WO2022036875A1 - 一种发声装置模组 - Google Patents

一种发声装置模组 Download PDF

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Publication number
WO2022036875A1
WO2022036875A1 PCT/CN2020/127367 CN2020127367W WO2022036875A1 WO 2022036875 A1 WO2022036875 A1 WO 2022036875A1 CN 2020127367 W CN2020127367 W CN 2020127367W WO 2022036875 A1 WO2022036875 A1 WO 2022036875A1
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WO
WIPO (PCT)
Prior art keywords
sound
diaphragm
magnet
device module
accommodating groove
Prior art date
Application number
PCT/CN2020/127367
Other languages
English (en)
French (fr)
Inventor
王琪忠
牟宗君
Original Assignee
歌尔股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 歌尔股份有限公司 filed Critical 歌尔股份有限公司
Priority to US18/042,052 priority Critical patent/US20230328425A1/en
Publication of WO2022036875A1 publication Critical patent/WO2022036875A1/zh

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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/20—Arrangements for obtaining desired frequency or directional characteristics
    • H04R1/22—Arrangements for obtaining desired frequency or directional characteristics for obtaining desired frequency characteristic only 
    • H04R1/24—Structural combinations of separate transducers or of two parts of the same transducer and responsive respectively to two or more frequency ranges
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R9/00—Transducers of moving-coil, moving-strip, or moving-wire type
    • H04R9/06—Loudspeakers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/02—Casings; Cabinets ; Supports therefor; Mountings therein
    • H04R1/025—Arrangements for fixing loudspeaker transducers, e.g. in a box, furniture
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R7/00—Diaphragms for electromechanical transducers; Cones
    • H04R7/02—Diaphragms for electromechanical transducers; Cones characterised by the construction
    • H04R7/04—Plane diaphragms
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R7/00—Diaphragms for electromechanical transducers; Cones
    • H04R7/16—Mounting or tensioning of diaphragms or cones
    • H04R7/18—Mounting or tensioning of diaphragms or cones at the periphery
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R7/00—Diaphragms for electromechanical transducers; Cones
    • H04R7/16—Mounting or tensioning of diaphragms or cones
    • H04R7/24—Tensioning by means acting directly on free portions of diaphragm or cone
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R9/00—Transducers of moving-coil, moving-strip, or moving-wire type
    • H04R9/02—Details
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R9/00—Transducers of moving-coil, moving-strip, or moving-wire type
    • H04R9/02—Details
    • H04R9/025—Magnetic circuit
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R9/00—Transducers of moving-coil, moving-strip, or moving-wire type
    • H04R9/02—Details
    • H04R9/04—Construction, mounting, or centering of coil
    • H04R9/045—Mounting
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R9/00—Transducers of moving-coil, moving-strip, or moving-wire type
    • H04R9/06—Loudspeakers
    • H04R9/063—Loudspeakers using a plurality of acoustic drivers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/20—Arrangements for obtaining desired frequency or directional characteristics
    • H04R1/32—Arrangements for obtaining desired frequency or directional characteristics for obtaining desired directional characteristic only
    • H04R1/34—Arrangements for obtaining desired frequency or directional characteristics for obtaining desired directional characteristic only by using a single transducer with sound reflecting, diffracting, directing or guiding means
    • H04R1/345—Arrangements for obtaining desired frequency or directional characteristics for obtaining desired directional characteristic only by using a single transducer with sound reflecting, diffracting, directing or guiding means for loudspeakers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2209/00—Details of transducers of the moving-coil, moving-strip, or moving-wire type covered by H04R9/00 but not provided for in any of its subgroups
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2400/00—Loudspeakers
    • H04R2400/11—Aspects regarding the frame of loudspeaker transducers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2499/00—Aspects covered by H04R or H04S not otherwise provided for in their subgroups
    • H04R2499/10—General applications
    • H04R2499/11—Transducers incorporated or for use in hand-held devices, e.g. mobile phones, PDA's, camera's

Definitions

  • the application belongs to the technical field of acoustic-electrical conversion, and in particular, the application relates to a sound-generating device module.
  • the sound-emitting device module As the core component of sound-emitting devices such as home audio, car audio and electronic equipment, the sound-emitting device module is widely used in electronic products.
  • the product quality of the sound device module itself directly affects the sound quality.
  • the development trend of electronic products tends to be thinner and smaller. For example, most mobile phone manufacturers will set the mobile phone thinner and thinner. Therefore, the volume of each electronic component in the corresponding mobile phone will be correspondingly compressed.
  • this structural design requirement will seriously affect the acoustic performance of the sounding device module, resulting in the defect that the acoustic performance cannot meet the sound quality requirements.
  • the purpose of this application is to provide an improved sounding device module.
  • a sounding device module provided by this application includes:
  • Basin frame the basin frame is fixedly arranged in the cavity, the opposite sides of the basin frame are respectively provided with a high-pitched sounding unit and a bass sounding unit, and the high-pitched sounding unit and the bass sounding unit share the cavity ;
  • a baffle plate is provided on one side of the casing corresponding to the high-pitched sound-emitting unit, and the baffle plate cooperates with the casing to form a side sound outlet corresponding to the high-pitched sound-emitting unit;
  • the sound-generating device module is configured to form a positive sound-emitting structure for the bass sound-generating unit.
  • the edge of the basin frame is bent and extended in the opposite direction of the baffle to form a first accommodating groove, and at least a part of the structure of the bass sounding unit is arranged in the first accommodating groove;
  • a through hole is opened in the middle of the basin frame, the side wall of the through hole is bent and extended toward the baffle to form a second accommodating groove, and at least a part of the high-pitched sounding unit is arranged in the second accommodating groove.
