WO2022082421A1 - Spliceable detector array, imaging system and imaging method - Google Patents

Spliceable detector array, imaging system and imaging method Download PDF

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Publication number
WO2022082421A1
WO2022082421A1 PCT/CN2020/122133 CN2020122133W WO2022082421A1 WO 2022082421 A1 WO2022082421 A1 WO 2022082421A1 CN 2020122133 W CN2020122133 W CN 2020122133W WO 2022082421 A1 WO2022082421 A1 WO 2022082421A1
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flat panel
panel detector
detector
cover plate
imaging
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PCT/CN2020/122133
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French (fr)
Chinese (zh)
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凌骏
符夏颖
刘建强
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江苏康众数字医疗科技股份有限公司
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Priority to PCT/CN2020/122133 priority Critical patent/WO2022082421A1/en
Publication of WO2022082421A1 publication Critical patent/WO2022082421A1/en

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    • AHUMAN NECESSITIES
    • A61MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61BDIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B6/00Apparatus for radiation diagnosis, e.g. combined with radiation therapy equipment
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01TMEASUREMENT OF NUCLEAR OR X-RADIATION
    • G01T1/00Measuring X-radiation, gamma radiation, corpuscular radiation, or cosmic radiation
    • G01T1/16Measuring radiation intensity

Definitions

  • the invention relates to the field of detector imaging, in particular to a splicable detector array, an imaging system and an imaging method.
  • a digital flat panel detector is a key component in a digital X-ray imaging system.
  • the flat panel detector converts information-carrying X-rays into digital signals that can be detected and expressed.
  • a flat-panel detector In order to obtain a larger imaging area, in the prior art, a flat-panel detector is usually used for multiple exposures by changing the position, and imaging cannot be formed by a single exposure.
  • the present invention provides a splicable detector array, an imaging system and an imaging method.
  • the specific technical solutions are as follows:
  • a splicable detector array comprising at least a first flat panel detector and a second flat panel detector, wherein the first flat panel detector and the second flat panel detector each include an upper cover plate, a lower cover plate and an imaging part and a circuit board arranged between the upper cover plate and the lower cover plate, the circuit board is electrically connected to the imaging part, the imaging part is used for converting the ray signal into a charge signal, and the circuit board converts the charge The signal is converted into a digital signal;
  • the first flat panel detector has a first inclined side surface inclined inward from the upper cover plate to the lower cover plate
  • the second flat panel detector has a second inclined side surface inclined outward from the upper cover plate to the lower cover plate
  • the imaging part of the second flat panel detector is arranged in an area opposite to the upper cover plate and an area opposite to the second inclined side surface
  • the first oblique side surface of the first flat panel detector is spliced with the second oblique side surface of the second flat panel detector, so that the imaging part of the first flat panel detector and the imaging part of the second flat panel detector are at the splicing place Partially set up and down.
  • each flat panel detector in the array has at least one first inclined side surface inclined inward from the upper cover plate to the lower cover plate and at least one second inclined side surface inclined outward from the upper cover plate to the lower cover plate.
  • the inclination angles of the first oblique side and the second oblique side on the same flat panel detector are complementary angles to each other, and/or the first oblique side of the first flat panel detector and the second flat panel detector
  • the inclination angles of the second inclined sides are complementary angles to each other.
  • the upper cover plate and the lower cover plate of the flat panel detector are both N-shaped, and the flat panel detector further includes n1 first inclined sides and n2 second inclined sides, wherein n1 and/or n2 are A positive integer, N is a positive integer greater than or equal to 3, and the sum of n1 and n2 is less than or equal to N.
  • each flat panel detector in the array there are contacts and/or sensors for communicating with the adjacent flat panel detectors.
  • each flat panel detector in the array is made of a material capable of penetrating radiation.
  • a detector array for three-dimensional imaging comprising a plurality of flat panel detectors arranged vertically, and an optical machine for emitting rays can be arranged between adjacent flat panel detectors, so that each optical machine After the beam is emitted, it is imaged on the corresponding flat panel detector on the opposite side.
  • an imaging system which includes a radiation source, an imaging display unit and the above-mentioned splicable detector array.
  • the radiation emitted by the radiation source is directed to the upper cover plate of the flat panel detector in the array, so the The imaging display unit is electrically connected to all or part of the circuit boards of the flat panel detectors, and each flat panel detector follows a sequence to perform synchronous work.
  • an imaging method based on the splicable detector array as described above comprising the following steps:
  • step S4 After obtaining the first stitched image in step S4, it also includes the following steps:
  • step S3 includes: using SIFT algorithm to extract feature points from the first image and the second image, using feature vectors to describe the feature points, and then calculating the distance between the feature vectors to realize the feature matching, the distance between the feature vectors is Euclidean distance, Hamming distance or cosine distance.
  • the entire detector array can be operated and imaged as a single detector.
  • Several flat panel detectors work together, and on the application side, it looks like they are operating a detector with a larger imaging area;
  • the appropriate detector splicing method can be flexibly selected according to the application scenario, the system adaptability is enhanced, and the spliced detector array can increase the imaging area;
  • the imaging areas of the spliced flat-panel detectors have overlapping projections at the splicing point, and seamless splicing can be achieved through image processing.
  • FIG. 1 is a partially enlarged schematic diagram of a splicable detector array provided by an embodiment of the present invention
  • FIG. 2 is a schematic diagram of a single structure of a flat panel detector provided by an embodiment of the present invention.
  • FIG. 3 is a schematic diagram of a splicing state of three flat panel detectors that are spliced in a forward direction provided by an embodiment of the present invention
  • FIG. 4 is a schematic diagram of splicing of a detector array for three-dimensional imaging according to an embodiment of the present invention.
  • the reference numerals include: 1-upper cover plate, 2-imaging part, 3-circuit board, 4-support frame, 5-lower cover plate, 6-flat panel detector, 61-first flat panel detector, 611- The first inclined side, 62 - the second flat panel detector, 621 - the second inclined side.
  • a splicable detector array includes at least a first flat panel detector 61 and a second flat panel detector 62.
  • the first flat panel Both the detector 61 and the second flat panel detector 62 include an upper cover plate 1, a lower cover plate 5, an imaging part 2, a support frame 4 and a circuit board 3 arranged between the upper cover plate 1 and the lower cover plate 5, a support frame 4 and a circuit board 3.
  • the upper cover 1 of each of the flat panel detectors 6 is made of a material capable of penetrating rays.
  • the upper cover 1 is made of an X-ray highly transparent material (this
  • the support frame 4 is used to support the imaging part 2, the circuit board 3 is optionally mounted on the support frame 4, and the support frame 4 adopts snap connection or bonding or locking parts (such as screws, screws or bolts) to be fixed on the inner wall of the detector, or, the support frame 4 can be integrally formed with the inner wall of the detector; the circuit board 3 is installed on the support frame 4
  • the specific location is not limited, the circuit board 3 is electrically connected with the imaging part 2, the imaging part 2 is used to convert the ray signal into a charge signal, and the circuit board 3 converts the charge signal into a digital signal, to achieve the above
  • the technology of converting the ray signal into the charge signal includes but is not limited to the indirect conversion technology of amorphous silicon or the direct conversion technology of amorphous selenium;
  • the first flat panel detector 61 has a first inclined side surface 611 inclined inward from the upper cover plate 1 of the first flat panel detector 61 to the lower cover plate 5
  • the second flat panel detector 62 has a detection surface from the second flat panel detector 61 .
  • the first inclined side 611 of the first flat panel detector 61 and the second flat panel detector 62 The inclination angles of the second inclined side surfaces 621 are complementary angles to each other; the imaging part 2 of the second flat panel detector 62 has a flexible substrate. Since the imaging part 2 is a flexible structure, the second flat panel detector 62 The imaging part 2 can extend from the upper cover plate 1 to the second inclined side 621 , so that imaging can be performed on both the horizontal plane and the inclined plane.
  • the first inclined side 611 and the first inclined side of the second flat panel detector 62 are also made of materials that can penetrate rays; it should be noted that the flexible structure of the imaging portion 2 is only a preferred embodiment.
  • the second flat panel detector The imaging part 2 of 62 may include a first part arranged opposite to the upper cover 1 and a second part arranged opposite to the second inclined side surface 621, and the technical scheme of splicing these two parts of the imaging part 2 can be used as a flexible structure.
