WO2022086490A1

WO2022086490A1 - Multi-function module for mmwave communication and function control in an electronic device

Info

Publication number: WO2022086490A1
Application number: PCT/US2020/056324
Authority: WO
Inventors: Vijay L. Asrani; Khan Mohammed Shams
Original assignee: Google Llc
Priority date: 2020-10-19
Filing date: 2020-10-19
Publication date: 2022-04-28

Abstract

This document describes a multi-function module (104) for mmWave communication and function control (e.g., volume control) in an electronic device. The multi-function module may be located behind a user control of the electronic device and may include multiple mmWave patch antennas (106) and multiple touch sensors (108) interleaved with one another. In addition, integrated circuit components (302) for radio frequency functionality may be mounted on an opposing side of a printed circuit board (204) from the patch antennas and the touch sensors. In aspects, the multi-function module enables the patch antennas and the touch sensors to coexist in the same region to reduce an amount of physical volume consumed by corresponding hardware and provide additional interior space for other components, such as a battery.

Description

MULTI-FUNCTION MODULE FOR MMWAVE COMMUNICATION AND FUNCTION CONTROL IN AN ELECTRONIC DEVICE

BACKGROUND

[oooi] With continual advances in wireless technology, many electronic devices are being designed to wirelessly communicate using millimeter wave (mmWave) frequencies, which are frequencies between 30 gigahertz (GHz) and 300 GHz. Because mmWave signals have short wavelengths, they may be susceptible to interference by objects in their path. Because of this, multiple mmWave modules and electrically transparent window coverings are sometimes used to reduce interference.

[0002] However, small, handheld electronic devices, such as mobile phones, generally incorporate a metal frame for the device, which results in a higher perceived quality, durability, and resiliency compared to that of a non-metal frame. Including an electrically transparent (e.g. , plastic window) over a mmWave module implemented on the side of the device, therefore, may not be desirable from an industrial point of view. For example, the plastic window may require an aperture to be provided in the metal frame or trim, and this creates a discontinuity in the metal frame or trim of the electronic device and may weaken the metal frame or trim. Therefore, challenges arise in implementing multiple mmWave modules into electronic devices, particularly handheld electronic devices, while maintaining both high-performance mmWave functionality and high quality in terms of industrial design.

SUMMARY

[0003] This document describes a multi-function module for mmWave communication and function control (e.g, volume control) in an electronic device. In use, the multi-function module may be located behind a user control of the electronic device. The multi-function module includes an array of mmWave patch antennas and touch sensors interleaved with one another. Integrated circuit (IC) components for radio frequency (RF) functionality may be mounted on an opposing side of a printed circuit board from the patch antennas and the touch sensors. The multi-function module enables the patch antennas and the touch sensors to coexist in the same region to reduce an amount of physical volume consumed by corresponding hardware and provide additional interior space for other components, such as the battery. Also, use of the multifunctional module reduces the number of apertures formed in the frame of the electronic device, and so simplifies the manufacturing process and increases the strength of the frame.

[0004] In one aspect, a multi-function module for mmWave communication and function control of an electronic device is disclosed. The multi-function module may include a printed circuit board, an interposer, a plurality of mmWave patch antennas, a plurality of touch sensors, and one or more integrated circuit components. The printed circuit board has a first side and a second side opposing the first side. The interposer is mounted to the first side of the printed circuit board. The plurality of mmWave patch antennas are mounted to the interposer. In aspects, the interposer is positioned between the plurality of mmWave patch antennas and the printed circuit board. Also, the plurality of mmWave patch antennas are configured to provide the mmWave communication. The plurality of touch sensors are interleaved with the plurality of mmWave patch antennas. Further, the plurality of touch sensors are configured to detect touch input. The one or more integrated circuit components are mounted to the second side of the printed circuit board to control one or more of the plurality of mmWave patch antennas or one or more of the plurality of touch sensors.

[0005] In other aspects, an electronic device is disclosed. The electronic device includes an enclosure having an exterior wall defining an elongated hole. The electronic device also includes a function control operable by a user, comprising an elongated button positioned within the elongated hole in the enclosure and having an inner surface and an outer surface. In addition, the electronic device includes the multi-function module as described above, where the plurality of mmWave patch antennas and the plurality of touch sensors of the multi-function module are aligned with the elongated button of the function control.

