WO2022073396A1

WO2022073396A1 - Electronic device and display module

Info

Publication number: WO2022073396A1
Application number: PCT/CN2021/115068
Authority: WO
Inventors: 张健民
Original assignee: Oppo广东移动通信有限公司
Priority date: 2020-10-10
Filing date: 2021-08-27
Publication date: 2022-04-14
Also published as: CN112233609A

Abstract

An electronic device ( 100 ) and a display module ( 20 ), which relate to the technical field of displays. The display module ( 20 ) comprises a plurality of pixel units ( 21 ) and a drive circuit, wherein each of the pixel units ( 21 ) comprises a first sub-pixel ( 211 ), a second sub-pixel ( 212 ), a third sub-pixel ( 213 ) and a fourth sub-pixel ( 214 ); the first sub-pixel ( 211 ), the second sub-pixel ( 212 ), the third sub-pixel ( 213 ) and the fourth sub-pixel ( 214 ) are arranged in a matrix; the third sub-pixel ( 213 ) and the fourth sub-pixel ( 214 ) are both blue sub-pixels, and the emission amount of harmful blue light of the fourth sub-pixel ( 214 ) is lower than the emission amount of harmful blue light of the third sub-pixel ( 213 ); and the third sub-pixel ( 213 ) and the fourth sub-pixel ( 214 ) are respectively configured to be separately controlled by the drive circuit so as to emit light or turn off. A fourth sub-pixel ( 214 ) is added to an existing pixel structure, and the fourth sub-pixel ( 214 ) is used as a spare sub-pixel for replacing the third sub-pixel ( 213 ) which is also a blue sub-pixel, such that the display module (20 ) uses the fourth sub-pixel ( 214 ) to replace the third sub-pixel ( 213 ) so as to emit light in an eye protection scenario.

Description

Electronic equipment and display modules

【Technical field】

The present application relates to the field of display technology, and in particular, to an electronic device and a display module.

【Background technique】

Filtering blue light to protect the eyes is one of the urgent issues to be solved in the display industry. At present, the blue light intensity of the LCD display is high and the wavelength is short, which is more harmful to the human eye.

[Content of the invention]

An aspect of the embodiments of the present application provides a display module, including a plurality of pixel units and a driving circuit, the pixel units including a first sub-pixel, a second sub-pixel, a third sub-pixel and a fourth sub-pixel, the The first sub-pixel, the second sub-pixel, the third sub-pixel and the fourth sub-pixel are arranged in a matrix, the third sub-pixel and the fourth sub-pixel are both blue sub-pixels, and The harmful blue light emission amount of the fourth sub-pixel is lower than the harmful blue light emission amount of the third sub-pixel, and the third sub-pixel and the fourth sub-pixel are respectively configured to be individually controlled by the driving circuit to emit light or off.

On the one hand, embodiments of the present application provide a display module, including:

A display module includes a plurality of pixel units and a driving circuit, the pixel units include a first sub-pixel, a second sub-pixel, a third sub-pixel and a fourth sub-pixel, the first sub-pixel, the second sub-pixel The pixel, the third sub-pixel and the fourth sub-pixel are arranged in a matrix, the third sub-pixel and the fourth sub-pixel are both blue sub-pixels, and the fourth sub-pixel emits harmful blue light The amount of harmful blue light emission is lower than that of the third sub-pixel, the color coordinates of the fourth sub-pixel are the same as the color coordinates of the third sub-pixel, and the third sub-pixel and the fourth sub-pixel are respectively The third sub-pixel and the fourth sub-pixel are configured to be individually controlled by the driving circuit to emit light or extinguish, and the third sub-pixel and the fourth sub-pixel are configured to replace the damaged one with the other when one of them is damaged.

Embodiments of the present application further provide an electronic device, including a display screen assembly and a casing assembly, the display screen assembly is mounted on the casing assembly, and the display screen assembly includes a display screen cover and the above-mentioned A display module, wherein the display screen cover is arranged on a side of the display module away from the casing assembly.

【Description of drawings】

In order to illustrate the technical solutions in the embodiments of the present application more clearly, the following briefly introduces the accompanying drawings used in the description of the embodiments. Obviously, the drawings in the following description are only some embodiments of the present application. For those of ordinary skill in the art, other drawings can also be obtained from these drawings without creative effort.

FIG. 1 discloses a schematic structural diagram of an electronic device in an embodiment of the present application;

FIG. 2 discloses a schematic structural diagram of a display screen assembly in an embodiment of the present application;

3 discloses a schematic diagram of a partial structure of a display module in an embodiment of the present application;

FIG. 4 discloses a partial structural schematic diagram of a display module in an embodiment of the present application;

FIG. 5 discloses a flowchart of a repair method in an embodiment of the present application;

FIG. 6 discloses a schematic structural diagram of a display module in an embodiment of the present application;

7 discloses a schematic structural diagram of a display module after a massive transfer operation in an embodiment of the present application;

FIG. 8 discloses a partial flowchart of a repair method in an embodiment of the present application;

FIG. 9 discloses a schematic structural diagram of a display module in a repairing process according to an embodiment of the present application;

10 discloses a schematic structural diagram of a display module during a repair process in an embodiment of the present application;

FIG. 11 discloses a schematic structural diagram of a display module in a repairing process according to an embodiment of the present application;

12 discloses a schematic structural diagram of a display module during a repair process in an embodiment of the present application;

13 discloses a schematic structural diagram of a repair method in an embodiment of the present application;

FIG. 14 discloses a partial structural schematic diagram of a display module in an embodiment of the present application;

FIG. 15 discloses a partial structural schematic diagram of a display module in an embodiment of the present application;

16 discloses a schematic structural diagram of a display module in an embodiment of the present application;

FIG. 17 discloses a driving circuit diagram for driving two B sub-pixels in an embodiment of the present application;

FIG. 18 discloses a partial structural schematic diagram of a display module in an embodiment of the present application;

FIG. 19 discloses a partial structural schematic diagram of a display module in an embodiment of the present application;

FIG. 20 discloses a partial structural schematic diagram of a display module in an embodiment of the present application;

FIG. 21 discloses a schematic structural diagram of a pixel unit in an embodiment of the present application;

FIG. 22 discloses a schematic structural diagram of a pixel unit in an embodiment of the present application;

23 and 24 respectively disclose a partial structural schematic diagram of a display screen assembly in an embodiment of the present application;

FIG. 25 discloses a schematic diagram of wiring and control of the Micro LED in the pixel unit according to an embodiment of the present application.

【Detailed ways】

The present application will be described in further detail below with reference to the accompanying drawings and embodiments. It is particularly pointed out that the following embodiments are only used to illustrate the present application, but do not limit the scope of the present application. Likewise, the following embodiments are only some of the embodiments of the present application, but not all of the embodiments, and all other embodiments obtained by those of ordinary skill in the art without creative work fall within the protection scope of the present application.

Reference herein to an "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment can be included in at least one embodiment of the present application. The appearance of the phrase in various places in the specification is not necessarily all referring to the same embodiment, nor is it a separate or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein may be combined with other embodiments.

As used herein, "electronic equipment" (which may also be referred to as "terminal" or "mobile terminal" or "electronic device") includes, but is not limited to, being configured to be connected via a wired line (eg, via a public switched telephone network (PSTN). ), digital subscriber line (DSL), digital cable, direct cable connection, and/or another data connection/network) and/or via (eg, for cellular networks, wireless local area networks (WLAN), digital such as DVB-H networks Television network, satellite network, AM-FM broadcast transmitter, and/or another communication terminal's) wireless interface to receive/transmit communication signals. A communication terminal arranged to communicate through a wireless interface may be referred to as a "wireless communication terminal", "wireless terminal" or "mobile terminal". Examples of mobile terminals include, but are not limited to, satellite or cellular telephones; Personal Communication System (PCS) terminals that may combine cellular radio telephones with data processing, fax, and data communication capabilities; may include radio telephones, pagers, Internet/Intranet access , a PDA with a web browser, memo pad, calendar, and/or a global positioning system (GPS) receiver; and conventional laptop and/or palm-sized receivers or other electronic devices including radiotelephone transceivers. A mobile phone is an electronic device equipped with a cellular communication module.

Please refer to FIG. 1 , which discloses a schematic structural diagram of an electronic device in an embodiment of the present application. The electronic device 100 may include a housing assembly 300 and a display screen assembly 600 . The housing assembly 300 is used to carry the display screen assembly 600 . Of course, the housing assembly 300 can also be used to carry electronic components such as a camera module, a battery, a motherboard, a processor, and various types of sensors in the electronic device 100 . Display screen assembly 600 is used to display information. The display screen assembly 600 is mounted on the housing assembly 300 .

In one embodiment, the housing assembly 300 may be a housing-like structure as a whole, and an accommodation space may be provided inside to accommodate electronic components such as a camera module, a battery, a motherboard, a processor, and various types of sensors.

