WO2022071749A1 - Adhesive member, electronic device comprising adhesive member, and method for manufacturing adhesive member - Google Patents

Abstract

According to one embodiment of the present invention, an adhesive member comprises: a first adhesive for attaching to a first part; a second adhesive for attaching to a second part; and a glue positioned between the first adhesive and the second adhesive, wherein at least one of the the first adhesive, the second adhesive, and the glue has a first thickness in a first section between the first part and the second part, and has a second thickness, which is different from the first thickness, in a second section between the first part and the second part. Various other embodiments may be possible.

Description

Adhesive member, electronic device including adhesive member, and method of manufacturing adhesive member

One embodiment of the present invention relates to an adhesive member, an electronic device including the adhesive member, and a method of manufacturing the adhesive member.

In a manufacturing process of an electronic device, there is an assembling process in which parts are combined with each other. An adhesive member such as a bond or a double-sided tape may be utilized in the assembly process.

Since it is becoming difficult to secure a mechanical fastening area due to slimming or lightening of the electronic device, a method of using an adhesive member instead of mechanical fastening using a fastening element such as a bolt is expanding. In addition, since the bonding area is decreasing, a bonding method (eg, bonding) using a bond having a higher bonding force per unit area than a bonding method using a double-sided tape may be considered. However, compared to the double-sided tape, the bond can secure bonding strength, but since it is difficult to peel off the bonding portion when there is a defect, it can make rework difficult and increase the cost of after-sales service of the product. In addition, since the bond is focused on bonding between the two adherends, various functions may be implemented.

An embodiment of the present invention may provide an adhesive member capable of having various functions while ensuring reworkability (or product repairability), an electronic device including the adhesive member, and a method of manufacturing the adhesive member.

The technical problems to be achieved in the present disclosure are not limited to the technical problems mentioned above, and other technical problems not mentioned can be clearly understood by those of ordinary skill in the art to which the present invention belongs from the description below. There will be.

According to an embodiment of the present invention, the adhesive member includes a first pressure-sensitive adhesive attached to the first component, a second pressure-sensitive adhesive attached to the second component, and an adhesive positioned between the first pressure-sensitive adhesive and the second pressure-sensitive adhesive. and at least one of the first adhesive, the second adhesive, and the adhesive has a first thickness in a first section between the first part and the second part, and between the first part and the second part may have a second thickness different from the first thickness in the second section of .

According to an embodiment of the present invention, an electronic device includes a first part and a second part, an adhesive member between the first part and the second part, and a first adhesive attached to the first part, and the second part. an adhesive member comprising a second pressure-sensitive adhesive attached to the component, and an adhesive positioned between the first and second pressure-sensitive adhesives, wherein at least one of the first pressure-sensitive adhesive, the second pressure-sensitive adhesive, and the adhesive comprises: having a first thickness in a first section between the first part and the second part, and having a second thickness different from the first thickness in a second section between the first part and the second part .

According to an embodiment of the present invention, a method of manufacturing an adhesive member includes an operation of arranging a first adhesive on a first part, an operation of arranging a second adhesive on a second part, and the first adhesive and the second adhesive positioning and curing an adhesive therebetween, wherein at least one of the first adhesive, the second adhesive, and the adhesive has a first thickness in a first section between the first part and the second part , may have a second thickness different from the first thickness in a second section between the first part and the second part.

The adhesive member according to an embodiment of the present invention enables rework while having bonding characteristics, and may be formed in various thicknesses depending on the bonding portion, as well as external shock relief, heat dissipation, electrical insulation, or electromagnetic noise. It may have various functions, such as shielding, to improve usability and reliability.

In addition, effects obtainable or predicted by various embodiments of the present invention will be disclosed directly or implicitly in the detailed description of the embodiments of the present invention. For example, various effects predicted according to various embodiments of the present invention will be disclosed in the detailed description to be described later.

1 is a cross-sectional view of a laminated structure including a first adherend, a second adherend, and an adhesive member for bonding the first adherend and the second adherend, according to an exemplary embodiment.

2 illustrates a manufacturing flow regarding an adhesive member for bonding a first adherend and a second adherend according to an embodiment.

3A, 3B, 3C, and 3D are diagrams for explaining the manufacturing flow of FIG. 2 according to an exemplary embodiment.

4, 5, 6, or 7 are cross-sectional views of a laminate structure including a first adherend, a second adherend, and an adhesive member bonding the first adherend and the second adherend according to various embodiments of the present disclosure;

8 is a perspective view of an electronic device including an adhesive member according to an exemplary embodiment;

Hereinafter, various embodiments of the present document will be described with reference to the accompanying drawings.

The various embodiments of this document and the terms used therein are not intended to limit the technical features described in this document to specific embodiments, but it should be understood to include various modifications, equivalents, or substitutions of the embodiments. In connection with the description of the drawings, like reference numerals may be used for similar or related components. The singular form of the noun corresponding to the item may include one or more of the item, unless the relevant context clearly dictates otherwise. In this document, "A or B", "at least one of A and B", "at least one of A or B," "A, B or C," "at least one of A, B and C," and "A , B, or C" each may include any one of the items listed together in the corresponding one of the phrases, or all possible combinations thereof. Terms such as “first”, “second”, or “first” or “second” may simply be used to distinguish the component from other such components, and refer to the component in another aspect (e.g., importance or order) is not limited.

The electronic device according to various embodiments disclosed in this document may have various types of devices. The electronic device may include, for example, a portable communication device (eg, a smart phone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a home appliance device. The electronic device according to the embodiment of the present document is not limited to the above-described devices.

1 illustrates a first adherend 101 , a second adherend 102 , and an adhesive member for bonding the first adherend 101 and the second adherend 102 according to an embodiment. It is a cross-sectional view of the laminated structure 103 including the member (100).

Referring to FIG. 1 , the adhesive member 100 may be positioned between a first adherend 101 (or a first component) and a second adherend 102 (or a second component). According to an embodiment, the adhesive member 100 includes a first adhesive layer 110 , a second adhesive layer 120 , and between the first adhesive layer 110 and the second adhesive layer 120 . A third adhesive layer 130 may be included. The first adhesive layer 110 may be positioned between the first adherend 101 and the third adhesive layer 130 . The second adhesive layer 120 may be positioned between the second adherend 102 and the third adhesive layer 130 . The first adhesive layer 110 may include a first adhesive (or glue) (or a first adhesive material). The second adhesive layer 120 may include a second adhesive (or a second adhesive material). The third adhesive layer 130 may include a third adhesive (or a third adhesive material). The first adhesive and the second adhesive may be the same as or different from each other. The third adhesive may be different from the first adhesive and the second adhesive. For example, the third adhesive may have different physical properties from the first and second adhesives.

