WO2022062805A1 - 一种线圈组件、电子设备及无线充电器 - Google Patents

一种线圈组件、电子设备及无线充电器 Download PDF

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Publication number
WO2022062805A1
WO2022062805A1 PCT/CN2021/114333 CN2021114333W WO2022062805A1 WO 2022062805 A1 WO2022062805 A1 WO 2022062805A1 CN 2021114333 W CN2021114333 W CN 2021114333W WO 2022062805 A1 WO2022062805 A1 WO 2022062805A1
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WO
WIPO (PCT)
Prior art keywords
terminal
coil
coil winding
winding
terminals
Prior art date
Application number
PCT/CN2021/114333
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English (en)
French (fr)
Inventor
裴昌盛
张安乐
陈宇飞
Original Assignee
华为技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 华为技术有限公司 filed Critical 华为技术有限公司
Priority to EP21871178.6A priority Critical patent/EP4210075A4/en
Priority to US18/246,154 priority patent/US20230369893A1/en
Publication of WO2022062805A1 publication Critical patent/WO2022062805A1/zh

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    • HELECTRICITY
    • H02GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02JCIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
    • H02J50/00Circuit arrangements or systems for wireless supply or distribution of electric power
    • H02J50/10Circuit arrangements or systems for wireless supply or distribution of electric power using inductive coupling
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00Details of transformers or inductances, in general
    • H01F27/28Coils; Windings; Conductive connections
    • H01F27/2804Printed windings
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00Details of transformers or inductances, in general
    • H01F27/28Coils; Windings; Conductive connections
    • H01F27/2823Wires
    • H01F27/2828Construction of conductive connections, of leads
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00Details of transformers or inductances, in general
    • H01F27/28Coils; Windings; Conductive connections
    • H01F27/29Terminals; Tapping arrangements for signal inductances
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00Details of transformers or inductances, in general
    • H01F27/34Special means for preventing or reducing unwanted electric or magnetic effects, e.g. no-load losses, reactive currents, harmonics, oscillations, leakage fields
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00Details of transformers or inductances, in general
    • H01F27/34Special means for preventing or reducing unwanted electric or magnetic effects, e.g. no-load losses, reactive currents, harmonics, oscillations, leakage fields
    • H01F27/38Auxiliary core members; Auxiliary coils or windings
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F38/00Adaptations of transformers or inductances for specific applications or functions
    • H01F38/14Inductive couplings
    • HELECTRICITY
    • H02GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02JCIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
    • H02J50/00Circuit arrangements or systems for wireless supply or distribution of electric power
    • H02J50/005Mechanical details of housing or structure aiming to accommodate the power transfer means, e.g. mechanical integration of coils, antennas or transducers into emitting or receiving devices
    • HELECTRICITY
    • H02GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02JCIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
    • H02J50/00Circuit arrangements or systems for wireless supply or distribution of electric power
    • H02J50/10Circuit arrangements or systems for wireless supply or distribution of electric power using inductive coupling
    • H02J50/12Circuit arrangements or systems for wireless supply or distribution of electric power using inductive coupling of the resonant type
    • HELECTRICITY
    • H02GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02JCIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
    • H02J7/00Circuit arrangements for charging or depolarising batteries or for supplying loads from batteries
    • H02J7/0042Circuit arrangements for charging or depolarising batteries or for supplying loads from batteries characterised by the mechanical construction
    • HELECTRICITY
    • H02GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02JCIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
    • H02J7/00Circuit arrangements for charging or depolarising batteries or for supplying loads from batteries
    • H02J7/02Circuit arrangements for charging or depolarising batteries or for supplying loads from batteries for charging batteries from ac mains by converters
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00Details of transformers or inductances, in general
    • H01F27/28Coils; Windings; Conductive connections
    • H01F27/2804Printed windings
    • H01F2027/2809Printed windings on stacked layers
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00Details of transformers or inductances, in general
    • H01F27/34Special means for preventing or reducing unwanted electric or magnetic effects, e.g. no-load losses, reactive currents, harmonics, oscillations, leakage fields
    • H01F2027/348Preventing eddy currents
    • HELECTRICITY
    • H02GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02JCIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTING ELECTRIC POWER; SYSTEMS FOR STORING ELECTRIC ENERGY
    • H02J2207/00Indexing scheme relating to details of circuit arrangements for charging or depolarising batteries or for supplying loads from batteries
    • H02J2207/20Charging or discharging characterised by the power electronics converter

Definitions

  • the present application relates to the technical field of wireless charging, and in particular, to a coil assembly, an electronic device and a wireless charger.
  • the wireless charging technology there is no need to connect the electronic device and the wireless charger through a power cord, and the electronic device can be charged only by placing the electronic device on the wireless charger, which is convenient for the user to use.
  • the contact terminal for connecting the power cord can also be omitted from the electronic device, thereby improving the safety and waterproof and dustproof performance of the electronic device. Therefore, in recent years, the application of wireless charging technology to charge electronic devices has become highly regarded.
  • charging efficiency is a key parameter that affects user experience. Under the same input power, the higher the charging efficiency, the more power the charging adapter can output, so that fast charging of electronic devices such as mobile phones can be achieved to reduce charging. time to improve user experience.
  • the transmitting coil and the receiving coil are the key components used to complete the power transfer from wireless chargers to electronic devices such as mobile phones. Therefore, the coil coupling system is the core design of wireless charging, and the quality of the coil design seriously affects the efficiency of wireless charging, thereby affecting the user experience.
  • the present application provides a coil assembly, an electronic device and a wireless charger, so as to improve the charging efficiency between the electronic device and the wireless charger.
  • the present application provides a coil assembly including a winding unit including a first coil winding, a second coil winding and a circuit board.
  • the first coil winding has a first connection end and a first lead end, and the first lead end is used for connecting with an external circuit.
  • the first coil winding includes a plurality of first wire groups arranged side by side.
  • the second coil winding has a second connection end and a second lead end, and the second lead end is used for connecting with an external circuit;
  • the second coil winding includes a plurality of second wire groups, and the plurality of second wire groups are arranged side by side set up.
  • the circuit board can be used as a medium for connection between the first coil winding and the second coil winding, the circuit board includes a plurality of circuit layers and a plurality of first via holes, and a plurality of first terminals and multiple circuit layers are arranged on the plurality of circuit layers. a second terminal.
  • the first terminal and the second terminal are connected by wires, and among the plurality of wires used to connect the plurality of first terminals and the plurality of second terminals, at least two of them pass through the first via holes at the intersection area and are replaced to different ones. Line layer for crossover settings.
  • the part of the first wire group of the first coil winding located at the first connection end can be fixed to the first terminal; when the second coil winding is connected to the circuit board, the second wire group is located at the first terminal. A portion of the second connection end is fixed to the second terminal.
  • the at least two first wire groups and the at least two second wire groups are connected by crossing wires.
  • the coil assembly of the embodiment of the present application by connecting at least two first wire groups of the first coil winding with at least two second wire groups of the second coil winding through cross-arranged wires, current flows through the first coil
  • the magnetic fields formed when the winding and the second coil are wound are in opposite directions at the at least two first wire groups and the at least two second wire groups, so that the magnetic fluxes in the gaps of the at least two first wire groups and the The magnetic fluxes in the gaps of the at least two second wire groups cancel each other out, thereby reducing the generation of circulating currents in the coil gaps of the first coil winding and the second coil winding, thereby effectively reducing the additional heating of the coil windings, which is beneficial to improving the Power transfer efficiency of the coil assembly.
  • the number of the first wire group is the same as the number of the second wire group.
  • the first wire group and the second wire group may be connected in a one-to-one correspondence, but not limited to. In this way, all the first wire groups of the first coil winding and all the second wire groups of the second coil winding can be used for power transmission, which is beneficial to improve the power transmission efficiency of the coil winding.
  • the number of wires in the multiple first wire groups may be the same; or at least two of the multiple first wire groups may be The number of wires in one wire group is different.
  • the number of wires in the plurality of first wire groups can be different.
  • the number of wires in multiple second wire groups may be the same; or the number of wires in at least two second wire groups in the plurality of second wire groups may also be the same. Differently, by way of example, the number of wires in the plurality of second wire groups may be different.
  • the number of wires in the connected first wire group and the second wire group can also be the same, so that the connected first wire group and the second wire group can have the same number of wires.
  • Conductors can be used for the transmission of electrical energy to improve the transmission efficiency of electrical energy.
  • the number of wires in the connected first wire group and the second wire group may be different.
  • the number of first terminals is n
  • the number of second terminals is n
  • the number of traces includes n
  • the number of first vias includes n-1
  • the number of n The first terminals are arranged in the first direction
  • the n second terminals are arranged in the first direction.
  • the first terminals and the second terminals are connected by wiring, and in a plurality of the first terminals and the second terminals are connected In the wiring, at least two wirings are replaced by the first via holes in the crossing area to different circuit layers for cross setting, specifically: the first first terminal and the nth second terminal are connected by the first wiring, The second first terminal and the n-1th second terminal are connected by the second trace, and so on, the n-1th first terminal and the second second terminal are connected by the n-1th trace Connection, the nth first terminal and the first second terminal are connected through the nth trace; the second trace is replaced by the first via at the first position in the cross area to a different one from the first trace In the circuit layer, the n-1th trace passes through the first via at the n-2th position in the intersection area and is replaced to a circuit layer different from the first trace, and the nth trace passes through the n-1th trace in the intersection area.
  • the first via hole at the position is replaced to a circuit layer different from that of the first trace, wherein n is an integer greater than or equal to 2.
  • n is an integer greater than or equal to 2.
  • a plurality of wires used for a plurality of first terminals and a plurality of second terminals can be arranged to cross each other.
  • the corresponding first terminals and the second terminals are connected by wires, and when connecting a plurality of first terminals and a plurality of second terminals Among the multiple traces, at least two traces are replaced to different circuit layers in the intersection area through the first via hole for cross arrangement, specifically: along the first arrangement direction, the first first terminal and the sixth The two terminals are connected by the first wire, the second first terminal and the fifth second terminal are connected by the second wire, and the third first terminal and the fourth second terminal are connected by the third wire Connection, the fourth first terminal and the third second terminal are connected by a fourth wire, the fifth first terminal and the second second terminal are connected by a fifth wire, and the sixth first terminal Connect with the first second terminal through the sixth trace.
  • the second trace is replaced to a circuit layer different from that of the first trace through the first via at the first position in the intersection area
  • the third trace passes through the first via at the second position in the intersection area.
  • the hole is changed to a circuit layer different from the first trace
  • the fourth trace is replaced to a different circuit layer from the first trace through the first via hole at the third position in the intersection area
  • the fifth trace In the intersection area, the first via at the fourth position is replaced to a circuit layer different from that of the first trace
  • the sixth trace in the intersection area is replaced by the first via at the fifth position to the same layer as the first trace. Trace different circuit layers to avoid contact shorts between individual traces.
  • the arrangement of the circuit board can realize the magnetic flux in the gaps of the plurality of first wire groups Complete cancellation of the magnetic flux in the gaps of the plurality of second wire groups, thereby reducing the generation of circulating currents in the coil gaps of the first coil winding and the second coil winding.
  • the corresponding first terminals and the second terminals are connected by wires, and when connecting a plurality of first terminals and a plurality of second terminals Among the multiple traces, at least two traces in the intersection area are replaced by the first via holes to different circuit layers for cross arrangement, specifically: along the first arrangement direction, the first first terminal and the fifth The two terminals are connected by the first wire, the second first terminal and the first fourth terminal are connected by the second wire, and the third first terminal and the second second terminal are connected by the third wire For connection, the fourth first terminal and the third second terminal are connected by a fourth wire, and the fifth first terminal and the first second terminal are connected by a fifth wire.
  • the second trace is replaced to a circuit layer different from that of the first trace through the first via at the first position in the intersection area
  • the third trace passes through the first via at the second position in the intersection area.
  • the hole is changed to a circuit layer different from the first trace
  • the fourth trace is replaced to a different circuit layer from the first trace through the first via hole at the third position in the intersection area
  • the fifth trace In the intersection area, the first via hole at the fourth position is replaced to a circuit layer different from that of the first trace, so as to avoid contact short circuit between the traces.
  • the arrangement of the circuit board can realize the magnetic flux and Part of the cancellation of the magnetic flux in the gap of the second wire set, however, can also largely reduce the generation of circulating currents in the coil gaps of the first coil winding and the second coil winding.
  • the area enclosed by the projection of one of the traces on the first surface or the second surface of the circuit board may be close to the other trace.
  • the area enclosed by the projection of the first surface or the second surface of the circuit board is similar.
  • the direction of the magnetic flux in the area enclosed by the two traces is opposite, so that the magnetic flux of the two parts can be Cancel each other out.
  • the distance between each adjacent two wirings can be made equal, so as to avoid the influence on the magnetic flux of the coil assembly.
  • the spacing between the wires has little influence on the magnetic flux of the coil assembly. , at this time, at least two of the distances between any two adjacent traces may be different.
  • multiple traces can be wound on the surface of the circuit board, and the widths of the multiple traces are the same; or, the radius of the coil formed by the traces is proportional to the width of the traces .
  • a first pad may be correspondingly provided at each first terminal of the circuit board, and a second pad may be correspondingly provided at each second terminal.
  • the first wire group and the first terminal can be connected by welding, and the second wire group and the second terminal can be connected by welding, so that the connection is more convenient.
  • the first terminal and the second terminal may be disposed on the same surface of the circuit board, so as to realize the connection between the first coil winding and the second coil winding and the circuit board.
  • the first terminal can also be arranged on the first surface of the circuit board, and the second terminal can be arranged on the second surface of the circuit board, wherein the first surface is arranged opposite to the second surface, so as to facilitate the connection of the first The terminal and the second terminal are set.
  • a third pad may also be connected to the part of each first wire group located at the first connection end, so that the welding of the third pad and the first pad can be used to The electrical connection between the first wire group and the first terminal of the circuit board is realized, and the connection operation is more convenient.
  • a fourth pad may also be provided at the first lead-out end.
  • a fifth pad can also be connected to the part of each second wire group at the second connection end, so that the second wire group and the circuit can be realized by welding the fifth pad and the second pad.
  • the connection operation is simpler.
  • the second lead end can also be connected with a sixth pad, so as to facilitate the connection of the second coil winding and the external circuit.
  • the first coil winding is an independent coil winding structure
  • the second coil winding is an independent coil winding structure
  • the first connection end of the first coil winding extends along the first arrangement direction to form The first extension part
  • the second connection end of the second coil winding extends along the first arrangement direction to form a second extension part
  • the circuit board is provided with a slot, and the slot is arranged on the first surface or the first terminal of the circuit board.
  • the area between the projection on the two surfaces and the projection of the second terminal on the first surface or the second surface of the circuit board, and the slot is opened along the first arrangement direction; the first extension extends into the slot and the second surface.
  • a terminal is connected, the second extension portion extends into the slot and is connected to the second terminal, and the first extension portion and the second extension portion are stacked at the slot.
  • the first extension part of the first coil winding and the second extension part of the second coil winding can be opened at the opening of the circuit board.
  • the slots are stacked in layers. It can effectively avoid the stacking of the first coil winding, the second coil winding and the circuit board, thereby facilitating the realization of the thin design of the coil assembly.
  • the first coil winding is an independent coil winding structure; the second coil winding is formed on the first surface of the circuit board, the second coil winding is formed by winding a plurality of traces, and the second coil winding is formed by winding a plurality of traces.
  • the second connection end of the coil winding is used as the second terminal of the circuit board, and continues to be wound along the decreasing trend of the winding radius and crossed to form the first terminal.
  • the first connection end of the first coil winding is connected to the first terminal. electrical connection.
  • the first coil winding may be formed on the first surface of the circuit board, and the second coil winding may be formed on the second surface of the circuit board.
  • the part of the first wire winding at the first connection end can be connected to the second via hole at one position.
  • first terminal a portion of the second wire group of the second coil winding at the second connection end may be connected to the second terminal through a second via hole at another location.
  • the coil assembly may include a plurality of winding units, for example, two, three or four, etc.
  • the plurality of winding units are stacked on top of each other, and the first lead ends of the first coil windings of the plurality of coil units are connected for connection with an external circuit, and the lead ends of the second coil windings of the plurality of coil units are connected for It is connected with external circuit to realize parallel arrangement of multiple winding units.
  • the coil assembly may include a plurality of winding units, for example, two, three or four, etc.
  • the plurality of winding units are arranged in layers, and in two adjacent winding units, the second lead-out end of the second coil winding of one winding unit is in phase with the first lead-out end of the first coil winding of the other winding unit connection, so as to realize the series arrangement of multiple winding units.
  • the coil assembly of the embodiment of the present application may further include a magnetic conductive sheet in a possible implementation manner, and the material of the magnetic conductive sheet may be, but not limited to, ferrite, amorphous nanocrystalline , one or more of magnetic conductive materials such as metal powder core.
