WO2022037226A1 - Optical module - Google Patents

Abstract

An optical module (200), comprising: an upper housing (201) which forms a packaging cavity with a lower housing (202), and a circuit board (300) arranged in the packaging cavity, wherein an inner surface of the upper housing (201) is provided with a first protrusion (2011); the circuit board (300) is provided with a signal line (301), and an upper surface of the circuit board is provided with a first copper foil (302) and a bonding finger (303); the end of the signal line (301) away from the first copper foil (302) is arranged on a surface of the circuit board (300), and the end of the signal line close to the first copper foil (302) is arranged inside the circuit board (300), and extends through the first copper foil (302) along the inside of the circuit board (300) and is then electrically connected to the bonding finger (303); and the first copper foil (302) and the bonding finger (303) are both located at one end of the circuit board (300), and the first copper foil is arranged corresponding to the first protrusion (2011) and is electrically connected to a second end of the first protrusion (2011).

Description

an optical module

This disclosure requires that it be submitted to the China Patent Office on August 18, 2020, with the application number of 202021725661.8 and the patent name of "An Optical Module", and submitted to the China Patent Office on September 14, 2020, with the application number of 202022007055.9 and the patent name of Priority for "an optical module," which is incorporated by reference in this disclosure in its entirety.

technical field

The present disclosure relates to the technical field of optical communication, and in particular, to an optical module.

Background technique

With the rapid development of data centers and supercomputers, optical modules also tend to have the characteristics of high integration and high speed. With the continuous improvement of the integration and speed of optical modules, it is easy to cause the EMI (Electro Magnetic Interference, electromagnetic interference) of optical modules to exceed the standard.

SUMMARY OF THE INVENTION

On the one hand, an embodiment of the present disclosure provides an optical module, including: an upper casing and a lower casing to form a wrapping cavity; a circuit board, placed in the wrapping cavity; and a first protrusion provided on the inner surface of the upper casing ; The first protrusion, the first end is connected to the inner surface of the upper casing; the circuit board is provided with a signal line, and the upper surface is provided with a first copper foil and a gold finger; the signal line, one end away from the first copper foil is placed On the surface of the circuit board, the end close to the first copper foil is placed inside the circuit board, and extends along the interior of the circuit board through the first copper foil to be electrically connected to the gold finger; the first copper foil and the gold finger are both located on the circuit board One end of the gold finger is perpendicular to the gold finger, is arranged corresponding to the first protrusion, and is electrically connected with the second end of the first protrusion.

On the other hand, an embodiment of the present disclosure provides an optical module, including: a lower casing; an upper casing, which is covered and closed on the lower casing to form a cavity; a first support plate and a groove are provided on the upper casing, and the groove and The first support plate is arranged adjacently; the circuit board is arranged in the cavity, and the first support plate is arranged between the circuit board and the main body of the upper casing; one end of the support plate is provided with a gold finger, the groove is arranged above the gold finger, and the gold finger is arranged above the gold finger. The fingers and the first support plate are respectively located on both sides of the groove.

Description of drawings

In order to illustrate the technical solutions of the present disclosure more clearly, the accompanying drawings that need to be used in the embodiments will be briefly introduced below. Other drawings can also be obtained from these drawings.

Fig. 1 is a schematic diagram of the connection relationship of optical communication terminals;

FIG. 2 is a schematic structural diagram of an optical network terminal;

FIG. 3 is a schematic structural diagram of an optical module according to an embodiment of the present disclosure;

FIG. 4 is a schematic diagram of an exploded structure of an optical module provided by an embodiment of the present disclosure;

FIG. 5 is a schematic structural diagram of an upper casing provided by an embodiment of the present disclosure;

FIG. 6 is a schematic structural diagram of a circuit board provided by an embodiment of the present disclosure;

FIG. 7 is a schematic structural diagram of the circuit board of FIG. 6 rotated by 180°;

8 is a schematic structural diagram of an upper casing and a circuit board according to an embodiment of the present disclosure;

FIG. 9 is a schematic structural diagram of a lower casing provided by an embodiment of the present disclosure;

FIG. 10 is a schematic structural diagram of a circuit board and a lower casing according to an embodiment of the present disclosure;

11 is a partial cross-sectional view of an optical module provided by an embodiment of the present disclosure;

FIG. 12 is another structural schematic diagram of an upper casing in an optical module according to an embodiment of the present disclosure;

FIG. 13 is another perspective schematic diagram of an upper casing in an optical module according to an embodiment of the present disclosure;

14 is a partial cross-sectional schematic diagram of an optical module provided by an embodiment of the present disclosure;

FIG. 15 is an enlarged schematic view of the position A in FIG. 14 .

detailed description

The technical solutions in the embodiments of the present disclosure will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present disclosure. Obviously, the described embodiments are only a part of the embodiments of the present disclosure, but not all of the embodiments. Based on the embodiments in the present disclosure, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present disclosure.

In the description of the specification, the terms "one embodiment", "some embodiments", "exemplary embodiments", "example", "specific example" example)" or "some examples" and the like are intended to indicate that a particular feature, structure, material or characteristic related to the embodiment or example is included in at least one embodiment or example of the present disclosure. The schematic representations of the above terms are not necessarily referring to the same embodiment or example. Furthermore, the particular features, structures, materials or characteristics described may be included in any suitable manner in any one or more embodiments or examples.

Hereinafter, the terms "first", "second", "third" and "fourth" are only used for descriptive purposes, and should not be understood as indicating or implying relative importance or implying the number of indicated technical features. Thus, features defined as "first", "second", "third" and "fourth" may expressly or implicitly include one or more of such features. In the description of the embodiments of the present disclosure, unless otherwise specified, "plurality" means two or more.

