WO2022062001A1 - 一种骨导麦克风及移动终端 - Google Patents

一种骨导麦克风及移动终端 Download PDF

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Publication number
WO2022062001A1
WO2022062001A1 PCT/CN2020/121815 CN2020121815W WO2022062001A1 WO 2022062001 A1 WO2022062001 A1 WO 2022062001A1 CN 2020121815 W CN2020121815 W CN 2020121815W WO 2022062001 A1 WO2022062001 A1 WO 2022062001A1
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WIPO (PCT)
Prior art keywords
vent hole
diaphragm
cover plate
bone conduction
conduction microphone
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PCT/CN2020/121815
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English (en)
French (fr)
Inventor
张金宇
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AAC Technologies Holdings Shenzhen Co Ltd
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AAC Acoustic Technologies Shenzhen Co Ltd
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Publication of WO2022062001A1 publication Critical patent/WO2022062001A1/zh
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Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/03—Constructional features of telephone transmitters or receivers, e.g. telephone hand-sets
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/04—Microphones

Definitions

  • the utility model relates to the technical field of micro-electromechanical systems, in particular to a bone conduction microphone and a mobile terminal.
  • Microphone scientific name is microphone, translated from English microphone (microphone), also known as microphone or microphone, which is an energy conversion device that converts sound signals into electrical signals.
  • MEMS microphones such as bone conduction microphones
  • MEMS Micro Electro-Mechanical Systems
  • RF Radio Frequency
  • EMI Electromagnetic Interference
  • the structure of the existing bone conduction microphone is usually divided into three independent cavities, and the three cavities are not associated with each other, resulting in low sensitivity of the bone conduction microphone.
  • the purpose of the present invention is to provide a bone conduction microphone and a mobile terminal, aiming at solving the problem of low sensitivity of the existing bone conduction microphone.
  • a first aspect of the embodiments of the present utility model provides a bone conduction microphone, including:
  • the mass block on the membrane, the first substrate, the second substrate and the cover plate are enclosed to form a back cavity
  • the cover plate, the backing plate and the first diaphragm are enclosed to form a middle cavity
  • the body is enclosed to form a front cavity
  • the first diaphragm is provided with a first vent hole
  • the cover plate is provided with a second vent hole corresponding to the position of the first vent hole
  • the bone conduction microphone further includes a through hole.
  • the backing plate is connected to the inverter tube of the first air vent hole and the second air vent hole, and the MEMS chip is located in the back cavity and arranged on the inner side of the cover plate, and the MEMS chip has a back cavity and a first air vent.
  • a second vibrating membrane, the second vibrating membrane is formed with a ventilation hole connecting the back cavity and the back cavity, and a sound hole is opened on the cover plate at a position corresponding to the back cavity.
  • the microphone further includes an ASIC chip located in the back cavity and disposed inside the cover plate, and the ASIC chip is electrically connected to the MEMS chip.
  • a third vent hole is formed on the backing plate at a position corresponding to the first vent hole, and the inverting tube is located in the third vent hole and communicated with the first vent hole and the Second vent.
  • the number of the second substrates is two or more.
  • the housing includes a housing body, a support portion surrounding the housing body and extending toward the first diaphragm.
  • a second aspect of the embodiment of the present invention provides a mobile terminal, including the bone conduction microphone according to the first aspect of the embodiment of the present invention.
  • the middle cavity is compressed (the pressure increases), and the front cavity is stretched (the pressure decreases).
  • the compliance of the microphone is improved, thereby improving the sensitivity of the microphone.
  • the back cavity is connected to the middle cavity. The pressure of the formed cavity is reduced, and a reverse pressure is applied on the side of the first diaphragm facing the cover plate, which further improves the sensitivity of the bone conduction microphone.
  • FIG. 1 is a schematic structural diagram of a bone conduction microphone provided by an embodiment of the present invention.
  • FIG. 2 is an exploded schematic diagram of a bone conduction microphone provided by an embodiment of the present invention.
  • FIG. 3 is a cross-sectional view of the bone conduction microphone provided by an embodiment of the present invention along the direction A-A in FIG. 1;
  • FIG. 4 is a module block diagram of a mobile terminal provided by an embodiment of the present invention.
  • FIG. 1 is a schematic structural diagram of a bone conduction microphone provided by an embodiment of the present invention
