CN112233609A

CN112233609A - Electronic equipment and display module

Info

Publication number: CN112233609A
Application number: CN202011077102.5A
Authority: CN
Inventors: 张健民
Original assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Current assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Priority date: 2020-10-10
Filing date: 2020-10-10
Publication date: 2021-01-15
Also published as: WO2022073396A1

Abstract

The application provides an electronic equipment and display module assembly relates to and shows technical field. The display module comprises a plurality of pixel units and a driving circuit, wherein each pixel unit comprises a first sub-pixel, a second sub-pixel, a third sub-pixel and a fourth sub-pixel, the first sub-pixel, the second sub-pixel, the third sub-pixel and the fourth sub-pixel are arranged in a matrix mode, the third sub-pixel and the fourth sub-pixel are blue sub-pixels, the emission quantity of harmful blue light of the fourth sub-pixel is lower than that of the third sub-pixel, and the third sub-pixel and the fourth sub-pixel are respectively configured to be independently controlled by the driving circuit to emit light or extinguish. The method provided by the application is that a fourth sub-pixel is added in the existing pixel structure, the fourth sub-pixel is used as a standby sub-pixel for replacing the third sub-pixel which is also a blue sub-pixel, and then the fourth sub-pixel is used for replacing the third sub-pixel to emit light for the display module in an eye protection scene.

Description

Electronic equipment and display module

Technical Field

The application relates to the technical field of display, in particular to an electronic device and a display module.

Background

The blue light filtering and eye protection is one of the problems to be solved urgently in the display screen industry, and at present, the blue light intensity of an LCD display screen is higher, the wavelength is shorter, and the damage to human eyes is larger.

Disclosure of Invention

In one aspect, the present application provides a display module, including a plurality of pixel units and a driving circuit, where each pixel unit includes a first sub-pixel, a second sub-pixel, a third sub-pixel, and a fourth sub-pixel, the first sub-pixel, the second sub-pixel, the third sub-pixel, and the fourth sub-pixel are arranged in a matrix, the third sub-pixel and the fourth sub-pixel are both blue sub-pixels, and the emission amount of harmful blue light of the fourth sub-pixel is lower than that of the third sub-pixel, and the third sub-pixel and the fourth sub-pixel are respectively configured to be individually controlled by the driving circuit to emit light or extinguish light.

The embodiment of the application provides an electronic equipment again, including display screen subassembly and housing assembly, the display screen unit mount is in on the housing assembly, the display screen subassembly includes the display screen apron and the aforesaid the display module assembly, the display screen apron lid is established the display module assembly is kept away from one side of housing assembly.

The method provided by the application is that a fourth sub-pixel is added in the existing pixel structure, the fourth sub-pixel is used as a standby sub-pixel for replacing the third sub-pixel which is also a blue sub-pixel, and then the fourth sub-pixel is used for replacing the third sub-pixel to emit light for the display module in an eye protection scene.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings without creative efforts.

Fig. 1 discloses a schematic structural diagram of an electronic device according to an embodiment of the present application;

FIG. 2 is a schematic diagram of a display panel assembly according to an embodiment of the present application;

FIG. 3 is a schematic diagram illustrating a partial structure of a display module according to an embodiment of the present disclosure;

FIG. 4 is a schematic diagram illustrating a partial structure of a display module according to an embodiment of the present disclosure;

FIG. 5 is a flowchart of a repair method according to an embodiment of the present application;

FIG. 6 is a schematic view of a display module according to an embodiment of the present disclosure;

FIG. 7 is a schematic diagram illustrating a structure of a display module after a bulk transfer operation according to an embodiment of the present application;

FIG. 8 discloses a partial flow chart of a repairing method according to an embodiment of the present application;

FIG. 9 is a schematic view of a display module during a repairing process according to an embodiment of the present disclosure;

FIG. 10 is a schematic view of a display module during a repairing process according to an embodiment of the present disclosure;

FIG. 11 is a schematic view of a display module during a repairing process according to an embodiment of the present disclosure;

FIG. 12 is a schematic view of a display module during a repairing process according to an embodiment of the present disclosure;

FIG. 13 is a schematic diagram of a repair method according to an embodiment of the present application;

FIG. 14 is a schematic view of a portion of a display module according to an embodiment of the present disclosure;

FIG. 15 is a schematic view of a display module according to an embodiment of the present disclosure;

FIG. 16 is a schematic view of a display module according to an embodiment of the present application;

FIG. 17 discloses a driving circuit diagram for driving two B sub-pixels according to an embodiment of the present application;

FIG. 18 is a schematic view of a portion of a display module according to an embodiment of the present application;

FIG. 19 is a schematic view of a portion of a display module according to an embodiment of the present application;

FIG. 20 is a schematic view of a portion of a display module according to an embodiment of the present application;

FIG. 21 is a schematic diagram illustrating a structure of a pixel unit according to an embodiment of the present application;

FIG. 22 is a schematic diagram illustrating a pixel unit according to an embodiment of the present disclosure;

FIGS. 23 and 24 respectively illustrate a partial structure of a display panel assembly according to an embodiment of the present application;

fig. 25 discloses a wiring and control schematic diagram of Micro LEDs in a pixel unit according to an embodiment of the present application.

Detailed Description

The present application will be described in further detail with reference to the accompanying drawings and embodiments. In particular, the following embodiments are merely illustrative of the present application, and do not limit the scope of the present application. Likewise, the following embodiments are only some embodiments of the present application, not all embodiments, and all other embodiments obtained by those skilled in the art without any inventive work are within the scope of the present application.

Reference herein to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the application. The appearances of the phrase in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. It is explicitly and implicitly understood by one skilled in the art that the embodiments described herein can be combined with other embodiments.

As used herein, "electronic equipment" (which may also be referred to as a "terminal" or "mobile terminal" or "electronic device") includes, but is not limited to, devices that are configured to receive/transmit communication signals via a wireline connection, such as via a Public Switched Telephone Network (PSTN), a Digital Subscriber Line (DSL), a digital cable, a direct cable connection, and/or another data connection/network, and/or via a wireless interface (e.g., for a cellular network, a Wireless Local Area Network (WLAN), a digital television network such as a DVB-H network, a satellite network, an AM-FM broadcast transmitter, and/or another communication terminal). A communication terminal arranged to communicate over a wireless interface may be referred to as a "wireless communication terminal", "wireless terminal" or "mobile terminal". Examples of mobile terminals include, but are not limited to, satellite or cellular telephones; a Personal Communications System (PCS) terminal that may combine a cellular radiotelephone with data processing, facsimile and data communications capabilities; PDAs that may include radiotelephones, pagers, internet/intranet access, Web browsers, notepads, calendars, and/or Global Positioning System (GPS) receivers; and conventional laptop and/or palmtop receivers or other electronic devices that include a radiotelephone transceiver. A cellular phone is an electronic device equipped with a cellular communication module.

Please refer to fig. 1, which discloses a schematic structural diagram of an electronic device according to an embodiment of the present application. The electronic device 100 may include a housing assembly 300 and a display screen assembly 600. Wherein the housing assembly 300 is used to carry the display screen assembly 600. Of course, the housing assembly 300 may also be used to carry electronic components such as a camera module, a battery, a motherboard, a processor, and various sensors in the electronic device 100. The display screen assembly 600 is used to display information. The display screen assembly 600 is mounted on the housing assembly 300.

In one embodiment, the housing assembly 300 may be a housing-like structure, and an accommodating space may be disposed inside the housing assembly to accommodate electronic components such as a camera module, a battery, a motherboard, a processor, and various sensors.

In one embodiment, please refer to fig. 2, which discloses a schematic structural diagram of a display screen assembly 600 according to an embodiment of the present application. The display screen assembly 600 may include a display screen cover 10 and a display module 20. Specifically, the display screen cover 10 and the display module 20 are stacked. The display module 20 is a main structure of the display panel assembly 600 for displaying images. The side of the display module 20 away from the display panel cover 10 is connected to the housing assembly 300. That is, the display cover 10 covers the display module 20 at a side away from the housing assembly 300. The display cover 10 is used for transmitting light of an image displayed by the display module 20. So that the user can view the image displayed by the display module 20 through the display cover 10.