  • the bass sounding unit includes a first magnet, a first coil and a first diaphragm, the first magnet is fixed on the bottom of the first receiving groove, and the first diaphragm is arranged on the On the casing on the opposite side of the opening of the first accommodating slot, a first magnetic gap is set between the first magnet and the slot wall of the first accommodating slot, and the first coil and the first vibrating film connected, the first coil is located in the first magnetic gap;
  • the high-pitched sounding unit includes a second magnet, a second coil and a second diaphragm, the second magnet is arranged in the second accommodating groove and is fixed on the first magnet, and the second diaphragm is arranged On the casing on the opposite side of the opening of the second accommodating slot, a second magnetic gap is provided between the second magnet and the slot wall of the second accommodating slot, and the second coil and the first The two diaphragms are connected, and the second coil is located in the second magnetic gap.
  • the casing is provided with a first sound outlet hole corresponding to the opening position of the first accommodating slot, and the first diaphragm is covered on the first sound outlet hole;
  • the casing is provided with a second sound outlet hole corresponding to the opening position of the second accommodating slot, and the second diaphragm is covered on the second sound outlet hole;
  • the area of the first sound outlet is larger than the area of the second sound outlet.
  • the edges of the first vibrating film and the second vibrating film are fixed on the housing;
  • the position of the first diaphragm close to the edge of the first sound outlet is recessed into the cavity to form a first ring;
  • the position of the second diaphragm close to the edge of the second sound outlet is recessed into the chamber to form a second ring;
  • a first reinforcing plate and a second reinforcing plate are respectively fixed on the first vibrating film and the second vibrating film.
  • a first washer is provided on the side of the first magnet facing the first diaphragm
  • a second washer is disposed on the side of the second magnet facing the second diaphragm.
  • the edge of the basin frame is bent and extended in the opposite direction of the baffle to form a third accommodating groove, and at least a part of the structure of the bass sounding unit is arranged in the third accommodating groove;
  • An installation hole is opened in the middle of the basin frame, and at least a part of the structure of the high-pitched sound generating unit is disposed in the third accommodating groove through the installation hole.
  • the bass sounding unit includes a third magnet, a third coil and a third diaphragm, the third magnet is annularly fixed on the bottom of the third receiving slot, and the third magnet is connected to the third accommodating slot.
  • a third magnetic gap is provided between the groove walls of the third accommodating slot, the third coil is connected to the third diaphragm, and the third coil is located in the third magnetic gap;
  • the high-pitched sounding unit package includes a fourth magnet, a fourth coil and a fourth diaphragm, the fourth magnet is arranged in the center of the third magnet in a columnar shape through the mounting hole, and the fourth magnet is connected to the center of the third magnet.
  • a fourth magnetic gap is formed between the third magnets, the fourth diaphragm is arranged on the casing corresponding to the side of the baffle plate, the fourth coil is connected to the fourth diaphragm, and the fourth diaphragm is Four coils are located within the fourth magnetic gap.
  • a third washer is disposed on the side of the third magnet facing the opening of the third accommodating slot, and the fourth magnet is fixed on the third washer.
  • the casing is provided with a third sound outlet hole corresponding to the opening position of the third accommodating groove, and the third diaphragm is covered on the third sound outlet hole;
  • a fourth sound outlet hole is opened on the side opposite to the third sound outlet hole on the casing, and the fourth diaphragm is covered on the fourth sound outlet hole;
  • the area of the third sound outlet is larger than the area of the fourth sound outlet.
  • the sound-generating device module provided by the present application makes full use of the space occupied by its overall structure, and the volume inside the sound-generating device module is reduced by sharing the basin frame with the high-pitched sound-generating unit and the bass sound-generating unit.
  • Fig. 1 is the side sectional schematic diagram of a kind of sounding device module provided by the specific embodiment of the present application;
  • FIG. 2 is a schematic side cross-sectional view of another sounding device module provided by the specific embodiment of the present application.
  • This application provides a sound device module, comprising:
  • the housing 1 has a chamber inside the housing 1 .
  • the cavity of the casing 1 is the rear sound cavity of the sounding device module.
  • the basin frame 2 the basin frame 2 is fixedly arranged in the chamber, and the opposite sides of the basin frame 2 are respectively provided with a treble sounding unit 5 and a bass sounding unit 4, the treble sounding unit 5 and the bass sounding unit 4 Units 4 share the chamber.
  • the high-pitched sounding unit 5 and the bass sounding unit 4 are arranged on the same basin frame 2 in opposite directions, which can greatly reduce the volume of the sounding device module.
  • a baffle 6 is provided on the side of the casing 1 corresponding to the high-pitched sound-emitting unit 5 , and the baffle 6 cooperates with the casing 1 to change the sound-emitting direction of the high-pitched sound-emitting unit 5 .
  • the baffle 6 cooperates with the casing 1 so that the sound generating device module forms a side sound outlet for the high-pitched sound generating unit 5, so that the sound generated by the vibration can be transmitted from the side.
  • the sound generating device module may configure a positive sound output structure for the bass sound generating unit 4, so that the sound of the bass sound generating unit 4 can be transmitted from the front.
  • the sound producing directions of the high-pitched sound generating unit 5 and the bass sounding unit 4 are perpendicular to each other.
  • the sound output direction of the high-pitched sound-emitting unit 5 is changed to be perpendicular to the sound-emitting direction of the bass sound-emitting unit 4 through the baffle 6, which can meet the requirements of different products on the sound output position. need.
  • the edge of the basin frame 2 is bent and extended in the opposite direction of the baffle plate 6 to form a first accommodating groove 21 , and part of the bass sounding unit 4 is disposed in the first accommodating groove 21 .
  • a through hole can be opened in the middle of the basin frame 2, and the side wall of the through hole is bent and extended toward the baffle 6 to form a second accommodating groove 22, and at least a part of the high-pitched sounding unit 5 is arranged in the structure. into the second accommodating groove 22 .
  • the bass sounding unit 4 includes a first magnet 41 , a first coil 42 and a first diaphragm 43 , the first magnet 41 is fixed on the bottom of the first receiving slot 21 , and the first The diaphragm 43 is disposed on the casing 1 on the opposite side of the opening of the first accommodating groove 21 , and a first magnetic gap 44 is provided between the first magnet 41 and the groove wall of the first accommodating groove 21 .
