WO2022030789A1 - Foldable electronic device - Google Patents

Foldable electronic device Download PDF

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Publication number
WO2022030789A1
WO2022030789A1 PCT/KR2021/008982 KR2021008982W WO2022030789A1 WO 2022030789 A1 WO2022030789 A1 WO 2022030789A1 KR 2021008982 W KR2021008982 W KR 2021008982W WO 2022030789 A1 WO2022030789 A1 WO 2022030789A1
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WO
WIPO (PCT)
Prior art keywords
folding
housing
electronic device
openings
hinge module
Prior art date
Application number
PCT/KR2021/008982
Other languages
French (fr)
Korean (ko)
Inventor
김성훈
김민욱
이기훈
조정민
김광태
윤병욱
홍현주
Original Assignee
삼성전자 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 삼성전자 주식회사 filed Critical 삼성전자 주식회사
Publication of WO2022030789A1 publication Critical patent/WO2022030789A1/en

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    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16Constructional details or arrangements
    • G06F1/1613Constructional details or arrangements for portable computers
    • G06F1/1633Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
    • G06F1/1637Details related to the display arrangement, including those related to the mounting of the display in the housing
    • G06F1/1652Details related to the display arrangement, including those related to the mounting of the display in the housing the display being flexible, e.g. mimicking a sheet of paper, or rollable
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16Constructional details or arrangements
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16Constructional details or arrangements
    • G06F1/1613Constructional details or arrangements for portable computers
    • G06F1/1615Constructional details or arrangements for portable computers with several enclosures having relative motions, each enclosure supporting at least one I/O or computing function
    • G06F1/1616Constructional details or arrangements for portable computers with several enclosures having relative motions, each enclosure supporting at least one I/O or computing function with folding flat displays, e.g. laptop computers or notebooks having a clamshell configuration, with body parts pivoting to an open position around an axis parallel to the plane they define in closed position
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16Constructional details or arrangements
    • G06F1/1613Constructional details or arrangements for portable computers
    • G06F1/1628Carrying enclosures containing additional elements, e.g. case for a laptop and a printer
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16Constructional details or arrangements
    • G06F1/1613Constructional details or arrangements for portable computers
    • G06F1/1633Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
    • G06F1/1637Details related to the display arrangement, including those related to the mounting of the display in the housing
    • G06F1/1641Details related to the display arrangement, including those related to the mounting of the display in the housing the display being formed by a plurality of foldable display components
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16Constructional details or arrangements
    • G06F1/1613Constructional details or arrangements for portable computers
    • G06F1/1633Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
    • G06F1/1675Miscellaneous details related to the relative movement between the different enclosures or enclosure parts
    • G06F1/1681Details related solely to hinges
    • GPHYSICS
    • G09EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09FDISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • GPHYSICS
    • G09EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09FDISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/301Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements flexible foldable or roll-able electronic displays, e.g. thin LCD, OLED
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04102Flexible digitiser, i.e. constructional details for allowing the whole digitising part of a device to be flexed or rolled like a sheet of paper

Definitions

  • Various embodiments of the present disclosure relate to a foldable electronic device.
  • Such an electronic device may have a deformable structure capable of using a large-screen display while being convenient to carry.
  • the electronic device may include a foldable electronic device that operates in a manner in which a plurality of housings are folded with respect to each other.
  • the foldable electronic device may include a plurality of housings that perform a folding operation in a manner that is folded with respect to each other, and in an unfolded state, a large-screen display may be used, and in the folded state, the volume thereof is reduced to facilitate portability.
  • an operation of folding and unfolding two housings in designated folding methods may be performed through a single hinge module.
  • These folding methods are an out-folding method in which the flexible display is visually exposed in a folded state through two housings rotatably connected by a hinge module, or an in-folding method in which the flexible display is not visually exposed in the folded state. It may include an (in-folding) method.
  • a foldable electronic device may be provided.
  • a foldable electronic device having a support structure capable of supporting a corresponding area of the flexible display corresponding to the intersecting folding axes and providing a bending characteristic.
  • the flexible display supported through housings operated by the crossed hinge modules It may include a support member (eg, a conductive sheet layer or a conductive plate) capable of reinforcing stiffness and determining flexural properties.
  • a support member eg, a conductive sheet layer or a conductive plate
  • the electronic device includes a first housing, a second housing that is foldably connected to the first housing with respect to a first folding axis through a first hinge module, and a second hinge module.
  • a third housing that is foldably connected to the first housing, and the first hinge module, based on the first folding axis, the third a fourth housing foldably connected to the housing and foldably connected to the second housing with respect to the second folding axis through the second hinge module; the first housing; the second housing;
  • a flexible display disposed to be supported by a third housing and the fourth housing, a first area corresponding to the first housing, a second area corresponding to the second housing, and a third area corresponding to the third housing
  • a flexible display disposed to be supported by a third housing and the fourth housing, a first area corresponding to the
  • the electronic device includes a plurality of housings that are foldably coupled with respect to a first folding axis and/or a second folding axis intersecting the first folding axis, and the plurality of housings are arranged to receive support.
  • a flexible display comprising: a first folding area corresponding to the first folding axis and foldable; a second folding area corresponding to the second folding axis and foldable; and the first folding area and the second folding area intersecting a flexible display including an intersecting area, a first bending part disposed under the flexible display and corresponding to the first folding area and including a first pattern, and a first bending part corresponding to the second folding area and including a second pattern and a conductive sheet layer including two bending portions and an intersection portion corresponding to the intersection region and including a third pattern.
  • the flexible display supported by the conductive sheet layer includes a window layer, a first folding area disposed under the window layer, a first folding area corresponding to a first folding axis, and a first folding area intersecting the first folding axis.
  • a display panel comprising a second folding area corresponding to two folding axes and an intersection area corresponding to an area in which the first folding axis and the second folding axis intersect, and a polymer layer disposed under the display panel
  • the conductive sheet layer is disposed under the polymer layer, and includes a first bending part corresponding to the first folding area and including a first pattern, and a second bending part corresponding to the second folding area and including a second pattern. and an intersection portion corresponding to the intersection region and including a third pattern.
  • the foldable electronic device since the foldable electronic device performs folding and unfolding operations in various folding methods through crossed folding axes, it is possible to provide a large screen display in the unfolded state, and in the folded state, various A screen of a size may be provided.
  • the support structure provided with rigidity and bending characteristics for supporting the cross-arranged folding axes and corresponding regions of the flexible display, the operation reliability of the foldable electronic device may be improved.
  • FIG. 1 is a block diagram of an electronic device in a network environment according to various embodiments of the present disclosure
  • FIG. 2A is a view illustrating a front side of a foldable electronic device in an unfolded state according to various embodiments of the present disclosure
  • FIG. 2B is a view illustrating a rear surface of a foldable electronic device in an unfolded state according to various embodiments of the present disclosure
  • 3A is a view illustrating a front side of a foldable electronic device in a state folded in a first folding manner according to various embodiments of the present disclosure
  • 3B is a view illustrating a rear surface of a foldable electronic device in a state folded in a first folding manner according to various embodiments of the present disclosure
  • 3C is a view illustrating a rear side of a foldable electronic device in a state in which it is folded in a second folding method according to various embodiments of the present disclosure
  • FIG. 4 is an exploded perspective view of a foldable electronic device according to various embodiments of the present disclosure.
  • FIG. 5 is a diagram illustrating a configuration of a conductive sheet layer according to various embodiments of the present disclosure.
  • 6A is an enlarged view of area 6A of FIG. 5 according to various embodiments of the present disclosure.
  • 6B is an enlarged view of area 6B of FIG. 5 according to various embodiments of the present disclosure.
  • FIG. 6C is an enlarged view of area 6c of FIG. 5 according to various embodiments of the present disclosure.
  • 6D is a diagram illustrating a relationship between bending stiffness due to a load applied to a specimen according to various embodiments of the present disclosure
  • FIG. 7A is a partial cross-sectional view of a foldable electronic device taken along line 7a-7a of FIG. 2A according to various embodiments of the present disclosure
  • FIG. 7B is a partial cross-sectional view of a foldable electronic device taken along line 7b-7b of FIG. 2A according to various embodiments of the present disclosure
  • FIG. 7C is a partial cross-sectional view illustrating a state in which a first hinge module and a second hinge module are connected through an elastic support disposed in a region 7c of FIG. 2A according to various embodiments of the present disclosure;
  • FIG. 8 is a cross-sectional view of the conductive sheet layer taken along line 8-8 of FIG. 5 for comparison of thicknesses for each region according to various embodiments of the present disclosure
  • 9A and 9B are diagrams illustrating various embodiments of the area 6c of FIG. 5 according to various embodiments of the present disclosure.
  • FIG. 1 is a block diagram of an electronic device 101 in a network environment according to various embodiments of the present disclosure.
  • an electronic device 101 communicates with an electronic device 102 through a first network 198 (eg, a short-range wireless communication network) or a second network 199 . It may communicate with the electronic device 104 or the server 108 through (eg, a long-distance wireless communication network). According to an embodiment, the electronic device 101 may communicate with the electronic device 104 through the server 108 .
  • a first network 198 eg, a short-range wireless communication network
  • a second network 199 e.g., a second network 199 . It may communicate with the electronic device 104 or the server 108 through (eg, a long-distance wireless communication network). According to an embodiment, the electronic device 101 may communicate with the electronic device 104 through the server 108 .
  • the electronic device 101 includes a processor 120 , a memory 130 , an input device 150 , a sound output device 155 , a display device 160 , an audio module 170 , and a sensor module ( 176), interface 177, connection terminal 178, haptic module 179, camera module 180, power management module 188, battery 189, communication module 190, subscriber identification module 196 , or an antenna module 197 may be included.
  • a processor 120 e.g, the connection terminal 178
  • the connection terminal 178 may be omitted or one or more other components may be added to the electronic device 101 .
  • some of these components are integrated into one component (eg, display device 160 ).
  • the sensor module 176 eg, a fingerprint sensor, an iris sensor, or an illuminance sensor
  • the display device 160 eg, a display
  • the processor 120 for example, executes software (eg, a program 140) to execute at least one other component (eg, a hardware or software component) of the electronic device 101 connected to the processor 120 . It can control and perform various data processing or operations. According to one embodiment, as at least part of data processing or operation, the processor 120 converts commands or data received from other components (eg, the sensor module 176 or the communication module 190 ) to the volatile memory 132 . may be loaded into the volatile memory 132 , and may process commands or data stored in the volatile memory 132 , and store the resulting data in the non-volatile memory 134 .
  • software eg, a program 140
  • the processor 120 converts commands or data received from other components (eg, the sensor module 176 or the communication module 190 ) to the volatile memory 132 .
  • the processor 120 is the main processor 121 (eg, a central processing unit or an application processor), or a secondary processor 123 (eg, a graphic processing unit, a neural network processing unit) capable of operating independently or together with the main processor 121 .
  • NPU neural processing unit
  • image signal processor sensor hub processor, or communication processor
  • the main processor 121 e.g., a central processing unit or an application processor
  • the secondary processor 123 e.g, a graphic processing unit, a neural network processing unit
  • image signal processor e.g., image signal processor, sensor hub processor, or communication processor.
  • the auxiliary processor 123 is, for example, on behalf of the main processor 121 while the main processor 121 is in an inactive (eg, sleep) state, or the main processor 121 is active (eg, executing an application). ), together with the main processor 121, at least one of the components of the electronic device 101 (eg, the display device 160, the sensor module 176, or the communication module 190) It is possible to control at least some of the related functions or states.
  • the co-processor 123 eg, an image signal processor or a communication processor
  • may be implemented as part of another functionally related component eg, the camera module 180 or the communication module 190. have.
  • the memory 130 may store various data used by at least one component of the electronic device 101 (eg, the processor 120 or the sensor module 176 ).
  • the data may include, for example, input data or output data for software (eg, the program 140 ) and instructions related thereto.
  • the memory 130 may include a volatile memory 132 or a non-volatile memory 134 .
  • the program 140 may be stored as software in the memory 130 , and may include, for example, an operating system 142 , middleware 144 , or an application 146 .
  • the input device 150 may receive a command or data to be used in a component (eg, the processor 120 ) of the electronic device 101 from the outside (eg, a user) of the electronic device 101 .
  • the input device 150 may include, for example, a microphone, a mouse, a keyboard, a key (eg, a button), or a digital pen (eg, a stylus pen).
  • the sound output device 155 may output a sound signal to the outside of the electronic device 101 .
  • the sound output device 155 may include, for example, a speaker or a receiver.
  • the speaker can be used for general purposes such as multimedia playback or recording playback.
  • the receiver may be used to receive an incoming call. According to one embodiment, the receiver may be implemented separately from or as part of the speaker.
  • the display device 160 may visually provide information to the outside of the electronic device 101 (eg, a user).
  • the display device 160 may include, for example, a display, a hologram device, or a projector and a control circuit for controlling the corresponding device.
  • the display device 160 may include a touch sensor configured to sense a touch or a pressure sensor configured to measure the intensity of a force generated by the touch.
  • the audio module 170 may convert a sound into an electric signal or, conversely, convert an electric signal into a sound. According to an embodiment, the audio module 170 acquires a sound through the input device 150 , or an external electronic device (eg, a sound output device 155 ) directly or wirelessly connected to the electronic device 101 . The sound may be output through the electronic device 102 (eg, a speaker or headphones).
  • an external electronic device eg, a sound output device 155
  • the sound may be output through the electronic device 102 (eg, a speaker or headphones).
  • the sensor module 176 detects an operating state (eg, power or temperature) of the electronic device 101 or an external environmental state (eg, user state), and generates an electrical signal or data value corresponding to the sensed state. can do.
  • the sensor module 176 may include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, It may include a temperature sensor, a humidity sensor, or an illuminance sensor.
  • the interface 177 may support one or more designated protocols that may be used by the electronic device 101 to directly or wirelessly connect with an external electronic device (eg, the electronic device 102 ).
  • the interface 177 may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.
  • HDMI high definition multimedia interface
  • USB universal serial bus
  • SD card interface Secure Digital Card
  • the connection terminal 178 may include a connector through which the electronic device 101 can be physically connected to an external electronic device (eg, the electronic device 102 ).
  • the connection terminal 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (eg, a headphone connector).
  • the haptic module 179 may convert an electrical signal into a mechanical stimulus (eg, vibration or movement) or an electrical stimulus that the user can perceive through tactile or kinesthetic sense.
  • the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulation device.
  • the camera module 180 may capture still images and moving images. According to an embodiment, the camera module 180 may include one or more lenses, image sensors, image signal processors, or flashes.
  • the power management module 188 may manage power supplied to the electronic device 101 .
  • the power management module 188 may be implemented as, for example, at least a part of a power management integrated circuit (PMIC).
  • PMIC power management integrated circuit
  • the battery 189 may supply power to at least one component of the electronic device 101 .
  • battery 189 may include, for example, a non-rechargeable primary cell, a rechargeable secondary cell, or a fuel cell.
  • the communication module 190 is a direct (eg, wired) communication channel or a wireless communication channel between the electronic device 101 and an external electronic device (eg, the electronic device 102, the electronic device 104, or the server 108). It can support establishment and communication performance through the established communication channel.
  • the communication module 190 may include one or more communication processors that operate independently of the processor 120 (eg, an application processor) and support direct (eg, wired) communication or wireless communication.
  • the communication module 190 is a wireless communication module 192 (eg, a cellular communication module, a short-range communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 194 (eg, : It may include a LAN (local area network) communication module, or a power line communication module).
  • GNSS global navigation satellite system
  • a corresponding communication module among these communication modules is a first network 198 (eg, a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network 199 (eg, legacy (legacy) It can communicate with an external electronic device through a cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (eg, a telecommunication network such as a LAN or WAN).
  • a first network 198 eg, a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)
  • a second network 199 eg, legacy (legacy) It can communicate with an external electronic device through a cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (eg, a telecommunication network such as a LAN or WAN).
  • a telecommunication network
  • the wireless communication module 192 uses the subscriber information (eg, International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module 196 within a communication network such as the first network 198 or the second network 199 .
  • the electronic device 101 may be identified or authenticated.
  • the antenna module 197 may transmit or receive a signal or power to the outside (eg, an external electronic device).
  • the antenna module 197 may include an antenna including a conductor formed on a substrate (eg, a PCB) or a radiator formed of a conductive pattern.
  • the antenna module 197 may include a plurality of antennas (eg, an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network such as the first network 198 or the second network 199 is selected from a plurality of antennas by, for example, the communication module 190 . can be A signal or power may be transmitted or received between the communication module 190 and an external electronic device through at least one selected antenna.
  • other components eg, a radio frequency integrated circuit (RFIC)
  • RFIC radio frequency integrated circuit
  • peripheral devices eg, a bus, general purpose input and output (GPIO), serial peripheral interface (SPI), inter-integrated circuit (I2C), mobile display digital interface (MDDI), Alternatively, they may be connected to each other through a mobile industry processor interface (MIPI) and exchange signals (eg, commands or data) with each other.
  • GPIO general purpose input and output
  • SPI serial peripheral interface
  • I2C inter-integrated circuit
  • MDDI mobile display digital interface
  • MIPI mobile industry processor interface
  • the command or data may be transmitted or received between the electronic device 101 and the external electronic device 104 through the server 108 connected to the second network 199 .
  • Each of the external electronic devices 102 or 104 may be the same as or different from the electronic device 101 .
  • all or a part of operations executed in the electronic device 101 may be executed in one or more external electronic devices 102 , 104 , or 108 .
  • the electronic device 101 may perform the function or service itself instead of executing the function or service itself.
  • one or more external electronic devices may be requested to perform at least a part of the function or the service.
  • One or more external electronic devices that have received the request may execute at least a part of the requested function or service, or an additional function or service related to the request, and transmit a result of the execution to the electronic device 101 .
  • the electronic device 101 may process the result as it is or additionally and provide it as at least a part of a response to the request.
  • cloud computing, distributed computing, and mobile edge computing MEC: mobile edge computing
  • client-server computing techniques may be used.
  • the electronic device 101 may provide an ultra-low latency service using, for example, distributed computing or mobile edge computing.
  • the external electronic device 104 may include an Internet of things (IoT) device.
  • Server 108 may be an intelligent server using machine learning and/or neural networks.
  • the external electronic device 104 or the server 108 may be included in the second network 199 .
  • the electronic device 101 may be applied to an intelligent service (eg, smart home, smart city, smart car, or health care) based on 5G communication technology and IoT-related technology.
  • the electronic device may have various types of devices.
  • the electronic device may include, for example, a portable communication device (eg, a smart phone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a home appliance device.
  • a portable communication device eg, a smart phone
  • a computer device e.g., a smart phone
  • a portable multimedia device e.g., a portable medical device
  • a camera e.g., a portable medical device
  • a camera e.g., a portable medical device
  • a camera e.g., a portable medical device
  • a wearable device e.g., a smart bracelet
  • a home appliance device e.g., a home appliance
  • first, second, or first or second may be used simply to distinguish the element from other elements in question, and may refer to elements in other aspects (e.g., importance or order) is not limited. It is said that one (eg, first) component is “coupled” or “connected” to another (eg, second) component, with or without the terms “functionally” or “communicatively”. When referenced, it means that one component can be connected to the other component directly (eg by wire), wirelessly, or through a third component.
  • module used in various embodiments of this document may include a unit implemented in hardware, software, or firmware, and is interchangeable with terms such as, for example, logic, logic block, component, or circuit.
  • a module may be an integrally formed part or a minimum unit or a part of the part that performs one or more functions.
  • the module may be implemented in the form of an application-specific integrated circuit (ASIC).
  • ASIC application-specific integrated circuit
  • one or more instructions stored in a storage medium may be implemented as software (eg, the program 140) including
  • a processor eg, processor 120
  • a device eg, electronic device 101
  • the one or more instructions may include code generated by a compiler or code executable by an interpreter.
  • the device-readable storage medium may be provided in the form of a non-transitory storage medium.
  • 'non-transitory' only means that the storage medium is a tangible device and does not contain a signal (eg, electromagnetic wave), and this term is used in cases where data is semi-permanently stored in the storage medium and It does not distinguish between temporary storage cases.
  • a signal eg, electromagnetic wave
  • the method according to various embodiments disclosed in this document may be included and provided in a computer program product.
  • Computer program products may be traded between sellers and buyers as commodities.
  • the computer program product is distributed in the form of a device-readable storage medium (eg compact disc read only memory (CD-ROM)), or through an application store (eg Play StoreTM) or on two user devices (eg, It can be distributed (eg downloaded or uploaded) directly or online between smartphones (eg: smartphones).
  • a part of the computer program product may be temporarily stored or temporarily created in a machine-readable storage medium such as a memory of a server of a manufacturer, a server of an application store, or a relay server.
  • each component eg, a module or a program of the above-described components may include a singular or a plurality of entities.
  • one or more components or operations among the above-described corresponding components may be omitted, or one or more other components or operations may be added.
  • a plurality of components eg, a module or a program
  • the integrated component may perform one or more functions of each component of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. .
  • operations performed by a module, program, or other component are executed sequentially, in parallel, repeatedly, or heuristically, or one or more of the operations are executed in a different order, or omitted. or one or more other operations may be added.
  • FIG. 2A is a diagram illustrating a front side of the foldable electronic device 200 in an unfolded state according to various embodiments of the present disclosure.
  • FIG. 2B is a view illustrating a rear surface of the foldable electronic device 200 in an unfolded state according to various embodiments of the present disclosure.
  • the foldable electronic device 200 of FIGS. 2A and 2B may be at least partially similar to the electronic device 101 of FIG. 1 , or may include other embodiments of the electronic device.
  • the foldable electronic device 200 is positioned with respect to each other with respect to a first folding axis A and a second folding axis B disposed to intersect the first folding axis A. It may include a first housing 210 , a second housing 220 , a third housing 230 , and a fourth housing 240 , which are rotatably disposed. According to an embodiment, the foldable electronic device 200 includes a first hinge module 285 disposed along a first folding axis A and a first hinge along a second folding axis B in an internal space.
  • the second housing 220 may be foldably connected to at least a portion of the first housing 210 with respect to the first folding axis A through the first hinge module 285 .
  • the third housing 230 may be foldably connected to at least a portion of the first housing 210 with respect to the second folding axis B through the second hinge module 286 . .
  • the fourth housing 240 may be foldably connected to the third housing 230 through the first hinge module 285 , and through the second hinge module 286 , the second housing 220 and may be collapsible.
  • the foldable electronic device 200 in the unfolded state, supports the first housing 210 , the second housing 220 , the third housing 230 , and/or the fourth housing 240 .
  • It may include a flexible display 250 (eg, the display device 160 of FIG. 1 ) disposed to receive .
  • the flexible display 250 may provide a user with a large-screen display having a rectangular shape in an unfolded state.
  • At least a portion of the first housing 210 , the second housing 220 , the third housing 230 and/or the third housing 240 is selected for supporting the flexible display 250 . It may be formed of a metal material and/or a non-metal material having a size rigidity.
  • the first housing 210 in the unfolded state, includes a first surface 211 facing a first direction (eg, a Z-axis direction), and a second surface 211 facing a direction opposite to the first surface 211 .
  • the surface 212 may include a first side frame 213 surrounding the space between the first surface 211 and the second surface 212 .
  • the second housing 220 in the unfolded state, the third surface 221 facing the first direction (eg, the Z-axis direction), the third surface 221 and the fourth surface facing the opposite direction
  • the surface 222 may include a second side frame 223 surrounding the space between the third surface 221 and the fourth surface 222 .
  • the third housing 230 is, in the unfolded state, the fifth surface 231 facing the first direction (eg, the Z-axis direction), and the sixth surface 231 facing the opposite direction to the fifth surface 231 .
  • the surface 232 may include a third side frame 233 surrounding the space between the fifth surface 231 and the sixth surface 232 .
  • the fourth housing 240 in the unfolded state, the seventh surface 241 facing the first direction (eg, Z-axis direction), the seventh surface 241 and the eighth side facing the opposite direction.
  • a fourth side frame 243 surrounding the surface 242 and the space between the seventh surface 241 and the eighth surface 242 may be included.
  • the side frames 213 , 223 , 233 , and 243 are electrically segmented through at least one segment (not shown) formed of a non-conductive portion (eg, polymer or hollow space). It may include at least one conductive portion (not shown).
  • the at least one conductive portion is electrically connected to a wireless communication module (eg, the wireless communication module 192 of FIG. 1 ) included in the foldable electronic device 200 , thereby designating at least one band (eg, legacy It can be used as an antenna operating in a cellular network band).
  • the side frames 213 , 223 , 233 , and 243 may be used as decoration members.
  • the second surface 212 , the fourth surface 222 , the sixth surface 232 , and the eighth surface 242 are the first housing 210 , the second housing 220 , and the third The housing 230 and the fourth housing 240 may be formed as a part of each, or may include structurally coupled rear covers 214 , 224 , 234 , 244 .
  • the rear covers 214 , 224 , 234 , 244 include a first rear cover 214 disposed as at least a portion of the second surface 212 , and a first rear cover 214 disposed as at least a portion of the fourth surface 222 .
  • the second rear cover 224 may include a third rear cover 234 disposed as at least a portion of the sixth surface 232 , and a fourth rear cover 244 formed as at least a portion of the eighth surface 242 .
  • the rear covers 214 , 224 , 234 , and 244 are integrally formed with the side frames 213 , 223 , 233 , 243 , or with the side frames 213 , 223 , 233 , 243 and They may be individually configured to be coupled.
  • the back covers 214 , 224 , 234 , 244 are, for example, coated or tinted glass, ceramic, polymer, metal (eg, aluminum, stainless steel (STS), or magnesium); Or it may be formed by a combination of at least two of the above materials.
  • the housings 210 , 220 , 230 , and 240 of the foldable electronic device 200 are not limited to the shapes and combinations shown in FIGS. 2A and 2B , and other shapes or combinations of parts and/or It can be implemented by combining.
  • the flexible display 250 includes a first area 250a corresponding to the first housing 210 , a second area 250b corresponding to the second housing 220 , and a third housing 230 . ) corresponding to the third region 250c, the fourth region 250d corresponding to the fourth housing 240, the first folding region 250e corresponding to the first hinge module 285, the second hinge module ( 286) and a second folding area (250f) corresponding to, and an intersection area ( 250g) (eg, a region where the first folding region 250e and the second folding region 250f intersect).
  • an intersection area 250g
  • the first region 250a, the second region 250b, the third region 250c, and/or the fourth region 250d are the first hinge module 285 and the second hinge module ( According to a folding operation of the housings 210 , 220 , 230 , and 240 through 286 , they may at least partially face each other or may be deformed to face opposite directions.
  • the flexible display 250 may be disposed in a space formed by the housings 210 , 220 , 230 , and 240 .
  • the flexible display 250 may be seated in a recess formed by the housings 210 , 220 , 230 , and 240 , and the front surface of the foldable electronic device 200 (eg, in the Z-axis direction) The surface facing) may be disposed to form most of the
  • the foldable electronic device 200 is disposed under at least a portion of the flexible display 250 or is visually exposed through an opening (eg, a punch hole) provided in at least a portion of the flexible display 250 . It may include at least one electronic component arranged so as to be possible. According to an embodiment, the at least one electronic component includes at least one camera module 204 or 207 (eg, the camera module 180 of FIG. 1 ) disposed in the inner space of the foldable electronic device 200 and at least One sensor module 205 (eg, the sensor module 176 of FIG. 1 ) may be included.
  • the at least one electronic component includes at least one camera module 204 or 207 (eg, the camera module 180 of FIG. 1 ) disposed in the inner space of the foldable electronic device 200 and at least One sensor module 205 (eg, the sensor module 176 of FIG. 1 ) may be included.
  • the at least one camera module 204 or 207 is disposed under the flexible display 250 in the internal space of the foldable electronic device 200 , and is configured to photograph a subject through the flexible display 250 .
  • a first camera module 204 for, and a second camera module 207 disposed in the inner space of the foldable electronic device 200 for photographing a subject through the rear surface may include
  • the at least one camera module 204, in the interior space of the electronic device 200 is visually displayed from the outside through the flexible display 250 without a perforated opening formed in at least a portion of the flexible display 250 . It may be arranged so that it cannot be seen.
  • the corresponding area of the display panel of the flexible display 250 corresponding to the at least one camera module 204 may be configured to have higher transmittance than the surrounding area by adjusting the wiring density and/or pixel density.
  • the first camera module 204 may be disposed under the first area 250a of the flexible display 250 .
  • the first camera module 204 may be disposed under the second area 250b, the third area 250c, and/or the fourth area 250d.
  • the second camera module 207 may be disposed to correspond to the first rear cover 214 in the inner space of the foldable electronic device 200 .
  • the second camera module 207 may include, in the inner space of the foldable electronic device 200 , the second back cover 224 , the third back cover 234 , and/or the fourth back cover 244 . ) may be arranged to correspond to According to an embodiment, the second camera module 207 may include a plurality of cameras or a single camera. According to one embodiment, the second camera module is omitted, and is not disposed on the first back cover 214 , the second back cover 224 , the third back cover 234 and/or the fourth back cover 244 .
  • the at least one sensor module 205 may include at least one of a proximity sensor, an illuminance sensor, an iris recognition sensor, an ultrasonic sensor, a fingerprint sensor, a distance detection sensor (eg, TOF sensor), or an indicator.
  • the foldable electronic device 200 may include a receiver 206 disposed through at least a part of the first housing 210 .
  • the foldable electronic device 200 is configured through the first housing 210 , the second housing 220 , the third housing 230 , and/or the fourth housing 240 . It may include an interface connector port, an ear jack hole, an external speaker module, an external card (SIM, UIM or SD card) tray, or at least one key button to be disposed.
  • the housings 210 , 220 , 230 , and 240 may be formed at an angle to each other or to each other according to a state (eg, an unfolded state, a folded state, or an intermediate state) of the foldable electronic device 200 .
  • distance may vary.
  • the angle formed by the housings 210 , 220 , 230 , and 240 is a first angle (eg, about 180 degrees) in an unfolded state, and a second angle (eg, about 0 degrees or about 360 degrees) in a folded state ), or in an intermediate state, it can form a third angle (eg, about 90 degrees).
  • the foldable electronic device 200 in the folded state, includes the housings 210 , 220 , 230 , and 240 according to a first folding method (eg, out-folding) or a second folding method (eg, in-folding). ) may be different from each other.
  • a first folding method eg, out-folding
  • a second folding method eg, in-folding
  • the intermediate state it may include a state of maintaining an arbitrary designated angle, moving from the folded state to the unfolded state or from the unfolded state to the folded state.
  • the first hinge module 285 has the first housing 210 and the third housing 230, and the second housing 220 and the fourth housing 240 are out-folding (out-folding) method. It may include a rail-type multi-joint hinge module for operation as a In another embodiment, the first hinge module 285 operates the first housing 210 and the third housing 230 in an out-folding manner with respect to the second housing 220 and the fourth housing 240 . Accordingly, when the area and/or length to which the flexible display 250 is visually exposed is changed, a multi-joint hinge module may be included.
  • the multi-joint hinge module may include a single-axis, two-axis, or multi-axis hinge module.
  • the second hinge module 286 is folded with respect to the first housing 210 and the second housing 220 , and the third housing 230 and the fourth housing 240 . may include a biaxial hinge module and/or a uniaxial hinge module for operating in this manner.
  • the thickness of the foldable electronic device 200 according to a state change (eg, out-folding or in-folding) of the foldable electronic device 200 may be different in in-folding and out-folding.
  • the foldable electronic device 200 may have a smaller thickness in a state in which in-folding is performed through the second hinge module 286 than in a state in which out-folding is performed through the first hinge module 285 .
  • 3A is a view illustrating a front side of a foldable electronic device in a state folded in a first folding manner according to various embodiments of the present disclosure
  • 3B is a view illustrating a rear surface of a foldable electronic device in a state folded in a first folding manner according to various embodiments of the present disclosure
  • 3C is a view illustrating a rear side of a foldable electronic device in a state in which it is folded in a second folding method according to various embodiments of the present disclosure
  • the first housing 210 and the third housing 230 and the second housing 220 and the fourth housing 240 are first It may be operated to be folded in a folding method (eg, an out-folding method).
  • the flexible display 250 may be disposed to be exposed to the outside.
  • the first housing 210 and the third housing 230 are folded with respect to the second housing 220 and the fourth housing 240 with respect to the first folding axis A
  • the first The surface 211 and the fifth surface 231 are substantially oriented in the same first direction
  • the third surface 221 and the seventh surface 241 are oriented in a direction opposite to the first direction
  • the second surface 212 is opposite to the first direction.
  • the sum of the areas of the second region 250b and the fourth region 250d is the first region 250a of the flexible display 250 supported by the first housing 210 and the third housing 230 . It may be formed to be smaller than the sum of the areas of the area and the third planar region 250c. (Asymmetrically folded structure) For example, even when the foldable electronic device 200 is folded in the first folding method, the second camera module A subject can be photographed through (207).
  • the sum of the areas of the second region 250b and the fourth region 250d of the flexible display 250 supported by the second housing 220 and the fourth housing 240 is the first housing ( It may be formed to be substantially equal to the sum of the areas of the first region 250a and the third region 250c of the flexible display 250 supported by the 210 and the third housing 230. (Symmetrically folded) Structure) In some embodiments, the sum of the areas of the second housing 220 and the fourth housing 240 may be formed to be smaller than the sum of the areas of the first housing 210 and the third housing 230 .
  • the sum of the areas of the second housing 220 and the fourth housing 240 is substantially equal to the sum of the areas of the first housing 210 and the third housing 230 .
  • at least a portion of the first hinge module 285 , the second hinge module 286 , and/or the elastic support 287 is a foldable electronic device 200 may be exposed to the outside, or disposed in the inner space so as not to be exposed.
  • the first housing 210 and the second housing 220, the third housing 230 and the fourth housing 240 are in a second folding method ( For example, it may be operated to be folded in an in-folding manner.
  • the flexible display 250 may be disposed so as not to be exposed to the outside.
  • the first housing 210 and the second housing 220 are folded with respect to the third housing 230 and the fourth housing 240 based on the second folding axis B, the first The surface 211 may correspond to the fifth surface 231 , and the third surface 221 may correspond to the seventh surface 241 .
  • the sum of the areas of the first region 250a and the third region 250c of the flexible display 250 supported by the first housing 210 and the third housing 220 is the third It may be formed to be substantially equal to the sum of the areas of the third region 250c and the fourth region 250d of the flexible display 250 supported by the housing 230 and the fourth housing 240 .
  • the foldable electronic device 200 when the foldable electronic device 200 is folded in the second folding method, portability may be facilitated and the flexible display 250 may be protected from external shocks and/or foreign substances.
  • the electronic device 200 has various modes according to the unfolded state, the folded state in the first folding method (eg, the out-folding method), and/or the folded state in the second folding method (eg, the in-folding method). It can be set to operate as According to an embodiment, when the electronic device 200 is in an unfolded state (eg, in the case of FIG. 2A ), it may be set to operate in a first mode (eg, a tablet mode). For example, in the first mode, the electronic device 200 may provide a large screen display (eg, a full front display) of a specified ratio (eg, 4:3). According to an embodiment, when the electronic device 200 is folded in the first folding method (eg, in the case of FIG.
  • the electronic device 200 is set to operate in the second mode (eg, a call mode or a selfie mode) can be
  • the electronic device 200 may provide displays of different ratios.
  • a display of a first ratio eg, 2:1
  • a display of a second ratio eg, 4:1
  • the call mode may be provided using the first ratio
  • the selfie mode may be provided using the second ratio.
  • the electronic device 200 uses the at least one first camera module 204 disposed at the lower end (eg, -z-axis direction) of the flexible display 250 to perform a call function (eg: may acquire an image related to a video call) and provide it to at least a portion of a surface (eg, the first surface 211 and the fifth surface 231 ) facing substantially in the same direction as the first camera module 204 .