  • the present invention claims protection regardless of whether the imaging portion 2 of the detector is a flexible structure.
  • the first oblique side surface 611 of the first flat panel detector 61 is spliced with the second oblique side surface 621 of the second flat panel detector 62, so that the imaging part 2 of the first flat panel detector 61 and the second flat panel detector 61 are connected to each other.
  • the imaging part 2 of the 62 is partially set up and down at the splicing part, and "partially set up and down” should be understood as the imaging part 2 of the first flat panel detector 61 and the imaging part 2 of the second flat panel detector 62 are located at the splicing part.
  • the lower cover 5 The projections on the image have overlapping parts for seamless stitching of subsequent image stitching.
  • the thickness of the X-ray photon absorbing material of the imaging part 2 (such as the scintillator that converts X-rays into visible light in the indirect conversion technology of amorphous silicon) at the main plane and extending to the inclined plane can be adjusted, so that The sensitivities of the main plane and the inclined plane are basically the same, which improves the uniformity of the images obtained on the main plane and the inclined plane.
  • the specific thickness adjustment data can be obtained through experiments.
  • FIG. 2 shows one of the flat panel detectors 6 in the detector array.
  • each flat panel detector 6 in the array has at least one inward inclination from the upper cover plate 1 to the lower cover plate 5
  • the angles are set to be complementary angles to each other, which can be set on opposite sides as shown in Figure 2.
  • One of the positive splicing methods of the multiple flat panel detectors 6 is shown in Figure 3.
  • the flat panel detectors can also be set.
  • the upper cover plate and the lower cover plate are both N-sided, and the flat panel detector further includes n1 (integer) first inclined sides and n2 (integer) second inclined sides, wherein n1 and/or n2 are positive integers, That is, n1 and n2 may not be zero at the same time.
  • n1 and/or n2 are positive integers, That is, n1 and n2 may not be zero at the same time.
  • one flat panel detector 6 only has the first inclined side, and the other flat panel detector 6 only has the second inclined side. Then the two flat panel detectors 6 can be spliced.
  • Both n1 and n2 may be non-zero; N is a positive integer greater than or equal to 3, and the sum of n1 and n2 is less than or equal to N, that is, the present invention does not limit each surface to be an oblique side, where n1 may be equal to n2, It can also be different.
  • the first oblique side 611 and the second oblique side 621 on the same detector can be arranged on the adjacent side or on the non-adjacent side (not shown), and the present invention is not limited to the array.
  • Different flat panel detectors have the same shape and size, for example, a detector array (not shown) can be obtained by splicing regular octagons and squares.
  • the present invention does not limit the inclination angles of the first oblique side surface 611 and the second oblique side surface 621 (that is, the angle between the oblique side surface and the horizontal plane) to be complementary angles to each other.
  • the part of the part 2 extending to the second inclined side 621 can be partially overlapped with the projection of the imaging part 2 of the first flat panel detector 61, even if the first inclined side 611 and the second inclined side 621
  • the angle of inclination that is, the angle between the inclined side and the horizontal plane
  • this structure should also be considered to fall within the protection scope claimed by the present invention.
  • a detector array for three-dimensional imaging is provided, which is used in a static CT application scenario.
  • the detector array includes a plurality of vertically arranged flat panel detectors 6 , an optical machine for emitting rays can be arranged between adjacent flat panel detectors 6 , so that each optical machine is imaged on the corresponding flat panel detector 6 on the opposite side after emitting a beam.
  • the five flat panel detectors 6 may form a circle, the first inclined side 611 on any one flat panel detector 6 is spliced with the second inclined side 621 on the adjacent flat panel detector 6, and any one flat panel detector 6
  • the second oblique side surface 621 on the upper panel is spliced with the first oblique side surface 611 on the adjacent flat panel detector 6, as shown in FIG.
  • the optomechanical between the detectors 1 and 2 is imaged on the detector 4 after the beam is emitted, and the detectors 2 and 3 are imaged. After the optical-mechanical beam between No. 3 and No. 4 is beamed out, it will be imaged on the detector 5, the optical-mechanical beam between the No.
  • 3 and No. 4 detectors will be imaged on the No. 1 detector, the light between the No. 4 and No. 5 detectors.
  • the X-ray machine After the X-ray machine is out of the beam, it will be imaged on the detector 2, and the optical machine between the detectors of 5 and 1 will be imaged on the detector of 3 after the beam is out.
  • the detectors work together, i.e. acquire images simultaneously, and the imaging on the last five detectors can be used for 3D reconstruction.
  • the present invention does not limit the specific number of detectors in the three-dimensional detector array.
  • the X-ray machine is in ping-pong mode, that is, only one X-ray machine emits light at a certain time, and then the X-ray machine emits light in sequence, and the detectors opposite the light-emitting machine must take pictures.
  • other detectors may not necessarily It has to work together, and even if they are synchronised, they are only collecting scattered rays.
  • an imaging system including a radiation source, an imaging display unit and the above-mentioned splicable detector array, the radiation emitted by the radiation source is directed to the flat panel detector 6 in the array
  • the imaging display unit is electrically connected to the circuit board 3 of all or part of the flat panel detectors 6; /or the second inclined side surface 621 is provided with contacts and/or sensors for communicating with the adjacent flat panel detectors 6, so that each flat panel detector 6 operates synchronously according to a sequence.
  • the functions of the physical contacts and/or sensors include at least the following two aspects:
  • the positional relationship between the spliced flat panel detectors 6 can be determined to determine the splicing mode of their respective imaging (the images collected by each of the flat panel detectors 6 can be corresponding to the relative positions of the flat panel detectors 6 . splicing);
  • the imaging unit 2 Based on the imaging principle as described above, the imaging unit 2 outputs a charge signal converted from visible light, and the charge signal is converted into a digital signal by the circuit board 3 and then displayed by the imaging display unit.
  • a central timing control unit can be set up, and under the control of the central timing control unit, each of the flat panel detectors of the detector array follows a time sequence (referred to as timing sequence) for synchronous work.
  • the images collected by the flat panel detector can be time-series marked by the circuit board.
  • the timing sequence of the flat panel detectors of the detector array can interact with the external timing sequence through the central timing control unit and the so-called single interface.
  • the imaging display unit may be electrically connected to the circuit board 3 of only one of the flat panel detectors 6 (become the master detector) (the other flat panel detectors 6 become slave detectors, all communicate with the main detector), obviously, it can also be electrically connected to the circuit boards 3 of a plurality of or even all of the flat panel detectors 6 .
  • an imaging method based on the above-mentioned splicable detector array comprising the following steps:
  • the positional relationship between the left and right splicing of the first flat panel detector and the second flat panel detector can be known.
  • the first image information and the second image information are also spliced according to the positional relationship of left and right splicing, because the imaging areas of the respective imaging parts 2 of the first flat panel detector and the second flat panel detector overlap in projection (Refer to the above for details), therefore, the first image information obtained by imaging and the second image information have the same image features at the splicing position, and the same image feature area should be a strip parallel to the oblique side of the detector.
  • the width depends on the width of the overlapping area on the projection.
  • Image feature matching can use conventional image recognition algorithms in the prior art, for example, using SIFT (Scale Invariance Feature Transform, scale invariant feature transform) algorithm to extract key points (or feature points, corner points) from the image, using mathematical The vector describes the feature points, and then the distance between the feature vectors (such as Euclidean distance, Hamming distance, and cosine distance) is calculated to realize feature matching.
  • SIFT Scale Invariance Feature Transform, scale invariant feature transform
  • the vector describes the feature points, and then the distance between the feature vectors (such as Euclidean distance, Hamming distance, and cosine distance) is calculated to realize feature matching.
  • the present invention does not specifically limit the specific algorithm of image feature matching to be the SIFT algorithm.
  • ORB Oriented Fast and Rotated Brief
  • the direct splicing of the first image information and the second image information will lead to repeated imaging at the splicing place (that is, the image of the first feature matching area that exists in both the first image information and the second image information)
  • the above two The purpose of the splicing method is to remove an extra piece of image information, that is, the image information of the first feature matching area, from the simple and directly spliced image.
