WO2022088128A1

WO2022088128A1 - Time-of-flight camera module, preparation method and electronic device

Info

Publication number: WO2022088128A1
Application number: PCT/CN2020/125640
Authority: WO
Inventors: 吴志维; 陈宏民; 陈开胜; 徐骏
Original assignee: 华为技术有限公司
Priority date: 2020-10-31
Filing date: 2020-10-31
Publication date: 2022-05-05
Also published as: CN116235375A

Abstract

Embodiments of the present application provide a time-of-flight camera module and an electronic device, for integrating a diffuser with a luminous source of a time-of-flight camera device, effectively preventing the diffuser from falling off, and reducing additional members of the time-of-flight camera module, thereby reducing the size and cost of the time-of-flight camera module. The time-of-flight camera module comprises a substrate material; a laser array grown on the lower surface of the substrate material and configured to emit laser at the back surface by means of the substate material; and a beam deflector cured on the upper surface of the substrate material and comprising a first microlens array and a first cover material, wherein the first microlens array is cured on the upper surface of the substrate material, the first cover material covers the first microlens array, and the beam deflector is configured to change the divergent angle of the laser.

Description

A time-of-flight camera module, preparation method and electronic device

technical field

The present application relates to the technical field of electronic products, and in particular, to a time-of-flight camera module, a preparation method and an electronic device.

Background technique

Three-dimensional (3-dimensional, 3D) depth sensing technology is an inevitable trend in the future development of consumer electronics, automotive electronics, lidar, biological perception, artificial intelligence and other emerging fields. One of the main implementations of 3D depth sensing is to introduce time-of-flight-based ranging technology on the basis of traditional 2D cameras to obtain depth information of images, namely time of flight (TOF) camera modules to achieve 3D depth. Measurement. The TOF camera module uses a pulse-pumped light source to generate a short pulse beam and project it onto the object to be measured. The beam is reflected by the object to be measured and received by the light receiver. By calculating the time or phase of the light pulse from being sent to being received The difference is used to calculate the distance of the object, that is, the depth information. Based on practical applications, in order to obtain the largest possible illumination field of view and detection effect in the TOF camera module, the light beam emitted by the TOF camera module needs to have a specific intensity distribution and field of view (FOV), For example, the FOV may be as large as 50 degrees while the intensity is uniformly distributed. The angle of view is related to the divergence angle of the light-emitting source, so it is necessary to adjust the divergence angle of the light-emitting source in the TOF camera module to achieve the desired angle of view. Because the divergence angle of the light source in the TOF camera module is fixed, generally 10 degrees to 30 degrees, which cannot meet the application requirements of the TOF camera module, a diffuser is used to expand the divergence angle of the light source to the required angle.

An existing TOF module solution is formed by assembling a vertical cavity surface emitting laser (VCSEL) array light source and an external component with a beam spreading function in the vertical direction. An exemplary solution can be shown in FIG. 1 , the light emitted by the light-emitting source 01 is modulated by the diffuser 02, and the surface of the diffuser 02 has an irregular concave-convex structure, and the light is scattered by the concave-convex structure. Diffusion, so that the light beam emitted by the light emitting source 01 can obtain a larger divergence angle after passing through the light diffuser 02 (the divergence angle α of the light emitting source will be increased to β as shown in FIG. 1 ).

However, this kind of external diffuser solution generally realizes the fixation of the diffuser and the module through the method of gluing. If the customer encounters a drop or bump during use, the external diffuser may fall off, resulting in the output beam. Too concentrated, creating a risk for human eye safety. Therefore, in order to monitor whether the diffuser has fallen off, an additional photodetector 04 needs to be mounted next to the VCSEL, which increases the lateral size and manufacturing cost of the module, and also affects the product yield. At the same time, the distance between the diffuser and the light source of the VCSEL is limited by the bonding height of the light source electrode and the control tolerance of the assembly process, which limits the thickness of the TOF module to be thinner.

SUMMARY OF THE INVENTION

The embodiments of the present application provide a time-of-flight camera module, a preparation method, and an electronic device, which are used to integrate a diffuser with a light-emitting source of a time-of-flight camera device, effectively prevent the diffuser from falling off, and reduce the time of flight camera module. Additional components to reduce the size and cost of the time-of-flight camera module.

A first aspect of the embodiments of the present application provides a time-of-flight camera module, the time-of-flight camera module includes a substrate material; a laser array, grown on the lower surface of the substrate material, is used to pass through the substrate material Realize backside emitting laser; a beam deflector is cured on the upper surface of the substrate material; the beam deflector includes a first microlens array and a first covering material; the first microlens array is cured on the substrate The upper surface of the material, the first covering material covers the first microlens array, and the beam deflector is used to change the divergence angle of the laser light.

In this embodiment, the beam deflector can expand the divergence angle of the beam and can also reduce the divergence angle of the beam. Wherein, the divergence angle of the light beam is the initial angle when the laser array emits the laser light.

In the technical solutions provided by the embodiments of the present application, the first microlens array and the first covering material microlens array function as beam deflectors to realize the function of changing the divergence angle of the laser light. At the same time, the first microlens array and the first covering material are cured on the upper surface (ie the back) of the substrate material, that is, the beam deflector passes through the mutual interaction between the substrate material and the material of the first microlens array. The function of adhesion realizes the function of integrating the beam deflector and the light source array, effectively preventing the light diffuser from falling off, and improving the safety of the time-of-flight camera module; this eliminates the need to add monitoring devices, thereby reducing additional time-of-flight camera modules. device, reducing the size and cost of the time-of-flight camera module.

Optionally, the refractive index of the first covering material is different from the refractive index of the material of the first microlens array. This enables beam scattering and deflection of the beam. It can be understood that, in this embodiment, according to the different requirements for the deflection of the divergence angle of the laser light, the refractive index of the first covering material and the refractive index of the material of the first microlens array have different requirements: When the divergence angle of the laser light is present, the refractive index of the first covering material is greater than the refractive index of the material of the first microlens array; when the divergence angle of the laser light needs to be reduced, the refractive index of the first covering material is smaller than that of the first covering material. The refractive index of the material of the microlens array.

Optionally, the material types of the first covering material and the first microlens array include semiconductor material, dielectric material or organic material, the organic material includes polymer (Polymer) and polyester (Polyester), and all The first covering material is of the same type as the first microlens array; wherein, the organic material includes polymer or polyester. When the same material type is selected for the first covering material and the material of the first microlens array, there can be better mutual adhesion between the two, thereby forming a beam deflector.

Optionally, according to different material types, the processing technology between the first microlens array and the first covering material is also different, and the details may be as follows:

In a possible implementation manner, when the material types of the first covering material and the first microlens array are dielectric materials, the material of the first microlens array is cured on the substrate material by sputtering The upper surface of the first microlens array is processed by chemical etching, and the first covering material is cured on the upper surface of the first microlens array by sputtering.

In another possible implementation manner, when the material types of the first covering material and the first microlens array are semiconductor materials, the material of the first microlens array is cured by deposition on the substrate material. and the first microlens array is processed by chemical etching, and the first covering material is cured on the upper surface of the first microlens array by deposition.

In another possible implementation manner, when the material types of the first covering material and the first microlens array are organic materials, the material of the first microlens array is cured on the substrate material by spin coating The upper surface of the first microlens array is processed by nano-imprinting, and the first covering material is cured on the upper surface of the first microlens array by spin coating.