  • the coil unit is arranged on one side surface of the magnetic conductive sheet, and the coil unit is insulated from the magnetic conductive sheet. Since the magnetic conductive sheet can play the role of magnetic conductivity, it can improve the magnetic induction of the winding unit, and at the same time, it can also prevent the magnetic field from leaking to the other side of the magnetic conductive sheet, so that the side of the magnetic conductive sheet opposite to the winding unit is arranged. The space has a good shielding effect.
  • the electronic device includes a power receiving circuit, and the coil assembly of the first aspect.
  • the coil assembly can be electrically connected to a power receiving circuit in the electronic device, so as to convert electromagnetic energy into electrical energy for storage or use.
  • the magnetic flux in the coil gap of the first coil winding of each winding unit of the coil assembly and the magnetic flux in the coil gap of the second coil winding can cancel each other, it can reduce the Because of the generation of the circulating current in the coil gap of the winding unit, the heat generation of the coil winding is low, the power transmission efficiency thereof is improved, and the charging efficiency of the electronic device is improved.
  • the present application also provides a wireless charger, which includes a power supply circuit, and the coil assembly of the first aspect.
  • the coil assembly is used as the transmitting coil of the wireless charger to be electrically connected with the power supply circuit, so as to convert electrical energy into electromagnetic energy for wireless transmission.
  • the wireless charger of the embodiment of the present application since the magnetic flux in the coil gap of the first coil winding of each winding unit of the coil assembly and the magnetic flux in the coil gap of the second coil winding can cancel each other, it can The generation of the circulating current in the coil gap of the winding unit is reduced, so the heat generation of the coil assembly is lower, the power transmission efficiency thereof is improved, and the charging efficiency of the wireless charger is improved.
  • the wireless charging system includes an electronic device and a wireless charger. Wherein, at least one of the electronic device and the wireless charger includes the coil assembly of the first aspect, the electronic device is arranged in contact with the wireless charger, and the wireless charger charges the electronic device.
  • the heating of the coil assembly of at least one of the wireless charger and the electronic device is relatively low, and the power transmission efficiency between the two is relatively high, so the charging efficiency of the wireless charging system can be effectively improved, thereby It is beneficial to improve the user experience.
  • FIG. 1 is a schematic structural diagram of a wireless charging system according to an embodiment of the present application
  • FIG. 2 is a schematic structural diagram of a wireless charger provided by an embodiment of the present application.
  • FIG. 3 is a schematic structural diagram of an electronic device provided by an embodiment of the present application.
  • Figure 4 is a schematic diagram of the generation principle of eddy current loss
  • FIG. 5 is a schematic structural diagram of a coil assembly provided by an embodiment of the application.
  • FIG. 6 is a schematic structural diagram of a first coil winding of a coil assembly provided by an embodiment of the application.
  • FIG. 7 is an enlarged view of the partial structure at A of the first coil winding in FIG. 6;
  • FIG. 8 is a schematic structural diagram of a second coil winding of a coil assembly provided by an embodiment of the application.
  • 9a is a schematic structural diagram of a first surface of a circuit board of a coil assembly according to an embodiment of the present application.
  • 9b is a schematic structural diagram of a second surface of a circuit board of a coil assembly according to an embodiment of the present application.
  • FIG. 10 is a schematic diagram of a magnetic flux cancellation principle of a coil assembly provided by an embodiment of the application.
  • FIG. 11 is a schematic structural diagram of a coil assembly provided by another embodiment of the present application.
  • 12a is a schematic structural diagram of a first surface of a circuit board of a coil assembly according to another embodiment of the present application.
  • 12b is a schematic structural diagram of a second surface of a circuit board of a coil assembly according to another embodiment of the present application.
  • FIG. 13 is a schematic structural diagram of a first surface of a circuit board of a coil assembly according to another embodiment of the present application.
  • FIG. 14 is a schematic structural diagram of a coil assembly provided by another embodiment of the present application.
  • 15 is a schematic diagram of a magnetic flux cancellation principle of a coil assembly provided by another embodiment of the present application.
  • 16 is a schematic diagram of a magnetic flux cancellation principle of a coil assembly provided by another embodiment of the present application.
  • FIG. 17 is a schematic structural diagram of a coil assembly provided by another embodiment of the present application.
  • 18a is a schematic structural diagram of a first coil winding of a coil assembly provided by another embodiment of the present application.
  • 18b is a schematic structural diagram of a second coil winding of a coil assembly provided by another embodiment of the present application.
  • Fig. 19a is an enlarged view of a part of the structure at E of the first coil winding in Fig. 18a;
  • Fig. 19b is an enlarged view of the partial structure at F of the second coil winding in Fig. 18b;
  • 20a is a schematic structural diagram of a first surface of a circuit board of a coil assembly according to another embodiment of the present application.
  • 20b is a schematic structural diagram of a second surface of a circuit board of a coil assembly according to another embodiment of the present application.
  • 21 is a schematic structural diagram of a coil assembly provided by another embodiment of the present application.
  • FIG. 22 is a schematic structural diagram of a first coil winding of a coil assembly provided by another embodiment of the present application.
  • 23a is a schematic structural diagram of a second surface of a circuit board of a coil assembly provided by another embodiment of the present application.
  • 23b is a schematic structural diagram of a second surface of a circuit board of a coil assembly according to another embodiment of the present application.
  • FIG. 24 is a schematic structural diagram of a coil assembly provided by another embodiment of the present application.
  • 25 is a schematic structural diagram of a first coil winding of a coil assembly provided by another embodiment of the present application.
  • 26 is a schematic structural diagram of a second coil winding of a coil assembly provided by another embodiment of the present application.
  • 27a is a schematic structural diagram of a second surface of a circuit board of a coil assembly according to another embodiment of the present application.
  • FIG. 27b is a schematic structural diagram of a second surface of a circuit board of a coil assembly according to another embodiment of the present application.
  • wireless charging technology is more and more widely used in consumer electronic products. Compared with the traditional cable plug-in power transmission technology, the wireless charging technology is safer, more convenient and more reliable because there is no cable connection between the power supply and the load in the process of wireless power transmission.
  • the methods used by wireless charging technology to realize wireless energy transmission include electromagnetic radiation, electromagnetic induction, electromagnetic resonance and electric field coupling. Based on the consideration of efficiency and safety, the wireless charging products on the market usually adopt the electromagnetic induction wireless energy transmission method.
  • FIG. 1 shows the composition of a wireless charger 2 and an electronic device 3 .
  • wireless charging system the wireless charger 2 is used as a power supply device, and the electronic device 3 is used as a power receiving device.
  • the electronic device can be, for example, a mobile phone, a wearable device (smart watch, smart bracelet or smart glasses, etc.), a tablet computer, and the like.
  • the wireless charger 2 is connected to the power source, and is used for sending the energy of the power source to the electronic device 3 to be charged in the form of electromagnetic waves; the electronic device 3 to be charged is in contact with the wireless charger 2 for receiving the electromagnetic wave, And through the energy carried by the electromagnetic wave to charge itself.
  • FIG. 2 provides a schematic structural diagram of a wireless charger 2 provided with the coil assembly 1 of the present application.
  • the wireless charger 2 may further include a power supply circuit 21 .
  • the coil assembly 1 is used as the transmitting coil of the wireless charger 2 to be electrically connected with the power supply circuit 21 in the power supply device, so as to convert electrical energy into electromagnetic energy for wireless transmission.
  • the power supply circuit 21 of the wireless charger 2 may include a direct current/alternating current (DC/AC) conversion module 212 , a matching circuit 213 and a control unit 214 .
  • DC/AC conversion module 212 when the wireless charger 2 supplies power to the powered device, the DC/AC conversion module 212 is connected to the DC power source 211 and converts the DC power source 211 into an AC signal, which flows through the matching circuit 213 and transmits it to the coil assembly 1 , the coil assembly 1 converts electrical energy into electromagnetic energy for wireless transmission.
  • the control unit 214 can control the operation of the power supply circuit 21 .
  • the coil assembly 1 is disposed in a power receiving device, and the power receiving device may be, for example, an electronic device such as a mobile phone, a smart watch, or a tablet computer.
  • the coil assembly 1 as a receiving coil of a power receiving device can be electrically connected to a power receiving circuit 31 in the power receiving device to convert electromagnetic energy into electrical energy for storage or use.
  • the power receiving circuit 31 may include a matching circuit 311 , an alternating current/direct current (AC/DC) conversion module 312 , a control unit 313 and a load 314 .
  • the coil assembly 1 can convert the received AC signal into electrical energy, and the electrical energy is transmitted to the AC/DC conversion module 312 through the matching circuit 311 , and the AC/DC conversion module 312 converts the received AC signal into a DC signal for storage or as a load 314 powered by.
  • the control unit 313 can control the operation of the power receiving circuit 31 .
  • the electromagnetic induction wireless charging technology is mainly based on the principle of magnetic coupling between the transmitting coil and the receiving coil for energy transmission, there is a strong alternating magnetic field between the transmitting coil and the receiving coil.
  • eddy current will be induced to cause eddy current loss, and the magnitude of the eddy current is proportional to the area of the metal coil. Therefore, the larger the area of the metal coil, the greater its eddy current loss under the same magnetic field, and if the transmitting coil or the receiving coil has a large eddy current loss, it will lead to lower wireless charging efficiency.
  • the embodiments of the present application provide a coil assembly to reduce its eddy current loss and improve its charging efficiency.
  • the coil assembly 1 of the embodiment of the present application may include a magnetic conductive sheet 11 and a winding unit 12 .
  • the winding unit 12 is disposed on one side surface of the magnetic conductive sheet 11 , and the winding unit 12 is insulated from the magnetic conductive sheet 11 . Since the magnetic conductive sheet 11 can play the role of magnetic conductivity, it can increase the magnetic induction of the winding unit 12, and at the same time, it can also prevent the magnetic field from leaking to the other side of the magnetic conductive sheet 11, so that the magnetic conductive sheet 11 is connected with the winding unit. 12 The space on the opposite side plays a good shielding effect.
  • the magnetic conductive sheet 11 may be made of a magnetic conductive material, for example, a ferrite, an amorphous nanocrystal, a metal powder core, and the like.
  • the winding unit 12 may include a first coil winding 121 , a second coil winding 122 and a circuit board 123 .
  • the number of turns of the first coil winding 121 may be the same as or different from the number of turns of the second coil winding 122 .
  • the area of the first coil winding 121 and the second coil winding 122 can be made the same, and the first coil winding 121 and the second coil winding 122 can be stacked. It can be understood that, in some embodiments of the present application, the first coil winding 121 and the second coil winding 122 may also be arranged in the opposite direction, or may be slightly misaligned.
  • the first coil winding 121 may be a multi-turn coil structure wound by a plurality of wires 1215 .
  • the wires 1215 may be metal wires, for example, and the first The coil winding 121 can be a planar structure formed by spiral winding (a plurality of wires 1215 are arranged side by side and are wound in the direction of increasing winding radius), and its shape can be, but not limited to, a circle, an ellipse, or polygons, etc.
  • the cross-sectional shape of the wire 1215 can be, but not limited to, a rectangle, a circle or an ellipse, and the surface of the wire 1215 is coated with an insulating paint film, or covered with an insulating material layer, etc., so that the first coil winding 121 Each of the two adjacent wires 1215 is insulated to avoid short circuit between the wires 1215 .
  • the starting end of the winding is called the connection end of the multi-turn coil structure
  • the ending end of the winding is called the multi-turn coil structure.
  • the terminal of the turn coil structure In other embodiments of the present application, the starting end of the winding of the multi-turn coil structure may also be referred to as its lead-out end, and the winding end end of the multi-turn coil structure may be referred to as the connection end of the multi-turn coil structure.
  • the two ends of the turn coil structure are distinguished. Referring to FIG.
  • the end of the first coil winding 121 disposed on the inner side is referred to as the first connection end 1211
  • the end located on the outer side thereof is referred to as the first lead-out end 1212 as an example. illustrate.
  • the width of the wire 1215 used to form the first coil winding 121 is small, then the width of the wire 1215 in the first coil winding 121
  • the number of wires 1215 is large.
  • the plurality of wires 1215 of the first coil winding 121 can be divided into a plurality of first wire groups, and each first wire group includes at least one wire 1215, for example
  • the first wire group may include two wires 1215 .
  • the number of wires 1215 in each first wire group may be the same or different.
  • the portion of each first wire group located at the first connection end 1211 of the first coil winding 121 may be fixedly connected to a pad 1213 . Since the total width of the wires 1215 fixed to each pad 1213 is smaller, the magnetic flux is smaller, and the eddy current loss formed by it is smaller. However, due to the limitation of the number of pads 1213, it is sometimes necessary for multiple wires 1215 to share one pad 1213, which will increase the total width of the wires 1215 connected to each pad 1213. The wires 1215 of the disk 1213 are as close as possible to reduce eddy currents.
  • first lead end 1212 of the first coil winding 121 can be connected to an external circuit.
  • it can be fixed to the pad 1214, so that the first coil winding 121 is connected to the external circuit by soldering the pad, which can effectively simplify the first coil winding 121 and the connection between the external circuit, and make the connection more reliable.
  • the second coil winding 122 when the second coil winding 122 is specifically arranged, the second coil winding 122 may also be a multi-turn coil structure wound by a plurality of wires 1225 .
  • the second coil winding 122 may be a planar structure formed by spiral winding, and its shape may be, but not limited to, a circle, an ellipse, or a polygon.
  • the cross-sectional shape of the wire 1225 can be, but not limited to, a rectangle, a circle, or an ellipse, etc.
  • the surface of the wire 1225 is coated with an insulating paint film, or covered with an insulating material layer, so that the second coil winding 122 has a Insulation is provided between every two adjacent wires 1225, so as to avoid a short circuit between the wires 1225.
  • the end of the second coil winding 122 located inside the multi-turn coil structure is referred to as the second connection end 1221
  • the end located outside the multi-turn coil structure is referred to as the second lead-out end 1222 Take an example to illustrate.
  • the plurality of wires 1225 of the second coil winding 122 can also be divided into at least two second wire groups at the second connection end 1221 thereof, each second wire group includes at least one turn of coil, and each second wire group The number of the middle wires 1225 can be the same or different.
  • Each of the second wire groups can be fixedly connected to a pad 1223, and the second lead-out end 1222 of the second coil winding 122 is connected to an external circuit. When connecting the second terminal 1222 to the external circuit, it can be fixed to the pad 1224, so that the first coil winding 121 is connected to the external circuit by soldering the pad, which can effectively simplify the second coil winding 122 and the connection between the external circuit, and make the connection more reliable.
  • the first connection end 1211 of the first coil winding 121 may be electrically connected to the second connection end 1221 of the second coil winding 122 .
  • the number of groups of the plurality of wires 1215 of the first coil winding 121 may be the same as The number of groups of the plurality of wires 1225 of the second coil winding 122 is the same, and the number of groups of the plurality of wires 1215 of the first coil winding 121 may be different from the number of groups of the plurality of wires 1225 of the second coil winding 122 .
  • the multiple wires 1215 of the first coil winding 121 and the multiple wires 1225 of the second coil winding 122 can all be connected to each other. connect. In other embodiments, the number of the wires of the first wire group and the second wire group to be connected may be different.
  • the first connection end 1211 of the first coil winding 121 is connected to the second connection end 1221 of the second coil winding 122
  • the first lead-out end 1212 of the first coil winding 121 It can be used as an input end to be connected to an external circuit
  • the second lead end 1222 of the second coil winding 122 can be used as an output end to be connected to an external circuit; or, the first lead end 1212 of the first coil winding 121 can be used as an output end to be connected to an external circuit
  • the second lead terminal 1222 of the second coil winding 122 can be used as an input terminal to be connected to an external circuit.
  • the circuit board 123 of the coil assembly 1 in the embodiment of the present application may be, but is not limited to, a printed circuit board (printed circuit board, PCB) or a flexible printed circuit (flexible printed circuit, FPC).
  • the circuit board 123 can be used as a medium for connection between the first coil winding 121 and the second coil winding 122 .
  • the circuit board 123 When the circuit board 123 is specifically arranged, the circuit board 123 includes a plurality of circuit layers, and the circuit board 123 can be stacked with the first coil winding 121 and the second coil winding 122 . In addition, when the hole in the middle of the first coil winding 121 and the second coil winding 122 is large enough, the circuit board 123 may be disposed in the region of the hole in the middle of the first coil winding 121 and the second coil winding 122 .
  • a plurality of first terminals are provided on the circuit board 123. Referring to FIG. 9a, each of the first terminals may be provided with a pad 1231. In addition, referring to FIG.
  • the circuit board 123 is further provided with a plurality of second terminals, and each of the second terminals may be provided with one or more pads 1232.
  • 9a is a schematic view of the structure of the first surface of the circuit board
  • FIG. 9b is a schematic view of the structure of the second surface of the circuit board.
  • the first surface and the second surface may be opposite surfaces of the circuit board.