  • the first coil 42 is connected to the first diaphragm 43
  • the first coil 42 is connected to the first diaphragm 43
  • the first coil 42 is located in the first magnetic gap 44 .
  • Fixing the first magnet 41 at the bottom of the first accommodating groove 21 can ensure the stability of the first magnet 41, and can further reduce the volume of the internal structure of the sounding device module and reduce the volume of the sounding device module.
  • a first magnetic gap 44 is formed between the first magnet 41 and the slot wall of the first accommodating slot 21. After the first coil 42 disposed in the first magnetic gap 44 is energized, the moving charges are subjected to the Lorentz force in the magnetic field. , the first coil 42 vibrates to convert electrical energy into mechanical energy, thereby driving the diaphragm to vibrate to generate sound.
  • the tweeter unit 5 includes a second magnet 51 , a second coil 52 and a second diaphragm 53 , the second magnet 51 is disposed in the second accommodating slot 22 and fixed to the first On the magnet 41 , the second diaphragm 53 is disposed on the casing 1 on the opposite side of the opening of the second accommodating groove 22 , between the second magnet 51 and the groove wall of the second accommodating groove 22 .
  • a second magnetic gap 54 is provided, the second coil 52 is connected to the second diaphragm 53 , and the second coil 52 is located in the second magnetic gap 54 .
  • the second magnet 51 is directly fixed on the top surface of the first magnet 41, and is disposed in the second accommodating groove 22 in the opposite direction to the first magnet 41. At this time, the high sound transmitted through the second diaphragm 53 is different from that transmitted through the first diaphragm 53.
  • the bass direction from the membrane 43 is opposite.
  • the baffle 6 can be set to be detachable, and a ring-shaped installation position is provided on the side of the casing 1 corresponding to the tweeter unit 5, and the baffle 6 can be installed In different positions, the sound output direction of the high-pitched sounding unit 5 can be manually adjusted, which is suitable for more electronic devices without redesigning the structure of the sounding device module, which is more versatile and further reduces costs.
  • the casing 1 is provided with a first sound outlet hole 11 corresponding to the opening position of the first accommodating groove 21, and the first diaphragm 43 covers the first sound outlet hole 11; the casing 1.
  • a second sound outlet hole 12 is formed corresponding to the opening position of the second accommodating groove 22 , and the second diaphragm 53 covers the second sound outlet hole 12 .
  • the sound of the first diaphragm 43 and the second diaphragm 53 is transmitted from the sound outlet during the vibration process.
  • the area of the first sound outlet hole 11 is larger than the area of the second sound outlet hole 12 .
  • the area of the first sound hole 11 needs to be larger than the area of the second sound hole 12, correspondingly
  • the area of the first diaphragm 43 is also larger than the area of the second diaphragm 53 .
  • the shapes of the first sound outlet hole 11 and the second sound outlet hole 12 are not specifically limited, and may be circular, round waist-shaped or other holes that can meet the sound output requirements.
  • the first sound hole 11 and the second sound hole 12 share a cavity, and the diameter of the first sound hole 11 is larger than The diameter of the second sound outlet 12 ensures that the sound coming out of the first sound outlet 11 is low pitch, and the sound coming out of the second sound outlet 12 is high pitch, which satisfies the integrity of each sound range of the sound generating device module.
  • the edges of the first vibrating membrane 43 and the second vibrating membrane 53 are fixed on the housing 1;
  • the cavity is recessed to form a first folded ring 431 ;
  • the position of the second diaphragm 53 close to the edge of the second sound outlet 12 is recessed into the cavity to form a second folded ring 531 .
  • the first voice coil and the second voice coil are energized, the current moves in the first magnetic gap 44 and the second magnetic gap 54 respectively, the first voice coil and the second voice coil vibrate and drive the first diaphragm 43 and the second diaphragm
  • the diaphragm 53 vibrates, and the first and second rings 431 and 531 are used to prevent the first diaphragm 43 and the second diaphragm 53 from being pulled and damaged during the vibration process, or the vibration amplitude is not enough, resulting in treble and bass. does not meet the requirements.
  • the first folded ring 431 and the second folded ring 531 provide a larger margin for the vibration of the first diaphragm 43 and the second diaphragm 53, so that the sounding device is The sound of the group is more fidelity.
  • the magnetic field strength can improve the sensitivity and amplitude of the vibration of the diaphragm, thereby improving the acoustic performance of the sound-generating device module.
  • the magnetic field strength is increased mainly by increasing the magnetism and volume of the first magnet 41 and the second magnet 51 .
  • the overall size of the sounding device module is often fixed and cannot be arbitrarily increased, which results in that the first magnet 41 and the second magnet 51 with limited volumes may not be able to generate a strong enough magnetic field, and cannot Achieving the desired acoustic performance.
  • the volume of the first magnet 41 and the second magnet 51 can be further increased on the premise that the overall volume of the sounding device module remains unchanged, so as to achieve the required acoustic performance.
  • the volume of the sound-emitting device module can be further reduced, and correspondingly, it can be adapted to more electronic devices, or the volume of the electronic device can be further reduced.
  • a first reinforcing plate 45 and a second reinforcing plate 55 are respectively fixed on the first vibrating film 43 and the second vibrating film 53 .
  • the first reinforcing plate 45 and the second reinforcing plate 55 are disposed on the first diaphragm 43 and the second diaphragm 53 respectively, the diaphragm can be restrained by a comprehensive and reliable balance, and the diaphragm can be polarized and tilted. The possibility of vibration is greatly reduced.
  • a first washer is disposed on the side of the first magnet 41 facing the first diaphragm 43 ; a first washer is disposed on the side of the second magnet 51 facing the second diaphragm 53 .
  • Erhua Division Thereby, the possibility of polarization caused by the unbalanced driving force of the whole vibration assembly is reduced.
  • the magnetic field strength and magnetic field uniformity at the magnetic gap are further improved by the first washer and the second washer, and a uniform and higher-strength magnetic field is formed in the magnetic gap. This enables the first voice coil and the second voice coil to receive an improved magnetic field in each area along the circumferential direction thereof, thereby improving the acoustic performance of the sound generating device module.