  • the imaging method can perform the following steps after obtaining the first spliced image information according to S4:

Abstract

A spliceable detector array, an imaging system, and an imaging method. The detector array at least comprises a first flat panel detector (61) and a second flat panel detector (62); the first flat panel detector (61) and the second flat panel detector (62) each comprise an upper cover plate (1), a lower cover plate (5), and an imaging portion (2) and a circuit board (3) which are arranged between the upper cover plate (1) and the lower cover plate (5), wherein the circuit board (3) is electrically connected to the imaging portion (2), the imaging portion (2) converts a ray signal into a charge signal, and the circuit board (3) converts the charge signal into a digital signal; the first flat panel detector (61) has a first inclined side face (611) that is inwardly inclined from the upper cover plate (1) to the lower cover plate (5), the second flat panel detector (62) has a second inclined side face (621) that is outwardly inclined from the upper cover plate (1) to the lower cover plate (5), the imaging portion (2) of the second flat panel detector (62) is provided with a flexible substrate, and the imaging portion (2) of the second flat panel detector extends from the upper cover plate (1) to the second inclined side face (621); and the two flat panel detectors are spliced in a forward direction, such that the imaging portions (2) of the two flat panel detectors are arranged up and down at the splicing part of the two inclined side faces.

Description

可拼接探测器阵列、成像系统及成像方法Stitchable detector array, imaging system and imaging method 技术领域technical field
本发明涉及探测器成像领域,特别涉及一种可拼接探测器阵列、成像系统及成像方法。The invention relates to the field of detector imaging, in particular to a splicable detector array, an imaging system and an imaging method.
背景技术Background technique
数字平板探测器是数字化X射线成像系统中的关键部件,在数字化X射线成像系统中,平板探测器将携带信息的X射线转化成可被检测并表达的数字信号。A digital flat panel detector is a key component in a digital X-ray imaging system. In a digital X-ray imaging system, the flat panel detector converts information-carrying X-rays into digital signals that can be detected and expressed.
当前市场上的数字化X射线平板探测器大多数为独立工作的个体,探测器与探测器之间除了进行数据传输和共享,没有其它协同工作的功能。所谓协同工作,是指在不改变原先接口和同步机制的前提下,若干台探测器拼接后联合工作,在应用端看起来就好像是在操作一块成像面积更大的探测器。Most of the digital X-ray flat panel detectors currently on the market are individuals that work independently. Except for data transmission and sharing, there is no other function of cooperation between the detectors. The so-called cooperative work refers to the joint work of several detectors after splicing without changing the original interface and synchronization mechanism. On the application side, it seems as if they are operating a detector with a larger imaging area.
为了获得较大的成像区域,现有技术中通常采用一块平板探测器变换位置多次曝光的方式,无法一次曝光成像。In order to obtain a larger imaging area, in the prior art, a flat-panel detector is usually used for multiple exposures by changing the position, and imaging cannot be formed by a single exposure.
发明内容SUMMARY OF THE INVENTION
为了克服现有技术存在的不足,本发明提供一种可拼接探测器阵列、成像系统及成像方法,具体技术方案如下:In order to overcome the deficiencies in the prior art, the present invention provides a splicable detector array, an imaging system and an imaging method. The specific technical solutions are as follows:
一方面,公开了一种可拼接探测器阵列,至少包括第一平板探测器和第二平板探测器,所述第一平板探测器和第二平板探测器均包括上盖板、下盖板以及设置在上盖板与下盖板之间的成像部和电路板,所述电路板与所述成像部电连接,所述成像部用于将射线信号转换为电荷信号,所述电路板将电荷信号转化为数字信号;In one aspect, a splicable detector array is disclosed, comprising at least a first flat panel detector and a second flat panel detector, wherein the first flat panel detector and the second flat panel detector each include an upper cover plate, a lower cover plate and an imaging part and a circuit board arranged between the upper cover plate and the lower cover plate, the circuit board is electrically connected to the imaging part, the imaging part is used for converting the ray signal into a charge signal, and the circuit board converts the charge The signal is converted into a digital signal;
所述第一平板探测器具有自上盖板向下盖板向内倾斜的第一斜侧面,所述第二平板探测器具有自上盖板向下盖板向外倾斜的第二斜侧面,所述第二平板 探测器的成像部设置在与所述上盖板相对的区域及与所述第二斜侧面相对的区域;The first flat panel detector has a first inclined side surface inclined inward from the upper cover plate to the lower cover plate, and the second flat panel detector has a second inclined side surface inclined outward from the upper cover plate to the lower cover plate, The imaging part of the second flat panel detector is arranged in an area opposite to the upper cover plate and an area opposite to the second inclined side surface;
所述第一平板探测器的第一斜侧面与所述第二平板探测器的第二斜侧面拼接,使所述第一平板探测器的成像部与第二平板探测器的成像部在拼接处部分上下设置。The first oblique side surface of the first flat panel detector is spliced with the second oblique side surface of the second flat panel detector, so that the imaging part of the first flat panel detector and the imaging part of the second flat panel detector are at the splicing place Partially set up and down.
进一步地,阵列中的每一个平板探测器均具有至少一个自上盖板向下盖板向内倾斜的第一斜侧面和至少一个自上盖板向下盖板向外倾斜的第二斜侧面。Further, each flat panel detector in the array has at least one first inclined side surface inclined inward from the upper cover plate to the lower cover plate and at least one second inclined side surface inclined outward from the upper cover plate to the lower cover plate. .
进一步地,同一个平板探测器上的第一斜侧面和第二斜侧面的倾斜角度互为补角,及/或所述第一平板探测器的第一斜侧面与所述第二平板探测器的第二斜侧面的倾斜角度互为补角。Further, the inclination angles of the first oblique side and the second oblique side on the same flat panel detector are complementary angles to each other, and/or the first oblique side of the first flat panel detector and the second flat panel detector The inclination angles of the second inclined sides are complementary angles to each other.
进一步地,所述平板探测器的上盖板和下盖板均为N边形,所述平板探测器还包括n1个第一斜侧面和n2个第二斜侧面,其中n1和/或n2为正整数,N为大于或者等于3的正整数,且n1与n2之和小于或等于N。Further, the upper cover plate and the lower cover plate of the flat panel detector are both N-shaped, and the flat panel detector further includes n1 first inclined sides and n2 second inclined sides, wherein n1 and/or n2 are A positive integer, N is a positive integer greater than or equal to 3, and the sum of n1 and n2 is less than or equal to N.
进一步地,阵列中的每一个平板探测器的第一斜侧面和/或第二斜侧面上设有用于与相邻的平板探测器进行通信的触点和/或传感器。Further, on the first inclined side and/or the second inclined side of each flat panel detector in the array, there are contacts and/or sensors for communicating with the adjacent flat panel detectors.
进一步地,阵列中的每一个平板探测器的上盖板由能够使射线穿透的材质制成。Further, the upper cover of each flat panel detector in the array is made of a material capable of penetrating radiation.
另一方面,公开了一种用于三维成像的探测器阵列,包括多个竖立设置的平板探测器,相邻的平板探测器之间能够设置用于发出射线的光机,使得每个光机出束后在对面对应的平板探测器上成像。In another aspect, a detector array for three-dimensional imaging is disclosed, comprising a plurality of flat panel detectors arranged vertically, and an optical machine for emitting rays can be arranged between adjacent flat panel detectors, so that each optical machine After the beam is emitted, it is imaged on the corresponding flat panel detector on the opposite side.
另一方面,公开了一种成像系统,包括射线源、成像显示单元及如上所述的可拼接探测器阵列,所述射线源发出的射线射向阵列中的平板探测器的上盖板,所述成像显示单元与全部或部分平板探测器的电路板电连接,每个平板探测器均遵循一个时序进行同步工作。On the other hand, an imaging system is disclosed, which includes a radiation source, an imaging display unit and the above-mentioned splicable detector array. The radiation emitted by the radiation source is directed to the upper cover plate of the flat panel detector in the array, so the The imaging display unit is electrically connected to all or part of the circuit boards of the flat panel detectors, and each flat panel detector follows a sequence to perform synchronous work.