In an embodiment, the display panel cover 10 may be made of a light-transmitting material such as glass or resin, and is not limited in this respect. The display panel cover 10 is used for protecting the display module 20 and electronic components inside the electronic device 100. The display screen cover 10 can prevent the display module 20 from being damaged. The user can view the image displayed by the display module 20 through the display cover 10. In an embodiment, the display module 20 may be an AMOLED (Active-matrix organic Light emitting diode) display module, a Micro LED (Micro Light emitting diode) display module, or even an lcd (liquid Crystal display) display module or a QLED (Quantum dot Light emitting diode) display module.

Next, the display module 20 is a Micro LED display module as an example. Please refer to fig. 3, which discloses a partial structural diagram of the display module 20 according to an embodiment of the present application. The display module 20 may include pixel units 21 arranged in a matrix. Each pixel unit 21 may be formed by a plurality of sub-pixel matrix arrangements.

In one embodiment, each pixel unit 21 may include four sub-pixels, such as a first sub-pixel 211, a second sub-pixel 212, a third sub-pixel 213, and a fourth sub-pixel 214. The first sub-pixel 211, the second sub-pixel 212, the third sub-pixel 213, and the fourth sub-pixel 214 may be arranged in a 2 × 2 matrix.

The terms "first", "second" and "third" in this application are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implying any indication of the number of technical features indicated. Thus, a feature defined as "first," "second," or "third" may explicitly or implicitly include at least one of the feature.

In one embodiment, one of the first sub-pixel 211, the second sub-pixel 212, and the third sub-pixel 213 may be an R sub-pixel (red sub-pixel), another one of the two may be a G sub-pixel (green sub-pixel), the remaining one may be a B sub-pixel (blue sub-pixel), and the fourth sub-pixel 214 may be one of an R sub-pixel, a G sub-pixel, a B sub-pixel, and a W sub-pixel (white sub-pixel).

In one embodiment, referring to fig. 3, in a 2 × 2 matrix arrangement, the first sub-pixel 211 and the second sub-pixel 212 are located in the same pixel row, and the third sub-pixel 213 is located in the same pixel column. The fourth sub-pixel 214 is located in the same pixel column as the second sub-pixel 212 and in the same pixel row as the third sub-pixel 213.

In an embodiment, referring to fig. 3 and 4, fig. 4 discloses a partial structural schematic diagram of a display module 20 according to an embodiment of the present application. The first sub-pixel 211 may be an R sub-pixel, the second sub-pixel 212 may be a G sub-pixel, the third sub-pixel 213 may be a B sub-pixel, and the fourth sub-pixel 214 may be one of an R sub-pixel, a G sub-pixel, a B sub-pixel, and a W sub-pixel. For example, the fourth subpixel 214 may be a W subpixel.

The micro light emitting diode is a core device for developing next generation display technology and equipment, and the application of the micro light emitting diode core technology in the display field faces a major breakthrough. However, there are still many problems to be solved in industrialization, such as: the method comprises the following steps of micro-scale and array, chip mass transfer and color transformation, detection and repair and the like, wherein the mass transfer and repair technology is the key technology which needs to be broken through firstly. Due to the corresponding relationship between the transfer yield and the damage number of the micro light-emitting diodes, the repair capability of the damage of the micro light-emitting diodes is improved besides the yield of mass transfer, which is important for improving the yield.

Next, a method for repairing a damaged sub-pixel in the display module 20 is described, in which the fourth sub-pixel 214 is used to replace other damaged sub-pixels (i.e. sub-pixels that cannot normally operate). For example, if the first sub-pixel 211 is a defective sub-pixel, then the fourth sub-pixel 214 is used to replace the first sub-pixel 211. If none of the sub-pixels of one pixel unit 21 except the fourth sub-pixel 214 are damaged sub-pixels, i.e. none of the sub-pixels except the fourth sub-pixel 214 are damaged or fail. Then the fourth sub-pixel 214 in the pixel unit 21 may not emit light, for example, the fourth sub-pixel 214 is not powered on, that is, the fourth sub-pixel 214 is turned off, for example, the fourth sub-pixel 214 is shielded from light.

The repairing method does not need to arrange a redundant circuit, can reduce the area of a driving circuit, improves the yield and improves the density of display pixels; in addition, a secondary transfer repair (De-Bonding (a process of taking the micro light-emitting diode crystal grains off the display module 20), a cleaning process, a Bonding (a process of fixing the micro light-emitting diode crystal grains on the display module 20) process and the like) is not required, so that the repair process is simplified, the huge repair efficiency of the micro light-emitting diode is greatly improved, and the repair cost is reduced. Please refer to fig. 5, which discloses a flowchart of a repair method according to an embodiment of the present application. The method can comprise the following steps:

step S001: and transferring a plurality of pixel units to be processed onto a driving substrate.

Please refer to fig. 6, which discloses a schematic structural diagram of a display module 20 according to an embodiment of the present application. The display module 20 may include a pixel unit 21, a driving substrate 22, and a transparent substrate 23. Wherein the pixel cells 21 constitute a pixel cell layer. The transparent substrate 23, the pixel unit layer, and the driving substrate 22 are sequentially stacked. The driving substrate 22 is disposed with a driving circuit layer 221 composed of a driving circuit, and the driving circuit is used for electrically connecting with the sub-pixels in the pixel unit 21, such as the first sub-pixel 211, the second sub-pixel 212, the third sub-pixel 213, and the fourth sub-pixel 214, so as to achieve the effect of driving the sub-pixels, such as the first sub-pixel 211, the second sub-pixel 212, the third sub-pixel 213, and the fourth sub-pixel 214 to display. The driving circuit layer 221 is disposed on a side of the driving substrate 22 facing the pixel unit layer.

In an embodiment, each sub-pixel may include a first micro light emitting diode die, a micro light emitting diode die, and a color filter color resist layer (e.g., a first color filter color resist layer, a second color filter color resist layer). The first micro light-emitting diode crystal grain and the micro light-emitting diode crystal grain are arranged on the driving circuit. The color film color resistance layer is arranged on one side of the first miniature light-emitting diode crystal grain and one side of the miniature light-emitting diode crystal grain, which are far away from the driving circuit layer 221, and can be used for respectively packaging the first miniature light-emitting diode crystal grain and the miniature light-emitting diode crystal grain to form a miniature light-emitting diode, so that the chromaticity uniformity of the first miniature light-emitting diode crystal grain and the miniature light-emitting diode crystal grain is better. In an embodiment, the color filter color resistance layer can control the chromaticity of the first micro light-emitting diode crystal grain and the micro light-emitting diode crystal grain through the coating thickness precision. It is understood that a color filter color resist layer, such as the first color filter color resist layer, may be used to encapsulate the first micro light emitting diode die to form the first micro light emitting diode. The color filter color resistance layer, such as the second color filter color resistance layer, can be used for packaging the micro light-emitting diode crystal grains to form a second micro light-emitting diode.

For example, the first sub-pixel 211 may include a first micro light emitting diode die 2111 and a first color filter layer 2112. The first micro led die 2111 is electrically connected to the driving circuit. The first color filter color resistance layer 2112 is disposed on a side of the first micro light emitting diode die 2111 away from the driving circuit layer 221, and is configured to change the chromaticity of the first micro light emitting diode die 2111. For example, the first sub-pixel 211 is an R sub-pixel, the first micro light emitting diode die 2111 may be any one of a micro light emitting diode die having a red light emitting color, a micro light emitting diode die having a green light emitting color, a micro light emitting diode die having a blue light emitting color, and a micro light emitting diode die having a white light emitting color, and the first color filter layer 2112 is a red color filter layer for changing the chromaticity of the first micro light emitting diode die 2111. When the first micro light emitting diode die 2111 is a micro light emitting diode die with a red light emitting color, the red color film color resistance layer can make the chromaticity uniformity of the micro light emitting diode die with the red light emitting color better.

