WO2022068303A1 - 导风插件、机柜、电子设备及导风插件的制造方法 - Google Patents

导风插件、机柜、电子设备及导风插件的制造方法 Download PDF

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Publication number
WO2022068303A1
WO2022068303A1 PCT/CN2021/104816 CN2021104816W WO2022068303A1 WO 2022068303 A1 WO2022068303 A1 WO 2022068303A1 CN 2021104816 W CN2021104816 W CN 2021104816W WO 2022068303 A1 WO2022068303 A1 WO 2022068303A1
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WO
WIPO (PCT)
Prior art keywords
air
cover plate
air guide
plate
space
Prior art date
Application number
PCT/CN2021/104816
Other languages
English (en)
French (fr)
Inventor
周陆军
闫涛
郑光明
Original Assignee
华为技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from CN202011492085.1A external-priority patent/CN114340301B/zh
Application filed by 华为技术有限公司 filed Critical 华为技术有限公司
Priority to EP21873965.4A priority Critical patent/EP4203635A4/en
Publication of WO2022068303A1 publication Critical patent/WO2022068303A1/zh
Priority to US18/187,686 priority patent/US20230225075A1/en

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20718—Forced ventilation of a gaseous coolant
    • H05K7/20736—Forced ventilation of a gaseous coolant within cabinets for removing heat from server blades
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136—Forced ventilation, e.g. by fans
    • H05K7/20145—Means for directing air flow, e.g. ducts, deflectors, plenum or guides

Definitions

  • the present application relates to the field of communication equipment, and in particular, to an air guide insert, a cabinet, an electronic device, and a manufacturing method of the air guide insert.
  • switches In the data center, there are a large number of switches, and the switches mainly include main control cards, line cards, and switching network boards.
  • the main control card is equivalent to the brain of the switch and plays the role of control.
  • the line card mainly provides ports of various speeds, while the switch network board provides the ability of high-speed interconnection between line cards.
  • the switch is usually carried by a cabinet.
  • the cabinet mainly includes a cabinet, a fan group, and multiple service carrier boards.
  • the service carrier boards are used to carry line cards.
  • the slots are stacked and connected in sequence from top to bottom.
  • the fan group is located on one side of each slot, so as to guide the air to flow through the slot to dissipate heat for the line card inserted in the slot.
  • there are usually vacant slots (the service carrier board is not inserted) and these empty slots will provide bypasses for the airflow, so that the airflow overflows from these empty slots, resulting in the insertion of the service carrier board.
  • the air volume in the slot becomes smaller, and the line card cannot get enough heat dissipation.
  • the wind resistance plate is usually inserted in the empty slot to block the airflow from entering, thereby reducing the airflow bypass.
  • Embodiments of the present application provide an air guide insert, a cabinet, an electronic device, and a method for manufacturing the air guide insert, so as to overcome the problem of poor heat dissipation effect of electronic devices in the related art.
  • an air guide insert is provided.
  • the air guide insert is applied in a cabinet and includes a housing and a flow guide structure.
  • the casing has a first air inlet and a first air outlet, and the planes where the first air inlet and the first air outlet are located have an included angle, that is, the flow directions of the first air inlet and the first air outlet are different.
  • the flow direction refers to the flow direction of the air flow when passing through the position, that is, the directions of the air flow when passing through the first air inlet and the first air outlet are different from each other.
  • the air guide structure is located in the housing, and the air guide structure is configured to guide the airflow flowing into the first air inlet to the first air outlet.
  • the position change and guidance of the air flow can be realized.
  • the air flow in the cabinet can be guided by the air guide inserts, so that the air guide inserts not only do not block the airflow, but also guide the airflow to other required parts in the cabinet.
  • the position of the electronic device (the position where the electronic device is arranged) not only ensures the total air intake of the cabinet, but also improves the heat dissipation effect for the electronic device.
  • the air guide insert After the air guide insert is applied to the cabinet, a part of the airflow flows through the position where the electronic devices are arranged, so as to directly dissipate the heat of the electronic devices.
  • the other part of the airflow flows through the air guide insert, and after entering through the first air inlet, it is guided to the first air outlet under the action of the air guide structure.
  • the air output from the first air outlet is guided to the position where the electronic devices are arranged in the cabinet, so the electronic devices can also be dissipated.
  • the housing includes an upper cover plate, a lower cover plate and an end plate.
  • the relative spacing between the upper cover plate and the lower cover plate provides a space basis for the circulation of airflow.
  • the end plate is located between the upper cover plate and the lower cover plate, and one side of the end plate is connected to one side of the upper cover plate, and the opposite side of the end plate is connected to one side of the lower cover plate, so as to pass the The end plate realizes the connection between the upper cover plate and the lower cover plate.
  • the air guide structure includes a first air guide plate, the first air guide plate is also located between the upper cover plate and the lower cover plate, and one side of the first air guide plate is connected with the upper cover plate, and the opposite side is connected with the upper cover plate.
  • the lower cover plates are connected, so that the first air guide plate can be stably connected between the upper cover plate and the lower cover plate. That is to say, the upper cover plate, the lower cover plate, the end plate and the first air guide plate are connected together to form a whole.
  • the upper cover plate, the lower cover plate, the end plate and the first air deflector enclose a first space, the first air inlet is located in the first space corresponding to the end plate, and the first air outlet is located in the first space corresponding to the lower part. position of the cover. That is, the first space can communicate the first air inlet and the second air outlet.
  • the air flow enters the first space from the outside, and is guided to the electronic device from the first space, so that the electronic device can be dissipated, so that the air flow can be fully use to ensure the cooling effect.
  • the first air deflector is arranged obliquely, and is inclined in a direction away from the first air outlet from one side edge of itself to the opposite side edge.
  • This design enables the first air guide plate to better guide the airflow entering the first space, so that it can flow toward the first air outlet along the inclined first air guide plate, so as to flow out of the first space smoothly.
  • the air guide structure further includes a second air guide plate
  • the second air guide plate is also located between the upper cover plate and the lower cover plate, and is located on the side of the first air guide plate away from the end plate , that is, it is spaced apart from the first air deflector.
  • One side of the second air guide plate is connected with the upper cover plate, and the opposite side is connected with the lower cover plate, so that the second air guide plate is stably connected between the upper cover plate and the lower cover plate.
  • the side of the upper cover, the lower cover and the second wind deflector away from the first wind deflector encloses a second space, that is, the second space is located on the side of the second wind deflector away from the first wind deflector .
  • the second air inlet is located at a position corresponding to the lower cover plate of the second space.
  • the second air deflector is arranged obliquely, and is inclined in a direction away from the second air inlet from one side edge of the second air guide plate to the opposite side edge.
  • This design enables the second air deflector to better guide the airflow entering the second space, so that it can flow along the inclined second air deflector and away from the second air deflector, so as to smoothly flow out of the second air deflector. space to remove heat.
  • a third space is formed between the upper cover plate, the lower cover plate, the first air guide plate and the second air guide plate, and the third space is located between the first space and the second space.
  • the third space has a third air inlet and a second air outlet, which are respectively located at positions corresponding to the upper cover plate of the third space.
  • the air outlet enters the corresponding third space, and further air flow will enter the corresponding second space through the second air outlet of the lower air guide insert and the second air inlet of the upper air guide insert in sequence, and finally flow out of the second space. That is to say, when two air guide inserts are adjacent, the airflow entering the upper air guide insert can circulate through the third space of the lower air guide insert, and finally return to the upper air guide insert and flow out, further Improve the uniformity of the air outlet.
  • the cabinet includes a variety of replaceable air guide inserts, and the structure of each air guide insert is substantially the same, except that the first air inlet, the second air inlet, the third air inlet, the The first air outlet and the second air outlet have various sizes.
  • the user can select the appropriate size of the air guide plug-in according to the actual needs to control the flow rate and flow rate of the air flow, which improves the applicability of the cabinet.
  • a cabinet which includes the following parts, which are a cabinet body, a fan group, an air guide insert, and a service carrier board.
  • the cabinet is used to provide the installation basis for the fan group, the air guide inserts and the service carrier board, so that the cabinet becomes a whole that can carry various electronic devices such as line cards.
  • a slot space is configured in the cabinet, and the slot space is further divided into a plurality of successively stacked and connected slots. Each slot is used for accommodating an air guide plug-in, or a service carrier board, that is, the air guide plug-in is plugged into the slot that is not plugged with the service carrier board.
  • the air guide insert and the service carrier board are respectively detachably inserted into the slot, so as to facilitate the replacement of the air guide insert and the service carrier board in the slot.
  • the service carrier board is used to carry the line card to provide the installation basis for the line card.
  • the fan group is arranged in the cabinet and arranged side by side with the slot space, so that the airflow formed by the fan group can flow through the slot space. A portion of the airflow flows through the slot into which the service carrier board is inserted, thereby dissipating heat from the line cards installed on the service carrier board. The other part of the airflow flows through the slot where the air guide insert is inserted. Since the air guide insert can guide the airflow in the slot to the adjacent slot, this part of the airflow will eventually be introduced into the slot.
  • the line card is further dissipated by being inserted into the slot where the service carrier board is inserted.
  • the fan group works to form an airflow flowing through the slot space.
  • a part of the airflow flows through the slot where the service carrier board is inserted, and directly dissipates heat for the line cards installed on the service carrier board.
  • the other part of the airflow flows through the slot where the air guide plug-in is inserted. Since the air guide plug-in can guide the airflow in the slot to the adjacent slot, this part of the air flow will eventually be introduced into the plug-in plug-in. In the slot where the service carrier board is connected, it can also dissipate heat for the line card installed on the service carrier board.
  • the air can enter, that is, the slot space can receive all the airflow generated by the fan group, ensuring the total intake air volume.
  • the airflow received by the slot space can be used to dissipate heat for the line cards on the service carrier board, so the problem of airflow overflow is also solved, and the heat dissipation effect is guaranteed.
  • the air guide inserts no longer block the airflow, the noise generated when the airflow hits is also reduced.
  • the fan group includes a plurality of fans, and the fans are arranged side by side in sequence along the stacking direction of the slots. This design enables the fan group to evenly generate airflow to each slot, avoids the problem of uneven airflow, and ensures that each slot can have sufficient airflow.
  • an electronic device including a cabinet and an electronic device.
  • the cabinet is the cabinet of the first aspect and has all the benefits of the cabinet of the first aspect.
  • the electronic equipment includes a line card and a switching network board.
  • the line card is installed in the service carrier board to be inserted into the slot together with the service carrier board, and can receive good heat dissipation from the cabinet.
  • the switch fabric board is directly installed in the cabinet and is located between the slot space and the fan group, so that the air flowing out of the slot space can also flow through the switch fabric board. Exported by the fan group for heat exchange with the outside world.
  • the electronic components are carried by the cabinet to provide the installation basis and heat dissipation conditions for the electronic components. Since the line card in the electronic equipment is installed on the service carrier board, and the service carrier board is located in the slot, the air flow in the slot can dissipate heat well for the line card, so that the line card is at a suitable working temperature to ensure that the the normal operation of the line card. Since the switch fabric board in the electronic equipment is installed in the cabinet and is located between the slot space and the fan group, the air flowing out of the slot space can further dissipate heat to the switch fabric board, so that the switch fabric board is in the The proper working temperature ensures the normal operation of the switch fabric board. That is to say, the electronic device provided by the embodiments of the present application can ensure good heat dissipation of the electronic device, thereby ensuring its normal and stable operation.