  • the edge of the basin frame 2 is bent and extended in the opposite direction of the baffle plate 6 to form a third accommodating groove 3 , and at least a part of the bass sounding unit 4 is structurally arranged in the third accommodating groove 3 .
  • the side of the basin frame 2 facing the third diaphragm 49 is provided with a third accommodating groove 3, and the treble sounding unit 5 and the bass sounding unit 4 are jointly arranged in the third accommodating groove 3, which further reduces the amount of space occupied by the basin frame 2. space, thereby reducing the volume of the sound-emitting device module, so that the sound-emitting device module can be adapted to thinner electronic equipment.
  • the bass sounding unit 4 includes a third magnet 47, a third coil 48 and a third diaphragm 49, the third magnet 47 is annularly fixed on the bottom of the third receiving slot 3, the A third magnetic gap 40 is provided between the third magnet 47 and the slot wall of the third receiving slot 3 , the third coil 48 is connected to the third diaphragm 49 , and the third coil 48 is located in the Inside the third magnetic gap 40; wherein the third magnet 47 is an annular structure with a transparent middle, the third magnetic gap 40 is arranged between the slot wall of the third receiving slot 3 and the side wall of the third magnet 47, and passes through the third coil
  • the vibration generated by 48 drives the third diaphragm 49 to vibrate, so as to realize the sound of the bass sounding unit 4 .
  • the treble sounding unit package 5 includes a fourth magnet 57, a fourth coil 58 and a fourth diaphragm 59, and the fourth magnet 57 is arranged in the center of the third magnet 47 in a columnar shape through the mounting hole, A fourth magnetic gap 50 is formed between the fourth magnet 57 and the third magnet 47 , the fourth diaphragm 59 is disposed on the casing corresponding to the side of the baffle 6 , and the fourth coil 58 Connected to the fourth diaphragm 59 , the fourth coil 58 is located in the fourth magnetic gap 50 .
  • the fourth magnet 57 passes through the center of the third magnet 47 and forms a fourth magnetic gap 50 with the inner ring of the third magnet 47.
  • the vibration of the fourth coil 58 drives the vibration of the fourth diaphragm 59, thereby realizing
  • the high-pitched sounding unit 5 produces sound and has a very compact structure, which further compresses the internal space of the sounding device module, reduces the volume of the sounding device module, and enables the sounding device module to be applied to more electronic devices with smaller volumes.
  • a third washer 7 is provided on the side of the third magnet 47 facing the opening of the third accommodating slot 3 , and the fourth magnet 57 is fixed on the third washer 7 .