Adhesion may be, for example, the tendency of different particles or surfaces to stick together as a way of bringing two objects into contact. Adhesion may refer to attaching or bonding the surfaces of two objects using an adhesive. Adhesion may refer to a state bonded by chemical or physical interaction between the surfaces of two objects, and the adhesive may include an adhesive component or an adhesive material used to attach, adhere, or bond two objects. can The first adhesive of the first adhesive layer 110 may adhere, for example, the first adherend 101 and the third adhesive layer 130 . The second adhesive of the second adhesive layer 120 may adhere, for example, the second adherend 102 and the third adhesive layer 130 . The third adhesive of the third adhesive layer 130 may adhere, for example, the first adhesive layer 110 and the second adhesive layer 120 . The adhesive, for example, by dissolving or dispersing the adhesive component in a solvent (eg, an organic solvent or water) may exist in a solution, or liquid state or paste state at room temperature. Upon drying to evaporate the solvent, the adhesive component can be cured. Curing is, for example, a chemical reaction, which may refer to a phenomenon in which the adhesive component reacts to increase molecular weight while at the same time strengthening the adhesive component due to intermolecular bonding (eg crosslinking) (eg, increasing cohesive force). . Adhesion force (or adhesive strength) may be the ability of an adhesive between two objects to stick to the surfaces of the two objects, thereby adhering the two surfaces to each other. Adhesion may include, for example, reciprocal attraction between molecules that cause them to stick together. Adhesion may, for example, correspond to the force required to separate the adhesive vertically from the surface of the object. Adhesion may refer to, for example, the maximum tensile stress measured at an interface between an adhesive and an object. The adhesion between the adhesive and the object may be a mechanical bond (or mechanical interaction), a chemical bond (or chemical interaction), and/or a physical bond (or physical interaction). Mechanical bonding may refer, for example, to a phenomenon in which an adhesive penetrates into holes or grooves on the surface of an object and hardens to adhere (eg anchor effect). Chemical bonding, for example, may refer to a phenomenon in which an adhesive and an object are chemically bonded (eg, a covalent bond in which atoms bond to each other by sharing electron pairs). Physical bonding, for example, may refer to a phenomenon in which an adhesive and individual molecules of an object are adhered to each other by a force (eg, intermolecular force). The adhesive force between two objects may be determined by a balance between a cohesion force and an interfacial force. Cohesive force may refer to the strength of the adhesive component after solidification. Interfacial bonding forces may refer to physical and/or chemical interactions at the interface between an adhesive and an object.

The pressure-sensitive adhesive, for example, may refer to an adhesive capable of adhering to an adherend by applying a small amount of pressure at room temperature for a short time without using curing conditions such as water, solvent (eg, curing agent), heat, or light. The adhesive enables temporary adhesion that can be detached and pasted to the adherend, and may have a non-curing feature. The pressure-sensitive adhesive may be maintained, for example, in a liquid or paste form in which the reaction has already been completed. Among the adhesives, an adhesive as opposed to an adhesive may react in a liquid or paste phase depending on curing conditions to change to a solid state or a harder state than before curing. Among adhesives, since an adhesive as opposed to a pressure-sensitive adhesive requires a curing time, the adhesive strength (or adhesive force) may depend on the progress of the reaction.

According to an embodiment, the third adhesive layer 130 may have a tensile strength greater than that of the first adhesive layer 110 and the second adhesive layer 120 . The third adhesive layer 130 may have, for example, a tensile strength of about 30 kgf/cm ² or more. The third adhesive layer 130 may be an inner core of the adhesive member 100 , and may contribute to reworkability (or repairability) of the adhesive member 100 . When reworkability is secured, the adhesive member 100 may be detachable from the first adherend 101 or the second adherend 102 without damage.

According to one embodiment, the adhesive force between the first adhesive layer 110 and the third adhesive layer 130, and the adhesive force between the second adhesive layer 120 and the third adhesive layer 130 are the first adhesive layer ( 110 ) and the first adherend 101 , and may be greater than the adhesive force between the second adhesive layer 120 and the second adherend 102 . Accordingly, reworkability of the adhesive member 100 may be secured. The adhesive force between the first adhesive layer 110 and the third adhesive layer 130 , and the adhesive force between the second adhesive layer 120 and the third adhesive layer 130 , according to one embodiment, is about 30 kgf/cm It may have ^two or more tensile strengths. The third adhesive included in the third adhesive layer 130 has compatibility with the first adhesive included in the first adhesive layer 110 and/or the second adhesive included in the second adhesive layer 120 . can have For example, the third adhesive included in the third adhesive layer 130 has the same series as the first adhesive included in the first adhesive layer 110 and/or the second adhesive included in the second adhesive layer 120 . of a polymer, whereby the adhesive force between the first adhesive layer 110 and the third adhesive layer 130, and between the second adhesive layer 120 and the third adhesive layer 130 of adhesion can be ensured. The first adhesive of the first adhesive layer 110 , the second adhesive of the second adhesive layer 120 , and the third adhesive of the third adhesive layer 130 may include, for example, an acrylic-based or an epoxy-based adhesive. can The first adhesive of the first adhesive layer 110 , the second adhesive of the second adhesive layer 120 , and the third adhesive of the third adhesive layer 130 may include other various types of polymers.

According to an embodiment, the first adhesive included in the first adhesive layer 110 and the second adhesive included in the second adhesive layer 120 may include an adhesive. The first adhesive layer 110 and the second adhesive layer 120 including the pressure-sensitive adhesive are formed in a small amount at room temperature for a short time without using, for example, curing conditions such as water, a solvent (eg, a curing agent), heat, or light. It may be possible to adhere to an adherend only by applying pressure. The first adhesive layer 110 and the second adhesive layer 120 including the pressure-sensitive adhesive may be in the form of a liquid or paste that enables temporary adhesion that can be peeled and pasted to the adherend. The third adhesive included in the third adhesive layer 130 may include an adhesive in contrast to the adhesive. The third adhesive layer 130 may exist, for example, in a solid state in which the third adhesive in liquid or paste form is cured depending on curing conditions, or in a harder state than before curing.

According to some embodiments, the first adhesive of the first adhesive layer 110 and/or the second adhesive of the second adhesive layer 120 may include an adhesive in contrast to the adhesive. The first adhesive layer 110 may exist, for example, in a solid state in which the first adhesive in liquid or paste form is cured according to curing conditions, or in a harder state than before curing. The second adhesive layer 120 may exist, for example, in a solid state in which the second adhesive in liquid or paste form is cured according to curing conditions, or in a harder state than before curing.

According to various embodiments, the third adhesive layer 130 may be implemented with a curing agent. by chemical bonding (eg, covalent bonding) between the curing agent and the first adhesive of the first adhesive layer 110 , and chemical bonding (eg, covalent bonding) between the curing agent and the second adhesive of the second adhesive layer 120 . , the third adhesive layer 130 having a greater tensile strength than that of the first adhesive layer 110 and the second adhesive layer 120 may be formed.

According to various embodiments, the third adhesive included in the third adhesive layer 130 may include a material (eg, a cushioning material) capable of mitigating an external impact. The third adhesive may include, for example, a material of high elongation and high elasticity capable of mitigating external impact. The third adhesive layer 130 may contribute to maintaining the bond between the first adherend 101 and the second adherend 102 by alleviating external impact. In various embodiments, the electronic device including the adhesive member 100 is a foldable electronic device capable of folding a flexible display or a rollable electronic device capable of retracting the flexible display into the electronic device. can be When the adhesive member 100 is positioned in the bending section of the electronic device, the third adhesive layer 130 may have a bending characteristic and a proof strength that does not break in response to a force acting in bending.