  • a method for manufacturing a cabinet including the following steps. First, a cabinet body is provided, the cabinet has a slot space, and the slot space is divided into a plurality of successively stacked and connected slots, This provides an installation basis for installing the fan group, air guide inserts, and service carrier board in the subsequent steps. Then, the fan group is connected to the cabinet, so that the fan group and the slot space are arranged side by side, so that the air flow through the slot space can be formed by the fan group. Next, the air guide insert is detachably inserted into the slot, so that the air flow in the slot can be guided to the adjacent slot through the air guide insert. Finally, the service carrier board is detachably plugged into the slot, so that the line card can be carried by the service carrier board.
  • the fan group works to form an airflow flowing through the slot space.
  • a part of the airflow flows through the slot where the service carrier board is inserted, and directly dissipates heat for the line cards installed on the service carrier board.
  • the other part of the airflow flows through the slot where the air guide plug-in is inserted. Since the air guide plug-in can guide the airflow in the slot to the adjacent slot, this part of the air flow will eventually be introduced into the plug-in plug-in. In the slot where the service carrier board is connected, it can also dissipate heat for the line card installed on the service carrier board.
  • the air can enter, that is, the slot space can receive all the airflow generated by the fan group, ensuring the total intake air volume.
  • the airflow received by the slot space can be used to dissipate heat for the line cards on the service carrier board, so the problem of airflow overflow is also solved, and the heat dissipation effect is guaranteed.
  • the air guide inserts no longer block the airflow, the noise generated when the airflow hits is also reduced.
  • FIG. 1 is a schematic structural diagram of a cabinet in the related art
  • FIG. 2 is a schematic structural diagram of a cabinet with a wind resistance board inserted in the related art
  • FIG. 3 is a schematic structural diagram of an air guide insert provided in an embodiment of the present application.
  • FIG. 4 is a schematic structural diagram of a cabinet provided by an embodiment of the present application.
  • Fig. 5 is the gas flow diagram of the air guide insert provided by the embodiment of the present application.
  • FIG. 6 is a schematic structural diagram of another air guide insert provided in an embodiment of the present application.
  • Fig. 7 is the gas flow diagram of the air guide insert provided by the embodiment of the present application.
  • FIG. 8 is a schematic structural diagram of another air guide insert provided in an embodiment of the present application.
  • Fig. 9 is the gas flow diagram of the air guide insert provided by the embodiment of the present application.
  • FIG. 10 is a schematic structural diagram of an electronic device provided by an embodiment of the present application.
  • FIG. 11 is a flowchart of a method for manufacturing an air guide insert provided in an embodiment of the present application.
  • A the first space
  • B the second space
  • C the third space
  • the data center switch is an important part of the data center, which mainly includes the main control card, line card and switching network board.
  • the main control card is equivalent to the brain of the switch and plays the role of control.
  • the line card mainly provides ports of various speeds, and the switch network board provides high-speed interconnection between the line cards.
  • the switch is usually carried by a cabinet.
  • the cabinet mainly includes a cabinet, a fan group, and multiple service carrier boards.
  • the service carrier boards are used to carry line cards.
  • the slots are stacked and connected in sequence from top to bottom.
  • the fan group is located on one side of each slot, so as to guide the air to flow through the slot to dissipate heat for the line card inserted in the slot.
  • FIG. 3 is a schematic structural diagram of the air guide insert.
  • the air guide insert includes a casing 1 and a flow guide structure 2 .
  • the housing 1 has a first air inlet 1a and a first air outlet 1b, and an angle is formed between the planes where the first air inlet 1a and the first air outlet 1b are located.
  • the air guide structure 2 is located in the casing 1, and the air guide structure 2 is configured to guide the air flow flowing into the first air inlet 1a to the first air outlet 1b.
  • the flow directions of the first air inlet 1a and the first air outlet 1b are different, that is, the airflow passes through the first air inlet 1a and the first air outlet 1b.
  • the directions of the first air outlets 1b are different from each other, so that the direction change and guidance of the air flow can be realized.
  • the air guide structure 2 can guide the air flow that flows into the first air inlet 1a to the first air outlet 1b, the air guide inserts can realize the direction change and guide of the air flow.
  • FIG. 4 is a schematic structural diagram of a cabinet according to an embodiment of the present application.
  • the air guide insert shown in FIG. 3 is configured in the cabinet.
  • the overall orientation of FIG. 4 is the same as that of FIG. 3 , that is, the fan group 20 is located on the right side of the air guide insert 30 in FIG. Flow laterally to the right.
  • the cabinet includes a cabinet body 10 , a fan group 20 , an air guide insert 30 and a service carrier board 40 .
  • the cabinet 10 has a slot space 101 .
  • the slot space 101 is composed of a plurality of slots 1011 that are stacked in sequence and communicate with each other.
  • Each slot 1011 is used to accommodate the air guide insert 30 or the service carrier board 40 . That is to say, the cabinet body 10, as the main body of the cabinet, can provide an installation basis for the air guide inserts 30 and the service carrier board 40.
  • the slot space 101 in the cabinet 10 is divided into a plurality of interconnected slots 1011, and each slot 1011 is plugged with an air guide insert 30 or a service carrier board 40, which can be used for airflow in each slot.
  • the circulation between the positions 1011 provides a space basis, and can also provide a relatively independent area for the air guide insert 30 and the service carrier board 40 to avoid mutual interference between the air guide insert 30 and the service carrier board 40 during the assembly process.
  • the fan group 20 is located in the cabinet 10 and arranged side by side with the slot space 101 , and is used to form an air flow flowing through the slot space 101 .
  • the direction of the air flow is from the slot space 101 to the fan group 20, that is, from left to right in FIG. Heat is taken away from the right side for air cooling.
  • the air guide insert 30 is detachably inserted into the slot 1011 to guide the airflow in the slot 1011 where it is located to the adjacent slot 1011 .
  • the service carrier board 40 is detachably plugged into the slot 1011 to carry the line card 210 .
  • the air guide plug-in 30 and the service carrier board 40 are respectively detachably plugged into the slot 1011 , so that the user can decide whether to plug the air guide plug-in 30 or the service carrier board 40 in the slot 1011 according to actual needs.
  • the service carrier board 40 is inserted into the correspondingly larger number of slots 1011, and the air guide plug-in 30 is inserted into the remaining empty slots 1011, so as to The air flow in the empty slot 1011 is guided into the other slots 1011 .
  • the service carrier boards 40 are inserted into the corresponding fewer slots 1011 , and the air guide plugs 30 are inserted into the remaining empty slots 1011 , so as to connect the empty slots 1011 The airflow in the duct is guided into other slots 1011 .
  • the fan group 20 operates to form an airflow flowing through the slot space 101 .
  • a part of the airflow flows through the slot 1011 into which the service carrier board 40 is inserted, and directly dissipates heat for the line card 210 installed on the service carrier board 40 .
  • Another part of the airflow flows through the slot 1011 where the air guide insert 30 is inserted. Since the air guide insert 30 can guide the airflow in the slot 1011 to the adjacent slot 1011, this part of the airflow, Finally, it will be introduced into the slot 1011 in which the service carrier board 40 is inserted, which can also dissipate heat from the line card 210 installed on the service carrier board 40 .
  • the air can enter whether it is inserted into the slot 1011 of the service carrier board 40 or into the slot 1011 of the air guide plug-in 30, that is, the slot space 101 can receive all the airflow generated by the fan group 20. , to ensure the total air intake.
  • the airflow received by the slot space 101 can be fully used to dissipate heat for the line cards 210 on the service carrier board 40, so the problem of airflow overflow is also solved, and the heat dissipation effect is ensured.
  • the air guide insert 30 no longer blocks the airflow, the noise generated when the airflow hits is also reduced.
  • the fan group 20 includes a plurality of fans 201 , and the fans 201 are arranged side by side in sequence along the stacking direction of the slots 1011 .
  • Such a design enables the fan group 20 to evenly generate airflow to each slot 1011 , avoiding the problem of uneven airflow, and ensuring sufficient airflow in each slot 1011 .
  • one fan 201 corresponds to two slots 1011 shown in FIG. 4
  • the number of fans 201 and slots 1011 corresponds to each other, which can be adjusted according to requirements.
  • one fan 201 corresponds to one slot 1011, or one fan 201 corresponds to three slots 1011, and so on. This application does not limit this.
  • the air guide insert 30 is a key component for making full use of the airflow in the slot 1011 to improve the heat dissipation effect.
  • the air guide insert 30 will be further introduced below.
  • the housing includes an upper cover plate 11 , a lower cover plate 12 and an end plate 13 .
  • the upper cover plate 11 and the lower cover plate 12 are relatively spaced apart, the end plate 13 is located between the upper cover plate 11 and the lower cover plate 12 , and one side of the end plate 13 is connected to a side of the upper cover plate 11 away from the fan group 20 .
  • the sides are connected, and the opposite side of the end plate 13 is connected with the side of the lower cover 12 away from the fan group 20 .
  • the air guide structure includes a first air guide plate, the first air guide plate 21 is located between the upper cover plate 11 and the lower cover plate 12, and one side of the first air guide plate 21 is connected with the upper cover plate 11, and the opposite side One side is connected with the lower cover plate 12 .
  • the upper cover plate 11 is a rectangular plate, extending from the direction of the groove body space toward the direction of the fan group 20 .
  • the lower cover 12 is parallel to the upper cover 11 , the shape and size of the lower cover 12 are the same as those of the upper cover 11 , and the orthographic projection of the lower cover 12 on the upper cover 11 completely coincides with the upper cover 11 .
  • the end plates 13 are rectangular plates, and the end plates 13 are perpendicular to the upper cover plate 11 and the lower cover plate 12 respectively. The end plate 13 , the upper cover plate 11 and the lower cover plate 12 are welded together to ensure the connection firmness of the end plate 13 between the upper cover plate 11 and the lower cover plate 12 .
  • the first air guide plate 21 is a rectangular plate, and the first air guide plate 21 , the upper cover plate 11 and the lower cover plate 12 are welded together, which can ensure that the first air guide plate 21 is connected to the upper cover plate 11 and the lower cover plate 12 .
  • the upper cover plate 11, the lower cover plate 12, the end plate 13 and the first air guide plate 21 enclose a first space A
  • the first air inlet 1a is located in the first space A corresponding to the position of the end plate 13, and the first air inlet 1a
  • the first air outlet 1b is located in the first space A at a position corresponding to the lower cover 12, and the first air outlet 1b is opposite to the adjacent slot 1011 below.
  • the end plate 13 By arranging the end plate 13 between the upper cover plate 11 and the lower cover plate 12, and the two sides of the end plate 13 are respectively connected with the upper cover plate 11 and the lower cover plate 12, the end plate 13 can be used to connect the upper cover plate 11 and the lower cover plate 12.
