on the antenna pattern 7.
  • the container 1 is, for example, an assembly-type box formed into a three-dimensional shape by assembling a flat base material 3 as shown in FIG.
  • the container 1 has a rectangular parallelepiped shape, for example, and the base material 3 is made of, for example, paper, resin, or plastic.
  • the base material 3 includes a first surface 3a, a second surface 3b, a third surface 3c, a fourth surface 3d, a fifth surface 3e, a sixth surface 3f, and a first flap 3g, a second flap 3h, and a third flap. Equipped with 3k.
  • the first surface 3a to the fourth surface 3d become a side surface when assembled
  • the fifth surface 3e becomes an upper surface when assembled
  • the sixth surface 3f becomes a lower surface when assembled.
  • the first main surface 3s of the base material 3 is a surface to be the outer surface (front surface) of the container 1
  • the second main surface 3t of the base material 3 is a surface to be the inner surface (back surface) of the container 1.
  • the first main surface 3s of the first flap 3g is attached to the second main surface 3t of the second surface 3b via an adhesive layer (not shown) when assembled.
  • the first main surface 3s of the second flap 3h is attached to the second main surface 3t of the first surface 3a via an adhesive layer when assembled.
  • the first main surface 3s of the third flap 3k is attached to the second main surface 3t of the first surface 3a via an adhesive layer when assembled.
  • the RFID module 5 of this embodiment is a wireless communication device configured to perform wireless communication (transmission / reception) with a high frequency signal having a communication frequency (carrier frequency).
  • the RFID module 5 is configured to perform wireless communication with, for example, a high frequency signal having a frequency for communication in the UHF band.
  • the UHF band is a frequency band from 860 MHz to 960 MHz.
  • the antenna pattern 7 is formed on the first main surface 3s of the base material 3.
  • the antenna pattern 7 has a first antenna film 7a and a second antenna film 7b.
  • a gap 9 is formed between the first antenna film 7a and the second antenna film 7b.
  • the antenna pattern 7 is made of a film body of a carbon-based material such as graphite or a conductive material such as tin or zinc-based material by printing.
  • the thickness of the antenna pattern 7 is, for example, about 0.1 ⁇ m to 3 ⁇ m.
  • the sheet resistance of the antenna pattern 7 of the embodiment is larger than the sheet resistance of the antenna pattern of the conventional dipole antenna.
  • the sheet resistance of the antenna pattern 7 is large, the following problems that have not occurred in the conventional dipole antenna occur.
  • the antenna pattern 7 of the conventional dipole antenna is formed of a metal foil such as aluminum, and its thickness is, for example, larger than 5 ⁇ m and 40 ⁇ m or less, and the sheet resistance of the antenna pattern 7 is 0.05 ⁇ / ⁇ or less.
  • the thickness of the metal foil is, for example, 5 ⁇ m
  • printing is performed on the metal pattern by decorative printing or gravure printing or offset printing as a design
  • gravure printing is printed. Since the thickness is about 0.5 ⁇ m to 3 ⁇ m, printing misalignment (blurring or bleeding) occurs due to a large step due to the thickness of the metal film as the antenna foil. As a result, it has not been possible to print directly as a design on a container with an antenna pattern using metal leaf.
  • the thickness of the metal film is about 0.1 ⁇ m to 3 ⁇ m. With this thickness, gravure printing can be performed on the printing electrode of the antenna pattern 7, and for example, printing can be performed so as to hide the antenna pattern 7 with white ink, which improves the design.
  • the printed antenna pattern 7 has a small film thickness, so that the sheet resistance becomes large, for example, 0.5 ⁇ / ⁇ to 50 ⁇ /. ⁇ It will be about.
  • the resistance value of the matching circuit section between the RFIC and the antenna will be the same thickness as the metal film, the resistance value of the matching circuit section will increase, the matching loss will increase, and the RFID module will not operate.
  • an antenna pattern (antenna electrode) made of a thin metal film cannot generate electromagnetic wave radiation due to a (series) resonance phenomenon, but when an electromagnetic wave is received by the metal film, a current is applied so as to cancel the electromagnetic wave in the metal film. Flows and shields electromagnetic waves.
  • This current is also called an eddy current. Since the current component flowing through the metal film due to the eddy current is not due to the resonance phenomenon of the antenna electrode, it can correspond to all frequency components regardless of the electrode pattern shape. This eddy current is known as an effect of the metal shield, but it is not usually used as an antenna.
  • the RFID module 5 has a parallel resonant circuit RC1 as a filter circuit that transmits only a current having a unique resonant frequency to the RFIC 23, so that the eddy current is frequency-selected and the current flows through the RFIC 23 to generate energy. Be transmitted. Only a specific frequency is selected between the antenna pattern 7 as an antenna electrode and the RFID module 5, impedance matching is performed, and energy transfer between the RFID 23 and the antenna pattern 7 becomes possible. In this way, it is considered that communication with the RFIC 23 becomes possible.
  • the state where the sheet resistance of the antenna pattern 7 is high occurs not only by the thickness of the antenna pattern 7 but also by the manufacturing method of the antenna pattern 7.
  • the antenna pattern 7 is formed of a conductive paste such as Ag paste or a conductive polymer material
  • the sheet resistance may be 0.5 ⁇ / ⁇ or more. Even in such a case, wireless communication can be performed with the container 1 of the present embodiment.
  • FIG. 3 is a perspective plan view of the RFID module
  • FIG. 4 is a sectional view taken along the line IV in FIG.
  • FIG. 5 shows a plan view of a conductor pattern formed on the substrate of the RFID module
  • FIG. 5a is a plan view of the conductor pattern formed on the upper surface of the substrate of the RFID module
  • FIG. 5b is a plan view of the conductor pattern formed on the lower surface of the substrate. It is a perspective plan view seen from the top of the conductor pattern.
  • FIG. 6 is a cross-sectional view of the arrowhead VI in FIG.
  • the XYZ coordinate system facilitates the understanding of the invention and does not limit the invention.
  • the X-axis direction indicates the longitudinal direction of the RFID module 5
  • the Y-axis direction indicates the depth (width) direction
  • the Z-axis direction indicates the thickness direction.
  • the X, Y, and Z directions are orthogonal to each other.
  • the RFID module 5 is attached to the upper surface of the antenna pattern 7 via an adhesive 15 such as double-sided tape or synthetic resin.
  • the RFID module 5 includes a substrate 21 and an RFID 23 mounted on the substrate 21.
  • the substrate 21 is a flexible substrate such as polyimide.
  • a protective film 25 is formed on the upper surface of the substrate 21 on which the RFIC 23 is mounted.
  • the protective film 25 is, for example, an elastomer such as polyurethane or a hot melt agent such as ethylene vinyl acetate (EVA).
  • a protective film 27 is also attached to the lower surface of the substrate 21.
  • the protective film 27 is, for example, a coverlay film such as a polyimide film (Kapton tape).
  • a third electrode 33, a fourth electrode 35, a conductor pattern L1a of the main portion of the first inductance element L1 and a conductor pattern L2a of the main portion of the second inductance element L2 are formed on the upper surface of the substrate 21, a third electrode 33, a fourth electrode 35, a conductor pattern L1a of the main portion of the first inductance element L1 and a conductor pattern L2a of the main portion of the second inductance element L2 are formed.
  • the third electrode 33 is connected to one end of the conductor pattern L1a
  • the fourth electrode 35 is connected to one end of the conductor pattern L2a.
  • These conductor patterns are, for example, a copper foil patterned by photolithography.
  • the first electrode 29 and the second electrode 31 are capacitively coupled to the antenna pattern 7, respectively. Further, on the lower surface of the substrate 21, a part of the conductor pattern L1b of the first inductance element L1 and the conductor patterns L3a, L3b (conductor pattern surrounded by the alternate long and short dash line) and L3c of the third inductance element L3 are formed. These conductor patterns are also, for example, a copper foil patterned by photolithography.
  • One end of a part of the conductor pattern L1b of the first inductance element L1 and one end of the conductor pattern L3a of the third inductance element L3 are connected to the first electrode 29.
  • one end of the conductor pattern L2b of the second inductance element L2 and one end of the conductor pattern L3c of the third inductance element L3 are connected to the second electrode 31.
  • a conductor pattern L3b is connected between the other end of the conductor pattern L3a of the third inductance element L3 and the other end of the conductor pattern L3c.
  • the other end of the conductor pattern L1b of the first inductance element L1 and the other end of the conductor pattern L1a of the first inductance element L1 are connected via the via conductor V1.
  • the other end of the conductor pattern L2b of the second inductance element L2 and the other end of the conductor pattern L2a of the second inductance element L2 are connected via the via conductor V2.
  • the RFIC 23 is mounted on the third electrode 33 and the fourth electrode 35 formed on the upper surface of the substrate 21. That is, the terminal 23a of the RFIC 23 is connected to the third electrode 33, and the terminal 23b of the RFIC 23 is connected to the fourth electrode 35.
  • the conductor patterns L3a of the first inductance element L1 and the third inductance element L3 are formed in different layers of the substrate 21, and are arranged so that their coil openings overlap each other.
  • the conductor patterns L3c of the second inductance element L2 and the third inductance element L3 are formed in different layers of the substrate 21, and the coil openings are arranged so as to overlap each other.
  • the RFIC 23 is positioned on the surface of the substrate 21 between the conductor pattern L3c of the second inductance element L2 and the third inductance element L3 and the conductor pattern L3a of the first inductance element L1 and the third inductance element L3. do.
  • the conductor patterns L1a, L1b, and L3a form the first coil Cr1
  • the conductor patterns L2a, L2b, and L3c form the second coil Cr2.
  • a first current path CP1 passing through the upper surface and the lower surface of the substrate 21 and a second current path CP2 passing through the lower surface of the substrate 21 are formed.
  • the first current path CP1 reaches the second electrode 31 from the first electrode 29 through the branch point N1, the conductor pattern L1b, the conductor pattern L1a, RFIC23, the conductor pattern L2a, the conductor pattern L2b, and the branch point N2.
  • the second current path CP2 reaches the second electrode 31 from the first electrode 29 through the branch point N1, the conductor pattern L3a, the conductor pattern L3b, the conductor pattern L3c, and the branch point N2.
  • first inductance element L1 composed of a conductor pattern L1b connected via a conductor pattern L1a and a via conductor V1, and a conductor pattern L2b connected via a conductor pattern L2a and a via conductor V2.
  • the winding directions of the current flowing through the second inductance element L2 are opposite to each other, and the magnetic field generated by the first inductance element L1 and the magnetic field generated by the second inductance element L2 cancel each other out.
  • the first current path CP1 and the second current path CP2 are formed in parallel with each other between the first electrode 29 and the second electrode 31, respectively.
  • the dipole antenna when a dipole antenna type antenna pattern is provided in a container, the dipole antenna may be affected by the contents in the container and communication may be hindered. This is because the physical length of the antenna pattern is fixed, and if the electrical length of the antenna pattern is affected by the contents such as liquid and changes, communication may not be possible. Therefore, the dipole antenna is not suitable as an antenna formed directly on the container.
  • the metal coating of the pouch 41 and the antenna pattern 7 are capacitively coupled.
  • the dielectric constant of the RFID tag may change depending on the dielectric material such as the liquid to be stored, and the electric length of the antenna pattern 7 may be shorter than the physical length. Further, the change in the dielectric constant also changes depending on the distance between the content and the antenna pattern 7. Therefore, each time the position of the contents changes in the container, the communication characteristics also change.
  • a high frequency signal is transmitted and received using the eddy current generated in the antenna pattern 7, and the RFID module 5 transmits a current due to an electromagnetic wave having a resonance frequency of the communication frequency.
  • the RFID module 5 transmits a current due to an electromagnetic wave having a resonance frequency of the communication frequency.
  • the antenna film 7b By printing away from the pouch 41, the antenna film 7b has almost no capacitive coupling, and the antenna film 7a selectively has a capacitive coupling with the metal coating surface.
  • the antenna film 7a By printing away from the pouch 41, the antenna film 7b has almost no capacitive coupling, and the antenna film 7a selectively has a capacitive coupling with the metal coating surface.
  • an eddy current flows through the antenna film 7a, an eddy current also flows through the metal coating surface due to capacitive coupling, so that the metal coating surface can also be used for transmitting and receiving high-frequency signals.
  • the resonance frequency is fixed by the RFID module 5 instead of designing the frequency by the length of the antenna pattern 7. It is possible to cope with the frequency change due to the length of the antenna pattern 7.
  • the RFIC 23 is a small chip, and each coil pattern is wound so that the first coil Cr1 and the second coil Cr2 having a laminated structure cancel the magnetic field.
  • the periphery of the RFID module 23 is fixed by the dielectric constant of the RFID module 5 and is not affected by the dielectric (contents) contained in the container 1, so that the frequency matching with the RFID module 23 does not change.
  • the permittivity of the substrate 21 between the conductor patterns L1a and L2a and the conductor patterns L3a and L3c is fixed, and there is no change between the line capacitances.
  • the conductor patterns L1a and L2a and the conductor patterns L3a and L3c are covered with a protective film 25 and a protective film 27 as a protective layer having a fixed dielectric constant, respectively. In this way, the dielectric constant of the RFID module 5 is fixed.
  • a figure eight coil is formed by the first coil Cr1 and the second coil Cr2 of the RFID module 5, and the magnetic field of the RFID module 5 is formed. Is a configuration that does not easily leak to the outside. Since the magnetic field of the RFID module 5 is less likely to leak, the inductance value is less likely to change due to external factors.
  • FIG. 8 is an equivalent circuit diagram of the RFID module 5.
  • the first current path CP1 is a part of the parallel resonant circuit RC1 which is an LC parallel resonant circuit, and matches the radio wave of the communication frequency. Therefore, the radio wave of the communication frequency is used as the antenna pattern 7. Is received, a current flows through the RFIC 23.
  • the RFID module 5 is formed with a parallel resonant circuit RC1.
  • the parallel resonant circuit RC1 is a loop circuit composed of a first inductance element L1, an RFIC23, a second inductance element L2, and a third inductance element L3.
  • the capacitance C1 is composed of a first antenna film 7a, a first electrode 29, an adhesive 15, and a protective film 27.
  • the capacitance C2 is composed of a second antenna film 7b, a second electrode 31, an adhesive 15, and a protective film 27.
  • the fourth inductance element L4 is an inductance component of the first antenna film 7a of the antenna pattern 7
  • the fifth inductance element L5 is an inductance component of the second antenna film 7b of the antenna pattern 7.
  • the parallel resonance circuit RC1 is designed to perform LC parallel resonance by impedance matching with radio waves at the communication frequency. As a result, the RFID module is matched with the RFID in the communication frequency, and the communication distance of the RFID module 5 in the communication frequency can be secured.
  • the antenna pattern 7 may be a part of the pattern 43 of the container 1.
  • the pattern 43 may be a metal film or a resin film.
  • FIG. 10 is a flowchart showing a flow of manufacturing the container of the present embodiment.
  • the antenna pattern 7 is printed and formed on the first main surface 3s of the base material 3 of the container 1 before assembly.
  • the antenna pattern 7 can be formed by gravure printing or offset printing. By using gravure printing or offset printing, the antenna pattern 7 can be printed at high speed.
  • step S2 the pattern 43 is printed and formed on the first main surface 3s of the base material 3 of the container 1.
  • the pattern 43 can be formed by gravure printing or offset printing, similarly to the antenna pattern 7. It should be noted that step S1 and step S2 may be performed separately, or may be performed simultaneously or continuously.
  • step S1 and step S2 are performed in the same printing process, the pattern 43 and the antenna pattern 7 can be printed simultaneously or continuously on the container 1, so that the position of the antenna pattern 7 can be fixed to the container 1. It is possible to individually design the positional relationship between the contents and the antenna pattern 7. Further, by printing the entire surface of white or printing a pattern on the antenna film (7a, 7b), the antenna pattern 7 can be made difficult to see, and the design can be improved.
  • step S3 the RFID module 5 is mounted on the antenna pattern 7.
  • the RFID module 5 is mounted on the upper surface of the antenna pattern 7 via the adhesive 15.
  • step S4 the container 1 is assembled. It should be noted that the container 1 can be shipped to the user in a state before being assembled. In this case, the user assembles the container 1 and stores the contents in the container 1.
  • the container 1 of the present embodiment is the container 1 provided with the RFID module 5, and is formed on the insulating base material 3 forming the outer shape of the container 1 and the first main surface 3s of the base material 3.
  • the antenna pattern 7 having the formed first antenna film 7a and the second antenna film 7b is provided.
  • the RFID module 5 includes an RFIC 23, a parallel resonance circuit RC1 as a filter circuit for transmitting a current due to an electromagnetic wave having a unique resonance frequency which is a communication frequency to the RFIC 23, and a first electrode 29 and a second electrode connected to the parallel resonance circuit RC1. 31 and.
  • the first electrode 29 of the RFID module 5 and the first antenna film 7a are electrically connected.
  • the sheet resistance of each of the first antenna film 7a and the second antenna film 7b is 0.5 ⁇ / ⁇ or more.
  • the antenna pattern 7 can be formed by printing, so that the pattern can be printed on the container 1 and the antenna pattern can be printed. It is also possible to perform printing with and at the same time, and it is possible to improve the manufacturing efficiency of the container 1 on which the pattern is printed. Further, since the antenna pattern 7 can be printed directly on the container 1, the degree of freedom in designing the shape of the antenna pattern 7 can be improved, and the RFID module 5 which suppresses the reduction of the design of the container 1 is provided. Container 1 can be provided. Further, since the antenna pattern 7 can be formed at high speed and in a large amount by printing, the container 1 provided with the RFID module 5 can be provided at a lower cost than in the conventional case.
  • electromagnetic waves are radiated by causing series resonance with the antenna pattern of the high frequency of the communication frequency.
  • both ends of the metal object and the antenna pattern are capacitively coupled, and a closed circuit is formed from the end of one antenna pattern to the end of the other antenna pattern via the metal object. It is formed, does not emit electromagnetic waves, and does not operate as an antenna.
  • the dielectric constant around the antenna pattern will increase because there is a dielectric near the antenna pattern. This causes the wavelength to be shortened and the series resonance frequency to be lower than the initial setting of the antenna. Since the series resonance frequency changes depending on the distance between the antenna pattern and the dielectric and the ratio of the antenna pattern near the dielectric, the operation of the antenna becomes unstable depending on the contents in the conventional configuration in which the RFID tag is attached. Become.
  • the antenna pattern 7 is formed on the base material 3 of the container 1, and the sheet resistances of the first antenna film 7a and the second antenna film 7b are 0.5 ⁇ / Since it is ⁇ or more, an eddy current is generated instead of the series resonance in the antenna pattern 7.
  • the eddy current generated in the antenna pattern 7 is matched by the parallel resonant circuit RC1 of the RFID module 5 to supply electric power to the RFID module 23. Since the antenna pattern 7 can be printed anywhere on the surface of the container 1 and the frequency is not designed by the pattern length of the antenna, the degree of freedom of the pattern is high. As a result, the antenna pattern 7 can be made into an optimum pattern shape with respect to the shapes of the container 1 and the contents.
  • the electromagnetic wave can be radiated from the antenna pattern 7.
  • the container 1 provided with the RFID module 5 of the present embodiment does not utilize series resonance, wireless communication is possible even if a metal object or a dielectric is present around the antenna pattern in the container 1. be.