再一方面,公开了一种基于如上所述的可拼接探测器阵列的成像方法,包括以下步骤:In yet another aspect, an imaging method based on the splicable detector array as described above is disclosed, comprising the following steps:
S1、正向拼接探测器阵列中的第一平板探测器和第二平板探测器,打开射线源,所述射线源射向两个平板探测器的上盖板;S1, splicing the first flat-panel detector and the second flat-panel detector in the detector array in a forward direction, and turning on the ray source, the ray source is directed to the upper cover plates of the two flat-panel detectors;
S2、利用所述第一平板探测器获取第一图像信息,利用所述第二平板探测 器获取第二图像信息;S2, using the first flat-panel detector to obtain first image information, and using the second flat-panel detector to obtain second image information;
S3、对所述第一图像信息与第二图像信息进行图像特征匹配,获得第一特征匹配区域;S3, performing image feature matching on the first image information and the second image information to obtain a first feature matching area;
S4、将所述第一图像信息去除所述第一特征匹配区域的剩余部分与所述第二图像信息进行拼接,或者,将所述第二图像信息去除所述第一特征匹配区域的剩余部分与所述第一图像信息进行拼接,得到第一拼接图像。S4, splicing the remaining part of the first feature matching area from the first image information and splicing the second image information, or removing the remaining part of the first feature matching area from the second image information Perform splicing with the first image information to obtain a first spliced image.
进一步地,在步骤S4得到第一拼接图像后,还包括以下步骤:Further, after obtaining the first stitched image in step S4, it also includes the following steps:
S5、利用探测器阵列中的第三平板探测器获取第三图像信息,其中,所述第三平板探测器与第二平板探测器正向拼接;S5. Obtain third image information by using a third flat panel detector in the detector array, wherein the third flat panel detector and the second flat panel detector are spliced in a forward direction;
S6、对所述第三图像信息与所述第一拼接图像信息进行图像特征匹配,获得第二特征匹配区域;S6, performing image feature matching on the third image information and the first stitched image information to obtain a second feature matching area;
S7、将所述第一拼接图像信息去除所述第二特征匹配区域的剩余部分与所述第三图像信息进行拼接,或者,将所述第三图像信息去除所述第二特征匹配区域的剩余部分与所述第一拼接图像信息进行拼接,得到第二拼接图像。S7, splicing the remaining part of the second feature matching area from the first spliced image information and splicing the third image information, or removing the third image information from the remaining part of the second feature matching area Part is spliced with the first spliced image information to obtain a second spliced image.
进一步地,步骤S3包括:利用SIFT算法从第一图像和第二图像中提取出特征点,利用特征向量对所述特征点进行描述,再对所述特征向量之间的距离进行计算来实现特征匹配,所述特征向量之间的距离为欧氏距离、汉明距离或余弦距离。Further, step S3 includes: using SIFT algorithm to extract feature points from the first image and the second image, using feature vectors to describe the feature points, and then calculating the distance between the feature vectors to realize the feature matching, the distance between the feature vectors is Euclidean distance, Hamming distance or cosine distance.
本发明的技术方案带来的有益效果包括:The beneficial effects brought by the technical solution of the present invention include:
(a)整个探测器阵列可以作为一台探测器进行操作和取图,若干台平板探测器联合工作,在应用端看起来就好像是在操作一块成像面积更大的探测器;(a) The entire detector array can be operated and imaged as a single detector. Several flat panel detectors work together, and on the application side, it looks like they are operating a detector with a larger imaging area;
(b)可以根据应用场景灵活选择合适的探测器拼接方式,系统适应性增强,拼接后的探测器阵列可以增加成像面积区域;(b) The appropriate detector splicing method can be flexibly selected according to the application scenario, the system adaptability is enhanced, and the spliced detector array can increase the imaging area;
(c)拼接的平板探测器的成像区域在拼接处投影有重合,通过图像处理可以实现无缝拼接。(c) The imaging areas of the spliced flat-panel detectors have overlapping projections at the splicing point, and seamless splicing can be achieved through image processing.
附图说明Description of drawings
为了更清楚地说明本发明实施例中的技术方案,下面将对实施例描述中所需要使用的附图作简单地介绍,显而易见地,下面描述中的附图仅仅是本发明 的一些实施例,对于本领域普通技术人员来讲,在不付出创造性劳动的前提下,还可以根据这些附图获得其他的附图。In order to illustrate the technical solutions in the embodiments of the present invention more clearly, the following briefly introduces the accompanying drawings used in the description of the embodiments. Obviously, the accompanying drawings in the following description are only some embodiments of the present invention. For those of ordinary skill in the art, other drawings can also be obtained from these drawings without creative effort.
图1是本发明实施例提供的可拼接探测器阵列的部分放大示意图;1 is a partially enlarged schematic diagram of a splicable detector array provided by an embodiment of the present invention;
图2是本发明实施例提供的平板探测器的单体结构示意图;2 is a schematic diagram of a single structure of a flat panel detector provided by an embodiment of the present invention;
图3是本发明实施例提供的正向拼接的三个平板探测器的拼接状态示意图;3 is a schematic diagram of a splicing state of three flat panel detectors that are spliced in a forward direction provided by an embodiment of the present invention;
图4是本发明实施例提供的用于三维成像的探测器阵列的拼接示意图。FIG. 4 is a schematic diagram of splicing of a detector array for three-dimensional imaging according to an embodiment of the present invention.
其中,附图标记包括:1-上盖板,2-成像部,3-电路板,4-支撑框架,5-下盖板,6-平板探测器,61-第一平板探测器,611-第一斜侧面,62-第二平板探测器,621-第二斜侧面。Wherein, the reference numerals include: 1-upper cover plate, 2-imaging part, 3-circuit board, 4-support frame, 5-lower cover plate, 6-flat panel detector, 61-first flat panel detector, 611- The first inclined side, 62 - the second flat panel detector, 621 - the second inclined side.
具体实施方式Detailed ways
为了使本技术领域的人员更好地理解本发明方案,更清楚地了解本发明的目的、技术方案及其优点,以下结合具体实施例并参照附图对本发明实施例中的技术方案进行清楚、完整的描述。显然,所描述的实施例仅仅是本发明一部分的实施例,而不是全部的实施例。基于本发明中的实施例,本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例,都应当属于本发明保护的范围。除此,本发明的说明书和权利要求书中的术语“包括”和“具有”以及他们的任何变形,意图在于覆盖不排他的包含,例如,包含了一系列步骤或单元的过程、方法、装置、产品或设备不必限于清楚地列出的那些步骤或单元,而是可包括没有清楚地列出的或对于这些过程、方法、产品或设备固有的其它步骤或单元。In order to make those skilled in the art better understand the solution of the present invention, and more clearly understand the purpose, technical solution and advantages of the present invention, the technical solutions in the embodiments of the present invention will be clarified below in conjunction with specific embodiments and with reference to the accompanying drawings. full description. Obviously, the described embodiments are only some, but not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention. In addition, the terms "comprising" and "having" and any variations thereof in the description and claims of the present invention are intended to cover non-exclusive inclusion, for example, a process, method, device comprising a series of steps or units , products or devices are not necessarily limited to those steps or units expressly listed, but may include other steps or units not expressly listed or inherent to these processes, methods, products or devices.