[0006] This summary is provided to introduce simplified concepts concerning a multi-function module for mmWave communication and function control in an electronic device, which is further described below in the Detailed Description and Drawings. This summary is not intended to identify essential features of the claimed subject matter, nor is it intended for use in determining the scope of the claimed subject matter.

BRIEF DESCRIPTION OF THE DRAWINGS

[0007] The details of one or more aspects of a multi-function module for mmWave communication and function control in an electronic device, and associated systems and methods, are described in this document with reference to the following drawings. The same numbers are used throughout the drawings to reference like features and components:

Fig. 1 illustrates an example environment of a multi-function module for mmWave communication and function control in an electronic device, and associated systems and methods.

Fig. 2 illustrates a front perspective view of the multi-function module from Fig. 1 in more detail.

Fig. 3 illustrates a rear perspective view of the multi-function module from Fig. 2.

Fig. 4 illustrates an example implementation of the multi-function module from Fig. 1.

Fig. 5 illustrates a cross-sectional view of a portion of the electronic device, including the multi-function module.

Fig. 6 illustrates an example implementation of the electronic device from Fig. 1 in greater detail in accordance with one or more aspects.

DETAILED DESCRIPTION

Overview

[0008] Incorporating mmWave functionality into an electronic device while maintaining a high-quality industrial design can be challenging, at least in part because materials used to provide the high-quality industrial design may interfere with the mmWave signals, but materials used to reduce the interference to the mmWave signals may reduce the quality, for example the strength, of the industrial design. Accordingly, techniques are described herein to combine mmWave functionality with a touch-sensitive control (e.g, a volume button) of an electronic device, which enables a mmWave module to be implemented on the metal frame of the electronic device without compromising the industrial design or resiliency of the metal frame.

[0009] Aspects of a multi-function module for mmWave communication and function control in an electronic device are described. The multi-function module includes an array of mmWave patch antennas and touch sensors. In such an array, the touch sensors may be interleaved with the patch antennas such that the touch sensors and the patch antennas share a same region (e.g, region behind the volume button). The touch sensors detect touch input to allow user control of a function of the electronic device (for example such as increase or decrease a volume). In addition, when the touch input is not detected, the patch antennas may transmit or receive mmWave radiation for wireless communication in the mmWave frequency band. The array of patch antennas and touch sensors may be mounted onto an interposer, which may be mounted to a first side of a printed circuit board (PCB). One or more RF components (also referred to as IC components for RF functionality) may be mounted on a second side of the PCB, opposite the patch antennas and touch sensors.

[0010] These are but a few examples of how the described techniques and devices may be used to enable a multi-function module for mmWave communication and function control in an electronic device, and associated systems and methods. Other examples and implementations are described throughout this document. The document now turns to an example system, after which example methods are described. In the example system the function control is a volume function control, to allow a user to control the volume of sound generated/emitted by the device, but the described techniques and devices are not limited to control of a volume function and may be applied to allow user control of other functions. Example System

[0011] Fig. 1 illustrates an example environment 100 of a multi-function module for mmWave communication and function control in an electronic device, and associated systems and methods. An electronic device 102 includes, among other components, a multi-function module 104 that combines mmWave functionality with function control for the electronic device 102. The multi-function module 104 includes an array of patch antennas (e.g, mmWave patch antennas 106) and sensors (e.g, touch sensors 108). In aspects, the patch antennas and the sensors are positioned behind an elongated plastic overmold (e.g, a volume control 110 or button) and share a physical volume generally allocated for hardware associated with the volume control 110. Having both the mmWave patch antennas 106 and the touch sensors 108 positioned in the same vicinity enables a single hole or cutout in the frame of the electronic device 102 to be used for both mmWave functionality and function control. Essentially, the multi-function module 104 replaces a conventional mechanical volume key with a touch control that also provides mmWave functionality. Combining the mmWave functionality with the function control also conserves space within the electronic device 102 and maintains a clean industrial design.

