WO2022105306A1 - 一种新型散热装置 - Google Patents

一种新型散热装置 Download PDF

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Publication number
WO2022105306A1
WO2022105306A1 PCT/CN2021/110160 CN2021110160W WO2022105306A1 WO 2022105306 A1 WO2022105306 A1 WO 2022105306A1 CN 2021110160 W CN2021110160 W CN 2021110160W WO 2022105306 A1 WO2022105306 A1 WO 2022105306A1
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Prior art keywords
heat dissipation
radiator
fan
novel
dissipation device
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PCT/CN2021/110160
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English (en)
French (fr)
Inventor
马春阳
刘瑜
龚士权
陈功义
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纽福克斯光电科技（上海）有限公司
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Priority claimed from CN202011299816.0A external-priority patent/CN112437590A/zh
Priority claimed from CN202022684570.0U external-priority patent/CN214206200U/zh
Application filed by 纽福克斯光电科技（上海）有限公司 filed Critical 纽福克斯光电科技（上海）有限公司
Priority to US18/253,538 priority Critical patent/US20230422429A1/en
Publication of WO2022105306A1 publication Critical patent/WO2022105306A1/zh

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136—Forced ventilation, e.g. by fans
    • H05K7/20154—Heat dissipaters coupled to components
    • H05K7/20163—Heat dissipaters coupled to components the components being isolated from air flow, e.g. hollow heat sinks, wind tunnels or funnels
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136—Forced ventilation, e.g. by fans
    • H05K7/20154—Heat dissipaters coupled to components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136—Forced ventilation, e.g. by fans
    • H05K7/20172—Fan mounting or fan specifications
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body