  • FIG. 2 is an exploded schematic diagram of a bone conduction microphone provided by an embodiment of the present invention
  • FIG. 3 is the present invention A cross-sectional view of the bone conduction microphone provided by the novel embodiment along the AA direction in FIG. 1 .
  • the bone conduction microphone provided by the first embodiment of the present invention includes a first base plate 1 , a second base plate 2 disposed on the first base plate 1 and having a first hollow portion 21 , The cover plate 3 arranged on the second base plate 2, the backing plate 4 arranged on the cover plate 3 and having the second hollow portion 41, the first diaphragm 5 arranged on the backing plate 4, the The casing 6 on the first diaphragm 5, the mass block 7 located between the first diaphragm 5 and the casing 6 and disposed on the first diaphragm 5, the first diaphragm 5
  • the substrate 1 , the second substrate 2 and the cover plate 3 are enclosed to form a rear cavity 13
  • the cover plate 3 , the backing plate 4 and the first diaphragm 5 are enclosed to form a middle cavity 12 , the first diaphragm 5 and the casing 6.
  • the front cavity 11 is formed by enclosing, the first diaphragm 5 is provided with a first vent hole 51, the cover plate 3 is provided with a second vent hole 31 corresponding to the position of the first vent hole 51, and the The bone conduction microphone also includes an inverted tube 8 penetrating the backing plate 4 and communicating with the first air vent hole 51 and the second air vent hole 31 .
  • MEMS chip 9 the MEMS chip 9 has a back cavity 91 and a second diaphragm 92, the second diaphragm 92 is formed with a ventilation hole 93 connecting the back cavity 91 and the back cavity 13, the cover plate 3 A sound hole 32 is opened at a position corresponding to the back cavity 91 .
  • annular channel enclosed by the arrow B in FIG. 3 is an air flow channel. Due to the combined action of the first air vent 51 , the second air vent 31 , the inverted tube 8 , the vent hole 93 and the sound hole 32 , the The front cavity 11 , the rear cavity 13 and the middle cavity 12 communicate with each other.
  • vent hole 93 formed on the second diaphragm 92 can be easily processed to several microns, thereby ensuring a flat frequency response of the bone conduction microphone.
  • the number of the second substrates 2 may be increased or decreased according to specific application conditions.
  • the materials of the cover plate 3 and the casing 6 in this embodiment are both metal.
  • the mass block 7 drives the first diaphragm 5 to move in the direction of the cover plate 3 , the middle cavity 12 is compressed (the pressure increases), and the front cavity 11 is stretched ( pressure decreases), since the inverter tube 8 is connected to the front cavity 11 and the rear cavity 13, the front cavity 11 and the rear cavity 13 are combined into a large cavity, which improves the compliance of the bone conduction microphone, thereby improving the bone conduction microphone. sensitivity.
  • the back cavity 13 is connected to the middle cavity 12, and the middle cavity
  • the pressure of 12 increases, the pressure of the cavity formed by the front cavity 11 and the rear cavity 13 decreases, and a reverse pressure is applied on the side of the first diaphragm 5 toward the cover plate 3, which further improves the sensitivity of the bone conduction microphone.
  • FIG. 2 is an exploded schematic view of the bone conduction microphone provided by the embodiment of the present invention
  • FIG. 3 is a cross-sectional view of the bone conduction microphone provided by the embodiment of the present invention along the direction A-A in FIG. 1 .
  • the second embodiment of the present invention adds an ASIC chip 10 .
  • the bone conduction microphone in this embodiment further includes an ASIC chip 10 located in the back cavity 13 and disposed inside the cover plate 3 , and the ASIC chip 10 is electrically connected to the MEMS chip 9 . .
  • the MEMS chip 9 when the capacitance of the MEMS chip 9 changes (indicating that it has received the sound wave signal), the MEMS chip 9 sends the sound wave signal to the ASIC chip 10 for processing, and the corresponding signal can be obtained and output to complete the sound transmission.
  • a position of the backing plate 4 corresponding to the first air vent hole 51 is provided.
  • the third vent hole 42 is formed.
  • the inverter tube 8 is located in the third vent hole 42 and communicated with the first vent hole 51 and the second vent hole 31 .
  • the casing 6 in this embodiment includes a casing body 61, which surrounds the casing body 61 and faces the The support portion 62 extending in the direction of the first diaphragm 5 is in contact with the first diaphragm 5 at one end of the support portion 62 away from the housing body 61 .
  • FIG. 4 is a block diagram of a module of a mobile terminal according to an embodiment of the present invention.
  • the mobile terminal 100 provided by the third embodiment of the present invention includes the bone conduction microphone 101 provided by the first embodiment and/or the second embodiment of the present invention.
  • the mobile terminal 100 includes, but is not limited to, a mobile phone, a notebook computer, a tablet computer, a POS machine, and a vehicle-mounted computer.