  • the lower cover 12 is connected as a whole.
  • the first air guide plate 21 is arranged between the upper cover plate 11 and the lower cover plate 12 , and the first air guide plate 21 can be used to enclose a first space between the upper cover plate 11 , the lower cover plate 12 and the end plate 13 . A, to provide a spatial basis for the diversion airflow.
  • a first air outlet 1b and a first air inlet 1a are arranged in the first space A, and the first air inlet 1a is located in the first space A at a position corresponding to the end plate 13, so that the first space A can be communicated with the outside world.
  • the first air outlet 1b is located in the first space A at a position corresponding to the lower cover 12, so that the first space A and the adjacent slot 1011 below can be opposite and communicated, thereby limiting the path of the airflow entering the first space A , and the output path of the first space A.
  • FIG. 5 is a gas flow diagram of the air guide insert 30. In order to show the air guide between adjacent slots 1011 more clearly, only two slots 1011 are shown in FIG. 5, and the remaining slots 1011 are omitted. In the following, in conjunction with FIG. 5 , the flow guiding principle of the air guiding insert 30 will be introduced.
  • the fan group 20 works to form a flowing airflow on both sides of the slot space 101 .
  • the service carrier board 40 is located below the air guide insert 30 .
  • the air at room temperature flows directly from the left side of the slot 1011 and flows through the service carrier board 40 .
  • the line card 210 on the 40 performs heat exchange, converts it into a higher temperature airflow and flows out from the right side of the slot 1011, thereby completing the entire heat dissipation process.
  • the air at room temperature flows into the first space A from the first air inlet 1a, and flows out of the first space A from the first air outlet 1b to flow into the lower slot In 1011 , it intersects with the airflow in the lower slot 1011 , thereby further increasing the airflow in the lower slot 1011 , thereby improving the heat dissipation effect for the line card 210 .
  • the first air outlet 1b is arranged close to the end plate 13 .
  • first air guide plate 21 is inclined in a direction away from the first air outlet 1b from one side to the opposite side. This design enables the first air deflector 21 to better guide the airflow entering the first space A, so that it can flow toward the first air outlet 1b along the inclined first air deflector 21 , so that the air flow can be smoothly Enter slot 1011 below.
  • the obliquely arranged first wind deflector 21 can also reduce the impact of the airflow on itself, so as to achieve the purpose of noise reduction.
  • FIG. 6 is a schematic structural diagram of another air guide insert 30 according to an embodiment of the present application. Since this figure is only a structural schematic diagram of the air guide insert 30 , other components of the cabinet are not shown. In order to facilitate the understanding of the orientation of the components in the air guide insert 30 in the cabinet, it is particularly noted that the overall orientation of FIG. 6 is the same as that of FIG. 4 , that is, the fan group 20 is located on the right side of the air guide insert 30 in FIG. Flow laterally to the right.
  • the wind guide insert 30 shown in FIG. 6 is substantially the same in structure as the wind guide insert 30 shown in FIG. 3 , and has all the beneficial effects of the wind guide insert 30 shown in FIG. 3 .
  • the air guide structure further includes a second air guide plate 22 .
  • the second air guide plate 22 is located on the side of the first air guide plate 21 away from the end plate 13 and between the upper cover plate 11 and the lower cover plate 12 . , one side of the second wind deflector 22 is connected with the upper cover 11 , and the opposite side is connected with the lower cover 12 .
  • the second air deflector 22 is a rectangular plate, and the second air deflector 22 , the upper cover 11 and the lower cover 12 are welded together, which can ensure that the second air deflector 22 is in the The connection firmness between the upper cover 11 and the lower cover 12 .
  • the side of the upper cover 11 , the lower cover 12 and the second wind deflector 22 away from the first wind deflector 21 encloses a second space B.
  • the side of the second space B facing the fan group 20 is an opening, and the opening is a gap between the upper cover plate 11 and the lower cover plate 12 .
  • the second air guide plate 22 can be used to enclose a second space B between the upper cover plate 11 and the lower cover plate 12, so as to provide a guide Streaming airflow provides the space basis.
  • a second air inlet 1c is provided in the second space B, and the second air inlet 1c is located in the second space B corresponding to the position of the lower cover 12, so that the second space B can be adjacent to the lower slot 1011. communicated, so as to define a path for the airflow to enter the second space B.
  • FIG. 7 is a gas flow diagram of the air guide insert 30. In order to more clearly show the air guide between adjacent slots 1011, only two slots 1011 are shown in FIG. 7, and the remaining slots 1011 are omitted. In the following, with reference to FIG. 7 , the flow guiding principle of the air guiding insert 30 will be introduced.
  • the fan group 20 works to form a flowing airflow on both sides of the slot space 101 .
  • the service carrier board 40 is located below the air guide insert 30 .
  • the air at room temperature flows directly from the left side of the slot 1011 and flows through the service carrier board 40 .
  • the line card 210 on the 40 performs heat exchange and converts it into a higher temperature air flow. Some of these air flows flow out from the right side of the slot 1011, and the other part flows upward, and flows through the second air inlet 1c in the upper slot 1011 to the corresponding air flow.
  • the second space B finally flows out from the opening on the side of the second space B toward the fan group 20 .
  • the airflow can not only flow out from the slot 1011 where the service carrier board 40 is inserted, but also flow out from the slot 1011 where the air guide insert 30 is inserted, which improves the air outlet uniformity of the slot space 101 .
  • it can also effectively avoid the occurrence of a no-wind area on the right side of the air guide insert 30 , that is, the side close to the fan group 20 , which affects the heat dissipation of other electronic devices in the cabinet.
  • the air at room temperature flows into the first space A from the first air inlet 1a, and flows out of the first space A from the first air outlet 1b to flow into the slot located below In the position 1011, the airflow in the lower slot 1011 intersects, thereby further increasing the airflow in the lower slot 1011, thereby improving the heat dissipation effect for the line card 210.
  • the second air inlet 1c is arranged close to the fan group 20 . In this way, it can be ensured that the air flows into the air guide insert 30 above through the second air inlet 1c after the line card 210 on the service carrier board 40 is sufficiently dissipated.
  • the second air guide plate 22 is inclined in a direction away from the second air inlet 1c from one side to the opposite side. This design enables the second air guide plate 22 to better guide the airflow entering the second space B, so that it can follow the inclined second air guide plate 22 from the second space B to the side of the fan group 20 out of the opening.
  • the obliquely arranged second wind deflector 22 can also reduce the impact of the airflow on itself, so as to achieve the purpose of noise reduction.
  • each empty slot 1011 there are usually a plurality of consecutively stacked empty slots 1011 , and the air guide inserts 30 are inserted into each empty slot 1011 .
  • the air guide inserts 30 in each empty slot 1011 can not only guide the air flow to the lower service carrier board 40 as described above, but also can guide the air flow in the lower service carrier board 40 back, and can also To continuously guide the air flow to the lower air guide insert 30, another air guide insert 30 is provided in the embodiment of the present application.
  • FIG. 8 is a schematic structural diagram of another air guide insert 30 according to an embodiment of the present application. Since this figure is only a structural schematic view of the air guide insert 30 , other components of the cabinet are not shown. In order to facilitate the understanding of the orientation of the components in the air guide insert 30 in the cabinet, it is particularly noted that the overall orientation of FIG. 8 is the same as that of FIG. 4 , that is, the fan group 20 is located on the right side of the air guide insert 30 in FIG. Flow laterally to the right.
  • the wind guide insert 30 shown in FIG. 8 is substantially the same in structure as the wind guide insert 30 shown in FIG. 6 , and has all the beneficial effects of the wind guide insert 30 shown in FIG. 6 .
  • the difference is that a third space C is formed between the upper cover plate 11 , the lower cover plate 12 , the first air guide plate 21 and the second air guide plate 22 , and the positions of the third space C corresponding to the upper cover plate 11 respectively have a third space C.
  • the air inlet 1d and the second air outlet 1e, the third air inlet 1d and the second air outlet 1e are spaced apart from each other, the third air inlet 1d is opposite to the first air outlet 1b in the adjacent slot 1011 above, and the second air outlet 1e is opposite to the second air inlet 1c in the upper adjacent slot 1011 .
  • a third space C is enclosed between the upper cover plate 11 and the lower cover plate 12 to provide a space basis for guiding airflow.
  • a third air inlet 1d and a second air outlet 1e are arranged in the third space C, and the third air inlet 1d and the second air outlet 1e are located in the third space C corresponding to the position of the upper cover 11, and the third air inlet 1d and the second air outlet 1e
  • the air outlet 1d is opposite to the first air outlet 1b in the adjacent slot 1011 above, and the second air outlet 1e is opposite to the second air inlet 1c in the adjacent slot 1011 above, so that the third space C can
  • the first space A and the second space B in the upper adjacent slot 1011 are connected to define the path for the airflow entering the third space C and the path for outputting the third space C.
  • the third air inlet 1d is partially opposite to the first air outlet 1b in the upper adjacent slot 1011
  • the second air outlet 1e is opposite to the second air inlet 1b in the upper adjacent slot 1011
  • the tuyere 1c is opposite. That is, relative to the position directly below the first air outlet 1b, the third air inlet 1d is biased towards the second air inlet 1c, and relative to the position directly below the second air inlet 1c, the second air outlet 1e is biased towards the first air outlet 1b .
  • FIG. 9 is a gas flow diagram of the air guide insert 30. In order to show the air guide between adjacent slots 1011 more clearly, only three slots 1011 are shown in FIG. 9, and the remaining slots 1011 are omitted.
  • the flow guiding principle of the air guiding insert 30 will be introduced below with reference to FIG. 9 .
  • the fan group 20 works to form a flowing airflow on both sides of the slot space 101 .
  • the first air guide insert 30 , the second air guide insert 30 , and the service carrier board 40 are stacked in sequence from top to bottom, that is, two air guide inserts 30 are continuously stacked together.
  • the air at room temperature flows into the first space A from the first air inlet 1a, flows out of the first space A from the first air outlet 1b, and then flows out of the second space A from the first air inlet 1a.
  • the third air inlet 1d of each air guide insert 30 enters the corresponding third space C, and the air flow in the third space C flows out of the third space C from the second air outlet 1e, and then flows from the third space C of the first air guide insert 30.
  • the two air inlets 1c enter the corresponding second space B, and finally flow out from the second space B toward the opening on the side of the fan group 20 .
  • the airflow entering the air guide inserts 30 in the upper slot 1011 can use the air flow of the air guide inserts 30 in the lower slot 1011.
  • the third space C circulates, and finally returns to the air guide insert 30 in the upper slot 1011 , and flows out of the slot space 101 , further improving the air outlet uniformity of the slot space 101 .
  • it can also effectively avoid the occurrence of a no-wind area on the right side of the air guide insert 30 , that is, the side close to the fan group 20 , which affects the heat dissipation of other electronic devices in the cabinet.
  • the air at room temperature flows into the first space A from the first air inlet 1a, and flows out of the first space A from the first air outlet 1b to flow into the lower
  • the slot 1011 intersects with the airflow in the lower slot 1011 , thereby further increasing the airflow in the lower slot 1011 , thereby improving the heat dissipation effect for the line card 210 .
