WO2022059609A1 - Pressure-sensitive-adhesive polarizing film, and laminate for image display device - Google Patents

Pressure-sensitive-adhesive polarizing film, and laminate for image display device Download PDF

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Publication number
WO2022059609A1
WO2022059609A1 PCT/JP2021/033283 JP2021033283W WO2022059609A1 WO 2022059609 A1 WO2022059609 A1 WO 2022059609A1 JP 2021033283 W JP2021033283 W JP 2021033283W WO 2022059609 A1 WO2022059609 A1 WO 2022059609A1
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Prior art keywords
polarizing film
pressure
adhesive
ring
sensitive adhesive
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PCT/JP2021/033283
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French (fr)
Japanese (ja)
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雄太 紺野
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綜研化学株式会社
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Priority to KR1020237010419A priority Critical patent/KR20230066575A/en
Priority to CN202180050315.5A priority patent/CN115989291A/en
Priority to JP2022550522A priority patent/JPWO2022059609A1/ja
Publication of WO2022059609A1 publication Critical patent/WO2022059609A1/en

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    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00Optical elements other than lenses
    • G02B5/30Polarising elements
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02Non-macromolecular additives
    • C09J11/06Non-macromolecular additives organic
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/08Macromolecular additives
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J153/00Adhesives based on block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers
    • C09J153/02Vinyl aromatic monomers and conjugated dienes
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00Adhesives based on unspecified macromolecular compounds
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • C09J7/30Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38Pressure-sensitive adhesives [PSA]

Definitions

  • the present invention relates to an adhesive polarizing film and a laminate for an image display device.
  • the image display member as disclosed in Patent Document 1 is composed of a plurality of members, and conventionally, an adhesive (adhesive layer) has been used for bonding each member.
  • the adhesive for adhering the image display member has a low resistance value.
  • a method of lowering the resistance value of the pressure-sensitive adhesive there is a method of blending a conductive material such as a conductive polymer with the pressure-sensitive adhesive.
  • the image display member may be exposed to a high temperature or high temperature / high humidity environment, and in the above environment, the members constituting the image display member shrink.
  • the pressure-sensitive adhesive layer used for bonding the members also shrinks with the shrinkage of the members, there is a problem that the arrangement of the conductive polymer in the pressure-sensitive adhesive layer is broken and the surface resistivity of the pressure-sensitive adhesive layer increases. ..
  • the present invention has been made in view of such circumstances, and provides an adhesive polarizing film capable of suppressing an increase in the surface resistivity of the adhesive layer in a high temperature environment.
  • the pressure-sensitive adhesive layer is formed of a pressure-sensitive adhesive composition containing a pressure-sensitive adhesive and a conductive polymer.
  • the adhesive layer has a relatively high storage elastic modulus even in a high temperature environment of 80 ° C. Therefore, even when the polarizing film tries to shrink due to heat, the adhesive layer Shrinkage is suppressed, and as a result, an increase in surface modulus due to shrinkage of the pressure-sensitive adhesive layer is suppressed.
  • the adhesive polarizing film 1 of the embodiment of the present invention is configured by laminating the pressure-sensitive adhesive layer 2 and the polarizing film 3. It is preferable that the adhesive surface 1a of the adhesive polarizing film 1 is provided with a release film 4 for protecting the adhesive surface 1a.
  • the release film 4 can be made of PET or the like.
  • Adhesive layer 2 The pressure-sensitive adhesive layer 2 is formed of a pressure-sensitive adhesive composition containing a pressure-sensitive adhesive and a conductive polymer. Conductivity is imparted to the pressure-sensitive adhesive layer 2 by the conductive polymer, and the surface resistivity of the pressure-sensitive adhesive layer 2 is reduced.
  • the storage elastic modulus (G') of the pressure-sensitive adhesive layer 2 at 80 ° C. is 20 to 1000 kPa.
  • the storage elastic modulus means the storage elastic modulus (G') at 80 ° C., and the measurement frequency of the storage elastic modulus is 1 Hz.
  • the storage elastic modulus is, for example, 20, 30, 40, 50, 60, 70, 80, 90, 100, 200, 300, 400, 500, 600, 700, 800, 900, 1000 kPa. Yes, it may be within the range between any two of the numerical values exemplified here.
  • the storage elastic modulus of the pressure-sensitive adhesive layer 2 can be adjusted by changing the composition of the pressure-sensitive adhesive.
  • the thickness of the pressure-sensitive adhesive layer 2 is usually 5 to 75 ⁇ m, preferably 10 to 50 ⁇ m in terms of dry film thickness.
  • Adhesive The adhesive is composed of any adhesive that can disperse the conductive polymer. Examples of the adhesive include an acrylic adhesive and a rubber adhesive.
  • Acrylic adhesives are adhesives containing (meth) acrylic polymers and cross-linking agents.
  • the (meth) acrylic polymer is a polymer containing a repeating structure having a (meth) acrylic unit structure.
  • Examples of the (meth) acrylic-based unit structure include a unit structure derived from the (meth) acrylic acid ester.
  • the storage elastic modulus of the pressure-sensitive adhesive layer 2 is preferably 20 to 200 kPa. This is because if the storage elastic modulus is too high, the adhesive strength may be too low. Specifically, the storage elastic modulus is, for example, 20, 30, 40, 50, 60, 70, 80, 90, 100, 110, 120, 130, 140, 150, 160, 170, 180, 190, 200 kPa. Yes, it may be within the range between any two of the numerical values exemplified here.
  • the storage elastic modulus of the pressure-sensitive adhesive layer 2 can be changed by changing the storage elastic modulus of the (meth) acrylic polymer alone or changing the content of the cross-linking agent. Can be adjusted.
  • the storage elastic modulus of the (meth) acrylic polymer alone is preferably 20 to 200 kPa, more preferably 30 to 100 kPa.
  • the storage elastic modulus is, for example, 20, 30, 40, 50, 60, 70, 80, 90, 100, 110, 120, 130, 140, 150, 160, 170, 180, 190, 200 kPa. Yes, it may be within the range between any two of the numerical values exemplified here.
  • the storage elastic modulus of the polymer alone is low, the storage elastic modulus of the pressure-sensitive adhesive layer 2 can be increased by increasing the amount of the cross-linking agent added, but in that case, the toughness of the polymer is lowered. In some cases, the storage elastic modulus of the polymer alone is preferably in the above range.
  • the weight average molecular weight Mw of the (meth) acrylic polymer is, for example, 400,000 to 3 million, preferably 600,000 to 2.5 million, and more preferably 1 million to 2 million.
  • the storage elastic modulus of the (meth) acrylic polymer tends to be a preferable value.
  • this Mw is, for example, 400,000, 500,000, 600,000, 700,000, 800,000, 900,000, 1 million, 1.1 million, 1.2 million, 1.3 million, 1.4 million, 1.5 million, 1.6 million, 170. It is 10,000, 1.8 million, 1.9 million, 2 million, 2.5 million, and 3 million, and may be within the range between any two of the numerical values exemplified here.
  • Mw is measured by gel permeation chromatography (GPC) method.
  • the molecular weight distribution (Mw / Mn; Mn is a number average molecular weight) of the (meth) acrylic polymer is, for example, 1 to 15, preferably 5 to 10. Specifically, this value is, for example, 1, 2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, and is any of the numerical values exemplified here. It may be within the range between the two. Mn is measured by the GPC method in the same manner as Mw.
  • the (meth) acrylic polymer is preferably a polymer of a monomer mixture containing the first and second monomers. Assuming that the total amount of the monomer mixture is 100% by mass, the content of the first monomer is preferably 0.05 to 10% by mass, and the content of the second monomer is preferably 51 to 99.5% by mass.
  • the monomer mixture may contain a third monomer. The content of the third monomer is the balance of 100% by mass minus the contents of the first and second monomers.
  • the content of the first monomer is preferably 1 to 5% by mass. Specifically, this content is, for example, 0.05, 0.1, 0.5, 1, 2, 3, 4, 5, 6, 7, 8, 9, and 10% by mass, and is exemplified here. It may be within the range between any two of the given numerical values.
  • the content of the second monomer is preferably 60 to 99.5% by mass. This content is specifically, for example, for example, 51, 55, 60, 65, 70, 75, 80, 85, 90, 95, 96, 97, 98, 99, 99.5% by mass. It may be within the range between any two of the numerical values exemplified here.
  • the first monomer is a crosslinkable functional group-containing monomer.
  • crosslinkable functional group is incorporated into a polymer chain as a polymerization component, and then, when the pressure-sensitive adhesive layer is formed, the functional group reacts with a functional group in another polymer chain, or the functional group.
  • a functional group capable of forming a three-dimensional crosslink between polymer chains in the system of the pressure-sensitive adhesive layer by the reaction between the polymer chain and the cross-linking agent examples include a hydroxyl group, an amino group, and a carboxyl group.
  • Examples of the monomer having a hydroxyl group as a crosslinkable functional group include 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 3-hydroxypropyl (meth) acrylate, and 4-hydroxybutyl (meth) acrylate.
  • 2-Hydroxy-3-chloropropyl (meth) acrylate, 2-hydroxy-3-phenoxypropyl (meth) acrylate, 6-hydroxyhexyl (meth) acrylate, ethylene glycol (meth) acrylate, polyethylene glycol (meth) acrylate, polypropylene Glycol (meth) acrylate and the like can be mentioned, and one of them can be used alone or in combination of two or more.
  • Examples of the monomer having an amino group as a crosslinkable functional group include N, N-dimethylaminoethyl (meth) acrylate, N, N-diethylaminoethyl (meth) acrylate, N, N-dimethylaminopropyl (meth) acrylamide, and the like.
  • N, N'-dimethylaminoethyl (meth) acrylamide, N, N'-dimethylaminopropyl (meth) acrylamide, acrylamide, etc. may be mentioned, and one of them may be used alone or in combination of two or more. can.
  • Examples of the monomer having a carboxyl group as a crosslinkable functional group include (meth) acrylic acid, crotonic acid, maleic acid, itaconic acid, citraconic acid, maleic anhydride, itaconic anhydride and the like, and one of them is used. It can be used alone or in combination of two or more.
  • a monomer having a crosslinkable functional group a monomer having a hydroxyl group is preferable, and more specifically, 2-hydroxyethyl (meth) acrylate, because it is easy to form a three-dimensional crosslinked structure in the system of the pressure-sensitive adhesive layer.
  • 4-Hydroxybutyl (meth) acrylate and 6-hydroxyhexyl (meth) acrylate are preferable.
  • the second monomer is not the first monomer, but a (meth) acrylic acid alkyl ester having a homopolymer glass transition temperature (Tg) of -60 to 20 ° C. and a homopolymer glass transition temperature of -60. At least one selected from (meth) acrylic acid alkoxyalkyl esters at ⁇ 20 ° C.
  • Tg glass transition temperature
  • Examples of such (meth) acrylic acid alkyl esters include butyl acrylate (-50 ° C), methyl acrylate (8 ° C), octyl methacrylate (-20 ° C), isooctyl methacrylate (-45 ° C), and 2-ethylhexyl. Examples thereof include methacrylate (-10 ° C.), isodecyl methacrylate ( ⁇ 41 ° C.), and isostearyl methacrylate (-18 ° C.). Examples of such (meth) acrylic acid alkoxyalkyl ester include 2-methoxyethyl acrylate (-50 ° C) and methoxy-triethylene glucol acrylate (-50 ° C). The temperature in parentheses for the second to third monomers is the homopolymer Tg.
  • the Tg of the second monomer is, for example, -60, -50, -40, -30, -20, -10, 0, 10, 20 ° C., and any two of the numerical values exemplified here. It may be within the range between.
  • the third monomer is a monomer that is neither the first nor the second monomer.
  • Such monomers include (meth) acrylic acid alkyl esters or (meth) acrylic acid alkoxyalkyl esters, other (meth) acrylic acid esters, and other ethylenes in which Tg is outside the range specified by the second monomer. It is a monomer having a sex unsaturated double bond.
  • a (meth) acrylic polymer can be obtained by polymerizing the above-mentioned monomer mixture by various known methods such as solution polymerization, emulsion polymerization and bulk polymerization.
  • the solution polymerization method is preferable from the viewpoint of the balance of characteristics such as the adhesive force and the holding force of the pressure-sensitive adhesive and the cost.
  • Ethyl acetate, toluene and the like are used as the solvent for solution polymerization.
  • the solution concentration is usually about 20 to 80% by weight.
  • As the polymerization initiator various known agents such as azo type and peroxide type can be used. Chain transfer agents may be used to adjust the molecular weight.
  • the reaction temperature is usually 50 to 80 ° C., and the reaction time is usually 1 to 8 hours.
  • a cross-linking structure is introduced by adding a cross-linking agent to the solution after polymerizing the (meth) acrylic polymer and heating as necessary.
  • the cross-linking agent include isocyanate-based cross-linking agents, epoxy-based cross-linking agents, oxazoline-based cross-linking agents, aziridine-based cross-linking agents, carbodiimide-based cross-linking agents, metal chelate-based cross-linking agents and the like. These cross-linking agents react with the cross-linking functional groups introduced into the (meth) acrylic polymer to form a cross-linked structure.
  • a polyisocyanate having two or more isocyanate groups in one molecule is preferable as the crosslinked agent.
  • the polyisocyanate-based cross-linking agent include lower aliphatic polyisocyanates such as butylene diisocyanate and hexamethylene diisocyanate; alicyclic isocyanates such as cyclopentylene diisocyanate, cyclohexylene diisocyanate and isophorone diisocyanate; 2,4-triisocyanate.
  • Aromatic isocyanates such as range isocyanate, 4,4'-diphenylmethane diisocyanate, xylylene diisocyanate; trimethylol propane / tolylene diisocyanate trimer adduct (eg, "Coronate L” manufactured by Toso), trimethylol propane / hexa Methylene diisocyanate trimeric adduct (eg, "Coronate HL” manufactured by Tosoh), trimethylol propane adduct of xylylene diisocyanate (eg, "Takenate D110N” manufactured by Mitsui Chemicals, isocyanurate of hexamethylene diisocyanate (eg, manufactured by Tosoh). Examples thereof include isocyanate additives such as "Coronate HX" and "Y-75” manufactured by Soken Kagaku.
  • the blending amount of the cross-linking agent is, for example, 0.005 to 2 parts by mass, preferably 0.01 to 1 part by mass, and further preferably 0.05 to 0.15 with respect to 100 parts by mass of the (meth) acrylic polymer. preferable.
  • the storage elastic modulus of the pressure-sensitive adhesive layer 2 tends to be a preferable value.
  • the blending amount is, for example, 0.005, 0.01, 0.05, 0.10, 0.15, 0.20, 0.50, 1.0, 2.0 parts by mass. , It may be within the range between any two of the numerical values exemplified here.
  • Rubber-based adhesives examples include rubber-based adhesive compositions using natural rubber or synthetic rubber as a polymer, and preferably contain a hydrogenated block copolymer, a tackifier resin, and a softening agent. ..
  • the block copolymer is thermoplastic having a segment composed of a polymer component of an aromatic vinyl monomer (hard segment) and a segment composed of a polymer component of a conjugated diene monomer (soft segment). It is an elastomer.
  • the aromatic vinyl compound is preferably styrene or ⁇ -methylstyrene (more preferably styrene), and the conjugated diene compound is preferably butadiene or isoprene.
  • hydrogenated block copolymer examples include, for example, a styrene- (ethylene-propylene) -styrene type block copolymer (SEPS) (a hydrogenated additive of a styrene-isoprene-styrene type block copolymer (SIS)).
  • SEPS styrene- (ethylene-propylene) -styrene type block copolymer
  • SIS styrene-isoprene-styrene type block copolymer
  • Stylite- (butadiene-butylene) -styrene type block copolymer (SBBS) hydrogenated product styrene- (ethylene-butylene) -styrene type block copolymer (SEBS) (styrene-butadiene-styrene type block copolymer weight Combined (SBS) hydrogen additive), styrene- (ethylene-propylene) type block copolymer (SEP) (styrene-isoprene type block copolymer (SI) hydrogen additive), styrene- (ethylene-butylene) Examples thereof include a type block copolymer (SEB) (a hydrogenated additive of a styrene-butadiene type block copolymer (SB)).
  • SEBS styrene- (ethylene-butylene) -styrene type block copolymer
  • SI styrene-isoprene type
  • the hydrogenated block copolymers are styrene- (ethylene-propylene) -styrene type block copolymer (SEPS) and styrene- (ethylene-butylene) from the viewpoint of excellent compatibility with the tackifier resin.
  • SEPS styrene- (ethylene-propylene) -styrene type block copolymer
  • SEBS styrene type block copolymers
  • the tackifier resin has the property of being compatible with the hard segments constituting the hydrogenated block copolymer.
  • the tackifier resin can be, for example, an aromatic tackifier resin.
  • the aromatic tackifier resin used as the tackifier resin preferably has a molecular weight of 5,000 or less from the viewpoint of compatibility.
  • the tackifier resin preferably has a softening point of 80 ° C. or higher.
  • the softening point is, for example, 80 to 200 ° C., specifically, for example, 80, 90, 100, 110, 120, 130, 140, 150, 160, 170, 180, 190, 200 ° C., and here. It may be within the range between any two of the numerical values exemplified in.
  • aromatic pressure-sensitive adhesive resin examples include aromatic petroleum resins, styrene-based polymers, ⁇ -methylstyrene-based polymers, styrene- ( ⁇ -methylstyrene) -based copolymers, and styrene.
  • aromatic petroleum resins examples include aromatic petroleum resins, styrene-based polymers, ⁇ -methylstyrene-based polymers, styrene- ( ⁇ -methylstyrene) -based copolymers, and styrene.
  • styrene-based polymers examples include aromatic petroleum resins, styrene-based polymers, ⁇ -methylstyrene-based polymers, styrene- ( ⁇ -methylstyrene) -based copolymers, and styrene.
  • FMR-0150 as a commercially available styrene-aromatic hydrocarbon-based polymer (softening point 145 ° C., manufactured by Mitsui Chemicals, Inc.), FTR-6100 as a styrene-aliphatic hydrocarbon-based copolymer.
  • the softener has the property of being compatible with the soft segments constituting the hydrogenated block copolymer.
  • the softener is a liquid at 23 ° C.
  • the softening agent examples include polybutene-based compounds, polyisobutylene-based compounds, aliphatic hydrocarbons such as polyisobutylene-based compounds, and more specifically, commercially available softeners, for example, Nisseki polybutene LV-7 as a polybutene-based compound. , LV-50, LV-100, HV-15, HV-35, HV-50, HV-100, HV-300, HV-1900 and SV-7000 (all manufactured by JXTG Energy), as polyisobutylene compounds.
  • Examples thereof include Trax 3T, 4T, 5T and 6T, Himor 4H, 5H, 5.5H and 6H (all manufactured by JXTG Energy), and as a polyisobutylene compound, Claprene LIR-290 (manufactured by Claret).
  • Conductive Polymer The conductive polymer of the present invention imparts conductivity to the pressure-sensitive adhesive composition and contributes to the antistatic property of the pressure-sensitive adhesive composition.
  • the conductive polymer is not particularly limited as long as it has the effect of the present invention as long as it is an organic polymer whose main chain is composed of a ⁇ -conjugated system.
  • Polyacetylene-based conductive polymer, polyphenylene-based conductive polymer, polyphenylene vinylene-based conductive polymer, polyaniline-based conductive polymer, polyacene-based conductive polymer, polythiophenine-based conductive polymer, and their co-weights Coalescence and the like can be mentioned. From the viewpoint of stability in air, polypyrrole-based conductive polymers, polythiophenes and polyaniline-based conductive polymers are preferable, and from the viewpoint of transparency, polythiophene-based conductive polymers are more preferable.
  • the conductive polymer preferably has at least one of the structural units represented by the chemical formula (1) or (2). Since the ⁇ -conjugated polymer contained in this conductive polymer has R 1 , the skeleton is easily distorted and the flexibility is improved. Therefore, the dispersibility in a solvent or a pressure-sensitive adhesive is good, and the conductivity of the pressure-sensitive adhesive composition can be most improved as compared with other ⁇ -conjugated polymer species.
  • the blending amount of the conductive polymer in the pressure-sensitive adhesive composition is preferably 0.01 to 35 parts by mass, more preferably 0.05 to 30 parts by mass, and 0.5 to 0.5 parts by mass with respect to 100 parts by mass of the pressure-sensitive adhesive. 20 parts by mass is more preferable.
  • the blending amount is, for example, 0.01, 0.05, 0.1, 0.5, 1, 2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12 , 13, 14, 15, 20, 25, 30, 35 parts by mass, and may be within the range between any two of the numerical values exemplified here.
  • the blending amount of the conductive polymer is preferably 0.01 to 20 parts by mass, more preferably 0.01 to 10 parts by mass with respect to 100 parts by mass of the pressure-sensitive adhesive.
  • the blending amount of the conductive polymer is preferably 0.01 to 35 parts by mass, more preferably 0.1 parts by mass or more with respect to 100 parts by mass of the pressure-sensitive adhesive.
  • R 1 is an alkyl group having 1 to 12 carbon atoms, an alkoxy group having 1 to 12 carbon atoms, an alkylene oxide group having 1 to 50 carbon atoms and having 1 to 12 carbon atoms, and a phenyl group which may have a substituent.
  • R 2 is an oxygen atom or a sulfur atom, respectively
  • R 3 is a hydrogen atom or an organic, respectively. It is a group.
  • a ⁇ is a monoanion derived from a dopant.
  • n is 2 or more and 300 or less.
  • the alkyl group having 1 or more and 12 or less carbon atoms may be linear, branched, cyclic or the like, and may be, for example, 1 or more and 8 or less carbon atoms, 1 or more and 6 or less carbon atoms, 1 or more and 4 or less carbon atoms, or the like. May be present, specifically, methyl group, ethyl group, n-propyl group, isopropyl group, n-butyl group, t-butyl group, cyclopentyl group, cyclohexyl group, bornyl group, isobornyl group, dicyclopentanyl. Examples include a group and an adamantyl group.
  • the alkoxy group having 1 or more and 12 or less carbon atoms may be linear, branched, cyclic or the like, and may be, for example, 1 or more and 8 or less carbon atoms, 1 or more and 6 or less carbon atoms, 1 or more and 4 or less carbon atoms, or the like. Is.
  • Examples of the alkylene oxide group having 1 or more and 12 or less carbon atoms include 1 or more and 8 or less carbon atoms, 1 or more and 6 or less carbon atoms, and 1 or more and 4 or less carbon atoms.
  • heterocyclic group examples include a silol ring, a furan ring, a thiophene ring, an oxazole ring, a pyrrole ring, a pyridine ring, a pyridazine ring, a pyrimidine ring, a pyrazine ring, a triazine ring, an oxadiazole ring, a triazole ring, an imidazole ring, and a pyrazole.
  • naphthalene ring As the fused ring group, naphthalene ring, azulene ring, anthracene ring, phenanthrene ring, pyrene ring, chrysene ring, naphthane ring, triphenylene ring, acenaphthene ring, coronene ring, fluorene ring, fluorene ring, pentacene ring, perylene ring, etc. Examples thereof include a pentaphene ring, a picene ring, and a pyrenethrene ring.
  • Examples of the substituent include an alkyl group having 1 to 12 carbon atoms, the alkyl ether group having 1 to 12 carbon atoms, an alkoxy group having 1 to 12 carbon atoms, an alkylene oxide group having 1 to 12 carbon atoms, and an aromatic group.
  • Examples thereof include a group group, a hydroxy group, a carboxyl group, a halogen such as fluorine, chlorine, bromine and iodine, an aldehyde group, an amino group, a cycloalkyl group having 3 or more carbon atoms and 8 or less carbon atoms, and a hydroxy group and a carboxyl group are preferable.
