WO2022030942A1 - Conductive foam tape for attaching display panel - Google Patents

Abstract

A conductive foam tape for attaching a display panel sequentially comprises: a first adhesive layer, which is a conductive adhesive layer; a metal deposition layer; a foam layer; and a second adhesive layer, and comprises a thermoplastic polyurethane (TPU) film layer between the metal deposition layer and the foam layer or between the foam layer and the second adhesive layer. A display apparatus comprising the tape, and a method using the tape are disclosed.

Description

Conductive foam tape for attaching display panels

The present disclosure provides a conductive foam tape for attaching a display panel, a display panel to which the conductive foam tape is attached, a display device including the conductive foam tape, a method for attaching a display panel to a frame using the conductive foam tape, and the It relates to a method of manufacturing a display device using a conductive foam tape.

BACKGROUND Liquid crystal displays (LCDs) are used in a variety of devices, including consumer electronic devices such as computer monitors, cell phones, and LCD televisions. The width of the bezel around liquid crystal displays (LCDs) in many consumer electronic devices is narrowing for both functional, visual and aesthetic reasons.

In the past, LCD panels were fixedly attached within a rigid frame. However, due to the demand for display devices with narrow bezels and thin overalls, manufacturers are increasingly able to design thinner devices by fixing the display panel to the middle frame through adhesive foam tape, rather than using a rigid frame. . As shown in FIG. 1 , by attaching the display panel 10 to the frame 30 using an adhesive foam tape 20 to manufacture a display device, a thin and narrow bezel display device can be manufactured.

Such an adhesive foam tape usually includes a porous foam to prevent direct stress from being transmitted to a liquid crystal panel or the like. In addition, the adhesive foam tape is used in the form of a double-sided tape including a material having adhesive properties.

The adhesive foam tape is manually attached to the display panel during the manufacturing process of the actual display device. Accordingly, in the process of attaching the tape, it may occur frequently that the tape is not well attached to the correct position at a time. If the tape is attached incorrectly, the tape must be removed from the panel and then reattached to the panel. Oftentimes, the tape breaks or a residue of the tape remains on the panel when the improperly attached tape is removed from the panel. Accordingly, there is a need for a tape that does not break easily and leaves no residue when removed, that is, an adhesive foam tape with high re-workability.

Meanwhile, the display device is necessarily subjected to an electrostatic discharge (ESD) test after manufacturing. At this time, if the panel is not sealed or a conductive tape is not attached to the back of the panel, the panel will be damaged in the electrostatic discharge test. Therefore, the conventional display manufacturing process requires a separate cumbersome sealing process or a process of attaching a conductive tape, which is a separate component, to the panel in addition to the adhesive foam tape.

In the present specification, a conductive foam tape for attaching a display panel, a display panel to which the conductive foam tape is attached, a display device including the conductive foam tape, a method for attaching a display panel to a frame using the conductive foam tape, and the A method of manufacturing a display device using a conductive foam tape is disclosed.

Disclosed is a conductive foam tape for attaching a display panel, the tape comprising: a first adhesive layer that is a conductive adhesive layer; metal deposition layer; foam layer; and a second pressure-sensitive adhesive layer, and a thermoplastic polyurethane (TPU) film layer between the metal deposition layer and the foam layer, or between the foam layer and the second pressure-sensitive adhesive layer.

In the present specification, a display panel to which the conductive foam tape is attached is disclosed.

In the present specification, a display device comprising the conductive foam tape is disclosed.

In the present specification, a method of attaching a display panel to a frame using the conductive foam tape is disclosed.

In the present specification, as a method of manufacturing a display device, the method comprising attaching the conductive foam tape to a display panel is disclosed.

The features described above and other features are exemplified by the following drawings, detailed description, and claims.

BRIEF DESCRIPTION OF THE DRAWINGS The following is a brief description of the drawings, and is presented for the purpose of explaining the exemplary aspects disclosed herein, and not by way of limitation. Like elements are similarly numbered in the accompanying drawings.

1 shows a display panel attached to a frame using a conductive foam tape according to the present disclosure.

2 shows the layers of a conventional adhesive foam tape.

3A, 3B, and 3C show layers of various conductive foam tapes in accordance with certain aspects of the present disclosure.

4 shows layers of a conductive foam tape according to an embodiment of the present disclosure.

5 shows layers of a conductive foam tape according to another embodiment of the present disclosure.

6A, 6B, and 6C show layers of various conductive foam tapes according to another aspect.

7 shows a manufacturing process of the conductive foam tape of FIG.

8 shows a manufacturing process of the conductive foam tape of FIG.

The present inventors have developed a conductive foam tape in which an adhesive foam tape and a conductive tape are combined. The present disclosure provides one tape that has both the functions of two separate tapes.

A conductive foam tape for attaching a display panel according to the present disclosure includes a first adhesive layer that is a conductive adhesive layer; metal deposition layer; foam layer; and a second pressure-sensitive adhesive layer sequentially. In addition, the conductive foam tape includes a thermoplastic polyurethane (TPU) film layer between the metal deposition layer and the foam layer, or between the foam layer and the second adhesive layer.

Throughout the aspects described herein, it should be understood that the various layers may fully or partially cover each other. It is also understood that the various layers may be in direct physical contact with neighboring layers (on top of it), or there may be an optional intervening layer, for example an adhesive layer.

Although the tapes shown in the drawings within this specification show each of the individual layers having a specific visual dimension with respect to itself and with respect to other layers, this is for illustrative purposes only, It should be understood that they are not intended to limit the scope of the invention disclosed herein. Each layer of the tape has the appropriate thickness necessary to provide the tape with the desired properties.

Referring to FIG. 1 , when manufacturing a display, a process of connecting the display panel 10 to the frame 30 is required. At this time, the adhesive foam tape 20 is attached between the display panel and the frame to couple the display panel and the frame. The conventional adhesive foam tape and the process of bonding the display panel and the frame are described in Korean Patent Registration No. 10-1969507, and the present specification is incorporated herein by reference in its entirety. At this time, the conventional adhesive foam tape 20 includes a foam layer in order to prevent damage to the panel due to external stress being transmitted to the display panel.