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  • Engineering & Computer Science (AREA)
  • Signal Processing (AREA)
  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)

Abstract

本实用新型提供了一种骨导麦克风及移动终端，麦克风包括依次层叠设置的第一基板、第二基板、盖板、垫板、第一振膜及壳体，所述第一基板、第二基板及盖板围合形成后腔，所述盖板、垫板及第一振膜围合形成中腔，所述第一振膜及壳体围合形成前腔，所述第一振膜上开设有第一泄气孔，所述盖板对应第一泄气孔的位置开设有第二泄气孔，所述麦克风还包括贯穿所述垫板且连通第一泄气孔及第二泄气孔的倒相管，位于所述后腔内且设置在盖板内侧的MEMS芯片，所述MEMS芯片具有背腔及第二振膜，所述第二振膜上形成有连通所述背腔与后腔的通气孔，所述盖板上对应背腔的位置开设有声孔。本实用新型能够有效提升骨导麦克风的灵敏度。

Description

一种骨导麦克风及移动终端 技术领域
本实用新型涉及微机电系统技术领域，尤其涉及一种骨导麦克风及移动终端。
 背景技术
麦克风，学名为传声器，由英语microphone（送话器）翻译而来，也称话筒或微音器，其是将声音信号转换为电信号的能量转换器件。近些年来，基于MEMS（微型机电系统）技术制造的MEMS麦克风（如骨导麦克风），凭借改进的噪声消除性能与良好的 RF（射频） 及 EMI（电磁干扰） 抑制性能，已在多种应用中体现出了诸多优势，特别是在中高端手机应用中。
现有的骨导麦克风的结构通常分为三个独立的腔体，三个腔体彼此不关联，导致骨导麦克风的灵敏度较低。
因此，有必要对上述骨导麦克风的结构进行改进。
 技术问题
本实用新型的目的在于提供一种骨导麦克风及移动终端，旨在解决现有的骨导麦克风灵敏度较低的问题。
 技术解决方案
本实用新型的技术方案如下：
本实用新型实施例第一方面提供了一种骨导麦克风，包括：
第一基板，设置在所述第一基板上且具有第一镂空部的第二基板，设置在所述第二基板上的盖板，设置在所述盖板上且具有第二镂空部的垫板，设置在所述垫板上的第一振膜，设置在所述第一振膜上的壳体，位于所述第一振膜与所述壳体之间且设置在所述第一振膜上的质量块，所述第一基板、第二基板及盖板围合形成后腔，所述盖板、垫板及第一振膜围合形成中腔，所述第一振膜及壳体围合形成前腔，所述第一振膜上开设有第一泄气孔，所述盖板对应于所述第一泄气孔的位置开设有第二泄气孔，所述骨导麦克风还包括贯穿所述垫板且连通于所述第一泄气孔及第二泄气孔的倒相管，位于所述后腔内且设置在所述盖板内侧的MEMS芯片，所述MEMS芯片具有背腔及第二振膜，所述第二振膜上形成有连通所述背腔与后腔的通气孔，所述盖板上对应于所述背腔的位置开设有声孔。
在一些实施方案中，所述麦克风还包括位于所述后腔内且设置在所述盖板内侧的ASIC芯片，所述ASIC芯片与所述MEMS芯片电连接。
在一些实施方案中，所述垫板对应于所述第一泄气孔的位置开设有第三泄气孔，所述倒相管位于所述第三泄气孔内且连通于所述第一泄气孔及第二泄气孔。
在一些实施方案中，所述第二基板的数量为两个或两个以上。
在一些实施方案中，所述壳体包括壳体本体，围绕所述壳体本体且朝所述第一振膜方向延伸的支撑部。
本实用新型实施例第二方面提供了一种移动终端，包括如本实用新型实施例第一方面所述的骨导麦克风。
 有益效果
从上述描述可知，与现有技术相比，本实用新型的有益效果在于：
当质量块带动第一振膜向盖板方向运动时，中腔被压缩（压强增大），前腔被拉伸（压强减小），由于倒相管连通前腔和后腔，使得前腔和后腔合并为一个大腔体，提升了麦克风的顺性，从而提升了麦克风的灵敏度。同时，又由于MEMS芯片的第二振膜上的通气孔、MEMS芯片的背腔及盖板上的声孔的作用，使得后腔连通中腔，当中腔压强增大时，前腔和后腔组成的腔体压强减小，会在第一振膜朝向盖板一侧施加反向压强，进一步提升了骨导麦克风的灵敏度。
 附图说明
为了更清楚地说明本实用新型实施例或现有技术中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍。显而易见地，下面描述中的附图仅仅是本实用新型的一些实施例，而不是全部实施例。对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据提供的附图获得其他的附图。
图1为本实用新型实施例提供的骨导麦克风的结构示意图；
图2为本实用新型实施例提供的骨导麦克风的分解示意图；
图3为本实用新型实施例提供的骨导麦克风沿图1中A-A方向的剖视图；
图4为本实用新型实施例提供的移动终端的模块方框图。
 本发明的实施方式
为了使本实用新型的目的、技术方案及优点更加清楚明白，以下结合附图及实施例，对本实用新型进行进一步详细说明，其中自始至终相同或类似的标号表示相同或类似的元件或具有相同或类似功能的元件。应当理解，此处所描述的具体实施例仅仅用以解释本实用新型，并不用于限定本实用新型。此外，下面所描述的本实用新型的各个实施方式中所涉及到的技术特征只要彼此之间未构成冲突就可以相互组合。
实施例1