  • R 1 preferably contains at least one of an alkyl group which may have a substituent and a silicone group, and preferably contains a silicone group. Since the silicone group has a low free energy, when R 1 contains a silicone group, the conductive polymer tends to gather near the surface in the pressure-sensitive adhesive composition, and the surface resistance tends to be reduced.
  • alkyl group examples include an alkyl group having 1 or more carbon atoms and 12 or less carbon atoms. Examples of this alkyl group include those described above.
  • a silicone group is a group in which an organic group is bonded to a siloxane bond in which silicon and oxygen are alternately bonded as the main skeleton of the bond.
  • the organic group is preferably an aromatic group or an alkyl group having 1 or more and 12 or less carbon atoms, and a methyl group is preferable.
  • R 1 preferably has an ester bond.
  • the ester bond of R 1 include a carboxylic acid ester bond, a phosphoric acid ester bond, a sulfonic acid ester bond, and the like, and a carboxylic acid ester bond is preferable.
  • R 1 has an acid group (carboxyl group or the like) that has not been esterified, the polarity of the conductive polymer becomes too high, and the cohesiveness of the conductive polymer in the pressure-sensitive adhesive composition becomes low. Esterification of the acid group lowers the polarity and improves dispersibility in the pressure-sensitive adhesive composition.
  • R 1 preferably has a structure represented by the chemical formula (3).
  • * is a bond
  • R 4 is a direct bond or an organic group
  • R 5 contains at least one of an organic group and a silicone group.
  • R 3 , R 4 or R 5 it may have a substituent, an alkyl group having 1 or more and 12 or less carbon atoms, an alkyl ether group having 1 or more and 12 or less carbon atoms, and 1 or more and 12 carbon atoms or less.
  • alkyl group having 1 or more and 12 or less carbon atoms examples thereof include an alkoxy group of the above, an alkylene oxide group having 1 or more and 12 or less carbon atoms, an aromatic group, a heterocyclic group and the like.
  • R 5 preferably has a hydroxyl group at the ⁇ -position.
  • alkyl group alkoxy group, alkylene oxide group and heterocyclic group here is the same as described above.
  • the alkyl ether group having 1 or more and 12 or less carbon atoms may be linear, branched, cyclic or the like, and may be, for example, 1 or more and 8 or less carbon atoms, 1 or more and 6 or less carbon atoms, 1 or more and 4 or less carbon atoms, or the like. Is.
  • Examples of the aromatic group include various condensed ring groups in addition to the phenyl group and the benzyl group.
  • the fused ring group naphthalene ring, azulene ring, anthracene ring, phenanthrene ring, pyrene ring, chrysene ring, naphthane ring, triphenylene ring, acenaphthene ring, coronene ring, fluorene ring, fluorene ring, pentacene ring, perylene ring, etc.
  • Examples thereof include a pentaphene ring, a picene ring, and a pyrenethrene ring.
  • Examples of the dopant include any compound that can impart conductivity to the ⁇ -conjugated polymer and become a monoanion.
  • Dopants include vinyl sulfonic acid, methane sulfonic acid, p-toluene sulfonic acid, dodecyl sulfonic acid, dodecylbenzene sulfonic acid, sulfonic acid such as di (2-ethylhexyl) sulfosuccinic acid, tetrafluoroboric acid, trifluoroacetic acid, hexa.
  • Examples thereof include monovalent acids such as fluorophosphate, trifluoromethanesulfonic acid and naphthalenesulfonic acid, and alkali metal salts thereof.
  • a dopant that becomes a monoanion is used, the conductivity of the conductive polymer is likely to be improved.
  • the structure of the dopant affects the dispersibility in the pressure-sensitive adhesive composition, and among these, dodecylbenzene sulfonic acid is preferable from the viewpoint of the balance between conductivity and dispersibility.
  • the number of the structural units (1) and (2) contained in the conductive polymer is not particularly limited, but is preferably 2 or more and 300 or less. Specifically, for example, it is 2, 5, 10, 20, 30, 40, 50, 60, 70, 80, 90, 100, 200 or 300, and is within the range between any two of the numerical values exemplified here. May be.
  • the content ratios of the structural units (1) and (2) contained in the conductive polymer can be adjusted by the ratio of the addition amount of the thiophene derivative represented by the chemical formula (4) to the aldehyde.
  • the molar ratio of the amount of the thiophene derivative to the aldehyde added (thiophene derivative / aldehyde) is, for example, 1/1, 2/1, 3/1, 4/1, 5/1, etc., and any two of these values are used. Although it may be within the range between them, the ratio of 1/1 to 4/1 is preferable, and the ratio of 1/1 to 2/1 is more preferable from the viewpoint of the balance between solubility and conductivity.
  • R 2 and R 3 are defined in the same manner as R 2 and R 3 in the chemical formulas (1) and (2), respectively.
  • the method for synthesizing the conductive polymer is not particularly limited, but for example, it can be obtained by adding a dopant and an oxidizing agent to a thiophene derivative and an aldehyde, heating and stirring in a solvent under an inert gas atmosphere, and polymerizing the polymer. Can be done. Further, a decomposition accelerator for an oxidizing agent may be added.
  • an aldehyde having an acid group may be used, or an aldehyde having an ester bond may be used.
  • the aldehyde having an acid group include phthalaldehyde acid.
  • the aldehyde having an ester bond include those obtained by esterifying the acid group of an aldehyde having an acid group. Esterification can be carried out, for example, by reacting an acid group with an epoxy group of an epoxy group-containing compound (eg, epoxyalkyl, one-ended epoxy silicone).
  • an epoxy group-containing compound eg, epoxyalkyl, one-ended epoxy silicone
  • the molar ratio of the dopant to the thiophene derivative is, for example, 0.01 to 0.5, preferably 0.1 to 0.5. Specifically, the molar ratio is, for example, 0.01, 0.05, 0.1, 0.2, 0.3, 0.4, 0.5, and any two of the numerical values exemplified here are used. It may be within the range between. If this molar ratio is too small, the conductivity of the conductive polymer may be too low.
  • the oxidizing agent is not particularly limited as long as it is an oxidizing agent in which the polymerization reaction proceeds, and it may be ammonium peroxodisulfate, potassium peroxodisulfate, sodium peroxodisulfate, iron (III) chloride, iron (III) sulfate, or hydroxide.
  • the solvent is not particularly limited as long as it is a solvent in which the reaction between the heterocyclic compound and the aldehyde derivative proceeds, and it may be ⁇ -butyrolactone, propylene carbonate, ethylene carbonate, acetonitrile, tert-butylmethyl ether, ethyl acetate, benzene, anisole.
  • Heptane water, methanol, ethanol, isopropyl alcohol, butanol and other alcohol solvents, acetone, methyl ethyl ketone, methyl isobutyl ketone, cyclopentanone and other ketone solvents, methyl cellosolve, ethyl cellosolve, propylene glycol methyl ether, propylene glycol ethyl
  • glycol-based solvents such as ether
  • lactic acid-based solvents such as methyl lactate and ethyl lactate.
  • An aprotic solvent is preferable because of the efficiency of the oxidizing agent.
  • the pressure-sensitive adhesive composition of the present invention may contain a solvent.
  • the solvent is not particularly limited as long as it can dissolve or disperse the conductive polymer, and preferably contains an organic solvent.
  • the organic solvent include alcohol solvents such as methanol, ethanol, isopropyl alcohol and butanol, ketone solvents such as acetone, methyl ethyl ketone, methyl isobutyl ketone and cyclopentanone, methyl cellosolve, ethyl cellosolve, propylene glycol methyl ether and propylene.
  • Glycol-based solvents such as glycol ethyl ether, lactic acid-based solvents such as methyl lactate and ethyl lactate, toluene, anisol, ethyl acetate, propylene carbonate, ⁇ -butyrolactone, toluene, isopropyl alcohol, ethylene glycol, dimethyl sulfoxide, methanol, benzyl alcohol and the like.
  • propylene carbonate, ⁇ -butyrolactone, methyl ethyl ketone, toluene, anisole, isopropyl alcohol, ethylene glycol, dimethyl sulfoxide, methanol, benzyl alcohol and the like are particularly preferable.
  • the organic solvent may be used in combination of a plurality of solvents, and may be the same as or different from the solvent used for synthesizing the conductive polymer.
  • the non-volatile content of the conductive polymer composition excluding the organic solvent is not particularly limited, but is, for example, 0.1% by mass or more and 20.0% by mass or less. Specifically, 0.1, 0.5, 1.0, 1.5, 2.0, 2.5, 3.0, 5.0, 10.0, 15.0, 20.0 mass%. It may be within the range between any two of the numerical values exemplified here.
  • the solvent of the conductive polymer composition may contain water in addition to the above organic solvent, but the water content is preferably 50% or less with respect to the solvent, more preferably 10% or less, from the viewpoint of substrate adhesion. preferable.
  • the pressure-sensitive adhesive composition of the present invention may contain components such as a silane coupling agent, a silicone resin, a platinum catalyst, and a photopolymerization initiator. Further, the pressure-sensitive adhesive composition of the present invention comprises a solvent, a tackifier resin, a sensitizer, a filler, a flame retardant, a filler, an organopolysiloxane compound, an ionic compound, a plasticizer, a curing auxiliary catalyst, a dispersant, and a pigment /.
  • a dye, a viscosity modifier, a lubricant, a settling inhibitor, a rheology control agent, an ultraviolet absorber, a light resistance imparting agent, an antioxidant, a water repellent agent, an antifoaming agent and the like may be appropriately blended.
  • silane coupling agent forms a bond such as a chemical bond with various adherends, and enhances the adhesiveness between the substrate and the adherend. It is especially effective for adhesion to glass substrates.
  • silane coupling agent examples include polymerizable unsaturated group-containing silicon compounds such as vinyltrimethoxysilane, vinyltriethoxysilane and metharoxypropyltrimethoxysilane; 3-glycidoxypropyltrimethoxysilane and 3-glycidoxy.
  • Silicon compounds having an epoxy structure such as propylmethyldimethoxysilane and 2- (3,4-epoxycyclohexyl) ethyltrimethoxysilane; 3-aminopropyltrimethoxysilane, N- (2-aminoethyl) 3-aminopropyltrimethoxy
  • Examples thereof include amino group-containing silicon compounds such as silane and N- (2-aminoethyl) -3-aminopropylmethyldimethoxysilane; and 3-chloropropyltrimethoxysilane; oligomer-type silane coupling agents.
  • the blending amount of the silane coupling agent is usually 0.01 to 0.3 parts by mass, preferably 0.05 to 0.25 parts by mass with respect to 100 parts by mass of the pressure-sensitive adhesive. Further, the silane coupling agent may be used alone or in combination of two or more.
  • Polarizing film 3 The polarizing film 3 may include a polarizing element 3a and may include a polarizing element protective film 3b. The polarizing element 3a is arranged between the pressure-sensitive adhesive layer 2 and the polarizing element protective film 3b.
  • Examples of the polarizing element 3a include a stretched film obtained by incorporating a polarizing component into a film made of a polyvinyl alcohol-based resin and stretching the film.
  • Examples of the polyvinyl alcohol-based resin include saponified products of polyvinyl alcohol, polyvinylformal, polyvinyl acetal, and ethylene-vinyl acetate copolymer.
  • Examples of the polarizing component include iodine and dichroic dyes.
  • Examples of the polarizing element protective film 3b include a film made of a thermoplastic resin.
  • the thermoplastic resin include cellulose resins such as triacetyl cellulose, polyester resins, polyether sulfone resins, polysulfone resins, polycarbonate resins, polyamide resins, polyimide resins, polyolefin resins, (meth) acrylic resins, and cyclic polyolefin resins (norbornen). (Based resin), polyarylate resin, polystyrene resin, polyvinyl alcohol resin, and a mixture of two or more selected from these resins can be mentioned.
  • the thickness of the polarizing film 3 is usually 10 to 200 ⁇ m, preferably 30 to 100 ⁇ m.
  • the polarizing element protective film 3b formed on the polarizing element 3a can be omitted, so that the polarizing film 3 can be made thinner.
  • the polarizing film 3 may have a property of easily shrinking in a high temperature environment.
  • the pressure-sensitive adhesive layer 2 tends to shrink as the polarizing film 3 shrinks. Therefore, as described above, it is technically significant to keep the storage elastic modulus of the pressure-sensitive adhesive layer 2 at 80 ° C. within a predetermined range. This is especially noticeable.
  • the single shrinkage rate P (%) ((Xp-Yp) / Xp) ⁇ 100 of the polarizing film 3 is defined.
  • Xp is the dimension in the stretch axis direction of the polarizing film 3 after the polarizing film 3 is left alone in the environment of 23 ° C. and 50% RH
  • Yp is the dimension of the polarizing film 3 alone in the environment of 80 ° C. It is the dimension in the drawing axis direction of the polarizing film 3 after leaving for 72 hours and letting it cool for 10 minutes in the environment of 23 degreeC 50% RH.
  • the single shrinkage rate P is, for example, 0.01 to 10%, preferably 1 to 8%. Specifically, the single shrinkage rate P is, for example, 0.01, 0.1, 0.5, 1, 2, 3, 4, 5, 6, 7, 8, 9, 10%, and is exemplified here. It may be within the range between any two of the given numerical values.
  • the adhesive polarizing film 1 preferably has excellent holding power at high temperatures. Specifically, when the adhesive surface 1a of the adhesive polarizing film 1 is attached to a glass plate (preferably a non-alkali glass plate) with an area of 10 mm ⁇ 10 mm, and a load of 800 g is applied in the shearing direction in an environment of 80 ° C. In addition, it is preferable that the amount of displacement of the adhesive layer with respect to the glass plate 1 hour after the start of load application is 2.0 mm or less. In this case, as shown in FIG. 2, when the adhesive polarizing film 1 is attached to the image display element 6, the adhesive polarizing film 1 is prevented from being displaced from the image display element 6. This deviation is, for example, 0 to 2.0 mm, specifically, for example, 0, 0.5, 1.0, 1.5, 2.0 mm, and is between any two of the numerical values exemplified here. It may be within the range of.
  • the image display device laminate 5 is configured by attaching the adhesive polarizing film 1 to the image display element 6.
  • the adhesive polarizing film 1 can be attached to the image display element 6 so that the adhesive surface 1a comes into contact with the image display element 6 in a state where the release film 4 is peeled off to expose the adhesive surface 1a.
  • the image display element 6 is an element for displaying an image.
  • the image display element 6 is preferably an element having a glass plate on the surface to which the adhesive polarizing film 1 is attached.
  • the glass plate is preferably a non-alkali glass plate. Examples of such an image display element 6 include a liquid crystal cell.
  • the liquid crystal cell is preferably a liquid crystal cell constituting an in-cell or on-cell type touch panel input / output device.
  • Incel is a method of incorporating a touch panel function into the pixels of a liquid crystal display.
  • On-cell is a method in which a touch panel function is built in between a color filter substrate and a polarizing film.
  • the touch sensor does not work normally due to static electricity generated near the cover glass, and touch failure often occurs. Therefore, by using a pressure-sensitive adhesive composition having a low surface resistivity in which the conductive polymer of the present invention is blended in the pressure-sensitive adhesive composition, the pressure-sensitive adhesive layer neutralizes and disperses static electricity generated in the vicinity of the cover glass. It is possible to suppress touch defects.
  • the thickness of the glass plate is, for example, 0.3 to 3 mm, specifically, for example, 0.3, 0.5, 1.0, 1.5, 2.0, 2.5, 3.0 mm. Yes, it may be within the range between any two of the numerical values exemplified here.
  • the thickness of the image display element 6 is, for example, 0.5 to 6 mm, specifically, for example, 0.5, 1.0, 1.5, 2.0, 2.5, 3.0, 3 It is 5.5, 4.0, 4.5, 5.0, 5.5, 6.0 mm, and may be within the range between any two of the numerical values exemplified here.
  • the shrinkage rate S (%) of the polarizing film 3 in the laminate 5 is defined as ((Xs—Ys) / Xs) ⁇ 100.
  • Xs is the dimension of the polarizing film 3 in the laminated body 5 in the state after the laminated body 5 is left in the environment of 23 ° C. and 50% RH
  • Ys is the dimension of the laminated body 5 in the environment of 80 ° C. It is the dimension in the stretch axis direction of the polarizing film 3 in the laminated body 5 after leaving it for 72 hours, and then letting it cool for 10 minutes in the environment of 23 degreeC 50% RH.
  • S is preferably less than 3. That is, it is preferable that the following equation (1) is satisfied. ((Xs-Ys) / Xs) x 100 ⁇ 3 ... (1)
  • the laminate shrinkage rate S is, for example, 0.01 to 2.99, preferably 0.01 to 2.9, and even more preferably 0.01 to 2.0.
  • the shrinkage rate S is, for example, 0.01, 0.1, 0.2, 0.3, 0.4, 0.5, 0.6, 0.7, 0.8, 0.9. , 1.0, 1.1, 1.2, 1.3, 1.4, 1.5, 1.6, 1.7, 1.8, 1.9, 2.0, 2.1, 2 .2, 2.3, 2.4, 2.5, 2.6, 2.7, 2.8, 2.9, 2.99, and the range between any two of the numerical values exemplified here. It may be inside.
  • the surface resistance of the adhesive layer 2 exposed by peeling the adhesive polarizing film 1 from the laminate 5 after leaving the laminate 5 in a 23 ° C. and 50% RH environment is set to Xr, and the laminate 5 is placed in an 80 ° C. environment.
  • Yr be the surface resistance of the adhesive layer 2 exposed by peeling the adhesive polarizing film 1 from the laminate 5 after allowing it to cool for 10 minutes in an environment of 23 ° C. and 50% RH.
  • Yr are both preferably less than 1.0 ⁇ 10 12 .
  • the laminate 5 having the pressure-sensitive adhesive layer 2 having a sufficiently low surface resistivity can be obtained at both normal temperature and high temperature.
  • less than 5.0 ⁇ 10 11 is more preferable, less than 1.0 ⁇ 10 11 is further preferable, less than 5.0 ⁇ 10 10 is further preferable, and less than 1.0 ⁇ 10 10 is further preferable. , 5.0 ⁇ 10 9 or less, more preferably 1.0 ⁇ 10 9 or less.
  • Xr and Yr satisfy the following formula (2). Yr / Xr ⁇ 10 ... (2)
  • Yr / Xr is, for example, 0.5 to 9.9, more preferably 1 to 5. Specifically, this value is, for example, 0.5, 1, 1.5, 2, 3, 4, 5, 6, 7, 8, 9, 9.9, and any of the numerical values exemplified here. It may be within the range between the two.
  • R 1 of the conductive polymer C 1 is represented by the chemical formula (5).
  • -Manufacturing example C2 (manufacturing of conductive polymer C2) 1.2 g of epoxyhexyl is added to the propylene carbonate dispersion obtained in Production Example C1, and the mixture is stirred at 80 ° C. for 6 hours to react the carboxyl group of the conductive polymer with the epoxy group of the epoxyhexyl to be alkyl-modified. A dispersion liquid of the conductive polymer C2 was obtained.
  • R 1 of the conductive polymer C2 is represented by the chemical formula (6).
  • -Manufacturing example C3 (manufacturing of conductive polymer C3)
  • 1.2 g of epoxy hexyl used for modification in Production Example C2 was changed to 56.4 g of one-ended epoxy silicone (“X-22-173DX” manufactured by Shin-Etsu Chemical Co., Ltd.).
  • a dispersion liquid of the conductive polymer C3 was obtained.
  • the conductive polymer C3 is silicone-modified by reacting the carboxyl group of the conductive polymer before modification with the epoxy group of X-22-173DX.
  • R 1 of the conductive polymer C3 is represented by the chemical formula (7).
  • -Manufacturing example C4 (manufacturing of conductive polymer C4) 30 g of one-ended epoxy organosiloxane (X-22-173BX manufactured by Shin-Etsu Chemical Co., Ltd.), 1.98 g of sodium 2-mercaptoethanesulfonate, 23 g of isopropyl alcohol, and 0.3 g of triethylamine are charged in a 1 L flask, mixed, and heated under reflux. It was allowed to react for 15 hours. Water was added to the reaction product and isopropyl alcohol was removed by distillation under reduced pressure to obtain an emulsion of an acid-modified silicone compound (nonvolatile content 12.6%).
  • the wet product was freeze-dried at 0 ° C. for 24 hours to obtain a dry powder of the conductive polymer C4.
  • the dry powder of the conductive polymer C4 is mixed at a ratio of 1.5% of the non-volatile content to the methyl ethyl ketone, treated with a probe-type ultrasonic homogenizer, and dispersed in an organic solvent of the conductive polymer C4. Obtained liquid.
  • -Manufacturing example C5 (manufacturing of conductive polymer C5)
  • 2-NaSEMA 2-sodium sulfoethyl methacrylate
  • BzMA benzyl methacrylate
  • 2-EHA 2-ethylhexyl methacrylate
  • AIBN azobisisobutyronitrile
  • the polymerization solution was separated by filtration, the obtained crystals were redispersed in water, washed, and filtered again.
  • the solid substance containing water obtained by repeating the above washing four times was taken out and dried at 40 ° C. under reduced pressure for 96 hours to obtain a dry powder of the conductive polymer C5.
  • the dry powder of the conductive polymer C5 is mixed at a ratio of 1.5% of the non-volatile content to the methyl ethyl ketone and treated with a probe-type ultrasonic homogenizer to obtain an organic solvent dispersion of the conductive polymer C5. rice field.
  • Production Examples A2 to A9 (Production of (meth) acrylic polymers A2 to A9)
  • the (meth) acrylic polymers A2 to A9 were polymerized by the same method as in Production Example A1 except that the composition ratio of the monomers was changed as shown in Table 1, and Mw, Mw / Mn, 80 ° C. was used by the method shown below. The storage elastic modulus was measured. The results are shown in Table 1.
  • -GPC column configuration The following 4-column column (all manufactured by Tosoh Corporation) (1) TSKgel HxL-H (guard column) (2) TSKgel GMHxL (3) TSKgel GMHxL (4) TSKgel G2500HxL ⁇
  • Mobile phase solvent Tetrahydrofuran ⁇ Standard polystyrene conversion
  • the 80 ° C. storage elastic modulus in the table was measured by the following method. On a stripped polyethylene terephthalate film (PET film), a measurement sample (here, a (meth) acrylic polymer) was placed on a polyethylene terephthalate film (PET film) so that the film thickness after drying was 25 ⁇ m, and the liquid temperature was 25 ° C. using a doctor blade. And dried at 90 ° C. for 3 minutes to obtain an adhesive sheet. Only a plurality of pressure-sensitive adhesive layers obtained from the pressure-sensitive adhesive sheet were prepared, and these were laminated to prepare a test piece having a thickness of 1 mm. Using this test piece, the storage elastic modulus at 80 ° C. was measured using a modular compact reometer MCR300 manufactured by AntonioPaar. The measurement frequency was 1 Hz.
  • a pressure-sensitive adhesive composition for evaluation was produced by mixing various components shown in Tables 2 to 5 with the formulations (parts by mass) shown in Tables 2 to 5.
  • the conductive polymer and the (meth) acrylic polymer were mixed in the state of the dispersion liquid or the solution obtained in the above-mentioned production example.
  • the blending amount of the conductive polymer and the (meth) acrylic polymer indicates the amount of the solid content in the dispersion liquid or the solution.
  • Adhesive Polarizing Film The adhesive composition obtained in "3. Production of Adhesive Composition” is placed on a peel-treated polyethylene terephthalate film (PET film) so that the film thickness after drying is 25 ⁇ m. The film was applied at a liquid temperature of 25 ° C. using a doctor blade and dried at 90 ° C. for 3 minutes to obtain an adhesive sheet.