Optionally, in order to reduce optical loss, an optical anti-reflection film is provided between the first microlens array and the substrate material; an optical anti-reflection film is provided on the upper surface of the first covering material; and the The number of optical antireflection films is at least one layer.

Optionally, the first microlens array is a regularly arranged array or the first microlens array is an irregularly arranged array.

Optionally, the optical beam expander further includes a second microlens array and a second covering material, the second microlens array is cured on the first covering material, and the second covering material is cured on the first covering material. on the second microlens array. Wherein, the second microlens array is a regularly arranged array or the second microlens array is an irregularly arranged array.

Optionally, the positive and negative electrodes of the light source array in the time-of-flight camera module are integrated on the same side, that is, the time-of-flight camera module adopts a backlight flip-chip welding structure, and at this time, the positive and negative electrodes of the light source array can pass through. The die bonding method is connected to the substrate, so the wire bonding method is no longer required. This simplifies the packaging process of the module.

Optionally, the laser array may be a vertical cavity surface emitting laser array or a horizontal cavity surface emitting laser array. The vertical cavity surface emitting laser array can achieve good results in the case of wavelengths less than 1200 nanometers (ie short wavelengths), but the horizontal cavity surface emitting laser arrays can achieve good results in the case of short wavelengths and long wavelengths (ie wavelengths greater than 1200 nanometers). All achieved good results.

Optionally, when the laser array is a horizontal cavity surface emitting laser array, each horizontal cavity surface emitting laser in the horizontal cavity surface emitting laser array includes a substrate, a waveguide, a grating, a reverse mirror and an active region; Among them, the grating is used to provide feedback of the light transmission direction to realize the resonant cavity of the laser; the waveguide provides the lateral light field confinement; the active region provides the gain for the laser and realizes the laser output under pumping; and the mirror is used for The purpose is to deflect the laser output along the waveguide direction by 90 degrees so that it is output from the substrate material of the time-of-flight camera module.

Optionally, the reflector may be a plane reflector with an installation direction of 45 degrees or a 45 degree reflecting prism. In this embodiment, the number and installation direction of the mirrors are not limited, as long as the beam can be deflected by 90 degrees from the horizontal direction and output from the substrate material of the time-of-flight camera module.

Optionally, the time-of-flight camera module can be controlled by partition, that is, the M lasers of the laser array correspond to the N microlens arrays in the microlens array on the first material, and the M lasers are subject to the same driving current. control, the N microlens arrays are used to realize the deflection of the light beam by the target deflection angle. That is, each partition is designed with a specific deflection angle, so as to achieve a large range and high illumination while reducing power requirements and driving current requirements.

In a second aspect, an embodiment of the present application provides an electronic device, the electronic device includes a controller and the time-of-flight camera module described in the first aspect, the controller is electrically connected to the laser array for controlling the laser array Fire a laser. In this embodiment, the controller can obtain the difference between the object to be measured and the time-of-flight camera module by calculating the time difference or phase difference between the detection light information emitted by the time-of-flight camera module and the received inductive light signal distance between. In the embodiments of the present application, the time-of-flight camera module can be applied to environments such as ranging, face recognition, avatar unlocking, gesture recognition, object modeling, 3D games, and smart homes.

In a third aspect, an embodiment of the present application provides a method for preparing a time-of-flight camera module, which specifically includes: providing a substrate material, and then growing a laser array for backside emitting laser on the lower surface of the substrate material; curing a first microlens array on the upper surface of the substrate material; curing a first covering material on the first microlens array, wherein the first microlens array and the first covering material are used to change the The deflection angle of the laser beam.

In the technical solutions provided by the embodiments of the present application, the first microlens array and the first covering material function as a beam deflector to realize the function of changing the deflection angle of the laser light. At the same time, the first microlens array and the first covering material are cured on the upper surface (ie the back) of the substrate material, that is, the beam deflector passes through the mutual interaction between the substrate material and the material of the first microlens array. The function of adhesion realizes the function of integrating the beam deflector and the light source array, effectively preventing the light diffuser from falling off, and improving the safety of the time-of-flight camera module; this eliminates the need to add monitoring devices, thereby reducing additional time-of-flight camera modules. device, reducing the size and cost of the time-of-flight camera module.

Description of drawings

Fig. 1 is a structural schematic diagram when the external light diffuser and the light source are adhesively connected;

FIG. 2 is a schematic diagram of an embodiment of an electronic device in an embodiment of the application;

3 is a schematic diagram of an embodiment of a time-of-flight camera module in an embodiment of the application;

4 is a side view of an embodiment of a time-of-flight camera module in an embodiment of the application;

5 is a bottom view of an embodiment of the time-of-flight camera module in the embodiment of the application;

6 is a top view of an embodiment of the time-of-flight camera module in the embodiment of the application;

7 is a schematic diagram of the projection principle of the time-of-flight camera module in the embodiment of the application;

8 is a schematic diagram of a test result of a time-of-flight camera module in an embodiment of the application;

9 is a schematic diagram of another embodiment of the time-of-flight camera module in the embodiment of the application;

10 to 13 are a process flow diagram of the time-of-flight camera module in the embodiment of the application;

14 is a schematic diagram of another embodiment of the time-of-flight camera module in the embodiment of the application;

15 is a schematic diagram of another embodiment of the time-of-flight camera module in the embodiment of the application;

16 is a schematic diagram of another embodiment of the time-of-flight camera module in the embodiment of the application;

17 is a schematic diagram of another embodiment of the time-of-flight camera module in the embodiment of the application;

18 is a schematic diagram of another embodiment of the time-of-flight camera module in the embodiment of the application;

FIG. 19 is a schematic diagram of a partition of the laser array in the time-of-flight camera module in the embodiment of the application;

FIG. 20 is a schematic diagram of partition scanning in the time-of-flight camera module according to the embodiment of the present application.

Detailed ways

In order to make the purpose, technical solutions and advantages of the present application clearer, the embodiments of the present application are described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. . Those of ordinary skill in the art know that with the emergence of new application scenarios, the technical solutions provided in the embodiments of the present application are also applicable to similar technical problems.

The terms "first", "second" and the like in the description and claims of the present application and the above drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It is to be understood that data so used may be interchanged under appropriate circumstances so that the embodiments described herein can be practiced in sequences other than those illustrated or described herein. Furthermore, the terms "comprising" and "having", and any variations thereof, are intended to cover non-exclusive inclusion, for example, a process, method, system, product or device comprising a series of steps or modules is not necessarily limited to those expressly listed Rather, those steps or modules may include other steps or modules not expressly listed or inherent to the process, method, product or apparatus. The naming or numbering of the steps in this application does not mean that the steps in the method flow must be executed in the time/logical sequence indicated by the naming or numbering, and the named or numbered process steps can be implemented according to the The technical purpose is to change the execution order, as long as the same or similar technical effects can be achieved. The division of units in this application is a logical division. In practical applications, there may be other division methods. For example, multiple units may be combined or integrated into another system, or some features may be ignored. , or not implemented, in addition, the shown or discussed mutual coupling or direct coupling or communication connection may be through some interfaces, and the indirect coupling or communication connection between units may be electrical or other similar forms. There are no restrictions in the application. In addition, the units or sub-units described as separate components may or may not be physically separated, may or may not be physical units, or may be distributed into multiple circuit units, and some or all of them may be selected according to actual needs. unit to achieve the purpose of the scheme of this application.

