WO2022099640A1 - High thermal conductivity and high flame retardance composite material and use thereof - Google Patents
High thermal conductivity and high flame retardance composite material and use thereof Download PDFInfo
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- WO2022099640A1 WO2022099640A1 PCT/CN2020/128790 CN2020128790W WO2022099640A1 WO 2022099640 A1 WO2022099640 A1 WO 2022099640A1 CN 2020128790 W CN2020128790 W CN 2020128790W WO 2022099640 A1 WO2022099640 A1 WO 2022099640A1
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- thermal conductivity
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- flame retardancy
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- 239000002131 composite material Substances 0.000 title claims abstract description 25
- 239000003063 flame retardant Substances 0.000 claims abstract description 13
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims abstract description 9
- 229910052698 phosphorus Inorganic materials 0.000 claims abstract description 9
- 239000011574 phosphorus Substances 0.000 claims abstract description 9
- 229920005989 resin Polymers 0.000 claims abstract description 9
- 239000011347 resin Substances 0.000 claims abstract description 9
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 claims abstract description 7
- -1 polypropylene Polymers 0.000 claims abstract description 6
- 239000000843 powder Substances 0.000 claims abstract description 6
- 239000000835 fiber Substances 0.000 claims abstract description 4
- 239000004743 Polypropylene Substances 0.000 claims abstract description 3
- 239000002174 Styrene-butadiene Substances 0.000 claims abstract description 3
- MCMNRKCIXSYSNV-UHFFFAOYSA-N ZrO2 Inorganic materials O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 claims abstract description 3
- 229910052810 boron oxide Inorganic materials 0.000 claims abstract description 3
- MTAZNLWOLGHBHU-UHFFFAOYSA-N butadiene-styrene rubber Chemical compound C=CC=C.C=CC1=CC=CC=C1 MTAZNLWOLGHBHU-UHFFFAOYSA-N 0.000 claims abstract description 3
- 239000000919 ceramic Substances 0.000 claims abstract description 3
- JKWMSGQKBLHBQQ-UHFFFAOYSA-N diboron trioxide Chemical compound O=BOB=O JKWMSGQKBLHBQQ-UHFFFAOYSA-N 0.000 claims abstract description 3
- 239000011521 glass Substances 0.000 claims abstract description 3
- 239000003365 glass fiber Substances 0.000 claims abstract description 3
- 239000003999 initiator Substances 0.000 claims abstract description 3
- 239000004816 latex Substances 0.000 claims abstract description 3
- 229920000126 latex Polymers 0.000 claims abstract description 3
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 claims abstract description 3
- 150000002978 peroxides Chemical class 0.000 claims abstract description 3
- 229920001955 polyphenylene ether Polymers 0.000 claims abstract description 3
- 229920001155 polypropylene Polymers 0.000 claims abstract description 3
- 239000011115 styrene butadiene Substances 0.000 claims abstract description 3
- 229920003048 styrene butadiene rubber Polymers 0.000 claims abstract description 3
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims abstract description 3
- 229920002554 vinyl polymer Polymers 0.000 claims abstract description 3
- 239000006087 Silane Coupling Agent Substances 0.000 claims description 6
- DWSWCPPGLRSPIT-UHFFFAOYSA-N benzo[c][2,1]benzoxaphosphinin-6-ium 6-oxide Chemical compound C1=CC=C2[P+](=O)OC3=CC=CC=C3C2=C1 DWSWCPPGLRSPIT-UHFFFAOYSA-N 0.000 claims description 6
- GKTNLYAAZKKMTQ-UHFFFAOYSA-N n-[bis(dimethylamino)phosphinimyl]-n-methylmethanamine Chemical compound CN(C)P(=N)(N(C)C)N(C)C GKTNLYAAZKKMTQ-UHFFFAOYSA-N 0.000 claims description 6
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 claims description 6
- BSYJHYLAMMJNRC-UHFFFAOYSA-N 2,4,4-trimethylpentan-2-ol Chemical compound CC(C)(C)CC(C)(C)O BSYJHYLAMMJNRC-UHFFFAOYSA-N 0.000 claims description 3
- 239000000654 additive Substances 0.000 claims description 3
- APOXBWCRUPJDAC-UHFFFAOYSA-N bis(2,6-dimethylphenyl) hydrogen phosphate Chemical compound CC1=CC=CC(C)=C1OP(O)(=O)OC1=C(C)C=CC=C1C APOXBWCRUPJDAC-UHFFFAOYSA-N 0.000 claims description 3
- CETPSERCERDGAM-UHFFFAOYSA-N ceric oxide Chemical compound O=[Ce]=O CETPSERCERDGAM-UHFFFAOYSA-N 0.000 claims description 3
- 229910000422 cerium(IV) oxide Inorganic materials 0.000 claims description 3
- ZQKXQUJXLSSJCH-UHFFFAOYSA-N melamine cyanurate Chemical compound NC1=NC(N)=NC(N)=N1.O=C1NC(=O)NC(=O)N1 ZQKXQUJXLSSJCH-UHFFFAOYSA-N 0.000 claims description 3
- 229920001296 polysiloxane Polymers 0.000 claims description 3
- 239000000126 substance Substances 0.000 claims description 3
