WO2022068261A1 - 数据处理设备及数据处理系统 - Google Patents

数据处理设备及数据处理系统 Download PDF

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Publication number
WO2022068261A1
WO2022068261A1 PCT/CN2021/099701 CN2021099701W WO2022068261A1 WO 2022068261 A1 WO2022068261 A1 WO 2022068261A1 CN 2021099701 W CN2021099701 W CN 2021099701W WO 2022068261 A1 WO2022068261 A1 WO 2022068261A1
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WO
WIPO (PCT)
Prior art keywords
data processing
processing device
side wall
computing power
board
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Application number
PCT/CN2021/099701
Other languages
English (en)
French (fr)
Inventor
高阳
刘方宇
陈前
巫跃凤
郭海丰
杨作兴
Original Assignee
深圳比特微电子科技有限公司
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Application filed by 深圳比特微电子科技有限公司 filed Critical 深圳比特微电子科技有限公司
Priority to US17/928,441 priority Critical patent/US20230217628A1/en
Priority to CA3180362A priority patent/CA3180362A1/en
Publication of WO2022068261A1 publication Critical patent/WO2022068261A1/zh

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H05K7/20263—Heat dissipaters releasing heat from coolant
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H05K7/20236—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures by immersion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20763—Liquid cooling without phase change
    • H05K7/20781—Liquid cooling without phase change within cabinets for removing heat from server blades

Definitions

  • the invention relates to the technical field of data processing, in particular to a data processing device and a data processing system.
  • virtual currency mining machines mainly use air-cooled heat dissipation, and some use water-cooled plates for heat dissipation.
  • To dissipate heat from the water-cooled plate it is generally necessary to attach the computing power board to the water-cooled plate, and the water-cooled plate is connected to a water circulation system through a pipeline. After the heat generated by the hash board is absorbed by the water inside the water-cooling board, the water circulation system takes away the heated water in the water-cooling board, thereby realizing the heat dissipation of the hash board. Due to the need to deploy a water circulation system through pipes, this water-cooling plate heat dissipation method tends to complicate the heat dissipation system.
  • a data processing device comprising:
  • a shell which can conduct heat and encloses a sealed accommodating cavity; a computing power board, which is arranged in the accommodating cavity and is fixedly connected with the shell; a control board, which is communicatively connected to the computing power board; a power module, which is electrically connected to the hash board.
  • At least one of the computing power board, the control board and the power module is attached to the inner surface of the housing.
  • the housing comprises a first inner sidewall, a second inner sidewall and a circumferential inner sidewall connected between the first inner sidewall and the second inner sidewall, the first inner sidewall and the second inner sidewall are oppositely disposed.
  • the inner side wall, the second inner side wall and the peripheral inner side wall enclose the receiving cavity; the control board and the power module are all arranged on the first inner side wall, and the computing power board is arranged on the the second inner side wall.
  • the housing comprises a first inner sidewall, a second inner sidewall and a circumferential inner sidewall connected between the first inner sidewall and the second inner sidewall, the first inner sidewall and the second inner sidewall are oppositely disposed.
  • the inner side wall, the second inner side wall and the peripheral inner side wall are enclosed to form the receiving cavity; the first inner side wall and the second inner side wall are both provided with the computing power board, the control board and the The power module is arranged on the inner sidewall of the circumference.
  • the casing is provided with a through hole, and the through hole is used for passing a cable, the cable is electrically connected to the power module, and the cable is sealedly connected to the casing.
  • the side of the casing facing away from the accommodating cavity is provided with a plurality of heat dissipation fins arranged at intervals; or, the side of the casing facing away from the accommodating cavity is covered with a heat-dissipating ceramic coating layer.
  • At least one of the computing power board, the control board, and the power module is attached to the inner surface of the casing through a heat dissipation layer, and the heat dissipation layer includes a graphite layer and a thermally conductive silicone grease layer. , at least one of thermally conductive silicone pads.
  • the computing power board is provided with a plurality of computing power chip sets, and each of the computing power chip sets includes a plurality of computing power chips.
  • a data processing system comprising a console and a virtual currency data processing device according to any one of the above embodiments, the data processing devices are configured in multiples, and the multiple data processing devices are respectively electrically connected to the console, and the console Used to control the working state of the data processing device.
  • the above-mentioned data processing equipment and data processing system because the casing can conduct heat and is provided with a receiving cavity, the computing power board is arranged in the receiving cavity and is fixedly connected with the casing, the heat generated by the computing power board during the working process can be conducted to the casing, and the casing can be Part or all of it is immersed in a cooling liquid such as water for liquid cooling and heat dissipation, and the outer casing can isolate the cooling liquid from the receiving cavity to ensure the reliability of the operation of the hash board.
  • the above data processing device can reduce the requirement for cooling liquid, simplify the configuration of the cooling system of the data processing device, and reduce the cost of the cooling system.
  • FIG. 1 is a cross-sectional view of a data processing device in one embodiment
  • Fig. 2 is a schematic diagram of the data processing device shown in Fig. 1 being placed in a cooling liquid;
  • FIG. 3 is a cross-sectional view of a data processing device in another embodiment
  • FIG. 4 is a cross-sectional view of a data processing device in yet another embodiment
  • FIG. 5 is a cross-sectional view of the data processing equipment shown in FIG. 4 along A-A;
  • FIG. 6 is a cross-sectional view of a data processing device in yet another embodiment
  • FIG. 7 is a cross-sectional view of a data processing device in yet another embodiment
  • FIG. 8 is a schematic diagram of a data processing system placed in a cooling liquid in one embodiment.