For example, the second sub-pixel 212 may include a first micro light emitting diode die 2121 and a first color filter layer 2122. The first micro led die 2121 is electrically connected to the driving circuit. The first color filter color resistance layer 2122 is disposed on a side of the first micro light emitting diode die 2121 away from the driving circuit layer 221, and is configured to change the chromaticity of the first micro light emitting diode die 2121. For example, the second sub-pixel 212 is a G sub-pixel, the first micro light emitting diode die 2121 may be any one of a red micro light emitting diode die, a green micro light emitting diode die, a blue micro light emitting diode die, and a white micro light emitting diode die, and the first color filter layer 2122 is a green color filter layer for changing the chromaticity of the first micro light emitting diode die 2121. When the first micro light emitting diode crystal grain 2121 is a micro light emitting diode crystal grain with a green emitting color, the green color film color resistance layer can make the chromaticity uniformity of the micro light emitting diode crystal grain with the green emitting color better.

For example, the third sub-pixel 213 may include a first micro light emitting diode die 2131 and a first color filter layer 2132. The first micro led die 2131 is electrically connected to the driving circuit. The first color filter layer 2132 is disposed on a side of the first micro light emitting diode die 2131 away from the driving circuit layer 221, and is configured to change chromaticity of the first micro light emitting diode die 2131. For example, the third sub-pixel 213 is a B sub-pixel, the first micro light emitting diode die 2131 may be any one of a red micro light emitting diode die, a green micro light emitting diode die, a blue micro light emitting diode die, and a white micro light emitting diode die, and the first color filter layer 2132 is a blue color filter layer for changing the chromaticity of the first micro light emitting diode die 2131. When the first micro light emitting diode die 2131 is a blue micro light emitting diode die, the blue color film color resist layer can make the chromaticity uniformity of the blue micro light emitting diode die better.

For example, the fourth sub-pixel 214 may include a micro light emitting diode die 2141 and a second color filter layer 2142. The micro led die 2141 is electrically connected to the driving circuit. The second color filter color resist 2142 is disposed on a side of the micro light emitting diode die 2141 away from the driving circuit layer 221, and is configured to change the chromaticity of the micro light emitting diode die. For example, the fourth sub-pixel 214 is a B sub-pixel, the micro led die 2141 may be any one of a red micro led die, a green micro led die, a blue micro led die, and a white micro led die, and the second color filter layer 2142 is a blue color filter layer for changing the chromaticity of the micro led die 2141. In an embodiment, the color of the micro led die 2141 is the same as the color of the second color filter color resist layer 2142. When any one of the first, second, and third sub-pixels 211, 212, and 213 is damaged, the fourth sub-pixel 214 may be substituted.

It is understood that the color of the sub-pixels can be determined by the color of the color filter color resist layer, and the micro light emitting diodes can also be determined by the color of the color filter color resist layer.

In the present embodiment, a driving substrate 22 is prepared for carrying the sub-pixels and forming the display module 20. In an embodiment, the driving substrate 22 may be a transparent substrate, such as a glass substrate, or a polyimide film, and it is understood by those skilled in the art that the driving substrate 22 may also be other materials, which is not limited herein.

In this embodiment, according to the display module 20 shown in fig. 3, 4 and 6, one pixel unit to be processed may include three first micro led dies and one micro led die. In an embodiment, please refer to fig. 7, which discloses a schematic structural diagram of the display module 20 after the transfer operation in an embodiment of the present application. A large number of micro led dies are transferred onto the driving substrate 22 to fabricate the display module 20. The driving substrate 22 is provided with a driving circuit, and the first micro light emitting diode die 2111, the first micro light emitting diode die 2121, the first micro light emitting diode die 2131 and the micro light emitting diode die 2141 are electrically connected to the driving circuit on the driving substrate 22, respectively.

In one embodiment, a bulk transfer method may be used in the transfer of the pixel unit to be processed.

The mass transfer method may be an electrostatic mass transfer method, a Van der Waals mass transfer method, a magnetic mass transfer method, a Selective Release (Selective Release) mass transfer method, a Self-Assembly (Self-Assembly) mass transfer method, or a transfer Printing (Roll Printing) mass transfer method, and the mass transfer method is not particularly limited. Wherein:

the huge electrostatic force transfer method adopts a transfer head with a double-stage structure, positive and negative voltages are respectively applied to the transfer head in the transfer process, when a silicon electrode is electrified positively to grasp a micro light-emitting diode grain, the micro light-emitting diode grain is adsorbed on the transfer head, and when the micro light-emitting diode grain needs to be placed at a preset position of a driving substrate 22, the other silicon electrode is electrified negatively to complete the transfer.

The van der waals force mass transfer method uses an elastic stamp in combination with a high precision motion control print head to allow the micro led die to be adhered to the transfer head or printed on a predetermined position of the driving substrate 22 by changing the speed of the print head using van der waals force.

The magnetic mass transfer method mixes magnetic materials such as iron, cobalt and nickel on the micro light-emitting diode crystal grains before cutting, and utilizes electromagnetic attraction and release.

The selective release bulk transfer method transfers the micro light emitting diode grains directly from the original position, and the most current realization mode is patterned laser lift-off (p-LLO), i.e. excimer laser is used to irradiate the sparsely separated mould size area on the gallium nitride slice on the growth interface, and then gallium element and nitrogen gas are generated by ultraviolet exposure, and are transferred to the substrate in parallel, so as to realize the precise optical array.

The self-assembly bulk transfer method uses a brush barrel to roll on a substrate, so that the micro-light emitting diode crystal grains are placed in a liquid suspension, and the micro-light emitting diode crystal grains fall into corresponding wells on the driving substrate 22 through fluid force.

The mass transfer method mostly uses a roller transfer method, such as Roll-to-Roll transfer technology, in which the rolling method can simultaneously transfer and interconnect through mechanical deformation, and the uniformity of the micro-led die can be controlled on the production line.

And step S002, respectively carrying out color resistance packaging on the three first micro light-emitting diode crystal grains to form three first micro light-emitting diodes.

In an embodiment, please refer to fig. 8, which discloses a partial flowchart of a repairing method in an embodiment of the present application. And, in step S002, may include:

step S011: a black matrix is arranged on the drive substrate.

Referring to fig. 6 and 9, fig. 9 is a schematic structural diagram of a display module 20 in a repairing process according to an embodiment of the present disclosure. The display module 20 may include a black matrix 215, and the black matrix 215 is disposed on a side of the driving substrate 22 where the driving circuit is disposed. The black matrix 215 is used to define the sub-pixels. The black matrix 215 has a plurality of receiving spaces. The black matrix 215 and the pixel cells 21 may constitute a pixel cell layer.

Step S012: and arranging the first micro light-emitting diode crystal grains and the micro light-emitting diode crystal grains in the accommodating spaces in a one-to-one correspondence manner.

Referring to fig. 9, the first micro led dies 2111, 2121, 2131 and the micro led die 2141 are separated by the black matrix 215. The first micro light emitting diode die and the micro light emitting diode die can be transferred into the accommodating spaces by adopting the transfer mode in the embodiment.

Step S013: the ink is filled in the accommodating space provided with the first micro light-emitting diode crystal grain so as to cover the first micro light-emitting diode crystal grain.

Referring to fig. 6 and 10, fig. 10 is a schematic structural diagram of a display module 20 in a repairing process according to an embodiment of the present disclosure. In the sub-pixels defined by the black matrix 215, the accommodating space is filled with the first color filter resist layer. In an embodiment, the first color filter layer 2112 is filled in the accommodating space where the first micro light emitting diode die 2111 is located, and covers the first micro light emitting diode die 2111. The first color filter color resistance layer 2122 is filled in the accommodating space where the first micro light emitting diode die 2121 is located, and covers the first micro light emitting diode die 2121. The first color filter layer 2132 is filled in the accommodating space where the first micro light emitting diode die 2131 is located, and covers the first micro light emitting diode die 2131. And the adjustment of the first color film color resistance layer on the grain chromaticity of the first miniature light-emitting diode is realized.