  • a call function eg: may acquire an image related to a video call
  • the electronic device 200 provides image information (eg, a preview, or a photographed image) related to camera shooting in a direction substantially the same as that of the at least one second camera module 207 .
  • the electronic device 200 when it is folded in the second folding method (eg, in the case of FIG. 3C ), it may be set to operate in a third mode (eg, a wallet mode).
  • a third mode eg, a wallet mode
  • the electronic device 200 is positioned between the support member assembly 280 and the rear covers 214 , 224 , 234 , and 244 while protecting the flexible display 250 from external impact.
  • a payment function and/or a charging function may be performed using an antenna (not shown).
  • the antenna may include a near field communication (NFC) antenna, a wireless charging antenna, and/or a magnetic secure transmission (MST) antenna.
  • An antenna may perform short-range communication with an external electronic device (eg, the electronic devices 102 and 104 of FIG. 1 , and the server 108 of FIG. 1 ) or wirelessly transmit/receive power required for charging. .
  • FIG 4 is an exploded perspective view of the foldable electronic device 200 according to various embodiments of the present disclosure.
  • the far foldable electronic device 200 includes a flexible display 250 and a conductive sheet layer 260 sequentially disposed under the flexible display 250 (eg, a conductive plate, a support member, a support sheet, or metal sheet layer), reinforcing plate 270 , support member assembly 280 , at least one substrate 291 , 292 (eg, a printed circuit board (PCB), flexible PCB (FPCB), or rigid flexible PCB (RFPCB). ), at least one flexible substrate capable of being bendable (eg, FPCB) 295a, 295b, 295c, at least one battery 293, 294, and back covers 214, 224, 234, 244. .
  • a flexible display 250 eg, a conductive plate, a support member, a support sheet, or metal sheet layer
  • reinforcing plate 270 e.g., support member assembly 280
  • support member assembly 280 eg, at least one substrate 291 , 292 (eg, a printed circuit board (PCB), flexible
  • the foldable electronic device 200 may further include a member (eg, a digitizer) for recognizing a handwriting input, which is disposed under the flexible display 250 .
  • a member eg, a digitizer
  • the foldable electronic device 200 may further include a touch sensor disposed in the flexible display 250 .
  • the foldable electronic device 200 may include a plurality of displays (eg, the display device 160 of FIG. 1 ), and the first display (eg, the flexible display 250 ) is an unbreakable display (UB).
  • the conductive sheet layer 260 may be formed of fiber reinforced plastics (FRP) having rigid properties for supporting the flexible display 250 (eg, carbon fiber reinforced plastics (CFRP) or glass fiber (GFRP)). It can also be replaced with non-metallic sheet-like materials, such as reinforced plastics).
  • FRP fiber reinforced plastics
  • CFRP carbon fiber reinforced plastics
  • GFRP glass fiber
  • the flexible display 250 may include a window layer 251 , a polarization layer 252 , a display panel 253 , and a polymer layer 254 .
  • the window layer 251 , the polarizing layer 252 , the display panel 253 , and the polymer layer 254 may be attached to each other through an adhesive P (or an adhesive).
  • the adhesive P may include at least one of an optical clear adhesive (OCA), a pressure sensitive adhesive (PSA), a heat-responsive adhesive, a general adhesive, and a double-sided tape.
  • the window layer 251 may include a glass layer.
  • the window layer 251 may include ultra thin glass (UTG).
  • the window layer 251 may include a polymer.
  • the window layer 251 may include polyethylene terephthalate (PET) or polyimide (PI).
  • PET polyethylene terephthalate
  • PI polyimide
  • a plurality of window layers 251 may be disposed. For example, one layer (eg, the top surface) of the plurality of window layers 251 is disposed by an adhesive having a weaker adhesive strength or a thinner thickness than that of the other layer so that it can be well separated from the other layer.
  • the window layer 251 may include a first protective layer formed of a first material that is sequentially stacked, and a second protective layer formed of a second material different from the first material.
  • the first material may include PET or PI having relatively superior optical properties than the second material
  • the second material may include TPU (thermoplastic polyurethane), which is relatively advantageous in elasticity than the first material.
  • the window layer 251 may further include various coating layers formed on at least a portion of at least one of an upper surface, a lower surface, and/or a side surface.
  • the display panel 253 may include a plurality of pixels. According to one embodiment, when viewed from the top of the display panel 253, at least one electronic component included in the foldable electronic device 200 (eg, the camera module 204 or 207 of FIGS. 2A to 2B ); Alternatively, the plurality of pixels may not be disposed in an area that at least partially overlaps the sensor module 205 .
  • the display panel 253 may include a pixel protection layer (not shown) for protecting the plurality of pixels.
  • the pixel passivation layer (not shown) may include encapsulation glass.
  • the display panel 253 may include liquid crystal polymer (LCP) or low temperature polycrystalline silicon (LTPS) glass.
  • the plurality of pixels may include a thin film transistor (TFT) formed on LTPS glass.
  • TFT thin film transistor
  • a specified pattern black matrix
  • An opaque metal layer not shown
  • a buffer layer including patterns
  • the polarizer 252 may selectively pass light generated from the light source of the display panel 253 and vibrating in a predetermined direction.
  • the display panel 253 and the polarization layer 252 may be integrally formed.
  • the flexible display 250 may include a touch panel (not shown).
  • the display panel 253 may include a control circuit.
  • the control circuit may include a display driver IC (DDI) and/or a touch display driver IC (TDDI) arranged in a chip on panel (COP) or chip on film (COF) manner.
  • the polymer layer 254 is disposed under the display panel 253 to provide a dark background for securing visibility of the display panel 253, and a cushioning material (eg, cushion) for a cushioning action. ) can be formed.
  • the polymer layer 254 is opaque to remove air bubbles that may be generated between the display panel 253 and its lower attachments and block light generated in the display panel 253 or light incident from the outside. It may include a metal layer (eg, a black layer including an uneven pattern) and/or a buffer layer (eg, a sponge layer) disposed for impact mitigation.
  • the flexible display 250 may include at least one functional member (not shown) disposed under the polymer layer 254 .
  • the functional member may include a graphite sheet for heat dissipation, a poster touch FPCB, a fingerprint sensor FPCB, an antenna radiator for communication, a conductive/non-conductive tape, or an open cell sponge.
  • the conductive sheet layer 260 may provide rigidity for supporting the flexible display 250 , and may include folding regions of the flexible display 250 (eg, the first folding region 250e of FIG. 2A ). ) and the second folding region 250f) and the crossing region (eg, the crossing region 250g of FIG. 2A ) to provide specified bending characteristics.
  • the conductive sheet layer 260 may include a metal plate.
  • the conductive sheet layer 260 may be formed of steel use stainless (SUS) (eg, stainless steel (STS)), Cu, Al, or metal CLAD (eg, a stacking member in which SUS and Al are alternately disposed).
  • the conductive sheet layer 260 may include at least one of In some embodiments, the conductive sheet layer 260 may include other alloy materials. In some embodiments, the conductive sheet layer 260 may help to reinforce the rigidity of the electronic device 200 , shield ambient noise, and may be used to dissipate heat emitted from surrounding heat dissipating components.
  • the conductive sheet layer 260 may include a first flat portion 261 corresponding to the first area (eg, the first area 250a of FIG. 2A ) of the flexible display 250 and a second area ( Example: a second planar portion 262 corresponding to the second area 250b of FIG. 2A ), a third planar portion 263 corresponding to a third area (eg, the third area 250c of FIG. 2A ); The fourth planar portion 264 corresponding to the fourth region (eg, the first region 250d of FIG. 2A ) and the first corresponding to the first folding region (eg, the first folding region 250e of FIG.
  • the bending portion 265 , the second bending portion 266 corresponding to the second folding region (eg, the second folding region 250f of FIG. 2A ), and an intersection region (eg, the intersection region 250g of FIG. 2A )) may include an intersection 267 corresponding to .
  • the first bending part 265 has a first bending characteristic for supporting the flexible display 250 to be bent based on a first folding axis (eg, the first folding axis A of FIG. 2A ). may include a first pattern (eg, the first pattern 2651 of FIG.
  • the second bending part 266 has a second bending characteristic for supporting the flexible display 250 to be bent based on a second folding axis (eg, the second folding axis B of FIG. 2A ).
  • a second folding axis eg, the second folding axis B of FIG. 2A
  • the crossing portion 267 may include a third pattern (eg, the third pattern 2671 of FIG. 6C ) provided to have both the first and second bending characteristics.
  • the first flexural characteristic and the second flexural characteristic may or may not be the same.
  • the stacked structures (eg, the polymer layer 254 or the conductive sheet layer 260 ) disposed under the display panel 253 in the flexible display 250 may move in a first direction (eg, FIG. In the Z-axis direction of 2a), the transmittance of the area is reduced by removing (or patterning) it from the portion overlapping with the electronic component (eg, the camera module 204, the sensor module 205, or the fingerprint sensor of FIG. 2A). can be raised
  • the stacked structures disposed under the display panel 253 are at least partially removed (or patterned) in the area (or overlapping area) in which the camera module 204 or the fingerprint sensor (not shown) of FIG. 2A is embedded (or patterned). ) can be
  • the electronic device 200 supports each of the planar portions 261 , 262 , 263 , 264 of the conductive sheet layer 260 under the conductive sheet layer 260 and a reinforcement disposed to provide rigidity.
  • a plate 270 may be included.
  • the reinforcing plate 270 includes a first reinforcing plate 271 corresponding to the first flat portion 261 , a second reinforcing plate 272 corresponding to the second flat portion 262 , and a third It may include a third reinforcing plate 273 corresponding to the flat portion 263 and a fourth reinforcing plate 274 corresponding to the fourth flat portion 264 .
  • the reinforcing plate 270 may be formed of a metal material.
  • the reinforcing plates 271 , 272 , 273 , 274 are excluded, and a support structure for supporting the flexible display 250 through a support member assembly 280 to be described later. may have
  • the support member assembly 280 supports each other at the intersection region of the first hinge module 285 , the second hinge module 286 , and the first hinge module 285 and the second hinge module 286 . It may include an elastic support 287 for connecting, and a plurality of support plates 281 , 282 , 283 , and 284 rotatably connected to the first hinge module 285 and the second hinge module 286 .
  • the support member assembly 280 may support the flexible display 250 in the inner space of the foldable electronic device 200 , and a rigidity for contributing to the rigidity of the foldable electronic device 200 . can have a structure.
  • the first hinge module 285 has a first folding axis (eg, FIG. It may include a first sub-hinge module 2851 and a second sub-hinge module 2852 divided along the first folding axis (A) of 2a.
  • the second hinge module 286 is a third sub-hinge module divided along a second folding axis (eg, the second folding axis (B) of FIG. 2A ) with respect to the elastic support body 287 ). 2861 and a fourth sub-hinge module 2862 may be included.
  • the first sub hinge module 2851 , the second sub hinge module 2852 , the third sub hinge module 2861 , and the fourth sub hinge module 2862 are to be coupled to the elastic support 287 .
  • the first sub-hinge module 2851 and the second sub-hinge module 2852 are formed in a region corresponding to the intersection 267 of the conductive sheet layer 260 through their own structure. When it has a structure in which bending characteristics are expressed, it may be integrally formed.
  • the third sub hinge module 2861 and the fourth sub hinge module 2862 have a structure in which the third bending characteristic is expressed through their own structure in the region corresponding to the intersection 267 . If it has, it may be integrally formed.
  • the plurality of support plates 281 , 282 , 283 , and 284 may include a first support plate 281 and a second planar portion corresponding to the first flat portion 261 of the conductive sheet layer 260 .
  • the first support plate 281 and the third support plate 283 include a first hinge module 285 (eg, a first sub hinge module 2851 , and a second sub hinge module 2852 ). )) may be connected to the second support plate 282 and the fourth support plate 284 .
  • the first support plate 281 and the second support plate 282 include the second hinge module 286 (eg, the third sub hinge module 2861 and the fourth sub hinge module 2862). ) may be connected to the third support plate 283 and the fourth support plate 284 .
  • the first support plate 281 and the second support plate 282 may be connected to each other through the first sub-hinge module 2851 of the first hinge module 285 .
  • the third support plate 283 and the fourth support plate 284 may be connected to each other through the second sub-hinge module 2852 of the first hinge module 285 .
  • the first support plate 281 and the third support plate 283 may be connected to each other through the third sub-hinge module 2861 of the second hinge module 286 .
  • the second support plate 282 and the fourth support plate 284 may be connected to each other through a fourth sub-hinge module 2862 of the second hinge module 286 .
  • At least a portion of the support member assembly 280 (eg, the first hinge module 285 , the second hinge module 286 , or the elastic support body 287 ) includes the housings 210 , 220 , 230 , 240), depending on the state of the foldable electronic device 200 (eg, an unfolded state, a folded state, or an intermediate state), it may be covered by a portion of the housings 210 , 220 , 230 , 240 or , can be exposed to the outside.
  • the foldable electronic device 200 when the foldable electronic device 200 is in an unfolded state, at least a portion of the first hinge module 285 , the second hinge module 286 , and/or the elastic support 287 may include the housing 210 , 220, 230, 240) and may not be exposed.
  • at least a portion of the first hinge module 285 , the second hinge module 286 , and/or the elastic support 287 according to the first folding manner or the second folding manner may be exposed to the outside between the housings 210 , 220 , 230 , and 240 .
  • the intermediate state at least a portion of the first hinge module 285 , the second hinge module 286 , and/or the elastic support 287 is externally between the housings 210 , 220 , 230 , 240 . may be partially exposed.
  • the exposed area of the intermediate state may be less than that of the folded state.
  • the substrates 291 , 292 , the batteries 293 , 294 , and the FPCBs 295 include the support plates 281 , 282 , 283 , 284 and the back covers 214 , 224 , 234, 244) may be disposed in the space formed between.
  • the substrates 291 and 292 , the batteries 293 and 294 , and the FPCBs 295a , 295b and 295c are disposed between the first support plate 281 and the first back cover 214 , and the second support plate disposed between 282 and the second back cover 224 , between the third support plate 283 and the third back cover 234 , and/or between the fourth support plate 284 and the fourth back cover 244 .
  • the first battery ( 293) may be disposed, in a position corresponding to a space between the fourth support plate 284 and the fourth back cover 244 or a designated space (eg, a swelling hole) of the fourth support plate 284 .
  • a second battery 294 may be disposed.
  • the substrates 291 and 292 for driving the flexible display 250 and operating the electronic device may be adjacent to each other or disposed in a diagonal direction.
  • the first substrate 291 (eg, the main substrate) and/or the camera module 204 may include a first housing (eg, the first housing of FIG. 2A ) in order to improve assembly and slimness of the electronic device 200 . (210)) may be disposed in the inner space.
  • the second substrate 292 may include an internal space of a second housing (eg, the second housing 220 of FIG. 2A ) and a third housing (eg, the third housing of FIG. 2A ). It may be disposed in the inner space of the housing 230 ) or the inner space of the fourth housing (eg, the fourth housing 240 of FIG. 2A ).
  • the internal space of the four divided housings 210 , 220 , 230 , 240 includes batteries 293 , 294 , substrates 291 , 292 , or electronics such as the camera module 204 . The parts can be arranged separately.
  • the first substrate 291 and the camera module 204 are disposed in the inner space of the first housing (eg, the first housing 210 of FIG. 2A ), and the third housing (eg, the third housing of FIG. 2A )
  • the second substrate 292 By disposing the second substrate 292 in the inner space of the 230 ), it may be advantageous to minimize the number of the flexible substrates 295a , 295b , and 295c disposed through the folding area.
  • FIG. 5 is a diagram illustrating a configuration of a conductive sheet layer according to various embodiments of the present disclosure.
  • 6A is an enlarged view of area 6A of FIG. 5 according to various embodiments of the present disclosure;
  • 6B is an enlarged view of area 6B of FIG. 5 according to various embodiments of the present disclosure;
  • At least one of the components (eg, the conductive sheet layer 260) of the foldable electronic device (eg, the foldable electronic device 200 of FIG. 2 ) according to various embodiments of the present disclosure is the folder of FIGS. 2A to 4 . Since it is the same as or similar to at least one of the components of the electronic device 200 , the overlapping description will be omitted below.
  • the conductive sheet layer 260 includes a first flat portion 261 corresponding to a first area (eg, a first area 250a of FIG. 2A ) of the flexible display 250 ,
  • the second planar part 262 corresponding to the second region (eg, the second region 250b of FIG. 2A ), and the third plane part corresponding to the third region (eg, the third region 250c of FIG. 2A )) 263), the fourth planar portion 264 corresponding to the fourth region (eg, the first region 250d of FIG. 2A ), and the first folding region (eg, the first folding region 250e of FIG.
  • the foldable electronic device 200 may have a lattice shape capable of drawing in the longitudinal direction of the first bending part 265 (eg, in substantially the same direction as the first folding axis A). ) through the hinge of the multi-joint shape of the metal and the first hinge module (eg, the first hinge module 285 of FIG. 4 ), it can be folded in the first folding method (eg, out-folding).
  • the foldable electronic device 200 includes a lattice-type metal and a second hinge that can be stretched in the transverse direction of the second bending part 266 (eg, in substantially the same direction as the second folding axis B).
  • the module eg, the second hinge module 286 of FIG. 4
  • the module may be folded in the second folding method (eg, in-folding) through the biaxial hinge.
  • the first bending part 265 includes a first pattern 2651 providing a first bending characteristic for supporting the flexible display 250 to be bent with respect to the first folding axis A. can do.
  • the first pattern 2651 may include a plurality of first openings 2651a.
  • each of the plurality of first openings 2651a has a first length H1 in a direction substantially parallel to the first folding axis A (Y-axis direction), and the first length ( It may be formed as a slit having a first width W1 smaller than H1) and having a first interval T1 with respect to each other.
  • the first bending characteristic may be determined through the shape and/or arrangement structure of the plurality of first openings 2651a.
  • the second bending part 266 includes a second pattern 2661 providing a second bending characteristic for supporting the flexible display 250 to be bent based on the second folding axis B. can do.
  • the second pattern 2661 may include a plurality of second openings 2661a.
  • each of the plurality of second openings 2661a has a second length H2 in a direction substantially parallel to the second folding axis B (X-axis direction), and the second length ( It may be formed as a slit having a second width W2 smaller than H2) and having a second interval T2 with respect to each other.
  • the second bending characteristic may be determined through a shape and/or an arrangement structure of the plurality of second openings 2661a.
  • housings of the foldable electronic device 200 may be operated in a first folding method (eg, out-folding method) based on the first folding axis (A), and in a second folding method (eg, in-folding method) based on the second folding axis (B).
  • first folding method eg, out-folding method
  • second folding method eg, in-folding method
  • the first folding method and the second folding method are not the same, the first bending characteristic and the second bending characteristic may be determined differently.
  • the first bending characteristic and the second bending characteristic may be determined to be substantially the same.
  • the flexural property may be measured by fixing at least one side of the specimen to be measured (eg, the specimen 800 of FIG. 6D ) and obtaining the distortion by applying a load in the vertical direction on which the specimen is placed.
  • FIG. 6C is an enlarged view of area 6c of FIG. 5 according to various embodiments of the present disclosure.
  • the intersection 267 of the conductive sheet layer 260 has a first bending characteristic of the first bending part 265 and/or a second bending characteristic of the second bending part 266 .
  • a third pattern 2671 provided to include (satisfy) may be included.
  • the third pattern 2671 has a third interval T3 specified along the x-axis direction, and a plurality of third openings (T4) arranged at a fourth interval T4 along the y-axis direction. 2671a).
  • T3 specified along the x-axis direction
  • T4 a plurality of third openings arranged at a fourth interval T4 along the y-axis direction. 2671a).
  • each of the plurality of third openings 2671a must be bent with respect to the first folding axis A and the second folding axis B, they are formed symmetrically with respect to the center C.
  • each of the plurality of third openings 2671a has an x-axis (eg, a first axis) passing through the center C, and a y-axis (eg, a first axis) passing through the center C and substantially perpendicular to the x-axis (eg: The second axis) may have a shape formed symmetrically with respect to each other.
  • each of the plurality of third openings 2671a may be disposed to have a specified separation distance from each other (eg, a third interval T3 and a fourth interval T4).
  • the plurality of third openings 2671a may be arranged such that the third interval T3 and the fourth interval T4 are substantially the same.
  • the third bending characteristic may be determined through the shape and/or arrangement structure of the plurality of third openings 2671a (spaced distances T3 and T4 between unit openings).
  • the third pattern 2671 is disposed in the space 2601 between the plurality of third openings 2671a, and a plurality of fourth openings disposed to have a designated fifth separation distance T5. (2671b).
  • the plurality of fourth openings 2671b may be symmetrically formed with respect to the center C of each of the plurality of fourth openings 2671b, and may be formed symmetrically on the x-axis and/or y It may be arranged to have the same fifth separation distance T5 along the axial direction.
  • the third bending characteristic of the intersection portion may be determined through the shape and/or arrangement structure of the plurality of fourth openings 2671b (a distance T5 between unit openings).
  • a diameter of each of the plurality of third openings 2671a may be within 6 mm.
  • a diameter of the plurality of fourth openings 2671b may be within 4 mm.
  • the plurality of third openings 2671a or the plurality of fourth openings 2671b may be omitted.
  • the third pattern 2671 includes a plurality of third openings 2671a disposed at a third interval T3 specified in the x-axis direction and at a fourth interval T4 specified in the y-axis direction. may be included, and the plurality of fourth openings 2671b may not be included.
  • the first bending part 265 may have a first bending characteristic that may be bent based on the first folding axis A through the first pattern 2651 .
  • the first bending characteristic may be determined through a first aperture ratio per unit area of the first pattern 2651 formed on the first bending part 265 .
  • the first bending part 265 may be formed to satisfy bending characteristics and rigidity by adjusting the first aperture ratio.
  • the second bending part 266 may have a second bending characteristic that can be bent based on the second folding axis A through the second pattern 2661 .
  • the second bending characteristic may be determined through the second aperture ratio per unit area of the second pattern 2661 formed on the second bending part 266 .
  • the second bending part 266 may be formed to satisfy the bending characteristics and rigidity by adjusting the second aperture ratio.
  • having the third flexural characteristic satisfying both the first flexural characteristic and the second flexural characteristic may mean that the third flexural characteristic is greater than the first flexural characteristic and the second flexural characteristic.
  • the crossing portion 267 having the third bending characteristic may be more bent than the first bending portion 265 having the first bending characteristic and the second bending portion 266 having the second bending characteristic.
  • the crossing portion 267 is bent based on the first bending characteristic and the second folding axis B, which are bent based on the first folding axis A, through the third pattern 2671 . It may have a third bending characteristic that satisfies the second bending characteristic. According to an embodiment, the third bending characteristic may be determined through the third aperture ratio per unit area of the third pattern 2671 formed at the intersection 267 .
  • the intersection portion 267 ) of the third aperture ratio may be determined to be at least equal to or greater than the first aperture ratio of the first bending part 265 and the second aperture ratio of the second bending part 266 .
  • the crossing portion 267 in which different folding methods intersect has the same or similar bending stiffness to the first bending portion 265 when folded in the first folding method (eg, out-folding method). ), and when folding in the second folding method (eg, in-folding method), it must have the same or similar bending stress as the second bending portion 266 to reduce the phenomenon of stress concentration in the intersection portion 267 have.
  • a breaking phenomenon due to stress concentration may be reduced through a plurality of third openings 2671a and/or a plurality of fourth openings 2671b disposed at the same vertical, horizontal, and horizontal intervals.
  • the center of each of the plurality of third openings 2671a is at least a portion of the center of at least some of the plurality of first openings 2651a and the center of at least some of the plurality of second openings 2661a and the center of each of the plurality of third openings 2671a They may be arranged on substantially the same line.
  • the center of each of the plurality of fourth openings 2671b is also substantially the same as the center of at least some of the plurality of first openings 2651a and the center of at least some of the plurality of second openings 2661a can be placed on the same line.
  • the third width W3 (eg, horizontal length) of each of the plurality of third openings 2671a is 2 in consideration of the shape of the first pattern 2651 of the first bending part 255 . May be equal to *W1+T1.
  • the fourth width W4 (eg, vertical length) of each of the plurality of third openings 2671a is 2 in consideration of the shape of the second pattern 2661 of the second bending part 256 . May be equal to *W2+T2.
  • the plurality of fourth openings 2671b may be disposed between the plurality of third openings 2671a while maintaining substantially the same distance.
  • the third interval T3 of each of the plurality of third openings 2671a is equal to the first width W1 of the plurality of first openings 2651a
  • the fourth interval T4 is a plurality of It may be equal to the second width W2 of each of the second openings 2661a.
  • an interval between the plurality of third openings 2671a and/or the plurality of fourth openings 2671b may be adjusted in a range of about 50% to 300% while maintaining the same distance.
  • 6D is a diagram illustrating a relationship between bending stiffness due to a load applied to a specimen according to various embodiments of the present disclosure
  • the bending characteristics of the conductive sheet layer 260 are calculated when one end of a specimen 800 (eg, a cantilever) to be measured is fixed and a load is applied from the other end in a vertical direction. It can be measured through the following ⁇ Equation 1> related to bending stiffness.
  • Equation 1 P is a load applied to the specimen 800
  • L is the length of the specimen 800
  • t may include the thickness of the specimen 800 .
  • Equation 1 it can be seen that the bending stiffness is proportional to the length (L) of the specimen and inversely proportional to the thickness (t) of the specimen.
  • the first bending part 265 when the first width W1 of the plurality of first openings 2651a decreases and the first interval T1 increases, the stress and repulsive force increase during bending. However, the rigidity in the thickness direction can be increased.
  • the stress and repulsive force during bending are reduced, but in the thickness direction stiffness may be lowered.
  • FIG. 7A is a partial cross-sectional view of the foldable electronic device 200 taken along line 7A-7A of FIG. 2A according to various embodiments of the present disclosure.
  • the foldable electronic device 200 includes a flexible display 250 , a conductive sheet layer 260 disposed under the flexible display 250 , reinforcing plates 271 and 272 , and support plates 281 . , 282).
  • the flexible display 250 may include a window layer 251 , a polarization layer 252 sequentially disposed under the window layer 251 , a display panel 253 , and a polymer layer 254 .
  • the polymer layer 254 may include a cushion layer 2541 , a first layer 2542 stacked with the cushion layer 2541 interposed therebetween, and a second layer 2543 .
  • the polymer layer 254 may block the inflow of foreign substances through the plurality of first openings 2651a formed of the first pattern 2651 of the conductive sheet layer 260, and the first bending part ( 265 , a stacked structure for preventing visibility of the folding boundary area of the flexible display 250 according to the folding and unfolding operation of the flexible display 250 may be provided.
  • the cushion layer 2541 may be formed of a material (eg, sponge or poron) for cushioning.
  • the first layer 2542 disposed on the cushion layer 2541, and the second layer 2543 disposed under the cushion layer 2541 are for surface quality improvement (visibility improvement). It may be formed of a material (eg, TPU (thermoplastic polyurethane)).
  • the conductive sheet layer 260 includes a first flat portion 261 , a second flat portion 262 , and a first extending from the first flat portion 261 to the second flat portion 262 .
  • a bending part 265 may be included.
  • the conductive sheet layer 260 may include a first pattern 2651 including a plurality of first openings 2651a disposed on the first bending part 265 .
  • the foldable electronic device 200 may include a first reinforcing plate 271 disposed under the first flat portion 261 , and a first support plate 281 disposed below the first flat portion 261 . have.
  • the foldable electronic device 200 may include a second reinforcing plate 272 disposed under the second planar portion 262 , and a second support plate 282 disposed below the second flat portion 262 .
  • the first support plate 281 and the second support plate 282 may be rotatably connected through the first hinge module 285 .
  • the first hinge module 285 includes a plurality of link members 285a and coupling members (not shown) on both sides of the link members 285a, respectively, and the first support plate 281 is formed on one side of the first hinge module 285 . It may be connected to a coupling member (not shown), and the second support plate 282 may be coupled to a coupling member (not shown) on the other side.
  • the first bending part 265 may support the first folding area (eg, the first folding area 250e of FIG. 2A ) under the flexible display 250 so that the first bending characteristic related to the first pattern 2651 is applied. .
  • FIG. 7B is a partial cross-sectional view of a foldable electronic device taken along line 7b-7b of FIG. 2A according to various embodiments of the present disclosure
  • the conductive sheet layer 260 includes a first flat portion 261 , a third flat portion 263 , and a second portion extending from the first flat portion 261 to the third flat portion 263 .
  • a bending part 266 may be included.
  • the conductive sheet layer 260 may include a second pattern 2661 including a plurality of second openings 2661a disposed on the second bending part 266 .
  • the foldable electronic device 200 may include a first reinforcing plate 271 disposed under the first flat portion 261 , and a first support plate 281 disposed below the first flat portion 261 . have.
  • the foldable electronic device 200 may include a third reinforcing plate 273 disposed under the third planar portion 263 , and a third support plate 283 disposed below the third flat portion 263 .
  • the first support plate 281 and the third support plate 283 may be rotatably connected through the second hinge module 286 .
  • the second hinge module 286 includes a plurality of gears (not shown) and a plurality of rotation parts (not shown) supporting the plurality of gears (not shown), and the first support plate 281 is It may be connected to one rotating part (not shown), and the third support plate 283 may be connected to another rotating part (not shown).
  • the second bending part Reference numeral 266 may support a second folding area (eg, the second folding area 250f of FIG. 2A ) under the flexible display 250 to apply a second bending characteristic related to the second pattern 2661 .
  • FIG. 7C is a partial cross-sectional view illustrating a state in which the first hinge module 285 and the second hinge module 286 are connected through the elastic support 287 disposed in the region 7c of FIG. 2A according to various embodiments of the present disclosure. .
  • the first hinge module 285 is located in a region corresponding to the intersection (eg, the intersection 267 of FIG. 5 ) of the conductive sheet layer (eg, the conductive sheet layer 260 of FIG. 5 ).
  • a first sub-hinge module 2851 and a second sub-hinge module 2852 divided along a first folding axis (eg, the first folding axis (A) of FIG. 2A ) based on the disposed elastic support 287 may include
  • the second hinge module 286 is a third sub-hinge module divided along a second folding axis (eg, the second folding axis (B) of FIG. 2A ) with respect to the elastic support body 287 ).
  • the elastic support 287 may include a highly stretchable elastomer such as urethane, silicone, or rubber.
  • the first sub hinge module 2851, the second sub hinge module 2852, the third sub hinge module 2861, and the fourth sub hinge module 2862 may be formed of a metal material. , may be fixed to the elastic support 287 through insert injection.
  • the first sub hinge module 2851 , the second sub hinge module 2852 , the third sub hinge module 2861 , and the fourth sub hinge module 2862 are structurally coupled (eg, fit-to-fit couplings). structure) may be fixed to the elastic support 287 .
  • the elastic support 287 may be disposed to protect and/or support internal electronic components according to a state (eg, an unfolded state, a folded state, or an intermediate state) of the foldable electronic device 200 .
  • the elastic support 287 may perform the same or similar function as the rear cover (eg, the rear cover (and the rear covers 214, 224, 234, 244) of FIG. 4),
  • a hinge module eg, a first sub hinge module 2851 , a second sub hinge module 2852 , a third sub hinge module 2861 , and a fourth sub hinge module 2862
  • a lattice structure it is possible to provide stability to a state change of the foldable electronic device 200 .
  • the elastic support 287 may include a metal sheet.
  • the elastic support 287 may include a fourth pattern including a plurality of openings in the metal sheet.
  • the elastic support 287 uses an adhesive member (eg, adhesive tape, or bond) or a welding member (eg, nickel, chromium, or copper), and the first sub-hinge module 2851 and the second sub-hinge module 2852 , the third sub hinge module 2861 and the fourth sub hinge module 2862 may be attached to at least one hinge module.
  • FIG. 8 is a cross-sectional view of the conductive sheet layer 260 taken along line 8-8 of FIG. 5 for comparison of thicknesses for each region according to various embodiments of the present disclosure.
  • the conductive sheet layer 260 is disposed between the second bending portion 266 having a first thickness D1 and the first bending portion 265 , and is thinner than the first thickness D1 . It has a second thickness D2 and may include an intersecting portion 267 intersecting the first bending portion 265 . According to one embodiment, the crossing portion 267 of the conductive sheet layer 260 is formed to have a thickness thinner than that of the first and second bending portions 265 and 266 surrounding the first bending portion 265 . ) through a first pattern (eg, the first pattern 2651 of FIG.
  • the crossing portion 267 may be formed to have a thickness thinner than the thickness of the first and second bending portions 265 and 266 around it through an etching process.
  • the crossing portion 267 of the conductive sheet layer 260 is formed to have a thinner thickness than the peripheral first bending part 265 and the second bending part 266 , so that the conductive sheet layer 260 is crossed.
  • the part 267 may not include an opening.
  • the intersecting portion 267 of the conductive sheet layer 260 may be formed to have a third bending characteristic without forming an opening or a pattern.
  • 9A and 9B are diagrams illustrating various embodiments of the area 6c of FIG. 5 according to various embodiments of the present disclosure.
  • the intersection ( 267 ) may be determined to be at least equal to or greater than the first aperture ratio of the first bending part 265 and the second opening ratio of the second bending part 266 .
  • the third pattern 2671 may be deformed into various shapes under a condition that satisfies the above-described third aperture ratio.
  • the third pattern 2671 has a first axis x1 passing through the center C, and a second axis passing through the center C and perpendicular to the first axis x1. It may include a plurality of third openings 2671c and 2671e formed symmetrically with respect to each other based on (y1) and arranged to have a specified separation distance (eg, a third interval D3) with respect to each other. . According to an embodiment, the third pattern 2671 may include a plurality of fourth openings 2671d and 2671f disposed between the plurality of third openings 2671c and 2671e.
  • the plurality of third openings 2671c and 2671e and the plurality of fourth openings 2671d and 2671f are circular, and/or a cross shape, cruciform shaped symmetrically. may include Also, the plurality of openings (eg, the third openings 2671c and 2671e , or the fourth openings 2671d and 2671f ) may be formed in a recess shape. According to an embodiment, the plurality of third openings 2671c and 2671e may be formed in the same shape as or different from those of the plurality of fourth openings 2671d and 2671f.
  • the plurality of third openings 2671c and 2671e and the plurality of fourth openings 2671d and 2671f may be formed in a square shape.
  • the bending characteristics of the intersection eg, the intersection 267 in FIG. 5
  • the shapes and/or positions of the plurality of third openings 2671c and 2671e and the plurality of fourth openings 2671d and 2671f are not limited to the illustrated embodiment, and various embodiments are not limited thereto. It may be changed depending on the example.
  • the electronic device (eg, the electronic device 200 of FIG. 2A ) includes a first housing (eg, the first housing 210 of FIG. 2A ) and a first hinge module (eg, the electronic device 200 of FIG. 2B ).
  • a first hinge module eg, the electronic device 200 of FIG. 2B
  • a second housing eg, in FIG. 2A through the second housing 220
  • a second hinge module eg, the second hinge module 286 of FIG. 2B
  • a second folding axis intersecting the first folding axis (eg, in FIG. 2A ) Based on the second folding shaft (B)
  • a third housing (eg, the third housing 230 of FIG.
  • a fourth housing eg, in FIG. The fourth housing 240 of 2a
  • the first housing, the second housing, the third housing, and the flexible display disposed to receive the support of the fourth housing (eg, the flexible display 250 of FIG. 2A )
  • a first region corresponding to the first housing eg, the first region 250a of FIG. 2A
  • a second region corresponding to the second housing eg, the second region 250b of FIG. 2A
  • a third region corresponding to the third housing eg, a third region 250c in FIG. 2A
  • a fourth region corresponding to the fourth housing eg, a fourth region 250d in FIG.