In the embodiment of the present application, the time-of-flight camera module can be applied to an electronic device, and the electronic device 100 in the embodiment of the present application will be introduced below. The electronic device 100 involved in this application may be a mobile phone, a tablet computer, an electronic reader, a notebook computer, a vehicle-mounted device, a wearable device, or the like. This embodiment is described by taking the electronic device 100 as a mobile phone as an example. FIG. 2 shows an exemplary schematic structural diagram of the electronic device 100 .

The electronic device 100 may include a processor 110, an external memory interface 120, an internal memory 121, a universal serial bus (USB) interface 130, a charge management module 140, a power management module 141, a battery 142, an antenna 1, an antenna 2 , mobile communication module 150, wireless communication module 160, audio module 170, speaker 170A, receiver 170B, microphone 170C, headphone jack 170D, sensor module 180, buttons 190, motor 191, indicator 192, camera 193, display screen 194, and Subscriber identification module (subscriber identification module, SIM) card interface 195 and so on. The sensor module 180 may include a pressure sensor 180A, a gyroscope sensor 180B, an air pressure sensor 180C, a magnetic sensor 180D, an acceleration sensor 180E, a distance sensor 180F, a proximity light sensor 180G, a fingerprint sensor 180H, a temperature sensor 180J, a touch sensor 180K, and ambient light. Sensor 180L, bone conduction sensor 180M, etc.

It can be understood that the structures illustrated in the embodiments of the present application do not constitute a specific limitation on the electronic device 100 . In other embodiments of the present application, the electronic device 100 may include more or less components than shown, or combine some components, or separate some components, or arrange different components. The illustrated components may be implemented in hardware, software, or a combination of software and hardware.

The processor 110 may include one or more processing units, for example, the processor 110 may include an application processor (application processor, AP), a modem processor, a graphics processor (graphics processing unit, GPU), an image signal processor ( image signal processor, ISP), controller, video codec, digital signal processor (digital signal processor, DSP), baseband processor, and/or neural-network processing unit (neural-network processing unit, NPU), etc. Wherein, different processing units may be independent devices, or may be integrated in one or more processors.

The controller can generate an operation control signal according to the instruction operation code and timing signal, and complete the control of fetching and executing instructions.

A memory may also be provided in the processor 110 for storing instructions and data. In some embodiments, the memory in processor 110 is cache memory. This memory may hold instructions or data that have just been used or recycled by the processor 110 . If the processor 110 needs to use the instruction or data again, it can be called directly from the memory. Repeated accesses are avoided and the latency of the processor 110 is reduced, thereby increasing the efficiency of the system.

In some embodiments, the processor 110 may include one or more interfaces. The interface may include an integrated circuit (inter-integrated circuit, I2C) interface, an integrated circuit built-in audio (inter-integrated circuitsound, I2S) interface, a pulse code modulation (pulse code modulation, PCM) interface, a universal asynchronous receiver (universal asynchronous receiver) /transmitter, UART) interface, mobile industry processor interface (MIPI), general-purpose input/output (GPIO) interface, subscriber identity module (SIM) interface, and/or Universal serial bus (universal serial bus, USB) interface, etc.

In this embodiment of the present application, the processor 110 may be configured to determine whether the electronic device 100 determines whether the first UE stores the reusable key information and security context information. In some embodiments, the processor 110 may be further configured to establish a first direct link with the second UE using the key information and the security context information after determining that the reusable key information and the security context information are stored .

The I2C interface is a bidirectional synchronous serial bus that includes a serial data line (SDA) and a serial clock line (SCL). In some embodiments, the processor 110 may contain multiple sets of I2C buses. The processor 110 can be respectively coupled to the touch sensor 180K, the charger, the flash, the camera 193 and the like through different I2C bus interfaces. For example, the processor 110 may couple the touch sensor 180K through the I2C interface, so that the processor 110 and the touch sensor 180K communicate with each other through the I2C bus interface, so as to realize the touch function of the electronic device 100 .

The I2S interface can be used for audio communication. In some embodiments, the processor 110 may contain multiple sets of I2S buses. The processor 110 may be coupled with the audio module 170 through an I2S bus to implement communication between the processor 110 and the audio module 170 . In some embodiments, the audio module 170 can transmit audio signals to the wireless communication module 160 through the I2S interface, so as to realize the function of answering calls through a Bluetooth headset.

The PCM interface can also be used for audio communications, sampling, quantizing and encoding analog signals. In some embodiments, the audio module 170 and the wireless communication module 160 may be coupled through a PCM bus interface. In some embodiments, the audio module 170 can also transmit audio signals to the wireless communication module 160 through the PCM interface, so as to realize the function of answering calls through the Bluetooth headset. Both the I2S interface and the PCM interface can be used for audio communication.

The UART interface is a universal serial data bus used for asynchronous communication. The bus may be a bidirectional communication bus. It converts the data to be transmitted between serial communication and parallel communication. In some embodiments, a UART interface is typically used to connect the processor 110 with the wireless communication module 160 . For example, the processor 110 communicates with the Bluetooth module in the wireless communication module 160 through the UART interface to implement the Bluetooth function. In some embodiments, the audio module 170 can transmit audio signals to the wireless communication module 160 through the UART interface, so as to realize the function of playing music through the Bluetooth headset.

The MIPI interface can be used to connect the processor 110 with peripheral devices such as the display screen 194 and the camera 193 . MIPI interfaces include camera serial interface (CSI), display serial interface (DSI), etc. In some embodiments, the processor 110 communicates with the camera 193 through a CSI interface, so as to realize the photographing function of the electronic device 100 . The processor 110 communicates with the display screen 194 through the DSI interface to implement the display function of the electronic device 100 .

The GPIO interface can be configured by software. The GPIO interface can be configured as a control signal or as a data signal. In some embodiments, the GPIO interface may be used to connect the processor 110 with the camera 193, the display screen 194, the wireless communication module 160, the audio module 170, the sensor module 180, and the like. The GPIO interface can also be configured as I2C interface, I2S interface, UART interface, MIPI interface, etc.

The USB interface 130 is an interface that conforms to the USB standard specification, and may specifically be a Mini USB interface, a Micro USB interface, a USB Type C interface, and the like. The USB interface 130 can be used to connect a charger to charge the electronic device 100, and can also be used to transmit data between the electronic device 100 and peripheral devices. It can also be used to connect headphones to play audio through the headphones. The interface can also be used to connect other electronic devices, such as AR devices.

It can be understood that the interface connection relationship between the modules illustrated in the embodiments of the present application is only a schematic illustration, and does not constitute a structural limitation of the electronic device 100 . In other embodiments of the present application, the electronic device 100 may also adopt different interface connection manners in the foregoing embodiments, or a combination of multiple interface connection manners.

The charging management module 140 is used to receive charging input from the charger. The charger may be a wireless charger or a wired charger. In some wired charging embodiments, the charging management module 140 may receive charging input from the wired charger through the USB interface 130 . In some wireless charging embodiments, the charging management module 140 may receive wireless charging input through a wireless charging coil of the electronic device 100 . While the charging management module 140 charges the battery 142 , it can also supply power to the electronic device through the power management module 141 .

The power management module 141 is used for connecting the battery 142 , the charging management module 140 and the processor 110 . The power management module 141 receives input from the battery 142 and/or the charging management module 140, and supplies power to the processor 110, the internal memory 121, the display screen 194, the camera 193, and the wireless communication module 160. The power management module 141 can also be used to monitor parameters such as battery capacity, battery cycle times, battery health status (leakage, impedance). In some other embodiments, the power management module 141 may also be provided in the processor 110 . In other embodiments, the power management module 141 and the charging management module 140 may also be provided in the same device.