在本发明的一个实施例中,提供了一种可拼接探测器阵列,参见图1,所述探测器阵列包括至少包括第一平板探测器61和第二平板探测器62,所述第一平板探测器61和第二平板探测器62均包括上盖板1、下盖板5以及设置在上盖板1与下盖板5之间的成像部2、支撑框架4和电路板3,阵列中的每一个平板探测器6的上盖板1由能够使射线穿透的材质制成,以X射线为例进行说明,在本实施例中所述上盖板1采用X射线高透材料(此为现有技术)制成;所述支撑框架4用于支撑所述成像部2,所述电路板3可选地安装在所述支撑框架4上,所述支撑框架4采用卡接或粘接或锁紧件(比如螺丝、螺钉或螺栓)的方式固定在探测器的内壁上,或者,所述支撑框架4可以与探测器的内壁一体成型; 对所述电路板3安装在支撑框架4上的具体位置不作限定,所述电路板3与所述成像部2电连接,所述成像部2用于将射线信号转换为电荷信号,所述电路板3将电荷信号转化为数字信号,实现以上将射线信号转换为电荷信号的技术包括但不限于非晶硅间接转换技术或者非晶硒直接转换技术;In one embodiment of the present invention, a splicable detector array is provided. Referring to FIG. 1 , the detector array includes at least a first flat panel detector 61 and a second flat panel detector 62. The first flat panel Both the detector 61 and the second flat panel detector 62 include an upper cover plate 1, a lower cover plate 5, an imaging part 2, a support frame 4 and a circuit board 3 arranged between the upper cover plate 1 and the lower cover plate 5, a support frame 4 and a circuit board 3. The upper cover 1 of each of the flat panel detectors 6 is made of a material capable of penetrating rays. Taking X-rays as an example, in this embodiment, the upper cover 1 is made of an X-ray highly transparent material (this The support frame 4 is used to support the imaging part 2, the circuit board 3 is optionally mounted on the support frame 4, and the support frame 4 adopts snap connection or bonding or locking parts (such as screws, screws or bolts) to be fixed on the inner wall of the detector, or, the support frame 4 can be integrally formed with the inner wall of the detector; the circuit board 3 is installed on the support frame 4 The specific location is not limited, the circuit board 3 is electrically connected with the imaging part 2, the imaging part 2 is used to convert the ray signal into a charge signal, and the circuit board 3 converts the charge signal into a digital signal, to achieve the above The technology of converting the ray signal into the charge signal includes but is not limited to the indirect conversion technology of amorphous silicon or the direct conversion technology of amorphous selenium;
所述第一平板探测器61具有自第一平板探测器61的上盖板1向下盖板5向内倾斜的第一斜侧面611,所述第二平板探测器62具有自第二平板探测器62的上盖板1向下盖板5向外倾斜的第二斜侧面621,在本实施例中所述第一平板探测器61的第一斜侧面611与所述第二平板探测器62的第二斜侧面621的倾斜角度互为补角;所述第二平板探测器62的成像部2具有柔性基板,由于所述成像部2为柔性结构,因此所述第二平板探测器62的成像部2能够由所述上盖板1延伸至所述第二斜侧面621,使得在水平面和斜面上均可以成像,显然,至少所述第二平板探测器62的第一斜侧面611和第二斜侧面621同样采用能够使射线穿透的材质制成;需要说明的是,上述成像部2为柔性结构仅为优选实施例,在本发明的一个实施例中,所述第二平板探测器62的成像部2可以包括与其上盖板1相对设置的第一部分及与所述第二斜侧面621相对设置的第二部分,上述成像部2的这两个部分拼接的技术方案可以作为柔性结构的成像部2的替代方案,无论探测器的成像部2是否为柔性结构,本发明均主张要求保护。The first flat panel detector 61 has a first inclined side surface 611 inclined inward from the upper cover plate 1 of the first flat panel detector 61 to the lower cover plate 5 , and the second flat panel detector 62 has a detection surface from the second flat panel detector 61 . In this embodiment, the first inclined side 611 of the first flat panel detector 61 and the second flat panel detector 62 The inclination angles of the second inclined side surfaces 621 are complementary angles to each other; the imaging part 2 of the second flat panel detector 62 has a flexible substrate. Since the imaging part 2 is a flexible structure, the second flat panel detector 62 The imaging part 2 can extend from the upper cover plate 1 to the second inclined side 621 , so that imaging can be performed on both the horizontal plane and the inclined plane. Obviously, at least the first inclined side 611 and the first inclined side of the second flat panel detector 62 . The two inclined sides 621 are also made of materials that can penetrate rays; it should be noted that the flexible structure of the imaging portion 2 is only a preferred embodiment. In an embodiment of the present invention, the second flat panel detector The imaging part 2 of 62 may include a first part arranged opposite to the upper cover 1 and a second part arranged opposite to the second inclined side surface 621, and the technical scheme of splicing these two parts of the imaging part 2 can be used as a flexible structure. As an alternative to the imaging portion 2 of the detector, the present invention claims protection regardless of whether the imaging portion 2 of the detector is a flexible structure.
所述第一平板探测器61的第一斜侧面611与所述第二平板探测器62的第二斜侧面621拼接,使所述第一平板探测器61的成像部2与第二平板探测器62的成像部2在拼接处部分上下设置,“部分上下设置”应当理解为所述第一平板探测器61的成像部2与第二平板探测器62的成像部2在拼接处在下盖板5上的投影具有重合部分,以实现后续图像拼接的无缝拼接。同时,作为预补偿机制,可以调节成像部2的X光光子吸收材质(例如非晶硅间接转换技术中将X光转换为可见光的闪烁体)在主平面处和延伸至斜面处的厚度,使得主平面和斜面的灵敏度基本一致,提高在上述主平面和斜面获取到的图像的均匀性,具体的厚度调节数据可以通过实验得到。The first oblique side surface 611 of the first flat panel detector 61 is spliced with the second oblique side surface 621 of the second flat panel detector 62, so that the imaging part 2 of the first flat panel detector 61 and the second flat panel detector 61 are connected to each other. The imaging part 2 of the 62 is partially set up and down at the splicing part, and "partially set up and down" should be understood as the imaging part 2 of the first flat panel detector 61 and the imaging part 2 of the second flat panel detector 62 are located at the splicing part. The lower cover 5 The projections on the image have overlapping parts for seamless stitching of subsequent image stitching. At the same time, as a pre-compensation mechanism, the thickness of the X-ray photon absorbing material of the imaging part 2 (such as the scintillator that converts X-rays into visible light in the indirect conversion technology of amorphous silicon) at the main plane and extending to the inclined plane can be adjusted, so that The sensitivities of the main plane and the inclined plane are basically the same, which improves the uniformity of the images obtained on the main plane and the inclined plane. The specific thickness adjustment data can be obtained through experiments.
图2为探测器阵列中的其中一块平板探测器6,在本发明的一个实施例中,阵列中的每一块平板探测器6均具有至少一个自上盖板1向下盖板5向内倾斜的第一斜侧面611和至少一个自上盖板1向下盖板5向外倾斜的第二斜侧面621, 同一个平板探测器6上的第一斜侧面611和第二斜侧面621的倾斜角度设置为互为补角,可以如图2所示设置在相对侧,多块平板探测器6的其中一种正向拼接方式如图3所示,除此也可以设置所述平板探测器的上盖板和下盖板均为N边形,所述平板探测器还包括n1(整数)个第一斜侧面和n2(整数)个第二斜侧面,其中n1和/或n2为正整数,即n1和n2可以不同时为零,比如一个平板探测器6只具有第一斜侧面,另一个平板探测器6只具有第二斜侧面,那么这两个平板探测器6可以进行拼接,显然,n1和n2可以均不为零;N为大于或者等于3的正整数,且n1与n2之和小于或等于N,即本发明不限定每个面均为斜侧面,其中n1可以与n2相等,也可以不等,同一个探测器上的第一斜侧面611和第二斜侧面621可以设置在相邻侧,也可以设置在非相邻侧(未图示),本发明也不限定阵列中的不同平板探测器具有相同的形状和大小,比如可以采用正八边形与正方形拼接得到探测器阵列(未图示)。FIG. 2 shows one of the flat panel detectors 6 in the detector array. In one embodiment of the present invention, each flat panel detector 6 in the array has at least one inward inclination from the upper cover plate 1 to the lower cover plate 5 The first inclined side 611 and at least one second inclined side 621 inclined outward from the upper cover 1 to the lower cover 5, the inclination of the first inclined side 611 and the second inclined side 621 on the same flat panel detector 6 The angles are set to be complementary angles to each other, which can be set on opposite sides as shown in Figure 2. One of the positive splicing methods of the multiple flat panel detectors 6 is shown in Figure 3. In addition, the flat panel detectors can also be set. The upper cover plate and the lower cover plate are both N-sided, and the flat panel detector further includes n1 (integer) first inclined sides and n2 (integer) second inclined sides, wherein n1 and/or n2 are positive integers, That is, n1 and n2 may not be zero at the same time. For example, one flat panel detector 6 only has the first inclined side, and the other flat panel detector 6 only has the second inclined side. Then the two flat panel detectors 6 can be spliced. Obviously, Both n1 and n2 may be non-zero; N is a positive integer greater than or equal to 3, and the sum of n1 and n2 is less than or equal to N, that is, the present invention does not limit each surface to be an oblique side, where n1 may be equal to n2, It can also be different. The first oblique side 611 and the second oblique side 621 on the same detector can be arranged on the adjacent side or on the non-adjacent side (not shown), and the present invention is not limited to the array. Different flat panel detectors have the same shape and size, for example, a detector array (not shown) can be obtained by splicing regular octagons and squares.