  • the antenna pattern 7 is formed on the first main surface 3s of the base material 3 as a part of the pattern. In this way, since the antenna pattern 7 can be a part of the decorative printing, the design of the container 1 can be improved.
  • FIG. 11 is a developed view of the container 1A in the first modification.
  • the container 1A in the first modification has a configuration in which the antenna pattern 7 of the container 1 of the embodiment has a meander shape. In this way, the first antenna film 7a and the second antenna film 7b of the antenna pattern 7 may extend in a meander shape.
  • Other configurations of the container 1A of the modification 1 are substantially the same as those of the container 1 of the embodiment. Even with such a configuration, the communication characteristics do not change, so that the container 1A of the modified example 1 can obtain the same effect as the container 1 of the embodiment.
  • FIG. 12 is a developed view of the container 1B in the modified example 2.
  • the container 1B in the second modification has a configuration in which the antenna pattern 7 of the container 1 of the embodiment is formed over two surfaces of the third surface 3c and the fourth surface 3d. Further, as in the modification 1, the antenna pattern 7 has a meander shape.
  • Other configurations of the container 1B of the modification 2 are substantially the same as those of the container 1 of the embodiment. Even with such a configuration, the communication characteristics do not change, so that the container 1B of the modified example 2 can obtain the same effect as the container 1 of the embodiment.
  • FIG. 13 is a developed view of the container 1C in the modified example 3 of the embodiment.
  • the container 1C in the modified example 3 of the embodiment has a shape in which the antenna pattern 7 includes the logotype in the container 1 of the embodiment.
  • the “MURATA” logotype is formed as an antenna pattern, and the logotype functions as an antenna.
  • the antenna pattern 7 may include a logo mark instead of the logotype, or may include a combination of the logotype and the logo mark. Even with such a configuration, the communication characteristics do not change, so that the container 1C of the modified example 3 can obtain the same effect as the container 1 of the embodiment.
  • the pattern is a printed matter for decorating the container 1 formed on the first main surface 3s of the container 1, and includes, for example, a figure, a picture, a character, a logotype, a logo mark, and a combination thereof. ..
  • FIG. 14A is a developed view of the container 1D in the modified example 4 of the embodiment.
  • FIG. 14B is a partially enlarged view of a developed view of the container 1D.
  • FIG. 15 is a perspective perspective view of the container 1D.
  • 16 is a perspective view of the XVI arrow of FIG. 15, and is a perspective side view of the container 1D.
  • FIG. 17 is a perspective view of XVII of FIG. 15 and is a perspective front view of the container 1D.
  • the container 1D in the modified example 4 of the embodiment is a modified example of the container 1 shown in FIG. 7, and has a configuration in which the antenna pattern 7 in the container 1 of the embodiment is formed in the first flap 3 g.
  • the base material 3 connects the first surface 3a and the second surface 3b having the first main surface 3s, which are the side surfaces of the box-shaped container 1D, and the first surface 3a and the second surface 3b by an adhesive layer. It has a first flap 3g continuous with the first surface 3a for the purpose.
  • the first antenna film 7Da is formed on the first flap 3g so as to overlap the lid 51b
  • the second antenna film 7Db is formed on the first flap 3g so as to overlap the container body 51a.
  • the container 1D has flaps other than the first flap 3g to the third flap 3k for reinforcement, for example, to prevent dust from entering the inside of the assembled container 51.
  • the antenna pattern 7D in the modified example 4 of the embodiment is an asymmetric dipole antenna.
  • the antenna pattern 7D has a first antenna film 7Da having a meander-shaped pattern and a second antenna film 7Db longer than the first antenna film 7Da.
  • the second antenna film 7Db has a meander-shaped pattern 7Dba and a linear-shaped pattern 7Dbb.
  • the antenna pattern 7D is formed, for example, by stamping a vapor-deposited foil or printing a conductive paste.
  • Container 1D further accommodates one or more containers 51 inside in a state of being assembled in a box.
  • the container 51 has a container body 51a for accommodating a liquid such as water, and a lid 51b attached to the container body 51a and having a hollow inside.
  • the container body 51a is made of, for example, metal or resin.
  • the container body 51a may be a metal article itself.
  • the lid 51b is made of resin, for example. Therefore, the lid 51b secures a space Sp in the container 1D between the container main body 51a and the fifth surface, which is the upper surface of the container 1D, with almost no liquid or metal.
  • the antenna pattern 7D and the RFID module 5 are formed on the first flap 3g, the antenna pattern 7D and the RFID module 5 are visually hidden at the time of forming the box, and the container is formed. It does not affect the design of 1D. Further, since the RFID module 5 is sandwiched between the first flap 3g and the second surface 3b at the time of assembling the box, it does not come into contact with the container 51 which is the content. Therefore, there is no possibility that the RFID module 5 will fall out of the container 1D when the container 51 is taken in and out.
  • the first antenna film 7Da which is one electrode of the antenna pattern 7D, is arranged away from the container body 51a for accommodating the liquid as the content or the container body 51a which is a metal, the liquid or metal. It is not easily affected by the contents of the product, and it is possible to suppress the reduction of communication characteristics.
  • the container 51 does not have to have the lid 51b.
  • the height of the container 1D is secured to such an extent that a space Sp is formed between the upper surface of the container 51 and the fifth surface 3e of the container 1D.
  • the first antenna film 7Da is formed on the first flap 3g so as to overlap the space Sp between the upper surface of the container 51 and the fifth surface 3e of the container 1D.
  • the first antenna film 7Da has a meander shape
  • the second antenna film 7Eab has a meander shape instead. It may have a flat plate shape. Since the second antenna film 7Eab on the flat plate is arranged so as to overlap the contents of the container 1E in a side view when the box is assembled, the same effect as the above-mentioned effect can be obtained.
  • the second antenna film 7Eab of the antenna pattern 7Ea formed on the first flap 3g may have various shapes other than the flat plate shape.
  • 20A and 20B are shown as examples of the shape of the second antenna film.
  • 20A (a) and 20B (b) and 20B (a) and 20B (b) are partially enlarged views of the developed view of the container in the modified example of the embodiment, respectively.
  • the second antenna film 7Ebb of the antenna pattern 7Eb formed on the first flap 3g of the container 1Eb may have an uneven shape on the side surface side of the first flap 3g. ..
  • the second antenna film 7Ebc of the antenna pattern 7Ec formed on the first flap 3g of the container 1Ec has a wave shape vibrating in the width direction of the first flap 3g. May be good.
  • the second antenna film 7Ebd of the antenna pattern 7Ed formed on the first flap 3g of the container 1Ed may be formed by combining a plurality of annular conductor patterns.
  • a plurality of conductor patterns may be formed in a mesh shape.
  • the non-metal region of the first flap 3g can be increased as compared with the antenna pattern 7E, so that the region where the base material 3 of the first flap 3g is exposed and the second.
  • the region where the base material 3 on the two surfaces 3b is exposed can be directly bonded by the adhesive layer 11. Thereby, the adhesive strength between the first flap 3g and the second surface can be improved.
  • the first antenna film 7Da and the second antenna film 7Db having a meander shape have other meander shapes as shown in FIGS. 21A and 21B. May be good.
  • 21A (a) and 21A (b) and FIGS. 21B (a) and 21B (b) are partially enlarged views of the developed view of the container in the modified example of the embodiment, respectively.
  • the antenna pattern 7Fa of the container 1Fa has a meander-shaped first antenna film 7Faa and a second antenna film 7Fab longer than the first antenna film 7Faa.
  • the second antenna film 7Fab has a meander-shaped pattern 7Faba and a linear-shaped pattern 7Fab.
  • the first antenna film 7Faa and the pattern 7Faba are formed at both ends in the longitudinal direction of the first flap 3 g.
  • the tips of the first antenna film 7Faa and the pattern 7Faba have the first flap 3g along the side 3aa between the first flap 3g and the first surface 3a, that is, the container 1Fa is assembled. In a state of being bent from the surface 3a, it extends so as to face the corner between the first flap 3g and the first surface 3a. Since the tips of the first antenna film 7Faa and the pattern 7Faba extend in the vicinity of the side side 3aa to be a crease, the respective tips of the antenna pattern 7Fa extend to the edge portion of the box-shaped container 1Fa. As a result, the contents are separated from the contents accommodated in the container 1F, so that the influence of the contents on the antenna pattern 7F can be reduced when the contents are a metal-coated pouch 41 or the like.
  • the meander shape of the first antenna film 7Faa and the pattern 7Faba may have an amplitude of the meander shape formed in the width direction of the first flap 3g, and is shown in FIG. 21A (b).
  • the amplitude of the meander shape may be formed in an oblique direction so that the pattern of the meander shape faces the angle between the first flap 3g and the first surface 3a from the middle.
  • the antenna pattern 7Fb of the container 1Fb has a meander-shaped first antenna film 7Fba and a second antenna film 7Fbb longer than the first antenna film 7Fba.
  • the second antenna film 7Fbb has a meander-shaped pattern 7Fbba and a linear-shaped pattern 7Fbbb.
  • the first antenna film 7Fba and the pattern 7Fbba are formed at both ends in the longitudinal direction of the first flap 3g, and the respective tip portions extend in the vicinity of the side side 3aa to be a crease.
  • the antenna pattern 7Fc of the container 1Fc has a first antenna film 7Fca having a meander shape and a second antenna film 7Fcb longer than the first antenna film 7Fca.
  • the second antenna film 7Fcb has a meander-shaped pattern 7Fcba and a linear-shaped pattern 7Fcb.
  • the first antenna film 7Fca and the pattern 7Fcba are formed at both ends in the longitudinal direction of the first flap 3g.
  • the pattern 7 Fcba is formed along the extension direction of the side side 3aa where the amplitude direction of the meander shape is a crease, and even if the meander shape pattern is formed so as to extend toward the edge 3ga at the tip of the first flap 3g. good.
  • the content is, for example, a metal object such as a PTP (Press Through Pack) sheet.
  • PTP Pressure Through Pack
  • FIG. 22 shows an example in which the first antenna film of the antenna pattern formed on the first flap 3g does not have a meander shape.
  • 22 (a), 22 (b), and 22 (c) are partially enlarged views of the developed view of the container in the modified example of the embodiment, respectively.
  • the antenna pattern 7Ga has a loop-shaped first antenna film 7Gaa and a second antenna film 7Gab longer than the first antenna film 7Gaa.
  • the second antenna film 7Gab has a rectangular shape.
  • One end of the first antenna film 7Gaa is a land 7Gak to which one end of the RFID module 5 is attached, and a pattern is formed from the outside to the inside in a spiral shape from the land 7Gak.
  • the electric field is strong in the region Ds between the portion 7Gad on the first surface 3a side of the first antenna film 7Gaa facing the land 7Gak and the land 7Gak. Therefore, the pattern of the loop-shaped first antenna film 7Gaa is formed so as to wind inward, for example, clockwise so that the region Ds does not overlap the contents contained in the container 1Ga.
  • the antenna pattern 7Gb of the container 1Gb has a first antenna film 7Gaa and a rectangular second antenna film 7Gab.
  • the second antenna film 7Gab is formed with one or more holes 7gbe. Since the base material 3 is exposed in the holes 7 gbe, the adhesive layer 11 can improve the adhesive force between the first flap 3 g and the second surface 3b.
  • the antenna pattern 7Gc of the container 1Gc has a first antenna film 7Gaa and a rectangular second antenna film 7Gac.
  • the second antenna film 7Gac is arranged close to the side side 3aa which is a crease. That is, the distance Dv between the second antenna film 7Gac and the margin 3ga is longer than the distance Dw between the second antenna film 7Gac and the side 3aa. As a result, the region where the second antenna film 7Gac overlaps with the contents contained in the container 1Gc can be reduced.
  • FIG. 23 is a partially enlarged view of a developed view of the container 1H in the modified example 5 of the embodiment
  • FIG. 23A is a diagram showing an antenna pattern formed on the first flap 3g
  • FIG. 23B is a diagram showing the antenna pattern formed on the first flap 3g.
  • It is a peripheral view of RFIC23
  • FIG. 23C is a diagram showing an antenna pattern to which RFIC23 is attached.
  • the container 1H in the modification 5 of the embodiment is a modification of the container 1D shown in FIG. 14A.
  • an inductor is formed on the antenna pattern side and the RFID 23 is attached to the antenna pattern which also has the function of an inductor. It is a configuration to attach.
  • the antenna pattern 7H in the modified example 5 of the embodiment is an asymmetric dipole antenna.
  • the antenna pattern 7H has a first antenna film 7Ha that also has a function as an inductor, and a second antenna film 7Hb.
  • the first antenna film 7Ha has a land 7Haa electrically connected to the other terminal of the RFIC 23 and a loop pattern 7Hab extending in a loop from the land 7Haa to the land 7Hbc.
  • the first antenna film 7Ha functions as a matching circuit, impedance-matches the first antenna film 7Ha and the RFIC 23, and enables energy transfer between the RFIC 23 and the antenna pattern 7H.
  • the second antenna film 7Hb has a land 7Hbc electrically connected to one terminal of the RFIC 23, a pattern 7Hbb linearly extending from the land 7Hbc, and an antenna film 7Hba having a meander-shaped pattern.
  • the first and second antenna films 7Ha and 7Hb are formed, for example, by stamping a vapor-deposited foil or printing a conductive paste.
  • the RFIC 23 includes electrodes 63 and 64 connected to the two terminals 23a and 23b of the RFIC 23, respectively, and a resin sheet 65 on which the electrodes 63 and 64 are formed. It is attached to the land 7Haa and the land 7Hbc via the.
  • the electrodes 63 and 64 and the lands 7Haa and the lands 7Hbc are arranged so as to overlap each other, and the electrodes 63 and 64 and the lands 7Haa and the lands 7Hbc are capacitively coupled, respectively.
  • the first antenna film 7Ha that also functions as an inductor is formed on the first flap 3g, so that the antenna pattern 7H and the RFIC 23 are formed at the time of box formation. Is hidden in appearance and does not affect the design of the container 1H.
  • FIG. 24A is a developed view of the container 1K in the modified example 6 of the embodiment
  • FIG. 24B is a diagram showing an antenna pattern formed on the first flap 3g
  • FIG. 23B is a peripheral view of the RFIC 23
  • FIG. 23 (c) is a diagram showing an antenna pattern to which the RFIC 23 is attached.
  • the container 1K in the modification 5 of the embodiment is a modification of the container 1D shown in FIG. 14A.
  • the second antenna film 7Kb is divided into a plurality of electrodes, and the container 1K functions as one antenna pattern in an assembled state. It is a configuration to do.
  • the antenna pattern 7K has a first antenna film 7Da and a second antenna film 7Kb.
  • the second antenna film 7Kb was arranged on the first main surface 3s side of the first flap 3g, the first pattern electrode 7Kba and the second pattern electrode 7Kbb arranged on the first main surface 3s side, and the second surface 3b on the first main surface 3s side.
  • a third pattern electrode 7Kbc is provided.
  • the first pattern electrode 7Kba to the third pattern electrode 7Kbc are formed by, for example, stamping a vapor-deposited foil or printing a conductive paste, respectively.
  • the second surface 3b is arranged between the first pattern electrode 7Kba and the second pattern electrode 7Kbb and the third pattern electrode 7Kbc.
  • a capacitance C3 is generated between the first pattern electrode 7Kba and the third pattern electrode 7Kbc
  • a capacitance C4 is generated between the second pattern electrode 7Kbb and the third pattern electrode 7Kbc, and the capacitances are coupled to each other.
  • the first pattern electrode 7Kba to the third pattern electrode 7Kbc function as one antenna pattern.
  • a first antenna film 7Da, a first pattern electrode 7Kba and a second pattern electrode 7Kbb of the second antenna film 7Kb are formed on the back surface (second main surface 3t) side of the second surface 3b.
  • the RFID module 5 may be arranged, and the third pattern electrode 7Kbc may be arranged on the front surface (first main surface 3s) side of the first flap 3g. Even with this configuration, when the container 1L is assembled, the first pattern electrode 7Kba to the third pattern electrode 7Kbc can function as one antenna pattern. Further, the first pattern electrode 7Kba to the third pattern electrode 7Kbc may be arranged on either the front surface or the back surface of the base material 3.
  • the container 1 is an assembly type, but the present invention is not limited to this.
  • the container 1 may be a bottle or a PET bottle.
  • the antenna pattern 7 is a part of the pattern formed on the container 1, but the present invention is not limited to this.
  • a printing film may be further applied to the container 1 on which the antenna pattern 7 is formed to give a design different from that of the antenna pattern 7.
  • the communication frequency band is the UHF band, but the frequency band is not limited to this. It may be configured to perform wireless communication with a high frequency signal having a frequency (carrier frequency) for communication in the HF band.
  • the HF band is a frequency band of 13 MHz or more and 15 MHz or less.
  • the antenna pattern 7 may be formed on the second main surface 3t instead of the first main surface 3S of the base material 3. That is, the antenna pattern 7 may be formed inside the container 1.

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  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
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Abstract

A container provided with an RFID module comprises an insulating substrate that forms the outside shape of the container, and an antenna having a first antenna film and a second antenna film that are formed on the first principal surface of the substrate. The RFID module is provided with: an RFIC element; a filter circuit for transmitting to the RFIC element an electric current resulting from electromagnetic waves having a unique resonant frequency, which is a communication frequency; and first and second electrodes connected to the filter circuit. The first electrode of the RFID module and the first antenna film are electrically connected to each other, and the second electrode of the RFID module and the second antenna film are electrically connected to each other. The first antenna film and the second antenna film each have a sheet resistance of 0.5 Ω/□ or more.

Description

ＲＦＩＤモジュールを備えた容器及びＲＦＩＤモジュールを備えた容器の製造方法How to manufacture a container with an RFID module and a container with an RFID module
　本発明は、RFIDモジュールを備えた容器、特に、誘導電磁界または電波によって、非接触でデータ通信を行うRFID(Radio Frequency Identification)技術を利用した、RFIDモジュールを備えた容器及びRFIDモジュールを備えた容器の製造方法に関する。 The present invention comprises a container equipped with an RFID module, particularly a container equipped with an RFID module and an RFID module using RFID (Radio Frequency Identification) technology for non-contact data communication by an induced electromagnetic field or radio waves. Regarding the manufacturing method of the container.
　従来、無線通信デバイスであるRFIDタグを容器に付すことで、容器内の商品の管理をすることが考えられている。RFIDタグは、RFIC(Radio-Frequency Integrated Circuit)と共に、アンテナパターンなどの金属材料が紙材や、樹脂材等の絶縁基板上に形成されている。しかしながら、容器の外面に金属膜が形成されていると、RFIDタグが影響を受けて通信ができなくなる。 Conventionally, it has been considered to manage products in a container by attaching an RFID tag, which is a wireless communication device, to the container. RFID tags, along with RFIC (Radio-Frequency Integrated Circuit), have a metal material such as an antenna pattern formed on an insulating substrate such as a paper material or a resin material. However, if a metal film is formed on the outer surface of the container, the RFID tag is affected and communication becomes impossible.