The wireless communication function of the electronic device 100 may be implemented by the antenna 1, the antenna 2, the mobile communication module 150, the wireless communication module 160, the modulation and demodulation processor, the baseband processor, and the like.

Antenna 1 and Antenna 2 are used to transmit and receive electromagnetic wave signals. Each antenna in electronic device 100 may be used to cover a single or multiple communication frequency bands. Different antennas can also be reused to improve antenna utilization. For example, the antenna 1 can be multiplexed as a diversity antenna of the wireless local area network. In other embodiments, the antenna may be used in conjunction with a tuning switch.

The mobile communication module 150 may provide wireless communication solutions including 2G/3G/4G/5G etc. applied on the electronic device 100 . The mobile communication module 150 may include at least one filter, switch, power amplifier, low noise amplifier (LNA) and the like. The mobile communication module 150 can receive electromagnetic waves from the antenna 1, filter and amplify the received electromagnetic waves, and transmit them to the modulation and demodulation processor for demodulation. The mobile communication module 150 can also amplify the signal modulated by the modulation and demodulation processor, and then turn it into an electromagnetic wave for radiation through the antenna 1 . In some embodiments, at least part of the functional modules of the mobile communication module 150 may be provided in the processor 110 . In some embodiments, at least part of the functional modules of the mobile communication module 150 may be provided in the same device as at least part of the modules of the processor 110 .

The modem processor may include a modulator and a demodulator. Wherein, the modulator is used to modulate the low frequency baseband signal to be sent into a medium and high frequency signal. The demodulator is used to demodulate the received electromagnetic wave signal into a low frequency baseband signal. Then the demodulator transmits the demodulated low-frequency baseband signal to the baseband processor for processing. The low frequency baseband signal is processed by the baseband processor and passed to the application processor. The application processor outputs sound signals through audio devices (not limited to the speaker 170A, the receiver 170B, etc.), or displays images or videos through the display screen 194 . In some embodiments, the modem processor may be a stand-alone device. In other embodiments, the modem processor may be independent of the processor 110, and may be provided in the same device as the mobile communication module 150 or other functional modules.

The wireless communication module 160 may provide applications on the electronic device 100 including wireless local area networks (WLAN) (such as wireless fidelity (Wi-Fi) networks), bluetooth (BT), global navigation satellite systems ( global navigation satellite system, GNSS), frequency modulation (frequency modulation, FM), near field communication technology (near field communication, NFC), infrared technology (infrared, IR) and other wireless communication solutions. The wireless communication module 160 may be one or more devices integrating at least one communication processing module. The wireless communication module 160 receives electromagnetic waves via the antenna 2 , frequency modulates and filters the electromagnetic wave signals, and sends the processed signals to the processor 110 . The wireless communication module 160 can also receive the signal to be sent from the processor 110 , perform frequency modulation on it, amplify it, and convert it into electromagnetic waves for radiation through the antenna 2 .

In some embodiments, the antenna 1 of the electronic device 100 is coupled with the mobile communication module 150, and the antenna 2 is coupled with the wireless communication module 160, so that the electronic device 100 can communicate with the network and other devices through wireless communication technology. The wireless communication technologies may include global system for mobile communications (GSM), general packet radio service (GPRS), code division multiple access (CDMA), wideband code Division Multiple Access (WCDMA), Time Division Code Division Multiple Access (TD-SCDMA), Long Term Evolution (LTE), BT, GNSS, WLAN, NFC, FM , and/or IR technology, etc. The GNSS may include a global positioning system (global positioning system, GPS), a global navigation satellite system (GLONASS), a Beidou satellite navigation system (beidounavigation satellite system, BDS), a quasi-zenith satellite system (quasi- zenith satellite system, QZSS) and/or satellite based augmentation systems (SBAS).

The electronic device 100 implements a display function through a GPU, a display screen 194, an application processor, and the like. The GPU is a microprocessor for image processing, and is connected to the display screen 194 and the application processor. The GPU is used to perform mathematical and geometric calculations for graphics rendering. Processor 110 may include one or more GPUs that execute program instructions to generate or alter display information.

Display screen 194 is used to display images, videos, and the like. Display screen 194 includes a display panel. The display panel can be a liquid crystal display (LCD), an organic light-emitting diode (OLED), an active-matrix organic light-emitting diode or an active-matrix organic light-emitting diode (active-matrix organic light-emitting diode). , AMOLED), flexible light-emitting diode (flex light-emitting diode, FLED), Miniled, MicroLed, Micro-oLed, quantum dot light-emitting diode (quantum dot light emitting diodes, QLED) and so on. In some embodiments, the electronic device 100 may include one or N display screens 194 , where N is a positive integer greater than one.

The electronic device 100 may implement a shooting function through an ISP, a camera 193, a video codec, a GPU, a display screen 194, an application processor, and the like.

The ISP is used to process the data fed back by the camera 193 . For example, when taking a photo, the shutter is opened, the light is transmitted to the camera photosensitive element through the lens, the light signal is converted into an electrical signal, and the camera photosensitive element transmits the electrical signal to the ISP for processing, and converts it into an image visible to the naked eye. ISP can also perform algorithm optimization on image noise, brightness, and skin tone. ISP can also optimize the exposure, color temperature and other parameters of the shooting scene. In some embodiments, the ISP may be provided in the camera 193 .

Camera 193 is used to capture still images or video. The object is projected through the lens to generate an optical image onto the photosensitive element. The photosensitive element may be a charge coupled device (CCD) or a complementary metal-oxide-semiconductor (CMOS) phototransistor. The photosensitive element converts the optical signal into an electrical signal, and then transmits the electrical signal to the ISP to convert it into a digital image signal. The ISP outputs the digital image signal to the DSP for processing. DSP converts digital image signals into standard RGB, YUV and other formats of image signals. In some embodiments, the electronic device 100 may include 1 or N cameras 193 , where N is a positive integer greater than 1.

A digital signal processor is used to process digital signals, in addition to processing digital image signals, it can also process other digital signals. For example, when the electronic device 100 selects a frequency point, the digital signal processor is used to perform Fourier transform on the frequency point energy and so on.

Video codecs are used to compress or decompress digital video. The electronic device 100 may support one or more video codecs. In this way, the electronic device 100 can play or record videos of various encoding formats, such as: Moving Picture Experts Group (moving picture experts group, MPEG) 1, MPEG2, MPEG3, MPEG4 and so on.

The NPU is a neural-network (NN) computing processor. By drawing on the structure of biological neural networks, such as the transfer mode between neurons in the human brain, it can quickly process the input information, and can continuously learn by itself. Applications such as intelligent cognition of the electronic device 100 can be implemented through the NPU, such as image recognition, face recognition, speech recognition, text understanding, and the like.

The external memory interface 120 can be used to connect an external memory card, such as a Micro SD card, to expand the storage capacity of the electronic device 100 . The external memory card communicates with the processor 110 through the external memory interface 120 to realize the data storage function. For example to save files like music, video etc in external memory card.

Internal memory 121 may be used to store computer executable program code, which includes instructions. The internal memory 121 may include a storage program area and a storage data area. The storage program area can store an operating system, an application program required for at least one function (such as a sound playback function, an image playback function, etc.), and the like. The storage data area may store data (such as audio data, phone book, etc.) created during the use of the electronic device 100 and the like. In addition, the internal memory 121 may include high-speed random access memory, and may also include non-volatile memory, such as at least one magnetic disk storage device, flash memory device, universal flash storage (UFS), and the like. The processor 110 executes various functional applications and data processing of the electronic device 100 by executing instructions stored in the internal memory 121 and/or instructions stored in a memory provided in the processor.