  • the air at room temperature flows directly from the left side of the slot 1011 and flows through the service carrier board 40 .
  • the line card 210 on the 40 performs heat exchange and converts it into a higher temperature air flow. Some of these air flows flow out from the right side of the slot 1011, and the other part flows upward, and flows through the second air inlet 1c of the second air guide insert 30. to the corresponding second space B, and finally flows out from the opening of the second space B toward the side of the fan group 20 .
  • the airflow can not only flow out from the slot 1011 where the service carrier board 40 is inserted, but also flow out from the slot 1011 where the air guide insert 30 is inserted, which improves the air outlet uniformity of the slot space 101 .
  • it can also effectively avoid the occurrence of a no-wind area on the right side of the air guide insert 30 , that is, the side close to the fan group 20 , which affects the heat dissipation of other electronic devices in the cabinet.
  • the third air inlet 1d and the second air outlet 1e can be communicated together to form a larger air outlet.
  • the air outlet is also opposite to the first air outlet 1b and the second air inlet 1c in the upper adjacent slot 1011 .
  • the air guide inserts 30 in the upper adjacent slots 1011 are used as isolation means, that is, the upper adjacent slots 1011 are used.
  • the interval between the first air outlet 1b and the second air inlet 1c can reduce the cost of materials and is conducive to cost control.
  • the first air inlet 1a, the second air inlet 1c, the third air inlet 1d, the first air outlet 1b and the second air outlet 1e have protective nets 14 therein.
  • This design can prevent foreign objects from directly entering the air guide insert 30 , which not only prevents foreign objects from blocking the air guide insert 30 , but also prevents foreign objects from entering the service carrier board 40 along with the airflow and affecting the line cards 210 in the service carrier board 40 .
  • the protection net 14 is only provided in the first air inlet 1a.
  • indicators such as the aperture and mesh number in the protective net 14 are adjusted according to actual needs. If the heat dissipation performance needs to be prioritized, the aperture of the protective net 14 is appropriately designed to be larger, and the mesh size is appropriately designed to be smaller. If the dustproof performance is required to be prioritized, the aperture of the protective net 14 is appropriately designed to be smaller, and the mesh size is appropriately designed to be larger. This application does not limit this.
  • the cabinet includes a plurality of replaceable air guide inserts 30, and each air guide insert 30 has a first air inlet 1a, a second air inlet 1c, a third air inlet 1d, and a first air outlet 1b.
  • the second air outlet 1e has various sizes.
  • the air guide insert 30 with the larger size of the first air inlet 1a is correspondingly selected. If it is necessary to increase the air output of the air guide insert 30, the air guide insert 30 with a larger size of the second air inlet 1c is selected accordingly.
  • each fan 201 is installed in the cabinet 10 in order from bottom to top, so that each fan 201 is located on one side of the slot space 101, that is, on the right side of FIG. 4 .
  • the service carrier 40 is selected.
  • the number of service carrier boards 40 is selected according to the number of line cards 210 . ) size, according to the cooling requirements.
  • each service carrier board 40 is inserted into the empty slot 1011 .
  • each service carrier board 40 is evenly arranged in the slot space 101, so as to avoid each service carrier board 40 being too concentrated.
  • FIG. 10 is an electronic device provided by an embodiment of the present application.
  • the electronic device includes a cabinet 100 and an electronic device 200 .
  • the cabinet 100 is the cabinet 100 provided above.
  • the electronic device 200 includes a line card 210 and a switch fabric board 220.
  • the line card 210 is located in the slot 1011 and is connected to the service carrier board 40.
  • the switch fabric board 220 is located in the cabinet 100 and clamped It is arranged between the slot space 101 and the fan group 20 .
  • the line card 210 in the service carrier board 40 By installing the line card 210 in the service carrier board 40 to be inserted into the slot 1011 together with the service carrier board 40 , it can receive good heat dissipation from the cabinet 100 .
  • the switch fabric board 220 in the cabinet 100 and located between the slot space 101 and the fan group 20 By directly installing the switch fabric board 220 in the cabinet 100 and located between the slot space 101 and the fan group 20 , the air flowing out of the slot space 101 can also flow through the switch fabric board 220 . After the mesh plate 220 dissipates heat, it is led out by the fan group 20 for heat exchange with the outside world.
  • the electronic device 200 is carried by the cabinet 100 , so as to provide an installation basis and heat dissipation conditions for the electronic device 200 . Since the line card 210 in the electronic device is installed on the service carrier board 40, and the service carrier board 40 is located in the slot 1011, the airflow circulating in the slot 1011 can well dissipate heat to the line card 210, so that the line card 210 Being at a suitable working temperature ensures the normal operation of the line card 210 .
  • the switch fabric board 220 in the electronic device is installed in the cabinet 100 and is located between the slot space 101 and the fan group 20 , the airflow flowing out of the slot space 101 can further dissipate heat to the switch fabric board 220 well. , so that the switching fabric board 220 is at a suitable working temperature, which ensures the normal operation of the switching fabric board 220 . It can be seen that the electronic device provided by the embodiments of the present application can ensure good heat dissipation of the electronic device, thereby ensuring its normal and stable operation.
  • the cabinet 100 has corresponding beneficial effects, and the electronic equipment also has corresponding beneficial effects. , which will not be repeated here.
  • the electronic device is a data center switch with an orthogonal architecture, wherein each line card 210 is arranged horizontally, and each switch fabric board 220 is vertical and horizontal, that is, between the line card 210 and the switch fabric board 220 They are perpendicular to each other, and the line card 210 and the switch fabric board 220 are connected through orthogonal connectors, so as to realize high-speed data transmission.
  • the transmission distance between the line card 210 and the switching network board 220 is shorter, and there are fewer fault points, which not only improves the performance of the electronic device, but also improves the reliability of the electronic device.
  • each fan 201 is installed in the cabinet 10 in order from bottom to top, so that each fan 201 is located on one side of the slot space 101 , that is, on the right side in FIG. 10 .
  • each fan 201 is located on one side of each fan 201 , that is, on the left side in FIG. 10 .
  • the service carrier 40 is selected.
  • the number of service carrier boards 40 is selected according to the number of line cards 210 . ) size, according to the cooling requirements.
  • each service carrier board 40 is evenly arranged in the slot space 101, so as to avoid each service carrier board 40 being too concentrated.
  • FIG. 11 is a flowchart of a method for manufacturing an air guide insert provided in an embodiment of the application.
  • the manufacturing method is used to manufacture any of the air guide inserts shown in FIGS. 3 to 9 .
  • the manufacturing method includes:
  • Step 1101 Provide a casing 1, and process a first air inlet 1a and a first air outlet 1b on the casing 1, so that there is an included angle between the planes where the first air inlet 1a and the first air outlet 1b are located.
  • Step 1102 Connect the air guide structure 2 to the housing 1 , and the air guide structure 2 is used to guide the airflow flowing into the first air inlet 1 a to the first air outlet 1 b.
  • the air guide insert manufactured by the manufacturing method provided in the embodiment of the present application, since there is an included angle between the planes where the first air inlet 1a and the first air outlet 1b are located, the first air inlet 1a and the first air outlet 1b have an angle between them.
  • the flow direction of an air outlet 1b is different, that is, the directions of the air flow when passing through the first air inlet 1a and the first air outlet 1b are different from each other, so that the direction change and guidance of the air flow can be realized.
  • the air guide structure 2 can guide the airflow flowing into the first air inlet 1a to the first air outlet 1b, the air guide inserts can realize the direction change and guide of the airflow.
  • the fan group 20 works to form the airflow flowing through the slot space 101 .
  • a part of the airflow flows through the slot 1011 in which the service carrier board 40 is inserted, and directly dissipates heat for the line card 210 installed on the service carrier board 40 .
  • the other part of the airflow flows through the slot 1011 where the air guide insert 30 is inserted. Since the air guide insert 30 can guide the airflow in the slot 1011 to the adjacent slot 1011, this part of the airflow, Finally, it will be introduced into the slot 1011 into which the service carrier board 40 is inserted, and it can also dissipate heat from the line card 210 installed on the service carrier board 40 .
  • the air can enter, that is, the slot space 101 can receive all the airflow generated by the fan group 20. , to ensure the total air intake.
  • the airflow received by the slot space 101 can be fully used to dissipate heat for the line cards 210 on the service carrier board 40, so the problem of airflow overflow is also solved, and the heat dissipation effect is ensured.