需要说明的是,本发明并不限定所述第一斜侧面611和第二斜侧面621的倾斜角度(即斜侧面与水平面的夹角)互为补角,在第二平板探测器62的成像部2延伸至第二斜侧面621的部分能够在投影上与第一平板探测器61的成像部2的投影有部分重叠的前提下,即使所述第一斜侧面611和第二斜侧面621的倾斜角度(即斜侧面与水平面的夹角)不互补,这种结构应当认为同样落入本发明要求的保护范围。It should be noted that the present invention does not limit the inclination angles of the first oblique side surface 611 and the second oblique side surface 621 (that is, the angle between the oblique side surface and the horizontal plane) to be complementary angles to each other. The part of the part 2 extending to the second inclined side 621 can be partially overlapped with the projection of the imaging part 2 of the first flat panel detector 61, even if the first inclined side 611 and the second inclined side 621 The angle of inclination (that is, the angle between the inclined side and the horizontal plane) is not complementary, and this structure should also be considered to fall within the protection scope claimed by the present invention.
在本发明的一个实施例中,提供了一种用于三维成像的探测器阵列,用于静态CT应用场景,如图4所示,所述探测器阵列包括多个竖立设置的平板探测器6,相邻的平板探测器6之间能够设置用于发出射线的光机,使得每个光机出束后在对面对应的平板探测器6上成像。In an embodiment of the present invention, a detector array for three-dimensional imaging is provided, which is used in a static CT application scenario. As shown in FIG. 4 , the detector array includes a plurality of vertically arranged flat panel detectors 6 , an optical machine for emitting rays can be arranged between adjacent flat panel detectors 6 , so that each optical machine is imaged on the corresponding flat panel detector 6 on the opposite side after emitting a beam.
具体地,五个平板探测器6可以围成一圈,任意一个平板探测器6上的第一斜侧面611与相邻平板探测器6上的第二斜侧面621拼接,任意一个平板探测器6上的第二斜侧面621与相邻平板探测器6上的第一斜侧面611拼接,如图4所示,依次分别编号为①-⑤号,待成像对象置于中间区域,每相邻的两个平板探测器6之间均设有一个光机(未图示),①号和②号探测器之间的光机出束后在④号探测器上成像,②号和③号探测器之间的光机出束后在⑤号探测器上成像,③号和④号探测器之间的光机出束后在①号探测器上成像,④号和 ⑤号探测器之间的光机出束后在②号探测器上成像,⑤号和①号探测器之间的光机在出束后在③号探测器上成像,如果所有的X光机同时出光,三维阵列中的所有探测器协同工作,即同步采图,最后五个探测器上的成像可用于三维重建。显然,本发明并不限定三维探测器阵列中探测器的具体数量。如果X光机是ping-pong模式,即某一个时刻只能一个X光机出光,然后X光机顺序出光,出光光机对面的探测器必须采图,这种情况下,其它探测器不一定必须协同工作,即使协同同步采图,也只是采集散射线。Specifically, the five flat panel detectors 6 may form a circle, the first inclined side 611 on any one flat panel detector 6 is spliced with the second inclined side 621 on the adjacent flat panel detector 6, and any one flat panel detector 6 The second oblique side surface 621 on the upper panel is spliced with the first oblique side surface 611 on the adjacent flat panel detector 6, as shown in FIG. There is an optomechanical (not shown) between the two flat panel detectors 6. The optomechanical between the detectors ① and ② is imaged on the detector ④ after the beam is emitted, and the detectors ② and ③ are imaged. After the optical-mechanical beam between No. 3 and No. ④ is beamed out, it will be imaged on the detector ⑤, the optical-mechanical beam between the No. 3 and No. ④ detectors will be imaged on the No. 1 detector, the light between the No. 4 and No. ⑤ detectors. After the X-ray machine is out of the beam, it will be imaged on the detector ②, and the optical machine between the detectors of ⑤ and ① will be imaged on the detector of ③ after the beam is out. The detectors work together, i.e. acquire images simultaneously, and the imaging on the last five detectors can be used for 3D reconstruction. Obviously, the present invention does not limit the specific number of detectors in the three-dimensional detector array. If the X-ray machine is in ping-pong mode, that is, only one X-ray machine emits light at a certain time, and then the X-ray machine emits light in sequence, and the detectors opposite the light-emitting machine must take pictures. In this case, other detectors may not necessarily It has to work together, and even if they are synchronised, they are only collecting scattered rays.
在本发明的一个实施例中,提供了一种成像系统,包括射线源、成像显示单元及如上所述的可拼接探测器阵列,所述射线源发出的射线射向阵列中的平板探测器6的上盖板1,所述成像显示单元与全部或部分平板探测器6的电路板3电连接;具体地,在本实施例中阵列中的每一个平板探测器6的第一斜侧面611和/或第二斜侧面621上设有用于与相邻的平板探测器6进行通信的触点和/或传感器,使得每个平板探测器6均遵循一个时序进行同步工作。其中,所述物理触点和/或传感器的作用至少包括以下两方面:In one embodiment of the present invention, an imaging system is provided, including a radiation source, an imaging display unit and the above-mentioned splicable detector array, the radiation emitted by the radiation source is directed to the flat panel detector 6 in the array The imaging display unit is electrically connected to the circuit board 3 of all or part of the flat panel detectors 6; /or the second inclined side surface 621 is provided with contacts and/or sensors for communicating with the adjacent flat panel detectors 6, so that each flat panel detector 6 operates synchronously according to a sequence. Wherein, the functions of the physical contacts and/or sensors include at least the following two aspects:
第一、可以确定拼接的平板探测器6之间的位置关系,以确定各自成像的拼接方式(每台所述的平板探测器6采集到的图像可以根据所述平板探测器6的相对位置相应地进行拼接);First, the positional relationship between the spliced flat panel detectors 6 can be determined to determine the splicing mode of their respective imaging (the images collected by each of the flat panel detectors 6 can be corresponding to the relative positions of the flat panel detectors 6 . splicing);
第二、实现传感器阵列中所有平板探测器6的协同工作,即使所述探测器阵列的每个所述平板探测器均遵循一个时间序列(简称时序)进行同步工作,确保后续拼接的各个成像的同步时序,提高拼接后的成像精度。Second, realize the cooperative work of all the flat panel detectors 6 in the sensor array, even if each flat panel detector of the detector array follows a time sequence (referred to as time sequence) to work synchronously, to ensure that the subsequent splicing of each image is consistent. Synchronize timing to improve imaging accuracy after splicing.
基于如上所述的成像原理,成像部2输出由可见光转化的电荷信号,所述电荷信号由所述电路板3转化为数字信号后,由所述成像显示单元显示。可以设置一个中央时序控制单元,在所述中央时序控制单元的管控下,所述探测器阵列的每个所述平板探测器均遵循一个时间序列(简称时序)进行同步工作,相应地,每台所述平板探测器采集到的图像可以由所述的电路板标记时序。具体地,所述探测器阵列的所述平板探测器的所述时序可以通过所述中央时序控制单元以及所谓单一接口和外界时序进行交互。在多个平板探测器协同工作的情况下,所述成像显示单元可以仅与其中一个平板探测器6(成为主探测器)的电路板3电连接(其他平板探测器6成为从探测器,均与该主探测器进行通信), 显然,也可以与多个甚至全部平板探测器6的电路板3电连接。Based on the imaging principle as described above, the imaging unit 2 outputs a charge signal converted from visible light, and the charge signal is converted into a digital signal by the circuit board 3 and then displayed by the imaging display unit. A central timing control unit can be set up, and under the control of the central timing control unit, each of the flat panel detectors of the detector array follows a time sequence (referred to as timing sequence) for synchronous work. The images collected by the flat panel detector can be time-series marked by the circuit board. Specifically, the timing sequence of the flat panel detectors of the detector array can interact with the external timing sequence through the central timing control unit and the so-called single interface. In the case where multiple flat panel detectors work together, the imaging display unit may be electrically connected to the circuit board 3 of only one of the flat panel detectors 6 (become the master detector) (the other flat panel detectors 6 become slave detectors, all communicate with the main detector), obviously, it can also be electrically connected to the circuit boards 3 of a plurality of or even all of the flat panel detectors 6 .
所述探测器阵列中探测器的特征及拼接方式如上述实施例所述,通过引用的方式将上述实施例中关于探测器阵列的结构特征和阵列拼接方式并入本成像系统实施例,而不再赘述。The features and splicing methods of the detectors in the detector array are as described in the above-mentioned embodiments, and the structural features and array splicing methods of the detector arrays in the above-mentioned embodiments are incorporated into this imaging system embodiment by reference, instead of Repeat.