The structure of the conventional adhesive foam tape 20 is demonstrated with reference to FIG. A conventional adhesive foam tape includes a foam layer 203, and includes first and second adhesive layers 201 and 202 as an uppermost layer and a lowermost layer of the tape to function as a double-sided tape.

The present disclosure provides a foam tape having conductive properties by adding a metal deposition layer to this conventional foam tape laminate structure and replacing the pressure-sensitive adhesive layer with a conductive pressure-sensitive adhesive layer. 3A, 3B, and 3C, the conductive foam tape according to the present disclosure includes a first pressure-sensitive adhesive layer 301 and a second pressure-sensitive adhesive layer 302 at the uppermost and lowermost ends of the laminated structure of the tape, respectively, and , including a foam layer 303 between them. The conductive foam tape according to the present disclosure also includes a metal deposited layer 304 . The first pressure-sensitive adhesive layer 301 is a conductive pressure-sensitive adhesive layer. In one embodiment, the metal deposition layer 304 and the first pressure-sensitive adhesive layer 301 are disposed in contact with each other. Since the conductive foam tape according to the present disclosure includes a metal deposition layer 301 and a first adhesive layer 301 that is a conductive adhesive layer, it has excellent electrical conductivity properties. Therefore, when the display panel is attached to the frame using the conductive foam tape according to the present disclosure, it is possible to eliminate both the need for attaching the conductive tape, which is a separate component, to the display panel and the need for the sealing process of the panel. .

The first and second adhesive layers 301 and 302 included in the conductive adhesive foam tape according to the present disclosure are attached to the display liquid crystal panel and the frame, respectively, and serve to connect them.

The type and thickness of the first and second pressure-sensitive adhesive layers 301 and 302 are selected so that the tape has a level of tackiness and removability suitable for the intended use of the tape. In an embodiment, the thickness of the pressure-sensitive adhesive layers 301 and 302 may be, for example, 10 to 150 micrometers (μm), 20 to 100 μm, 25 to 80 μm, or 25 to 60 μm. In one embodiment, the thickness of the first pressure-sensitive adhesive layer 301 and the second pressure-sensitive adhesive layer 302 may be different from each other. In one aspect, the thickness of the first pressure-sensitive adhesive layer 301 is 25 to 40 µm, preferably about 30 µm, and the thickness of the second pressure-sensitive adhesive layer 302 is 30 to 60 µm, preferably about 50 µm.

Examples of the adhesive included in the first and second adhesive layers 301 and 302 include an acrylic adhesive, a rubber adhesive, a silicone adhesive, a urethane adhesive, or a combination thereof. The adhesive may be prepared from an adhesive material customarily used in the same field or related fields, but this is not particularly limited. In one embodiment, the pressure-sensitive adhesive includes an acrylic monomer, an acrylic oligomer, an acetate polymer, and/or a styrene polymer. Examples of specific pressure-sensitive adhesives are disclosed in Korean Patent Application Laid-Open No. 10-2016-0119837, the entirety of which is incorporated herein by reference. The pressure-sensitive adhesive may selectively use a crosslinking agent such as an isocyanate-based crosslinking agent, an epoxy-based crosslinking agent, or a metal chelate crosslinking agent.

The first pressure-sensitive adhesive layer is a conductive pressure-sensitive adhesive layer, and further includes a metal powder in the above-described pressure-sensitive adhesive component. The added metal powder imparts electrically conductive properties. Metal powders include, but are not limited to, copper, silver, gold, aluminum, platinum, nickel, or combinations thereof.

The foam layer 303 included in the conductive adhesive foam tape according to the present disclosure is made of a material having porosity and/or elasticity in order to prevent the panel from being damaged due to the transfer of stress to the display liquid crystal panel. Foam layer 303 may comprise a foam material commonly used in the art, and in one aspect, foam layer 303 is made of polyurethane, polypropylene, polyethylene, polyolefin, acrylic, silicone, or a combination thereof. including but not limited to.

When polyurethane is used as the foam layer 303 , the polyurethane is methylene diphenyl isocyanate (MDI), toluene diisocyanate (TDI), methylene diethyl isocyanate oligomer (MDI oligomer), and toluene diisocyanate (MDI). one selected from the group consisting of isocyanate oligomer (TDI oligomer), hexamethylene diisocyanate (HDI), isophorone diisocyanate (IDPI) and carbodiimide modified methylene diisocyanate. It may be prepared through a reaction between the above diisocyanate and at least one polyol selected from the group consisting of polypropylene glycol, polytetramethylene glycol, and polyethylene glycol.

In one aspect, the foam layer 303 is the thickest of the layers constituting the tape for the purpose of panel protection. The thickness of the foam layer 303 may be 100 to 3000 μm, 200 to 900 μm, 400 to 800 μm, 500 to 750 μm, 600 to 700 μm, 650 to 690 μm, or about 670 μm.

The foam layer is disclosed in Korean Patent Application Laid-Open No. 10-2016-0119837 and Korean Patent Publication No. 10-1969507, the entirety of which is incorporated herein by reference.

The conductive adhesive foam tape according to the present disclosure includes a metal deposition layer 304 to exhibit excellent electrically conductive properties. A metal deposition layer 304 is incorporated into the tape while in direct contact with the conductive adhesive layer. The metal deposited layer 304 includes, but is not limited to, copper, silver, gold, aluminum, platinum, nickel, or combinations thereof.

In one embodiment, the metal deposition layer 304 is atmospheric pressure chemical vapor deposition (APCVD), low pressure chemical vapor deposition (Low pressuce CVD, LPCVD), plasma chemical vapor deposition (Plasma enhanced CVD, PECVD), organometallic vapor deposition (Metal-organic CVD, MOCVD), thermal evaporation deposition (Thermal evaporation deposition), sputtering deposition (Sputtering deposition), and ion-beam assisted deposition (Ion-beam assisted deposition) can be manufactured through any one method selected from.