The electronic device 100 may implement audio functions through an audio module 170, a speaker 170A, a receiver 170B, a microphone 170C, an earphone interface 170D, an application processor, and the like. Such as music playback, recording, etc.

The audio module 170 is used for converting digital audio information into analog audio signal output, and also for converting analog audio input into digital audio signal. Audio module 170 may also be used to encode and decode audio signals. In some embodiments, the audio module 170 may be provided in the processor 110 , or some functional modules of the audio module 170 may be provided in the processor 110 .

Speaker 170A, also referred to as a "speaker", is used to convert audio electrical signals into sound signals. The electronic device 100 can listen to music through the speaker 170A, or listen to a hands-free call.

The receiver 170B, also referred to as "earpiece", is used to convert audio electrical signals into sound signals. When the electronic device 100 answers a call or a voice message, the voice can be answered by placing the receiver 170B close to the human ear.

The microphone 170C, also called "microphone" or "microphone", is used to convert sound signals into electrical signals. When making a call or sending a voice message, the user can make a sound by approaching the microphone 170C through a human mouth, and input the sound signal into the microphone 170C. The electronic device 100 may be provided with at least one microphone 170C. In other embodiments, the electronic device 100 may be provided with two microphones 170C, which can implement a noise reduction function in addition to collecting sound signals. In other embodiments, the electronic device 100 may further be provided with three, four or more microphones 170C to collect sound signals, reduce noise, identify sound sources, and implement directional recording functions.

The earphone jack 170D is used to connect wired earphones. The earphone interface 170D can be the USB interface 130, or can be a 3.5mm open mobile terminal platform (OMTP) standard interface, a cellular telecommunications industry association of the USA (CTIA) standard interface.

The pressure sensor 180A is used to sense pressure signals, and can convert the pressure signals into electrical signals. In some embodiments, the pressure sensor 180A may be provided on the display screen 194 . There are many types of pressure sensors 180A, such as resistive pressure sensors, inductive pressure sensors, capacitive pressure sensors, and the like. The capacitive pressure sensor may be comprised of at least two parallel plates of conductive material. When a force is applied to the pressure sensor 180A, the capacitance between the electrodes changes. The electronic device 100 determines the intensity of the pressure according to the change in capacitance. When a touch operation acts on the display screen 194, the electronic device 100 detects the intensity of the touch operation according to the pressure sensor 180A. The electronic device 100 may also calculate the touched position according to the detection signal of the pressure sensor 180A. In some embodiments, touch operations acting on the same touch position but with different touch operation intensities may correspond to different operation instructions. For example, when a touch operation whose intensity is less than the first pressure threshold acts on the short message application icon, the instruction for viewing the short message is executed. When a touch operation with a touch operation intensity greater than or equal to the first pressure threshold acts on the short message application icon, the instruction to create a new short message is executed.

The gyro sensor 180B may be used to determine the motion attitude of the electronic device 100 . In some embodiments, the angular velocity of electronic device 100 about three axes (ie, x, y, and z axes) may be determined by gyro sensor 180B. The gyro sensor 180B can be used for image stabilization. Exemplarily, when the shutter is pressed, the gyro sensor 180B detects the shaking angle of the electronic device 100, calculates the distance that the lens module needs to compensate according to the angle, and allows the lens to offset the shaking of the electronic device 100 through reverse motion to achieve anti-shake. The gyro sensor 180B can also be used for navigation and somatosensory game scenarios.

The air pressure sensor 180C is used to measure air pressure. In some embodiments, the electronic device 100 calculates the altitude through the air pressure value measured by the air pressure sensor 180C to assist in positioning and navigation.

The magnetic sensor 180D includes a Hall sensor. The electronic device 100 can detect the opening and closing of the flip holster using the magnetic sensor 180D. In some embodiments, when the electronic device 100 is a flip machine, the electronic device 100 can detect the opening and closing of the flip according to the magnetic sensor 180D. Further, according to the detected opening and closing state of the leather case or the opening and closing state of the flip cover, characteristics such as automatic unlocking of the flip cover are set.

The acceleration sensor 180E can detect the magnitude of the acceleration of the electronic device 100 in various directions (generally three axes). The magnitude and direction of gravity can be detected when the electronic device 100 is stationary. It can also be used to identify the posture of electronic devices, and can be used in applications such as horizontal and vertical screen switching, pedometers, etc.

Distance sensor 180F for measuring distance. The electronic device 100 can measure the distance through infrared or laser. In some embodiments, when shooting a scene, the electronic device 100 can use the distance sensor 180F to measure the distance to achieve fast focusing.

Proximity light sensor 180G may include, for example, light emitting diodes (LEDs) and light detectors, such as photodiodes. The light emitting diodes may be infrared light emitting diodes. The electronic device 100 emits infrared light to the outside through the light emitting diode. Electronic device 100 uses photodiodes to detect infrared reflected light from nearby objects. When sufficient reflected light is detected, it can be determined that there is an object near the electronic device 100 . When insufficient reflected light is detected, the electronic device 100 may determine that there is no object near the electronic device 100 . The electronic device 100 can use the proximity light sensor 180G to detect that the user holds the electronic device 100 close to the ear to talk, so as to automatically turn off the screen to save power. Proximity light sensor 180G can also be used in holster mode, pocket mode automatically unlocks and locks the screen.

The ambient light sensor 180L is used to sense ambient light brightness. The electronic device 100 can adaptively adjust the brightness of the display screen 194 according to the perceived ambient light brightness. The ambient light sensor 180L can also be used to automatically adjust the white balance when taking pictures. The ambient light sensor 180L can also cooperate with the proximity light sensor 180G to detect whether the electronic device 100 is in a pocket, so as to prevent accidental touch.

The fingerprint sensor 180H is used to collect fingerprints. The electronic device 100 can use the collected fingerprint characteristics to realize fingerprint unlocking, accessing application locks, taking pictures with fingerprints, answering incoming calls with fingerprints, and the like.

The temperature sensor 180J is used to detect the temperature. In some embodiments, the electronic device 100 uses the temperature detected by the temperature sensor 180J to execute a temperature processing strategy. For example, when the temperature reported by the temperature sensor 180J exceeds a threshold value, the electronic device 100 reduces the performance of the processor located near the temperature sensor 180J in order to reduce power consumption and implement thermal protection. In other embodiments, when the temperature is lower than another threshold, the electronic device 100 heats the battery 142 to avoid abnormal shutdown of the electronic device 100 caused by the low temperature. In some other embodiments, when the temperature is lower than another threshold, the electronic device 100 boosts the output voltage of the battery 142 to avoid abnormal shutdown caused by low temperature.

Touch sensor 180K, also called "touch panel". The touch sensor 180K may be disposed on the display screen 194, and the touch sensor 180K and the display screen 194 form a touch screen, also referred to as a "touch screen". The touch sensor 180K is used to detect a touch operation on or near it. The touch sensor can pass the detected touch operation to the application processor to determine the type of touch event. Visual output related to touch operations may be provided through display screen 194 . In other embodiments, the touch sensor 180K may also be disposed on the surface of the electronic device 100 , which is different from the location where the display screen 194 is located.