  • Control board 14 Power module 15. Cable
  • the data processing device 10 includes a housing 11 and a computing power board 12 disposed in the housing 11 .
  • the housing 11 can conduct heat and encloses a sealed receiving cavity 111
  • the computing power board 12 is provided in the housing 11 .
  • the cavity 111 is fixedly connected with the housing 11 .
  • the hash board 12 may be fixedly connected to the housing 11 by using threaded fasteners, or may be fixedly connected to the housing 11 by means of bonding or welding.
  • the heat generated by the hash board 12 during operation can be conducted to the casing 11 and dissipated to the external environment through the casing 11 .
  • the housing 11 is made of aluminum alloy, and the aluminum alloy housing 11 has the advantages of light weight, convenient processing, relatively low price, and high cost performance. In other embodiments, the housing 11 may also be made of materials such as copper alloys.
  • the data processing device 10 may be partially immersed in a cooling liquid, such as cooling water, for liquid cooling and heat dissipation, and the housing 11 may isolate the cooling liquid from the receiving cavity 111 . In other embodiments, the entire housing 11 may be immersed in cooling liquid to improve heat dissipation efficiency. In this embodiment, the housing 11 can also isolate the cooling liquid from the accommodating cavity 111 .
  • the data processing device 10 is an application-specific integrated circuit (Application Specific Integrated Circuit, ASIC) data processing device, and the computing power board 12 may be provided with multiple computing power chipsets, and each computing power chipset may include multiple Computing power chip.
  • ASIC Application Specific Integrated Circuit
  • the data processing device 10 receives a data processing task, the data processing task can be subdivided into multiple computing tasks, and the multiple computing tasks can be allocated to each computing power chip for calculation.
  • the data processing device 10 may also be other types of data processing devices such as graphics card data processing devices or FPGA (Field-Programmable Gate Array, Field Programmable Gate Array) data processing devices.
  • the data processing device 10 may include a control board 13 that is communicatively connected to the computing power board 12 and a power module 14 that is electrically connected to the computing power board 12 .
  • the control board 13 can be used for receiving data processing tasks, and after receiving the data processing tasks, assigning the data processing tasks to the computing power units (eg chips) on the computing power board 12 .
  • the control board 13 can be detachably connected to the housing 11 by threaded fasteners, or can be fixedly connected to the housing 11 by means of bonding or welding.
  • the power supply module 14 is used for external power supply to supply power to the entire data processing device 10 through the external power supply.
  • the power supply module 14 at least has the function of stabilizing the output voltage or current, so that the control board 13 and the computing power board 12 connected to the power supply module 14 can be reliably , work stably.
  • the connection between the power module 14 and the casing 11 There are various ways of fixing the connection between the power module 14 and the casing 11 .
  • the power module 14 may be detachably connected to the housing 11 by threaded fasteners, or may be fixedly connected to the housing 11 by means of bonding or welding.
  • the control board 13 can also be used to control the opening and closing of the power supply module 14.
  • the control board 13 can control the connection between the power supply module 14 and the control board 13 (or the computing power board 12). Turning on and off the power supply circuit.
  • the control board 13 can also be used to adjust the output voltage of the power supply module 14 or read the working state of the power supply module 14 and the like.
  • the heat generated by the power module 14 and the control board 13 can also be conducted to the casing 11 and dissipated to the external environment through the casing 11 .
  • the data processing device 10 may further include a cable 15 , the casing 11 is provided with a through hole (not shown), and the cable 15 passes through the through hole and is sealedly connected to the casing 11 . Further, the cable 15 is at least electrically connected to the power supply module 14, and is used to supply power to the power supply module 14 when an external power supply is used. In some embodiments, the cable 15 may also be communicatively connected to the control board 13 or the computing power board 12 to perform data transmission with external devices through the cable 15 . Of course, this setting is not necessary, for example, the data processing device 10 can perform data transmission with an external device by means of wireless communication or the like.
  • the wireless communication may be Bluetooth communication, near field communication, cellular communication, or WIFI communication.
  • the cable 15 and the housing 11 have waterproof properties, so that the data processing device 10 can be partially or fully immersed in water and can work normally in water and perform water cooling and heat dissipation to improve data Heat dissipation efficiency of processing device 10 .
  • the data processing device 10 may also be partially or fully immersed in other types of cooling liquids, such as cooling oil, and perform liquid cooling and heat dissipation.
  • the cables 15 and the cooling liquid can be well It is enough to isolate and ensure the reliable operation of the data processing device 10 .
  • an electrical connection interface may be provided on the side where the outer surface of the housing 11 is located, and the cable 15 for supplying power to the data processing device can be docked with the electrical connection interface on the housing 11 to connect the cable 15 to an external connection.
  • the data processing device 10 can be powered. This structure can improve the convenience of handling the data processing device 10, prevent accidental damage to the cable 15 caused by the cable 15 being cluttered or entangled in the casing 11, and the user can select the appropriate length of the cable 15 and the casing according to actual needs. 11 Assemble to improve the ease of assembly.
  • the arrangement of the electrical connection interface can further ensure the sealing performance of the housing 11 .
  • the electrical connection interface can be formed on the housing 11 by injection molding to improve the sealing performance of the housing 11 at the electrical connection interface. Compared with the structure in which the cable 15 is passed through the casing 11 , this arrangement can avoid the relative displacement of the cable 15 and the casing 11 at the through hole, thereby reducing the reliability of sealing.
  • the heat-conducting casing 11 is provided with a receiving cavity 111, and the computing power board 12 is arranged in the receiving cavity 111 and is fixedly connected with the casing 11, the heat generated by the computing power board 12 during the working process can be conducted to the casing.