  • the pads 1231 and the pads 1232 may be connected by wires 1233 .
  • each first wire group of the first coil winding 121 can be matched with the One of the pads 1231 shown in Figure 9a is connected, and each second wire set of the second coil winding 122 is connected to one of the pads 1232 shown in Figure 9b. It can be understood that, in the embodiment of the present application, after each first wire group of the first coil winding 121 is connected to a pad 1231, it can be connected to the second coil through the pad 1232 connected to the pad 1231. A second wire group of the winding 122 to realize the connection between the first coil winding 121 and the second coil winding 122 .
  • each pad 1213 can be soldered to a pad 1231, and each pad 1223 of the second connection end 1221 of the second coil winding 122 can be soldered to a pad 1232, so that there are It is beneficial to simplify the connection process between the first coil winding 121 , the second coil winding 122 and the circuit board 123 , thereby helping to improve the production efficiency of the coil assembly 1 .
  • a dislocation connected structure is formed between the wire groups.
  • the dislocation connection between the wire groups of the two coil windings refers to: in the first arrangement direction, the first wire group of the first coil winding 121 located at the first position is connected to the second coil winding 122 located at the second position.
  • the first arrangement direction refers to one arrangement direction when a plurality of wires are arranged side by side. It can be understood that, when a plurality of first wire groups and a plurality of second wire groups are cross-connected, at least two of the connecting wires for connecting the plurality of first wire groups and the plurality of second wire groups are arranged in a cross.
  • the plurality of wires 1215 of the first coil winding 121 may be coiled It is divided into 6 first wire groups, and the plurality of wires 1225 of the second coil winding 122 are divided into 6 second wire groups as an example for description.
  • the plurality of wires 1215 of the first coil winding 121 are divided into 6 first wire groups as shown in The portion of the wire group located at the first connection end 1211 is connected to a pad 1213.
  • the plurality of pads 1213 are sequentially marked as L11, L12, L13, L14, L15 and L16 according to the first arrangement direction.
  • the plurality of wires 1225 of the second coil winding 122 are divided into 6 second wire groups as shown in FIG. 8 in the first arrangement, and the part of each second wire group located at the second connection end 1221 Connected to one pad 1223, the plurality of pads 1223 are sequentially marked as L41, L42, L43, L44, L45 and L46 according to the first arrangement direction.
  • the pad 1213 marked L11 is connected to the pad 1223 marked L46
  • the pad 1213 marked L12 is connected to the pad 1223 marked L45
  • the pad 1213 marked L13 is connected to the pad 1223 marked L44 Connections
  • pad 1213 marked L14 is connected to pad 1223 marked L43
  • pad 1213 marked L15 is connected to pad 1223 marked L42
  • pad 1213 marked L16 is connected to pad marked L41 1223 connections.
  • the plurality of connecting wires for connecting the plurality of second wire groups and the plurality of first wire groups are arranged to cross each other, so that the magnetic flux in the gaps of the plurality of first wire groups can be changed.
  • the magnetic fluxes in the gaps of the plurality of second wire groups cancel each other out, so as to reduce the generation of circulating currents in the coil gaps of the two coil windings, thereby effectively reducing the extra heat generation of the coil windings.
  • the above-mentioned corresponding connection relationship between the plurality of pads 1213 and the plurality of pads 1223 is only an exemplary description of the present application.
  • the corresponding connection relationship between the plurality of pads 1213 and the plurality of pads 1223 may also be different from the above-mentioned embodiments, as long as at least two first wire groups of the first coil winding 121 can be connected to The dislocation between at least two second wire groups of the second coil winding 122 may be connected.
  • a plurality of pads 1231 can be arranged on the first surface of the circuit board 123;
  • each pad 1231 and each pad 1232 can be connected by one trace 1233, so that at least two of the plurality of traces 1233 can be connected to the circuit shown in FIG. 9a or 9b
  • the crossover regions Q of the board 123 are crossed through the vias 1234 at different positions of the circuit layer of the circuit board 123 respectively when the layers are changed, so as to realize the dislocation connection of the pads 1231 and 1232 .
  • the shape of the via hole 1234 may be, but not limited to, a strip shape, a circular arc hole, a wave-shaped hole, a comb-shaped hole, or the like.
  • n first terminals can be arranged along the first direction
  • n second terminals can be arranged along the first direction
  • the first terminals and the second terminals are connected by wiring, and when connecting a plurality of first terminals and a plurality of first terminals Among the multiple traces of two terminals, at least two traces are replaced in the intersection area Q through vias to different circuit layers for cross arrangement, specifically: the first first terminal and the nth second terminal pass through the first Trace connection, the second first terminal and the n-1th second terminal are connected through the second trace, and so on, the n-1th first terminal and the second second terminal are connected through the n-th One trace is connected, and the nth first terminal and the first second terminal are connected through the nth trace.
  • the second trace in the intersection area Q passes through the via at the first position and is replaced to a circuit layer different from the first trace
  • the n-1th trace passes through the n-2th position in the intersection area Q.
  • the via hole of 1 is replaced to a circuit layer different from that of the first trace
  • the nth trace is replaced to a different circuit layer from the first trace through the first via hole at the n-1th position in the intersection area Q,
  • n is an integer greater than or equal to 2.
  • the first There are six terminals, six second terminals, each first terminal is connected to one pad 1231, and each second terminal is connected to one pad 1232 as an example to illustrate.
  • the six traces 1233 for connecting the six pads 1231 and the six pads 1232 are sequentially marked as L21, L22, L23, L24, L25, L26 along the first arrangement direction, and the first pad 1231 and the sixth pad 1232 are connected by trace 1233 marked L21, the second pad 1231 and the fifth pad 1232 are connected by trace 1233 marked L22, and the third pad 1231 is connected to the fourth
  • the first pad 1232 is connected by the trace 1233 marked L23
  • the fourth pad 1231 is connected to the third pad 1232 by the trace 1233 marked L24
  • the fifth pad 1231 is connected to the second pad 1232
  • the sixth pad 1231 is connected to the first pad 1232 by the trace 1233 marked L26.
  • the trace 1233 marked as L21 has not changed layers in the intersection area Q.
  • the trace 1233 marked as L22 in the intersection area Q is replaced by the via hole 1234a at the first position to the same mark
  • the trace 1233 marked as L21 is a different circuit layer
  • the trace 1233 marked as L23 passes through the via hole 1234b at the second position in the intersection area Q and is replaced to a circuit layer different from the trace 1233 marked as L21
  • the trace marked as L24 The trace 1233 passes through the via hole 1234c at the third position in the intersection area Q and is replaced to a circuit layer different from the trace 1233 marked L21
  • the trace 1233 marked L25 passes through the via hole at the fourth position in the intersection area Q 1234d is replaced to a circuit layer different from the trace 1233 marked L21
  • the trace 1233 marked L26 is replaced to a circuit layer different from the trace 1233 marked L21 through the via hole 1234e at the fifth position in the intersection area Q , so
  • the multiple traces 1233 in FIG. 9a can be electrically connected to traces at corresponding positions on the circuit layer shown in FIG. 9b after the layers are changed at the corresponding via holes.
  • the above-mentioned way of changing the layers of the wirings 1233 is only an exemplary description given by an embodiment of the present application.
  • the wirings 1233 can also pass through the steps shown in FIG. 9a and FIG. 9b.
  • the vias 1235 located at multiple positions in the intersection area Q and arranged along the first arrangement direction, or the vias 1236 at multiple positions arranged along the first arrangement direction are layered or connected with the circuit board 123.
  • the traces on other layer structures are electrically connected.
  • the traces 1233 for connecting the pads 1231 and the pads 1232 can also be wound in a ring shape on the first surface and the second surface of the circuit board 123 .
  • the area enclosed by the projection of one trace 1233 on the first surface or the second surface of the circuit board 123 can be separated from the area enclosed by the projection of the other trace 1233 on the first surface of the circuit board 123 . or the area enclosed by the projection of the second surface is similar.
  • the areas of the two are similar means that the areas of the two are similar or that the difference between the areas of the two is less than an area threshold, and the area threshold is a smaller value.
  • the first coil winding 121 when the first coil winding 121 and the second coil winding 122 are respectively connected to the circuit board 123 , the first coil winding 121 can be The plurality of pads 1213 of the second coil winding 122 are welded to the same number of pads 1231 in one-to-one correspondence, and the plurality of pads 1223 of the second coil winding 122 are welded to the same number of pads 1232 in one-to-one correspondence. It can be understood that, after a pad 1213 of the first coil winding 121 is connected to a pad 1231 , it can be connected to a pad 1223 of the second coil winding 122 through a pad 1232 .
  • the pads 1213 of the first coil winding 121 and the pads 1223 of the second coil winding 122 can be connected to the circuit board 123 .
  • the number of the pads 1231 and the pads 1232 are the same, and the arrangement direction is the same.
  • the principle of gap magnetic flux cancellation between the first coil winding 121 and the second coil winding 122 is that the winding unit including the first coil winding 121 , the second coil winding 122 and the circuit board 123 has four inductance structures, which are A plurality of first wire groups (respectively denoted by L11, . Indicated by L21, . A second wire group (represented by L41, . . . , L4n respectively).
  • At least two of the plurality of traces 1233 on the circuit board 123 for connecting the pads 1231 and the pads 1232 are in a cross-arranged structure, for example, the trace L21 is connected to the trace On L3n, the wiring L2n is connected to the wiring L31 so as to form a two-by-two structure.
  • the first wire group L11 and the wire L21 can be connected in series, and the wire L31 and the second wire group L11 can be connected in series.
  • the first wire group L1n and the wire L2n can be connected in series, and the wire L3n and the second wire group L4n can be connected in series.
  • the multiple first wire groups of the first coil winding 121 and the multiple second wire groups of the second coil winding 122 are connected by dislocation through the circuit board 123 .
  • ".” and “*” respectively represent the directions of the magnetic flux passing through the above-mentioned four inductive structures, and ".” and “*” respectively represent two opposite directions, so that the first coil winding 121 has a
  • the magnetic fluxes in the gaps of the plurality of first wire groups and the magnetic fluxes in the gaps of the plurality of second wire groups of the second coil windings 122 cancel each other out, so as to reduce the generation of circulating currents in the coil gaps of the two coil windings, thereby effectively reducing the flow rate of the two coil windings. Reduces additional heating of the coil windings.
  • n can be an even number, so as to realize a pairwise crossing arrangement of a plurality of wires for connecting the first wire group and the second wire group, so that the first wire group of the first coil winding 121 is connected to the first wire group.
  • the magnetic flux in the gap and the magnetic flux in the gap between the second wire group of the second coil winding 122 are completely canceled, so as to realize the zero circulating current structure of the two coil windings.
  • the number of first terminals is five and the number of second terminals is five as an example, and the connection mode of the first terminal and the second terminal when n is an odd number will be described. At this time, you can also refer to FIG. 9a and FIG. 9b. Since the connection modes of six first terminals and six second terminals are shown in FIG.
  • each first terminal can be connected to one pad 1231, and each second terminal can be connected to one pad 1232.
  • each first terminal can be connected to one pad 1231, and each second terminal can be connected to one pad 1232.
  • the lines 1233 are sequentially marked as L21, L22, L23, L24, and L25 along the first arrangement direction.
  • the first pad 1231 and the fifth pad 1232 are connected by the trace 1233 marked as L21, and the second pad 1231 is connected to the fifth pad 1232.
  • the fourth pad 1232 is connected by the trace 1233 marked L22, the third pad 1231 is connected to the second pad 1232 by the trace 1233 marked L23, the fourth pad 1231 is connected to the third pad 1232
  • the pad 1232 is connected by a trace 1233 labeled L24, and the fifth pad 1231 is connected to the first pad 1232 by a trace 1233 labeled L25.
  • the trace 1233 marked as L21 has not changed layers in the intersection area Q. Referring to FIG. 9a and FIG.
  • the trace 1233 marked as L22 is replaced in the intersection area Q through the via 1234a at the first position to the same mark
  • the trace 1233 marked as L21 is a different circuit layer
  • the trace 1233 marked as L23 passes through the via hole 1234b at the second position in the intersection area Q and is replaced to a circuit layer which is different from the trace 1233 marked as L21
  • the trace marked as L24 The trace 1233 passes through the via 1234c at the third position in the intersection area Q and is replaced to a different circuit layer from the trace 1233 marked L21
  • the trace 1233 marked L25 passes through the via hole at the fourth position in the intersection area Q 1234d is replaced to a circuit layer different from the traces 1233 marked L21 to avoid contact shorts between the traces 1233.
  • the circuit board 123 of the winding unit 12 in the embodiment of the present application adopts the setting method of the above-mentioned embodiment.
  • the pads 1231 and the pads 1232 may also be disposed on the surface of the same layer structure of the circuit board 123 .
  • the circuit board 123 may include a plurality of circuit layers, so that a plurality of traces 1233 for connecting the pads 1231 and 1232 can be arranged through the arrangement as shown in FIG. 12a or 12b
  • the shown vias 1234 in the intersection area Q of the circuit board 123 are replaced with different circuit layers to realize the intersection, so as to realize the dislocation connection between the pads 1231 and the pads 1232 .
  • the multiple traces 1233 are replaced to different circuit layers through the vias 1234 in the intersection area Q to realize the cross setting.
  • FIG. 9 a and FIG. 9 b which will not be repeated here.
  • the traces 1233 for connecting the pads 1231 and the pads 1232 can be wound in a ring shape on the first surface and the second surface of the circuit board 123 .
  • the area enclosed by the projection of one of the traces 1233 on the first surface or the second surface of the circuit board 123 may be the same as that of the other trace 1233 on the first surface of the circuit board 123.
  • the area enclosed by the projection of one surface or the second surface is similar.
  • the pads 1231 and 1232 may also be arranged on the same side surface of the circuit board 123 , and a plurality of traces 1233 for connecting the pads 1231 and 1232 may be arranged through
  • the vias 1234 in the intersection area Q of the circuit board 123 are replaced to different circuit layers to realize the intersection, so as to realize the dislocation connection between the pads 1231 and the pads 1232 .
  • the coil assembly 1 has two winding units 12 , which are a winding unit 12 a and a winding unit 12 b respectively.
  • the winding unit 12a includes a first coil winding 121a, a second coil winding 122a and a circuit board 123a;
  • the winding unit 12b includes a first coil winding 121b, a second coil winding 122b and a circuit board 123b.
  • the plurality of first wire groups of the first coil winding 121a and the plurality of second wire groups of the second coil winding 122a are connected by dislocation through the circuit board 123a.
  • the plurality of first wire groups of the first coil winding 121b and the plurality of second wire groups of the second coil winding 122b are connected by dislocation through the circuit board 123b.
  • the setting can be made with reference to the embodiment shown in FIG. 9a and FIG. 9b, or with reference to the embodiment shown in FIG. 12a and FIG. Or refer to the embodiment shown in FIG. 13 for setting, which will not be repeated here.
  • some modifications made to the specific arrangement of the circuit board 123 are all within the protection scope of the present application.
  • the arrangement of the circuit board 123a and the circuit board 123b may be the same or different, as long as the plurality of first wire groups of the first coil winding 121a and the plurality of second wire groups of the second coil winding 122a can pass through the circuit board 123a can be connected by dislocation, so that the plurality of first wire groups of the first coil winding 121b and the plurality of second wire groups of the second coil winding 122b can be connected by displacement through the circuit board 123b.
  • the first lead end 1212a of the first coil winding 121a is electrically connected to the first lead end 1212b of the first coil winding 121b to form a terminal C connected to an external circuit
  • the second coil winding 122a The second lead end 1222a of the coil is electrically connected to the second lead end 1222b of the second coil winding 122b to form a terminal D connected to an external circuit.
  • the winding unit 12a including the structure in which the first coil winding 121a and the second coil winding 122a are connected by dislocation through the circuit board 123a is formed, and the structure including the second coil winding 122b and the second coil winding 122b is formed by dislocation connection through the circuit board 123b.
  • the winding units 12b are connected in parallel.
  • a plurality of first wire groups of the first coil winding 121a (respectively represented by L11, . L41, .
  • the lines are respectively denoted by L31, . L41', .
  • Multiple traces on the two surfaces are represented by L31',..., L3n' respectively.
  • the winding unit 12 including the structure in which the first coil winding 121a and the second coil winding 122a are connected by dislocation through the circuit board 123a is formed by connecting the second coil winding 122b and the second coil winding 122b through the circuit board 123b.
  • the winding units 12 of the structure are connected in parallel, which can effectively reduce the impedance of the coil winding (which is half of the impedance of the coil winding of the coil assembly 1 including only one winding unit 12 ).
  • the coil assembly when the coil assembly includes more than two winding units, it can be arranged with reference to the above-mentioned embodiments to form a parallel structure of more than two winding units, thereby further reducing the impedance of the coil windings of the coil assembly.