　特許文献１において、容器の一部に形成された金属に対応可能なRFIDタグを取り付けた構成が提案されている。特許文献１に開示されたパッケージは、金属粒子を含むインクを用いてパッケージ本体に金属層を印刷することでパッケージ本体に金属光沢を付与している。また、パッケージ本体の一部には、金属層が形成されていない領域があり、この領域にRFIDタグが貼り付けられている。 Patent Document 1 proposes a configuration in which an RFID tag compatible with a metal formed in a part of a container is attached. The package disclosed in Patent Document 1 imparts a metallic luster to the package body by printing a metal layer on the package body using an ink containing metal particles. In addition, there is a region where the metal layer is not formed in a part of the package body, and the RFID tag is attached to this region.
国際公開第２０１９－０３９４８４号International Publication No. 2019-039484
　しかしながら、特許文献１では、RFICチップとアンテナパターンとが一体となったRFIDタグを容器の外面上に取り付けるスペースが必要であった。したがって、RFIDタグの取り付けスペースに模様を形成する場合、RFIDタグ上に再度、模様を印刷しなければならなかった。 However, in Patent Document 1, a space for mounting the RFID tag in which the RFID chip and the antenna pattern are integrated on the outer surface of the container is required. Therefore, when forming a pattern in the RFID tag mounting space, the pattern had to be printed again on the RFID tag.
　本発明は、意匠性の低減を抑制し、製造効率を向上可能なRFIDモジュールを有する容器、及び、RFIDモジュールを有する容器の製造方法の提供を目的とする。 An object of the present invention is to provide a container having an RFID module capable of suppressing a reduction in design and improving manufacturing efficiency, and a method for manufacturing a container having an RFID module.
　本発明の一態様の容器は、RFIDモジュールを備えた容器であって、容器の外形を形成する絶縁性の基材と、基材の第１主面に形成された第１アンテナ膜及び第２アンテナ膜を有するアンテナパターンと、を備える。RFIDモジュールは、RFIC素子と、通信周波数である固有の共振周波数の電磁波による電流をRFIC素子に伝送するフィルタ回路と、フィルタ回路と接続する第１及び第２電極と、を備える。RFIDモジュールの第１電極と第１アンテナ膜とが電気的に接続され、RFIDモジュールの第２電極と第２アンテナ膜とが電気的に接続される。第１アンテナ膜及び第２アンテナ膜のそれぞれのシート抵抗は０．５Ω／□以上である。 The container of one aspect of the present invention is a container provided with an RFID module, which is an insulating base material forming the outer shape of the container, a first antenna film and a second antenna film formed on the first main surface of the base material. It comprises an antenna pattern having an antenna film. The RFID module includes an RFIC element, a filter circuit for transmitting a current due to an electromagnetic wave having a unique resonance frequency which is a communication frequency to the RFIC element, and first and second electrodes connected to the filter circuit. The first electrode of the RFID module and the first antenna film are electrically connected, and the second electrode of the RFID module and the second antenna film are electrically connected. The sheet resistance of each of the first antenna film and the second antenna film is 0.5Ω / □ or more.
　本発明の一態様の容器の製造方法は、容器の外形を形成する絶縁性の基材の第１主面に第１アンテナ膜及び第２アンテナ膜を有するアンテナパターンを印刷し、RFIC素子と、通信周波数である固有の共振周波数の電磁波による電流をRFIC素子に伝送するフィルタ回路と、フィルタ回路と接続する第１及び第２電極とを備えるRFIDモジュールを、第１電極と第１アンテナ膜と、及び第２電極と第２アンテナ膜とをそれぞれ電気的に接続するように第１アンテナ膜及び第２アンテナ膜に装着し、第１アンテナ膜及び第２アンテナ膜のそれぞれのシート抵抗は０．５Ω／□以上である。 In the method for manufacturing a container according to one aspect of the present invention, an antenna pattern having a first antenna film and a second antenna film is printed on the first main surface of an insulating base material forming the outer shape of the container, and an RFIC element and an RFIC element are used. An RFID module including a filter circuit that transmits a current generated by an electromagnetic wave having a unique resonance frequency, which is a communication frequency, to an RFID element and first and second electrodes connected to the filter circuit, a first electrode, a first antenna film, and the like. And the 2nd antenna and the 2nd antenna film are attached to the 1st antenna film and the 2nd antenna film so as to be electrically connected to each other, and the sheet resistance of each of the 1st antenna film and the 2nd antenna film is 0.5Ω. / □ or more.
　本発明によれば、意匠性の低減を抑制し、製造効率を向上可能なRFIDモジュールを有する容器、及び、RFIDモジュールを有する容器の製造方法を提供することができる。 According to the present invention, it is possible to provide a container having an RFID module capable of suppressing a reduction in design and improving manufacturing efficiency, and a method for manufacturing a container having an RFID module.
実施形態のRFIDモジュールを有する容器の全体斜視図Overall perspective view of the container having the RFID module of the embodiment 図１における容器の展開図Development view of the container in FIG. RFIDモジュールの透視平面図Perspective plan view of RFID module 図３における矢視ＩVの断面図Sectional view of arrow view IV in FIG. RFIDモジュールの基板に形成されている導体パターンの平面図を示し、図５ａはRFIDモジュールの基板の上面に形成された導体パターンの平面図であり、図５ｂは基板の下面に形成された導体パターンの上から見た透視平面図A plan view of the conductor pattern formed on the substrate of the RFID module is shown, FIG. 5a is a plan view of the conductor pattern formed on the upper surface of the substrate of the RFID module, and FIG. 5b is a plan view of the conductor pattern formed on the lower surface of the substrate. Perspective plan seen from above 図３における矢視ＶＩの断面図Sectional view of arrow view VI in FIG. 金属コーティングのパウチを収納した状態の容器の全体斜視図Overall perspective view of the container with the metal-coated pouch stored RFIDモジュールの等価回路図Equivalent circuit diagram of RFID module 実施形態の変形例における容器の全体斜視図Overall perspective view of the container in the modified example of the embodiment 実施形態の容器を製造する流れを示すフローチャートFlow chart showing the flow of manufacturing the container of the embodiment 実施形態の変形例における容器の展開図Development view of the container in the modified example of the embodiment 実施形態の変形例における容器の展開図Development view of the container in the modified example of the embodiment 実施形態の変形例における容器の展開図Development view of the container in the modified example of the embodiment 実施形態の変形例における容器の展開図Development view of the container in the modified example of the embodiment 実施形態の変形例における容器の展開図の部分拡大図Partially enlarged view of the developed view of the container in the modified example of the embodiment 実施形態の変形例における容器の透視斜視図Perspective perspective view of the container in the modified example of the embodiment 実施形態の変形例における容器の透視側面図Perspective side view of the container in the modified example of the embodiment 実施形態の変形例における容器の透視正面図A perspective front view of the container in a modified example of the embodiment 実施形態の変形例における容器の透視斜視図Perspective perspective view of the container in the modified example of the embodiment 実施形態の変形例における容器の展開図の部分拡大図Partially enlarged view of the developed view of the container in the modified example of the embodiment 実施形態の変形例における容器の展開図の部分拡大図Partially enlarged view of the developed view of the container in the modified example of the embodiment 実施形態の変形例における容器の展開図の部分拡大図Partially enlarged view of the developed view of the container in the modified example of the embodiment 実施形態の変形例における容器の展開図の部分拡大図Partially enlarged view of the developed view of the container in the modified example of the embodiment 実施形態の変形例における容器の展開図の部分拡大図Partially enlarged view of the developed view of the container in the modified example of the embodiment 実施形態の変形例における容器の展開図の部分拡大図Partially enlarged view of the developed view of the container in the modified example of the embodiment 実施形態の変形例における容器の展開図の部分拡大図Partially enlarged view of the developed view of the container in the modified example of the embodiment 実施形態の変形例における容器の展開図Development view of the container in the modified example of the embodiment 実施形態の変形例における容器の斜視図Perspective view of the container in the modified example of the embodiment 実施形態の変形例におけるアンテナ回路図Antenna circuit diagram in a modified example of the embodiment 実施形態の変形例における容器の展開図Development view of the container in the modified example of the embodiment
　本発明に係る一態様の容器は、RFIDモジュールを備えた容器であって、容器の外形を形成する絶縁性の基材と、基材の第１主面に形成された第１アンテナ膜及び第２アンテナ膜を有するアンテナパターンと、を備える。RFIDモジュールは、RFIC素子と、通信周波数である固有の共振周波数の電磁波による電流をRFIC素子に伝送するフィルタ回路と、フィルタ回路と接続する第１及び第２電極と、を備える。RFIDモジュールの第１電極と第１アンテナ膜とが電気的に接続され、RFIDモジュールの第２電極と第２アンテナ膜とが電気的に接続される。第１アンテナ膜及び第２アンテナ膜のそれぞれのシート抵抗は０．５Ω／□以上である。 One aspect of the container according to the present invention is a container provided with an RFID module, which is an insulating base material forming the outer shape of the container, a first antenna film formed on the first main surface of the base material, and a first surface. It comprises an antenna pattern having two antenna films. The RFID module includes an RFIC element, a filter circuit for transmitting a current due to an electromagnetic wave having a unique resonance frequency which is a communication frequency to the RFIC element, and first and second electrodes connected to the filter circuit. The first electrode of the RFID module and the first antenna film are electrically connected, and the second electrode of the RFID module and the second antenna film are electrically connected. The sheet resistance of each of the first antenna film and the second antenna film is 0.5Ω / □ or more.
　この態様の容器は、容器の基材に形成されたアンテナパターンを利用して模様を形成することができるので、容器において、意匠性の自由度の低減を抑制してRFIDモジュールを容器に取り付けることができる。また、RFIDモジュールがフィルタ回路を有するので、アンテナパターンに発生した渦電流を利用してRFICに電力を供給することができる。 Since the container of this embodiment can form a pattern by using the antenna pattern formed on the base material of the container, the RFID module is attached to the container while suppressing the reduction of the degree of freedom in design. Can be done. Further, since the RFID module has a filter circuit, it is possible to supply electric power to the RFID by utilizing the eddy current generated in the antenna pattern.
　フィルタ回路は、ＬＣ並列共振回路でもよい。これにより、RFICとマッチングする周波数の電流をRFICに流すことができる。 The filter circuit may be an LC parallel resonant circuit. As a result, a current having a frequency matching the RFIC can be passed through the RFIC.
　フィルタ回路は、基板上に形成されたコイルを有し、コイルは、保護層で覆われてもよい。これにより、コイルの誘電率を固定することができ、容器内の誘電体の影響を受けるのを防止することができる。 The filter circuit has a coil formed on the substrate, and the coil may be covered with a protective layer. As a result, the dielectric constant of the coil can be fixed, and it is possible to prevent the influence of the dielectric material in the container.
　フィルタ回路のコイルは、８の字形状を有してもよい。これにより、コイルの磁界が外部に漏れにくくすることができ、コイルのインダクタンス値を外部要因で変化しにくくすることができる。 The coil of the filter circuit may have a figure eight shape. As a result, the magnetic field of the coil can be made difficult to leak to the outside, and the inductance value of the coil can be made difficult to change due to an external factor.
　第１アンテナ膜及び第２アンテナ膜の厚みは０．１μｍ以上３μｍ以下であってもよい。この構成であっても、RFIDモジュールがフィルタ回路を有するので、第１アンテナ膜及び第２アンテナ膜に発生した渦電流を利用してRFICに流すことができる。 The thickness of the first antenna film and the second antenna film may be 0.1 μm or more and 3 μm or less. Even in this configuration, since the RFID module has a filter circuit, the eddy current generated in the first antenna film and the second antenna film can be used to flow through the RFID.
　アンテナパターンは、基材に形成された模様の一部であってもよい。基材に形成された模様の一部をアンテナパターンとして形成することで、容器の意匠性の低減を防止することができる。 The antenna pattern may be a part of the pattern formed on the base material. By forming a part of the pattern formed on the base material as an antenna pattern, it is possible to prevent the design of the container from being reduced.
　アンテナパターン上に印刷膜が形成されてもよい。これにより、容器の外面においてアンテナパターンと異なる意匠にすることができる。 A print film may be formed on the antenna pattern. As a result, the outer surface of the container can be designed differently from the antenna pattern.
　RFIDモジュールを備えた容器は、組み立て式の箱でもよい。 The container equipped with the RFID module may be a prefabricated box.
　基材は、箱の側面となる、第１主面をそれぞれ有する第１面及び第２面と、第１面と第２面とを接着層により接続するための、第１面に連続したフラップとを有し、アンテナパターンはフラップに形成され、RFIDモジュールは、フラップに配置されていてもよい。 The base material is a flap continuous with the first surface for connecting the first surface and the second surface having the first main surface, which are the side surfaces of the box, and the first surface and the second surface by an adhesive layer. The antenna pattern may be formed on the flap, and the RFID module may be arranged on the flap.
　容器は、金属製の物品又は水分を含む物品を中に収容してもよい。金属製の物品や水分を含む物品による誘電率の変化を低減しているので、通信することが可能である。 The container may contain a metal article or an article containing water. Communication is possible because the change in permittivity due to metal articles and articles containing moisture is reduced.
　容器は、金属製の物品又は水分を含む物品を中に収容し、容器内において、金属製の物品または水分を含む物品の上方に空間が形成され、側面視において、空間と重なるように第１アンテナ膜が配置され、金属製の物品又は水分を含む物品と重なるように第２アンテナ膜が配置されていてもよい。 The container contains a metal article or an article containing water, and a space is formed above the metal article or the article containing water in the container so as to overlap the space in a side view. The antenna film may be arranged, and the second antenna film may be arranged so as to overlap with the metal article or the article containing water.
　本発明に係る一態様の容器の製造方法は、容器の外形を形成する絶縁性の基材の第１主面に第１アンテナ膜及び第２アンテナ膜を有するアンテナパターンを印刷し、RFIC素子と、通信周波数である固有の共振周波数の電磁波による電流をRFIC素子に伝送するフィルタ回路と、フィルタ回路と接続する第１及び第２電極とを備えるRFIDモジュールを、第１電極と第１アンテナ膜と、及び第２電極と第２アンテナ膜とをそれぞれ電気的に接続するように第１アンテナ膜及び第２アンテナ膜に装着し、第１アンテナ膜及び第２アンテナ膜のそれぞれのシート抵抗は０．５Ω／□以上である。 In one aspect of the method for manufacturing a container according to the present invention, an antenna pattern having a first antenna film and a second antenna film is printed on the first main surface of an insulating base material forming the outer shape of the container, and the RFIC element is used. An RFID module including a filter circuit that transmits a current generated by an electromagnetic wave having a unique resonance frequency, which is a communication frequency, to an RFID element and first and second electrodes connected to the filter circuit, the first electrode and the first antenna film. , And the second antenna and the second antenna film are attached to the first antenna film and the second antenna film so as to be electrically connected to each other, and the sheet resistance of the first antenna film and the second antenna film is 0. It is 5Ω / □ or more.
　この態様の容器の製造方法によれば、容器の基材に形成されたアンテナパターンを利用して模様を形成することができるので、容器において、意匠性の自由度の低減を抑制してRFIDモジュールを容器に取り付けることができる。また、RFIDモジュールがフィルタ回路を有するので、アンテナパターンに発生した渦電流を利用してRFICに電力を供給することができる。 According to the method for manufacturing a container of this aspect, since the pattern can be formed by using the antenna pattern formed on the base material of the container, the RFID module suppresses the reduction of the degree of freedom of design in the container. Can be attached to the container. Further, since the RFID module has a filter circuit, it is possible to supply electric power to the RFID by utilizing the eddy current generated in the antenna pattern.
　また、基材の第１主面に模様を印刷してもよい。これにより、アンテナパターンを模様の一部として形成することが可能になり、意匠性の自由度の低減を抑制することができる。 Alternatively, a pattern may be printed on the first main surface of the base material. As a result, the antenna pattern can be formed as a part of the pattern, and the reduction in the degree of freedom in design can be suppressed.
　基材の第１主面へのアンテナパターンの印刷と模様の印刷とを同じ印刷工程で行ってもよい。容器の基材への印刷と連続してアンテナパターンの第１アンテナ膜及び第２アンテナ膜を形成することができるので、容器１の模様の印刷とアンテナパターンの形成の製造効率を向上させることができる。 The antenna pattern may be printed on the first main surface of the base material and the pattern may be printed in the same printing process. Since the first antenna film and the second antenna film of the antenna pattern can be formed continuously with the printing on the base material of the container, it is possible to improve the manufacturing efficiency of printing the pattern of the container 1 and forming the antenna pattern. can.
　グラビア印刷又はオフセット印刷によって、第１主面にアンテナパターンを印刷してもよい。これにより、アンテナパターンを高速に形成することができる。 The antenna pattern may be printed on the first main surface by gravure printing or offset printing. As a result, the antenna pattern can be formed at high speed.
　なお、以下で説明する実施の形態は、いずれも本発明の一具体例を示すものであり、本発明がこの構成に限定されるものではない。また、以下の実施の形態において具体的に示される数値、形状、構成、ステップ、ステップの順序などは、一例を示すものであり、本発明を限定するものではない。以下の実施の形態における構成要素のうち、最上位概念を示す独立請求項に記載されていない構成要素については、任意の構成要素として説明される。また、全ての実施の形態において、各変形例における構成も同様であり、各変形例に記載した構成をそれぞれ組み合わせてもよい。 Note that all of the embodiments described below show a specific example of the present invention, and the present invention is not limited to this configuration. Further, the numerical values, shapes, configurations, steps, the order of steps, etc. specifically shown in the following embodiments are only examples, and do not limit the present invention. Among the components in the following embodiments, the components not described in the independent claims indicating the highest level concept are described as arbitrary components. Further, in all the embodiments, the configuration in each modification is the same, and the configurations described in each modification may be combined.
　なお、比誘電率εｒ＞１の場合、アンテナパターン及び導体パターンの電気的長さは物理的長さに対して長くなる。本明細書において、電気的長さとは、比誘電率や寄生リアクタンス成分による波長の短縮や延長を考慮した長さである。 When the relative permittivity εr> 1, the electrical length of the antenna pattern and the conductor pattern is longer than the physical length. In the present specification, the electrical length is a length considering the shortening or extension of the wavelength due to the relative permittivity and the parasitic reactance component.
（実施形態）
　次に、本発明に係るRFIDモジュール５を備える容器１の概略構成について説明する。図１は、本発明に係る実施形態のRFIDモジュール５を有する容器１の全体斜視図である。図２は図１における容器１の展開図である。 (Embodiment)
Next, a schematic configuration of the container 1 provided with the RFID module 5 according to the present invention will be described. FIG. 1 is an overall perspective view of a container 1 having an RFID module 5 according to an embodiment of the present invention. FIG. 2 is a developed view of the container 1 in FIG.
　本実施形態の容器１は、基材３と、基材３の第１主面３ｓに形成されたアンテナパターン７と、アンテナパターン７に装着されたRFIDモジュール５と、を備える。 The container 1 of the present embodiment includes a base material 3, an antenna pattern 7 formed on the first main surface 3s of the base material 3, and an RFID module 5 mounted on the antenna pattern 7.
　容器１は、例えば、図２に示すような平面状の基材３を組み立てることで立体形状に形成される組み立て式の箱である。容器１は、例えば、直方体形状であり、基材３は、例えば、紙製、樹脂製またはプラスチック製である。 The container 1 is, for example, an assembly-type box formed into a three-dimensional shape by assembling a flat base material 3 as shown in FIG. The container 1 has a rectangular parallelepiped shape, for example, and the base material 3 is made of, for example, paper, resin, or plastic.
