WO2022102974A1

WO2022102974A1 - Clip member and circuit board comprising same

Info

Publication number: WO2022102974A1
Application number: PCT/KR2021/013702
Authority: WO
Inventors: 김수홍; 최명상
Original assignee: 삼성전자주식회사
Priority date: 2020-11-11
Filing date: 2021-10-06
Publication date: 2022-05-19
Also published as: KR20220063961A

Abstract

A circuit board is disclosed. The circuit board comprises: a substrate; a conductive member disposed on the side surface of the substrate; and a clip member which electrically connects the conductive member to an external device, wherein the clip member grips one area of the substrate while coming into contact with the conductive member on the side surface of the substrate.

Description

Clip member and circuit board including same

The present disclosure relates to a clip member and a circuit board including the same, and more particularly, to a clip member having an improved structure for easy and quick electrical connection between a conductive member of the board and an external device, and to a circuit board including the same it's about

When a signal or data is transmitted between different devices by wire, a component called a connector header needs to be mounted on a board in order to electrically connect the devices.

However, the connector header mounted on the board unnecessarily occupies an area of the board, a process for mounting it on the board is additionally required, and there is a problem in that the material cost is unnecessarily increased.

The present disclosure is to solve the above problems, and an object of the present disclosure is to provide a clip member having an improved structure for easy and quick electrical connection between a conductive member of the substrate and an external device, and a circuit board including the same there is.

A circuit board according to an embodiment of the present disclosure for achieving the above object includes a substrate, a conductive member disposed on a side surface of the substrate, and a clip member electrically connecting the conductive member and an external device, The clip member may grip a region of the substrate while being in contact with the conductive member on a side surface of the substrate.

The clip member is disposed at one end of at least one of a first support member and a second support member, a hinge that rotatably connects the first and second support members, and the first and second support members It may include a pin in contact with the member.

The clip member may further include a pressing member connecting the first supporting member and the second supporting member.

The hinge may electrically insulate the first support member and the second support member.

The other end of at least one of the first and second support members may be connected to a cable of the external device.

The circuit board further includes a guide hole penetrating the substrate, the conductive member is disposed in an area adjacent to the guide hole of the substrate, and the clip member is provided with a part penetrating the guide hole. One region of the substrate may be gripped.

The conductive member may include a first conductive member disposed on a side surface of the substrate and a second conductive member disposed on one side adjacent to the first conductive member among the circumferences of the guide hole.

The first and second conductive members may be disposed in parallel with each other.

A cross-section of the guide hole may have a rectangular shape.

The guide hole may include a first guide hole and a second guide hole passing through different regions of the substrate.

The conductive member may include a third conductive member disposed on the circumference of the first guide hole and a fourth conductive member disposed on one side adjacent to the third conductive member among the circumferences of the second guide hole.

The third and fourth conductive members may be disposed in parallel with each other.

A horizontal length of the guide hole may be longer than a horizontal length of the clip member.

The conductive member may be disposed on at least one of two sides of the substrate facing each other.

The substrate may include a groove formed in at least one of two side surfaces facing each other, and the conductive member may be disposed in the groove.

A clip member electrically connecting a substrate and an external device according to an embodiment of the present disclosure includes a first support member and a second support member, a hinge rotatably connecting the first and second support members, and the first and second support members and a pin disposed at one end of at least one of the second support members to contact the substrate, and the first and second support members may rotate about the hinge to grip a region of the substrate.

1 is a top view of a substrate according to an embodiment of the present disclosure;

2 is a side view of a clip member according to an embodiment of the present disclosure;

3 is a cross-sectional view illustrating a state in which the clip member grips the substrate of FIG. 1 .

4 is a top view of a substrate on which a groove is formed.

5 is a cross-sectional view illustrating a state in which the clip member grips the substrate of FIG. 4 .

6 is a top view of a substrate on which guide holes are formed.

7 is a cross-sectional view illustrating a state in which the clip member grips the substrate of FIG. 6 .

8 and 9 are views illustrating a state in which the conductive member is disposed at various positions on the substrate of FIG. 4 .

10 is a top view of a substrate on which two guide holes are formed.

11 is a cross-sectional view illustrating a state in which the clip member grips the substrate of FIG. 10 .

12 is a view illustrating a state in which the conductive member is disposed at another position on the substrate of FIG. 10 .

13 is a cross-sectional view illustrating a state in which the clip member grips the substrate of FIG. 12 .