  • a flexible display including a second folding area 250f of a second folding area of and a first bending part corresponding to the first folding area and including a first pattern (eg, the first pattern 2651 of FIG. 6A ). (eg, the bending part 265 of FIG. 5 ), and a second bending part (eg, FIG. 5 ) that corresponds to the second folding area and includes a second pattern (eg, the second pattern 2661 of FIG. 6B ).
  • intersection 267 in FIG. 5 corresponding to the intersection region and including a third pattern (eg, the third pattern 2671 in FIG. 6C ))
  • a conductive sheet layer eg, the conductive sheet layer 260 of FIG. 5 including:
  • the first pattern includes a plurality of first openings in which the first bending part has a first bending characteristic
  • the second pattern includes the second bending part having a second bending characteristic.
  • a plurality of second openings may be included
  • the third pattern may include a plurality of third openings formed so that the crossing portion has a third bending characteristic.
  • the first bending characteristic is determined through the shape and/or arrangement structure of the plurality of first openings
  • the second bending characteristic is determined by the shape and/or arrangement structure of the plurality of second openings.
  • each of the plurality of first openings may include a slit structure having a length along the first folding axis.
  • each of the plurality of second openings may include a slit structure having a length along the second folding axis.
  • the plurality of first openings may be formed such that the first bending portion has a first aperture ratio
  • the plurality of second openings may be formed such that the second bending portion has a second aperture ratio
  • the intersection portion is formed to have a third aperture ratio
  • the third aperture ratio may be determined to be equal to or larger than the first aperture ratio and the second aperture ratio
  • each of the plurality of third openings may be formed in a vertical, horizontally symmetrical shape, and may be disposed to have a specified spacing with respect to each other.
  • the plurality of fourth openings may include a plurality of fourth openings disposed at regular intervals in a space between the plurality of third openings.
  • the first housing when the electronic device is folded in the first folding manner, the first housing corresponds to the second housing, the third housing corresponds to the fourth housing, and the electronic device When folded in a folding manner, the first housing may correspond to the third housing, and the second housing may correspond to the fourth housing.
  • the flexible display when folded in the first folding method, at least a portion of the flexible display may be visually exposed, and when folded in the second folding method, the flexible display may not be visually exposed.
  • At least some of the respective housings when folded in the first folding method and/or in the second folding method, at least some of the respective housings may be asymmetrically folded with respect to each other.
  • the first hinge module includes a first sub-hinge module and a second sub-hinge module divided along the first folding axis based on the crossing region, and the second hinge module includes the crossing region.
  • a third sub-hinge module and a fourth sub-hinge module divided along the second folding axis based on can do.
  • the elastic support body may be formed of an elastic material that satisfies both bending characteristics of the first hinge module and the second hinge module.
  • the electronic device includes a plurality of housings that are foldably coupled with respect to a first folding axis and/or a second folding axis intersecting the first folding axis, and the plurality of housings to receive the support of the housings.
  • a flexible display that is arranged, wherein a foldable first folding area corresponding to the first folding axis, a foldable second folding area corresponding to the second folding axis, and the first folding area and the second folding area intersect a flexible display including an intersecting region of and a conductive sheet layer including a second bending portion and an intersection portion corresponding to the intersection region and including a third pattern.
  • the first pattern includes a plurality of first openings in which the first bending part has a first bending characteristic
  • the second pattern includes the second bending part having a second bending characteristic.
  • a plurality of second openings may be included
  • the third pattern may include a plurality of third openings formed so that the crossing portion has a third bending characteristic.
  • the first bending portion in the plurality of first openings, is formed to have a first aperture ratio, and in the plurality of second openings, the second bending portion is formed to have a second aperture ratio, and the plurality of first openings are formed to have a second aperture ratio.
  • the intersection portion is formed to have a third aperture ratio, and the third aperture ratio may be determined to be equal to or greater than the first aperture ratio and the second aperture ratio.
  • each of the plurality of third openings may be formed in a vertical, horizontally symmetrical shape, and may be disposed to have a specified spacing with respect to each other.
  • the flexible display supported by the conductive sheet layer includes a window layer, a first folding area disposed under the window layer, a first folding area corresponding to a first folding axis, and a first folding area intersecting the first folding axis.
  • a display panel comprising a second folding area corresponding to two folding axes and an intersection area corresponding to an area in which the first folding axis and the second folding axis intersect, and a polymer layer disposed under the display panel
  • the conductive sheet layer is disposed under the polymer layer, and includes a first bending part corresponding to the first folding area and including a first pattern, and a second bending part corresponding to the second folding area and including a second pattern. and a third pattern corresponding to the crossing region.
  • the first pattern includes a plurality of first openings in which the first bending part has a first bending characteristic
  • the second pattern includes the second bending part having a second bending characteristic.
  • a plurality of second openings formed to have a plurality of second openings
  • the third pattern includes a plurality of third openings formed such that the crossing portion has a third bending characteristic
  • the third bending characteristic is the first bending characteristic and It may be determined to include the second bending characteristic.

Abstract

An electronic device, according to various embodiments, may comprise: a plurality of housings coupled so as to be foldable about a first folding axis and/or a second folding axis intersecting with the first folding axis; a flexible display disposed so as to be supported by the plurality of housings, and comprising a first folding region which is foldable and corresponds to the first folding axis, a second folding region which is foldable and corresponds to the second folding axis, and an intersecting region in which the first folding region and the second folding region intersect; and a conductive sheet layer disposed under the flexible display and comprising a first bending part which corresponds to the first folding region and comprises a first pattern, a second bending part which corresponds to the second folding region and comprises a second pattern, and an intersecting part which corresponds to the intersecting region and comprises a third pattern.

Description

폴더블 전자 장치foldable electronics
본 개시의 다양한 실시예들은 폴더블 전자 장치에 관한 것이다.Various embodiments of the present disclosure relate to a foldable electronic device.
전자 장치는 점차 슬림화되어가고 있으며, 전자 장치의 디스플레이는 다양한 컨텐츠들(예: 영화 또는 웹 서핑)을 하나의 화면에서 많은 정보를 제공하거나 큰 화면을 제공할 수 있도록 점점 커지고 있다. 또한, 전자 장치는 강성이 증가되고, 디자인적 측면이 강화됨과 동시에, 그 기능적 요소가 차별화되도록 개선되고 있다. 이러한 전자 장치는 휴대가 편리하면서, 대화면 디스플레이를 이용할 수 있는 변형 가능한 구조를 가질 수 있다. 변형 가능한 구조의 일환으로, 전자 장치는 복수의 하우징들이 서로에 대하여 접히는 방식으로 동작하는 폴더블(foldable) 전자 장치를 포함할 수 있다.Electronic devices are getting slimmer, and the display of the electronic device is getting bigger so that a lot of information can be provided on a single screen or a large screen can be provided with various contents (eg, movie or web surfing). In addition, the electronic device is being improved so that rigidity is increased, design aspects are strengthened, and functional elements thereof are differentiated. Such an electronic device may have a deformable structure capable of using a large-screen display while being convenient to carry. As part of the deformable structure, the electronic device may include a foldable electronic device that operates in a manner in which a plurality of housings are folded with respect to each other.
폴더블 전자 장치는 서로에 대하여 접히는 방식으로, 폴딩 동작을 수행하는 복수의 하우징들을 포함할 수 있으며, 펼쳐진 상태에서, 대화면 디스플레이를 이용할 수 있고, 접혀진 상태에서, 그 부피가 축소되어 휴대가 용이할 수 있다. 이러한 폴더블 전자 장치는 하나의 힌지 모듈을 통해 두 개의 하우징들이 지정된 폴딩 방식들로 접히고 펼쳐지는 동작이 수행될 수 있다. 이러한 폴딩 방식들은 힌지 모듈에 의해 회동 가능하게 연결된 두 개의 하우징들을 통해, 접힘 상태에서 플렉서블 디스플레이가 시각적으로 노출되는 아웃 폴딩(out folding) 방식, 또는 접힘 상태에서 플렉서블 디스플레이가 시각적으로 노출되지 않는 인 폴딩(in-folding) 방식을 포함할 수 있다.The foldable electronic device may include a plurality of housings that perform a folding operation in a manner that is folded with respect to each other, and in an unfolded state, a large-screen display may be used, and in the folded state, the volume thereof is reduced to facilitate portability. can In such a foldable electronic device, an operation of folding and unfolding two housings in designated folding methods may be performed through a single hinge module. These folding methods are an out-folding method in which the flexible display is visually exposed in a folded state through two housings rotatably connected by a hinge module, or an in-folding method in which the flexible display is not visually exposed in the folded state. It may include an (in-folding) method.
다양한 실시예들에 따르면, 폴더블 전자 장치를 제공할 수 있다.According to various embodiments, a foldable electronic device may be provided.
다양한 실시예에 따르면, 교차 배치된 폴딩축들을 통해 다양한 폴딩 방식으로 동작되는 폴더블 전자 장치를 제공할 수 있다.According to various embodiments, it is possible to provide a foldable electronic device that is operated in various folding methods through intersecting folding axes.
다양한 실시예에 따르면, 교차 배치된 폴딩축들과 대응하는 플렉서블 디스플레이의 대응 영역을 지지하고, 굴곡 특성이 제공될 수 있는 지지 구조를 갖는 폴더블 전자 장치를 제공할 수 있다.According to various embodiments, it is possible to provide a foldable electronic device having a support structure capable of supporting a corresponding area of the flexible display corresponding to the intersecting folding axes and providing a bending characteristic.
본 개시의 다양한 실시예에 따르면, 적어도 두 개의 힌지 모듈의 교차 배치를 통해 서로 교차하는 폴딩축들을 갖는 갖는 폴더블 전자 장치에 있어서, 교차된 힌지 모듈에 의해 동작하는 하우징들을 통해 지지받는 플렉서블 디스플레이의 강성을 보강하고 굴곡 특성을 결정할 수 있는 지지 부재(예: 도전성 시트층 또는 도전성 플레이트)를 포함할 수 있다.According to various embodiments of the present disclosure, in a foldable electronic device having folding axes that cross each other through the cross arrangement of at least two hinge modules, the flexible display supported through housings operated by the crossed hinge modules It may include a support member (eg, a conductive sheet layer or a conductive plate) capable of reinforcing stiffness and determining flexural properties.
본 개시에서 이루고자 하는 기술적 과제는 이상에서 언급한 기술적 과제로 제한되지 않으며, 언급되지 않은 또 다른 기술적 과제들은 아래의 기재로부터 본 개시가 속하는 기술분야에서 통상의 지식을 가진 자에게 명확하게 이해될 수 있을 것이다.The technical problems to be achieved in the present disclosure are not limited to the technical problems mentioned above, and other technical problems not mentioned can be clearly understood by those of ordinary skill in the art to which the present disclosure belongs from the description below. There will be.
다양한 실시예에 따르면, 전자 장치는, 제1하우징과, 제1힌지 모듈을 통해, 제1폴딩축을 기준으로, 상기 제1하우징과 접힘 가능하게 연결되는 제2하우징과, 제2힌지 모듈을 통해, 상기 제1폴딩축과 교차하는 제2폴딩축을 기준으로, 상기 제1하우징과 접힘 가능하게 연결되는 제3하우징과, 상기 제1힌지 모듈을 통해, 상기 제1폴딩축을 기준으로, 상기 제3하우징과 접힘 가능하게 연결되고, 상기 제2힌지 모듈을 통해, 상기 제2폴딩축을 기준으로, 상기 제2하우징과 접힘 가능하게 연결되는 제4하우징과, 상기 제1하우징, 상기 제2하우징, 상기 제3하우징 및 상기 제4하우징의 지지를 받도록 배치되는 플렉서블 디스플레이로써, 상기 제1하우징에 대응하는 제1영역과, 상기 제2하우징에 대응하는 제2영역과, 상기 제3하우징에 대응하는 제3영역과, 상기 제4하우징에 대응하는 제4영역과, 상기 제1폴딩축과 대응하고 접힘 가능한 제1폴딩 영역과, 상기 제2회전축과 대응하는 접힘 가능한 제2폴딩 영역 및 상기 제1폴딩 영역과 상기 제2폴딩 영역이 교차하는 교차 영역을 포함하는 플렉서블 디스플레이 및 상기 플렉서블 디스플레이 아래에 배치되고, 상기 제1폴딩 영역에 대응하고 제1패턴을 포함하는 제1밴딩부, 상기 제2폴딩 영역에 대응하고 제2패턴을 포함하는 제2밴딩부 및 상기 상기 교차 영역과 대응하고 제3패턴을 포함하는 교차부를 포함하는 도전성 시트층을 포함할 수 있다.According to various embodiments of the present disclosure, the electronic device includes a first housing, a second housing that is foldably connected to the first housing with respect to a first folding axis through a first hinge module, and a second hinge module. , Based on a second folding axis that intersects the first folding axis, a third housing that is foldably connected to the first housing, and the first hinge module, based on the first folding axis, the third a fourth housing foldably connected to the housing and foldably connected to the second housing with respect to the second folding axis through the second hinge module; the first housing; the second housing; A flexible display disposed to be supported by a third housing and the fourth housing, a first area corresponding to the first housing, a second area corresponding to the second housing, and a third area corresponding to the third housing A third area, a fourth area corresponding to the fourth housing, a first folding area corresponding to the first folding shaft and foldable, a second folding area corresponding to the second rotation axis, and the first folding area A flexible display including an intersecting area in which an area and the second folding area intersect, a first bending part disposed under the flexible display, the first bending part corresponding to the first folding area and including a first pattern, and the second folding area and a conductive sheet layer including a second bending portion corresponding to and including a second pattern and an intersection portion corresponding to the cross region and including a third pattern.
다양한 실시예에 따르면, 전자 장치는, 제1폴딩축 및/또는 제1폴딩축과 교차하는 제2폴딩축을 기준으로 접힘 가능하게 결합되는 복수의 하우징들과, 상기 복수의 하우징들의 지지를 받도록 배치되는 플렉서블 디스플레이로써, 상기 제1폴딩축과 대응하고 접힘 가능한 제1폴딩 영역과, 상기 제2폴딩축과 대응하고 접힘 가능한 제2폴딩 영역 및 상기 제1폴딩 영역과 상기 제2폴딩 영역이 교차하는 교차 영역을 포함하는 플렉서블 디스플레이 및 상기 플렉서블 디스플레이 아래에 배치되고, 상기 제1폴딩 영역에 대응하고 제1패턴을 포함하는 제1밴딩부, 상기 제2폴딩 영역에 대응하고 제2패턴을 포함하는 제2밴딩부 및 상기 상기 교차 영역과 대응하고 제3패턴을 포함하는 교차부를 포함하는 도전성 시트층을 포함할 수 있다.According to various embodiments of the present disclosure, the electronic device includes a plurality of housings that are foldably coupled with respect to a first folding axis and/or a second folding axis intersecting the first folding axis, and the plurality of housings are arranged to receive support. A flexible display comprising: a first folding area corresponding to the first folding axis and foldable; a second folding area corresponding to the second folding axis and foldable; and the first folding area and the second folding area intersecting a flexible display including an intersecting area, a first bending part disposed under the flexible display and corresponding to the first folding area and including a first pattern, and a first bending part corresponding to the second folding area and including a second pattern and a conductive sheet layer including two bending portions and an intersection portion corresponding to the intersection region and including a third pattern.
다양한 실시예에 따르면, 도전성 시트층의 지지를 받는 플렉서블 디스플레이는, 윈도우층과, 상기 윈도우층 아래에 배치되고, 제1폴딩축과 대응하는 제1폴딩 영역, 상기 제1폴딩축과 교차하는 제2폴딩축과 대응하는 제2폴딩 영역 및 상기 제1폴딩축과 상기 제2폴딩축이 교차하는 영역에 대응하는 교차 영역을 포함하는 디스플레이 패널 및 상기 디스플레이 패널 아래에 배치되는 폴리머층을 포함하고, 상기 도전성 시트층은 상기 폴리머층 아래에 배치되고, 상기 제1폴딩 영역에 대응하고 제1패턴을 포함하는 제1밴딩부, 상기 제2폴딩 영역에 대응하고 제2패턴을 포함하는 제2밴딩부 및 상기 교차 영역과 대응하고 제3패턴을 포함하는 교차부를 포함할 수 있다.According to various embodiments, the flexible display supported by the conductive sheet layer includes a window layer, a first folding area disposed under the window layer, a first folding area corresponding to a first folding axis, and a first folding area intersecting the first folding axis. A display panel comprising a second folding area corresponding to two folding axes and an intersection area corresponding to an area in which the first folding axis and the second folding axis intersect, and a polymer layer disposed under the display panel, The conductive sheet layer is disposed under the polymer layer, and includes a first bending part corresponding to the first folding area and including a first pattern, and a second bending part corresponding to the second folding area and including a second pattern. and an intersection portion corresponding to the intersection region and including a third pattern.
본 개시의 다양한 실시예들에 따른, 폴더블 전자 장치는, 교차된 폴딩축들을 통해 다양한 폴딩 방식으로 접히고 펼쳐지는 동작을 수행하기 때문에 펼쳐진 상태에서는 대화면 디스플레이를 제공할 수 있고, 접혀진 상태에서는 다양한 크기의 화면이 제공될 수 있다. 또한, 교차 배치된 폴딩축들과 대응하는 플렉서블 디스플레이의 대응 영역들을 지지하기 위한 강성 및 굴곡 특성이 제공되는 지지 구조에 의해, 폴더블 전자 장치의 작동 신뢰성이 향상될 수 있다.According to various embodiments of the present disclosure, since the foldable electronic device performs folding and unfolding operations in various folding methods through crossed folding axes, it is possible to provide a large screen display in the unfolded state, and in the folded state, various A screen of a size may be provided. In addition, by the support structure provided with rigidity and bending characteristics for supporting the cross-arranged folding axes and corresponding regions of the flexible display, the operation reliability of the foldable electronic device may be improved.
이 외에, 본 문서를 통해 직접적 또는 간접적으로 파악되는 다양한 효과들이 제공될 수 있다.In addition, various effects directly or indirectly identified through this document may be provided.
도면의 설명과 관련하여, 동일 또는 유사한 구성 요소에 대해서는 동일 또는 유사한 참조 부호가 사용될 수 있다.In connection with the description of the drawings, the same or similar reference numerals may be used for the same or similar components.
도 1은 본 개시의 다양한 실시예에 따른 네트워크 환경 내의 전자 장치의 블록도이다.1 is a block diagram of an electronic device in a network environment according to various embodiments of the present disclosure;
도 2a는 본 개시의 다양한 실시예에 따른 펼침 상태(unfolded state)에서, 폴더블 전자 장치의 전면을 도시한 도면이다.2A is a view illustrating a front side of a foldable electronic device in an unfolded state according to various embodiments of the present disclosure;
도 2b는 본 개시의 다양한 실시예에 따른 펼침 상태(unfolded state)에서, 폴더블 전자 장치의 후면을 도시한 도면이다.2B is a view illustrating a rear surface of a foldable electronic device in an unfolded state according to various embodiments of the present disclosure;
도 3a는 본 개시의 다양한 실시예에 따른 제1폴딩 방식으로 접힌 상태에서, 폴더블 전자 장치의 전면을 도시한 도면이다.3A is a view illustrating a front side of a foldable electronic device in a state folded in a first folding manner according to various embodiments of the present disclosure;
도 3b는 본 개시의 다양한 실시예에 따른 제1폴딩 방식으로 접힌 상태에서, 폴더블 전자 장치의 후면을 도시한 도면이다.3B is a view illustrating a rear surface of a foldable electronic device in a state folded in a first folding manner according to various embodiments of the present disclosure;
도 3c는 본 개시의 다양한 실시예에 따른 제2폴딩 방식으로 접힌 상태에서, 폴더블 전자 장치의 후면을 도시한 도면이다.3C is a view illustrating a rear side of a foldable electronic device in a state in which it is folded in a second folding method according to various embodiments of the present disclosure;
도 4는 본 개시의 다양한 실시예에 따른 폴더블 전자 장치의 분리 사시도이다.4 is an exploded perspective view of a foldable electronic device according to various embodiments of the present disclosure;
도 5는 본 개시의 다양한 실시예에 따른 도전성 시트층의 구성을 도시한 도면이다.5 is a diagram illustrating a configuration of a conductive sheet layer according to various embodiments of the present disclosure.
도 6a는 본 개시의 다양한 실시예에 따른 도 5의 6a 영역을 확대한 도면이다.6A is an enlarged view of area 6A of FIG. 5 according to various embodiments of the present disclosure;
도 6b는 본 개시의 다양한 실시예에 따른 도 5의 6b 영역을 확대한 도면이다.6B is an enlarged view of area 6B of FIG. 5 according to various embodiments of the present disclosure;
도 6c는 본 개시의 다양한 실시예에 따른 도 5의 6c 영역을 확대한 도면이다.FIG. 6C is an enlarged view of area 6c of FIG. 5 according to various embodiments of the present disclosure;
도 6d는 본 개시의 다양한 실시예에 따른 시편에 가해지는 하중에 의한 굽힘 강성 관계를 도시한 도면이다.6D is a diagram illustrating a relationship between bending stiffness due to a load applied to a specimen according to various embodiments of the present disclosure;
도 7a는 본 개시의 다양한 실시예에 따른 도 2a의 라인 7a-7a를 따라 바라본 폴더블 전자 장치의 일부 단면도이다.7A is a partial cross-sectional view of a foldable electronic device taken along line 7a-7a of FIG. 2A according to various embodiments of the present disclosure;
도 7b는 본 개시의 다양한 실시예에 따른 도 2a의 라인 7b-7b를 따라 바라본 폴더블 전자 장치의 일부 단면도이다.7B is a partial cross-sectional view of a foldable electronic device taken along line 7b-7b of FIG. 2A according to various embodiments of the present disclosure;
도 7c는 본 개시의 다양한 실시예에 따른 도 2a의 7c 영역에 배치된 탄성 지지체를 통해 제1힌지 모듈과 제2힌지 모듈이 연결된 상태를 도시한 일부 단면도이다.7C is a partial cross-sectional view illustrating a state in which a first hinge module and a second hinge module are connected through an elastic support disposed in a region 7c of FIG. 2A according to various embodiments of the present disclosure;
도 8은 본 개시의 다양한 실시예에 따른 영역별 두께 비교를 위하여 도 5의 라인 8-8을 따라 바라본 도전성 시트층의 단면도이다.FIG. 8 is a cross-sectional view of the conductive sheet layer taken along line 8-8 of FIG. 5 for comparison of thicknesses for each region according to various embodiments of the present disclosure;
도 9a 및 도 9b는 본 개시의 다양한 실시예에 따른 도 5의 6c 영역에 대한 다양한 실시예를 도시한 도면이다.9A and 9B are diagrams illustrating various embodiments of the area 6c of FIG. 5 according to various embodiments of the present disclosure;
도 1은 본 개시의 다양한 실시예에 따른 네트워크 환경 내의 전자 장치(101)의 블록도이다.1 is a block diagram of an electronic device 101 in a network environment according to various embodiments of the present disclosure.
도 1을 참조하면, 네트워크 환경(100)에서 전자 장치(101)는 제 1 네트워크(198)(예: 근거리 무선 통신 네트워크)를 통하여 전자 장치(102)와 통신하거나, 또는 제 2 네트워크(199)(예: 원거리 무선 통신 네트워크)를 통하여 전자 장치(104) 또는 서버(108)와 통신할 수 있다. 일 실시예에 따르면, 전자 장치(101)는 서버(108)를 통하여 전자 장치(104)와 통신할 수 있다. 일 실시예에 따르면, 전자 장치(101)는 프로세서(120), 메모리(130), 입력 장치(150), 음향 출력 장치(155), 표시 장치(160), 오디오 모듈(170), 센서 모듈(176), 인터페이스(177), 연결 단자(178), 햅틱 모듈(179), 카메라 모듈(180), 전력 관리 모듈(188), 배터리(189), 통신 모듈(190), 가입자 식별 모듈(196), 또는 안테나 모듈(197)을 포함할 수 있다. 어떤 실시예에서는, 전자 장치(101)에는, 이 구성요소들 중 적어도 하나(예: 연결 단자(178))가 생략되거나, 하나 이상의 다른 구성 요소가 추가될 수 있다. 어떤 실시예에서는, 이 구성요소들 중 일부들(예: 센서 모듈(176), 카메라 모듈(180), 또는 안테나 모듈(197))은 하나의 구성요소(예: 표시 장치(160))로 통합될 수 있다. 예를 들면, 센서 모듈(176)(예: 지문 센서, 홍채 센서, 또는 조도 센서)은 표시 장치(160)(예: 디스플레이)에 임베디드된 채 구현될 수 있다Referring to FIG. 1 , in a network environment 100 , an electronic device 101 communicates with an electronic device 102 through a first network 198 (eg, a short-range wireless communication network) or a second network 199 . It may communicate with the electronic device 104 or the server 108 through (eg, a long-distance wireless communication network). According to an embodiment, the electronic device 101 may communicate with the electronic device 104 through the server 108 . According to an embodiment, the electronic device 101 includes a processor 120 , a memory 130 , an input device 150 , a sound output device 155 , a display device 160 , an audio module 170 , and a sensor module ( 176), interface 177, connection terminal 178, haptic module 179, camera module 180, power management module 188, battery 189, communication module 190, subscriber identification module 196 , or an antenna module 197 may be included. In some embodiments, at least one of these components (eg, the connection terminal 178 ) may be omitted or one or more other components may be added to the electronic device 101 . In some embodiments, some of these components (eg, sensor module 176 , camera module 180 , or antenna module 197 ) are integrated into one component (eg, display device 160 ). can be For example, the sensor module 176 (eg, a fingerprint sensor, an iris sensor, or an illuminance sensor) may be implemented while being embedded in the display device 160 (eg, a display).
프로세서(120)는, 예를 들면, 소프트웨어(예: 프로그램(140))를 실행하여 프로세서(120)에 연결된 전자 장치(101)의 적어도 하나의 다른 구성요소(예: 하드웨어 또는 소프트웨어 구성요소)를 제어할 수 있고, 다양한 데이터 처리 또는 연산을 수행할 수 있다. 일 실시예에 따르면, 데이터 처리 또는 연산의 적어도 일부로서, 프로세서(120)는 다른 구성요소(예: 센서 모듈(176) 또는 통신 모듈(190))로부터 수신된 명령 또는 데이터를 휘발성 메모리(132)에 로드하고, 휘발성 메모리(132)에 저장된 명령 또는 데이터를 처리하고, 결과 데이터를 비휘발성 메모리(134)에 저장할 수 있다. 일 실시예에 따르면, 프로세서(120)는 메인 프로세서(121)(예: 중앙 처리 장치 또는 어플리케이션 프로세서), 또는 이와는 독립적으로 또는 함께 운영 가능한 보조 프로세서(123)(예: 그래픽 처리 장치, 신경망 처리 장치(NPU: neural processing unit), 이미지 시그널 프로세서, 센서 허브 프로세서, 또는 커뮤니케이션 프로세서)를 포함할 수 있다. 예를 들어, 전자 장치(101)가 메인 프로세서(121) 및 보조 프로세서(123)를 포함하는 경우, 보조 프로세서(123)은 메인 프로세서(121)보다 저전력을 사용하거나, 지정된 기능에 특화되도록 설정될 수 있다. 보조 프로세서(123)는 메인 프로세서(121)와 별개로, 또는 그 일부로서 구현될 수 있다.The processor 120, for example, executes software (eg, a program 140) to execute at least one other component (eg, a hardware or software component) of the electronic device 101 connected to the processor 120 . It can control and perform various data processing or operations. According to one embodiment, as at least part of data processing or operation, the processor 120 converts commands or data received from other components (eg, the sensor module 176 or the communication module 190 ) to the volatile memory 132 . may be loaded into the volatile memory 132 , and may process commands or data stored in the volatile memory 132 , and store the resulting data in the non-volatile memory 134 . According to an embodiment, the processor 120 is the main processor 121 (eg, a central processing unit or an application processor), or a secondary processor 123 (eg, a graphic processing unit, a neural network processing unit) capable of operating independently or together with the main processor 121 . (NPU: neural processing unit), image signal processor, sensor hub processor, or communication processor). For example, when the electronic device 101 includes the main processor 121 and the sub-processor 123 , the sub-processor 123 uses less power than the main processor 121 or is set to be specialized for a specified function. can The auxiliary processor 123 may be implemented separately from or as a part of the main processor 121 .
보조 프로세서(123)는, 예를 들면, 메인 프로세서(121)가 인액티브(예: 슬립) 상태에 있는 동안 메인 프로세서(121)를 대신하여, 또는 메인 프로세서(121)가 액티브(예: 어플리케이션 실행) 상태에 있는 동안 메인 프로세서(121)와 함께, 전자 장치(101)의 구성요소들 중 적어도 하나의 구성요소(예: 표시 장치(160), 센서 모듈(176), 또는 통신 모듈(190))와 관련된 기능 또는 상태들의 적어도 일부를 제어할 수 있다. 일 실시예에 따르면, 보조 프로세서(123)(예: 이미지 시그널 프로세서 또는 커뮤니케이션 프로세서)는 기능적으로 관련 있는 다른 구성 요소(예: 카메라 모듈(180) 또는 통신 모듈(190))의 일부로서 구현될 수 있다. The auxiliary processor 123 is, for example, on behalf of the main processor 121 while the main processor 121 is in an inactive (eg, sleep) state, or the main processor 121 is active (eg, executing an application). ), together with the main processor 121, at least one of the components of the electronic device 101 (eg, the display device 160, the sensor module 176, or the communication module 190) It is possible to control at least some of the related functions or states. According to an embodiment, the co-processor 123 (eg, an image signal processor or a communication processor) may be implemented as part of another functionally related component (eg, the camera module 180 or the communication module 190). have.
메모리(130)는, 전자 장치(101)의 적어도 하나의 구성요소(예: 프로세서(120) 또는 센서모듈(176))에 의해 사용되는 다양한 데이터를 저장할 수 있다. 데이터는, 예를 들어, 소프트웨어(예: 프로그램(140)) 및, 이와 관련된 명령에 대한 입력 데이터 또는 출력 데이터를 포함할 수 있다. 메모리(130)는, 휘발성 메모리(132) 또는 비휘발성 메모리(134)를 포함할 수 있다. The memory 130 may store various data used by at least one component of the electronic device 101 (eg, the processor 120 or the sensor module 176 ). The data may include, for example, input data or output data for software (eg, the program 140 ) and instructions related thereto. The memory 130 may include a volatile memory 132 or a non-volatile memory 134 .
프로그램(140)은 메모리(130)에 소프트웨어로서 저장될 수 있으며, 예를 들면, 운영 체제(142), 미들 웨어(144) 또는 어플리케이션(146)을 포함할 수 있다. The program 140 may be stored as software in the memory 130 , and may include, for example, an operating system 142 , middleware 144 , or an application 146 .
입력 장치(150)는, 전자 장치(101)의 구성요소(예: 프로세서(120))에 사용될 명령 또는 데이터를 전자 장치(101)의 외부(예: 사용자)로부터 수신할 수 있다. 입력 장치(150)은, 예를 들면, 마이크, 마우스, 키보드, 키(예: 버튼), 또는 디지털 펜(예: 스타일러스 펜)을 포함할 수 있다. The input device 150 may receive a command or data to be used in a component (eg, the processor 120 ) of the electronic device 101 from the outside (eg, a user) of the electronic device 101 . The input device 150 may include, for example, a microphone, a mouse, a keyboard, a key (eg, a button), or a digital pen (eg, a stylus pen).
음향 출력 장치(155)는 음향 신호를 전자 장치(101)의 외부로 출력할 수 있다. 음향 출력 장치(155)는, 예를 들면, 스피커 또는 리시버를 포함할 수 있다. 스피커는 멀티미디어 재생 또는 녹음 재생과 같이 일반적인 용도로 사용될 수 있다. 리시버는 착신 전화를 수신하기 위해 사용될 수 있다. 일 실시예에 따르면, 리시버는 스피커와 별개로, 또는 그 일부로서 구현될 수 있다.The sound output device 155 may output a sound signal to the outside of the electronic device 101 . The sound output device 155 may include, for example, a speaker or a receiver. The speaker can be used for general purposes such as multimedia playback or recording playback. The receiver may be used to receive an incoming call. According to one embodiment, the receiver may be implemented separately from or as part of the speaker.
표시 장치(160)는 전자 장치(101)의 외부(예: 사용자)로 정보를 시각적으로 제공할 수 있다. 표시 장치(160)은, 예를 들면, 디스플레이, 홀로그램 장치, 또는 프로젝터 및 해당 장치를 제어하기 위한 제어 회로를 포함할 수 있다. 일 실시예에 따르면, 표시 장치(160)는 터치를 감지하도록 설정된 터치 센서, 또는 터치에 의해 발생되는 힘의 세기를 측정하도록 설정된 압력 센서를 포함할 수 있다. The display device 160 may visually provide information to the outside of the electronic device 101 (eg, a user). The display device 160 may include, for example, a display, a hologram device, or a projector and a control circuit for controlling the corresponding device. According to an embodiment, the display device 160 may include a touch sensor configured to sense a touch or a pressure sensor configured to measure the intensity of a force generated by the touch.
오디오 모듈(170)은 소리를 전기 신호로 변환시키거나, 반대로 전기 신호를 소리로 변환시킬 수 있다. 일 실시예에 따르면, 오디오 모듈(170)은, 입력 장치(150)를 통해 소리를 획득하거나, 음향 출력 장치(155), 또는 전자 장치(101)와 직접 또는 무선으로 연결된 외부 전자 장치(예: 전자 장치(102)) (예: 스피커 또는 헤드폰))를 통해 소리를 출력할 수 있다.The audio module 170 may convert a sound into an electric signal or, conversely, convert an electric signal into a sound. According to an embodiment, the audio module 170 acquires a sound through the input device 150 , or an external electronic device (eg, a sound output device 155 ) directly or wirelessly connected to the electronic device 101 . The sound may be output through the electronic device 102 (eg, a speaker or headphones).
센서 모듈(176)은 전자 장치(101)의 작동 상태(예: 전력 또는 온도), 또는 외부의 환경 상태(예: 사용자 상태)를 감지하고, 감지된 상태에 대응하는 전기 신호 또는 데이터 값을 생성할 수 있다. 일 실시예에 따르면, 센서 모듈(176)은, 예를 들면, 제스처 센서, 자이로 센서, 기압 센서, 마그네틱 센서, 가속도 센서, 그립 센서, 근접 센서, 컬러 센서, IR(infrared) 센서, 생체 센서, 온도 센서, 습도 센서, 또는 조도 센서를 포함할 수 있다. The sensor module 176 detects an operating state (eg, power or temperature) of the electronic device 101 or an external environmental state (eg, user state), and generates an electrical signal or data value corresponding to the sensed state. can do. According to one embodiment, the sensor module 176 may include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, It may include a temperature sensor, a humidity sensor, or an illuminance sensor.
인터페이스(177)는 전자 장치(101)가 외부 전자 장치(예: 전자 장치(102))와 직접 또는 무선으로 연결되기 위해 사용될 수 있는 하나 이상의 지정된 프로토콜들을 지원할 수 있다. 일 실시예에 따르면, 인터페이스(177)는, 예를 들면, HDMI(high definition multimedia interface), USB(universal serial bus) 인터페이스, SD카드 인터페이스, 또는 오디오 인터페이스를 포함할 수 있다.The interface 177 may support one or more designated protocols that may be used by the electronic device 101 to directly or wirelessly connect with an external electronic device (eg, the electronic device 102 ). According to an embodiment, the interface 177 may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.
