WO2022082875A1

WO2022082875A1 - Encapsulation structure for semiconductor laser

Info

Publication number: WO2022082875A1
Application number: PCT/CN2020/126883
Authority: WO
Inventors: 张志平; 张文华; 王宁
Original assignee: 光华临港工程应用技术研发(上海)有限公司
Priority date: 2020-10-22
Filing date: 2020-11-06
Publication date: 2022-04-28
Also published as: CN112397991A

Abstract

An encapsulation structure for a semiconductor laser (4). The encapsulation structure comprises a housing (1); and a heat dissipation mechanism (3) and a transmitting hole (2), the transmitting hole (2) being provided in one side of the housing (1). The heat dissipation mechanism (3) comprises a heat dissipation box (31), a cooling device (33), an air exhaust fan (34), a mounting frame (36), a filter screen (37) and ventilation holes (38). The heat dissipation box (31) is movably inserted into the bottom of the housing (1); the air exhaust fan (34) is fixedly mounted in the middle of the bottom of an inner wall of the heat dissipation box (31); the cooling device (33) is movably inserted at the position of the inner wall of the heat dissipation box (31) away from the top of the air exhaust fan (34); the ventilation holes (38) are respectively provided in side walls of two sides of the heat dissipation box (31) and at the bottom of the side walls; and the mounting frame (36) is inserted into the ventilation holes (38) in a threaded manner. The encapsulation structure effectively solves the problems of the temperature of an existing semiconductor laser (4) when in use having a significant influence on threshold current density, slope efficiency, spectral stability, etc., and the overheating of a light-emitting area leading to the damage of a cavity surface of the light-emitting area and even the degradation of the device, finally resulting in the device failure.

Description

A package structure of a semiconductor laser

technical field

The invention relates to the technical field of semiconductor lasers, in particular to a packaging structure of a semiconductor laser.

Background technique

Semiconductor lasers, also known as laser diodes, are lasers that use semiconductor materials as working substances. Due to the differences in the material structure, the specific processes of different types of lasers are special. Commonly used working substances are gallium arsenide, cadmium sulfide, indium phosphide, zinc sulfide, etc. The excitation methods include electric injection, electron beam excitation and optical pumping. Semiconductor laser devices can be divided into homojunction and single heterojunction. , double heterojunction, etc.

technical problem

However, there are some drawbacks in the traditional use process, such as:

The temperature of the package structure of a semiconductor laser during operation has a significant impact on its threshold current density, slope efficiency, and spectral stability.

technical solutions

The purpose of the present invention is to provide a packaging structure of a semiconductor laser to solve the above-mentioned problems in the background art.

In order to achieve the above purpose, the present invention provides the following technical solutions: including a casing; a heat dissipation mechanism, and a radiating hole; one side of the casing is provided with a radiating hole; the heat dissipation mechanism includes a heat dissipation box, a cooling device, an exhaust fan, Frame, filter screen and ventilation holes, the bottom of the casing is movably plugged with a heat dissipation box, the bottom of the inner wall of the heat dissipation box is fixedly installed with an exhaust fan, and the inner wall of the heat dissipation box is away from the top of the exhaust fan. A cooling device is connected, ventilation holes are opened at the bottoms of the side walls on both sides of the heat dissipation box, an installation frame is inserted into the inner thread of the ventilation hole, and a filter screen is fixedly welded between the inner walls of the installation frame; The cooling device includes a water tank, a water replenishment hole, a fixing frame, a refrigerator, a water pump and a cooling pipe. The inside of the fixing frame is provided with a cooling pipe, both ends of the cooling pipe penetrate the side wall of the water tank and extend to the interior of the water tank, a water pump is fixedly installed inside one side of the cooling pipe, and the water tank is away from one end of the fixing frame A water replenishment hole is opened, and a sealing plug is connected to the inside of the water replenishment hole, and a refrigerator is fixedly installed on the inner wall of the water tank; a heat conduction plate, a heat conduction plate is fixedly inserted on the top of the heat dissipation box; The top surface of the board is fixedly welded with the semiconductor laser; the fixing column, the bottom of the casing and on both sides of the heat dissipation box are fixedly welded with fixed columns; the installation mechanism, the surface of the heat dissipation box is fixed and installed on the outside of the casing There is an installation mechanism, and the installation mechanism is fixedly installed with the fixing column.