In an embodiment, please refer to FIG. 2 , which discloses a schematic structural diagram of a display screen assembly 600 in an embodiment of the present application. The display screen assembly 600 may include the display screen cover 10 and the display module 20 . Specifically, the display screen cover 10 and the display module 20 are stacked and arranged. The display module 20 is the main structure of the display screen assembly 600 for displaying images. The side of the display module 20 away from the display screen cover 10 is connected to the housing assembly 300 . That is, the display screen cover 10 is covered on the side of the display module 20 away from the casing assembly 300 . The display screen cover 10 is used to transmit the light of the image displayed by the display module 20 . The user can view the image displayed by the display module 20 through the display screen cover 10 .

In one embodiment, the display screen cover 10 may be made of a light-transmitting material such as glass or resin, which is not specifically limited herein. The display screen cover 10 is used to protect the display module 20 and the electronic components inside the electronic device 100 . The display screen cover 10 can prevent the display module 20 from being damaged. The user can view the screen displayed by the display module 20 through the display screen cover 10 . In one embodiment, the display module 20 may be an AMOLED (Active-matrix organic light emitting diode, active matrix organic light emitting diode or active matrix organic light emitting diode) display module, or a Micro LED (miniature light emitting diode). Light-emitting diode) display module, even LCD (Liquid Crystal Display) display module or QLED (Quantum dots Light-emitting Diodes) display module.

Next, it is taken as an example that the display module 20 is a Micro LED display module. Please refer to FIG. 3 , which discloses a partial structural schematic diagram of the display module 20 in an embodiment of the present application. The display module 20 may include pixel units 21 arranged in a matrix. Each pixel unit 21 may be formed by arranging a plurality of sub-pixels in a matrix.

In one embodiment, each pixel unit 21 may include four sub-pixels such as a first sub-pixel 211 , a second sub-pixel 212 , a third sub-pixel 213 and a fourth sub-pixel 214 . The first sub-pixel 211 , the second sub-pixel 212 , the third sub-pixel 213 and the fourth sub-pixel 214 may be arranged in a 2×2 matrix.

The terms "first", "second" and "third" in this application are only used for descriptive purposes, and should not be construed as indicating or implying relative importance or implying the number of indicated technical features. Thus, a feature defined as "first", "second", "third" may expressly or implicitly include at least one of that feature.

In one embodiment, one of the first sub-pixel 211, the second sub-pixel 212, and the third sub-pixel 213 may be an R sub-pixel (red sub-pixel), and one of the other two may be a G sub-pixel ( Green sub-pixel), the remaining one can be B sub-pixel (blue sub-pixel), and the fourth sub-pixel 214 can be one of R sub-pixel, G sub-pixel, B sub-pixel, W sub-pixel (white sub-pixel) one.

In one embodiment, please refer to FIG. 3 , in a 2×2 matrix arrangement, the first sub-pixel 211 and the second sub-pixel 212 are located in the same pixel row, and are located in the same pixel column as the third sub-pixel 213 . The fourth sub-pixel 214 and the second sub-pixel 212 are located in the same pixel column, and are located in the same pixel row as the third sub-pixel 213 .

In an embodiment, please refer to FIG. 3 and FIG. 4 . FIG. 4 discloses a partial structural diagram of the display module 20 in an embodiment of the present application. The first subpixel 211 may be an R subpixel, the second subpixel 212 may be a G subpixel, the third subpixel 213 may be a B subpixel, and the fourth subpixel 214 may be an R subpixel, a G subpixel, and a B subpixel. One of pixel and W sub-pixel. For example, the fourth subpixel 214 may be a W subpixel.

Miniature light-emitting diodes are the core devices for the development of next-generation display technologies and equipment, and the application of the core technology of miniature light-emitting diodes in the display field is facing a major breakthrough. However, there are still many problems in its industrialization, such as: miniaturization and arraying, mass transfer and color conversion of chips, detection and repair, etc., among which mass transfer and repair technology are the key technologies that need to be broken first. Due to the corresponding relationship between the transfer yield and the number of damages to the micro-LEDs, in addition to improving the yield of the mass transfer, improving the repairing ability of the micro-LEDs for damage is the top priority for improving the yield.

Next, a method for repairing a display module is described, which can be used to repair the damaged sub-pixels in the above-mentioned display module 20, by using the fourth sub-pixel 214 to replace other damaged sub-pixels (it can also be said that it cannot be working subpixels). For example, if the first sub-pixel 211 is a damaged sub-pixel, then the fourth sub-pixel 214 is used to replace the first sub-pixel 211 . If none of the other sub-pixels except the fourth sub-pixel 214 in one pixel unit 21 are damaged sub-pixels, that is, the other sub-pixels except the fourth sub-pixel 214 are not damaged or failed. Then, the fourth sub-pixel 214 in the pixel unit 21 may not emit light. For example, the fourth sub-pixel 214 is not energized to work, that is, the fourth sub-pixel 214 is turned off. For example, the fourth sub-pixel 214 is shielded and protected from light.

The repair method does not need to set up redundant circuits, which can reduce the area of the driving circuit, improve the yield rate, and improve the display pixel density; in addition, there is no need for secondary transfer repair (De-bonding (removing the micro LED die from the display module 20). process) process, cleaning process, Bonding (the process of fixing the micro LED die on the display module 20) process, etc.), which simplifies the repair process, greatly improves the massive repair efficiency of the micro LED, and reduces the repair cost. . Please refer to FIG. 5 , which discloses a flowchart of a repair method in an embodiment of the present application. The method may include:

Step S001: Transfer a plurality of pixel units to be processed onto a driving substrate.

Please refer to FIGS. 4 and 6 . FIG. 6 discloses a schematic structural diagram of the display module 20 according to an embodiment of the present application. The display module 20 may include a pixel unit 21 , a driving substrate 22 and a transparent substrate 23 . The pixel unit 21 constitutes a pixel unit layer. The transparent substrate 23 , the pixel unit layer and the driving substrate 22 are stacked in sequence. A driving circuit layer 221 composed of driving circuits is disposed on the driving substrate 22 , and the driving circuits are used to communicate with sub-pixels in the pixel unit 21 , such as the first sub-pixel 211 , the second sub-pixel 212 , the third sub-pixel 213 and the fourth sub-pixel 213 . The pixels 214 are electrically connected to realize the function of driving sub-pixels such as the first sub-pixel 211 , the second sub-pixel 212 , the third sub-pixel 213 and the fourth sub-pixel 214 to display. The driving circuit layer 221 is disposed on the side of the driving substrate 22 facing the pixel unit layer.

In one embodiment, each sub-pixel may include a first micro LED die, a micro LED die, and a color filter layer (eg, a first color filter layer, a second color filter layer). The first micro LED die and the micro LED die are arranged on the driving circuit. The color filter color resist layer is disposed on the side of the first micro-LED die and the micro-LED die away from the driving circuit layer 221, and can be used to encapsulate the first micro-LED die and the micro-LED die to form micro-luminescence. The diode can make the chromaticity uniformity of the first micro light emitting diode die and the micro light emitting diode die better. In one embodiment, the color filter color resist layer can control the chromaticity of the first micro-LED die and the micro-LED die by the precision of the coating thickness. It can be understood that a color filter color resist layer such as the first color filter color resist layer can be used to encapsulate the first micro light emitting diode die to form the first micro light emitting diode. The color filter color resist layer, such as the second color filter color resist layer, can be used to encapsulate the micro light emitting diode die to form the second micro light emitting diode.

For example, the first sub-pixel 211 may include a first micro-LED die 2111 and a first color filter layer 2112 . The first micro LED die 2111 is electrically connected to the driving circuit. The first color filter color resist layer 2112 is disposed on the side of the first micro-LED die 2111 away from the driving circuit layer 221 for changing the chromaticity of the first micro-LED die 2111 . For example, the first sub-pixel 211 is an R sub-pixel, and the first micro-LED die 2111 may be a micro-LED die with a red light-emitting color, a micro-LED die with a green light-emitting color, or a micro-LED die with a blue light-emitting color. Any one of the micro LED die and the micro LED die with white light emission color. Chroma. When the first micro-LED die 2111 is a micro-LED die with red light emission color, the red color film color resist layer can make the chromaticity uniformity of the micro-LED die with red light-emitting color better.

For example, the second sub-pixel 212 may include a first micro LED die 2121 and a first color filter layer 2122 . The first micro LED die 2121 is electrically connected to the driving circuit. The first color filter color resist layer 2122 is disposed on the side of the first micro-LED die 2121 away from the driving circuit layer 221 for changing the chromaticity of the first micro-LED die 2121 . For example, the second sub-pixel 212 is a G sub-pixel, and the first micro-LED die 2121 can be a micro-LED die with a red light emission color, a micro LED die with a green light-emitting color, or a micro-LED die with a blue light-emitting color. Any one of the micro LED die and the micro LED die with white light emission color. Chroma. When the first micro-LED die 2121 is a micro-LED die with a green light emission color, the green color filter layer can make the chromaticity uniformity of the micro-LED die with a green light-emitting color better.