  • the third washer 7 is fixed in the chamber by the third magnet 47, provides a fixed position for the fourth magnet 57, and can guide the magnetic lines of the third magnet 47 and the fourth magnet 57 at the same time, so that the third The voice coil and the fourth voice coil can receive an improved magnetic field in each area along the circumferential direction thereof, thereby improving the acoustic performance of the sound generating device module.
  • the casing 1 is provided with a third sound outlet hole corresponding to the opening position of the third accommodating groove 3, and the third diaphragm 49 is covered on the third sound outlet hole;
  • a fourth sound hole is opened on the opposite side of the third sound hole, and the fourth diaphragm 59 covers the fourth sound hole;
  • the area of the third sound hole is larger than that of the fourth sound hole The area of the sound hole.
  • the area of the third sound hole needs to be larger than that of the fourth sound hole.
  • the area of the three diaphragms 49 is also larger than that of the fourth diaphragm 59 .
  • the shapes of the third sound outlet hole and the fourth sound outlet hole are not specifically limited, and may be circular, round waist-shaped, or other holes that can meet the sound output requirements. Only the third and fourth sound holes are circular sound holes as an example.
  • the third sound hole and the fourth sound hole share a cavity, and the diameter of the third sound hole is larger than that of the fourth sound hole.
  • the diameter of the 3rd sound outlet ensures that the sound from the third sound hole is low and the sound from the fourth sound hole is high frequency, and at the same time, it satisfies the integrity of each sound range of the sound device module.
  • corresponding folding rings and corresponding reinforcing plates may also be provided on the third diaphragm 49 and the fourth diaphragm 59 to improve the acoustic performance.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Multimedia (AREA)
  • Health & Medical Sciences (AREA)
  • Otolaryngology (AREA)
  • Details Of Audible-Bandwidth Transducers (AREA)
  • Audible-Bandwidth Dynamoelectric Transducers Other Than Pickups (AREA)

Abstract

本申请公开了一种发声装置模组，包括：外壳，所述外壳内具有腔室；盆架，所述盆架固定设置于所述腔室内，所述盆架相对的两侧分别设置有高音发声单元和低音发声单元，所述高音发声单元和所述低音发声单元共用所述腔室；所述外壳对应所述高音发声单元一侧设置有挡板，所述挡板与所述外壳配合形成对应于所述高音发声单元的侧出声口；所述发声装置模组被配置为对所述低音发声单元形成正出声结构。本申请提供的发声装置模组充分利用了其整体结构占用的空间，通过高音发声单元和低音发声单元共用盆架，减小了发声装置模组内部的体积。

Description

一种发声装置模组 技术领域
本申请属于声电转换技术领域，具体地，本申请涉及一种发声装置模组。
背景技术
发声装置作为一种人们平时娱乐消遣的设备，随着人们对生活质量的要求越来越高，对发声装置也提出了越来越高的要求。
发声装置模组作为家用音响、车载音响和电子设备等发声装置的核心部件，其广泛应用于电子产品中。发声装置模组本身的产品质量直接影响着发声的品质。近年来电子产品的发展趋势倾向于轻薄化、小型化，例如大部分手机厂家都会将手机设置的越来越薄，因此，相应的手机中的各个电子元器件的体积也会相应被压缩，然而，这种结构设计要求会严重影响发声装置模组的声学性能，造成声学性能无法满足音质要求的缺陷。
因此，有必要对发声装置模组的结构进行改进，在有限的空间中优化结构，以优化声学性能。
发明内容
本申请的目的是提供一种改进的发声装置模组。
本申请提供的一种发声装置模组，包括：
外壳，所述外壳内具有腔室；
盆架，所述盆架固定设置于所述腔室内，所述盆架相对的两侧分别设置有高音发声单元和低音发声单元，所述高音发声单元和所述低音发声单元共用所述腔室；
所述外壳对应所述高音发声单元一侧设置有挡板，所述挡板与所述外壳配合形成对应于所述高音发声单元的侧出声口；