[0012] The mmWave patch antennas 106 enable communication (e.g, transmission and reception) of radio frequencies in the mmWave frequency band. Some wirelesscommunication systems, such as fifth generation (5G) systems and next generation systems for wireless network technology, may implement mmWave antennas due to their functional properties, including ultra-wideband and high-transmission rate. Millimeter waves have short wavelengths that range from approximately ten mm to approximately one mm. Because of the short wavelengths, millimeter waves travel by line of sight and can experience significant interference by an object (e.g, a building, a tree, a person’s finger or hand, a person’s body, metal chassis of the electronic device 102) blocking the path of the millimeter waves.

[0013] The touch sensors 108 may include any suitable touch sensor that can detect a user input for adjusting the volume. The touch sensors 108 may include capacitive sensors, inductive sensors, strain gauge sensors, and so forth. For example, a capacitive sensor can detect a change in capacitance when the user’s finger is placed in close proximity to the capacitive sensor. In another example, an inductive sensor can detect a change in inductance when the user’s finger is placed in close proximity to the inductive sensor. In yet another example, a strain gauge sensor can be used to detect a mechanical force applied to the sensor by a user’s finger pressing on the volume control 110, which causes the sensor to slightly deflect and then convert the mechanical force into an electrical signal. For purposes of illustration, the example touch sensors 108 herein are described in the context of capacitive sensors.

[0014] The array of patch antennas and touch sensors may include any suitable configuration and is not limited to the illustrated examples. In the example shown in Fig. 1, the array includes a 1x4 array of mmWave patch antennas 106 interleaved with capacitive touch sensors 108. The example array includes a pattern of alternating touch sensors and patch antennas, where the patch antennas 106 are distributed along a longitudinal length of the multi-function module 104 (also along a longitudinal length of the electronic device 102), and a pair of touch sensors 108 are disposed proximate to each lengthwise end of the multi-function module 104.

[0015] Fig. 2 illustrates a front perspective view 200 of the multi-function module 104 from Fig. 1 in more detail. Fig. 3 illustrates a rear perspective view 300 of the multifunction module 104 from Fig. 2. As illustrated in Fig. 2, the multi-function module 104 includes a PCB 204 used to mount the mmWave patch antennas 106 and the touch sensors 108. In an example, the mmWave patch antennas 106 and the touch sensors 108 may be mounted directly to an antenna substrate (e.g, interposer 206), which may be directly mounted to the PCB 204 such that the antenna substrate is located between the PCB 204 and the array of patch antennas and touch sensors. Alternatively, the mmWave patch antennas 106 and the touch sensors 108 may be mounted directly to the PCB 204. In the illustrated example, the interposer 206 is mounted to a first side 208 of the PCB 204. On an opposing, second side 210 of the PCB 204 from the interposer 206 is mounted an RF shield 212, which houses and shields one or more IC components (e.g, IC components 302 shown in Fig. 3) for RF functionality, including an RF integrated circuit (RFIC), a power-management IC (PMIC), and/or a touch IC.

[0016] Returning to Fig. 2, the multi-function module 104 includes four mmWave patch antennas (e.g, patch antennas 106-1, 106-2, 106-3, and 106-4) and four capacitive touch sensors 108 (e.g, touch sensors 108-1, 108-2, 108-3, and 108-4) distributed along a longitudinal length of the multi-function module 104. The longitudinal length is a length having a direction substantially parallel to a longitudinal axis 202 of the multi-function module 104. In aspects, the mmWave patch antennas 106 may be interleaved with the touch sensors 108. For instance, a first pair of the touch sensors 108 (e.g, the touch sensors 108-1 and 108-2) may be positioned proximate to a first end 214 of the multi-function module 104 and separated by at least one patch antenna (e.g, the patch antenna 106-1). The first end 214 of the multi-function module 104 is a first lengthwise end of the multifunction module 104 and may correspond to a first lengthwise end of the interposer and/or a first lengthwise end of the PCB 204. A second pair of the touch sensors 108 (e.g, the touch sensors 108-3 and 108-4) may be positioned proximate to a second end 216 of the multi-function module 104 and separated by at least one patch antenna (e.g, the patch antenna 106-4). The second end 216 of the multi-function module 104 is a second lengthwise end of the multi-function module 104 and may correspond to a second lengthwise end of the interposer and/or a second lengthwise end of the PCB 204. Although a pair of touch sensors 108 is illustrated at each lengthwise end of the multi-function module 104, any suitable number of touch sensors 108 may be used, including one, two, three, or more touch sensors 108. Using multiple touch sensors 108 at the first end 214 and/or the second end 216 may enable detection of a slide motion or a drag motion of a user’s finger lengthwise along the multi-function module 104. For example, and as discussed further herein, detection of such slide motion or drag motion can be mapped to a function to increase or decrease the volume based on the direction that the slide motion or the drag motion is detected.