For example, the third sub-pixel 213 may include a first micro LED die 2131 and a first color filter layer 2132 . The first micro LED die 2131 is electrically connected to the driving circuit. The first color filter color resist layer 2132 is disposed on the side of the first micro LED die 2131 away from the driving circuit layer 221 for changing the chromaticity of the first micro LED die 2131 . For example, the third sub-pixel 213 is a B sub-pixel, and the first micro-LED die 2131 can be a micro-LED die with a red light-emitting color, a micro-LED die with a green light-emitting color, or a micro-LED die with a blue light-emitting color. Any one of the micro LED die and the micro LED die with white light emission color. Chroma. When the first micro-LED die 2131 is a micro-LED die with blue light emission color, the blue color film color resist layer can make the chromaticity uniformity of the micro-LED die with blue light-emitting color better.

For example, the fourth sub-pixel 214 may include a micro LED die 2141 and a second color filter layer 2142 . The micro LED die 2141 is electrically connected to the driving circuit. The second color filter layer 2142 is disposed on the side of the micro LED die 2141 away from the driving circuit layer 221, and is used to change the chromaticity of the micro LED die. For example, the fourth sub-pixel 214 is a B sub-pixel, and the micro-LED die 2141 can be a micro-LED die with a red light-emitting color, a micro-LED die with a green light-emitting color, or a micro-LED with a blue light-emitting color The second color filter layer 2142 is a blue color filter layer, which is used to change the chromaticity of the micro LED chips 2141 . In one embodiment, the color of the micro LED die 2141 is the same as the color of the second color filter color resist layer 2142 . When any one of the first sub-pixel 211 , the second sub-pixel 212 and the third sub-pixel 213 is damaged, the fourth sub-pixel 214 can be used instead.

It can be understood that the color of the sub-pixel can be determined by the color of the color filter color resist layer, and it can also be said that the micro light emitting diode can be determined by the color of the color filter color resist layer.

In this embodiment, a driving substrate 22 is prepared, which can be used to carry the above-mentioned sub-pixels, and is fabricated into the display module 20 . In one embodiment, the driving substrate 22 may be a transparent substrate such as a glass substrate, or may be a polyimide film. Within the range that can be understood by those skilled in the art, the driving substrate 22 may also be made of other materials, which will not be described here. limited.

In this embodiment, according to the display module 20 shown in FIG. 3 , FIG. 4 and FIG. 6 , one pixel unit to be processed may include three first micro-LED die and one micro-LED die. In an embodiment, please refer to FIG. 7 , which discloses a schematic structural diagram of the display module 20 after the transfer operation in an embodiment of the present application. The display module 20 is fabricated by transferring a huge amount of micro-LED dies onto the driving substrate 22 . The driving substrate 22 is provided with a driving circuit. The first micro LED die 2111 , the first micro LED die 2121 , the first micro LED die 2131 and the micro LED die 2141 are respectively connected with the driving circuit on the driving substrate 22 . The circuit is electrically connected.

In one embodiment, a mass transfer method may be used in the process of transferring the pixel units to be processed.

Mass transfer method can be electrostatic mass transfer method, Van der Waals force mass transfer method, magnetic mass transfer method, Selective Release mass transfer method, Self-Assembly mass transfer method method and transfer (Roll Printing) mass transfer method, and the mass transfer method may not be specifically limited here. in:

The electrostatic mass transfer method uses a transfer head with a double-stage structure. During the transfer process, positive and negative voltages are respectively applied. The die will be adsorbed on the transfer head. When the micro LED die needs to be placed on the predetermined position of the driving substrate 22, the transfer can be completed by applying negative electricity to another silicon electrode.

Van der Waals force mass transfer method, using elastic stamping, combined with high-precision motion control print head, using van der Waals force, by changing the speed of the print head, to make the micro LED die adhere to the transfer head, or print to the predetermined position of the drive substrate 22 .

In the magnetic mass transfer method, magnetic materials such as iron, cobalt, and nickel are mixed on the micro-LED grains before cutting, and electromagnetic adsorption and release are used.

The selective release mass transfer method directly transfers the micro-LED grains from the original position. At present, the most commonly implemented method is patterned laser lift-off (p-LLO), that is, the excimer laser is used to irradiate the growth interface. The sparsely separated mold-sized areas on the gallium nitride sheet are then exposed to ultraviolet light to generate gallium and nitrogen, which are transferred to the substrate in parallel to achieve a precise optical array.

The self-assembly mass transfer method uses a brush cylinder to roll on the substrate, so that the micro LED die is placed in a liquid suspension, and the micro LED die is caused to fall into the corresponding well on the driving substrate 22 by fluid force.

Transfer mass transfer method, mostly using roller transfer method, such as roll to roll process (Roll to Roll) transfer technology, the rolling method can be transferred and interconnected at the same time through mechanical deformation, and can control the micro LED die on the production line uniformity.

Step S002: Color-resistance packaging is performed on the three first micro-LED die respectively to form three first micro-LEDs.

In an embodiment, please refer to FIG. 8 , which discloses a partial flowchart of a repair method in an embodiment of the present application. Step S002 may include:

Step S011 : arranging a black matrix on the driving substrate.

Please refer to FIG. 6 and FIG. 9 . FIG. 9 discloses a schematic structural diagram of the display module 20 in the repairing process according to an embodiment of the present application. The display module 20 may include a black matrix 215, and the black matrix 215 is disposed on the side of the driving substrate 22 where the driving circuit is disposed. Black matrix 215 is used to define sub-pixels. The black matrix 215 is provided with a plurality of accommodating spaces. The black matrix 215 and the pixel units 21 can form a pixel unit layer.

Step S012: Disposing each of the first micro-LED die and the micro-LED die in each accommodating space in a one-to-one correspondence.

Referring to FIG. 9 , the first micro LED die 2111 , 2121 , 2131 and the micro LED die 2141 are separated by the black matrix 215 respectively. The first micro-LED die and the micro-LED die can be transferred into each accommodating space by the transfer method in the above-mentioned embodiment.

Step S013 : filling ink in the accommodating space provided with the first micro-LED die to cover the first micro-LED die.

Please refer to FIG. 6 and FIG. 10 . FIG. 10 is a schematic structural diagram of the display module 20 in the repairing process according to an embodiment of the present application. In the sub-pixels defined by the black matrix 215, the accommodating space is filled with the first color filter layer. In one embodiment, the first color filter layer 2112 is filled in the accommodating space where the first micro LED die 2111 is located, and covers the first micro LED die 2111 . The first color filter layer 2122 is filled in the accommodating space where the first micro-LED die 2121 is located, and covers the first micro-LED die 2121 . The first color filter layer 2132 is filled in the accommodating space where the first micro-LED die 2131 is located, and covers the first micro-LED die 2131 . The adjustment of the chromaticity of the crystal grains of the first micro light emitting diode by the first color filter color resist layer is realized.

In one embodiment, in step S013 , the first color filter color resist layer may be prepared into ink, and the inkjet printing process may be used to fill the accommodating space where the first micro-LED die is located.

Step S014 : curing the package to form a first miniature light emitting diode.

Referring to FIG. 10 , waiting for the ink to cure and encapsulate the first micro-LED dies 2111 , 2121 , and 2131 , three first micro-LEDs are formed in one pixel unit 21 . In this process, the chromaticity of the micro-LED die can be precisely controlled by changing the coating thickness and color of the color filter layer.

In one embodiment, please refer to FIG. 10 , the first micro-LED die 2111 is a micro-LED die with a red light emission color, and the first micro-LED die 2121 is a micro-LED die with a green light-emitting color , the first micro light emitting diode die 2131 is a micro light emitting diode die whose emission color is blue. Correspondingly, the first color filter color resist layer 2112 filled in the accommodating space where the first micro LED die 2111 is located is a red color filter color resist layer, which is filled in the accommodating space where the first micro LED die 2121 is located. The first color filter color resist layer 2122 in the space is a green color filter color resist layer, and the first color filter color resist layer 2132 filled in the accommodating space where the first micro LED die 2131 is located is a blue color filter color resist layer. layer. Further, the light-emitting colors of the three first micro light-emitting diodes are red, blue, and green, respectively.

Step S003 : providing a driving substrate provided with a plurality of pixel units.

In one embodiment, the driving substrate processed in step S014 may be provided. Of course, it can also be the driving substrate processed in step S012 or S013. Referring to FIG. 6 and FIG. 10 , one pixel unit 21 may include first

micro-LED die

2111 , 2121 , 2131 and one micro-LED die 2141 .