所述发声装置模组被配置为对所述低音发声单元形成正出声结构。
可选地，所述盆架的边缘向所述挡板相反方向弯折延伸形成第一容纳槽，所述低音发声单元的至少一部分结构设置于所述第一容纳槽内；
所述盆架的中部开设有通孔，所述通孔的侧壁向所述挡板方向弯折延伸形成第二容纳槽，所述高音发声单元的至少一部分结构设置于所述第二容纳槽内。
可选地，所述低音发声单元包括第一磁铁、第一线圈和第一振膜，所述第一磁铁固定于所述第一容纳槽的槽底，所述第一振膜设置于所述第一容纳槽开口相对一侧的所述外壳上，所述第一磁铁与所述第一容纳槽的槽壁之间设置有第一磁间隙，所述第一线圈与所述第一振膜连接，所述第一线圈位于所述第一磁间隙内；
所述高音发声单元包括第二磁铁、第二线圈和第二振膜，所述第二磁铁设置于所述第二容纳槽内并固定于所述第一磁铁上，所述第二振膜设置于所述第二容纳槽开口相对一侧的所述外壳上，所述第二磁铁与所述第二容纳槽的槽壁之间设置有第二磁间隙，所述第二线圈与所述第二振膜连接，所述第二线圈位于所述第二磁间隙内。
可选地，所述外壳对应所述第一容纳槽的开口位置开设有第一出声孔，所述第一振膜覆盖于所述第一出声孔上；
所述外壳对应所述第二容纳槽的开口位置开设有第二出声孔，所述第二振膜覆盖于所述第二出声孔上；
所述第一出声孔的面积大于所述第二出声孔的面积。
可选地，所述第一振膜和所述第二振膜的边缘固定于所述外壳上；
所述第一振膜靠近所述第一出声孔边缘的位置向所述腔室内凹陷形成第一折环；
所述第二振膜靠近所述第二出声孔边缘的位置向所述腔室内凹陷形成第二折环；
所述第一振膜和所述第二振膜上分别固定有第一补强板和第二补强板。
可选地，所述第一磁铁上朝向所述第一振膜的一侧设置有第一华司；
所述第二磁铁上朝向所述第二振膜的一侧设置有第二华司。
可选地，所述盆架的边缘向所述挡板相反方向弯折延伸形成第三容纳槽，所述低音发声单元的至少一部分结构设置于所述第三容纳槽内；
所述盆架的中部开设有安装孔，所述高音发声单元的至少一部分结构穿过所述安装孔设置于所述第三容纳槽内。
可选地，所述低音发声单元包括第三磁铁、第三线圈和第三振膜，所述第三磁铁呈环形固定于所述第三容纳槽的槽底，所述第三磁铁与所述第三容纳槽的槽壁之间设置有第三磁间隙，所述第三线圈与所述第三振膜连接，所述第三线圈位于所述第三磁间隙内；
所述高音发声单元包包括第四磁铁、第四线圈和第四振膜，所述第四磁铁呈柱状穿过所述安装孔设置于所述第三磁铁的中心位置，所述第四磁铁与所述第三磁铁之间形成有第四磁间隙，所述第四振膜设置于对应所述挡板一侧的外壳上，所述第四线圈与所述第四振膜连接，所述第四线圈位于所述第四磁间隙内。
可选地，所述第三磁铁朝向所述第三容纳槽开口的一侧设置有第三华司，所述第四磁铁固定于所述第三华司上。
可选地，所述外壳对应所述第三容纳槽的开口位置开设有第三出声孔，所述第三振膜覆盖于所述第三出声孔上；
所述外壳上与所述第三出声孔相对一侧开设有第四出声孔，所述第四振膜覆盖于所述第四出声孔上；
所述第三出声孔的面积大于所述第四出声孔的面积。
本申请提供的发声装置模组充分利用了其整体结构占用的空间，通过高音发声单元和低音发声单元共用盆架，减小了发声装置模组内部的体积。
通过以下参照附图对本申请的示例性实施例的详细描述，本申请的其它特征及其优点将会变得清楚。
附图说明
被结合在说明书中并构成说明书的一部分的附图示出了本申请的实施例，并且连同其说明一起用于解释本申请的原理。
图1是本申请具体实施方式提供的一种发声装置模组的侧面剖视示意图；
图2是本申请具体实施方式提供的另一种发声装置模组的侧面剖视示意图。
附图标记：
1、外壳；11、第一出声孔；12、第二出声孔；2、盆架；21、第一容纳槽；22、第二容纳槽；3、第三容纳槽；4、低音发声单元；41、第一磁铁；42、第一线圈；43、第一振膜；431、第一折环；44、第一磁间隙；45、第一补强板；46、第一华司；47、第三磁铁；48、第三线圈；49、第三振膜；40、第三磁间隙；5、高音发声单元；51、第二磁铁；52、第二线圈；53、第二振膜；531、第二折环；54、第二磁间隙；55、第二补强板；56、第二华司；57、第四磁铁；58、第四线圈；59、第四振膜；50、第四磁间隙；6、挡板；7、第三华司。
具体实施方式
现在将参照附图来详细描述本申请的各种示例性实施例。应注意到：除非另外具体说明，否则在这些实施例中阐述的部件和步骤的相对布置、数字表达式和数值不限制本申请的范围。
以下对至少一个示例性实施例的描述实际上仅仅是说明性的，决不作为对本申请及其应用或使用的任何限制。
对于相关领域普通技术人员已知的技术、方法和设备可能不作详细讨论，但在适当情况下，所述技术、方法和设备应当被视为说明书的一部分。
在这里示出和讨论的所有例子中，任何具体值应被解释为仅仅是示例性的，而不是作为限制。因此，示例性实施例的其它例子可以具有不同的值。
应注意到：相似的标号和字母在下面的附图中表示类似项，因此，一旦某一项在一个附图中被定义，则在随后的附图中不需要对其进行进一步讨论。
本申请提供了本申请提供了一种发声装置模组，包括：
外壳1，所述外壳1内具有腔室。所述外壳1的的腔室为发声装置模组的后音腔。
盆架2，所述盆架2固定设置于所述腔室内，所述盆架2相对的两侧分别设置有高音发声单元5和低音发声单元4，所述高音发声单元5和所述低音发声单元4共用所述腔室。通常由于盆架2体积较大容易占用过多的模组内部空间，相应的需要将模组体积做大，才能够保证音质不被损坏。所以为了进一步缩小发声装置模组的体积，将高音发声单元5和低音发声单元4朝向相反地设置在同一个盆架2上，能够大大减小发声装置模组的体积。
所述外壳1对应所述高音发声单元5一侧设置有挡板6，所述挡板6与所述外壳1配合改变所述高音发声单元5的出声方向。所述挡板6与外壳1配合使得发声装置模组对高音发声单元5形成侧出声口，使其振动产生的声音能够从侧面传出。可选地，所述发声装置模组可以对低音发声单元4配置正出声结构，使得低音发声单元4的声音能够从正面传出。例如，所述高音发声单元5和所述低音发声单元4的出声方向相垂直。为了满足更多电子设备的不同的出声孔位置，将高音发声单元5的出声方向通过挡板6改变至与低音发声单元4的出声方向垂直，能够满足不同的产品对出声位置的需求。
可选地，所述盆架2的边缘向所述挡板6相反方向弯折延伸形成第一容纳槽21，部分所述低音发声单元4设置于所述第一容纳槽21内。
所述盆架2的中部可以开设有通孔，所述通孔的侧壁向所述挡板6方向弯折延伸形成第二容纳槽22，所述高音发声单元5的至少一部分结构设置于所述第二容纳槽22内。