In an embodiment, in step S013, the first color filter layer may be prepared into ink, and the ink is filled in the accommodating space where the first micro light emitting diode die is located by using an inkjet printing process.

Step S014: and curing and packaging to form the first micro light-emitting diode.

Referring to fig. 10, three first micro light emitting diodes are formed in one pixel unit 21 by waiting for the ink to cure and encapsulate the first micro light emitting diode dies 2111, 2121 and 2131. In the process, the chromaticity of the micro light-emitting diode crystal grain can be accurately controlled by changing the coating thickness, the color and the like of the color film color resistance layer.

In an embodiment, referring to fig. 10, the first micro led die 2111 is a red micro led die, the first micro led die 2121 is a green micro led die, and the first micro led die 2131 is a blue micro led die. Correspondingly, the first color film color resistor 2112 filled in the accommodating space of the first micro light emitting diode die 2111 is a red color film color resistor, the first color film color resistor 2122 filled in the accommodating space of the first micro light emitting diode die 2121 is a green color film color resistor, and the first color film color resistor 2132 filled in the accommodating space of the first micro light emitting diode die 2131 is a blue color film color resistor. And then the light emitting colors of the three first micro light emitting diodes are respectively red, blue and green.

Step S003: a driving substrate provided with a plurality of pixel units is provided.

In one embodiment, the driving substrate processed in step S014 may be provided. Of course, the driving substrate may be processed in step SS012 or SS 013. Referring to fig. 6 and 10, a pixel unit 21 may include first micro light emitting diode dies 2111, 2121 and 2131 and a micro light emitting diode die 2141.

Step S004: and detecting whether each first miniature light-emitting diode can work normally.

The sub-pixel is damaged because the micro light emitting diode is damaged and cannot work normally. Therefore, the detection of the micro light emitting diode is helpful to ensure the qualification rate of the display module 20, and the micro light emitting diode dies which cannot normally work, such as the first micro light emitting diode dies 2111, 2121, 2131 and the micro light emitting diode dies, can be replaced when the micro light emitting diode which cannot normally work is detected.

Of course, in the detection process, the micro light emitting diode die detection may be performed before each first micro light emitting diode die is packaged to form a first micro light emitting diode, or after each first micro light emitting diode die is packaged to form a first micro light emitting diode, generally before each first micro light emitting diode die is packaged to form a first micro light emitting diode, so as to avoid 2 to 4 micro light emitting diode dies which cannot normally operate in one pixel unit 21. Of course, the probability of this situation is very low, and when it is ensured that there is one micro light emitting diode die which cannot operate normally in one pixel unit 21, the process may be performed after each first micro light emitting diode die is packaged to form 1 first micro light emitting diode.

Step S005: if the pixel unit has the first miniature light-emitting diode which can not work normally, the miniature light-emitting diode crystal grain is subjected to color resistance packaging to replace the light-emitting function of the first miniature light-emitting diode which can not work normally in the pixel unit.

When it is ensured in step S005 that only 1 micro led die incapable of normal operation exists in one pixel unit 21, the micro led die 2141 may be packaged, and the micro led die incapable of normal operation may be replaced. In the packaging process, for example, as shown in fig. 10, the first micro led die 2111 cannot work normally, and the first sub-pixel 211 is an R sub-pixel, so the micro led die 2141 needs to be packaged to form an R sub-pixel instead of the first sub-pixel 211.

The micro light-emitting diode crystal grains 2141 are preset for standby, so that the repair of the sub-pixels with specific colors is achieved, and finally, the huge repair of the micro light-emitting diode crystal grains with low cost and high efficiency is achieved.

In one embodiment, step S005 may include: the ink is filled in the accommodating space provided with the micro light emitting diode die 2141 to cover the micro light emitting diode die 2141, and the second micro light emitting diode is formed by curing and packaging.

Please refer to fig. 11, which discloses a schematic structural diagram of the display module 20 in the repairing process according to an embodiment of the present application. The light emitting color of the second micro light emitting diode is the same as the original light emitting color of the replaced first micro light emitting diode, so that the fourth sub-pixel 214 can replace the sub-pixel which can not work normally; the color coordinate of the pixel unit provided with the second micro light-emitting diode is the same as that of the pixel unit when each first micro light-emitting diode normally works, so that the micro light-emitting diode crystal grains which can not normally work can be addressed, and the micro light-emitting diode crystal grains which can not normally work can be repaired.

For example, in one pixel, the first micro led die 2121 is a damaged first micro led die, and the micro led die 2141 and the first micro led die 2121 are in the same pixel, so the micro led die 2141 is used as a spare micro led die to replace the damaged first micro led die 2121, and the micro led die 2141 is color-resistance packaged to form a second micro led, and the light emitting color of the second micro led is the same as the original light emitting color of the replaced first micro led.

In an embodiment, referring to fig. 11 and 12, fig. 12 discloses a schematic structural diagram of a display module 20 in a repairing process according to an embodiment of the present application. The second color filter layer 2142 may control the chromaticity of the micro light emitting diode die 2141, for example, the micro light emitting diode die 2141 is a white micro light emitting diode die, the second color filter layer 2142 is a green color filter layer, and the light emitting color of the second micro light emitting diode should be green. For example, the micro light emitting diode die 2141 is a micro light emitting diode die having a red light emitting color, and the second color filter layer 2142 is a blue color filter layer, so that the light emitting color of the second micro light emitting diode die should be blue.

That is, the light emitting color of the second micro light emitting diode is determined by the color of the second color filter layer 2142 itself.

In an embodiment, in the filling process of the second color filter layer 2142, the second color filter layer 2142 may be prepared into ink, and the ink is filled in the accommodating space where the micro light emitting diode die 2141 is located by using an inkjet printing process, and the micro light emitting diode die 2141 is packaged after the ink is cured. In the process, the chromaticity of the micro light-emitting diode crystal grain can be accurately controlled by changing the coating thickness, the color and the like of the color film color resistance layer.

In an embodiment, please refer to fig. 13, which discloses a schematic structural diagram of a repairing method in an embodiment of the present application. After step S004, the method may further include:

step S021: and attaching a transparent substrate on one side of the pixel unit far away from the driving substrate.

Referring to fig. 6, the display module 20 further includes a transparent substrate 23, and the transparent substrate 23 is disposed on a side of the pixel unit layer away from the driving substrate 22 and stacked with the pixel unit layer. Specifically, the two components can be connected and fixed by means of bonding, for example, the two components can be directly bonded, and can also be bonded by optical clear adhesive (OCA optical adhesive). The encapsulation of the pixel unit 21 is completed by the transparent substrate 23 and the black matrix 215. In one embodiment, the transparent substrate 23 may be a transparent material such as glass, plastic, etc. Referring to fig. 2, the display cover 10 covers the display module 20 on the side where the transparent substrate 23 is disposed. In one embodiment, the display cover 10 and the display module 20 may be bonded by optically clear adhesive (OCA optical adhesive). In an embodiment, the transparent substrate 23 may be omitted, and the display screen cover plate 10 is disposed on a side of the pixel unit layer far from the driving substrate 22 instead of the transparent substrate 23, that is, the display screen cover plate 10 is disposed on top of the pixel unit layer.

It is understood that the display module 20 manufactured by the above repairing method may include a pixel unit layer, a driving substrate 22 and a transparent substrate 23, which are sequentially stacked, wherein each pixel unit 21 in the pixel unit layer is provided with a first sub-pixel 211, a second sub-pixel 212, a third sub-pixel 213 and a fourth sub-pixel 214. And there is a pixel cell 21 in the pixel cell layer having a damaged sub-pixel, and the fourth sub-pixel 214 in the pixel cell 21 having a damaged sub-pixel replaces the damaged sub-pixel. The fourth sub-pixel 214 can make the light emitting color of the second micro light emitting diode the same as the light emitting color of the first micro light emitting diode which cannot normally work through the cooperation of the micro light emitting diode crystal grain 2141 and the second color film color resistance layer 2142.