Conventional tapes exhibiting conductivity use a metal foil, a metal plating layer, or a conductive fabric layer. In this case, when a metal foil is used, it is difficult to manufacture the tape by a roll-to-roll process and storage is also difficult because a problem occurs in that the product is bent during winding of the manufactured tape. In addition, there is a problem in that the tape becomes hard and bulky, and the reworkability is poor. In addition, since the metal foil itself is easily bent, it is difficult to adhere to other layers of the tape.

In the case of the conductive fabric layer, it is manufactured by laminating a metal plating layer on the fabric layer through electroless plating, or including metal powder in the fabric layer. The tape with the conductive fabric layer thus prepared will come off with metal powder over time, and the metal powder adversely affects the performance of the panel. In addition, since the conductive fabric layer and the metal plating layer described above are also hard, winding is difficult, it is difficult to manufacture the tape through a roll-to-roll process, and the reworkability of the tape is also disadvantageous. In addition, in the case of the metal plating layer, it is impossible to form only one metal, for example, a copper plating layer. If only copper is plated, it is corroded and plating is not performed on the fabric layer, so nickel plating is first performed on the fabric layer, copper plating is performed again, and then the process of plating with nickel again must be performed. That is, since a single copper plating layer cannot be formed, the thickness is increased, and inconvenience occurs in the manufacturing process.

The metal deposited layer 304 according to the present disclosure can solve the above-mentioned problems. The metal deposition layer 304 may exhibit excellent conductivity while having a relatively thin thickness. In addition, since the tape including the metal deposition layer 304 according to the present disclosure can be wound, it can be manufactured through a roll-to-roll process and is easy to store. In addition, it was directly confirmed from the present disclosure that the reworkability of the tape including the metal deposition layer 304 according to the present disclosure is excellent. In addition, in the case of the metal deposition layer 304 according to the present disclosure, since it is directly deposited on other layers constituting the tape, there is no problem with the adhesion between the respective layers of the tape.

The thickness of the metal deposition layer 304 is 300 nm to 800 nm, 300 to 600 nm, 300 to 500 nm, 350 to 450 nm, or about 400 nm. In general, in forming a metal deposition layer, in order to form a deposition layer having a thickness of 300 nm or 400 nm, it is necessary to go through several deposition processes. However, through several deposition processes, the base layer on which the deposition layer is formed (eg, as described below, a substrate layer or a TPU film layer) may be wrinkled and damaged, such as wrinkles. In the present disclosure, the metal deposition layer 304 having a thickness of 300 nm or 400 nm or more may be formed through one process through plasma sputtering deposition. On the other hand, if the thickness is thinner than this, desirable electrical conduction properties cannot be exhibited, and as a result, a problem in that the liquid crystal panel is damaged in the ESD test may occur.

The resistance of the metal deposition layer 304 may be 10 mΩ to 100 mΩ, preferably 20 mΩ to 80 mΩ, and more preferably 30 mΩ to 50 mΩ.

The conductive adhesive foam tape according to the present disclosure further includes a thermoplastic polyurethane (TPU) film layer 305 to have excellent reworkability properties. The term "thermoplastic" as used herein refers to a material that is a plastic or deformable material, which melts into a liquid when heated and solidifies to a brittel glassy when sufficiently cooled.

In one embodiment, the thickness of the TPU film layer 305 is at least 20 μm, between 20 and 50 μm, between 20 and 40 μm, or between 20 and 30 μm. In one embodiment, the TPU film layer 305 has a tensile strength of at least 300, preferably 330 kgf/cm ² . In one embodiment, the TPU film layer 305 has an elongation of at least 380%. In one embodiment, the TPU film layer 305 has a modulus of at least 40 MPa, or at least 60 MPa. The TPU polymer of the TPU film layer 305 may be selected from among TPU polymers having a high tensile strength value to exhibit excellent reworkability properties. In one aspect, the TPU polymer according to the present disclosure may be a TPU polymer having the following structural formula (1).

NPG: neopentyl glycol

AA: adipic acid

MDI: methylene diphenyl diisocyanate

EG: ethylene glycol

1,4-BD: 1,4-butanediol (1,4-butandiol)

MeOH: methanol (methanol)

DT-1001: Copolymer composed of NPG-AA-NPG

DT-2014: Copolymer composed of (1,4-BD)-AA-EG

In Structural Formula 1, m is an integer of 1 to 10, an integer of 1 to 5, or an integer of 1 to 3, n is an integer of 1 to 10, an integer of 2 to 8, or an integer of 3 to 5, o is It may be an integer of 1 to 10, an integer of 1 to 5, or an integer of 2 to 3.

In another embodiment, the TPU polymer according to the present disclosure comprises toluene diisocyanate (TDI) in place of MDI of Formula 1 above.

The average molecular weight of the TPU polymer according to the present disclosure may be 10,000 to 100,000 g/mol, 10,000 to 50,000 g/mol, 10,000 to 30,000 g/mol, 12,000 to 20,000 g/mol, about 15,000 g/mol.

In one embodiment, the reworkability characteristics were directly observed using the film layer made of the above-described TPU, and it was confirmed that the TPU exhibits very excellent reworkability characteristics.

The conductive adhesive foam tape according to the present disclosure further includes a substrate layer 306 . A metal deposition layer 304 is deposited over the TPU film layer 305 or substrate layer 306 described above. The thickness of the substrate layer 306 is 10 to 100 μm, 20 to 80 μm, 30 to 70 μm, 40 to 60 μm, or about 50 μm. The substrate layer 306 may include a material used as a substrate material in the art. In one aspect, the substrate layer 306 includes, but is not limited to, polyethylene terephthalate (PET), polyethylene naphthalate, polymethylmethacrylate, polyester, polyamide, or combinations thereof.

The material of the substrate layer may further contain additives as needed to achieve the desired properties. Examples of additives include fillers, flame retardants, antioxidants (anti-curing agents), antistatic agents, emollients, ultraviolet absorbers, antioxidants, plasticizers, surfactants, and combinations thereof.