  • one winding unit 12 when the coil assembly 1 includes two winding units 12 , one winding unit 12 includes a first coil winding 121 a , a second coil winding 122 a and a circuit board 123 a ; the other winding unit 12 The first coil winding 121b, the second coil winding 122b and the circuit board 123b are included.
  • the plurality of first wire groups of the first coil winding 121a and the plurality of second wire groups of the second coil winding 122a are connected by dislocation through the circuit board 123a.
  • the plurality of first wire groups of the first coil winding 121b and the plurality of second wire groups of the second coil winding 122b are connected by dislocation through the circuit board 123b.
  • the setting can be made with reference to the embodiment shown in FIG. 9a and FIG. 9b, or with reference to the embodiment shown in FIG. 12a and FIG. Or refer to the embodiment shown in FIG. 13 for setting, which will not be repeated here.
  • some modifications made to the specific arrangement of 123a and circuit board 123b are all within the protection scope of the present application.
  • the arrangement of the circuit board 123a and the circuit board 123b may be the same or different, as long as the plurality of first wire groups of the first coil winding 121a and the plurality of second wire groups of the second coil winding 122a can pass through the circuit board 123a can be connected by dislocation, so that the plurality of first wire groups of the first coil winding 121b and the plurality of second wire groups of the second coil winding 122b can be connected by displacement through the circuit board 123b.
  • the first lead end 1212a of the first coil winding 121a is used as a terminal connected to an external circuit
  • the first lead end 1212b of the first coil winding 121b is electrically connected to the second lead end 1222a of the second coil winding 122a.
  • the second lead end 1222b of the second coil winding 122b serves as another terminal for connection with an external circuit.
  • the winding unit 12a including the structure in which the first coil winding 121a and the second coil winding 122a are connected by dislocation through the circuit board 123a is formed, and the structure including the second coil winding 122b and the second coil winding 122b is formed by dislocation connection through the circuit board 123b.
  • the winding units 12b are connected in series.
  • a plurality of first wire groups of the first coil winding 121a (respectively denoted by L11, . L41, .
  • the lines are respectively denoted by L31, . L41', ..., L4n' respectively) realize dislocation connection through the circuit board 123b, wherein, the multiple traces on the first surface of the circuit board 123b are respectively denoted by L21', ..., L2n', and the second line of the circuit board 123b
  • the multiple traces on the surface are represented by L31',..., L3n' respectively.
  • the winding unit 12a is formed by connecting the first coil winding 121a and the second coil winding 122a through the circuit board 123a in a staggered manner, and the second coil winding 122b and the second coil winding 122b pass through the winding unit 12a.
  • the winding units 12b of the structure formed by the circuit boards 123b being dislocated and connected in series can increase the number of coil turns of the coil assembly 1 and increase the magnetic induction of the coil assembly 1 . It can be applied to scenarios where the coil inductance of the coil assembly 1 needs to be adjusted due to the voltage gain.
  • the coil assembly when the coil assembly includes more than two winding units, it can be set with reference to the above-mentioned embodiments to form a series structure of more than two winding units, thereby further increasing the number of coil turns of the coil assembly, improving the Magnetic induction of the coil assembly.
  • the adjustment of the coil inductance of the coil assembly can also be more flexibly realized through the combination of series and parallel between the winding units.
  • the first coil winding 121 and the second coil winding 122 can be formed by using the above-mentioned direct wire winding method, and can also be formed by processing a circuit board to form the first coil winding 121 and the second coil winding 122.
  • a coil winding 121 and a second coil winding 122 can be formed by using the above-mentioned direct wire winding method, and can also be formed by processing a circuit board to form the first coil winding 121 and the second coil winding 122.
  • a coil winding 121 and a second coil winding 122 can be formed by using the above-mentioned direct wire winding method, and can also be formed by processing a circuit board to form the first coil winding 121 and the second coil winding 122.
  • the specific setting method is similar to that of metal wire winding, so that multiple traces on the circuit board can be used as multiple wires to form a helical shape on the first surface of the circuit board 123 . turns the coil, thereby forming the first coil winding 121 as shown in Figure 18a. Similarly, a plurality of traces are spirally formed on the second surface of the circuit board 123 to form a multi-turn coil, thereby forming the second coil winding 122 as shown in FIG. 18b. It can be understood that the layer structure of the circuit board is omitted in FIGS. 18 a and 18 b for clearly showing the structures of the first coil winding 121 and the second coil winding 122 .
  • the plurality of first terminals, the plurality of second terminals on the circuit board 123, and the plurality of traces for connecting the plurality of first terminals and the plurality of second terminals may refer to the above-mentioned embodiment Make cross settings.
  • the via holes at different positions of the multiple traces 1233c in the intersection area Q shown in FIG. 20a or FIG. 20b can be changed to different circuit layers of the circuit board 123 to realize the cross setting.
  • FIG. 9a and FIG. 9b for the manner, reference may be made to the embodiments shown in FIG. 9a and FIG. 9b , and details are not described here.
  • the first terminal is arranged on the first surface of the circuit board
  • the second terminal is arranged on the second surface
  • the first coil winding 121 is formed on the first surface of the circuit board
  • the second coil winding 122 is formed Taking the second surface of the circuit board as an example, the formation of the first coil winding 121 and the second coil winding 122 in this embodiment, as well as the connection between the first coil winding 121 and the first terminal, and the second coil winding 122 and the second
  • the procedure for connecting the terminals is explained.
  • the plurality of traces 1233a on the first surface of the circuit board and the plurality of traces 1233b on the second surface pass through the vias 1234a shown in FIG. Vias 1234b are connected in parallel.
  • the parallel-connected multiple wires 1233a and multiple wires 1233b are wound for one turn in a clockwise direction at the same time.
  • the multiple traces 1233b in FIG. 18b are transferred to the first surface of the circuit board shown in FIG. 18a through the vias 1234c, and continue to be wound in a clockwise direction with a decreasing trend of the winding radius to form the first surface of the circuit board.
  • Coil winding 121 It can be understood that, as shown in FIG. 18b , the winding starting ends of the plurality of traces 1233b can be used as the first lead-out ends 1212 of the first coil winding 121 for connecting to an external circuit.
  • connection end 1211 of the first coil winding 121 is connected to the trace 1233c on the second surface of the circuit board through the via hole 1234d shown in FIG.
  • the hole 1234e is transferred to the second surface of the circuit board shown in FIG. 18b, and serves as the second connection end 1221 of the second coil winding 122, and continues to be wound in the clockwise direction with the increasing trend of the winding radius, so as to
  • the second coil winding 122 is formed, and the second lead end 1222 of the wound second coil winding 122 is connected to an external circuit.
  • the magnetic flux in the gap between the first wire groups of the first coil winding 121 and the magnetic flux in the gap between the second wire groups of the second coil winding 122 can cancel each other out, so that the magnetic flux of the first coil winding 121
  • the magnetic flux in the gap between the first wire groups and the magnetic flux in the gap between the second wire groups of the second coil winding 122 cancel each other out, so as to reduce the generation of circulating current in the coil gap of the coil winding, thereby effectively reducing the coil winding. Additional heating of the windings.