可选地，所述低音发声单元4包括第一磁铁41、第一线圈42和第一振膜43，所述第一磁铁41固定于所述第一容纳槽21的槽底，所述第一振膜43设置于所述第一容纳槽21开口相对一侧的所述外壳1上，所述第一磁铁41与所述第一容纳槽21的槽壁之间设置有第一磁间隙44，所述第一线圈42与所述第一振膜43连接，所述第一线圈42与所述第一振膜43连接，所述第一线圈42位于所述第一磁间隙44内。将第一磁铁41固定在第 一容纳槽21的槽底，能够保证第一磁铁41的稳定性，也能够进一步减小发声装置模组内部结构的体积，减小发声装置模组的体积。第一磁铁41和第一容纳槽21的槽壁之间形成有第一磁间隙44，设置在第一磁间隙44内的第一线圈42通电后，运动的电荷在磁场中受到洛伦兹力，第一线圈42产生振动，实现将电能转化为机械能，从而带动振膜振动产生声音。
可选地，所述高音发声单元5包括第二磁铁51、第二线圈52和第二振膜53，所述第二磁铁51设置于所述第二容纳槽22内并固定于所述第一磁铁41上，所述第二振膜53设置于所述第二容纳槽22开口相对一侧的所述外壳1上，所述第二磁铁51与所述第二容纳槽22的槽壁之间设置有第二磁间隙54，所述第二线圈52与所述第二振膜53连接，所述第二线圈52位于所述第二磁间隙54内。第二磁铁51直接固定于第一磁铁41的顶面，且与第一磁铁41朝向相反的设置于第二容纳槽22内，此时通过第二振膜53传出的高音与通过第一振膜43传出的低音方向相反。
同时通过挡板6对高音出声方向的改变，可以实现将后出声改变为侧出声。为了适配于更多的电子设备，具体的可以将挡板6设置为可拆卸的，并在外壳1上对应高音发声单元5的一侧设置有环状的安装位，可以将挡板6安装在不同位置，使高音发声单元5的出声方向能够手动调节，适配于更多的电子设备而不用重新设计发声装置模组的结构，更加通用，进一步降低成本。
可选地，所述外壳1对应所述第一容纳槽21的开口位置开设有第一出声孔11，所述第一振膜43覆盖于所述第一出声孔11上；所述外壳1对应所述第二容纳槽22的开口位置开设有第二出声孔12，所述第二振膜53覆盖于所述第二出声孔12上。具体的，第一振膜43和第二振膜53在振动过程中声音从出声孔处传出。
可选地，所述第一出声孔11的面积大于所述第二出声孔12的面积。为了保证发声装置模组高音的甜美通透以及低音的澎湃和震撼，需要对高音和低音作出明显的区分，所以，第一出声孔11的面积需要大于第二出声孔12的面积，相应的第一振膜43的面积也大于第二振膜53的面积。具体的，第一出声孔11和第二出声孔12的形状不做具体限定，可以为圆形、 圆腰形或其它能够满足出声要求的孔。仅以第一出声孔11和第二出声孔12为圆形出声孔为例，第一出声孔11和第二出声孔12共用腔室，第一出声孔11的直径大于第二出声孔12的直径，保证第一出声孔11中传出的声音为低音，第二出声孔12中传出的声音为高音，满足发声装置模组各个音域的完整。
可选地，所述第一振膜43和所述第二振膜53的边缘固定于所述外壳1上；所述第一振膜43靠近所述第一出声孔11边缘的位置向所述腔室内凹陷形成第一折环431；所述第二振膜53靠近所述第二出声孔12边缘的位置向所述腔室内凹陷形成第二折环531。在第一音圈和第二音圈通电后，电流分别在第一磁间隙44和第二磁间隙54内运动，第一音圈和第二音圈振动并带动第一振膜43和第二振膜53振动，而第一折环431和第二折环531则是为了避免在振动过程中第一振膜43和第二振膜53被拉扯损坏，或是振动幅度不够，导致高音和低音达不到要求。当第一线圈42和第二线圈52振动时，第一折环431和第二折环531为第一振膜43和第二振膜53的振动提供了更大的余量，使发声装置模组的声音更加保真。
通常而言，增大磁场强度就能够提高振膜振动的灵敏度和振幅，进而提高发声装置模组的声学性能。增大磁场强度主要通过增大第一磁铁41和第二磁铁51的磁性以及体积。但是，在实际的产品需求中，发声装置模组的整体尺寸往往是固定的，不能随意增大，这就造成体积有限的第一磁铁41和第二磁铁51可能无法产生足够强的磁场，无法实现需要达到的声学性能。所以，通过低音发声单元4和高音发声单元5共用同一盆架2，能够保证发声装置模组整体体积不变的前提下第一磁铁41和第二磁铁51体积进一步增大，从而达到要求的声学性能。或是能够进一步减小发声装置模组的体积，相应的也就能够适配于更多的电子设备，或是将电子设备的体积进一步缩小。
可选地，所述第一振膜43和所述第二振膜53上分别固定有第一补强板45和第二补强板55。在第一振膜43和第二振膜53振动的过程中，由于振膜为软质材料，所以会随着振动频率的改变，导致声学性能的损失。所以通过在第一振膜43和第二振膜53上分别设置第一补强板45和第二补 强板55，使振膜能够受到全面、可靠的平衡限制作用，振膜产生偏振、倾斜振动的可能性大幅降低。
可选地，所述第一磁铁41上朝向所述第一振膜43的一侧设置有第一华司；所述第二磁铁51上朝向所述第二振膜53的一侧设置有第二华司。从而降低整个振动组件因驱动力不均衡而产生的偏振的可能性。通过第一华司和第二华司进一步提高磁间隙处的磁场强度和磁场均匀性，在磁间隙中形成均匀、强度更高的磁场。使得第一音圈和第二音圈在沿其圆周方向上的各个区域都能够接收到改善的磁场，进而提高发声装置模组的声学性能。
可选地，如图2所示，所述盆架2的边缘向所述挡板6相反方向弯折延伸形成第三容纳槽3，所述低音发声单元4的至少一部分结构设置于所述第三容纳槽3内；所述盆架2的中部开设有安装孔，所述高音发声单元5的至少一部分结构穿过所述安装孔设置于所述第三容纳槽3内。盆架2朝向第三振膜49的一侧设置第三容纳槽3，并将高音发声单元5和低音发声单元4共同设置于第三容纳槽3内，进一步减小了盆架2所占用的空间，从而减小发声装置模组的体积，使发声装置模组能够适配于更薄的电子设备内。
可选地，所述低音发声单元4包括第三磁铁47、第三线圈48和第三振膜49，所述第三磁铁47呈环形固定于所述第三容纳槽3的槽底，所述第三磁铁47与所述第三容纳槽3的槽壁之间设置有第三磁间隙40，所述第三线圈48与所述第三振膜49连接，所述第三线圈48位于所述第三磁间隙40内；其中第三磁铁47为中部通透的环形结构，第三磁间隙40设置于第三容纳槽3的槽壁和第三磁铁47的侧壁之间，通过第三线圈48产生振动带动第三振膜49振动，实现低音发声单元4的发声。
所述高音发声单元包5包括第四磁铁57、第四线圈58和第四振膜59，所述第四磁铁57呈柱状穿过所述安装孔设置于所述第三磁铁47的中心位置，所述第四磁铁57与所述第三磁铁47之间形成有第四磁间隙50，所述第四振膜59设置于对应所述挡板6一侧的外壳上，所述第四线圈58与所述第四振膜59连接，所述第四线圈58位于所述第四磁间隙50内。第四磁 铁57穿过第三磁铁47中心位置，并与第三磁铁47的内环之间形成第四磁间隙50，通过第四线圈58的振动，带动第四振膜59的振动，从而实现高音发声单元5的发声，且结构十分紧凑，进一步压缩发声装置模组内部空间，减小发声装置模组的体积，使发声装置模组能够应用于更多的体积较小的电子设备中。