In the visible light emitted by the Micro LED display module, the shortest wavelength and the strongest energy is blue light (380-500 nm), and the blue light is used as the strongest visible light, including blue light, indigo light and purple light, and penetrates through a cornea and a crystal to directly enter a macula part, so that the oxidation of cells of the macula part is accelerated, and retinal photoreceptor cells are damaged. In order to filter blue light and protect eyes, the Micro light-emitting diode crystal grains are used for assisting the B sub-pixels, so that the Micro LED display module component is used in scenes, and the requirements of low blue light eye protection are met on the premise of ensuring the luminous efficiency and power consumption of the blue light LED. Please refer to fig. 14, which discloses a partial structural diagram of the display module 20 according to an embodiment of the present application. The display module 20 may include pixel units 21 arranged in a matrix. Each pixel unit 21 may be formed by a plurality of sub-pixel matrix arrangements.

In one embodiment, one of the first sub-pixel 211, the second sub-pixel 212, and the third sub-pixel 213 may be an R sub-pixel, another one of the two may be a G sub-pixel, the remaining one may be a B sub-pixel, and the fourth sub-pixel 214 may be a B sub-pixel. In one embodiment, the fourth sub-pixel 214 has a lower amount of harmful blue emission than the sub-pixel that is the other B sub-pixel. In one embodiment, the blue light emission can be reduced by adjusting the light emission efficiency, for example, the light emission efficiency of the fourth sub-pixel 214 is lower than the light emission efficiency of the sub-pixel as another B sub-pixel.

In one embodiment, referring to fig. 14, in a 2 × 2 matrix arrangement, the first sub-pixel 211 and the fourth sub-pixel 214 are located in the same pixel row, and the third sub-pixel 213 is located in the same pixel column. The second sub-pixel 212 and the fourth sub-pixel 214 are located in the same pixel column, and are located in the same pixel row as the third sub-pixel 213.

In an embodiment, please refer to fig. 14 and 15, and fig. 15 discloses a partial structural schematic diagram of the display module 20 in an embodiment of the present application. The first sub-pixel 211 may be an R sub-pixel, the second sub-pixel 212 may be a G sub-pixel, the third sub-pixel 213 may be a B sub-pixel, and the fourth sub-pixel 214 may be a B sub-pixel. In one embodiment, the amount of harmful blue light emission of the fourth sub-pixel 214 is lower than the amount of harmful blue light emission of the third sub-pixel 213. In one embodiment, the light emitting efficiency of the fourth sub-pixel 214 is lower than that of the third sub-pixel 213. When the display module 20 normally operates (i.e., displays a message), the third sub-pixel 213 is normally displayed as the B sub-pixel, the fourth sub-pixel 214 may not be displayed, and the fourth sub-pixel 214 may also be displayed, which is not limited herein. In some eye-protection use scenes, such as e-book reading, cell phone use in late night, news reading, etc., the fourth sub-pixel 214 is normally displayed (i.e., lit) as the B sub-pixel, and the third sub-pixel 213 is not displayed (i.e., turned off) as the B sub-pixel. The harmful blue light emission of the B sub-pixel is reduced through using scenes for protecting eyes, and the effect of protecting eyes is achieved.

Please refer to fig. 16, which discloses a schematic structural diagram of a display module 20 according to an embodiment of the present application. The display module 20 may include a pixel unit 21, a driving substrate 22, and a transparent substrate 23. The transparent substrate 23, the pixel unit layer including the pixel unit 21, and the driving substrate 22 are sequentially stacked. The driving substrate 22 is disposed with a driving circuit layer 221 composed of a driving circuit, and the driving circuit is used for electrically connecting with the sub-pixels in the pixel unit 21, such as the first sub-pixel 211, the second sub-pixel 212, the third sub-pixel 213, and the fourth sub-pixel 214, so as to achieve the effect of driving the sub-pixels, such as the first sub-pixel 211, the second sub-pixel 212, the third sub-pixel 213, and the fourth sub-pixel 214 to display. The driving circuit layer 221 is disposed on a side of the driving substrate 22 facing the pixel unit layer.

In an embodiment, each sub-pixel may include a first micro light emitting diode die, a micro light emitting diode die, and a color filter color resist layer (e.g., a first color filter color resist layer, a second color filter color resist layer). The first micro light-emitting diode crystal grain and the micro light-emitting diode crystal grain are arranged on the driving circuit. The color film color resistance layer is arranged on one side of the first miniature light-emitting diode crystal grain and the miniature light-emitting diode crystal grain, which is far away from the driving circuit layer 221, and is used for controlling the chromaticity of the first miniature light-emitting diode crystal grain and the miniature light-emitting diode crystal grain, so that the chromaticity uniformity of the first miniature light-emitting diode crystal grain and the miniature light-emitting diode crystal grain can be better. In an embodiment, the color filter color resistance layer can control the chromaticity of the first micro light-emitting diode crystal grain and the micro light-emitting diode crystal grain through the coating thickness precision.

For example, the fourth sub-pixel 214 may include a micro light emitting diode die 2141 and a second color filter layer 2142. The micro led die 2141 is electrically connected to the driving circuit. The second color filter color resist layer 2142 is disposed on a side of the micro light emitting diode die 2141 away from the driving circuit layer 221, and is configured to change the chromaticity of the micro light emitting diode die 2141. The fourth sub-pixel 214 is a B sub-pixel, the micro led die 2141 may be any one of a red micro led die, a green micro led die, a blue micro led die, and a white micro led die, and the second color filter color resist layer 2142 is a blue color filter color resist layer for changing the chromaticity of the micro led die 2141. In an embodiment, the micro led die 2141 may be a blue micro led die, and the second color filter layer 2142 is a blue color filter layer.

Referring to fig. 16, the display module 20 may include a black matrix 215, and the black matrix 215 is disposed on a side of the driving substrate 22 where the driving circuit is disposed. The black matrix 215 is used to define sub-pixels, and the black matrix 215 is provided with a plurality of accommodating spaces. The black matrix 215 and the pixel cells 21 may constitute a pixel cell layer. The first micro light emitting diode dies 2111, 2121 and 2131 and the micro light emitting diode dies 2141 are correspondingly disposed in the accommodating spaces. The black matrix 215 is provided as part of the pixel cell layer. The first color filter color resist layer 2112 is filled in the accommodating space where the first micro light emitting diode die 2111 is located, and covers the first micro light emitting diode die 2111. The first color filter color resistance layer 2122 is filled in the accommodating space where the first micro light emitting diode die 2121 is located, and covers the first micro light emitting diode die 2121. The first color filter layer 2132 is filled in the accommodating space where the first micro light emitting diode die 2131 is located, and covers the first micro light emitting diode die 2131. And the adjustment of the first color film color resistance layer on the grain chromaticity of the first miniature light-emitting diode is realized.

In an embodiment, referring to fig. 15, the first micro led die 2111 is a red micro led die, the first micro led die 2121 is a green micro led die, and the first micro led die 2131 is a blue micro led die. Correspondingly, the first color film color resistor 2112 filled in the accommodating space of the first micro light emitting diode die 2111 is a red color film color resistor, the first color film color resistor 2122 filled in the accommodating space of the first micro light emitting diode die 2121 is a green color film color resistor, and the first color film color resistor 2132 filled in the accommodating space of the first micro light emitting diode die 2131 is a blue color film color resistor.

In an embodiment, referring to fig. 15, the second color filter layer 2142 may control the chromaticity of the micro light emitting diode die 2141, for example, the micro light emitting diode die 2141 is a white micro light emitting diode die, and the second color filter layer 2142 is a blue color filter layer, so that the light emitting color of the micro light emitting diode should be blue. For example, the micro light emitting diode die 2141 is a micro light emitting diode die having a red light emitting color, and the second color filter layer 2142 is a blue color filter layer, so that the light emitting color of the micro light emitting diode die should be blue.