In describing some embodiments, the expression "connected" and its derivatives may be used. For example, the term "connected" may be used in describing some embodiments to indicate that two or more components are in direct physical or electrical contact with each other. However, the term "connected" may also mean that two or more components are not in direct contact with each other, but yet still co-operate or interact with each other. The embodiments disclosed herein are not necessarily limited by the content herein.

The use of "configured to" herein means open and inclusive language that does not exclude devices that are configured to perform additional tasks or steps.

Additionally, the use of "based on" is meant to be open and inclusive, as a process, step, calculation or other action "based on" one or more of the stated conditions or values may in practice be based on additional conditions or beyond the stated values.

One of the core links of optical fiber communication is the mutual conversion of optical and electrical signals. Optical fiber communication uses information-carrying optical signals to transmit in information transmission equipment such as optical fibers/optical waveguides. The passive transmission characteristics of light in optical fibers/optical waveguides can realize low-cost, low-loss information transmission; while computers and other information processing equipment Electrical signals are used. In order to establish an information connection between information transmission equipment such as optical fibers/optical waveguides and information processing equipment such as computers, it is necessary to realize the mutual conversion of electrical signals and optical signals.

The optical module realizes the mutual conversion function of the above-mentioned optical and electrical signals in the technical field of optical fiber communication, and the mutual conversion of the optical signal and the electrical signal is the core function of the optical module. The optical module realizes the electrical connection with the external host computer through the golden fingers on its internal circuit board. The main electrical connections include power supply, I2C signal, data signal and grounding, etc. The optical module realizes the optical connection with the external optical fiber through the optical interface. There are many ways to connect external optical fibers, and a variety of optical fiber connector types are derived; the use of gold fingers to achieve electrical connection at the electrical interface has become the mainstream connection method in the optical module industry. The definition of the pin has formed a variety of industry protocols/standards; the optical connection method realized by the optical interface and the optical fiber connector has become the mainstream connection method in the optical module industry. Based on this, the optical fiber connector has also formed a variety of industry standards. Such as LC interface, SC interface, MPO interface, etc., the optical interface of the optical module is also designed for the adaptability of the optical fiber connector. Therefore, there are various types of optical fiber adapters set at the optical interface.

FIG. 1 is a schematic diagram of a connection relationship of an optical communication terminal. As shown in FIG. 1 , the connection of the optical communication terminal mainly includes the interconnection between the optical network terminal 100, the optical module 200, the optical fiber 101 and the network cable 103;

One end of the optical fiber 101 is connected to the remote server, and one end of the network cable 103 is connected to the local information processing device. The connection between the local information processing device and the remote server is completed by the connection between the optical fiber 101 and the network cable 103; and the connection between the optical fiber 101 and the network cable 103 is completed by The optical network terminal 100 with the optical module 200 is completed.

The optical interface of the optical module 200 is externally connected to the optical fiber 101, and a two-way optical signal connection is established with the optical fiber 101; the electrical interface of the optical module 200 is externally connected to the optical network terminal 100, and a two-way electrical signal connection is established with the optical network terminal 100; The two-way mutual conversion between optical signals and electrical signals is realized inside the optical module, thereby realizing the establishment of an information connection between the optical fiber and the optical network terminal; in some embodiments of the present disclosure, the optical signal from the optical fiber 101 is converted into an electrical signal by the optical module After being input into the optical network terminal 100 , the electrical signal from the optical network terminal 100 is converted into an optical signal by the optical module and input into the optical fiber 101 .

The optical network terminal has an optical module interface 102, which is used to access the optical module 200 and establish a two-way electrical signal connection with the optical module 200; Signal connection (generally the electrical signal of the Ethernet protocol, which belongs to a different protocol/type from the electrical signal used by the optical module); the connection between the optical module 200 and the network cable 103 is established through the optical network terminal 100, in some embodiments of the present disclosure Among them, the optical network terminal transmits the signal from the optical module to the network cable, and transmits the signal from the network cable to the optical module, and the optical network terminal acts as the upper computer of the optical module to monitor the operation of the optical module. The optical network terminal is the host computer of the optical module. It provides data signals to the optical module and receives data signals from the optical module. So far, the remote server communicates with the local information processing equipment through optical fibers, optical modules, optical network terminals and network cables. Establish a two-way signal transmission channel.

Common local information processing equipment includes routers, home switches, electronic computers, etc.; common optical network terminals include optical network units ONU, optical line terminals OLT, data center servers, and data center switches.

FIG. 2 is a schematic structural diagram of an optical network terminal. As shown in FIG. 2, the optical network terminal 100 has a circuit board 105, and a cage 106 is provided on the surface of the circuit board 105; an electrical connector is provided inside the cage 106 for connecting to an electrical interface (such as a gold finger) of an optical module. etc.); a radiator 107 is provided on the cage 106, and the radiator 107 has raised portions such as fins that increase the heat dissipation area.

The optical module 200 is inserted into the optical network terminal, the electrical interface of the optical module is inserted into the electrical connector inside the cage 106, and the optical interface of the optical module is connected to the optical fiber 101.

The cage 106 is located on the circuit board, and the electrical connectors on the circuit board are wrapped in the cage, so that the interior of the cage is provided with electrical connectors; the optical module is inserted into the cage, the optical module is fixed by the cage, and the heat generated by the optical module is conducted to the cage. 106 and then diffuse through a heat sink 107 on the cage.

FIG. 3 is a schematic structural diagram of an optical module according to an embodiment of the present disclosure. FIG. 4 is a schematic diagram of an exploded structure of an optical module provided by an embodiment of the present disclosure. As shown in FIGS. 3 and 4 , the optical module 200 provided by the embodiment of the present disclosure includes an upper casing 201 , a lower casing 202 , an unlocking part 203 , a circuit board 300 , a lens assembly 400 , and an optical fiber array 500 .