The substrate layer 306 may be formed by any suitable method. For example, the substrate layer 306 is formed by casting the selected polymer composition into a film, or by molding the resin composition comprising the selected polymeric material into a sheet by a molding method such as extrusion molding, injection molding or calender molding. It can be formed by

The substrate layer is disclosed in Korean Patent Application Laid-Open No. 10-2016-0119837 and Korean Patent Publication No. 10-1969507, the entirety of which is incorporated herein by reference.

3A, 3B, and 3C illustrate various embodiments of a conductive foam tape including the layers described above. The uppermost first adhesive layer 301 is in contact with the metal deposition layer 304 , and the metal deposition layer 304 is deposited on the substrate layer 306 or the TPU film layer 305 . The second pressure-sensitive adhesive layer 302 is located at the bottom.

In this specification, the expressions of the top, top, bottom, bottom, etc. are all used to describe by giving a specific direction to help understand the present invention, and the direction of lamination of the tape and the direction of application of the tape according to the present disclosure It is not a limiting condition. Therefore, it should be understood that the present disclosure includes a case in which the tape is in an inverted state, that is, the first pressure-sensitive adhesive layer 301 is positioned at the bottom and the second pressure-sensitive adhesive layer 302 is positioned at the top.

4 shows the tape of Example 1 provided in the present disclosure. The conductive foam tape of FIG. 4 sequentially includes a first adhesive layer 401, a metal deposition layer 404, a TPU film layer 405, a third adhesive layer 407, a foam layer 403, and a substrate layer 406. , a second pressure-sensitive adhesive layer 402 and a release film layer 409 . The first pressure-sensitive adhesive layer, the metal deposition layer, the TPU film layer, the foam layer, the substrate layer and the second pressure-sensitive adhesive layer are all the same as described above.

The conductive foam tape according to the present disclosure may further include third and/or fourth pressure-sensitive adhesive layers, and the structure of the tape including the third pressure-sensitive adhesive layer 407 is illustrated in FIGS. 3A, 3B and 3C . shown as hostile. Both the third pressure-sensitive adhesive layer and the fourth pressure-sensitive adhesive layer may include the same pressure-sensitive adhesive component of the first and second pressure-sensitive adhesive layers as described above, and may have a thickness similar to that of the first and second pressure-sensitive adhesive layers.

The conductive foam tape according to the present disclosure may further include a release film layer. The release film layer may be positioned on the outermost layer while in contact with the first pressure-sensitive adhesive layer and/or the second pressure-sensitive adhesive layer. The release film layer is a layer removable from the pressure-sensitive adhesive layer, and the thickness of the release film layer may be 5 to 150 μm, 10 to 125 μm, 20 to 100 μm, 40 to 85 μm, or 50 to 75 μm.

The release film layer may be, but is not limited to, a transparent or colored plastic material. Specifically, the release film layer may comprise a support or "liner", such as a paper or plastic based carrier or web material. For example, the specific liner is Kraft Paper, and the specific intermediate coating is high density polyethylene (HDPE). The release liner may be, for example, polyethylene terephthalate (PET), polyethylene naphthalate (PEN) polyester polyamide, polycarbonate, ethylene vinyl acetate copolymer, ethylene-ethyl acrylate copolymer, ethylene-propylene copolymer, and poly It may include a material selected from the group consisting of vinyl chloride. Specifically, the silicone resin or oligomer may be coated onto PET or polyolefin coated paper. The tackifier need not form a continuous or agglomerated layer on the release liner.

Specifically, the release film layer may comprise a liner coated on one or both sides with a release agent, which provides a release effect for any type of adhesive material such as a pressure-sensitive adhesive. Release involves separation of the liner from the adhesive material.

Various release film layers are known in the art and, in one aspect, may include a liner, an intermediate coating, and a release coating. An exemplary release layer is sold under the trade name Rexam Grade 16043 as Rexam Release, Bedford Park, Ill.

The release film layer optionally comprises an intermediate coating and a release coating on both sides of the liner, i.e. a first intermediate coating and a first release coating on one side of the liner and a second intermediate coating and a second release coating on the other side of the liner can do. This enables a so-called differential release in which the foam tape dispensed from the roll preferentially separates between the release coating in contact with one layer of tape and the first adhesive layer of the lower tape layer. Accordingly, the double-sided release layer comprises a release coating on the opposite side. Specifically, the release coating may include a silicone polymer.

An example including a release film layer 409 is shown in FIG. 4 .

7 shows a manufacturing process of the tape of FIG. The order in which the layers are stacked is chosen to stack the layers in the most efficient way, and does not necessarily follow this manufacturing process.

5 shows the tape of Example 2 provided in the present disclosure. The conductive foam tape of FIG. 5 sequentially includes a second adhesive layer 502, a TPU film layer 505, a foam layer 503, a third adhesive layer 507, a substrate layer 506, and a metal deposition layer 504. , a first pressure-sensitive adhesive layer 501 and a release film layer 509 . The second pressure-sensitive adhesive layer, the TPU film layer, the foam layer, the third pressure-sensitive adhesive layer, the substrate layer, the metal deposition layer, the first pressure-sensitive adhesive layer and the release film layer are all the same as described above. Unlike FIGS. 3A, 3B, 3C and 4 , the tape of FIG. 5 has a structure in which the first adhesive layer 501 is positioned at the bottom and the second adhesive layer 502 is positioned at the top.

8 shows a manufacturing process of the tape of FIG. The order in which the layers are stacked is chosen to stack the layers in the most efficient way, and does not necessarily follow this manufacturing process.

6A, 6B, and 6C illustrate various aspects of conductive foam tapes in accordance with the present disclosure. The tape of FIG. 6A is the same as the tape of FIG. 4 except that the foam layer is positioned on top of the third pressure-sensitive adhesive layer. The tape of FIG. 6B is the same as the tape of FIG. 6A except that a fourth pressure-sensitive adhesive layer is added. The tape of FIG. 6c is identical to the tape of FIG. 4 except that there is no substrate layer.