  • the air guide insert 30 no longer blocks the airflow, the noise generated when the airflow hits is also reduced.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
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Abstract

本申请公开了一种导风插件、机柜、电子设备及导风插件的制造方法。该导风插件包括壳体和导流结构；壳体上具有第一进风口和第一出风口，第一进风口和第一出风口所处的平面之间具有夹角；导流结构位于壳体内，导流结构被配置为，将流入第一进风口的气流导流至第一出风口。本申请能够提高对于电子器件的散热能力。

Description

导风插件、机柜、电子设备及导风插件的制造方法
本申请要求于2020年09月30日提交的申请号为202011063409.X、发明名称为“风阻板结构”的中国专利申请，以及于2020年12月16日提交的申请号为202011492085.1、发明名称为“导风插件、机柜、电子设备及导风插件的制造方法”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本申请涉及通信设备领域，尤其涉及导风插件、机柜、电子设备及导风插件的制造方法。
背景技术
在数据中心内，具有大量的交换机，交换机主要包括主控卡、线卡、交换网板。主控卡相当于交换机的大脑，起到控制的作用，线卡主要提供各种不同速率的端口，而交换网板则提供线卡间高速互联的能力。
在相关技术中，通常利用机柜对交换机进行承载。机柜主要包括柜体、风扇组和多个业务载板，业务载板用于承载线卡，柜体内具有多个能够容置业务载板的槽位，槽位由上至下依次叠设且连通，风扇组位于各槽位的一侧，从而引导空气流经槽位，以对插接在槽位内的线卡进行散热。在实际应用中，通常会有槽位空缺(未插接业务载板)，这些空槽位会为气流提供旁路，使得气流从这些空槽位中溢流，导致插接有业务载板的槽位内的风量变小，线卡不能得到足够的散热。为了解决这一问题，通常会在空槽位内插接风阻板，以阻挡气流进入，从而减少了气流旁路。
然而，由于部分气流被风阻板阻挡在外，所以导致仅有部分槽位能够进风，降低了总进风量，对机柜的散热效果造成了影响。
发明内容
本申请实施例提供了一种导风插件、机柜、电子设备及导风插件的制造方法，以克服相关技术中存在的电子器件的散热效果不佳的问题。
第一方面，提供了一种导风插件，该导风插件应用于机柜中，其包括壳体和导流结构。壳体上具有第一进风口和第一出风口，第一进风口和第一出风口所处的平面之间具有夹角，即第一进风口和第一出风口的过流方向不同。过流方向指的是气流经过该位置时的流向，也就是说，气流在经过第一进风口和第一出风口时的方向互不相同。导流结构位于壳体内，导流结构被配置为，将流入第一进风口的气流导流至第一出风口。由于第一进风口和第一出风口的过流方向不同，所以能够实现气流的变向和导向。如此一来，在将导风插件应用于机柜中之后，通过导风插件能够对机柜中的气流进行导向，使得导风插件不仅不会阻挡气流，还会将气流导流到机柜中其他所需的位置(设置有电子器件的位置)，不仅保证了机柜的总进风量，还能够提高对于电子器件的散热效果。
本申请实施例提供的导风插件，至少具有以下效果：
在将导风插件应用于机柜中后，一部分气流流经设置有电子器件的位置，以直接对电子器件进行散热。另外一部分气流则流经导风插件，在由第一进风口进入后，在导风结构的作用下，被导向至第一出风口。从第一出风口输出气流被导流到机柜中设置有电子器件的位置，所以同样也能够对电子器件进行散热。由此可见，对于机柜来说，无论是流经导风插件的气流，还是未流经导风插件的气流，都能够对电子器件进行散热，所以既解决了气流溢流的问题，也保证了总进风量。除此之外，由于导风插件不再阻挡气流，所以也减少了气流撞击时产生的噪音。
作为一种示例性实施例，壳体包括上盖板、下盖板和端板。上盖板和下盖板之间相对间隔，为气流的流通提供空间基础。端板位于上盖板和下盖板之间，且端板的一侧边与上盖板的一侧边相连，端板的相对另一侧边与下盖板的一侧边相连，从而通过端板实现了上盖板和下盖板之间的连接。导流结构包括第一导风板，第一导风板同样位于上盖板和下盖板之间，且第一导风板的一侧边与上盖板相连，相对的另一侧边与下盖板相连，使得第一导风板能够稳固的连接在上盖板和下盖板之间。也就是说，上盖板、下盖板、端板和第一导风板连接在一起，成为一个整体。并且，上盖板、下盖板、端板和第一导风板围成第一空间，第一进风口位于第一空间内对应端板的位置，第一出风口位于第一空间内对应下盖板的位置。也就是说，第一空间能够将第一进风口和第二出风口连通。如此设计，当导风插件下方相邻的位置设置有电子器件时，气流从外界进入第一空间，并由第一空间导流至电子器件，从而能够对电子器件进行散热，使得气流能够得到充分的利用，保证了散热效果。
作为一种示例性实施例，第一导风板倾斜布置，且由自身的一侧边至相对的另一侧边沿背离第一出风口的方向倾斜。如此设计，使得第一导风板能够更好的对进入第一空间的气流进行引导，使其能够顺着倾斜的第一导风板，朝向第一出风口流动，从而顺畅流出第一空间。
作为一种示例性实施例，导流结构还包括第二导风板，第二导风板同样位于上盖板和下盖板之间，且位于第一导风板的背离端板的一侧，即与第一导风板间隔布置。第二导风板的一侧边与上盖板相连，相对的另一侧边与下盖板相连，使得第二导风板稳固的连接在上盖板和下盖板之间。并且，上盖板、下盖板和第二导风板背离第一导风板的一侧围成第二空间，即第二空间位于第二导风板的背离第一导风板的一侧。第二空间内具有第二进风口，第二进风口位于第二空间的对应下盖板的位置。如此设计，当导风插件下方相邻的位置设置有电子器件时，气流在对电子器件进行了散热，并流经到靠近第二进风口的位置后，一部分按照原方向继续流动，另一部分则向上流动，并通过上方的第二进风口回到对应的第二空间，最终从第二空间流出。也就是说，增加了气流在对电子器件进行散热后的流动路线，提高了出风均匀性。
作为一种示例性实施例，第二导风板倾斜布置，且由自身的一侧边至相对的另一侧边沿背离第二进风口的方向倾斜。如此设计，使得第二导风板能够更好的对进入第二空间的气流进行引导，使其能够顺着倾斜的第二导风板，背离第二导风板流动，从而顺畅的流出第二空间，以带走热量。
作为一种示例性实施例，上盖板、下盖板、第一导风板和第二导风板之间构成第三空间，第三空间位于第一空间和第二空间之间。第三空间具有第三进风口和第二出风口，且分别位于第三空间的对应上盖板的位置。如此设计，当导风插件下方相邻的位置中设置的也是导风插件时，上方导风插件的第一空间中的气流将依次通过对应的第一出风口、下方导风插件的 第三进风口进入对应第三空间中，进一步地气流将依次通过下方导风插件的第二出风口、上方导风插件的第二进风口进入对应的第二空间中，最终流出第二空间。也就是说，当两个导风插件相邻时，进入上方导风插件的气流，能够借助下方导风插件的第三空间进行流通，并最终回到上方导风插件中，并流出，进一步地提高了出风均匀性。
作为一种示例性实施例，机柜包括多种可替换的导风插件，各导风插件的结构大体相同，区别在于各导风插件的第一进风口、第二进风口、第三进风口、第一出风口、第二出风口具有多种尺寸。如此设计，用户能够根据实际需求，选择合适尺寸的导风插件，以控制气流的流量和流速，提高了机柜的适用性。
第二方面，提供了一种机柜，包括以下几个部分，分别是柜体、风扇组、导风插件和业务载板。柜体用于为风扇组、导风插件和业务载板提供安装基础，使得机柜成为一个能够承载例如线卡等各种电子器件的整体。柜体内配置有槽位空间，且槽位空间被进一步地分隔为多个依次叠设且连通的槽位。每个槽位被用于容置一个导风插件，或者一个业务载板，即未插接业务载板的槽位内，均插接有导风插件。导风插件和业务载板分别可拆卸地插接在槽位内，从而便于更换槽位内的导风插件和业务载板。其中，业务载板用于承载线卡，以为线卡提供安装基础。风扇组设置在柜体内，且与槽位空间并排布置，使得风扇组形成的气流能够流经槽位空间。一部分气流流经插接有业务载板的槽位，从而对安装在业务载板上的线卡进行散热。而另外一部分气流则流经插接有导风插件的槽位，由于导风插件能够将所处槽位中的气流导流至相邻的槽位内，所以这部分的气流，最终将被导入插接有业务载板的槽位内，进一步地对线卡进行散热。
本申请实施例提供的机柜，至少具有以下效果：
在通过本申请实施例提供的机柜容置例如线卡等电子器件时，风扇组工作，以形成流经槽位空间的气流。一部分气流流经插接有业务载板的槽位，直接对安装在业务载板上的线卡进行散热。另外一部分气流则流经插接有导风插件的槽位，由于导风插件能够将所处槽位中的气流导流至相邻的槽位内，所以这部分的气流，最终将被导入插接有业务载板的槽位内，同样也能够对安装在业务载板上的线卡进行散热。由此可见，无论是插接业务载板的槽位，还是插接导风插件的槽位，都能够进风，即槽位空间能够接收由风扇组所产生的所有气流，保证了总进风量。并且，被槽位空间接收的气流，能够被全部用来对业务载板上的线卡进行散热，所以也解决了气流溢流的问题，保证了散热效果。除此之外，由于导风插件不再阻挡气流，所以也减少了气流撞击时产生的噪音。
作为一种示例性实施例，风扇组包括多个风扇，各风扇沿槽位的叠设方向依次并排布置。如此设计，使得风扇组能够均匀的对各槽位产生气流，避免了气流不均的问题，以保证各槽位中能够具有充足的气流。
第三方面，还提供了一种电子设备，包括机柜和电子器件。机柜为第一方面的机柜，具有第一方面机柜的所有有益效果。电子设备包括线卡和交换网板，线卡安装在业务载板内，以与业务载板一同插接在槽位内，能够受到机柜的良好散热。交换网板则直接安装在机柜内，且位于槽位空间和风扇组之间，从而使得从槽位空间中流出的气流，还能够流经交换网板，在对交换网板进行散热后，再由风扇组导出，以与外界进行热交换。
本申请实施例提供的电子设备，至少具有以下效果：
通过机柜来承载电子器件，以为电子器件提供安装基础和散热条件。由于电子设备中的线卡安装在业务载板上，而业务载板又位于槽位内，所以槽位内流通的气流能够对线卡进行良好的散热，使得线卡处于合适的工作温度，保证了线卡的正常工作。由于电子设备中的交换网板安装在机柜内，且位于槽位空间和风扇组之间，所以从槽位空间中流出的气流能够进一步地对交换网板进行良好的散热，使得交换网板处于合适的工作温度，保证了交换网板的正常工作。也就是说，本申请实施例提供的电子设备，能够保证其中电子设备的良好散热，进而保证其正常稳定的工作。
第四方面，还提供了一种机柜的制造方法，包括以下几个步骤，首先，提供柜体，柜体内具有槽位空间，将槽位空间分隔为多个依次叠设且连通的槽位，从而为后续步骤中安装风扇组、导风插件和业务载板提供安装基础。然后，将风扇组连接至柜体内，使得风扇组与槽位空间并排布置，从而能够通过风扇组形成流经槽位空间的气流。接着，将导风插件可拆卸地插接在槽位内，从而能够通过导风插件将所处的槽位中的气流导流至相邻的槽位内。最后，将业务载板可拆卸地插接在槽位内，从而能够通过业务载板承载线卡。
本申请实施例提供的机柜的制造方法，至少具有以下效果：