  • the first coil winding 121 in addition to forming the first coil winding 121 and the second coil winding 122 in the same way, the first coil winding 121 can also be formed by winding a wire.
  • the independent coil winding structure is formed, and the second coil winding 122 is formed by the processing method of the circuit board.
  • the specific arrangement of the first coil winding 121 is the same as that of the coil winding formed by wire winding in the above-mentioned embodiment, and will not be repeated here.
  • the second coil winding 122 when the second coil winding 122 is specifically arranged, it is taken as an example that the second coil winding 122 is arranged on the first surface of the circuit board 123 .
  • the plurality of wires 1233 are wound in a clockwise direction with a decreasing tendency of the winding radius to form the second coil winding 122 , and the winding starting end of the plurality of wires 1233 serves as the second The lead-out end 1222 and the winding ends of the plurality of wires 1233 serve as the second connection end 1221 of the second coil winding 122 .
  • the plurality of traces 1233 continue to be wound in a decreasing trend of the winding radius and are arranged crosswise.
  • the via holes 1234 at different positions of the multiple traces 1233 in the intersection area Q shown in FIG. 23a or FIG. 23b can be replaced to different circuit layers of the circuit board 123 to realize the crossover arrangement, so as to avoid the crossover arrangement. Contacts between the plurality of traces 1233 are shorted.
  • the multiple traces 1233 are exchanged to different circuit layers of the circuit board 123 through the vias 1234 at different positions in the intersection area Q to realize the cross setting.
  • FIG. 9a and FIG. 9b The illustrated embodiment will not be repeated here.
  • a plurality of traces 1233 are wound on the first surface and the second surface of the circuit board, and a first terminal is formed, and the first terminal can be formed on the first surface of the circuit board 123 surface or second surface.
  • the first connection end 1211 of the first coil winding 121 can be fixedly connected to the first terminal.
  • the magnetic flux in the gap of the first coil winding 121 and the magnetic flux in the gap of the second coil winding 122 can cancel each other out, so that the magnetic flux in the gap of the first coil winding 121 and the magnetic flux in the gap of the second coil winding 122 can cancel each other out.
  • the magnetic fluxes in the gaps cancel each other, so as to reduce the generation of circulating currents in the coil gaps of the coil windings, thereby effectively reducing the extra heat generation of the coil windings.
  • the first coil winding 121 can be The connection end 1211 extends along the first arrangement direction to form a first extension portion 1216 .
  • a pad 1213 may be provided at the end of the first extension portion 1216 .
  • the second connecting end 1221 of the second coil winding 122 can also be extended along the first arrangement direction to form a second extending portion 1226 , and a pad can be provided at the end of the second extending portion 226 1223.
  • the circuit board 123 when the circuit board 123 is specifically set, the first terminal of the circuit board 123 is connected to the pad 1231 and the second terminal is connected to the pad 1232 as an example.
  • the circuit board 123 is provided with a slot G, the slot G is opened on the projection of the pad 1231 connected with the first terminal on the first surface or the second surface of the circuit board 123, and the pad 1232 connected with the second terminal is in the In the area between the projections on the first surface or the second surface of the circuit board 123, in addition, the slot G can be opened along the first arrangement direction.
  • the first extension 1216 of the first coil winding 121 can be extended into the slot G of the circuit board 123, Solder the pad 1213 at the end of the first extension part 1216 to the pad 1231 of the circuit board 123 ; similarly, the second extension part 1226 of the second coil winding 122 can be extended into the slot G of the circuit board 123 , and solder the pad 1223 at the end of the second extension portion 1226 to the pad 1232 of the circuit board 123 .
  • the first extension portion 1216 of the first coil winding 121 can be connected to the second coil winding 122 .
  • the second extension parts 1226 of the 123 are stacked at the slot G of the circuit board 123 . It can effectively avoid the stacking of the first coil winding 121 , the second coil winding 122 and the circuit board 123 , thereby facilitating the realization of the thin design of the coil assembly 1 .
  • the wireless charging system of the embodiment of the present application can at least improve the charging efficiency when the transmitting coil of the wireless charger 2 is directly opposite to the receiving coil of the electronic device 3 . 1.3%.
  • the charging efficiency is increased by at least 2.39%. Therefore, the charging efficiency of the wireless charging system of the embodiments of the present application is effectively improved.

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Abstract

本申请提供一种线圈组件、电子设备及无线充电器,涉及无线充电领域。线圈组件包括第一线圈绕组、第二线圈绕组及电路板。第一线圈绕组包括多个第一导线组,其第一引出端与外部电路连接;第二线圈绕组包括多个第二导线组,其第二引出端与外部电路连接;第二线圈绕组与第一线圈绕组层叠;电路板设置有多个第一端子和多个第二端子;每个第一端子与每个第二端子通过一条走线连接;用于连接多个第一端子与多个第二端子的多条走线中,至少两条走线在交叉区域通过第一过孔更换至不同线路层进行交叉设置;每个第一导线组的第一连接端与每个第二导线组的第二连接端通过第一端子和第二端子连接。本申请的线圈组件的线圈绕组的发热低,电能的传输效率较高。

Description

一种线圈组件、电子设备及无线充电器
相关申请的交叉引用
本申请要求在2020年09月22日提交中国专利局、申请号为202011003878.2、申请名称为“一种线圈组件、电子设备及无线充电器”的中国专利申请的优先权,其全部内容通过引用结合在本申请中。
技术领域
本申请涉及无线充电技术领域,尤其涉及一种线圈组件、电子设备及无线充电器。
背景技术
无线充电技术中,电子设备与无线充电器之间无需通过电源线连接,只需将电子设备放置在无线充电器上即可为电子设备充电,方便用户使用。并且,电子设备上也可以省去用于连接电源线的接触端子,进而可以提高电子设备的安全性以及防水、防尘性能。因此,近年来应用无线充电技术为电子设备充电开始备受推崇。
无线充电中,充电效率是影响用户体验的关键参数,在相同的输入功率下,充电效率越高,充电适配器能够输出越多的功率,从而可实现对手机等电子设备的快速充电,以减少充电时间,提升用户体验。
由于在能量传输链路中,发射线圈与接收线圈为用于完成电能从无线充电器到手机等电子设备的关键元件。因此,线圈耦合系统是无线充电的核心设计,线圈设计的优劣严重影响无线充电效率,从而影响用户体验。
发明内容
本申请提供了一种线圈组件、电子设备及无线充电器,以提高电子设备与无线充电器之间的充电效率。
第一方面,本申请提供了一种线圈组件,所述线圈组件包括绕组单元,该绕组单元包括第一线圈绕组、第二线圈绕组以及电路板。其中,第一线圈绕组具有第一连接端和第一引出端,第一引出端用于与外部电路连接。另外,第一线圈绕组包括多个第一导线组,该多个第一导线组并排设置。相类似的,第二线圈绕组具有第二连接端和第二引出端,第二引出端用于与外部电路连接;第二线圈绕组包括多个第二导线组,该多个第二导线组并排设置。电路板可用作第一线圈绕组与第二线圈绕组之间连接的介质,电路板包括多个线路层和多个第一过孔,在多个线路层上设置有多个第一端子和多个第二端子。第一端子和第二端子通过走线连接,且用于连接多个第一端子和多个第二端子的多条走线中,至少两条在交叉区域处穿过第一过孔更换至不同线路层进行交叉设置。在本申请中,通过在电路板上开设第一过孔,来使至少两条走线在交叉区域通过该第一过孔更换至不同的线路层进行交叉设置,从而使电路板上的走线布置较为清晰、整齐,并且可避免走线之间的接触短路。
在将第一线圈绕组与电路板连接时,可使第一线圈绕组的第一导线组位于第一连接端的部分固定于第一端子;第二线圈绕组与电路板连接时,第二导线组位于第二连接端的部 分固定于第二端子。另外,至少两个第一导线组与至少两个第二导线组通过交叉设置的走线连接。
采用本申请实施例的线圈组件,通过使第一线圈绕组的至少两个第一导线组,与第二线圈绕组的至少两个第二导线组通过交叉设置的走线连接,电流通过第一线圈绕组和第二线圈绕组时形成的磁场在该至少两个第一导线组和至少两个第二导线组处的方向相反,因此可以使该至少两个第一导线组的缝隙内的磁通和至少两个第二导线组的缝隙内的磁通互相抵消,从而减少第一线圈绕组和第二线圈绕组的线圈缝隙内的环流的产生,进而有效的降低线圈绕组的额外发热,其有利于提高线圈组件的电能传输效率。
在本申请一种可能的实现方式中,第一导线组的数量与第二导线组的数量相同,另外,还可以但不限于使第一导线组与第二导线组一一对应连接。这样可使第一线圈绕组的全部第一导线组与第二线圈绕组的全部第二导线组均可用于电能的传输,从而有利于提高线圈绕组的电能传输效率。
在本申请一种可能的实现方式中,在具体设置第一导线组时,多个第一导线组的导线的数量可以均相同;或者也可使多个第一导线组中的至少两个第一导线组的导线的数量不同,示例性的,可使多个第一导线组的导线的数量均不同。
相类似的,在具体设置第二导线组时,多个第二导线组的导线的数量可以均相同;或者也可使多个第二导线组中的至少两个第二导线组的导线的数量不同,示例性的,可使多个第二导线组的导线的数量均不同。
在本申请一种可能的实现方式中,还可以使相连接的第一导线组与第二导线组中的导线的条数相同,从而可使相连接的第一导线组与第二导线组的导线均可用于电能的传输,以提高电能的传输效率。另外,也可以使相连接的第一导线组与第二导线组中的导线的条数不同。
在本申请一种可能的实现方式中,多个第一端子为n个,多个第二端子为n个,多条走线包括n条,多个第一过孔包括n-1个,n个第一端子沿第一方向排列,n个第二端子沿第一方向排列,则第一端子与第二端子通过走线连接,在连接多个第一端子与多个第二端子的多条走线中,至少两条走线在交叉区域通过第一过孔更换至不同线路层进行交叉设置,具体为:第一个第一端子与第n个第二端子通过第一条走线连接,第二个第一端子与第n-1个第二端子通过第二条走线连接,以此类推,第n-1个第一端子与第二个第二端子通过第n-1条走线连接,第n个第一端子与第一个第二端子通过第n条走线连接;第二条走线在交叉区域通过第一位置处的第一过孔更换至与第一走线不同的线路层,第n-1条走线在交叉区域通过第n-2位置处的第一过孔更换至与第一走线不同的线路层,第n条走线在交叉区域通过第n-1位置处的第一过孔更换至与第一走线不同的线路层,其中,n为大于等于2的整数。以实现至少两条走线的交叉设置,从而实现至少部分第一导线组的缝隙内的磁通和至少部分第二导线组的缝隙内的磁通的抵消,从而可以很大程度上减少第一线圈绕组和第二线圈绕组的线圈缝隙内的环流的产生。
当n为偶数时,可使用于多个第一端子与多个第二端子的多条走线两两交叉设置。示例性的,以第一端子为六个,第二端子为六个为例,则相对应的第一端子与第二端子通过走线连接,在连接多个第一端子与多个第二端子的多条走线中,至少两条走线在交叉区域通过第一过孔更换至不同线路层进行交叉设置,具体为:沿第一排列方向上,第一个第一端子与第六个第二端子通过第一条走线连接,第二个第一端子与第五个第二端子通过第二 条走线连接,第三个第一端子与第四个第二端子通过第三条走线连接,第四个第一端子与第三个第二端子通过第四条走线连接,第五个第一端子与第二个第二端子通过第五条走线连接,第六个第一端子与第一个第二端子通过第六条走线连接。另外,第二条走线在交叉区域通过第一位置处的第一过孔更换至与第一条走线不同的线路层,第三条走线在交叉区域通过第二位置处的第一过孔更换至与第一条走线不同的线路层,第四条走线在交叉区域通过第三位置处的第一过孔更换至与第一条走线不同的线路层,第五条走线在交叉区域通过第四位置处的第一过孔更换至与第一条走线不同的线路层,第六条走线在交叉区域通过第五位置处的第一过孔更换至与第一条走线不同的线路层,以避免各条走线之间的接触短路。当第一导线组与第一端子一一对应连接,第二导线组与第二端子一一对应连接时,采用该电路板的设置方式,可以实现多个第一导线组的缝隙内的磁通和多个第二导线组的缝隙内的磁通的完全抵消,从而减少第一线圈绕组和第二线圈绕组的线圈缝隙内的环流的产生。