- 238000002360 preparation method Methods 0.000 claims description 2
- 229920002050 silicone resin Polymers 0.000 claims description 2
- 230000000694 effects Effects 0.000 abstract description 5
- 230000005540 biological transmission Effects 0.000 description 3
- 239000003292 glue Substances 0.000 description 3
- DXZMANYCMVCPIM-UHFFFAOYSA-L zinc;diethylphosphinate Chemical compound [Zn+2].CCP([O-])(=O)CC.CCP([O-])(=O)CC DXZMANYCMVCPIM-UHFFFAOYSA-L 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 239000011190 CEM-3 Substances 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 239000011342 resin composition Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B17/00—Layered products essentially comprising sheet glass, or glass, slag, or like fibres
- B32B17/02—Layered products essentially comprising sheet glass, or glass, slag, or like fibres in the form of fibres or filaments
- B32B17/04—Layered products essentially comprising sheet glass, or glass, slag, or like fibres in the form of fibres or filaments bonded with or embedded in a plastic substance
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L51/00—Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
- C08L51/08—Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers grafted on to macromolecular compounds obtained otherwise than by reactions only involving unsaturated carbon-to-carbon bonds
Definitions
- the present application relates to the technical field of composite materials, in particular to a composite material with high thermal conductivity and high flame retardancy and its application.
- 5G has a larger amount of data, a larger transmission frequency, and a higher working frequency band, which requires better transmission performance and heat dissipation performance of the base station PCB board, which means that the 5G base station PCB board needs to use more Electronic substrate for high frequency, higher transmission speed and better heat resistance. Therefore, in order to meet the needs of market development, high heat resistance, high frequency, and high thermal conductivity are the themes that the performance of CCL should be improved in the next few years.
- thermally conductive organic resin copper clad laminates are basically the same as those of general-purpose copper clad laminates (FR-4, CEM-3, etc.), but it is necessary to select a matrix resin with good thermal conductivity, compound thermal conductivity fillers, and form high thermal conductivity composite materials.
- the composite materials in the prior art cannot achieve the effects of high thermal conductivity and good flame retardancy.
- the purpose of the present application is to provide a composite material with high thermal conductivity and high flame retardancy in order to solve the problem that the composite material in the prior art cannot achieve the effect of high thermal conductivity and good flame retardancy.
- a high thermal conductivity and high flame retardancy composite material includes the following components: 40-46 parts of glass fibers; 16-16 parts of modified polyphenylene ether resin containing unsaturated carbon-carbon double bonds 40 parts; 16-18 parts of styrene-butadiene latex; 2-5 parts of vinyl silicone resin; 13-15 parts of ceramic powder; 4-6 parts of peroxide initiator; 10-15 parts of phosphorus flame retardant; polypropylene 16-18 parts of fiber; 14-16 parts of glass powder; 5-11 parts of zirconium dioxide; 22-30 parts of boron oxide.
- the phosphorus-containing flame retardant is selected from one or a combination of the following substances: phosphazene or modified phosphazene, melamine cyanurate, resorcinol bis[bis(2,6 -Dimethylphenyl) phosphate], 9,10-dihydro-9oxa-10-phosphaphenanthrene-10-oxide (DOPO) or DOPO phosphorus-containing polysiloxane derivative series flame retardants.
- the following additives are also included: a silane coupling agent; the silane coupling agent is added in parts by mass of 5 to 8 parts.
- the composite material further comprises 4-7 parts by weight of ceria.
- an application of a composite material with high thermal conductivity and high flame retardancy in preparing a PCB board is also provided.
- the high thermal conductivity and high flame retardancy composite materials provided by the embodiments of the present application achieve the effects of high thermal conductivity and high flame retardancy.
- the application also provides a composite material with high thermal conductivity and high flame retardancy, comprising the following components (parts) by weight percentage:
- the specific preparation method is as follows:
- Thermal conductivity refer to ASTM 5470 test, (50°C, W/(m.k)).