Definitions

  • the invention relates to the technical field of heat dissipation of equipment and devices, in particular to a novel heat dissipation device.
  • the existing heat dissipation method is mainly to set a heat dissipation fan on the main board of the circuit, and the air heat exchange is formed through the operation of the heat dissipation fan, and then the high temperature inside the equipment is cooled down, but the effect of this cooling method is not obvious, especially for centralized Therefore, how to provide an effective cooling method for the heating element and improve the utilization efficiency of the cooling fan is an urgent problem that needs to be solved at present.
  • a new type of heat dissipation device including a motherboard and a heat dissipation fan, including:
  • a radiator which is arranged on the main board and is in close contact with one end of the exhaust port of the cooling fan;
  • the heat sink includes:
  • the tank body is used to accommodate the heating element arranged on the main board;
  • heat dissipation fins distributed inside the heat sink and located on both sides of the tank body;
  • An exhaust air radiating channel is formed between the interior of the radiator and the exhaust port of the radiating fan.
  • the radiator is mainly composed of left-right symmetrical cooling units.
  • a pair of the heat dissipating units are fixedly connected by means of a connecting member.
  • the radiator is configured with a fixing position corresponding to the setting position of the cooling fan, and the cooling fan is arranged at the fixing position through a fastening structure.
  • the top of the heat sink is provided with a sliding groove along the horizontal direction
  • the connecting member is provided with a sliding block matched with the sliding groove
  • a sliding fixing is formed between the sliding block and the sliding groove.
  • the heat dissipation unit is provided with a groove oppositely, and a hook-shaped structure is provided on the inner side of the end of the groove;
  • a pair of the grooves constitute the sliding groove structure
  • the slider structure includes a fixing bar arranged in a vertical direction and a fixing plate arranged in a horizontal direction, and the end of the fixing plate is provided with a locking structure in which the grooves are reversely matched.
  • the heat dissipation fins are regularly arranged from top to bottom.
  • the four corners of the radiator are respectively provided with a fixing hole 1
  • the four corners of the cooling fan are provided with a fixing hole 2 corresponding to the fixing hole 1, and the fixing hole 1 and the fixing hole 2 are fixed by screws. .
  • the outer side wall of the radiator is in close contact with a row of heating devices arranged on the main board.
  • the cross-sectional area of the air inlet and outlet of the cooling fan is less than or equal to the cross-sectional area of one end of the radiator.
  • the above technical solution has the following advantages or beneficial effects: other heating elements are placed in the radiator, the space in the radiator is fully utilized, and the fan is used to simultaneously dissipate heat on the radiator and the heating elements in the middle, thereby increasing the utilization rate of the fan and improving the performance of the fan. Heat dissipation efficiency, efficient use of space.
  • FIG. 1 is a schematic diagram of an explosion structure of an embodiment of a novel heat sink of the present invention
  • FIG. 2 is a schematic diagram of an explosion structure of an embodiment of a novel heat sink of the present invention
  • FIG. 3 is a schematic diagram of an explosion structure of an embodiment of a novel heat dissipation device of the present invention.
  • the present invention includes a novel heat dissipation device.
  • a new type of heat dissipation device includes a motherboard 1 and a heat dissipation fan 4, including:
  • the radiator 2 is arranged on the main board 1, and is closely attached to one end of the exhaust port of the cooling fan 4;
  • Radiator 2 includes:
  • the groove body 21 is used to accommodate the heating element 3 arranged on the main board 1;
  • the cooling fins 22 are distributed inside the radiator 2 and located on both sides of the groove body 21;
  • An exhaust air radiating channel is formed between the interior of the radiator 2 and the exhaust port of the radiating fan 4 .
  • the space between the two radiators 2 is fully utilized, and the radiator 2 and the heating element 3 in the middle are simultaneously dissipated by a fan.
  • the fan rotates, and the air on one side forms a negative pressure. Since the side of the radiator 2 is close to the end face of the fan on one side, the cold air enters the end hole of the radiator 2 through the action of the fan, and is arranged in the middle of the radiator 2.
  • the heating element 3 is discharged from the other side of the radiator 2, taking away the heat on the radiator 2 and also taking away the heat of the heating element 3 arranged in the middle of the radiator 2, which improves the heat dissipation efficiency and effectively utilizes the space.
  • the radiator 2 is mainly composed of left-right symmetrical cooling units (23, 24).
  • a pair of heat dissipating units ( 23 , 24 ) are fixedly connected by means of a connecting member 27 .
  • the radiator 2 is provided with a fixing position 26 corresponding to the installation position of the cooling fan 4 , and the cooling fan 4 is arranged at the fixing position 26 through the fastening structure.
  • the top of the radiator 2 is provided with a sliding groove 25 along the horizontal direction
  • the connecting member 27 is provided with a sliding block matching the sliding groove 25
  • a sliding fixing is formed between the sliding block and the sliding groove 25 .
  • the heat dissipation units (23, 24) are oppositely provided with grooves, and a hook-shaped structure is provided on the inner side of the end of the groove;
  • a pair of grooves constitute the sliding groove 25 structure
  • the slider structure (not shown in the figure) includes a fixing bar arranged in a vertical direction and a fixing plate arranged in a horizontal direction.
  • the heat dissipation units (23, 24) can be made of metal materials, such as aluminum materials, alloy materials, etc., and the bottom of the heat dissipation units (23, 24) and the main board 1 are provided with corresponding fixed cooperation, such as screws. Thread fixed fit, no specific limitation is made here.
  • the heat dissipation fins 22 are regularly arranged from top to bottom.
  • the four corners of the radiator 2 are respectively provided with a fixing hole 1
  • the four corners of the cooling fan 4 are provided with a fixing hole 2 corresponding to the fixing hole 1, and the fixing hole 1 and the fixing hole 2 are fixed by screws.
  • the outer sidewall of the heat sink 2 is in close contact with a row of heating devices disposed on the mainboard 1 .
  • the cross-sectional area of the air inlet and outlet of the cooling fan 4 is less than or equal to the cross-sectional area of one end of the radiator 2 .

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

本发明提供了一种新型散热装置，包括，主板及散热风机，其中，包括：散热器，设置于所述主板上，并与所述散热风机的排气口的一端紧贴；所述散热器包括：槽体，用以容纳设置于主板上的发热元件；散热翅片，分布于所述散热器的内部且位于所述槽体的两侧；所述散热器的内部与所述散热风机的排气口之间构成一排风散热通道。其技术方案的有益效果在于，散热器中放置其他发热元件，充分利用散热器中的空间，利用风机对散热器及中间的发热元件同时散热，从而加大了风机的利用率，提高了散热效率，有效地利用了空间。