需要说明的是,上文所述的电连接均应当认为既包含有线电连接方式,又包含无线电连接方式。It should be noted that the electrical connection described above should be considered to include both wired electrical connection and wireless connection.
在本发明的一个实施例中,提供了一种基于如上所述的可拼接探测器阵列的成像方法,包括以下步骤:In one embodiment of the present invention, there is provided an imaging method based on the above-mentioned splicable detector array, comprising the following steps:
S1、正向拼接探测器阵列中的第一平板探测器和第二平板探测器(具体探测器的结构和拼接方式参见上述实施例,在此不再赘述),打开射线源,所述射线源射向两个平板探测器的上盖板。S1. Forward splicing of the first flat panel detector and the second flat panel detector in the detector array (for the specific structure and splicing method of the detectors, refer to the above-mentioned embodiment, which will not be repeated here), turn on the ray source, and the ray source Shoots towards the top cover of the two flat panel detectors.
S2、利用所述第一平板探测器获取第一图像信息,利用所述第二平板探测器获取第二图像信息。S2. Use the first flat panel detector to acquire first image information, and use the second flat panel detector to acquire second image information.
S3、对所述第一图像信息与第二图像信息进行图像特征匹配,获得第一特征匹配区域。S3. Perform image feature matching on the first image information and the second image information to obtain a first feature matching area.
具体地,在所述第一平板探测器和第二平板探测器通过侧面物理触点或传感器进行通信的情况下,可以得知比如第一平板探测器和第二平板探测器左右拼接的位置关系,相应地,所述第一图像信息与第二图像信息同样按照左右拼接的位置关系进行拼接,由于第一平板探测器与第二平板探测器的各自成像部2的成像区域在投影上有重叠(具体参见上述),因此,成像得到的第一图像信息与第二图像信息在拼接位置处存在相同的图像特征,该相同的图像特征区域应该是与探测器的斜侧面平行的条状,条宽取决于投影上重叠区域的宽度。图像特征匹配可采用现有技术中常规的图像识别算法,比如,利用SIFT(Scale Invariance Feature Transform,尺度不变特征变换)算法从图像中提取出关键点(或特征点、角点),利用数学向量对特征点进行描述,再对特征向量之间的距离(比如欧氏距离、汉明距离、余弦距离)进行计算来实现特征匹配,本发明具体不限定图像特征匹配的具体算法为SIFT算法,像其他公知的ORB(Oriented Fast and RotatedBrief)算法、基于灰度匹配的方法等等。Specifically, when the first flat panel detector and the second flat panel detector communicate through side physical contacts or sensors, for example, the positional relationship between the left and right splicing of the first flat panel detector and the second flat panel detector can be known. , correspondingly, the first image information and the second image information are also spliced according to the positional relationship of left and right splicing, because the imaging areas of the respective imaging parts 2 of the first flat panel detector and the second flat panel detector overlap in projection (Refer to the above for details), therefore, the first image information obtained by imaging and the second image information have the same image features at the splicing position, and the same image feature area should be a strip parallel to the oblique side of the detector. The width depends on the width of the overlapping area on the projection. Image feature matching can use conventional image recognition algorithms in the prior art, for example, using SIFT (Scale Invariance Feature Transform, scale invariant feature transform) algorithm to extract key points (or feature points, corner points) from the image, using mathematical The vector describes the feature points, and then the distance between the feature vectors (such as Euclidean distance, Hamming distance, and cosine distance) is calculated to realize feature matching. The present invention does not specifically limit the specific algorithm of image feature matching to be the SIFT algorithm. Like other well-known ORB (Oriented Fast and Rotated Brief) algorithms, methods based on grayscale matching, and so on.
S4、将所述第一图像信息去除所述第一特征匹配区域的剩余部分与所述第 二图像信息进行拼接,或者,将所述第二图像信息去除所述第一特征匹配区域的剩余部分与所述第一图像信息进行拼接,得到第一拼接图像。S4, splicing the remaining part of the first feature matching area from the first image information and splicing the second image information, or removing the remaining part of the first feature matching area from the second image information Perform splicing with the first image information to obtain a first spliced image.
因为第一图像信息和第二图像信息直接拼接会导致在拼接处出现重复的成像(即第一图像信息和第二图像信息中均存在的所述第一特征匹配区域的图像),以上两种拼接方式目的都是从简单直接拼接图像中去除多余的一份图像信息,即第一特征匹配区域的图像信息。Because the direct splicing of the first image information and the second image information will lead to repeated imaging at the splicing place (that is, the image of the first feature matching area that exists in both the first image information and the second image information), the above two The purpose of the splicing method is to remove an extra piece of image information, that is, the image information of the first feature matching area, from the simple and directly spliced image.
以上为两块探测器拼接对应的图像成像方法,对于三块探测器拼接的探测器阵列,其成像方法在根据S4得到所述第一拼接图像信息后,可以进行以下步骤:The above is an image imaging method corresponding to the splicing of two detectors. For a detector array spliced with three detectors, the imaging method can perform the following steps after obtaining the first spliced image information according to S4:
S5、利用探测器阵列中的第三平板探测器获取第三图像信息,其中,所述第三平板探测器与第二平板探测器正向拼接;S5. Obtain third image information by using a third flat panel detector in the detector array, wherein the third flat panel detector and the second flat panel detector are spliced in a forward direction;
S6、对所述第三图像信息与所述第一拼接图像信息进行图像特征匹配,获得第二特征匹配区域;S6, performing image feature matching on the third image information and the first stitched image information to obtain a second feature matching area;
S7、将所述第一拼接图像信息去除所述第二特征匹配区域的剩余部分与所述第三图像信息进行拼接,或者,将所述第三图像信息去除所述第二特征匹配区域的剩余部分与所述第一拼接图像信息进行拼接,得到第二拼接图像,得到第二拼接图像信息的具体方法同理于S4。S7, splicing the remaining part of the second feature matching area from the first spliced image information and splicing the third image information, or removing the third image information from the remaining part of the second feature matching area Part is spliced with the first spliced image information to obtain a second spliced image, and the specific method for obtaining the second spliced image information is the same as S4.
对于四块以上探测器拼接的探测器阵列,同理于上,反复执行已经拼接的图像与未拼接的的探测器成像的特征匹配(参见S3)及去重拼接(参见S4)即可。显然,探测器阵列的各个探测器的时序同步是必须的,尤其是针对被成像体为非静止对象的情况下,必须确保各探测器成的局部图像为同一时间形成的。For a detector array with more than four detectors spliced, in the same way as above, feature matching (see S3) and de-duplication stitching (see S4) between the stitched image and the unstitched detector imaging can be performed repeatedly. Obviously, timing synchronization of each detector of the detector array is necessary, especially when the imaged object is a non-stationary object, it must be ensured that the partial images formed by each detector are formed at the same time.
以上所述仅为本发明的较佳实施例,并不用以限制本发明,凡在本发明的精神和原则之内,所作的任何修改、等同替换、改进等,均应包含在本发明的保护范围之内。The above descriptions are only preferred embodiments of the present invention, and are not intended to limit the present invention. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection of the present invention. within the range.