当n为奇数时,总有两条走线无法相交,与该无法相交的两条走线相连接的两个第一导线组之间的缝隙内的磁通与两个第二导线组之间的缝隙内的磁通无法抵消。示例性的,以第一端子为五个,第二端子为五个为例,则相对应的第一端子与第二端子通过走线连接,在连接多个第一端子与多个第二端子的多条走线中,至少两条走线在交叉区域通过第一过孔更换至不同线路层进行交叉设置,具体为:沿第一排列方向上,第一个第一端子与第五个第二端子通过第一条走线连接,第二个第一端子与第一个第四端子通过第二条走线连接,第三个第一端子与第二个第二端子通过第三条走线连接,第四个第一端子与第三个第二端子通过第四条走线连接,第五个第一端子与第一个第二端子通过第五条走线连接。另外,第二条走线在交叉区域通过第一位置处的第一过孔更换至与第一条走线不同的线路层,第三条走线在交叉区域通过第二位置处的第一过孔更换至与第一条走线不同的线路层,第四条走线在交叉区域通过第三位置处的第一过孔更换至与第一条走线不同的线路层,第五条走线在交叉区域通过第四位置处的第一过孔更换至与第一条走线不同的线路层,以避免各条走线之间的接触短路。当第一导线组与第一端子一一对应连接,第二导线组与第二端子一一对应连接时,采用该电路板的设置方式,可以实现部分第一导线组的缝隙内的磁通和部分第二导线组的缝隙内的磁通的抵消,但是,其也可以很大程度上减少第一线圈绕组和第二线圈绕组的线圈缝隙内的环流的产生。
在本申请一种可能的实现方式中,针对交叉设置的两条走线,可以使其中一条走线在电路板的第一表面或第二表面的投影围成的面积,与另一条走线在电路板的第一表面或第二表面的投影围成的面积相近。以使该两条走线产生的磁感量相近,又因为该两条走线交叉设置,故该两条走线围成的区域内的磁通方向相反,从而可以使这两部分的磁通相互抵消。
在本申请可能的实现方式中,在具体设置走线时,可使每相邻的两条走线之间的间距相等,以避免其对线圈组件的磁通量产生影响。另外,在多个第一导线组的缝隙内的磁通和多个第二导线组的缝隙内的磁通量可以实现完全抵消时,这时走线之间的间距对于线圈组件的磁通影响较小,此时,还可以使任意相邻的两条走线之间的间距中的至少两个不同。
在本申请一种可能的实现方式中,多条走线可绕制于电路板的表面,该多条走线的宽度均相同;或,使走线形成的线圈半径与走线的宽度成正比。
可在电路板的每个第一端子处对应设置一个第一焊盘,并在每个第二端子处对应设置 一个第二焊盘。这样可使第一导线组与第一端子通过焊接的方式实现连接,并使第二导线组与第二端子通过焊接的方式实现连接,从而使其连接较为方便。
在本申请一种可能的实现方式中,第一端子与第二端子可以设置于电路板的同一表面,以便于实现第一线圈绕组与第二线圈绕组与该电路板的连接。另外,还可以使第一端子设置于电路板的第一表面,并使第二端子设置于电路板的第二表面,其中,第一表面与第二表面相背设置,以便于对该第一端子与第二端子进行设置。
在本申请一种可能的实现方式中,还可在每个第一导线组位于第一连接端的部分连接有一个第三焊盘,这样可通过第三焊盘与第一焊盘的焊接,来实现第一导线组与电路板的第一端子的电连接,其连接操作更为简便。为了便于实现第一线圈绕组与外部电路的连接,还可以在第一引出端设置有第四焊盘。
相类似的,还可以在每个第二导线组位于第二连接端的部分连接有一个第五焊盘,这样可通过第五焊盘与第二焊盘的焊接,来实现第二导线组与电路板的第二端子的电连接,其连接操作更为简便。另外,还可使第二引出端连接有第六焊盘,以便于第二线圈绕组与外部电路的连接。
在本申请一种可能的实现方式中,第一线圈绕组为独立的线圈绕组结构,第二线圈绕组为独立的线圈绕组结构;第一线圈绕组的第一连接端处沿第一排列方向延伸形成第一延伸部,第二线圈绕组的第二连接端处沿第一排列方向延伸形成第二延伸部;电路板开设有开槽,开槽设置于第一端子在电路板的第一表面或第二表面上的投影,与第二端子在电路板的第一表面或第二表面上的投影之间的区域,且开槽沿第一排列方向开设;第一延伸部伸入至开槽与第一端子连接,第二延伸部伸入至开槽与第二端子连接,第一延伸部与第二延伸部在开槽处层叠设置。在将实现方式中,将第一线圈绕组、第二线圈绕组以及电路板进行组装时,可使第一线圈绕组的第一延伸部,与第二线圈绕组的第二延伸部在电路板的开槽处层叠设置。其可以有效的避免第一线圈绕组、第二线圈绕组以及电路板三者的层叠,从而有利于实现该线圈组件的薄型化设计。
在本申请一种可能的实现方式中,第一线圈绕组为独立的线圈绕组结构;第二线圈绕组形成于电路板的第一表面,第二线圈绕组由多条走线绕制形成,第二线圈绕组的第二连接端作为电路板的第二端子,并继续沿绕制半径减小的趋势进行绕制且交叉设置后形成第一端子,第一线圈绕组的第一连接端与第一端子电连接。采用该设置方式,可提高该线圈组件的集成度,从而使其使用较为便利。
在本申请一种可能的实现方式中,可以使第一线圈绕组形成于电路板的第一表面,并使第二线圈绕组形成于电路板的第二表面。在该实现方式中,在将第一线圈绕组的第一导线组与电路板的第一端子相连接时,可使第一导线绕组位于第一连接端的部分通过一个位置处第二过孔连接于第一端子。相类似的,第二线圈绕组的第二导线组位于第二连接端的部分可通过另一位置处第二过孔连接于第二端子。采用该设置方式,可有效的提高该线圈组件的集成度,从而使其使用较为便利。
在本申请一种可能的实现方式中,线圈组件可以包括多个绕组单元,示例性的,可为两个、三个或四个等。该多个绕线单元相层叠设置,且多个线圈单元的第一线圈绕组的第一引出端相连接用于与外部电路连接,多个线圈单元的第二线圈绕组的引出端相连接用于与外部电路连接,从而实现多个绕组单元的并联设置。采用本方案,可以减少各线圈绕组的线圈缝隙内的环流的产生,进而有效的降低线圈绕组的额外发热。另外,通过将多个绕 组单元并联,可以有效的降低线圈绕组的阻抗。
在本申请一种可能的实现方式中,线圈组件可以包括多个绕组单元,示例性的,可为两个、三个或四个等。该多个绕线单元相层叠设置,且相邻的两个绕组单元中,一个绕组单元的第二线圈绕组的第二引出端,与另一个绕组单元的第一线圈绕组的第一引出端相连接,从而实现多个绕组单元的串联设置。采用该方案,通过将多个绕组单元进行串联,可以增加线圈组件的线圈匝数,提升线圈组件的磁感量。其可应用于由于电压增益的原因需要调节线圈组件的线圈感量的场景。
本申请实施例的线圈组件除包括上述结构外,在一种可能的实现方式中,线圈组件还可以包括导磁片,该导磁片的材质可以但不限于为铁氧体、非晶纳米晶、金属粉芯等导磁材料中的一种或多种。线圈单元设置于导磁片的一侧表面,且线圈单元与导磁片之间绝缘设置。由于导磁片能够起到导磁作用,其可以提高绕组单元的磁感量,同时还可避免磁场泄露到导磁片另一侧,从而对导磁片的与设置有绕组单元相对的一侧的空间起到良好的屏蔽效果。
第二方面,本身请还提供了一种电子设备,该电子设备包括受电电路,以及第一方面的线圈组件。线圈组件作为电子设备的接收线圈可以与电子设备中的受电电路进行电连接,以将电磁能转化为电能进行储存或使用。
在本申请实施例的电子设备中,由于其线圈组件的每个绕组单元的第一线圈绕组的线圈缝隙内的磁通和第二线圈绕组的线圈缝隙内的磁通能够互相抵消,从而可以减少绕组单元的线圈缝隙内的环流的产生,因此该线圈绕组的发热较低,其电能传输效率得到提高,从而使电子设备的充电效率得到提高。
第三方面,本申请还提供了一种无线充电器,该无线充电器包括供电电路,以及第一方面的线圈组件。线圈组件作为该无线充电器的发射线圈与供电电路进行电连接,以将电能转化为电磁能进行无线传输。
在本申请实施例的无线充电器中,由于其线圈组件的每个绕组单元的第一线圈绕组的线圈缝隙内的磁通和第二线圈绕组的线圈缝隙内的磁通能够互相抵消,从而可以减少绕组单元的线圈缝隙内的环流的产生,因此该线圈组件的发热较低,其电能传输效率得到提高,从而使该无线充电器的充电效率得到提高。
第四方面,本身请还提供了一种无线充电系统,该无线充电系统包括电子设备和无线充电器。其中,电子设备与无线充电器中的至少一个包括第一方面的线圈组件,电子设备与无线充电器相接触设置,无线充电器为电子设备充电。在该无线充电系统中,无线充电器和电子设备中的至少一个的线圈组件的发热较低,二者之间的电能传输效率较高,因此该无线充电系统的充电效率能够得到有效提高,从而有利于提升用户的使用体验。
附图说明
图1为本申请一实施例提供的无线充电系统的结构示意图;
图2为本申请一实施例提供的无线充电器的结构示意图;
图3为本申请一实施例提供的电子设备的结构示意图;
图4为涡流损耗产生原理示意图;
图5为本申请一实施例提供的线圈组件的结构示意图;
图6为本申请一实施例提供的线圈组件的第一线圈绕组的结构示意图;
图7为图6中第一线圈绕组的A处的局部结构放大图;
图8为本申请一实施例提供的线圈组件的第二线圈绕组的结构示意图;
图9a为本申请一实施例提供的线圈组件的电路板的第一表面的结构示意图;
图9b为本申请一实施例提供的线圈组件的电路板的第二表面的结构示意图;
图10为本申请一实施例提供的线圈组件的磁通量抵消原理示意图;
图11为本申请另一实施例提供的线圈组件的结构示意图;
图12a为本申请另一实施例提供的线圈组件的电路板的第一表面的结构示意图;
图12b为本申请另一实施例提供的线圈组件的电路板的第二表面的结构示意图;
图13为本申请另一实施例提供的线圈组件的电路板的第一表面的结构示意图;
图14为本申请另一实施例提供的线圈组件的结构示意图;
图15为本申请另一实施例提供的线圈组件的磁通量抵消原理示意图;
图16为本申请另一实施例提供的线圈组件的磁通量抵消原理示意图;
图17为本申请另一实施例提供的线圈组件的结构示意图;
图18a为本申请另一实施例提供的线圈组件的第一线圈绕组的结构示意图;
图18b为本申请另一实施例提供的线圈组件的第二线圈绕组的结构示意图;
图19a为图18a中第一线圈绕组的E处的局部结构放大图;
图19b为图18b中第二线圈绕组的F处的局部结构放大图;
图20a为本申请另一实施例提供的线圈组件的电路板的第一表面的结构示意图;
图20b为本申请另一实施例提供的线圈组件的电路板的第二表面的结构示意图;
图21为本申请另一实施例提供的线圈组件的结构示意图;
图22为本申请另一实施例提供的线圈组件的第一线圈绕组的结构示意图;
图23a为本申请另一实施例提供的线圈组件的电路板的第二表面的结构示意图;
图23b为本申请另一实施例提供的线圈组件的电路板的第二表面的结构示意图;
图24为本申请另一实施例提供的线圈组件的结构示意图;
图25为本申请另一实施例提供的线圈组件的第一线圈绕组的结构示意图;
图26为本申请另一实施例提供的线圈组件的第二线圈绕组的结构示意图;
图27a为本申请另一实施例提供的线圈组件的电路板的第二表面的结构示意图;
图27b为本申请另一实施例提供的线圈组件的电路板的第二表面的结构示意图。
具体实施方式
为了使本申请的目的、技术方案和优点更加清楚,下面将结合附图对本申请作进一步地详细描述。为了方便理解本申请实施例提供的线圈组件,下面首先介绍一下其应用场景。
随着消费类电子产品得到巨大发展与普及,便携式电子产品为人们生活带来极大的便利。但是,不同产品需要配置不同的充电适配器,由于不同产品的接口不能共用,且不同产品的功率不兼容等因素使得各个厂家之间的适配器通用性差。另外,导线充电方式的导线多、充电需要插拔电缆等因素大大降低了用户使用的便捷性。
随着科学技术发展,无线充电技术在消费类电子产品上的应用越来越广泛。相比于传统的电缆插拔式电能传输技术,无线充电技术在进行无线电能传输的过程中,由于其电源和负载之间不存在电缆的连接,因此更加安全、便捷和可靠。无线充电技术用于实现无线电能传输的方式有:电磁辐射式、电磁感应式、电磁谐振式和电场耦合方式等。基于效率 和安全性方面的考虑,市场上的无线充电产品通常采用电磁感应式的无线电能传输方式。
本申请提供的线圈组件1基于电磁感应式的无线电能传输方式进行设计,其可以应用于各种无线充电系统中,参照图1,图1示出了一种无线充电器2与电子设备3构成的无线充电系统。在该无线充电系统中,无线充电器2作为供电设备,电子设备3作为受电设备,电子设备例如可为手机、可穿戴设备(智能手表、智能手环或智能眼镜等)、平板电脑等。
在图1所示的实施例中,无线充电器2与电子设备3中的至少一个设置有本申请的线圈组件1,该线圈组件1可作为无线充电器2等供电设备的发射线圈,或者电子设备3中的接收线圈。其中,无线充电器2与电源连接,用于将该电源的能量以电磁波的方式发送给待充电的电子设备3;待充电的电子设备3与无线充电器2相接触,用于接收该电磁波,并通过该电磁波携带的能量为自身充电。
在线圈组件1设置在无线充电器2等供电设备中时,可参照图2,图2提供了一种设置有本申请的线圈组件1的无线充电器2的结构示意图。继续参照图2,无线充电器2中除了线圈组件1外,还可以包括供电电路21。其中,线圈组件1作为该无线充电器2的发射线圈与供电设备中的供电电路21进行电连接,以将电能转化为电磁能进行无线传输。
继续参照图2,无线充电器2的供电电路21可以包括直流/交流(DC/AC)转换模块212、匹配电路213和控制单元214。这样,该无线充电器2在为受电设备进行供电时,DC/AC转换模块212与直流电源211连接,并将直流电源211转换成交流信号,交流信号流过匹配电路213传输给线圈组件1,线圈组件1将电能转化为电磁能进行无线传输。另外,控制单元214可对该供电电路21的工作进行控制。
在本申请另一个实施例中,线圈组件1设置于受电设备中,受电设备例如可以是手机、智能手表、平板电脑等电子设备。参照图3,线圈组件1作为受电设备的接收线圈可以与受电设备中的受电电路31进行电连接,以将电磁能转化为电能进行储存或使用。
继续参照图3,受电电路31可以包括匹配电路311、交流/直流(AC/DC)转换模块312、控制单元313和负载314。线圈组件1可将接收到的交流信号转化为电能,电能通过匹配电路311传输到AC/DC转换模块312,AC/DC转换模块312将接收到的交流信号转换成直流信号进行存储或者为负载314供电。另外,控制单元313可对该受电电路31的工作进行控制。
由于电磁感应式无线充电技术主要是基于发射线圈与接收线圈之间的磁耦合原理进行能量传输,因此在发射线圈与接收线圈之间存在很强的交流磁场。如图4所示,金属线圈放置在交流磁场中会感应出涡流造成涡流损耗,涡流电流的大小正比于金属线圈的面积大小。因此,金属线圈面积越大,则在相同磁场下其涡流损耗越大,而如果发射线圈或接收线圈具有很大的涡流损耗,则会导致无线充电效率较低。
但是,若将金属线圈切割成两个,且其面积均为原来金属线圈面积一半的小线圈时,在相同的磁场下,每个小线圈产生的涡流均减小,从而使包括该两个小线圈的金属线圈的损耗降低,经试验验证,其损耗可以降低到原来的25%左右。基于此,本申请实施例提供了一种线圈组件,以降低其涡流损耗,提高其充电效率。
参照图5,本申请实施例的线圈组件1可以包括导磁片11以及绕组单元12。其中,绕组单元12设置于该导磁片11的一侧表面,且绕组单元12与导磁片11之间绝缘设置。由于导磁片11能够起到导磁作用,其可以提高绕组单元12的磁感量,同时还可避免磁场泄 露到导磁片11另一侧,从而对导磁片11的与设置有绕组单元12相对的一侧的空间起到良好的屏蔽效果。在本申请实施例中,导磁片11可由导磁材料制成,示例性的,可为铁氧体、非晶纳米晶、金属粉芯等。
继续参照图5,绕组单元12可以包括第一线圈绕组121、第二线圈绕组122以及电路板123。其中,第一线圈绕组121的匝数可以与第二线圈绕组122的匝数相同,也可以不同。另外,可使第一线圈绕组121与第二线圈绕组122的面积相同,并使第一线圈绕组121与第二线圈绕组122层叠设置。可以理解的是,在本申请一些实施例中,还可以使第一线圈绕组121与第二线圈绕组122可以正对设置,也可以稍有错位。在具体设置第一线圈绕组121时,可参照图6,第一线圈绕组121可为由多条导线1215绕制而成的多匝线圈结构,该导线1215例如可为金属导线,且该第一线圈绕组121可为采用螺旋式绕制(多条导线1215并排设置,且沿绕制半径增大的方向进行绕制)方式形成的平面结构,其形状可以但不限于为圆形、椭圆形或者多边形等。另外,导线1215的截面形状可以但不限于为矩形、圆形或者椭圆形等,在该导线1215的表面涂覆有绝缘漆膜,或者包覆有绝缘材料层等,以使第一线圈绕组121的每相邻的两条导线1215之间绝缘设置,从而避免导线1215之间的短路。
本申请实施例中,在采用螺旋式绕制方式形成的多匝线圈结构中,将其绕制的起始端称为该多匝线圈结构的连接端,将其绕制的结束端称为该多匝线圈结构的引出端。在本申请另外一些实施例中,也可以将多匝线圈结构绕制的起始端称为其引出端,将绕制的结束端称为该多匝线圈结构的连接端,在此只是为了对多匝线圈结构的两个端部进行区分。参照图6,在本申请实施例中,以第一线圈绕组121的设置于其内侧的端部称为第一连接端1211,以及位于其外侧的端部称为第一引出端1212为例进行说明。
继续参照图6,在本申请实施例中,为了实现第一线圈绕组121的薄型化设计,用于绕制形成第一线圈绕组121的导线1215的宽度较小,则第一线圈绕组121内的导线1215的数量较多。为了便于实现线圈绕组之间的连接,一并参照图7,可将第一线圈绕组121的多条导线1215分为多个第一导线组,每个第一导线组包括至少一条导线1215,示例性的,可参照图7中的B处所示,第一导线组可以包括两条导线1215。另外,每个第一导线组中导线1215的数量可以相同,也可以不同。
在本申请一个实施例中,一并参照图6和图7,每个第一导线组的位于第一线圈绕组121的第一连接端1211的部分可与一个焊盘1213固定连接。由于固定于每个焊盘1213的导线1215的总宽度越小,磁通量就越小,其形成的涡流损耗越小。但是受焊盘1213设置数量的限制,有时需要多条导线1215共用一个焊盘1213,这样会使连接于每个焊盘1213的导线1215的总宽度变大,此时需要将该连接于一个焊盘1213的导线1215尽量靠近,以减少涡流。
另外,第一线圈绕组121的第一引出端1212可与外部电路进行连接。在将该第一引出端1212与外部电路连接时,可将其固定于焊盘1214,从而使第一线圈绕组121通过焊盘焊接的方式与外部电路连接,其可有效的简化第一线圈绕组121与外部电路之间的连接,并使其连接较为可靠。
参照图8,在具体设置第二线圈绕组122时,第二线圈绕组122也可为由多条导线1225绕制而成的多匝线圈结构。相类似的,该第二线圈绕组122可为采用螺旋式绕制方式形成的平面结构,其形状可以但不限于为圆形、椭圆形或者多边形等。另外,导线1225的截 面形状可以但不限于为矩形、圆形或者椭圆形等,在该导线1225的表面涂覆有绝缘漆膜,或者包覆有绝缘材料层,以使第二线圈绕组122的每相邻的两条导线1225之间绝缘设置,从而避免导线1225之间的短路。另外,在本申请实施例中,以第二线圈绕组122的位于多匝线圈结构内侧的端部称为第二连接端1221,以及位于多匝线圈结构外侧的端部称为第二引出端1222为例进行说明。
另外,第二线圈绕组122的多条导线1225也可在其第二连接端1221分为至少两个第二导线组,每个第二导线组包括至少一匝线圈,且每个第二导线组中导线1225的数量可以相同,也可以不同。每个第二导线组可与一个焊盘1223固定连接,第二线圈绕组122的第二引出端1222与外部电路连接。在将该第二引出端1222与外部电路连接时,可将其固定于焊盘1224,从而使第一线圈绕组121通过焊盘焊接的方式与外部电路连接,其可有效的简化第二线圈绕组122与外部电路之间的连接,并使其连接较为可靠。
在本申请实施例中,一并参照图6和图8,第一线圈绕组121的第一连接端1211可与第二线圈绕组122的第二连接端1221电连接。可以理解的是,当对第一线圈绕组121的多条导线1215以及第二线圈绕组122的多条导线1225进行分组时,可以使第一线圈绕组121的多条导线1215的分组的数量,与第二线圈绕组122的多条导线1225的分组的数量相同,也可以使第一线圈绕组121的多条导线1215的分组的数量,与第二线圈绕组122的多条导线1225的分组的数量不同。
另外,当相连接的第一导线组与第二导线组的导线的数量相同时,可以使第一线圈绕组121的多条导线1215与第二线圈绕组122的多条导线1225之间均能够实现连接。在另外一些实施例中,也可以使相连接的第一导线组与第二导线组的导线的数量不同。
另外,一并参照图6和图8,在第一线圈绕组121的第一连接端1211与第二线圈绕组122的第二连接端1221相连接时,第一线圈绕组121的第一引出端1212可作为输入端与外部电路连接,第二线圈绕组122的第二引出端1222可作为输出端与外部电路连接;或者,第一线圈绕组121的第一引出端1212可作为输出端与外部电路连接,第二线圈绕组122的第二引出端1222可作为输入端与外部电路连接。