Step S004: Detect whether each of the first micro light emitting diodes can work normally.

The damage of the sub-pixels is mostly due to the damage of the miniature light-emitting diodes, which can't work normally. Therefore, the detection of the micro-LEDs helps to ensure the pass rate of the display module 20, and is convenient for detecting the micro-LEDs that cannot work normally, such as the first micro-LEDs. 2111, 2121, 2131, micro-LED die for replacement.

Of course, the detection process can be performed before each first micro-LED die is packaged to form a first micro-LED, or after each first micro-LED die is packaged to form a first micro-LED, generally The micro-LED die detection is performed before each first micro-LED die is packaged to form a first micro-LED die, so as to avoid the existence of 2-4 micro-LED die that cannot work normally in one pixel unit 21 . grain. Of course, the probability of this situation is extremely low. When it is ensured that a micro LED die that cannot work normally exists in one pixel unit 21, each first micro LED die can be packaged to form a first micro LED after the diode.

Step S005: If there is a first micro-LED that cannot work normally in the pixel unit, encapsulate the micro-LED die with color resistance to replace the light-emitting function of a non-working first micro-LED in the pixel unit.

When it is ensured in step S005 that there is only one micro LED die that cannot work normally in one pixel unit 21, the micro LED die 2141 can be packaged to replace the micro LED die that cannot work normally. During the packaging process, for example, as shown in FIG. 10 , the first micro LED die 2111 cannot work normally, and the first sub-pixel 211 is an R sub-pixel, then the micro LED die 2141 needs to be packaged to form an R sub-pixel. pixel to replace the first sub-pixel 211 .

By presetting the micro LED die 2141 as a backup, it can achieve the repair of the sub-pixels of a specific color, and finally realize the massive restoration of the micro LED die with low cost and high efficiency.

In one embodiment, step S005 may include: filling ink in the accommodating space provided with the micro LED die 2141 to cover the micro LED die 2141 , and curing the package to form the second micro LED.

Please refer to FIG. 11 , which discloses a schematic structural diagram of the display module 20 in a repairing process according to an embodiment of the present application. The light-emitting color of the second micro-LED is the same as the original light-emitting color of the replaced first micro-LED, so that the fourth sub-pixel 214 can replace the sub-pixel that cannot work normally; the pixel provided with the second micro-LED The color coordinate of the unit is the same as that of the pixel unit when each first micro-LED is working normally, so as to address the micro-LED die that cannot work normally and repair the micro-LED die that cannot work normally.

For example, in a pixel, the first micro-LED die 2121 is the damaged first micro-LED die, the micro-LED die 2141 and the first micro-LED die 2121 are in the same pixel, so the micro-LED die 2141 is in the same pixel. Die 2141 is used as a spare micro-LED die to replace the damaged first micro-LED die 2121, and the micro-LED die 2141 is packaged with color resistance to form a second micro-LED. The light emission color is the same as the original light emission color of the replaced first micro light-emitting diode.

In an embodiment, please refer to FIG. 11 and FIG. 12 . FIG. 12 discloses a schematic structural diagram of the display module 20 in the repair process in an embodiment of the present application. The second color filter layer 2142 can control the chromaticity of the micro LED die 2141. For example, the micro LED die 2141 is a micro LED die with a white light emission color, and the second color filter color resist layer 2142 is a green color. The film color-resisting layer, the light-emitting color of the second micro light-emitting diode should be green. For example, the micro light emitting diode die 2141 is a micro light emitting diode die with a red light emission color, and the second color filter layer 2142 is a blue color film color resistance layer, so the light color of the second micro light emitting diode should be blue.

That is, the light emission color of the second micro LED is determined by the color of the second color filter color resist layer 2142 itself.

In one embodiment, during the filling process of the second color filter color resist layer 2142, the second color filter color resist layer 2142 can be prepared into ink, and the inkjet printing process is used to fill the accommodating space where the micro LED die 2141 is located. Inside, wait for the ink to cure to encapsulate the micro LED die 2141 . In this process, the chromaticity of the micro-LED die can be precisely controlled by changing the coating thickness and color of the color filter layer.

In an embodiment, please refer to FIG. 13 , which discloses a schematic structural diagram of a repair method in an embodiment of the present application. After step S004, the method may further include:

Step S021 : attaching a transparent substrate to the side of the pixel unit away from the driving substrate.

Referring to FIG. 6 , the display module 20 further includes a transparent substrate 23 . The transparent substrate 23 is disposed on the side of the pixel unit layer away from the driving substrate 22 and is stacked with the pixel unit layer. Specifically, it can be connected and fixed by bonding, for example, the two can be directly bonded, or they can be bonded by optically transparent adhesive (OCA optical adhesive). The encapsulation of the pixel unit 21 is completed by the transparent substrate 23 and the black matrix 215 . In one embodiment, the transparent substrate 23 may be a transparent material such as glass or plastic. Please also refer to FIG. 2 , the display screen cover 10 is disposed on the side of the display module 20 where the transparent substrate 23 is disposed. In one embodiment, the display screen cover 10 and the display module 20 may be bonded by optically clear adhesive (OCA optical adhesive). In one embodiment, the transparent substrate 23 may be omitted, and the display screen cover 10 is disposed on the side of the pixel unit layer away from the driving substrate 22 instead of the transparent substrate 23 , that is, the display screen cover 10 and the pixel unit layer are stacked.

It can be understood that the display module 20 manufactured by the above repair method may include a pixel unit layer, a driving substrate 22 and a transparent substrate 23 that are stacked in sequence, wherein each pixel unit 21 in the pixel unit layer is provided with a first sub-pixel 211. , a second sub-pixel 212 , a third sub-pixel 213 and a fourth sub-pixel 214 . And there is a pixel unit 21 with damaged sub-pixels in the pixel unit layer, and the fourth sub-pixel 214 in the pixel unit 21 with damaged sub-pixels replaces the damaged sub-pixel. The fourth sub-pixel 214 can be matched with the micro LED die 2141 and the second color filter layer 2142, so that the emission color of the second micro LED is the same as that of the first non-working micro LED.

Among the visible light emitted by the Micro LED display module, the blue light (380-500nm) has the shortest wavelength and the strongest energy. Blue light is the visible light with the strongest energy, including blue, indigo, and violet light, which penetrate the cornea and the crystal and enter the macula directly. It accelerates the oxidation of macular cells and damages retinal photoreceptor cells. In order to filter blue light to protect the eyes, micro LED chips are used to assist the B sub-pixels, so that the Micro LED display module can be used in different scenarios. On the premise of ensuring the luminous efficiency and power consumption of blue LEDs, the needs of low blue light eye protection are taken into account. Please refer to FIG. 14 , which discloses a partial structural diagram of the display module 20 in an embodiment of the present application. The display module 20 may include pixel units 21 arranged in a matrix. Each pixel unit 21 may be formed by arranging a plurality of sub-pixels in a matrix.

In one embodiment, one of the first sub-pixel 211, the second sub-pixel 212, and the third sub-pixel 213 may be an R sub-pixel, one of the other two may be a G sub-pixel, and the other one may be a G sub-pixel. Being a B sub-pixel, the fourth sub-pixel 214 may be a B sub-pixel. In one embodiment, the harmful blue light emission of the fourth subpixel 214 is lower than the harmful blue light emission of the subpixel that is another B subpixel. In one embodiment, the emission of blue light can be reduced by adjusting the luminous efficiency. For example, the luminous efficiency of the fourth sub-pixel 214 is lower than that of the sub-pixel serving as another B sub-pixel.

In one embodiment, please refer to FIG. 14 , in a 2×2 matrix arrangement, the first sub-pixel 211 and the fourth sub-pixel 214 are located in the same pixel row, and are located in the same pixel column as the third sub-pixel 213 . The second sub-pixel 212 and the fourth sub-pixel 214 are located in the same pixel column, and are located in the same pixel row as the third sub-pixel 213 .

In an embodiment, please refer to FIG. 14 and FIG. 15 . FIG. 15 discloses a partial structural diagram of the display module 20 in an embodiment of the present application. The first subpixel 211 may be an R subpixel, the second subpixel 212 may be a G subpixel, the third subpixel 213 may be a B subpixel, and the fourth subpixel 214 may be a B subpixel. In one embodiment, the harmful blue light emission of the fourth sub-pixel 214 is lower than the harmful blue light emission of the third sub-pixel 213 . In one embodiment, the luminous efficiency of the fourth sub-pixel 214 is lower than that of the third sub-pixel 213 . When the display module 20 is working normally (ie, displaying a message), the third sub-pixel 213 is used as the B sub-pixel for normal display, and the fourth sub-pixel 214 may not be displayed. Of course, the fourth sub-pixel 214 can also be displayed, which is not done here. Specific restrictions. In some eye protection usage scenarios, such as e-book reading, mobile phone use late at night, news reading, etc., the fourth sub-pixel 214 is used as a B sub-pixel for normal display (ie, emits light), and the third sub-pixel 213 is used as a B sub-pixel for normal display. displayed (ie, off). The eye protection effect is achieved by reducing the harmful blue light emission of the B sub-pixels in the eye protection use scene.