  • PET film polyethylene terephthalate film
  • FMR-0150 aromatic adhesive-imparting resin with softening point of 145 ° C: manufactured by Mitsui Chemicals
  • TH-130 softening point 130 ° C. terpene phenol-type adhesive-imparting resin: manufactured by Yasuhara Chemical Co., Ltd.
  • FTR-6100 Aromaatic adhesive resin with softening point of 95 ° C: manufactured by Mitsui Chemicals
  • Polarizing film As the polarizing film, the one having the configuration shown in Table 6 was used.
  • COP Cycloolefin Polymer
  • PMMA Polymethylmethacrylate
  • PET Polyethylene terephthalate
  • TAC Triacetylcellulose
  • the single shrinkage of the polarizing film was measured by the following method.
  • a test piece was prepared by cutting the polarizing film into a size of 160 mm (MD direction) ⁇ 25 mm (TD direction). This test piece was left alone in an environment of 23 ° C. and 50% RH for 10 minutes, and then the dimension (Xp) in the long side direction of the test piece was measured. Next, the test piece was left alone under the condition of 80 ° C. for 72 hours, then allowed to cool for 10 minutes in an environment of 23 ° C. and 50% RH, and the dimension (Yp) in the long side direction of the polarizing film was measured. ..
  • the single shrinkage rate (((Xp-Yp) / Xp) ⁇ 100) was calculated from the obtained Xp and Yp.
  • test piece was prepared by cutting an adhesive polarizing film into a size of 160 mm (MD direction) ⁇ 25 mm (TD direction).
  • the PET film is peeled off from the test piece, and a pressure-sensitive adhesive layer and a non-alkali glass plate are formed on one side of a liquid crystal panel having a 2 mm-thick non-alkali glass plate as a glass substrate using a laminator roll.
  • the contact-bonded material was held in an autoclave adjusted to 50 ° C./5 atm for 20 minutes to prepare a laminated body for testing.
  • the laminated body of the example has a smaller shrinkage rate, Xr, Yr, Yr / Xr of the laminated body than the laminated body of the comparative example, and is excellent in heat resistance and durability at 80 ° C. You can see that.
  • the 80 ° C. storage elastic modulus of the pressure-sensitive adhesive layer was measured by the method described in "2. Production of (meth) acrylic polymer" using the pressure-sensitive adhesive composition constituting the pressure-sensitive adhesive layer as a measurement sample.
  • the adhesive polarizing film is cut into a width of 10 mm ⁇ a length of 100 mm, the PET film is peeled off, and the adhesive layer is attached onto the non-alkali glass so that the adhesive layer is in contact with the glass and has a bonding area of 10 mm ⁇ 10 mm. Together, a test piece for measurement was obtained.
  • test piece for measurement was held in an autoclave adjusted to 50 ° C./5 atm for 20 minutes, and allowed to stand for 1 hour in a 23 ° C. and 50% RH environment.
  • test piece was set in the chamber BOX of a microcreep measuring machine (model name: TA.TX.PLUS manufactured by Eiko Seiki Co., Ltd.) with a length of 15 mm for the fixing chuck portion.
  • the pressure-sensitive polarizing film on the test piece was subjected to the polarizing film and the glass under a tensile load of 800 g and a tension time of 1 hour. It was pulled parallel to the bonding surface with the polarizing film and in the length direction of the polarizing film, and the amount of deviation ( ⁇ m) of the bonded portion between the glass and the polarizing film in the test piece was measured.
  • ⁇ Layer shrinkage rate> The laminated body for the test was allowed to cool for 10 minutes in an environment of 23 ° C. and 50% RH, and the dimensions (Xs) in the long side direction of the polarizing film in the laminated body were measured. Next, the laminate was left to stand at 80 ° C. for 72 hours and then allowed to cool for 10 minutes in an environment of 23 ° C. and 50% RH to determine the dimensions (Ys) of the polarizing film in the laminate in the long side direction. It was measured. The laminate shrinkage rate (((Xs—Ys) / Xs) ⁇ 100) was calculated from the obtained Xs and Ys.
  • ⁇ Surface resistivity> The surface of the pressure-sensitive adhesive layer exposed by allowing the test laminate to cool in an environment of 23 ° C. and 50% RH for 10 minutes and peeling off the adhesive polarizing film from the liquid crystal panel at a peeling angle of 90 ° and a peeling speed of 300 mm / min.
  • the resistivity (Xr) was measured using a resistivity meter (High Resta UX MCP-HT800, Mitsubishi Chemical Analytical) at an applied voltage of 1000 V according to JIS-K-6911.
  • the laminate was left to stand at 80 ° C. for 72 hours and then allowed to cool for 10 minutes in an environment of 23 ° C. and 50% RH to peel off the adhesive polarizing film from the liquid crystal panel at a peeling angle of 90 ° and a peeling speed of 300 mm.
  • the surface resistivity (Yr) was measured in the same manner as the surface resistivity (Xr) except that it was peeled off at / min.

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Abstract

Provided is a pressure-sensitive-adhesive polarizing film whereby an increase in the surface resistivity of a pressure-sensitive-adhesive layer in a high-temperature environment can be suppressed. Through the present invention, there is provided a pressure-sensitive-adhesive polarizing film constituted by layering a pressure-sensitive-adhesive layer and a polarizing film, wherein the pressure-sensitive-adhesive layer is formed from a pressure-sensitive-adhesive composition containing a pressure-sensitive adhesive and an electroconductive polymer, and the storage modulus (G') at 80°C of the pressure-sensitive-adhesive layer is 20-1000 kPa.

Description

粘着性偏光フィルム及び画像表示装置用積層体Adhesive polarizing film and laminate for image display device
 本発明は、粘着性偏光フィルム及び画像表示装置用積層体に関する。 The present invention relates to an adhesive polarizing film and a laminate for an image display device.
 特許文献1に開示されているような画像表示部材は複数の部材から構成されるものであり、従来から、各部材の貼り合わせには粘着剤(粘着剤層)が使用されている。 The image display member as disclosed in Patent Document 1 is composed of a plurality of members, and conventionally, an adhesive (adhesive layer) has been used for bonding each member.
国際公開第2014/042248号International Publication No. 2014/042248
 画像表示部材においては、静電気が各種部材に蓄積することによる画像表示異常が課題となっており、静電気蓄積防止のため、画像表示部材を貼り合わせる粘着剤が低抵抗値であることが求められている。粘着剤(粘着剤層)を低抵抗値化する方法として、導電性高分子等の導電材を粘着剤に配合する方法がある。 In the image display member, an image display abnormality due to the accumulation of static electricity in various members has become an issue, and in order to prevent the accumulation of static electricity, it is required that the adhesive for adhering the image display member has a low resistance value. There is. As a method of lowering the resistance value of the pressure-sensitive adhesive (pressure-sensitive adhesive layer), there is a method of blending a conductive material such as a conductive polymer with the pressure-sensitive adhesive.
 画像表示部材は、高温または高温・高湿環境下に晒されることがあるが、前記環境下においては、画像表示部材を構成する部材の収縮が発生する。部材の収縮に伴い、部材の貼り合わせに使用される粘着剤層も収縮すると、導電性高分子の粘着剤層中での配置が崩れ、粘着剤層の表面抵抗率が上昇する問題があった。 The image display member may be exposed to a high temperature or high temperature / high humidity environment, and in the above environment, the members constituting the image display member shrink. When the pressure-sensitive adhesive layer used for bonding the members also shrinks with the shrinkage of the members, there is a problem that the arrangement of the conductive polymer in the pressure-sensitive adhesive layer is broken and the surface resistivity of the pressure-sensitive adhesive layer increases. ..
 本発明はこのような事情に鑑みてなされたものであり、高温環境下での粘着剤層の表面抵抗率の上昇を抑制可能な、粘着性偏光フィルムを提供するものである。 The present invention has been made in view of such circumstances, and provides an adhesive polarizing film capable of suppressing an increase in the surface resistivity of the adhesive layer in a high temperature environment.
 本発明によれば、粘着剤層と偏光フィルムが積層されて構成された粘着性偏光フィルムにおいて、前記粘着剤層は、粘着剤と、導電性高分子とを含有する粘着剤組成物より形成され、前記粘着剤層の80℃における貯蔵弾性率(G')が20~1000kPaである、粘着性偏光フィルムが提供される。 According to the present invention, in an adhesive polarizing film composed of a pressure-sensitive adhesive layer and a polarizing film laminated, the pressure-sensitive adhesive layer is formed of a pressure-sensitive adhesive composition containing a pressure-sensitive adhesive and a conductive polymer. Provided is an adhesive polarizing film having a storage elasticity (G') of the pressure-sensitive adhesive layer at 80 ° C. of 20 to 1000 kPa.
 本発明の粘着性偏光フィルムでは、粘着剤層が80℃という高温環境下においても比較的高い貯蔵弾性率を有しているために、熱によって偏光フィルムが収縮しようとした場合でも、粘着剤層が収縮することが抑制され、その結果、粘着剤層の収縮に起因する表面抵抗率の上昇が抑制される。 In the adhesive polarizing film of the present invention, the adhesive layer has a relatively high storage elastic modulus even in a high temperature environment of 80 ° C. Therefore, even when the polarizing film tries to shrink due to heat, the adhesive layer Shrinkage is suppressed, and as a result, an increase in surface modulus due to shrinkage of the pressure-sensitive adhesive layer is suppressed.
本発明の一実施形態の粘着性偏光フィルム1の層構成図である。It is a layer block diagram of the adhesive polarizing film 1 of one Embodiment of this invention. 本発明の一実施形態の画像表示装置用積層体5の層構成図である。It is a layer block diagram of the laminated body 5 for an image display device of one Embodiment of this invention.
 以下、本発明の実施形態について、詳細に説明する。 Hereinafter, embodiments of the present invention will be described in detail.
1.粘着性偏光フィルム
 図1に示すように、本発明の一実施形態の粘着性偏光フィルム1は、粘着剤層2と偏光フィルム3が積層されて構成される。粘着性偏光フィルム1の粘着面1aには、粘着面1aを保護するための剥離フィルム4が設けられることが好ましい。剥離フィルム4は、PETなどの構成することができる。
 以下、各構成について説明する。
1. 1. Adhesive polarizing film As shown in FIG. 1, the adhesive polarizing film 1 of the embodiment of the present invention is configured by laminating the pressure-sensitive adhesive layer 2 and the polarizing film 3. It is preferable that the adhesive surface 1a of the adhesive polarizing film 1 is provided with a release film 4 for protecting the adhesive surface 1a. The release film 4 can be made of PET or the like.
Hereinafter, each configuration will be described.
1-1.粘着剤層2
 粘着剤層2は、粘着剤と、導電性高分子とを含有する粘着剤組成物より形成される。導電性高分子によって粘着剤層2に導電性が付与されて、粘着剤層2の表面抵抗率が低減される。
1-1. Adhesive layer 2
The pressure-sensitive adhesive layer 2 is formed of a pressure-sensitive adhesive composition containing a pressure-sensitive adhesive and a conductive polymer. Conductivity is imparted to the pressure-sensitive adhesive layer 2 by the conductive polymer, and the surface resistivity of the pressure-sensitive adhesive layer 2 is reduced.
 粘着剤層2の80℃における貯蔵弾性率(G')が20~1000kPaである。以下、別段の記載がない限り、貯蔵弾性率は、80℃における貯蔵弾性率(G')を意味し、貯蔵弾性率の測定周波数は1Hzとする。貯蔵弾性率がこのような範囲内であることによって、高温環境下での粘着剤層2の収縮に起因する表面抵抗率の上昇が抑制される。この貯蔵弾性率は、例えば、具体的には例えば、20、30、40、50、60、70、80、90、100、200、300、400、500、600、700、800、900、1000kPaであり、ここで例示した数値の何れか2つの間の範囲内であってもよい。粘着剤層2の貯蔵弾性率は、粘着剤の組成を変更することによって調整することができる。 The storage elastic modulus (G') of the pressure-sensitive adhesive layer 2 at 80 ° C. is 20 to 1000 kPa. Hereinafter, unless otherwise specified, the storage elastic modulus means the storage elastic modulus (G') at 80 ° C., and the measurement frequency of the storage elastic modulus is 1 Hz. When the storage elastic modulus is within such a range, an increase in surface resistivity due to shrinkage of the pressure-sensitive adhesive layer 2 in a high temperature environment is suppressed. The storage elastic modulus is, for example, 20, 30, 40, 50, 60, 70, 80, 90, 100, 200, 300, 400, 500, 600, 700, 800, 900, 1000 kPa. Yes, it may be within the range between any two of the numerical values exemplified here. The storage elastic modulus of the pressure-sensitive adhesive layer 2 can be adjusted by changing the composition of the pressure-sensitive adhesive.
 粘着剤層2の厚さは、乾燥膜厚で通常5~75μm、好ましくは10~50μmである。 The thickness of the pressure-sensitive adhesive layer 2 is usually 5 to 75 μm, preferably 10 to 50 μm in terms of dry film thickness.
1-2.粘着剤
 粘着剤は、導電性高分子を分散可能な任意の粘着剤で構成される。粘着剤としては、アクリル系粘着剤やゴム系粘着剤が挙げられる。
1-2. Adhesive The adhesive is composed of any adhesive that can disperse the conductive polymer. Examples of the adhesive include an acrylic adhesive and a rubber adhesive.
1-2-1.アクリル系粘着剤
 アクリル系粘着剤は、(メタ)アクリル系ポリマーと、架橋剤とを含む粘着剤である。(メタ)アクリル系ポリマーは、(メタ)アクリル系の単位構造からなる繰り返し構造を含むポリマーである。(メタ)アクリル系の単位構造としては、(メタ)アクリル酸エステルに由来する単位構造が挙げられる。
1-2-1. Acrylic Adhesives Acrylic adhesives are adhesives containing (meth) acrylic polymers and cross-linking agents. The (meth) acrylic polymer is a polymer containing a repeating structure having a (meth) acrylic unit structure. Examples of the (meth) acrylic-based unit structure include a unit structure derived from the (meth) acrylic acid ester.
 粘着剤がアクリル系粘着剤である場合、粘着剤層2の貯蔵弾性率は、20~200kPaであることが好ましい。貯蔵弾性率が高すぎると粘着力が低くなりすぎる場合があるからである。この貯蔵弾性率は、具体的には例えば、20、30、40、50、60、70、80、90、100、110、120、130、140、150、160、170、180、190、200kPaであり、ここで例示した数値の何れか2つの間の範囲内であってもよい。 When the pressure-sensitive adhesive is an acrylic pressure-sensitive adhesive, the storage elastic modulus of the pressure-sensitive adhesive layer 2 is preferably 20 to 200 kPa. This is because if the storage elastic modulus is too high, the adhesive strength may be too low. Specifically, the storage elastic modulus is, for example, 20, 30, 40, 50, 60, 70, 80, 90, 100, 110, 120, 130, 140, 150, 160, 170, 180, 190, 200 kPa. Yes, it may be within the range between any two of the numerical values exemplified here.
 粘着剤がアクリル系粘着剤である場合、(メタ)アクリル系ポリマー単独での貯蔵弾性率を変更したり、架橋剤の含有量を変更したりすることによって、粘着剤層2の貯蔵弾性率を調整することができる。 When the pressure-sensitive adhesive is an acrylic pressure-sensitive adhesive, the storage elastic modulus of the pressure-sensitive adhesive layer 2 can be changed by changing the storage elastic modulus of the (meth) acrylic polymer alone or changing the content of the cross-linking agent. Can be adjusted.
<(メタ)アクリル系ポリマー>
 (メタ)アクリル系ポリマー単独での貯蔵弾性率は、20~200kPaが好ましく、30~100kPaがさらに好ましい。この貯蔵弾性率は、具体的には例えば、20、30、40、50、60、70、80、90、100、110、120、130、140、150、160、170、180、190、200kPaであり、ここで例示した数値の何れか2つの間の範囲内であってもよい。
<(Meta) acrylic polymer>
The storage elastic modulus of the (meth) acrylic polymer alone is preferably 20 to 200 kPa, more preferably 30 to 100 kPa. Specifically, the storage elastic modulus is, for example, 20, 30, 40, 50, 60, 70, 80, 90, 100, 110, 120, 130, 140, 150, 160, 170, 180, 190, 200 kPa. Yes, it may be within the range between any two of the numerical values exemplified here.
 ポリマー単独での貯蔵弾性率が低い場合でも架橋剤の添加量を増やすことによって、粘着剤層2の貯蔵弾性率を高くすることができるが、その場合には、ポリマーの靭性が低下してしまう場合があるので、ポリマー単独での貯蔵弾性率が上記範囲であることが好ましい。 Even when the storage elastic modulus of the polymer alone is low, the storage elastic modulus of the pressure-sensitive adhesive layer 2 can be increased by increasing the amount of the cross-linking agent added, but in that case, the toughness of the polymer is lowered. In some cases, the storage elastic modulus of the polymer alone is preferably in the above range.
 (メタ)アクリル系ポリマーの重量平均分子量Mwは、例えば、40万~300万であり、60万~250万が好ましく、100万~200万がさらに好ましい。この場合に、(メタ)アクリル系ポリマーの貯蔵弾性率が好ましい値になりやすい。このMwは、具体的には例えば、40万、50万、60万、70万、80万、90万、100万、110万、120万、130万、140万、150万、160万、170万、180万、190万、200万、250万、300万であり、ここで例示した数値の何れか2つの間の範囲内であってもよい。Mwは、ゲルパーミエーションクロマトグラフィー(GPC)法により測定される。 The weight average molecular weight Mw of the (meth) acrylic polymer is, for example, 400,000 to 3 million, preferably 600,000 to 2.5 million, and more preferably 1 million to 2 million. In this case, the storage elastic modulus of the (meth) acrylic polymer tends to be a preferable value. Specifically, this Mw is, for example, 400,000, 500,000, 600,000, 700,000, 800,000, 900,000, 1 million, 1.1 million, 1.2 million, 1.3 million, 1.4 million, 1.5 million, 1.6 million, 170. It is 10,000, 1.8 million, 1.9 million, 2 million, 2.5 million, and 3 million, and may be within the range between any two of the numerical values exemplified here. Mw is measured by gel permeation chromatography (GPC) method.
 (メタ)アクリル系ポリマーの分子量分布(Mw/Mn;Mnは数平均分子量)は、例えば1~15であり、5~10が好ましい。この値は、具体的には例えば、1、2、3、4、5、6、7、8、9、10、11、12、13、14、15であり、ここで例示した数値の何れか2つの間の範囲内であってもよい。Mnは、Mwと同様にGPC法により測定する。 The molecular weight distribution (Mw / Mn; Mn is a number average molecular weight) of the (meth) acrylic polymer is, for example, 1 to 15, preferably 5 to 10. Specifically, this value is, for example, 1, 2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, and is any of the numerical values exemplified here. It may be within the range between the two. Mn is measured by the GPC method in the same manner as Mw.
 (メタ)アクリル系ポリマーは、第1及び第2モノマーを含むモノマー混合物の重合体であることが好ましい。モノマー混合物全体を100質量%とすると、第1モノマーの含有量が0.05~10質量%であり、第2モノマーの含有量が51~99.5質量%であることが好ましい。モノマー混合物は、第3モノマーを含有してもよい。第3モノマーの含有量は、100質量%から第1及び第2モノマー含有量を引いた残りである。このような配合のモノマー混合物を用いて(メタ)アクリル系ポリマーを形成すると、(メタ)アクリル系ポリマーの貯蔵弾性率が好ましい値になりやすい。 The (meth) acrylic polymer is preferably a polymer of a monomer mixture containing the first and second monomers. Assuming that the total amount of the monomer mixture is 100% by mass, the content of the first monomer is preferably 0.05 to 10% by mass, and the content of the second monomer is preferably 51 to 99.5% by mass. The monomer mixture may contain a third monomer. The content of the third monomer is the balance of 100% by mass minus the contents of the first and second monomers. When a (meth) acrylic polymer is formed by using a monomer mixture having such a composition, the storage elastic modulus of the (meth) acrylic polymer tends to be a preferable value.
 第1モノマーの含有量は、好ましくは、1~5質量%である。この含有量は、具体的には例えば、0.05、0.1、0.5、1、2、3、4、5、6、7、8、9、10質量%であり、ここで例示した数値の何れか2つの間の範囲内であってもよい。 The content of the first monomer is preferably 1 to 5% by mass. Specifically, this content is, for example, 0.05, 0.1, 0.5, 1, 2, 3, 4, 5, 6, 7, 8, 9, and 10% by mass, and is exemplified here. It may be within the range between any two of the given numerical values.
 第2モノマーの含有量は、好ましくは、60~99.5質量%である。この含有量は、具体的には例えば、具体的には例えば、51、55、60、65、70、75、80、85、90、95、96、97、98、99、99.5質量%であり、ここで例示した数値の何れか2つの間の範囲内であってもよい。 The content of the second monomer is preferably 60 to 99.5% by mass. This content is specifically, for example, for example, 51, 55, 60, 65, 70, 75, 80, 85, 90, 95, 96, 97, 98, 99, 99.5% by mass. It may be within the range between any two of the numerical values exemplified here.
・第1モノマー
 第1モノマーは、架橋性官能基含有モノマーである。
-First monomer The first monomer is a crosslinkable functional group-containing monomer.
 「架橋性官能基」とは、重合成分としてポリマー鎖に取り込まれ、その後、粘着剤層を構成する際に、当該官能基と他のポリマー鎖中の官能基との反応により、又は当該官能基と架橋剤との反応により、粘着剤層の系内でポリマー鎖同士の三次元架橋を形成し得る官能基のことを指す。このような架橋性官能基としては、水酸基、アミノ基、カルボキシル基などが挙げられる。 The "crosslinkable functional group" is incorporated into a polymer chain as a polymerization component, and then, when the pressure-sensitive adhesive layer is formed, the functional group reacts with a functional group in another polymer chain, or the functional group. Refers to a functional group capable of forming a three-dimensional crosslink between polymer chains in the system of the pressure-sensitive adhesive layer by the reaction between the polymer chain and the cross-linking agent. Examples of such a crosslinkable functional group include a hydroxyl group, an amino group, and a carboxyl group.
 架橋性官能基として水酸基を有するモノマーとしては、例えば、2-ヒドロキシエチル(メタ)アクリレート、2-ヒドロキシプロピル(メタ)アクリレート、3-ヒドロキシプロピル(メタ)アクリレート、4-ヒドロキシブチル(メタ)アクリレート、2-ヒドロキシ-3-クロロプロピル(メタ)アクリレート、2-ヒドロキシ-3-フェノキシプロピル(メタ)アクリレート、6-ヒドロキシヘキシル(メタ)アクリレート、エチレングリコール(メタ)アクリレート、ポリエチレングリコール(メタ)アクリレート、ポリプロピレングリコール(メタ)アクリレートなどが挙げられ、このうち1種を単独でまたは2種以上を組み合わせて使用することができる。 Examples of the monomer having a hydroxyl group as a crosslinkable functional group include 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 3-hydroxypropyl (meth) acrylate, and 4-hydroxybutyl (meth) acrylate. 2-Hydroxy-3-chloropropyl (meth) acrylate, 2-hydroxy-3-phenoxypropyl (meth) acrylate, 6-hydroxyhexyl (meth) acrylate, ethylene glycol (meth) acrylate, polyethylene glycol (meth) acrylate, polypropylene Glycol (meth) acrylate and the like can be mentioned, and one of them can be used alone or in combination of two or more.