  • the casing 11 can be partially or fully immersed in a cooling liquid such as water for liquid cooling and heat dissipation.
  • the above data processing device 10 can also avoid arranging complex water circulation pipelines at the periphery, thereby simplifying the arrangement of the cooling system of the data processing device, avoiding waste of space by the cooling system, and improving the space utilization rate of the device.
  • the data processing apparatus 10 described above may be fully or partially submerged in a cooling pool or cooling tank.
  • the cooling pool or cooling box can be connected with external pipes to continuously inject relatively low-temperature cooling liquid, and continuously discharge the heated cooling liquid to improve the cooling efficiency of the entire cooling system.
  • the above-mentioned data processing device 10 may be fully or partially immersed in rivers and lakes, thereby simplifying the construction of the cooling system and saving the cost of the cooling system of the data processor.
  • the hash board 12 is attached to the inner surface of the housing 11 , and this arrangement can increase the contact area between the hash board 12 and the housing 11 , so as to improve the housing 11 and the hash board 12 The heat exchange efficiency between them is improved, thereby improving the heat dissipation performance of the data processing device 10 .
  • the hash board 12 is attached to the inner surface of the casing 11 via the heat dissipation layer 113 , and the heat dissipation layer 113 can be regarded as a part of the casing 11 .
  • the heat dissipation layer 113 can further improve the heat exchange efficiency between the hash board 12 and the casing 11 , thereby improving the heat dissipation performance of the data processing device 10 .
  • the heat dissipation layer 113 is a thermally conductive silicone grease layer, and the thermally conductive silicone grease layer can improve the heat conduction speed between the computing power board 12 and the casing 11 , thereby improving the heat exchange efficiency.
  • the heat dissipation layer 113 is a graphite layer, and the graphite layer can also improve the heat exchange efficiency between the computing power board 12 and the casing 11 , thereby improving the heat dissipation performance of the data processing device 10 .
  • the heat dissipation layer 113 can also be a thermally conductive silicone pad, and the thermally conductive silicone pad can also improve the heat dissipation performance of the data processing device 10 .
  • control board 13 is attached to the inner surface of the housing 11 , and this arrangement can increase the contact area between the control board 13 and the housing 11 , so as to improve the contact area between the housing 11 and the control board 13 .
  • the heat exchange efficiency is improved, thereby improving the heat dissipation performance of the data processing device 10 . Further, referring to FIG.
  • the control board 13 is attached to the inner surface of the casing 11 through the heat dissipation layer 113 , the heat dissipation layer 113 can be regarded as a part of the casing 11 , and the heat dissipation layer 113 can further enhance the control board 13 and the casing 11 The heat exchange efficiency between them is improved, thereby improving the heat dissipation performance of the data processing device 10 .
  • the heat dissipation layer 113 may be at least one of a thermally conductive silicone grease layer, a graphite layer, or a thermally conductive silicone pad, which will not be repeated here.
  • the power module 14 is attached to the inner surface of the housing 11 , and this arrangement can increase the contact area between the power module 14 and the housing 11 , so as to increase the heat between the housing 11 and the power module 14 .
  • the exchange efficiency is improved, thereby improving the heat dissipation performance of the data processing device 10 . Further, referring to FIG.
  • the power module 14 is attached to the inner surface of the casing 11 via the heat dissipation layer 113 , the heat dissipation layer 113 can be regarded as a part of the casing 11 , and the heat dissipation layer 113 can further enhance the power module 14 and the casing 11 The heat exchange efficiency between them is improved, thereby improving the heat dissipation performance of the data processing device 10 .
  • the heat dissipation layer 113 may be at least one of a thermally conductive silicone grease layer, a graphite layer, or a thermally conductive silicone pad, which will not be described herein again.
  • the power module 14 does not have to be arranged in the casing 11 .
  • the power supply module 14 can be externally placed in the data processing device 10, and can supply power to the computing power board 12 and the control board 13 through the cable 15 when the power supply is externally connected.
  • the data processing device 10 in this embodiment can save the space occupied by the power module 14 in the housing 11 , thereby improving the compactness of the structure of the data processing device 10 .
  • the data processing devices 10 of two or more default power modules 14 can be connected to a unified power management platform through cables 15, respectively, and the power supply of the multiple data processing devices 10 can be managed through the power management platform. , to improve the compactness of the device and the convenience of power management.
  • control board 13 does not have to be disposed in the housing 11 , for example, the control board 13 can be externally placed in the data processing device 10 and can be connected to the computing power board 12 through the cable 15 for communication.
  • the data processing device 10 in this embodiment can save the space occupied by the control board 13 in the housing 11 , thereby improving the compactness of the structure of the data processing device 10 .
  • the data processing devices 10 of two or more default control boards 13 can be connected to a unified control platform through cables 15, respectively, and the work of the multiple data processing devices 10 can be controlled respectively through the control platform. In order to improve the compactness of the equipment and improve the convenience of control.
  • the housing 11 is substantially in the shape of a rectangular box. Referring to FIG. 1 , it may include a first inner side wall 11 a and a second inner side wall 11 b that are oppositely disposed and connected to the first inner side wall 11 a and the second inner side wall 11 b.
  • the first inner side wall 11a , the second inner side wall 11b and the inner peripheral side wall 11c enclose a receiving cavity 111 .
  • the control board 13 and the power module 14 are both arranged on the first inner side wall 11a, and the computing power board 12 is arranged on the second inner side wall 11b.