The display device includes a display panel on which an image is displayed, and an intermediate frame in contact with a rear surface of the display panel. In more detail, the manufacturing process of the display device includes a process of attaching the display panel to the inside of the frame. In order to realize a very thin display device, the display panel and the frame are attached by double-sided tape. The conductive foam tape according to the present disclosure is used in the process of attaching a display panel to a frame.

Since the conductive foam tape according to the present disclosure has conductivity, there is no need to attach a separate conductive tape to the panel. In addition, since the metal-deposited layer has superior properties than conventional conductive layers, such as good electrical conductivity, rollability, good adhesion properties with other layers, and the like, the present disclosure provides an advantageous tape. In addition, since the tape of the present disclosure comprises an advantageous TPU film layer having a specific tensile strength, it is possible to provide a tape advantageous in reworkability.

The following examples are provided to illustrate the present disclosure. The examples are illustrative only and are not intended to limit devices made in accordance with the present disclosure to the materials, conditions, or process parameters presented herein.

Example

Example 1

A conductive foam tape structure as shown in Table 1 and FIG. 4 below was prepared as follows.

film	Thickness (μm)
first pressure-sensitive adhesive layer (401)	30
Metal Deposited Layer (404)	0.4
TPU Film Layer (405)	30
Third pressure-sensitive adhesive layer (407)	30
Foam layer (403)	670
substrate layer (406)	50
second pressure-sensitive adhesive layer (402)	50
release film layer (409)	50

1) Preparation of the thermoplastic polyurethane (TPU) film layer 405

A TPU film layer 405 was prepared using DPU-5465B (purchased from Intech, average molecular weight 15,000 g/mol). Specifically, DPU-5465B TPU is a TPU having the following structural formula, and its manufacturing method is as follows:

DT-1001 (40 wt %), DT-2014 (20 wt %), EG (4.5 wt %), NPG (3.5 wt %), and toner (Carbon black, 1 wt %) are added to the reactor and heated at 80 ° C. while stirring. To the sufficiently stirred polyol mixture, MDI (30 wt %) was slowly added and added while keeping the temperature from rising rapidly at 80°C. At this time, the added MDI was such that the mole of the OH group of the polyol mixture and the mole of MDI were 1:1. Since the reaction of OH and NCO is an exothermic reaction, it was reacted with sufficient stirring while maintaining at 80° C. until the temperature was no longer increased. Then, MeOH (1 wt %) was added to terminate the reaction.

NPG: neopentyl glycol

AA: adipic acid

MDI: methylene diphenyl diisocyanate

EG: ethylene glycol

1,4-BD: 1,4-butanediol (1,4-butandiol)

MeOH: methanol (methanol)

DT-1001: Copolymer composed of NPG-AA-NPG

DT-2014: Copolymer composed of (1,4-BD)-AA-EG

m: an integer from 1 to 3

n: an integer of 3 to 5

o: an integer from 2 to 3

Thereafter, a TPU film layer 405 was manufactured through the following process.

A release film layer 405-1 of a PET mat having a thickness of 50 μm was prepared. A polymer solution containing the TPU was prepared. This polymer solution was coated on the release film layer 405-1 using a comma coating method to form a TPU layer 405 on the release film layer 405-1. The comma coating process is a coating process in which a polymer solution is cast on the release film layer 405-1 serving as a carrier, and the polymer solution is passed through an oven equipment to evaporate the solvent and form a polymer film. At this time, the moving speed of the carrier film moving during the coating process was an average of 12 m/min. In addition, the temperature of the oven was 140 degreeC. The thickness of the prepared TPU layer 405 was 20 μm. The prepared TPU layer 405 and the release film layer 405-1 were wound in a roll shape.

2) Preparation of the metal deposition layer 404

The copper deposition layer 404 was used as the metal deposition layer, and the copper deposition layer 404 was manufactured through the following process.

Copper of OTK-RollCuPY0.1 was purchased from OKTOKKI and deposited on the TPU layer 405 through a sputtering deposition method. At this time, the deposition was carried out under vacuum conditions at an average temperature of 120° C. at a rate of 1 m/min. The thickness of the prepared copper deposition layer 404 was 400 nm on average.

3) Preparation of the first pressure-sensitive adhesive layer 401

A release film layer 401-1 of a PET mat having a thickness of 50 μm was prepared. Acrylic Co-Polymer, CAS No. from Greentack. 35239-19-1 was purchased, and it was liquefied by putting it in a toluene solvent. After that, 1.0 wt% of nickel powder was added, and the mixture and dispersion were mixed to prepare a first pressure-sensitive adhesive solution. Using this solution, a first pressure-sensitive adhesive layer 401 was prepared on the release film layer 401-1. In this case, the first pressure-sensitive adhesive layer 401 was made of a conductive pressure-sensitive adhesive layer. During the coating process, it was dried at 120° C. when passing through an oven, and the film layer 401-1 was prepared while moving at an average speed of 10 m/min. The thickness of the first pressure-sensitive adhesive layer 401 was 30 μm. The prepared first adhesive layer 401 was laminated with the copper deposition layer 404 using a roll-to-roll process. At this time, the release film layer 405-1 was removed, and it was wound in the form of a roll.

4) Preparation of the third pressure-sensitive adhesive layer 407

A pressure-sensitive adhesive solution containing an acrylic material (Acrylic Co-Polymer, CAS No. 35239-19-1 was purchased from Greentack) was prepared. This was coated on the release film layer 407-1 to prepare a third pressure-sensitive adhesive layer 407. During the coating process, it was dried at 120° C. when passing through an oven, and the film layer was prepared while moving at an average speed of 10 m/min. The thickness of the prepared third pressure-sensitive adhesive layer 407 was 30 μm. After the coating was prepared, it was wound into rolls.

5) Preparation of substrate layer 406

As the substrate layer 406, black PET was used, and SB00C of SKC Co, Ltd was used. In this case, the thickness of the substrate layer 406 was 50 μm.

6) Preparation of foam layer 403

Polyurethane was used as the foam layer 403, and it was manufactured through the following process.