 架橋性官能基としてアミノ基を有するモノマーとしては、例えば、N,N-ジメチルアミノエチル(メタ)アクリレート、N,N-ジエチルアミノエチル(メタ)アクリレート、N,N-ジメチルアミノプロピル(メタ)アクリルアミド、N,N'-ジメチルアミノエチル(メタ)アクリルアミド、N,N'-ジメチルアミノプロピル(メタ)アクリルアミド、アクリルアミドなどが挙げられ、このうち1種を単独でまたは2種以上を組み合わせて使用することができる。 Examples of the monomer having an amino group as a crosslinkable functional group include N, N-dimethylaminoethyl (meth) acrylate, N, N-diethylaminoethyl (meth) acrylate, N, N-dimethylaminopropyl (meth) acrylamide, and the like. N, N'-dimethylaminoethyl (meth) acrylamide, N, N'-dimethylaminopropyl (meth) acrylamide, acrylamide, etc. may be mentioned, and one of them may be used alone or in combination of two or more. can.
 架橋性官能基としてカルボキシル基を有するモノマーとしては、例えば、(メタ)アクリル酸、クロトン酸、マレイン酸、イタコン酸、シトラコン酸、無水マレイン酸、無水イタコン酸などが挙げられ、このうち1種を単独でまたは2種以上を組み合わせて使用することができる。 Examples of the monomer having a carboxyl group as a crosslinkable functional group include (meth) acrylic acid, crotonic acid, maleic acid, itaconic acid, citraconic acid, maleic anhydride, itaconic anhydride and the like, and one of them is used. It can be used alone or in combination of two or more.
 架橋性官能基を有するモノマーの中でも、粘着剤層の系内で三次元架橋構造を形成しやすい点から、水酸基を有するモノマーが好ましく、より具体的には、2-ヒドロキシエチル(メタ)アクリレート、4-ヒドロキシブチル(メタ)アクリレート、6-ヒドロキシヘキシル(メタ)アクリレートが好ましい。 Among the monomers having a crosslinkable functional group, a monomer having a hydroxyl group is preferable, and more specifically, 2-hydroxyethyl (meth) acrylate, because it is easy to form a three-dimensional crosslinked structure in the system of the pressure-sensitive adhesive layer. 4-Hydroxybutyl (meth) acrylate and 6-hydroxyhexyl (meth) acrylate are preferable.
・第2モノマー
 第2モノマーは、第1モノマーでなく、ホモポリマーのガラス転移温度(Tg)が-60~20℃である(メタ)アクリル酸アルキルエステルと、ホモポリマーのガラス転移温度が-60~20℃である(メタ)アクリル酸アルコキシアルキルエステルから選択される少なくとも1種である。ホモポリマーのガラス転移温度(Tg)は、Polymer Handbook Fourth Edition(Wiley-Interscience 1999)に記載された値を採用する。
-Second monomer The second monomer is not the first monomer, but a (meth) acrylic acid alkyl ester having a homopolymer glass transition temperature (Tg) of -60 to 20 ° C. and a homopolymer glass transition temperature of -60. At least one selected from (meth) acrylic acid alkoxyalkyl esters at ~ 20 ° C. For the glass transition temperature (Tg) of the homopolymer, the value described in Polymer Handbook Fourth Edition (Wiley-Interscience 1999) is adopted.
 このような(メタ)アクリル酸アルキルエステルとしては、ブチルアクリレート(-50℃)、メチルアクリレート(8℃)、オクチルメタクリレート(-20℃)、イソオクチルメタクリレート(-45℃)、2-エチルへキシルメタクリレート(-10℃)、イソデシルメタクリレート(-41℃)、イソステアリルメタクリレート(-18℃)が挙げられる。このような(メタ)アクリル酸アルコキシアルキルエステルとしては、2-メトキシエチルアクリレート(-50℃)、メトキシ-トリエチレングルコールアクリレート(-50℃)が挙げられる。第2~第3モノマーについての括弧内の温度は、ホモポリマーのTgである。 Examples of such (meth) acrylic acid alkyl esters include butyl acrylate (-50 ° C), methyl acrylate (8 ° C), octyl methacrylate (-20 ° C), isooctyl methacrylate (-45 ° C), and 2-ethylhexyl. Examples thereof include methacrylate (-10 ° C.), isodecyl methacrylate (−41 ° C.), and isostearyl methacrylate (-18 ° C.). Examples of such (meth) acrylic acid alkoxyalkyl ester include 2-methoxyethyl acrylate (-50 ° C) and methoxy-triethylene glucol acrylate (-50 ° C). The temperature in parentheses for the second to third monomers is the homopolymer Tg.
 第2モノマーのTgは、具体的には例えば、-60、-50、-40、-30、-20、-10、0、10、20℃であり、ここで例示した数値の何れか2つの間の範囲内であってもよい。 Specifically, the Tg of the second monomer is, for example, -60, -50, -40, -30, -20, -10, 0, 10, 20 ° C., and any two of the numerical values exemplified here. It may be within the range between.
・第3モノマー
 第3モノマーは、第1及び第2モノマーの何れでもないモノマーである。このようなモノマーとしては、Tgが第2モノマーで規定した範囲外である(メタ)アクリル酸アルキルエステル又は(メタ)アクリル酸アルコキシアルキルエステルや、その他の(メタ)アクリル酸エステルや、その他のエチレン性不飽和二重結合を有するモノマーである。
-Third monomer The third monomer is a monomer that is neither the first nor the second monomer. Such monomers include (meth) acrylic acid alkyl esters or (meth) acrylic acid alkoxyalkyl esters, other (meth) acrylic acid esters, and other ethylenes in which Tg is outside the range specified by the second monomer. It is a monomer having a sex unsaturated double bond.
・重合方法
 上記モノマー混合物を、溶液重合、乳化重合、塊状重合等の各種公知の方法により重合することで(メタ)アクリル系ポリマーが得られる。粘着剤の接着力、保持力等の特性のバランスや、コスト等の観点から、溶液重合法が好ましい。溶液重合の溶媒としては、酢酸エチル、トルエン等が用いられる。溶液濃度は通常20~80重量%程度である。重合開始剤としては、アゾ系、過酸化物系等の各種公知のものを使用できる。分子量を調整するために、連鎖移動剤が用いられていてもよい。反応温度は通常50~80℃、反応時間は通常1~8時間である。
-Polymerization method A (meth) acrylic polymer can be obtained by polymerizing the above-mentioned monomer mixture by various known methods such as solution polymerization, emulsion polymerization and bulk polymerization. The solution polymerization method is preferable from the viewpoint of the balance of characteristics such as the adhesive force and the holding force of the pressure-sensitive adhesive and the cost. Ethyl acetate, toluene and the like are used as the solvent for solution polymerization. The solution concentration is usually about 20 to 80% by weight. As the polymerization initiator, various known agents such as azo type and peroxide type can be used. Chain transfer agents may be used to adjust the molecular weight. The reaction temperature is usually 50 to 80 ° C., and the reaction time is usually 1 to 8 hours.
<架橋剤>
 粘着剤に適度の凝集力を持たせる観点から、(メタ)アクリル系ポリマーには架橋構造が導入されることが好ましい。例えば、(メタ)アクリル系ポリマーを重合後の溶液に架橋剤を添加し、必要に応じて加熱を行うことにより、架橋構造が導入される。架橋剤としては、イソシアネート系架橋剤、エポキシ系架橋剤、オキサゾリン系架橋剤、アジリジン系架橋剤、カルボジイミド系架橋剤、金属キレート系架橋剤等が挙げられる。これらの架橋剤は、(メタ)アクリル系ポリマー中に導入された架橋性官能基と反応して架橋構造を形成する。
<Crosslinking agent>
From the viewpoint of giving the pressure-sensitive adhesive an appropriate cohesive force, it is preferable to introduce a crosslinked structure into the (meth) acrylic polymer. For example, a cross-linking structure is introduced by adding a cross-linking agent to the solution after polymerizing the (meth) acrylic polymer and heating as necessary. Examples of the cross-linking agent include isocyanate-based cross-linking agents, epoxy-based cross-linking agents, oxazoline-based cross-linking agents, aziridine-based cross-linking agents, carbodiimide-based cross-linking agents, metal chelate-based cross-linking agents and the like. These cross-linking agents react with the cross-linking functional groups introduced into the (meth) acrylic polymer to form a cross-linked structure.
 加熱により(メタ)アクリル系ポリマーに架橋構造を導入可能であることから、架橋剤としては、1分子中に2個以上のイソシアネート基を有するポリイソシアネートが好ましい。ポリイソシアネート系架橋剤としては、例えば、ブチレンジイソシアネート、ヘキサメチレンジイソシアネート等の低級脂肪族ポリイソシアネート類;シクロペンチレンジイソシアネート、シクロへキシレンジイソシアネート、イソホロンジイソシアネート等の脂環族イソシアネート類;2,4-トリレンジイソシアネート、4,4'-ジフェニルメタンジイソシアネート、キシリレンジイソシアネート等の芳香族イソシアネート類;トリメチロールプロパン/トリレンジイソシアネート3量体付加物(例えば、東ソー製「コロネートL」)、トリメチロールプロパン/へキサメチレンジイソシアネート3量体付加物(例えば、東ソー製「コロネートHL」)、キシリレンジイソシアネートのトリメチロールプロパン付加物(例えば、三井化学製「タケネートD110N」、ヘキサメチレンジイソシアネートのイソシアヌレート体(例えば、東ソー製「コロネートHX」、綜研化学製「Y-75」)等のイソシアネート付加物等が挙げられる。 Since a crosslinked structure can be introduced into the (meth) acrylic polymer by heating, a polyisocyanate having two or more isocyanate groups in one molecule is preferable as the crosslinked agent. Examples of the polyisocyanate-based cross-linking agent include lower aliphatic polyisocyanates such as butylene diisocyanate and hexamethylene diisocyanate; alicyclic isocyanates such as cyclopentylene diisocyanate, cyclohexylene diisocyanate and isophorone diisocyanate; 2,4-triisocyanate. Aromatic isocyanates such as range isocyanate, 4,4'-diphenylmethane diisocyanate, xylylene diisocyanate; trimethylol propane / tolylene diisocyanate trimer adduct (eg, "Coronate L" manufactured by Toso), trimethylol propane / hexa Methylene diisocyanate trimeric adduct (eg, "Coronate HL" manufactured by Tosoh), trimethylol propane adduct of xylylene diisocyanate (eg, "Takenate D110N" manufactured by Mitsui Chemicals, isocyanurate of hexamethylene diisocyanate (eg, manufactured by Tosoh). Examples thereof include isocyanate additives such as "Coronate HX" and "Y-75" manufactured by Soken Kagaku.
 架橋剤の配合量は、(メタ)アクリル系ポリマーの100質量部に対し、例えば0.005~2質量部であり、0.01~1質量部が好ましく、0.05~0.15がさらに好ましい。粘着剤層2の貯蔵弾性率が好ましい値になりやすい。この配合量は、具体的には例えば、0.005、0.01、0.05、0.10、0.15、0.20、0.50、1.0、2.0質量部であり、ここで例示した数値の何れか2つの間の範囲内であってもよい。 The blending amount of the cross-linking agent is, for example, 0.005 to 2 parts by mass, preferably 0.01 to 1 part by mass, and further preferably 0.05 to 0.15 with respect to 100 parts by mass of the (meth) acrylic polymer. preferable. The storage elastic modulus of the pressure-sensitive adhesive layer 2 tends to be a preferable value. Specifically, the blending amount is, for example, 0.005, 0.01, 0.05, 0.10, 0.15, 0.20, 0.50, 1.0, 2.0 parts by mass. , It may be within the range between any two of the numerical values exemplified here.
1-2-2.ゴム系粘着剤
 ゴム系粘着剤としては、天然ゴムや合成ゴムをポリマーとするゴム系粘着剤組成物が挙げられ、水添ブロック共重合体と、粘着付与樹脂と、軟化剤を含むことが好ましい。
1-2-2. Rubber-based adhesives Examples of the rubber-based adhesives include rubber-based adhesive compositions using natural rubber or synthetic rubber as a polymer, and preferably contain a hydrogenated block copolymer, a tackifier resin, and a softening agent. ..
<水添ブロック共重合体>
 ブロック共重合体は、芳香族ビニル単量体の重合体成分から構成されるセグメント(ハードセグメント)と、共役ジエン単量体の重合体成分から構成されるセグメント(ソフトセグメント)とを有する熱可塑性エラストマーである。ここで、より具体的には、芳香族ビニル化合物はスチレン、α-メチルスチレンであることが好ましく(より好ましくはスチレン)、共役ジエン化合物はブタジエン、イソプレンであることが好ましい。
<Hydrogenated block copolymer>
The block copolymer is thermoplastic having a segment composed of a polymer component of an aromatic vinyl monomer (hard segment) and a segment composed of a polymer component of a conjugated diene monomer (soft segment). It is an elastomer. Here, more specifically, the aromatic vinyl compound is preferably styrene or α-methylstyrene (more preferably styrene), and the conjugated diene compound is preferably butadiene or isoprene.
 水添ブロック共重合体の具体例としては、例えば、スチレン-(エチレン-プロピレン)-スチレン型ブロック共重合体(SEPS)(スチレン-イソプレン-スチレン型ブロック共重合体(SIS)の水素添加物)、スチレン-(ブタジエン-ブチレン)-スチレン型ブロック共重合体(SBBS)の水素添加物、スチレン-(エチレン-ブチレン)-スチレン型ブロック共重合体(SEBS)(スチレン-ブタジエン-スチレン型ブロック共重合体(SBS)の水素添加物)、スチレン-(エチレン-プロピレン)型ブロック共重合体(SEP)(スチレン-イソプレン型ブロック共重合体(SI)の水素添加物)、スチレン-(エチレン-ブチレン)型ブロック共重合体(SEB)(スチレン-ブタジエン型ブロック共重合体(SB)の水素添加物)などが挙げられる。なかでも、粘着付与樹脂との相溶性に優れている観点から、水添ブロック共重合体は、スチレン-(エチレン-プロピレン)-スチレン型ブロック共重合体(SEPS)、スチレン-(エチレン-ブチレン)-スチレン型ブロック共重合体(SEBS)等のABA型水添ブロック共重合体が特に好ましい。これらは単独で使用してもよく、また2種以上を混合して使用してもよい。 Specific examples of the hydrogenated block copolymer include, for example, a styrene- (ethylene-propylene) -styrene type block copolymer (SEPS) (a hydrogenated additive of a styrene-isoprene-styrene type block copolymer (SIS)). , Stylite- (butadiene-butylene) -styrene type block copolymer (SBBS) hydrogenated product, styrene- (ethylene-butylene) -styrene type block copolymer (SEBS) (styrene-butadiene-styrene type block copolymer weight Combined (SBS) hydrogen additive), styrene- (ethylene-propylene) type block copolymer (SEP) (styrene-isoprene type block copolymer (SI) hydrogen additive), styrene- (ethylene-butylene) Examples thereof include a type block copolymer (SEB) (a hydrogenated additive of a styrene-butadiene type block copolymer (SB)). Among them, the hydrogenated block copolymers are styrene- (ethylene-propylene) -styrene type block copolymer (SEPS) and styrene- (ethylene-butylene) from the viewpoint of excellent compatibility with the tackifier resin. -ABA type hydrogenated block copolymers such as styrene type block copolymers (SEBS) are particularly preferable. These may be used alone or in combination of two or more.
<粘着付与樹脂>
 粘着付与樹脂は、水添ブロック共重合体を構成するハードセグメントに相溶する性質を有する。粘着付与樹脂は、例えば、芳香族系粘着付与樹脂であることができる。粘着付与樹脂として用いられる芳香族系粘着付与樹脂は、相溶性の観点からは分子量5,000以下であるのが好ましい。
<Adhesive-imparting resin>
The tackifier resin has the property of being compatible with the hard segments constituting the hydrogenated block copolymer. The tackifier resin can be, for example, an aromatic tackifier resin. The aromatic tackifier resin used as the tackifier resin preferably has a molecular weight of 5,000 or less from the viewpoint of compatibility.
 粘着付与樹脂は、軟化点が80℃以上であることが好ましい。この軟化点は、例えば、80~200℃であり、具体的には例えば、80、90、100、110、120、130、140、150、160、170、180、190、200℃であり、ここで例示した数値の何れか2つの間の範囲内であってもよい。 The tackifier resin preferably has a softening point of 80 ° C. or higher. The softening point is, for example, 80 to 200 ° C., specifically, for example, 80, 90, 100, 110, 120, 130, 140, 150, 160, 170, 180, 190, 200 ° C., and here. It may be within the range between any two of the numerical values exemplified in.
 粘着付与樹脂として使用可能な芳香族系粘着付与樹脂としては、例えば、芳香族石油樹脂、スチレン系重合体、α-メチルスチレン系重合体、スチレン-(α-メチルスチレン)系共重合体、スチレン-脂肪族炭化水素系共重合体、スチレン-(α-メチルスチレン)-脂肪族炭化水素系共重合体、スチレン-芳香族炭化水素系共重合体などがあげられる。より具体的には、例えば市販のスチレン-芳香族炭化水素系共重合体としてのFMR-0150(軟化点145℃、三井化学製)、スチレン-脂肪族炭化水素系共重合体としてのFTR-6100(軟化点100℃、三井化学製)、FTR-6110(軟化点110℃、三井化学製)およびFTR-6125(軟化点125℃、三井化学製)、スチレン-(α-メチルスチレン)-脂肪族炭化水素系共重合体としてのFTR-7100(軟化点100℃、三井化学製)、スチレン系重合体としてのFTR-8120(軟化点120℃、三井化学製)およびSX-100(軟化点100℃、ヤスハラケミカル製)、α-メチルスチレン系重合体としてのFTR-0100(軟化点100℃、三井化学製)、スチレン-(α-メチルスチレン)系共重合体としてのFTR-2120(軟化点120℃、三井化学製)、FTR-2140(軟化点145℃、三井化学製)、クリスタレックス3100(軟化点100℃、イーストマンケミカル製)、クリスタレックス3085(軟化点85℃、イーストマンケミカル製)、クリスタレックス5140(軟化点140℃、イーストマンケミカル製)、クリスタレックス1120(軟化点120℃、イーストマンケミカル製)、クリスタレックスF85(軟化点85℃、イーストマンケミカル製)、クリスタレックスF100(軟化点100℃、イーストマンケミカル製)およびクリスタレックスF115(軟化点115℃、イーストマンケミカル製)、などを使用することもできる。 Examples of the aromatic pressure-sensitive adhesive resin that can be used as the pressure-sensitive adhesive resin include aromatic petroleum resins, styrene-based polymers, α-methylstyrene-based polymers, styrene- (α-methylstyrene) -based copolymers, and styrene. -Examples include aliphatic hydrocarbon-based copolymers, styrene- (α-methylstyrene) -aliphatic hydrocarbon-based copolymers, and styrene-aromatic hydrocarbon-based copolymers. More specifically, for example, FMR-0150 as a commercially available styrene-aromatic hydrocarbon-based polymer (softening point 145 ° C., manufactured by Mitsui Chemicals, Inc.), FTR-6100 as a styrene-aliphatic hydrocarbon-based copolymer. (Softening point 100 ° C, manufactured by Mitsui Chemicals), FTR-6110 (softening point 110 ° C, manufactured by Mitsui Chemicals) and FTR-6125 (softening point 125 ° C, manufactured by Mitsui Chemicals), styrene- (α-methylstyrene) -aliphatic FTR-7100 (softening point 100 ° C., manufactured by Mitsui Chemicals) as a hydrocarbon-based polymer, FTR-8120 (softening point 120 ° C., manufactured by Mitsui Chemicals) and SX-100 (softening point 100 ° C.) as styrene-based polymers. , Yasuhara Chemical Co., Ltd., FTR-0100 as an α-methylstyrene polymer (softening point 100 ° C, manufactured by Mitsui Chemicals), FTR-2120 as a styrene- (α-methylstyrene) polymer (softening point 120 ° C) , Mitsui Chemicals), FTR-2140 (softening point 145 ° C, manufactured by Mitsui Chemicals), Crystalx 3100 (softening point 100 ° C, manufactured by Eastman Chemical), Crystalex 3085 (softening point 85 ° C, manufactured by Eastman Chemical), Crystalx 5140 (softening point 140 ° C., manufactured by Eastman Chemical), Crystalx 1120 (softening point 120 ° C., manufactured by Eastman Chemical), Crystalx F85 (softening point 85 ° C., manufactured by Eastman Chemical), Crystalx F100 (softening point) A point of 100 ° C., manufactured by Eastman Chemical), Crystalx F115 (softening point of 115 ° C., manufactured by Eastman Chemical), and the like can also be used.
<軟化剤>
 軟化剤は、水添ブロック共重合体を構成するソフトセグメントに相溶する性質を有する。軟化剤は、23℃において液体である。
<Softener>
The softener has the property of being compatible with the soft segments constituting the hydrogenated block copolymer. The softener is a liquid at 23 ° C.
 軟化剤として、ポリブテン系化合物、ポリイソブチレン系化合物、ポリイソプレン系化合等の脂肪族炭化水素等が挙げられ、より具体的には、市販の軟化剤、例えばポリブテン系化合物として日石ポリブテンLV-7、LV-50、LV-100、HV-15、HV-35、HV-50、HV-100、HV-300、HV-1900およびSV-7000(いずれもJXTGエネルギー製)、ポリイソブチレン系化合物としてテトラックス3T、4T、5Tおよび6T、ハイモール4H、5H、5.5Hおよび6H(いずれもJXTGエネルギー製)、ポリイソプレン系化合物としてクラプレンLIR-290(クラレ製)などが挙げられる。 Examples of the softening agent include polybutene-based compounds, polyisobutylene-based compounds, aliphatic hydrocarbons such as polyisobutylene-based compounds, and more specifically, commercially available softeners, for example, Nisseki polybutene LV-7 as a polybutene-based compound. , LV-50, LV-100, HV-15, HV-35, HV-50, HV-100, HV-300, HV-1900 and SV-7000 (all manufactured by JXTG Energy), as polyisobutylene compounds. Examples thereof include Trax 3T, 4T, 5T and 6T, Himor 4H, 5H, 5.5H and 6H (all manufactured by JXTG Energy), and as a polyisobutylene compound, Claprene LIR-290 (manufactured by Claret).
1-3.導電性高分子
 本発明の導電性高分子は、粘着剤組成物に導電性を付与して、粘着剤組成物の帯電防止に寄与する。
1-3. Conductive Polymer The conductive polymer of the present invention imparts conductivity to the pressure-sensitive adhesive composition and contributes to the antistatic property of the pressure-sensitive adhesive composition.
 導電性高分子は、主鎖がπ共役系で構成されている有機高分子であれば本発明の効果を有する限り特に制限されず、例えば、ポリピロール系導電性高分子、ポリチオフェン系導電性高分子、ポリアセチレン系導電性高分子、ポリフェニレン系導電性高分子、ポリフェニレンビニレン系導電性高分子、ポリアニリン系導電性高分子、ポリアセン系導電性高分子、ポリチオフェンビニレン系導電性高分子、及びこれらの共重合体等が挙げられる。空気中での安定性の点からは、ポリピロール系導電性高分子、ポリチオフェン類及びポリアニリン系導電性高分子が好ましく、透明性の面から、ポリチオフェン系導電性高分子がより好ましい。 The conductive polymer is not particularly limited as long as it has the effect of the present invention as long as it is an organic polymer whose main chain is composed of a π-conjugated system. , Polyacetylene-based conductive polymer, polyphenylene-based conductive polymer, polyphenylene vinylene-based conductive polymer, polyaniline-based conductive polymer, polyacene-based conductive polymer, polythiophenine-based conductive polymer, and their co-weights Coalescence and the like can be mentioned. From the viewpoint of stability in air, polypyrrole-based conductive polymers, polythiophenes and polyaniline-based conductive polymers are preferable, and from the viewpoint of transparency, polythiophene-based conductive polymers are more preferable.