The upper casing 201 is closed on the lower casing 202 to form a wrapping cavity with two openings; the outer contour of the wrapping cavity generally presents a square body. Two side plates on both sides of the main board and perpendicular to the main board; the upper shell includes a cover plate, and the cover plate is covered with the two side plates of the upper shell to form a wrapping cavity; the upper shell can also include a cover The two side walls on both sides of the plate and the two side walls vertically arranged with the cover plate are combined with the two side plates to realize that the upper casing is covered on the lower casing.

One of the two openings is an electrical interface 204, and the golden fingers of the circuit board extend from the electrical interface 204 and are inserted into a host computer such as an optical network terminal; the other opening is an optical interface 205, which is used for connecting with an external optical fiber connector (external Optoelectronic devices such as the circuit board 300, the lens assembly 400 and the optical fiber array 500 are located in the package cavity.

The combination of the upper casing and the lower casing is adopted to facilitate the installation of the circuit board 300, the lens assembly 400 and the optical fiber array 50 into the casing, and the upper casing and the lower casing form the outermost package of the optical module Protective casing; the upper casing and the lower casing are generally made of metal materials, which are conducive to electromagnetic shielding and heat dissipation; generally, the casing of the optical module is not made into an integral part, and the integrated casing is not conducive to the assembly of the internal components of the casing .

The unlocking part 203 is located on the outer wall of the enclosing cavity/lower casing 202, and is used to realize the fixed connection between the optical module and the upper computer, or to release the fixed connection between the optical module and the upper computer.

The unlocking part 203 has an engaging part matched with the cage of the upper computer; pulling the end of the unlocking part can make the unlocking part move relatively on the surface of the outer wall; the optical module is inserted into the cage of the upper computer, and the optical module is moved by the engaging part of the unlocking part. It is fixed in the cage of the upper computer; by pulling the unlocking part, the engaging part of the unlocking part moves with it, thereby changing the connection relationship between the engaging part and the upper computer, so as to release the engaging relationship between the optical module and the upper computer, so that the The optical module is pulled out from the cage of the host computer.

The circuit board 300 is provided with a light-emitting chip LD, a driving chip LDD, a light-receiving chip PD, a transimpedance amplifying chip TIA, a limiting amplifying chip LA and a microprocessor chip MCU, wherein the light-emitting chip and the light-receiving chip are directly mounted on the circuit board 300 . On the circuit board of the optical module, this form is called COB (chip on board) package in the industry.

The circuit board connects the electrical components in the optical module according to the circuit design through the circuit wiring, so as to realize the electrical functions such as power supply, electrical signal transmission and grounding.

The circuit board is generally a rigid circuit board. Due to its relatively hard material, the rigid circuit board can also realize the bearing function. For example, the rigid circuit board can carry the chip smoothly; when the lens assembly is located on the circuit board, the rigid circuit board can also provide stable The rigid circuit board can also be inserted into the electrical connector in the upper computer cage. In some embodiments of the present disclosure, metal pins/gold fingers are formed on one end surface of the rigid circuit board for electrical connection with connector; these are inconvenient to implement with flexible circuit boards. A common rigid circuit board is a printed circuit board PCB.

Optical modules sometimes use flexible circuit boards as a supplement to rigid circuit boards; flexible circuit boards are generally used in conjunction with rigid circuit boards.

The lens assembly 400 is disposed on the circuit board 300, and is disposed above the optical chip in a cover-and-buckle manner (the optical chip mainly refers to the light emitting chip, the driving chip, the light receiving chip, the transimpedance amplifying chip, the limiting amplifying chip, etc.) Chips related to photoelectric conversion function), the lens assembly 400 and the circuit board 300 form a cavity for encapsulating optical chips such as light emitting chips and light receiving chips, and the lens assembly 400 and the circuit board 300 together form a structure for encapsulating the optical chips. The light emitted by the light emitting chip is reflected by the lens assembly 400 and then enters the fiber array 500. The light from the fiber array 500 is reflected by the lens assembly 400 and then enters the light receiving chip. The lens assembly establishes a mutual relationship between the light emitting chip and the fiber array. optical connection. The lens assembly not only acts to seal the optical chip, but also establishes the optical connection between the optical chip and the fiber array. The lens assembly 400 can be integrally formed using a polymer material through an injection molding process. In some embodiments of the present disclosure, the material of the lens assembly 400 includes PEI (Polyetherimide, polyetherimide) plastic (Ultem series) and other materials with good light transmittance. Since all the light beam propagation elements in the lens assembly 400 are formed of the same polymer material in a single piece, the molding die can be greatly reduced, and the manufacturing cost and complexity can be reduced. Meanwhile, the embodiment of the present disclosure only needs to adjust the positions of the incident light beam and the optical fiber based on the above-described structure of the lens assembly 400, and the installation and debugging are simple.

One end of the optical fiber array 500 establishes an optical connection with the lens assembly 400, and the other end establishes an optical connection with an external optical fiber connector (external optical fiber). The optical fiber array is composed of a plurality of optical fibers, which transmit the light from the lens assembly to the optical fiber adapter to send out optical signals, and transmit the light from the optical fiber adapter to the lens assembly to receive the optical signal from the outside of the optical module. There is a good optical coupling structure design between the optical fiber array and the lens assembly. The multi-channel converging light from the lens assembly is incident into the multi-channel optical fibers of the optical fiber array, and the optical connection with the light emission chip is realized by the optical structure of the lens assembly; The multi-path light of the optical fiber array is incident into the lens assembly, and the optical connection with the light receiving chip is realized by using the optical structure of the lens assembly. The optical fiber array and the lens assembly have a good fixed structure design, which can realize the relative fixation between the optical fiber array and the lens assembly, so that the lens assembly and the circuit board are relatively fixed, and the optical fiber array and the lens assembly are relatively fixed.