在通过本申请实施例提供的制造方法制造出的机柜，容置例如线卡等电子器件时，风扇组工作，以形成流经槽位空间的气流。一部分气流流经插接有业务载板的槽位，直接对安装在业务载板上的线卡进行散热。另外一部分气流则流经插接有导风插件的槽位，由于导风插件能够将所处槽位中的气流导流至相邻的槽位内，所以这部分的气流，最终将被导入插接有业务载板的槽位内，同样也能够对安装在业务载板上的线卡进行散热。由此可见，无论是插接业务载板的槽位，还是插接导风插件的槽位，都能够进风，即槽位空间能够接收由风扇组所产生的所有气流，保证了总进风量。并且，被槽位空间接收的气流，能够被全部用来对业务载板上的线卡进行散热，所以也解决了气流溢流的问题，保证了散热效果。除此之外，由于导风插件不再阻挡气流，所以也减少了气流撞击时产生的噪音。
附图说明
图1为相关技术中机柜的结构示意图；
图2为相关技术中插接有风阻板的机柜的结构示意图；
图3为本申请实施例提供的一种导风插件的结构示意图；
图4为本申请实施例提供的机柜的结构示意图；
图5为本申请实施例提供的导风插件的气体流向图；
图6为本申请实施例提供的另一种导风插件的结构示意图；
图7为本申请实施例提供的导风插件的气体流向图；
图8为本申请实施例提供的又一种导风插件的结构示意图；
图9为本申请实施例提供的导风插件的气体流向图；
图10为本申请实施例提供的一种电子设备的结构示意图；
图11为本申请实施例提供的一种导风插件的制造方法的流程图。
图例说明：
1、壳体；1a、第一进风口；1b、第一出风口；1c、第二进风口；1d、第三进风口；1e、第二出风口；11、上盖板；12、下盖板；13、端板；14、防护网；
2、导流结构；21、第一导风板；22、第二导风板；
A、第一空间；B、第二空间；C、第三空间；
10、柜体；101、槽位空间；1011、槽位；
20、风扇组；201、风扇；
30、导风插件；
40、业务载板；
100、机柜；
200、电子器件；210、线卡；220、交换网板。
具体实施方式
本申请的实施方式部分使用的术语仅用于对本申请的实施例进行解释，而非旨在限定本申请。
数据中心交换机是数据中心的重要组成部分，其主要包括主控卡、线卡和交换网板。主控卡相当于交换机的大脑，起到控制的作用，线卡主要提供各种不同速率的端口，而交换网板则为各线卡之间提供高速互联的能力。
在相关技术中，通常利用机柜对交换机进行承载。机柜主要包括柜体、风扇组和多个业务载板，业务载板用于承载线卡，柜体内具有多个能够容置业务载板的槽位，槽位由上至下依次叠设且连通，风扇组位于各槽位的一侧，从而引导空气流经槽位，以对插接在槽位内的线卡进行散热。参见图1，在实际应用中，通常会有槽位空缺(未插接业务载板)，这些空槽位会为气流提供旁路，使得气流从这些空槽位中溢流，导致插接有业务载板的槽位内的风量变小，线卡不能得到足够的散热。为了解决这一问题，通常会在空槽位内插接风阻板，以阻挡气流进入，从而减少了气流旁路(参见图2)。
然而，由于部分气流被风阻板阻挡在外，所以导致仅有部分槽位能够进风，降低了总进风量，对机柜的散热效果造成了影响。
为了解决这一技术问题，本申请实施例提供了一种导风插件，图3为该导风插件的结构示意图。导风插件包括壳体1和导流结构2。壳体1上具有第一进风口1a和第一出风口1b，第一进风口1a和第一出风口1b所处的平面之间具有夹角。导流结构2位于壳体1内，导流结构2被配置为，将流入第一进风口1a的气流导流至第一出风口1b。
由于第一进风口1a和第一出风口1b所处的平面之间具有夹角，所以第一进风口1a和第一出风口1b的过流方向不同，即气流在经过第一进风口1a和第一出风口1b时的方向互不相同，从而能够实现气流的变向和导向。并且，由于导流结构2能够将流入第一进风口1a的气流导流至第一出风口1b，所以通过导风插件能够实现气流的变向和导流。
该导风插件应用于机柜中，图4为本申请实施例提供的一种机柜的结构示意图，该机柜中配置有图3所示的导风插件。为了便于理解导风插件30中各部件在机柜中的方位，特别说明图4的整体方位与图3相同，即风扇组20位于图3中导风插件30的右侧，气流由图3的左侧向右侧流动。
参见图4，在本实施例中，该机柜包括柜体10、风扇组20、导风插件30和业务载板40。
柜体10内具有槽位空间101，槽位空间101由多个依次叠设且连通的槽位1011构成，各槽位1011用于容置导风插件30或者业务载板40。也就是说，柜体10作为机柜的主体，能够为导风插件30和业务载板40提供安装基础。并且，将柜体10中的槽位空间101分成多个相互连通的槽位1011，各槽位1011中插接一个导风插件30，或者是一个业务载板40，既能够为气流在各槽位1011之间的流通提供空间基础，又能够为导风插件30和业务载板40提供较为独立的区域，避免了在装配过程中，导风插件30和业务载板40之间造成相互干涉。
风扇组20位于柜体10内，且与槽位空间101并排布置，用于形成流经槽位空间101的气流。为了形成稳定的风道，气流的方向是由槽位空间101朝向风扇组20，即图4中由左至右流动，使得气流在流经槽位空间101时，能够将槽位空间101内的热量从右侧带走，以实现风冷散热。
导风插件30可拆卸地插接在槽位1011内，以将所处的槽位1011中的气流导流至相邻的槽位1011内。业务载板40可拆卸地插接在槽位1011内，以承载线卡210。导风插件30和业务载板40分别可拆卸地插接在槽位1011内，使得用户能够根据实际需求，来决定槽位1011中是插接导风插件30还是业务载板40。举例来说，若需承载的线卡210数量较多，则将对应数量的较多槽位1011中插接业务载板40，而剩余的空槽位1011中插接导风插件30，以将空槽位1011中的气流导流到其他槽位1011内。若需承载的线卡210数量较少，则将对应数量的较少槽位1011中插接业务载板40，而剩余的空槽位1011中插接导风插件30，以将空槽位1011中的气流导流到其他槽位1011内。
在通过本申请实施例提供的机柜容置例如线卡210等电子器件时，风扇组20工作，以形成流经槽位空间101的气流。一部分气流流经插接有业务载板40的槽位1011，直接对安装在业务载板40上的线卡210进行散热。另外一部分气流则流经插接有导风插件30的槽位1011，由于导风插件30能够将所处槽位1011中的气流导流至相邻的槽位1011内，所以这部分的气流，最终将被导入插接有业务载板40的槽位1011内，同样也能够对安装在业务载板40上的线卡210进行散热。由此可见，无论是插接业务载板40的槽位1011，还是插接导风插件30的槽位1011，都能够进风，即槽位空间101能够接收由风扇组20所产生的所有气流，保证了总进风量。并且，被槽位空间101接收的气流，能够被全部用来对业务载板40上的线卡210进行散热，所以也解决了气流溢流的问题，保证了散热效果。除此之外，由于导风插件30不再阻挡气流，所以也减少了气流撞击时产生的噪音。
在一种示例性实施例中，风扇组20包括多个风扇201，各风扇201沿槽位1011的叠设方向依次并排布置。如此设计，使得风扇组20能够均匀的对各槽位1011产生气流，避免了气流不均的问题，以保证各槽位1011中能够具有充足的气流。
需要说明的是，虽然图4中展示的是一个风扇201对应两个槽位1011，但是在实际情况下，风扇201和槽位1011之间的数量对应，能够根据需求进行调整。例如，一个风扇201对应一个槽位1011，或者一个风扇201对应三个槽位1011等。本申请对此不作限制。
由前文可知，导风插件30是将槽位1011中的气流充分利用，以提高散热效果的关键部件，下面对导风插件30做进一步地介绍。
再次参见图3，在本实施例中，壳体包括上盖板11、下盖板12和端板13。上盖板11和下盖板12之间相对间隔，端板13位于上盖板11和下盖板12之间，且端板13的一侧边与上 盖板11的远离风扇组20的一侧边相连，端板13的相对另一侧边与下盖板12的远离风扇组20的一侧边相连。导流结构包括第一导风板，第一导风板21位于上盖板11和下盖板12之间，且第一导风板21的一侧边与上盖板11相连，相对的另一侧边与下盖板12相连。
在一种示例性实施例中，上盖板11为矩形板件，由槽体空间的方向朝向风扇组20的方向延伸。下盖板12平行于上盖板11，下盖板12的形状和尺寸与上盖板11相同，且下盖板12在上盖板11上的正投影，与上盖板11完全重合。端板13为矩形板件，端板13分别垂直于上盖板11和下盖板12。端板13、上盖板11和下盖板12之间焊接在一起，能够保证端板13在上盖板11和下盖板12之间的连接牢固度。第一导风板21为矩形板，第一导风板21、上盖板11和下盖板12之间焊接在一起，能够保证第一导风板21在上盖板11和下盖板12之间的连接牢固度。
上盖板11、下盖板12、端板13和第一导风板21围成第一空间A，第一进风口1a位于第一空间A内对应端板13的位置，第一进风口1a与外界连通，第一出风口1b位于第一空间A内对应下盖板12的位置，第一出风口1b与下方相邻的槽位1011相对。
通过在上盖板11和下盖板12之间设置端板13，且端板13的两侧边分别与上盖板11和下盖板12相连，能够利用端板13将上盖板11和下盖板12连接为一个整体。而在上盖板11和下盖板12之间设置第一导风板21，能够利用第一导风板21在上盖板11、下盖板12和端板13之间围成第一空间A，以为导流气流提供空间基础。进一步地，在第一空间A内设置第一出风口1b和第一进风口1a，第一进风口1a位于第一空间A内对应端板13的位置，从而能够使得第一空间A与外界连通，第一出风口1b位于第一空间A内对应下盖板12的位置，从而能够使得第一空间A与下方相邻的槽位1011相对且连通，以此限定气流进入第一空间A的路径，以及输出第一空间A的路径。
图5为导风插件30的气体流向图，为了更清楚的展示相邻槽位1011之间的导风情况，图5中仅展示了两个槽位1011，省略了其余的槽位1011。下面结合图5，对导风插件30的导流原理进行介绍。
风扇组20工作，以在槽位空间101的两侧形成流动的气流。业务载板40位于导风插件30的下方。
针对插接有业务载板40的槽位1011来说，常温的气流直接从槽位1011的左侧流入并流经业务载板40，在流经业务载板40的过程中，与业务载板40上的线卡210进行热交换，转变为较高温的气流并从槽位1011的右侧流出，从而完成整个散热过程。
而针对插接有导风插件30的槽位1011来说，常温的气流从第一进风口1a流入第一空间A，并从第一出风口1b流出第一空间A以流入位于下方的槽位1011中，与下方槽位1011中的气流交汇，从而进一步地增大了下方槽位1011中的气流流量，进而提高了对于其中线卡210的散热效果。
并且，为了保证从第一出风口1b流入的气流能够顺畅的与该槽位1011左侧流入的气流交汇，第一出风口1b靠近端板13布置。
进一步地，第一导风板21由一侧边至相对的另一侧边沿背离第一出风口1b的方向倾斜。如此设计，使得第一导风板21能够更好的对进入第一空间A的气流进行引导，使其能够顺着倾斜的第一导风板21，朝向第一出风口1b流动，从而顺畅的进入下方槽位1011。
除此之外，倾斜布置的第一导风板21，还能够减小自身受到气流的冲击，从而能够达到 降噪的目的。
图6为本申请实施例提供的另一种导风插件30的结构示意图，由于该图仅为导风插件30的结构示意图，所以其中未展示机柜的其余部件。为了便于理解导风插件30中各部件在机柜中的方位，特别说明图6的整体方位与图4相同，即风扇组20位于图6中导风插件30的右侧，气流由图6的左侧向右侧流动。