[0017] Multiple patch antennas 106 may be implemented in the multi-function module 104 to enable the electronic device 102 to switch between the patch antennas 106 when a user’s finger occludes one or more of the patch antennas, such as during the touch input. Alternatively, the electronic device 102 can switch to a different mmWave module implemented at a different location on the electronic device 102 when one or more of the patch antennas 106 are occluded by the user’s finger or other object. Although the examples described herein show four patch antennas 106 integrated with four touch sensors 108, any suitable number of patch antennas 106 (e.g, two, three, four, five, six) can be integrated with any suitable number of touch sensors 108 (e.g, two, three, four, five, six). Although the patch antennas 106 and the touch sensors 108 are illustrated as having substantially rectangular shapes, the patch antennas 106 and the touch sensors 108 can have any suitable shape, including a generally elliptical shape, a generally square shape, an asymmetric shape, and so forth.

[0018] The PCB 204 may be formed, for example, from glass-reinforced epoxy material such as FR4. In some instances, the PCB 204 may include a single layer of electrically conductive traces and be a single-layer board. In other instances, the PCB 204 may be a multi-layer board that includes multiple layers of electrically conductive traces that are separated by layers of a dielectric material.

[0019] The interposer 206 is configured to form an electrical interface between the patch antennas 106 and the PCB 204 and between the touch sensors 108 and the PCB 204. The interposer 206 may be formed, for example, from glass-reinforced epoxy material such as FR4 or other substrate material. The interposer 206 includes a thickness 218 sufficient to cause the patch antennas 106 to be positioned proximate to an exterior surface of the electronic device 102. An example thickness 218 for the interposer 206 may include a thickness within a range of approximately 0.02 millimeter (mm) to approximately 0.08 mm. While the PCB 204 may be positioned within an interior of the frame of the electronic device 102, the patch antennas 106 are positioned within a hole (e.g, a slot) defined by the frame of the electronic device 102 (shown in Fig. 5) and behind the volume control 110 to reduce signal interference by the frame. As discussed herein, the frame may include a metal material that can interfere with RF radiation, but the volume control 110 may include a non-metal material that is substantially transparent to the RF radiation. Further discussion of this is described below in relation to Fig. 5.

[0020] In some aspects, the patch antennas 106 may have a width that substantially matches a width of the interposer 206. Such a width may be dependent on, or limited by, a width of the slot in the frame of the electronic device 102 to reduce signal interference caused by the frame.

[0021] As illustrated in Fig. 3 the IC components 302 and the RF shield 212 are mounted on the back side (e.g, the second side 210) of the PCB 204, such that the PCB 204 is between the IC components 302 and the interposer 206. Additional RF components may also be positioned proximate to, or mounted onto, the second side 210 of the PCB 204. The RF shield provides electromagnetic force (EMF) shielding for the RFIC, the PMIC, the touch IC, and any additional RF components.

[0022] The second side 210 of the PCB 204 may also include a connector 304 (e.g, a flex-cable connector) to electrically connect the multi-function module 104 to a main logic board of the electronic device 102. The RF shield 212 may also shield the connector 304. The connector 304 may be positioned proximate to one lengthwise end (e.g, the second end 216 of the multi-function module 104) of the PCB 204 and proximate to the RF shield 212. In some implementations, one or more of the IC components 302 (e.g, RFIC, PMIC, and/or the touch IC) may be mounted to the main logic board rather than on the multi-function module 104. However, assembling such IC components onto the multifunction module 104 may help minimize transmission loss associated with mmWave frequencies.