FIG. 5 is a schematic structural diagram of an upper casing provided by an embodiment of the present disclosure. FIG. 6 is a schematic structural diagram of a circuit board provided by an embodiment of the present disclosure. FIG. 7 is a schematic structural diagram of the circuit board of FIG. 6 rotated by 180°. FIG. 8 is a schematic structural diagram of an upper casing and a circuit board according to an embodiment of the present disclosure. FIG. 11 is a partial cross-sectional view of an optical module provided by an embodiment of the present disclosure. As shown in FIGS. 5-8 and 11 , in the embodiment of the present disclosure, the inner surface of the upper casing 201 is provided with first protrusions 2011 , the circuit board 300 is provided with signal lines 301 , and the upper surface of the circuit board 300 is provided with first protrusions 2011 . Copper foil 302 and gold fingers 303, and the first copper foil 302 is perpendicular to the gold fingers 303, and the lower surface of the circuit board 300 is also provided with a second copper foil 304. specific,

The first protrusion 2011 is disposed corresponding to the first copper foil 302 , the first end is connected to the inner surface of the upper casing 201 , and the second end is connected to the first copper foil 302 by a glue strip. The rubber strip is an elastic conductive rubber strip. The elastic conductive rubber strip can not only form an electromagnetic shielding cavity with the first protrusion 2011 and the first copper foil 302 , but also reduce the wear of the first protrusion 2011 and the first copper foil 302 . The upper casing 201 , the first protrusion 2011 , the first copper foil 302 and the circuit board 300 form an electromagnetic shielding cavity. Since the first copper foil 302 is disposed corresponding to the first protrusion 2011 , and the first copper foil 302 is perpendicular to the gold finger 303 , the first protrusion 2011 is also perpendicular to the gold finger 303 .

The length dimension of the first protrusion 2011 is equal to the width dimension of the circuit board 300 . When the length dimension of the first protrusion 2011 is larger or smaller than the width dimension of the circuit board 300 , even if there is a sealing connection between the first protrusion 2011 and the circuit board 300 , there is no connection between the upper casing 201 and the circuit board 300 . There is a gap, and the upper casing 201 and the circuit board 300 cannot form an electromagnetic shielding cavity.

The first protrusion 2011 and the upper casing 201 may be integrally formed, or they may be connected as a whole by welding.

The included angle between the first protrusion 2011 and the inner surface of the upper casing 201 may be 0-180°. For the convenience of manufacture, the included angle between the first protrusion 2011 and the inner surface of the upper casing 201 is set to 90°. The included angle between the first protrusion 2011 and the inner surface of the upper case 201 is 90°, which means that the first protrusion 2011 and the inner surface of the upper case 201 are perpendicular to each other. The first protrusions 2011 and the inner surface of the upper casing 201 are perpendicular to each other, which is convenient for the first protrusions 2011 and the upper casing 201 to be integrally formed, and also facilitates welding the first protrusions 2011 to the inner surface of the upper casing 201 .

Both the length and width of the first end of the first protrusion 2011 may be greater than the length and width of the second end of the first protrusion 2011, and the length and width of the first end of the first protrusion 2011 may be smaller than the first The length and width of the second end of the protrusion 2011 and the length and width of the first end of the first protrusion 2011 may be equal to the length and width of the second end of the first protrusion 2011 .

When the length and width of the first end of the first protrusion 2011 are greater than the length and width of the second end of the first protrusion 2011, the shape of the first protrusion 2011 is a trapezoid, wherein the first protrusion 2011 The first end of the first protrusion 2011 serves as the bottom surface of the trapezoid body, and the second end of the first protrusion 2011 serves as the top surface of the trapezoid body.

When the length and width of the first end of the first protrusion 2011 are both smaller than the length and width of the second end of the first protrusion 2011, the shape of the first protrusion 2011 is an inverted trapezoid, wherein the first protrusion The first end of 2011 serves as the top surface of the trapezoid body, and the first end of the first protrusion 2011 serves as the bottom surface of the trapezoid body.

When the length and width of the first end of the first protrusion 2011 are equal to the length and width of the second end of the first protrusion 2011 , the shape of the first protrusion 2011 is a cuboid or a cube. The end of the signal line 301 away from the first copper foil 302 is placed on the surface of the circuit board 300 , and the end close to the first copper foil 302 is placed inside the circuit board 300 and extends along the interior of the circuit board 300 through the first copper foil 302 is electrically connected to the gold finger 303 . Specifically, the surface of the circuit board 300 is provided with a through hole, and the signal line 301 can be electrically connected to the gold finger 303 along the through hole. One end of the signal line 301 away from the first copper foil 302 is connected to the lens assembly 400 , and the other end of the signal line 301 is connected to the gold finger 303 through a through hole. The signal line 301 connected to the lens assembly 400 is first placed on the upper surface of the circuit board 300 . When approaching the first copper foil 302 , the signal line 301 is buried inside the circuit board 300 , and the signal line 301 is no longer placed on the upper surface of the circuit board 300 . The signal line 301 extends along the interior of the circuit board 300 and crosses the portion of the circuit board 300 under the first copper foil 302 , and is connected to the gold finger 303 through a through hole. The signal line 301 is buried inside the circuit board 300 when it is close to the first copper foil 302 , and extends along the interior of the circuit board 300 , and is not placed on the upper surface of the circuit board 300 to reduce leakage of electromagnetic radiation.

The first copper foil 302 and the gold finger 303 are both located at one end of the circuit board 300 , perpendicular to the gold finger 303 , corresponding to the first protrusion 2011 , and electrically connected to the second end of the first protrusion 2011 . Specifically, since the gold finger 303 is located at the electrical port of the optical module 200 , the first copper foil 302 , which is both located at one end of the circuit board 300 with the gold finger 303 , is also located at the electrical port of the optical module 200 . The first copper foil 302 is perpendicular to the gold finger 303, the first copper foil 302 is arranged corresponding to the first protrusion 2011, the first copper foil 302 is electrically connected to the second end of the first protrusion 2011, and the upper case 201, The first protrusion 2011, the first copper foil 302 and the circuit board 300 form an electromagnetic shielding cavity to further reduce leakage of electromagnetic radiation.