It should be understood that the embodiments described below are illustratively shown to help the understanding of the present disclosure, and the present disclosure may be implemented with various modifications, different from the embodiments described herein. However, in the following description of the present disclosure, if it is determined that a detailed description of a related known function or component may unnecessarily obscure the subject matter of the present disclosure, the detailed description and specific illustration thereof will be omitted. In addition, the accompanying drawings are not drawn to scale in order to help understanding of the disclosure, but dimensions of some components may be exaggerated.

The terms used in this specification and claims have been chosen in consideration of the function of the present disclosure. However, these terms may vary depending on the intention of a person skilled in the art, legal or technical interpretation, and emergence of new technology. Also, some terms are arbitrarily selected by the applicant. These terms may be interpreted in the meanings defined in this specification, and if there is no specific term definition, it may be interpreted based on the general content of the present specification and common technical common sense in the art.

In this specification, expressions such as "have", "may have", "include" or "may include" indicate the existence of a corresponding feature (eg, a numerical value, function, operation, or component such as a part). and does not exclude the presence of additional features.

In addition, since the present specification describes components necessary for the description of each embodiment of the present disclosure, the present disclosure is not necessarily limited thereto. Accordingly, some components may be changed or omitted, and other components may be added. In addition, they may be distributed and arranged in different independent devices.

Further, an embodiment of the present disclosure will be described in detail below with reference to the accompanying drawings and the contents described in the accompanying drawings, but the present disclosure is not limited or limited by the embodiments.

Hereinafter, the present disclosure will be described in more detail with reference to the accompanying drawings.

1 is a top view of a substrate according to an embodiment of the present disclosure; 2 is a side view of a clip member according to an embodiment of the present disclosure; 3 is a cross-sectional view illustrating a state in which the clip member grips the substrate of FIG. 1 .

1 to 3 , a circuit board 1 according to an embodiment of the present disclosure may include a substrate 100 , a conductive member 300 , and a clip member 400 .

The substrate 100 may be applied to various electronic devices such as, for example, a TV, a smartphone, a PC, a notebook PC, a digital broadcasting terminal, a camera, a PDA, a washing machine, a dishwasher, and a refrigerator.

The substrate 100 may be in the form of a flat plate on which a plurality of electronic components can be mounted, and may be formed in various shapes and sizes as needed. For example, the substrate 100 may have a rectangular parallelepiped thin plate shape. The thickness of the substrate 100 may be approximately 1 mm.

In addition, the substrate 100 may be a printed circuit board (PCB), for example, a rigid printed circuit board (rigid PCB) or a flexible printed circuit board (flexible PCB).

Also, the substrate 100 may be a single-sided PCB or a double-sided PCB, and may be a multi-layer PCB.

The conductive member 300 may be disposed on a side surface of the substrate 100 . Specifically, the conductive member 300 may be disposed on at least one of an outer surface 102 of the substrate 100 and an inner surface formed by a guide hole ( FIGS. 6 and 200 ) to be described later.

The conductive member 300 may be made of metal and may be plated on the side surface of the substrate 100 . In addition, the conductive member 300 may cover at least one of the upper surface 101 and the lower surface 103 of the substrate 100 as well as the side surface of the substrate.

The conductive member 300 is a conductive metal, and may be formed of at least one of silver, gold, platinum, palladium, copper, nickel, iron, aluminum, molybdenum, and tungsten, but the material of the conductive member 300 is not limited thereto. , it is sufficient if it can be electrically connected to an external device through electricity.

The external device may be a TV, a smartphone, a PC, a notebook PC, a digital broadcasting terminal, a camera, a PDA, a washing machine, a dishwasher, a refrigerator, etc. various electronic devices.

The substrate 100 may have a groove shape in which an area in which the conductive member 300 is disposed is recessed. However, the shape of the substrate 100 is not limited thereto, and the substrate 100 may have a flat or convex shape in one region where the conductive member 300 is disposed.

For example, the conductive member 300 may be disposed on at least one of the two

sides

102a and 102b facing each other of the substrate 100 . In FIG. 1 , the conductive member 300 is illustrated as being disposed on both of the two

sides

102a and 102b facing each other of the substrate 100 , but the present invention is not limited thereto. It may be arranged in only one of them.

The clip member 400 may electrically connect the substrate 100 and an external device. Specifically, the clip member 400 may electrically connect the conductive member 300 disposed on the substrate 100 and an external device.