Wherein, a drying device is fixedly installed on the inner wall of the heat dissipation box and away from the top of the cooling device, and the drying device includes a drying frame, a ventilation hole, a desiccant and a filter bag, and the drying frame and the heat dissipation box are movably plugged together, The top and bottom of the drying frame are provided with several ventilation holes, the inner wall of the drying frame is bonded and connected with a filter bag, and the inside of the filter bag is filled with a desiccant.

Wherein, the position corresponding to the drying device and the cooling device on one side of the inner wall of the heat-dissipating box is fixedly welded with the corresponding limiting seat.

Wherein, a temperature sensor is fixedly installed on one side of the inner wall of the water tank, the temperature sensor is electrically connected with a control module, and the control module is electrically connected with a refrigerator.

Wherein, the control module is electrically connected with a power supply module, and the power supply module adopts an external power supply or a battery.

Wherein, the fixing frame adopts the structure of a rectangular body with accommodating cavities open at both ends, and the cooling pipe has a serpentine structure inside the fixing frame.

Wherein, the installation mechanism includes a fixed plate, a groove, a fixed rod, a bolt and a limit ring, a fixed plate is fixedly sleeved on the surface of the heat dissipation box and located outside the casing, and the interior of the fixed plate is located in the heat dissipation box. Both sides of the box are movably plugged with the fixed column, and one end of the fixed column extending to the outside of the fixed plate is movably sleeved with a limit ring, and the inside of the fixed plate is provided with a groove for the limit ring, and the fixed column There is a fixing rod inside, the two ends of the fixing rod pass through the side wall of the fixing column and the side wall of the limit ring in sequence and extend to the outside of the limit ring, and the fixed rod extends to both ends of the outside of the limit ring Bolts are inserted into each thread.

Wherein, the cross-section of the limiting ring has a U-shaped structure, and the groove adopts a rectangular structure.

Wherein, a sealing ring is glued and connected on the top of the fixing plate and located between the heat dissipation box and the fixing column, and the bottom of the casing is provided with a limiting groove adapted to the sealing ring.

beneficial effect

Compared with the prior art, the beneficial effects of the present invention are:

1. The heat-conducting plate absorbs the heat of the semiconductor laser. The heat-conducting plate is made of insulating and heat-conducting materials to avoid mutual interference. Then start the exhaust fan, water pump and refrigerator. The water pump can pump the water inside the water tank into the cooling pipe. , and then flow back to the inside of the water tank from the other end of the cooling pipe, and the water circulating inside the water tank can be cooled by the refrigerator, so as to avoid the temperature being too high and the effect of water cooling cannot be achieved. It is pumped into the interior of the heat dissipation box, and then contacts the cooling pipe for heat exchange, so that the heat-exchanged cold air contacts the heat-conducting plate, which can speed up the cooling speed of the heat-conducting plate. By combining air cooling and water cooling, the semiconductor laser can be rapidly The cooling can effectively prolong the service life of the semiconductor laser.

2. By installing a drying device between the cooling device and the heat-conducting plate, the cold air can be dried. Due to the moisture generated when the air contacts the cooling pipe, the humidity is high and the service life of the semiconductor laser is easily affected. Dry the gas , which can further improve the service life of the semiconductor laser.

3. When the semiconductor laser needs to be repaired and repaired, unscrew the bolt from one end of the fixing rod, and then pull out the fixing rod, so that the fixing rod and the fixing column are separated, repeat the operation on the other side, and then move the shell upward to make the shell The fixing column at the bottom of the body can be detached from the fixing plate, so that the semiconductor laser can be quickly dismantled, which is convenient for the repair and maintenance of the semiconductor laser, and can effectively avoid opening threaded grooves in the fixing column or the inside of the heat sink. The thread groove is easy to cause damage and is not easy to replace.