[0023] Fig. 4 illustrates an example implementation 400 of the multi-function module 104 from Fig. 1. In this example, the electronic device 102 (e.g, the touch IC of the electronic device 102) may register a user input indicating a volume adjustment (increase or decrease) based on a detected pattern of changes in capacitance to the touch sensors 108 over time. For instance, the touch sensors 108-1, 108-2, 108-3, and 108-4 each correspond to a respective channel 1, 2, 3, and 4. When the user drags or slides their finger 402 along the length of the multi-function module 104, the electronic device 102 may detect a pattern of capacitance changes over the various channels, which can be used to detect a volume-up input or a volume-down input. In diagram 410, for example, the pattern of capacitance changes over time (t) is detected beginning at channel 1, progressing to channels 2 and 3, and ending at channel 4. This pattern may indicate a volume-up input. For user intuitiveness, the touch sensor 108-4, which corresponds to channel 4, may be located closer to a top edge of the electronic device 102 in a portrait orientation compared to the touch sensor 108-1, which corresponds to channel 1. Such an arrangement may allow the user to slide their finger upward along the side edge of the electronic device 102 (in the portrait orientation) to intuitively increase the volume.

[0024] Alternatively, if the user slides their finger 402 downward along the side edge of the electronic device 102 in the portrait orientation, the touch input may be intended to decrease the volume. For example, the pattern detected by the touch sensors 108, as illustrated by diagram 420, may begin at channel 4, progress to channels 3 and 2, and end at channel 1. Accordingly, a downward direction of the slide motion can be mapped to a decrease command for the volume control (e.g, volume control 110 of Fig. 1).

[0025] In some implementations, when the touch sensors 108 detect the user’s finger, hand, or body, the electronic device 102 may use that detection as input for power reduction or module selection. For example, a touch input detected by one or more of the touch sensors 108 indicates that those particular touch sensors 108 are likely occluded by the user’s finger, hand, or another object, causing the capacitance change to those particular touch sensors 108. Due to the occlusion, the radiation produced or received by the particular touch sensors 108 may be blocked. Consequently, the electronic device 102 may reduce power provided to one or more of the patch antennas 106 on the multi-function module 104, including the patch anteima(s) located proximate to the particular touch sensors 108 that detected the touch input. Additionally or alternatively, in response to the detection of the touch input, the electronic device 102 may switch operation to a different mmWave module that is likely not occluded.

[0026] Fig. 5 illustrates a cross-sectional view 500 of a portion of the electronic device 102, including the multi-function module 104. The electronic device 102 is illustrated as having an enclosure 502, a display 504, back glass 506, and a molded plastic insert (e.g, an elongated button 508).

[0027] The enclosure 502 is a support structure or frame that defines a perimeter of the electronic device 102 around the display 504. The enclosure 502 may be formed of any suitable material, including metal for high durability and resiliency. The enclosure 502 may include an exterior wall 510 defining an elongated hole to house components of the volume control 110, such as the elongated button 508 and at least a portion of the multifunction module 104. Accordingly, the elongated button 508 may be positioned within the elongated hole in the exterior wall 510 of the enclosure 502. The elongated button 508 includes an inner surface and an opposing, outer surface. In some aspects, the outer surface of the elongated button 508 may be substantially flush with the exterior surface of the enclosure 502. However, the outer surface of the elongated button 508 may be proud (e.g., raised) or recessed in relation to the exterior surface of the enclosure 502.

[0028] The multi-function module 104 may be positioned within the enclosure 502 and aligned with the elongated button 508 such that the mmWave patch antennas 106 and the touch sensors 108 face outward and are proximate to the elongated button 508. In an example, at least some of the mmWave patch antennas and the touch sensors 108 may have a flat metal element defining a plane that is substantially parallel to an exterior surface of the enclosure 502 and/or substantially orthogonal to a plane defined by the display 504. The button 508 includes a non-metal material, such as plastic, that is substantially transparent to mmWave radiation to enable the mmWave signals to pass through. Further, the RF shield 212 is positioned within an interior of the electronic device 102, on an opposing side of the PCB 204 from the interposer 206, which has the patch antennas 106 and the touch sensors 108 mounted thereon. The electronic device 102 also includes a bracket 512, which may be part of the enclosure 502 or may be a separate component connected to the enclosure 502.