According to various embodiments, the third adhesive included in the third adhesive layer 130 may include a material capable of diffusing, dispersing, or dissipating heat. The stacked structure 103 of FIG. 1 may correspond to, for example, a bonding structure between two components in various types of electronic devices, and the adhesive member 100 may diffuse, disperse, or can heat up.

According to various embodiments, the third adhesive included in the third adhesive layer 130 may include a dielectric material having insulating properties. The stacked structure 103 of FIG. 1 may correspond to, for example, a coupling structure between two components in various types of electronic devices, and the adhesive member 100 may contribute to electrical insulation between the two components. .

According to various embodiments, the third adhesive included in the third adhesive layer 130 may include a material capable of absorbing or shielding electromagnetic waves. The stacked structure 103 of FIG. 1 may correspond to, for example, a coupling structure between two components in various types of electronic devices, and the adhesive member 100 may shield electromagnetic noise. (eg electro magnetic interface (EMI) shielding).

The third adhesive layer 130 may include a material for various other functions.

According to various embodiments (not shown), the adhesive member 100 may be implemented by further including various other adhesive layers. For example, the adhesive member 100 may include at least one positioned between the first adhesive layer 110 and the third adhesive layer 130 , or between the second adhesive layer 120 and the third adhesive layer 130 . It may further include an adhesive layer. In various embodiments, at least one of the first adhesive layer 110 , the second adhesive layer 120 , and the third adhesive layer 130 may include a plurality of adhesive layers.

According to various embodiments, the thickness of the first adhesive layer 110 , the thickness of the second adhesive layer 120 , or the thickness of the third adhesive layer 130 is the thickness of the first adherend 101 and the second adherend ( 102) can be formed in various ways.

FIG. 2 shows a manufacturing flow 200 for an adhesive member 100 bonding a first adherend 101 and a second adherend 102 according to an embodiment. 3A, 3B, 3C, and 3D are diagrams for explaining the manufacturing flow 200 of FIG. 2 according to an embodiment.

2 and 3A , in operation 210 , a first adhesive (eg, a first adhesive) 310 may be disposed on the first adherend 101 . For example, the liquid or paste-like first adhesive 310 may be applied to the surface of the first adherend 101 using a spraying device (eg, a dispenser).

2 and 3B , in operation 220 , a third adhesive 330 may be disposed on the first adhesive 310 . For example, the liquid or paste-like third adhesive 330 may be applied to the surface of the first adhesive 310 using a spraying device. In operation 220 , the spraying equipment may apply the third adhesive 330 by moving while maintaining a distance from the first adhesive 310 so that the first adhesive 310 is not damaged by the spraying equipment.

2 and 3C , in operation 230 , a second adhesive (eg, a second adhesive) 320 may be disposed on the second adherend 102 . For example, the liquid or paste-like first adhesive 320 may be applied to the surface of the second adherend 102 using a spraying device.

In operation 210 , operation 220 , or operation 230 , the application thickness of the adhesive is determined by the liquid properties such as the viscosity and/or surface tension of the adhesive, the flow rate discharged from the nozzle of the spraying equipment, the distance between the nozzle and the spraying surface, and/or It can be determined according to various process conditions, such as the moving speed of the injection equipment. In operation 210 , operation 220 , or operation 230 , the application thickness of the adhesive may vary according to design conditions of the adhesive member 100 corresponding to the first adherend 101 and the second adherend 120 , and the process The spraying equipment can be programmed to operate based on conditions and design conditions. In various embodiments, in operation 210 , operation 220 , or operation 230 , a spraying device including a slit nozzle (eg, a nozzle having a rectangular cross-section of the spraying opening) when uniformly forming an application thickness of the adhesive can be utilized.

Referring to FIGS. 2 and 3D , in operation 240 , curing may be performed after disposing the second adhesive 320 and the third adhesive 330 to be in contact with each other. The third adhesive 330 may change from a liquid or paste to a solid state or a harder state than before curing according to curing conditions, whereby the cured third adhesive 330 forms the third adhesive layer 130 of FIG. 1 . can do. For example, the third adhesive 330 may include an adhesive component and a curing agent, and may be cured by the curing agent. For another example, the third adhesive 330 may be cured in response to heat or may be cured in response to light of a specified frequency band. For another example, the third adhesive 330 may include a general adhesive, and may be cured after a corresponding curing time has elapsed at room temperature.

The first adhesive 310 may form the first adhesive layer 110 of FIG. 1 , and the second adhesive 320 may form the second adhesive layer 120 of FIG. 1 . According to an embodiment, the first adhesive 310 and the second adhesive 320 may include an adhesive. The first adhesive layer 110 and the second adhesive layer 120 including the pressure-sensitive adhesive can be formed by applying a small amount of pressure at room temperature for a short time without using curing conditions such as water, solvent (eg, curing agent), heat, or light. Adhesive to the adherend may be possible. The first adhesive layer 110 and the second adhesive layer 120 including the pressure-sensitive adhesive may be in the form of a liquid or paste that enables temporary adhesion that can be peeled and pasted to the adherend.

According to some embodiments, the first adhesive 310 and/or the second adhesive 320 may include an adhesive as opposed to an adhesive, and in this case, it reacts in a liquid or paste phase depending on curing conditions to react in a solid state, or hardening It can exist in a more rigid state than before.

According to various embodiments, in operations 220 and 240 of FIG. 2 , the third adhesive 330 may be replaced with a curing agent. The first adhesive layer 110 of FIG. 1 and The third adhesive layer 130 of FIG. 1 having a greater tensile strength than the second adhesive layer 120 may be formed. For example, the first adhesive 310 and the second adhesive 320 may include an acryl-based or silicone-based adhesive, and the curing agent may include an isocyanate.

In some embodiments, operations 220 and 240 may be referred to as positioning and curing the third adhesive 300 between the first adhesive 310 and the second adhesive 320 .

4 includes a first adherend 401, a second adherend 402, and an adhesive member 400 for bonding the first adherend 401 and the second adherend 402 according to various embodiments. It is a cross-sectional view of the laminated structure 403 to

Referring to FIG. 4 , the adhesive member 400 includes a first adhesive layer (eg, a first adhesive layer) 410 and a second adherend 402 attached to a first adherend 401 (or a first part). ) (or the second part), a second adhesive layer (eg, a second adhesive layer) 420 , and a third adhesive layer 430 between the first adhesive layer 410 and the second adhesive layer 420 . ) may be included. The first adhesive layer 410 may be formed in substantially the same manner as the first adhesive layer 110 of FIG. 1 . The second adhesive layer 420 may be formed in substantially the same manner as the second adhesive layer 120 of FIG. 1 . The third adhesive layer 430 may be formed in substantially the same manner as the third adhesive layer 130 of FIG. 1 .