- the composite material of the present application has better high thermal conductivity and better flame retardant effect.
- the phosphorus-containing flame retardant is selected from one or a combination of the following substances: phosphazene or modified phosphazene, melamine cyanurate, resorcinol bis[bis(2,6 -Dimethylphenyl) phosphate], 9,10-dihydro-9oxa-10-phosphaphenanthrene-10-oxide (DOPO) or DOPO phosphorus-containing polysiloxane derivative series flame retardants.
- the following additives are also included: a silane coupling agent; the silane coupling agent is added in parts by mass of 5 to 8 parts.
- the composite material further comprises 4-7 parts by weight of ceria.
- the composite material prepared by the silicon-containing resin composition of the present invention has high thermal conductivity, high heat resistance, low dielectric constant and dielectric loss and other excellent characteristics, and meets the requirements of halogen-free flame retardant. , more suitable for places with high power output requirements.
- the prepreg, laminate and multilayer printed circuit board based on the present invention have excellent properties such as high thermal conductivity, high heat resistance, halogen-free flame retardant, low water absorption, high frequency and low dielectric, and are especially suitable for high-power halogen-free flame retardant Circuit board substrate required for 5G base stations.
Abstract
A high thermal conductivity and high flame retardance composite material and the use thereof. The composite material comprises the following components: 40-46 parts of glass fibers, 16-40 parts of a modified polyphenylene ether resin containing an unsaturated carbon-carbon double bond, 16-18 parts of a styrene-butadiene latex, 2-5 parts of a vinyl organosilicon resin, 13-15 parts of a ceramic powder, 4-6 parts of a peroxide initiator, 10-15 parts of a phosphorus-containing flame retardant, 16-18 parts of polypropylene fibers, 14-16 parts of a glass powder, 5-11 parts of zirconium dioxide, and 22-30 parts of boron oxide. The composite material has the effect of a high thermal conductivity and a high flame retardance.
Description
本申请涉及复合材料技术领域，特别涉及一种高导热、高阻燃性复合材料及其应用。The present application relates to the technical field of composite materials, in particular to a composite material with high thermal conductivity and high flame retardancy and its application.
随着5G电子信息的飞速发展，电子器件集成技术的发展及电子器件功率也在不断增大，其工作温度也逐渐升高。相比4G，5G的数据量更大、发射频率更大、工作的频段也更高，这需要基站用PCB板有更好的传输性能和散热性能，这意味着5G基站用PCB板要使用更高频率、更高传输速度、耐热性更好的电子基材。因此为了应对市场发展需求，高耐热、高频性、高导热性是未来多年覆铜板性能应提高的主题。导热有机树脂覆铜板的组成与结构基本相同于通用型覆铜板(FR-4、CEM-3等)，只是需要选择导热性能好的基体树脂，复配导热性填充填料，形成高导热复合材料。With the rapid development of 5G electronic information, the development of electronic device integration technology and the increasing power of electronic devices, the operating temperature is also gradually increasing. Compared with 4G, 5G has a larger amount of data, a larger transmission frequency, and a higher working frequency band, which requires better transmission performance and heat dissipation performance of the base station PCB board, which means that the 5G base station PCB board needs to use more Electronic substrate for high frequency, higher transmission speed and better heat resistance. Therefore, in order to meet the needs of market development, high heat resistance, high frequency, and high thermal conductivity are the themes that the performance of CCL should be improved in the next few years. The composition and structure of thermally conductive organic resin copper clad laminates are basically the same as those of general-purpose copper clad laminates (FR-4, CEM-3, etc.), but it is necessary to select a matrix resin with good thermal conductivity, compound thermal conductivity fillers, and form high thermal conductivity composite materials.
现有技术中的复合材料达不到高导热性且阻燃性好的效果。The composite materials in the prior art cannot achieve the effects of high thermal conductivity and good flame retardancy.
发明内容SUMMARY OF THE INVENTION
本申请的目的是为了解决现有技术中现有技术中的复合材料达不到高导热性且阻燃性好的效果的问题，提供一种高导热、高阻燃性复合材料。The purpose of the present application is to provide a composite material with high thermal conductivity and high flame retardancy in order to solve the problem that the composite material in the prior art cannot achieve the effect of high thermal conductivity and good flame retardancy.