Please refer to FIG. 16 , which discloses a schematic structural diagram of the display module 20 in an embodiment of the present application. The display module 20 may include a pixel unit 21 , a driving substrate 22 and a transparent substrate 23 . The transparent substrate 23 , the pixel unit layer including the pixel unit 21 and the driving substrate 22 are stacked in sequence. A driving circuit layer 221 composed of driving circuits is disposed on the driving substrate 22 , and the driving circuits are used to communicate with sub-pixels in the pixel unit 21 , such as the first sub-pixel 211 , the second sub-pixel 212 , the third sub-pixel 213 and the fourth sub-pixel 213 . The pixels 214 are electrically connected to realize the function of driving sub-pixels such as the first sub-pixel 211 , the second sub-pixel 212 , the third sub-pixel 213 and the fourth sub-pixel 214 to display. The driving circuit layer 221 is disposed on the side of the driving substrate 22 facing the pixel unit layer.

In one embodiment, each sub-pixel may include a first micro LED die, a micro LED die, and a color filter layer (eg, a first color filter layer, a second color filter layer). The first micro LED die and the micro LED die are arranged on the driving circuit. The color filter color resist layer is disposed on the side of the first micro-LED die and the micro-LED die away from the driving circuit layer 221, and is used to control the chromaticity of the first micro-LED die and the micro-LED die. Therefore, the chromaticity uniformity of the first micro-LED die and the micro-LED die is better. In one embodiment, the color filter color resist layer can control the chromaticity of the first micro-LED die and the micro-LED die by the precision of the coating thickness.

For example, the fourth sub-pixel 214 may include a micro LED die 2141 and a second color filter layer 2142 . The micro LED die 2141 is electrically connected to the driving circuit. The second color filter layer 2142 is disposed on the side of the micro LED die 2141 away from the driving circuit layer 221 , and is used to change the chromaticity of the micro LED die 2141 . The fourth sub-pixel 214 is the B sub-pixel, and the micro-LED die 2141 may be a micro-LED die with a red light-emitting color, a micro-LED die with a green light-emitting color, or a micro-LED die with a blue light-emitting color. The second color film color resist layer 2142 is a blue color film color resist layer, which is used to change the chromaticity of the micro light emitting diode die 2141. In one embodiment, the micro LED die 2141 may be a micro LED die with a blue light emission color, and the second color filter layer 2142 is a blue color filter layer.

Referring to FIG. 16 , the display module 20 may include a black matrix 215 , and the black matrix 215 is disposed on the side of the driving substrate 22 where the driving circuit is disposed. The black matrix 215 is used to define sub-pixels, and the black matrix 215 is provided with a plurality of accommodating spaces. The black matrix 215 and the pixel units 21 can form a pixel unit layer. Each of the first

micro-LED die

2111, 2121, 2131 and the micro-LED die 2141 are disposed in each accommodating space in a one-to-one correspondence. The black matrix 215 is part of the pixel cell layer. The first color filter layer 2112 is filled in the accommodating space where the first micro-LED die 2111 is located, and covers the first micro-LED die 2111 . The first color filter layer 2122 is filled in the accommodating space where the first micro-LED die 2121 is located, and covers the first micro-LED die 2121 . The first color filter layer 2132 is filled in the accommodating space where the first micro-LED die 2131 is located, and covers the first micro-LED die 2131 . The adjustment of the chromaticity of the crystal grains of the first micro light emitting diode by the first color filter color resist layer is realized.

In one embodiment, please refer to FIG. 15 , the first micro-LED die 2111 is a micro-LED die with a red light emission color, and the first micro-LED die 2121 is a micro-LED die with a green light-emitting color , the first micro light emitting diode die 2131 is a micro light emitting diode die whose emission color is blue. Correspondingly, the first color filter color resist layer 2112 filled in the accommodating space where the first micro LED die 2111 is located is a red color filter color resist layer, which is filled in the accommodating space where the first micro LED die 2121 is located. The first color filter color resist layer 2122 in the space is a green color filter color resist layer, and the first color filter color resist layer 2132 filled in the accommodating space where the first micro LED die 2131 is located is a blue color filter color resist layer. layer.

In one embodiment, please refer to FIG. 15 , the second color filter color resist layer 2142 can control the chromaticity of the micro LED die 2141 , for example, the micro LED die 2141 is a micro LED die with a white light emission color, The second color filter color resist layer 2142 is a blue color filter color resist layer, so the light-emitting color of the micro light-emitting diode should be blue. For example, the micro LED die 2141 is a micro LED die with a red light emission color, and the second color filter color resist layer 2142 is a blue color film color resist layer, so the light emission color of the micro LED should be blue.

In one embodiment, please refer to FIG. 16 , the display module 20 further includes a transparent substrate 23 . The transparent substrate 23 is disposed on the side of the pixel unit layer away from the driving substrate 22 and stacked with the pixel unit layer. Specifically, it can be connected and fixed by bonding, for example, the two can be directly bonded, or they can be bonded by optically transparent adhesive (OCA optical adhesive). The encapsulation of the pixel unit 21 is completed by the transparent substrate 23 and the black matrix 215 . In one embodiment, the transparent substrate 23 may be a transparent material such as glass or plastic. Please also refer to FIG. 2 , the display screen cover 10 is disposed on the side of the display module 20 where the transparent substrate 23 is disposed. In one embodiment, the display screen cover 10 and the display module 20 may be bonded by optically transparent adhesive. In one embodiment, the transparent substrate 23 may be omitted, and the display screen cover 10 is disposed on the side of the pixel unit layer away from the driving substrate 22 instead of the transparent substrate 23 , that is, the display screen cover 10 and the pixel unit layer are stacked.

In one embodiment, each micro LED die is driven by a pixel driving module (a part of the driving circuit) disposed on the driving substrate 22 , so that each micro LED die is displayed. Since there are two B sub-pixels, it is necessary to jointly drive the two B sub-pixels. Please refer to FIG. 17 , which discloses a driving circuit diagram for driving two B sub-pixels in an embodiment of the present application. Among them, in the same pixel unit 21, the same output end of the pixel driving module 2211 is respectively connected to the first switch control module (Switch1) 2212 and the second switch control module (Switch2) 2213, and the first switch control module (Switch1) 2212 and The first micro LED die 2131 is electrically connected, so that the first switch control module (Switch1) 2212 controls the first micro LED die 2131 to turn off or emit light, and the second switch control module (Switch2) 2213 is connected to the micro LED die. The chips 2141 are electrically connected, so that the second switch control module (Switch2) 2213 controls the micro LED chips 2141 to turn off or to emit light. The first switch control module (Switch1) 2212 and the second switch control module (Switch2) 2213 are respectively controlled by a data signal. That is, the first micro LED die 2131 and the micro LED die 2141 belong to two rows, the first switch control module (Switch1) 2212 is controlled by the first switch control data signal Switch1, and the second switch control module (Switch2) 2213 is controlled by the first switch control data signal Switch1. The second switch is controlled by the data signal Switch2. The first switch control module (Switch1) 2212 is used to control the first micro LED die 2131 to light up or turn off, and the second switch control module (Switch2) 2213 is used to control the micro LED die 2141 to light up or turn off. In one embodiment, the output terminal of the pixel driving module for driving the R sub-pixels can be electrically connected to the first micro-LED die 2111 directly. In one embodiment, the output terminal of the pixel driving module for driving the G sub-pixels can be electrically connected to the first micro-LED die 2121 directly.

The pixel driving module 2211 may include a first transistor T1, a second transistor T2, a third transistor T3, a fourth transistor T4, a fifth transistor T5, a sixth transistor T6, a seventh transistor T7 and a capacitor C1.

The gate electrode of the first transistor T1 is used for first receiving the scan signal SCAN1, the first end thereof is used for receiving the reference voltage Vref, and the second end thereof is electrically connected to the first end of the capacitor C1 and the gate of the third transistor T3 pole, the first end of the fifth transistor T5.

The gate electrode of the second transistor T2 is used to receive the enable signal EMIT, the first end of the second transistor T2 is used to receive the positive power supply voltage ELVDD, and the second end is electrically connected to the first end of the third transistor T3 and the fourth transistor T4 the first end.

The second end of the third transistor T3 is electrically connected to the second end of the fifth transistor T5 and the first end of the sixth transistor T6.

The gate electrode of the fourth transistor T4 is used for receiving the second scan signal SCAN2, and the second terminal thereof is used for receiving the data voltage Vdata.