In an embodiment, referring to fig. 16, the display module 20 further includes a transparent substrate 23, and the transparent substrate 23 is disposed on a side of the pixel unit layer away from the driving substrate 22 and stacked with the pixel unit layer. Specifically, the two components can be connected and fixed by means of bonding, for example, the two components can be directly bonded, and can also be bonded by optical clear adhesive (OCA optical adhesive). The encapsulation of the pixel unit 21 is completed by the transparent substrate 23 and the black matrix 215. In one embodiment, the transparent substrate 23 may be a transparent material such as glass, plastic, etc. Referring to fig. 2, the display cover 10 covers the display module 20 on the side where the transparent substrate 23 is disposed. In one embodiment, the display cover 10 and the display module 20 may be bonded by optically clear adhesive (OCA optical adhesive). In an embodiment, the transparent substrate 23 may be omitted, and the display screen cover plate 10 is disposed on a side of the pixel unit layer far from the driving substrate 22 instead of the transparent substrate 23, that is, the display screen cover plate 10 is disposed on top of the pixel unit layer.

In one embodiment, each of the micro led dies is driven by a pixel driving module (a part of a driving circuit) disposed on the driving substrate 22, so that each of the micro led dies performs a display. Since there are two B sub-pixels, the two B sub-pixels need to be driven in common. Referring to fig. 17, a driving circuit diagram for driving two B sub-pixels according to an embodiment of the present application is disclosed. In the same pixel unit 21, the same output terminal of the pixel driving module 2211 is respectively connected to the first Switch control module (Switch1)2212 and the second Switch control module (Switch2)2213, the first Switch control module (Switch1)2212 is electrically connected to the first micro light emitting diode die 2131, so that the first Switch control module (Switch1)2212 controls the first micro light emitting diode die 2131 to turn off or emit light, and the second Switch control module (Switch2)2213 is electrically connected to the micro light emitting diode die 2141, so that the second Switch control module (Switch2)2213 controls the micro light emitting diode die 2141 to turn off or emit light. The first Switch control block (Switch1)2212 and the second Switch control block (Switch2)2213 are each controlled by one data signal. That is, the first micro led die 2131 and the micro led die 2141 are divided into two rows, the first Switch control module (Switch1)2212 is controlled by the first Switch control data signal Switch1, and the second Switch control module (Switch2)2213 is controlled by the second Switch control data signal Switch 2. The first Switch control module (Switch1)2212 is used for controlling the first micro led die 2131 to emit light or turn off, and the second Switch control module (Switch2)2213 is used for controlling the micro led die 2141 to emit light or turn off. In one embodiment, the pixel driving module for driving the R sub-pixel can be directly electrically connected to the first micro led die 2111 at the output end. In an embodiment, the pixel driving module for driving the G sub-pixel may be directly electrically connected to the first micro led die 2121 through the output terminal.

The pixel driving module 2211 may include a first transistor T1, a second transistor T2, a third transistor T3, a fourth transistor T4, a fifth transistor T5, a sixth transistor T6, a seventh transistor T7, and a capacitor C1.

The first transistor T1 has a gate electrode for receiving the SCAN signal SCAN1, a first terminal for receiving the reference voltage Vref, and a second terminal electrically connected to the first terminal of the capacitor C1, the gate of the third transistor T3, and the first terminal of the fifth transistor T5.

The second transistor T2 has a gate electrode for receiving the enable signal EMIT, a first terminal for receiving the power supply positive electrode voltage ELVDD, and a second terminal electrically connected to the first terminal of the third transistor T3 and the first terminal of the fourth transistor T4.

The second terminal of the third transistor T3 is electrically connected to the second terminal of the fifth transistor T5 and the first terminal of the sixth transistor T6.

A gate electrode of the fourth transistor T4 is for receiving the second SCAN signal SCAN2, and a second terminal thereof is for receiving the data voltage Vdata.

A gate electrode of the fifth transistor T5 is to receive the second SCAN signal SCAN 2.

The sixth transistor T6 has a gate electrode for receiving the enable signal EMIT and second ends connected to first ends of the first and second Switch control modules (Switch1 and Switch2) 2212 and 2213 and the seventh transistor T7, respectively.

The gate electrode of the seventh transistor T7 is for receiving the first SCAN signal SCAN1, and the second terminal thereof is for receiving the reference voltage Vref.

The first Switch control module (Switch1)2212 may include an eighth transistor T8, a gate electrode of the eighth transistor T8 is configured to receive the first Switch control data signal Switch1, a first end of the eighth transistor T8 is electrically connected to a second end of the sixth transistor T6, and a second end of the eighth transistor T8 is electrically connected to the anode of the first micro led die 2131.

The second Switch control module (Switch2)2213 may include a ninth transistor T9, a gate electrode of the ninth transistor T9 is configured to receive the second Switch control data signal Switch2, a first end of the ninth transistor T9 is electrically connected to a second end of the sixth transistor T6, and a second end of the ninth transistor T9 is electrically connected to the anode of the micro light emitting diode die 2141.

The cathode of the first micro led die 2131 and the cathode of the micro led die 2141 are both connected to the power supply cathode voltage ELVSS.

When the display module 20 performs a huge transfer of the micro led dies, and there is no B sub-pixel damage, all the micro led dies 2141 send black in an eye-protecting scene, i.e., display gray scale 0, which can be independently controlled by a single micro led die 2141; on the contrary, when the led chip is used in a normal scene, all the first micro led dies 2131 are turned black.

However, once it is detected that there is a large transfer, the first micro led die 2131 or the micro led die 2141 in a pixel unit 21 is damaged. There is only a single blue subpixel, whether in eye-protection mode or normal mode. The first micro led die 2131 and the micro led die 2141 are both sent corresponding display signals to light up (only one blue sub-pixel is actually lit because one blue sub-pixel is damaged), so that even if the first micro led die 2131 is damaged during the mass transfer process, the micro led die 2141 is used as a spare for repairing the first micro led die 2131 that cannot normally operate, i.e., the display module 20 in this embodiment can also improve the yield of mass transfer of the micro led dies.

Next, the display module 20 is taken as an AMOLED display module as an example. Many types of sensors in the electronic device 100 may include complementary metal oxide semiconductor sensors (CMOS sensors), i.e., imaging photosensitive cells. The CMOS Sensor can be used as the main component of fingerprint identification under the screen, touches display module 20 at user's finger, and display module 20 is luminous as the light source, and the light source passes through the reflection of finger (the difference of fingerprint ridge and fingerprint valley reflection of light), and the reflection light is through formation of image in lens to CMOS Sensor, carries out fingerprint identification with the information of fingerprint formation of image. The brightness of the AMOLED display module has limitation, and the speed and the unlocking success rate of fingerprint unlocking are influenced directly. The embodiment employs the pixel unit 21 (also referred to as a micro light emitting diode pixel unit) in the AMOLED display module to improve the speed and success rate of fingerprint unlocking.

It should be understood that the pixel unit 21 (also referred to as a micro Light emitting diode pixel unit) in the above embodiments may also be used in a display module with fingerprint identification capability, such as a display module 20 that is an lcd (liquid Crystal display) display module or a QLED (Quantum dot Light-emitting diode) display module. Of course, the optical fingerprint sensor can be disposed inside the display module 20 according to actual conditions.

Please refer to fig. 18, which discloses a partial structural diagram of the display module 20 according to an embodiment of the present application. The display module 20 may include display main pixel units 24 arranged in a matrix. Each display main pixel unit 24 may be formed by a matrix arrangement of a plurality of sub-pixels (which may also be referred to as "display sub-pixels").

In one embodiment, each display main pixel unit 24 may include four sub-pixels, such as a first display sub-pixel 241, a second display sub-pixel 242, a third display sub-pixel 243, and a fourth display sub-pixel 244. The first display sub-pixel 241, the second display sub-pixel 242, the third display sub-pixel 243 and the fourth display sub-pixel 244 may be arranged in a 2 × 2 matrix. In an embodiment, please refer to fig. 19, which discloses a schematic structural diagram of a portion of the display module 20 according to an embodiment of the present application. The fourth display sub-pixel 244 may be omitted, and the first display sub-pixel 241, the second display sub-pixel 242, and the third display sub-pixel 243 may be arranged in a 1 × 3 matrix.