  • the length and width of the housing 11 can be comparable to the length and width of the hash board 12, and the control board 13 and the power module 14 can be disposed opposite to the hash board 12, so that the housing 11 has a relatively small size
  • the length and width dimensions and the smaller height dimensions of the data processing device 10 are further improved in structure compactness.
  • the above embodiment can also make the computing power board 12 , the control board 13 , the power module 14 and the inner surface of the housing 11 have relatively large contact areas, so as to improve the heat dissipation performance of the data processing device 10 .
  • more than two computing power boards 12 may be arranged in the receiving cavity 111 .
  • This embodiment takes two hash boards 12 as an example.
  • One of the hash boards 12 can be attached and fixed to the first inner side wall 11a, and the other hash board 12 can be attached and fixed to the second inner side wall 11b.
  • the computing power boards 12 are arranged opposite to each other, and the control board 13 and the power module 14 are arranged on the inner side wall 11c.
  • the control board 13 and the power module 14 can be respectively disposed on the inner side walls 11c of different circumferences. 11c, or the control board 13 and the power module 14 are respectively disposed on the two adjacent inner side walls 11c.
  • other computing power plates 12 can also be provided on the inner surface of the inner circumferential side wall 11 c of the housing 11 , so that multiple computing power boards 12 are arranged in a single data processing device 10 to improve the total calculation of a single data processing device 10 .
  • power that is to say, a single data processing device 10 has a stronger performance.
  • the housing 11 may be in other shapes, for example, the housing 11 may be cylindrical, that is, the cross-section of the housing 11 is circular. As another example, the cross-section of the housing 11 may be polygonal, eg, pentagonal, hexagonal, or shaped. For another example, the shape of the housing 11 may be a truncated cone shape or a terrace shape, which will not be repeated here.
  • the side of the housing 11 facing away from the receiving cavity 111 is provided with a plurality of heat sinks 11d arranged at intervals, and the material of the heat sinks 11d may be the same as that of the housing 11 and may be integrated with the housing 11 forming.
  • the heat sinks 11d can provide a relatively large heat dissipation area, and the heat of the housing 11 can be dissipated to the external environment through the heat sinks 11d, thereby improving the heat dissipation performance of the data processing device 10.
  • the first inner side wall 11 a , the second inner side wall 11 b and the circumferential inner side wall 11 c of the casing 11 can all be provided with radiating fins 11 d , and the radiating fins 11 d can be distributed on the entire outer surface of the casing 11 . surface to further improve the heat dissipation performance of the data processing device 10 .
  • the heat sink 11d may be provided at some positions of the first inner side wall 11a, the second inner side wall 11b and the circumferential inner side wall 11c.
  • the materials of the heat sink 11d and the housing 11 may be different, and the heat sink 11d may be independently processed and formed and assembled on the housing 11 .
  • the material of the casing 11 can be aluminum alloy, and the material of the heat sink 11d is copper alloy.
  • the plurality of heat sinks 11d are integrally formed, they can be fixedly connected to the outer surface of the casing 11 by welding, bonding or screwing. Such a structure can also improve the heat dissipation performance of the data processing device 10 .
  • the side of the housing 11 facing away from the receiving cavity 111 may be covered with a heat-dissipating ceramic coating 16 .
  • the heat-dissipating ceramic coating 16 can improve the efficiency of radiation heat dissipation.
  • the heat-dissipating ceramic coating 16 can radiate heat to the outside with an infrared wavelength of 8 ⁇ m to 13.5 ⁇ m, so as to reduce the temperature of the surface and the interior of the casing 11 , and thus can significantly improve The heat dissipation efficiency of the casing 11 reduces the temperature rise of the casing 11 .
  • the heat-dissipating ceramic coating 16 also has the advantage of not being affected by the surrounding medium, so that the data processing device 10 can be applied to more liquid-cooled heat-dissipating environments. Further, the disposition of the heat-dissipating ceramic coating 16 can further improve the surface performance of the data processing device 10 , for example, it can improve the surface structural strength of the data processing device 10 , and improve the corrosion resistance and wear resistance of the surface.
  • the present invention also discloses a data processing system 20, the data processing system 20 includes a console 21 and the data processing device 10 in the above embodiment, and the data processing device 10 can be configured as a plurality of, for example, each data processing device
  • the system 20 may be configured with two or more data processing devices 10 , and the plurality of data processing devices 10 are respectively electrically connected to the console 21 .
  • Each data processing device 10 can be electrically connected to a console 21 through a cable 15 , and the console 21 can provide power to each data processing device 10 .
  • the console 21 can also communicate with the data processing device 10 through the cable 15 to control the working state of each data processing device 10 in a unified manner or independently.
  • all data processing devices 10 can be immersed in cooling pools, cooling boxes or rivers and lakes, so as to perform liquid cooling and heat dissipation for multiple data processing devices 10 at the same time, thereby improving the heat dissipation performance of the data processing system 20 .