　基材３は、第１面３ａ、第２面３ｂ、第３面３ｃ、第４面３ｄ、第５面３ｅ、第６面３ｆ、及び、第１フラップ３ｇ、第２フラップ３ｈ、第３フラップ３ｋを備える。例えば、第１面３ａ～第４面３ｄは組み立てた際に側面となり、第５面３ｅは組み立てた際に上面となり、第６面３ｆは組み立てた際に下面となる。基材３の第１主面３ｓは容器１の外面（表面）となる面であり、基材３の第２主面３ｔは容器１の内面（裏面）となる面である。 The base material 3 includes a first surface 3a, a second surface 3b, a third surface 3c, a fourth surface 3d, a fifth surface 3e, a sixth surface 3f, and a first flap 3g, a second flap 3h, and a third flap. Equipped with 3k. For example, the first surface 3a to the fourth surface 3d become a side surface when assembled, the fifth surface 3e becomes an upper surface when assembled, and the sixth surface 3f becomes a lower surface when assembled. The first main surface 3s of the base material 3 is a surface to be the outer surface (front surface) of the container 1, and the second main surface 3t of the base material 3 is a surface to be the inner surface (back surface) of the container 1.
　第１フラップ３ｇの第１主面３ｓは組み立てた際に第２面３ｂの第２主面３ｔに接着層（図示省略）を介して貼り付けられる。第２フラップ３ｈの第１主面３ｓは組み立てた際に第１面３ａの第２主面３ｔに接着層を介して貼り付けられる。第３フラップ３ｋの第１主面３ｓは組み立てた際に第１面３ａの第２主面３ｔに接着層を介して貼り付けられる。 The first main surface 3s of the first flap 3g is attached to the second main surface 3t of the second surface 3b via an adhesive layer (not shown) when assembled. The first main surface 3s of the second flap 3h is attached to the second main surface 3t of the first surface 3a via an adhesive layer when assembled. The first main surface 3s of the third flap 3k is attached to the second main surface 3t of the first surface 3a via an adhesive layer when assembled.
　本実施形態のRFIDモジュール５は、通信周波数（キャリア周波数）を有する高周波信号で無線通信（送受信）するように構成された無線通信デバイスである。RFIDモジュール５は、例えば、UHF帯の通信用の周波数を有する高周波信号で無線通信するよう構成されている。ここでUHF帯とは、８６０MHzから９６０MHzの周波数帯域である。 The RFID module 5 of this embodiment is a wireless communication device configured to perform wireless communication (transmission / reception) with a high frequency signal having a communication frequency (carrier frequency). The RFID module 5 is configured to perform wireless communication with, for example, a high frequency signal having a frequency for communication in the UHF band. Here, the UHF band is a frequency band from 860 MHz to 960 MHz.
　アンテナパターン７は、基材３の第１主面３ｓ上に形成されている。アンテナパターン７は、第１アンテナ膜７ａ及び第２アンテナ膜７ｂを有する。第１アンテナ膜７ａと第２アンテナ膜７ｂとの間にギャップ９が形成されている。アンテナパターン７は、印刷によりグラファイトなどのカーボン系や錫や亜鉛系などの導電材料の膜体により作製されている。アンテナパターン７として、アンテナパターン７の厚みは、例えば、０．１μｍ～３μｍ程度である。 The antenna pattern 7 is formed on the first main surface 3s of the base material 3. The antenna pattern 7 has a first antenna film 7a and a second antenna film 7b. A gap 9 is formed between the first antenna film 7a and the second antenna film 7b. The antenna pattern 7 is made of a film body of a carbon-based material such as graphite or a conductive material such as tin or zinc-based material by printing. As the antenna pattern 7, the thickness of the antenna pattern 7 is, for example, about 0.1 μm to 3 μm.
　実施の形態のアンテナパターン７のシート抵抗は、従来のダイポールアンテナのアンテナパターンのシート抵抗よりも大きい。アンテナパターン７のシート抵抗が大きい場合、従来のダイポールアンテナでは発生しなかった以下の問題が発生する。 The sheet resistance of the antenna pattern 7 of the embodiment is larger than the sheet resistance of the antenna pattern of the conventional dipole antenna. When the sheet resistance of the antenna pattern 7 is large, the following problems that have not occurred in the conventional dipole antenna occur.
　従来のダイポールアンテナでは、アンテナ電極としてアンテナパターン７の全体で共振現象を起こし、電磁波を放射していた。従来のダイポールアンテナのアンテナパターン７はアルミなどの金属箔で形成され、その厚みは例えば、５μｍより大きく４０μｍ以下であり、アンテナパターン７のシート抵抗では、０.０５Ω／□以下である。 In the conventional dipole antenna, a resonance phenomenon occurs in the entire antenna pattern 7 as an antenna electrode, and electromagnetic waves are radiated. The antenna pattern 7 of the conventional dipole antenna is formed of a metal foil such as aluminum, and its thickness is, for example, larger than 5 μm and 40 μm or less, and the sheet resistance of the antenna pattern 7 is 0.05 Ω / □ or less.
　アンテナパターン７としてアルミ金属箔等を使う場合、金属箔の厚みが例えば、５μｍの場合でも、その金属パターン上に、加飾印刷や意匠としてグラビア印刷またはオフセット印刷等で印刷すると、グラビア印刷の印刷厚みが０．５μｍ～３μｍ程度であるので、アンテナ箔としての金属膜の厚みによる大きな段差により印刷ズレ（かすれ、または、にじみ）が発生する。これにより、従来、金属箔を使ったアンテナパターンが貼ってある容器に意匠として直接印刷することが出来なかった。 When aluminum metal foil or the like is used as the antenna pattern 7, even if the thickness of the metal foil is, for example, 5 μm, if printing is performed on the metal pattern by decorative printing or gravure printing or offset printing as a design, gravure printing is printed. Since the thickness is about 0.5 μm to 3 μm, printing misalignment (blurring or bleeding) occurs due to a large step due to the thickness of the metal film as the antenna foil. As a result, it has not been possible to print directly as a design on a container with an antenna pattern using metal leaf.
　本案の様にグラビア印刷またはオフセット印刷等で印刷するアンテナパターン７として金属膜を印刷法により形成するので、金属膜の厚みは、０．１μｍ～３μｍ程度になる。この厚みならば、アンテナパターン７の印刷電極の上にグラビア印刷が可能であり、例えば白色インクでアンテナパターン７を隠すように印刷することも可能であり、意匠性が向上する。しかし、第１アンテナ膜７ａ及び第２アンテナ膜７ｂがこの程度の厚みになると、印刷されたアンテナパターン７は、膜厚が小さいのでシート抵抗が大きくなり、例えば、０．５Ω／□～５０Ω／□程度になる。 Since the metal film is formed by the printing method as the antenna pattern 7 to be printed by gravure printing or offset printing as in the present proposal, the thickness of the metal film is about 0.1 μm to 3 μm. With this thickness, gravure printing can be performed on the printing electrode of the antenna pattern 7, and for example, printing can be performed so as to hide the antenna pattern 7 with white ink, which improves the design. However, when the first antenna film 7a and the second antenna film 7b have such a thickness, the printed antenna pattern 7 has a small film thickness, so that the sheet resistance becomes large, for example, 0.5Ω / □ to 50Ω /. □ It will be about.
　しかし、金属膜のシート抵抗が大きくなると、金属膜によるアンテナ電極全体で定在波を作る直列共振現象を起こしても、金属膜の抵抗により放射電力が、ほとんど熱になってしまうので、アンテナとして電磁波放射を行うことができない。 However, when the sheet resistance of the metal film increases, even if a series resonance phenomenon that creates a standing wave in the entire antenna electrode due to the metal film occurs, the radiation power becomes almost heat due to the resistance of the metal film, so it can be used as an antenna. Cannot emit electromagnetic waves.
　また、RFICとアンテナ間のマッチング回路部の抵抗値も金属膜と同じ厚みになってしまうので、整合回路部の抵抗値が上昇し、整合ロスが大きくなり、RFIDモジュールとして動作しない。 Also, since the resistance value of the matching circuit section between the RFIC and the antenna will be the same thickness as the metal film, the resistance value of the matching circuit section will increase, the matching loss will increase, and the RFID module will not operate.
　このように、膜厚の薄い金属膜によるアンテナパターン（アンテナ電極）では（直列）共振現象による電磁波放射を起こすことができないが、金属膜で電磁波を受けると、金属膜に電磁波を打ち消すように電流が流れて電磁波をシールドする。この電流は、渦電流とも呼ばれる。渦電流による金属膜に流れる電流成分は、アンテナ電極の共振現象によるものではないので電極パターン形状に寄らず全周波数成分に対応することができる。この渦電流は、金属シールドの効果としては知られているが、通常はアンテナとして利用されていない。 In this way, an antenna pattern (antenna electrode) made of a thin metal film cannot generate electromagnetic wave radiation due to a (series) resonance phenomenon, but when an electromagnetic wave is received by the metal film, a current is applied so as to cancel the electromagnetic wave in the metal film. Flows and shields electromagnetic waves. This current is also called an eddy current. Since the current component flowing through the metal film due to the eddy current is not due to the resonance phenomenon of the antenna electrode, it can correspond to all frequency components regardless of the electrode pattern shape. This eddy current is known as an effect of the metal shield, but it is not usually used as an antenna.
　RFIDモジュール５には、後述するように、固有の共振周波数の電流だけをRFIC２３に伝送するフィルタ回路としての並列共振回路ＲＣ１を有するので、渦電流が周波数選択されてRFIC２３に電流が流れてエネルギーが伝送される。アンテナ電極としてのアンテナパターン７とRFIDモジュール５間で特定周波数だけを選択して、インピーダンス整合し、RFIC２３とアンテナパターン７間のエネルギー伝達が可能となる。このようにして、RFIC２３と通信可能になると考えられる。 As will be described later, the RFID module 5 has a parallel resonant circuit RC1 as a filter circuit that transmits only a current having a unique resonant frequency to the RFIC 23, so that the eddy current is frequency-selected and the current flows through the RFIC 23 to generate energy. Be transmitted. Only a specific frequency is selected between the antenna pattern 7 as an antenna electrode and the RFID module 5, impedance matching is performed, and energy transfer between the RFID 23 and the antenna pattern 7 becomes possible. In this way, it is considered that communication with the RFIC 23 becomes possible.
　したがって、容器１であれば、アンテナパターン７のシート抵抗が高い場合でも、従来では利用されなかった渦電流を用いることで通信可能にすることができる。 Therefore, in the case of the container 1, even if the sheet resistance of the antenna pattern 7 is high, communication can be enabled by using an eddy current that has not been used in the past.
　また、アンテナパターン７のシート抵抗が高い状態は、アンテナパターン７の厚みだけでなくアンテナパターン７の製法によっても発生する。例えば、アンテナパターン７をＡｇペースト等の導電性ペーストや導電性高分子材により形成する場合も、シート抵抗が０．５Ω／□以上になる場合がある。このような場合でも、本実施形態の容器１であれば、無線通信を行うことができる。 Further, the state where the sheet resistance of the antenna pattern 7 is high occurs not only by the thickness of the antenna pattern 7 but also by the manufacturing method of the antenna pattern 7. For example, when the antenna pattern 7 is formed of a conductive paste such as Ag paste or a conductive polymer material, the sheet resistance may be 0.5 Ω / □ or more. Even in such a case, wireless communication can be performed with the container 1 of the present embodiment.
　次に、図３から図６を参照して、RFIDモジュール５の構成について説明する。図３は、RFIDモジュールの透視平面図であり、図４は、図３における矢視ＩＶの断面図である。図５はRFIDモジュールの基板に形成されている導体パターンの平面図を示し、図５ａはRFIDモジュールの基板の上面に形成された導体パターンの平面図であり、図５ｂは基板の下面に形成された導体パターンの上から見た透視平面図である。図６は、図３における矢視ＶＩの断面図である。図中において、Ｘ－Ｙ－Ｚ座標系は、発明の理解を容易にするものであって、発明を限定するものではない。Ｘ軸方向はRFIDモジュール５の長手方向を示し、Ｙ軸方向は奥行き（幅）方向を示し、Ｚ軸方向は厚さ方向を示している。Ｘ、Ｙ、Ｚ方向は互いに直交する。 Next, the configuration of the RFID module 5 will be described with reference to FIGS. 3 to 6. FIG. 3 is a perspective plan view of the RFID module, and FIG. 4 is a sectional view taken along the line IV in FIG. FIG. 5 shows a plan view of a conductor pattern formed on the substrate of the RFID module, FIG. 5a is a plan view of the conductor pattern formed on the upper surface of the substrate of the RFID module, and FIG. 5b is a plan view of the conductor pattern formed on the lower surface of the substrate. It is a perspective plan view seen from the top of the conductor pattern. FIG. 6 is a cross-sectional view of the arrowhead VI in FIG. In the figure, the XYZ coordinate system facilitates the understanding of the invention and does not limit the invention. The X-axis direction indicates the longitudinal direction of the RFID module 5, the Y-axis direction indicates the depth (width) direction, and the Z-axis direction indicates the thickness direction. The X, Y, and Z directions are orthogonal to each other.
　図３に示すように、RFIDモジュール５は、両面テープまたは合成樹脂等の粘着剤１５を介してアンテナパターン７の上面に貼り合わされる。 As shown in FIG. 3, the RFID module 5 is attached to the upper surface of the antenna pattern 7 via an adhesive 15 such as double-sided tape or synthetic resin.
　図４に示すように、RFIDモジュール５は、基板２１と、基板２１に搭載されるRFIC２３とを備える。基板２１は、例えば、ポリイミド等のフレキシブル基板である。RFIC２３が実装された基板２１の上面には保護膜２５が形成されている。保護膜２５は、例えば、ポリウレタン等のエラストマや、エチレン酢酸ビニル（EVA）のようなホットメルト剤である。基板２１の下面にも、保護フィルム２７が貼り付けられている。保護フィルム２７は、例えば、ポリイミドフィルム（カプトンテープ）等のカバーレイフィルムである。 As shown in FIG. 4, the RFID module 5 includes a substrate 21 and an RFID 23 mounted on the substrate 21. The substrate 21 is a flexible substrate such as polyimide. A protective film 25 is formed on the upper surface of the substrate 21 on which the RFIC 23 is mounted. The protective film 25 is, for example, an elastomer such as polyurethane or a hot melt agent such as ethylene vinyl acetate (EVA). A protective film 27 is also attached to the lower surface of the substrate 21. The protective film 27 is, for example, a coverlay film such as a polyimide film (Kapton tape).
　図５を参照する。基板２１の上面には、第３電極３３、第４電極３５、第１インダクタンス素子Ｌ１の主要部の導体パターンＬ１ａ、および、第２インダクタンス素子Ｌ２の主要部の導体パターンＬ２ａが形成されている。第３電極３３は導体パターンＬ１ａの一端と接続され、第４電極３５は導体パターンＬ２ａの一端と接続されている。これらの導体パターンは、例えば、銅箔をフォトリソグラフィによってパターニングしたものである。 Refer to FIG. On the upper surface of the substrate 21, a third electrode 33, a fourth electrode 35, a conductor pattern L1a of the main portion of the first inductance element L1 and a conductor pattern L2a of the main portion of the second inductance element L2 are formed. The third electrode 33 is connected to one end of the conductor pattern L1a, and the fourth electrode 35 is connected to one end of the conductor pattern L2a. These conductor patterns are, for example, a copper foil patterned by photolithography.
　基板２１の下面には、アンテナパターン７にそれぞれ容量結合される第１電極２９および第２電極３１が形成されている。また、基板２１の下面には、第１インダクタンス素子Ｌ１の一部の導体パターンＬ１ｂ、第３インダクタンス素子Ｌ３の導体パターンＬ３ａ、Ｌ３ｂ（二点鎖線で囲む導体パターン）、Ｌ３ｃが形成されている。これらの導体パターンも、例えば、銅箔をフォトリソグラフィによってパターニングしたものである。 On the lower surface of the substrate 21, the first electrode 29 and the second electrode 31 are capacitively coupled to the antenna pattern 7, respectively. Further, on the lower surface of the substrate 21, a part of the conductor pattern L1b of the first inductance element L1 and the conductor patterns L3a, L3b (conductor pattern surrounded by the alternate long and short dash line) and L3c of the third inductance element L3 are formed. These conductor patterns are also, for example, a copper foil patterned by photolithography.
　第１インダクタンス素子Ｌ１の一部の導体パターンＬ１ｂの一端と第３インダクタンス素子Ｌ３の導体パターンＬ３ａの一端とが第１電極２９と接続されている。同様に、第２インダクタンス素子Ｌ２の導体パターンＬ２ｂの一端と第３インダクタンス素子Ｌ３の導体パターンＬ３ｃの一端とが第２電極３１と接続されている。第３インダクタンス素子Ｌ３の導体パターンＬ３ａの他端と、導体パターンＬ３ｃの他端との間には、導体パターンＬ３ｂが接続されている。 One end of a part of the conductor pattern L1b of the first inductance element L1 and one end of the conductor pattern L3a of the third inductance element L3 are connected to the first electrode 29. Similarly, one end of the conductor pattern L2b of the second inductance element L2 and one end of the conductor pattern L3c of the third inductance element L3 are connected to the second electrode 31. A conductor pattern L3b is connected between the other end of the conductor pattern L3a of the third inductance element L3 and the other end of the conductor pattern L3c.
　第１インダクタンス素子Ｌ１の導体パターンＬ１ｂの他端と、第１インダクタンス素子Ｌ１の導体パターンＬ１ａの他端とは、ビア導体Ｖ１を介して接続されている。同様に、第２インダクタンス素子Ｌ２の導体パターンＬ２ｂの他端と、第２インダクタンス素子Ｌ２の導体パターンＬ２ａの他端とは、ビア導体Ｖ２を介して接続されている。 The other end of the conductor pattern L1b of the first inductance element L1 and the other end of the conductor pattern L1a of the first inductance element L1 are connected via the via conductor V1. Similarly, the other end of the conductor pattern L2b of the second inductance element L2 and the other end of the conductor pattern L2a of the second inductance element L2 are connected via the via conductor V2.
　基板２１の上面に形成された第３電極３３および第４電極３５にRFIC２３が搭載されている。つまり、RFIC２３の端子２３ａが第３電極３３に接続されて、RFIC２３の端子２３ｂが第４電極３５に接続されている。 The RFIC 23 is mounted on the third electrode 33 and the fourth electrode 35 formed on the upper surface of the substrate 21. That is, the terminal 23a of the RFIC 23 is connected to the third electrode 33, and the terminal 23b of the RFIC 23 is connected to the fourth electrode 35.