Description

一种新型散热装置 技术领域
本发明涉及设备器件散热技术领域，尤其涉及一种新型散热装置。
背景技术
随着社会的发展，人们对电子产品的要求越来越高，体积小、价格便宜成为趋势。通常，电子产品内都会有发热元件，产品的体积越小对内部元件散热的要求就越高。现有的散热方式主要是在电路主板上设置有散热风机，通过散热风机的工作形成空气热交换，进而对设备内部的高温进行降温处理，但是这种降温方式效果并不明显，尤其是对于集中放置的发热元件，因此如何对发热元件提供有效的散热方式，提高散热风机的利用效率是当下亟需解决的问题
发明内容
针对现有技术中对设备主板上的发热元件的散热存在的上述问题，现提供一种旨在提高风机利用效率整体提高散热效率的新型散热装置。
具体技术方案如下：
一种新型散热装置，包括，主板及散热风机，其中，包括：
散热器，设置于所述主板上，并与所述散热风机的排气口的一端紧贴；
所述散热器包括：
槽体，用以容纳设置于主板上的发热元件；
散热翅片，分布于所述散热器的内部且位于所述槽体的两侧；
所述散热器的内部与所述散热风机的排气口之间构成一排风散热通道。
优选的，所述散热器主要由左右对称的散热单元组成。
优选的，一对所述散热单元通过连接部件配合固定连接。
优选的，所述散热器对应所述散热风机的设置位置配置有固定位，通过 紧固结构将所述散热风机配置于所述固定位处。
优选的，所述散热器的顶部沿水平方向设置有滑动槽，所述连接部件设置有与所述滑动槽匹配的滑块，所述滑块与所述滑动槽之间形成滑动固定。
优选的，所述散热单元相对设置有凹槽，且所述凹槽末端内侧设置有一勾状结构；
一对所述凹槽构成所述滑动槽结构；
所述滑块结构包括沿竖直方向设置的固定条及水平方向设置的固定板，所述固定板的末端设置有所述沟槽反向配合的卡位结构。
优选的，所述散热翅片由上之下规则排列。
优选的，所述散热器四角分别设置有固定孔一，所述散热风机的四角设置有与所述固定孔一对应的固定孔二，所述固定一及所述固定孔二之间通过螺纹固定。
优选的，所述散热器的外侧壁与设置于所述主板上的一排发热器件紧贴。
优选的，所述散热风机的进出气口的横截面积小于等于所述散热器的一端的截面积。
上述技术方案具有如下优点或有益效果：散热器中放置其他发热元件，充分利用散热器中的空间，利用风机对散热器及中间的发热元件同时散热，从而加大了风机的利用率，提高了散热效率，有效地利用了空间。
附图说明
参考所附附图，以更加充分的描述本发明的实施例。然而，所附附图仅用于说明和阐述，并不构成对本发明范围的限制。
图1为本发明一种新型散热装置实施例的爆炸结构示意图；
图2为本发明一种新型散热装置实施例的爆炸结构示意图；
图3为本发明一种新型散热装置实施例的爆炸结构示意图。
上述附图标记表示：
1、主板；2、散热器；3、发热元件；4、散热风机；21、槽体；22、翅片；散热单元(23、24)；25、滑动槽；26、固定位；27、连接部件。
具体实施方式
下面将结合本发明实施例中的附图，对本发明实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本发明一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有作出创造性劳动的前提下所获得的所有其他实施例，都属于本发明保护的范围。
需要说明的是，在不冲突的情况下，本发明中的实施例及实施例中的特征可以相互组合。
下面结合附图和具体实施例对本发明作进一步说明，但不作为本发明的限定。
本发明包括一种新型散热装置。
如图1至图3所示，一种新型散热装置，包括，主板1及散热风机4，其中，包括：
散热器2，设置于主板1上，并与散热风机4的排气口的一端紧贴；
散热器2包括：
槽体21，用以容纳设置于主板1上的发热元件3；
散热翅片22，分布于散热器2的内部且位于槽体21的两侧；
散热器2的内部与散热风机4的排气口之间构成一排风散热通道。
上述技术方案中，通过散热器2中放置其他发热元件3，充分利用两个散热器2之间的空间，利用风机对散热器2及中间的发热元件3同时散热。工作时，风机旋转，一侧空气形成负压，由于散热器2一侧与风机一侧端面紧贴，冷空气经风机作用，从散热器2端面孔中进入，并经过布置在散热器2中间的发热元件3，从散热器2另一侧排出，带走散热器2上热量的同时也带走了布置在散热器2中间的发热元件3的热量，提高了散热效率，有效利用了空间。
在一种较优的实施方式中，散热器2主要由左右对称的散热单元(23、24)组成。
在一种较优的实施方式中，一对散热单元(23、24)通过连接部件27配合固定连接。
在一种较优的实施方式中，散热器2对应散热风机4的设置位置配置有固定位26，通过紧固结构将散热风机4配置于固定位26处。
在一种较优的实施方式中，散热器2的顶部沿水平方向设置有滑动槽25，连接部件27设置有与滑动槽25匹配的滑块，滑块与滑动槽25之间形成滑动固定。
在一种较优的实施方式中，散热单元(23、24)相对设置有凹槽，且凹槽末端内侧设置有一勾状结构；
一对凹槽构成滑动槽25结构；
滑块结构(未于图中示出)包括沿竖直方向设置的固定条及水平方向设置的固定板，固定板的末端设置有沟槽反向配合的卡位结构。
上述技术方案中，散热单元(23、24)可由金属材质制成，如用铝材质、合金材质等，散热单元(23、24)的底部与主板1之间设置有相应的固定配合，如螺丝螺纹固定配合，此处不做具体限制。
在一种较优的实施方式中，散热翅片22由上之下规则排列。
在一种较优的实施方式中，散热器2四角分别设置有固定孔一，散热风机4的四角设置有与固定孔一对应的固定孔二，固定一及固定孔二之间通过螺纹固定。
在一种较优的实施方式中，散热器2的外侧壁与设置于主板1上的一排发热器件紧贴。
在一种较优的实施方式中，散热风机4的进出气口的横截面积小于等于散热器2的一端的截面积。
上述技术方案中，两个相互组合散热单元(23、24)之间放置其他发热元件3，充分利用两个散热单元(23、24)之间的空间，利用风机对散热器2及中间的发热元件3同时散热，从而加大了风机的利用率，提高了散热效率，有效地利用了空间。
以上所述仅为本发明较佳的实施例，并非因此限制本发明的实施方式及保护范围，对于本领域技术人员而言，应当能够意识到凡运用本发明说明书及图示内容所作出的等同替换和显而易见的变化所得到的方案，均应当包含在本发明的保护范围内。