Specifically, the clip member 400 may include a first support member 410 , a second support member 420 , a hinge 430 , and a pin 440 . The clip member 400 may grip a region of the substrate 100 while in contact with the conductive member 300 .

The hinge 430 may rotatably connect the first and

second support members

410 and 420 . The hinge 430 may connect the middle region of the first and

second support members

410 and 420 , but the position thereof is not limited thereto.

The first and

second support members

410 and 420 may rotate about the hinge 430 to grip a region of the substrate 100 and contact the conductive member 300 .

The pin 440 may be disposed on one

end

411 and 421 of at least one of the first and

second support members

410 and 420 to contact the conductive member 300 . The other ends 412 and 422 of at least one of the first and

second support members

410 and 420 may be connected to cables C1 and C2 of an external device.

The pin 440 may have a shape corresponding to the shape of the conductive member 300 . For example, the pin 440 may have a convex shape corresponding to the conductive member 300 having a concave shape. Accordingly, the pin 440 and the conductive member 300 may be stably coupled to each other by engaging with each other.

The fin 440 is a conductive metal, and may be formed of at least one of silver, gold, platinum, palladium, copper, nickel, iron, aluminum, molybdenum, and tungsten, but the material of the fin 440 is not limited thereto. It is sufficient if it can electrically connect the cables C1 and C2 of the device and the conductive member 300 .

In addition, the pins 440 may be formed in the same number as the conductive member 300 , and may be disposed on the first and

second support members

410 and 420 corresponding to the positions of the conductive member 300 . For example, four first fins 441 are formed to correspond to four first conductive members 301 formed on one side surface 102a of the substrate 100 to form one end ( 411) can be placed. In addition, four second fins 442 are formed to correspond to the second conductive member 302 formed in four on the other side surface 102b of the substrate 100 to form one end 421 of the second support member 420 . can be placed in

That is, one end of the clip member 400 may have a pin 440 in contact with the conductive member 300 is disposed, and the other end of the clip member 400 may be connected to cables C1 and C2 of an external device. In addition, the clip member 400 may have an internal circuit electrically connect the cables C1 and C2 of the external device and the pin 440 . Accordingly, the board 100 and the external device communicate with each other signal and data by the clip member 400 gripping an area of the board 100 even if a separate component such as a connector header is not mounted on the board 100 . can be exchanged stably.

The clip member 400 may further include a pressing member 450 connecting the first support member 410 and the second support member 420 . The pressing member 450 may be a tension spring connecting the first and

second support members

410 and 420 .

Accordingly, since the pressing member 450 continuously presses the first and

second support members

410 and 420 toward each other, the pin 440 and the conductive member 300 are unintentionally spaced apart by an external force. and the clip member 400 can stably grip one area of the substrate 100 .

The hinge 430 may electrically insulate the first support member 410 and the second support member 420 from each other. Accordingly, it is possible to prevent a problem that signals or data transmitted and received through each of the first and

second support members

410 and 420 are unintentionally mixed due to a short circuit, and can be transmitted and received independently without mutual interference. .

4 is a top view of a substrate on which a groove is formed. 5 is a cross-sectional view illustrating a state in which the clip member grips the substrate of FIG. 4 .

4 and 5 , the substrate 100 may include a groove formed in at least one of two

side surfaces

102a and 102b facing each other. Specifically, the substrate 100 may include a first groove 110a formed on one side surface 102a and a second groove 110b formed on the other side surface 102b. Accordingly, the substrate 100 is disposed in the middle The region may have an “I” shape with a small width. However, the present invention is not limited thereto, and the substrate 100 may include only one of the first and

second grooves

110a and 110b.

The first and

second grooves

110a and 110b may have a substantially rectangular cross-section, but are not limited thereto. Due to the first and

second grooves

110a and 110b, the grip area 100a of the substrate 100 may have a narrower width than other areas.

Since the clip member 400 grips the grip region 100a of the substrate 100 without protruding outside the substrate 100 while a portion thereof is disposed in the first and

second grooves

110a and 110b, the circuit The substrate 1 may have a slimmer appearance.

Specifically, the first support member 410 rotates in a space inserted into the substrate 100 formed by the first groove 110a, and the second support member 420 is the substrate formed by the second groove 110b. It can rotate in the retracted space of (100). Accordingly, the clip member 400 can rotate while minimizing interference with other components, and can stably grip the grip region 100a of the substrate 100 .

6 is a top view of a substrate on which guide holes are formed. 7 is a cross-sectional view illustrating a state in which the clip member grips the substrate of FIG. 6 .