연결 단자(178)는, 그를 통해서 전자 장치(101)가 외부 전자 장치(예: 전자 장치(102))와 물리적으로 연결될 수 있는 커넥터를 포함할 수 있다. 일 실시예에 따르면, 연결 단자(178)은, 예를 들면, HDMI 커넥터, USB 커넥터, SD 카드 커넥터, 또는 오디오 커넥터(예: 헤드폰 커넥터)를 포함할 수 있다.The connection terminal 178 may include a connector through which the electronic device 101 can be physically connected to an external electronic device (eg, the electronic device 102 ). According to an embodiment, the connection terminal 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (eg, a headphone connector).
햅틱 모듈(179)은 전기적 신호를 사용자가 촉각 또는 운동 감각을 통해서 인지할 수 있는 기계적인 자극(예: 진동 또는 움직임) 또는 전기적인 자극으로 변환할 수 있다. 일 실시예에 따르면, 햅틱 모듈(179)은, 예를 들면, 모터, 압전 소자, 또는 전기 자극 장치를 포함할 수 있다.The haptic module 179 may convert an electrical signal into a mechanical stimulus (eg, vibration or movement) or an electrical stimulus that the user can perceive through tactile or kinesthetic sense. According to an embodiment, the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulation device.
카메라 모듈(180)은 정지 영상 및 동영상을 촬영할 수 있다. 일 실시예에 따르면, 카메라 모듈(180)은 하나 이상의 렌즈들, 이미지 센서들, 이미지 시그널 프로세서들, 또는 플래시들을 포함할 수 있다.The camera module 180 may capture still images and moving images. According to an embodiment, the camera module 180 may include one or more lenses, image sensors, image signal processors, or flashes.
전력 관리 모듈(188)은 전자 장치(101)에 공급되는 전력을 관리할 수 있다. 일 실시예에 따르면, 전력 관리 모듈(188)은, 예를 들면, PMIC(power management integrated circuit)의 적어도 일부로서 구현될 수 있다.The power management module 188 may manage power supplied to the electronic device 101 . According to an embodiment, the power management module 188 may be implemented as, for example, at least a part of a power management integrated circuit (PMIC).
배터리(189)는 전자 장치(101)의 적어도 하나의 구성 요소에 전력을 공급할 수 있다. 일 실시예에 따르면, 배터리(189)는, 예를 들면, 재충전 불가능한 1차 전지, 재충전 가능한 2차 전지 또는 연료 전지를 포함할 수 있다.The battery 189 may supply power to at least one component of the electronic device 101 . According to one embodiment, battery 189 may include, for example, a non-rechargeable primary cell, a rechargeable secondary cell, or a fuel cell.
통신 모듈(190)은 전자 장치(101)와 외부 전자 장치(예: 전자 장치(102), 전자 장치(104), 또는 서버(108))간의 직접(예: 유선) 통신 채널 또는 무선 통신 채널의 수립, 및 수립된 통신 채널을 통한 통신 수행을 지원할 수 있다. 통신 모듈(190)은 프로세서(120)(예: 어플리케이션 프로세서)와 독립적으로 운영되고, 직접(예: 유선) 통신 또는 무선 통신을 지원하는 하나 이상의 커뮤니케이션 프로세서를 포함할 수 있다. 일 실시예에 따르면, 통신 모듈(190)은 무선 통신 모듈(192)(예: 셀룰러 통신 모듈, 근거리 무선 통신 모듈, 또는 GNSS(global navigation satellite system) 통신 모듈) 또는 유선 통신 모듈(194)(예: LAN(local area network) 통신 모듈, 또는 전력선 통신 모듈)을 포함할 수 있다. 이들 통신 모듈 중 해당하는 통신 모듈은 제 1 네트워크(198)(예: 블루투스, WiFi(wireless fidelity) direct 또는 IrDA(infrared data association)와 같은 근거리 통신 네트워크) 또는 제 2 네트워크(199)(예: 레거시(legacy) 셀룰러 네트워크, 5G 네트워크, 차세대 통신 네트워크, 인터넷, 또는 컴퓨터 네트워크(예: LAN 또는 WAN)와 같은 원거리 통신 네트워크)를 통하여 외부의 전자 장치와 통신할 수 있다. 이런 여러 종류의 통신 모듈들은 하나의 구성 요소(예: 단일 칩)으로 통합되거나, 또는 서로 별도의 복수의 구성 요소들(예: 복수 칩들)로 구현될 수 있다. 무선 통신 모듈(192)은 가입자 식별 모듈(196)에 저장된 가입자 정보(예: 국제 모바일 가입자 식별자(IMSI))를 이용하여 제 1 네트워크(198) 또는 제 2 네트워크(199)와 같은 통신 네트워크 내에서 전자 장치(101)를 확인 또는 인증할 수 있다. The communication module 190 is a direct (eg, wired) communication channel or a wireless communication channel between the electronic device 101 and an external electronic device (eg, the electronic device 102, the electronic device 104, or the server 108). It can support establishment and communication performance through the established communication channel. The communication module 190 may include one or more communication processors that operate independently of the processor 120 (eg, an application processor) and support direct (eg, wired) communication or wireless communication. According to one embodiment, the communication module 190 is a wireless communication module 192 (eg, a cellular communication module, a short-range communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 194 (eg, : It may include a LAN (local area network) communication module, or a power line communication module). A corresponding communication module among these communication modules is a first network 198 (eg, a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network 199 (eg, legacy (legacy) It can communicate with an external electronic device through a cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (eg, a telecommunication network such as a LAN or WAN). These various types of communication modules may be integrated into one component (eg, a single chip) or may be implemented as a plurality of components (eg, multiple chips) separate from each other. The wireless communication module 192 uses the subscriber information (eg, International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module 196 within a communication network such as the first network 198 or the second network 199 . The electronic device 101 may be identified or authenticated.
안테나 모듈(197)은 신호 또는 전력을 외부(예: 외부의 전자 장치)로 송신하거나 외부로부터 수신할 수 있다. 일 실시예에 따르면, 안테나 모듈(197)은 서브스트레이트(예: PCB) 위에 형성된 도전체 또는 도전성 패턴으로 이루어진 방사체를 포함하는 안테나를 포함할 수 있다. 일 실시예에 따르면, 안테나 모듈(197)은 복수의 안테나들(예: 어레이 안테나)을 포함할 수 있다. 이런 경우, 제 1 네트워크(198) 또는 제 2 네트워크(199)와 같은 통신 네트워크에서 사용되는 통신 방식에 적합한 적어도 하나의 안테나가, 예를 들면, 통신 모듈(190)에 의하여 복수의 안테나들로부터 선택될 수 있다. 신호 또는 전력은 선택된 적어도 하나의 안테나를 통하여 통신 모듈(190)과 외부의 전자 장치 간에 송신되거나 수신될 수 있다. 어떤 실시예에 따르면, 방사체 이외에 다른 부품(예: RFIC(radio frequency integrated circuit))이 추가로 안테나 모듈(197)의 일부로 형성될 수 있다.The antenna module 197 may transmit or receive a signal or power to the outside (eg, an external electronic device). According to an embodiment, the antenna module 197 may include an antenna including a conductor formed on a substrate (eg, a PCB) or a radiator formed of a conductive pattern. According to an embodiment, the antenna module 197 may include a plurality of antennas (eg, an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network such as the first network 198 or the second network 199 is selected from a plurality of antennas by, for example, the communication module 190 . can be A signal or power may be transmitted or received between the communication module 190 and an external electronic device through at least one selected antenna. According to some embodiments, other components (eg, a radio frequency integrated circuit (RFIC)) other than the radiator may be additionally formed as a part of the antenna module 197 .
상기 구성요소들 중 적어도 일부는 주변 기기들간 통신 방식(예: 버스, GPIO(general purpose input and output), SPI(serial peripheral interface), I2C(inter-integrated circuit), MDDI(mobile display digital interface), 또는 MIPI(mobile industry processor interface))를 통해 서로 연결되고 신호(예: 명령 또는 데이터)를 상호간에 교환할 수 있다.At least some of the components include a communication method between peripheral devices (eg, a bus, general purpose input and output (GPIO), serial peripheral interface (SPI), inter-integrated circuit (I2C), mobile display digital interface (MDDI), Alternatively, they may be connected to each other through a mobile industry processor interface (MIPI) and exchange signals (eg, commands or data) with each other.
일 실시예에 따르면, 명령 또는 데이터는 제 2 네트워크(199)에 연결된 서버(108)를 통해서 전자 장치(101)와 외부의 전자 장치(104)간에 송신 또는 수신될 수 있다. 외부의 전자 장치(102, 또는 104) 각각은 전자 장치(101)와 동일한 또는 다른 종류의 장치일 수 있다. 일 실시예에 따르면, 전자 장치(101)에서 실행되는 동작들의 전부 또는 일부는 외부의 전자 장치들(102, 104, 또는 108) 중 하나 이상의 외부의 전자 장치들에서 실행될 수 있다. 예를 들면, 전자 장치(101)가 어떤 기능이나 서비스를 자동으로, 또는 사용자 또는 다른 장치로부터의 요청에 반응하여 수행해야 할 경우에, 전자 장치(101)는 기능 또는 서비스를 자체적으로 실행시키는 대신에 또는 추가적으로, 하나 이상의 외부의 전자 장치들에게 그 기능 또는 그 서비스의 적어도 일부를 수행하라고 요청할 수 있다. 상기 요청을 수신한 하나 이상의 외부의 전자 장치들은 요청된 기능 또는 서비스의 적어도 일부, 또는 상기 요청과 관련된 추가 기능 또는 서비스를 실행하고, 그 실행의 결과를 전자 장치(101)로 전달할 수 있다. 전자 장치(101)는 상기 결과를, 그대로 또는 추가적으로 처리하여, 상기 요청에 대한 응답의 적어도 일부로서 제공할 수 있다.. 이를 위하여, 예를 들면, 클라우드 컴퓨팅, 분산 컴퓨팅, 모바일 에지 컴퓨팅(MEC: mobile edge computing), 또는 클라이언트-서버 컴퓨팅 기술이 이용될 수 있다. 전자 장치(101)는, 예를 들어, 분산 컴퓨팅 또는 모바일 에지 컴퓨팅을 이용하여 초저지연 서비스를 제공할 수 있다. 다른 실시예에 있어서, 외부의 전자 장치(104)는 IoT(internet of things) 기기를 포함할 수 있다. 서버(108)는 기계 학습 및/또는 신경망을 이용한 지능형 서버일 수 있다. 일 실시예에 따르면, 외부의 전자 장치(104) 또는 서버(108)는 제 2 네트워크(199) 내에 포함될 수 있다. 전자 장치(101)는 5G 통신 기술 및 IoT 관련 기술을 기반으로 지능형 서비스(예: 스마트 홈, 스마트 시티, 스마트 카, 또는 헬스 케어)에 적용될 수 있다.According to an embodiment, the command or data may be transmitted or received between the electronic device 101 and the external electronic device 104 through the server 108 connected to the second network 199 . Each of the external electronic devices 102 or 104 may be the same as or different from the electronic device 101 . According to an embodiment, all or a part of operations executed in the electronic device 101 may be executed in one or more external electronic devices 102 , 104 , or 108 . For example, when the electronic device 101 is to perform a function or service automatically or in response to a request from a user or other device, the electronic device 101 may perform the function or service itself instead of executing the function or service itself. Alternatively or additionally, one or more external electronic devices may be requested to perform at least a part of the function or the service. One or more external electronic devices that have received the request may execute at least a part of the requested function or service, or an additional function or service related to the request, and transmit a result of the execution to the electronic device 101 . The electronic device 101 may process the result as it is or additionally and provide it as at least a part of a response to the request. For this purpose, for example, cloud computing, distributed computing, and mobile edge computing (MEC: mobile edge computing), or client-server computing techniques may be used. The electronic device 101 may provide an ultra-low latency service using, for example, distributed computing or mobile edge computing. In another embodiment, the external electronic device 104 may include an Internet of things (IoT) device. Server 108 may be an intelligent server using machine learning and/or neural networks. According to an embodiment, the external electronic device 104 or the server 108 may be included in the second network 199 . The electronic device 101 may be applied to an intelligent service (eg, smart home, smart city, smart car, or health care) based on 5G communication technology and IoT-related technology.
본 문서에 개시된 다양한 실시예들에 따른 전자 장치는 다양한 형태의 장치가 될 수 있다. 전자 장치는, 예를 들면, 휴대용 통신 장치(예: 스마트폰), 컴퓨터 장치, 휴대용 멀티미디어 장치, 휴대용 의료 기기, 카메라, 웨어러블 장치, 또는 가전 장치를 포함할 수 있다. 본 문서의 실시예에 따른 전자 장치는 전술한 기기들에 한정되지 않는다.The electronic device according to various embodiments disclosed in this document may have various types of devices. The electronic device may include, for example, a portable communication device (eg, a smart phone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a home appliance device. The electronic device according to the embodiment of the present document is not limited to the above-described devices.
본 문서의 다양한 실시예들 및 이에 사용된 용어들은 본 문서에 기재된 기술적 특징들을 특정한 실시예들로 한정하려는 것이 아니며, 해당 실시예의 다양한 변경, 균등물, 또는 대체물을 포함하는 것으로 이해되어야 한다. 도면의 설명과 관련하여, 유사한 또는 관련된 구성요소에 대해서는 유사한 참조 부호가 사용될 수 있다. 아이템에 대응하는 명사의 단수 형은 관련된 문맥상 명백하게 다르게 지시하지 않는 한, 상기 아이템 한 개 또는 복수 개를 포함할 수 있다. 본 문서에서, "A 또는 B", "A 및 B 중 적어도 하나","A 또는 B 중 적어도 하나,""A, B 또는 C," "A, B 및 C 중 적어도 하나,"및 "A, B, 또는 C 중 적어도 하나"와 같은 문구들 각각은 그 문구들 중 해당하는 문구에 함께 나열된 항목들 중 어느 하나, 또는 그들의 모든 가능한 조합을 포함할 수 있다. "제 1", "제 2", 또는 "첫째" 또는 "둘째"와 같은 용어들은 단순히 해당 구성요소를 다른 해당 구성요소와 구분하기 위해 사용될 수 있으며, 해당 구성요소들을 다른 측면(예: 중요성 또는 순서)에서 한정하지 않는다. 어떤(예: 제 1) 구성요소가 다른(예: 제 2) 구성요소에, "기능적으로" 또는 "통신적으로"라는 용어와 함께 또는 이런 용어 없이, "커플드" 또는 "커넥티드"라고 언급된 경우, 그것은 상기 어떤 구성요소가 상기 다른 구성요소에 직접적으로(예: 유선으로), 무선으로, 또는 제 3 구성요소를 통하여 연결될 수 있다는 것을 의미한다.The various embodiments of this document and terms used therein are not intended to limit the technical features described in this document to specific embodiments, but it should be understood to include various modifications, equivalents, or substitutions of the embodiments. In connection with the description of the drawings, like reference numerals may be used for similar or related components. The singular form of the noun corresponding to the item may include one or more of the item, unless the relevant context clearly dictates otherwise. In this document, "A or B", "at least one of A and B", "at least one of A or B," "A, B or C," "at least one of A, B and C," and "A , B, or C" each may include any one of the items listed together in the corresponding one of the phrases, or all possible combinations thereof. Terms such as "first", "second", or "first" or "second" may be used simply to distinguish the element from other elements in question, and may refer to elements in other aspects (e.g., importance or order) is not limited. It is said that one (eg, first) component is "coupled" or "connected" to another (eg, second) component, with or without the terms "functionally" or "communicatively". When referenced, it means that one component can be connected to the other component directly (eg by wire), wirelessly, or through a third component.
본 문서의 다양한 실시예들에서 사용된 용어 "모듈"은 하드웨어, 소프트웨어 또는 펌웨어로 구현된 유닛을 포함할 수 있으며, 예를 들면, 로직, 논리 블록, 부품, 또는 회로와 같은 용어와 상호 호환적으로 사용될 수 있다. 모듈은, 일체로 구성된 부품 또는 하나 또는 그 이상의 기능을 수행하는, 상기 부품의 최소 단위 또는 그 일부가 될 수 있다. 예를 들면, 일 실시예에 따르면, 모듈은 ASIC(application-specific integrated circuit)의 형태로 구현될 수 있다. The term “module” used in various embodiments of this document may include a unit implemented in hardware, software, or firmware, and is interchangeable with terms such as, for example, logic, logic block, component, or circuit. can be used as A module may be an integrally formed part or a minimum unit or a part of the part that performs one or more functions. For example, according to an embodiment, the module may be implemented in the form of an application-specific integrated circuit (ASIC).
본 문서의 다양한 실시예들은 기기(machine)(예: 전자 장치(101)) 의해 읽을 수 있는 저장 매체(storage medium)(예: 내장 메모리(136) 또는 외장 메모리(138))에 저장된 하나 이상의 명령어들을 포함하는 소프트웨어(예: 프로그램(140))로서 구현될 수 있다. 예를 들면, 기기(예: 전자 장치(101))의 프로세서(예: 프로세서(120))는, 저장 매체로부터 저장된 하나 이상의 명령어들 중 적어도 하나의 명령을 호출하고, 그것을 실행할 수 있다. 이것은 기기가 상기 호출된 적어도 하나의 명령어에 따라 적어도 하나의 기능을 수행하도록 운영되는 것을 가능하게 한다. 상기 하나 이상의 명령어들은 컴파일러에 의해 생성된 코드 또는 인터프리터에 의해 실행될 수 있는 코드를 포함할 수 있다. 기기로 읽을 수 있는 저장매체 는, 비일시적(non-transitory) 저장매체의 형태로 제공될 수 있다. 여기서, ‘비일시적’은 저장매체가 실재(tangible)하는 장치이고, 신호(signal)(예: 전자기파)를 포함하지 않는다는 것을 의미할 뿐이며, 이 용어는 데이터가 저장매체에 반영구적으로 저장되는 경우와 임시적으로 저장되는 경우를 구분하지 않는다.According to various embodiments of the present document, one or more instructions stored in a storage medium (eg, internal memory 136 or external memory 138) readable by a machine (eg, electronic device 101) may be implemented as software (eg, the program 140) including For example, a processor (eg, processor 120 ) of a device (eg, electronic device 101 ) may call at least one command among one or more commands stored from a storage medium and execute it. This makes it possible for the device to be operated to perform at least one function according to the called at least one command. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The device-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' only means that the storage medium is a tangible device and does not contain a signal (eg, electromagnetic wave), and this term is used in cases where data is semi-permanently stored in the storage medium and It does not distinguish between temporary storage cases.
일 실시예에 따르면, 본 문서에 개시된 다양한 실시예들에 따른 방법은 컴퓨터 프로그램 제품(computer program product)에 포함되어 제공될 수 있다. 컴퓨터 프로그램 제품은 상품으로써 판매자 및 구매자 간에 거래될 수 있다. 컴퓨터 프로그램 제품은 기기로 읽을 수 있는 저장 매체(예: compact disc read only memory (CD-ROM))의 형태로 배포되거나, 또는 어플리케이션 스토어(예: 플레이 스토어TM)를 통해 또는 두개의 사용자 장치들(예: 스마트폰들) 간에 직접, 온라인으로 배포(예: 다운로드 또는 업로드)될 수 있다. 온라인 배포의 경우에, 컴퓨터 프로그램 제품의 적어도 일부는 제조사의 서버, 어플리케이션 스토어의 서버, 또는 중계 서버의 메모리와 같은 기기로 읽을 수 있는 저장 매체에 적어도 일시 저장되거나, 임시적으로 생성될 수 있다.According to an embodiment, the method according to various embodiments disclosed in this document may be included and provided in a computer program product. Computer program products may be traded between sellers and buyers as commodities. The computer program product is distributed in the form of a device-readable storage medium (eg compact disc read only memory (CD-ROM)), or through an application store (eg Play Store™) or on two user devices (eg, It can be distributed (eg downloaded or uploaded) directly or online between smartphones (eg: smartphones). In the case of online distribution, at least a part of the computer program product may be temporarily stored or temporarily created in a machine-readable storage medium such as a memory of a server of a manufacturer, a server of an application store, or a relay server.
다양한 실시예들에 따르면, 상기 기술한 구성요소들의 각각의 구성요소(예: 모듈 또는 프로그램)는 단수 또는 복수의 개체를 포함할 수 있다. 다양한 실시예들에 따르면, 전술한 해당 구성요소들 중 하나 이상의 구성요소들 또는 동작들이 생략되거나, 또는 하나 이상의 다른 구성요소들 또는 동작들이 추가될 수 있다. 대체적으로 또는 추가적으로, 복수의 구성요소들(예: 모듈 또는 프로그램)은 하나의 구성요소로 통합될 수 있다. 이런 경우, 통합된 구성요소는 상기 복수의 구성요소들 각각의 구성요소의 하나 이상의 기능들을 상기 통합 이전에 상기 복수의 구성요소들 중 해당 구성요소에 의해 수행되는 것과 동일 또는 유사하게 수행할 수 있다. 다양한 실시예들에 따르면, 모듈, 프로그램 또는 다른 구성요소에 의해 수행되는 동작들은 순차적으로, 병렬적으로, 반복적으로, 또는 휴리스틱하게 실행되거나, 상기 동작들 중 하나 이상이 다른 순서로 실행되거나, 생략되거나, 또는 하나 이상의 다른 동작들이 추가될 수 있다.According to various embodiments, each component (eg, a module or a program) of the above-described components may include a singular or a plurality of entities. According to various embodiments, one or more components or operations among the above-described corresponding components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (eg, a module or a program) may be integrated into one component. In this case, the integrated component may perform one or more functions of each component of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. . According to various embodiments, operations performed by a module, program, or other component are executed sequentially, in parallel, repeatedly, or heuristically, or one or more of the operations are executed in a different order, or omitted. or one or more other operations may be added.
도 2a는 본 개시의 다양한 실시예에 따른 펼침 상태(unfolded state)에서, 폴더블 전자 장치(200)의 전면을 도시한 도면이다. 도 2b는 본 개시의 다양한 실시예에 따른 펼침 상태(unfolded state)에서, 폴더블 전자 장치(200)의 후면을 도시한 도면이다.FIG. 2A is a diagram illustrating a front side of the foldable electronic device 200 in an unfolded state according to various embodiments of the present disclosure. FIG. 2B is a view illustrating a rear surface of the foldable electronic device 200 in an unfolded state according to various embodiments of the present disclosure.
도 2a 및 도 2b의 폴더블 전자 장치(200)는 도 1의 전자 장치(101)와 적어도 일부 유사하거나, 전자 장치의 다른 실시예들을 포함할 수 있다.The foldable electronic device 200 of FIGS. 2A and 2B may be at least partially similar to the electronic device 101 of FIG. 1 , or may include other embodiments of the electronic device.
도 2a 및 도 2b를 참고하면, 폴더블 전자 장치(200)는 제1폴딩축(A) 및 제1폴딩축(A)과 교차하도록 배치되는 제2폴딩축(B)을 기준으로 서로에 대하여 회동 가능하게 배치되는 제1하우징(210), 제2하우징(220), 제3하우징(230) 및 제4하우징(240)을 포함할 수 있다. 한 실시예에 따르면, 폴더블 전자 장치(200)는, 내부 공간에서, 제1폴딩축(A)을 따라 배치되는 제1힌지 모듈(285), 제2폴딩축(B)을 따라 제1힌지 모듈(285)과 교차되도록 배치되는 제2힌지 모듈(286), 및 교차 영역에서, 제1힌지 모듈(285)와 제2힌지 모듈(286)을 연결하는 탄성 지지체(287)를 포함할 수 있다. 한 실시예에 따르면, 제2하우징(220)은 제1힌지 모듈(285)을 통해, 제1폴딩축(A)을 기준으로, 제1하우징(210)의 적어도 일부와 접힘 가능하게 연결될 수 있다. 한 실시예에 따르면, 제3하우징(230)은 제2힌지 모듈(286)을 통해, 제2폴딩축(B)을 기준으로, 제1하우징(210)의 적어도 일부와 접힘 가능하게 연결될 수 있다. 한 실시예에 따르면, 제4하우징(240)은 제1힌지 모듈(285)을 통해, 제3하우징(230)과 접힘 가능하게 연결될 수 있고, 제2힌지 모듈(286)을 통해, 제2하우징(220)과 접힘 가능하게 연결될 수 있다. 한 실시예에 따르면, 폴더블 전자 장치(200)는 펼침 상태에서, 제1하우징(210), 제2하우징(220), 제3하우징(230), 및/또는 제4하우징(240)의 지지를 받도록 배치되는 플렉서블 디스플레이(250)(예: 도 1의 표시 장치(160))를 포함할 수 있다. 한 실시예에 따르면, 플렉서블 디스플레이(250)는, 펼침 상태에서 장방형 형상을 갖는 대화면 디스플레이를 사용자에게 제공할 수 있다. 한 실시예에 따르면, 제1하우징(210), 제2하우징(220), 제3하우징(230) 및/또는 제3하우징(240)의 적어도 일부는 플렉서블 디스플레이(250)를 지지하기 위한, 선택된 크기의 강성을 갖는 금속 재질 및/또는 비금속 재질로 형성될 수 있다. 2A and 2B , the foldable electronic device 200 is positioned with respect to each other with respect to a first folding axis A and a second folding axis B disposed to intersect the first folding axis A. It may include a first housing 210 , a second housing 220 , a third housing 230 , and a fourth housing 240 , which are rotatably disposed. According to an embodiment, the foldable electronic device 200 includes a first hinge module 285 disposed along a first folding axis A and a first hinge along a second folding axis B in an internal space. It may include a second hinge module 286 disposed to intersect the module 285 , and an elastic support 287 connecting the first hinge module 285 and the second hinge module 286 in the intersecting region. . According to an embodiment, the second housing 220 may be foldably connected to at least a portion of the first housing 210 with respect to the first folding axis A through the first hinge module 285 . . According to one embodiment, the third housing 230 may be foldably connected to at least a portion of the first housing 210 with respect to the second folding axis B through the second hinge module 286 . . According to one embodiment, the fourth housing 240 may be foldably connected to the third housing 230 through the first hinge module 285 , and through the second hinge module 286 , the second housing 220 and may be collapsible. According to an embodiment, in the unfolded state, the foldable electronic device 200 supports the first housing 210 , the second housing 220 , the third housing 230 , and/or the fourth housing 240 . It may include a flexible display 250 (eg, the display device 160 of FIG. 1 ) disposed to receive . According to an embodiment, the flexible display 250 may provide a user with a large-screen display having a rectangular shape in an unfolded state. According to an embodiment, at least a portion of the first housing 210 , the second housing 220 , the third housing 230 and/or the third housing 240 is selected for supporting the flexible display 250 . It may be formed of a metal material and/or a non-metal material having a size rigidity.
다양한 실시예에 따르면, 제1하우징(210)은, 펼침 상태에서, 제1방향(예: Z 축 방향)을 향하는 제1면(211), 제1면(211)과 반대 방향을 향하는 제2면(212), 및 제1면(211)과 제2면(212) 사이의 공간을 둘러싸는 제1측면 프레임(213)을 포함할 수 있다. 한 실시예에 따르면, 제2하우징(220)은, 펼침 상태에서, 제1방향(예: Z 축 방향)을 향하는 제3면(221), 제3면(221)과 반대 방향을 향하는 제4면(222), 및 제3면(221)과 제4면(222) 사이의 공간을 둘러싸는 제2측면 프레임(223)을 포함할 수 있다. 한 실시예에 따르면, 제3하우징(230)은, 펼침 상태에서, 제1방향(예: Z 축 방향)을 향하는 제5면(231), 제5면(231)과 반대 방향을 향하는 제6면(232), 및 제5면(231)과 제6면(232) 사이의 공간을 둘러싸는 제3측면 프레임(233)을 포함할 수 있다. 한 실시예에 따르면, 제4하우징(240)은, 펼침 상태에서, 제1방향(예: Z 축 방향)을 향하는 제7면(241), 제7면(241)과 반대 방향을 향하는 제8면(242) 및 제7면(241)과 제8면(242) 사이의 공간을 둘러싸는 제4측면 프레임(243)을 포함할 수 있다. 한 실시예에 따르면, 측면 프레임들(213, 223, 233, 243) 중 적어도 일부는 비도전성 부분(예; 폴리머 또는 빈 공간)으로 형성된 적어도 하나의 분절부(미도시)를 통해 전기적으로 분절된 적어도 하나의 도전성 부분(미도시)을 포함할 수도 있다. 예를 들면, 적어도 하나의 도전성 부분은 폴더블 전자 장치(200)에 포함된 무선 통신 모듈(예: 도 1의 무선 통신 모듈(192))와 전기적으로 연결됨으로서 지정된 적어도 하나의 대역(예: 레거시 셀룰러 네트워크 대역)에서 동작하는 안테나로 사용될 수 있다. 한 실시예에 따르면, 측면 프레임들(213, 223, 233, 243)은 장식 부재(decoration member)로 사용될 수 있다.According to various embodiments, in the unfolded state, the first housing 210 includes a first surface 211 facing a first direction (eg, a Z-axis direction), and a second surface 211 facing a direction opposite to the first surface 211 . The surface 212 may include a first side frame 213 surrounding the space between the first surface 211 and the second surface 212 . According to an embodiment, the second housing 220, in the unfolded state, the third surface 221 facing the first direction (eg, the Z-axis direction), the third surface 221 and the fourth surface facing the opposite direction The surface 222 may include a second side frame 223 surrounding the space between the third surface 221 and the fourth surface 222 . According to one embodiment, the third housing 230 is, in the unfolded state, the fifth surface 231 facing the first direction (eg, the Z-axis direction), and the sixth surface 231 facing the opposite direction to the fifth surface 231 . The surface 232 may include a third side frame 233 surrounding the space between the fifth surface 231 and the sixth surface 232 . According to one embodiment, the fourth housing 240, in the unfolded state, the seventh surface 241 facing the first direction (eg, Z-axis direction), the seventh surface 241 and the eighth side facing the opposite direction. A fourth side frame 243 surrounding the surface 242 and the space between the seventh surface 241 and the eighth surface 242 may be included. According to an embodiment, at least some of the side frames 213 , 223 , 233 , and 243 are electrically segmented through at least one segment (not shown) formed of a non-conductive portion (eg, polymer or hollow space). It may include at least one conductive portion (not shown). For example, the at least one conductive portion is electrically connected to a wireless communication module (eg, the wireless communication module 192 of FIG. 1 ) included in the foldable electronic device 200 , thereby designating at least one band (eg, legacy It can be used as an antenna operating in a cellular network band). According to an embodiment, the side frames 213 , 223 , 233 , and 243 may be used as decoration members.
다양한 실시예에 따르면, 제2면(212), 제4면(222), 제6면(232) 및 제8면(242)은 제1하우징(210), 제2하우징(220), 제3하우징(230) 및 제4하우징(240)의 각각 일부분으로 형성되거나, 구조적으로 결합된 후면 커버들(214, 224, 234, 244)을 포함할 수도 있다. 한 실시예에 따르면, 후면 커버들(214, 224, 234, 244)은 제2면(212)의 적어도 일부로 배치되는 제1후면 커버(214), 제4면(222)의 적어도 일부로 배치되는 제2후면 커버(224), 제6면(232)의 적어도 일부로 배치되는 제3후면 커버(234) 및 제8면(242)의 적어도 일부로 형성되는 제4후면 커버(244)를 포함할 수 있다. 한 실시예에 따르면, 후면 커버들(214, 224, 234, 244)은 측면 프레임들(213, 223, 233, 243)과 일체로 형성되거나, 측면 프레임들(213, 223, 233, 243)과 결합되도록 개별적으로 구성될 수 있다. 한 실시예에 따르면, 후면 커버들(214, 224, 234, 244)은, 예를 들어, 코팅 또는 착색된 유리, 세라믹, 폴리머, 금속(예: 알루미늄, 스테인레스 스틸(STS), 또는 마그네슘), 또는 상기 물질들 중 적어도 둘의 조합에 의하여 형성될 수 있다. 한 실시예에 따르면, 폴더블 전자 장치(200)의 하우징(210, 220, 230, 240)은 도 2a 및 도 2b에 도시된 형태 및 결합으로 제한되지 않으며, 다른 형상이나 부품의 조합 및/또는 결합에 의해 구현될 수 있다.According to various embodiments, the second surface 212 , the fourth surface 222 , the sixth surface 232 , and the eighth surface 242 are the first housing 210 , the second housing 220 , and the third The housing 230 and the fourth housing 240 may be formed as a part of each, or may include structurally coupled rear covers 214 , 224 , 234 , 244 . According to one embodiment, the rear covers 214 , 224 , 234 , 244 include a first rear cover 214 disposed as at least a portion of the second surface 212 , and a first rear cover 214 disposed as at least a portion of the fourth surface 222 . The second rear cover 224 may include a third rear cover 234 disposed as at least a portion of the sixth surface 232 , and a fourth rear cover 244 formed as at least a portion of the eighth surface 242 . According to one embodiment, the rear covers 214 , 224 , 234 , and 244 are integrally formed with the side frames 213 , 223 , 233 , 243 , or with the side frames 213 , 223 , 233 , 243 and They may be individually configured to be coupled. According to one embodiment, the back covers 214 , 224 , 234 , 244 are, for example, coated or tinted glass, ceramic, polymer, metal (eg, aluminum, stainless steel (STS), or magnesium); Or it may be formed by a combination of at least two of the above materials. According to an embodiment, the housings 210 , 220 , 230 , and 240 of the foldable electronic device 200 are not limited to the shapes and combinations shown in FIGS. 2A and 2B , and other shapes or combinations of parts and/or It can be implemented by combining.