　第１インダクタンス素子Ｌ１と第３インダクタンス素子Ｌ３の導体パターンＬ３ａとは、基板２１の異なる層にそれぞれ形成され、かつ、それぞれのコイル開口が重なる関係に配置されている。同様に、第２インダクタンス素子Ｌ２および第３インダクタンス素子Ｌ３の導体パターンＬ３ｃとは、基板２１の異なる層にそれぞれ形成され、かつ、それぞれのコイル開口が重なる関係に配置されている。さらに、RFIC２３は、基板２１の面上で、第２インダクタンス素子Ｌ２および第３インダクタンス素子Ｌ３の導体パターンＬ３ｃと、第１インダクタンス素子Ｌ１および第３インダクタンス素子Ｌ３の導体パターンＬ３ａとの間に、位置する。導体パターンＬ１ａ、Ｌ１ｂ、及びＬ３ａで第１コイルＣｒ１を構成し、導体パターンＬ２ａ、Ｌ２ｂ、及びＬ３ｃで第２コイルＣｒ２を構成する。 The conductor patterns L3a of the first inductance element L1 and the third inductance element L3 are formed in different layers of the substrate 21, and are arranged so that their coil openings overlap each other. Similarly, the conductor patterns L3c of the second inductance element L2 and the third inductance element L3 are formed in different layers of the substrate 21, and the coil openings are arranged so as to overlap each other. Further, the RFIC 23 is positioned on the surface of the substrate 21 between the conductor pattern L3c of the second inductance element L2 and the third inductance element L3 and the conductor pattern L3a of the first inductance element L1 and the third inductance element L3. do. The conductor patterns L1a, L1b, and L3a form the first coil Cr1, and the conductor patterns L2a, L2b, and L3c form the second coil Cr2.
　RFIDモジュール５内において、基板２１の上面及び下面を通る第１電流経路ＣＰ１と基板２１の下面を通る第２電流経路ＣＰ２とが形成されている。第１電流経路ＣＰ１は、第１電極２９から分岐点Ｎ１、導体パターンＬ１ｂ、導体パターンＬ１ａ、RFIC２３、導体パターンＬ２ａ、導体パターンＬ２ｂ、分岐点Ｎ２、を通って第２電極３１に至る。第２電流経路ＣＰ２は、第１電極２９から分岐点Ｎ１、導体パターンＬ３ａ、導体パターンＬ３ｂ、導体パターンＬ３ｃ、分岐点Ｎ２を通って第２電極３１に至る。ここで、導体パターンＬ１ａとビア導体Ｖ１を介して接続している導体パターンＬ１ｂで構成される第１インダクタンス素子Ｌ１と、導体パターンＬ２ａとビア導体Ｖ２を介して接続している導体パターンＬ２ｂで構成される第２インダクタンス素子Ｌ２に流れる電流の巻き方向は逆になっており、第１インダクタンス素子Ｌ１で発生する磁界と第２インダクタンス素子Ｌ２で発生する磁界はお互いに打ち消し合っている。第１電流経路ＣＰ１及び第２電流経路ＣＰ２は、それぞれ、第１電極２９と第２電極３１との間で、互いに並列に形成されている。 In the RFID module 5, a first current path CP1 passing through the upper surface and the lower surface of the substrate 21 and a second current path CP2 passing through the lower surface of the substrate 21 are formed. The first current path CP1 reaches the second electrode 31 from the first electrode 29 through the branch point N1, the conductor pattern L1b, the conductor pattern L1a, RFIC23, the conductor pattern L2a, the conductor pattern L2b, and the branch point N2. The second current path CP2 reaches the second electrode 31 from the first electrode 29 through the branch point N1, the conductor pattern L3a, the conductor pattern L3b, the conductor pattern L3c, and the branch point N2. Here, it is composed of a first inductance element L1 composed of a conductor pattern L1b connected via a conductor pattern L1a and a via conductor V1, and a conductor pattern L2b connected via a conductor pattern L2a and a via conductor V2. The winding directions of the current flowing through the second inductance element L2 are opposite to each other, and the magnetic field generated by the first inductance element L1 and the magnetic field generated by the second inductance element L2 cancel each other out. The first current path CP1 and the second current path CP2 are formed in parallel with each other between the first electrode 29 and the second electrode 31, respectively.
　従来、容器にダイポールアンテナ型のアンテナパターンを設けた場合、ダイポールアンテナが容器内の内容物により影響を受けて通信が妨げられる場合があった。これは、アンテナパターンの物理的長さが固定されており、液体等の内容物によってアンテナパターンの電気的長さが影響を受けて変化すると、通信ができなくなる場合がある。したがって、容器に直接形成するアンテナとしてダイポールアンテナは不向きであった。 Conventionally, when a dipole antenna type antenna pattern is provided in a container, the dipole antenna may be affected by the contents in the container and communication may be hindered. This is because the physical length of the antenna pattern is fixed, and if the electrical length of the antenna pattern is affected by the contents such as liquid and changes, communication may not be possible. Therefore, the dipole antenna is not suitable as an antenna formed directly on the container.
　図７に示すように、液体等の誘電体またはレトルトパウチ（sealed pouch）のような金属コーティングされたパウチ４１を容器内に収容する場合、パウチ４１の金属コーティングとアンテナパターン７とが容量結合して影響を受けたり、収納する液体等の誘電体によりRFIDタグの誘電率が変化してアンテナパターン７の電気長が物理的長さよりも短くなることがある。また、誘電率の変化は内容物とアンテナパターン７との距離によっても変化する。したがって、内容物の位置が容器の中で変わるごとに通信特性も変化する。 As shown in FIG. 7, when a dielectric such as a liquid or a metal-coated pouch 41 such as a sealed pouch is housed in a container, the metal coating of the pouch 41 and the antenna pattern 7 are capacitively coupled. The dielectric constant of the RFID tag may change depending on the dielectric material such as the liquid to be stored, and the electric length of the antenna pattern 7 may be shorter than the physical length. Further, the change in the dielectric constant also changes depending on the distance between the content and the antenna pattern 7. Therefore, each time the position of the contents changes in the container, the communication characteristics also change.
　本実施形態において、アンテナパターン７において直列共振を発生させるのではなく、アンテナパターン７において発生した渦電流を利用して高周波信号の送受信し、RFIDモジュール５が通信周波数の共振周波数の電磁波による電流をRFIC素子に伝送するフィルタ回路持つことで、アンテナパターン７とパウチ４１とが容量結合しても通信周波数にほとんど変化がなく通信することができる。また、内容物が金属コーティングされたパウチ４１である場合、図７の様にアンテナ膜７ａを容器１の基材３を介して内容物に対向するように印刷し、アンテナ膜７ｂを金属コーティングされたパウチ４１から離れる様に印刷することで、アンテナ膜７ｂは容量結合がほとんどなく、アンテナ膜７ａが選択的に金属コーティング面と容量結合する。これによりアンテナ膜７ａに渦電流が流れると、容量結合により金属コーティング表面にも渦電流が流れるので、金属コーティング面も高周波信号の送受信に使うことが出来る。 In the present embodiment, instead of generating series resonance in the antenna pattern 7, a high frequency signal is transmitted and received using the eddy current generated in the antenna pattern 7, and the RFID module 5 transmits a current due to an electromagnetic wave having a resonance frequency of the communication frequency. By having a filter circuit that transmits to the RFIC element, communication can be performed with almost no change in the communication frequency even if the antenna pattern 7 and the pouch 41 are capacitively coupled. When the content is a metal-coated pouch 41, the antenna film 7a is printed so as to face the content via the base material 3 of the container 1 as shown in FIG. 7, and the antenna film 7b is metal-coated. By printing away from the pouch 41, the antenna film 7b has almost no capacitive coupling, and the antenna film 7a selectively has a capacitive coupling with the metal coating surface. As a result, when an eddy current flows through the antenna film 7a, an eddy current also flows through the metal coating surface due to capacitive coupling, so that the metal coating surface can also be used for transmitting and receiving high-frequency signals.
　また、本実施形態において、この誘電率の変化による波長変化（周波数変化）を避けるために、アンテナパターン７の長さで周波数設計するのではなく、RFIDモジュール５で共振周波数を固定することで、アンテナパターン７の長さによる周波数変化に対応できる。 Further, in the present embodiment, in order to avoid the wavelength change (frequency change) due to the change in the dielectric constant, the resonance frequency is fixed by the RFID module 5 instead of designing the frequency by the length of the antenna pattern 7. It is possible to cope with the frequency change due to the length of the antenna pattern 7.
　また、RFIC２３は小型のチップであり、積層構造した第１コイルＣｒ１及び第２コイルCｒ２が磁界を打ち消すようにそれぞれのコイルパターンが巻かれている。これにより、RFIC２３の周辺はRFIDモジュール５の誘電率で固定され、容器１に収容される誘電体（内容物）による影響を受けないので、RFIC２３にマッチングする周波数が変化しない。図６を参照すると、導体パターンＬ１ａ、Ｌ２ａと、導体パターンＬ３ａ、Ｌ３ｃ間の基板２１の誘電率が固定しており、線間容量間の変化がない。また、導体パターンＬ１ａ、Ｌ２ａと、導体パターンＬ３ａ、Ｌ３ｃとは、固定の誘電率の保護層としての保護膜２５及び保護フィルム２７でそれぞれ覆われている。このようにして、RFIDモジュール５の誘電率が固定されている。 Further, the RFIC 23 is a small chip, and each coil pattern is wound so that the first coil Cr1 and the second coil Cr2 having a laminated structure cancel the magnetic field. As a result, the periphery of the RFID module 23 is fixed by the dielectric constant of the RFID module 5 and is not affected by the dielectric (contents) contained in the container 1, so that the frequency matching with the RFID module 23 does not change. Referring to FIG. 6, the permittivity of the substrate 21 between the conductor patterns L1a and L2a and the conductor patterns L3a and L3c is fixed, and there is no change between the line capacitances. Further, the conductor patterns L1a and L2a and the conductor patterns L3a and L3c are covered with a protective film 25 and a protective film 27 as a protective layer having a fixed dielectric constant, respectively. In this way, the dielectric constant of the RFID module 5 is fixed.
　また、容器１内の誘電体の誘電率の影響を小さくするために、RFIDモジュール５の第１コイルＣｒ１と、第２コイルＣｒ２とで８の字コイルを形成しており、RFIDモジュール５の磁界が外部に漏れにくい構成である。RFIDモジュール５の磁界が漏れにくいのでインダクタンス値が外部要因で変化しにくい構成である。 Further, in order to reduce the influence of the dielectric constant of the dielectric in the container 1, a figure eight coil is formed by the first coil Cr1 and the second coil Cr2 of the RFID module 5, and the magnetic field of the RFID module 5 is formed. Is a configuration that does not easily leak to the outside. Since the magnetic field of the RFID module 5 is less likely to leak, the inductance value is less likely to change due to external factors.
　また、RFIDモジュール５の磁束も閉じているので、容器１の中に金属を収容する場合でも、RFIC２３にマッチングする周波数の変化が小さくなる。 Further, since the magnetic flux of the RFID module 5 is also closed, the change in the frequency matching with the RFID 23 is small even when the metal is housed in the container 1.
　次に、図８を参照して、RFIDモジュール５の回路構成について説明する。図８はRFIDモジュール５の等価回路図である。 Next, the circuit configuration of the RFID module 5 will be described with reference to FIG. FIG. 8 is an equivalent circuit diagram of the RFID module 5.
　RFIDモジュール５内において、第１電流経路ＣＰ１は、ＬＣ並列共振回路である並列共振回路ＲＣ１の一部であり、通信周波数の電波に対してマッチングしているので、通信周波数の電波をアンテナパターン７が受信すると、RFIC２３に電流が流れる。 In the RFID module 5, the first current path CP1 is a part of the parallel resonant circuit RC1 which is an LC parallel resonant circuit, and matches the radio wave of the communication frequency. Therefore, the radio wave of the communication frequency is used as the antenna pattern 7. Is received, a current flows through the RFIC 23.
　RFIDモジュール５は、並列共振回路ＲＣ１が形成されている。並列共振回路ＲＣ１は、第１インダクタンス素子Ｌ１、RFIC２３、第２インダクタンス素子Ｌ２、および、第３インダクタンス素子Ｌ３で構成されるループ回路である。 The RFID module 5 is formed with a parallel resonant circuit RC1. The parallel resonant circuit RC1 is a loop circuit composed of a first inductance element L1, an RFIC23, a second inductance element L2, and a third inductance element L3.
　容量Ｃ１は、第１アンテナ膜７ａ、第１電極２９、粘着剤１５、および保護フィルム２７で構成される。容量Ｃ２は、第２アンテナ膜７ｂ、第２電極３１、粘着剤１５、および保護フィルム２７で構成される。第４インダクタンス素子Ｌ４はアンテナパターン７の第１アンテナ膜７ａのインダクタンス成分であり、第５インダクタンス素子Ｌ５はアンテナパターン７の第２アンテナ膜７ｂのインダクタンス成分である。 The capacitance C1 is composed of a first antenna film 7a, a first electrode 29, an adhesive 15, and a protective film 27. The capacitance C2 is composed of a second antenna film 7b, a second electrode 31, an adhesive 15, and a protective film 27. The fourth inductance element L4 is an inductance component of the first antenna film 7a of the antenna pattern 7, and the fifth inductance element L5 is an inductance component of the second antenna film 7b of the antenna pattern 7.
　並列共振回路ＲＣ１は、通信周波数における電波に対してインピーダンス整合してＬＣ並列共振するように設計されている。これにより、通信周波数でRFICとマッチングしており、通信周波数におけるRFIDモジュール５の通信距離を確保することができる。 The parallel resonance circuit RC1 is designed to perform LC parallel resonance by impedance matching with radio waves at the communication frequency. As a result, the RFID module is matched with the RFID in the communication frequency, and the communication distance of the RFID module 5 in the communication frequency can be secured.
　本実施形態の容器１において、図９に示すように、アンテナパターン７が容器１の模様４３の一部であってもよい。模様４３は、金属膜であってもいいし、樹脂膜であってもよい。 In the container 1 of the present embodiment, as shown in FIG. 9, the antenna pattern 7 may be a part of the pattern 43 of the container 1. The pattern 43 may be a metal film or a resin film.
　次に、図１０を参照して容器１の製造方法を説明する。図１０は、本実施形態の容器を製造する流れを示すフローチャートである。 Next, a method for manufacturing the container 1 will be described with reference to FIG. FIG. 10 is a flowchart showing a flow of manufacturing the container of the present embodiment.
　ステップＳ１において、組み立て前の容器１の基材３の第１主面３ｓ上にアンテナパターン７を印刷形成する。アンテナパターン７は、グラビア印刷またはオフセット印刷により形成することができる。グラビア印刷またはオフセット印刷を用いることで、高速にアンテナパターン７を印刷することができる。 In step S1, the antenna pattern 7 is printed and formed on the first main surface 3s of the base material 3 of the container 1 before assembly. The antenna pattern 7 can be formed by gravure printing or offset printing. By using gravure printing or offset printing, the antenna pattern 7 can be printed at high speed.
　ステップＳ２において、容器１の基材３の第１主面３ｓ上に模様４３を印刷形成する。模様４３は、アンテナパターン７と同様に、グラビア印刷またはオフセット印刷により形成することができる。なお、ステップＳ１とステップＳ２とは、別々に実施してもいいし、同時または連続して実施してもよい。ステップＳ１とステップＳ２を同じ印刷工程で実施する場合、容器１に模様４３とアンテナパターン７とを同時にまたは連続して印刷形成できるので、容器１に対してアンテナパターン７の位置を固定することができ、内容物とアンテナパターン７との位置関係を個別に設計することができる。またアンテナ膜(７ａ、７ｂ)上に白色の全面印刷や模様印刷をすることで、アンテナパターン７を視認しにくくすることで、意匠性を向上させることも出来る。 In step S2, the pattern 43 is printed and formed on the first main surface 3s of the base material 3 of the container 1. The pattern 43 can be formed by gravure printing or offset printing, similarly to the antenna pattern 7. It should be noted that step S1 and step S2 may be performed separately, or may be performed simultaneously or continuously. When step S1 and step S2 are performed in the same printing process, the pattern 43 and the antenna pattern 7 can be printed simultaneously or continuously on the container 1, so that the position of the antenna pattern 7 can be fixed to the container 1. It is possible to individually design the positional relationship between the contents and the antenna pattern 7. Further, by printing the entire surface of white or printing a pattern on the antenna film (7a, 7b), the antenna pattern 7 can be made difficult to see, and the design can be improved.
　ステップＳ３において、アンテナパターン７上にRFIDモジュール５を取り付ける。RFIDモジュール５は粘着剤１５を介してアンテナパターン７の上面に装着される。 In step S3, the RFID module 5 is mounted on the antenna pattern 7. The RFID module 5 is mounted on the upper surface of the antenna pattern 7 via the adhesive 15.
　ステップＳ４において、容器１が組み立てられる。なお、容器１が組み立てられる前の状態でユーザに出荷することもできる。この場合、ユーザ側で容器１を組み立てて、容器１内に内容物を収納する。 In step S4, the container 1 is assembled. It should be noted that the container 1 can be shipped to the user in a state before being assembled. In this case, the user assembles the container 1 and stores the contents in the container 1.
　以上のように、本実施形態の容器１は、RFIDモジュール５を備えた容器１であって、容器１の外形を形成する絶縁性の基材３と、基材３の第１主面３ｓに形成された第１アンテナ膜７ａ及び第２アンテナ膜７ｂを有するアンテナパターン７とを備える。RFIDモジュール５は、RFIC２３と、通信周波数である固有の共振周波数の電磁波による電流をRFIC２３に伝送するフィルタ回路としての並列共振回路ＲＣ１と、並列共振回路ＲＣ１と接続する第１電極２９及び第２電極３１と、を備える。RFIDモジュール５の第１電極２９と第１アンテナ膜７ａとが電気的に接続されている。第１アンテナ膜７ａ及び第２アンテナ膜７ｂのそれぞれのシート抵抗は０．５Ω／□以上である。 As described above, the container 1 of the present embodiment is the container 1 provided with the RFID module 5, and is formed on the insulating base material 3 forming the outer shape of the container 1 and the first main surface 3s of the base material 3. The antenna pattern 7 having the formed first antenna film 7a and the second antenna film 7b is provided. The RFID module 5 includes an RFIC 23, a parallel resonance circuit RC1 as a filter circuit for transmitting a current due to an electromagnetic wave having a unique resonance frequency which is a communication frequency to the RFIC 23, and a first electrode 29 and a second electrode connected to the parallel resonance circuit RC1. 31 and. The first electrode 29 of the RFID module 5 and the first antenna film 7a are electrically connected. The sheet resistance of each of the first antenna film 7a and the second antenna film 7b is 0.5 Ω / □ or more.
　第１アンテナ膜７ａ及び第２アンテナ膜７ｂのそれぞれのシート抵抗は０．５Ω／□以上であるので、アンテナパターン７を印刷により形成することができるので、容器１への模様の印刷とアンテナパターンとの印刷を同時に実施することも可能であり、模様が印刷された容器１の製造効率を向上させることができる。また、アンテナパターン７を容器１に直接印刷することも可能であるので、アンテナパターン７の形状の設計自由度を向上させることができ、容器１の意匠性の低減を抑制したRFIDモジュール５を有する容器１を提供することができる。また、印刷により高速かつ大量にアンテナパターン７を形成することができるので、従来よりもRFIDモジュール５を備えた容器１を安価に提供することができる。 Since the sheet resistance of each of the first antenna film 7a and the second antenna film 7b is 0.5 Ω / □ or more, the antenna pattern 7 can be formed by printing, so that the pattern can be printed on the container 1 and the antenna pattern can be printed. It is also possible to perform printing with and at the same time, and it is possible to improve the manufacturing efficiency of the container 1 on which the pattern is printed. Further, since the antenna pattern 7 can be printed directly on the container 1, the degree of freedom in designing the shape of the antenna pattern 7 can be improved, and the RFID module 5 which suppresses the reduction of the design of the container 1 is provided. Container 1 can be provided. Further, since the antenna pattern 7 can be formed at high speed and in a large amount by printing, the container 1 provided with the RFID module 5 can be provided at a lower cost than in the conventional case.