可参照图5,本申请实施例的线圈组件1的电路板123可以但不限于为印制电路板(printed circuit board,PCB)或者柔性电路板(flexible printed circuit,FPC)。该电路板123可作为第一线圈绕组121与第二线圈绕组122之间连接的介质。
在具体设置该电路板123时,电路板123包括多个线路层,电路板123可与第一线圈绕组121和第二线圈绕组122层叠设置。另外,当第一线圈绕组121和第二线圈绕组122的中间的孔足够大时,可将电路板123设置于第一线圈绕组121和第二线圈绕组122的中间的孔的区域内。电路板123上设置有多个第一端子,参照图9a,每个第一端子处可设置有一个焊盘1231。另外,参照图9b,电路板123上还设置有多个第二端子,每个第二端子处可设置有一个多个焊盘1232。其中,图9a为电路板的第一表面的结构示意图,图9b为电路板的第二表面的结构示意图,该第一表面和该第二表面可为该电路板的相背的两个表面。在本申请实施例中,焊盘1231与焊盘1232之间可通过走线1233连接。
一并参照图6和图8,当对第一线圈绕组121的多条导线1215以及第二线圈的多条导线1225进行分组时,可使第一线圈绕组121的每个第一导线组与图9a中所示的一个焊盘1231进行连接,并使第二线圈绕组122的每个第二导线组与图9b中所示的一个焊盘1232进行连接。可以理解的是,在本申请实施例中,第一线圈绕组121的每个第一导线组与一 个焊盘1231进行连接后,可以通过与该焊盘1231连接的焊盘1232连接于第二线圈绕组122的一个第二导线组,以实现第一线圈绕组121与第二线圈绕组122的连接。
另外,当第一线圈绕组121的每个第一导线组位于第一连接端1211的部分连接有焊盘1213,且第二线圈绕组122的每个第二导线组位于第二连接端1221的部分连接有焊盘1223时,可使每个焊盘1213对应焊接于一个焊盘1231,第二线圈绕组122的第二连接端1221的每个焊盘1223可对应焊接于一个焊盘1232,从而有利于简化第一线圈绕组121、第二线圈绕组122与电路板123之间的连接工艺,从而有利于提高线圈组件1的生产效率。
针对每个线圈绕组,在对其通入交变电的情况下,其产生的交变磁通会在相邻的两个线圈之间的缝隙中产生不必要的环流,从而增加线圈绕组的发热,进而降低电能的传输效率。为了解决这一问题,在本申请一个实施例中,可使图6所示的第一线圈绕组121的多个第一导线组与图8中所示的第二线圈绕组122的多个第二导线组之间形成错位相连的结构。其中,两线圈绕组的导线组之间的错位相连是指:在第一排列方向上,第一线圈绕组121的位于第一位置处的第一导线组,与第二线圈绕组122的位于第二位置处的第二导线组相连接,且第一位置与第二位置不同。另外,值得一提的是,在本申请中,第一排列方向是指多条导线并排设置时,其中的一个排列方向。可以理解的是,当多个第一导线组与多个第二导线组交叉相连时,用于连接多个第一导线组与多个第二导线组的连接线中的至少两条交叉设置。
为了便于对第一线圈绕组121的多个第一导线组与第二线圈绕组122的多个第二导线组之间的错位相连进行理解,可以将第一线圈绕组121的多条导线1215匝线圈分为6个第一导线组,且第二线圈绕组122的多条导线1225分为6个第二导线组为例进行说明。
具体的,将第一线圈绕组121的多条导线1215在第一排列方向(图7中箭头所示的方向)上分为如图6所示的6个第一导线组,且每个第一导线组的位于第一连接端1211的部分与一个焊盘1213连接,参照图7,该多个焊盘1213按照第一排列方向依次标记为L11、L12、L13、L14、L15和L16。
相类似的,将第二线圈绕组122的多条导线1225在第一排列上分为如图8所示的6个第二导线组,每个第二导线组的位于第二连接端1221的部分与一个焊盘1223连接,该多个焊盘1223按照第一排列方向依次标记为L41、L42、L43、L44、L45和L46。其中,标记为L11的焊盘1213与标记为L46焊盘1223连接,标记为L12的焊盘1213与标记为L45的焊盘1223连接,标记为L13的焊盘1213与标记为L44的焊盘1223连接,标记为L14的焊盘1213与标记为L43的焊盘1223连接,标记为L15的焊盘1213与标记为L42的焊盘1223连接,标记为L16的焊盘1213与标记为L41的焊盘1223连接。从而实现第一线圈绕组121的多个第一导线组与第二线圈绕组122的多个第二导线组之间的错位相连。另外,在该实施例中,用于连接多个第二导线组与多个第一导线组的多条连接线之间两两交叉设置,从而可使多个第一导线组缝隙内的磁通和多个第二导线组缝隙内的磁通互相抵消,以减少两个线圈绕组的线圈缝隙内的环流的产生,进而有效的降低线圈绕组的额外发热。
可以理解的是,上述多个焊盘1213与多个焊盘1223的对应连接关系只是本申请的一种示例性的说明。在本请其它实施例中,多个焊盘1213与多个焊盘1223之间的对应连接关系还可与上述实施例不同,只要能够实现第一线圈绕组121的至少两个第一导线组与第二线圈绕组122的至少两个第二导线组之间的错位相连即可。
为了实现第一线圈绕组121的多个第一导线组与第二线圈绕组122的多个第二导线组之间的错位相连,在本申请一个可能的实施例中,在具体设置电路板123时,参照图9a,可使多个焊盘1231设置于电路板123的第一表面;另外,参照图9b,可将多个焊盘1232设置于电路板123的第二表面。
在该实施例中,可使每个焊盘1231与每个焊盘1232通过一条走线1233连接,这样可使多条走线1233中的至少两条在图9a或图9b中所示的电路板123的交叉区域Q,分别通过穿过电路板123的线路层的不同位置处的过孔1234进行换层时进行交叉设置,以实现焊盘1231和焊盘1232的错位相连。其中,过孔1234的形状可以但不限于为条形、圆弧孔、波浪形孔或者梳状孔等。
可以理解的是,在该实施例中,当第一端子为n个,第二端子为n个时,用于连接n个第一端子与n个第二端子的走线为n条。此时,可参照图9a,在将该n条走线进行交叉设置时,可使其中的一条走线不换层,而使另外的n-1条走线经过n-1个位置处的过孔换至与上述未换层的走线不同的线路层进行交叉设置,以避免走线之间的接触短路。其中,可使n个第一端子沿第一方向排列,n个第二端子沿第一方向排列,则第一端子与第二端子通过走线连接,在连接多个第一端子与多个第二端子的多条走线中,至少两条走线在交叉区域Q通过过孔更换至不同线路层进行交叉设置,具体为:第一个第一端子与第n个第二端子通过第一条走线连接,第二个第一端子与第n-1个第二端子通过第二条走线连接,以此类推,第n-1个第一端子与第二个第二端子通过第n-1条走线连接,第n个第一端子与第一个第二端子通过第n条走线连接。另外,第二条走线在交叉区域Q通过第一位置处的过孔更换至与第一条走线不同的线路层,第n-1条走线在交叉区域Q通过第n-2位置处的过孔更换至与第一条走线不同的线路层,第n条走线在交叉区域Q通过第n-1位置处的第一过孔更换至与第一条走线不同的线路层,其中,n为大于等于2的整数。
为了便于对连接n个第一端子与n个第二端子的多条走线1233在交叉区域Q通过过孔1234更换至不同线路层进行交叉设置进行理解,参照图9a和图9b,以第一端子为六个,第二端子为六个,每个第一端子与一个焊盘1231连接,每个第二端子与一个焊盘1232连接为例进行说明。其中,参照图9a,用于连接六个焊盘1231和六个焊盘1232的六条走线1233沿第一排列方向依次标记为L21、L22、L23、L24、L25、L26,第一个焊盘1231与第六个焊盘1232通过标记为L21的走线1233连接,第二个焊盘1231与第五个焊盘1232通过标记为L22的走线1233连接,第三个焊盘1231与第四个焊盘1232通过标记为L23的走线1233连接,第四个焊盘1231与第三个焊盘1232通过标记为L24的走线1233连接,第五个焊盘1231与第二个焊盘1232通过标记为L25的走线1233连接,第六个焊盘1231与第一个焊盘1232通过标记为L26的走线1233连接。另外,标记为L21的走线1233在交叉区域Q未换层,一并参照图9a和图9b,标记为L22的走线1233在交叉区域Q通过第一位置处的过孔1234a更换至与标记为L21的走线1233不同的线路层,标记为L23的走线1233在交叉区域Q通过第二位置处的过孔1234b更换至与标记为L21的走线1233不同的线路层,标记为L24的走线1233在交叉区域Q通过第三位置处的过孔1234c更换至与标记为L21的走线1233不同的线路层,标记为L25的走线1233在交叉区域Q通过第四位置处的过孔1234d更换至与标记为L21的走线1233不同的线路层,标记为L26的走线1233在交叉区域Q通过第五位置处的过孔1234e更换至与标记为L21的走线1233不同的线路层,以避免各条走线1233之间的接触短路。
可以理解的是,上述图9a中的多条走线1233在对应的过孔处换层后可与图9b所示的线路层上的对应位置处的走线电连接。另外,上述走线1233的换层方式只是本申请一种实施例给出的示例性的说明,在本申请另外一些实施例中,各条走线1233还可以通过图9a和图9b中所示的位于交叉区域Q内的沿第一排列方向进行设置的多个位置处的过孔1235,或者沿第一排列方向进行设置的多个位置处的过孔1236进行换层或者与电路板123的其它层结构上的走线进行电连接。
另外,还可使用于连接焊盘1231与焊盘1232的走线1233在电路板123的第一表面和第二表面上呈环形绕制。针对交叉设置的两条走线1233,可以使其中一条走线1233在电路板123的第一表面或第二表面的投影围成的面积,与另一条走线1233在电路板123的第一表面或第二表面的投影围成的面积相近。以使该两条走线1233产生的磁感量相近,又因为该两条走线1233交叉设置,故该两条走线1233围成的区域内的磁通方向相反,从而可以使这两部分的磁通相互抵消。以避免电路板123走线1233对线圈组件1的磁通产生影响。
需要说明的是,二者面积相近指的是二者的面积差不多或者二者面积的差值小于面积阈值,该面积阈值为一个较小的值。
在该实施例中,一并参照图6、图8和图9a、图9b,在将第一线圈绕组121以及第二线圈绕组122分别与电路板123进行连接时,可使第一线圈绕组121的多个焊盘1213与相同数量的焊盘1231一一对应焊接,并使第二线圈绕组122的多个焊盘1223与相同数量的焊盘1232一一对应焊接。可以理解的是,第一线圈绕组121的一个焊盘1213与一个焊盘1231连接后,可通过一个焊盘1232与第二线圈绕组122的一个焊盘1223连接。这样,在将第一线圈绕组121的多个第一导线组与第二线圈绕组122的多个第二导线组进行连接时,可减少对其连接关系进行确认的过程,从而可有效的简化第一线圈绕组121及第二线圈绕组122的互连过程。
另外,为了进一步简化第一线圈绕组121以及第二线圈绕组122与电路板123的连接过程,可以使第一线圈绕组121的焊盘1213、第二线圈绕组122的焊盘1223,电路板123上的焊盘1231以及焊盘1232的数量均相同,且排列方向相同。
参照图10,第一线圈绕组121和第二线圈绕组122的缝隙磁通量抵消原理为:包括第一线圈绕组121、第二线圈绕组122以及电路板123的绕组单元具有4个电感结构,分别为将第一线圈绕组121分组后形成的多个第一导线组(分别用L11,…,L1n表示),电路板123的第一表面上的与多个焊盘1231分别连接的多条走线(分别用L21,…,L2n表示),以及第二表面上的与多个焊盘1232分别连接的多条走线(分别用L31,…,L3n表示),将第二线圈绕组122分组后形成的多个第二导线组(分别用L41,…,L4n表示)。
继续参照图10,电路板123上的用于连接焊盘1231和焊盘1232的多条走线1233中的至少两条之间成交叉设置的结构,示例性的,走线L21连接到走线L3n上,走线L2n连接到走线L31上,以使其形成一个两两交叉的结构。此时,可使第一导线组L11、走线L21串联,走线L31、第二导线组L11串联。相类似的,可使第一导线组L1n、走线L2n串联,走线L3n、第二导线组L4n串联。从而使第一线圈绕组121的多个第一导线组与第二线圈绕组122的多个第二导线组之间通过电路板123实现错位相连。在图10中,“.”和“*”分别代表磁通穿过上述4个电感结构的方向,且“.”和“*”分别代表两个相反的方向,从而使第一线圈绕组121的多个第一导线组缝隙内的磁通和第二线圈绕组122的多个第二导线组缝 隙内的磁通互相抵消,以减少两个线圈绕组的线圈缝隙内的环流的产生,进而有效的降低线圈绕组的额外发热。
另外,在图10中示意了第一线圈绕组121的n个第一导线组与第二线圈绕组122的n个第二导线组的错位相连的设置方式。在该实施例中,n可取为偶数,以可以实现用于连接第一导线组与第二导线组多条走线的两两交叉设置,从而使第一线圈绕组121的第一导线组间的缝隙内的磁通和第二线圈绕组122的第二导线组间的缝隙内的磁通完全被抵消,以实现两个线圈绕组的零环流结构。
当n取奇数时,会多出一个第一导线组与一个第二导线组的缝隙内的磁通无法抵消,但当n足够大(n>4)时,即使只有一组导线组没有对消,在大部分导线组的缝隙磁通能对消的情况下,其仍然能有效的降低线圈绕组的发热,从而使电能传输效率得到提高。在该实施例中,在具体设置电路板时,可以第一端子为五个,第二端子为五个为例,对n取奇数时第一端子与第二端子的连接方式进行说明。此时,也可参照图9a和图9b,由于图9a和图9b中展示了六个第一端子和六个第二端子的连接方式,在第一端子为五个,第二端子为五个时可以参照其中的部分走线的设置。具体的,可使每个第一端子与一个焊盘1231连接,每个第二端子与一个焊盘1232连接,参照图9a,用于连接五个焊盘1231和五个焊盘1232的五条走线1233沿第一排列方向依次标记为L21、L22、L23、L24、L25,第一个焊盘1231与第五个焊盘1232通过标记为L21的走线1233连接,第二个焊盘1231与第四个焊盘1232通过标记为L22的走线1233连接,第三个焊盘1231与第二个焊盘1232通过标记为L23的走线1233连接,第四个焊盘1231与第三个焊盘1232通过标记为L24的走线1233连接,第五个焊盘1231与第一个焊盘1232通过标记为L25的走线1233连接。另外,标记为L21的走线1233在交叉区域Q未换层,一并参照图9a和图9b,标记为L22的走线1233在交叉区域Q通过第一位置处的过孔1234a更换至与标记为L21的走线1233不同的线路层,标记为L23的走线1233在交叉区域Q通过第二位置处的过孔1234b更换至与标记为L21的走线1233不同的线路层,标记为L24的走线1233在交叉区域Q通过第三位置处的过孔1234c更换至与标记为L21的走线1233不同的线路层,标记为L25的走线1233在交叉区域Q通过第四位置处的过孔1234d更换至与标记为L21的走线1233不同的线路层,以避免各条走线1233之间的接触短路。
在将第一线圈绕组121和第二线圈绕组122进行错位相连时,一并参照图11、图12a和图12b,本申请实施例的绕组单元12的电路板123除了采用上述实施例的设置方式外,还可以将焊盘1231以及焊盘1232设置于电路板123的同一层结构的表面。通过将电路板123上的用于与第一线圈绕组121和第二线圈绕组122的焊盘均分布在电路板123的同一面,这样可以有效的简化第一线圈绕组121和第二线圈绕组122与电路板123之间的焊接工艺,从而提高生产效率。
在该实施例中,参照图12a和图12b,电路板123可以包括多个线路层,这样可以使用于连接焊盘1231和焊盘1232的多条走线1233通过设置于如图12a或12b中所示的电路板123的交叉区域Q的过孔1234更换至不同的线路层来实现交叉,以实现焊盘1231和焊盘1232的错位相连。其中,多条走线1233通过交叉区域Q的过孔1234更换至不同的线路层来实现交叉设置具体可参照图9a和图9b所示的实施例,在此不进行赘述。另外,还可以但不限于使用于连接焊盘1231与焊盘1232的走线1233在电路板123的第一表面和第二表面上呈环形绕制。另外,针对交叉设置的两条走线1233,可以使其中一条走线1233 在电路板123的第一表面或第二表面的投影围成的面积,与另一条走线1233在电路板123的第一表面或第二表面的投影围成的面积相近。以使该两条走线1233产生的磁感量相近,又因为该两条走线1233交叉设置,故该两条走线1233围成的区域内的磁通方向相反,从而可以使这两部分的磁通相互抵消。
参照图13,本申请一些实施例中,还可以使焊盘1231和焊盘1232设置于电路板123的同一侧表面,并使用于连接焊盘1231和焊盘1232的多条走线1233通过设置于电路板123的交叉区域Q的过孔1234更换至不同的线路层来实现交叉,以实现焊盘1231和焊盘1232的错位相连。
参照图14,在本申请一些实施例中,线圈组件1的绕组单元12为两个,分别为绕组单元12a和绕组单元12b。其中,绕组单元12a包括第一线圈绕组121a、第二线圈绕组122a和电路板123a;绕组单元12b包括第一线圈绕组121b、第二线圈绕组122b和电路板123b。
其中,第一线圈绕组121a的多个第一导线组、第二线圈绕组122a的多个第二导线组通过电路板123a实现错位相连。第一线圈绕组121b的多个第一导线组、第二线圈绕组122b的多个第二导线组通过电路板123b实现错位相连。在该实施例中,在对电路板123a和电路板123b进行具体设置时,可参照图9a和图9b所示的实施例进行设置,或者参照图12a和图12b所示的实施例进行设置,又或者参照图13所示的实施例进行设置,在此不进行赘述。当然,在上述实施例提供的电路板123的设置方式的基础上,对电路板123的具体设置作出的一些变形,其均在本申请的保护范围内。
另外,电路板123a和电路板123b的设置方式可以相同,也可以不同,只要使第一线圈绕组121a的多个第一导线组、第二线圈绕组122a的多个第二导线组能够通过电路板123a实现错位相连,使第一线圈绕组121b的多个第一导线组、第二线圈绕组122b的多个第二导线组通过电路板123b实现错位相连即可。
在本申请该实施例中,第一线圈绕组121a的第一引出端1212a,与第一线圈绕组121b的第一引出端1212b电连接形成与外部电路连接的一个端子C,且第二线圈绕组122a的第二引出端1222a,与第二线圈绕组122b的第二引出端1222b电连接形成与外部电路连接的一个端子D。从而使包括第一线圈绕组121a、第二线圈绕组122a通过电路板123a错位相连形成的结构的绕组单元12a,与包括第二线圈绕组122b、第二线圈绕组122b通过电路板123b错位相连形成的结构的绕组单元12b之间并联。
一并参照图15,在该实施例中,第一线圈绕组121a的多个第一导线组(分别用L11,…,L1n表示)、第二线圈绕组122a的多个第二导线组(分别用L41,…,L4n表示)能够通过电路板123a实现错位相连,其中,电路板123a的第一表面的多条走线分别用L21,…,L2n表示,电路板123a的第二表面的多条走线分别用L31,…,L3n表示;另外,第一线圈绕组121b的多个第一导线组(分别用L11′,…,L1n′表示)、第二线圈绕组122b的多个第二导线组(分别用L41′,…,L4n′表示)通过电路板123b实现错位相连,其中,电路板123b的第一表面的多条走线,分别用L21′,…,L2n′表示,电路板123b的第二表面的多条走线分别用L31′,…,L3n′表示。
在图15中,“.”和“*”分别代表磁通的方向,且“.”和“*”分别代表两个相反的方向。采用本方案可以使第一线圈绕组121a的第一导线组间的缝隙内的磁通和第二线圈绕组122a的第二导线组间的缝隙内的磁通互相抵消,使第一线圈绕组121b的第一导线组间的缝隙内的磁通和第二线圈绕组122b的第二导线组间的缝隙内的磁通互相抵消,以减少线圈绕 组的线圈缝隙内的环流的产生,进而有效的降低线圈绕组的额外发热。
另外,通过将包括第一线圈绕组121a、第二线圈绕组122a通过电路板123a错位相连形成的结构的绕组单元12,与包括第二线圈绕组122b、第二线圈绕组122b通过电路板123b错位相连形成的结构的绕组单元12之间并联,可以有效的降低线圈绕组的阻抗(为只包括一个绕组单元12的线圈组件1的线圈绕组的阻抗的一半)。
可以理解的是,当线圈组件中包括两个以上的绕组单元时,其可参照上述实施例进行设置以形成两个以上的绕组单元的并联结构,从而进一步降低线圈组件的线圈绕组的阻抗。