다양한 실시예에 따르면, 플렉서블 디스플레이(250)는, 제1하우징(210)과 대응하는 제1영역(250a), 제2하우징(220)과 대응하는 제2영역(250b), 제3하우징(230)과 대응하는 제3영역(250c), 제4하우징(240)과 대응하는 제4영역(250d), 제1힌지 모듈(285)과 대응하는 제1폴딩 영역(250e), 제2힌지 모듈(286)과 대응하는 제2폴딩 영역(250f), 및 제1힌지 모듈(285)과 제2힌지 모듈(286)을 탄성적으로 연결하는 탄성 지지체(287)와 대응하는 영역에 배치되는 교차 영역(250g)(예: 제1폴딩 영역(250e)과 제2폴딩 영역(250f)이 교차하는 영역)을 포함할 수 있다. 한 실시예에 따르면, 제1영역(250a), 제2영역(250b), 제3영역(250c), 및/또는 제4영역(250d)은 제1힌지 모듈(285) 및 제2힌지 모듈(286)을 통한 하우징들(210, 220, 230, 240)의 접힘 동작에 따라 적어도 부분적으로 서로 마주보거나, 서로 반대 방향을 향하도록 변형될 수 있다. 플렉서블 디스플레이(250)는, 하우징(210, 220, 230, 240)에 의해 형성된 공간 상에 배치될 수 있다. 예를 들어, 플렉서블 디스플레이(250)는 하우징(210, 220, 230, 240)에 의해 형성되는 리세스(recess)에 안착될 수 있으며, 폴더블 전자 장치(200)의 전면(예: Z 축 방향을 향하는 면) 대부분을 형성하도록 배치될 수 있다.According to various embodiments, the flexible display 250 includes a first area 250a corresponding to the first housing 210 , a second area 250b corresponding to the second housing 220 , and a third housing 230 . ) corresponding to the third region 250c, the fourth region 250d corresponding to the fourth housing 240, the first folding region 250e corresponding to the first hinge module 285, the second hinge module ( 286) and a second folding area (250f) corresponding to, and an intersection area ( 250g) (eg, a region where the first folding region 250e and the second folding region 250f intersect). According to one embodiment, the first region 250a, the second region 250b, the third region 250c, and/or the fourth region 250d are the first hinge module 285 and the second hinge module ( According to a folding operation of the housings 210 , 220 , 230 , and 240 through 286 , they may at least partially face each other or may be deformed to face opposite directions. The flexible display 250 may be disposed in a space formed by the housings 210 , 220 , 230 , and 240 . For example, the flexible display 250 may be seated in a recess formed by the housings 210 , 220 , 230 , and 240 , and the front surface of the foldable electronic device 200 (eg, in the Z-axis direction) The surface facing) may be disposed to form most of the
다양한 실시예에 따르면, 폴더블 전자 장치(200)는 플렉서블 디스플레이(250)의 적어도 일부 영역 아래에 배치되거나, 플렉서블 디스플레이(250)의 적어도 일부에 마련된 오프닝(예: 펀치홀)을 통해 시각적으로 노출되도록 배치되는 적어도 하나의 전자 부품을 포함할 수 있다. 한 실시예에 따르면, 적어도 하나의 전자 부품은 폴더블 전자 장치(200)의 내부 공간에 배치되는 적어도 하나의 카메라 모듈(204, 또는 207)(예: 도 1의 카메라 모듈(180)) 및 적어도 하나의 센서 모듈(205)(예: 도 1의 센서 모듈(176))을 포함할 수 있다. 한 실시예에 따르면, 적어도 하나의 카메라 모듈(204, 또는 207)은 폴더블 전자 장치(200)의 내부 공간에서 플렉서블 디스플레이(250) 아래에 배치되고, 플렉서블 디스플레이(250)를 통해 피사체를 촬영하기 위한 제1카메라 모듈(204), 및 폴더블 전자 장치(200)의 내부 공간에 배치되고, 후면(예: 제2면(212))을 통해 피사체를 촬영하기 위한 제2카메라 모듈(207)을 포함할 수 있다. 어떤 실시예에서, 적어도 하나의 카메라 모듈(204)은, 전자 장치(200)의 내부 공간에서, 플렉서블 디스플레이(250)의 적어도 일부에 형성된 천공된 오프닝 없이, 플렉서블 디스플레이(250)를 통해 외부로부터 시각적으로 보이지 않도록 배치될 수도 있다. 이러한 경우, 적어도 하나의 카메라 모듈(204)과 대응하는 플렉서블 디스플레이(250)의 디스플레이 패널의 대응 영역은 배선 밀도 및/또는 픽셀 밀도를 조절하여 주변 영역보다 높은 투과율을 갖도록 구성될 수 있다. 한 실시예에 따르면, 제1카메라 모듈(204)은 플렉서블 디스플레이(250)의 제1영역(250a) 아래에 배치될 수 있다. 어떤 실시예에서, 제1카메라 모듈(204)은 제2영역(250b), 제3영역(250c) 및/또는 제4영역(250d) 아래에 배치될 수도 있다. 한 실시예에 따르면, 제2카메라 모듈(207)은, 폴더블 전자 장치(200)의 내부 공간에서 제1후면 커버(214)와 대응하도록 배치될 수 있다. 어떤 실시예에서, 제2카메라 모듈(207)은, 폴더블 전자 장치(200)의 내부 공간에서, 제2후면 커버(224), 제3후면 커버(234) 및/또는 제4후면 커버(244)와 대응하도록 배치될 수도 있다. 한 실시예에 따르면, 제2카메라 모듈(207)은 복수의 카메라 또는 하나의 카메라로 구성될 수 있다. 한 실시예에 따르면, 제2카메라 모듈은 생략되어, 제1후면 커버(214), 제2후면 커버(224), 제3후면 커버(234) 및/또는 제4후면 커버(244)에 배치되지 않을 수 있다. 한 실시예에 따르면, 적어도 하나의 센서 모듈(205)은 근접 센서, 조도 센서, 홍채 인식 센서, 초음파 센서, 지문 센서, 거리 검출 센서(예: TOF 센서), 또는 인디케이터 중 적어도 하나를 포함할 수 있다. 한 실시예에 따르면, 폴더블 전자 장치(200)는, 제1하우징(210) 중 적어도 일부를 통해 배치되는 리시버(206)를 포함할 수 있다. 한 실시예에 따르면, 폴더블 전자 장치(200)는, 미도시되었으나, 제1하우징(210), 제2하우징(220), 제3하우징(230) 및/또는 제4하우징(240)을 통해 배치되는 인터페이스 커넥터 포트, 이어잭 홀, 외장형 스피커 모듈, 외장형 카드(SIM, UIM 또는 SD 카드) 트레이, 또는 적어도 하나의 키 버튼을 포함할 수도 있다. According to various embodiments, the foldable electronic device 200 is disposed under at least a portion of the flexible display 250 or is visually exposed through an opening (eg, a punch hole) provided in at least a portion of the flexible display 250 . It may include at least one electronic component arranged so as to be possible. According to an embodiment, the at least one electronic component includes at least one camera module 204 or 207 (eg, the camera module 180 of FIG. 1 ) disposed in the inner space of the foldable electronic device 200 and at least One sensor module 205 (eg, the sensor module 176 of FIG. 1 ) may be included. According to an embodiment, the at least one camera module 204 or 207 is disposed under the flexible display 250 in the internal space of the foldable electronic device 200 , and is configured to photograph a subject through the flexible display 250 . a first camera module 204 for, and a second camera module 207 disposed in the inner space of the foldable electronic device 200 for photographing a subject through the rear surface (eg, the second surface 212) may include In some embodiments, the at least one camera module 204, in the interior space of the electronic device 200 , is visually displayed from the outside through the flexible display 250 without a perforated opening formed in at least a portion of the flexible display 250 . It may be arranged so that it cannot be seen. In this case, the corresponding area of the display panel of the flexible display 250 corresponding to the at least one camera module 204 may be configured to have higher transmittance than the surrounding area by adjusting the wiring density and/or pixel density. According to an embodiment, the first camera module 204 may be disposed under the first area 250a of the flexible display 250 . In some embodiments, the first camera module 204 may be disposed under the second area 250b, the third area 250c, and/or the fourth area 250d. According to an embodiment, the second camera module 207 may be disposed to correspond to the first rear cover 214 in the inner space of the foldable electronic device 200 . In some embodiments, the second camera module 207 may include, in the inner space of the foldable electronic device 200 , the second back cover 224 , the third back cover 234 , and/or the fourth back cover 244 . ) may be arranged to correspond to According to an embodiment, the second camera module 207 may include a plurality of cameras or a single camera. According to one embodiment, the second camera module is omitted, and is not disposed on the first back cover 214 , the second back cover 224 , the third back cover 234 and/or the fourth back cover 244 . it may not be According to an embodiment, the at least one sensor module 205 may include at least one of a proximity sensor, an illuminance sensor, an iris recognition sensor, an ultrasonic sensor, a fingerprint sensor, a distance detection sensor (eg, TOF sensor), or an indicator. have. According to an embodiment, the foldable electronic device 200 may include a receiver 206 disposed through at least a part of the first housing 210 . According to an embodiment, although not shown, the foldable electronic device 200 is configured through the first housing 210 , the second housing 220 , the third housing 230 , and/or the fourth housing 240 . It may include an interface connector port, an ear jack hole, an external speaker module, an external card (SIM, UIM or SD card) tray, or at least one key button to be disposed.
다양한 실시예에 따르면, 하우징들(210, 220, 230, 240)은, 폴더블 전자 장치(200)의 상태(예: 펼침 상태, 접힘 상태, 또는 중간 상태)에 따라 서로 이루는 각도나, 서로에 대한 거리가 달라질 수 있다. 예를 들면, 하우징들(210, 220, 230, 240)이 이루는 각도는, 펼침 상태에서는 제1각도(예: 약 180도), 접힘 상태에서는 제2각도(예: 약 0도 또는 약 360도), 또는 중간 상태에서는 제3각도(예: 약 90도)를 형성할 수 있다. 예를 들면, 접힘 상태에서, 폴더블 전자 장치(200)는 제1폴딩 방식(예: 아웃 폴딩), 또는 제2폴딩 방식(예: 인 폴딩)에 따라 하우징들(210, 220, 230, 240)이 이루는 각도가 상이할 수 있다. 또한, 중간 상태의 경우, 접힘 상태에서 펼침 상태로 또는 펼침 상태에서 접힘 상태로 이동하는, 임의의 지정된 각도를 유지하는 상태를 포함할 수 있다.According to various embodiments, the housings 210 , 220 , 230 , and 240 may be formed at an angle to each other or to each other according to a state (eg, an unfolded state, a folded state, or an intermediate state) of the foldable electronic device 200 . distance may vary. For example, the angle formed by the housings 210 , 220 , 230 , and 240 is a first angle (eg, about 180 degrees) in an unfolded state, and a second angle (eg, about 0 degrees or about 360 degrees) in a folded state ), or in an intermediate state, it can form a third angle (eg, about 90 degrees). For example, in the folded state, the foldable electronic device 200 includes the housings 210 , 220 , 230 , and 240 according to a first folding method (eg, out-folding) or a second folding method (eg, in-folding). ) may be different from each other. In addition, in the case of the intermediate state, it may include a state of maintaining an arbitrary designated angle, moving from the folded state to the unfolded state or from the unfolded state to the folded state.
다양한 실시예에 따르면 제1힌지 모듈(285)은 제1하우징(210)과 제3하우징(230)을, 제2하우징(220)과 제4하우징(240)에 대하여 아웃 폴딩(out folding) 방식으로 동작시키기 위한 레일형 다관절 힌지 모듈을 포함할 수 있다. 다른 실시예로, 제1힌지 모듈(285)는 제1하우징(210)과 제3하우징(230)을, 제2하우징(220)과 제4하우징(240)에 대하여 아웃 폴딩 방식으로 동작시킴에 따라 플렉서블 디스플레이(250)가 시각적으로 노출되는 면적 및/또는 길이가 변경될 경우, 적용되는 다관절 힌지 모듈을 포함할 수 있다. 예를 들면, 다관절 힌지 모듈은 1축, 2축 또는 다축 힌지 모듈을 포함할 수 있다. 한 실시예에 따르면, 제2힌지 모듈(286)은 제1하우징(210)과 제2하우징(220)을, 제3하우징(230)과 제4하우징(240)에 대하여 인 폴딩(in folding) 방식으로 동작시키기 위한 2축 힌지 모듈 및/또는 1축 힌지 모듈을 포함할 수 있다. 한 실시예에 따르면, 폴더블 전자 장치(200)의 상태 변화(예: 아웃 폴딩, 또는 인 폴딩)에 따른 폴더블 전자 장치(200)의 두께는, 인 폴딩과 아웃 폴딩에서 서로 다를 수 있다. 예를 들면, 제2 힌지 모듈(286)을 통한 인 폴딩을 수행한 상태가, 제1 힌지 모듈(285)을 통한 아웃 폴딩을 수행한 상태보다 폴더블 전자 장치(200)의 두께가 작게 형성될 수 있다.According to various embodiments, the first hinge module 285 has the first housing 210 and the third housing 230, and the second housing 220 and the fourth housing 240 are out-folding (out-folding) method. It may include a rail-type multi-joint hinge module for operation as a In another embodiment, the first hinge module 285 operates the first housing 210 and the third housing 230 in an out-folding manner with respect to the second housing 220 and the fourth housing 240 . Accordingly, when the area and/or length to which the flexible display 250 is visually exposed is changed, a multi-joint hinge module may be included. For example, the multi-joint hinge module may include a single-axis, two-axis, or multi-axis hinge module. According to an embodiment, the second hinge module 286 is folded with respect to the first housing 210 and the second housing 220 , and the third housing 230 and the fourth housing 240 . may include a biaxial hinge module and/or a uniaxial hinge module for operating in this manner. According to an embodiment, the thickness of the foldable electronic device 200 according to a state change (eg, out-folding or in-folding) of the foldable electronic device 200 may be different in in-folding and out-folding. For example, the foldable electronic device 200 may have a smaller thickness in a state in which in-folding is performed through the second hinge module 286 than in a state in which out-folding is performed through the first hinge module 285 . can
도 3a는 본 개시의 다양한 실시예에 따른 제1폴딩 방식으로 접힌 상태에서, 폴더블 전자 장치의 전면을 도시한 도면이다. 도 3b는 본 개시의 다양한 실시예에 따른 제1폴딩 방식으로 접힌 상태에서, 폴더블 전자 장치의 후면을 도시한 도면이다. 도 3c는 본 개시의 다양한 실시예에 따른 제2폴딩 방식으로 접힌 상태에서, 폴더블 전자 장치의 후면을 도시한 도면이다.3A is a view illustrating a front side of a foldable electronic device in a state folded in a first folding manner according to various embodiments of the present disclosure; 3B is a view illustrating a rear surface of a foldable electronic device in a state folded in a first folding manner according to various embodiments of the present disclosure; 3C is a view illustrating a rear side of a foldable electronic device in a state in which it is folded in a second folding method according to various embodiments of the present disclosure;
도 3a 및 도 3b를 참고하면, 폴더블 전자 장치(200)는 제1하우징(210)과 제3하우징(230)이, 제2하우징(220)과 제4하우징(240)에 대하여, 제1폴딩 방식(예: 아웃 폴딩 방식)으로 접히도록 동작될 수 있다. 이러한 경우, 플렉서블 디스플레이(250)는 외부로 노출되도록 배치될 수 있다. 예컨대, 제1하우징(210)과 제3하우징(230)이, 제2하우징(220)과 제4하우징(240)에 대하여, 제1폴딩축(A)을 기준으로 접힘 상태일 때, 제1면(211)과 제5면(231)이 실질적으로 동일한 제1방향을 향하고, 제3면(221)과 제7면(241)이 제1방향과 반대 방향을 향하며, 제2면(212)은 제4면(222)과 대응하고, 제6면(232)은 제8면(242)과 대응할 수 있다. 한 실시예에 따르면, 제1폴딩 방식으로 접힌 상태일 때, 제2카메라 모듈(207)이 외부로 노출되도록, 제2하우징(220)과 제4하우징(240)의 지지를 받는 플렉서블 디스플레이(250)의 제2영역(250b)과 제4영역(250d)의 면적의 합이, 제1하우징(210)과 제3하우징(230)의 지지를 받는 플렉서블 디스플레이(250)의 제1영역(250a)과 제3평면영역(250c)의 면적의 합보다 작게 형성될 수 있다.(비대칭으로 접히는 구조) 예를 들어, 폴더블 전자 장치(200)는 제1폴딩 방식으로 접힌 상태에서도, 제2카메라 모듈(207)을 통해 피사체를 촬영할 수 있다. 어떤 실시예에서, 제2하우징(220)과 제4하우징(240)의 지지를 받는 플렉서블 디스플레이(250)의 제2영역(250b)과 제4영역(250d)의 면적의 합은 제1하우징(210)과 제3하우징(230)의 지지를 받는 플렉서블 디스플레이(250)의 제1영역(250a)과 제3영역(250c)의 면적의 합과 실질적으로 동일하게 형성될 수도 있다.(대칭으로 접히는 구조) 어떤 실시예에서, 제2하우징(220)과 제4하우징(240)의 면적의 합이, 제1하우징(210)과 제3하우징(230)의 면적의 합보다 작게 형성될 수 있다.(비대칭으로 접히는 구조) 어떤 실시예에서, 제2하우징(220)과 제4하우징(240)의 면적의 합은 제1하우징(210)과 제3하우징(230)의 면적의 합과 실질적으로 동일하게 형성될 수도 있다.(대칭으로 접히는 구조) 어떤 실시예에서, -제1힌지 모듈(285), 제2힌지 모듈(286), 및/또는 탄성 지지체(287)의 적어도 일부는 폴더블 전자 장치(200)의 외부로 노출되거나, 또는 노출되지 않도록 내부 공간에 배치될 수도 있다.Referring to FIGS. 3A and 3B , in the foldable electronic device 200 , the first housing 210 and the third housing 230 and the second housing 220 and the fourth housing 240 are first It may be operated to be folded in a folding method (eg, an out-folding method). In this case, the flexible display 250 may be disposed to be exposed to the outside. For example, when the first housing 210 and the third housing 230 are folded with respect to the second housing 220 and the fourth housing 240 with respect to the first folding axis A, the first The surface 211 and the fifth surface 231 are substantially oriented in the same first direction, the third surface 221 and the seventh surface 241 are oriented in a direction opposite to the first direction, and the second surface 212 is opposite to the first direction. may correspond to the fourth surface 222 , and the sixth surface 232 may correspond to the eighth surface 242 . According to an embodiment, the flexible display 250 supported by the second housing 220 and the fourth housing 240 so that the second camera module 207 is exposed to the outside when it is folded in the first folding manner. ), the sum of the areas of the second region 250b and the fourth region 250d is the first region 250a of the flexible display 250 supported by the first housing 210 and the third housing 230 . It may be formed to be smaller than the sum of the areas of the area and the third planar region 250c. (Asymmetrically folded structure) For example, even when the foldable electronic device 200 is folded in the first folding method, the second camera module A subject can be photographed through (207). In some embodiments, the sum of the areas of the second region 250b and the fourth region 250d of the flexible display 250 supported by the second housing 220 and the fourth housing 240 is the first housing ( It may be formed to be substantially equal to the sum of the areas of the first region 250a and the third region 250c of the flexible display 250 supported by the 210 and the third housing 230. (Symmetrically folded) Structure) In some embodiments, the sum of the areas of the second housing 220 and the fourth housing 240 may be formed to be smaller than the sum of the areas of the first housing 210 and the third housing 230 . (Asymmetrically folded structure) In some embodiments, the sum of the areas of the second housing 220 and the fourth housing 240 is substantially equal to the sum of the areas of the first housing 210 and the third housing 230 . (Symmetrically folded structure) In some embodiments, at least a portion of the first hinge module 285 , the second hinge module 286 , and/or the elastic support 287 is a foldable electronic device 200 may be exposed to the outside, or disposed in the inner space so as not to be exposed.
도 3c를 참고하면, 폴더블 전자 장치(200)는 제1하우징(210)과 제2하우징(220)이, 제3하우징(230)과 제4하우징(240)에 대하여, 제2폴딩 방식(예: 인 폴딩 방식)으로 접히도록 동작될 수 있다. 이러한 경우, 플렉서블 디스플레이(250)는 외부로 노출되지 않도록 배치될 수 있다. 예컨대, 제1하우징(210)과 제2하우징(220)이, 제3하우징(230)과 제4하우징(240)에 대하여, 제2폴딩축(B)을 기준으로 접힘 상태일 때, 제1면(211)은 제5면(231)과 대응하고, 제3면(221)은 제7면(241)과 대응할 수 있다. 한 실시예에 따르면, 제1하우징(210)과 제3하우징(220)의 지지를 받는 플렉서블 디스플레이(250)의 제1영역(250a)과 제3영역(250c)의 면적의 합이, 제3하우징(230)과 제4하우징(240)의 지지를 받는 플렉서블 디스플레이(250)의 제3영역(250c)과 제4영역(250d)의 면적의 합과 실질적으로 동일하게 형성될 수 있다. 예를 들면, 폴더블 전자 장치(200)는 제2폴딩 방식으로 접힌 상태에서, 휴대성이 용이해지고, 외부 충격 및/또는 이물질로부터 플렉서블 디스플레이(250)를 보호할 수 있다. Referring to FIG. 3C , in the foldable electronic device 200, the first housing 210 and the second housing 220, the third housing 230 and the fourth housing 240 are in a second folding method ( For example, it may be operated to be folded in an in-folding manner. In this case, the flexible display 250 may be disposed so as not to be exposed to the outside. For example, when the first housing 210 and the second housing 220 are folded with respect to the third housing 230 and the fourth housing 240 based on the second folding axis B, the first The surface 211 may correspond to the fifth surface 231 , and the third surface 221 may correspond to the seventh surface 241 . According to an embodiment, the sum of the areas of the first region 250a and the third region 250c of the flexible display 250 supported by the first housing 210 and the third housing 220 is the third It may be formed to be substantially equal to the sum of the areas of the third region 250c and the fourth region 250d of the flexible display 250 supported by the housing 230 and the fourth housing 240 . For example, when the foldable electronic device 200 is folded in the second folding method, portability may be facilitated and the flexible display 250 may be protected from external shocks and/or foreign substances.
다양한 실시예에 따르면, 전자 장치(200)는 펼침 상태, 제1폴딩 방식(예: 아웃 폴딩 방식)으로 접힘 상태 및/또는 제2폴딩 방식(예: 인 폴딩 방식)으로 접힘 상태에 따라 다양한 모드로 동작하도록 설정될 수 있다. 한 실시예에 따르면, 전자 장치(200)는 펼침 상태일 경우(예: 도 2a의 경우), 제1모드(예: 타블렛(tablet mode) 모드)로 동작하도록 설정될 수 있다. 예를 들면, 제1모드의 경우, 전자 장치(200)는 지정된 비율(예: 4:3)의 대화면 디스플레이(예: full front display)를 제공할 수 있다. 한 실시예에 따르면, 전자 장치(200)는 제1폴딩 방식으로 접힘 상태일 경우(예: 도 3a의 경우), 제2모드(예: 통화 모드 또는 셀피(selfie)) 모드)로 동작하도록 설정될 수 있다. 예를 들면, 제2모드의 경우, 전자 장치(200)는 서로 다른 비율의 디스플레이를 제공할 수 있다. 예를 들면, 접힘 상태(예: 도 3a의 경우)에서, 제1면(211)과 제5면(231)을 통해 제1 비율(예: 2:1)의 디스플레이를 제공할 수 있고, 제3면(221)과 제7면(241)을 통해 제2 비율(예: 4:1)의 디스플레이를 제공할 수 있다. 일 실시예에 따라, 접힘 상태(예: 도 3a의 경우)에서, 제1 비율을 이용하여 통화 모드를 제공할 수 있고, 제2 비율을 이용하여 셀피 모드를 제공할 수 있다. 예를 들면, 전자 장치(200)는 통화 모드에서, 플렉서블 디스플레이(250)의 하단(예: -z축 방향)에 배치되는 적어도 하나의 제1카메라 모듈(204)을 이용하여 통화 기능(예: 영상 통화)과 관련된 이미지를 획득하고, 제1 카메라 모듈(204)과 실질적으로 동일한 방향을 향하는 면(예: 제1면(211)과 제5면(231))의 적어도 일부에 제공할 수 있다. 또한 전자 장치(200)는, 셀피 모드에서, 카메라 촬영과 관련된 영상 정보(예: 프리뷰(pre-view), 또는 촬영 이미지)를 적어도 하나의 제2카메라 모듈(207)과 실질적으로 동일한 방향을 향하는 면(예: 제3면(221), 제7면(241))의 적어도 일부에 제공할 수 있다. 한 실시예에 따르면, 전자 장치(200)는 제2폴딩 방식으로 접힘 상태일 경우(예: 도 3c의 경우), 제3모드(예: 지갑(wallet)모드)로 동작하도록 설정될 수도 있다. 예를 들면, 전자 장치(200)는 제3모드에서 플렉서블 디스플레이(250)을 외부의 충격으로부터 보호하면서, 지지 부재 어셈블리(280) 및 후면 커버들(214, 224, 234, 244) 사이에 위치된 안테나(미도시)를 이용하여 결제 기능 및/또는 충전 기능을 수행할 수 있다. 예를 들면, 안테나(미도시)는, NFC(near field communication) 안테나, 무선 충전 안테나, 및/또는 MST(magnetic secure transmission) 안테나를 포함할 수 있다. 안테나(미도시)는, 예를 들어, 외부 전자 장치(예: 도 1의 전자 장치(102, 104), 서버(108))와 근거리 통신을 하거나, 충전에 필요한 전력을 무선으로 송수신 할 수 있다.According to various embodiments, the electronic device 200 has various modes according to the unfolded state, the folded state in the first folding method (eg, the out-folding method), and/or the folded state in the second folding method (eg, the in-folding method). It can be set to operate as According to an embodiment, when the electronic device 200 is in an unfolded state (eg, in the case of FIG. 2A ), it may be set to operate in a first mode (eg, a tablet mode). For example, in the first mode, the electronic device 200 may provide a large screen display (eg, a full front display) of a specified ratio (eg, 4:3). According to an embodiment, when the electronic device 200 is folded in the first folding method (eg, in the case of FIG. 3A ), the electronic device 200 is set to operate in the second mode (eg, a call mode or a selfie mode) can be For example, in the second mode, the electronic device 200 may provide displays of different ratios. For example, in a folded state (eg, in the case of FIG. 3A ), a display of a first ratio (eg, 2:1) may be provided through the first surface 211 and the fifth surface 231 , A display of a second ratio (eg, 4:1) may be provided through the third surface 221 and the seventh surface 241 . According to an embodiment, in the folded state (eg, in the case of FIG. 3A ), the call mode may be provided using the first ratio and the selfie mode may be provided using the second ratio. For example, in the call mode, the electronic device 200 uses the at least one first camera module 204 disposed at the lower end (eg, -z-axis direction) of the flexible display 250 to perform a call function (eg: may acquire an image related to a video call) and provide it to at least a portion of a surface (eg, the first surface 211 and the fifth surface 231 ) facing substantially in the same direction as the first camera module 204 . . Also, in the selfie mode, the electronic device 200 provides image information (eg, a preview, or a photographed image) related to camera shooting in a direction substantially the same as that of the at least one second camera module 207 . It may be provided on at least a portion of the surfaces (eg, the third surface 221 and the seventh surface 241 ). According to an embodiment, when the electronic device 200 is folded in the second folding method (eg, in the case of FIG. 3C ), it may be set to operate in a third mode (eg, a wallet mode). For example, in the third mode, the electronic device 200 is positioned between the support member assembly 280 and the rear covers 214 , 224 , 234 , and 244 while protecting the flexible display 250 from external impact. A payment function and/or a charging function may be performed using an antenna (not shown). For example, the antenna (not shown) may include a near field communication (NFC) antenna, a wireless charging antenna, and/or a magnetic secure transmission (MST) antenna. An antenna (not shown), for example, may perform short-range communication with an external electronic device (eg, the electronic devices 102 and 104 of FIG. 1 , and the server 108 of FIG. 1 ) or wirelessly transmit/receive power required for charging. .
도 4는 본 개시의 다양한 실시예에 따른 폴더블 전자 장치(200)의 분리 사시도이다.4 is an exploded perspective view of the foldable electronic device 200 according to various embodiments of the present disclosure.
도 4를 참고하면, 멀리 폴더블 전자 장치(200)는 플렉서블 디스플레이(250), 플렉서블 디스플레이(250) 아래에 순차적으로 배치되는 도전성 시트층(260)(예: 도전성 플레이트, 지지 부재, 지지 시트 또는 금속 시트층), 보강 플레이트(270), 지지 부재 어셈블리(280), 적어도 하나의 기판(291, 292)(예: PCB(printed circuit board), FPCB(flexible PCB), 또는 RFPCB(rigid flexible PCB)), 굴곡 가능한 적어도 하나의 가요성 기판(예: FPCB)(295a, 295b, 295c), 적어도 하나의 배터리(293, 294) 및 후면 커버들(214, 224, 234, 244)을 포함할 수 있다. 어떤 실시예에서, 폴더블 전자 장치(200)는 플렉서블 디스플레이(250) 아래에 배치되는, 필기 입력을 인식하기 위한 부재(예: 디지타이저)를 더 포함할 수도 있다. 예를 들면, 전자 펜으로부터 인가된 전자기 유도 방식의 공진 주파수를 검출할 수 있도록 유전체 기판상에 배치되는 코일 부재를 포함할 수 있다. 어떤 실시예에서, 폴더블 전자 장치(200)는 플렉서블 디스플레이(250) 중에 배치되는 터치 센서를 더 포함할 수도 있다. 어떤 실시예에서, 폴더블 전자 장치(200)는 복수의 디스플레이(예: 도 1의 표시 장치(160))를 포함할 수 있고, 제1디스플레이(예: 플렉서블 디스플레이(250))는 UB(unbreakable) type OLED(active matrix organic light-emitting diode) 디스플레이를 포함할 수 있고, 제2디스플레이(미도시)는 OCTA(on cell touch AMOLED) 디스플레이를 포함할 수도 있다. 어떤 실시예에서, 도전성 시트층(260)은 플렉서블 디스플레이(250)를 지지하기 위한 리지드(rigid)한 특성을 갖는 FRP(fiber reinforced plastics)(예: CFRP(carbon fiber reinforced plastics) 또는 GFRP(glass fiber reinforced plastics))와 같은, 비금속 박판형 소재로 대체될 수도 있다.Referring to FIG. 4 , the far foldable electronic device 200 includes a flexible display 250 and a conductive sheet layer 260 sequentially disposed under the flexible display 250 (eg, a conductive plate, a support member, a support sheet, or metal sheet layer), reinforcing plate 270 , support member assembly 280 , at least one substrate 291 , 292 (eg, a printed circuit board (PCB), flexible PCB (FPCB), or rigid flexible PCB (RFPCB). ), at least one flexible substrate capable of being bendable (eg, FPCB) 295a, 295b, 295c, at least one battery 293, 294, and back covers 214, 224, 234, 244. . In some embodiments, the foldable electronic device 200 may further include a member (eg, a digitizer) for recognizing a handwriting input, which is disposed under the flexible display 250 . For example, it may include a coil member disposed on the dielectric substrate to detect the resonance frequency of the electromagnetic induction method applied from the electronic pen. In some embodiments, the foldable electronic device 200 may further include a touch sensor disposed in the flexible display 250 . In some embodiments, the foldable electronic device 200 may include a plurality of displays (eg, the display device 160 of FIG. 1 ), and the first display (eg, the flexible display 250 ) is an unbreakable display (UB). ) type active matrix organic light-emitting diode (OLED) display, and the second display (not shown) may include an on cell touch AMOLED (OCTA) display. In some embodiments, the conductive sheet layer 260 may be formed of fiber reinforced plastics (FRP) having rigid properties for supporting the flexible display 250 (eg, carbon fiber reinforced plastics (CFRP) or glass fiber (GFRP)). It can also be replaced with non-metallic sheet-like materials, such as reinforced plastics).
다양한 실시예에 따르면, 플렉서블 디스플레이(250)는 윈도우층(251), 편광층(252), 디스플레이 패널(253) 및 폴리머층(254)을 포함할 수 있다. 한 실시예에 따르면, 윈도우층(251), 편광층(252), 디스플레이 패널(253) 및 폴리머층(254)은 점착제(P)(또는 접착제)를 통해 서로에 대하여 부착될 수 있다. 예컨대, 점착제(P)는 OCA(optical clear adhesive), PSA(pressure sensitive adhesive), 열반응 접착제, 일반 접착제, 또는 양면 테이프 중 적어도 하나를 포함할 수 있다.According to various embodiments, the flexible display 250 may include a window layer 251 , a polarization layer 252 , a display panel 253 , and a polymer layer 254 . According to one embodiment, the window layer 251 , the polarizing layer 252 , the display panel 253 , and the polymer layer 254 may be attached to each other through an adhesive P (or an adhesive). For example, the adhesive P may include at least one of an optical clear adhesive (OCA), a pressure sensitive adhesive (PSA), a heat-responsive adhesive, a general adhesive, and a double-sided tape.
다양한 실시예에 따르면, 윈도우층(251)은 글래스층을 포함할 수 있다. 한 실시예에 따르면, 윈도우층(251)은 UTG(ultra thin glass)를 포함할 수 있다. 어떤 실시예에서, 윈도우층(251)은 폴리머를 포함할 수도 있다. 이러한 경우, 윈도우층(251)은 PET(polyethylene terephthalate) 또는 PI(polyimide)를 포함할 수 있다. 어떤 실시예에서, 윈도우층(251)은 복수로 배치될 수도 있다. 예를 들면, 복수의 윈도우층(251)들 중 하나의 층(예: 상면)은 다른 하나의 층으로부터 잘 분리될 수 있도록, 다른 층의 접착제보다 접착력이 약하거나 두께가 더 얇은 접착제에 의해 배치될 수도 있다. 다양한 실시예에 따르면, 윈도우층(251)은 순차적으로 적층되는 제1소재로 형성된 제1보호층, 및 제1소재와 다른 제2소재로 형성된 제2보호층을 포함할 수 있다. 예를 들면, 제1소재는 제2소재보다 상대적으로 우수한 광학적 특성을 갖는 PET 또는 PI를 포함할 수 있고, 제2소재는 제1소재보다 상대적으로 탄성 측면에서 유리한 TPU(Thermoplastic polyurethane)를 포함할 수 있다. 어떤 실시예에서, 윈도우층(251)은 상면, 하면 및/또는 측면 중 적어도 하나의 면의 적어도 일부에 형성되는 다양한 코팅층을 더 포함할 수도 있다. According to various embodiments, the window layer 251 may include a glass layer. According to an embodiment, the window layer 251 may include ultra thin glass (UTG). In some embodiments, the window layer 251 may include a polymer. In this case, the window layer 251 may include polyethylene terephthalate (PET) or polyimide (PI). In some embodiments, a plurality of window layers 251 may be disposed. For example, one layer (eg, the top surface) of the plurality of window layers 251 is disposed by an adhesive having a weaker adhesive strength or a thinner thickness than that of the other layer so that it can be well separated from the other layer. it might be According to various embodiments, the window layer 251 may include a first protective layer formed of a first material that is sequentially stacked, and a second protective layer formed of a second material different from the first material. For example, the first material may include PET or PI having relatively superior optical properties than the second material, and the second material may include TPU (thermoplastic polyurethane), which is relatively advantageous in elasticity than the first material. can In some embodiments, the window layer 251 may further include various coating layers formed on at least a portion of at least one of an upper surface, a lower surface, and/or a side surface.
한 실시예에 따르면, 디스플레이 패널(253)은 복수의 픽셀들을 포함할 수 있다. 한 실시예에 따르면, 디스플레이 패널(253)의 상면 에서 바라볼 때, 폴더블 전자 장치(200)에 포함된 적어도 하나의 전자 부품(예: 도 2a 내지 2b의 카메라 모듈(204, 또는 207), 또는 센서 모듈(205))와 적어도 일부 중첩되는 영역에는 복수의 픽셀들이 배치되지 않을 수 있다. 한 실시예에 따르면, 디스플레이 패널(253)은, 복수의 픽셀들의 보호하기 위한 픽셀 보호층(미도시)을 포함할 수 있다. 예를 들어, 픽셀 보호층(미도시)는 인캡슐레이션 글래스(encapsulation glass)를 포함할 수 있다. 예를 들면, 디스플레이 패널(253)은, LCP(liquid crystal polymer), 또는 LTPS(low temperature polycrystalline silicon) 글래스를 포함할 수 있다. 예를 들면, 복수의 픽셀들은, LTPS 글래스에 형성된 TFT(thin film transistor)를 포함할 수 있다. 한 실시예에 따르면, 디스플레이 패널(253)의 내부에는 카메라 모듈(예: 도 2a 내지 2b의 카메라 모듈(204, 또는 207))로 유입되는 광의 회절을 줄이기 위한 지정된 패턴(black matrix), 또는 지정된 패턴들을 포함하는 불투명 금속층(미도시)(예: buffer layer)이 형성될 수 있다. According to one embodiment, the display panel 253 may include a plurality of pixels. According to one embodiment, when viewed from the top of the display panel 253, at least one electronic component included in the foldable electronic device 200 (eg, the camera module 204 or 207 of FIGS. 2A to 2B ); Alternatively, the plurality of pixels may not be disposed in an area that at least partially overlaps the sensor module 205 . According to an embodiment, the display panel 253 may include a pixel protection layer (not shown) for protecting the plurality of pixels. For example, the pixel passivation layer (not shown) may include encapsulation glass. For example, the display panel 253 may include liquid crystal polymer (LCP) or low temperature polycrystalline silicon (LTPS) glass. For example, the plurality of pixels may include a thin film transistor (TFT) formed on LTPS glass. According to one embodiment, a specified pattern (black matrix) for reducing diffraction of light entering the interior of the display panel 253 (eg, the camera module 204 or 207 of FIGS. 2A to 2B ), or a specified An opaque metal layer (not shown) (eg, a buffer layer) including patterns may be formed.