　また、従来のRFIDタグを容器に貼り付けた構成では、通信周波数の高周波をアンテナパターンで直列共振を起こすことで電磁波の放射が実施されている。この場合、容器内部に金属物がある場合、この金属物とアンテナパターンの両端が容量結合し、一方のアンテナパターンの端部から金属物を経て他方のアンテナパターンの端部への閉じた回路が形成され、電磁波の放射が発生しなくなり、アンテナとして動作しなくなる。 In addition, in the conventional configuration in which the RFID tag is attached to the container, electromagnetic waves are radiated by causing series resonance with the antenna pattern of the high frequency of the communication frequency. In this case, if there is a metal object inside the container, both ends of the metal object and the antenna pattern are capacitively coupled, and a closed circuit is formed from the end of one antenna pattern to the end of the other antenna pattern via the metal object. It is formed, does not emit electromagnetic waves, and does not operate as an antenna.
　容器内部に水分などの誘電体がある場合、アンテナパターン付近に誘電体があるので、アンテナパターンまわりの誘電率が上昇する。これにより、波長短縮がおこり、直列共振周波数がアンテナの初期設定より低くなる。アンテナパターンと誘電体の距離や、誘電体の近傍になるアンテナパターンの割合によって、直列共振周波数が変わるので、従来のようにRFIDタグを貼りつける構成は、アンテナの動作が内容物により不安定になる。 If there is a dielectric such as moisture inside the container, the dielectric constant around the antenna pattern will increase because there is a dielectric near the antenna pattern. This causes the wavelength to be shortened and the series resonance frequency to be lower than the initial setting of the antenna. Since the series resonance frequency changes depending on the distance between the antenna pattern and the dielectric and the ratio of the antenna pattern near the dielectric, the operation of the antenna becomes unstable depending on the contents in the conventional configuration in which the RFID tag is attached. Become.
　これに対して、本実施形態の容器１は、容器１の基材３にアンテナパターン７が形成されており、第１アンテナ膜７ａ及び第２アンテナ膜７ｂのそれぞれのシート抵抗は０．５Ω／□以上であるので、アンテナパターン７に直列共振が発生する代わりに渦電流が発生する。アンテナパターン７に発生した渦電流は、RFIDモジュール５が有する並列共振回路ＲＣ１によって、マッチングされてRFIC２３へ電力を供給する。このアンテナパターン７は、容器１の面のどこにでも印刷できアンテナのパターン長で周波数設計しないので、パターンの自由度も高くなる。これにより容器１と内容物の形状に対し、アンテナパターン７を最適となるパターン形状にすることができる。よって箱内に金属物がある場合や水がある場合でも、アンテナパターン７から電磁波を放射することができる。このように、本実施形態のRFIDモジュール５を備えた容器１は、直列共振を利用していないので、容器１におけるアンテナパターン周囲に金属物や誘電体が存在しても、無線通信が可能である。 On the other hand, in the container 1 of the present embodiment, the antenna pattern 7 is formed on the base material 3 of the container 1, and the sheet resistances of the first antenna film 7a and the second antenna film 7b are 0.5Ω / Since it is □ or more, an eddy current is generated instead of the series resonance in the antenna pattern 7. The eddy current generated in the antenna pattern 7 is matched by the parallel resonant circuit RC1 of the RFID module 5 to supply electric power to the RFID module 23. Since the antenna pattern 7 can be printed anywhere on the surface of the container 1 and the frequency is not designed by the pattern length of the antenna, the degree of freedom of the pattern is high. As a result, the antenna pattern 7 can be made into an optimum pattern shape with respect to the shapes of the container 1 and the contents. Therefore, even if there is a metal object or water in the box, the electromagnetic wave can be radiated from the antenna pattern 7. As described above, since the container 1 provided with the RFID module 5 of the present embodiment does not utilize series resonance, wireless communication is possible even if a metal object or a dielectric is present around the antenna pattern in the container 1. be.
　また、アンテナパターン７は、模様の一部として基材３の第１主面３ｓに形成されている。このように、アンテナパターン７を加飾印刷の一部にすることが出来るので容器１の意匠性を向上させることができる。 Further, the antenna pattern 7 is formed on the first main surface 3s of the base material 3 as a part of the pattern. In this way, since the antenna pattern 7 can be a part of the decorative printing, the design of the container 1 can be improved.
　次に、図１１を参照して実施形態の変形例１を説明する。図１１は、変形例１における容器１Ａの展開図である。変形例１における容器１Ａは、実施形態の容器１のアンテナパターン７がミアンダ形状を有する構成である。このように、アンテナパターン７の第１アンテナ膜７ａ及び第２アンテナ膜７ｂがミアンダ形状に延びてもよい。変形例１の容器１Ａにおけるその他の構成は実施形態の容器１と実質的に同じである。このような構成であっても、通信特性としては変わることがないので、変形例１の容器１Ａは、実施形態の容器１と同様の効果を得ることができる。 Next, a modification 1 of the embodiment will be described with reference to FIG. FIG. 11 is a developed view of the container 1A in the first modification. The container 1A in the first modification has a configuration in which the antenna pattern 7 of the container 1 of the embodiment has a meander shape. In this way, the first antenna film 7a and the second antenna film 7b of the antenna pattern 7 may extend in a meander shape. Other configurations of the container 1A of the modification 1 are substantially the same as those of the container 1 of the embodiment. Even with such a configuration, the communication characteristics do not change, so that the container 1A of the modified example 1 can obtain the same effect as the container 1 of the embodiment.
　次に、図１２を参照して実施形態の変形例２を説明する。図１２は、変形例２における容器１Ｂの展開図である。変形例２における容器１Ｂは、実施形態の容器１のアンテナパターン７が第３面３ｃと第４面３ｄとの２つの面にわたって形成された構成である。また、変形例１と同様に、アンテナパターン７がミアンダ形状を有する構成である。変形例２の容器１Ｂのその他の構成は実施形態の容器１と実質的に同じである。このような構成であっても、通信特性としては変わることがないので、変形例２の容器１Ｂは、実施形態の容器１と同様の効果を得ることができる。 Next, a modification 2 of the embodiment will be described with reference to FIG. FIG. 12 is a developed view of the container 1B in the modified example 2. The container 1B in the second modification has a configuration in which the antenna pattern 7 of the container 1 of the embodiment is formed over two surfaces of the third surface 3c and the fourth surface 3d. Further, as in the modification 1, the antenna pattern 7 has a meander shape. Other configurations of the container 1B of the modification 2 are substantially the same as those of the container 1 of the embodiment. Even with such a configuration, the communication characteristics do not change, so that the container 1B of the modified example 2 can obtain the same effect as the container 1 of the embodiment.
　次に、図１３を参照して実施形態の変形例３を説明する。図１３は、実施形態の変形例３における容器１Ｃの展開図である。実施形態の変形例３における容器１Ｃは、実施形態の容器１において、アンテナパターン７がロゴタイプを含む形状である。図１３においては、「MURATA」のロゴタイプがアンテナパターンとして形成され、ロゴタイプがアンテナとして機能する。アンテナパターン７は、ロゴタイプの代わりにロゴマークを含んでもよいし、ロゴタイプとロゴマークとの組み合わせを含んでもよい。このような構成であっても、通信特性としては変わることがないので、変形例３の容器１Ｃは、実施形態の容器１と同様の効果を得ることができる。 Next, a modification 3 of the embodiment will be described with reference to FIG. FIG. 13 is a developed view of the container 1C in the modified example 3 of the embodiment. The container 1C in the modified example 3 of the embodiment has a shape in which the antenna pattern 7 includes the logotype in the container 1 of the embodiment. In FIG. 13, the “MURATA” logotype is formed as an antenna pattern, and the logotype functions as an antenna. The antenna pattern 7 may include a logo mark instead of the logotype, or may include a combination of the logotype and the logo mark. Even with such a configuration, the communication characteristics do not change, so that the container 1C of the modified example 3 can obtain the same effect as the container 1 of the embodiment.
　このように、模様とは、容器１の第１主面３ｓ上に形成された容器１を装飾する印刷物であり、例えば、図形、絵、文字、ロゴタイプ、ロゴマーク、及びこれらの組み合わせを含む。 As described above, the pattern is a printed matter for decorating the container 1 formed on the first main surface 3s of the container 1, and includes, for example, a figure, a picture, a character, a logotype, a logo mark, and a combination thereof. ..
　次に、図１４Ａ－図１７を参照して実施形態の変形例４を説明する。図１４Ａは、実施形態の変形例４における容器１Ｄの展開図である。図１４Ｂは、容器１Ｄの展開図の部分拡大図である。図１５は、容器１Ｄの透視斜視図である。図１６は、図１５のXVI矢視図であり、容器１Ｄの透視側面図である。図１７は、図１５のXVII矢視図であり、容器１Ｄの透視正面図である。 Next, a modification 4 of the embodiment will be described with reference to FIGS. 14A-17. FIG. 14A is a developed view of the container 1D in the modified example 4 of the embodiment. FIG. 14B is a partially enlarged view of a developed view of the container 1D. FIG. 15 is a perspective perspective view of the container 1D. 16 is a perspective view of the XVI arrow of FIG. 15, and is a perspective side view of the container 1D. FIG. 17 is a perspective view of XVII of FIG. 15 and is a perspective front view of the container 1D.
　実施形態の変形例４における容器１Ｄは、図７に示す容器１の変形例であり、実施形態の容器１におけるアンテナパターン７が第１フラップ３ｇに形成されている構成である。基材３は、箱状の容器１Ｄの側面となる、第１主面３ｓをそれぞれ有する第１面３ａ及び第２面３ｂと、第１面３ａと第２面３ｂとを接着層により接続するための、第１面３ａに連続した第１フラップ３ｇとを有する。側面視において、第１アンテナ膜７Ｄａは蓋５１ｂと重なるように第１フラップ３ｇに形成され、第２アンテナ膜７Ｄｂは容器本体５１ａと重なるように第１フラップ３ｇに形成されている。また、容器１Ｄは、第１フラップ３ｇ～第３フラップ３ｋ以外のフラップを、例えば、組み立てられた容器５１の内部に埃が進入するのを防止するためと補強用に有している。 The container 1D in the modified example 4 of the embodiment is a modified example of the container 1 shown in FIG. 7, and has a configuration in which the antenna pattern 7 in the container 1 of the embodiment is formed in the first flap 3 g. The base material 3 connects the first surface 3a and the second surface 3b having the first main surface 3s, which are the side surfaces of the box-shaped container 1D, and the first surface 3a and the second surface 3b by an adhesive layer. It has a first flap 3g continuous with the first surface 3a for the purpose. In the side view, the first antenna film 7Da is formed on the first flap 3g so as to overlap the lid 51b, and the second antenna film 7Db is formed on the first flap 3g so as to overlap the container body 51a. Further, the container 1D has flaps other than the first flap 3g to the third flap 3k for reinforcement, for example, to prevent dust from entering the inside of the assembled container 51.
　図１４Ａに示すように、実施形態の変形例４におけるアンテナパターン７Ｄは、非対称ダイポールアンテナである。アンテナパターン７Ｄは、ミアンダ形状のパターンを有する第１アンテナ膜７Ｄａと、第１アンテナ膜７Ｄａよりも長い第２アンテナ膜７Ｄｂとを有する。第２アンテナ膜７Ｄｂは、ミアンダ形状のパターン７Ｄｂａと、直線形状のパターン７Ｄｂｂとを有する。アンテナパターン７Ｄは、例えば、蒸着箔の箔押しや、導電性ペーストの印刷により形成される。 As shown in FIG. 14A, the antenna pattern 7D in the modified example 4 of the embodiment is an asymmetric dipole antenna. The antenna pattern 7D has a first antenna film 7Da having a meander-shaped pattern and a second antenna film 7Db longer than the first antenna film 7Da. The second antenna film 7Db has a meander-shaped pattern 7Dba and a linear-shaped pattern 7Dbb. The antenna pattern 7D is formed, for example, by stamping a vapor-deposited foil or printing a conductive paste.
　容器１Ｄは、箱に組たてられた状態において、さらに、１つ以上の容器５１を内部に収容する。容器５１は、水などの液体を収容する容器本体５１ａと、容器本体５１ａにとりつけられ、内部が空洞の蓋５１ｂとを有する。容器本体５１ａは、例えば、金属製または樹脂製である。容器本体５１ａが金属製の物品そのものであってもよい。蓋５１ｂは、例えば、樹脂製である。したがって、蓋５１ｂは、容器１Ｄ内において容器本体５１ａと容器１Ｄの上面である第５面との間に液体や金属がほとんどない空間Ｓｐを確保する。 Container 1D further accommodates one or more containers 51 inside in a state of being assembled in a box. The container 51 has a container body 51a for accommodating a liquid such as water, and a lid 51b attached to the container body 51a and having a hollow inside. The container body 51a is made of, for example, metal or resin. The container body 51a may be a metal article itself. The lid 51b is made of resin, for example. Therefore, the lid 51b secures a space Sp in the container 1D between the container main body 51a and the fifth surface, which is the upper surface of the container 1D, with almost no liquid or metal.
　実施形態の変形例４における容器１Ｄによれば、アンテナパターン７Ｄ及びRFIDモジュール５が第１フラップ３ｇに形成されているので、箱形成時にアンテナパターン７Ｄ及びRFIDモジュール５が外観上隠れており、容器１Ｄの意匠性に影響しない。また、箱組み立て時に、RFIDモジュール５が第１フラップ３ｇと第２面３ｂとに挟まれるので、内容物である容器５１に接触することがない。したがって、容器５１の出し入れにより、RFIDモジュール５が容器１Ｄから脱落するおそれがない。 According to the container 1D in the modification 4 of the embodiment, since the antenna pattern 7D and the RFID module 5 are formed on the first flap 3g, the antenna pattern 7D and the RFID module 5 are visually hidden at the time of forming the box, and the container is formed. It does not affect the design of 1D. Further, since the RFID module 5 is sandwiched between the first flap 3g and the second surface 3b at the time of assembling the box, it does not come into contact with the container 51 which is the content. Therefore, there is no possibility that the RFID module 5 will fall out of the container 1D when the container 51 is taken in and out.
　また、アンテナパターン７Ｄの一方の電極である第１アンテナ膜７Ｄａが、内容物である液体を収容する容器本体５１ａ、または、金属である容器本体５１ａから離れて配置されているので、液体または金属製の内容物の影響を受けにくく、通信特性の低減を抑制することができる。 Further, since the first antenna film 7Da, which is one electrode of the antenna pattern 7D, is arranged away from the container body 51a for accommodating the liquid as the content or the container body 51a which is a metal, the liquid or metal. It is not easily affected by the contents of the product, and it is possible to suppress the reduction of communication characteristics.
　なお、図１８に示すように、容器５１は蓋５１ｂを有していなくてもよい。この場合、容器５１の上面と容器１Ｄの第５面３ｅとの間に空間Ｓｐが形成される程度に容器１Ｄの高さを確保する。側面視において、第１アンテナ膜７Ｄａは、容器５１の上面と容器１Ｄの第５面３ｅとの間の空間Ｓｐと重なるように第１フラップ３ｇに形成されている。これにより、上述した効果と同様の効果を得ることができる。 As shown in FIG. 18, the container 51 does not have to have the lid 51b. In this case, the height of the container 1D is secured to such an extent that a space Sp is formed between the upper surface of the container 51 and the fifth surface 3e of the container 1D. In the side view, the first antenna film 7Da is formed on the first flap 3g so as to overlap the space Sp between the upper surface of the container 51 and the fifth surface 3e of the container 1D. Thereby, the same effect as the above-mentioned effect can be obtained.
　また、図１９に示すように、第１フラップ３ｇに形成されるアンテナパターン７Ｅａにおいて、第１アンテナ膜７Ｄａはミアンダ形状を有しているが、第２アンテナ膜７Ｅａｂは、ミアンダ形状を有する代わりに平板状の形状を有してもよい。平板上の第２アンテナ膜７Ｅａｂが、箱組み立て時に側面視で容器１Ｅの内容物と重なるように配置されているので、上述した効果と同様の効果を得ることができる。 Further, as shown in FIG. 19, in the antenna pattern 7Ea formed on the first flap 3g, the first antenna film 7Da has a meander shape, but the second antenna film 7Eab has a meander shape instead. It may have a flat plate shape. Since the second antenna film 7Eab on the flat plate is arranged so as to overlap the contents of the container 1E in a side view when the box is assembled, the same effect as the above-mentioned effect can be obtained.
　また、第１フラップ３ｇに形成されるアンテナパターン７Ｅａの第２アンテナ膜７Ｅａｂは、平板状の形状以外にも種々の形状を有してもよい。第２アンテナ膜の形状の例として、図２０Ａ及び図２０Ｂに示す。図２０Ａ（ａ）、（ｂ）及び図２０Ｂ（ａ）、（ｂ）は、それぞれ、実施形態の変形例における容器の展開図の部分拡大図である。 Further, the second antenna film 7Eab of the antenna pattern 7Ea formed on the first flap 3g may have various shapes other than the flat plate shape. 20A and 20B are shown as examples of the shape of the second antenna film. 20A (a) and 20B (b) and 20B (a) and 20B (b) are partially enlarged views of the developed view of the container in the modified example of the embodiment, respectively.
　図２０Ａ（ａ）に示すように、容器１Ｅｂの第１フラップ３ｇに形成されるアンテナパターン７Ｅｂの第２アンテナ膜７Ｅｂｂは、第１フラップ３ｇの側辺部側に凹凸形状を有してもよい。 As shown in FIG. 20A (a), the second antenna film 7Ebb of the antenna pattern 7Eb formed on the first flap 3g of the container 1Eb may have an uneven shape on the side surface side of the first flap 3g. ..
　また、図２０Ａ（ｂ）に示すように、容器１Ｅｃの第１フラップ３ｇに形成されるアンテナパターン７Ｅｃの第２アンテナ膜７Ｅｂｃは、第１フラップ３ｇの幅方向に振動する波形状を有してもよい。 Further, as shown in FIG. 20A (b), the second antenna film 7Ebc of the antenna pattern 7Ec formed on the first flap 3g of the container 1Ec has a wave shape vibrating in the width direction of the first flap 3g. May be good.
　また、図２０Ｂ（ａ）に示すように、容器１Ｅｄの第１フラップ３ｇに形成されるアンテナパターン７Ｅｄの第２アンテナ膜７Ｅｂｄは、複数の環状の導体パターンが結合して構成されてもよい。 Further, as shown in FIG. 20B (a), the second antenna film 7Ebd of the antenna pattern 7Ed formed on the first flap 3g of the container 1Ed may be formed by combining a plurality of annular conductor patterns.