  • the data processing device of the present application can be, for example, a virtual currency mining machine.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Computer Hardware Design (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

一种数据处理设备及数据处理系统，数据处理设备包括外壳，可导热且围成一密封的收容腔；算力板，设于所述收容腔内并与所述外壳固定连接；控制板，通信连接于所述算力板；电源模块，电连接于所述算力板。

Description

数据处理设备及数据处理系统 技术领域
本发明涉及数据处理技术领域，特别是涉及一种数据处理设备及数据处理系统。
背景技术
相关技术中，虚拟货币矿机主要采用风冷散热，也有部分采用水冷板进行散热。水冷板散热一般需要将算力板贴在水冷板上，水冷板通过管道外接水循环系统。算力板在工作过程中产生的热量被水冷板内部的水吸收后，水循环系统将水冷板内升温的水带走，从而实现算力板的散热。由于需要通过管道部署水循环系统，这种水冷板散热方式易造成散热系统复杂化。
发明内容
基于此，有必要提供一种数据处理设备及数据处理系统，以简化散热系统的配置。
一种数据处理设备，包括：
外壳，可导热且围成一密封的收容腔；算力板，设于所述收容腔内并与所述外壳固定连接；控制板，通信连接于所述算力板；电源模块，电连接于所述算力板。
在其中一个实施例中，所述算力板、所述控制板和所述电源模块中至少一个贴合于所述外壳的内表面。
在其中一个实施例中，所述外壳包括相对设置的第一内侧壁、第二内侧壁和连接于所述第一内侧壁、所述第二内侧壁之间的周内侧壁，所述第一内侧壁、所述第二内侧壁和所述周内侧壁围成所述收容腔；所述控制板和所述电源模块均设于所述第一内侧壁，所述算力板设于所述第二内侧壁。
在其中一个实施例中，所述外壳包括相对设置的第一内侧壁、第二内侧壁和连接于所述第一内侧壁、所述第二内侧壁之间的周内侧壁，所述第一内侧壁、所述第二内侧壁和所述周内侧壁围合形成所述收容腔；所述第一内侧壁和所述第二内侧壁均设有所述算力板，所述控制板和所述电源模块设于所述周内侧壁。
在其中一个实施例中，所述外壳开设有通孔，所述通孔用于穿设线缆，所述线缆电性连接于所述电源模块，所述线缆与所述外壳密封连接。
在其中一个实施例中，所述外壳的背向所述收容腔的一侧设有多个间隔设置的散热 片；或者，所述外壳的背向所述收容腔的一侧覆盖有散热陶瓷涂层。
在其中一个实施例中，所述算力板、所述控制板和所述电源模块中至少一个经散热层贴合于所述外壳的内表面，所述散热层包括石墨层、导热硅脂层、导热硅胶垫中的至少一个。
在其中一个实施例中，所述算力板设置多个算力芯片组，每个所述算力芯片组包含多个算力芯片。
一种数据处理系统，包括控制台和以上任一实施例虚拟货币数据处理设备，所述数据处理设备配置为多个，多个所述数据处理设备分别与所述控制台电连接，所述控制台用于控制所述数据处理设备的工作状态。
上述数据处理设备及数据处理系统，由于外壳可导热且设有收容腔，算力板设于收容腔内并与外壳固定连接，算力板在工作过程中产生的热量能够传导至外壳，外壳可以部分或全部浸入于冷却液例如水中以进行液冷散热，且外壳可以将冷却液隔离于收容腔外，以保证算力板的工作可靠性。上述数据处理设备可以降低对冷却液的要求，并简化数据处理设备的散热系统的配置、降低散热系统的成本。
附图说明
为了更清楚地说明本发明实施例或现有技术中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本发明的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1为一实施例中数据处理设备的剖视图；
图2为图1所示数据处理设备置于冷却液中的示意图；
图3为另一实施例中数据处理设备的剖视图；
图4为又一实施例中数据处理设备的剖视图；
图5为图4所示数据处理设备沿A-A处的剖视图；
图6为又一实施例中数据处理设备的剖视图；
图7为又一实施例中数据处理设备的剖视图；
图8为一实施例中数据处理系统置于冷却液中的示意图。
附图标记：
10、数据处理设备        11、外壳                 11a、第一内侧壁
11b、第二内侧壁         11c、周内侧壁            11d、散热片
111、收容腔             113、散热层              12、算力板
13、控制板              14、电源模块             15、线缆
16、散热陶瓷涂层        20、数据处理系统         21、控制台
具体实施方式
为了便于理解本发明，下面将参照相关附图对本发明进行更全面的描述。附图中给出了本发明的较佳的实施例。但是，本发明可以以许多不同的形式来实现，并不限于本文所描述的实施例。相反地，提供这些实施例的目的是使对本发明的公开内容的理解更加透彻全面。
需要说明的是，当元件被称为“固定于”另一个元件，它可以直接在另一个元件上或者也可以存在居中的元件。当一个元件被认为是“连接”另一个元件，它可以是直接连接到另一个元件或者可能同时存在居中元件。本文所使用的术语“垂直的”、“水平的”、“左”、“右”以及类似的表述只是为了说明的目的。