In an embodiment, referring to fig. 18, one of the first display sub-pixel 241, the second display sub-pixel 242, and the third display sub-pixel 243 may be an R sub-pixel, another one of the first display sub-pixel 241, the second display sub-pixel 242, and the third display sub-pixel 243 may be a G sub-pixel, the remaining one may be a B sub-pixel, and the fourth display sub-pixel 244 may be one of an R sub-pixel, a G sub-pixel, a B sub-pixel, and a W sub-pixel.

In one embodiment, referring to fig. 18, in a 2 × 2 matrix arrangement, the first display sub-pixel 241 and the fourth display sub-pixel 244 are located in the same pixel row, and the second display sub-pixel 242 is located in the same pixel column. The third display sub-pixel 243 and the fourth display sub-pixel 244 are located in the same pixel column, and are located in the same pixel row as the third display sub-pixel 243.

In an embodiment, referring to fig. 18 and 20, fig. 20 discloses a schematic structural diagram of a portion of a display module 20 according to an embodiment of the present disclosure. The first display sub-pixel 241 may be an R sub-pixel, the second display sub-pixel 242 may be a G sub-pixel, the third display sub-pixel 243 may be a B sub-pixel, and the fourth display sub-pixel 244 may be one of an R sub-pixel, a G sub-pixel, a B sub-pixel, and a W sub-pixel. For example, the fourth display sub-pixel 244 may be a G sub-pixel.

In order to realize that the light of the miniature light-emitting diode is used as a surface light source for optical fingerprint unlocking, the exposure time is reduced. And a micro light-emitting diode pixel unit is arranged in the area between any four adjacent display sub-pixels arranged in a 2 x 2 matrix in the fingerprint unlocking area. Referring to fig. 18, 19 and 20, a fingerprint unlocking region 25 is disposed in the display module 20, and a micro led pixel unit (i.e., the pixel unit 21 in the above embodiment) is disposed in a region between any four adjacent display sub-pixels in the fingerprint unlocking region 25. In one embodiment, the pixel unit 21 may include a first micro light emitting diode pixel unit 26 and an infrared micro light emitting diode pixel unit 27. The first micro light emitting diode pixel unit 26 and the infrared micro light emitting diode pixel unit 27 are disposed at intervals. In one embodiment, one of the first micro light emitting diode pixel unit 26 and the infrared micro light emitting diode pixel unit 27 may be omitted.

In one embodiment, the first micro led pixel unit 26 is used for a fingerprint unlocking light source, and the infrared micro led pixel unit 27 is used for a biological anti-counterfeit. During specific use, in each fingerprint sampling, the interval time is reserved, the infrared miniature light-emitting diode pixel unit 27 is lighted, fingerprint imaging under an infrared light source is completed, the fingerprint imaging is used for biological anti-counterfeiting, and after the interval time is 1-2 frames, the first miniature light-emitting diode pixel unit 26 is lighted to be used as a fingerprint unlocking light source.

It is understood that the micro led pixel units disposed between the display sub-pixels are arranged in a uniform manner, and may be arranged in a matrix manner in the display sub-pixels, but not limited to that, one micro led pixel unit is disposed in any area between four adjacent display sub-pixels arranged in a 2 × 2 matrix manner.

Referring to fig. 21, a schematic structural diagram of a pixel unit 21 according to an embodiment of the present disclosure is disclosed. The pixel unit 21 may include a first subpixel 211, a second subpixel 212, a third subpixel 213, and a fourth subpixel 214. Specifically, for detailed descriptions of the first sub-pixel 211, the second sub-pixel 212, the third sub-pixel 213, and the fourth sub-pixel 214, reference may be made to the above embodiments, which are not repeated herein. In an embodiment, please refer to fig. 22, which discloses a schematic structural diagram of a pixel unit 21 according to an embodiment of the present application. The fourth subpixel 214 may be omitted and the first subpixel 211, the second subpixel 212, and the third subpixel 213 may be arranged in a 1 × 3 matrix.

Referring to fig. 23 and fig. 24, a schematic structural diagram of a portion of a display screen assembly 600 according to an embodiment of the present application is respectively disclosed. The display screen assembly 600 may include a first transparent substrate 28, a flexible substrate layer 29, a buffer layer 30, a first gate insulating layer 31, a second gate insulating layer 32, a planarization layer 33, a pixel isolation layer 34, a cathode layer 35, a flexible package layer 36, a touch panel layer 37, a polarization layer 38, an optically transparent adhesive layer 39, a display screen cover plate 10, a polysilicon layer 40, a gate layer 41, a first source drain layer 42, a second source drain layer 43, an anode layer 44, and an organic light emitting layer 45.

Specifically, the first transparent substrate 28, the flexible substrate layer 29, the buffer layer 30, the first gate insulating layer 31, the second gate insulating layer 32, the flat layer 33, the pixel isolation layer 34, the cathode layer 35, the flexible encapsulation layer 36, the touch panel layer 37, the polarizing layer 38, the optical transparent adhesive layer 39, and the display screen cover plate 10 are sequentially stacked.

The polysilicon layer 40 is disposed between the buffer layer 30 and the first gate insulating layer 31 such that a portion of the buffer layer 30 is in contact with the polysilicon layer 40 and a portion is in contact with the first gate insulating layer 31. So that a portion of the first gate insulating layer 31 contacts the polysilicon layer 40 and a portion contacts the buffer layer 30.

The gate layer 41 is disposed between the first gate insulating layer 31 and the second gate insulating layer 32 such that a portion of the first gate insulating layer 31 is in contact with the gate layer 41 and a portion is in contact with the second gate insulating layer 32. So that a portion of the second gate insulating layer 32 is in contact with the gate layer 41 and a portion is in contact with the first gate insulating layer 31. The orthographic projection area of the gate layer 41 on the flexible substrate layer 29 is contained within the orthographic projection area of the polysilicon layer 40 on the flexible substrate layer 29.

The first source-drain layer 42 is disposed between the second gate insulating layer 32 and the planarization layer 33 such that a portion of the second gate insulating layer 32 is in contact with the first source-drain layer 42 and a portion is in contact with the planarization layer 33. So that a portion of the planarization layer 33 is in contact with the first source-drain layer 42 and a portion is in contact with the second gate insulating layer 32.

The second source-drain layer 43 is disposed between the second gate insulating layer 32 and the planarization layer 33 such that a portion of the second gate insulating layer 32 is in contact with the second source-drain layer 43 and a portion is in contact with the planarization layer 33. So that a portion of the planarization layer 33 is in contact with the second source-drain layer 43 and a portion is in contact with the second gate insulating layer 32.

The first source drain layer 42 and the second source drain layer 43 are respectively connected to the polysilicon layer 40 via holes.

In one embodiment, the first transparent substrate 28, the flexible substrate layer 29, the buffer layer 30, the first gate insulating layer 31, the second gate insulating layer 32, and the planarization layer 33 constitute auxiliary layers. The pixel isolation layer 34, the cathode layer 35, the anode layer 44, and the organic light emitting layer 45 constitute a display layer. The flexible encapsulation layer 36 is used to encapsulate the display layer. The organic light emitting layer 45 serves as a part of a sub-pixel of the display main pixel unit 24. The polysilicon layer 40, the gate layer 41, the first source drain layer 42 and the second source drain layer 43 constitute a gate driving circuit, and the gate driving circuit is formed in the auxiliary layer. It is understood that the auxiliary layer may also be provided with a data line circuit, and the gate driving circuit and the data line circuit may constitute a pixel driving circuit.

In an embodiment the anode layer 44 and the organic light emitting layer 45 are arranged on top of each other, the anode layer 44 being arranged on the side of the planar layer 33 facing away from the flexible substrate layer 29.

The pixel isolation layer 34 covers the anode layer 44, the organic light emitting layer 45, and the upper surface of the planarization layer 33, which is not covered by the anode layer 44 and the organic light emitting layer 45. And a via hole is partially formed at a portion where the pixel isolation layer 34 is in contact with the anode layer 44. The organic light emitting layer 45 is positioned on the pixel isolation layer 34 and is connected to the anode layer 44 through a via hole partially penetrating the pixel isolation layer 34. The pixel isolation layer 34 and the organic light emitting layer 45 are provided with a cathode layer 35, and the organic light emitting layer 45 is connected to the cathode layer 35 through a via hole.