The bone conduction sensor 180M can acquire vibration signals. In some embodiments, the bone conduction sensor 180M can acquire the vibration signal of the vibrating bone mass of the human voice. The bone conduction sensor 180M can also contact the pulse of the human body and receive the blood pressure beating signal. In some embodiments, the bone conduction sensor 180M can also be disposed in the earphone, combined with the bone conduction earphone. The audio module 170 can analyze the voice signal based on the vibration signal of the vocal vibration bone block obtained by the bone conduction sensor 180M, so as to realize the voice function. The application processor can analyze the heart rate information based on the blood pressure beat signal obtained by the bone conduction sensor 180M, and realize the function of heart rate detection.

The keys 190 include a power-on key, a volume key, and the like. Keys 190 may be mechanical keys. It can also be a touch key. The electronic device 100 may receive key inputs and generate key signal inputs related to user settings and function control of the electronic device 100 .

Motor 191 can generate vibrating cues. The motor 191 can be used for vibrating alerts for incoming calls, and can also be used for touch vibration feedback. For example, touch operations acting on different applications (such as taking pictures, playing audio, etc.) can correspond to different vibration feedback effects. The motor 191 can also correspond to different vibration feedback effects for touch operations on different areas of the display screen 194 . Different application scenarios (for example: time reminder, receiving information, alarm clock, games, etc.) can also correspond to different vibration feedback effects. The touch vibration feedback effect can also support customization.

The indicator 192 can be an indicator light, which can be used to indicate the charging state, the change of the power, and can also be used to indicate a message, a missed call, a notification, and the like.

The SIM card interface 195 is used to connect a SIM card. The SIM card can be contacted and separated from the electronic device 100 by inserting into the SIM card interface 195 or pulling out from the SIM card interface 195 . The electronic device 100 may support 1 or N SIM card interfaces, where N is a positive integer greater than 1. The SIM card interface 195 can support Nano SIM card, Micro SIM card, SIM card and so on. Multiple cards can be inserted into the same SIM card interface 195 at the same time. The types of the plurality of cards may be the same or different. The SIM card interface 195 can also be compatible with different types of SIM cards. The SIM card interface 195 is also compatible with external memory cards. The electronic device 100 interacts with the network through the SIM card to realize functions such as call and data communication. In some embodiments, the electronic device 100 employs an eSIM, ie: an embedded SIM card. The eSIM card can be embedded in the electronic device 100 and cannot be separated from the electronic device 100 .

In this embodiment, the time-of-flight camera module can be connected to the camera 193, and the controller in the processor 110 is electrically connected to the laser array in the time-of-flight camera module for controlling the laser array to emit laser light. In this embodiment, the controller can obtain the difference between the object to be measured and the time-of-flight camera module by calculating the time difference or phase difference between the detection light information emitted by the time-of-flight camera module and the received inductive light signal distance between. In the embodiments of the present application, the time-of-flight camera module can be applied to environments such as ranging, face recognition, avatar unlocking, gesture recognition, object modeling, 3D games, and smart homes.

The following describes the time-of-flight camera module 300 in the embodiments of the present application in detail with reference to the drawings. 3 , the time-of-flight camera module 300 includes a laser array 301 , a substrate material 302 and a beam deflector 303 ; wherein the beam deflector 303 includes a first microlens array 3031 and a first covering material 3032 . In the time-of-flight camera module 300, the laser array 301 is grown on the lower surface of the substrate material 302 for backside emission of laser light through the substrate material 302; the beam deflector 303 is cured on the substrate material 302 The upper surface of the base material 302 . Specifically, the first microlens array 3031 is cured on the upper surface of the substrate material 302 , the first covering material 3032 covers the first microlens array 3031 , and the beam deflector 303 Used to change the divergence angle of the laser. The working mode of the time-of-flight camera module 300 is: when the laser array 301 is powered on, the laser array 301 emits laser light toward the substrate material 302 through the light exit hole, and the laser light passes through the substrate material 302, the first The microlens array 3031 and the first covering material 303 change the divergence angle of the laser light.

In this embodiment, the beam deflector is used for expanding and reducing the divergence angle, and the divergence angle is the initial angle at which the laser array emits the laser light.

In an exemplary solution, the positive and negative electrodes of the laser array 301 are integrated on the same side. That is, the time-of-flight camera module 300 shown in FIGS. 4 to 6 , wherein, FIG. 4 is a side view of the time-of-flight camera module, FIG. 5 is a bottom view of the time-of-flight camera module, and FIG. 6 is a time-of-flight camera module top view. According to the combination of FIG. 3 and FIG. 4 , the laser array 301 may include metal electrodes (positive and negative electrodes on the same side) 1 of the lasers in the laser array and light exit holes 2 of the lasers. In the time-of-flight camera module 300 shown in FIG. 4, 3 is used to represent the above-mentioned substrate material 302; 4 is used to represent the light-emitting direction of the laser in the laser array 301, along the direction of the substrate material 302; 5 is used to represent The first microlens array 3031 ; 6 is used to represent the first covering material 3032 ; 7 is used to represent the exit direction of the laser light after passing through the first microlens array 3031 and the first covering material 3032 .

As shown in FIG. 4 , the first microlens array 3031 and the first covering material 3032 realize the function of a beam deflector, wherein the first microlens array 3031 The microlens arrays can be arranged irregularly or regularly. cloth, using the principle of light diffraction (the schematic diagram of the projection principle shown in Figure 7) to discretize and homogenize the spot of the laser. In the entire time-of-flight camera module 300, the laser is powered through the metal electrode 1, and then the laser is emitted in the direction of the substrate material 3 through the light exit hole 2. After the laser passes through the first microlens array 3031 and the first covering material 3032, The divergence angle of the light is enlarged or reduced. The actual device test results shown in Figure 8 show that the right side is the light spot formed by the laser whose divergence angle is amplified by the light diffuser. The light spot formed by the laser has a divergence angle of 20 degrees to 22 degrees.

In an exemplary solution, in order to achieve a better mutual adhesion effect between the first microlens array 3031 and the first covering material 3032, the material of the first microlens array 3031 and the first covering material 3032 Can be the same type of material. The material type may be a dielectric material, a semiconductor material or an organic material, wherein the organic material includes a polymer (Polymer) and a polyester (Polyester). In order to realize the expansion or reduction of the divergence angle, the refractive index of the first covering material 3032 needs to be different from the refractive index of the material of the first microlens array 3031 . Specifically, if the divergence angle needs to be enlarged, the refractive index of the first covering material 3032 is greater than the refractive index of the material of the first microlens array 3031; if the divergence angle needs to be reduced, the first covering material 3032 The refractive index is smaller than the refractive index of the material of the first microlens array 3031 .

In another exemplary solution, in order to reduce optical loss, an optical anti-reflection film is included between the substrate material 302 and the first microlens array 3031 , and an optical anti-reflection film is also provided on the upper surface of the first covering material 3032 . As shown in Figure 9, wherein, the optical anti-reflection film can be integrated on the upper surface of the substrate material or the upper surface of the first covering material 3032 by means of deposition. It can be understood that the number of the optical anti-reflection film may be one layer or multiple layers.

In another exemplary solution, according to the different material types of the first covering material 3032 and the material of the first microlens array 3031, the processing technology of the first covering material 3032 and the first microlens array 3031 is also different. The same, the details can be as follows:

In a possible implementation manner, when the material types of the first covering material 3032 and the first microlens array 3031 are dielectric materials, the material of the first microlens array 3031 is cured by sputtering on the The upper surface of the substrate material 302, and the first microlens array 3031 is processed by chemical etching, and the first covering material 3032 is cured on the upper surface of the first microlens array 3031 by sputtering .