According to one embodiment, the first interface S11 between the first adhesive layer 410 and the first adherend 401 and the second interface between the second adhesive layer 420 and the second adherend 402 . (S12) may be substantially parallel. The third adhesive layer 430 may be formed to have a different thickness for each section between the first adherend 401 and the second adherend 402 . For example, the third adhesive layer 430 may be formed in the first section between the first adherend 401 and the second adherend 402 (eg, the first attachment portion or the first attachment region) 451 . It may be formed to a thickness of one (T11). The third adhesive layer 430 has a first thickness T11 in a second section (eg, a second attachment portion or a second attachment region) 452 between the first adherend 401 and the second adherend 402 . ) may be formed to a thicker second thickness T12. The second adhesive layer 420 may be formed to a third thickness T13 in the first section 451 and to a fourth thickness T14 thinner than the third thickness T13 in the second section 452 . there is. In an embodiment, the third interface S13 between the first adhesive layer 410 and the third adhesive layer 430 may be substantially parallel to the first interface S11 .

According to various embodiments, between the first section 451 and the second section 452 , the interface between the second adhesive layer 420 and the third adhesive layer 430 is smoothly formed as indicated by the reference numeral '453'. can be

According to various embodiments (not shown), in the embodiment of FIG. 4 , at least a portion of the first interface S11 or the second interface S12 may include a curved surface, and the first interface included in the adhesive member 400 may be curved. The adhesive layer 410 , the second adhesive layer 420 , or the third adhesive layer 430 is not limited to the illustrated examples and may be formed to have various thicknesses.

5 includes a first adherend 501 , a second adherend 502 , and an adhesive member 500 for bonding the first adherend 501 and the second adherend 502 according to various embodiments. It is a cross-sectional view of the laminated structure 503 to be used.

Referring to FIG. 5 , the adhesive member 500 includes a first adhesive layer (eg, a first adhesive layer) 510 and a second adherend 502 attached to a first adherend 501 (or a first part). ) (or the second part), a second adhesive layer (eg, a second adhesive layer) 520 , and a third adhesive layer 530 between the first adhesive layer 510 and the second adhesive layer 520 . ) may be included. The first adhesive layer 510 may be formed in substantially the same manner as the first adhesive layer 110 of FIG. 1 . The second adhesive layer 520 may be formed in substantially the same manner as the second adhesive layer 120 of FIG. 1 . The third adhesive layer 530 may be formed in substantially the same manner as the third adhesive layer 130 of FIG. 1 .

According to an embodiment, the first interface S21 between the first adhesive layer 510 and the first adherend 501 and the second interface S21 between the second adhesive layer 520 and the second adherend 502 . (S22) may be substantially parallel. The third adhesive layer 530 may be formed to have a different thickness for each section between the first adherend 501 and the second adherend 502 . For example, the third adhesive layer 530 may be formed in a first section (eg, a first attachment portion or a first attachment region) 551 between the first adherend 501 and the second adherend 502 . It may be formed to a thickness of 1 T21. The third adhesive layer 530 has a first thickness T21 in a second section (eg, a second attachment portion or a second attachment region) 552 between the first adherend 501 and the second adherend 502 . ) may be formed to a thicker second thickness T22. The second adhesive layer 520 may be formed to a third thickness T23 in the first section 551 and to a fourth thickness T24 thinner than the third thickness T23 in the second section 552 . there is. The third adhesive layer 530 may be formed to a fifth thickness T25 in the first section 551 and to a sixth thickness T26 thinner than the fifth thickness T25 in the second section 552 . there is.

According to various embodiments, between the first section 551 and the second section 552 , the interface between the first adhesive layer 410 and the third adhesive layer 430 is formed smoothly as indicated by the reference numeral '553'. can be Between the first section 551 and the second section 552 , an interface between the second adhesive layer 420 and the third adhesive layer 430 may be smoothly formed as indicated by reference numeral '554'.

According to various embodiments (not shown), in the embodiment of FIG. 5 , at least a portion of the first interface S21 or the second interface S22 may include a curved surface, and the first interface included in the adhesive member 500 may be curved. The adhesive layer 510 , the second adhesive layer 520 , or the third adhesive layer 530 is not limited to the illustrated example and may be formed to have various thicknesses.

6 includes a first adherend 601 , a second adherend 602 , and an adhesive member 600 bonding the first adherend 601 and the second adherend 602 according to various embodiments. It is a cross-sectional view of the laminated structure 603 to

6 , in one embodiment, a first section (eg, a first attachment portion) between a first adherend 601 (or a first part) and a second adherend 602 (or a second part). or in the first attachment region) 651 , the first interface S31 between the adhesive member 600 and the first adherend 601 and the second interface S31 between the adhesive member 600 and the second adherend 602 . The interface S32 may be positioned to be spaced apart by a first distance. The adhesive member 600 may be formed to have a first thickness T31 in the first section 651 . In the second section (eg, the twenty-first attachment portion or the second attachment region) 652 between the first adherend 601 and the second adherend 602 , the adhesive member 600 and the first adherend 601 . ) and the third interface S33 between the adhesive member 600 and the second adherend 602 may be spaced apart from each other by a second distance greater than the first distance. The second interface S32 and the third interface S33 may have different heights. The adhesive member 600 may be formed to have a second thickness T32 that is thicker than the first thickness T31 in the second section 652 . The adhesive member 600 includes, like the adhesive member 100 of FIG. 1 , a first adhesive layer attached to the first adherend 601 , a second adhesive layer adhered to the second adherend 602 , and a second adhesive layer attached to the second adherend 602 . and a third adhesive layer between the first adhesive layer and the second adhesive layer. The first adhesive layer, the second adhesive layer, or the third adhesive layer may be formed in various thicknesses in the first section 651 or the second section 652 . For example, at least one of the first adhesive layer, the second adhesive layer, and the third adhesive layer may be formed to have different thicknesses in the first section 651 or the second section 652 .

According to various embodiments, between the first section 651 and the second section 652, the interface between the second adherend 602 and the adhesive member 600 may be smoothly formed as indicated by the reference numeral '653'. there is.

According to various embodiments (not shown), in the embodiment of FIG. 6 , at least a portion of the first interface S31 , the second interface S32 , or the third interface S33 may include a curved surface, and the adhesive member The first adhesive layer, the second adhesive layer, or the third adhesive layer included in 600 is not limited to the illustrated example and may be formed to have various thicknesses.

7 includes a first adherend 701, a second adherend 702, and an adhesive member 700 for bonding the first adherend 701 and the second adherend 702 according to various embodiments. It is a cross-sectional view regarding the laminated structure 703 which is

Referring to FIG. 7 , in one embodiment, a first section (eg, a first attachment portion) between a first adherend 701 (or a first part) and a second adherend 702 (or a second part). or in the first attachment region) 751 , the first interface S41 between the adhesive member 700 and the first adherend 701 and the second interface S41 between the adhesive member 700 and the second adherend 702 . The interface S42 may be positioned to be spaced apart by a first distance. The adhesive member 700 may be formed to have a first thickness T41 in the first section 751 . In the second section (eg, the second attachment portion or the second attachment region) 752 between the first adherend 701 and the second adherend 702 , the adhesive member 700 and the first adherend 701 are ) and the fourth interface S44 between the adhesive member 700 and the second adherend 702 may be spaced apart from each other by a second distance greater than the first distance. The first interface S41 and the third interface S43 may have different heights, and the second interface S42 and the fourth interface S44 may have different heights. The adhesive member 700 may be formed to have a second thickness T42 that is thicker than the first thickness T41 in the second section 752 . The adhesive member 700 includes, like the adhesive member 100 of FIG. 1 , a first adhesive layer attached to the first adherend 701 , a second adhesive layer adhered to the second adherend 702 , and a second adhesive layer attached to the second adherend 702 . and a third adhesive layer between the first adhesive layer and the second adhesive layer. The first adhesive layer, the second adhesive layer, or the third adhesive layer may be formed in various thicknesses in the first section 751 or the second section 752 . For example, at least one of the first adhesive layer, the second adhesive layer, and the third adhesive layer may be formed to have different thicknesses in the first section 751 or the second section 752 .