The length dimension of the first copper foil 302 is equal to the width dimension of the circuit board 300 . When the length dimension of the first copper foil 302 is smaller than the width dimension of the circuit board 300 , the circuit board 300 corresponding to the first copper foil 302 is notched, and the first copper foil 302 and the circuit board 300 cannot form an electromagnetic shielding board.

The length dimension of the first protrusion 2011 and the first copper foil 302 is equal to the width dimension of the circuit board 300 .

The gold finger 303 is located at the electrical port of the optical module 200 . The host computer 100 reads the electrical signal of the optical module on the golden finger 303 , or transmits the electrical signal to the optical module 200 through the golden finger 303 .

In order to make the first protrusion 2011 and the first copper foil 302 form an electromagnetic shielding plate, in the embodiment of the present disclosure, the length and width of the second end of the first protrusion 2011 are respectively the same as the length and width of the first copper foil 302 match. When the length dimension of the second end of the first bump 2011 is equal to the length dimension of the first copper foil 302 , the first bump 2011 and the first copper foil 302 form an electromagnetic shielding plate. When the length dimension of the second end of the first bump 2011 is smaller than the length dimension of the first copper foil 302 , the first bump 2011 and the first copper foil 302 form a structural board with a gap. When the length dimension of the second end of the first bump 2011 is greater than the length dimension of the first copper foil 302 , the first bump 2011 and the first copper foil 302 also form a structural board with a gap. Among them, the structural plate with a gap cannot be an electromagnetic shielding plate.

The second copper foil 304 and the first copper foil 302 are respectively placed on both sides of the circuit board.

FIG. 9 is a schematic structural diagram of a lower casing according to an embodiment of the present disclosure. FIG. 10 is a schematic structural diagram of a circuit board and a lower casing according to an embodiment of the present disclosure. As shown in FIGS. 9-11 , in the embodiment of the present disclosure, the optical module 200 further includes a second protrusion 2021 . specific,

The first end of the second protrusion 2021 is connected to the inner surface of the lower case 202 , and is disposed corresponding to the second copper foil 304 , and the second end and the second copper foil 304 are connected by a glue strip. specific,

The length and width dimensions of the second ends of the second protrusions 2021 are matched with the length and width dimensions of the second copper foil 304, respectively. When the length dimension of the second end of the second bump 2021 is equal to the length dimension of the second copper foil 304 , the second bump 2021 and the second copper foil 304 form an electromagnetic shielding plate. When the length dimension of the second end of the second bump 2021 is smaller than the length dimension of the second copper foil 304 , the second bump 2021 and the second copper foil 304 form a structural board with a gap. When the length dimension of the second end of the second bump 2021 is greater than the length dimension of the second copper foil 304 , the second bump 2021 and the second copper foil 304 also form a structural board with a gap.

The second protrusions 2021 and the first protrusions 2011 are placed on two sides of the circuit board 300 respectively, and both are connected to the copper foil on the circuit board 300 by adhesive strips. 202 forms an electromagnetic shielding cavity to further reduce electromagnetic radiation.

The rubber strip is an elastic conductive rubber strip. The elastic conductive rubber strip can not only form an electromagnetic shielding cavity with the second protrusion 2021 and the second copper foil 304 , but also can reduce the wear of the second protrusion 2021 and the second copper foil 304 .

The present disclosure provides an optical module including an upper casing and a circuit board. The upper shell and the lower shell form a wrapping cavity. The circuit board is placed in the package cavity. The inner surface of the upper casing is provided with a first protrusion. The first protrusion, the first end of which is connected with the inner surface of the upper casing. The circuit board is provided with signal lines, and the upper surface is provided with first copper foil and gold fingers. One end of the signal line far away from the first copper foil is placed on the surface of the circuit board, and one end close to the first copper foil is placed inside the circuit board, and extends along the interior of the circuit board through the first copper foil and is electrically connected to the gold finger. The first copper foil and the gold fingers are both located at one end of the circuit board, are perpendicular to the gold fingers, are arranged corresponding to the first protrusions, and are electrically connected to the second ends of the first protrusions. In the present disclosure, the upper surface of the circuit board is provided with the first copper foil, the first copper foil is perpendicular to the gold finger, and the end of the signal line close to the first copper foil is buried inside the circuit board, which reduces the leakage of electromagnetic radiation; the upper case The first protrusion on the inner surface of the body is electrically connected to the first copper foil, so that the upper casing and the circuit board form an electromagnetic shielding cavity, which further reduces the leakage of electromagnetic radiation, thereby solving the problem of EMI exceeding the standard.

FIG. 12 is a schematic structural diagram of an upper casing 201 in an optical module according to an embodiment of the disclosure, and FIG. 13 is another angular structural schematic diagram of the upper casing 201 in an optical module according to an embodiment of the disclosure. As shown in FIG. 12 and FIG. 13 , the upper casing 201 is provided with a first supporting plate 2011 and a groove, the first supporting plate 2011 is disposed adjacent to the groove, and the first supporting plate 2011 is disposed on the main body of the upper casing 201 Between the circuit board 300 and the circuit board 300 , it is used to support and fix the circuit board 300 . In the embodiment of the present disclosure, the first support plate 2011 and the groove are parallel to each other, and are disposed along the width direction of the upper casing 201 .

In some embodiments of the present disclosure, the first support plate 2011 can divide the main body of the upper casing 201 into a first part and a second part, the second part is located above the gold fingers on the circuit board 300 , and the groove is provided on the upper casing The second part of the body 201 is used for reflection and attenuation of the electromagnetic waves conducted on the circuit board 300 .