Description of drawings

Fig. 1 is the overall structure schematic diagram of the present invention;

Fig. 2 is the structural schematic diagram of the cooling device of the present invention;

Fig. 3 is the structural schematic diagram of the drying device of the present invention;

4 is a schematic diagram of the connection structure of the drying device, the cooling device and the heat dissipation box of the present invention;

Fig. 5 is the enlarged schematic diagram of the structure at place A in Fig. 1 of the present invention;

Fig. 6 is the enlarged structural schematic diagram at B in Fig. 1 of the present invention;

FIG. 7 is a schematic diagram of the system structure of the present invention.

In the figure: 1- shell; 2- emission hole; 3- cooling mechanism; 31- cooling box; 32- drying device; 321- drying frame; 322- ventilation hole; 323- desiccant; 324- filter bag; 33- Cooling device; 331-water tank; 332-water supply hole; 333-fixed frame; 334-refrigerator; 335-temperature sensor; 336-water pump; 337-cooling pipe; 34-exhaust fan; 35-limit seat; 36-installation Frame; 37-filter; 38-vent; 4-semiconductor laser; 5-conducting plate; 6-fixing column; 7-installation mechanism; 71-fixing plate; 72-groove; 73-fixing rod; 74-bolt ; 75-limit ring; 8-control module; 9-power supply module.

BEST MODE FOR CARRYING OUT THE INVENTION

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, but not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

Example 1:

1-4, the present invention provides a technical solution: a packaging structure of a semiconductor laser, a casing 1; an emission hole 2, a side of the casing 1 is provided with an emission hole 2; a heat dissipation mechanism 3, the The heat dissipation mechanism 3 includes a heat dissipation box 31, a cooling device 33, an exhaust fan 34, a mounting frame 36, a filter screen 37 and a ventilation hole 38. The bottom of the housing 1 is movably plugged with a heat dissipation box 31. An exhaust fan 34 is fixedly installed at the center of the bottom of the inner wall, and a cooling device 33 is movably plugged into the inner wall of the heat dissipation box 31 and away from the top of the exhaust fan 34, and ventilation holes are opened at the bottom of the side walls on both sides of the heat dissipation box 31. 38. An installation frame 36 is inserted into the internal thread of the ventilation hole 38, and a filter screen 37 is fixedly welded between the inner walls of the installation frame 36; the cooling device 33 includes a water tank 331, a water replenishing hole 332, The fixing frame 333 , the refrigerator 334 , the water pump 336 and the cooling pipe 337 , the fixing frame 333 is fixedly installed on one side of the water tank 331 , and the fixing frame 333 is movably plugged with the cooling box 31 . A cooling pipe 337 is provided inside. Both ends of the cooling pipe 337 penetrate the side wall of the water tank 331 and extend to the interior of the water tank 331. A water pump 336 is fixedly installed on one side of the cooling pipe 337, and the water tank 331 is far away from the water tank 331. One end of the fixing frame 333 is provided with a water replenishing hole 332, a sealing plug is connected to the inside of the water replenishing hole 332, and a refrigerator 334 is fixedly installed on the inner wall of the water tank 331; A heat-conducting plate 5 is connected; the semiconductor laser 4 is fixedly welded with the semiconductor laser 4 on the top surface of the heat-conducting plate 5; 6; the installation mechanism 7, the surface of the heat dissipation box 31 is fixedly installed with the installation mechanism 7 outside the casing 1, the installation mechanism 7 is fixedly installed with the fixing column 6, and the heat conduction plate 5 absorbs the heat of the semiconductor laser 4 , the heat-conducting plate 5 is made of insulating and heat-conducting materials to avoid mutual interference, and then start the exhaust fan 34, the water pump 336 and the refrigerator 334. The water pump 336 can pump the water inside the water tank 331 into the cooling pipe 337, and then start the cooling pipe 337. The other end of the cooling pipe 337 flows back to the inside of the water tank 331 , and the water circulating in the water tank 331 can be cooled by the refrigerator 334 to avoid the temperature being too high and the effect of water cooling cannot be achieved. After filtering, it is pumped into the interior of the heat dissipation box 31, and then contacted with the cooling pipe 337 to exchange heat, so that the cold air after heat exchange is in contact with the heat-conducting plate 5, which can speed up the cooling speed of the heat-conducting plate 5. The semiconductor laser 4 can be rapidly cooled, and the service life of the semiconductor laser 4 can be effectively prolonged.