 この導電性高分子は、化学式(1)又は(2)で表される構成単位の少なくとも1つを有することが好ましい。この導電性高分子に含まれるπ共役系高分子は、Rを有することによって骨格が歪み易く、フレキシブル性が向上する。そのため、溶剤や粘着剤への分散性が良好であり、その他のπ共役系の高分子種と比較し、粘着剤組成物の導電性を最も向上させることができる。 The conductive polymer preferably has at least one of the structural units represented by the chemical formula (1) or (2). Since the π-conjugated polymer contained in this conductive polymer has R 1 , the skeleton is easily distorted and the flexibility is improved. Therefore, the dispersibility in a solvent or a pressure-sensitive adhesive is good, and the conductivity of the pressure-sensitive adhesive composition can be most improved as compared with other π-conjugated polymer species.
 粘着剤組成物中での導電性高分子の配合量は、粘着剤100質量部に対して、0.01~35質量部が好ましく、0.05~30質量部がさらに好ましく、0.5~20質量部がさらに好ましい。この配合量は、具体的には例えば、0.01、0.05、0.1、0.5、1、2、3、4、5、6、7、8、9、10、11、12、13、14、15、20、25、30、35質量部であり、ここで例示した数値の何れか2つの間の範囲内であってもよい。 The blending amount of the conductive polymer in the pressure-sensitive adhesive composition is preferably 0.01 to 35 parts by mass, more preferably 0.05 to 30 parts by mass, and 0.5 to 0.5 parts by mass with respect to 100 parts by mass of the pressure-sensitive adhesive. 20 parts by mass is more preferable. Specifically, the blending amount is, for example, 0.01, 0.05, 0.1, 0.5, 1, 2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12 , 13, 14, 15, 20, 25, 30, 35 parts by mass, and may be within the range between any two of the numerical values exemplified here.
 Rがシリコーン基を含む場合、導電性高分子の配合量は、粘着剤100質量部に対して、0.01~20質量部が好ましく、0.01~10質量部がさらに好ましい。Rにおいて、シリコーン基部分の割合を調整することで、配合量が少ない場合でも、分散性と導電性を両立することができる。 When R 1 contains a silicone group, the blending amount of the conductive polymer is preferably 0.01 to 20 parts by mass, more preferably 0.01 to 10 parts by mass with respect to 100 parts by mass of the pressure-sensitive adhesive. By adjusting the ratio of the silicone base portion in R 1 , it is possible to achieve both dispersibility and conductivity even when the blending amount is small.
 Rがアルキル基を含む場合、導電性高分子の配合量は、粘着剤100質量部に対して、0.01~35質量部が好ましく、0.1質量部以上がさらに好ましい。 When R 1 contains an alkyl group, the blending amount of the conductive polymer is preferably 0.01 to 35 parts by mass, more preferably 0.1 parts by mass or more with respect to 100 parts by mass of the pressure-sensitive adhesive.
Figure JPOXMLDOC01-appb-C000003
Figure JPOXMLDOC01-appb-C000003
Figure JPOXMLDOC01-appb-C000004
Figure JPOXMLDOC01-appb-C000004
 Rは、炭素数1~12のアルキル基、炭素数1~12のアルコキシ基、繰り返し単位が1~50の炭素数1~12のアルキレンオキサイド基、置換基を有してもよいフェニル基、置換基を有してもよい複素環基、又は置換基を有してもよい縮合環基を表し、Rは、それぞれ酸素原子又は硫黄原子であり、Rは、それぞれ、水素原子又は有機基である。Aは、ドーパント由来のモノアニオンである。nは、2以上300以下である。 R 1 is an alkyl group having 1 to 12 carbon atoms, an alkoxy group having 1 to 12 carbon atoms, an alkylene oxide group having 1 to 50 carbon atoms and having 1 to 12 carbon atoms, and a phenyl group which may have a substituent. Represents a heterocyclic group which may have a substituent or a fused ring group which may have a substituent, R 2 is an oxygen atom or a sulfur atom, respectively, and R 3 is a hydrogen atom or an organic, respectively. It is a group. A is a monoanion derived from a dopant. n is 2 or more and 300 or less.
 前記炭素数1以上12以下のアルキル基は、直鎖状、分岐状、環状等のいずれでもよく、例えば、炭素数1以上8以下、炭素数1以上6以下、炭素数1以上4以下等であってもよく、具体的には、メチル基、エチル基、n-プロピル基、イソプロピル基、n-ブチル基、t-ブチル基、シクロペンチル基、シクロヘキシル基、ボルニル基、イソボルニル基、ジシクロペンタニル基、アダマンチル基等があげられる。 The alkyl group having 1 or more and 12 or less carbon atoms may be linear, branched, cyclic or the like, and may be, for example, 1 or more and 8 or less carbon atoms, 1 or more and 6 or less carbon atoms, 1 or more and 4 or less carbon atoms, or the like. May be present, specifically, methyl group, ethyl group, n-propyl group, isopropyl group, n-butyl group, t-butyl group, cyclopentyl group, cyclohexyl group, bornyl group, isobornyl group, dicyclopentanyl. Examples include a group and an adamantyl group.
 前記炭素数1以上12以下のアルコキシ基としては、直鎖状、分岐状、環状等のいずれでもよく、例えば、炭素数1以上8以下、炭素数1以上6以下、炭素数1以上4以下等である。 The alkoxy group having 1 or more and 12 or less carbon atoms may be linear, branched, cyclic or the like, and may be, for example, 1 or more and 8 or less carbon atoms, 1 or more and 6 or less carbon atoms, 1 or more and 4 or less carbon atoms, or the like. Is.
 前記炭素数1以上12以下のアルキレンオキサイド基としては、炭素数1以上8以下、炭素数1以上6以下、炭素数1以上4以下等があげられる。 Examples of the alkylene oxide group having 1 or more and 12 or less carbon atoms include 1 or more and 8 or less carbon atoms, 1 or more and 6 or less carbon atoms, and 1 or more and 4 or less carbon atoms.
 前記複素環基としては例えば、シロール環、フラン環、チオフェン環、オキサゾール環、ピロール環、ピリジン環、ピリダジン環、ピリミジン環、ピラジン環、トリアジン環、オキサジアゾール環、トリアゾール環、イミダゾール環、ピラゾール環、チアゾール環、インドール環、ベンズイミダゾール環、ベンズチアゾール環、ベンズオキサゾール環、キノキサリン環、キナゾリン環、フタラジン環、チエノチオフェン環、カルバゾール環、アザカルバゾール環(カルバゾール環を構成する炭素原子の任意の一つ以上が窒素原子で置き換わったものを表す)、ジベンゾシロール環、ジベンゾフラン環、ジベンゾチオフェン環、ベンゾチオフェン環やジベンゾフラン環を構成する炭素原子の任意の一つ以上が窒素原子で置き換わった環、ベンゾジフラン環、ベンゾジチオフェン環、アクリジン環、ベンゾキノリン環、フェナジン環、フェナントリジン環、フェナントロリン環、サイクラジン環、キンドリン環、テペニジン環、キニンドリン環、トリフェノジチアジン環、トリフェノジオキサジン環、フェナントラジン環、アントラジン環、ペリミジン環、ナフトフラン環、ナフトチオフェン環、ナフトジフラン環、ナフトジチオフェン環、アントラフラン環、アントラジフラン環、アントラチオフェン環、アントラジチオフェン環、チアントレン環、フェノキサチイン環、ジベンゾカルバゾール環、インドロカルバゾール環、ジチエノベンゼン環、エポキシ環、アジリジン環、チイラン環、オキセタン環、アゼチジン環、チエタン環、テトラヒドロフラン環、ジオキソラン環、ピロリジン環、ピラゾリジン環、イミダゾリジン環、オキサゾリジン環、テトラヒドロチオフェン環、スルホラン環、チアゾリジン環、ε-カプロラクトン環、ε-カプロラクタム環、ピペリジン環、ヘキサヒドロピリダジン環、ヘキサヒドロピリミジン環、ピペラジン環、モルホリン環、テトラヒドロピラン環、1,3-ジオキサン環、1,4-ジオキサン環、トリオキサン環、テトラヒドロチオピラン環、チオモルホリン環、チオモルホリン-1,1-ジオキシド環、ピラノース環、ジアザビシクロ[2,2,2]-オクタン環、フェノキサジン環、フェノチアジン環、オキサントレン環、チオキサンテン環、フェノキサチイン環から導出される1価の基等があげられる。 Examples of the heterocyclic group include a silol ring, a furan ring, a thiophene ring, an oxazole ring, a pyrrole ring, a pyridine ring, a pyridazine ring, a pyrimidine ring, a pyrazine ring, a triazine ring, an oxadiazole ring, a triazole ring, an imidazole ring, and a pyrazole. Ring, thiazole ring, indole ring, benzimidazole ring, benzthiazole ring, benzoxazole ring, quinoxalin ring, quinazoline ring, phthalazine ring, thienothiophene ring, carbazole ring, azacarbazole ring (any of the carbon atoms constituting the carbazole ring) (Representing one or more replaced with a nitrogen atom), a ring in which any one or more of the carbon atoms constituting the dibenzosilol ring, dibenzofuran ring, dibenzothiophene ring, benzothiophene ring or dibenzofuran ring is replaced with a nitrogen atom, Benzodifuran ring, benzodithiophene ring, aclysine ring, benzoquinoline ring, phenazine ring, phenanthridine ring, phenanthroline ring, cyclazine ring, kindrin ring, tepenidine ring, quinindrin ring, triphenodithiadin ring, triphenodioxazine ring, fe. Nantradine ring, anthrazine ring, perimidine ring, naphthofuran ring, naphthothiophene ring, naphthodifuran ring, naphthodithiophene ring, anthrafran ring, anthradifuran ring, anthrathiophene ring, anthradithiophene ring, thianthone ring, phenoxatiin ring. , Dibenzocarbazole ring, indolocarbazole ring, dithienobenzene ring, epoxy ring, aziridine ring, thiirane ring, oxetane ring, azetidine ring, thietan ring, tetrahydrofuran ring, dioxolan ring, pyrrolidine ring, pyrazolidine ring, imidazolidine ring, oxazolidine Ring, tetrahydrothiophene ring, sulforane ring, thiazolidine ring, ε-caprolactone ring, ε-caprolactam ring, piperidine ring, hexahydropyridazine ring, hexahydropyrimidine ring, piperazin ring, morpholin ring, tetrahydropyran ring, 1,3-dioxane Ring, 1,4-dioxane ring, trioxane ring, tetrahydrothiopyran ring, thiomorpholin ring, thiomorpholin-1,1-dioxide ring, pyranose ring, diazabicyclo [2,2,2] -octane ring, phenoxazine ring, Examples thereof include a monovalent group derived from a phenothiazine ring, an oxanthrene ring, a thioxanthene ring, and a phenoxatiin ring.
 縮合環基としては、ナフタレン環、アズレン環、アントラセン環、フェナントレン環、ピレン環、クリセン環、ナフタセン環、トリフェニレン環、アセナフテン環、コロネン環、フルオレン環、フルオラントレン環、ペンタセン環、ペリレン環、ペンタフェン環、ピセン環、ピラントレン環等があげられる。 As the fused ring group, naphthalene ring, azulene ring, anthracene ring, phenanthrene ring, pyrene ring, chrysene ring, naphthane ring, triphenylene ring, acenaphthene ring, coronene ring, fluorene ring, fluorene ring, pentacene ring, perylene ring, etc. Examples thereof include a pentaphene ring, a picene ring, and a pyrenethrene ring.
 置換基としては例えば、炭素数1以上12以下のアルキル基、前記炭素数1以上12以下のアルキルエーテル基、炭素数1以上12以下のアルコキシ基、炭素数1以上12以下のアルキレンオキサイド基、芳香族基、ヒドロキシ基、カルボキシル基、フッ素、塩素、臭素、ヨウ素等のハロゲン、アルデヒド基、アミノ基、炭素数3以上8以下のシクロアルキル基等があげられ、ヒドロキシ基、カルボキシル基が好ましい。 Examples of the substituent include an alkyl group having 1 to 12 carbon atoms, the alkyl ether group having 1 to 12 carbon atoms, an alkoxy group having 1 to 12 carbon atoms, an alkylene oxide group having 1 to 12 carbon atoms, and an aromatic group. Examples thereof include a group group, a hydroxy group, a carboxyl group, a halogen such as fluorine, chlorine, bromine and iodine, an aldehyde group, an amino group, a cycloalkyl group having 3 or more carbon atoms and 8 or less carbon atoms, and a hydroxy group and a carboxyl group are preferable.
 Rは、置換基を有していてもよいアルキル基と、シリコーン基の少なくとも一方を含むことが好ましく、シリコーン基を含むことが好ましい。シリコーン基は自由エネルギーが低いので、Rがシリコーン基を含むと、粘着剤組成物中において導電性高分子が表面近傍に集まりやすくなり、表面抵抗が低減されやすくなる。 R 1 preferably contains at least one of an alkyl group which may have a substituent and a silicone group, and preferably contains a silicone group. Since the silicone group has a low free energy, when R 1 contains a silicone group, the conductive polymer tends to gather near the surface in the pressure-sensitive adhesive composition, and the surface resistance tends to be reduced.
 アルキル基としては、炭素数1以上12以下のアルキル基が挙げられる。このアルキル基としては、上述したものが挙げられる。 Examples of the alkyl group include an alkyl group having 1 or more carbon atoms and 12 or less carbon atoms. Examples of this alkyl group include those described above.
 シリコーン基は、結合の主骨格がケイ素と酸素が交互に結びついたシロキサン結合に有機基が結合した基である。有機基は、芳香族基や炭素数1以上12以下のアルキル基であることが好ましく、メチル基が好ましい。 A silicone group is a group in which an organic group is bonded to a siloxane bond in which silicon and oxygen are alternately bonded as the main skeleton of the bond. The organic group is preferably an aromatic group or an alkyl group having 1 or more and 12 or less carbon atoms, and a methyl group is preferable.
 Rは、エステル結合を有することが好ましい。Rのエステル結合としては、カルボン酸エステル結合、リン酸エステル結合、スルホン酸エステル結合などが挙げられ、カルボン酸エステル結合が好ましい。Rがエステル化されていない酸基(カルボキシル基等)を有する場合、導電性高分子の極性が高くなりすぎて、粘着剤組成物中での導電性高分子の凝集性が低くなる。酸基をエステル化すると極性が低くなり、粘着剤組成物中での分散性が向上する。 R 1 preferably has an ester bond. Examples of the ester bond of R 1 include a carboxylic acid ester bond, a phosphoric acid ester bond, a sulfonic acid ester bond, and the like, and a carboxylic acid ester bond is preferable. When R 1 has an acid group (carboxyl group or the like) that has not been esterified, the polarity of the conductive polymer becomes too high, and the cohesiveness of the conductive polymer in the pressure-sensitive adhesive composition becomes low. Esterification of the acid group lowers the polarity and improves dispersibility in the pressure-sensitive adhesive composition.
 Rは、好ましくは、化学式(3)で表される構造を有する。
Figure JPOXMLDOC01-appb-C000005
(化学式(3)中、*は、結合部であり、Rは、直接結合又は有機基であり、Rは、有機基とシリコーン基の少なくとも一方を含む。)
R 1 preferably has a structure represented by the chemical formula (3).
Figure JPOXMLDOC01-appb-C000005
(In the chemical formula (3), * is a bond, R 4 is a direct bond or an organic group, and R 5 contains at least one of an organic group and a silicone group.)
 R、R又はRの有機基として、置換基を有していてもよい、炭素数1以上12以下のアルキル基、炭素数1以上12以下のアルキルエーテル基、炭素数1以上12以下のアルコキシ基、炭素数1以上12以下のアルキレンオキサイド基、芳香族基、複素環基等が挙げられる。Rは、β位に水酸基を有することが好ましい。 As the organic group of R 3 , R 4 or R 5 , it may have a substituent, an alkyl group having 1 or more and 12 or less carbon atoms, an alkyl ether group having 1 or more and 12 or less carbon atoms, and 1 or more and 12 carbon atoms or less. Examples thereof include an alkoxy group of the above, an alkylene oxide group having 1 or more and 12 or less carbon atoms, an aromatic group, a heterocyclic group and the like. R 5 preferably has a hydroxyl group at the β-position.
 ここでのアルキル基、アルコキシ基、アルキレンオキサイド基、複素環基の説明は、上述したものと同じである。 The description of the alkyl group, alkoxy group, alkylene oxide group and heterocyclic group here is the same as described above.
 前記炭素数1以上12以下のアルキルエーテル基は、直鎖状、分岐状、環状等のいずれでもよく、例えば、炭素数1以上8以下、炭素数1以上6以下、炭素数1以上4以下等である。 The alkyl ether group having 1 or more and 12 or less carbon atoms may be linear, branched, cyclic or the like, and may be, for example, 1 or more and 8 or less carbon atoms, 1 or more and 6 or less carbon atoms, 1 or more and 4 or less carbon atoms, or the like. Is.
 前記芳香族基としては、フェニル基、ベンジル基等の他にも各種の縮合環基をあげることができる。縮合環基としては、ナフタレン環、アズレン環、アントラセン環、フェナントレン環、ピレン環、クリセン環、ナフタセン環、トリフェニレン環、アセナフテン環、コロネン環、フルオレン環、フルオラントレン環、ペンタセン環、ペリレン環、ペンタフェン環、ピセン環、ピラントレン環等があげられる。 Examples of the aromatic group include various condensed ring groups in addition to the phenyl group and the benzyl group. As the fused ring group, naphthalene ring, azulene ring, anthracene ring, phenanthrene ring, pyrene ring, chrysene ring, naphthane ring, triphenylene ring, acenaphthene ring, coronene ring, fluorene ring, fluorene ring, pentacene ring, perylene ring, etc. Examples thereof include a pentaphene ring, a picene ring, and a pyrenethrene ring.
 ドーパントとしては、π共役系高分子に導電性を付与可能で、かつモノアニオンとなる任意の化合物が挙げられる。ドーパントとしては、ビニルスルホン酸、メタンスルホン酸、p-トルエンスルホン酸、ドデシルスルホン酸、ドデシルベンゼンスルホン酸、ジ(2-エチルヘキシル)スルホコハク酸等のスルホン酸、テトラフルオロホウ酸、トリフルオロ酢酸、ヘキサフルオロリン酸、トリフルオロメタンスルホンイミド、ナフタレンスルホン酸等の一価酸、又はそのアルカリ金属塩等が挙げられる。モノアニオンとなるドーパントを用いると導電性高分子の導電率が向上しやすい。ドーパントの構造は粘着剤組成物中の分散性に影響を及ぼすが、これらの中で、導電性と分散性のバランスの観点からドデシルベンゼンスルホン酸が好ましい。 Examples of the dopant include any compound that can impart conductivity to the π-conjugated polymer and become a monoanion. Dopants include vinyl sulfonic acid, methane sulfonic acid, p-toluene sulfonic acid, dodecyl sulfonic acid, dodecylbenzene sulfonic acid, sulfonic acid such as di (2-ethylhexyl) sulfosuccinic acid, tetrafluoroboric acid, trifluoroacetic acid, hexa. Examples thereof include monovalent acids such as fluorophosphate, trifluoromethanesulfonic acid and naphthalenesulfonic acid, and alkali metal salts thereof. When a dopant that becomes a monoanion is used, the conductivity of the conductive polymer is likely to be improved. The structure of the dopant affects the dispersibility in the pressure-sensitive adhesive composition, and among these, dodecylbenzene sulfonic acid is preferable from the viewpoint of the balance between conductivity and dispersibility.
 導電性高分子が有する構成単位(1)及び(2)の数としては特に制限されないが、好ましくは2以上300以下である。具体的には例えば、2、5、10、20、30、40、50、60、70、80、90、100、200又は300であり、ここで例示した数値の何れか2つの間の範囲内であってもよい。 The number of the structural units (1) and (2) contained in the conductive polymer is not particularly limited, but is preferably 2 or more and 300 or less. Specifically, for example, it is 2, 5, 10, 20, 30, 40, 50, 60, 70, 80, 90, 100, 200 or 300, and is within the range between any two of the numerical values exemplified here. May be.
 導電性高分子中に含まれる構成単位(1)及び(2)の含有割合は、化学式(4)で表されるチオフェン誘導体とアルデヒドの添加量の比によって調整することができる。チオフェン誘導体とアルデヒドの添加量のモル比(チオフェン誘導体/アルデヒド)は、例えば1/1、2/1、3/1、4/1、5/1等であり、これらの数値のいずれか2つの間の範囲内であってもよいが、可溶性と導電性のバランスの観点から1/1~4/1の比が好ましく、1/1~2/1の比がより好ましい。 The content ratios of the structural units (1) and (2) contained in the conductive polymer can be adjusted by the ratio of the addition amount of the thiophene derivative represented by the chemical formula (4) to the aldehyde. The molar ratio of the amount of the thiophene derivative to the aldehyde added (thiophene derivative / aldehyde) is, for example, 1/1, 2/1, 3/1, 4/1, 5/1, etc., and any two of these values are used. Although it may be within the range between them, the ratio of 1/1 to 4/1 is preferable, and the ratio of 1/1 to 2/1 is more preferable from the viewpoint of the balance between solubility and conductivity.
Figure JPOXMLDOC01-appb-C000006
Figure JPOXMLDOC01-appb-C000006
 化学式(4)中、R及びRは、それぞれ、化学式(1)及び(2)のR及びRと同様に定義される。 In the chemical formula (4), R 2 and R 3 are defined in the same manner as R 2 and R 3 in the chemical formulas (1) and (2), respectively.
 導電性高分子を合成する方法としては、特に限定されないが、例えば、チオフェン誘導体とアルデヒドに、ドーパントと酸化剤を加え不活性ガス雰囲気下の溶媒中で、加熱撹拌して重合することで得ることができる。また、酸化剤の分解促進剤を加えても良い。 The method for synthesizing the conductive polymer is not particularly limited, but for example, it can be obtained by adding a dopant and an oxidizing agent to a thiophene derivative and an aldehyde, heating and stirring in a solvent under an inert gas atmosphere, and polymerizing the polymer. Can be done. Further, a decomposition accelerator for an oxidizing agent may be added.
 アルデヒドとしては、酸基を有するものを用いてもよく、エステル結合を有するものを用いてもよい。酸基を有するアルデヒドとしては、フタルアルデヒド酸などが挙げられる。エステル結合を有するアルデヒドとしては、酸基を有するアルデヒドの酸基をエステル化したものが挙げられる。エステル化は、例えば、酸基と、エポキシ基含有化合物(例:エポキシアルキル、片末端エポキシシリコーン)のエポキシ基を反応させることによって行うことができる。酸基を有するアルデヒドを用いた場合、分子間の相互作用が強くなるため、導電性が高くなりやすい。 As the aldehyde, an aldehyde having an acid group may be used, or an aldehyde having an ester bond may be used. Examples of the aldehyde having an acid group include phthalaldehyde acid. Examples of the aldehyde having an ester bond include those obtained by esterifying the acid group of an aldehyde having an acid group. Esterification can be carried out, for example, by reacting an acid group with an epoxy group of an epoxy group-containing compound (eg, epoxyalkyl, one-ended epoxy silicone). When an aldehyde having an acid group is used, the interaction between molecules becomes strong, so that the conductivity tends to be high.
 チオフェン誘導体に対するドーパントのモル比(ドーパント/チオフェン誘導体)は、例えば0.01~0.5であり、好ましくは0.1~0.5である。このモル比は、具体的に例えば、0.01、0.05、0.1、0.2、0.3、0.4、0.5であり、ここで例示した数値の何れか2つの間の範囲内であってもよい。このモル比が小さすぎると導電性高分子の導電性が低くなりすぎる場合がある。 The molar ratio of the dopant to the thiophene derivative (dopant / thiophene derivative) is, for example, 0.01 to 0.5, preferably 0.1 to 0.5. Specifically, the molar ratio is, for example, 0.01, 0.05, 0.1, 0.2, 0.3, 0.4, 0.5, and any two of the numerical values exemplified here are used. It may be within the range between. If this molar ratio is too small, the conductivity of the conductive polymer may be too low.