As a raw material for polyurethane foam, USYS Co. Ltd.'s 1010P0 polyol mixture and 1040I2 MDI prepolymer mixture were prepared by polymerization and coating on the substrate layer 406 . During the coating process, it was dried at 100° C. when passing through an oven, and the film layer was prepared while moving at an average speed of 10 m/min. The thickness of the prepared polyurethane layer 403 was 670 μm. After production, it was wound in the form of a roll.

7) Preparation of the second pressure-sensitive adhesive layer 402

A pressure-sensitive adhesive solution containing an acrylic material (Acrylic Co-Polymer, CAS No. 35239-19-1 was purchased from Greentack) was prepared. This was coated on the release film layer 409 to prepare a second pressure-sensitive adhesive layer 402 . During the coating process, it was dried at 120° C. when passing through an oven, and the film layer was prepared while moving at an average speed of 10 m/min. The thickness of the prepared second pressure-sensitive adhesive layer 402 was 50 μm. After the coating was prepared, it was wound into rolls.

Thereafter, the second pressure-sensitive adhesive layer 402 and the substrate film layer 406 prepared by using a roll-to-roll process were laminated. Again, it was wound into rolls.

8) Lamination of the foam layer 403 and the third pressure-sensitive adhesive layer 407

By using a roll-to-roll process, the previously prepared foam layer 403 and the third pressure-sensitive adhesive layer 407 were laminated. At this time, the release film layer 407-1 and the release film layer 401-1 were removed.

Example 2

A conductive foam tape structure as disclosed in Table 2 and FIG. 5 below was prepared as follows.

film	Thickness (㎛)
second pressure-sensitive adhesive layer (502)	50
TPU film layer (505)	20
Foam Layer (503)	670
Third adhesive layer (507)	30
substrate layer (506)	50
Metal Deposited Layer (504)	0.4
first pressure-sensitive adhesive layer (501)	30
release film layer (509)	50

Each layer was prepared in the same manner as in Example 1, except that the stacking order and the thickness of the TPU film layer 505 were 20 μm and the top and bottom of the tape were reversed, and each layer was laminated as follows .

A copper deposition layer 504 was formed in the same manner as in 2) of Example 1, except that a copper deposition layer 504 was deposited on the substrate layer 506 .

As a conductive adhesive layer, the first adhesive layer 501 was coated on the release film layer 509 . The specific formation process except for the thickness is the same as 3) of Example 1 above.

The prepared first pressure-sensitive adhesive layer 501 was laminated with the copper deposition layer 504 using a roll-to-roll process.

A third pressure-sensitive adhesive layer 507 was coated on the release film layer 507-1 in the same manner as 4) of Example 1, and this was laminated on the back surface of the substrate layer 506 using a roll-to-roll process.

Meanwhile, the TPU film layer 505 was coated on the release film layer 505-1. The specific forming process except for the thickness is the same as 1) of Example 1 above. The prepared TPU film layer 505 was laminated using a foam layer 503 and a roll-to-roll process.

A second pressure-sensitive adhesive layer 502 was coated on the release film layer 501-1. The specific formation process except for the thickness is the same as 7) of Example 1 above.

The second pressure-sensitive adhesive layer 502 was laminated using the TPU film layer 505 and a roll-to-roll process. At this time, the release film layer 505-1 was removed.

The third pressure-sensitive adhesive layer 507 was laminated with the foam layer 503 using a roll-to-roll process. At this time, the release film layer (502-1) and the release film layer (507-1) were removed, and wound up in a roll shape.

Experimental Example 1: Comparative analysis of the metal plating layer and the metal deposition layer

In order to compare the electrical conductivity with the case of using a plating layer instead of a metal deposition layer, a metal plating layer was prepared as a comparative example. Specifically, the polyester fabric was washed with a diluted sodium hydroxide solution (concentration 10%) and neutralized again with a diluted hydrochloric acid solution (concentration 20%). This was precipitated in a nickel solution (concentration 4.5%) to perform electroless nickel plating. Thereafter, it was precipitated in a copper solution (concentration 3.0%) to perform electroless copper plating. Again, this was precipitated in a nickel solution to perform nickel plating.

This is compared with the copper deposition layer 504 of Example 1 and shown in Table 3.

	Plated	deposition
Thickness (㎛)	7	0.8
Resistance value (mΩ)	30-50	30-50

In the case of the plating layer, it can be confirmed that the thickness is about 9 times thicker than that of the deposition layer. It was confirmed that the copper deposition layer 504 of Example 1 was much thinner than the plating layer and had electrical conductivity similar to that of the plating layer.

Experimental Example 2: Analysis of reworkability according to the physical properties of the TPU film layer

In order to confirm the reworkability characteristics according to the TPU properties, three TPU layers having a thickness of 10 μm, 20 μm, and 30 μm, respectively, were prepared. Except for the thickness, all were the same as the TPU layer used in Example 1.

TPUs with different physical properties were used and compared with TPUs according to the present disclosure. For the TPU layer of Comparative Example, HI-THANETM S-1090FD (molecular weight 75,000 g/mol) of Songwon Industries was used. The TPU of Comparative Example was dissolved in a dimethylformamide (DMF) solvent to obtain a polymer solution, and then coated on the release film layer through a gravure coating method. At this time, the coating thickness was 10 μm and 20 μm, respectively, and coating was performed at 150° C. at a rate of 18 m/min to obtain a comparative TPU layer.

The thickness was measured using a thickness gauge, and tensile strength and elongation were measured based on ASTM D3574-05. Reworkability was evaluated by attaching the TPU to the glass at room temperature and performing a process of separating the TPU at a rate of 1500 mm/min to 1700 mm/min after 30 minutes have elapsed. At this time, the case where the TPU layer is not broken and there is no residue is indicated by Y, and when the TPU layer is broken or there is a residue, it is indicated by N. This was confirmed visually.

The results are shown in Table 4 below.