可选地，所述第三磁铁47朝向所述第三容纳槽3开口的一侧设置有第三华司7，所述第四磁铁57固定于所述第三华司7上。第三华司7通过第三磁铁47固定在腔室内，同时为第四磁铁57提供安装固定的位置，且能够同时对第三磁铁47和第四磁铁57的磁感线进行引导，使得第三音圈和第四音圈在沿其圆周方向上的各个区域都能够接收到改善的磁场，进而提高发声装置模组的声学性能。
可选地，所述外壳1对应所述第三容纳槽3的开口位置开设有第三出声孔，所述第三振膜49覆盖于所述第三出声孔上；所述外壳上与所述第三出声孔相对一侧开设有第四出声孔，所述第四振膜59覆盖于所述第四出声孔上；所述第三出声孔的面积大于所述第四出声孔的面积。为了保证发声装置模组高音的甜美通透以及低音的澎湃和震撼，需要对高音和低音作出明显的区分，所以，第三出声孔的面积需要大于第四出声孔的面积，相应的第三振膜49的面积也大于第四振膜59的面积。具体的，第三出声孔和第四出声孔的形状不做具体限定，可以为圆形、圆腰形或其它能够满足出声要求的孔。仅以第三出声孔和第四出声孔为圆形出声孔为例，第三出声孔和第四出声孔共用腔室，第三出声孔的直径大于第四出声孔的直径，保证第三出声孔中传出的声音为低音，第四出声孔中传出的声音为高音，同时满足发声装置模组各个音域的完整。
同样的对应第三振膜49和第四振膜59上也可以设置相应的折环以及相应的补强板来提升声学性能。
虽然已经通过例子对本申请的一些特定实施例进行了详细说明，但是本领域的技术人员应该理解，以上例子仅是为了进行说明，而不是为了限制本申请的范围。本领域的技术人员应该理解，可在不脱离本申请的范围和精神的情况下，对以上实施例进行修改。本申请的范围由所附权利要求 来限定。

Claims (10)

  1. 一种发声装置模组，其特征在于，包括：
    外壳(1)，所述外壳(1)内具有腔室；
    盆架(2)，所述盆架(2)固定设置于所述腔室内，所述盆架(2)相对的两侧分别设置有高音发声单元(5)和低音发声单元(4)，所述高音发声单元(5)和所述低音发声单元(4)共用所述腔室；
    所述外壳(1)对应所述高音发声单元(5)一侧设置有挡板(6)，所述挡板(6)与所述外壳(1)配合形成对应于所述高音发声单元(5)的侧出声口；
    所述发声装置模组被配置为对所述低音发声单元(4)形成正出声结构。
  2. 根据权利要求1所述的发声装置模组，其特征在于，所述盆架(2)的边缘向所述挡板(6)相反方向弯折延伸形成第一容纳槽(21)，所述低音发声单元(4)的至少一部分结构设置于所述第一容纳槽(21)内；
    所述盆架(2)的中部开设有通孔，所述通孔的侧壁向所述挡板(6)方向弯折延伸形成第二容纳槽(22)，所述高音发声单元(5)的至少一部分结构设置于所述第二容纳槽(22)内。
  3. 根据权利要求2所述的发声装置模组，其特征在于，所述低音发声单元(4)包括第一磁铁(41)、第一线圈(42)和第一振膜(43)，所述第一磁铁(41)固定于所述第一容纳槽(21)的槽底，所述第一振膜(43)设置于所述第一容纳槽(21)开口相对一侧的所述外壳(1)上，所述第一磁铁(41)与所述第一容纳槽(21)的槽壁之间设置有第一磁间隙(44)，所述第一线圈(42)与所述第一振膜(43)连接，所述第一线圈(42)位于所述第一磁间隙(44)内；
    所述高音发声单元(5)包括第二磁铁(51)、第二线圈(52)和第二振膜(53)，所述第二磁铁(51)设置于所述第二容纳槽(22)内并固定于所述第一磁铁(41)上，所述第二振膜(53)设置于所述第二容纳槽(22)开口相对一侧的所述外壳(1)上，所述第二磁铁(51)与所述第二 容纳槽(22)的槽壁之间设置有第二磁间隙(54)，所述第二线圈(52)与所述第二振膜(53)连接，所述第二线圈(52)位于所述第二磁间隙(54)内。
  4. 根据权利要求3所述的发声装置模组，其特征在于，所述外壳(1)对应所述第一容纳槽(21)的开口位置开设有第一出声孔(11)，所述第一振膜(43)覆盖于所述第一出声孔(11)上；
    所述外壳(1)对应所述第二容纳槽(22)的开口位置开设有第二出声孔(12)，所述第二振膜(53)覆盖于所述第二出声孔(12)上；
    所述第一出声孔(11)的面积大于所述第二出声孔(12)的面积。
  5. 根据权利要求4所述的发声装置模组，其特征在于，所述第一振膜(43)和所述第二振膜(53)的边缘固定于所述外壳(1)上；
    所述第一振膜(43)靠近所述第一出声孔(11)边缘的位置向所述腔室内凹陷形成第一折环(431)；
    所述第二振膜(53)靠近所述第二出声孔(12)边缘的位置向所述腔室内凹陷形成第二折环(531)；
    所述第一振膜(43)和所述第二振膜(53)上分别固定有第一补强板(45)和第二补强板(55)。
  6. 根据权利要求3所述的发声装置模组，其特征在于，所述第一磁铁(41)上朝向所述第一振膜(43)的一侧设置有第一华司；
    所述第二磁铁(51)上朝向所述第二振膜(53)的一侧设置有第二华司。
  7. 根据权利要求1所述的发声装置模组，其特征在于，所述盆架(2)的边缘向所述挡板(6)相反方向弯折延伸形成第三容纳槽(3)，所述低音发声单元(4)的至少一部分结构设置于所述第三容纳槽(3)内；
    所述盆架(2)的中部开设有安装孔，所述高音发声单元(5)的至少一部分结构穿过所述安装孔设置于所述第三容纳槽(3)内。
  8. 根据权利要求7所述的发声装置模组，其特征在于，所述低音发声单元(4)包括第三磁铁(47)、第三线圈(48)和第三振膜(49)，所述第三磁铁(47)呈环形固定于所述第三容纳槽(3)的槽底，所述第三磁铁 (47)与所述第三容纳槽(3)的槽壁之间设置有第三磁间隙(40)，所述第三线圈(48)与所述第三振膜(49)连接，所述第三线圈(48)位于所述第三磁间隙(40)内；
    所述高音发声单元包(5)包括第四磁铁(57)、第四线圈(58)和第四振膜(59)，所述第四磁铁(57)呈柱状穿过所述安装孔设置于所述第三磁铁(47)的中心位置，所述第四磁铁(57)与所述第三磁铁(47)之间形成有第四磁间隙(50)，所述第四振膜(59)设置于对应所述挡板一侧的外壳上，所述第四线圈(58)与所述第四振膜(59)连接，所述第四线圈(58)位于所述第四磁间隙(50)内。
  9. 根据权利要求8所述的发声装置模组，其特征在于，所述第三磁铁(47)朝向所述第三容纳槽(3)开口的一侧设置有第三华司(7)，所述第四磁铁(57)固定于所述第三华司(7)上。
  10. 根据权利要求8所述的发声装置模组，其特征在于，所述外壳(1)对应所述第三容纳槽(3)的开口位置开设有第三出声孔，所述第三振膜(49)覆盖于所述第三出声孔上；
    所述外壳上与所述第三出声孔相对一侧开设有第四出声孔，所述第四振膜(59)覆盖于所述第四出声孔上；
    所述第三出声孔的面积大于所述第四出声孔的面积。
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