 酸化剤としては、特に限定されないが、重合反応が進行する酸化剤であればよく、ペルオキソ二硫酸アンモニウム、ペルオキソ二硫酸カリウム、ペルオキソ二硫酸ナトリウム、塩化鉄(III)、硫酸鉄(III)、水酸化鉄(III)、テトラフルオロホウ酸鉄(III)、ヘキサフルオロリン酸鉄(III)、硫酸銅(II)、塩化銅(II)、テトラフルオロホウ酸銅(II)、ヘキサフルオロリン酸銅(II)およびオキソ二硫酸アンモニウム、過酸化ベンゾイル、過酸化ラウロイルなどの有機過酸化物等があげられる。 The oxidizing agent is not particularly limited as long as it is an oxidizing agent in which the polymerization reaction proceeds, and it may be ammonium peroxodisulfate, potassium peroxodisulfate, sodium peroxodisulfate, iron (III) chloride, iron (III) sulfate, or hydroxide. Iron (III), Iron Tetrafluoroborate (III), Iron Hexafluorophosphate (III), Copper Sulfate (II), Copper Chloride (II), Copper Tetrafluoroborate (II), Copper Hexafluorophosphate (II) II) and organic peroxides such as ammonium oxodisulfate, benzoyl peroxide and lauroyl peroxide can be mentioned.
 溶媒としては、特に限定されないが、ヘテロ環化合物とアルデヒド誘導体の反応が進行する溶媒であればよく、γ-ブチロラクトン、プロピレンカーボネート、エチレンカーボネート、アセトニトリル、tert-ブチルメチルエーテル、酢酸エチル、ベンゼン、アニソール、ヘプタン、水、メタノール、エタノール、イソプロピルアルコール、ブタノール等のアルコール系溶媒、アセトン、メチルエチルケトン、メチルイソブチルケトン、シクロペンタノン等のケトン系溶媒、メチルセロソルブ、エチルセロソルブ、プロピレングリコールメチルエーテル、プロピレングリコールエチルエーテル等のグリコール系溶媒、乳酸メチル、乳酸エチル等の乳酸系溶媒等があげられる。酸化剤の効率から、非プロトン性溶媒であることが好ましい。 The solvent is not particularly limited as long as it is a solvent in which the reaction between the heterocyclic compound and the aldehyde derivative proceeds, and it may be γ-butyrolactone, propylene carbonate, ethylene carbonate, acetonitrile, tert-butylmethyl ether, ethyl acetate, benzene, anisole. , Heptane, water, methanol, ethanol, isopropyl alcohol, butanol and other alcohol solvents, acetone, methyl ethyl ketone, methyl isobutyl ketone, cyclopentanone and other ketone solvents, methyl cellosolve, ethyl cellosolve, propylene glycol methyl ether, propylene glycol ethyl Examples thereof include glycol-based solvents such as ether, and lactic acid-based solvents such as methyl lactate and ethyl lactate. An aprotic solvent is preferable because of the efficiency of the oxidizing agent.
1-4.溶媒
 本発明の粘着剤組成物は、溶媒を含んでもよい。溶媒は、導電性高分子を溶解又は分散可能なものであれば特に限定されず、有機溶媒を含むことが好ましい。有機溶媒としては、例えば、メタノール、エタノール、イソプロピルアルコール、ブタノール等のアルコール系溶媒、アセトン、メチルエチルケトン、メチルイソブチルケトン、シクロペンタノン等のケトン系溶媒、メチルセロソルブ、エチルセロソルブ、プロピレングリコールメチルエーテル、プロピレングリコールエチルエーテル等のグリコール系溶媒、乳酸メチル、乳酸エチル等の乳酸系溶媒、トルエン、アニソール、酢酸エチル、プロピレンカーボネート、γ-ブチロラクトン、トルエン、イソプロピルアルコール、エチレングリコール、ジメチルスルホキシド、メタノール、ベンジルアルコール等があげられるが、プロピレンカーボネート、γ-ブチロラクトン、メチルエチルケトン、トルエン、アニソール、イソプロピルアルコール、エチレングリコール、ジメチルスルホキシド、メタノール、ベンジルアルコール等が特に好ましい。有機溶媒は、複数の溶媒を組み合わせて用いてもよく、導電性高分子の合成に用いる溶媒と同じであっても異なっていてもよい。
1-4. Solvent The pressure-sensitive adhesive composition of the present invention may contain a solvent. The solvent is not particularly limited as long as it can dissolve or disperse the conductive polymer, and preferably contains an organic solvent. Examples of the organic solvent include alcohol solvents such as methanol, ethanol, isopropyl alcohol and butanol, ketone solvents such as acetone, methyl ethyl ketone, methyl isobutyl ketone and cyclopentanone, methyl cellosolve, ethyl cellosolve, propylene glycol methyl ether and propylene. Glycol-based solvents such as glycol ethyl ether, lactic acid-based solvents such as methyl lactate and ethyl lactate, toluene, anisol, ethyl acetate, propylene carbonate, γ-butyrolactone, toluene, isopropyl alcohol, ethylene glycol, dimethyl sulfoxide, methanol, benzyl alcohol and the like. However, propylene carbonate, γ-butyrolactone, methyl ethyl ketone, toluene, anisole, isopropyl alcohol, ethylene glycol, dimethyl sulfoxide, methanol, benzyl alcohol and the like are particularly preferable. The organic solvent may be used in combination of a plurality of solvents, and may be the same as or different from the solvent used for synthesizing the conductive polymer.
 導電性高分子を水に分散安定させるには、ドープに寄与しない余剰スルホン酸が必要であるが、導電性高分子組成物が有機溶媒を含む場合、余剰スルホン酸が少ない量でも、導電性高分子を有機溶媒中に安定的に溶解又は分散させることが可能である。 In order to disperse and stabilize the conductive polymer in water, excess sulfonic acid that does not contribute to doping is required. However, when the conductive polymer composition contains an organic solvent, the conductivity is high even if the amount of excess sulfonic acid is small. It is possible to stably dissolve or disperse the molecule in an organic solvent.
 導電性高分子組成物のうち、有機溶媒を除いた不揮発分は、特に制限されないが、例えば0.1質量%以上20.0質量%以下である。具体的には、0.1、0.5、1.0、1.5、2.0、2.5、3.0、5.0、10.0、15.0、20.0質量%であり、ここで例示した数値の何れか2つの間の範囲内であってもよい。 The non-volatile content of the conductive polymer composition excluding the organic solvent is not particularly limited, but is, for example, 0.1% by mass or more and 20.0% by mass or less. Specifically, 0.1, 0.5, 1.0, 1.5, 2.0, 2.5, 3.0, 5.0, 10.0, 15.0, 20.0 mass%. It may be within the range between any two of the numerical values exemplified here.
 導電性高分子組成物の溶媒は、上記有機溶媒以外に水を含んでも良いが、基材密着性の観点から含水率は溶媒に対して50%以下であることが好ましく、10%以下がより好ましい。 The solvent of the conductive polymer composition may contain water in addition to the above organic solvent, but the water content is preferably 50% or less with respect to the solvent, more preferably 10% or less, from the viewpoint of substrate adhesion. preferable.
1-5.その他の成分
 本発明の粘着剤組成物は、シランカップリング剤、シリコーンレジン、白金触媒、光重合開始剤等の成分を含んでもよい。また、本発明の粘着剤組成物は、溶媒、粘着付与樹脂、増感剤、充填剤、難燃剤、フィラー、オルガノポリシロキサン化合物、イオン性化合物、可塑剤、硬化補助触媒、分散剤、顔料/染料、粘度調整剤、滑剤、沈降防止剤、レオロジーコントロール剤、紫外線吸収剤、耐光性付与剤、酸化防止剤、撥水剤、消泡剤などを適宜配合してもよい。
1-5. Other Ingredients The pressure-sensitive adhesive composition of the present invention may contain components such as a silane coupling agent, a silicone resin, a platinum catalyst, and a photopolymerization initiator. Further, the pressure-sensitive adhesive composition of the present invention comprises a solvent, a tackifier resin, a sensitizer, a filler, a flame retardant, a filler, an organopolysiloxane compound, an ionic compound, a plasticizer, a curing auxiliary catalyst, a dispersant, and a pigment /. A dye, a viscosity modifier, a lubricant, a settling inhibitor, a rheology control agent, an ultraviolet absorber, a light resistance imparting agent, an antioxidant, a water repellent agent, an antifoaming agent and the like may be appropriately blended.
〔シランカップリング剤〕
 シランカップリング剤は、各種被着体との間で化学的結合などの結合を形成し、基材と被着体との接着性を高める。特にガラス基板との接着に有効である。
〔Silane coupling agent〕
The silane coupling agent forms a bond such as a chemical bond with various adherends, and enhances the adhesiveness between the substrate and the adherend. It is especially effective for adhesion to glass substrates.
 前記シランカップリング剤としては、ビニルトリメトキシシラン,ビニルトリエトキシシラン及びメタクリロキシプロピルトリメトキシシラン等の重合性不飽和基含有ケイ素化合物;3-グリシドキシプロピルトリメトキシシラン,3-グリシドキシプロピルメチルジメトキシシラン及び2-(3,4-エポキシシクロヘキシル)エチルトリメトキシシラン等のエポキシ構造を有するケイ素化合物;3-アミノプロピルトリメトキシシラン,N-(2-アミノエチル)3-アミノプロピルトリメトキシシラン及びN-(2-アミノエチル)-3-アミノプロピルメチルジメトキシシラン等のアミノ基含有ケイ素化合物;並びに3-クロロプロピルトリメトキシシラン;オリゴマー型シランカップリング剤等が挙げられる。 Examples of the silane coupling agent include polymerizable unsaturated group-containing silicon compounds such as vinyltrimethoxysilane, vinyltriethoxysilane and metharoxypropyltrimethoxysilane; 3-glycidoxypropyltrimethoxysilane and 3-glycidoxy. Silicon compounds having an epoxy structure such as propylmethyldimethoxysilane and 2- (3,4-epoxycyclohexyl) ethyltrimethoxysilane; 3-aminopropyltrimethoxysilane, N- (2-aminoethyl) 3-aminopropyltrimethoxy Examples thereof include amino group-containing silicon compounds such as silane and N- (2-aminoethyl) -3-aminopropylmethyldimethoxysilane; and 3-chloropropyltrimethoxysilane; oligomer-type silane coupling agents.
 シランカップリング剤の配合量は、粘着剤100質量部に対して、通常0.01~0.3質量部であり、好ましくは0.05~0.25質量部である。またシランカップリング剤は、1種単独で使用しても2種以上を組み合わせて使用してもよい。 The blending amount of the silane coupling agent is usually 0.01 to 0.3 parts by mass, preferably 0.05 to 0.25 parts by mass with respect to 100 parts by mass of the pressure-sensitive adhesive. Further, the silane coupling agent may be used alone or in combination of two or more.
1-6.偏光フィルム3
 偏光フィルム3は、偏光子3aを備え、偏光子保護膜3bを備えてもよい。偏光子3aは、粘着剤層2と偏光子保護膜3bの間に配置される。
1-6. Polarizing film 3
The polarizing film 3 may include a polarizing element 3a and may include a polarizing element protective film 3b. The polarizing element 3a is arranged between the pressure-sensitive adhesive layer 2 and the polarizing element protective film 3b.
 偏光子3aとしては、例えば、ポリビニルアルコール系樹脂からなるフィルムに偏光成分を含有させて、延伸することにより得られる延伸フィルムが挙げられる。ポリビニルアルコール系樹脂としては、例えば、ポリビニルアルコール、ポリビニルホルマール、ポリビニルアセタール、エチレン-酢酸ビニル共重合体の鹸化物が挙げられる。偏光成分としては、例えば、ヨウ素または二色性染料が挙げられる。 Examples of the polarizing element 3a include a stretched film obtained by incorporating a polarizing component into a film made of a polyvinyl alcohol-based resin and stretching the film. Examples of the polyvinyl alcohol-based resin include saponified products of polyvinyl alcohol, polyvinylformal, polyvinyl acetal, and ethylene-vinyl acetate copolymer. Examples of the polarizing component include iodine and dichroic dyes.
 偏光子保護膜3bとしては、例えば、熱可塑性樹脂からなるフィルムが挙げられる。熱可塑性樹脂としては、例えば、トリアセチルセルロース等のセルロース樹脂、ポリエステル樹脂、ポリエーテルスルホン樹脂、ポリスルホン樹脂、ポリカーボネート樹脂、ポリアミド樹脂、ポリイミド樹脂、ポリオレフィン樹脂、(メタ)アクリル樹脂、環状ポリオレフィン樹脂(ノルボルネン系樹脂)、ポリアリレート樹脂、ポリスチレン樹脂、ポリビニルアルコール樹脂、およびこれらの樹脂から選択される2種以上の混合物が挙げられる。 Examples of the polarizing element protective film 3b include a film made of a thermoplastic resin. Examples of the thermoplastic resin include cellulose resins such as triacetyl cellulose, polyester resins, polyether sulfone resins, polysulfone resins, polycarbonate resins, polyamide resins, polyimide resins, polyolefin resins, (meth) acrylic resins, and cyclic polyolefin resins (norbornen). (Based resin), polyarylate resin, polystyrene resin, polyvinyl alcohol resin, and a mixture of two or more selected from these resins can be mentioned.
 偏光フィルム3の厚さは、通常10~200μm、好ましくは30~100μmである。本発明では、偏光子3a上に形成される偏光子保護膜3bを省略することができるため、偏光フィルム3を薄型化することができる。 The thickness of the polarizing film 3 is usually 10 to 200 μm, preferably 30 to 100 μm. In the present invention, the polarizing element protective film 3b formed on the polarizing element 3a can be omitted, so that the polarizing film 3 can be made thinner.
 ところで、偏光フィルム3は、高温環境下で収縮しやすい性質を有する場合がある。この場合、偏光フィルム3の収縮に伴って粘着剤層2が収縮しやすいので、上述したように、粘着剤層2の80℃における貯蔵弾性率を所定の範囲内にすることの技術的意義が特に顕著である。 By the way, the polarizing film 3 may have a property of easily shrinking in a high temperature environment. In this case, the pressure-sensitive adhesive layer 2 tends to shrink as the polarizing film 3 shrinks. Therefore, as described above, it is technically significant to keep the storage elastic modulus of the pressure-sensitive adhesive layer 2 at 80 ° C. within a predetermined range. This is especially noticeable.
 ここで、偏光フィルム3の単独収縮率P(%)=((Xp-Yp)/Xp)×100と定義する。Xpは、偏光フィルム3を単独で23℃50%RH環境下に放置した後の状態での偏光フィルム3の延伸軸方向の寸法であり、Ypは、偏光フィルム3を単独で80℃環境下に72時間放置後、23℃50%RHの環境下で10分間放冷した後の、偏光フィルム3の延伸軸方向の寸法である。 Here, the single shrinkage rate P (%) = ((Xp-Yp) / Xp) × 100 of the polarizing film 3 is defined. Xp is the dimension in the stretch axis direction of the polarizing film 3 after the polarizing film 3 is left alone in the environment of 23 ° C. and 50% RH, and Yp is the dimension of the polarizing film 3 alone in the environment of 80 ° C. It is the dimension in the drawing axis direction of the polarizing film 3 after leaving for 72 hours and letting it cool for 10 minutes in the environment of 23 degreeC 50% RH.
 単独収縮率Pは、例えば0.01~10%であり、1~8%が好ましい。単独収縮率Pは、具体的には例えば、0.01、0.1、0.5、1、2、3、4、5、6、7、8、9、10%であり、ここで例示した数値の何れか2つの間の範囲内であってもよい。 The single shrinkage rate P is, for example, 0.01 to 10%, preferably 1 to 8%. Specifically, the single shrinkage rate P is, for example, 0.01, 0.1, 0.5, 1, 2, 3, 4, 5, 6, 7, 8, 9, 10%, and is exemplified here. It may be within the range between any two of the given numerical values.
1-7.高温保持力
 粘着性偏光フィルム1は、高温での保持力が優れていることが好ましい。具体的には、粘着性偏光フィルム1の粘着面1aを10mm×10mmの面積でガラス板(好ましくは無アルカリガラス板)に貼付し、80℃環境下でせん断方向に800gの荷重を加えた場合に、荷重付加開始から1時間後のガラス板に対する粘着剤層のズレ量が2.0mm以下であることが好ましい。この場合、図2に示すように、粘着性偏光フィルム1を画像表示素子6に貼り付けたときに、粘着性偏光フィルム1が画像表示素子6からずれることが抑制される。このズレは、例えば0~2.0mmであり、具体的には例えば、0、0.5、1.0、1.5、2.0mmであり、ここで例示した数値の何れか2つの間の範囲内であってもよい。
1-7. High-temperature holding power The adhesive polarizing film 1 preferably has excellent holding power at high temperatures. Specifically, when the adhesive surface 1a of the adhesive polarizing film 1 is attached to a glass plate (preferably a non-alkali glass plate) with an area of 10 mm × 10 mm, and a load of 800 g is applied in the shearing direction in an environment of 80 ° C. In addition, it is preferable that the amount of displacement of the adhesive layer with respect to the glass plate 1 hour after the start of load application is 2.0 mm or less. In this case, as shown in FIG. 2, when the adhesive polarizing film 1 is attached to the image display element 6, the adhesive polarizing film 1 is prevented from being displaced from the image display element 6. This deviation is, for example, 0 to 2.0 mm, specifically, for example, 0, 0.5, 1.0, 1.5, 2.0 mm, and is between any two of the numerical values exemplified here. It may be within the range of.
2.画像表示装置用積層体
 図2に示すように、本発明の一実施形態の画像表示装置用積層体5は、粘着性偏光フィルム1が画像表示素子6に貼り付けられて構成される。
2. 2. As shown in FIG. 2, the image display device laminate 5 according to the embodiment of the present invention is configured by attaching the adhesive polarizing film 1 to the image display element 6.
 粘着性偏光フィルム1は、剥離フィルム4を剥がして粘着面1aを露出させた状態で、粘着面1aが画像表示素子6に接触するように、画像表示素子6に貼着することができる。 The adhesive polarizing film 1 can be attached to the image display element 6 so that the adhesive surface 1a comes into contact with the image display element 6 in a state where the release film 4 is peeled off to expose the adhesive surface 1a.
 画像表示素子6は、画像を表示するための素子である。画像表示素子6は、粘着性偏光フィルム1を貼り付ける面にガラス板を有する素子であることが好ましい。ガラス板は、無アルカリガラス板であることが好ましい。このような画像表示素子6としては、液晶セルが挙げられる。 The image display element 6 is an element for displaying an image. The image display element 6 is preferably an element having a glass plate on the surface to which the adhesive polarizing film 1 is attached. The glass plate is preferably a non-alkali glass plate. Examples of such an image display element 6 include a liquid crystal cell.
 液晶セルは、好ましくは、インセルまたはオンセル方式のタッチパネル式入出力装置を構成する液晶セルである。インセルとは、タッチパネル機能を液晶の画素の中に組み込む方式である。オンセルとは、タッチパネル機能をカラーフィルタ基板と偏光フィルムの間に作り込む方式である。 The liquid crystal cell is preferably a liquid crystal cell constituting an in-cell or on-cell type touch panel input / output device. Incel is a method of incorporating a touch panel function into the pixels of a liquid crystal display. On-cell is a method in which a touch panel function is built in between a color filter substrate and a polarizing film.
 このような方式は、カバーガラス付近で発生した静電気により、タッチセンサーが正常に働かない、タッチ不良がしばしば生じる。そこで、本発明の導電性高分子を粘着剤組成物に配合した、表面抵抗率が低い粘着剤組成物を用いることにより、カバーガラス付近に発生した静電気を、粘着剤層が中和、分散することができ、タッチ不良を抑制することが可能である。 In such a method, the touch sensor does not work normally due to static electricity generated near the cover glass, and touch failure often occurs. Therefore, by using a pressure-sensitive adhesive composition having a low surface resistivity in which the conductive polymer of the present invention is blended in the pressure-sensitive adhesive composition, the pressure-sensitive adhesive layer neutralizes and disperses static electricity generated in the vicinity of the cover glass. It is possible to suppress touch defects.
 ガラス板の厚さは、例えば0.3~3mmであり、具体的には例えば、0.3、0.5、1.0、1.5、2.0、2.5、3.0mmであり、ここで例示した数値の何れか2つの間の範囲内であってもよい。 The thickness of the glass plate is, for example, 0.3 to 3 mm, specifically, for example, 0.3, 0.5, 1.0, 1.5, 2.0, 2.5, 3.0 mm. Yes, it may be within the range between any two of the numerical values exemplified here.
 画像表示素子6の厚さは、例えば、0.5~6mmであり、具体的には例えば、0.5、1.0、1.5、2.0、2.5、3.0、3.5、4.0、4.5、5.0、5.5、6.0mmであり、ここで例示した数値の何れか2つの間の範囲内であってもよい。 The thickness of the image display element 6 is, for example, 0.5 to 6 mm, specifically, for example, 0.5, 1.0, 1.5, 2.0, 2.5, 3.0, 3 It is 5.5, 4.0, 4.5, 5.0, 5.5, 6.0 mm, and may be within the range between any two of the numerical values exemplified here.
 ここで、積層体5中の偏光フィルム3の積層体収縮率S(%)=((Xs-Ys)/Xs)×100と定義する。Xsは、積層体5を23℃50%RH環境下に放置した後の状態での積層体5中の偏光フィルム3の延伸軸方向の寸法であり、Ysは、積層体5を80℃環境下に72時間放置後、23℃50%RHの環境下で10分間放冷した後の、積層体5中の偏光フィルム3の延伸軸方向の寸法である。 Here, the shrinkage rate S (%) of the polarizing film 3 in the laminate 5 is defined as ((Xs—Ys) / Xs) × 100. Xs is the dimension of the polarizing film 3 in the laminated body 5 in the state after the laminated body 5 is left in the environment of 23 ° C. and 50% RH, and Ys is the dimension of the laminated body 5 in the environment of 80 ° C. It is the dimension in the stretch axis direction of the polarizing film 3 in the laminated body 5 after leaving it for 72 hours, and then letting it cool for 10 minutes in the environment of 23 degreeC 50% RH.
 Sは、3未満である好ましい。つまり、以下の式(1)が充足されることが好ましい。
 ((Xs-Ys)/Xs)×100<3・・・(1)
S is preferably less than 3. That is, it is preferable that the following equation (1) is satisfied.
((Xs-Ys) / Xs) x 100 <3 ... (1)
 この場合、収縮率Sが大きくないので、偏光フィルム3の収縮に起因する粘着剤層2の表面抵抗率上昇が抑制される。 In this case, since the shrinkage rate S is not large, the increase in the surface resistivity of the pressure-sensitive adhesive layer 2 due to the shrinkage of the polarizing film 3 is suppressed.
 積層体収縮率Sは、例えば、0.01~2.99であり、0.01~2.9が好ましく、0.01~2.0がさらに好ましい。収縮率Sは、具体的には例えば、0.01、0.1、0.2、0.3、0.4、0.5、0.6、0.7、0.8、0.9、1.0、1.1、1.2、1.3、1.4、1.5、1.6、1.7、1.8、1.9、2.0、2.1、2.2、2.3、2.4、2.5、2.6、2.7、2.8、2.9、2.99であり、ここで例示した数値の何れか2つの間の範囲内であってもよい。 The laminate shrinkage rate S is, for example, 0.01 to 2.99, preferably 0.01 to 2.9, and even more preferably 0.01 to 2.0. Specifically, the shrinkage rate S is, for example, 0.01, 0.1, 0.2, 0.3, 0.4, 0.5, 0.6, 0.7, 0.8, 0.9. , 1.0, 1.1, 1.2, 1.3, 1.4, 1.5, 1.6, 1.7, 1.8, 1.9, 2.0, 2.1, 2 .2, 2.3, 2.4, 2.5, 2.6, 2.7, 2.8, 2.9, 2.99, and the range between any two of the numerical values exemplified here. It may be inside.