한 실시예에 따르면, 편광층(polarizer)(252)은 디스플레이 패널(253)의 광원으로부터 발생되고 일정한 방향으로 진동하는 빛을 선택적으로 통과시킬 수 있다. 한 실시예에 따르면, 디스플레이 패널(253)과 편광층(252)은 일체로 형성될 수도 있다. 한 실시예에 따르면, 플렉서블 디스플레이(250)는 터치 패널(미도시 됨)을 포함할 수도 있다. 한 실시예에 따르면, 미도시되었으나, 디스플레이 패널(253)은 제어 회로를 포함할 수 있다. 한 실시예에 따르면, 제어 회로는 COP(chip on panel) 또는 COF(chip on film) 방식으로 배치되는 DDI(display driver IC) 및/또는 TDDI(touch display driver IC)를 포함할 수 있다.According to one embodiment, the polarizer 252 may selectively pass light generated from the light source of the display panel 253 and vibrating in a predetermined direction. According to one embodiment, the display panel 253 and the polarization layer 252 may be integrally formed. According to an embodiment, the flexible display 250 may include a touch panel (not shown). According to one embodiment, although not shown, the display panel 253 may include a control circuit. According to an embodiment, the control circuit may include a display driver IC (DDI) and/or a touch display driver IC (TDDI) arranged in a chip on panel (COP) or chip on film (COF) manner.
다양한 실시예에 따르면, 폴리머층(254)은 디스플레이 패널(253) 아래에 배치됨으로써, 디스플레이 패널(253)의 시인성 확보를 위한 어두운 배경을 제공할 수 있고, 완충 작용을 위한 완충 소재(예: cushion)로 형성될 수 있다. 예를 들면, 폴리머층(254)은, 디스플레이 패널(253)과 그 하부 부착물들간에 발생될 수 있는 기포를 제거하고 디스플레이 패널(253)에서 생성된 광 또는 외부로부터 입사하는 광을 차단하기 위한 불투명 금속층(예: 울퉁 불퉁한 패턴을 포함하는 블랙층) 및/또는 충격 완화를 위하여 배치되는 완충층(예: 스폰지 층)을 포함할 수 있다.According to various embodiments, the polymer layer 254 is disposed under the display panel 253 to provide a dark background for securing visibility of the display panel 253, and a cushioning material (eg, cushion) for a cushioning action. ) can be formed. For example, the polymer layer 254 is opaque to remove air bubbles that may be generated between the display panel 253 and its lower attachments and block light generated in the display panel 253 or light incident from the outside. It may include a metal layer (eg, a black layer including an uneven pattern) and/or a buffer layer (eg, a sponge layer) disposed for impact mitigation.
다양한 실시예에 따르면, 플렉서블 디스플레이(250)는 폴리머층(254) 아래에 배치되는 적어도 하나의 기능성 부재(미도시 됨)를 포함할 수도 있다. 한 실시예에 따르면, 기능성 부재는 방열을 위한 그라파이트 시트, 포스터치 FPCB, 지문 센서 FPCB, 통신용 안테나 방사체, 도전/비도전 테이프 또는 open cell 스폰지를 포함할 수 있다. According to various embodiments, the flexible display 250 may include at least one functional member (not shown) disposed under the polymer layer 254 . According to an embodiment, the functional member may include a graphite sheet for heat dissipation, a poster touch FPCB, a fingerprint sensor FPCB, an antenna radiator for communication, a conductive/non-conductive tape, or an open cell sponge.
다양한 실시예에 따르면, 도전성 시트층(260)은 플렉서블 디스플레이(250)를 지지하기 위한 강성을 제공할 수 있고, 플렉서블 디스플레이(250)의 폴딩 영역들(예: 도 2a의 제1폴딩 영역(250e) 및 제2폴딩 영역(250f)) 및 교차 영역(예: 도 2a의 교차 영역(250g))에 대응하여 지정된 굴곡 특성을 제공하도록 배치될 수 있다. 예를 들면, 도전성 시트층(260)은 금속 플레이트를 포함할 수 있다. 한 실시예에 따르면, 도전성 시트층(260)은 SUS(steel use stainless)(예: STS(stainless steel)), Cu, Al, 또는 금속 CLAD(예: SUS와 Al이 교번하여 배치된 적층 부재) 중 적어도 하나를 포함할 수 있다. 어떤 실시예에서, 도전성 시트층(260)은 기타 다른 합금 소재를 포함할 수도 있다. 어떤 실시예에서, 도전성 시트층(260)은 전자 장치(200)의 강성 보강에 도움을 줄 수 있고, 주변 노이즈를 차폐하며, 주변의 열 방출 부품으로부터 방출되는 열을 분산시키기 위하여 사용될 수 있다. According to various embodiments, the conductive sheet layer 260 may provide rigidity for supporting the flexible display 250 , and may include folding regions of the flexible display 250 (eg, the first folding region 250e of FIG. 2A ). ) and the second folding region 250f) and the crossing region (eg, the crossing region 250g of FIG. 2A ) to provide specified bending characteristics. For example, the conductive sheet layer 260 may include a metal plate. According to an embodiment, the conductive sheet layer 260 may be formed of steel use stainless (SUS) (eg, stainless steel (STS)), Cu, Al, or metal CLAD (eg, a stacking member in which SUS and Al are alternately disposed). may include at least one of In some embodiments, the conductive sheet layer 260 may include other alloy materials. In some embodiments, the conductive sheet layer 260 may help to reinforce the rigidity of the electronic device 200 , shield ambient noise, and may be used to dissipate heat emitted from surrounding heat dissipating components.
다양한 실시예에 따르면, 도전성 시트층(260)은 플렉서블 디스플레이(250)의 제1영역(예: 도 2a의 제1영역(250a))에 대응하는 제1평면부(261), 제2영역(예: 도 2a의 제2영역(250b))에 대응하는 제2평면부(262), 제3영역(예: 도 2a의 제3영역(250c))에 대응하는 제3평면부(263), 제4영역(예: 도 2a의 제1영역(250d))에 대응하는 제4평면부(264), 제1폴딩 영역(예: 도 2a의 제1폴딩 영역(250e))에 대응하는 제1밴딩부(265), 제2폴딩 영역(예: 도 2a의 제2폴딩 영역(250f))에 대응하는 제2밴딩부(266), 및 교차 영역(예: 도 2a의 교차 영역(250g))에 대응하는 교차부(267)를 포함할 수 있다. 한 실시예에 따르면, 제1밴딩부(265)는 플렉서블 디스플레이(250)가 제1폴딩축(예: 도 2a의 제1폴딩축(A))을 기준으로 굴곡되도록 지지하기 위한 제1굴곡 특성을 제공하는 제1패턴(예: 도 6a의 제1패턴(2651))을 포함할 수 있다. 한 실시예에 따르면, 제2밴딩부(266)는 플렉서블 디스플레이(250)가 제2폴딩축(예: 도 2a의 제2폴딩축(B))을 기준으로 굴곡되도록 지지하기 위한 제2굴곡 특성을 제공하는 제2패턴(예: 도 6b의 제2패턴(2661))을 포함할 수 있다. 한 실시예에 따르면, 교차부(267)는 제1굴곡 특성 및 제2굴곡 특성을 모두 갖도록 제공되는 제3패턴(예: 도 6c의 제3패턴(2671))을 포함할 수 있다. 어떤 실시예에서, 제1굴곡 특성과 제2굴곡 특성은 동일하거나 동일하지 않을 수 있다.According to various embodiments, the conductive sheet layer 260 may include a first flat portion 261 corresponding to the first area (eg, the first area 250a of FIG. 2A ) of the flexible display 250 and a second area ( Example: a second planar portion 262 corresponding to the second area 250b of FIG. 2A ), a third planar portion 263 corresponding to a third area (eg, the third area 250c of FIG. 2A ); The fourth planar portion 264 corresponding to the fourth region (eg, the first region 250d of FIG. 2A ) and the first corresponding to the first folding region (eg, the first folding region 250e of FIG. 2A )) The bending portion 265 , the second bending portion 266 corresponding to the second folding region (eg, the second folding region 250f of FIG. 2A ), and an intersection region (eg, the intersection region 250g of FIG. 2A )) may include an intersection 267 corresponding to . According to an embodiment, the first bending part 265 has a first bending characteristic for supporting the flexible display 250 to be bent based on a first folding axis (eg, the first folding axis A of FIG. 2A ). may include a first pattern (eg, the first pattern 2651 of FIG. 6A ) providing According to an embodiment, the second bending part 266 has a second bending characteristic for supporting the flexible display 250 to be bent based on a second folding axis (eg, the second folding axis B of FIG. 2A ). may include a second pattern (eg, the second pattern 2661 of FIG. 6B ) that provides According to an embodiment, the crossing portion 267 may include a third pattern (eg, the third pattern 2671 of FIG. 6C ) provided to have both the first and second bending characteristics. In some embodiments, the first flexural characteristic and the second flexural characteristic may or may not be the same.
다양한 실시예에 따르면, 플렉서블 디스플레이(250)에서 디스플레이 패널(253) 아래에 배치된 적층 구조물들(예: 폴리머층(254), 또는 도전성 시트층(260))은, 제1 방향(예: 도 2a의 Z축 방향)에서 볼 떼, 전자 부품(예: 도 2a의 카메라 모듈(204), 센서 모듈(205), 또는 지문 센서)와 중첩되는 일부분에서 제거(또는 패터닝)됨으로써 해당 영역의 투과율을 높일 수 있다. 예를 들면, 디스플레이 패널(253) 아래에 배치된 적층 구조물들은, 도 2a의 카메라 모듈(204) 또는 지문 센서(미도시)가 내장된 영역(또는 중첩되는 영역)에서 적어도 일부가 제거(또는 패터닝)될 수 있다.According to various embodiments, the stacked structures (eg, the polymer layer 254 or the conductive sheet layer 260 ) disposed under the display panel 253 in the flexible display 250 may move in a first direction (eg, FIG. In the Z-axis direction of 2a), the transmittance of the area is reduced by removing (or patterning) it from the portion overlapping with the electronic component (eg, the camera module 204, the sensor module 205, or the fingerprint sensor of FIG. 2A). can be raised For example, the stacked structures disposed under the display panel 253 are at least partially removed (or patterned) in the area (or overlapping area) in which the camera module 204 or the fingerprint sensor (not shown) of FIG. 2A is embedded (or patterned). ) can be
다양한 실시예에 따르면, 전자 장치(200)는 도전성 시트층(260) 아래에서 도전성 시트층(260)의 평면부들(261, 262, 263, 264) 각각을 지지하고 강성을 제공하기 위하여 배치되는 보강 플레이트(270)를 포함할 수 있다. 한 실시예에 따르면, 보강 플레이트(270)는 제1평면부(261)에 대응하는 제1보강 플레이트(271), 제2평면부(262)에 대응하는 제2보강 플레이트(272), 제3평면부(263)에 대응하는 제3보강 플레이트(273) 및 제4평면부(264)에 대응하는 제4보강 플레이트(274)를 포함할 수 있다. 한 실시예에 따르면, 보강 플레이트(270)는 금속 소재로 형성될 수 있다. 어떤 실시예에서, 폴더블 전자 장치(200)는 보강 플레이트들(271, 272, 273, 274)이 배제되고, 후술될 지지 부재 어셈블리(280)를 통해 플렉서블 디스플레이(250)를 지지하기 위한 지지 구조를 가질 수도 있다.According to various embodiments, the electronic device 200 supports each of the planar portions 261 , 262 , 263 , 264 of the conductive sheet layer 260 under the conductive sheet layer 260 and a reinforcement disposed to provide rigidity. A plate 270 may be included. According to one embodiment, the reinforcing plate 270 includes a first reinforcing plate 271 corresponding to the first flat portion 261 , a second reinforcing plate 272 corresponding to the second flat portion 262 , and a third It may include a third reinforcing plate 273 corresponding to the flat portion 263 and a fourth reinforcing plate 274 corresponding to the fourth flat portion 264 . According to one embodiment, the reinforcing plate 270 may be formed of a metal material. In some embodiments, in the foldable electronic device 200 , the reinforcing plates 271 , 272 , 273 , 274 are excluded, and a support structure for supporting the flexible display 250 through a support member assembly 280 to be described later. may have
다양한 실시예에 따르면, 지지 부재 어셈블리(280)는 제1힌지 모듈(285), 제2힌지 모듈(286), 제1힌지 모듈(285)과 제2힌지 모듈(286)의 교차 영역에서 서로를 연결하는 탄성 지지체(287), 및 제1힌지 모듈(285)과 제2힌지 모듈(286)에 회동 가능하게 연결되는 복수의 지지 플레이트들(281, 282, 283, 284)을 포함할 수 있다. 한 실시예에 따르면, 지지 부재 어셈블리(280)는 폴더블 전자 장치(200)의 내부 공간에서, 플렉서블 디스플레이(250)를 지지할 수 있고, 폴더블 전자 장치(200)의 강성에 기여하기 위한 강성 구조를 가질 수 있다. According to various embodiments, the support member assembly 280 supports each other at the intersection region of the first hinge module 285 , the second hinge module 286 , and the first hinge module 285 and the second hinge module 286 . It may include an elastic support 287 for connecting, and a plurality of support plates 281 , 282 , 283 , and 284 rotatably connected to the first hinge module 285 and the second hinge module 286 . According to an embodiment, the support member assembly 280 may support the flexible display 250 in the inner space of the foldable electronic device 200 , and a rigidity for contributing to the rigidity of the foldable electronic device 200 . can have a structure.
다양한 실시예에 따르면, 제1힌지 모듈(285)은 도전성 시트층(260)의 교차부(267)와 대응하는 영역에 배치되는 탄성 지지체(287)를 기준으로, 제1폴딩축(예: 도 2a의 제1폴딩축(A))을 따라 분할되는 제1서브 힌지 모듈(2851) 및 제2서브 힌지 모듈(2852)을 포함할 수 있다. 한 실시예에 따르면, 제2힌지 모듈(286)은 탄성 지지체(287)를 기준으로, 제2폴딩축(예: 도 2a의 제2폴딩축(B))을 따라 분할되는 제3서브 힌지 모듈(2861) 및 제4서브 힌지 모듈(2862)을 포함할 수 있다. 한 실시예에 따르면, 제1서브 힌지 모듈(2851), 제2서브 힌지 모듈(2852), 제3서브 힌지 모듈(2861) 및 제4서브 힌지 모듈(2862)은 탄성 지지체(287)에 결합될 수 있다. 한 실시예에 따르면, 제1서브 힌지 모듈(2851)과 제2서브 힌지 모듈(2852)은, 도전성 시트층(260)의 교차부(267)와 대응하는 영역에서, 자체적인 구조를 통해 제3굴곡 특성이 발현되는 구조를 가질 경우, 일체로 형성될 수도 있다. 한 실시예에 따르면, 제3서브 힌지 모듈(2861)과 제4서브 힌지 모듈(2862)은, 교차부(267)와 대응하는 영역에서, 자체적인 구조를 통해 제3굴곡 특성이 발현되는 구조를 가질 경우, 일체로 형성될 수도 있다.According to various embodiments, the first hinge module 285 has a first folding axis (eg, FIG. It may include a first sub-hinge module 2851 and a second sub-hinge module 2852 divided along the first folding axis (A) of 2a. According to one embodiment, the second hinge module 286 is a third sub-hinge module divided along a second folding axis (eg, the second folding axis (B) of FIG. 2A ) with respect to the elastic support body 287 ). 2861 and a fourth sub-hinge module 2862 may be included. According to one embodiment, the first sub hinge module 2851 , the second sub hinge module 2852 , the third sub hinge module 2861 , and the fourth sub hinge module 2862 are to be coupled to the elastic support 287 . can According to one embodiment, the first sub-hinge module 2851 and the second sub-hinge module 2852 are formed in a region corresponding to the intersection 267 of the conductive sheet layer 260 through their own structure. When it has a structure in which bending characteristics are expressed, it may be integrally formed. According to one embodiment, the third sub hinge module 2861 and the fourth sub hinge module 2862 have a structure in which the third bending characteristic is expressed through their own structure in the region corresponding to the intersection 267 . If it has, it may be integrally formed.
다양한 실시예에 따르면, 복수의 지지 플레이트들(281, 282, 283, 284)은 도전성 시트층(260)의 제1평면부(261)에 대응하는 제1지지 플레이트(281), 제2평면부(262)에 대응하는 제2지지 플레이트(282), 제3평면부(263)에 대응하는 제3지지 플레이트(283) 및 제4평면부(264)에 대응하는 제4지지 플레이트(284)를 포함할 수 있다. 한 실시예에 따르면, 제1지지 플레이트(281)와 제3지지 플레이트(283)는, 제1힌지 모듈(285)(예: 제1서브 힌지 모듈(2851), 및 제2서브 힌지 모듈(2852))을 통해 제2지지 플레이트(282)와 제4지지 플레이트(284)에 연결될 수 있다. 한 실시예에 따르면, 제1지지 플레이트(281)와 제2지지 플레이트(282)는, 제2힌지 모듈(286)(예: 제3서브 힌지 모듈(2861) 및 제4서브 힌지 모듈(2862))을 통해 제3지지 플레이트(283)와 제4지지 플레이트(284)에 연결될 수 있다. 한 실시예에 따르면, 제1지지 플레이트(281)와 제2지지 플레이트(282)는 제1힌지 모듈(285)의 제1서브 힌지 모듈(2851)을 통해 연결될 수 있다. 한 실시예에 따르면, 제3지지 플레이트(283)와 제4지지 플레이트(284)는 제1힌지 모듈(285)의 제2서브 힌지 모듈(2852)을 통해 연결될 수 있다. 한 실시예에 따르면, 제1지지 플레이트(281)와 제3지지 플레이트(283)는 제2힌지 모듈(286)의 제3서브 힌지 모듈(2861)을 통해 연결될 수 있다. 제2지지 플레이트(282)와 제4지지 플레이트(284)는 제2힌지 모듈(286)의 제4서브 힌지 모듈(2862)을 통해 연결될 수 있다. According to various embodiments, the plurality of support plates 281 , 282 , 283 , and 284 may include a first support plate 281 and a second planar portion corresponding to the first flat portion 261 of the conductive sheet layer 260 . The second support plate 282 corresponding to 262, the third support plate 283 corresponding to the third flat portion 263, and the fourth support plate 284 corresponding to the fourth flat portion 264 are formed. may include According to one embodiment, the first support plate 281 and the third support plate 283 include a first hinge module 285 (eg, a first sub hinge module 2851 , and a second sub hinge module 2852 ). )) may be connected to the second support plate 282 and the fourth support plate 284 . According to one embodiment, the first support plate 281 and the second support plate 282 include the second hinge module 286 (eg, the third sub hinge module 2861 and the fourth sub hinge module 2862). ) may be connected to the third support plate 283 and the fourth support plate 284 . According to an embodiment, the first support plate 281 and the second support plate 282 may be connected to each other through the first sub-hinge module 2851 of the first hinge module 285 . According to one embodiment, the third support plate 283 and the fourth support plate 284 may be connected to each other through the second sub-hinge module 2852 of the first hinge module 285 . According to an embodiment, the first support plate 281 and the third support plate 283 may be connected to each other through the third sub-hinge module 2861 of the second hinge module 286 . The second support plate 282 and the fourth support plate 284 may be connected to each other through a fourth sub-hinge module 2862 of the second hinge module 286 .
다양한 실시예에 따르면, 지지 부재 어셈블리(280)의 적어도 일부(예: 제1힌지 모듈(285), 제2힌지 모듈(286), 또는 탄성 지지체(287))는 하우징(210, 220, 230, 240) 사이에 배치될 수 있고, 폴더블 전자 장치(200)의 상태(예: 펼침 상태, 접힘 상태, 또는 중간 상태)에 따라, 하우징(210, 220, 230, 240)의 일부에 의해 가려지거나, 외부로 노출될 수 있다. 예를 들어, 폴더블 전자 장치(200)가 펼침 상태인 경우, 제1힌지 모듈(285), 제2힌지 모듈(286), 및/또는 탄성 지지체(287)의 적어도 일부는, 하우징(210, 220, 230, 240)에 의해 가려져 노출되지 않을 수 있다. 다양한 실시예에 따라, 접힘 상태인 경우, 제1폴딩 방식 또는 제2폴딩 방식에 따라, 제1 힌지 모듈(285), 제2힌지 모듈(286), 및/또는 탄성 지지체(287)의 적어도 일부는, 하우징(210, 220, 230, 240) 사이에서 외부로 노출될 수 있다. 또한, 중간 상태인 경우, 제1힌지 모듈(285), 제2힌지 모듈(286), 및/또는 탄성 지지체(287)의 적어도 일부는, 하우징(210, 220, 230, 240) 사이에서 외부로 부분적으로 노출될 수 있다. 예를 들어, 중간 상태의 노출되는 영역은 접힘 상태보다 적을 수 있다.According to various embodiments, at least a portion of the support member assembly 280 (eg, the first hinge module 285 , the second hinge module 286 , or the elastic support body 287 ) includes the housings 210 , 220 , 230 , 240), depending on the state of the foldable electronic device 200 (eg, an unfolded state, a folded state, or an intermediate state), it may be covered by a portion of the housings 210 , 220 , 230 , 240 or , can be exposed to the outside. For example, when the foldable electronic device 200 is in an unfolded state, at least a portion of the first hinge module 285 , the second hinge module 286 , and/or the elastic support 287 may include the housing 210 , 220, 230, 240) and may not be exposed. According to various embodiments, when in a folded state, at least a portion of the first hinge module 285 , the second hinge module 286 , and/or the elastic support 287 according to the first folding manner or the second folding manner may be exposed to the outside between the housings 210 , 220 , 230 , and 240 . In addition, in the intermediate state, at least a portion of the first hinge module 285 , the second hinge module 286 , and/or the elastic support 287 is externally between the housings 210 , 220 , 230 , 240 . may be partially exposed. For example, the exposed area of the intermediate state may be less than that of the folded state.
다양한 실시예에 따르면, 기판들(291, 292), 배터리들(293, 294), 및 FPCB들(295)은 지지 플레이트들(281, 282, 283, 284)과 후면 커버들(214, 224, 234, 244) 사이에 형성되는 공간에 배치될 수 있다. 예컨대, 기판들(291, 292), 배터리들(293, 294), 및 FPCB들(295a, 295b, 295c)은 제1지지 플레이트(281)와 제1후면 커버(214) 사이, 제2지지 플레이트(282)와 제2후면 커버(224) 사이, 제3지지 플레이트(283)와 제3후면 커버(234) 사이 및/또는 제4지지 플레이트(284)와 제4후면 커버(244) 사이에 배치될 수 있다. 예를 들면, 제2지지 플레이트(282)와 제2후면 커버(224) 사이의 공간, 또는 제2지지 플레이트(282)의 지정된 공간(예: 스웰링 홀)과 대응하는 위치에 제1 배터리(293)이 배치될 수 있고, 제4지지 플레이트(284)와 제4후면 커버(244) 사이의 공간, 또는 제4지지 플레이트(284)의 지정된 공간(예: 스웰링 홀)과 대응하는 위치에 제2 배터리(294)이 배치될 수 있다. 한 실시예에 따르면, 플렉서블 디스플레이(250)의 구동 및 전자 장치의 동작을 위한 기판들(291, 292)은 서로 이웃하거나, 대각선 방향으로 배치될 수 있다. 예컨대, 제1기판(291)(예: 메인 기판) 및/또는 카메라 모듈(204)은, 전자 장치(200)의 조립성 향상 및 슬림화를 위하여, 제1하우징(예: 도 2a의 제1하우징(210))의 내부 공간에 배치될 수 있다. 한 실시예에 따르면, 제2기판(292)(예: 서브 기판)은 제2하우징(예: 도 2a의 제2하우징(220))의 내부 공간, 제3하우징(예: 도 2a의 제3하우징(230))의 내부 공간 또는 제4하우징(예: 도 2a의 제4하우징(240))의 내부 공간에 배치될 수 있다. 한 실시예에 따르면, 4개의 분할된 하우징들(210, 220, 230, 240)의 내부 공간에는 배터리들(293, 294), 기판들(291, 292), 또는 카메라 모듈(204)과 같은 전자 부품들이 나뉘어 배치 될 수 있다. 예컨대, 제1하우징(예: 도 2a의 제1하우징(210))의 내부 공간에 제1기판(291) 및 카메라 모듈(204)이 배치되고, 제3하우징(예: 도 2a의 제3하우징(230))의 내부 공간에 제2기판(292)이 배치됨으로써, 폴딩 영역을 통해 배치되는 가요성 기판들(295a, 295b, 295c)의 개 수를 최소화 하는데 유리할 수 있다.According to various embodiments, the substrates 291 , 292 , the batteries 293 , 294 , and the FPCBs 295 include the support plates 281 , 282 , 283 , 284 and the back covers 214 , 224 , 234, 244) may be disposed in the space formed between. For example, the substrates 291 and 292 , the batteries 293 and 294 , and the FPCBs 295a , 295b and 295c are disposed between the first support plate 281 and the first back cover 214 , and the second support plate disposed between 282 and the second back cover 224 , between the third support plate 283 and the third back cover 234 , and/or between the fourth support plate 284 and the fourth back cover 244 . can be For example, the first battery ( 293) may be disposed, in a position corresponding to a space between the fourth support plate 284 and the fourth back cover 244 or a designated space (eg, a swelling hole) of the fourth support plate 284 . A second battery 294 may be disposed. According to an embodiment, the substrates 291 and 292 for driving the flexible display 250 and operating the electronic device may be adjacent to each other or disposed in a diagonal direction. For example, the first substrate 291 (eg, the main substrate) and/or the camera module 204 may include a first housing (eg, the first housing of FIG. 2A ) in order to improve assembly and slimness of the electronic device 200 . (210)) may be disposed in the inner space. According to an embodiment, the second substrate 292 (eg, a sub substrate) may include an internal space of a second housing (eg, the second housing 220 of FIG. 2A ) and a third housing (eg, the third housing of FIG. 2A ). It may be disposed in the inner space of the housing 230 ) or the inner space of the fourth housing (eg, the fourth housing 240 of FIG. 2A ). According to one embodiment, the internal space of the four divided housings 210 , 220 , 230 , 240 includes batteries 293 , 294 , substrates 291 , 292 , or electronics such as the camera module 204 . The parts can be arranged separately. For example, the first substrate 291 and the camera module 204 are disposed in the inner space of the first housing (eg, the first housing 210 of FIG. 2A ), and the third housing (eg, the third housing of FIG. 2A ) By disposing the second substrate 292 in the inner space of the 230 ), it may be advantageous to minimize the number of the flexible substrates 295a , 295b , and 295c disposed through the folding area.
도 5는 본 개시의 다양한 실시예에 따른 도전성 시트층의 구성을 도시한 도면이다. 도 6a는 본 개시의 다양한 실시예에 따른 도 5의 6a 영역을 확대한 도면이다. 도 6b는 본 개시의 다양한 실시예에 따른 도 5의 6b 영역을 확대한 도면이다. 다양한 실시예에 따른, 폴더블 전자 장치(예: 도 2의 폴더블 전자 장치(200))의 구성 요소들(예: 도전성 시트층(260)) 중 적어도 하나는, 도 2a 내지 도 4의 폴더블 전자 장치(200)의 구성 요소들 중 적어도 하나와 동일 또는 유사하므로, 이하 중복되는 설명은 생략하도록 한다.5 is a diagram illustrating a configuration of a conductive sheet layer according to various embodiments of the present disclosure. 6A is an enlarged view of area 6A of FIG. 5 according to various embodiments of the present disclosure; 6B is an enlarged view of area 6B of FIG. 5 according to various embodiments of the present disclosure; At least one of the components (eg, the conductive sheet layer 260) of the foldable electronic device (eg, the foldable electronic device 200 of FIG. 2 ) according to various embodiments of the present disclosure is the folder of FIGS. 2A to 4 . Since it is the same as or similar to at least one of the components of the electronic device 200 , the overlapping description will be omitted below.
도 5 내지 도 6b를 참고하면, 도전성 시트층(260)은 플렉서블 디스플레이(250)의 제1영역(예: 도 2a의 제1영역(250a))에 대응하는 제1평면부(261), 제2영역(예: 도 2a의 제2영역(250b))에 대응하는 제2평면부(262), 제3영역(예: 도 2a의 제3영역(250c))에 대응하는 제3평면부(263), 제4영역(예: 도 2a의 제1영역(250d))에 대응하는 제4평면부(264), 제1폴딩 영역(예: 도 2a의 제1폴딩 영역(250e))에 대응하는 제1밴딩부(265), 제2폴딩 영역(예: 도 2a의 제2폴딩 영역(250f))에 대응하는 제2밴딩부(266) 및 교차 영역(예: 도 2a의 교차 영역(250g))에 대응하는 교차부(267)를 포함할 수 있다. 예를 들면, 폴더블 전자 장치(200)는, 제1밴딩부(265)의 종방향(예: 제1폴딩축(A)과 실질적으로 동일한 방향)으로 연신(drawing)이 가능한 격자형(lattice) 금속과 제1힌지 모듈(예: 도 4의 제1힌지 모듈(285))의 다관절 형태의 힌지를 통해, 제1폴딩 방식(예: 아웃 폴딩)으로 접힐 수 있다. 예를 들면, 폴더블 전자 장치(200)는, 제2밴딩부(266)의 횡방향(예: 제2폴딩축(B)과 실질적으로 동일한 방향)으로 연신이 가능한 격자형 금속과 제2힌지 모듈(예: 도 4의 제2힌지 모듈(286))의 2축 힌지를 통해, 제2폴딩 방식(예: 인 폴딩)으로 접힐 수 있다.5 to 6B , the conductive sheet layer 260 includes a first flat portion 261 corresponding to a first area (eg, a first area 250a of FIG. 2A ) of the flexible display 250 , The second planar part 262 corresponding to the second region (eg, the second region 250b of FIG. 2A ), and the third plane part corresponding to the third region (eg, the third region 250c of FIG. 2A )) 263), the fourth planar portion 264 corresponding to the fourth region (eg, the first region 250d of FIG. 2A ), and the first folding region (eg, the first folding region 250e of FIG. 2A )) The first bending portion 265, the second bending portion 266 corresponding to the second folding area (eg, the second folding area 250f of FIG. 2A ), and the crossing area (eg, the intersection area 250g of FIG. 2A ) )) corresponding to an intersection 267 . For example, the foldable electronic device 200 may have a lattice shape capable of drawing in the longitudinal direction of the first bending part 265 (eg, in substantially the same direction as the first folding axis A). ) through the hinge of the multi-joint shape of the metal and the first hinge module (eg, the first hinge module 285 of FIG. 4 ), it can be folded in the first folding method (eg, out-folding). For example, the foldable electronic device 200 includes a lattice-type metal and a second hinge that can be stretched in the transverse direction of the second bending part 266 (eg, in substantially the same direction as the second folding axis B). The module (eg, the second hinge module 286 of FIG. 4 ) may be folded in the second folding method (eg, in-folding) through the biaxial hinge.
다양한 실시예에 따르면, 제1밴딩부(265)는 플렉서블 디스플레이(250)가 제1폴딩축(A)을 기준으로 굴곡되도록 지지하기 위한 제1굴곡 특성을 제공하는 제1패턴(2651)을 포함할 수 있다. 한 실시예에 따르면, 제1패턴(2651)은 복수의 제1오프닝들(2651a)을 포함할 수 있다. 한 실시예에 따르면, 복수의 제1오프닝들(2651a) 각각은 제1폴딩축(A)과 실질적으로 평행한 방향(Y 축 방향)을 따라 제1길이(H1)를 갖고, 제1길이(H1)보다 작은 제1폭(W1)을 가지며, 서로에 대하여 제1간격(T1)을 갖는 슬릿으로 형성될 수 있다. 한 실시예에 따르면, 제1굴곡 특성은 복수의 제1오프닝들(2651a)의 형상 및/또는 배치 구조를 통해 결정될 수 있다. 한 실시예에 따르면, 제2밴딩부(266)는 플렉서블 디스플레이(250)가 제2폴딩축(B)을 기준으로 굴곡되도록 지지하기 위한 제2굴곡 특성을 제공하는 제2패턴(2661)을 포함할 수 있다. 한 실시예에 따르면, 제2패턴(2661)은 복수의 제2오프닝들(2661a)을 포함할 수 있다. 한 실시예에 따르면, 복수의 제2오프닝들(2661a) 각각은 제2폴딩축(B)과 실질적으로 평행한 방향(X 축 방향)을 따라 제2길이(H2)를 갖고, 제2길이(H2)보다 작은 제2폭(W2)을 가지며, 서로에 대하여 제2간격(T2)을 갖는 슬릿으로 형성될 수 있다. 한 실시예에 따르면, 제2굴곡 특성은 복수의 제2오프닝들(2661a)의 형상 및/또는 배치 구조를 통해 결정될 수 있다. According to various embodiments, the first bending part 265 includes a first pattern 2651 providing a first bending characteristic for supporting the flexible display 250 to be bent with respect to the first folding axis A. can do. According to an embodiment, the first pattern 2651 may include a plurality of first openings 2651a. According to one embodiment, each of the plurality of first openings 2651a has a first length H1 in a direction substantially parallel to the first folding axis A (Y-axis direction), and the first length ( It may be formed as a slit having a first width W1 smaller than H1) and having a first interval T1 with respect to each other. According to an embodiment, the first bending characteristic may be determined through the shape and/or arrangement structure of the plurality of first openings 2651a. According to an embodiment, the second bending part 266 includes a second pattern 2661 providing a second bending characteristic for supporting the flexible display 250 to be bent based on the second folding axis B. can do. According to an embodiment, the second pattern 2661 may include a plurality of second openings 2661a. According to one embodiment, each of the plurality of second openings 2661a has a second length H2 in a direction substantially parallel to the second folding axis B (X-axis direction), and the second length ( It may be formed as a slit having a second width W2 smaller than H2) and having a second interval T2 with respect to each other. According to an embodiment, the second bending characteristic may be determined through a shape and/or an arrangement structure of the plurality of second openings 2661a.
다양한 실시예에 따르면, 폴더블 전자 장치(200)의 하우징들(예: 도 2a의 제1하우징(210), 제2하우징(220), 제3하우징(230), 및 제4하우징(240))은 제1폴딩축(A)을 기준으로 제1폴딩 방식(예: 아웃 폴딩 방식)으로 동작될 수 있으며, 제2폴딩축(B)을 기준으로 제2폴딩 방식(예: 인 폴딩 방식)으로 동작될 수 있다. 한 실시예에 따르면, 제1폴딩 방식과 제2폴딩 방식이 동일하지 않을 경우, 제1굴곡 특성과 제2굴곡 특성을 서로 다르게 결정될 수 있다. 한 실시예에 따르면, 제1폴딩 방식과 제2폴딩 방식이 동일할 경우, 제1굴곡 특성과 제2굴곡 특성은 실질적으로 동일하도록 결정될 수 있다. 예를 들어, 제1굴곡 특성과 제2굴곡 특성의 차이가 5% 이내인 경우 실질적으로 동일하다고 할수 있다. 굴곡 특성은 측정하고자하는 시편(예: 도 6d의 시편(800))의 적어도 한쪽을 고정시키고 시편을 놓은 수직방향으로 하중을 가해서 왜곡을 구하는 방법으로 측정될 수 있다.According to various embodiments, housings of the foldable electronic device 200 (eg, the first housing 210 , the second housing 220 , the third housing 230 , and the fourth housing 240 of FIG. 2A ) ) may be operated in a first folding method (eg, out-folding method) based on the first folding axis (A), and in a second folding method (eg, in-folding method) based on the second folding axis (B). can be operated with According to an embodiment, when the first folding method and the second folding method are not the same, the first bending characteristic and the second bending characteristic may be determined differently. According to an embodiment, when the first folding method and the second folding method are the same, the first bending characteristic and the second bending characteristic may be determined to be substantially the same. For example, when the difference between the first bending characteristic and the second bending characteristic is within 5%, it may be said that the difference is substantially the same. The flexural property may be measured by fixing at least one side of the specimen to be measured (eg, the specimen 800 of FIG. 6D ) and obtaining the distortion by applying a load in the vertical direction on which the specimen is placed.