The gate electrode of the fifth transistor T5 is used for receiving the second scan signal SCAN2.

The gate electrode of the sixth transistor T6 is used for receiving the enable signal EMIT, and the second end thereof is respectively connected to the first switch control module (Switch1) 2212 and the second switch control module (Switch2) 2213 and the first switch of the seventh transistor T7. end.

The gate electrode of the seventh transistor T7 is used for receiving the first scan signal SCAN1, and the second terminal thereof is used for receiving the reference voltage Vref.

The first switch control module (Switch1) 2212 may include an eighth transistor T8, the gate electrode of the eighth transistor T8 is used to receive the first switch control data signal Swich1, and the first terminal of the eighth transistor T8 is electrically connected to the second terminal of the sixth transistor T6 , the second end of which is electrically connected to the anode of the first micro-LED die 2131 .

The second switch control module (Switch2) 2213 may include a ninth transistor T9, the gate electrode of the ninth transistor T9 is used for receiving the second switch control data signal Swich2, and the first terminal of the ninth transistor T9 is electrically connected to the second terminal of the sixth transistor T6 , the second end of which is electrically connected to the anode of the micro LED die 2141 .

The cathode of the first micro LED die 2131 and the cathode of the micro LED die 2141 are both connected to the negative power supply voltage ELVSS.

When there is no damage to the B sub-pixel when the micro-LED die is massively transferred in the display module 20, in the eye protection scenario, all the micro-LED die 2141 are sent to black, that is, the gray scale 0 is displayed. The micro-LED die 2141 is controlled independently; on the contrary, when used in a normal scene, all the first micro-LED die 2131 are sent black.

However, the first micro-LED die 2131 or the micro-LED die 2141 in one pixel unit 21 is damaged once detected in the bulk transfer. There is only a single blue sub-pixel, whether in eye protection mode or normal mode. The first micro-LED die 2131 and the micro-LED die 2141 will be sent corresponding display signals to light up (because one blue sub-pixel has been damaged, only one blue sub-pixel is actually illuminated) , that is, in the process of mass transfer, even if the first micro LED die 2131 is damaged, the micro LED die 2141 will be used as a backup to repair the first micro LED die 2131 that cannot work normally. That is, the display module 20 in this embodiment can also improve the yield of the mass transfer of micro-LED die.

Next, it is taken as an example that the display module 20 is an AMOLED display module. Various types of sensors in electronic device 100 may include complementary metal-oxide-semiconductor sensors (CMOS Sensors), ie, imaging photosensitive cells. The CMOS Sensor can be used as the main component of fingerprint recognition under the screen. When the user's finger touches the display module 20, the display module 20 emits light as a light source. The light is imaged in the CMOS Sensor through the lens, and the information of the fingerprint image is used for fingerprint recognition. The brightness of the AMOLED display module is limited, which directly affects the speed of fingerprint unlocking and the success rate of unlocking. In this embodiment, the pixel unit 21 (also referred to as a micro light-emitting diode pixel unit) described in the above-mentioned embodiment is used in the AMOLED display module to improve the fingerprint unlocking speed and the unlocking success rate.

Understandably, when the display module 20 is an LCD (Liquid Crystal Display) display module or a QLED (Quantum dots Light-emitting Diodes) display module and other display modules that can attach fingerprint identification capabilities, the display module is also The pixel unit 21 (which may also be referred to as a micro light emitting diode pixel unit) described in the above embodiments may be used. Of course, the optical fingerprint recognition sensor can also be arranged inside the display module 20 according to the actual situation.

Please refer to FIG. 18 , which discloses a partial structural diagram of the display module 20 in an embodiment of the present application. The display module 20 may include display main pixel units 24 arranged in a matrix. Each display main pixel unit 24 may be formed by arranging a plurality of sub-pixels (also referred to as "display sub-pixels") in a matrix.

In one embodiment, each display main pixel unit 24 may include four sub-pixels such as a first display sub-pixel 241 , a second display sub-pixel 242 , a third display sub-pixel 243 and a fourth display sub-pixel 244 . The first display sub-pixel 241 , the second display sub-pixel 242 , the third display sub-pixel 243 and the fourth display sub-pixel 244 may be arranged in a 2×2 matrix. In an embodiment, please refer to FIG. 19 , which discloses a partial structural diagram of the display module 20 in an embodiment of the present application. The fourth display sub-pixel 244 may be omitted, and the first display sub-pixel 241 , the second display sub-pixel 242 , and the third display sub-pixel 243 may be arranged in a 1×3 matrix.

In one embodiment, please refer to FIG. 18 , one of the first display sub-pixel 241 , the second display sub-pixel 242 , and the third display sub-pixel 243 may be an R sub-pixel, and one of the other two may be a G sub-pixel Of the sub-pixels, the remaining one may be a B sub-pixel, and the fourth display sub-pixel 244 may be one of an R sub-pixel, a G sub-pixel, a B sub-pixel, and a W sub-pixel.

In one embodiment, please refer to FIG. 18 , in a 2×2 matrix arrangement, the first display sub-pixel 241 and the fourth display sub-pixel 244 are located in the same pixel row, and are located in the same pixel column as the second display sub-pixel 242 . The third display sub-pixel 243 and the fourth display sub-pixel 244 are located in the same pixel column, and are located in the same pixel row as the third display sub-pixel 243 .

In an embodiment, please refer to FIG. 18 and FIG. 20 . FIG. 20 discloses a partial structural diagram of the display module 20 in an embodiment of the present application. The first display sub-pixel 241 may be an R sub-pixel, the second display sub-pixel 242 may be a G sub-pixel, the third display sub-pixel 243 may be a B sub-pixel, and the fourth display sub-pixel 244 may be an R sub-pixel, a G sub-pixel One of a pixel, a B sub-pixel, and a W sub-pixel. For example, the fourth display sub-pixel 244 may be a G sub-pixel.

In order to realize the use of micro light-emitting diodes to emit light as a surface light source for optical fingerprint unlocking, the exposure time is reduced. A micro light-emitting diode pixel unit is arranged in the area between any four adjacent display sub-pixels arranged in a 2×2 matrix in the fingerprint unlocking area. Please refer to FIG. 18 , FIG. 19 and FIG. 20 , a fingerprint unlocking area 25 is arranged in the display module 20 , and in the fingerprint unlocking area 25 , a micro LED pixel is arranged in the area between any four adjacent display sub-pixels unit (ie, the pixel unit 21 in the above embodiment). In one embodiment, the pixel unit 21 may include a first micro LED pixel unit 26 and an infrared micro LED pixel unit 27 . The first micro LED pixel unit 26 and the infrared micro LED pixel unit 27 are arranged at intervals. In one embodiment, one of the first micro LED pixel unit 26 and the infrared micro LED pixel unit 27 may be omitted.

In one embodiment, the first micro LED pixel unit 26 is used for fingerprint unlocking light source, and the infrared micro LED pixel unit 27 is used for biological anti-counterfeiting. In specific use, in each fingerprint sampling, an interval time will be reserved, and the infrared miniature light-emitting diode pixel unit 27 will light up to complete the fingerprint imaging under the infrared light source, which is used for biological anti-counterfeiting. Afterwards, the first micro light-emitting diode pixel unit 26 lights up and is used as a fingerprint unlocking light source.

It can be understood that the miniature light-emitting diode pixel units arranged between the display sub-pixels are arranged in a uniform arrangement, and of course they can also be arranged in a matrix in the display sub-pixels, but not limited to any four adjacent and arranged in a 2×2 matrix. A miniature light-emitting diode pixel unit is arranged in the area between the display sub-pixels.

Please refer to FIG. 21 , which discloses a schematic structural diagram of the pixel unit 21 in an embodiment of the present application. The pixel unit 21 may include a first subpixel 211 , a second subpixel 212 , a third subpixel 213 and a fourth subpixel 214 . Specifically, for the detailed introduction of the first sub-pixel 211 , the second sub-pixel 212 , the third sub-pixel 213 and the fourth sub-pixel 214 , reference may be made to the foregoing embodiments, and details are not repeated here. In an embodiment, please refer to FIG. 22 , which discloses a schematic structural diagram of the pixel unit 21 in an embodiment of the present application. The fourth sub-pixel 214 may be omitted, and the first sub-pixel 211 , the second sub-pixel 212 and the third sub-pixel 213 are arranged in a 1×3 matrix.

Please refer to FIG. 23 and FIG. 24 , which respectively disclose a partial structural schematic diagram of a display screen assembly 600 in an embodiment of the present application. The display screen assembly 600 may include a first transparent substrate 28 , a flexible substrate layer 29 , a buffer layer 30 , a first gate insulating layer 31 , a second gate insulating layer 32 , a planarization layer 33 , a pixel isolation layer 34 , and a cathode layer 35 , flexible packaging layer 36, touch panel layer 37, polarizing layer 38, optically transparent adhesive layer 39, display cover plate 10, polysilicon layer 40, gate layer 41, first source and drain layer 42, second source and drain layer layer 43 , anode layer 44 and organic light-emitting layer 45 .