参照图14,在本申请另外一些实施例中,线圈组件1包括两个绕组单元12时,一个绕组单元12包括第一线圈绕组121a、第二线圈绕组122a和电路板123a;另一个绕组单元12包括第一线圈绕组121b、第二线圈绕组122b和电路板123b。
其中,第一线圈绕组121a的多个第一导线组、第二线圈绕组122a的多个第二导线组通过电路板123a实现错位相连。第一线圈绕组121b的多个第一导线组、第二线圈绕组122b的多个第二导线组通过电路板123b实现错位相连。在该实施例中,在对电路板123a和电路板123b进行具体设置时,可参照图9a和图9b所示的实施例进行设置,或者参照图12a和图12b所示的实施例进行设置,又或者参照图13所示的实施例进行设置,在此不进行赘述。当然,在上述实施例提供的123a和电路板123b的设置方式的基础上,对123a和电路板123b的具体设置作出的一些变形,其均在本申请的保护范围内。
另外,电路板123a和电路板123b的设置方式可以相同,也可以不同,只要使第一线圈绕组121a的多个第一导线组、第二线圈绕组122a的多个第二导线组能够通过电路板123a实现错位相连,使第一线圈绕组121b的多个第一导线组、第二线圈绕组122b的多个第二导线组通过电路板123b实现错位相连即可。
在该实施例中,第一线圈绕组121a的第一引出端1212a作为与外部电路连接的一个端子,第一线圈绕组121b的第一引出端1212b与第二线圈绕组122a的第二引出端1222a电连接,第二线圈绕组122b的第二引出端1222b作为与外部电路连接的另一个端子。从而使包括第一线圈绕组121a、第二线圈绕组122a通过电路板123a错位相连形成的结构的绕组单元12a,与包括第二线圈绕组122b、第二线圈绕组122b通过电路板123b错位相连形成的结构的绕组单元12b之间串联。
一并参照图16,在该实施例中,第一线圈绕组121a的多个第一导线组(分别用L11,…,L1n表示)、第二线圈绕组122a的多个第二导线组(分别用L41,…,L4n表示)能够通过电路板123a实现错位相连,其中,电路板123a的第一表面的多条走线分别用L21,…,L2n表示,电路板123a的第二表面的多条走线分别用L31,…,L3n表示;另外,第一线圈绕组121b的多个第一导线组(分别用L11′,…,L1n′表示)、第二线圈绕组122b的多个第一导线组(分别用L41′,…,L4n′表示)通过电路板123b实现错位相连,其中,电路板123b的第一表面的多条走线分别用L21′,…,L2n′表示,电路板123b的第二表面的多条走线分别用L31′,…,L3n′表示。
在图16中,“.”和“*”分别代表磁通的方向,且“.”和“*”分别代表两个相反的方向。采用本方案可以使第一线圈绕组121a的第一导线组间的缝隙内的磁通和第二线圈绕组122a的第二导线组间的缝隙内的磁通互相抵消,使第一线圈绕组121b的第一导线组间的缝隙内的磁通和第二线圈绕组122b的第二导线组间的缝隙内的磁通互相抵消,以减少四个线圈绕组的线圈缝隙内的环流的产生,进而有效的降低线圈绕组的额外发热。
另外,在该实施例中,通过将包括第一线圈绕组121a、第二线圈绕组122a通过电路板123a错位相连形成的结构的绕组单元12a,与包括第二线圈绕组122b、第二线圈绕组122b通过电路板123b错位相连形成的结构的绕组单元12b进行串联,可以增加线圈组件1的线圈匝数,提升线圈组件1的磁感量。其可应用于由于电压增益的原因需要调节线圈组件1的线圈感量的场景。
在另外一些实施例中,当线圈组件包括两个以上的绕组单元时,其可参照上述实施例进行设置以形成两个以上的绕组单元的串联结构,从而进一步增加线圈组件的线圈匝数,提升线圈组件的磁感量。在本申请一些实施例中,还可以通过绕组单元之间的串联、并联的组合更加灵活的实现对线圈组件的线圈感量的调节。
在本申请一些实施例中,参照图17,第一线圈绕组121与第二线圈绕组122除了可以采用上述的直接用导线绕制的方式形成以外,还可以采用电路板的加工方式来制作形成第一线圈绕组121与第二线圈绕组122。
在形成第一线圈绕组121时,其具体设置方式与金属导线绕制相类似,可使电路板上的多条走线作为多条导线在电路板123的第一表面上呈螺旋状的形成多匝线圈,从而形成如图18a所示的第一线圈绕组121。相类似的,多条走线在电路板123的第二表面上呈螺旋状的形成多匝线圈,从而形成如图18b所示的第二线圈绕组122。可以理解的是,在图18a和图18b中省略了电路板的层结构,以用于清楚的显示第一线圈绕组121和第二线圈绕组122的结构。
另外,在该实施例中,电路板123上的多个第一端子、多个第二端子,以及用于连接多个第一端子和多个第二端子的多条走线可参照上述实施例进行交叉设置。示例性的,可使多条走线1233c在图20a或图20b中所示的交叉区域Q中的不同位置处的过孔换至电路板123的不同的线路层来实现交叉设置,其具体设置方式可参照图9a和图9b所示的实施例,在此不进行赘述。
参照图18a,图18b,以将第一端子设置于电路板的第一表面,第二端子设置于第二表面,第一线圈绕组121形成于电路板的第一表面,第二线圈绕组122形成于电路板的第二表面为例,对本实施例的第一线圈绕组121和第二线圈绕组122的形成方式,以及第一线圈绕组121与第一端子进行连接,第二线圈绕组122与第二端子进行连接的过程进行说明。
首先,参照图18a和图18b,电路板的第一表面上的多条走线1233a和第二表面上的多条走线1233b通过图19a中所示的过孔1234a和图19b中所示的过孔1234b相并联。参照图18a和图18b,该并联的多条走线1233a和多条走线1233b同时沿顺时针方向绕制一周。
之后,图18b中的多条走线1233b通过过孔1234c换层到图18a所示的电路板的第一表面,并继续沿顺时针方向向绕制半径减小的趋势进行绕制形成第一线圈绕组121。可以理解的是,如图18b所示,多条走线1233b的绕制起始端可作为第一线圈绕组121的第一引出端1212,用于与外部电路连接。
最后,第一线圈绕组121的第一连接端1211通过图20a中所示的过孔1234d与电路板的第二表面的走线1233c连接,走线1233c沿顺时针绕制一周从图20a的过孔1234e换层到图18b所示的电路板的第二表面,并作为第二线圈绕组122的第二连接端1221,并继续沿顺时针方向向绕制半径增大的趋势进行绕制,以形成第二线圈绕组122,绕制形成的第二线圈绕组122的第二引出端1222与外部电路连接。
采用本方案可以使第一线圈绕组121的第一导线组间的缝隙内的磁通和第二线圈绕组122的第二导线组间的缝隙内的磁通互相抵消,使第一线圈绕组121的第一导线组间的缝隙内的磁通和第二线圈绕组122的第二导线组间的缝隙内的磁通互相抵消,以减少线圈绕组的线圈缝隙内的环流的产生,进而有效的降低线圈绕组的额外发热。
参照图21,在本申请另外一些实施例中,除了可将第一线圈绕组121与第二线圈绕组122采用相同的方式形成以外,还可以使第一线圈绕组121为采用导线绕制的方式形成的独立的线圈绕组结构,而第二线圈绕组122采用电路板的加工方式来制作形成。
参照图22,在该实施例中,第一线圈绕组121的具体设置方式与上述实施例中采用导线绕制的方式形成的线圈绕组的具体设置方式相同,在此不再进行赘述。
参照图23a,该实施例中,在具体设置第二线圈绕组122时,以第二线圈绕组122设置于电路板123的第一表面为例。首先,多条走线1233沿顺时针方向向绕制半径减小的趋势进行绕制以形成第二线圈绕组122,该多条走线1233的绕制起始端作为第二线圈绕组122的第二引出端1222,多条走线1233的绕制末端作为第二线圈绕组122的第二连接端1221。
然后,以第二线圈绕组122的第二连接端1221作为电路板上的第二端子,多条走线1233继续向绕制半径减小的趋势进行绕制并交叉设置。示例性的,可使多条走线1233在图23a或图23b中所示的交叉区域Q中的不同位置处的过孔1234更换至电路板123的不同的线路层来实现交叉设置,以避免多条走线1233之间的接触短路。其中,在该实施例中,多条走线1233通过交叉区域Q中的不同位置处的过孔1234换至电路板123的不同的线路层来实现交叉设置,具体可参照图9a和图9b所示的实施例,在此不进行赘述。
最后,一并参照图23a和图23b,多条走线1233在电路板的第一表面和第二表面完成绕制,并形成第一端子,该第一端子可形成于电路板123的第一表面或者第二表面。第一线圈绕组121的第一连接端1211可与第一端子进行固定连接。
采用本方案可以使第一线圈绕组121的缝隙内的磁通和第二线圈绕组122的缝隙内的磁通互相抵消,使第一线圈绕组121的缝隙内的磁通和第二线圈绕组122的缝隙内的磁通互相抵消,以减少线圈绕组的线圈缝隙内的环流的产生,进而有效的降低线圈绕组的额外发热。
参照图24,在本申请另外一些实施例中,当第一线圈绕组121与第二线圈绕组122均为独立的线圈绕组结构时,一并参照图25,可将第一线圈绕组121的第一连接端1211处沿第一排列方向延伸,以形成第一延伸部1216,此时可在第一延伸部1216的末端设置焊盘1213。相类似的,参照图26,也可将第二线圈绕组122的第二连接端1221处沿第一排列方向延伸形成第二延伸部1226,并可在该第二延伸部226的末端设置焊盘1223。
在该实施例中,具体设置电路板123时,以电路板123的第一端子与焊盘1231连接,第二端子与焊盘1232连接为例,可一并参照图27a和图27b,电路板123开设有一开槽G,该开槽G开设于与第一端子连接的焊盘1231在该电路板123的第一表面或第二表面上的投影,及与第二端子连接的焊盘1232在该电路板123的第一表面或第二表面上的投影之间的区域,另外,可使该开槽G沿第一排列方向开设。
在将第一线圈绕组121、第二线圈绕组122以及电路板123进行组装时,示例性的,可将第一线圈绕组121的第一延伸部1216伸入至电路板123的开槽G内,并将第一延伸部1216末端的焊盘1213焊接于电路板123的焊盘1231;相类似的,可将第二线圈绕组 122的第二延伸部1226伸入至电路板123的开槽G内,并将第二延伸部1226末端的焊盘1223焊接于电路板123的焊盘1232。
采用本申请实施例的技术方案,在将第一线圈绕组121、第二线圈绕组122以及电路板123进行组装时,可使第一线圈绕组121的第一延伸部1216,与第二线圈绕组122的第二延伸部1226在电路板123的开槽G处层叠设置。其可以有效的避免第一线圈绕组121、第二线圈绕组122以及电路板123三者的层叠,从而有利于实现该线圈组件1的薄型化设计。
经试验验证,与现有技术的无线充电系统相比,本申请实施例的无线充电系统在无线充电器2的发射线圈,与电子设备3的接收线圈正对的情况下,其充电效率至少提高1.3%。在无线充电器2的发射线圈,与电子设备3的接收线圈在水平方向上偏移10mm时,其充电效率至少提高2.39%。因此,本申请实施例的无线充电系统的充电效率得到有效提高。
显然,本领域的技术人员可以对本申请实施例进行各种改动和变型而不脱离本申请实施例的精神和范围。这样,倘若本申请实施例的这些修改和变型属于本申请权利要求及其等同技术的范围之内,则本申请也意图包含这些改动和变型在内。

Claims (23)

  1. 一种线圈组件,其特征在于,包括绕组单元,所述绕组单元包括第一线圈绕组、第二线圈绕组以及电路板,其中:
    所述第一线圈绕组,具有第一连接端和第一引出端,所述第一线圈绕组包括并排设置的多个第一导线组;所述第一引出端用于与外部电路连接;
    所述第二线圈绕组,具有第二连接端和第二引出端,所述第二线圈绕组包括并排设置的多个第二导线组;所述第二引出端用于与外部电路连接;所述第二线圈绕组与所述第一线圈绕组层叠设置;
    所述电路板,包括多个线路层和多个第一过孔,在所述多个线路层上设置有多个第一端子和多个第二端子;所述第一端子与所述第二端子通过走线连接,在连接多个所述第一端子与多个所述第二端子的多条所述走线中,至少两条所述走线在交叉区域通过所述第一过孔更换至不同线路层进行交叉设置;
    所述第一连接端固定于所述第一端子,所述第二连接端固定于所述第二端子。
  2. 如权利要求1所述的线圈组件,其特征在于,所述第一导线组的数量与所述第二导线组的数量相同。
  3. 如权利要求1或2所述的线圈组件,其特征在于,每个所述第一导线组的导线的数量相同或者不同。
  4. 如权利要求1~3任一项所述的线圈组件,其特征在于,每个所述第二导线组的所述导线的数量相同。
  5. 如权利要求1~3任一项所述的线圈组件,其特征在于,相连接的所述第一导线组与所述第二导线组中的导线的条数相同。
  6. 如权利要求1~5任一项所述的线圈组件,其特征在于,所述第一线圈绕组为独立的线圈绕组结构,所述第二线圈绕组为独立的线圈绕组结构;所述第一线圈绕组的所述第一连接端处沿第一排列方向延伸形成第一延伸部,所述第二线圈绕组的所述第二连接端处沿第一排列方向延伸形成第二延伸部;
    所述电路板开设有开槽,所述开槽设置于所述第一端子在所述电路板的第一表面或第二表面上的投影,与所述第二端子在所述电路板的第一表面或第二表面上的投影之间的区域,且所述开槽沿第一排列方向开设;所述第一延伸部伸入至所述开槽与所述第一端子连接,所述第二延伸部伸入至所述开槽与所述第二端子连接,所述第一延伸部与所述第二延伸部在所述开槽处层叠设置。
  7. 如权利要求1~5任一项所述的线圈组件,其特征在于,所述第一线圈绕组为独立的线圈绕组结构;所述第二线圈绕组形成于所述电路板的第一表面,所述第二线圈绕组由多条所述走线绕制形成,所述第二线圈绕组的所述第二连接端作为所述电路板的所述第二端子,并继续沿绕制半径减小的趋势进行绕制且交叉设置后形成所述第一端子,所述第一线圈绕组的所述第一连接端与所述第一端子电连接。
  8. 如权利要求1~5任一项所述的线圈组件,其特征在于,所述第一线圈绕组形成于所述电路板的第一表面,所述第二线圈绕组形成于所述电路板的第二表面,所述第一线圈绕组的所述第一连接端通过一个位置处的第二过孔与所述第一端子电连接,所述第二线圈绕组的所述第二连接端通过另一位置处的所述第二过孔与所述第二端子电连接。
  9. 如权利要求1~8任一项所述的线圈组件,其特征在于,所述第一端子与所述第二端子设置于所述电路板的同一表面;或,所述第一端子设置于所述电路板的第一表面,所述第二端子设置于所述电路板的第二表面,所述第一表面与所述第二表面相背设置。
  10. 如权利要求1~9任一项所述的线圈组件,其特征在于,所述多个第一端子为n个,所述多个第二端子为n个,多条所述走线包括n条,所述多个第一过孔包括n-1个,所述n个第一端子沿第一方向排列,所述n个第二端子沿第一方向排列,则所述第一端子与所述第二端子通过走线连接,在连接多个所述第一端子与多个所述第二端子的多条所述走线中,至少两条所述走线在交叉区域通过第一过孔更换至不同线路层进行交叉设置,具体为:第一个所述第一端子与第n个所述第二端子通过第一条所述走线连接,第二个所述第一端子与第n-1个所述第二端子通过第二条所述走线连接,以此类推,第n-1个所述第一端子与第二个所述第二端子通过第n-1条所述走线连接,第n个所述第一端子与第一个所述第二端子通过第n条所述走线连接;第二条所述走线在所述交叉区域通过第一位置处的第一过孔更换至与第一条所述走线不同的线路层,第n-1条所述走线在所述交叉区域通过第n-2位置处的第一过孔更换至与第一条所述走线不同的线路层,第n条所述走线在所述交叉区域通过第n-1位置处的第一过孔更换至与所述第一条走线不同的线路层,其中,n为大于等于2的整数。
  11. 如权利要求10所述的线圈组件,其特征在于,所述第一端子为偶数个,所述第二端子为偶数个,用于连接多个所述第一端子与多个所述第二端子的多条所述走线两两交叉设置。
  12. 如权利要求10或11所述的线圈组件,其特征在于,若所述多个第一端子为六个,所述多个第二端子为六个,则所述相对应的所述第一端子与所述第二端子通过所述走线连接,在连接多个所述第一端子与多个所述第二端子的多条所述走线中,至少两条所述走线在交叉区域通过第一过孔更换至不同线路层进行交叉设置,具体为:沿所述第一排列方向上,第一个所述第一端子与第六个所述第二端子通过第一条所述走线连接,第二个所述第一端子与第五个所述第二端子通过第二条所述走线连接,第三个所述第一端子与第四个所述第二端子通过第三条所述走线连接,第四个所述第一端子与第三个所述第二端子通过第四条所述走线连接,第五个所述第一端子与第二个所述第二端子通过第五条所述走线连接,第六个所述第一端子与第一个所述第二端子通过第六条所述走线连接;第二条所述走线在所述交叉区域通过第一位置处的第一过孔更换至与第一条所述走线不同的线路层,第三条所述走线在所述交叉区域通过第二位置处的第一过孔更换至与第一条所述走线不同的线路层,第四条所述走线在所述交叉区域通过第三位置处的第一过孔更换至与第一条所述走线不同的线路层,第五条所述走线在所述交叉区域通过第四位置处的第一过孔更换至与第一条所述走线不同的线路层,第六条所述走线在所述交叉区域通过第五位置处的第一过孔更换至与第一条所述走线不同的线路层。
  13. 如权利要求10所述的线圈组件,其特征在于,若所述多个第一端子为五个,所述多个第二端子为五个,则所述相对应的所述第一端子与所述第二端子通过走线连接,在连接多个所述第一端子与多个所述第二端子的多条所述走线中,至少两条所述走线在交叉区域通过第一过孔更换至不同线路层进行交叉设置,具体为:沿所述第一排列方向上,第一个所述第一端子与第五个所述第二端子通过第一条所述走线连接,第二个所述第一端子与第一个所述第四端子通过第二条所述走线连接,第三个所述第一端子与第二个所述第二端 子通过第三条所述走线连接,第四个所述第一端子与第三个所述第二端子通过第四条所述走线连接,第五个所述第一端子与第一个所述第二端子通过第五条所述走线连接;第二条所述走线在所述交叉区域通过第一位置处的第一过孔更换至与第一条所述走线不同的线路层,第三条所述走线在所述交叉区域通过第二位置处的第一过孔更换至与第一条所述走线不同的线路层,第四所条述走线在所述交叉区域通过第三位置处的第一过孔更换至与第一条所述走线不同的线路层,所述第五走线在所述交叉区域通过第四位置处的第一过孔更换至与第一条所述走线不同的线路层。
  14. 如权利要求1~13任一项所述的线圈组件,其特征在于,针对交叉设置的两条所述走线,其中一条所述走线在所述电路板的第一表面或第二表面的投影围成的面积,与另一条所述走线在所述电路板的第一表面或第二表面的投影围成的面积相近。
  15. 如权利要求1~14任一项所述的线圈组件,其特征在于,每相邻的两条所述走线之间的间距相等。
  16. 如权利要求8~14任一项所述的线圈组件,其特征在于,多条所述走线的宽度均相同;或,所述走线形成的线圈半径与所述走线的宽度成正比。
  17. 如权利要求1~16任一项所述的线圈组件,其特征在于,所述线圈组件包括多个所述绕组单元,多个所述绕线单元相层叠设置;且多个所述线圈单元的所述第一线圈绕组的所述第一引出端相连接用于与所述外部电路连接,多个所述线圈单元的所述第二线圈绕组的所述引出端相连接用于与所述外部电路连接。
  18. 如权利要求1~16任一项所述的线圈组件,其特征在于,所述线圈组件包括多个所述绕组单元,多个所述绕线单元相层叠设置;且相邻的两个所述绕组单元中,一个所述绕组单元的所述第二线圈绕组的所述第二引出端,与另一个所述绕组单元的所述第一线圈绕组的所述第一引出端相连接。
  19. 如权利要求1~18任一项所述的线圈组件,其特征在于,所述线圈组件还包括导磁片,所述绕组单元设置于所述导磁片的一侧表面,且所述绕组单元与所述导磁片之间绝缘设置。
  20. 如权利要求19所述的线圈组件,其特征在于,所述导磁片的材质为铁氧体、非晶纳米晶、金属粉芯中的一种或多种。
  21. 一种电子设备,其特征在于,包括受电电路,以及如权利要求1~20任一项所述的线圈组件,所述线圈组件与所述受电电路电连接。
  22. 一种无线充电器,其特征在于,包括供电电路,以及如权利要求1~20任一项所述的线圈组件,其中,所述线圈组件与所述供电电路电连接。
  23. 一种无线充电系统,其特征在于,包括电子设备和无线充电器,其中,所述电子设备与所述无线充电器中的至少一个包括如权利要求1~20任一项所述的线圈组件;所述无线充电器用于为所述电子设备无线充电。
PCT/CN2021/114333 2020-09-22 2021-08-24 一种线圈组件、电子设备及无线充电器 WO2022062805A1 (zh)

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