请参阅图1、图2以及图3，图1为本实用新型实施例提供的骨导麦克风的结构示意图，图2为本实用新型实施例提供的骨导麦克风的分解示意图，图3为本实用新型实施例提供的骨导麦克风沿图1中A-A方向的剖视图。
如图1至图3所示，本实用新型第一实施例提供的骨导麦克风，包括第一基板1，设置在所述第一基板1上且具有第一镂空部21的第二基板2，设置在所述第二基板2上的盖板3，设置在所述盖板3上且具有第二镂空部41的垫板4，设置在所述垫板4上的第一振膜5，设置在所述第一振膜5上的壳体6，位于所述第一振膜5与所述壳体6之间且设置在所述第一振膜5上的质量块7，所述第一基板1、第二基板2及盖板3围合形成后腔13，所述盖板3、垫板4及第一振膜5围合形成中腔12，所述第一振膜5及壳体6围合形成前腔11，所述第一振膜5上开设有第一泄气孔51，所述盖板3对应于所述第一泄气孔51的位置开设有第二泄气孔31，所述骨导麦克风还包括贯穿所述垫板4且连通于所述第一泄气孔51及第二泄气孔31的倒相管8，位于所述后腔13内且设置在所述盖板3内侧的MEMS芯片9，所述MEMS芯片9具有背腔91及第二振膜92，所述第二振膜92上形成有连通所述背腔91与后腔13的通气孔93，所述盖板3上对应于所述背腔91的位置开设有声孔32。应当理解的是，图3中箭头B所围成的环形通道为气流通道，由于第一泄气孔51、第二泄气孔31、倒相管8、通气孔93及声孔32的共同作用，使得前腔11、后腔13及中腔12相互连通。
需要说明的是，由于MEMS工艺，开设在第二振膜92上的通气孔93能够很容易地被加工至几微米，从而可以确保骨导麦克风平坦的频率响应。
还需要说明的是，在本实施例中，所述第二基板2设置有两个，且依次层叠设置在所述第一基板1上。应当理解，在其他实施例中，可根据具体应用情况，对所述第二基板2的数量进行增减。
此外，本实施例中的盖板3和壳体6的材质均为金属。
本实用新型第一实施例提供的骨导麦克风中，当质量块7带动第一振膜5向盖板3方向运动时，中腔12被压缩（压强增大），前腔11被拉伸（压强减小），由于倒相管8连通前腔11和后腔13，使得前腔11和后腔13合并为一个大腔体，提升了骨导麦克风的顺性，从而提升了骨导麦克风的灵敏度。同时，又由于MEMS芯片9的第二振膜92上的通气孔93、MEMS芯片9的背腔91及盖板3上的声孔32的作用，使得后腔13连通了中腔12，当中腔12压强增大时，前腔11和后腔13组成的腔体压强减小，会在第一振膜5朝向盖板3一侧施加反向压强，进一步提升了骨导麦克风的灵敏度。
实施例2
请参阅图2以及图3，图2为本实用新型实施例提供的骨导麦克风的分解示意图，图3为本实用新型实施例提供的骨导麦克风沿图1中A-A方向的剖视图。
与本实用新型第一实施例提供的骨导麦克风相比，本实用新型第二实施例增加了ASIC芯片10。
如图2所示，本实施例中的骨导麦克风还包括位于所述后腔13内且设置在所述盖板3内侧的ASIC芯片10，所述ASIC芯片10与所述MEMS芯片9电连接。
应当理解的是，当MEMS芯片9的电容发生变化时（表明其已接收到声音波信号），MEMS芯片9将声音波信号发送至ASIC芯片10进行处理，即可获取相应信号并输出，以完成声音传导。
如图2所示，本实施例为了保证倒相管8与第一泄气孔51及第二泄气孔31之间的连通，在所述垫板4对应于所述第一泄气孔51的位置开设了第三泄气孔42，此时，倒相管8位于所述第三泄气孔42内且连通于所述第一泄气孔51及第二泄气孔31。
如图3所示,为了保证壳体6与第一振膜5之间能够形成前腔11，本实施例中的壳体6包括壳体本体61，围绕所述壳体本体61且朝所述第一振膜5方向延伸的支撑部62，所述支撑部62远离壳体本体61一端与所述第一振膜5接触。
实施例3
请参阅图4，图4为本实用新型实施例提供的移动终端的模块方框图。
如图4所示，本实用新型第三实施例提供的移动终端100，包括如本实用新型第一实施例和/或第二实施例所提供的骨导麦克风101。
应当理解的是，本实施例提供的移动终端100包括但不限于手机、笔记本电脑、平板电脑、POS机及车载电脑。
需要说明的是，本实用新型内容中的各个实施例均采用递进的方式描述，每个实施例重点说明的都是与其他实施例的不同之处，各个实施例之间相同相似的部分互相参见即可。
还需要说明的是，在本实用新型内容中，诸如第一和第二等之类的关系术语仅仅用来将一个实体或者操作与另一个实体或操作区分开来，而不一定要求或者暗示这些实体或操作之间存在任何这种实际的关系或者顺序。而且，术语“包括”、“包含”或者其任何其他变体意在涵盖非排他性的包含，从而使得包括一系列要素的过程、方法、物品或者设备不仅包括那些要素，而且还包括没有明确列出的其他要素，或者是还包括为这种过程、方法、物品或者设备所固有的要素。在没有更多限制的情况下，由语句“包括一个……”限定的要素，并不排除在包括所述要素的过程、方法、物品或者设备中还存在另外的相同要素。
对所公开的实施例的上述说明，使本领域专业技术人员能够实现或使用本实用新型内容。对这些实施例的多种修改对本领域的专业技术人员来说将是显而易见的，本实用新型内容中所定义的一般原理可以在不脱离本实用新型内容的精神或范围的情况下，在其它实施例中实现。因此，本实用新型内容将不会被限制于本实用新型内容所示的这些实施例，而是要符合与本实用新型内容所公开的原理和新颖特点相一致的最宽的范围。