本申请采用的技术方案如下：一种高导热、高阻燃性复合材料包括以下所述的组分：玻璃纤维40～46份；含不饱和碳碳双键的改性聚苯醚树脂16～40份；丁苯胶乳16～18份；乙烯基有机硅树脂2～5份； 陶瓷粉13～15份；过氧化物引发剂4～6份；含磷阻燃剂10～15份；聚丙烯纤维16～18份；玻璃粉14～16份；二氧化锆5～11份；氧化硼22～30份。The technical solution adopted in the present application is as follows: a high thermal conductivity and high flame retardancy composite material includes the following components: 40-46 parts of glass fibers; 16-16 parts of modified polyphenylene ether resin containing unsaturated carbon-carbon double bonds 40 parts; 16-18 parts of styrene-butadiene latex; 2-5 parts of vinyl silicone resin; 13-15 parts of ceramic powder; 4-6 parts of peroxide initiator; 10-15 parts of phosphorus flame retardant; polypropylene 16-18 parts of fiber; 14-16 parts of glass powder; 5-11 parts of zirconium dioxide; 22-30 parts of boron oxide.
可选地，所述含磷阻燃剂选自以下物质中的一种或几种的组合：磷腈或改性磷腈、三聚氰胺氰尿酸盐、间苯二酚双[二(2,6-二甲基苯基)磷酸酯]、9,10-二氢-9氧杂-10-磷杂菲-10-氧化物(DOPO)或DOPO含磷聚硅氧烷衍生物系列阻燃剂。Optionally, the phosphorus-containing flame retardant is selected from one or a combination of the following substances: phosphazene or modified phosphazene, melamine cyanurate, resorcinol bis[bis(2,6 -Dimethylphenyl) phosphate], 9,10-dihydro-9oxa-10-phosphaphenanthrene-10-oxide (DOPO) or DOPO phosphorus-containing polysiloxane derivative series flame retardants.
可选地，还包含以下添加物：硅烷偶联剂；所述硅烷偶联剂加入质量份为5～8份。Optionally, the following additives are also included: a silane coupling agent; the silane coupling agent is added in parts by mass of 5 to 8 parts.
可选地，所述复合材料还包含重量份数为4～7份二氧化铈。Optionally, the composite material further comprises 4-7 parts by weight of ceria.
根据本申请的另一个实施例，还提供了一种高导热、高阻燃性复合材料在制备PCB板中的应用。According to another embodiment of the present application, an application of a composite material with high thermal conductivity and high flame retardancy in preparing a PCB board is also provided.
通过本申请实施例提供的高导热、高阻燃性复合材料，达到了高导热性且高阻燃性的效果。The high thermal conductivity and high flame retardancy composite materials provided by the embodiments of the present application achieve the effects of high thermal conductivity and high flame retardancy.
对本申请的组合物进行详细的说明：The composition of this application is described in detail:
本申请还提供了一种高导热、高阻燃性复合材料，包括按重量百分比计的以下组分(份数)：The application also provides a composite material with high thermal conductivity and high flame retardancy, comprising the following components (parts) by weight percentage:
具体制备方法如下：The specific preparation method is as follows:
将按照上述配比制得的复合材料溶解或分散在有机溶剂中得到一种树脂胶液，使用纤维织物材料浸渍上述树脂胶液后，在100～130℃下烘烤5～8min后得到一种半固化片，然后将属箔与所述半固化片热压后得到PCB板。Dissolving or dispersing the composite material prepared according to the above ratio in an organic solvent to obtain a resin glue solution, using a fiber fabric material to impregnate the resin glue solution, and baking at 100 to 130 ° C for 5 to 8 minutes to obtain a resin glue solution. prepreg, and then heat-pressing the metal foil and the prepreg to obtain a PCB board.
上述5中配比下测得的导热系数及阻燃性数据如下表所示：The thermal conductivity and flame retardancy data measured under the above 5 ratios are shown in the following table:
导热系数：参照ASTM 5470测试，(50℃、W/(m.k))。Thermal conductivity: refer to ASTM 5470 test, (50℃, W/(m.k)).
阻燃性根据UL94规范的方法测试。Flame retardancy is tested according to the method specified in UL94.
根据对比结果可以看出，本申请复合材料具有较好的高导热性且阻燃效果较好。According to the comparison results, it can be seen that the composite material of the present application has better high thermal conductivity and better flame retardant effect.
可选地，所述含磷阻燃剂选自以下物质中的一种或几种的组合：磷腈或改性磷腈、三聚氰胺氰尿酸盐、间苯二酚双[二(2,6-二甲基苯基)磷酸酯]、9,10-二氢-9氧杂-10-磷杂菲-10-氧化物(DOPO)或DOPO含磷聚硅氧烷衍生物系列阻燃剂。Optionally, the phosphorus-containing flame retardant is selected from one or a combination of the following substances: phosphazene or modified phosphazene, melamine cyanurate, resorcinol bis[bis(2,6 -Dimethylphenyl) phosphate], 9,10-dihydro-9oxa-10-phosphaphenanthrene-10-oxide (DOPO) or DOPO phosphorus-containing polysiloxane derivative series flame retardants.