Embodiments of the present invention

Embodiment 2:

As a preferred solution of the first embodiment, a drying device 32 is fixedly installed on the inner wall of the heat dissipation box 31 and away from the top of the cooling device 33, and the drying device 32 includes a drying frame 321, a ventilation hole 322, a desiccant 323 and a filter A bag 324, the drying frame 321 and the heat dissipation box 31 are movably plugged, the top and bottom of the drying frame 321 are provided with several ventilation holes 322, and the inner wall of the drying frame 321 is bonded and connected with a filter bag 324, The inside of the filter bag 324 is filled with a desiccant 323, and the corresponding position of the drying device 32 and the cooling device 33 on one side of the inner wall of the heat dissipation box 31 is fixed and welded with the corresponding limit seat 35. A drying device 32 is installed between the cooling device 33 and the heat-conducting plate 5, which can dry the cold air. Since the air is in contact with the cooling pipe 337, water vapor is generated, resulting in high humidity, which easily affects the service life of the semiconductor laser 4. Drying can further improve the service life of the semiconductor laser 4 , and the installation stability of the drying device 32 and the cooling device 33 can be increased through the limiting seat 35 .

Embodiment three:

As a preferred solution of the first embodiment, a temperature sensor 335 is fixedly installed on one side of the inner wall of the water tank 331 , the temperature sensor 335 is electrically connected to the control module 8 , and the control module 8 is electrically connected to the refrigerator 334 , the control module 8 is electrically connected with a power supply module 9, the power supply module 9 adopts an external power supply or a battery, and the power supply module 8 provides power for the entire device, and the fixing frame 333 adopts a rectangular shape with accommodating cavities open at both ends. The cooling pipe 337 has a serpentine structure inside the fixed frame 333, and the cooling pipe 337 has a serpentine structure, which can increase the contact area, thereby improving the heat exchange efficiency. The control module 8 may include at least one The circuit including the processor may also be a circuit including at least one single-chip microcomputer, or may be a combination of multiple circuits or chips, as long as the corresponding functions can be realized. It can be understood that for those skilled in the art, the control module 8 can also be a common circuit composed of amplifiers, comparators, triodes, MOS tubes, etc. to achieve corresponding functions in a purely hardware manner, and the temperature sensor 335 can detect the water tank. The temperature of the water inside 31, when the temperature sensor 335 detects that the temperature value inside the water tank 31 is greater than the value set by the control module 8, the control module 8 transmits a signal to the refrigerator 334 to start the refrigerator 334 to start, when the temperature sensor 335 detects When the value of the water temperature inside the water tank 31 is lower than the value set by the control module 8, the control module 8 can transmit a signal to the refrigerator 334, and the refrigerator 334 is turned off, which can effectively prevent the refrigerator 334 from working all the time. of energy saving.