Claims (6)

  1. 一种骨导麦克风，包括第一基板，设置在所述第一基板上且具有第一镂空部的第二基板，设置在所述第二基板上的盖板，设置在所述盖板上且具有第二镂空部的垫板，设置在所述垫板上的第一振膜，设置在所述第一振膜上的壳体，位于所述第一振膜与所述壳体之间且设置在所述第一振膜上的质量块，所述第一基板、第二基板及盖板围合形成后腔，所述盖板、垫板及第一振膜围合形成中腔，所述第一振膜及壳体围合形成前腔，其特征在于，所述第一振膜上开设有第一泄气孔，所述盖板对应于所述第一泄气孔的位置开设有第二泄气孔，所述骨导麦克风还包括贯穿所述垫板且连通于所述第一泄气孔及第二泄气孔的倒相管，位于所述后腔内且设置在所述盖板内侧的MEMS芯片，所述MEMS芯片具有背腔及第二振膜，所述第二振膜上形成有连通所述背腔与后腔的通气孔，所述盖板上对应于所述背腔的位置开设有声孔。
  2. 根据权利要求1所述的骨导麦克风，其特征在于，还包括位于所述后腔内且设置在所述盖板内侧的ASIC芯片，所述ASIC芯片与所述MEMS芯片电连接。
  3. 根据权利要求1所述的骨导麦克风，其特征在于，所述垫板对应于所述第一泄气孔的位置开设有第三泄气孔，所述倒相管位于所述第三泄气孔内且连通于所述第一泄气孔及第二泄气孔。
  4. 根据权利要求1所述的骨导麦克风，其特征在于，所述第二基板的数量为两个或两个以上。
  5. 根据权利要求1所述的骨导麦克风，其特征在于，所述壳体包括壳体本体，围绕所述壳体本体且朝所述第一振膜方向延伸的支撑部。
  6. 一种移动终端，其特征在于，包括：如权利要求1-5任一项所述的骨导麦克风。
PCT/CN2020/121815 2020-09-25 2020-10-19 一种骨导麦克风及移动终端 Ceased WO2022062001A1 (zh)

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