도 6c는 본 개시의 다양한 실시예에 따른 도 5의 6c 영역을 확대한 도면이다.FIG. 6C is an enlarged view of area 6c of FIG. 5 according to various embodiments of the present disclosure;
도 5 및 도 6c를 참고하면, 도전성 시트층(260)의 교차부(267)는 제1밴딩부(265)의 제1굴곡 특성 및/또는 제2밴딩부(266)의 제2굴곡 특성을 포함하도록(만족하도록) 제공되는 제3패턴(2671)을 포함할 수 있다. 한 실시예에 따르면, 제3패턴(2671)은 x 축 방향을 따라 지정된 제3간격(T3)을 가지고, y 축 방향을 따라 지정된 제4간격(T4)으로 배치되는 복수의 제3오프닝들(2671a)을 포함할 수 있다. 한 실시예에 따르면, 복수의 제3오프닝들(2671a) 각각은 제1폴딩축(A) 및 제2폴딩축(B)에 대하여 굴곡되어야 하므로, 중심(C)을 기준으로 상하좌우 대칭으로 형성되는 형상을 가질 수 있다. 예컨대, 복수의 제3오프닝들(2671a) 각각은 중심(C)을 지나는 x 축(예: 제1축)과, 중심(C)을 지나고 x 축과 실질적으로 수직으로 교차하는 y 축(예: 제2축)을 기준으로 서로에 대하여 대칭으로 형성되는 형상을 가질 수 있다. 한 실시예에 따르면, 복수의 제3오프닝들(2671a) 각각은 서로에 대하여 지정된 이격 거리(예: 제3간격(T3) 및 제4간격(T4))를 갖도록 배치될 수 있다. 예컨대, 복수의 제3오프닝들(2671a)은 제3간격(T3)과 제4간격(T4)이 실질적으로 동일하도록 배치될 수 있다. 한 실시예에 따르면, 제3굴곡 특성은 복수의 제3오프닝들(2671a)의 형상 및/또는 배치 구조(단위 오프닝들간의 이격 거리(T3, T4))를 통해 결정될 수 있다. 한 실시예에 따르면, 제3패턴(2671)은 복수의 제3오프닝들(2671a) 사이의 공간(2601)에 배치되고, 지정된 제5이격 거리(T5)를 갖도록 배치되는 복수의 제4오프닝들(2671b)을 포함할 수도 있다. 한 실시예에 따르면, 복수의 제4오프닝들(2671b)은, 복수의 제4오프닝들(2671b) 각각의 중심(C)을 기준으로 상하좌우 대칭으로 형성될 수 있고, x 축 및/또는 y 축 방향으로 따라 동일한 제5이격 거리(T5)를 갖도록 배치될 수 있다. 한 실시예에 따르면, 교차부의 제3굴곡 특성은 복수의 제4오프닝들(2671b)의 형상 및/또는 배치 구조(단위 오프닝들간의 이격 거리(T5))를 통해 결정될 수도 있다. 한 실시예에 따르면, 복수의 제3오프닝들(2671a) 각각의 직경은 6mm 이내일 수 있다. 한 실시예에 따르면, 복수의 제4오프닝들(2671b)의 직경은 4mm 이내일 수 있다. 어떤 실시예에서, 복수의 제3오프닝들(2671a) 또는 복수의 제4오프닝들(2671b)은 생략될 수 있다. 예를 들어, 제3패턴(2671)은 x축 방향으로 지정된 제3간격(T3)으로 배치되고, y 축 방향으로 지정된 제4간격(T4)으로 배치되는 복수의 제3오프닝들(2671a)을 포함하고, 복수의 제4오프닝들(2671b)은 포함하지 않을수 있다.Referring to FIGS. 5 and 6C , the intersection 267 of the conductive sheet layer 260 has a first bending characteristic of the first bending part 265 and/or a second bending characteristic of the second bending part 266 . A third pattern 2671 provided to include (satisfy) may be included. According to one embodiment, the third pattern 2671 has a third interval T3 specified along the x-axis direction, and a plurality of third openings (T4) arranged at a fourth interval T4 along the y-axis direction. 2671a). According to one embodiment, since each of the plurality of third openings 2671a must be bent with respect to the first folding axis A and the second folding axis B, they are formed symmetrically with respect to the center C. It may have a shape that becomes For example, each of the plurality of third openings 2671a has an x-axis (eg, a first axis) passing through the center C, and a y-axis (eg, a first axis) passing through the center C and substantially perpendicular to the x-axis (eg: The second axis) may have a shape formed symmetrically with respect to each other. According to an embodiment, each of the plurality of third openings 2671a may be disposed to have a specified separation distance from each other (eg, a third interval T3 and a fourth interval T4). For example, the plurality of third openings 2671a may be arranged such that the third interval T3 and the fourth interval T4 are substantially the same. According to an embodiment, the third bending characteristic may be determined through the shape and/or arrangement structure of the plurality of third openings 2671a (spaced distances T3 and T4 between unit openings). According to one embodiment, the third pattern 2671 is disposed in the space 2601 between the plurality of third openings 2671a, and a plurality of fourth openings disposed to have a designated fifth separation distance T5. (2671b). According to an embodiment, the plurality of fourth openings 2671b may be symmetrically formed with respect to the center C of each of the plurality of fourth openings 2671b, and may be formed symmetrically on the x-axis and/or y It may be arranged to have the same fifth separation distance T5 along the axial direction. According to an embodiment, the third bending characteristic of the intersection portion may be determined through the shape and/or arrangement structure of the plurality of fourth openings 2671b (a distance T5 between unit openings). According to an embodiment, a diameter of each of the plurality of third openings 2671a may be within 6 mm. According to one embodiment, a diameter of the plurality of fourth openings 2671b may be within 4 mm. In some embodiments, the plurality of third openings 2671a or the plurality of fourth openings 2671b may be omitted. For example, the third pattern 2671 includes a plurality of third openings 2671a disposed at a third interval T3 specified in the x-axis direction and at a fourth interval T4 specified in the y-axis direction. may be included, and the plurality of fourth openings 2671b may not be included.
다양한 실시예에 따르면, 제1밴딩부(265)는, 제1패턴(2651)을 통해, 제1폴딩축(A)을 기준으로 벤딩될 수 있는 제1굴곡 특성을 가질 수 있다. 한 실시예에 따르면, 제1굴곡 특성은 제1밴딩부(265)에 형성된 제1패턴(2651)의 단위 면적당 제1개구율을 통해 결정될 수 있다. 한 실시예에 따르면, 제1밴딩부(265)는 제1개구율의 조절을 통해 굴곡 특성과 강성이 만족되도록 형성될 수 있다. According to various embodiments, the first bending part 265 may have a first bending characteristic that may be bent based on the first folding axis A through the first pattern 2651 . According to an embodiment, the first bending characteristic may be determined through a first aperture ratio per unit area of the first pattern 2651 formed on the first bending part 265 . According to an embodiment, the first bending part 265 may be formed to satisfy bending characteristics and rigidity by adjusting the first aperture ratio.
다양한 실시예에 따르면, 제2밴딩부(266)는, 제2패턴(2661)을 통해, 제2폴딩축(A)을 기준으로 벤딩될 수 있는 제2굴곡 특성을 가질 수 있다. 한 실시예에 따르면, 제2굴곡 특성은 제2밴딩부(266)에 형성된 제2패턴(2661)의 단위 면적당 제2개구율을 통해 결정될 수 있다. 한 실시예에 따르면, 제2밴딩부(266)는 제2개구율의 조절을 통해 굴곡 특성과 강성이 만족되도록 형성될 수 있다. 한 실시예에 따르면, 제1굴곡 특성 및 제2굴곡 특성을 모두 만족하는 제3굴곡 특성을 가진다는 것은, 제1굴곡 특성 및 제2굴곡 특성보다 제3굴곡 특성이 크다는 것을 의미할 수 있다. 예를 들어, 제1굴곡 특성을 가진 제1밴딩부(265) 및 제2굴곡 특성을 가진 제2밴딩부(266) 보다 제3굴곡 특성을 가진 교차부(267)가 더 잘 휘어질수 있다.According to various embodiments, the second bending part 266 may have a second bending characteristic that can be bent based on the second folding axis A through the second pattern 2661 . According to an embodiment, the second bending characteristic may be determined through the second aperture ratio per unit area of the second pattern 2661 formed on the second bending part 266 . According to an exemplary embodiment, the second bending part 266 may be formed to satisfy the bending characteristics and rigidity by adjusting the second aperture ratio. According to an embodiment, having the third flexural characteristic satisfying both the first flexural characteristic and the second flexural characteristic may mean that the third flexural characteristic is greater than the first flexural characteristic and the second flexural characteristic. For example, the crossing portion 267 having the third bending characteristic may be more bent than the first bending portion 265 having the first bending characteristic and the second bending portion 266 having the second bending characteristic.
다양한 실시예에 따르면, 교차부(267)는, 제3패턴(2671)을 통해, 제1폴딩축(A)을 기준으로 벤딩되는 제1굴곡 특성 및 제2폴딩축(B)을 기준으로 벤딩되는 제2굴곡 특성을 만족하는 제3굴곡 특성을 가질 수 있다. 한 실시예에 따르면, 제3굴곡 특성은 교차부(267)에 형성된 제3패턴(2671)의 단위 면적당 제3개구율을 통해 결정될 수 있다. 한 실시예에 따르면, 제3패턴(2671)의 제3굴곡 특성은 제1패턴(2651)의 제1굴곡 특성 및 제2패턴(2652)의 제2굴곡 특성을 만족시켜야하므로, 교차부(267)의 제3개구율은 제1밴딩부(265)의 제1개구율 및 제2밴딩부(266)의 제2개구율과 적어도 동일하거나, 더 크게 결정될 수 있다. According to various embodiments, the crossing portion 267 is bent based on the first bending characteristic and the second folding axis B, which are bent based on the first folding axis A, through the third pattern 2671 . It may have a third bending characteristic that satisfies the second bending characteristic. According to an embodiment, the third bending characteristic may be determined through the third aperture ratio per unit area of the third pattern 2671 formed at the intersection 267 . According to one embodiment, since the third bending characteristic of the third pattern 2671 must satisfy the first bending characteristic of the first pattern 2651 and the second bending characteristic of the second pattern 2652 , the intersection portion 267 ) of the third aperture ratio may be determined to be at least equal to or greater than the first aperture ratio of the first bending part 265 and the second aperture ratio of the second bending part 266 .
다양한 실시예에 따르면, 서로 다른 폴딩 방식이 교차하는 교차부(267)는 제1폴딩 방식(예: 아웃 폴딩 방식)으로 폴딩 시, 제1밴딩부(265)와 동일하거나 유사한 굽힘 응력(bending stiffness) 를 가져야 하고, 제2폴딩 방식(예: 인 폴딩 방식)으로 폴딩 시, 제2밴딩부(266)와 동일하거나 유사한 굽힘 응력을 가져야 교차부(267)에 응력이 집중되는 현상을 감소시킬 수 있다. 예컨대, 교차부(267)는 상하좌우 간격이 동일하게 배치되는 복수의 제3오프닝들(2671a) 및/또는 복수의 제4오프닝들(2671b)을 통해 응력 집중에 의한 끊어짐 현상이 감소될 수 있다.다양한 실시예에 따르면, 복수의 제3오프닝들(2671a) 각각의 중심은 복수의 제1오프닝들(2651a) 중 적어도 일부의 중심 및 복수의 제2오프닝들(2661a) 중 적어도 일부의 중심과 실질적으로 동일한 라인상에 배치될 수 있다. 한 실시예에 따르면, 복수의 제4오프닝들(2671b) 각각의 중심 역시 복수의 제1오프닝들(2651a) 중 적어도 일부의 중심 및 복수의 제2오프닝들(2661a) 중 적어도 일부의 중심과 실질적으로 동일한 라인상에 배치될 수 있다.According to various embodiments, the crossing portion 267 in which different folding methods intersect has the same or similar bending stiffness to the first bending portion 265 when folded in the first folding method (eg, out-folding method). ), and when folding in the second folding method (eg, in-folding method), it must have the same or similar bending stress as the second bending portion 266 to reduce the phenomenon of stress concentration in the intersection portion 267 have. For example, in the intersection portion 267, a breaking phenomenon due to stress concentration may be reduced through a plurality of third openings 2671a and/or a plurality of fourth openings 2671b disposed at the same vertical, horizontal, and horizontal intervals. According to various embodiments, the center of each of the plurality of third openings 2671a is at least a portion of the center of at least some of the plurality of first openings 2651a and the center of at least some of the plurality of second openings 2661a and the center of each of the plurality of third openings 2671a They may be arranged on substantially the same line. According to an embodiment, the center of each of the plurality of fourth openings 2671b is also substantially the same as the center of at least some of the plurality of first openings 2651a and the center of at least some of the plurality of second openings 2661a can be placed on the same line.
다양한 실시예에 따르면, 복수의 제3오프닝들(2671a) 각각의 제3폭(W3)(예: 가로 길이)은 제1밴딩부(255)의 제1패턴(2651)의 형상을 고려하여 2*W1+T1와 같을 수 있다. 한 실시예에 따르면, 복수의 제3오프닝들(2671a) 각각의 제4폭(W4)(예: 세로 길이)은 제2밴딩부(256)의 제2패턴(2661)의 형상을 고려하여 2*W2+T2와 같을 수 있다. 한 실시예에 따르면, 복수의 제4오프닝들(2671b)은 실질적으로 동일 간격을 유지하며 복수의 제3오프닝들(2671a) 사이에 배치될 수 있다. 한 실시예에 따르면, 복수의 제3오프닝들(2671a) 각각의 제3간격(T3)은 복수의 제1오프닝들(2651a)의 제1폭(W1)과 같고 제4간격(T4)은 복수의 제2오프닝들(2661a) 각각의 제2폭(W2)과 같을 수 있다. 한 실시예에 따르면, 복수의 제3오프닝들(2671a) 및/또는 복수의 제4오프닝들(2671b)의 간격은 동일하게 유지하면서, 약 50% ~ 300%의 범위를 가지고 조절될 수 있다.According to various embodiments, the third width W3 (eg, horizontal length) of each of the plurality of third openings 2671a is 2 in consideration of the shape of the first pattern 2651 of the first bending part 255 . May be equal to *W1+T1. According to an embodiment, the fourth width W4 (eg, vertical length) of each of the plurality of third openings 2671a is 2 in consideration of the shape of the second pattern 2661 of the second bending part 256 . May be equal to *W2+T2. According to an embodiment, the plurality of fourth openings 2671b may be disposed between the plurality of third openings 2671a while maintaining substantially the same distance. According to one embodiment, the third interval T3 of each of the plurality of third openings 2671a is equal to the first width W1 of the plurality of first openings 2651a, and the fourth interval T4 is a plurality of It may be equal to the second width W2 of each of the second openings 2661a. According to an embodiment, an interval between the plurality of third openings 2671a and/or the plurality of fourth openings 2671b may be adjusted in a range of about 50% to 300% while maintaining the same distance.
도 6d는 본 개시의 다양한 실시예에 따른 시편에 가해지는 하중에 의한 굽힘 강성 관계를 도시한 도면이다.6D is a diagram illustrating a relationship between bending stiffness due to a load applied to a specimen according to various embodiments of the present disclosure;
도 6d를 참고하면, 도전성 시트층(260)의 굴곡 특성은 측정하고자하는 시편(800)(예: 외팔보(cantilever))의 일단을 고정시키고, 타단에서 수직 방향으로 하중을 가했을 때, 산출되는 굽힘 강성(bending stiffness)에 관련된 하기 <수학식 1>을 통해 측정될 수 있다.Referring to FIG. 6D , the bending characteristics of the conductive sheet layer 260 are calculated when one end of a specimen 800 (eg, a cantilever) to be measured is fixed and a load is applied from the other end in a vertical direction. It can be measured through the following <Equation 1> related to bending stiffness.
Figure PCTKR2021008982-appb-M000001
Figure PCTKR2021008982-appb-M000001
여기서, P는 시편(800)에 가해지는 하중이고, L은 시편(800)의 길이이며, t는 시편(800)의 두께를 포함할 수 있다. 상기 <수학식 1>을 통해, 굽힘 강성은 시편의 길이(L)에 비례하고, 시편의 두께(t)에 반비례함을 알 수 있다. 예를 들어, 제1밴딩부(265)에서, 복수의 제1오프닝들(2651a)의 제1폭(W1)이 작아지고, 제1간격(T1)이 커지면, 벤딩시, 응력 및 반발력은 증가하나 두께 방향의 강성을 높일 수 있다. 반대로, 제1밴딩부(265)에서, 복수의 제1오프닝들(2651a) 제1폭(W1)이 커지고, 제1간격(T1)이 작아지면, 벤딩시, 응력 및 반발력은 감소하나 두께 방향의 강성은 낮아질 수 있다. Here, P is a load applied to the specimen 800 , L is the length of the specimen 800 , and t may include the thickness of the specimen 800 . Through Equation 1, it can be seen that the bending stiffness is proportional to the length (L) of the specimen and inversely proportional to the thickness (t) of the specimen. For example, in the first bending part 265 , when the first width W1 of the plurality of first openings 2651a decreases and the first interval T1 increases, the stress and repulsive force increase during bending. However, the rigidity in the thickness direction can be increased. Conversely, in the first bending part 265 , when the first width W1 of the plurality of first openings 2651a increases and the first interval T1 decreases, the stress and repulsive force during bending are reduced, but in the thickness direction stiffness may be lowered.
도 7a는 본 개시의 다양한 실시예에 따른 도 2a의 라인 7a-7a를 따라 바라본 폴더블 전자 장치(200)의 일부 단면도이다.7A is a partial cross-sectional view of the foldable electronic device 200 taken along line 7A-7A of FIG. 2A according to various embodiments of the present disclosure.
도 7a를 참고하면, 폴더블 전자 장치(200)는 플렉서블 디스플레이(250), 플렉서블 디스플레이(250) 아래에 배치되는 도전성 시트층(260), 보강 플레이트들(271, 272) 및 지지 플레이트들(281, 282)을 포함할 수 있다. 플렉서블 디스플레이(250)는 윈도우층(251), 윈도우층(251) 아래에 순차적으로 배치되는 편광층(252), 디스플레이 패널(253), 및 폴리머층(254)을 포함할 수 있다. 한 실시예에 따르면, 폴리머층(254)은 쿠션층(2541), 쿠션층(2541)을 사이에 두고 적층되는 제1층(2542), 및 제2층(2543)을 포함할 수 있다. 한 실시예에 따르면, 폴리머층(254)은 도전성 시트층(260)의 제1패턴(2651)으로 형성된 복수의 제1오프닝들(2651a)을 통한 이물질 유입을 차단할 수 있고, 제1밴딩부(265)에서, 플렉서블 디스플레이(250)의 접히고 펼쳐지는 동작에 따른 플렉서블 디스플레이(250)의 접힘 경계 영역에 대한 시인을 방지하기 위한 적층 구조를 가질 수 있다. 한 실시예에 따르면, 쿠션층(2541)은 완충을 위한 재질(예: 스폰지 또는 포론)로 형성될 수 있다. 한 실시예에 따르면, 쿠션층(2541)의 상부에 배치되는 제1층(2542), 및 쿠션층(2541)의 하부에 배치되는 제2층(2543)은 면품위 개선(시인성 개선)을 위한 재질(예: TPU(thermoplastic polyurethane))로 형성될 수 있다. Referring to FIG. 7A , the foldable electronic device 200 includes a flexible display 250 , a conductive sheet layer 260 disposed under the flexible display 250 , reinforcing plates 271 and 272 , and support plates 281 . , 282). The flexible display 250 may include a window layer 251 , a polarization layer 252 sequentially disposed under the window layer 251 , a display panel 253 , and a polymer layer 254 . According to an embodiment, the polymer layer 254 may include a cushion layer 2541 , a first layer 2542 stacked with the cushion layer 2541 interposed therebetween, and a second layer 2543 . According to one embodiment, the polymer layer 254 may block the inflow of foreign substances through the plurality of first openings 2651a formed of the first pattern 2651 of the conductive sheet layer 260, and the first bending part ( 265 , a stacked structure for preventing visibility of the folding boundary area of the flexible display 250 according to the folding and unfolding operation of the flexible display 250 may be provided. According to one embodiment, the cushion layer 2541 may be formed of a material (eg, sponge or poron) for cushioning. According to one embodiment, the first layer 2542 disposed on the cushion layer 2541, and the second layer 2543 disposed under the cushion layer 2541 are for surface quality improvement (visibility improvement). It may be formed of a material (eg, TPU (thermoplastic polyurethane)).
다양한 실시예에 따르면, 도전성 시트층(260)은 제1평면부(261), 제2평면부 (262), 및 제1평면부(261)로부터 제2평면부(262)까지 연장되는 제1밴딩부(265)를 포함할 수 있다. 한 실시예에 따르면, 도전성 시트층(260)은 제1밴딩부(265)에 배치되는 복수의 제1오프닝들(2651a)을 포함하는 제1패턴(2651)을 포함할 수 있다. 한 실시예에 따르면, 폴더블 전자 장치(200)는 제1평면부(261) 아래에 배치되는 제1보강 플레이트(271), 및 그 아래에 배치되는 제1지지 플레이트(281)를 포함할 수 있다. 한 실시예에 따르면, 폴더블 전자 장치(200)는 제2평면부(262) 아래에 배치되는 제2보강 플레이트(272), 및 그 아래에 배치되는 제2지지 플레이트(282)를 포함할 수 있다. 한 실시예에 따르면, 제1지지 플레이트(281)와 제2지지 플레이트(282)는 제1힌지 모듈(285)을 통해 회동 가능하게 연결될 수 있다. 예를 들어, 제1힌지 모듈(285)은 복수의 링크 부재(285a) 및 상기 링크 부재(285a)의 양측에 각각 결합 부재(미도시)를 포함하고, 제1지지 플레이트(281)는 일측의 결합 부재(미도시)에 연결되고, 및 제2지지 플레이트(282)는 타측의 결합 부재(미도시)에 연결될 수 있다. 한 실시예에 따르면, 제1힌지 모듈(285)을 통해 제1지지 플레이트(281)와 제2지지 플레이트(282)가 제1폴딩 방식(예: 아웃 폴딩 방식)으로 접힐 경우, 제1밴딩부(265)는 제1패턴(2651)과 관련된 제1굴곡 특성이 적용되도록, 플렉서블 디스플레이(250) 아래에서 제1폴딩 영역(예: 도 2a의 제1폴딩 영역(250e))을 지지할 수 있다.According to various embodiments, the conductive sheet layer 260 includes a first flat portion 261 , a second flat portion 262 , and a first extending from the first flat portion 261 to the second flat portion 262 . A bending part 265 may be included. According to an embodiment, the conductive sheet layer 260 may include a first pattern 2651 including a plurality of first openings 2651a disposed on the first bending part 265 . According to an embodiment, the foldable electronic device 200 may include a first reinforcing plate 271 disposed under the first flat portion 261 , and a first support plate 281 disposed below the first flat portion 261 . have. According to an embodiment, the foldable electronic device 200 may include a second reinforcing plate 272 disposed under the second planar portion 262 , and a second support plate 282 disposed below the second flat portion 262 . have. According to one embodiment, the first support plate 281 and the second support plate 282 may be rotatably connected through the first hinge module 285 . For example, the first hinge module 285 includes a plurality of link members 285a and coupling members (not shown) on both sides of the link members 285a, respectively, and the first support plate 281 is formed on one side of the first hinge module 285 . It may be connected to a coupling member (not shown), and the second support plate 282 may be coupled to a coupling member (not shown) on the other side. According to an embodiment, when the first support plate 281 and the second support plate 282 are folded in the first folding method (eg, out-folding method) through the first hinge module 285 , the first bending part 265 may support the first folding area (eg, the first folding area 250e of FIG. 2A ) under the flexible display 250 so that the first bending characteristic related to the first pattern 2651 is applied. .
도 7b는 본 개시의 다양한 실시예에 따른 도 2a의 라인 7b-7b를 따라 바라본 폴더블 전자 장치의 일부 단면도이다.7B is a partial cross-sectional view of a foldable electronic device taken along line 7b-7b of FIG. 2A according to various embodiments of the present disclosure;
도 7b의 전자 장치(200)를 설명함에 있어서, 도 7a의 전자 장치와 실질적으로 동일한 구성 요소들에 대해서는 동일한 부호를 부여하였으며, 그 상세한 설명은 생략될 수 있다.In the description of the electronic device 200 of FIG. 7B , the same reference numerals are given to components substantially the same as those of the electronic device of FIG. 7A , and a detailed description thereof may be omitted.
도 7b를 참고하면, 도전성 시트층(260)은 제1평면부(261), 제3평면부(263), 및 제1평면부(261)로부터 제3평면부(263)까지 연장되는 제2밴딩부(266)를 포함할 수 있다. 한 실시예에 따르면, 도전성 시트층(260)은 제2밴딩부(266)에 배치되는 복수의 제2오프닝들(2661a)을 포함하는 제2패턴(2661)을 포함할 수 있다. 한 실시예에 따르면, 폴더블 전자 장치(200)는 제1평면부(261) 아래에 배치되는 제1보강 플레이트(271), 및 그 아래에 배치되는 제1지지 플레이트(281)를 포함할 수 있다. 한 실시예에 따르면, 폴더블 전자 장치(200)는 제3평면부(263) 아래에 배치되는 제3보강 플레이트(273), 및 그 아래에 배치되는 제3지지 플레이트(283)를 포함할 수 있다. 한 실시예에 따르면, 제1지지 플레이트(281)와 제3지지 플레이트(283)는 제2힌지 모듈(286)을 통해 회동 가능하게 연결될 수 있다. 예를 들어, 제2힌지 모듈(286)은 복수의 기어(미도시) 및 상기 복수의 기어(미도시)를 지지하는 복수의 회동부(미도시) 포함하고, 제1지지 플레이트(281)는 하나의 회동부(미도시)에 연결되고, 및 제3지지 플레이트(283)는 다른(another) 회동부(미도시)에 연결될 수 있다. 한 실시예에 따르면, 제2힌지 모듈(286)을 통해 제1지지 플레이트(281)와 제3지지 플레이트(283)가 제2폴딩 방식(예: 인 폴딩 방식)으로 접힐 경우, 제2밴딩부(266)는 제2패턴(2661)과 관련된 제2굴곡 특성이 적용되도록 플렉서블 디스플레이(250) 아래에서 제2폴딩 영역(예: 도 2a의 제2폴딩 영역(250f))을 지지할 수 있다.Referring to FIG. 7B , the conductive sheet layer 260 includes a first flat portion 261 , a third flat portion 263 , and a second portion extending from the first flat portion 261 to the third flat portion 263 . A bending part 266 may be included. According to an embodiment, the conductive sheet layer 260 may include a second pattern 2661 including a plurality of second openings 2661a disposed on the second bending part 266 . According to an embodiment, the foldable electronic device 200 may include a first reinforcing plate 271 disposed under the first flat portion 261 , and a first support plate 281 disposed below the first flat portion 261 . have. According to an embodiment, the foldable electronic device 200 may include a third reinforcing plate 273 disposed under the third planar portion 263 , and a third support plate 283 disposed below the third flat portion 263 . have. According to an embodiment, the first support plate 281 and the third support plate 283 may be rotatably connected through the second hinge module 286 . For example, the second hinge module 286 includes a plurality of gears (not shown) and a plurality of rotation parts (not shown) supporting the plurality of gears (not shown), and the first support plate 281 is It may be connected to one rotating part (not shown), and the third support plate 283 may be connected to another rotating part (not shown). According to one embodiment, when the first support plate 281 and the third support plate 283 are folded in the second folding method (eg, in-folding method) through the second hinge module 286, the second bending part Reference numeral 266 may support a second folding area (eg, the second folding area 250f of FIG. 2A ) under the flexible display 250 to apply a second bending characteristic related to the second pattern 2661 .
도 7c는 본 개시의 다양한 실시예에 따른 도 2a의 7c 영역에 배치된 탄성 지지체(287)를 통해 제1힌지 모듈(285)과 제2힌지 모듈(286)이 연결된 상태를 도시한 일부 단면도이다.7C is a partial cross-sectional view illustrating a state in which the first hinge module 285 and the second hinge module 286 are connected through the elastic support 287 disposed in the region 7c of FIG. 2A according to various embodiments of the present disclosure. .
도 7c를 참고하면, 제1힌지 모듈(285)은 도전성 시트층(예: 도 5의 도전성 시트층(260))의 교차부(예: 도 5의 교차부(267))와 대응하는 영역에 배치되는 탄성 지지체(287)를 기준으로 제1폴딩축(예: 도 2a의 제1폴딩축(A))을 따라 분할되는 제1서브 힌지 모듈(2851) 및 제2서브 힌지 모듈(2852)을 포함할 수 있다. 한 실시예에 따르면, 제2힌지 모듈(286)은 탄성 지지체(287)를 기준으로, 제2폴딩축(예: 도 2a의 제2폴딩축(B))을 따라 분할되는 제3서브 힌지 모듈(2861) 및 제4서브 힌지 모듈(2862)을 포함할 수 있다. 한 실시예에 따르면, 탄성 지지체(287)는 우레탄, 실리콘, 또는 러버와 같은 고연신 탄성중합체(elastomer)를 포함할 수 있다. 한 실시예에 따르면, 제1서브 힌지 모듈(2851), 제2서브 힌지 모듈(2852), 제3서브 힌지 모듈(2861), 및 제4서브 힌지 모듈(2862)은 금속 소재로 형성될 수 있으며, 인서트 사출을 통해 탄성 지지체(287)에 고정될 수 있다. 어떤 실시예에서, 제1서브 힌지 모듈(2851), 제2서브 힌지 모듈(2852), 제3서브 힌지 모듈(2861), 및 제4서브 힌지 모듈(2862)은 구조적 결합(예: 끼워맞추는 결합 구조)을 통해 탄성 지지체(287)에 고정될 수도 있다. 예를 들면, 탄성 지지체(287)는, 폴더블 전자 장치(200)의 상태(예: 펼침 상태, 접힘 상태, 또는 중간 상태)에 따라 내부 전자 부품을 보호 및/또는 지지할 수 있도록 배치될 수 있다. 예를 들면, 탄성 지지체(287)은, 후면 커버(예: 도 4의 후면 커버(과 후면 커버들(214, 224, 234, 244)와 동일 또는 유사한 기능을 수행할 수 있으며, 외부 충격으로부터 내부 전자 부품을 보호할 수 있다. 또한, 힌지 모듈(예: 제1서브 힌지 모듈(2851), 제2서브 힌지 모듈(2852), 제3서브 힌지 모듈(2861), 및 제4서브 힌지 모듈(2862))과의 결합 및 격자(lattice) 구조를 통해, 폴더블 전자 장치(200)의 상태 변화에 안정성을 제공할 수 있다.Referring to FIG. 7C , the first hinge module 285 is located in a region corresponding to the intersection (eg, the intersection 267 of FIG. 5 ) of the conductive sheet layer (eg, the conductive sheet layer 260 of FIG. 5 ). A first sub-hinge module 2851 and a second sub-hinge module 2852 divided along a first folding axis (eg, the first folding axis (A) of FIG. 2A ) based on the disposed elastic support 287 may include According to one embodiment, the second hinge module 286 is a third sub-hinge module divided along a second folding axis (eg, the second folding axis (B) of FIG. 2A ) with respect to the elastic support body 287 ). 2861 and a fourth sub-hinge module 2862 may be included. According to one embodiment, the elastic support 287 may include a highly stretchable elastomer such as urethane, silicone, or rubber. According to one embodiment, the first sub hinge module 2851, the second sub hinge module 2852, the third sub hinge module 2861, and the fourth sub hinge module 2862 may be formed of a metal material. , may be fixed to the elastic support 287 through insert injection. In some embodiments, the first sub hinge module 2851 , the second sub hinge module 2852 , the third sub hinge module 2861 , and the fourth sub hinge module 2862 are structurally coupled (eg, fit-to-fit couplings). structure) may be fixed to the elastic support 287 . For example, the elastic support 287 may be disposed to protect and/or support internal electronic components according to a state (eg, an unfolded state, a folded state, or an intermediate state) of the foldable electronic device 200 . have. For example, the elastic support 287 may perform the same or similar function as the rear cover (eg, the rear cover (and the rear covers 214, 224, 234, 244) of FIG. 4), In addition, a hinge module (eg, a first sub hinge module 2851 , a second sub hinge module 2852 , a third sub hinge module 2861 , and a fourth sub hinge module 2862 ) can protect electronic components. )) and a lattice structure, it is possible to provide stability to a state change of the foldable electronic device 200 .
다양한 실시예에 따르면, 탄성 지지체(287)는 금속 시트를 포함할 수 있다. 예를 들어, 탄성 지지체(287)는 금속 시트에 복수의 오프닝들을 포함하는 제4패턴을 포함할 수 있다. 탄성 지지체(287)는 접착 부재(예: 접착테이프, 또는 본드) 또는 용접부재(예: 니켈, 크롬, 또는 구리)를 이용하며 제1서브 힌지 모듈(2851), 제2서브 힌지 모듈(2852), 제3서브 힌지 모듈(2861) 및 제4서브 힌지 모듈(2862)중 적어도 하나의 힌지 모듈에 부착될 수 있다.According to various embodiments, the elastic support 287 may include a metal sheet. For example, the elastic support 287 may include a fourth pattern including a plurality of openings in the metal sheet. The elastic support 287 uses an adhesive member (eg, adhesive tape, or bond) or a welding member (eg, nickel, chromium, or copper), and the first sub-hinge module 2851 and the second sub-hinge module 2852 , the third sub hinge module 2861 and the fourth sub hinge module 2862 may be attached to at least one hinge module.
도 8은 본 개시의 다양한 실시예에 따른 영역별 두께 비교를 위하여 도 5의 라인 8-8을 따라 바라본 도전성 시트층(260)의 단면도이다.FIG. 8 is a cross-sectional view of the conductive sheet layer 260 taken along line 8-8 of FIG. 5 for comparison of thicknesses for each region according to various embodiments of the present disclosure.
도 8을 참고하면, 도전성 시트층(260)은 제1두께(D1)를 갖는 제2밴딩부(266), 및 제1밴딩부(265) 사이에 배치되고, 제1두께(D1)보다 얇은 제2두께(D2)를 가지며, 제1밴딩부(265)와 교차하는 교차부(267)를 포함할 수 있다. 한 실시예에 따르면, 도전성 시트층(260)의 교차부(267)는 주변의 제1밴딩부(265), 및 제2밴딩부(266) 보다 얇은 두께로 형성됨으로써, 제1밴딩부(265)를 통한 제1굴곡 특성을 만족하는 제1패턴(예: 도 6a의 제1패턴(2651)), 및 제2밴딩부(266)를 통한 제2굴곡 특성을 만족하는 제2패턴(예: 도 6b의 제2패턴(2661))을 형성할 수 있고, 제3굴곡 특성을 시연하는데 도움을 줄 수 있다. 한 실시예에 따르면, 교차부(267)는 에칭 공정을 통해, 주변의 제1밴딩부(265) 및 제2밴딩부(266)의 두께보다 얇은 두께를 갖도록 형성될 수 있다.Referring to FIG. 8 , the conductive sheet layer 260 is disposed between the second bending portion 266 having a first thickness D1 and the first bending portion 265 , and is thinner than the first thickness D1 . It has a second thickness D2 and may include an intersecting portion 267 intersecting the first bending portion 265 . According to one embodiment, the crossing portion 267 of the conductive sheet layer 260 is formed to have a thickness thinner than that of the first and second bending portions 265 and 266 surrounding the first bending portion 265 . ) through a first pattern (eg, the first pattern 2651 of FIG. 6A ) that satisfies the first bending characteristic, and a second pattern that satisfies the second bending characteristic through the second bending part 266 (eg: The second pattern 2661 of FIG. 6B ) may be formed, and it may help to demonstrate the third bending characteristic. According to one embodiment, the crossing portion 267 may be formed to have a thickness thinner than the thickness of the first and second bending portions 265 and 266 around it through an etching process.