　また、図２０Ｂ（ｂ）に示すように、容器１Ｅｅの第１フラップ３ｇに形成されるアンテナパターン７Ｅｅの第２アンテナ膜７Ｅｂｅは、複数の導体パターンがメッシュ状に形成されてもよい。このように、アンテナパターン７Ｅｂ～７Ｅｅによれば、アンテナパターン７Ｅよりも、第１フラップ３ｇの非金属領域を増やすことができるので、第１フラップ３ｇの基材３が露出している領域と第２面３ｂの基材３が露出している領域とを、直接接着層１１により接着することができる。これにより、第１フラップ３ｇと第２面との接着力を向上させることができる。 Further, as shown in FIG. 20B (b), in the second antenna film 7Ebe of the antenna pattern 7Ee formed on the first flap 3g of the container 1Ee, a plurality of conductor patterns may be formed in a mesh shape. As described above, according to the antenna patterns 7Eb to 7Ee, the non-metal region of the first flap 3g can be increased as compared with the antenna pattern 7E, so that the region where the base material 3 of the first flap 3g is exposed and the second. The region where the base material 3 on the two surfaces 3b is exposed can be directly bonded by the adhesive layer 11. Thereby, the adhesive strength between the first flap 3g and the second surface can be improved.
　また、実施形態の変形例４における容器１Ｄのアンテナパターン７Ｄは、ミアンダ形状の第１アンテナ膜７Ｄａと第２アンテナ膜７Ｄｂは、他にも図２１Ａ及び図２１Ｂに示すようなミアンダ形状であってもよい。図２１Ａ（ａ）、（ｂ）及び図２１Ｂ（ａ）、（ｂ）は、それぞれ、実施形態の変形例における容器の展開図の部分拡大図である。 Further, in the antenna pattern 7D of the container 1D in the modified example 4 of the embodiment, the first antenna film 7Da and the second antenna film 7Db having a meander shape have other meander shapes as shown in FIGS. 21A and 21B. May be good. 21A (a) and 21A (b) and FIGS. 21B (a) and 21B (b) are partially enlarged views of the developed view of the container in the modified example of the embodiment, respectively.
　図２１Ａ（ａ）に示すように、容器１Ｆａのアンテナパターン７Ｆａは、ミアンダ形状の第１アンテナ膜７Ｆａａと第１アンテナ膜７Ｆａａよりも長い第２アンテナ膜７Ｆａｂとを有する。第２アンテナ膜７Ｆａｂは、ミアンダ形状のパターン７Ｆａｂａと、直線形状のパターン７Ｆａｂｂとを有する。第１アンテナ膜７Ｆａａ及びパターン７Ｆａｂａは、第１フラップ３ｇの長手方向両端部に形成されている。 As shown in FIG. 21A (a), the antenna pattern 7Fa of the container 1Fa has a meander-shaped first antenna film 7Faa and a second antenna film 7Fab longer than the first antenna film 7Faa. The second antenna film 7Fab has a meander-shaped pattern 7Faba and a linear-shaped pattern 7Fab. The first antenna film 7Faa and the pattern 7Faba are formed at both ends in the longitudinal direction of the first flap 3 g.
　第１アンテナ膜７Ｆａａ及びパターン７Ｆａｂａのそれぞれの先端は、容器１Ｆａが組み立てられた状態、すなわち、第１フラップ３ｇと第１面３ａとの間の側辺３ａａに沿って第１フラップ３ｇが第１面３ａから折り曲げられた状態で、第１フラップ３ｇと第１面３ａとの角を向くように延びている。第１アンテナ膜７Ｆａａ及びパターン７Ｆａｂａのそれぞれの先端が、折り目となる側辺３ａａの近傍に延びることで、アンテナパターン７Ｆａのそれぞれの先端が箱状の容器１Ｆａのエッジ部に延びることになる。これにより、容器１Ｆａに収容される内容物から離れることになるので、内容物が金属コーティングされたパウチ４１の場合などに、アンテナパターン７Ｆａへの内容物の影響を低減することができる。 The tips of the first antenna film 7Faa and the pattern 7Faba have the first flap 3g along the side 3aa between the first flap 3g and the first surface 3a, that is, the container 1Fa is assembled. In a state of being bent from the surface 3a, it extends so as to face the corner between the first flap 3g and the first surface 3a. Since the tips of the first antenna film 7Faa and the pattern 7Faba extend in the vicinity of the side side 3aa to be a crease, the respective tips of the antenna pattern 7Fa extend to the edge portion of the box-shaped container 1Fa. As a result, the contents are separated from the contents accommodated in the container 1F, so that the influence of the contents on the antenna pattern 7F can be reduced when the contents are a metal-coated pouch 41 or the like.
　図２１Ａ（ａ）に示すように、第１アンテナ膜７Ｆａａ及びパターン７Ｆａｂａのミアンダ形状は、第１フラップ３ｇの幅方向にミアンダ形状の振幅が形成されてもよいし、図２１Ａ（ｂ）に示すように、途中からミアンダ形状のパターンが第１フラップ３ｇと第１面３ａとの角を向くようにミアンダ形状の振幅が斜め方向に形成されてもよい。 As shown in FIG. 21A (a), the meander shape of the first antenna film 7Faa and the pattern 7Faba may have an amplitude of the meander shape formed in the width direction of the first flap 3g, and is shown in FIG. 21A (b). As described above, the amplitude of the meander shape may be formed in an oblique direction so that the pattern of the meander shape faces the angle between the first flap 3g and the first surface 3a from the middle.
　図２１Ａ（ｂ）に示すように、容器１Ｆｂのアンテナパターン７Ｆｂは、ミアンダ形状の第１アンテナ膜７Ｆｂａと第１アンテナ膜７Ｆｂａよりも長い第２アンテナ膜７Ｆｂｂとを有する。第２アンテナ膜７Ｆｂｂは、ミアンダ形状のパターン７Ｆｂｂａと、直線形状のパターン７Ｆｂｂｂとを有する。第１アンテナ膜７Ｆｂａ及びパターン７Ｆｂｂａは、第１フラップ３ｇの長手方向両端部に形成され、それぞれの先端部が折り目となる側辺３ａａの近傍に延びる。 As shown in FIG. 21A (b), the antenna pattern 7Fb of the container 1Fb has a meander-shaped first antenna film 7Fba and a second antenna film 7Fbb longer than the first antenna film 7Fba. The second antenna film 7Fbb has a meander-shaped pattern 7Fbba and a linear-shaped pattern 7Fbbb. The first antenna film 7Fba and the pattern 7Fbba are formed at both ends in the longitudinal direction of the first flap 3g, and the respective tip portions extend in the vicinity of the side side 3aa to be a crease.
　また、図２１Ｂ（ａ）に示すようなアンテナパターンを採用することで内容物の影響を低減することができる。容器１Ｆｃのアンテナパターン７Ｆｃは、ミアンダ形状の第１アンテナ膜７Ｆｃａと第１アンテナ膜７Ｆｃａよりも長い第２アンテナ膜７Ｆｃｂとを有する。第２アンテナ膜７Ｆｃｂは、ミアンダ形状のパターン７Ｆｃｂａと、直線形状のパターン７Ｆｃｂｂとを有する。第１アンテナ膜７Ｆｃａ及びパターン７Ｆｃｂａは、第１フラップ３ｇの長手方向両端部に形成されている。パターン７Ｆｃｂａは、ミアンダ形状の振幅方向が折り目となる側辺３ａａの延びる方向に沿って形成され、ミアンダ形状のパターンが第１フラップ３ｇの先端の辺縁３ｇａに向けて延びるように形成されてもよい。 Further, by adopting the antenna pattern as shown in FIG. 21B (a), the influence of the contents can be reduced. The antenna pattern 7Fc of the container 1Fc has a first antenna film 7Fca having a meander shape and a second antenna film 7Fcb longer than the first antenna film 7Fca. The second antenna film 7Fcb has a meander-shaped pattern 7Fcba and a linear-shaped pattern 7Fcb. The first antenna film 7Fca and the pattern 7Fcba are formed at both ends in the longitudinal direction of the first flap 3g. The pattern 7 Fcba is formed along the extension direction of the side side 3aa where the amplitude direction of the meander shape is a crease, and even if the meander shape pattern is formed so as to extend toward the edge 3ga at the tip of the first flap 3g. good.
　長いアンテナパターンである第２アンテナ膜７Ｆｃｂのミアンダ形状のパターン７Ｆｃｂａの延びる方向をパターン７Ｆｃｂｂの延びる方向から９０度回転させることで、内容物が、例えば、ＰＴＰ（Press Through Pack）シートなどの金属物のときに、通信距離をいくらか長くすることができる。 By rotating the extending direction of the meander-shaped pattern 7Fcba of the second antenna film 7Fcb, which is a long antenna pattern, by 90 degrees from the extending direction of the pattern 7Fcbb, the content is, for example, a metal object such as a PTP (Press Through Pack) sheet. At this time, the communication distance can be increased somewhat.
　また、図１９に示すアンテナパターン７Ｅａの第１アンテナ膜７Ｄａは、ミアンダ形状を有していたが、これに限らない。図２２に、第１フラップ３ｇに形成されたアンテナパターンの第１アンテナ膜がミアンダ形状ではない例を示している。図２２（ａ）、図２２（ｂ）及び図２２（ｃ）は、それぞれ、実施形態の変形例における容器の展開図の部分拡大図である。 Further, the first antenna film 7Da of the antenna pattern 7Ea shown in FIG. 19 had a meander shape, but the present invention is not limited to this. FIG. 22 shows an example in which the first antenna film of the antenna pattern formed on the first flap 3g does not have a meander shape. 22 (a), 22 (b), and 22 (c) are partially enlarged views of the developed view of the container in the modified example of the embodiment, respectively.
　図２２（ａ）に示すように、アンテナパターン７Ｇａは、ループ形状の第１アンテナ膜７Ｇａａと第１アンテナ膜７Ｇａａよりも長い第２アンテナ膜７Ｇａｂとを有する。第２アンテナ膜７Ｇａｂは、矩形形状を有する。第１アンテナ膜７Ｇａａの一端は、RFIDモジュール５の一端が貼り付けられるランド７Ｇａｋであり、このランド７Ｇａｋから渦巻状に外側から内側へパターンが形成されている。 As shown in FIG. 22A, the antenna pattern 7Ga has a loop-shaped first antenna film 7Gaa and a second antenna film 7Gab longer than the first antenna film 7Gaa. The second antenna film 7Gab has a rectangular shape. One end of the first antenna film 7Gaa is a land 7Gak to which one end of the RFID module 5 is attached, and a pattern is formed from the outside to the inside in a spiral shape from the land 7Gak.
　ランド７Ｇａｋと対向する第１アンテナ膜７Ｇａａの第１面３ａ側の部分７Ｇａｄと、ランド７Ｇａｋとの間の領域Ｄｓにおいて、電界が強い。したがって、領域Ｄｓが容器１Ｇａに収容されている内容物に重ならないように、ループ状の第１アンテナ膜７Ｇａａのパターンが内側に巻くように、例えば、時計回りに形成される。 The electric field is strong in the region Ds between the portion 7Gad on the first surface 3a side of the first antenna film 7Gaa facing the land 7Gak and the land 7Gak. Therefore, the pattern of the loop-shaped first antenna film 7Gaa is formed so as to wind inward, for example, clockwise so that the region Ds does not overlap the contents contained in the container 1Ga.
　また、図２２（ｂ）に示すように、容器１Ｇｂのアンテナパターン７Ｇｂは、第１アンテナ膜７Ｇａａと、矩形形状の第２アンテナ膜７Ｇａｂとを有する。第２アンテナ膜７Ｇａｂは１つ以上の孔７ｇｂｅが形成されている。孔７ｇｂｅには、基材３が露出しているので、接着層１１により第１フラップ３ｇと第２面３ｂとの接着力を向上させることができる。 Further, as shown in FIG. 22B, the antenna pattern 7Gb of the container 1Gb has a first antenna film 7Gaa and a rectangular second antenna film 7Gab. The second antenna film 7Gab is formed with one or more holes 7gbe. Since the base material 3 is exposed in the holes 7 gbe, the adhesive layer 11 can improve the adhesive force between the first flap 3 g and the second surface 3b.
　また、図２２（ｃ）に示すように、容器１Ｇｃのアンテナパターン７Ｇｃは、第１アンテナ膜７Ｇａａと、矩形形状の第２アンテナ膜７Ｇａｃとを有する。第２アンテナ膜７Ｇａｃは、折り目となる側辺３ａａに寄せて配置されている。すなわち、第２アンテナ膜７Ｇａｃと側辺３ａａとの間の距離Ｄｗよりも、第２アンテナ膜７Ｇａｃと辺縁３ｇａとの間の距離Ｄｖの方が長い。これにより、第２アンテナ膜７Ｇａｃが容器１Ｇｃに収容される内容物と重なる領域を低減することができる。 Further, as shown in FIG. 22 (c), the antenna pattern 7Gc of the container 1Gc has a first antenna film 7Gaa and a rectangular second antenna film 7Gac. The second antenna film 7Gac is arranged close to the side side 3aa which is a crease. That is, the distance Dv between the second antenna film 7Gac and the margin 3ga is longer than the distance Dw between the second antenna film 7Gac and the side 3aa. As a result, the region where the second antenna film 7Gac overlaps with the contents contained in the container 1Gc can be reduced.
　次に、図２３を参照して実施形態の変形例５を説明する。図２３は実施形態の変形例５における容器１Ｈの展開図の部分拡大図であり、図２３（ａ）は第１フラップ３ｇに形成されたアンテナパターンを示す図であり、図２３（ｂ）はRFIC２３の周辺図であり、図２３（ｃ）はRFIC２３が貼り付けられたアンテナパターンを示す図である。 Next, a modification 5 of the embodiment will be described with reference to FIG. 23. FIG. 23 is a partially enlarged view of a developed view of the container 1H in the modified example 5 of the embodiment, FIG. 23A is a diagram showing an antenna pattern formed on the first flap 3g, and FIG. 23B is a diagram showing the antenna pattern formed on the first flap 3g. It is a peripheral view of RFIC23, and FIG. 23C is a diagram showing an antenna pattern to which RFIC23 is attached.
　実施形態の変形例５における容器１Ｈは、図１４Ａに示す容器１Ｄの変形例であり、RFIDモジュール５を用いる代わりにインダクタをアンテナパターン側に形成してRFIC２３をインダクタの機能も有するアンテナパターンに貼り付ける構成である。 The container 1H in the modification 5 of the embodiment is a modification of the container 1D shown in FIG. 14A. Instead of using the RFID module 5, an inductor is formed on the antenna pattern side and the RFID 23 is attached to the antenna pattern which also has the function of an inductor. It is a configuration to attach.
　図２３（ａ）に示すように、実施形態の変形例５におけるアンテナパターン７Ｈは、非対称ダイポールアンテナである。アンテナパターン７Ｈは、インダクタとしての機能も有する第１アンテナ膜７Ｈａと、第２アンテナ膜７Ｈｂとを有する。 As shown in FIG. 23A, the antenna pattern 7H in the modified example 5 of the embodiment is an asymmetric dipole antenna. The antenna pattern 7H has a first antenna film 7Ha that also has a function as an inductor, and a second antenna film 7Hb.
　第１アンテナ膜７Ｈａは、RFIC２３の他方の端子と電気的に接続されるランド７Ｈａａと、ランド７Ｈａａからランド７Ｈｂｃまでループ状に延びるループパターン７Ｈａｂとを有する。第１アンテナ膜７Ｈａは、マッチング回路として機能し、第１アンテナ膜７ＨａとRFIC２３とをインピーダンス整合し、RFIC２３とアンテナパターン７Ｈ間のエネルギー伝達が可能となる。 The first antenna film 7Ha has a land 7Haa electrically connected to the other terminal of the RFIC 23 and a loop pattern 7Hab extending in a loop from the land 7Haa to the land 7Hbc. The first antenna film 7Ha functions as a matching circuit, impedance-matches the first antenna film 7Ha and the RFIC 23, and enables energy transfer between the RFIC 23 and the antenna pattern 7H.
　第２アンテナ膜７Ｈｂは、RFIC２３の一方の端子と電気的に接続されるランド７Ｈｂｃと、ランド７Ｈｂｃから直線状に延びるパターン７Ｈｂｂと、ミアンダ形状のパターンを有するアンテナ膜７Ｈｂａと、を有する。第１及び第２アンテナ膜７Ｈａ、７Ｈｂは、例えば、蒸着箔の箔押しや、導電性ペーストの印刷により形成される。 The second antenna film 7Hb has a land 7Hbc electrically connected to one terminal of the RFIC 23, a pattern 7Hbb linearly extending from the land 7Hbc, and an antenna film 7Hba having a meander-shaped pattern. The first and second antenna films 7Ha and 7Hb are formed, for example, by stamping a vapor-deposited foil or printing a conductive paste.
　図２３（ｂ）及び（ｃ）に示すように、RFIC２３は、RFIC２３の２つの端子２３ａ、２３ｂとそれぞれ接続される電極６３、６４と、電極６３、６４が形成される樹脂製のシート６５と、を介してランド７Ｈａａ及びランド７Ｈｂｃに貼り付けられる。電極６３及び６４と、ランド７Ｈａａ及びランド７Ｈｂｃとがそれぞれ重なるように配置され、電極６３及び６４と、ランド７Ｈａａ及びランド７Ｈｂｃとがそれぞれ容量結合される。 As shown in FIGS. 23 (b) and 23 (c), the RFIC 23 includes electrodes 63 and 64 connected to the two terminals 23a and 23b of the RFIC 23, respectively, and a resin sheet 65 on which the electrodes 63 and 64 are formed. It is attached to the land 7Haa and the land 7Hbc via the. The electrodes 63 and 64 and the lands 7Haa and the lands 7Hbc are arranged so as to overlap each other, and the electrodes 63 and 64 and the lands 7Haa and the lands 7Hbc are capacitively coupled, respectively.
　実施形態の変形例５における容器１Hによれば、RFIDモジュール５を用いる代わりに、インダクタとしても機能する第１アンテナ膜７Ｈａを第１フラップ３ｇに形成することで、箱形成時にアンテナパターン７Ｈ及びRFIC２３が外観上隠れており、容器１Ｈの意匠性に影響しない。 According to the container 1H in the modification 5 of the embodiment, instead of using the RFID module 5, the first antenna film 7Ha that also functions as an inductor is formed on the first flap 3g, so that the antenna pattern 7H and the RFIC 23 are formed at the time of box formation. Is hidden in appearance and does not affect the design of the container 1H.
　次に、図２４Ａ及び図２４Ｂを参照して実施形態の変形例６を説明する。図２４Ａは実施形態の変形例６における容器１Ｋの展開図であり、図２４Ｂは第１フラップ３ｇに形成されたアンテナパターンを示す図であり、図２３（ｂ）はRFIC２３の周辺図であり、図２３（ｃ）はRFIC２３が貼り付けられたアンテナパターンを示す図である。 Next, a modification 6 of the embodiment will be described with reference to FIGS. 24A and 24B. FIG. 24A is a developed view of the container 1K in the modified example 6 of the embodiment, FIG. 24B is a diagram showing an antenna pattern formed on the first flap 3g, and FIG. 23B is a peripheral view of the RFIC 23. FIG. 23 (c) is a diagram showing an antenna pattern to which the RFIC 23 is attached.