In another possible implementation manner, when the material types of the first covering material 3032 and the first microlens array 3031 are semiconductor materials, the material of the first microlens array 3031 is cured on the substrate by deposition. The upper surface of the base material 302, and the first microlens array 3031 is processed by chemical etching, and the first covering material 3032 is cured on the upper surface of the first microlens array 3031 by deposition.

In another possible implementation, when the material types of the first covering material 3032 and the first microlens array 3031 are organic materials, the material of the first microlens array 3031 is cured by spin coating on the The upper surface of the substrate material 302, and the first microlens array 3031 is processed by nano-imprinting, and the first covering material 3032 is cured on the upper surface of the first microlens array 3031 by spin coating .

When the material of the first microlens array 3031 and the material type of the first covering material 3032 are organic materials, the additive formula of the first microlens array 3031, the first covering material 3032 and the optical anti-reflection film can be as follows 10 to 13. First, as shown in FIG. 10, a layer of optical anti-reflection film is deposited on the upper surface of the substrate material 302; after the optical anti-reflection film is cured, as shown in FIG. 11, the upper surface of the optical anti-reflection film is rotated The material of the first microlens array 3031 is coated, and the first microlens array 3031 (as shown in FIG. 12 ) is produced on the material by means of nano-imprinting; then the first microlens array 3031 is heated by heating Or change it from a liquid state to a solid state by means of ultraviolet irradiation; The covering material 3032 can also be flattened by nano-imprinting and then changed from liquid to solid, or can be directly changed from liquid to solid by spin coating, the specific method is not limited here. The first covering material 3032 can also be heated or irradiated with ultraviolet rays to change from a liquid state to a solid state.

In another exemplary solution, in order to continue to increase or decrease the divergence angle of the beam, a multi-layer material may also be included to realize the function of a beam deflector. That is, the second microlens array 3033 can be further cured on the upper surface of the first covering material 3032 , and then the second covering material 3034 can be cured on the second microlens array 3033 . The curing method of the second microlens array 3033 and the second covering material 3034 is the same as that of the first microlens array 3031 and the first covering material 3032 , and details are not described herein again. It can be understood that, in this technical solution, the second microlens array 3033 is not related to the first microlens array 3031 , that is, the arrangement, size, position and other information of the microlens arrays are not related between the two. In an exemplary solution, as shown in FIG. 14 , the material of the second microlens array 3033 is spin-coated on the upper surface of the first covering material 3032; then a second microlens array is made on the material by nanoimprinting technology. Lens array 3033; after the second microlens array 3033 changes from liquid to solid, spin-coating the second covering material 3034. In this embodiment, the quantity of materials for generating the microlens array by nano-imprinting is not limited, as long as the preset target is met.

In each of the above solutions, the microlens array may have a regular shape as shown in FIG. 15 or an irregular shape as shown in FIG. 16 , as long as the preset deflection target can be met. The specific shape is here. Not limited. The surface of the covering material (such as the first covering material 3032 or the second covering material 3034 ) can be embossed into a flat surface as shown in FIG. 16 or an uneven surface as shown in FIG. 17 . limited.

In another exemplary solution, the laser array 301 may be a vertical cavity surface emitting laser array or a horizontal cavity surface emitting laser array. The vertical cavity surface emitting laser array can achieve good results in the case of wavelengths less than 1200 nanometers (ie short wavelengths), but the horizontal cavity surface emitting laser arrays can achieve good results in the case of short wavelengths and long wavelengths (ie wavelengths greater than 1200 nanometers). All achieved good results.

When the laser array 301 is a horizontal cavity surface emitting laser array, the horizontal cavity surface emitting laser array may be as shown in FIG. 18 , the horizontal cavity surface emitting laser array includes a plurality of horizontal cavity surface emitting lasers, wherein each horizontal cavity surface emitting laser array The emitting lasers all include a substrate, a waveguide, a grating, a reverse mirror and an active region; wherein, the grating is used to provide feedback of the light transmission direction to realize the resonant cavity of the laser; the waveguide provides lateral light field confinement; the active region Provide gain for the laser, and realize laser output under pumping; and the mirror is used to deflect the laser output along the waveguide direction by 90 degrees, so that it is output from the substrate material of the time-of-flight camera module. The substrate of the horizontal cavity surface emitting laser can be indium phosphide InP or gallium arsenide GaAs or other semiconductor substrates, the material of the active region can be semiconductor materials such as InGaAsP, AlGaInAs, InGaAs, AlGaAs, etc., and the waveguide structure of the laser can be a ridge A waveguide or other type of waveguide. The cavity length (L) can be 50 microns or 100 microns according to the light-emitting point interval required by the 2D laser array; the spacing (D) of the lasers in the width direction of the waveguide can be greater than or equal to 8 microns. On the basis of this solution, the reflector can be a flat reflector with an installation direction of 45 degrees or a 45-degree reflecting prism. In this embodiment, the number and installation direction of the mirrors are not limited, as long as the beam can be deflected by 90 degrees from the horizontal direction and output from the substrate material of the time-of-flight camera module.

In another exemplary solution, the laser array 301 and the microlens array may be in a corresponding relationship of partitions, that is, M lasers in the laser array 301 correspond to N microlens arrays in the microlens array relation. Wherein, the M lasers are controlled by the same driving current, and the N microlens arrays realize the deflection of the target deflection angle of the light beam. In an exemplary solution, it can be seen from the top view of the laser arrangement shown in FIG. 19 that the laser array 301 is divided into 12 partitions (1 to 12 respectively); and the side view of the laser arrangement shown in FIG. 20 shows that , the microlens array is also divided into 1 to 12 partitions, that is, the partition 1 of the laser array corresponds to the partition 1 of the microlens array, the partition 2 of the laser array corresponds to the partition 2 of the microlens array, and the other partitions also correspond. It will not be repeated here. Then in the schematic projection diagram shown in Figure 20, it can be seen that the beam deflection angles of the lasers and the microlens array in each partition are different to achieve different far-field distributions. Each time a partition is lit, a corresponding spot is generated, and then passed through 2D scanning method can achieve a wide range of scanning. In this way, the power requirement and driving current requirement can be reduced while realizing a large range and high illumination, and the chip cost and driving circuit requirement can be effectively reduced.

Those skilled in the art can clearly understand that, for the convenience and brevity of description, the specific working process of the system, device and unit described above may refer to the corresponding process in the foregoing method embodiments, which will not be repeated here.

In the several embodiments provided in this application, it should be understood that the disclosed system, apparatus and method may be implemented in other manners. For example, the apparatus embodiments described above are only illustrative. For example, the division of the units is only a logical function division. In actual implementation, there may be other division methods. For example, multiple units or components may be combined or Can be integrated into another system, or some features can be ignored, or not implemented. On the other hand, the shown or discussed mutual coupling or direct coupling or communication connection may be through some interfaces, indirect coupling or communication connection of devices or units, and may be in electrical, mechanical or other forms.

The units described as separate components may or may not be physically separated, and components displayed as units may or may not be physical units, that is, may be located in one place, or may be distributed to multiple network units. Some or all of the units may be selected according to actual needs to achieve the purpose of the solution in this embodiment.

In addition, each functional unit in each embodiment of the present application may be integrated into one processing unit, or each unit may exist physically alone, or two or more units may be integrated into one unit. The above-mentioned integrated units may be implemented in the form of hardware, or may be implemented in the form of software functional units.