Embodiment 4:

The installation mechanism 7 includes a fixed plate 71, a groove 72, a fixed rod 73, a bolt 74 and a limit ring 75. The surface of the heat dissipation box 31 is located outside the casing 1 and is fixedly sleeved with the fixed plate 71. The inside of the fixed plate 71 is located on both sides of the heat dissipation box 31 and is movably plugged with the fixed column 6 . The groove 72 of the limiting ring 75 is adapted, and the fixing rod 73 is provided inside the fixing column 6. Extending to the outside of the limit ring 75 , bolts 74 are threadedly inserted at both ends of the fixing rod 73 extending to the outside of the limit ring 75 , the cross-section of the limit ring 75 is a U-shaped structure, and the concave The groove 72 adopts a rectangular structure, the top of the fixed plate 71 is located between the heat dissipation box 31 and the fixed column 6 and is bonded and connected with a sealing ring, and the bottom of the housing 1 is provided with a sealing ring to match. The limit groove can improve the sealing performance and avoid the entry of dust. When the semiconductor laser 4 needs to be repaired, repaired, replaced with a drying device, or when the water tank 331 is replenished with water, the bolt 74 is unscrewed from one end of the fixing rod 73, and then the fixing rod is screwed out. 73 is pulled out, so that the fixing rod 73 is separated from the fixing column 6, and the operation is repeated on the other side, and then the casing 1 is moved upward, so that the fixing column 6 at the bottom of the casing 1 can be separated from the fixing plate 71, so that the semiconductor laser 4 can be carried out. The quick removal is convenient for the repair and maintenance of the semiconductor laser 4, and can effectively avoid the problem of opening threaded grooves in the interior of the fixing column 6 or the heat dissipation box 31.

Working principle: When in use, the heat-conducting plate 5 absorbs the heat of the semiconductor laser 4, and the heat-conducting plate 5 is made of insulating and heat-conducting materials to avoid mutual interference, and then starts the exhaust fan 34, the water pump 336 and the refrigerator 334, and the water pump 336 can be used. The water in the water tank 331 is pumped into the cooling pipe 337, and then flows back to the water tank 331 from the other end of the cooling pipe 337. The water circulating in the water tank 331 can be cooled by the refrigerator 334 to avoid the temperature being too high. The effect of water cooling cannot be achieved. The exhaust fan 34 filters the external air through the filter screen 37 and then draws it into the interior of the heat dissipation box 31, and then contacts the cooling pipe 337 for heat exchange, so that the heat-exchanged cold air is dried by the drying device 32. Contact with the heat-conducting plate 5 can speed up the cooling speed of the heat-conducting plate 5 . By combining air cooling and water cooling, the semiconductor laser 4 can be rapidly cooled, which can effectively prolong the service life of the semiconductor laser 4 .

It should be noted that, in this document, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any relationship between these entities or operations. any such actual relationship or sequence exists. Moreover, the terms "comprising", "comprising" or any other variation thereof are intended to encompass a non-exclusive inclusion such that a process, method, article or device that includes a list of elements includes not only those elements, but also includes not explicitly listed or other elements inherent to such a process, method, article or apparatus.

Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, and substitutions can be made in these embodiments without departing from the principle and spirit of the invention and modifications, the scope of the present invention is defined by the appended claims and their equivalents.

Claims

A packaging structure for a semiconductor laser, characterized in that it includes:

shell(1);

a launch hole (2), a launch hole (2) is opened on one side of the casing (1);

a heat dissipation mechanism (3), the heat dissipation mechanism (3) includes a heat dissipation box (31), a cooling device (33), an exhaust fan (34), a mounting frame (36), a filter screen (37) and a ventilation hole (38), A heat dissipation box (31) is movably plugged into the bottom of the housing (1), and an exhaust fan (34) is fixedly installed at the center of the bottom of the inner wall of the heat dissipation box (31). A cooling device (33) is movably plugged into the top away from the exhaust fan (34), and ventilation holes (38) are opened at the bottoms of the side walls on both sides of the heat dissipation box (31). An installation frame (36) is threadedly inserted, and a filter screen (37) is fixedly welded between the inner walls of the installation frame (36);