　実施形態の変形例５における容器１Ｋは、図１４Ａに示す容器１Ｄの変形例であり、第２アンテナ膜７Ｋｂを複数の電極に分割し、容器１Ｋが組み立てられた状態で１つのアンテナパターンとして機能する構成である。 The container 1K in the modification 5 of the embodiment is a modification of the container 1D shown in FIG. 14A. The second antenna film 7Kb is divided into a plurality of electrodes, and the container 1K functions as one antenna pattern in an assembled state. It is a configuration to do.
　アンテナパターン７Ｋは、第１アンテナ膜７Ｄａと、第２アンテナ膜７Ｋｂとを有する。第２アンテナ膜７Ｋｂは、第１フラップ３ｇの第１主面３ｓ側に配置された第１パターン電極７Ｋｂａ及び第２パターン電極７Ｋｂｂと、第２面３ｂの第１主面３ｓ側に配置された第３パターン電極７Ｋｂｃとを備える。第１パターン電極７Ｋｂａ～第３パターン電極７Ｋｂｃは、それぞれ、例えば、蒸着箔の箔押しや、導電性ペーストの印刷により形成される。 The antenna pattern 7K has a first antenna film 7Da and a second antenna film 7Kb. The second antenna film 7Kb was arranged on the first main surface 3s side of the first flap 3g, the first pattern electrode 7Kba and the second pattern electrode 7Kbb arranged on the first main surface 3s side, and the second surface 3b on the first main surface 3s side. A third pattern electrode 7Kbc is provided. The first pattern electrode 7Kba to the third pattern electrode 7Kbc are formed by, for example, stamping a vapor-deposited foil or printing a conductive paste, respectively.
　容器１Ｋが組み立てられると、図２４Ｂ及び図２４Ｃに示すように、第１パターン電極７Ｋｂａ及び第２パターン電極７Ｋｂｂと第３パターン電極７Ｋｂｃとの間に第２面３ｂが配置される。第１パターン電極７Ｋｂａと第３パターン電極７Ｋｂｃとの間に容量Ｃ３が、第２パターン電極７Ｋｂｂと第３パターン電極７Ｋｂｃとの間に容量Ｃ４が発生し、それぞれ容量結合される。これにより、第１パターン電極７Ｋｂａ～第３パターン電極７Ｋｂｃにより１つのアンテナパターンとして機能する。 When the container 1K is assembled, as shown in FIGS. 24B and 24C, the second surface 3b is arranged between the first pattern electrode 7Kba and the second pattern electrode 7Kbb and the third pattern electrode 7Kbc. A capacitance C3 is generated between the first pattern electrode 7Kba and the third pattern electrode 7Kbc, and a capacitance C4 is generated between the second pattern electrode 7Kbb and the third pattern electrode 7Kbc, and the capacitances are coupled to each other. As a result, the first pattern electrode 7Kba to the third pattern electrode 7Kbc function as one antenna pattern.
　また、図２４Ｄに示すように、第２面３ｂの裏（第２主面３ｔ）側に、第１アンテナ膜７Ｄａと、第２アンテナ膜７Ｋｂの第１パターン電極７Ｋｂａ及び第２パターン電極７Ｋｂｂと、RFIDモジュール５を配置し、第１フラップ３ｇの表（第１主面３ｓ）側に第３パターン電極７Ｋｂｃを配置してもよい。この構成であっても、容器１Ｌを組み立てると、第１パターン電極７Ｋｂａ～第３パターン電極７Ｋｂｃで１つのアンテナパターンとして機能することができる。また、第１パターン電極７Ｋｂａ～第３パターン電極７Ｋｂｃは、基材３の表面及び裏面のどちらに配置してもよい。 Further, as shown in FIG. 24D, on the back surface (second main surface 3t) side of the second surface 3b, a first antenna film 7Da, a first pattern electrode 7Kba and a second pattern electrode 7Kbb of the second antenna film 7Kb are formed. , The RFID module 5 may be arranged, and the third pattern electrode 7Kbc may be arranged on the front surface (first main surface 3s) side of the first flap 3g. Even with this configuration, when the container 1L is assembled, the first pattern electrode 7Kba to the third pattern electrode 7Kbc can function as one antenna pattern. Further, the first pattern electrode 7Kba to the third pattern electrode 7Kbc may be arranged on either the front surface or the back surface of the base material 3.
　本発明は、上記各実施の形態のものに限らず、次のように変形実施することができる。 The present invention is not limited to those of each of the above embodiments, and can be modified as follows.
　（１）上記各実施の形態において、容器１は組み立て式であったがこれに限らない。容器１は、瓶またはペットボトルであってもよい。 (1) In each of the above embodiments, the container 1 is an assembly type, but the present invention is not limited to this. The container 1 may be a bottle or a PET bottle.
　（２）上記各実施の形態において、アンテナパターン７は容器１に形成された模様の一部であったがこれに限らない。アンテナパターン７が形成された容器１に、さらに印刷膜を塗布してアンテナパターン７とは別の意匠を施してもよい。 (2) In each of the above embodiments, the antenna pattern 7 is a part of the pattern formed on the container 1, but the present invention is not limited to this. A printing film may be further applied to the container 1 on which the antenna pattern 7 is formed to give a design different from that of the antenna pattern 7.
　（３）上記各実施の形態において、通信用周波数帯はUHF帯であったがこれに限られない。HF帯の通信用の周波数（キャリア周波数）を有する高周波信号で無線通信するよう構成されていてもよい。なお、HF帯とは、１３ＭＨｚ以上１５ＭＨｚ以下の周波数帯域である。 (3) In each of the above embodiments, the communication frequency band is the UHF band, but the frequency band is not limited to this. It may be configured to perform wireless communication with a high frequency signal having a frequency (carrier frequency) for communication in the HF band. The HF band is a frequency band of 13 MHz or more and 15 MHz or less.
　（４）上記各実施の形態において、アンテナパターン７は、基材３の第１主面３Ｓの代わりに第２主面３ｔ上に形成してもよい。すなわち、アンテナパターン７を容器１の内部に形成してもよい。 (4) In each of the above embodiments, the antenna pattern 7 may be formed on the second main surface 3t instead of the first main surface 3S of the base material 3. That is, the antenna pattern 7 may be formed inside the container 1.
　本発明をある程度の詳細さをもって各実施の形態において説明したが、これらの実施の形態の開示内容は構成の細部において変化してしかるべきものであり、各実施の形態における要素の組合せや順序の変化は請求された本発明の範囲および思想を逸脱することなく実現し得るものである。 Although the present invention has been described in each embodiment with some detail, the disclosure content of these embodiments should vary in the details of the configuration, and the combination and order of the elements in each embodiment. Changes can be realized without departing from the claimed scope and ideas of the invention.
　　　１　　容器
　　　３　　基材
　　　３ａ　第１面
　　　３ａａ　側辺
　　　３ｂ　第２面
　　　３ｃ　第３面
　　　３ｃａ　第１領域
　　　３ｃｂ　第２領域
　　　３ｃｃ　第３領域
　　　３ｃｄ　第４領域
　　　３ｄ　第４面
　　　３ｅ　第５面
　　　３ｆ　第６面
　　　３ｇ　第１フラップ
　　　３ｇａ　辺縁
　　　３ｈ　第２フラップ
　　　３ｋ　第３フラップ
　　　３ｓ　第１主面
　　　３ｔ　第２主面
　　　３ｕ　テーパー部
　　　３ｖ　凹部
　　　５　　RFIDモジュール
　　　５ａ　表面
　　　５ｂ　裏面
　　　７、７Ｄ　アンテナパターン
　　　７ａ、７Ｄａ　第１アンテナ膜
　　　７ｂ、７Ｄｂ　第２アンテナ膜
　　　９　　ギャップ
　　１５　　粘着剤
　　２１　　基板
　　２３　　RFIC
　　２３ａ　端子
　　２３ｂ　端子
　　２５　　保護膜
　　２７　　保護フィルム
　　２９　　第１電極
　　３１　　第２電極
　　３３　　第３電極
　　３５　　第４電極
　　４１　　パウチ
　　４３　　模様
　　５１　　容器
　　５１ａ　容器本体
　　５１ｂ　蓋
　　Ｌ１　　第１インダクタンス素子
　　Ｌ１ａ　導体パターン
　　Ｌ２ａ　導体パターン
　　Ｌ２　第２インダクタンス素子
　　Ｌ２ａ　導体パターン
　　Ｌ２ｂ　導体パターン
　　Ｌ３　　第３インダクタンス素子
　　Ｌ３ａ　導体パターン
　　Ｌ３ｂ　導体パターン
　　Ｌ３ｃ　導体パターン
　　Ｌ４　　第４インダクタンス素子
　　Ｌ５　　第５インダクタンス素子
　　ＣＰ１　第１電流経路
　　ＣＰ２　第２電流経路
　　Ｃｒ１　第１コイル
　　Ｃｒ２　第２コイル
　　Ｃ１、Ｃ２、Ｃ３、Ｃ４　容量
　　Ｓｐ　　空間 1 Container 3 Base material 3a 1st surface 3aa Side side 3b 2nd surface 3c 3rd surface 3ca 1st area 3cc 2nd area 3cc 3rd area 3cd 4th area 3d 4th surface 3e 5th surface 3f 6th surface 3g 1 flap 3ga edge 3h 2nd flap 3k 3rd flap 3s 1st main surface 3t 2nd main surface 3u taper part 3v recess 5 RFID module 5a front surface 5b back surface 7, 7D antenna pattern 7a, 7Da 1st antenna film 7b, 7Db 2nd antenna film 9 gap 15 adhesive 21 substrate 23 RFIC
23a terminal 23b terminal 25 protective film 27 protective film 29 1st electrode 31 2nd electrode 33 3rd electrode 35 4th electrode 41 pouch 43 pattern 51 container 51a container body 51b lid L1 1st inductance element L1a conductor pattern L2a conductor pattern L2 2 Conductor pattern L2a Conductor pattern L2b Conductor pattern L3 Third inductance element L3a Conductor pattern L3b Conductor pattern L3c Conductor pattern L4 Fourth inductance element L5 Fifth inductance element CP1 First current path CP2 Second current path Cr1 First coil Cr2 Second Coil C1, C2, C3, C4 Capacitance Sp space

Claims (15)

  1. 　RFIDモジュールを備えた容器であって、
    　前記容器の外形を形成する絶縁性の基材と、
    　前記基材の第１主面に形成された第１アンテナ膜及び第２アンテナ膜を有するアンテナパターンと、を備え、
    　前記RFIDモジュールは、RFIC素子と、通信周波数である固有の共振周波数の電磁波による電流を前記RFIC素子に伝送するフィルタ回路と、前記フィルタ回路と接続する第１及び第２電極と、を備え、
    　RFIDモジュールの前記第１電極と前記第１アンテナ膜とが電気的に接続され、
    　RFIDモジュールの前記第２電極と前記第２アンテナ膜とが電気的に接続され、
    　前記第１アンテナ膜及び前記第２アンテナ膜のそれぞれのシート抵抗は０．５Ω／□以上である、
    　RFIDモジュールを備えた容器。     A container with an RFID module
    An insulating base material that forms the outer shape of the container,
    An antenna pattern having a first antenna film and a second antenna film formed on the first main surface of the base material is provided.
    The RFID module includes an RFID element, a filter circuit for transmitting a current due to an electromagnetic wave having a unique resonance frequency which is a communication frequency to the RFID element, and first and second electrodes connected to the filter circuit.
    The first electrode of the RFID module and the first antenna film are electrically connected to each other.
    The second electrode of the RFID module and the second antenna film are electrically connected to each other.
    The sheet resistance of each of the first antenna film and the second antenna film is 0.5 Ω / □ or more.
    A container with an RFID module.
  2. 　前記フィルタ回路は、ＬＣ並列共振回路である、
    　請求項１に記載のRFIDモジュールを備えた容器。     The filter circuit is an LC parallel resonant circuit.
    A container comprising the RFID module according to claim 1.
  3. 　前記フィルタ回路は、基板上に形成されたコイルを有し、
    　前記コイルは、保護層で覆われている、
    　請求項２に記載のRFIDモジュールを備えた容器。     The filter circuit has a coil formed on a substrate and has a coil.
    The coil is covered with a protective layer,
    A container provided with the RFID module according to claim 2.
  4. 　前記フィルタ回路の前記コイルは、８の字形状を有する、
    　請求項３に記載のRFIDモジュールを備えた容器。     The coil of the filter circuit has a figure eight shape.
    A container comprising the RFID module according to claim 3.
  5. 　前記前記第１アンテナ膜及び前記第２アンテナ膜のそれぞれの厚みは０．１μｍ以上３μｍ以下である、
    　請求項１から４のいずれか１つに記載のRFIDモジュールを備えた容器。     The thickness of each of the first antenna film and the second antenna film is 0.1 μm or more and 3 μm or less.
    A container comprising the RFID module according to any one of claims 1 to 4.
  6. 　前記アンテナパターンは、前記基材に形成された模様の一部である、
    　請求項１から５のいずれか１つに記載のRFIDモジュールを備えた容器。     The antenna pattern is part of a pattern formed on the substrate.
    A container comprising the RFID module according to any one of claims 1 to 5.
  7. 　前記アンテナパターン上に印刷膜が形成されている、
    　請求項１から６のいずれか１つに記載のRFIDモジュールを備えた容器。     A printed film is formed on the antenna pattern.
    A container comprising the RFID module according to any one of claims 1 to 6.
  8. 　前記RFIDモジュールを備えた容器は、組み立て式の箱である、
    　請求項１から７のいずれか１つに記載のRFIDモジュールを備えた容器。     The container with the RFID module is a prefabricated box.
    A container comprising the RFID module according to any one of claims 1 to 7.
  9. 　前記基材は、前記箱の側面となる、第１主面をそれぞれ有する第１面及び第２面と、前記第１面と前記第２面とを接続するための、前記第１面に連続したフラップとを有し、
    　前記アンテナパターンは前記フラップに形成され、
    　RFIDモジュールは、前記フラップに配置されている、
    　請求項８に記載のRFIDモジュールを備えた容器。     The base material is continuous with the first surface having the first main surface, which is the side surface of the box, and the first surface for connecting the first surface and the second surface, respectively. With flaps
    The antenna pattern is formed on the flap and
    The RFID module is located on the flap,
    A container comprising the RFID module according to claim 8.
  10. 　金属製の物品又は水分を含む物品を中に収容する、
    　請求項１から９のいずれか１つに記載のRFIDモジュールを備えた容器。     Contains metal or moisture-containing articles,
    A container comprising the RFID module according to any one of claims 1 to 9.
  11. 　前記容器は、金属製の物品又は水分を含む物品を中に収容し、
    　前記容器内において、前記金属製の物品又は水分を含む物品の上方に空間が形成され、
    　側面視において、前記空間と重なるように前記第１アンテナ膜が配置され、前記金属製の物品又は水分を含む物品と重なるように前記第２アンテナ膜が配置されている、
    　請求項９に記載のＲＦＩＤモジュールを備えた容器。     The container contains a metal article or an article containing moisture.
    In the container, a space is formed above the metal article or the article containing water.
    In the side view, the first antenna film is arranged so as to overlap the space, and the second antenna film is arranged so as to overlap the metal article or the article containing water.
    A container comprising the RFID module according to claim 9.
  12. 　容器の外形を形成する絶縁性の基材の第１主面に第１アンテナ膜及び第２アンテナ膜を有するアンテナパターンを印刷し、
    　RFIC素子と、通信周波数である固有の共振周波数の電磁波による電流を前記RFIC素子に伝送するフィルタ回路と、前記フィルタ回路と接続する第１及び第２電極とを備えるRFIDモジュールを、前記第１電極と前記第１アンテナ膜と、及び前記第２電極と前記第２アンテナ膜とをそれぞれ電気的に接続するように前記第１アンテナ膜及び前記第２アンテナ膜に装着し、
    　前記第１アンテナ膜及び前記第２アンテナ膜のそれぞれのシート抵抗は０．５Ω／□以上である、
    　RFIDモジュールを備えた容器の製造方法。     An antenna pattern having a first antenna film and a second antenna film is printed on the first main surface of the insulating base material forming the outer shape of the container.
    An RFID module including an RFIC element, a filter circuit for transmitting a current due to an electromagnetic wave having a unique resonance frequency which is a communication frequency, to the RFID element, and first and second electrodes connected to the filter circuit is provided with the first electrode. And the first antenna film, and the second electrode and the second antenna film are attached to the first antenna film and the second antenna film so as to be electrically connected to each other.
    The sheet resistance of each of the first antenna film and the second antenna film is 0.5 Ω / □ or more.
    A method for manufacturing a container equipped with an RFID module.
  13. 　前記基材の前記第１主面に模様を印刷する、
    　請求項１２に記載のRFIDモジュールを備えた容器の製造方法。     A pattern is printed on the first main surface of the substrate.
    The method for manufacturing a container provided with the RFID module according to claim 12.
  14. 　前記基材の前記第１主面への前記アンテナパターンの印刷と前記模様の印刷とを同じ印刷工程で行う、
    　請求項１３に記載のRFIDモジュールを備えた容器の製造方法。     Printing of the antenna pattern on the first main surface of the substrate and printing of the pattern are performed in the same printing step.
    The method for manufacturing a container provided with the RFID module according to claim 13.
  15. 　グラビア印刷又はオフセット印刷によって、前記第１主面に前記アンテナパターンを印刷する、
    　請求項１２から１４のいずれか１つに記載のRFIDモジュールを備えた容器の製造方法。     The antenna pattern is printed on the first main surface by gravure printing or offset printing.
    The method for manufacturing a container including the RFID module according to any one of claims 12 to 14.
PCT/JP2021/042274 2020-11-30 2021-11-17 Container provided with rfid module and method for manufacturing container provided with rfid module WO2022113851A1 (en)

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JP2002259934A (en) * 2001-03-06 2002-09-13 Dainippon Printing Co Ltd Liquid container with rfid tag
US20100090832A1 (en) * 2006-08-31 2010-04-15 Francois Bozet Method of protecting a radio frequency identification inlay
WO2010146944A1 (en) * 2009-06-19 2010-12-23 株式会社村田製作所 Wireless ic device and method for coupling power supply circuit and radiating plates
EP2428457A1 (en) * 2010-09-09 2012-03-14 Centre Technique de l'Industrie des Papiers, Cartons et Celluloses Packaging sheet with radiofrequency identification system and packaging case made up from such a packaging sheet
WO2019039484A1 (en) * 2017-08-24 2019-02-28 株式会社村田製作所 Package with rfid tag

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JP2002049905A (en) * 2000-08-03 2002-02-15 Dainippon Printing Co Ltd Package having non-contact carrier and method for managing product information
JP2002259934A (en) * 2001-03-06 2002-09-13 Dainippon Printing Co Ltd Liquid container with rfid tag
US20100090832A1 (en) * 2006-08-31 2010-04-15 Francois Bozet Method of protecting a radio frequency identification inlay
WO2010146944A1 (en) * 2009-06-19 2010-12-23 株式会社村田製作所 Wireless ic device and method for coupling power supply circuit and radiating plates
EP2428457A1 (en) * 2010-09-09 2012-03-14 Centre Technique de l'Industrie des Papiers, Cartons et Celluloses Packaging sheet with radiofrequency identification system and packaging case made up from such a packaging sheet
WO2019039484A1 (en) * 2017-08-24 2019-02-28 株式会社村田製作所 Package with rfid tag

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