The integrated unit, if implemented in the form of a software functional unit and sold or used as an independent product, may be stored in a computer-readable storage medium. Based on this understanding, the technical solutions of the present application can be embodied in the form of software products in essence, or the parts that contribute to the prior art, or all or part of the technical solutions, and the computer software products are stored in a storage medium , including several instructions for causing a computer device (which may be a personal computer, a server, or a network device, etc.) to execute all or part of the steps of the methods described in the various embodiments of the present application. The aforementioned storage medium includes: U disk, mobile hard disk, Read-Only Memory (ROM, Read-Only Memory), Random Access Memory (RAM, Random Access Memory), magnetic disk or optical disk and other media that can store program codes .

As mentioned above, the above embodiments are only used to illustrate the technical solutions of the present application, but not to limit them; although the present application has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand: The technical solutions described in the embodiments are modified, or some technical features thereof are equivalently replaced; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions in the embodiments of the present application.

Claims

A time-of-flight camera module, comprising:

substrate material;

a laser array, grown on the lower surface of the substrate material, for realizing backside emitting laser through the substrate material;

a beam deflector, cured on the upper surface of the substrate material;

the beam deflector includes a first microlens array and a first covering material;

The first microlens array is cured on the upper surface of the substrate material, the first covering material covers the first microlens array, and the beam deflector is used to change the divergence angle of the laser light.
The module according to claim 1, wherein the refractive index of the first covering material is different from the refractive index of the material of the first microlens array.
The module according to claim 1 or 2, wherein the material types of the first covering material and the first microlens array include semiconductor materials, dielectric materials or organic materials, and the organic materials include polymers or polyester, and the first covering material and the first microlens array are of the same material type;

Wherein, the organic material includes polymers and polyesters.
The module according to claim 3, wherein, when the material types of the first covering material and the first microlens array are semiconductor materials, the microlens array is a semiconductor material, and the material of the first microlens array is deposited by deposition. is cured on the upper surface of the substrate material, the first microlens array is processed by chemical etching, and the first covering material is cured on the upper surface of the first microlens array by deposition .
The module according to claim 3, wherein when the material types of the first covering material and the first microlens array are dielectric materials, the material of the first microlens array is cured by sputtering on the upper surface of the substrate material, and the first microlens array is processed by chemical etching, and the first covering material is cured on the upper surface of the first microlens array by sputtering.
The module according to claim 3, wherein when the material types of the first covering material and the first microlens array are organic materials, the material of the first microlens array is cured by spin coating on the upper surface of the substrate material, and the first microlens array is processed by nano-imprinting, and the first covering material is cured on the upper surface of the first microlens array by spin coating.
The module according to any one of claims 1 to 6, wherein an optical anti-reflection film is arranged between the first microlens array and the substrate material;

The upper surface of the first covering material is provided with an optical anti-reflection film;

The number of the optical anti-reflection films is at least one layer.
The module according to any one of claims 1 to 7, wherein the first microlens array is a regularly arranged array or the first microlens array is an irregularly arranged array.
The module according to any one of claims 1 to 8, wherein the optical beam expander further comprises a second microlens array and a second covering material, and the second microlens array is cured on the On the first covering material, the second covering material is cured on the second microlens array.
The module according to claim 9, wherein the second microlens array is a regularly arranged array or the second microlens array is an irregularly arranged array.
The module according to any one of claims 1 to 10, wherein the positive and negative electrodes of the laser array are integrated on the same side.
The module according to any one of claims 1 to 11, wherein the laser array is a horizontal cavity surface emitting laser array or a vertical cavity surface emitting laser array.
The module according to claim 12, wherein when the laser array is a horizontal cavity surface emitting laser array, each horizontal cavity surface emitting laser in the horizontal cavity surface emitting laser array includes a mirror;

The reflecting mirror is used to deflect the laser light output from the horizontal cavity surface emitting laser by 90 degrees along the horizontal cavity surface, so that the laser light is output from the substrate material.
The module according to claim 13, wherein the reflecting mirror is a plane reflecting mirror with an installation direction of 45 degrees or a 45-degree reflecting prism.
The module according to any one of claims 1 to 14, wherein the M lasers of the laser array correspond to the N microlens arrays in the first microlens array, and the M lasers The laser is controlled by the same driving current, and the N microlens arrays are used to realize the deflection of the beam divergence angle by the target deflection angle.
An electronic device, comprising a controller and the time-of-flight camera module according to any one of claims 1 to 15, wherein the controller is electrically connected to the laser array.
A preparation method of a time-of-flight camera module, comprising:

provide substrate material;

growing a laser array for backside emitting laser on the lower surface of the substrate material;

curing a first microlens array on the upper surface of the substrate material;

A first covering material is cured on the first microlens array, wherein the first microlens array and the first covering material are used to change the divergence angle of the laser light.
The method of claim 17, wherein the refractive index of the first cover material is different from the refractive index of the material of the first microlens array.
The method according to claim 17 or 18, wherein the material types of the first covering material and the first microlens array include semiconductor materials, dielectric materials or organic materials, and the organic materials include polymers or polyester, and the first covering material and the material type of the first microlens array are the same;

Wherein, the organic material includes polymer or polyester.
The method according to claim 19, wherein when the material types of the first covering material and the first microlens array are semiconductor materials, the material of the first microlens array is cured by deposition on the material of the first microlens array. The upper surface of the substrate material, the first microlens array is processed by chemical etching, and the first covering material is cured on the upper surface of the first microlens array by deposition.
The method according to claim 19, wherein when the material types of the first covering material and the first microlens array are dielectric materials, the material of the first microlens array is cured by sputtering on the The upper surface of the substrate material, and the first microlens array is processed by chemical etching, and the first covering material is cured on the upper surface of the first microlens array by sputtering.
The method according to claim 19, wherein when the material types of the first covering material and the first microlens array are organic materials, the material of the first microlens array is cured by spin coating on The upper surface of the substrate material, and the first microlens array is processed by nano-imprinting, and the first covering material is cured on the upper surface of the first microlens array by spin coating.
The method according to any one of claims 17 to 22, wherein an optical anti-reflection film is cured between the first microlens array and the substrate material;

An optical anti-reflection film is cured on the upper surface of the first covering material;

Wherein, the number of the optical anti-reflection film is at least one layer.
The method according to any one of claims 17 to 23, wherein the first microlens array is a regularly arranged array or the first microlens array is an irregularly arranged array.
The method according to any one of claims 17 to 24, wherein a second microlens array is further cured on the upper surface of the first covering material, and a second microlens array is cured on the upper surface of the second microlens array. 2. Covering material.
The method of claim 25, wherein the second microlens array is a regularly arranged array or the second microlens array is an irregularly arranged array.
The method according to any one of claims 17 to 26, wherein the positive and negative electrodes of the laser array are integrated on the same side.
The method according to any one of claims 17 to 27, wherein the laser array is a horizontal cavity surface emitting laser array or a vertical cavity surface emitting laser array.
The method according to claim 28, wherein when the laser array is a horizontal cavity surface emitting laser array, each horizontal cavity surface emitting laser in the horizontal cavity surface emitting laser array is further equipped with a mirror;

The reflecting mirror is used to deflect the laser light output from the horizontal cavity surface emitting laser by 90 degrees along the horizontal cavity surface, so that the laser light is output from the substrate material.
The method according to claim 29, wherein the reflecting mirror is a plane reflecting mirror with an installation direction of 45 degrees or a 45-degree reflecting prism.
The method according to any one of claims 17 to 30, wherein the M lasers of the laser array correspond to the N microlens arrays in the first microlens array, and the M lasers Controlled by the same driving current, the N microlens arrays are used to realize the deflection of the light beam by the target deflection angle.