 積層体5を23℃50%RH環境下に放置した後に粘着性偏光フィルム1を積層体5から剥がして露出させた粘着剤層2の表面抵抗率をXrとし、積層体5を80℃環境下に72時間放置後、23℃50%RHの環境下で10分間放冷した後に粘着性偏光フィルム1を積層体5から剥がして露出させた粘着剤層2の表面抵抗率をYrとすると、Xr及びYrが何れも1.0×1012未満であることが好ましい。この場合、常温・高温の何れにおいても、表面抵抗率が十分に低い粘着剤層2を有する積層体5が得られる。 The surface resistance of the adhesive layer 2 exposed by peeling the adhesive polarizing film 1 from the laminate 5 after leaving the laminate 5 in a 23 ° C. and 50% RH environment is set to Xr, and the laminate 5 is placed in an 80 ° C. environment. Let Yr be the surface resistance of the adhesive layer 2 exposed by peeling the adhesive polarizing film 1 from the laminate 5 after allowing it to cool for 10 minutes in an environment of 23 ° C. and 50% RH. And Yr are both preferably less than 1.0 × 10 12 . In this case, the laminate 5 having the pressure-sensitive adhesive layer 2 having a sufficiently low surface resistivity can be obtained at both normal temperature and high temperature.
 Xr及びYrは、それぞれ、5.0×1011未満がさらに好ましく、1.0×1011未満がさらに好ましく、5.0×1010未満がさらに好ましく、1.0×1010未満がさらに好ましく、5.0×10未満がさらに好ましく、1.0×10未満がさらに好ましい。 For Xr and Yr, respectively, less than 5.0 × 10 11 is more preferable, less than 1.0 × 10 11 is further preferable, less than 5.0 × 10 10 is further preferable, and less than 1.0 × 10 10 is further preferable. , 5.0 × 10 9 or less, more preferably 1.0 × 10 9 or less.
 Xr,Yrは、下記式(2)を満たすことが好ましい。
 Yr/Xr<10・・・(2)
It is preferable that Xr and Yr satisfy the following formula (2).
Yr / Xr <10 ... (2)
 この場合、高温環境下での表面抵抗率の上昇が抑制される。Yr/Xrの値は、例えば、0.5~9.9であり、1~5がさらに好ましい。この値は、具体的には例えば、0.5、1、1.5、2、3、4、5、6、7、8、9、9.9であり、ここで例示した数値の何れか2つの間の範囲内であってもよい。 In this case, the increase in surface resistivity in a high temperature environment is suppressed. The value of Yr / Xr is, for example, 0.5 to 9.9, more preferably 1 to 5. Specifically, this value is, for example, 0.5, 1, 1.5, 2, 3, 4, 5, 6, 7, 8, 9, 9.9, and any of the numerical values exemplified here. It may be within the range between the two.
 実施例において本発明をさらに詳細に説明するが、これら実施例によって限定されるものではない。 The present invention will be described in more detail in Examples, but the present invention is not limited to these Examples.
1.導電性高分子の製造
 以下に示す方法で、導電性高分子C1~C5を製造した。
1. 1. Production of Conductive Polymers Conductive polymers C1 to C5 were produced by the methods shown below.
・製造例C1(導電性高分子C1の製造)
 1Lフラスコにプロピレンカーボネート500g、3,4-エチレンジオキシチオフェン(EDOT)3.4g、ドデシルベンゼンスルホン酸(DBS)3.0gを仕込み、0.25時間撹拌した。次いで、窒素パージ下、トリスパラトルエンスルホン酸鉄(III)(Fe(PTS))0.04g、フタルアルデヒド酸(PAA)1.8g、過酸化ベンゾイル6.75g、プロピレンカーボネート100gを加え40℃にて4時間攪拌した。さらにDBS1.25gを添加して、60℃にて2時間撹拌した。プロピレンカーボネートで置換したアニオン交換樹脂(レバチットMP62WS ランクセス社製)を30g添加して24時間攪拌後、アニオン交換樹脂を除去し、超音波ホモジナイザーにて処理し、プロピレンカーボネートで調液し、化学式(1)で表される構成単位を主に含む導電性高分子C1のプロピレンカーボネート分散液(不揮発分1.0質量%)を得た。
-Manufacturing example C1 (manufacturing of conductive polymer C1)
A 1 L flask was charged with 500 g of propylene carbonate, 3.4 g of 3,4-ethylenedioxythiophene (EDOT) and 3.0 g of dodecylbenzenesulfonic acid (DBS), and stirred for 0.25 hours. Then, under nitrogen purge, 0.04 g of iron (III) trisparatoluenesulfonate (Fe (PTS) 3 ), 1.8 g of phthalaldehyde acid (PAA), 6.75 g of benzoyl peroxide, and 100 g of propylene carbonate were added, and the temperature was 40 ° C. Was stirred for 4 hours. Further, 1.25 g of DBS was added, and the mixture was stirred at 60 ° C. for 2 hours. After adding 30 g of an anion exchange resin substituted with propylene carbonate (manufactured by LANXESS MP62WS) and stirring for 24 hours, the anion exchange resin is removed, treated with an ultrasonic homogenizer, prepared with propylene carbonate, and the chemical formula (1). ) Was obtained as a propylene carbonate dispersion (nonvolatile content 1.0% by mass) of the conductive polymer C1 mainly containing the structural unit represented by).
 導電性高分子C1のRは、化学式(5)で表される。
Figure JPOXMLDOC01-appb-C000007
R 1 of the conductive polymer C 1 is represented by the chemical formula (5).
Figure JPOXMLDOC01-appb-C000007
・製造例C2(導電性高分子C2の製造)
 製造例C1で得られたプロピレンカーボネート分散液にエポキシヘキシル1.2gを添加し、80℃にて6時間撹拌し、導電性高分子のカルボキシル基とエポキシヘキシルのエポキシ基を反応させ、アルキル変性された導電性高分子C2の分散液を得た。
-Manufacturing example C2 (manufacturing of conductive polymer C2)
1.2 g of epoxyhexyl is added to the propylene carbonate dispersion obtained in Production Example C1, and the mixture is stirred at 80 ° C. for 6 hours to react the carboxyl group of the conductive polymer with the epoxy group of the epoxyhexyl to be alkyl-modified. A dispersion liquid of the conductive polymer C2 was obtained.
 導電性高分子C2のRは、化学式(6)で表される。
Figure JPOXMLDOC01-appb-C000008
R 1 of the conductive polymer C2 is represented by the chemical formula (6).
Figure JPOXMLDOC01-appb-C000008
・製造例C3(導電性高分子C3の製造)
 製造例C2において変性に用いられるエポキシヘキシル1.2gを、片末端エポキシシリコーン(信越化学工業社製「X-22-173DX」)56.4gに変更した以外は、製造例C2と同様の方法で導電性高分子C3の分散液を得た。導電性高分子C3は、変性前の導電性高分子のカルボキシル基がX-22-173DXのエポキシ基と反応してシリコーン変性されている。
-Manufacturing example C3 (manufacturing of conductive polymer C3)
In the same manner as in Production Example C2, 1.2 g of epoxy hexyl used for modification in Production Example C2 was changed to 56.4 g of one-ended epoxy silicone (“X-22-173DX” manufactured by Shin-Etsu Chemical Co., Ltd.). A dispersion liquid of the conductive polymer C3 was obtained. The conductive polymer C3 is silicone-modified by reacting the carboxyl group of the conductive polymer before modification with the epoxy group of X-22-173DX.
 導電性高分子C3のRは、化学式(7)で表される。
Figure JPOXMLDOC01-appb-C000009
R 1 of the conductive polymer C3 is represented by the chemical formula (7).
Figure JPOXMLDOC01-appb-C000009
・製造例C4(導電性高分子C4の製造)
 1Lフラスコに、片末端エポキシオルガノシロキサン(信越化学工業製 X-22-173BX)30g、2-メルカプトエタンスルホン酸ナトリウム1.98g、イソプロピルアルコール23g、トリエチルアミン0.3gを仕込んで混合し、加熱還流下15時間反応させた。反応物に水を加え減圧留去によりイソプロピルアルコールを除去することで酸変性シリコーン化合物の乳化液(不揮発分12.6%)を得た。
-Manufacturing example C4 (manufacturing of conductive polymer C4)
30 g of one-ended epoxy organosiloxane (X-22-173BX manufactured by Shin-Etsu Chemical Co., Ltd.), 1.98 g of sodium 2-mercaptoethanesulfonate, 23 g of isopropyl alcohol, and 0.3 g of triethylamine are charged in a 1 L flask, mixed, and heated under reflux. It was allowed to react for 15 hours. Water was added to the reaction product and isopropyl alcohol was removed by distillation under reduced pressure to obtain an emulsion of an acid-modified silicone compound (nonvolatile content 12.6%).
 次に、反応装置に、前記酸変性シリコーン化合物の乳化液142.5g、濃塩酸1.6gエチレンジオキシチオフェン(EDOT)3.2g、硫酸鉄0.09gをそれぞれ混合し、30℃で30分攪拌した。その後、上記混合物に、過硫酸アンモニウム5.9gをイオン交換水50gに溶かした水溶液を1時間かけて滴下した。その後、30℃の状態を保ち5時間反応させた。得られた反応液を固液分離することで導電性高分子C4の湿体品を得た。該湿体品を24時間、0℃で凍結乾燥し、導電性高分子C4の乾燥粉末を得た。次に、導電性高分子C4の乾燥粉末を、メチルエチルケトンに対して不揮発分が1.5%になる比率で混合し、プローブ型超音波ホモジナイザーで処理を行い、導電性高分子C4の有機溶剤分散液を得た。 Next, 142.5 g of the emulsion of the acid-modified silicone compound, 3.2 g of concentrated hydrochloric acid of 1.6 g of ethylenedioxythiophene (EDOT), and 0.09 g of iron sulfate were mixed in the reaction apparatus, and the mixture was mixed at 30 ° C. for 30 minutes. Stirred. Then, an aqueous solution prepared by dissolving 5.9 g of ammonium persulfate in 50 g of ion-exchanged water was added dropwise to the above mixture over 1 hour. Then, the reaction was carried out for 5 hours while maintaining the state of 30 ° C. By solid-liquid separation of the obtained reaction solution, a wet product of the conductive polymer C4 was obtained. The wet product was freeze-dried at 0 ° C. for 24 hours to obtain a dry powder of the conductive polymer C4. Next, the dry powder of the conductive polymer C4 is mixed at a ratio of 1.5% of the non-volatile content to the methyl ethyl ketone, treated with a probe-type ultrasonic homogenizer, and dispersed in an organic solvent of the conductive polymer C4. Obtained liquid.
・製造例C5(導電性高分子C5の製造)
  2Lフラスコに、2-ソジウムスルホエチルメタクリレート(2-NaSEMA)50g、ベンジルメタクリレート(BzMA)55g、2-エチルヘキシルメタクリレート(2-EHA)47g、水150gおよびイソプロピルアルコール300gを仕込み、リフラックス温度まで昇温後、アゾビスイソブチロニトリル(AIBN)を0.7g添加して、リフラックス状態のまま18時間重合反応を行った。反応終了後、常温まで冷却し、重合液を得た。
-Manufacturing example C5 (manufacturing of conductive polymer C5)
In a 2L flask, 50 g of 2-sodium sulfoethyl methacrylate (2-NaSEMA), 55 g of benzyl methacrylate (BzMA), 47 g of 2-ethylhexyl methacrylate (2-EHA), 150 g of water and 300 g of isopropyl alcohol are charged and raised to the reflux temperature. After warming, 0.7 g of azobisisobutyronitrile (AIBN) was added, and the polymerization reaction was carried out for 18 hours in a reflux state. After completion of the reaction, the mixture was cooled to room temperature to obtain a polymerization solution.
  次に、前記重合液が入った2Lフラスコにヘキサン500gを添加し、混合液を得た。分液ロートを用い、前記混合液を分液抽出により油層の不純物を除去した。分液後の水層に、1kgのメタノールを1時間かけて滴下して固形分を析出させ、固形分を濾別した。得られた固形物を減圧下、100℃で24時間乾燥した後、乳鉢で粉砕して高分子化合物の粉体を得た。 Next, 500 g of hexane was added to the 2 L flask containing the polymerization solution to obtain a mixed solution. Using a separating funnel, impurities in the oil layer were removed from the mixed solution by liquid separation extraction. 1 kg of methanol was added dropwise to the aqueous layer after the liquid separation over 1 hour to precipitate the solid content, and the solid content was filtered off. The obtained solid material was dried under reduced pressure at 100 ° C. for 24 hours and then pulverized in a mortar to obtain a powder of a polymer compound.
  次に、前記高分子化合物16.1g、イオン交換水200gおよび35%塩酸水溶液6gを1フラスコに秤り取り、60℃で加熱攪拌を行い、均一な高分子化合物水溶液を得た。前記高分子化合物水溶液を冷却後、アニリン4.65gを秤量し加えた。この混合物を攪拌・溶解したところ、均一な乳化液となった。別に、水30g、ペルオキソ二硫酸アンモニウム10gを計量、混合し、この混合物を0℃で2時間かけて乳化液の入ったフラスコ中に滴下した。滴下終了後、室温(25℃)に戻し、48時間攪拌を行った。 Next, 16.1 g of the polymer compound, 200 g of ion-exchanged water and 6 g of a 35% aqueous hydrochloric acid solution were weighed into one flask and heated and stirred at 60 ° C. to obtain a uniform aqueous solution of the polymer compound. After cooling the aqueous solution of the polymer compound, 4.65 g of aniline was weighed and added. When this mixture was stirred and dissolved, a uniform emulsion was obtained. Separately, 30 g of water and 10 g of ammonium peroxodisulfate were weighed and mixed, and the mixture was added dropwise at 0 ° C. over 2 hours into a flask containing an emulsion. After completion of the dropping, the temperature was returned to room temperature (25 ° C.), and the mixture was stirred for 48 hours.
  反応終了後の重合溶液を濾別し、得られた結晶を水に再分散して洗浄を行い、再度濾別を行った。前記洗浄を4回繰り返して得た水を含んだ固形物を取り出し、減圧下40℃にて96時間乾燥して導電性高分子C5の乾燥粉末を得た。
  導電性高分子C5の乾燥粉末を、メチルエチルケトンに対して不揮発分が1.5%になる比率で混合し、プローブ型超音波ホモジナイザーで処理を行い、導電性高分子C5の有機溶剤分散液を得た。
After completion of the reaction, the polymerization solution was separated by filtration, the obtained crystals were redispersed in water, washed, and filtered again. The solid substance containing water obtained by repeating the above washing four times was taken out and dried at 40 ° C. under reduced pressure for 96 hours to obtain a dry powder of the conductive polymer C5.
The dry powder of the conductive polymer C5 is mixed at a ratio of 1.5% of the non-volatile content to the methyl ethyl ketone and treated with a probe-type ultrasonic homogenizer to obtain an organic solvent dispersion of the conductive polymer C5. rice field.
2.(メタ)アクリル系ポリマーの製造
・製造例A1((メタ)アクリル系ポリマーA1の製造)
 撹拌機、還流冷却器、温度計及び窒素導入管を備えた反応装置に、アクリル酸ブチル:96.8質量部、アクリル酸:0.2質量部、アクリル酸2-ヒドロキシエチル:3質量部を仕込み、次に酢酸エチルをモノマー濃度が50質量%になる配合量にて仕込んだ。次いで、モノマー成分の合計100質量部に対して2,2'-アゾビスイソブチロニトリル0.1質量部を加え、反応容器内の空気を窒素ガスで置換しながら攪拌を行い60℃に昇温した後、4時間反応させた。反応終了後、酢酸エチルで希釈し、(メタ)アクリル系ポリマーA1の溶液(不揮発分15%)を得た。(メタ)アクリル系ポリマーA1の重量平均分子量(Mw),Mw/Mn,80℃におけるポリマー単独の貯蔵弾性率は、表1に示す通りであった。
2. 2. Example of Manufacture / Production of (Meta) Acrylic Polymer A1 (Manufacturing of (Meta) Acrylic Polymer A1)
Butyl acrylate: 96.8 parts by mass, acrylic acid: 0.2 parts by mass, 2-hydroxyethyl acrylate: 3 parts by mass in a reaction device equipped with a stirrer, a reflux condenser, a thermometer and a nitrogen introduction tube. After charging, ethyl acetate was charged in an amount of 50% by mass of the monomer concentration. Next, 0.1 part by mass of 2,2'-azobisisobutyronitrile was added to 100 parts by mass of the total monomer components, and the mixture was stirred while replacing the air in the reaction vessel with nitrogen gas to raise the temperature to 60 ° C. After warming, it was reacted for 4 hours. After completion of the reaction, the mixture was diluted with ethyl acetate to obtain a solution of (meth) acrylic polymer A1 (nonvolatile content 15%). The weight average molecular weight (Mw) of the (meth) acrylic polymer A1, Mw / Mn, and the storage elastic modulus of the polymer alone at 80 ° C. are as shown in Table 1.
・製造例A2~A9((メタ)アクリル系ポリマーA2~A9の製造)
 モノマーの組成比を表1に示すように変更した以外は、製造例A1と同様の方法で(メタ)アクリル系ポリマーA2~A9を重合し、以下に示す方法でMw、Mw/Mn、80℃貯蔵弾性率の測定を行った。その結果を表1に示す。
Production Examples A2 to A9 (Production of (meth) acrylic polymers A2 to A9)
The (meth) acrylic polymers A2 to A9 were polymerized by the same method as in Production Example A1 except that the composition ratio of the monomers was changed as shown in Table 1, and Mw, Mw / Mn, 80 ° C. was used by the method shown below. The storage elastic modulus was measured. The results are shown in Table 1.
Figure JPOXMLDOC01-appb-T000010
Figure JPOXMLDOC01-appb-T000010
 表中の略称の意味は、以下の通りである。
BA:アクリル酸ブチル
MEA:アクリル酸2-メトキシエチル
MA:アクリル酸メチル
BzA:アクリル酸ベンジル
2EHA:アクリル酸2-エチルヘキシル
AA:アクリル酸
2HEA:アクリル酸2-ヒドロキシエチル
The meanings of the abbreviations in the table are as follows.
BA: Butyl acrylate MEA: 2-methoxyethyl acrylate MA: Methyl acrylate BzA: Benzyl acrylate 2EHA: 2-ethylhexyl acrylate AA: 2HEA acrylate: 2-hydroxyethyl acrylate
<Mw,Mn>
 重量平均分子量(Mw)および数平均分子量(Mn)は、ゲルパーミエーションクロマトグラフィー法(GPC法)により、下記条件で求めた。
・測定装置:HLC-8320GPC(東ソー株式会社製)
・GPCカラム構成:以下の4連カラム(すべて東ソー株式会社製)
(1)TSKgel  HxL-H(ガードカラム)
(2)TSKgel  GMHxL
(3)TSKgel  GMHxL
(4)TSKgel  G2500HxL
・流速:1.0mL/min
・カラム温度:40℃
・サンプル濃度:1.5%(w/v)(テトラヒドロフランで希釈)
・移動相溶媒:テトラヒドロフラン
・標準ポリスチレン換算
<Mw, Mn>
The weight average molecular weight (Mw) and the number average molecular weight (Mn) were determined by the gel permeation chromatography method (GPC method) under the following conditions.
-Measuring device: HLC-8320GPC (manufactured by Tosoh Corporation)
-GPC column configuration: The following 4-column column (all manufactured by Tosoh Corporation)
(1) TSKgel HxL-H (guard column)
(2) TSKgel GMHxL
(3) TSKgel GMHxL
(4) TSKgel G2500HxL
・ Flow velocity: 1.0 mL / min
-Column temperature: 40 ° C
-Sample concentration: 1.5% (w / v) (diluted with tetrahydrofuran)
・ Mobile phase solvent: Tetrahydrofuran ・ Standard polystyrene conversion
<80℃貯蔵弾性率>
 表中の80℃貯蔵弾性率は、以下の方法で測定した。
 剥離処理されたポリエチレンテレフタレートフィルム(PETフィルム)上に、乾燥後の膜厚が25μmとなるように測定用サンプル(ここでは、(メタ)アクリル系ポリマー)を、ドクターブレードを用いて液温25℃で塗布し、90℃で3分間乾燥させ、粘着シートを得た。前記粘着シートから得られる粘着剤層のみを複数用意し、これを積層することで、1mm厚の試験片を作製した。この試験片を用いて、アントンパール(AntonPaar)社製のモジュラーコンパクトレオメーターMCR300を用い、80℃における貯蔵弾性率を測定した。なお、測定周波数は1Hzとした。
<80 ° C storage elastic modulus>
The 80 ° C. storage elastic modulus in the table was measured by the following method.
On a stripped polyethylene terephthalate film (PET film), a measurement sample (here, a (meth) acrylic polymer) was placed on a polyethylene terephthalate film (PET film) so that the film thickness after drying was 25 μm, and the liquid temperature was 25 ° C. using a doctor blade. And dried at 90 ° C. for 3 minutes to obtain an adhesive sheet. Only a plurality of pressure-sensitive adhesive layers obtained from the pressure-sensitive adhesive sheet were prepared, and these were laminated to prepare a test piece having a thickness of 1 mm. Using this test piece, the storage elastic modulus at 80 ° C. was measured using a modular compact reometer MCR300 manufactured by AntonioPaar. The measurement frequency was 1 Hz.
3.粘着剤組成物の製造
 表2~表5に示す配合(質量部)で、表2~表5に示す各種成分を混合して評価用の粘着剤組成物を製造した。導電性高分子及び(メタ)アクリル系ポリマーは、上記製造例で得られた分散液又は溶液の状態で混合した。導電性高分子及び(メタ)アクリル系ポリマーの配合量は、分散液又は溶液中の固形分の量を示す。
3. 3. Production of Adhesive Composition A pressure-sensitive adhesive composition for evaluation was produced by mixing various components shown in Tables 2 to 5 with the formulations (parts by mass) shown in Tables 2 to 5. The conductive polymer and the (meth) acrylic polymer were mixed in the state of the dispersion liquid or the solution obtained in the above-mentioned production example. The blending amount of the conductive polymer and the (meth) acrylic polymer indicates the amount of the solid content in the dispersion liquid or the solution.
4.粘着性偏光フィルムの製造
 「3.粘着剤組成物の製造」で得られた粘着剤組成物を、剥離処理されたポリエチレンテレフタレートフィルム(PETフィルム)上に乾燥後の膜厚が25μmとなるように、ドクターブレードを用いて液温25℃で塗布し、90℃で3分間乾燥させ、粘着シートを得た。
4. Production of Adhesive Polarizing Film The adhesive composition obtained in "3. Production of Adhesive Composition" is placed on a peel-treated polyethylene terephthalate film (PET film) so that the film thickness after drying is 25 μm. The film was applied at a liquid temperature of 25 ° C. using a doctor blade and dried at 90 ° C. for 3 minutes to obtain an adhesive sheet.