The upper casing 201 may be provided with at least two grooves, the first support plate 2011 is disposed in parallel with the at least two grooves, and the at least two grooves are disposed on the same side of the first support plate 2011 . The electromagnetic waves generated by the optoelectronic devices on the circuit board 300 can be conducted from the gap between the first support plate 2011 and the circuit board 300, and the conducted electromagnetic waves enter the grooves of the upper casing 201, and the electromagnetic waves are reflected in the grooves. Change the propagation direction of the electromagnetic wave to reduce the energy of the electromagnetic wave; then the electromagnetic wave enters another groove, and continues to reflect in the other groove to further reduce the energy of the electromagnetic wave. In this way, the electromagnetic waves conducted to the outside of the optical module can be reduced, so as to avoid electromagnetic interference caused by the electromagnetic waves to other communication devices outside the optical module.

Likewise, the golden finger connector connected with the golden finger also generates electromagnetic waves, and the electromagnetic waves can also be conducted into the optical module from the gap between the first support plate 2011 and the circuit board 300 . In the embodiment of the present disclosure, the electromagnetic wave generated by the gold finger connector enters the groove of the upper casing 201, and the electromagnetic wave is reflected in the groove to change the propagation direction of the electromagnetic wave and reduce the energy of the electromagnetic wave; then the electromagnetic wave enters another groove, Reflection continues in another groove, further reducing the electromagnetic energy. In this way, the electromagnetic waves conducted to the inside of the optical module can be reduced, and the electromagnetic interference of the electromagnetic waves to the optoelectronic devices inside the optical module can be avoided.

FIG. 14 is a partial cross-sectional schematic diagram of an optical module according to an embodiment of the present disclosure, and FIG. 15 is an enlarged schematic diagram of part A in FIG. 14 . As shown in FIG. 14 and FIG. 15 , a first groove 2012 and a second groove 2013 can be provided on the upper casing 201 . The first support plate 2011 , the first groove 2012 and the second groove 2013 are arranged in parallel, and the A side surface of a groove 2012 may be the same side surface as a side surface of the first support plate 2011 , that is, the first groove 2012 and the first support plate 2011 share the same side surface.

The first groove 2012 and the second groove 2013 are spaced apart, and a baffle plate is disposed between the first groove 2012 and the second groove 2013 . In some embodiments of the present disclosure, one side of the baffle is the same side as the other side of the first groove 2012 , and the other opposite side of the baffle is the same side as one side of the second groove 2013 . That is, among the two opposite sides of the baffle, one side is shared with the first groove 2012 , and the other side is shared with the second groove 2013 .

In the embodiment of the present disclosure, according to the size of the optical module and the gold fingers on the circuit board 300, the groove width of the first groove 2012 and the second groove 2013 on the upper casing 201 may be 0.6-1 mm, and the first groove The width of the baffle plate between the groove 2012 and the second groove 2013 may be 0.6-1 mm. In this way, after the electromagnetic wave is reflected in the first groove 2012, the reflected electromagnetic wave easily enters the second groove 2013, and continues to reflect in the second groove 2013, further reducing the energy of the electromagnetic wave.

When the electromagnetic wave generated by the optoelectronic device on the circuit board 300 is conducted through the gap between the first support plate 2011 and the circuit board 300, the radiation angle of the electromagnetic wave can spread in all directions; or the electromagnetic wave generated by the gold finger connector enters the optical module. , the radiation angle of the electromagnetic wave also has multiple directions. In order to allow the electromagnetic waves to enter the first groove 2012 as much as possible, the depth of the first groove 2012 should be a preset depth to accommodate more electromagnetic waves. Similarly, the depth of the second groove 2013 should also be a preset depth, so that the reflected electromagnetic waves can enter the second groove 2013 as much as possible. In the embodiment of the present disclosure, the preset depths of the first groove 2012 and the second groove 2013 may both be 0.6˜2 mm.

In order to separate the first groove 2012 and the second groove 2013, the depth of the baffle between the first groove 2012 and the second groove 2013 can also be 0.6-2 mm, so as to prevent the baffle from blocking the input from the first groove 2012 to the second groove 2013. The electromagnetic waves of the two grooves 2013.

In the embodiment of the present disclosure, the depths of the first grooves 2012 and the second grooves 2013 are not limited to the preset depths, and the preset depths of the first grooves 2012 and the second grooves 2013 can also be reasonably selected according to the actual situation. All belong to the protection scope of the embodiments of the present disclosure.

Since the first groove 2012 and the second groove 2013 are both disposed along the width direction of the upper casing 201, and the first groove 2012 and the second groove 2013 are used to reflect the electromagnetic waves conducted by the circuit board 300, the first groove The dimensions of the 2012 and the second groove 2013 may be equal to or slightly larger than the width dimension of the circuit board 300 , so as to receive as many electromagnetic waves conducted by the circuit board 300 as possible. In the embodiment of the present disclosure, considering the size of the upper casing 201 and the circuit board 300 , the size of the first groove 2012 and the second groove 2013 may be 12.8 mm×0.9 mm.