图6中所示的导风插件30与图3中所示的导风插件30，在结构上大体相同，且具有图3中所示的导风插件30的所有有益效果。区别在于，导流结构还包括第二导风板22，第二导风板22位于第一导风板21的背离端板13的一侧，且位于上盖板11和下盖板12之间，第二导风板22的一侧边与上盖板11相连，相对的另一侧边与下盖板12相连。
在一种示例性实施例中，第二导风板22为矩形板，第二导风板22、上盖板11和下盖板12之间焊接在一起，能够保证第二导风板22在上盖板11和下盖板12之间的连接牢固度。
上盖板11、下盖板12和第二导风板22背离第一导风板21的一侧围成第二空间B。第二空间B朝向风扇组20的一侧为开口，该开口为上盖板11和下盖板12之间的间隙。第二空间B内对应下盖板12的位置具有第二进风口1c，第二进风口1c与下方相邻的槽位1011相对。
通过在上盖板11和下盖板12之间设置第二导风板22，能够利用第二导风板22在上盖板11和下盖板12之间围成第二空间B，以为导流气流提供空间基础。进一步地，在第二空间B内设置第二进风口1c，第二进风口1c位于第二空间B内对应下盖板12的位置，从而能够使得第二空间B与下方相邻的槽位1011连通，以此限定气流进入第二空间B的路径。
图7为导风插件30的气体流向图，为了更清楚的展示相邻槽位1011之间的导风情况，图7中仅展示了两个槽位1011，省略了其余的槽位1011。下面结合图7，对导风插件30的导流原理进行介绍。
风扇组20工作，以在槽位空间101的两侧形成流动的气流。业务载板40位于导风插件30的下方。
针对插接有业务载板40的槽位1011来说，常温的气流直接从槽位1011的左侧流入并流经业务载板40，在流经业务载板40的过程中，与业务载板40上的线卡210进行热交换，转变为较高温的气流，这些气流一部分槽位1011的右侧流出，另一部分则向上流动，并通过上方槽位1011内的第二进风口1c流到对应的第二空间B，最终从第二空间B朝向风扇组20一侧的开口流出。也就是说，气流不仅能够从插接有业务载板40的槽位1011流出，还能够从插接有导风插件30的槽位1011流出，提高了槽位空间101的出风均匀性。除此之外，还能够有效的避免因导风插件30的右侧，即靠近风扇组20的一侧出现无风区，而影响机柜内的其余电子器件的散热。
而对于针对插接有导风插件30的槽位1011来说，常温的气流从第一进风口1a流入第一空间A，并从第一出风口1b流出第一空间A以流入位于下方的槽位1011中，与下方槽位1011中的气流交汇，从而进一步地增大了下方槽位1011中的气流流量，进而提高了对于其中线卡210的散热效果。
并且，为了避免从业务载板40经第二进风口1c流出的气流，不会影响到业务载板40的散热效果，第二进风口1c靠近风扇组20布置。这样，就能够保证气流在对业务载板40上的线卡210进行充分散热后，才会由第二进风口1c流入上方的导风插件30中。
进一步地，第二导风板22由一侧边至相对的另一侧边沿背离第二进风口1c的方向倾斜。 如此设计，使得第二导风板22能够更好的对进入第二空间B的气流进行引导，使其能够顺着倾斜的第二导风板22，由第二空间B朝向风扇组20一侧的开口流出。
除此之外，倾斜布置的第二导风板22，还能够减小自身受到气流的冲击，从而能够达到降噪的目的。
在实际情况下，通常会有多个连续叠设的空槽位1011，各空槽位1011中插接有导风插件30。为了保证各空槽位1011中的导风插件30既能够如前文所述的将气流导流到下方的业务载板40，也能够将下方的业务载板40中的气流导流回来，还能够连续的将气流导流到下方的导风插件30，本申请实施例提供了又一种导风插件30。
图8为本申请实施例提供的又一种导风插件30的结构示意图，由于该图仅为导风插件30的结构示意图，所以其中未展示机柜的其余部件。为了便于理解导风插件30中各部件在机柜中的方位，特别说明图8的整体方位与图4相同，即风扇组20位于图8中导风插件30的右侧，气流由图8的左侧向右侧流动。
图8中所示的导风插件30与图6中所示的导风插件30，在结构上大体相同，且具有图6中所示的导风插件30的所有有益效果。区别在于，上盖板11、下盖板12、第一导风板21和第二导风板22之间构成第三空间C，第三空间C内对应上盖板11的位置分别具有第三进风口1d和第二出风口1e，第三进风口1d和第二出风口1e相互间隔，第三进风口1d与上方相邻的槽位1011中的第一出风口1b相对，第二出风口1e与上方相邻的槽位1011中的第二进风口1c相对。
利用第二导风板22和第一导风板21，在上盖板11和下盖板12之间围成第三空间C，以为导流气流提供空间基础。进一步地，在第三空间C内设置第三进风口1d和第二出风口1e，第三进风口1d和第二出风口1e位于第三空间C内对应上盖板11的位置，第三进风口1d与上方相邻的槽位1011中的第一出风口1b相对，第二出风口1e与上方相邻的槽位1011中的第二进风口1c相对，使得第三空间C能够分别与位于上方相邻的槽位1011中的第一空间A和第二空间B连通，以此限定气流进入第三空间C的路径，以及输出第三空间C的路径。
在一种示例性实施例中，第三进风口1d与上方相邻的槽位1011中的第一出风口1b部分相对，第二出风口1e与上方相邻的槽位1011中的第二进风口1c相对。即相对于第一出风口1b的正下方位置，第三进风口1d偏向于第二进风口1c，相对于第二进风口1c的正下方位置，第二出风口1e偏向于第一出风口1b。
图9为导风插件30的气体流向图，为了更清楚的展示相邻槽位1011之间的导风情况，图9中仅展示了三个槽位1011，省略了其余的槽位1011。下面结合图9，对导风插件30的导流原理进行介绍。
风扇组20工作，以在槽位空间101的两侧形成流动的气流。第一个导风插件30、第二个导风插件30、业务载板40由上至下依次叠设，即有两个导风插件30连续叠设在一起。
针对插接有第一个导风插件30的槽位1011来说，常温的气流从第一进风口1a流入第一空间A，并从第一出风口1b流出第一空间A，进而从第二个导风插件30的第三进风口1d进入对应的第三空间C中，第三空间C中的气流从第二出风口1e流出第三空间C，进而从第一个导风插件30的第二进风口1c进入对应的第二空间B中，最终从第二空间B朝向风扇组20一侧的开口流出。也就是说，当相邻的两个槽位1011中均插接导风插件30时，进入上方槽位1011内的导风插件30的气流，能够借助下方槽位1011内的导风插件30的第三空间C 进行流通，并最终回到上方槽位1011内的导风插件30中，并流出槽位空间101，进一步地提高了槽位空间101的出风均匀性。除此之外，还能够有效的避免因导风插件30的右侧，即靠近风扇组20的一侧出现无风区，而影响机柜内的其余电子器件的散热。
针对插接有第二个导风插件30的槽位1011来说，常温的气流从第一进风口1a流入第一空间A，并从第一出风口1b流出第一空间A以流入位于下方的槽位1011中，与下方槽位1011中的气流交汇，从而进一步地增大了下方槽位1011中的气流流量，进而提高了对于其中线卡210的散热效果。
针对插接有业务载板40的槽位1011来说，常温的气流直接从槽位1011的左侧流入并流经业务载板40，在流经业务载板40的过程中，与业务载板40上的线卡210进行热交换，转变为较高温的气流，这些气流一部分槽位1011的右侧流出，另一部分则向上流动，并通过第二个导风插件30的第二进风口1c流到对应的第二空间B，最终从第二空间B朝向风扇组20一侧的开口流出。也就是说，气流不仅能够从插接有业务载板40的槽位1011流出，还能够从插接有导风插件30的槽位1011流出，提高了槽位空间101的出风均匀性。除此之外，还能够有效的避免因导风插件30的右侧，即靠近风扇组20的一侧出现无风区，而影响机柜内的其余电子器件的散热。
在一种示例性实施例中，第三进风口1d和第二出风口1e，能够连通在一起，以形成较大的风口。该风口同时与上方相邻的槽位1011中的第一出风口1b和第二进风口1c相对。在此情况下，由于第三进风口1d和第二出风口1e之间没有间隔，所以利用上方相邻的槽位1011中的导风插件30作为隔离手段，即利用上方相邻的槽位1011中的第一出风口1b和第二进风口1c之间的间隔。这种情况能够降低用料成本，有利于成本控制。
在一种示例性实施例中，第一进风口1a、第二进风口1c、第三进风口1d、第一出风口1b和第二出风口1e中具有防护网14。如此设计，能够防止异物直接进入导风插件30，不仅避免了异物堵塞导风插件30，还能够防止异物随着气流进入业务载板40，对业务载板40内的线卡210造成影响。
容易理解的是，为了降低成本，在一种示例性实施例中，仅在第一进风口1a中设置防护网14。
示例性地，防护网14内的孔径和目数等指标根据实际需求进行调整。若需要散热性能优先，那么防护网14的孔径适当设计的较大，而目数则适当设计的较小。若需要防尘性能优先，那么防护网14的孔径适当设计的较小，而目数则适当设计的较大。本申请对此不作限制。
在一种示例性实施例中，机柜包括多个可替换的导风插件30，各导风插件30的第一进风口1a、第二进风口1c、第三进风口1d、第一出风口1b、第二出风口1e具有多种尺寸。
也就是说，能够准备多个结构相同，而风口(第一进风口1a、第二进风口1c、第三进风口1d、第一出风口1b、第二出风口1e)尺寸不同的导风插件30。如此设计，用户能够根据实际需求，选择合适尺寸的导风插件30，以控制气流的流量和流速，提高了机柜的适用性。
举例来说，若需要提高导风插件30的进风量，那么相应的选择第一进风口1a尺寸较大的导风插件30。若需要提高导风插件30的出风量，那么相应的选择第二进风口1c尺寸较大的导风插件30。
下面简单介绍一下，本申请实施例提供的机柜的装配流程。
首先，将各风扇201按照由下至上的顺序依次安装在柜体10内，使得各风扇201位于槽 位空间101的一侧，即位于图4的右侧。
然后，选择业务载板40。业务载板40的数量按照线卡210的数量选择，业务载板40的风口(第一进风口1a、第二进风口1c、第三进风口1d、第一出风口1b、第二出风口1e)尺寸，按照散热要求选择。
接着，将业务载板40插接至空槽位1011中。为了保证各业务载板40的散热效果，各业务载板40在槽位空间101内均匀间隔布置，以避免各业务载板40过于集中。
最后，将导风插件30插接至剩余空槽位1011中。
图10为本申请实施例提供的一种电子设备，该电子设备包括机柜100和电子器件200。
机柜100为前文提供的机柜100，电子器件200包括线卡210和交换网板220，线卡210位于槽位1011内，且与业务载板40相连，交换网板220位于机柜100内，且夹设在槽位空间101和风扇组20之间。
通过将线卡210安装在业务载板40内，以与业务载板40一同插接在槽位1011内，能够受到机柜100的良好散热。通过将交换网板220直接安装在机柜100内，且位于槽位空间101和风扇组20之间，从而使得从槽位空间101中流出的气流，还能够流经交换网板220，在对交换网板220进行散热后，再由风扇组20导出，以与外界进行热交换。
也就是说，本申请实施例提供的电子设备，通过机柜100来承载电子器件200，以为电子器件200提供安装基础和散热条件。由于电子设备中的线卡210安装在业务载板40上，而业务载板40又位于槽位1011内，所以槽位1011内流通的气流能够对线卡210进行良好的散热，使得线卡210处于合适的工作温度，保证了线卡210的正常工作。由于电子设备中的交换网板220安装在机柜100内，且位于槽位空间101和风扇组20之间，所以从槽位空间101中流出的气流能够进一步地对交换网板220进行良好的散热，使得交换网板220处于合适的工作温度，保证了交换网板220的正常工作。由此可见，本申请实施例提供的电子设备，能够保证其中电子设备的良好散热，进而保证其正常稳定的工作。