	TPU used in the present disclosure			Comparison TPU
	One	2	3	One	2
TPU thickness (㎛)	10	20	30	10	20
Tensile strength (kgf/cm2)	395	453	525	261	332
Elongation (%)	376	460	535	223	384
Reworkability (N or Y)	N	Y	Y	N	Y

Based on the above results, for reworkability, it is preferable to use a TPU having a thickness of 20um or more, and it is preferable to use a TPU having a tensile strength of 300, preferably 330 kgf/cm2 or more and an elongation of 380% or more at a thickness of 20um. It can be confirmed that it is preferable. In particular, since TPU having a high tensile strength value is used, an adhesive having excellent reworkability can be obtained.

In addition, the result of measuring the modulus value of the TPU used in the present disclosure (using ASTM D882 method) is shown in Table 5 below. At this time, it was measured using the TPU layer of Example 1. It was confirmed that the TPU used in the present disclosure has a high modulus.

	TPU
Thickness (㎛)	20
Modulus (MPa)	64.8

Various non-limiting aspects of the present disclosure are set forth below.

Aspect 1: A first pressure-sensitive adhesive layer that is a conductive pressure-sensitive adhesive layer;

metal deposition layer;

foam layer; and

As a conductive foam tape for attaching a display panel sequentially comprising a second pressure-sensitive adhesive layer,

Between the metal deposition layer and the foam layer, or between the foam layer and the second adhesive layer, a conductive foam tape comprising a thermoplastic polyurethane (TPU) film layer.

Aspect 2: The conductive foam tape of Aspect 1, further comprising a substrate layer between the foam layer and the second adhesive layer, when the TPU film layer is included between the metal deposition layer and the foam layer.

Aspect 3: The conductive foam tape of aspect 1, further comprising a substrate layer between the metal deposition layer and the foam layer, when the TPU film layer is included between the foam layer and the second adhesive layer.

Aspect 4: The conductive foam tape of aspect 1, wherein the conductive adhesive layer comprises an adhesive component and a metal powder.

Aspect 5: The conductive foam tape according to aspect 4, wherein the pressure-sensitive adhesive component of the conductive pressure-sensitive adhesive layer and the second pressure-sensitive adhesive layer include an acrylic pressure-sensitive adhesive, a rubber-based pressure-sensitive adhesive, a silicone pressure-sensitive adhesive, a urethane pressure-sensitive adhesive, or a combination thereof.

Aspect 6: The conductive foam tape of aspect 4, wherein the metal powder of the conductive adhesive layer comprises nickel, aluminum, silver, gold, or a combination thereof.

Aspect 7: The conductive foam tape of aspect 1, wherein the foam layer comprises polyurethane, polyolefin, polypropylene, polyethylene, acrylic, silicone, or combinations thereof.

Aspect 8: The conductive foam tape of aspect 1, wherein the metal deposited layer comprises copper, silver, gold, aluminum, platinum, nickel, or a combination thereof.

Aspect 9: The metal deposition layer of aspect 1, wherein the metal deposition layer is formed by atmospheric pressure chemical vapor deposition (APCVD), low pressure chemical vapor deposition (LPCVD), plasma enhanced CVD (PECVD), an organometallic deposition It is prepared through one method selected from vapor deposition (Metal-organic CVD, MOCVD), thermal evaporation deposition, sputtering deposition, and ion-beam assisted deposition, conductive foam tape.

Aspect 10: The conductive foam tape of aspect 1, wherein the thickness of the metal deposition layer is 300 nm to 800 nm.

Aspect 11: The conductive foam tape of aspect 1, wherein the metal deposition layer is produced via plasma sputter deposition.

Aspect 12: The conductive foam of aspect 1, wherein the thickness of the thermoplastic polyurethane (TPU) film layer is 20 μm to 50 μm and the tensile strength of the thermoplastic polyurethane (TPU) film layer is 300 kgf/cm ² or more. tape.

Aspect 13: The conductive foam tape of aspect 1, wherein the substrate layer comprises polyethylene terephthalate (PET), polyethylene naphthalate, polymethylmethacrylate, polyester, polyamide, or a combination thereof.

Aspect 14: The conductive foam tape of aspect 1, wherein the tape further comprises a third adhesive layer.

Side 15: a first pressure-sensitive adhesive layer that is a conductive pressure-sensitive adhesive layer;

metal deposition layer;

a thermoplastic polyurethane (TPU) film layer;

a third pressure-sensitive adhesive layer;

foam layer;

substrate layer; and

A conductive foam tape for attaching a display panel sequentially comprising a second pressure-sensitive adhesive layer.

Side 16: a first pressure-sensitive adhesive layer that is a conductive pressure-sensitive adhesive layer;

metal deposition layer;

substrate layer;

a third pressure-sensitive adhesive layer;

foam layer;

a thermoplastic polyurethane (TPU) film layer; and

A conductive foam tape for attaching a display panel sequentially comprising a second pressure-sensitive adhesive layer.

Aspect 17: A display panel to which the conductive foam tape according to any one of aspects 1 to 16 is attached.

Aspect 18: A display device comprising the conductive foam tape of any one of aspects 1-16.

Aspect 19: A method of attaching a display panel to a frame using the conductive foam tape according to any one of aspects 1 to 16.

Aspect 20: A method of manufacturing a display device, the method comprising:

A method of manufacturing a display device, comprising the step of attaching the conductive foam tape according to any one of aspects 1 to 16 to a display panel.

The compositions, methods, and articles may alternatively include, consist of, or consist essentially of any suitable material, step, or component described herein. The compositions, methods, and articles are additionally or alternatively formulated so as to be free or substantially free of any material (or species), step, or element that is not essential to the achievement of the function or purpose of the compositions, methods, and articles. can be

The terms "a" and "an" do not denote a limitation of quantity, but rather the presence of at least one of the referenced items. The term “or” means “and/or” unless the context clearly dictates otherwise. Throughout the specification, “an aspect,” “an embodiment,” “another embodiment,” “some embodiments,” and the like, refer to specific elements described in connection with an aspect (eg. eg, feature, structure, step, or characteristic) is included in at least one aspect described herein, and may or may not be present in another aspect. It should also be understood that the described elements may be combined in any suitable manner in the various aspects. When an element, such as a layer, film, region, or substrate, is referred to as being “on” another element, it may be directly on the other element or intervening elements may be present. Conversely, when an element is referred to as being “directly on” another element, the intervening element is not present.