According to various embodiments, between the first section 751 and the second section 752 , the interface between the first adherend 701 and the adhesive member 700 may be smoothly formed as indicated by the reference numeral '753'. there is. Between the first section 751 and the second section 752 , an interface between the second adherend 702 and the adhesive member 700 may be smoothly formed as indicated by reference numeral '754'.

According to various embodiments (not shown), in the embodiment of FIG. 7 , at least a portion of the first interface S41 , the second interface S42 , the third interface S43 , or the fourth interface S44 has a curved surface. may be included, and the first adhesive layer, the second adhesive layer, or the third adhesive layer included in the adhesive member 700 are not limited to the illustrated examples and may have various thicknesses.

8 is a perspective view of an electronic device 8 including an adhesive member 900 according to an exemplary embodiment.

Referring to FIG. 8 , the electronic device 8 may include a foldable housing 80 . FIG. 8 shows, for example, the electronic device 8 when the foldable housing 80 is in a flat or unfolded state. The foldable housing 80 may form a first side 80A of the electronic device 8 and a second side 80B of the electronic device 8 facing in a direction opposite to the first side 80A. . The foldable housing 80 may form a first side 80C and a second side 80D of the electronic device 8 that at least partially enclose the space between the first side 80A and the second side 80B. can The first surface 80A may include a first cover area (①), a second cover area (②), and a folding cover area (F) between the first cover area (①) and the second cover area (②). can In the unfolded state of the foldable housing 80 , the first surface 80A is flatly disposed, and the first cover area ① , the second cover area ② , and the folding cover area F are substantially the same direction can be directed. For example, in the unfolded state of the foldable housing 80 , the first cover area (①) and the second cover area (②) may form an angle of about 180 degrees. The second surface 80B may include a third cover area (③) and a fourth cover area (④). The third cover area (③) is located on the opposite side to the first cover area (①) of the first surface 80A, and may face in the opposite direction to the first cover area (①). The fourth cover area (④) is located on the opposite side to the second cover area (②) of the first surface 80A, and may face in the opposite direction to the second cover area (②).

According to an embodiment, the foldable housing 80 may be implemented in an out-folding structure in which the first surface 80A is folded outward. In the unfolded state of the foldable housing 80 , the folding cover area F is disposed in a plane, and the first cover area ① and the second cover area ② may form an angle of about 180 degrees. When the foldable housing 20 is switched from the unfolded state to the folded state, the folding cover area F is arranged in a curved surface, and the first cover area ① and the second cover area ② are at an angle of about 180 degrees. Different angles can be achieved. The folded state may include a fully folded state or an intermediate state. The fully folded state is a fully folded state in which the third cover region ③ and the fourth cover region ④ of the second surface 80B are no longer close, for example, the third cover region ③ and The fourth cover area ④ may form an angle of about 0 degrees to about 10 degrees. In a fully folded state, the second surface 80B may not be substantially exposed to the outside. The intermediate state may refer to a state between an unfolded state and a fully collapsed state. The folding cover area F of the first surface 80A may be more bent in the fully folded state than in the intermediate state.

According to another embodiment, the foldable housing 80 may be implemented as an in-folding structure in which the first surface 80A is folded inward. In the unfolded state of the foldable housing 80 , the folding cover area F is disposed in a plane, and the first cover area ① and the second cover area ② may form an angle of about 180 degrees. When the foldable housing 20 is switched from the unfolded state to the folded state, the folding cover area F is arranged in a curved surface, and the first cover area ① and the second cover area ② are at an angle of about 180 degrees. Different angles can be achieved. The folded state may include a fully folded state or an intermediate state. The fully folded state is a fully folded state in which the first cover area (①) and the second cover area (②) of the first surface 80A are no longer close, for example, the first cover area (①) and The second cover area (②) may form an angle of about 0 degrees to about 10 degrees. In the fully folded state, the first surface 80A (or the screen) may not be substantially exposed to the outside. The intermediate state may refer to a state between an unfolded state and a fully collapsed state. The folding cover area F of the first surface 80A may be more bent in the fully folded state than in the intermediate state.

According to an embodiment, the foldable housing 80 may include a front cover (eg, a window) 801 forming at least a part of the first surface 80A. The front cover 801 may be substantially transparent, for example. The flexible display 90 may be positioned in the internal space of the electronic device 8 and may be visually exposed through at least a portion of the front cover 801 . For example, the flexible display 90 may be positioned in the inner space of the electronic device 8 by overlapping at least partially with the front cover 801 , and the light output from the flexible display 90 may cover the front cover 801 . You can go through it and go outside. The flexible display 90 includes, for example, a first area (or first display area) 91 overlapping the first cover area ① of the first surface 80A, and a first area of the first surface 80A. It may include a second area (or second display area) 92 overlapping the second cover area (②), and a folding area (or third display area) 93 overlapping the folding cover area (F). . The front cover 801 may protect the flexible display 90 from the outside. In some embodiments, the front cover 801 may be integrally formed with the flexible display 90 as a component included in the flexible display 90 . The front cover 801 may be implemented in the form of a thin film such as a film to have flexibility. The front cover 801 may include, for example, a plastic film (eg, polyimide film) or thin glass (eg, ultra-thin glass (UTG)). In various embodiments, the front The cover 801 may include a plurality of layers, for example, the front cover 801 may be formed of a plastic film or thin glass with various polymer materials (eg, PET (polyester), PI (polyimide), or TPU (thermoplastic). It may be in a form in which a coating layer or a protective layer of polyurethane)) is disposed.

According to one embodiment, the foldable housing 80 includes a first housing portion (or first housing structure) 810 , a second housing portion (or second housing structure) 820 , and/or a hinge structure. structure) 830 . The first housing part 810 and the second housing part 820 are connected by a hinge structure 830, and the folding axis C of the foldable housing 80 (eg, the rotation axis of the hinge structure 830) It may be mutually rotatable with respect to the reference. The first housing part 810 may include a first rear cover 811 which at least partially forms the third cover area ③ of the second surface 80B. The first housing unit 810 may include a first side member (or a first side bezel structure) 812 . The first side member 812 may form, for example, a first side surface 80C that at least partially surrounds the space between the first surface 80A and the third cover area ③. The second housing unit 820 may include a second rear cover 821 that forms at least a part of the fourth cover area ④ of the second surface 80B. The second housing unit 820 may include a second side member (or a second side bezel structure) 822 . The second side member 822 may form, for example, a second side surface 80D that at least partially surrounds the space between the first surface 80A and the fourth cover area ④. In the fully folded state of the foldable housing 80 , the first side member 812 and the second side member 822 may overlap and be aligned. The first side member 212 and/or the second side member 822 may be formed of, for example, ceramic, polymer, metal (eg, aluminum, stainless steel, or magnesium), or a combination of at least two of the foregoing. can be formed by The first back cover 811 and/or the second back cover 821 may be substantially opaque. The first back cover 811 and/or the second back cover 821 may be, for example, coated or colored glass, ceramic, polymer, metal (eg, aluminum, stainless steel, or magnesium), or materials thereof. It may be formed by a combination of at least two of them. In various embodiments, the first back cover 811 and the first side member 812 may be integrally formed and may include the same material. In various embodiments, the second back cover 821 and the second side member 822 may be integrally formed and may include the same material.