除非另有定义，本文所使用的所有的技术和科学术语与属于本发明的技术领域的技术人员通常理解的含义相同。本文中在本发明的说明书中所使用的术语只是为了描述具体的实施例的目的，不是旨在于限制本发明。本文所使用的术语“及/或”包括一个或多个相关的所列项目的任意的和所有的组合。
参考图1，在一些实施方式中，数据处理设备10包括外壳11和设于外壳11内的算力板12，外壳11可导热且围成一密封的收容腔111，算力板12设于收容腔111内并与外壳11固定连接。算力板12与外壳11固定连接的方式可以有多种。例如，算力板12可以采用螺纹紧固件固定连接于外壳11，也可以采用粘接或焊接等方式固定连接于外壳11。算力板12在工作过程中产生的热量能够传导至外壳11，并通过外壳11向外部环境散发。在一些实施方式中，外壳11采用铝合金制成，铝合金的外壳11具有质轻、加工便捷、价格相对低廉、性价比高等优点。在其他实施方式中，外壳11也可以采用铜合金等材料制成。在一些实施方式中，数据处理设备10可以部分浸入冷却液例如冷却水中以进行液冷散热，且外壳11可以将冷却液隔离于收容腔111外。在另一些实施方式中，整个外壳11可以浸没于冷却液中以提升散热效率。在这种实施方式中，外壳11同样可以将冷却液隔离于收容腔111外。
在一些实施方式中，数据处理设备10为专用集成电路(Application Specific Integrated Circuit，ASIC)数据处理设备，其算力板12可设置多个算力芯片组，每个算力芯片组可以包含多个算力芯片。当数据处理设备10接到数据处理任务时，可将数据处理任务细分为多个运算任务，并将多个运算任务分配给各个算力芯片进行计算。在其他实施方式中，数据处理设备10也可以为其他类型例如显卡数据处理设备或者FPGA(Field-Programmable Gate Array，现场可编程门阵列)数据处理设备。
进一步，数据处理设备10可以包括通信连接于算力板12的控制板13以及电连接于算力板12的电源模块14，控制板13和电源模块14均设于收容腔111内并与外壳11固定连接。控制板13可用于接收数据处理任务，并在接到数据处理任务后将数据处理任务分配给算力板12上的算力单元(如芯片)。控制板13与外壳11的固定连接的方式可以有多种。例如，控制板13可以用过螺纹紧固件可拆卸地连接于外壳11，也可以采用粘接或焊接等方式固定连接于外壳11。电源模块14用于外接电源以通过外接电源为整个数据处理设备10供电，电源模块14至少具备稳定输出电压或电流的功能，以使连接于电源模块14的控制板13和算力板12能够可靠、稳定地工作。电源模块14与外壳11的固定连接方式有多种。例如，电源模块14可以通过螺纹紧固件可拆卸地连接于外壳11，也可以通过粘接或者焊接等方式固定连接于外壳11。进一步，在电源模块14外接电源的情况下，控制板13还可用于控制电源模块14的开启和关闭，例如控制板13可以控制电源模块14与控制板13(或算力板12)之间的供电电路的接通与断开。在电源模块14外接电源的情况下，控制板13还可用于调节电源模块14的输出电压或者读取电源模块14的工作状态等。在数据处理设备10的工作过程中，电源模块14和控制板13产生的热量同样可以传导至外壳11，并通过外壳11向外部环境散发。
继续参阅图1，在一些实施方式中，数据处理设备10还可以包括线缆15，外壳11开设有通孔(图未示)，线缆15穿设于通孔并与外壳11密封连接。进一步，线缆15至少电连接于电源模块14，且用于在外接电源时为电源模块14供电。在一些实施方式中，线缆15还可以通信连接于控制板13或者算力板12，以通过线缆15与外部设备进行数据传输。当然，这种设置不是必须的，例如，数据处理设备10可以采用无线通信等方式与外部设备进行数据传输。无线通信可以为蓝牙通信、近场通信、蜂窝通信或者WIFI通信等方式。进一步，参阅图2，在一些实施方式中，线缆15、外壳11均具有防水特性，以使数据处理设备10能够部分或者全部浸没于水中且可以在水中正常工作并进行水冷散热，以提升数据处理设备10的散热效率。当然，在其他实施方式中，数据处理设备10也可以部分或 者全部浸没于其他类型的冷却液例如冷却油中并进行液冷散热，在这种实施方式中，线缆15与冷却液能够实现良好的隔绝、保证数据处理设备10的可靠工作即可。
可以理解的是，线缆15穿设于外壳11的设置不是必须的。例如，在另一些实施方式中，外壳11的外表面所在侧可以设置电连接接口，用于为数据处理设备供电的线缆15能够与外壳11上的电连接接口对接，以在线缆15外接电源时为数据处理设备10供电即可。这种结构可以提升数据处理设备10搬运的便利性，防止因线缆15杂乱或者缠绕于外壳11而造成线缆15的意外损伤，且使用者可以根据实际需求选择合适长度的线缆15与外壳11进行组装，以提升组装的便利性。电连接接口的设置还可以进一步保证外壳11的密封性能，例如，电连接接口可以通过注塑成型等方式形成于外壳11，以提升外壳11在电连接接口处的密封性能。相比于线缆15穿设于外壳11的结构，这种设置可以避免线缆15在通孔处与外壳11产生相对位移而降低密封的可靠性。
上述数据处理设备10，由于可导热的外壳11设有收容腔111，算力板12设于收容腔111内并与外壳11固定连接，算力板12在工作过程中产生的热量能够传导至外壳11，外壳11可以部分或全部浸入于冷却液例如水中以进行液冷散热。以水冷散热为例，由于外壳11将算力板12与冷却水隔离，相比于水冷板散热的方案，这种方式可以降低对水质的要求，无需采用去离子水以防止产生水垢而影响散热性能。由于冷却水位于外壳11的外部，不是在密闭的管路或者水冷板内流动，因此本公开的数据处理设备10对冷却水的水质要求不高，且可以避免出现管路堵塞等问题。上述数据处理设备10，同样可以避免在外围设置复杂的水循环管路，因而可以简化数据处理设备的散热系统的布置，并避免散热系统对空间的浪费以提升设备的空间利用率。例如，上述数据处理设备10可以全部或者部分浸没于冷却池或冷却箱中。当然，冷却池或者冷却箱可以外接管道以不断注入温度相对较低的冷却液，并将升温后的冷却液不断排出以提升整个散热系统的散热效率。又如，上述数据处理设备10可以全部或者部分浸没于江河湖泊中，从而可以简化散热系统的建设，节省数据处理器的散热系统的成本。