除此之外，当机柜100中配置前文图3、图6、图8中所示的导风插件30时，机柜100相应的具有对应的有益效果，电子设备同样也相应的具有对应的有益效果，在此不做赘述。
在一种示例性实施例中，电子设备为正交架构的数据中心交换机，其中各线卡210水平布置，而各交换网板220垂直水平面竖直，即线卡210和交换网板220之间相互垂直，线卡210和交换网板220之间通过正交连接器相连，实现数据的高速传输。如此设计，使得线卡210和交换网板220之间的传输距离更短，且故障点更少，既提高了电子设备的性能，又提高了电子设备的可靠性。
下面简单介绍一下，本申请实施例提供的电子设备的装配流程。
首先，将各风扇201按照由下至上的顺序依次安装在柜体10内，使得各风扇201位于槽位空间101的一侧，即位于图10中的右侧。
然后，将交换网板220依次安装在柜体10内，使得各风扇201位于各风扇201的一侧，即位于图10中的左侧。
再然后，选择业务载板40。业务载板40的数量按照线卡210的数量选择，业务载板40的风口(第一进风口1a、第二进风口1c、第三进风口1d、第一出风口1b、第二出风口1e)尺寸，按照散热要求选择。
接着，将线卡210安装至对应的业务载板40中，并将业务载板40插接至空槽位1011中。 为了保证各业务载板40的散热效果，各业务载板40在槽位空间101内均匀间隔布置，以避免各业务载板40过于集中。
最后，将导风插件30插接至剩余空槽位1011中。
图11为本申请实施例提供的一种导风插件的制造方法的流程图，该制造方法用于制造图3-9所示的任一个导风插件，结合图11，该制造方法包括：
步骤1101：提供壳体1，在壳体1上加工出第一进风口1a和第一出风口1b，使得第一进风口1a和第一出风口1b所处的平面之间具有夹角。
步骤1102：将导流结构2连接至壳体1内，导流结构2用于将流入第一进风口1a的气流导流至第一出风口1b。
对于通过本申请实施例提供的制造方法所制造出的导风插件来说，由于第一进风口1a和第一出风口1b所处的平面之间具有夹角，所以第一进风口1a和第一出风口1b的过流方向不同，即气流在经过第一进风口1a和第一出风口1b时的方向互不相同，从而能够实现气流的变向和导向。并且，由于导流结构2能够将流入第一进风口1a的气流导流至第一出风口1b，所以通过导风插件能够实现气流的变向和导流。
在将本申请实施例提供的制造方法所制造出的导风插件，应用于机柜中时，风扇组20工作，以形成流经槽位空间101的气流。一部分气流流经插接有业务载板40的槽位1011，直接对安装在业务载板40上的线卡210进行散热。另外一部分气流则流经插接有导风插件30的槽位1011，由于导风插件30能够将所处槽位1011中的气流导流至相邻的槽位1011内，所以这部分的气流，最终将被导入插接有业务载板40的槽位1011内，同样也能够对安装在业务载板40上的线卡210进行散热。由此可见，无论是插接业务载板40的槽位1011，还是插接导风插件30的槽位1011，都能够进风，即槽位空间101能够接收由风扇组20所产生的所有气流，保证了总进风量。并且，被槽位空间101接收的气流，能够被全部用来对业务载板40上的线卡210进行散热，所以也解决了气流溢流的问题，保证了散热效果。除此之外，由于导风插件30不再阻挡气流，所以也减少了气流撞击时产生的噪音。
以上的具体实施方式，对本申请的目的、技术方案和有益效果进行了进一步详细说明，所应理解的是，以上仅为本申请的具体实施方式而已，并不用于限定本申请的保护范围，凡在本申请的技术方案的基础之上，所做的任何修改、等同替换、改进等，均应包括在本申请的保护范围之内。

Claims (16)

  1. 一种导风插件，所述导风插件应用于机柜中，其特征在于，所述导风插件包括壳体(1)和导流结构(2)；
    所述壳体(1)上具有第一进风口(1a)和第一出风口(1b)，所述第一进风口(1a)和所述第一出风口(1b)所处的平面之间具有夹角；
    所述导流结构(2)位于所述壳体(1)内，所述导流结构(2)被配置为，将流入所述第一进风口(1a)的气流导流至所述第一出风口(1b)。
  2. 根据权利要求1所述的导风插件，其特征在于，所述壳体(1)包括上盖板(11)、下盖板(12)和端板(13)；
    所述上盖板(11)和所述下盖板(12)之间相对间隔；
    所述端板(13)位于所述上盖板(11)和所述下盖板(12)之间，且所述端板(13)的一侧边与所述上盖板(11)的一侧边相连，所述端板(13)的相对另一侧边与所述下盖板(12)的一侧边相连；
    所述导流结构(2)包括第一导风板(21)，所述第一导风板(21)位于所述上盖板(11)和所述下盖板(12)之间，且所述第一导风板(21)的一侧边与所述上盖板(11)相连，相对的另一侧边与所述下盖板(12)相连；
    所述上盖板(11)、所述下盖板(12)、所述端板(13)和所述第一导风板(21)围成第一空间(A)，所述第一进风口(1a)位于所述第一空间(A)内对应所述端板(13)的位置，所述第一出风口(1b)位于所述第一空间(A)内对应所述下盖板(12)的位置。
  3. 根据权利要求2所述的导风插件，其特征在于，所述第一导风板(21)由一侧边至相对的另一侧边沿背离所述第一出风口(1b)的方向倾斜。
  4. 根据权利要求2所述的导风插件，其特征在于，所述导流结构(2)还包括第二导风板(22)，所述第二导风板(22)位于所述第一导风板(21)的背离所述端板(13)的一侧，且位于所述上盖板(11)和所述下盖板(12)之间，所述第二导风板(22)的一侧边与所述上盖板(11)相连，相对的另一侧边与所述下盖板(12)相连；
    所述上盖板(11)、所述下盖板(12)和所述第二导风板(22)背离所述第一导风板(21)的一侧围成第二空间(B)，所述第二空间(B)内对应所述下盖板(12)的位置具有第二进风口(1c)。
  5. 根据权利要求4所述的导风插件，其特征在于，所述第二导风板(22)由一侧边至相对的另一侧边沿背离所述第二进风口(1c)的方向倾斜。
  6. 根据权利要求4所述的导风插件，其特征在于，所述上盖板(11)、所述下盖板(12)、所述第一导风板(21)和所述第二导风板(22)之间构成第三空间(C)，所述第三空间(C) 内对应上盖板(11)的位置分别具有第三进风口(1d)和第二出风口(1e)。
  7. 一种机柜，其特征在于，包括柜体(10)、风扇组(20)、导风插件(30)和业务载板(40)；
    所述柜体(10)内具有槽位空间(101)，所述槽位空间(101)由多个依次叠设且连通的槽位(1011)构成，各所述槽位(1011)用于容置所述导风插件(30)或者所述业务载板(40)；
    所述风扇组(20)位于所述柜体(10)内，且与所述槽位空间(101)并排布置，用于形成流经所述槽位空间(101)的气流；
    所述导风插件(30)为权利要求1-6任一项所述的导风插件，所述导风插件(30)可拆卸地插接在所述槽位(1011)内，以将所处的所述槽位(1011)中的气流导流至相邻的所述槽位(1011)内；
    所述业务载板(40)可拆卸地插接在所述槽位(1011)内，以承载线卡(210)。
  8. 根据权利要求7所述的机柜，其特征在于，所述机柜包括多种可替换的所述导风插件(30)，各所述导风插件(30)的第一进风口(1a)、第二进风口(1c)、第三进风口(1d)、第一出风口(1b)、第二出风口(1e)具有多种尺寸。
  9. 根据权利要求7所述的机柜，其特征在于，所述风扇组(20)包括多个风扇(201)，各所述风扇(201)沿所述槽位(1011)的叠设方向依次并排布置。
  10. 一种电子设备，其特征在于，包括：机柜(100)和电子器件(200)；
    所述机柜(100)为权利要求7-9任一项所述的机柜；
    所述电子器件(200)包括线卡(210)和交换网板(220)，所述线卡(210)位于所述槽位(1011)内，且与所述业务载板(40)相连，所述交换网板(220)位于所述机柜(100)内，且夹设在所述槽位空间(101)和所述风扇组(20)之间。
  11. 一种导风插件的制造方法，其特征在于，包括：
    提供壳体(1)，在所述壳体(1)上加工出第一进风口(1a)和第一出风口(1b)，使得所述第一进风口(1a)和所述第一出风口(1b)所处的平面之间具有夹角；
    将导流结构(2)连接至所述壳体(1)内，所述导流结构(2)用于将流入所述第一进风口(1a)的气流导流至所述第一出风口(1b)。
  12. 根据权利要求11所述的制造方法，其特征在于，所述壳体(1)包括上盖板(11)、下盖板(12)和端板(13)；
    所述上盖板(11)和所述下盖板(12)之间相对间隔；
    所述端板(13)位于所述上盖板(11)和所述下盖板(12)之间，且所述端板(13)的一侧边与所述上盖板(11)的一侧边相连，所述端板(13)的相对另一侧边与所述下盖板(12)的一侧边相连；
    所述导流结构(2)包括第一导风板，所述第一导风板(21)位于所述上盖板(11)和所述下盖板(12)之间，且所述第一导风板(21)的一侧边与所述上盖板(11)相连，相对的另一侧边与所述下盖板(12)相连；
    所述上盖板(11)、所述下盖板(12)、所述端板(13)和所述第一导风板(21)围成第一空间(A)，所述第一进风口(1a)位于所述第一空间(A)内对应所述端板(13)的位置，所述第一出风口(1b)位于所述第一空间(A)内对应所述下盖板(12)的位置。
  13. 根据权利要求12所述的制造方法，其特征在于，所述第一导风板(21)由一侧边至相对的另一侧边沿背离所述第一出风口(1b)的方向倾斜。
  14. 根据权利要求12所述的制造方法，其特征在于，所述导流结构(2)还包括第二导风板(22)，所述第二导风板(22)位于所述第一导风板(21)的背离所述端板(13)的一侧，且位于所述上盖板(11)和所述下盖板(12)之间，所述第二导风板(22)的一侧边与所述上盖板(11)相连，相对的另一侧边与所述下盖板(12)相连；
    所述上盖板(11)、所述下盖板(12)和所述第二导风板(22)背离所述第一导风板(21)的一侧围成第二空间(B)，所述第二空间(B)内对应所述下盖板(12)的位置具有第二进风口(1c)。
  15. 根据权利要求14所述的制造方法，其特征在于，所述第二导风板(22)由一侧边至相对的另一侧边沿背离所述第二进风口(1c)的方向倾斜。
  16. 根据权利要求14所述的制造方法，其特征在于，所述上盖板(11)、所述下盖板(12)、所述第一导风板(21)和所述第二导风板(22)之间构成第三空间(C)，所述第三空间(C)内对应上盖板(11)的位置分别具有第三进风口(1d)和第二出风口(1e)。
PCT/CN2021/104816 2020-09-30 2021-07-06 导风插件、机柜、电子设备及导风插件的制造方法 WO2022068303A1 (zh)

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