Specifically, the first transparent substrate 28, the flexible substrate layer 29, the buffer layer 30, the first gate insulating layer 31, the second gate insulating layer 32, the flat layer 33, the pixel isolation layer 34, the cathode layer 35, the flexible packaging layer 36. The touch panel layer 37, the polarizing layer 38, the optically transparent adhesive layer 39, and the display screen cover 10 are stacked in sequence.

The polysilicon layer 40 is disposed between the buffer layer 30 and the first gate insulating layer 31 such that a part of the buffer layer 30 is in contact with the polysilicon layer 40 and a part is in contact with the first gate insulating layer 31 . So that a part of the first gate insulating layer 31 is in contact with the polysilicon layer 40 and a part is in contact with the buffer layer 30 .

The gate layer 41 is provided between the first gate insulating layer 31 and the second gate insulating layer 32 so that a part of the first gate insulating layer 31 is in contact with the gate layer 41 and a part is in contact with the second gate insulating layer 32 contacts. so that a part of the second gate insulating layer 32 is in contact with the gate layer 41 and a part is in contact with the first gate insulating layer 31 . The orthographic projection area of the gate layer 41 on the flexible substrate layer 29 is included in the orthographic projection area of the polysilicon layer 40 on the flexible substrate layer 29 .

The first source and drain layers 42 are disposed between the second gate insulating layer 32 and the flat layer 33 so that a part of the second gate insulating layer 32 is in contact with the first source and drain layers 42 and a part is in contact with the flat layer 33 . So that a part of the flat layer 33 is in contact with the first source and drain layers 42 , and a part is in contact with the second gate insulating layer 32 .

The second source-drain layer 43 is disposed between the second gate insulating layer 32 and the flat layer 33 such that a part of the second gate insulating layer 32 is in contact with the second source-drain layer 43 and a part is in contact with the flat layer 33 . So that a part of the flat layer 33 is in contact with the second source and drain layers 43 , and a part is in contact with the second gate insulating layer 32 .

The first source and drain layers 42 and the second source and drain layers 43 are respectively connected to the polysilicon layer 40 via vias.

In one embodiment, the first transparent substrate 28 , the flexible substrate layer 29 , the buffer layer 30 , the first gate insulating layer 31 , the second gate insulating layer 32 , the second gate insulating layer 32 , and the flat layer 33 form an auxiliary layer. The pixel isolation layer 34, the cathode layer 35, the anode layer 44, and the organic light-emitting layer 45 constitute a display layer. The flexible encapsulation layer 36 is used to encapsulate the display layer. The organic light-emitting layer 45 serves as a part of the sub-pixels of the display main pixel unit 24 . The polysilicon layer 40 , the gate layer 41 , the first source and drain layers 42 and the second source and drain layers 43 constitute a gate driving circuit, and the gate driving circuit is formed in the auxiliary layer. Of course, it can be understood that a data line circuit may also be provided in the auxiliary layer, and the gate driving circuit and the data line circuit may constitute a pixel driving circuit.

In one embodiment, the anode layer 44 and the organic light-emitting layer 45 are stacked and disposed, and the anode layer 44 is disposed on the side of the flat layer 33 away from the flexible substrate layer 29 .

The pixel isolation layer 34 covers the anode layer 44 , the organic light emitting layer 45 and the portion of the upper surface of the flat layer 33 that is not covered by the anode layer 44 and the organic light emitting layer 45 . And the part where the pixel isolation layer 34 is in contact with the anode layer 44 is partially formed with a through hole. The organic light emitting layer 45 is located on the pixel isolation layer 34 and is partially connected to the anode layer 44 through the through holes of the pixel isolation layer 34 . A cathode layer 35 is disposed on the pixel isolation layer 34 and the organic light-emitting layer 45 , and the organic light-emitting layer 45 is connected to the cathode layer 35 through via holes.

The touch panel layer 37 may be an on-cell touch layer. A metal layer is arranged on the side of the touch panel layer 37 away from the flexible packaging layer 36 to form a driving circuit for driving the display of the pixel unit 21 . The orthographic projection of the pixel unit 21 on the flat layer 33 is located on the portion of the upper surface of the flat layer 33 that is not covered by the anode layer 44 and the organic light-emitting layer 45 . That is, the orthographic projection of the pixel unit 21 on the flexible substrate layer 29 is within the orthographic projection of the portion not covered by the anode layer 44 and the organic light-emitting layer 45 on the upper surface of the flat layer 33 on the flexible substrate layer 29 . It can be understood that the touch panel layer 37 can be used to replace the driving substrate 22 described in the above embodiments. The black matrix 215 may be disposed on the touch panel layer 37 .

Please refer to FIG. 25 , which discloses a schematic diagram of wiring and control of the micro LEDs in the pixel unit 21 according to an embodiment of the present application. Among them, all the micro LEDs in the first micro LED pixel unit 26 (as the fingerprint unlocking light source) are connected in series, and the switch is controlled by the anode control line 46, and the brightness of the micro LED is controlled by the voltage setting on the anode control line 46. All the infrared miniature LEDs (fingerprint unlocking light source) in the infrared miniature LED pixel unit 27 are connected in series, and the switch is controlled by the anode control line 48, and the brightness of the infrared miniature LED is controlled by the voltage setting on the anode control line 48. The miniature LEDs in the first miniature LED pixel unit 26 and the infrared miniature LEDs in the infrared miniature LED pixel unit 27 are provided with a common cathode line 49 .

The scheme of combining the micro LED pixel unit and the display main pixel unit 24 for display is adopted, the first micro LED pixel unit 26 and the infrared micro LED pixel unit 27 are arranged in the fingerprint unlocking area 25, and the normal display outside the fingerprint unlocking area 25 The area is displayed by the display main pixel unit 24, with the advantages of micro LED inorganic ultra-high display life and brightness, to overcome the risk of fingerprint unlocking burn-in, and at the same time in the fingerprint unlock area 25, the first micro LED pixel unit 26 and infrared micro The LED pixel unit 27 cooperates with the display to realize biological access and fingerprint sampling, which can solve the problem of horizontal stripes in optical fingerprint imaging, improve the false rejection rate, and significantly enhance the biological anti-counterfeiting function.

The above are only the embodiments of the present application, and are not intended to limit the scope of the patent of the present application. Any equivalent structure or equivalent process transformation made by using the contents of the description and drawings of the present application, or directly or indirectly applied to other related The technical field is similarly included in the scope of patent protection of this application.

Claims

A display module, characterized in that it includes a plurality of pixel units and a driving circuit, the pixel units include a first sub-pixel, a second sub-pixel, a third sub-pixel and a fourth sub-pixel, the first sub-pixel , the second sub-pixel, the third sub-pixel and the fourth sub-pixel are arranged in a matrix, the third sub-pixel and the fourth sub-pixel are both blue sub-pixels, and the fourth sub-pixel The harmful blue light emission amount of the sub-pixel is lower than the harmful blue light emission amount of the third sub-pixel, and the third sub-pixel and the fourth sub-pixel are respectively configured to be individually controlled by the driving circuit to emit light or extinguish.
The display module according to claim 1, wherein the first sub-pixel, the second sub-pixel and the third sub-pixel all comprise a first miniature light emitting diode, and the fourth sub-pixel A second micro light emitting diode is included, and the harmful blue light emission amount of the second micro light emitting diode is lower than the harmful blue light emission amount of the first micro light emitting diode in the third sub-pixel.
The display module according to claim 2, wherein the display module comprises a driving substrate, a transparent substrate and a pixel unit layer including a plurality of the pixel units, and the pixel unit layer is disposed on the transparent substrate and the drive substrate.
The display module according to claim 3, wherein the pixel unit layer further comprises a black matrix, the black matrix is arranged on the driving substrate, and the black matrix is provided with a plurality of accommodating spaces, so The first micro light emitting diode and the second micro light emitting diode are disposed in each of the accommodating spaces in a one-to-one correspondence.
The display module according to claim 4, wherein the first micro light emitting diode comprises a first micro light emitting diode die and a first color filter color resist layer, and the first micro light emitting diode die is disposed on the On the driving substrate, the first micro light-emitting diode die and the first color filter color resist layer are both disposed in the accommodating space, and the first color filter color resist layer is configured to cover the on the first micro-LED die.
The display module according to claim 5, wherein the second micro light emitting diode comprises a micro light emitting diode die and a second color filter layer, and the micro light emitting diode die is disposed on the driving substrate above, the micro LED die and the second color filter color resist layer are both disposed in the accommodating space, and the second color filter color resist layer is configured to cover the micro LED die .
The display module according to any one of claims 2 to 6, wherein the light-emitting color of the first miniature light-emitting diode in the first sub-pixel is red, and the light-emitting color of all the second sub-pixels is red. The light-emitting color of the first micro light-emitting diode is green, and the light-emitting color of the first micro light-emitting diode in the third sub-pixel is blue.
The display module according to any one of claims 2-4, wherein the driving circuit comprises a pixel driving module, a first switch control module and a second switch control module, and the same output terminal of the pixel driving module The first switch control module and the second switch control module are respectively electrically connected, and the first switch control module is electrically connected to the first micro light emitting diode in the third sub-pixel and is used for controlling The light-emitting or extinguishing of the first micro-LED in the third sub-pixel, the second switch control module is electrically connected to the second micro-LED, and is used to control the lighting of the second micro-LED On or off.
The display module according to claim 8, wherein the pixel driving module comprises a first transistor, a second transistor, a third transistor, a fourth transistor, a fifth transistor, a sixth transistor, a seventh transistor and a capacitor ;