Except to the contrary in this specification, all test standards are the most recent standard from the filing date of the filing of this application, or the earliest date in which the test standard appears in effect, if asserted.

Endpoints of full ranges pointing to the same component or property are inclusive of the endpoints, may be independently combined, and include all intermediate points and ranges. For example, a range of “up to 25 wt %, or 5 to 20 wt %” is a range of “5 to 25 wt %,” such as 10 to 23 wt %, etc. All median and endpoints are included.

The term “combination” includes blends, mixtures, alloys, reaction products, and the like. Also, "at least one of" means that the list includes each element individually, and includes combinations of two or more elements of the list and combinations of at least one element of the list and similar elements not referred to. means that Alternatively, in the list of available species, "a combination thereof" means that the combination may include a combination of at least one element of the list together with one or more similar elements not referred to.

Unless defined otherwise, technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs.

All cited patents, patent applications, and other references are incorporated herein by reference in their entirety. However, to the extent that terms in this application contradict or conflict with a term in an incorporated reference, the term in this application takes precedence over the conflicting term in the incorporated reference.

While specific aspects have been described, alternatives, modifications, variations, improvements and substantial equivalents that are not presently or foreseeable may occur to applicants or persons skilled in the art. Accordingly, the appended claims as filed and as may be amended are intended to cover all such alternatives, modifications, variations, improvements and substantial equivalents.

It is understood that the term “about” refers to a range of numbers that one of ordinary skill in the art would consider equivalent to the recited value in terms of achieving the same function or result.

All numerical ranges given throughout this specification include their upper and lower values, as well as all narrower numerical ranges falling therein, and all such narrower numerical ranges are considered to be expressly and specifically set forth herein.

Claims (20)

1. a first pressure-sensitive adhesive layer that is a conductive pressure-sensitive adhesive layer;

   metal deposition layer;

   foam layer; and

   As a conductive foam tape for attaching a display panel sequentially comprising a second pressure-sensitive adhesive layer,

   Between the metal deposition layer and the foam layer, or between the foam layer and the second adhesive layer, a conductive foam tape comprising a thermoplastic polyurethane (TPU) film layer.
2. The conductive foam tape according to claim 1, further comprising a substrate layer between the foam layer and the second adhesive layer when the TPU film layer is included between the metal deposition layer and the foam layer.
3. The conductive foam tape according to claim 1, further comprising a substrate layer between the metal deposition layer and the foam layer when the TPU film layer is included between the foam layer and the second pressure-sensitive adhesive layer.
4. The conductive foam tape according to claim 1, wherein the conductive adhesive layer comprises an adhesive component and a metal powder.
5. The conductive foam tape according to claim 4, wherein the adhesive component of the conductive adhesive layer and the second adhesive layer include an acrylic adhesive, a rubber adhesive, a silicone adhesive, a urethane adhesive, or a combination thereof.
6. The conductive foam tape according to claim 4, wherein the metal powder of the conductive adhesive layer includes nickel, aluminum, silver, gold, or a combination thereof.
7. The conductive foam tape of claim 1 , wherein the foam layer comprises polyurethane, polyolefin, polypropylene, polyethylene, acrylic, silicone, or combinations thereof.
8. The conductive foam tape of claim 1 , wherein the metal deposition layer comprises copper, silver, gold, aluminum, platinum, nickel, or a combination thereof.
9. According to claim 1, wherein the metal deposition layer is atmospheric pressure chemical vapor deposition (Atmospheric pressure chemical vapor deposition, APCVD), low pressure chemical vapor deposition (Low pressuce CVD, LPCVD), plasma chemical vapor deposition (Plasma enhanced CVD, PECVD), organometallic vapor deposition (Metal-organic CVD, MOCVD), thermal evaporation deposition (Thermal evaporation deposition), sputtering deposition (Sputtering deposition) and ion-beam assisted deposition (Ion-beam assisted deposition) to be prepared through one method selected from, the conductive foam tape.
10. The conductive foam tape according to claim 1, wherein the thickness of the metal deposition layer is 300 nm to 800 nm.
11. The conductive foam tape according to claim 1, wherein the metal deposition layer is manufactured through plasma sputtering deposition.
12. The conductive foam tape according to claim 1, wherein the thickness of the thermoplastic polyurethane (TPU) film layer is 20 μm to 50 μm and the tensile strength of the thermoplastic polyurethane (TPU) film layer is 300 kgf/cm ² or more.
13. The conductive foam tape of claim 1 , wherein the substrate layer comprises polyethylene terephthalate (PET), polyethylene naphthalate, polymethylmethacrylate, polyester, polyamide, or a combination thereof.
14. The conductive foam tape of claim 1 , wherein the tape further comprises a third adhesive layer.
15. a first pressure-sensitive adhesive layer that is a conductive pressure-sensitive adhesive layer;

    metal deposition layer;

    a thermoplastic polyurethane (TPU) film layer;

    a third pressure-sensitive adhesive layer;

    foam layer;

    substrate layer; and

    A conductive foam tape for attaching a display panel sequentially comprising a second pressure-sensitive adhesive layer.
16. a first pressure-sensitive adhesive layer that is a conductive pressure-sensitive adhesive layer;

    metal deposition layer;

    substrate layer;

    a third pressure-sensitive adhesive layer;

    foam layer;

    a thermoplastic polyurethane (TPU) film layer; and

    A conductive foam tape for attaching a display panel sequentially comprising a second pressure-sensitive adhesive layer.
17. A display panel to which the conductive foam tape according to any one of claims 1 to 16 is attached.
18. A display device comprising the conductive foam tape according to claim 1 .
19. A method for attaching a display panel to a frame using the conductive foam tape according to any one of claims 1 to 16.
20. A method of manufacturing a display device, the manufacturing method comprising:

    A method of manufacturing a display device, comprising the step of attaching the conductive foam tape according to any one of claims 1 to 16 to a display panel.

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