In the optical module provided by the embodiment of the present disclosure, a first support plate and at least two grooves are arranged on the upper casing, the grooves and the first support plate are arranged in parallel, and the first support plate is arranged on the main body of the upper casing and the circuit board between them to support the circuit board; one end of the circuit board is provided with a gold finger, the groove is arranged above the gold finger, and the gold finger and the first support plate are located on both sides of the groove, so that the photoelectric devices on the circuit board generate After the electromagnetic wave is conducted through the gap between the first support plate and the circuit board, the electromagnetic wave enters the groove and is reflected in the groove, changing the propagation direction of the electromagnetic wave, thereby reducing the output of the electromagnetic wave and preventing the electromagnetic wave from being transmitted to the optical module. Externally, it will cause electromagnetic interference to other communication equipment. In addition, the electromagnetic wave generated by the gold finger connector can also be reflected in the groove to reduce the electromagnetic wave, prevent the electromagnetic wave from entering the interior of the optical module, and avoid electromagnetic interference to the optoelectronic devices inside the optical module. In the present disclosure, at least two grooves are arranged on the upper casing to reflect the electromagnetic waves from the inside of the optical module or the gold finger connector, which changes the propagation direction of the electromagnetic waves and reduces the output of the electromagnetic waves. Electromagnetic shielding is performed to improve the electromagnetic shielding performance of the optical module.

For the electromagnetic wave shielding at the electrical port of the optical module is a weak part of the EMI design of the optical module, the embodiment of the present disclosure also provides an optical module, the optical module is provided with a groove on the lower casing, and the groove is set below the gold finger, The electromagnetic wave conducted by the gap at the electrical port of the optical module is injected into the groove and reflected in the groove, which can reduce the electromagnetic wave output, avoid electromagnetic interference from electromagnetic waves to other communication equipment, and improve the electromagnetic shielding performance of the optical module.

In some embodiments of the present disclosure, the lower case 202 is provided with a second support plate and a groove, the second support plate is disposed adjacent to the groove, and the second support plate is disposed on the main body of the lower case 202 and the circuit board 300 between, for supporting and fixing the circuit board 300 . In this example, the second support plate and the groove are parallel to each other, and both are disposed along the width direction of the lower case 202 .

At least two grooves may be provided on the lower casing 202 , the second support plate is disposed in parallel with the at least two grooves, and the at least two grooves are disposed on the same side of the second support plate. The electromagnetic waves generated by the optoelectronic devices on the circuit board 300 can be conducted from the gap between the second support plate and the circuit board 300, and the conducted electromagnetic waves enter the grooves of the lower casing 202, and the electromagnetic waves are reflected in the grooves, changing the The propagation direction of the electromagnetic wave reduces the energy of the electromagnetic wave; then the electromagnetic wave enters another groove, and continues to reflect in the other groove, further reducing the energy of the electromagnetic wave. In this way, electromagnetic waves conducted to the outside of the optical module can be reduced, and electromagnetic waves can be prevented from causing electromagnetic interference to other communication devices outside the optical module.

Likewise, the golden finger connector connected with the golden finger also generates electromagnetic waves, and the electromagnetic waves can also be conducted into the optical module from the gap between the second support plate and the circuit board 300 . In the embodiment of the present disclosure, the electromagnetic wave generated by the gold finger connector enters the groove of the lower casing 202, and the electromagnetic wave is reflected in the groove to change the propagation direction of the electromagnetic wave and reduce the energy of the electromagnetic wave; then the emitted electromagnetic wave enters another The groove continues to reflect in another groove, further reducing the energy of the electromagnetic wave. In this way, the electromagnetic waves conducted to the inside of the optical module can be reduced, and the electromagnetic interference of the electromagnetic waves to the optoelectronic devices inside the optical module can be avoided.

In some embodiments of the present disclosure, the lower casing 202 may be provided with a third groove and a fourth groove, the second support plate, the third groove and the fourth groove may be disposed in parallel, and one of the third grooves may be arranged in parallel. The side surface and the side surface of the second support plate may be the same side surface, that is, the third groove and the second support plate share the same side surface.

The third groove and the fourth groove are arranged at intervals, and a baffle plate is arranged between the third groove and the fourth groove. In some embodiments of the present disclosure, one side surface of the baffle is the same side surface as the other side surface of the third groove, and the other side surface opposite to the baffle plate is the same side surface as the one side surface of the fourth groove. That is, among the two opposite sides of the baffle, one side is shared with the third groove, and the other side is shared with the fourth groove.

In the embodiment of the present disclosure, according to the size of the optical module and the gold fingers on the circuit board 300 , the groove widths of the third groove and the fourth groove on the lower case 202 may be 0.6-1 mm, and the third groove and the The width of the baffle plate between the fourth grooves may be 0.6˜1 mm. In this way, after the electromagnetic wave is reflected in the first groove 2012, the reflected electromagnetic wave easily enters the second groove 2013, and continues to reflect in the second groove 2013, further reducing the energy of the electromagnetic wave.

When the electromagnetic wave generated by the optoelectronic device on the circuit board 300 is conducted through the gap between the second support plate and the circuit board 300, the radiation angle of the electromagnetic wave can be spread in all directions; or when the electromagnetic wave generated by the gold finger connector enters the inside of the optical module , the radiation angle of electromagnetic waves also has multiple directions. In order to allow the electromagnetic waves to enter the third groove as much as possible, the depth of the third groove should be a preset depth to accommodate more electromagnetic waves. Similarly, the depth of the fourth groove should also be a preset depth, so that the reflected electromagnetic waves can enter the fourth groove as much as possible. In the embodiment of the present disclosure, the preset depths of the third groove and the fourth groove may both be 0.6-2 mm.

In order to separate the third groove and the fourth groove, the depth of the baffle between the third groove and the fourth groove can also be 0.6-2mm, so as to prevent the baffle from blocking the electromagnetic waves input into the fourth groove from the third groove .

In the embodiment of the present disclosure, the depths of the third groove and the fourth groove are not limited to the preset depths, and the preset depths of the third groove and the fourth groove can also be reasonably selected according to the actual situation, all of which belong to the present disclosure Scope of protection of the embodiments.