The gate electrode of the first transistor is used for receiving the first scan signal, the first terminal is used for receiving the reference voltage, and the second terminal is electrically connected to the first terminal of the capacitor and the gate of the third transistor , the first end of the fifth transistor;

The gate electrode of the second transistor is used for receiving the enable signal, and the first terminal is used for receiving the positive voltage of the power supply, and the second terminal is electrically connected to the first terminal of the third transistor and the terminal of the fourth transistor. first end;

The second end of the third transistor is electrically connected to the second end of the fifth transistor and the first end of the sixth transistor;

The gate electrode of the fourth transistor is used for receiving the second scan signal, and the second terminal is used for receiving the data voltage;

the gate electrode of the fifth transistor is used for receiving the second scan signal;

The gate electrode of the sixth transistor is used for receiving the enable signal, and the second terminal is respectively connected to the first switch control module and the second switch control module, and the first terminal of the seventh transistor;

The gate electrode of the seventh transistor is used for receiving the scan signal, and the second terminal is used for receiving the reference voltage.
The display module according to claim 9, wherein,

The first switch control module includes an eighth transistor, the gate electrode of the eighth transistor is used for receiving the first switch control data signal, and the first end is electrically connected to the second end of the sixth transistor, and the first end is electrically connected to the second end of the sixth transistor. The two terminals are electrically connected to the anode of the first micro-LED of the third sub-pixel;

The second switch control module includes a ninth transistor, the gate electrode of the ninth transistor is used for receiving the second switch control data signal, and the first end is electrically connected to the second end of the sixth transistor, and the first end is electrically connected to the second end of the sixth transistor. The two terminals are electrically connected to the anode of the second miniature light-emitting diode;

The cathode of the first micro-LED and the cathode of the second micro-LED of the third sub-pixel are both connected to the negative voltage of the power supply.
A display module, characterized in that, comprising:

A display module includes a plurality of pixel units and a driving circuit, the pixel units include a first sub-pixel, a second sub-pixel, a third sub-pixel and a fourth sub-pixel, the first sub-pixel, the second sub-pixel The pixel, the third sub-pixel and the fourth sub-pixel are arranged in a matrix, the third sub-pixel and the fourth sub-pixel are both blue sub-pixels, and the fourth sub-pixel emits harmful blue light The amount of harmful blue light emission is lower than that of the third sub-pixel, the color coordinates of the fourth sub-pixel are the same as the color coordinates of the third sub-pixel, and the third sub-pixel and the fourth sub-pixel are respectively The third sub-pixel and the fourth sub-pixel are configured to be individually controlled by the driving circuit to emit light or extinguish, and the third sub-pixel and the fourth sub-pixel are configured to replace the damaged one with the other when one of them is damaged.
The display module according to claim 11, wherein the first sub-pixel, the second sub-pixel and the third sub-pixel all comprise a first miniature light emitting diode, and the fourth sub-pixel A second micro light emitting diode is included, and the harmful blue light emission amount of the second micro light emitting diode is lower than the harmful blue light emission amount of the first micro light emitting diode in the third sub-pixel.
The display module according to claim 12, wherein the display module comprises a driving substrate, a transparent substrate and a pixel unit layer including a plurality of the pixel units, and the pixel unit layer is disposed on the transparent substrate and the drive substrate.
The display module according to claim 13, wherein the pixel unit layer further comprises a black matrix, the black matrix is disposed on the driving substrate, the black matrix is provided with a plurality of accommodating spaces, and the The first micro light emitting diode and the second micro light emitting diode are disposed in each of the accommodating spaces in a one-to-one correspondence.
The display module according to claim 14, wherein the first micro light emitting diode comprises a first micro light emitting diode die and a first color filter layer, and the first micro light emitting diode die is disposed on the On the driving substrate, the first micro light-emitting diode die and the first color filter color resist layer are both disposed in the accommodating space, and the first color filter color resist layer is configured to cover the on the first micro-LED die.
16. The display module according to claim 15, wherein the second micro light emitting diode comprises a micro light emitting diode die and a second color filter layer, and the micro light emitting diode die is disposed on the driving substrate above, the micro LED die and the second color filter color resist layer are both disposed in the accommodating space, and the second color filter color resist layer is configured to cover the micro LED die .
The display module according to any one of claims 12 to 16, wherein the light-emitting color of the first miniature light-emitting diode in the first sub-pixel is red, and all the light-emitting diodes in the second sub-pixel are red. The light-emitting color of the first micro light-emitting diode is green, and the light-emitting color of the first micro light-emitting diode in the third sub-pixel is blue.
The display module according to any one of claims 12-14, wherein the driving circuit comprises a pixel driving module, a first switch control module and a second switch control module, and the same output end of the pixel driving module The first switch control module and the second switch control module are respectively electrically connected, and the first switch control module is electrically connected to the first micro light emitting diode in the third sub-pixel and is used for controlling The light-emitting or extinguishing of the first micro-LED in the third sub-pixel, the second switch control module is electrically connected to the second micro-LED, and is used to control the lighting of the second micro-LED On or off.
The display module according to claim 18, wherein the pixel driving module comprises a first transistor, a second transistor, a third transistor, a fourth transistor, a fifth transistor, a sixth transistor, a seventh transistor and a capacitor ;

The gate electrode of the first transistor is used for receiving the first scan signal, the first terminal is used for receiving the reference voltage, and the second terminal is electrically connected to the first terminal of the capacitor and the gate of the third transistor , the first end of the fifth transistor;

The gate electrode of the second transistor is used for receiving the enable signal, and the first terminal is used for receiving the positive voltage of the power supply, and the second terminal is electrically connected to the first terminal of the third transistor and the terminal of the fourth transistor. first end;

The second end of the third transistor is electrically connected to the second end of the fifth transistor and the first end of the sixth transistor;

The gate electrode of the fourth transistor is used for receiving the second scan signal, and the second terminal is used for receiving the data voltage;

the gate electrode of the fifth transistor is used for receiving the second scan signal;

The gate electrode of the sixth transistor is used for receiving the enable signal, and the second terminal is respectively connected to the first switch control module and the second switch control module, and the first terminal of the seventh transistor;

The gate electrode of the seventh transistor is used for receiving the scan signal, and the second terminal is used for receiving the reference voltage;

The first switch control module includes an eighth transistor, the gate electrode of the eighth transistor is used for receiving the first switch control data signal, and the first end is electrically connected to the second end of the sixth transistor, and the first end is electrically connected to the second end of the sixth transistor. The two terminals are electrically connected to the anode of the first micro-LED of the third sub-pixel;

The second switch control module includes a ninth transistor, the gate electrode of the ninth transistor is used for receiving the second switch control data signal, and the first end is electrically connected to the second end of the sixth transistor, and the first end is electrically connected to the second end of the sixth transistor. The two terminals are electrically connected to the anode of the second miniature light-emitting diode;

The cathode of the first micro-LED and the cathode of the second micro-LED of the third sub-pixel are both connected to the negative voltage of the power supply.
An electronic device, characterized in that it includes a display screen assembly and a casing assembly, the display screen assembly is mounted on the casing assembly, and the display screen assembly includes:

A display module includes a plurality of pixel units and a driving circuit, the pixel units include a first sub-pixel, a second sub-pixel, a third sub-pixel and a fourth sub-pixel, the first sub-pixel, the second sub-pixel The pixel, the third sub-pixel and the fourth sub-pixel are arranged in a matrix, the third sub-pixel and the fourth sub-pixel are both blue sub-pixels, and the fourth sub-pixel emits harmful blue light an amount lower than the harmful blue light emission amount of the third sub-pixel, the third sub-pixel and the fourth sub-pixel are respectively configured to be individually controlled by the driving circuit to emit light or to extinguish; and

The display screen cover plate is covered on the side of the display module away from the housing assembly.