[0029] The integration of the capacitive touch sensors 108 with the multi-function module 104 can create additional space behind the volume key that can be used for placing other components, such as a battery 514. This allows the battery capacity of the device to be increased, thereby increasing the battery lifetime between charges. In one implementation, additional space 516 may be created by implementing the multi-function module 104 into an existing electronic device because the multi-function module 104 is more compact than conventional physical button assemblies used for the volume control 110. To utilize the additional space 516, the bracket 512 may be moved to reduce the additional space 516 between the bracket 512 and the RF shield 212, resulting in a proportional increase to a gap 518 between the bracket 512 and a battery 514. In some implementations, the bracket 512 may be positioned to abut the RF shield 212 to support the multi-function module 104 and form a heatsink for heat generated by one or more of the IC components 302 (e.g. , RFIC, PMIC, touch IC). The bracket 512 may also be bonded to one or more of the IC components 302 and/or to the RF shield 212. Positioning the bracket 512 proximate to the multi-function module 104 may not only reduce the size of the additional space 516, but also may provide more space for a larger version of the battery 514 that has more capacity and longer battery life than that of conventional devices that use the bracket 512 in its original, illustrated location.

[0030] Many devices have volume controls (e.g., the volume control 110), or other user controls, located on an edge of the device (e.g., on a lateral side of the display). When the electronic device 102 is used in landscape orientation, the volume controls may face upward (e.g., toward the sky). If a mmWave base station is located on a lamp post and a user of the electronic device 102 is standing underneath the lamp post holding the electronic device 102 in a landscape orientation such that the mmWave patch antennas 106 have direct line-of-sight with the base station, interference with the mmWave signals may be minimized, and the performance of mmWave communication may be optimized. Accordingly, combining the mmWave functionality with the volume control 110 may improve landscape mmWave performance (e.g., performance of mmWave communication when the electronic device 102 is in the landscape orientation).

[0031] Fig. 6 illustrates an example implementation 600 of the electronic device 102 from Fig. 1 in greater detail in accordance with one or more aspects. The electronic device 102 is illustrated with various non-limiting example devices: a smartphone 102-1, a tablet 102-2, a laptop 102-3, a desktop 102-4, a wearable computing device 102-5 (e.g, smartwatch), computing spectacles 102-6 (e.g, smart glasses), a gaming system 102-7, a home-automation and control system 102-8, and an appliance 102-9 (e.g, a microwave).

[0032] The electronic device 102 includes computer processor(s) 602 and computer- readable media 604, which includes non-transitory memory media 606 and non-transitory storage media 608. Applications and/or an operating system (not shown) implemented as computer-readable instructions stored on the computer-readable media 604 can be executed by the processor(s) 602 to provide some or all of the functionalities described herein. For example, the computer-readable media 604 can include application(s) 610, which can utilize the multi-function module 104 for both user-initiated function control and mmWave communication with a base station. The electronic device 102 may be implemented with any number of mmWave modules, including the multi-function module 104, for mmWave communication with the base station, such as two mmWave modules, three mmWave modules, four mmWave modules, five mmWave modules, and so forth. Generally, implementing multiple mmWave modules in a handheld electronic device provides improved performance for mmWave communication compared to using a single mmWave module in the handheld electronic device. However, manufacturing costs may increase with an increased number of mmWave modules.

[0033] The computer processors 602 may include an SoC, one or more of the IC components 302 (e.g, an RFIC, a PMIC, and/or a touch IC), a processor with embedded processor instructions or configured to access processor instructions stored in memory, hardware with embedded firmware, a printed circuit board with various hardware components, or any combination thereof.

[0034] The electronic device 102 may also include a network interface(s) 612 for communicating data over wired, wireless, or optical networks. By way of example and not limitation, the network interface 612 may communicate data over a local-area-network (LAN), a wireless local-area-network (WLAN), a personal-area-network (PAN), a wide- area-network (WAN), an intranet, the Internet, a peer-to-peer network, point-to-point network, a mesh network, and the like. [0035] Some examples are described below:

Example 1: A multi-function module for mmWave communication and control of a function of an electronic device, the multi-function module comprising a printed circuit board (204) having a first side (208) and a second side (210) opposing the first side; a plurality of mmWave patch antennas (106) mounted to the first side of the printed circuit board, the plurality of mmWave patch antennas configured to provide the mmWave communication; a plurality of touch sensors (108) interleaved with the plurality of mmWave patch antennas, the plurality of touch sensors configured to detect touch input; and one or more integrated circuit components mounted to the second side of the printed circuit board to control one or more of the plurality of mmWave patch antennas or one or more of the plurality of touch sensors. The module may further comprise an interposer (206) mounted to the first side of the printed circuit board, and the plurality of mmWave patch antennas (106) may be mounted to the interposer, the interposer positioned between the plurality of mmWave patch antennas and the printed circuit board.