继续参阅图1，在一些实施方式中，算力板12贴合于外壳11的内表面，这种设置可以增大算力板12与外壳11的接触面积，以提升外壳11与算力板12之间的热交换效率，进而提升数据处理设备10的散热性能。进一步，参阅图3，在一些实施方式中，算力板12经散热层113贴合于外壳11内表面，散热层113可以视为外壳11的一部分。散热层113可以进一步提升算力板12与外壳11之间的热交换效率，进而提升数据处理设备10的散热性能。在一些实施例中，散热层113为导热硅脂层，导热硅脂层能够提升算力板12 与外壳11之间的热传导速度，进而提升热交换效率。在另一些实施方式中，散热层113为石墨层，石墨层同样可以提升算力板12与外壳11之间的热交换效率，进而提升数据处理设备10的散热性能。在其他实施方式中，散热层113还可以为导热硅胶垫，导热硅胶垫同样可以提升数据处理设备10的散热性能。
继续参阅图1，在一些实施方式中，控制板13贴合于外壳11的内表面，这种设置可以增大控制板13与外壳11的接触面积，以提升外壳11与控制板13之间的热交换效率，进而提升数据处理设备10的散热性能。进一步，参阅图3，在一些实施方式中，控制板13经散热层113贴合于外壳11内表面，散热层113可以视为外壳11的一部分，散热层113可以进一步提升控制板13与外壳11之间的热交换效率，进而提升数据处理设备10的散热性能。在一些实施例中，散热层113可以导热硅脂层、石墨层或者导热硅胶垫中的至少一者，此处不再赘述。
参阅图1，在一些实施方式中，电源模块14贴合于外壳11的内表面，这种设置可以增大电源模块14与外壳11的接触面积，以提升外壳11与电源模块14之间的热交换效率，进而提升数据处理设备10的散热性能。进一步，参阅图3，在一些实施方式中，电源模块14经散热层113贴合于外壳11内表面，散热层113可以视为外壳11的一部分，散热层113可以进一步提升电源模块14与外壳11之间的热交换效率，进而提升数据处理设备10的散热性能。在一些实施例中，散热层113可以是导热硅脂层、石墨层或者导热硅胶垫中的至少一者，此处不再赘述。
当然，可以理解的是，电源模块14不是必须设于外壳11内。例如，电源模块14可以外置于数据处理设备10，并能够在外接电源时通过线缆15为算力板12、控制板13供电即可。这种实施方式的数据处理设备10可以节省电源模块14在外壳11内的占用空间，从而提升数据处理设备10的结构紧凑性。作为一种可实施方式，可以将两个以上缺省电源模块14的数据处理设备10分别通过线缆15外接统一的电源管理平台，并通过电源管理平台对多个数据处理设备10的供电进行管理，以提升设备的结构紧凑性，并提升电源管理的便利性。
同样可以理解的是，控制板13不是必须设于外壳11内，例如控制板13可以外置于数据处理设备10，并能够通过线缆15与算力板12通信连接即可。这种实施方式的数据处理设备10可以节省控制板13在外壳11内的占用空间，从而提升数据处理设备10的结构紧凑性。作为一种可实施方式，可以将两个以上缺省控制板13的数据处理设备10分别通过线缆15外接统一的控制平台，并通过控制平台分别对多个数据处理设备10的工作进行 控制，以提升设备的结构紧凑性，并提升控制的便利性。
在一些实施方式中，外壳11大致呈矩形箱状，参阅图1，其可以包括相对设置的第一内侧壁11a、第二内侧壁11b和连接于第一内侧壁11a、第二内侧壁11b之间的周内侧壁11c，第一内侧壁11a、第二内侧壁11b和周内侧壁11c围合形成收容腔111。控制板13和电源模块14均设于第一内侧壁11a，算力板12设于第二内侧壁11b。在这种实施方式中，外壳11的长宽尺寸可以与算力板12的长宽尺寸相当，控制板13和电源模块14均可与算力板12相对设置，从而使得外壳11具有相对较小的长宽尺寸及较小的高度尺寸，进而提升数据处理设备10的结构紧凑性。上述实施方式还可以使得算力板12、控制板13、电源模块14与外壳11的内表面具有相对较大的接触面积，以提升数据处理设备10的散热性能。
参阅图4和图5，在其他实施方式中，收容腔111内可以设置两个以上的算力板12。本实施方式以设置两块算力板12为例，其中一块算力板12可以贴合并固定于第一内侧壁11a，另一块算力板12可以贴合并固定于第二内侧壁11b，且两块算力板12相对设置，控制板13和电源模块14设于周内侧壁11c。进一步，以矩形箱状的外壳11为例，控制板13和电源模块14可以分别设置于不同周内侧壁11c上，例如可以将控制板13和电源模块14分别设置于相对的两个周内侧壁11c上，或者将控制板13和电源模块14分别设置于相邻的两个周内侧壁11c上。在其他实施方式中，外壳11的周内侧壁11c的内表面同样可以设置其他算力板12，从而在单个数据处理设备10内设置多个算力板12，以提升单个数据处理设备10的总算力，也即使得单个数据处理设备10具备更强的性能。
当然，在其他实施方式中，外壳11可以为其他形状，例如外壳11可以为圆筒状，即外壳11的横截面为圆形。又如，外壳11的横截面可以为多边形例如五边形、六边形或者异形的。再如，外壳11的形状可以为圆锥台状或者梯台状，此处不再赘述。