Claims (10)

  1. 一种新型散热装置，包括，主板及散热风机，其特征在于，包括：
    散热器，设置于所述主板上，并与所述散热风机的排气口的一端紧贴；
    所述散热器包括：
    槽体，用以容纳设置于主板上的发热元件；
    散热翅片，分布于所述散热器的内部且位于所述槽体的两侧；
    所述散热器的内部与所述散热风机的排气口之间构成一排风散热通道。
  2. 根据权利要求1所述的新型散热装置，其特征在于，所述散热器主要由左右对称的散热单元组成。
  3. 根据权利要求2所述的新型散热装置，其特征在于，一对所述散热单元通过连接部件配合固定连接。
  4. 根据权利要求1所述的新型散热装置，其特征在于，所述散热器对应所述散热风机的设置位置配置有固定位，通过紧固结构将所述散热风机配置于所述固定位处。
  5. 根据权利要求3所述的新型散热装置，其特征在于，所述散热器的顶部沿水平方向设置有滑动槽，所述连接部件设置有与所述滑动槽匹配的滑块，所述滑块与所述滑动槽之间形成滑动固定。
  6. 根据权利要求5所述的新型散热装置，其特征在于，所述散热单元相对设置有凹槽，且所述凹槽末端内侧设置有一勾状结构；
    一对所述凹槽构成所述滑动槽结构；
    所述滑块结构包括沿竖直方向设置的固定条及水平方向设置的固定板，所述固定板的末端设置有所述沟槽反向配合的卡位结构。
  7. 根据权利要求1所述的新型散热装置，其特征在于，所述散热翅片由上之下规则排列。
  8. 根据权利要求4所述的新型散热装置，其特征在于，所述散热器四角分别设置有固定孔一，所述散热风机的四角设置有与所述固定孔一对应的固定孔二，所述固定一及所述固定孔二之间通过螺纹固定。
  9. 根据权利要求1所述的新型散热装置，其特征在于，所述散热器的外侧壁与设置于所述主板上的一排发热器件紧贴。
  10. 根据权利要求1所述的新型散热装置，其特征在于，所述散热风机的进出气口的横截面积小于等于所述散热器的一端的截面积。
PCT/CN2021/110160 2020-11-18 2021-08-02 一种新型散热装置 WO2022105306A1 (zh)

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Citations (5)

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Publication number Priority date Publication date Assignee Title
US20020020517A1 (en) * 2000-08-15 2002-02-21 Hsu Hul Chun Geometrical streamline flow guiding and heat dissipating structure
CN201418227Y (zh) * 2009-06-05 2010-03-03 深圳市宾利达智能科技有限公司 新型散热器
CN107577305A (zh) * 2017-06-14 2018-01-12 威海职业学院 一种电脑机箱通风散热装置
CN110190033A (zh) * 2019-04-25 2019-08-30 黄金平 一种电子产品用芯片固定装置
CN112437590A (zh) * 2020-11-18 2021-03-02 纽福克斯光电科技（上海）有限公司 一种新型散热装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020020517A1 (en) * 2000-08-15 2002-02-21 Hsu Hul Chun Geometrical streamline flow guiding and heat dissipating structure
CN201418227Y (zh) * 2009-06-05 2010-03-03 深圳市宾利达智能科技有限公司 新型散热器
CN107577305A (zh) * 2017-06-14 2018-01-12 威海职业学院 一种电脑机箱通风散热装置
CN110190033A (zh) * 2019-04-25 2019-08-30 黄金平 一种电子产品用芯片固定装置
CN112437590A (zh) * 2020-11-18 2021-03-02 纽福克斯光电科技（上海）有限公司 一种新型散热装置

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