[0036] Example 2: The multi-function module as recited in example 1, wherein the multi-function module further comprises a connector positioned on the second side of the printed circuit board, the multi-function module configured to electrically connect the multi-function module to one or more components on a main logic board.

[0037] Example 3 : The multi-function module as recited in example 1 or example 2, wherein the one or more integrated circuit components include one or more of a radiofrequency integrated circuit, a power-management integrated circuit, and a touch integrated circuit.

[0038] Example 4: The multi-function module as recited in example 3, wherein the touch integrated circuit is configured to: detect the touch input to one or more of the plurality of touch sensors; and responsive to detection of the touch input, adjust a function of the electronic device. For example, the touch integrated circuit may be configured to, responsive to detection of the touch input, adjust the volume function of the electronic device (that is, to adjust the volume with which the device generate s/emits sound). [0039] Example 5: The multi-function module as recited in example 4, wherein the plurality of touch sensors includes one or more touch sensors positioned proximate to each lengthwise end of the interposer.

[0040] Example 6: The multi-function module as recited in any preceding example, wherein the plurality of touch sensors include: a first pair of touch sensors positioned proximate to a first lengthwise end of the printed circuit board and separated by a first mmWave patch antenna of the plurality of mmWave patch antennas; and a second pair of touch sensors positioned proximate to a second lengthwise end of the printed circuit board that is opposite the first lengthwise end, the second pair of touch sensors separated by a second mmWave patch antenna of the plurality of mmWave patch antennas.

[0041] Example 7: The multi-function module as recited in any preceding example, wherein the plurality of touch sensors comprise capacitive sensors or inductive sensors.

[0042] Example 8: The multi-function module as recited in any one of examples 1 to 6, wherein the plurality of touch sensors comprise strain gauge sensors to detect the touch input based on a force applied to a user control (such as a control button) of the electronic device.

[0043] Example 9: The multi-function module as recited in any preceding example, wherein the multi-function module includes a radio frequency shield mounted to the second side of the printed circuit board to shield the one or more integrated circuit components.

[0044] Example 10: The multi-function module as recited in any preceding example, wherein the plurality of mmWave patch antennas and the plurality of touch sensors are distributed along a longitudinal length of the interposer.

[0045] Example 11: An electronic device (102) comprising: an enclosure (502) having an exterior wall defining an elongated hole; a function control (110) comprising an elongated button (508) positioned within the elongated hole in the enclosure and having an inner surface and an outer surface; and the multi-function module (104) of any preceding example, wherein the plurality of mmWave patch antennas and the plurality of touch sensors of the multi-function module are aligned with the elongated button of the function control (110).

[0046] Example 12: The electronic device as recited in example 11, wherein the interposer is positioned within the elongated hole of the enclosure to cause the plurality of mmWave antennas and the plurality of touch sensors to be positioned proximate to the inner surface of the elongated button and proximate to an exterior surface of the enclosure.

[0047] Example 13: The electronic device as recited in example 11 or example 12, further comprising a bracket connected to the enclosure, the bracket positioned proximate to the one or more integrated circuit components that are mounted on the second side of the printed circuit board, the bracket forming a heatsink for the one or more integrated circuit components.

[0048] Example 14: The electronic device as recited in example 13, wherein the bracket is positioned to support the multi-function module.

[0049] Example 15: The electronic device as recited in any one of examples 11 to 14, wherein the elongated button is substantially transparent to mmWave radiation.