参阅图6，在一些实施方式中，外壳11的背向收容腔111的一侧设有多个间隔设置的散热片11d，散热片11d的材质可以和外壳11的材质相同并可以与外壳11一体成型。散热片11d间具有多个间隔设置的散热槽115，散热片11d可以提供相对较大的散热面积，外壳11的热量可以通过散热片11d散发至外部环境，从而提升数据处理设备10的散热性能。在外壳11呈矩形箱状的实施方式中，外壳11的第一内侧壁11a、第二内侧壁11b和周内侧壁11c均可以设置散热片11d，且散热片11d可以分布于外壳11的整个外表面，以进一步提升数据处理设备10的散热性能。当然，在另一些实施方式中，第一内侧壁11a、第二内侧壁11b和周内侧壁11c中的一些位置设置散热片11d即可。可以理解的是，在其 他实施方式中，散热片11d与外壳11的材质可以不同，散热片11d可以独立加工成型并组装于外壳11上。例如，外壳11的材质可以为铝合金，散热片11d的材质为铜合金，多个散热片11d一体成型后，可采用焊接、粘接或者螺纹连接等方式固定连接于外壳11的外表面，这种结构同样能够提升数据处理设备10的散热性能。
参阅图7，在另一些实施方式中，外壳11的背向收容腔111的一侧可以覆盖有散热陶瓷涂层16。散热陶瓷涂层16可以提升辐射散热的效率，例如，散热陶瓷涂层16能够以8微米～13.5微米的红外波长向外界辐射热量，以降低外壳11的表面及内部的温度，因而能够显著地提升外壳11的散热效率，降低外壳11的温升。散热陶瓷涂层16还具有不受周围介质影响等优点，因而能够使得数据处理设备10适用于更多的液冷散热环境。进一步，散热陶瓷涂层16的设置可以进一步提升数据处理设备10的表面性能，例如其可以提升数据处理设备10的表面结构强度，提升其表面的抗腐蚀性能、耐磨性能等。
参阅图8，本发明还公开了一种数据处理系统20，数据处理系统20包括控制台21和以上实施例中的数据处理设备10，数据处理设备10可以配置为多个，例如每一数据处理系统20可以配置2个以上的数据处理设备10，多个数据处理设备10分别与控制台21电连接。每一数据处理设备10可以通过线缆15电连接至控制台21，控制台21可以为各个数据处理设备10提供电能。控制台21也可以通过线缆15与数据处理设备10通信，以统一控制或者分别独立控制各个数据处理设备10的工作状态。进一步，全部数据处理设备10可以浸没于冷却池或者冷却箱或者江河湖泊内，以同时对多个数据处理设备10进行液冷散热，从而提升数据处理系统20的散热性能。本申请的数据处理设备，例如可以是虚拟货币挖矿机。
以上所述实施例的各技术特征可以进行任意的组合，为使描述简洁，未对上述实施例中的各个技术特征所有可能的组合都进行描述，然而，只要这些技术特征的组合不存在矛盾，都应当认为是本说明书记载的范围。
以上所述实施例仅表达了本发明的几种实施方式，其描述较为具体和详细，但并不能因此而理解为对发明专利范围的限制。应当指出的是，对于本领域的普通技术人员来说，在不脱离本发明构思的前提下，还可以做出若干变形和改进，这些都属于本发明的保护范围。因此，本发明专利的保护范围应以所附权利要求为准。

Claims (9)

  1. 一种数据处理设备，其特征在于，包括：
    外壳，可导热且围成一密封的收容腔；
    算力板，设于所述收容腔内并与所述外壳固定连接；
    控制板，通信连接于所述算力板；
    电源模块，电连接于所述算力板。
  2. 根据权利要求1所述的数据处理设备，其特征在于，所述算力板、所述控制板和所述电源模块中至少一个贴合于所述外壳的内表面。
  3. 根据权利要求1所述的数据处理设备，其特征在于，所述外壳包括相对设置的第一内侧壁、第二内侧壁和连接于所述第一内侧壁、所述第二内侧壁之间的周内侧壁，所述第一内侧壁、所述第二内侧壁和所述周内侧壁围成所述收容腔；所述控制板和所述电源模块均设于所述第一内侧壁，所述算力板设于所述第二内侧壁。
  4. 根据权利要求1所述的数据处理设备，其特征在于，所述外壳包括相对设置的第一内侧壁、第二内侧壁和连接于所述第一内侧壁、所述第二内侧壁之间的周内侧壁，所述第一内侧壁、所述第二内侧壁和所述周内侧壁围合形成所述收容腔；所述第一内侧壁和所述第二内侧壁均设有所述算力板，所述控制板和所述电源模块设于所述周内侧壁。
  5. 根据权利要求1所述的数据处理设备，其特征在于，所述外壳开设有通孔，所述通孔用于穿设线缆，所述线缆电性连接于所述电源模块，所述线缆与所述外壳密封连接。
  6. 根据权利要求1-5任一项所述的数据处理设备，其特征在于，所述外壳的背向所述收容腔的一侧设有多个间隔设置的散热片；或者，所述外壳的背向所述收容腔的一侧覆盖有散热陶瓷涂层。
  7. 根据权利要求1所述的数据处理设备，其特征在于，所述算力板、所述控制板和所述电源模块中至少一个经散热层贴合于所述外壳的内表面，所述散热层包括石墨层、导热硅脂层、导热硅胶垫中的至少一个。
  8. 根据权利要求1所述的数据处理设备，其特征在于，所述算力板设置多个算力芯片组，每个所述算力芯片组包含多个算力芯片。
  9. 一种数据处理系统，其特征在于，包括控制台和权利要求1-8任一项所述的数据处理设备，所述数据处理设备配置为多个，多个所述数据处理设备分别与所述控制台电连接，所述控制台用于控制所述数据处理设备的工作状态。
PCT/CN2021/099701 2020-09-30 2021-06-11 数据处理设备及数据处理系统 WO2022068261A1 (zh)

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