The first housing part 810 is defined by including a partial area of the front cover 801 forming the first folding cover area F1 positioned on one side of the folding cover area F with respect to the folding axis C. can be The second housing part 820 is defined including a partial area of the front cover 801 forming the second folding cover area F2 located on the other side with respect to the folding axis C among the folding cover areas F. can be

According to various embodiments, the electronic device 8 may include an input module, a sound output module, a camera module, a sensor module, or a connection terminal. The electronic device 8 may be implemented by omitting some of the components or adding other components according to its provision form or convergence trend.

The input module may include, for example, a microphone located inside the electronic device 8 , and a first side 80A, a second side 80B, a first side 80C, or a second side corresponding to the microphone. It may include a microphone hole formed in (80D). In various embodiments, the electronic device 8 may include a plurality of microphones capable of detecting the direction of sound.

The input module may include, for example, a key input device. The key input device may be located on the first side 80C or the second side 80D. In some embodiments, the key input device may include at least one sensor module.

The sound output module may include, for example, a speaker located inside the electronic device 8 , and a first side 80A, a second side 80B, a first side 80C, or a second side corresponding to the speaker A speaker hole formed in the side surface 80D may be included. In various embodiments, the speaker may be a receiver for calls. In various embodiments, the microphone hole and the speaker hole may be implemented as one hole. In some embodiments, when a piezo speaker is included, the speaker hole may be omitted.

The camera module may be, for example, a first camera module (or front camera module) located inside the electronic device 8 corresponding to the first side 80A, and/or corresponding to the second side 80B. It may include a second camera module (or a rear camera module) located inside the electronic device 8 . The first camera module may photograph a subject positioned toward the first surface 80A, and the second camera module may photograph a subject positioned toward the second surface 80B. The camera module may include a flash (eg, a light emitting diode or a xenon lamp), and the flash may, for example, output light necessary for photographing the second camera module. The first camera module and/or the second camera module may include one or a plurality of lenses, an image sensor, and/or an image signal processor.

According to an embodiment, the first camera module may be aligned with an opening (eg, a through hole or a notch) formed in the flexible display 90 and positioned inside the electronic device 8 . In this case, external light may pass through the opening and a partial area of the front cover 801 overlapping the opening to reach the first camera module. According to some embodiments, the first camera module may be disposed at the bottom of the flexible display 90 , and the position of the first camera module is not visually distinguished (or exposed) and performs a related function (eg, image taking). can do. For example, the first camera module may be located on the rear surface of the flexible display 90 , or below or beneath the flexible display 90 . In various embodiments, the first camera module may be aligned and positioned in a recess formed on the rear surface of the flexible display 90 . The first camera module may be disposed to overlap at least a portion of the screen, and may acquire an image of an external subject without being exposed to the outside. In this case, a portion of the flexible display 90 overlapping at least partially with the first camera module may include a pixel structure and/or a wiring structure different from that of the other areas. For example, a portion of the flexible display 90 that is at least partially overlapped with the first camera module may have a different pixel density than other areas. A pixel structure and/or a wiring structure formed in a portion of the flexible display 90 overlapping at least partially with the first camera module may reduce light loss between the outside and the first camera module. According to some embodiments, pixels may not be disposed in a portion of the flexible display 90 that at least partially overlaps the first camera module.

According to an embodiment, the second camera module (eg, dual camera or triple camera) may have different properties (eg, angle of view) or functions. For example, the second camera module may include lenses having different angles of view, and the electronic device 8 changes the angle of view of the camera module performed by the electronic device 8 based on a user's selection. can be controlled For another example, the second camera module includes at least one of a wide-angle camera, a telephoto camera, a color camera, a monochrome camera, or an IR (infrared) camera (eg, a time of flight (TOF) camera, a structured light camera). may include In various embodiments, the IR camera may be operated as at least a part of a sensor module (not shown).

The sensor module may generate an electrical signal or data value corresponding to an internal operating state of the electronic device 8 or an external environmental state. The sensor module may include, for example, a proximity sensor, a gesture sensor, a gyro sensor, a barometric sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an IR (infrared) sensor, a biometric sensor (eg, a fingerprint sensor, an HRM sensor); It may include at least one of a temperature sensor, a humidity sensor, and an illuminance sensor.

According to an embodiment, the sensor module may include an optical sensor, aligned with an opening (eg, a through hole, or a notch) formed in the flexible display 90 to be positioned inside the electronic device 8 . can In this case, external light may pass through the opening and a partial area of the front cover 801 overlapping the opening to be introduced into the optical sensor.

According to some embodiments, the sensor module may be disposed at the bottom of the flexible display 90 , and the position of the sensor module may be visually not distinguished (or exposed) and may perform a related function. For example, the sensor module may be located on the rear surface of the flexible display 90 , or below or beneath the flexible display 90 . According to various embodiments, the sensor module may be aligned and positioned in a recess formed on the rear surface of the flexible display 90 . The sensor module may be disposed to overlap at least a portion of the screen, and may perform a corresponding function without being exposed to the outside. In this case, a portion of the flexible display 90 overlapping at least partially with the sensor module may include a pixel structure and/or a wiring structure different from other areas. For example, some areas of the flexible display 90 overlapping at least in part with the sensor module may have different pixel densities compared to other areas. A pixel structure and/or a wiring structure formed in a partial area of the flexible display 90 overlapping at least partially with the sensor module allows various types of signals (eg, light or ultrasound) related to the sensor module to pass between the outside and the sensor module. when that loss can be reduced. According to some embodiments, a plurality of pixels may not be disposed in a portion of the flexible display 90 that at least partially overlaps the sensor module.

The connection terminal includes, for example, a connector (eg, a USB connector) located inside the electronic device 8 , and a connector hole formed on the first side 80C or the second side 80D corresponding to the connector can do. The electronic device 8 may transmit and/or receive power and/or data with an external electronic device electrically connected to the connector through the connector hole.