The touch panel layer 37 may be an On-cell touch layer. And laying a metal layer on the side of the touch panel layer 37 far away from the flexible packaging layer 36 to manufacture a driving circuit for driving the pixel unit 21 to display. The orthographic projection of the pixel unit 21 on the flat layer 33 is positioned on the part of the upper surface of the flat layer 33 which is not covered by the anode layer 44 and the organic light-emitting layer 45. That is, the orthographic projection of the pixel unit 21 on the flexible substrate layer 29 is located within the orthographic projection of the upper surface of the flat layer 33, which is not covered by the anode layer 44 and the organic light emitting layer 45, on the flexible substrate layer 29. It is to be understood that the touch panel layer 37 may be used in place of the driving substrate 22 described in the above embodiments. The black matrix 215 may be disposed on the touch panel layer 37.

Fig. 25 is a schematic diagram illustrating routing and control of micro light emitting diodes in a pixel unit 21 according to an embodiment of the present application. The micro leds in all the first micro led pixel units 26 (as fingerprint unlock light sources) are connected in series, and the switch is controlled by the anode control line 46, and the brightness of the micro leds is controlled by the voltage setting on the anode control line 46. The infrared micro light emitting diodes (fingerprint unlocking light sources) in all the infrared micro light emitting diode pixel units 27 are connected in series, the switch is controlled by the anode control line 48, and the light emitting brightness of the infrared micro light emitting diodes is controlled by the voltage setting on the anode control line 48. The micro leds in the first micro led pixel unit 26 and the infrared micro leds in the infrared micro led pixel unit 27 are disposed in a common cathode trace 49.

The scheme of combined display of the micro light-emitting diode pixel unit and the display main pixel unit 24 is adopted, the first micro light-emitting diode pixel unit 26 and the infrared micro light-emitting diode pixel unit 27 are arranged in the fingerprint unlocking area 25, the display main pixel unit 24 is adopted in a normal display area outside the fingerprint unlocking area 25 for display, the risk of screen burning of fingerprint unlocking is overcome by virtue of the inorganic ultrahigh display service life and brightness of the micro light-emitting diode, meanwhile, the first micro light-emitting diode pixel unit 26 and the infrared micro light-emitting diode pixel unit 27 are cooperatively displayed in the fingerprint unlocking area 25, biological access and fingerprint sampling are realized, the problem of cross striations in optical fingerprint imaging can be solved, the false rejection rate is improved, and meanwhile, the biological anti-counterfeiting function is obviously enhanced.

The above description is only an example of the present application and is not intended to limit the scope of the present application, and all modifications of equivalent structures and equivalent processes, which are made by the contents of the specification and the drawings, or which are directly or indirectly applied to other related technical fields, are intended to be included within the scope of the present application.

Claims

1. A display module is characterized by comprising a plurality of pixel units and a driving circuit, wherein each pixel unit comprises a first sub-pixel, a second sub-pixel, a third sub-pixel and a fourth sub-pixel, the first sub-pixel, the second sub-pixel, the third sub-pixel and the fourth sub-pixel are arranged in a matrix, the third sub-pixel and the fourth sub-pixel are blue sub-pixels, the emission quantity of harmful blue light of the fourth sub-pixel is lower than that of the third sub-pixel, and the third sub-pixel and the fourth sub-pixel are respectively configured to be controlled by the driving circuit to emit light or extinguish.

2. The display module of claim 1, wherein the first sub-pixel, the second sub-pixel, and the third sub-pixel each comprise a first micro light emitting diode, the fourth sub-pixel comprises a second micro light emitting diode, and the amount of harmful blue light emission of the second micro light emitting diode is less than the amount of harmful blue light emission of the first micro light emitting diode in the third sub-pixel.

3. The display module according to claim 2, wherein the display module comprises a driving substrate, a transparent substrate, and a pixel unit layer including a plurality of the pixel units, the pixel unit layer being disposed between the transparent substrate and the driving substrate.

4. The display module according to claim 3, wherein the pixel unit layer further comprises a black matrix disposed on the driving substrate, the black matrix has a plurality of receiving spaces, and the first micro light emitting diodes and the second micro light emitting diodes are disposed in the receiving spaces in a one-to-one correspondence.

5. The display module according to claim 4, wherein the first micro light emitting diode includes a first micro light emitting diode die and a first color filter layer, the first micro light emitting diode die is disposed on the driving substrate, the first micro light emitting diode die and the first color filter layer are both disposed in the accommodating space, and the first color filter layer is configured to cover the first micro light emitting diode die.

6. The display module according to claim 5, wherein the second micro light emitting diode comprises a micro light emitting diode crystal grain and a second color filter color resistance layer, the micro light emitting diode crystal grain is disposed on the driving substrate, the micro light emitting diode crystal grain and the second color filter color resistance layer are both disposed in the accommodating space, and the second color filter color resistance layer is configured to cover the micro light emitting diode crystal grain.

7. The display module according to any one of claims 2 to 6, wherein the first micro light-emitting diode in the first sub-pixel emits red light, the first micro light-emitting diode in the second sub-pixel emits green light, and the first micro light-emitting diode in the third sub-pixel emits blue light.

8. The display module according to claims 2-4, wherein the driving circuit comprises a pixel driving module, a first switch control module and a second switch control module, the same output terminal of the pixel driving module is electrically connected to the first switch control module and the second switch control module, respectively, the first switch control module is electrically connected to the first micro light emitting diode in the third sub-pixel and is configured to control the first micro light emitting diode in the third sub-pixel to emit light or turn off, and the second switch control module is electrically connected to the second micro light emitting diode and is configured to control the second micro light emitting diode to emit light or turn off.

9. The display module of claim 8, wherein the pixel driving module comprises a first transistor, a second transistor, a third transistor, a fourth transistor, a fifth transistor, a sixth transistor, a seventh transistor and a capacitor;

a gate electrode of the first transistor is used for receiving a first scanning signal, a first end of the first transistor is used for receiving a reference voltage, and a second end of the first transistor is electrically connected to a first end of the capacitor, a gate electrode of the third transistor and a first end of the fifth transistor;

the gate electrode of the second transistor is used for receiving an enable signal, the first end of the second transistor is used for receiving the voltage of the positive electrode of the power supply, and the second end of the second transistor is electrically connected to the first end of the third transistor and the first end of the fourth transistor;

a second end of the third transistor is electrically connected to a second end of the fifth transistor and a first end of the sixth transistor;

a gate electrode of the fourth transistor is used for receiving a second scanning signal, and a second end of the fourth transistor is used for receiving a data voltage;

a gate electrode of the fifth transistor is used for receiving the second scanning signal;

a gate electrode of the sixth transistor is used for receiving the enable signal, and second ends of the sixth transistor are respectively connected to the first switch control module, the second switch control module and a first end of the seventh transistor;

a gate electrode of the seventh transistor is for receiving the scan signal, and a second terminal is for receiving the reference voltage.

10. The display module of claim 9,

the first switch control module comprises an eighth transistor, a gate electrode of the eighth transistor is used for receiving a first switch control data signal, a first end of the eighth transistor is electrically connected to a second end of the sixth transistor, and a second end of the eighth transistor is electrically connected to an anode of the first micro light-emitting diode of the third sub-pixel;

the second switch control module comprises a ninth transistor, a gate electrode of the ninth transistor is used for receiving a second switch control data signal, a first end of the ninth transistor is electrically connected to a second end of the sixth transistor, and a second end of the ninth transistor is electrically connected to an anode of the second micro light-emitting diode;

and the cathode of the first micro light-emitting diode and the cathode of the second micro light-emitting diode of the third sub-pixel are both connected to the voltage of the negative electrode of the power supply.

11. An electronic device, comprising a display screen assembly and a housing assembly, wherein the display screen assembly is mounted on the housing assembly, the display screen assembly comprises a display screen cover plate and the display module set forth in any one of claims 1-10, and the display screen cover plate is covered on a side of the display module set away from the housing assembly.