 次に、得られた粘着シートと、表2~表5に示す偏光フィルムとを、前記塗膜と偏光フィルムとが接するように貼り合わせ、23℃/50%RHの条件で7日間静置し、実施例・比較例の粘着性偏光フィルムを得た。 Next, the obtained adhesive sheet and the polarizing films shown in Tables 2 to 5 were bonded together so that the coating film and the polarizing film were in contact with each other, and allowed to stand for 7 days under the conditions of 23 ° C./50% RH. , An adhesive polarizing film of Examples and Comparative Examples was obtained.
Figure JPOXMLDOC01-appb-T000011
Figure JPOXMLDOC01-appb-T000011
Figure JPOXMLDOC01-appb-T000012
Figure JPOXMLDOC01-appb-T000012
Figure JPOXMLDOC01-appb-T000013
Figure JPOXMLDOC01-appb-T000013
Figure JPOXMLDOC01-appb-T000014
Figure JPOXMLDOC01-appb-T000014
 上記表中に記載の成分及び部材の詳細は、以下の通りである。 Details of the components and members described in the above table are as follows.
((メタ)アクリル系ポリマー)
・(メタ)アクリル系ポリマーA1~A9:製造例A1~A9で製造したもの
((Meta) acrylic polymer)
(Meta) Acrylic Polymers A1 to A9: Manufactured by Production Examples A1 to A9
(導電性高分子)
・導電性高分子C1~C5:製造例C1~C5で製造したもの
(Conductive polymer)
-Conductive polymers C1 to C5: Manufactured by Production Examples C1 to C5
(水添ブロック共重合体)
 ゴム系ポリマー1及び2の詳細は、以下の通りである。Mw及び80℃貯蔵弾性率は、「2.(メタ)アクリル系ポリマーの製造」で説明した方法で測定した。
・ゴム系ポリマー1(SEPS50質量%とSEP50質量%との混合物、水添率90%超、スチレン含有量15質量%、Mw:13万、80℃貯蔵弾性率:720kPa)
・ゴム系ポリマー2(SEPS50質量%とSEP50質量%との混合物、水添率90%超、スチレン含有量20質量%、Mw:15万、80℃貯蔵弾性率:920kPa)
(Hydrogenated block copolymer)
The details of the rubber-based polymers 1 and 2 are as follows. Mw and the 80 ° C. storage elastic modulus were measured by the method described in "2. Production of (meth) acrylic polymer".
-Rubber polymer 1 (mixture of SEPS 50% by mass and SEP 50% by mass, hydrogenation rate over 90%, styrene content 15% by mass, Mw: 130,000, 80 ° C storage elastic modulus: 720 kPa)
-Rubber polymer 2 (mixture of SEPS 50% by mass and SEP 50% by mass, hydrogenation rate over 90%, styrene content 20% by mass, Mw: 150,000, 80 ° C storage elastic modulus: 920 kPa)
(粘着付与樹脂)
・FMR-0150(軟化点145℃の芳香族系粘着付与樹脂:三井化学製)
・TH-130(軟化点130℃テルペンフェノール型粘着付与樹脂:ヤスハラケミカル製)
・FTR-6100(軟化点95℃の芳香族系粘着付与樹脂:三井化学製)
(Adhesive-imparting resin)
FMR-0150 (aromatic adhesive-imparting resin with softening point of 145 ° C: manufactured by Mitsui Chemicals)
TH-130 (softening point 130 ° C. terpene phenol-type adhesive-imparting resin: manufactured by Yasuhara Chemical Co., Ltd.)
・ FTR-6100 (Aromatic adhesive resin with softening point of 95 ° C: manufactured by Mitsui Chemicals)
(軟化剤)
・LV-100(Mn500のポリブテン:ENEOS製)
・HV-300(Mn1400のポリブテン:ENEOS製)
(Softener)
LV-100 (Mn500 polybutene: made by ENEOS)
HV-300 (Mn1400 polybutene: manufactured by ENEOS)
(その他の成分)
・架橋剤:東ソー社製「コロネートL」
・シランカップリング剤:信越化学工業社製「KBM-403」
・酸化防止剤:アデカスタブAO-330(ヒンダードフェノール系酸化防止剤:ADEKA製)
(Other ingredients)
-Crosslinking agent: "Coronate L" manufactured by Tosoh Corporation
-Silane coupling agent: "KBM-403" manufactured by Shin-Etsu Chemical Co., Ltd.
-Antioxidant: ADEKA STAB AO-330 (Hindered phenolic antioxidant: ADEKA)
(偏光フィルム)
 偏光フィルムは、表6に示す構成のものを用いた。
(Polarizing film)
As the polarizing film, the one having the configuration shown in Table 6 was used.
Figure JPOXMLDOC01-appb-T000015
Figure JPOXMLDOC01-appb-T000015
 保護層部材の略称の意味は、以下の通りである。
COP:シクロオレフィンポリマー
PMMA:ポリメチルメタクリレート
PET:ポリエチレンテレフタレート
TAC:トリアセチルセルロース
The meaning of the abbreviation of the protective layer member is as follows.
COP: Cycloolefin Polymer PMMA: Polymethylmethacrylate PET: Polyethylene terephthalate TAC: Triacetylcellulose
 偏光フィルムの単独収縮率は、以下の方法で測定した。
 偏光フィルム160mm(MD方向)×25mm(TD方向)の大きさに裁断して試験片を作成した。この試験片を単独で23℃50%RHの環境下に10分間放置し、その後、試験片の長辺方向の寸法(Xp)を測定した。次に、前記試験片を単独で80℃の条件下で72時間放置した後、23℃50%RHの環境下で10分間放冷し、偏光フィルムの長辺方向の寸法(Yp)を測定した。
 得られたXp、Ypから単独収縮率(((Xp-Yp)/Xp)×100)を計算した。
The single shrinkage of the polarizing film was measured by the following method.
A test piece was prepared by cutting the polarizing film into a size of 160 mm (MD direction) × 25 mm (TD direction). This test piece was left alone in an environment of 23 ° C. and 50% RH for 10 minutes, and then the dimension (Xp) in the long side direction of the test piece was measured. Next, the test piece was left alone under the condition of 80 ° C. for 72 hours, then allowed to cool for 10 minutes in an environment of 23 ° C. and 50% RH, and the dimension (Yp) in the long side direction of the polarizing film was measured. ..
The single shrinkage rate (((Xp-Yp) / Xp) × 100) was calculated from the obtained Xp and Yp.
5.試験用の積層体の作成
 粘着性偏光フィルムを160mm(MD方向)×25mm(TD方向)の大きさに裁断して試験片を作成した。前記試験片からPETフィルムを剥離し、ラミネーターロールを用いて、粘着性偏光フィルムを厚さ2mmの無アルカリガラス板をガラス基板として有する液晶パネルの片面に、粘着剤層と無アルカリガラス板とが接するように貼着したものを50℃/5気圧に調整されたオートクレーブ中に20分間保持して、試験用の積層体を作成した。
5. Preparation of laminated body for test A test piece was prepared by cutting an adhesive polarizing film into a size of 160 mm (MD direction) × 25 mm (TD direction). The PET film is peeled off from the test piece, and a pressure-sensitive adhesive layer and a non-alkali glass plate are formed on one side of a liquid crystal panel having a 2 mm-thick non-alkali glass plate as a glass substrate using a laminator roll. The contact-bonded material was held in an autoclave adjusted to 50 ° C./5 atm for 20 minutes to prepare a laminated body for testing.
6.評価
 以下の基準に従って、各種評価を行った。その結果を表2~表5に示す。
6. Evaluation Various evaluations were performed according to the following criteria. The results are shown in Tables 2 to 5.
 実施例・比較例を比較すると、実施例の積層体は、比較例の積層体に比べて、積層体収縮率、Xr,Yr,Yr/Xrが小さく、80℃dry耐熱耐久性に優れていることが分かる。 Comparing Examples and Comparative Examples, the laminated body of the example has a smaller shrinkage rate, Xr, Yr, Yr / Xr of the laminated body than the laminated body of the comparative example, and is excellent in heat resistance and durability at 80 ° C. You can see that.
<粘着剤層の80℃貯蔵弾性率>
 粘着剤層の80℃貯蔵弾性率は、測定用サンプルとして、粘着剤層を構成する粘着剤組成物を用い、「2.(メタ)アクリル系ポリマーの製造」で説明した方法で測定した。
<80 ° C storage elastic modulus of adhesive layer>
The 80 ° C. storage elastic modulus of the pressure-sensitive adhesive layer was measured by the method described in "2. Production of (meth) acrylic polymer" using the pressure-sensitive adhesive composition constituting the pressure-sensitive adhesive layer as a measurement sample.
<粘着剤層の80℃ズレ量>
 粘着性偏光フィルムを幅10mm×長さ100mmにカットし、PETフィルムを剥がして無アルカリガラス上に、粘着剤層が前記ガラスに接するように、かつ10mm×10mmの貼り合わせ面積となるように貼り合わせ、測定用試験片を得た。
<Amount of deviation of the adhesive layer at 80 ° C>
The adhesive polarizing film is cut into a width of 10 mm × a length of 100 mm, the PET film is peeled off, and the adhesive layer is attached onto the non-alkali glass so that the adhesive layer is in contact with the glass and has a bonding area of 10 mm × 10 mm. Together, a test piece for measurement was obtained.
 前記測定用試験片を、50℃/5気圧に調整されたオートクレーブ中に20分間保持し、23℃50%RH環境下で1時間静置した。次に前記試験片を、微少クリープ測定機(英弘精機(株)社製 機種名:TA.TX.PLUS)のチャンバーBOX内に固定用チャック部分の長さ15mmにてセットした。 The test piece for measurement was held in an autoclave adjusted to 50 ° C./5 atm for 20 minutes, and allowed to stand for 1 hour in a 23 ° C. and 50% RH environment. Next, the test piece was set in the chamber BOX of a microcreep measuring machine (model name: TA.TX.PLUS manufactured by Eiko Seiki Co., Ltd.) with a length of 15 mm for the fixing chuck portion.
 前記チャンバーBOX内を80℃まで加熱して、測定温度にて40分間静置後に、引張荷重800g、引張時間1時間にて、前記試験片における前記粘着性偏光フィルムを、該偏光フィルムと前記ガラスとの接着面に平行にかつ前記偏光フィルムの長さ方向に引っ張り、 前記試験片における前記ガラスと偏光フィルムとの貼り合わせ部分のズレ量(μm)を測定した。 After heating the inside of the chamber BOX to 80 ° C. and allowing it to stand at the measurement temperature for 40 minutes, the pressure-sensitive polarizing film on the test piece was subjected to the polarizing film and the glass under a tensile load of 800 g and a tension time of 1 hour. It was pulled parallel to the bonding surface with the polarizing film and in the length direction of the polarizing film, and the amount of deviation (μm) of the bonded portion between the glass and the polarizing film in the test piece was measured.
<積層体収縮率>
 試験用の積層体を23℃50%RHの環境下で10分間放冷し、積層体中の偏光フィルムの長辺方向の寸法(Xs)を測定した。次に、積層体を、80℃の条件下で72時間放置した後、23℃50%RHの環境下で10分間放冷し、積層体中の偏光フィルムの長辺方向の寸法(Ys)を測定した。得られたXs、Ysから積層体収縮率(((Xs-Ys)/Xs)×100)を計算した。
<Layer shrinkage rate>
The laminated body for the test was allowed to cool for 10 minutes in an environment of 23 ° C. and 50% RH, and the dimensions (Xs) in the long side direction of the polarizing film in the laminated body were measured. Next, the laminate was left to stand at 80 ° C. for 72 hours and then allowed to cool for 10 minutes in an environment of 23 ° C. and 50% RH to determine the dimensions (Ys) of the polarizing film in the laminate in the long side direction. It was measured. The laminate shrinkage rate (((Xs—Ys) / Xs) × 100) was calculated from the obtained Xs and Ys.
<表面抵抗率>
 試験用の積層体を23℃50%RHの環境下で10分間放冷し、液晶パネルから粘着性偏光フィルムを剥離角度90°、剥離速度300mm/minで剥がして露出させた粘着剤層の表面抵抗率(Xr)を、抵抗率計(ハイレスタUX MCP-HT800、三菱化学アナリティック)を用い、印加電圧1000Vで、JIS-K-6911に準じて行った。
<Surface resistivity>
The surface of the pressure-sensitive adhesive layer exposed by allowing the test laminate to cool in an environment of 23 ° C. and 50% RH for 10 minutes and peeling off the adhesive polarizing film from the liquid crystal panel at a peeling angle of 90 ° and a peeling speed of 300 mm / min. The resistivity (Xr) was measured using a resistivity meter (High Resta UX MCP-HT800, Mitsubishi Chemical Analytical) at an applied voltage of 1000 V according to JIS-K-6911.
 また、前記積層体を、80℃の条件下で72時間放置した後、23℃50%RHの環境下で10分間放冷し、液晶パネルから粘着性偏光フィルムを剥離角度90°、剥離速度300mm/minで剥がした以外は表面抵抗率(Xr)と同様にして、表面抵抗率(Yr)を測定した。 Further, the laminate was left to stand at 80 ° C. for 72 hours and then allowed to cool for 10 minutes in an environment of 23 ° C. and 50% RH to peel off the adhesive polarizing film from the liquid crystal panel at a peeling angle of 90 ° and a peeling speed of 300 mm. The surface resistivity (Yr) was measured in the same manner as the surface resistivity (Xr) except that it was peeled off at / min.
<80℃dry耐熱耐久性>
 試験用の積層体を温度80℃dryの条件下で500時間放置した後の積層体の状態を目視で観察し、積層体の80℃dry耐熱耐久性を以下の基準で評価した。
○:粘着剤層にシワ・発泡・剥がれが何れも存在しない
△:粘着剤層にシワが存在するが、発泡・剥がれは何れも存在しない
×:粘着剤層に発泡又は剥がれが存在する
<80 ° C dry heat resistance durability>
After the test laminate was left at a temperature of 80 ° C. dry for 500 hours, the state of the laminate was visually observed, and the heat resistance and durability of the laminate at 80 ° C. dry was evaluated according to the following criteria.
◯: No wrinkles, foaming, or peeling in the adhesive layer Δ: Wrinkles are present in the adhesive layer, but no foaming or peeling is present ×: Foaming or peeling is present in the adhesive layer

Claims (11)

  1.  粘着剤層と偏光フィルムが積層されて構成された粘着性偏光フィルムにおいて、
     前記粘着剤層は、粘着剤と、導電性高分子とを含有する粘着剤組成物より形成され、
     前記粘着剤層の80℃における貯蔵弾性率(G')が20~1000kPaである、粘着性偏光フィルム。
    In an adhesive polarizing film formed by laminating an adhesive layer and a polarizing film,
    The pressure-sensitive adhesive layer is formed of a pressure-sensitive adhesive composition containing a pressure-sensitive adhesive and a conductive polymer.
    An adhesive polarizing film having a storage elastic modulus (G') of the pressure-sensitive adhesive layer at 80 ° C. of 20 to 1000 kPa.
  2.  請求項1に記載の粘着性偏光フィルムであって、
     前記粘着剤が、アクリル系粘着剤であり、
     前記アクリル系粘着剤は、(メタ)アクリル系ポリマーと、架橋剤とを含み、
     前記(メタ)アクリル系ポリマーは、モノマー混合物の重合体であり、
     前記モノマー混合物は、第1モノマーの含有量が0.05~10質量%であり、第2モノマーの含有量が51~99.5質量%であり、
     第1モノマーは、架橋性官能基含有モノマーであり、
     第2モノマーは、第1モノマーでなく、ホモポリマーのガラス転移温度が-60~20℃である(メタ)アクリル酸アルキルエステルと、ホモポリマーのガラス転移温度が-60~20℃である(メタ)アクリル酸アルコキシアルキルエステルから選択される少なくとも1種であり、
     前記(メタ)アクリル系ポリマーの重量平均分子量が60万以上である、粘着性偏光フィルム。
    The adhesive polarizing film according to claim 1, wherein the adhesive polarizing film is used.
    The pressure-sensitive adhesive is an acrylic pressure-sensitive adhesive.
    The acrylic pressure-sensitive adhesive contains a (meth) acrylic polymer and a cross-linking agent.
    The (meth) acrylic polymer is a polymer of a monomer mixture, and is
    The monomer mixture has a content of the first monomer of 0.05 to 10% by mass and a content of the second monomer of 51 to 99.5% by mass.
    The first monomer is a crosslinkable functional group-containing monomer, and is
    The second monomer is not the first monomer, but a (meth) acrylic acid alkyl ester having a homopolymer glass transition temperature of −60 to 20 ° C. and a homopolymer having a glass transition temperature of −60 to 20 ° C. (meth). ) At least one selected from acrylic acid alkoxyalkyl esters,
    An adhesive polarizing film having a weight average molecular weight of 600,000 or more of the (meth) acrylic polymer.
  3.  請求項1に記載の粘着性偏光フィルムであって、
     前記粘着剤は、ゴム系粘着剤であり、
     前記ゴム系粘着剤は、水添ブロック共重合体と、粘着付与樹脂と、軟化剤とを含み、
     前記水添ブロック共重合体は、芳香族ビニル単量体の重合体成分から構成されるセグメントと、共役ジエン単量体の重合体成分から構成されるセグメントとを有し、
     前記粘着付与樹脂は、軟化点が80℃以上であり、
     前記軟化剤は、23℃において液体である、粘着性偏光フィルム。
    The adhesive polarizing film according to claim 1, wherein the adhesive polarizing film is used.
    The pressure-sensitive adhesive is a rubber-based pressure-sensitive adhesive.
    The rubber-based pressure-sensitive adhesive contains a hydrogenated block copolymer, a tack-imparting resin, and a softening agent.
    The hydrogenated block copolymer has a segment composed of a polymer component of an aromatic vinyl monomer and a segment composed of a polymer component of a conjugated diene monomer.
    The tackifier resin has a softening point of 80 ° C. or higher and has a softening point of 80 ° C. or higher.
    The softener is an adhesive polarizing film that is liquid at 23 ° C.
  4.  請求項1~請求項3の何れか1つに記載の粘着性偏光フィルムであって、
     前記導電性高分子は、化学式(1)又は(2)で表される構成単位の少なくとも1つを有する、粘着性偏光フィルム。
    Figure JPOXMLDOC01-appb-C000001
    Figure JPOXMLDOC01-appb-C000002
    (Rは、炭素数1~12のアルキル基、炭素数1~12のアルコキシ基、繰り返し単位が1~50の炭素数1~12のアルキレンオキサイド基、置換基を有してもよいフェニル基、置換基を有してもよい複素環基、又は置換基を有してもよい縮合環基を表し、Rは、それぞれ酸素原子又は硫黄原子であり、Rは、それぞれ、水素原子又は有機基である。Aは、ドーパント由来のモノアニオンである。nは、2以上300以下である。)
    The adhesive polarizing film according to any one of claims 1 to 3.
    The conductive polymer is an adhesive polarizing film having at least one of the structural units represented by the chemical formula (1) or (2).
    Figure JPOXMLDOC01-appb-C000001
    Figure JPOXMLDOC01-appb-C000002
    (R 1 is an alkyl group having 1 to 12 carbon atoms, an alkoxy group having 1 to 12 carbon atoms, an alkylene oxide group having 1 to 50 carbon atoms and having 1 to 12 carbon atoms, and a phenyl group which may have a substituent. , A heterocyclic group which may have a substituent, or a fused ring group which may have a substituent, R 2 is an oxygen atom or a sulfur atom, respectively, and R 3 is a hydrogen atom or a hydrogen atom, respectively. It is an organic group. A is a monoanion derived from a dopant. N is 2 or more and 300 or less.)
  5.  請求項4に記載の粘着性偏光フィルムであって、
     前記導電性高分子(B)のRが、エステル結合を有する、粘着性偏光フィルム。
    The adhesive polarizing film according to claim 4, wherein the adhesive polarizing film is used.
    An adhesive polarizing film in which R 1 of the conductive polymer (B) has an ester bond.
  6.  請求項1~請求項5の何れか1つに記載の粘着性偏光フィルムであって、
     前記粘着剤組成物は、シランカップリング剤を含有する、粘着性偏光フィルム。
    The adhesive polarizing film according to any one of claims 1 to 5.
    The pressure-sensitive adhesive composition is a pressure-sensitive polarizing film containing a silane coupling agent.
  7.  請求項1~請求項6の何れか1つに記載の粘着性偏光フィルムであって、
     前記粘着性偏光フィルムの粘着面を10mm×10mmの面積でガラス板に貼付し、80℃環境下でせん断方向に800gの荷重を加えた場合に、荷重付加開始から1時間後のガラス板に対する粘着剤層のずれが2.0mm以下である、粘着性偏光フィルム。
    The adhesive polarizing film according to any one of claims 1 to 6.
    When the adhesive surface of the adhesive polarizing film is attached to a glass plate with an area of 10 mm × 10 mm and a load of 800 g is applied in the shearing direction in an environment of 80 ° C., the adhesive surface adheres to the glass plate 1 hour after the start of load application. An adhesive polarizing film having a displacement of 2.0 mm or less in the agent layer.
  8.  請求項1~請求項7の何れか1つに記載の粘着性偏光フィルムが画像表示素子に貼り付けられて構成された画像表示装置用積層体。 A laminate for an image display device configured by attaching the adhesive polarizing film according to any one of claims 1 to 7 to an image display element.
  9.  請求項8に記載の積層体であって、
     下記式(1)を満たす、積層体。
     ((Xs-Ys)/Xs)×100<3・・・(1)
     (Xsは、前記積層体を23℃50%RH環境下に放置した後の状態での前記積層体中の前記偏光フィルムの延伸軸方向の寸法であり、Ysは、前記積層体を80℃環境下に72時間放置後、23℃50%RHの環境下で10分間放冷した後の、前記積層体中の前記偏光フィルムの延伸軸方向の寸法である。)
    The laminated body according to claim 8.
    A laminated body that satisfies the following formula (1).
    ((Xs-Ys) / Xs) x 100 <3 ... (1)
    (Xs is the dimension in the stretch axis direction of the polarizing film in the laminate in a state after the laminate is left in a 23 ° C. and 50% RH environment, and Ys is a dimension in which the laminate is placed in an 80 ° C. environment. It is the dimension in the stretch axis direction of the polarizing film in the laminated body after leaving it under the structure for 72 hours and then allowing it to cool for 10 minutes in an environment of 23 ° C. and 50% RH.)
  10.  請求項8又は請求項9に記載の積層体であって、
     Xr及びYrが何れも1.0×1012未満である、積層体。
     (Xrは、前記積層体を23℃50%RH環境下に放置した後に前記粘着性偏光フィルムを前記積層体から剥がして露出させた前記粘着剤層の表面抵抗率であり、Yrは、前記積層体を80℃環境下に72時間放置後、23℃50%RHの環境下で10分間放冷した後に前記粘着性偏光フィルムを前記積層体から剥がして露出させた前記粘着剤層の表面抵抗率である。)
    The laminated body according to claim 8 or 9.
    A laminate in which both Xr and Yr are less than 1.0 × 10 12 .
    (Xr is the surface resistance of the adhesive layer exposed by peeling the adhesive polarizing film from the laminate after leaving the laminate in a 23 ° C. and 50% RH environment, and Yr is the surface resistance of the laminate. The surface resistance of the pressure-sensitive adhesive layer exposed by peeling the adhesive polarizing film from the laminate after leaving the body in an environment of 80 ° C. for 72 hours and then allowing it to cool in an environment of 23 ° C. and 50% RH for 10 minutes. Is.)
  11.  請求項10に記載の積層体であって、
     下記式(2)を満たす、積層体。
     Yr/Xr<10・・・(2)
    The laminated body according to claim 10.
    A laminated body that satisfies the following formula (2).
    Yr / Xr <10 ... (2)
PCT/JP2021/033283 2020-09-17 2021-09-10 Pressure-sensitive-adhesive polarizing film, and laminate for image display device WO2022059609A1 (en)

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