The circuit board 1 according to an embodiment of the present disclosure may include a guide hole 200 . The guide hole 200 may penetrate the substrate 100 .

A cross-section of the guide hole 200 may have a rectangular shape. For example, when viewed from the upper side of the substrate 100 , both the substrate 100 and the guide hole 200 may have a rectangular shape, and corresponding corners of each rectangle may be parallel to each other. However, the shapes of the substrate 100 and the guide hole 200 are not limited thereto.

The guide hole 200 may be formed in a size sufficient to allow a portion of the clip member 400 to pass through and rotate. For example, the horizontal length of the guide hole 200 may be formed to be longer than the horizontal length of the clip member 400 . Accordingly, a portion of the clip member 400 may rotate while penetrating the guide hole 200 having a sufficiently large size to easily grip a region of the substrate 100 .

The conductive member 300 may be disposed in an area adjacent to the guide hole 200 of the substrate 100 .

For example, the conductive member 300 is one side adjacent to the first conductive member 301 among the circumferences of the first conductive member 301 and the guide hole 200 disposed on the outer surface 102 of the substrate 100 . and a second conductive member 302 disposed at 200a. That is, the second conductive member 302 may be disposed on the inner surface of the substrate 100 formed by the guide hole 200 .

In addition, the first and second

conductive members

301 and 302 may be disposed in parallel with each other. For example, the outer surface 102 of the substrate 100 on which the first conductive member 301 is disposed and the one side 200a of the guide hole 200 on which the second conductive member 203 is disposed are parallel to each other. can be placed.

The first and

second support members

410 and 420 of the clip member 400 rotate about an axis parallel to the outer surface 102 of the substrate 100 and one side 200a of the guide hole 200, respectively, It is possible to stably grip the outer surface 102 of the substrate 100 and one side 200a of the guide hole 200 .

For example, the clip member 400 may grip a region of the substrate 100 in a state where a part passes through the guide hole 200 .

The first support member 410 may rotate outside the substrate 100 , and the second support member 420 may rotate within the guide hole 200 . Accordingly, the clip member 400 may grip a region of the substrate 100 in a state where the second support member 420 penetrates the guide hole 200 .

*70 FIGS. 8 and 9 are views illustrating a state in which the conductive member is disposed at various positions on the substrate of FIG. 6 .

Referring to FIG. 8 , all of the conductive members 300 may be disposed only on the outer surface 102 of the substrate 100 . Corresponding to the above-described arrangement of the conductive member 300 , the pin 440 is disposed only on one end 411 of the first supporting member 410 , and the cable C of the external device is connected to the first supporting member 410 . It may be connected only to the other end 412 of

Also, referring to FIG. 9 , all of the conductive members 300 may be disposed only on one side 200a of the guide hole 200 that is the inner surface of the substrate 100 . Corresponding to the arrangement of the conductive member 300 described above, the pin 440 is disposed only on one end 421 of the second support member 420 , and the cable C of the external device is connected to the second support member 420 . It may be connected only to the other end 422 of

10 is a top view of a substrate on which two guide holes are formed. 11 is a cross-sectional view illustrating a state in which the clip member grips the substrate of FIG. 10 . 10 to 11 , the guide hole 200 may include a first guide hole 201 and a second guide hole 202 penetrating different regions of the substrate 100 .

The width of the first and second guide holes 201 and 202 may be longer than the width of the clip member 400 . For example, the first and second guide holes 201 and 202 may have the same width. The longitudinal lengths of the first and second guide holes 201 and 202 may be sufficiently long to cover the rotation radius of the clip member 400 .

The conductive member 300 includes one side 202a adjacent to the third conductive member 303 among the perimeters of the third conductive member 303 and the second guide hole 202 disposed on the periphery of the first guide hole 201 . and a fourth conductive member 304 disposed on the . In addition, the third and fourth

conductive members

303 and 304 may be disposed in parallel with each other.

The first support member 410 may rotate within the first guide hole 201 to contact the third conductive member 303 disposed around the first guide hole 201 . In addition, the second support member 420 may rotate within the second guide hole 202 to come into contact with the fourth conductive member 304 disposed on one side 202a of the periphery of the second guide hole 202 . . Accordingly, the clip member 400 can easily grip a region of the substrate 100 on which the third and fourth

conductive members

303 and 304 are disposed without interference with the substrate 100 .