可选地，还包含以下添加物：硅烷偶联剂；所述硅烷偶联剂加入质量份为5～8份。Optionally, the following additives are also included: a silane coupling agent; the silane coupling agent is added in parts by mass of 5 to 8 parts.
可选地，所述复合材料还包含重量份数为4～7份二氧化铈。Optionally, the composite material further comprises 4-7 parts by weight of ceria.
与现有技术相比，本发明的含硅树脂组合物制备的复合材料具有较高的导热系数、高耐热，以及较低介电常数和介电损耗等优良特性，并且满足无卤阻燃，更加适用于高功率输出使用需求的场所。基于本发明的半固化片、层压板、多层印刷线路板具有高导热、高耐热、无卤阻燃、低吸水率以及高频低介电等优良特性，特别适用于高功率无卤阻燃的5G基站所要求的线路板基材。Compared with the prior art, the composite material prepared by the silicon-containing resin composition of the present invention has high thermal conductivity, high heat resistance, low dielectric constant and dielectric loss and other excellent characteristics, and meets the requirements of halogen-free flame retardant. , more suitable for places with high power output requirements. The prepreg, laminate and multilayer printed circuit board based on the present invention have excellent properties such as high thermal conductivity, high heat resistance, halogen-free flame retardant, low water absorption, high frequency and low dielectric, and are especially suitable for high-power halogen-free flame retardant Circuit board substrate required for 5G base stations.
Claims (5)
- 一种高导热、高阻燃性复合材料，其特征在于，包括以下所述的组分：A composite material with high thermal conductivity and high flame retardancy, characterized in that it comprises the following components:玻璃纤维40～46份；40 to 46 parts of glass fiber;含不饱和碳碳双键的改性聚苯醚树脂16～40份；16-40 parts of modified polyphenylene ether resin containing unsaturated carbon-carbon double bonds;丁苯胶乳16～18份；16-18 servings of styrene-butadiene latex;乙烯基有机硅树脂2～5份；2 to 5 parts of vinyl silicone resin;陶瓷粉13～15份；13 to 15 parts of ceramic powder;过氧化物引发剂4～6份；4-6 parts of peroxide initiator;含磷阻燃剂10～15份；10-15 parts of phosphorus flame retardant;聚丙烯纤维16～18份；16-18 parts of polypropylene fibers;玻璃粉14～16份；14-16 parts of glass powder;二氧化锆5～11份；5 to 11 parts of zirconium dioxide;氧化硼22～30份。22 to 30 parts of boron oxide.
- 根据权利要求1所述的高导热、高阻燃性复合材料，其特征在于，所述含磷阻燃剂选自以下物质中的一种或几种的组合：磷腈或改性磷腈、三聚氰胺氰尿酸盐、间苯二酚双[二(2,6-二甲基苯基)磷酸酯]、9,10-二氢-9氧杂-10-磷杂菲-10-氧化物(DOPO)或DOPO含磷聚硅氧烷衍生物系列阻燃剂。The composite material with high thermal conductivity and high flame retardancy according to claim 1, wherein the phosphorus-containing flame retardant is selected from one or a combination of the following substances: phosphazene or modified phosphazene, Melamine cyanurate, resorcinol bis[bis(2,6-dimethylphenyl)phosphate], 9,10-dihydro-9oxa-10-phosphaphenanthrene-10-oxide ( DOPO) or DOPO phosphorus-containing polysiloxane derivatives series of flame retardants.
- 根据权利要求1所述的高导热、高阻燃性复合材料，其特征在于，还包含以下添加物：硅烷偶联剂；所述硅烷偶联剂加入质量份为5～8份。The composite material with high thermal conductivity and high flame retardancy according to claim 1, further comprising the following additives: a silane coupling agent; the silane coupling agent is added in an amount of 5-8 parts by mass.
- 根据权利要求1所述的高导热、高阻燃性复合材料，其特征 在于，所述复合材料还包含重量份数为4～7份二氧化铈。The composite material with high thermal conductivity and high flame retardancy according to claim 1, characterized in that, the composite material further comprises 4-7 parts by weight of ceria.
- 一种将权利要求1至4中任一项所述的高导热、高阻燃性复合材料在制备PCB板中的应用。An application of the high thermal conductivity and high flame retardancy composite material according to any one of claims 1 to 4 in the preparation of a PCB board.
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