Since the third groove and the fourth groove are both disposed along the width direction of the lower casing 202 , and the third groove and the fourth groove are used to reflect the electromagnetic waves conducted by the circuit board 300 , the third groove and the fourth groove are The size of the slot may be equal to or slightly larger than the width size of the circuit board 300 to receive as many electromagnetic waves conducted by the circuit board 300 as possible. In the embodiment of the present disclosure, considering the size of the lower case 202 and the circuit board 300, the size of the third groove and the fourth groove may be 12.8 mm×0.9 mm.

In the optical module provided by the embodiment of the present disclosure, a second support plate and at least two grooves are arranged on the lower casing, the grooves and the second support plate are arranged in parallel, and the second support plate is arranged between the main body of the lower casing and the circuit board , to support the circuit board; one end of the circuit board is provided with a gold finger, the groove is arranged below the gold finger, and the gold finger and the second support plate are located on both sides of the groove, so that the electromagnetic waves generated by the optoelectronic devices on the circuit board are generated. , after being conducted through the gap between the second support plate and the circuit board, the electromagnetic wave enters the groove and is reflected in the groove, changing the propagation direction of the electromagnetic wave, thereby reducing the output of the electromagnetic wave and preventing the electromagnetic wave from being transmitted to the outside of the optical module. Causes electromagnetic interference to other communication equipment. In addition, the electromagnetic wave generated by the gold finger connector can also be reflected in the groove to reduce the electromagnetic wave, prevent the electromagnetic wave from entering the interior of the optical module, and avoid electromagnetic interference to the optoelectronic devices inside the optical module. In the present disclosure, at least two grooves are arranged on the upper casing to reflect the electromagnetic waves from the inside of the optical module or the gold finger connector, which changes the propagation direction of the electromagnetic waves and reduces the output of the electromagnetic waves. Electromagnetic shielding is performed to improve the electromagnetic shielding performance of the optical module.

In the application embodiments, grooves can be provided on the upper casing or the lower casing to reflect the electromagnetic waves from the inside of the optical module or the gold finger connector, change the propagation direction of the electromagnetic waves, reduce the output of the electromagnetic waves, and improve the performance of the optical module. Electromagnetic shielding performance. However, considering the size of the optical module, it is not suitable to provide grooves for reducing electromagnetic waves on the upper casing and the lower casing respectively.

Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present disclosure, but not to limit them; although the present disclosure has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that: it can still be Modifications are made to the technical solutions described in the foregoing embodiments, or some technical features thereof are equivalently replaced; and these modifications or replacements do not make the essence of the corresponding technical solutions depart from the spirit and scope of the technical solutions of the embodiments of the present disclosure.

Claims (17)

1. An optical module, characterized in that it includes:

   The upper shell and the lower shell form a wrapping cavity;

   a circuit board, placed in the package cavity;

   The inner surface of the upper casing is provided with a first protrusion;

   the first protrusion, the first end is connected with the inner surface of the upper casing;

   The circuit board is provided with a signal line, and the upper surface is provided with a first copper foil and a gold finger;

   The signal line, one end away from the first copper foil is placed on the surface of the circuit board, and one end close to the first copper foil is placed inside the circuit board, and along the interior of the circuit board extending through the first copper foil and electrically connected to the gold finger;

   The first copper foil and the gold finger are both located at one end of the circuit board, perpendicular to the gold finger, corresponding to the first protrusion, and electrically connected to the second end of the first protrusion. connect.
2. The optical module according to claim 1, wherein the first copper foil is electrically connected to the second end of the first protrusion through a rubber strip.
3. The optical module according to claim 2, wherein the rubber strip is an elastic conductive rubber strip.
4. The optical module according to claim 1, wherein the length dimension of the first protrusion and the first copper foil is equal to the width dimension of the circuit board.
5. The optical module according to claim 1, wherein the length and width of the second end of the first protrusion are respectively matched with the length and width of the first copper foil.
6. The optical module according to claim 1, further comprising a second copper foil;

   The second copper foil is located on the lower surface of the circuit board, and is placed on both sides of the circuit board with the first copper foil.
7. The optical module according to claim 6, further comprising a second protrusion;

   The first end of the second protrusion is connected to the inner surface of the lower casing, and is disposed correspondingly to the second copper foil, and the second end is electrically connected to the second copper foil through an adhesive strip.
8. The optical module according to claim 7, wherein the length and width of the second end of the second protrusion are respectively matched with the length and width of the second copper foil.
9. An optical module, characterized in that it includes:

   lower shell;

   The upper casing is covered with the lower casing to form a cavity; a first support plate and a groove are arranged on the upper casing, and the groove is arranged adjacent to the first support plate;

   The circuit board is arranged in the cavity, the first support plate is arranged between the circuit board and the main body of the upper casing; one end of the circuit board is provided with a gold finger, and the groove is arranged at the bottom of the gold finger. above, and the gold finger and the first support plate are respectively located on two sides of the groove.
10. The optical module according to claim 9, wherein at least two grooves are formed on the upper casing, the first support plate is arranged in parallel with the at least two grooves, and at least two of the grooves are arranged in parallel. The grooves are arranged on the same side of the first support plate.
11. The optical module according to claim 10, wherein a first groove and a second groove are arranged in parallel on the upper casing, and a side surface of the first groove is connected to a side of the first support plate. One side is the same side; a baffle is arranged between the first groove and the second groove.
12. The optical module according to claim 11, wherein one side of the baffle is the same side as the other side of the first groove, and the other side opposite to the baffle is the same as the second side. One side of the groove is the same side.
13. The optical module according to claim 11, wherein the widths of the first groove and the second groove are both 0.6-1 mm.
14. The optical module according to claim 12, wherein the width of the baffle is 0.6-1 mm.
15. The optical module according to claim 14, wherein the baffle has a depth of 0.6-2 mm.
16. The optical module according to claim 9, wherein the depth of the groove is 0.6-2 mm.
17. The optical module according to claim 9, wherein the size of the groove is 12.8 mm×0.9 mm.

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