A cooling device (33), the cooling device (33) includes a water tank (331), a water replenishing hole (332), a fixing frame (333), a refrigerator (334), a water pump (336) and a cooling pipe (337), the A fixing frame (333) is fixedly installed on one side of the water tank (331), the fixing frame (333) is movably plugged with the cooling box (31), and a cooling pipe (337) is arranged inside the fixing frame (333). ), both ends of the cooling pipe (337) penetrate the side wall of the water tank (331) and extend to the interior of the water tank (331), and a water pump (336) is fixedly installed in one side of the cooling pipe (337), A water replenishing hole (332) is opened at one end of the water tank (331) away from the fixing frame (333), a sealing plug is fitted inside the water replenishing hole (332), and a refrigerator is fixedly installed on the inner wall of the water tank (331). (334);

a heat-conducting plate (5), a heat-conducting plate (5) is fixedly inserted on the top of the heat-dissipating box (31);

a semiconductor laser (4), a semiconductor laser (4) is fixedly welded on the top surface of the heat-conducting plate (5);

a fixing column (6), the bottom of the casing (1) and on both sides of the heat dissipation box (31) are fixedly welded with fixing columns (6);

An installation mechanism (7) is fixedly installed on the surface of the heat dissipation box (31) and located outside the casing (1), and the installation mechanism (7) is fixedly installed with the fixing column (6).
A semiconductor laser packaging structure according to claim 1, characterized in that: a drying device (32) is fixedly installed on the inner wall of the heat dissipation box (31) and away from the top of the cooling device (33), and the drying device (32) includes a drying frame (321), ventilation holes (322), a desiccant (323) and a filter bag (324), the drying frame (321) and the heat dissipation box (31) are movably plugged, and the drying The top and bottom of the frame (321) are provided with several ventilation holes (322), the inner wall of the drying frame (321) is bonded and connected with a filter bag (324), and the interior of the filter bag (324) is filled with a desiccant (323).
The packaging structure of a semiconductor laser according to claim 1, characterized in that: the positions corresponding to the drying device (32) and the cooling device (33) on one side of the inner wall of the heat dissipation box (31) are fixedly welded with The corresponding limit seat (35).
A semiconductor laser packaging structure according to claim 1, characterized in that: a temperature sensor (335) is fixedly installed on one side of the inner wall of the water tank (331), and the temperature sensor (335) is electrically connected with a control A module (8), the control module (8) is electrically connected with a refrigerator (334).
A semiconductor laser packaging structure according to claim 4, characterized in that: the control module (8) is electrically connected with a power supply module (9), and the power supply module (9) adopts an external power supply or a battery.
The packaging structure of a semiconductor laser according to claim 1, characterized in that: the fixing frame (333) adopts the structure of a rectangular body with accommodating cavities open at both ends, and the cooling pipe (337) is in the The interior of the fixed frame (333) is a serpentine structure.
A semiconductor laser packaging structure according to claim 1, characterized in that: the mounting mechanism (7) comprises a fixing plate (71), a groove (72), a fixing rod (73), a bolt (74) and The limiting ring (75) is fixedly sleeved with a fixing plate (71) on the surface of the heat dissipation box (31) and located outside the casing (1), and the fixing plate (71) is inside and located in the heat dissipation box (31). ) is movably plugged with the fixing column (6), and the end of the fixing column (6) extending to the outside of the fixing plate (71) is movably sleeved with the limiting ring (75), and the inner part of the fixing plate (71) A groove (72) adapted to the limiting ring (75) is provided, a fixing rod (73) is arranged inside the fixing column (6), and both ends of the fixing rod (73) pass through the fixing column (6) in turn. ) and the side wall of the limit ring (75) and extend to the outside of the limit ring (75), and both ends of the fixing rod (73) extending to the outside of the limit ring (75) are threadedly plugged with Bolt (74).
The packaging structure of a semiconductor laser according to claim 7, characterized in that: the cross-section of the limiting ring (75) is a U-shaped structure, and the groove (72) adopts a rectangular structure.
A semiconductor laser packaging structure according to claim 7, characterized in that: a sealing ring is bonded and connected on the top of the fixing plate (71) and between the heat dissipation box (31) and the fixing column (6), And the bottom of the casing (1) is provided with a limiting groove which is adapted to the sealing ring.