In addition, since the clip member 400 can grip the intermediate region in which the third and fourth

conductive members

303 and 304 of the substrate 100 are disposed, the clip member 400 is at least partially formed of the substrate 100 . It may not be located outside. Accordingly, the clip member 400 may minimize physical interference between adjacent electronic components, and the overall volume of the circuit board 1 may be minimized.

12 is a view illustrating a state in which the conductive member is disposed at another position on the substrate of FIG. 10 . 13 is a cross-sectional view illustrating a state in which the clip member grips the substrate of FIG. 12 .

12 and 13 , the first

conductive members

301a and 301b may be respectively disposed on one side 102a and the other side 102b of the substrate 100 . In addition, the third

conductive members

303a and 303b may be respectively disposed on the other side 201b and the one side 201a of the first guide hole 201 . In addition, the fourth

conductive members

304a and 304b may be respectively disposed on one side 202a and the other side 202b of the second guide hole 202 . In addition, the first, third, and fourth

conductive members

301a, 301b, 303a, 303b, 304a, and 304b may all be arranged side by side.

13 , the first clip member 400a includes a first conductive member 301a disposed on one side surface 102a of the substrate 100 and the other side 201b of the first guide hole 201 . It is possible to grip the third conductive member 303a disposed on the . In addition, the second clip member 400b includes a third conductive member 303b disposed on one side 201a of the first guide hole 201 and a third conductive member 303b disposed on one side 202a of the second guide hole 202 . The fourth conductive member 304a may be gripped. In addition, the third clip member 400c includes a fourth conductive member 304b disposed on one side 202b of the second guide hole 202 and a first conductive member 304b disposed on the other side 102b of the substrate 100 . The member 301b may be gripped.

That is, the three

different clip members

400a , 400b , and 400c may grip three different regions of the substrate 100 to electrically connect the external device and the substrate 100 . Accordingly, the substrate 100 and the external device can efficiently transmit/receive massive signals and data within a short time.

However, the number or grip area of the clip member 400 is not limited thereto, and may be implemented in various ways as needed.

In the above, preferred embodiments of the present disclosure have been illustrated and described, but the present disclosure is not limited to the specific embodiments described above, and in the technical field to which the disclosure belongs without departing from the gist of the present disclosure as claimed in the claims. Any person skilled in the art can make various modifications, of course, and such modifications are within the scope of the claims.

Claims

Board;

a conductive member disposed on a side surface of the substrate; and

a clip member electrically connecting the conductive member and an external device;

The clip member,

A circuit board gripping a region of the substrate while in contact with the conductive member on a side surface of the substrate.
According to claim 1,

The clip member,

a first support member and a second support member;

a hinge rotatably connecting the first and second support members; and

and a pin disposed on one end of at least one of the first and second support members and in contact with the conductive member.
3. The method of claim 2,

The clip member,

The circuit board further comprising a pressing member connecting the first support member and the second support member.
3. The method of claim 2,

The hinge is

A circuit board electrically insulating the first support member and the second support member.
3. The method of claim 2,

The other end of at least one of the first and second support members is connected to a cable of the external device.
According to claim 1,

It further includes a guide hole passing through the substrate;

The conductive member is disposed in an area adjacent to the guide hole of the substrate,

The clip member,

A circuit board for gripping a region of the board with a part penetrating through the guide hole.
7. The method of claim 6,

The conducting member is

a first conductive member disposed on a side surface of the substrate; and

and a second conductive member disposed on a side of the guide hole adjacent to the first conductive member.
8. The method of claim 7,

The first and second conductive members are disposed in parallel with each other.
7. The method of claim 6,

A circuit board having a cross section of the guide hole having a rectangular shape.
7. The method of claim 6,

The guide hole is

A circuit board comprising a first guide hole and a second guide hole passing through different regions of the substrate.
11. The method of claim 10,

The conducting member is

a third conductive member disposed around the first guide hole; and

and a fourth conductive member disposed on one side of the circumference of the second guide hole adjacent to the third conductive member.
12. The method of claim 11,

The third and fourth conductive members are disposed in parallel with each other.
7. The method of claim 6,

A horizontal length of the guide hole is formed to be longer than a horizontal length of the clip member.
The method of claim 1,

The conducting member is

A circuit board disposed on at least one of two sides of the board facing each other.
To a clip member for electrically connecting a substrate and an external device,

a first support member and a second support member;

a hinge rotatably connecting the first and second support members; and

and a pin disposed on one end of at least one of the first and second support members and in contact with the substrate;

The first and second support members rotate about the hinge to grip a region of the substrate.