Conclusion

[0050] Although aspects of the multi-function module for mmWave communication and function (e.g., volume function) control in an electronic device, and associated systems and methods, have been described in language specific to features and/or methods, the subject of the appended claims is not necessarily limited to the specific features or methods described. Rather, the specific features and methods are disclosed as example implementations of the multi-function module for mmWave communication and function control in an electronic device, and associated systems and methods. Accordingly, other equivalent features and methods are intended to be within the scope of the appended claims. Further, various different aspects are described, and it is to be appreciated that each described aspect can be implemented independently or in connection with one or more other described aspects.

Claims

CLAIMS What is claimed is:

1. A multi-function module for mmWave communication and function control of an electronic device, the multi-function module comprising: a printed circuit board (204) having a first side (208) and a second side (210) opposing the first side; an interposer (206) mounted to the first side of the printed circuit board; a plurality of mmWave patch antennas (106) mounted to the interposer, the interposer positioned between the plurality of mmWave patch antennas and the printed circuit board, the plurality of mmWave patch antennas configured to provide the mmWave communication; a plurality of touch sensors (108) interleaved with the plurality of mmWave patch antennas, the plurality of touch sensors configured to detect touch input; and one or more integrated circuit components mounted to the second side of the printed circuit board to control one or more of the plurality of mmWave patch antennas or one or more of the plurality of touch sensors.

2. The multi-function module as recited in claim 1, wherein the multi-function module further comprises a connector positioned on the second side of the printed circuit board, the connector configured to electrically connect the multi-function module to one or more components on a main logic board.

3. The multi-function module as recited in claim 1 or claim 2, wherein the one or more integrated circuit components include one or more of a radio-frequency integrated circuit, a power-management integrated circuit, and a touch integrated circuit.

4. The multi-function module as recited in claim 3, wherein the touch integrated circuit is configured to: detect the touch input to one or more of the plurality of touch sensors; and responsive to detection of the touch input, adjust a volume of the electronic device.

5. The multi-function module as recited in claim 1, 2, 3 or 4, wherein the plurality of touch sensors includes one or more touch sensors positioned proximate to each lengthwise end of the interposer.

6. The multi-function module as recited in any preceding claim, wherein the plurality of touch sensors include: a first pair of touch sensors positioned proximate to a first lengthwise end of the printed circuit board and separated by a first mmWave patch antenna of the plurality of mmWave patch antennas; and a second pair of touch sensors positioned proximate to a second lengthwise end of the printed circuit board that is opposite the first lengthwise end, the second pair of touch sensors separated by a second mmWave patch antenna of the plurality of mmWave patch antennas.

7. The multi-function module as recited in any preceding claim, wherein the plurality of touch sensors comprise capacitive sensors or inductive sensors.

8. The multi-function module as recited in any one of claims 1 to 6, wherein the plurality of touch sensors comprise strain gauge sensors to detect the touch input based on a force applied to the plurality of touch sensors of the electronic device.

9. The multi-function module as recited in any preceding claim, wherein the multi-function module includes a radio frequency shield mounted to the second side of the printed circuit board to shield the one or more integrated circuit components.

10. The multi-function module as recited in any preceding claim, wherein the plurality of mmWave patch antennas and the plurality of touch sensors are distributed along a longitudinal length of the interposer.

11. An electronic device (102) comprising: an enclosure (502) having an exterior wall defining an elongated hole; a volume control (110) comprising an elongated button (508) positioned within the elongated hole in the enclosure and having an inner surface and an outer surface; and the multi-function module (104) of any preceding claim, wherein the plurality of mmWave patch antennas and the plurality of touch sensors of the multi-function module are aligned with the elongated button of the volume control.

12. The electronic device as recited in claim 11, wherein the interposer is positioned within the elongated hole of the enclosure to cause the plurality of mmWave antennas and the plurality of touch sensors to be positioned proximate to the inner surface of the elongated button and proximate to an exterior surface of the enclosure.

13. The electronic device as recited in claim 11 or claim 12, further comprising a bracket connected to the enclosure, the bracket positioned proximate to the one or more integrated circuit components that are mounted on the second side of the printed circuit board, the bracket forming a heatsink for the one or more integrated circuit components.

14. The electronic device as recited in claim 13, wherein the bracket is positioned to support the multi-function module.

15. The electronic device as recited in any one of claims 11 to 14, wherein the elongated button is substantially transparent to mmWave radiation.

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