According to an embodiment, the electronic device 8 may include at least one flexible printed circuit board (eg, a flexible printed circuit board (FPCB)) 910 positioned inside the foldable housing 80 . The flexible printed circuit board 910 may extend from the first housing part 810 to the second housing part 820 . The flexible printed circuit board 910 may electrically connect the first component included in the first housing part 810 and the second component included in the second housing part 810 . For example, the flexible printed circuit board 910 may include a first printed circuit board (eg, a printed circuit board (PCB)) positioned in the first housing part 810 and a second printed circuit board (PCB) positioned in the second housing part 820 . A printed circuit board may be electrically connected. According to an embodiment, the adhesive member 900 may be at least partially positioned between the flexible printed circuit board 910 and at least one support overlapping the flexible printed circuit board 910 . The adhesive member 900 , like the adhesive member 100 of FIG. 1 , may include a first adhesive layer, a second adhesive layer, and a third adhesive layer between the first adhesive layer and the second adhesive layer. The first adhesive layer may be attached to the flexible printed circuit board 910 , and the second adhesive layer may be attached to the support part. The support part may include, for example, various members (eg, a support member) overlapping the flexible printed circuit board 910 . In one embodiment, the adhesive member 900 may include a first portion 901 , a second portion 902 , and/or a third portion 903 . The first part 901 is the first cover area (①) of the first surface 80A or the first part of the flexible display 90 when viewed from above the first surface 80A in the electronic device 8 in the unfolded state. At least a portion of the first region 91 may overlap. The second part 902 is the second cover area ② of the first surface 80A or the second part of the flexible display 90 when viewed from above the first surface 80A in the electronic device 8 in the unfolded state. The second region 92 may at least partially overlap. The third part 903 is a folding cover area F of the first surface 80A or a folding area of the flexible display 90 when viewed from above the first surface 80A in the electronic device 8 in an unfolded state. (93) may overlap at least partially. The laminate structure regarding the first part 901 and the third part 903 , or the laminate structure regarding the second part 902 and the third part 903 is, for example, the first part in the embodiment of FIG. 4 . The laminate structure of the adhesive member 400 disposed between the adherend 401 and the second adherend 402 to correspond to the first section 451 and the second section 452 may be formed substantially the same. . The laminated structure of the first part 901 and the third part 903 or the laminated structure of the second part 902 and the third part 903 is another example, in the embodiment of FIG. 5 . Between the first adherend 501 and the second adherend 502, the first section 551 and the second section 552 may be formed to have substantially the same laminate structure as the adhesive member 500 disposed to correspond to the first and second sections 551 and 552. there is. The laminated structure of the first part 901 and the third part 903 or the laminated structure of the second part 902 and the third part 903 is another example, in the embodiment of FIG. 6 . Between the first adherend 601 and the second adherend 602, the first section 651 and the second section 652 may be formed to have substantially the same laminated structure as the adhesive member 600 disposed to correspond to the first and second sections 651 and 652. there is. The laminated structure of the first part 901 and the third part 903 or the laminated structure of the second part 902 and the third part 903 is another example, in the embodiment of FIG. 7 . Between the first adherend 701 and the second adherend 702, the first section 751 and the second section 752 may be formed to have substantially the same laminated structure as the adhesive member 700 disposed to correspond to the first section 751 and the second section 752. there is.

According to various embodiments, the third adhesive layer (eg, the third adhesive layer 130 of FIG. 1 ) included in the adhesive member 900 may mitigate external impact. The third adhesive layer may contribute to maintaining the bond between the two parts by mitigating external impact. The third part 903 of the adhesive member 900 is positioned in the folding section of the electronic device 8, and the third adhesive layer has a bending characteristic and has a bearing strength that does not break in response to a force acting in bending. there is.

According to various embodiments, the stacked structure 103 of FIG. 1 , the fourth stacked structure 403 , the stacked structure 503 of FIG. 5 , the stacked structure 603 of FIG. 6 , or the stacked structure 703 of FIG. 7 , according to various embodiments ) is not limited to the embodiment of FIG. 8 , and may correspond to a coupling structure between various other two components included in the electronic device 8 .

According to various embodiments, the stacked structure 103 of FIG. 1 , the fourth stacked structure 403 , the stacked structure 503 of FIG. 5 , the stacked structure 603 of FIG. 6 , or the stacked structure 703 of FIG. 7 , according to various embodiments ) is the first corner portion C1 and/or the second corner portion C2 of the first side member 812 , and/or the third corner portion C3 and/or the second corner portion C2 of the second side member 822 . Corresponding to the four corner portions C4 may correspond to a coupling structure between the two parts. When an external impact (eg, external impact due to falling) is applied to the first corner portion C1, the second corner portion C2, the third corner portion C3, or the fourth corner portion C4, the adhesive member (eg, the adhesive member 100 of FIG. 1 , the adhesive member 400 of FIG. 4 , the adhesive member 500 of FIG. 5 , the adhesive member 600 of FIG. 6 , or the adhesive member 700 of FIG. 7 ) The included third adhesive layer (eg, the third adhesive layer 130 of FIG. 1 ) may contribute to maintaining the bond between the two adherends by mitigating external impact.

According to various embodiments, the third adhesive layer (eg, the third adhesive layer 130 of FIG. 1 ) included in the adhesive member 900 may diffuse, disperse, or radiate heat generated in the electronic device 8 . there is. The third adhesive layer included in the adhesive member 900 may contribute to electrical insulation between the two components. The third adhesive layer included in the adhesive member 900 may serve as an EMI shielding function. The third adhesive layer included in the adhesive member 900 may include materials for various other functions.

According to an embodiment of the present invention, the adhesive member (eg, the adhesive member 100 of FIG. 1 ) may include a first adhesive (eg, the first adherend 101 of FIG. 1 ) attached to the first part (eg, the first adherend 101 of FIG. 1 ). The first adhesive layer 110 of FIG. 1 may be included. The adhesive member may include a second adhesive (eg, the second adhesive layer 120 of FIG. 1 ) attached to the second component (eg, the second adherend 102 of FIG. 1 ). The adhesive member may include an adhesive (eg, the third adhesive layer 130 of FIG. 1 ) positioned between the first adhesive and the second adhesive. At least one of the first adhesive, the second adhesive, and the adhesive has a first thickness in a first section between the first part and the second part, and a second adhesive between the first part and the second part. In the second section, the second thickness may be different from the first thickness (eg, refer to FIGS. 4, 5, 6, or 7 ).

According to an embodiment of the present invention, the adhesive member may have different thicknesses in the first section and the second section (eg, refer to FIGS. 6 or 7 ).

According to an embodiment of the present invention, the adhesive (eg, the third adhesive layer 130 of FIG. 1 ) includes the first adhesive (eg, the first adhesive layer 110 of FIG. 1 ) and the second adhesive ( Example: It may have a greater tensile strength than the second adhesive layer 120 of FIG. 1 ).

According to an embodiment of the present invention, the adhesive (eg, the third adhesive layer 130 of FIG. 1 ) may have a tensile strength of 30 kgf/cm ² or more.

According to an embodiment of the present invention, the first adhesive (eg, the first adhesive layer 110 of FIG. 1 ), the second adhesive (eg, the second adhesive layer 120 of FIG. 1 ), and the adhesive (eg, the third adhesive layer 130 of FIG. 1 ) may include a polymer of the same series.

According to an embodiment of the present invention, the adhesive (eg, the third adhesive layer 130 of FIG. 1 ) includes the first adhesive (eg, the first adhesive layer 110 of FIG. 1 ) and the second adhesive ( Example: A curing agent for chemical bonding with the second adhesive layer 120 of FIG. 1 ) may be included.

According to an embodiment of the present invention, the adhesive (eg, the third adhesive layer 130 of FIG. 1 ) may be cured by reacting with a curing agent.

According to an embodiment of the present invention, the adhesive (eg, the third adhesive layer 130 of FIG. 1 ) may be cured in response to heat.