Claims (10)

  1. 一种可拼接探测器阵列,其特征在于,至少包括第一平板探测器(61)和第二平板探测器(62),所述第一平板探测器(61)和第二平板探测器(62)均包括上盖板(1)、下盖板(5)以及设置在上盖板(1)与下盖板(5)之间的成像部(2)和电路板(3),所述电路板(3)与所述成像部(2)电连接,所述成像部(2)用于将射线信号转换为电荷信号,所述电路板(3)将电荷信号转化为数字信号;A splicable detector array, characterized in that it comprises at least a first flat panel detector (61) and a second flat panel detector (62), the first flat panel detector (61) and the second flat panel detector (62) ) each includes an upper cover plate (1), a lower cover plate (5), an imaging part (2) and a circuit board (3) arranged between the upper cover plate (1) and the lower cover plate (5), the circuit The board (3) is electrically connected to the imaging part (2), the imaging part (2) is used for converting the ray signal into a charge signal, and the circuit board (3) converts the charge signal into a digital signal;
    所述第一平板探测器(61)具有自上盖板(1)向下盖板(5)向内倾斜的第一斜侧面(611),所述第二平板探测器(62)具有自上盖板(1)向下盖板(5)向外倾斜的第二斜侧面(621),所述第二平板探测器(62)的成像部(2)设置在与所述上盖板(1)相对的区域及与所述第二斜侧面(621)相对的区域;The first flat panel detector (61) has a first inclined side surface (611) inclined inward from the upper cover plate (1) to the lower cover plate (5), and the second flat panel detector (62) has an upward The cover plate (1) has a second inclined side surface (621) of the lower cover plate (5) inclined outward, and the imaging part (2) of the second flat panel detector (62) is arranged on the upper cover plate (1) ) opposite area and the area opposite to the second inclined side surface (621);
    所述第一平板探测器(61)的第一斜侧面(611)与所述第二平板探测器(62)的第二斜侧面(621)拼接,使所述第一平板探测器(61)的成像部(2)与第二平板探测器(62)的成像部(2)在拼接处部分上下设置。The first oblique side surface (611) of the first flat panel detector (61) is spliced with the second oblique side surface (621) of the second flat panel detector (62), so that the first flat panel detector (61) The imaging part (2) of the second flat panel detector (62) and the imaging part (2) of the second flat panel detector (62) are partially arranged up and down at the splicing part.
  2. 根据权利要求1所述的可拼接探测器阵列,其特征在于,阵列中的每一个平板探测器(6)均具有至少一个自上盖板(1)向下盖板(5)向内倾斜的第一斜侧面(611)和至少一个自上盖板(1)向下盖板(5)向外倾斜的第二斜侧面(621)。The splicable detector array according to claim 1, characterized in that, each flat panel detector (6) in the array has at least one inwardly inclined from the upper cover plate (1) to the lower cover plate (5). A first inclined side surface (611) and at least one second inclined side surface (621) inclined outward from the upper cover plate (1) to the lower cover plate (5).
  3. 根据权利要求2所述的可拼接探测器阵列,其特征在于,同一个平板探测器(6)上的第一斜侧面(611)和第二斜侧面(621)的倾斜角度互为补角,及/或所述第一平板探测器(61)的第一斜侧面(611)与所述第二平板探测器(62)的第二斜侧面(621)的倾斜角度互为补角。The splicable detector array according to claim 2, wherein the inclination angles of the first oblique side surface (611) and the second oblique side surface (621) on the same flat panel detector (6) are complementary angles to each other, And/or the inclination angles of the first inclined side surface (611) of the first flat panel detector (61) and the second inclined side surface (621) of the second flat panel detector (62) are complementary angles to each other.
  4. 根据权利要求2所述的可拼接探测器阵列,其特征在于,所述平板探测器(6)的上盖板(1)和下盖板(5)均为N边形,所述平板探测器(6) 还包括n1个第一斜侧面(611)和n2个第二斜侧面(621),其中n1和/或n2为正整数,N为大于或者等于3的正整数,且n1与n2之和小于或等于N。The splicable detector array according to claim 2, wherein the upper cover plate (1) and the lower cover plate (5) of the flat panel detector (6) are both N-sided, and the flat panel detector (6) It also includes n1 first inclined sides (611) and n2 second inclined sides (621), wherein n1 and/or n2 are positive integers, N is a positive integer greater than or equal to 3, and the difference between n1 and n2 and less than or equal to N.
  5. 根据权利要求1所述的可拼接探测器阵列,其特征在于,阵列中的每一个平板探测器(6)的第一斜侧面(611)和/或第二斜侧面(621)上设有用于与相邻的平板探测器(6)进行通信的触点和/或传感器。The splicable detector array according to claim 1, characterized in that, the first inclined side (611) and/or the second inclined side (621) of each flat panel detector (6) in the array is provided with a Contacts and/or sensors that communicate with adjacent flat panel detectors (6).
  6. 一种用于三维成像的探测器阵列,其特征在于,包括多个竖立设置的平板探测器(6),相邻的平板探测器(6)之间能够设置用于发出射线的光机,使得每个光机出束后在对面对应的平板探测器(6)上成像。A detector array for three-dimensional imaging, characterized in that it comprises a plurality of flat panel detectors (6) arranged vertically, and an optical machine for emitting rays can be arranged between adjacent flat panel detectors (6), so that After each optical machine emits a beam, an image is formed on the corresponding flat panel detector (6) on the opposite side.
  7. 一种成像系统,其特征在于,包括射线源、成像显示单元及如权利要求1-6中任意一项所述的探测器阵列,所述射线源发出的射线射向阵列中的平板探测器(6)的上盖板(1),所述成像显示单元与全部或部分平板探测器(6)的电路板(3)电连接,每个平板探测器(6)均遵循一个时序进行同步工作。An imaging system, characterized in that it comprises a radiation source, an imaging display unit, and the detector array according to any one of claims 1-6, wherein the radiation emitted by the radiation source is directed to a flat panel detector ( 6) The upper cover plate (1), the imaging display unit is electrically connected to all or part of the circuit boards (3) of the flat panel detectors (6), and each flat panel detector (6) operates synchronously according to a sequence.
  8. 一种基于如权利要求1所述的可拼接探测器阵列的成像方法,其特征在于,包括以下步骤:An imaging method based on the splicable detector array as claimed in claim 1, characterized in that it comprises the following steps:
    S1、正向拼接探测器阵列中的第一平板探测器和第二平板探测器,打开射线源,所述射线源射向两个平板探测器的上盖板;S1, splicing the first flat-panel detector and the second flat-panel detector in the detector array in a forward direction, and turning on the ray source, the ray source is directed to the upper cover plates of the two flat-panel detectors;
    S2、利用所述第一平板探测器获取第一图像信息,利用所述第二平板探测器获取第二图像信息;S2, using the first flat panel detector to acquire first image information, and using the second flat panel detector to acquire second image information;
    S3、对所述第一图像信息与第二图像信息进行图像特征匹配,获得第一特征匹配区域;S3, performing image feature matching on the first image information and the second image information to obtain a first feature matching area;
    S4、将所述第一图像信息去除所述第一特征匹配区域的剩余部分与所述第二图像信息进行拼接,或者,将所述第二图像信息去除所述第一特征匹配区域的剩余部分与所述第一图像信息进行拼接,得到第一拼接图像。S4, splicing the remaining part of the first feature matching area from the first image information and splicing the second image information, or removing the remaining part of the first feature matching area from the second image information Perform splicing with the first image information to obtain a first spliced image.
  9. 根据权利要求8所述的成像方法,其特征在于,在步骤S4得到第一拼接图像后,还包括以下步骤:The imaging method according to claim 8, characterized in that, after obtaining the first stitched image in step S4, it further comprises the following steps:
    S5、利用探测器阵列中的第三平板探测器获取第三图像信息,其中,所述第三平板探测器与第二平板探测器正向拼接;S5. Obtain third image information by using a third flat panel detector in the detector array, wherein the third flat panel detector and the second flat panel detector are spliced in a forward direction;
    S6、对所述第三图像信息与所述第一拼接图像信息进行图像特征匹配,获得第二特征匹配区域;S6, performing image feature matching on the third image information and the first stitched image information to obtain a second feature matching area;
    S7、将所述第一拼接图像信息去除所述第二特征匹配区域的剩余部分与所述第三图像信息进行拼接,或者,将所述第三图像信息去除所述第二特征匹配区域的剩余部分与所述第一拼接图像信息进行拼接,得到第二拼接图像。S7, splicing the remaining part of the second feature matching area from the first spliced image information and splicing the third image information, or removing the third image information from the remaining part of the second feature matching area Part is spliced with the first spliced image information to obtain a second spliced image.
  10. 根据权利要求8所述的成像方法,其特征在于,步骤S3包括:利用SIFT算法从第一图像和第二图像中提取出特征点,利用特征向量对所述特征点进行描述,再对所述特征向量之间的距离进行计算来实现特征匹配,所述特征向量之间的距离为欧氏距离、汉明距离或余弦距离。The imaging method according to claim 8, wherein step S3 comprises: extracting feature points from the first image and the second image by using a SIFT algorithm, describing the feature points by using a feature vector, and then describing the feature points by using a feature vector. The distance between feature vectors is calculated to realize feature matching, and the distance between the feature vectors is Euclidean distance, Hamming distance or cosine distance.
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