According to an embodiment of the present invention, the adhesive (eg, the third adhesive layer 130 of FIG. 1 ) may be cured in response to light.

According to an embodiment of the present invention, the adhesive (eg, the third adhesive layer 130 of FIG. 1 ) may include a buffer material.

According to an embodiment of the present invention, the adhesive (eg, the third adhesive layer 130 of FIG. 1 ) may include a heat dissipation material.

According to an embodiment of the present invention, the adhesive (eg, the third adhesive layer 130 of FIG. 1 ) may include an electromagnetic shielding material.

According to an embodiment of the present invention, the adhesive (eg, the third adhesive layer 130 of FIG. 1 ) may include a dielectric material having insulating properties.

According to an embodiment of the present invention, an electronic device (eg, the electronic device 8 of FIG. 8 ) may include a first component and a second component. The electronic device may include a first adhesive (eg, the first adhesive layer 110 of FIG. 1 ) attached to the first component (eg, the first adherend 101 of FIG. 1 ). The electronic device may include a second adhesive (eg, the second adhesive layer 120 of FIG. 1 ) attached to the second component (eg, the second adherend 102 of FIG. 1 ). The electronic device may include an adhesive (eg, the third adhesive layer 130 of FIG. 1 ) positioned between the first adhesive and the second adhesive. At least one of the first adhesive, the second adhesive, and the adhesive has a first thickness in a first section between the first part and the second part, and a second adhesive between the first part and the second part. In the second section, the second thickness may be different from the first thickness (eg, refer to FIGS. 4, 5, 6, or 7 ).

According to an embodiment of the present invention, the adhesive member may have different thicknesses in the first section and the second section (eg, refer to FIGS. 6 or 7 ).

According to an embodiment of the present invention, the adhesive (eg, the third adhesive layer 130 of FIG. 1 ) includes the first adhesive (eg, the first adhesive layer 110 of FIG. 1 ) and the second adhesive It may have a greater tensile strength than (eg, the second adhesive layer 120 of FIG. 1 ).

According to an embodiment of the present invention, the adhesive (eg, the third adhesive layer 130 of FIG. 1 ) may have a tensile strength of 30 kgf/cm ² or more.

According to an embodiment of the present invention, the first component (eg, the first adherend 101 of FIG. 1 ) or the second component (eg, the second adherend 102 of FIG. 1 ) is a flexible printed circuit. It may include a board (eg, the flexible printed circuit board 910 of FIG. 8 ).

According to an embodiment of the present invention, the electronic device may further include a housing (eg, the housing 80 of FIG. 8 ). The housing includes a first side of the electronic device (eg, the first side 80A of FIG. 8 ) and a second side of the electronic device that faces in a direction opposite to the first side (eg, the second side of the electronic device, such as the second side of FIG. 8 ). face 80B). The housing may be foldable in or out of the first surface with respect to a folding axis (eg, a folding axis (C) of FIG. 8 ). The electronic device may further include a flexible display (eg, the flexible display 90 of FIG. 8 ) positioned in the housing. The flexible display may be visually exposed through the first surface. The flexible display includes a first area (eg, the first area 91 of FIG. 8 ), a second area (eg, the second area 92 of FIG. 8 ), and a space between the first area and the second area. It may include a folding area (eg, the folding area 93 of FIG. 8 ). The adhesive member (eg, the adhesive member 900 of FIG. 8 ) may include a first portion that at least partially overlaps the first region (eg, the first portion 901 of FIG. 8 , and at least partially overlaps the second region) It may include a second part (eg, the second part 902 of FIG. 8 ), and a third part (eg, the third part 903 of FIG. 8 ) that at least partially overlaps the folding area. 1 section (eg, the first section 451 of FIG. 4 , the first section 551 of FIG. 5 , the first section 651 of FIG. 6 , or the first section 751 of FIG. 7 ) is the first section part or corresponding to the second part, and the second section (eg, the second section 452 of Fig. 4 , the first section 552 of Fig. 5 , the first section 652 of Fig. 6 , or Fig. 7 ) The first section 752 of ) may correspond to the third part.

According to an embodiment of the present invention, the method of manufacturing an adhesive member includes an operation of disposing a first adhesive on a first part (eg, operation 210 of FIG. 2 ), an operation of disposing a second adhesive on a second part (eg, operation 210 of FIG. 2 ) : operation 230 of FIG. 2 ), and an operation of placing and curing an adhesive between the first adhesive and the second adhesive (eg, operations 220 and 240 of FIG. 2 ). At least one of the first adhesive, the second adhesive, and the adhesive has a first thickness in a first section between the first part and the second part, and a second adhesive between the first part and the second part. In the second section, the second thickness may be different from the first thickness.

The embodiments of the present invention disclosed in the present specification and drawings are merely provided for specific examples to easily explain the technical contents according to the embodiments of the present invention and help the understanding of the embodiments of the present invention, and limit the scope of the embodiments of the present invention It's not what you want to do. Therefore, the scope of various embodiments of the present invention should be construed as being included in the scope of various embodiments of the present invention, in addition to the embodiments disclosed herein, changes or modifications.

Claims (14)

1. In the adhesive member,

   a first adhesive attached to the first part;

   a second adhesive to be attached to the second part; and

   an adhesive positioned between the first pressure-sensitive adhesive and the second pressure-sensitive adhesive;

   At least one of the first adhesive, the second adhesive, and the adhesive,

   having a first thickness in a first section between the first part and the second part;

   An adhesive member having a second thickness different from the first thickness in a second section between the first part and the second part.
2. The method of claim 1,

   The adhesive member may have different thicknesses in the first section and the second section.
3. The method of claim 1,

   The adhesive has a greater tensile strength than that of the first and second adhesives.
4. The method of claim 1,

   The adhesive is an adhesive member having a tensile strength of 30 kgf/cm ² or more.
5. The method of claim 1,

   The first pressure-sensitive adhesive, the second pressure-sensitive adhesive, and the adhesive is an adhesive member including a polymer of the same series.
6. The method of claim 1,

   The adhesive is an adhesive member including a curing agent for chemical bonding with the first and second pressure-sensitive adhesives.
7. The method of claim 1,

   The adhesive is an adhesive member cured in response to a curing agent.
8. The method of claim 1,

   The adhesive is an adhesive member cured in response to heat.
9. The method of claim 1,

   The adhesive is an adhesive member cured in response to light.
10. The method of claim 1,

    The adhesive is an adhesive member including a cushioning material.
11. The method of claim 1,

    The adhesive is an adhesive member including a heat dissipation material.
12. The method of claim 1,

    wherein the adhesive includes an electromagnetic shielding material.
13. The method of claim 1,

    The adhesive is an adhesive member including a dielectric material having insulating properties.
14. In the manufacturing method of the adhesive member,

    placing a first adhesive on the first part;

    placing a second adhesive on the second part; and

    Positioning and curing an adhesive between the first pressure-sensitive adhesive and the second pressure-sensitive adhesive,

    At least one of the first adhesive, the second adhesive, and the adhesive,

    having a first thickness in a first section between the first part and the second part;

    and a second thickness different from the first thickness in a second section between the first part and the second part.

Images