다양한 실시예에 따르면, 도전성 시트층(260)의 교차부(267)가 주변 제1밴딩부(265) 및 제2밴딩부(266) 보다 얇은 두께로 형성됨으로서, 도전성 시트층(260)의 교차부(267)에는 오프닝이 포함되지 않을수 있다. 예를 들어, 도전성 시트층(260)의 교차부(267)에는 오프닝 또는 패턴의 형성이 없이, 제3굴곡 특성을 갖도록 형성될 수 있다.According to various embodiments, the crossing portion 267 of the conductive sheet layer 260 is formed to have a thinner thickness than the peripheral first bending part 265 and the second bending part 266 , so that the conductive sheet layer 260 is crossed. The part 267 may not include an opening. For example, the intersecting portion 267 of the conductive sheet layer 260 may be formed to have a third bending characteristic without forming an opening or a pattern.
도 9a 및 도 9b는 본 개시의 다양한 실시예에 따른 도 5의 6c 영역에 대한 다양한 실시예를 도시한 도면이다.9A and 9B are diagrams illustrating various embodiments of the area 6c of FIG. 5 according to various embodiments of the present disclosure;
도 9a 및 도 9b의 도전성 시트층(260)을 설명함에 있어서, 도 6c의 도전성 시트층(260)과 실질적으로 동일한 구성 요소들에 대해서는 동일한 부호를 부여하였으며, 그 상세한 설명은 생략될 수 있다.In describing the conductive sheet layer 260 of FIGS. 9A and 9B , the same reference numerals are assigned to the components substantially the same as those of the conductive sheet layer 260 of FIG. 6C , and detailed description thereof may be omitted.
다양한 실시예에 따르면, 제3패턴(2671)의 제3굴곡 특성은 제1패턴(2651)의 제1굴곡 특성, 및 제2패턴(2652)의 제2굴곡 특성을 만족시켜야하므로, 교차부(267)의 제3개구율은 제1밴딩부(265)의 제1개구율, 및 제2밴딩부(266)의 제2개구율과 적어도 동일하거나, 더 크게 결정될 수 있다. 한 실시예에 따르면, 제3패턴(2671)은 상술한 제3개구율을 만족하는 조건하에 다양한 형상으로 변형될 수 있다.According to various embodiments, since the third bending characteristic of the third pattern 2671 must satisfy the first bending characteristic of the first pattern 2651 and the second bending characteristic of the second pattern 2652, the intersection ( 267 ) may be determined to be at least equal to or greater than the first aperture ratio of the first bending part 265 and the second opening ratio of the second bending part 266 . According to an embodiment, the third pattern 2671 may be deformed into various shapes under a condition that satisfies the above-described third aperture ratio.
도 9a 및 도 9b를 참고하면, 제3패턴(2671)은 중심(C)을 지나는 제1축(x1)과, 중심(C)을 지나고 제1축(x1)과 수직으로 교차하는 제2축(y1)을 기준으로 서로에 대하여 대칭으로 형성되고, 서로에 대하여 지정된 이격 거리(예: 제3간격(D3))를 갖도록 배치되는 복수의 제3오프닝들(2671c, 2671e)을 포함할 수 있다. 한 실시예에 따르면, 제3패턴(2671)은 복수의 제3오프닝들(2671c, 2671e) 사이에 배치되는 복수의 제4오프닝들(2671d, 2671f)을 포함할 수 있다. 한 실시예에 따르면, 복수의 제3오프닝들(2671c, 2671e)과 복수의 제4오프닝들(2671d, 2671f)은 상하좌우 대칭으로 형상되는 원형, 및/또는 십자(a cross shape, cruciform) 형태를 포함할 수 있다. 또한, 복수의 오프닝들(예: 제3 오프닝들(2671c, 2671e), 또는 제4 오프닝들(2671d, 2671f))이 아닌, 리세스(recess) 형태로 형성될 수 있다. 한 실시예에 따르면, 복수의 제3오프닝들(2671c, 2671e)은 복수의 제4오프닝들(2671d, 2671f)과 동일하거나, 동일하지 않은 형상으로 형성될 수 있다. 어떤 실시예에서, 복수의 제3오프닝들(2671c, 2671e)과 복수의 제4오프닝들(2671d, 2671f)은 정사각형으로 형성될 수도 있다. 예를 들면, 제3 오프닝들(2671c, 2671e) 및/또는 제4 오프닝들(2671d, 2671f)의 형상에 따라 교차부(예: 도 5의 교차부(267))의 굴곡 특성(예: 제3 굴곡 특성)을 적용할 수 있다. 한 실시예에 따라, 복수의 제3 오프닝들(2671c, 2671e), 및 복수의 제4 오프닝들(2671d, 2671f)의 형상 및/또는 위치는, 도시된 실시예에 한정되는 것은 아니며, 다양한 실시예에 따라 변경될 수 있다.9A and 9B , the third pattern 2671 has a first axis x1 passing through the center C, and a second axis passing through the center C and perpendicular to the first axis x1. It may include a plurality of third openings 2671c and 2671e formed symmetrically with respect to each other based on (y1) and arranged to have a specified separation distance (eg, a third interval D3) with respect to each other. . According to an embodiment, the third pattern 2671 may include a plurality of fourth openings 2671d and 2671f disposed between the plurality of third openings 2671c and 2671e. According to an embodiment, the plurality of third openings 2671c and 2671e and the plurality of fourth openings 2671d and 2671f are circular, and/or a cross shape, cruciform shaped symmetrically. may include Also, the plurality of openings (eg, the third openings 2671c and 2671e , or the fourth openings 2671d and 2671f ) may be formed in a recess shape. According to an embodiment, the plurality of third openings 2671c and 2671e may be formed in the same shape as or different from those of the plurality of fourth openings 2671d and 2671f. In some embodiments, the plurality of third openings 2671c and 2671e and the plurality of fourth openings 2671d and 2671f may be formed in a square shape. For example, depending on the shape of the third openings 2671c and 2671e and/or the fourth openings 2671d and 2671f, the bending characteristics of the intersection (eg, the intersection 267 in FIG. 5 ) (eg, the first 3 flexural properties) can be applied. According to an embodiment, the shapes and/or positions of the plurality of third openings 2671c and 2671e and the plurality of fourth openings 2671d and 2671f are not limited to the illustrated embodiment, and various embodiments are not limited thereto. It may be changed depending on the example.
다양한 실시예에 따르면, 전자 장치(예: 도 2a의 전자 장치(200))는, 제1하우징(예: 도 2a의 제1하우징(210))과, 제1힌지 모듈(예: 도 2b의 제1힌지 모듈(285))을 통해, 제1폴딩축(예: 도 2a의 제1폴딩축(A))을 기준으로, 상기 제1하우징과 접힘 가능하게 연결되는 제2하우징(예: 도 2a의 제2하우징(220))과, 제2힌지 모듈(예: 도 2b의 제2힌지 모듈(286))을 통해, 상기 제1폴딩축과 교차하는 제2폴딩축(예: 도 2a의 제2폴딩축(B))을 기준으로, 상기 제1하우징과 접힘 가능하게 연결되는 제3하우징(예: 도 2a의 제3하우징(230))과, 상기 제1힌지 모듈을 통해, 상기 제1폴딩축을 기준으로, 상기 제3하우징과 접힘 가능하게 연결되고, 상기 제2힌지 모듈을 통해, 상기 제2폴딩축을 기준으로, 상기 제2하우징과 접힘 가능하게 연결되는 제4하우징(예: 도 2a의 제4하우징(240))과, 상기 제1하우징, 상기 제2하우징, 상기 제3하우징 및 상기 제4하우징의 지지를 받도록 배치되는 플렉서블 디스플레이(예: 도 2a의 플렉서블 디스플레이(250))로써, 상기 제1하우징에 대응하는 제1영역(예: 도 2a의 제1영역(250a))과, 상기 제2하우징에 대응하는 제2영역(예: 도 2a의 제2영역(250b))과, 상기 제3하우징에 대응하는 제3영역(예: 도 2a의 제3영역(250c))과, 상기 제4하우징에 대응하는 제4영역(예: 도 2a의 제4영역(250d))과, 상기 제1폴딩축과 대응하고 접힘 가능한 제1폴딩 영역(예: 도 2a의 제1폴딩 영역(250e))과, 상기 제2회전축과 대응하는 접힘 가능한 제2폴딩 영역(예: 도 2a의 제2폴딩 영역(250f)) 및 상기 제1폴딩 영역과 상기 제2폴딩 영역이 교차하는 교차 영역(예: 도 2a의 교차 영역(250f))을 포함하는 플렉서블 디스플레이 및 상기 플렉서블 디스플레이 아래에 배치되고, 상기 제1폴딩 영역에 대응하고 제1패턴(예: 도 6a의 제1패턴(2651))을 포함하는 제1밴딩부(예: 도 5의 밴딩부(265))와, 상기 제2폴딩 영역에 대응하고 제2패턴(예: 도 6b의 제2패턴(2661))을 포함하는 제2밴딩부(예: 도 5의 제2밴딩부(266)) 및 상기 상기 교차 영역과 대응하고 제3패턴(예: 도 6c의 제3패턴(2671))을 포함하는 교차부(예: 도 5의 교차부(267))를 포함하는 도전성 시트층(예: 도 5의 도전성 시트층(260))을 포함할 수 있다.According to various embodiments, the electronic device (eg, the electronic device 200 of FIG. 2A ) includes a first housing (eg, the first housing 210 of FIG. 2A ) and a first hinge module (eg, the electronic device 200 of FIG. 2B ). Through the first hinge module 285), a second housing (eg, in FIG. 2A through the second housing 220) and a second hinge module (eg, the second hinge module 286 of FIG. 2B), a second folding axis intersecting the first folding axis (eg, in FIG. 2A ) Based on the second folding shaft (B)), a third housing (eg, the third housing 230 of FIG. 2A ) that is foldably connected to the first housing and the first hinge module, A fourth housing (eg, in FIG. The fourth housing 240 of 2a), and the first housing, the second housing, the third housing, and the flexible display disposed to receive the support of the fourth housing (eg, the flexible display 250 of FIG. 2A ) Thus, a first region corresponding to the first housing (eg, the first region 250a of FIG. 2A ) and a second region corresponding to the second housing (eg, the second region 250b of FIG. 2A )) and a third region corresponding to the third housing (eg, a third region 250c in FIG. 2A ) and a fourth region corresponding to the fourth housing (eg, a fourth region 250d in FIG. 2A )) and a first folding area corresponding to the first folding shaft and foldable (eg, the first folding area 250e of FIG. 2A ) and a second folding area corresponding to the second rotation axis (eg, FIG. 2A ) a flexible display including a second folding area 250f of a second folding area of and a first bending part corresponding to the first folding area and including a first pattern (eg, the first pattern 2651 of FIG. 6A ). (eg, the bending part 265 of FIG. 5 ), and a second bending part (eg, FIG. 5 ) that corresponds to the second folding area and includes a second pattern (eg, the second pattern 2661 of FIG. 6B ). of the second bending portion 266) and an intersection (eg, intersection 267 in FIG. 5 ) corresponding to the intersection region and including a third pattern (eg, the third pattern 2671 in FIG. 6C )) may include a conductive sheet layer (eg, the conductive sheet layer 260 of FIG. 5 ) including:
다양한 실시예에 따르면, 상기 제1패턴은, 상기 제1밴딩부가 제1굴곡 특성을 갖도록 형성되는 복수의 제1오프닝들을 포함하고, 상기 제2패턴은, 상기 제2밴딩부가 제2굴곡 특성을 갖도록 형성되는 복수의 제2오프닝들을 포함하고, 상기 제3패턴은, 상기 교차부가 제3굴곡 특성을 갖도록 형성되는 복수의 제3오프닝들을 포함할 수 있다.According to various embodiments, the first pattern includes a plurality of first openings in which the first bending part has a first bending characteristic, and the second pattern includes the second bending part having a second bending characteristic. A plurality of second openings may be included, and the third pattern may include a plurality of third openings formed so that the crossing portion has a third bending characteristic.
다양한 실시예에 따르면, 상기 제1굴곡 특성은 상기 복수의 제1오프닝들의 형상 및/또는 배치 구조를 통해 결정되고, 상기 제2굴곡 특성은 상기 복수의 제2오프닝들의 형상 및/또는 배치 구조를 통해 결정될 수 있다.According to various embodiments, the first bending characteristic is determined through the shape and/or arrangement structure of the plurality of first openings, and the second bending characteristic is determined by the shape and/or arrangement structure of the plurality of second openings. can be determined through
다양한 실시예에 따르면, 상기 복수의 제1오프닝들 각각은 상기 제1폴딩축을 따라 길이를 갖는 슬릿 구조를 포함할 수 있다.According to various embodiments, each of the plurality of first openings may include a slit structure having a length along the first folding axis.
다양한 실시예에 따르면, 상기 복수의 제2오프닝들 각각은 상기 제2폴딩축을 따라 길이를 갖는 슬릿 구조를 포함할 수 있다.According to various embodiments, each of the plurality of second openings may include a slit structure having a length along the second folding axis.
다양한 실시예에 따르면, 상기 복수의 제1오프닝들은, 상기 제1밴딩부가 제1개구율을 갖도록 형성되고, 상기 복수의 제2오프닝들은, 상기 제2밴딩부가 제2개구율을 갖도록 형성될 수 있다.According to various embodiments, the plurality of first openings may be formed such that the first bending portion has a first aperture ratio, and the plurality of second openings may be formed such that the second bending portion has a second aperture ratio.
다양한 실시예에 따르면, 상기 복수의 제3오프닝들은, 상기 교차부가 제3개구율을 갖도록 형성되고, 상기 제3개구율은, 상기 제1개구율 및 상기 제2개구율과 동일하거나 더 크게 결정될 수 있다.According to various embodiments, in the plurality of third openings, the intersection portion is formed to have a third aperture ratio, and the third aperture ratio may be determined to be equal to or larger than the first aperture ratio and the second aperture ratio.
다양한 실시예에 따르면, 상기 복수의 제3오프닝들 각각은 상하좌우 대칭 형상으로 형성되고, 서로에 대하여 지정된 이격 간격을 갖도록 배치될 수 있다.According to various embodiments, each of the plurality of third openings may be formed in a vertical, horizontally symmetrical shape, and may be disposed to have a specified spacing with respect to each other.
다양한 실시예에 따르면, 상기 제3복수의 오프닝들 사이의 공간에 규칙적인 간격으로 배치되는 복수의 제4오프닝들을 포함할 수 있다.According to various embodiments, the plurality of fourth openings may include a plurality of fourth openings disposed at regular intervals in a space between the plurality of third openings.
다양한 실시예에 따르면, 상기 전자 장치가 제1폴딩 방식으로 접힐 때, 상기 제1하우징은 상기 제2하우징과 대응하고, 상기 제3하우징은 상기 제4하우징과 대응하고, 상기 전자 장치가 제2폴딩 방식으로 접힐 때, 상기 제1하우징은 상기 제3하우징과 대응하고, 상기 제2하우징은 상기 제4하우징과 대응할 수 있다.According to various embodiments, when the electronic device is folded in the first folding manner, the first housing corresponds to the second housing, the third housing corresponds to the fourth housing, and the electronic device When folded in a folding manner, the first housing may correspond to the third housing, and the second housing may correspond to the fourth housing.
다양한 실시예에 따르면, 상기 제1폴딩 방식으로 접힐 때, 상기 플렉서블 디스플레이의 적어도 일부가 시각적으로 노출되고, 상기 제2폴딩 방식으로 접힐 때, 상기 플렉서블 디스플레이가 시각적으로 노출되지 않을 수 있다.According to various embodiments, when folded in the first folding method, at least a portion of the flexible display may be visually exposed, and when folded in the second folding method, the flexible display may not be visually exposed.
다양한 실시예에 따르면, 상기 제1폴딩 방식 및/또는 상기 제2폴딩 방식으로 접힐 때, 상기 각 하우징들 중 적어도 일부는 서로에 대하여 비대칭으로 접힐 수 있다.According to various embodiments, when folded in the first folding method and/or in the second folding method, at least some of the respective housings may be asymmetrically folded with respect to each other.
다양한 실시예에 따르면, 상기 제1힌지 모듈은 상기 교차 영역을 기준으로 상기 제1폴딩축을 따라 분할된 제1서브 힌지 모듈 및 제2서브 힌지 모듈을 포함하고, 상기 제2힌지 모듈은 상기 교차 영역을 기준으로 상기 제2폴딩축을 따라 분할된 제3서브 힌지 모듈 및 제4서브 힌지 모듈을 포함하고, 상기 교차 영역에서, 상기 제1, 2, 3, 4 서브 힌지 모듈과 결합되는 탄성 지지체를 포함할 수 있다.According to various embodiments, the first hinge module includes a first sub-hinge module and a second sub-hinge module divided along the first folding axis based on the crossing region, and the second hinge module includes the crossing region. a third sub-hinge module and a fourth sub-hinge module divided along the second folding axis based on can do.
다양한 실시예에 따르면, 상기 탄성 지지체는 상기 제1힌지 모듈 및 상기 제2힌지 모듈의 굴곡 특성을 모두 만족하는 탄성 소재로 형성될 수 있다.According to various embodiments, the elastic support body may be formed of an elastic material that satisfies both bending characteristics of the first hinge module and the second hinge module.
다양한 실시예에 따르면, 전자 장치는, 제1폴딩축 및/또는 상기 제1폴딩축과 교차하는 제2폴딩축을 기준으로 접힘 가능하게 결합되는 복수의 하우징들과, 상기 복수의 하우징들의 지지를 받도록 배치되는 플렉서블 디스플레이로써, 상기 제1폴딩축과 대응하고 접힘 가능한 제1폴딩 영역과, 상기 제2폴딩축과 대응하는 접힘 가능한 제2폴딩 영역 및 상기 제1폴딩 영역과 상기 제2폴딩 영역이 교차하는 교차 영역을 포함하는 플렉서블 디스플레이 및 상기 플렉서블 디스플레이 아래에 배치되고, 상기 제1폴딩 영역에 대응하고 제1패턴을 포함하는 제1밴딩부, 상기 제2폴딩 영역에 대응하고 제2패턴을 포함하는 제2밴딩부 및 상기 상기 교차 영역과 대응하고 제3패턴을 포함하는 교차부를 포함하는 도전성 시트층을 포함할 수 있다.According to various embodiments, the electronic device includes a plurality of housings that are foldably coupled with respect to a first folding axis and/or a second folding axis intersecting the first folding axis, and the plurality of housings to receive the support of the housings. A flexible display that is arranged, wherein a foldable first folding area corresponding to the first folding axis, a foldable second folding area corresponding to the second folding axis, and the first folding area and the second folding area intersect a flexible display including an intersecting region of and a conductive sheet layer including a second bending portion and an intersection portion corresponding to the intersection region and including a third pattern.
다양한 실시예에 따르면, 상기 제1패턴은, 상기 제1밴딩부가 제1굴곡 특성을 갖도록 형성되는 복수의 제1오프닝들을 포함하고, 상기 제2패턴은, 상기 제2밴딩부가 제2굴곡 특성을 갖도록 형성되는 복수의 제2오프닝들을 포함하고, 상기 제3패턴은, 상기 교차부가 제3굴곡 특성을 갖도록 형성되는 복수의 제3오프닝들을 포함할 수 있다.According to various embodiments, the first pattern includes a plurality of first openings in which the first bending part has a first bending characteristic, and the second pattern includes the second bending part having a second bending characteristic. A plurality of second openings may be included, and the third pattern may include a plurality of third openings formed so that the crossing portion has a third bending characteristic.
다양한 실시예에 따르면, 상기 복수의 제1오프닝들은, 상기 제1밴딩부가 제1개구율을 갖도록 형성되고, 상기 복수의 제2오프닝들은, 상기 제2밴딩부가 제2개구율을 갖도록 형성되고, 상기 복수의 제3오프닝들은, 상기 교차부가 제3개구율을 갖도록 형성되고, 상기 제3개구율은, 상기 제1개구율 및 상기 제2개구율과 동일하거나 더 크게 결정될 수 있다.According to various embodiments, in the plurality of first openings, the first bending portion is formed to have a first aperture ratio, and in the plurality of second openings, the second bending portion is formed to have a second aperture ratio, and the plurality of first openings are formed to have a second aperture ratio. In the third openings of , the intersection portion is formed to have a third aperture ratio, and the third aperture ratio may be determined to be equal to or greater than the first aperture ratio and the second aperture ratio.
다양한 실시예에 따르면, 상기 복수의 제3오프닝들 각각은 상하좌우 대칭 형상으로 형성되고, 서로에 대하여 지정된 이격 간격을 갖도록 배치될 수 있다.According to various embodiments, each of the plurality of third openings may be formed in a vertical, horizontally symmetrical shape, and may be disposed to have a specified spacing with respect to each other.
다양한 실시예에 따르면, 도전성 시트층의 지지를 받는 플렉서블 디스플레이는, 윈도우층과, 상기 윈도우층 아래에 배치되고, 제1폴딩축과 대응하는 제1폴딩 영역, 상기 제1폴딩축과 교차하는 제2폴딩축과 대응하는 제2폴딩 영역 및 상기 제1폴딩축과 상기 제2폴딩축이 교차하는 영역에 대응하는 교차 영역을 포함하는 디스플레이 패널 및 상기 디스플레이 패널 아래에 배치되는 폴리머층을 포함하고, 상기 도전성 시트층은 상기 폴리머층 아래에 배치되고, 상기 제1폴딩 영역에 대응하고 제1패턴을 포함하는 제1밴딩부, 상기 제2폴딩 영역에 대응하고 제2패턴을 포함하는 제2밴딩부 및 상기 교차 영역과 대응하고 제3패턴을 포함할 수 있다.According to various embodiments, the flexible display supported by the conductive sheet layer includes a window layer, a first folding area disposed under the window layer, a first folding area corresponding to a first folding axis, and a first folding area intersecting the first folding axis. A display panel comprising a second folding area corresponding to two folding axes and an intersection area corresponding to an area in which the first folding axis and the second folding axis intersect, and a polymer layer disposed under the display panel, The conductive sheet layer is disposed under the polymer layer, and includes a first bending part corresponding to the first folding area and including a first pattern, and a second bending part corresponding to the second folding area and including a second pattern. and a third pattern corresponding to the crossing region.
다양한 실시예에 따르면, 상기 제1패턴은, 상기 제1밴딩부가 제1굴곡 특성을 갖도록 형성되는 복수의 제1오프닝들을 포함하고, 상기 제2패턴은, 상기 제2밴딩부가 제2굴곡 특성을 갖도록 형성되는 복수의 제2오프닝들을 포함하고, 상기 제3패턴은, 상기 교차부가 제3굴곡 특성을 갖도록 형성되는 복수의 제3오프닝들을 포함하고, 상기 제3굴곡 특성은 상기 제1굴곡 특성 및 상기 제2굴곡 특성을 포함하도록 결정될 수 있다.According to various embodiments, the first pattern includes a plurality of first openings in which the first bending part has a first bending characteristic, and the second pattern includes the second bending part having a second bending characteristic. a plurality of second openings formed to have a plurality of second openings, wherein the third pattern includes a plurality of third openings formed such that the crossing portion has a third bending characteristic, and the third bending characteristic is the first bending characteristic and It may be determined to include the second bending characteristic.
그리고 본 명세서와 도면에 개시된 본 개시의 실시예들은 본 개시의 실시예에 따른 기술 내용을 쉽게 설명하고 본 개시의 실시예의 이해를 돕기 위해 특정 예를 제시한 것일 뿐이며, 본 개시의 실시예의 범위를 한정하고자 하는 것은 아니다. 따라서 본 개시의 다양한 실시예의 범위는 여기에 개시된 실시예들 이외에도 본 개시의 다양한 실시예의 기술적 사상을 바탕으로 도출되는 모든 변경 또는 변형된 형태가 본 개시의 다양한 실시예의 범위에 포함되는 것으로 해석되어야 한다.And the embodiments of the present disclosure disclosed in the present specification and drawings are merely provided for specific examples to easily explain the technical content according to the embodiments of the present disclosure and help the understanding of the embodiments of the present disclosure, and to extend the scope of the embodiments of the present disclosure It is not meant to be limiting. Therefore, in the scope of various embodiments of the present disclosure, in addition to the embodiments disclosed herein, all changes or modifications derived from the technical ideas of various embodiments of the present disclosure should be interpreted as being included in the scope of various embodiments of the present disclosure. .

Claims (15)

  1. 전자 장치에 있어서,In an electronic device,
    제1하우징;a first housing;
    제1힌지 모듈을 통해, 제1폴딩축을 기준으로, 상기 제1하우징과 접힘 가능하게 연결되는 제2하우징;a second housing that is foldably connected to the first housing with respect to the first folding axis through the first hinge module;
    제2힌지 모듈을 통해, 상기 제1폴딩축과 교차하는 제2폴딩축을 기준으로, 상기 제1하우징과 접힘 가능하게 연결되는 제3하우징;a third housing that is foldably connected to the first housing through a second hinge module based on a second folding axis intersecting the first folding axis;
    상기 제1힌지 모듈을 통해, 상기 제1폴딩축을 기준으로, 상기 제3하우징과 접힘 가능하게 연결되고, 상기 제2힌지 모듈을 통해, 상기 제2폴딩축을 기준으로, 상기 제2하우징과 접힘 가능하게 연결되는 제4하우징;Through the first hinge module, it is foldably connected to the third housing with respect to the first folding axis, and through the second hinge module, it is foldable with the second housing with respect to the second folding axis. a fourth housing that is connected to each other;
    상기 제1하우징, 상기 제2하우징, 상기 제3하우징, 및 상기 제4하우징의 지지를 받도록 배치되는 플렉서블 디스플레이로써,A flexible display disposed to receive support from the first housing, the second housing, the third housing, and the fourth housing,
    상기 제1하우징에 대응하는 제1영역;a first area corresponding to the first housing;
    상기 제2하우징에 대응하는 제2영역;a second area corresponding to the second housing;
    상기 제3하우징에 대응하는 제3영역;a third area corresponding to the third housing;
    상기 제4하우징에 대응하는 제4영역;a fourth area corresponding to the fourth housing;
    상기 제1폴딩축과 대응하고 접힘 가능한 제1폴딩 영역;a first folding area corresponding to the first folding axis and being foldable;
    상기 제2회전축과 대응하는 접힘 가능한 제2폴딩 영역; 및a second foldable area corresponding to the second rotation shaft; and
    상기 제1폴딩 영역과 상기 제2폴딩 영역이 교차하는 교차 영역을 포함하는 플렉서블 디스플레이; 및a flexible display including an intersection area in which the first folding area and the second folding area intersect; and
    상기 플렉서블 디스플레이 아래에 배치되고, 상기 제1폴딩 영역에 대응하고 제1패턴을 포함하는 제1밴딩부, 상기 제2폴딩 영역에 대응하고 제2패턴을 포함하는 제2밴딩부, 및 상기 상기 교차 영역과 대응하고 제3패턴을 포함하는 교차부를 포함하는 도전성 시트층을 포함하는 전자 장치.A first bending portion disposed under the flexible display and corresponding to the first folding area and including a first pattern, a second bending portion corresponding to the second folding area and including a second pattern, and the crossover An electronic device comprising: a conductive sheet layer having an intersection corresponding to the region and comprising a third pattern.
  2. 제1항에 있어서,According to claim 1,
    상기 제1패턴은, 상기 제1밴딩부가 제1굴곡 특성을 갖도록 형성되는 복수의 제1오프닝들을 포함하고, The first pattern includes a plurality of first openings formed so that the first bending portion has a first bending characteristic,
    상기 제2패턴은, 상기 제2밴딩부가 제2굴곡 특성을 갖도록 형성되는 복수의 제2오프닝들을 포함하고,The second pattern includes a plurality of second openings formed so that the second bending portion has a second bending characteristic,
    상기 제3패턴은, 상기 교차부가 제3굴곡 특성을 갖도록 형성되는 복수의 제3오프닝들을 포함하는 전자 장치.The third pattern may include a plurality of third openings in which the intersection portion has a third bending characteristic.
  3. 제2항에 있어서,3. The method of claim 2,
    상기 제1굴곡 특성은 상기 복수의 제1오프닝들의 형상 및/또는 배치 구조를 통해 결정되고,The first bending characteristic is determined through a shape and/or arrangement structure of the plurality of first openings,
    상기 제2굴곡 특성은 상기 복수의 제2오프닝들의 형상 및/또는 배치 구조를 통해 결정되는 전자 장치.The second bending characteristic is determined through a shape and/or an arrangement structure of the plurality of second openings.
  4. 제2항에 있어서,3. The method of claim 2,
    상기 복수의 제1오프닝들 각각은 상기 제1폴딩축을 따라 길이를 갖는 슬릿 구조를 포함하는 전자 장치.and each of the plurality of first openings includes a slit structure having a length along the first folding axis.
  5. 제2항에 있어서,3. The method of claim 2,
    상기 복수의 제2오프닝들 각각은 상기 제2폴딩축을 따라 길이를 갖는 슬릿 구조를 포함하는 전자 장치.and each of the plurality of second openings includes a slit structure having a length along the second folding axis.
  6. 제2항에 있어서,3. The method of claim 2,
    상기 복수의 제1오프닝들은, 상기 제1밴딩부가 제1개구율을 갖도록 형성되고,The plurality of first openings are formed such that the first bending portion has a first aperture ratio,
    상기 복수의 제2오프닝들은, 상기 제2밴딩부가 제2개구율을 갖도록 형성되는 전자 장치.In the plurality of second openings, the second bending portion is formed to have a second aperture ratio.
  7. 제6항에 있어서,7. The method of claim 6,
    상기 복수의 제3오프닝들은, 상기 교차부가 제3개구율을 갖도록 형성되고, The plurality of third openings are formed such that the intersection has a third aperture ratio,
    상기 제3개구율은, 상기 제1개구율 및 상기 제2개구율과 동일하거나 더 크게 결정되는 전자 장치.The third aperture ratio is determined to be equal to or greater than the first aperture ratio and the second aperture ratio.
  8. 제2항에 있어서,3. The method of claim 2,
    상기 복수의 제3오프닝들 각각은 상하좌우 대칭 형상으로 형성되고,Each of the plurality of third openings is formed in a vertical, horizontally symmetrical shape,
    서로에 대하여 지정된 이격 간격을 갖도록 배치되는 전자 장치.An electronic device disposed to have a specified spacing with respect to each other.
  9. 제8항에 있어서,9. The method of claim 8,
    상기 복수의 제3오프닝들 사이의 공간에, 지정된 이격 간격으로 배치되는 복수의 제4오프닝들을 포함하는 전자 장치.An electronic device including a plurality of fourth openings disposed at a predetermined interval in a space between the plurality of third openings.
  10. 제1항에 있어서,According to claim 1,
    상기 전자 장치가 제1폴딩 방식으로 접힐 때, 상기 제1하우징은 상기 제2하우징과 대면하고, 상기 제3하우징은 상기 제4하우징과 대면하고,When the electronic device is folded in the first folding manner, the first housing faces the second housing, the third housing faces the fourth housing,
    상기 전자 장치가 제2폴딩 방식으로 접힐 때, 상기 제1하우징은 상기 제3하우징과 대면하고, 상기 제2하우징은 상기 제4하우징과 대면하는 전자 장치.When the electronic device is folded in the second folding method, the first housing faces the third housing, and the second housing faces the fourth housing.
  11. 제10항에 있어서,11. The method of claim 10,
    상기 제1폴딩 방식으로 접힐 때, 상기 플렉서블 디스플레이의 적어도 일부가 시각적으로 노출되고,When folded in the first folding manner, at least a portion of the flexible display is visually exposed,
    상기 제2폴딩 방식으로 접힐 때, 상기 플렉서블 디스플레이가 시각적으로 노출되지 않는 전자 장치.When the flexible display is folded in the second folding method, the electronic device is not visually exposed.
  12. 제10항에 있어서,11. The method of claim 10,
    상기 제1폴딩 방식 및/또는 상기 제2폴딩 방식으로 접힐 때, 상기 각 하우징들 중 적어도 일부는 서로에 대하여 비대칭으로 접히는 전자 장치.When folded in the first folding manner and/or the second folding manner, at least some of the respective housings are asymmetrically folded with respect to each other.
  13. 제1항에 있어서,According to claim 1,
    상기 제1힌지 모듈은 상기 교차 영역을 기준으로 상기 제1폴딩축을 따라 분할된 제1서브 힌지 모듈 및 제2서브 힌지 모듈을 포함하고,The first hinge module includes a first sub-hinge module and a second sub-hinge module divided along the first folding axis based on the crossing area,
    상기 제2힌지 모듈은 상기 교차 영역을 기준으로 상기 제2폴딩축을 따라 분할된 제3서브 힌지 모듈 및 제4서브 힌지 모듈을 포함하고,The second hinge module includes a third sub-hinge module and a fourth sub-hinge module divided along the second folding axis based on the crossing area,
    상기 교차 영역에서, 상기 제1, 2, 3, 4 서브 힌지 모듈과 결합되는 탄성 지지체를 포함하는 전자 장치.and an elastic support member coupled to the first, second, third, and fourth sub-hinge modules in the crossing region.
  14. 제13항에 있어서,14. The method of claim 13,
    상기 탄성 지지체는 상기 제1힌지 모듈 및 상기 제2힌지 모듈의 굴곡 특성을 만족하는 탄성 소재로 형성되는 전자 장치.The elastic support is formed of an elastic material that satisfies the flexural characteristics of the first hinge module and the second hinge module.
  15. 전자 장치에 있어서,In an electronic device,
    제1폴딩축, 및/또는 상기 제1폴딩축과 교차하는 제2폴딩축을 기준으로접힘 가능하게 결합되는 복수의 하우징들;a plurality of housings coupled to be foldable with respect to a first folding axis and/or a second folding axis intersecting the first folding axis;
    상기 복수의 하우징들의 지지를 받도록 배치되는 플렉서블 디스플레이로써, As a flexible display disposed to receive the support of the plurality of housings,
    상기 제1폴딩축과 대응하고 접힘 가능한 제1폴딩 영역;a first folding area corresponding to the first folding axis and being foldable;
    상기 제2폴딩축과 대응하고 접힘 가능한 제2폴딩 영역; 및a second folding area corresponding to the second folding axis and being foldable; and
    상기 제1폴딩 영역과 상기 제2폴딩 영역이 교차하는 교차 영역을 포함하는 플렉서블 디스플레이; 및a flexible display including an intersection area in which the first folding area and the second folding area intersect; and
    상기 플렉서블 디스플레이 아래에 배치되고, 상기 제1폴딩 영역에 대응하고 제1패턴을 포함하는 제1밴딩부, 상기 제2폴딩 영역에 대응하고 제2패턴을 포함하는 제2밴딩부, 및 상기 상기 교차 영역과 대응하고 제3패턴을 포함하는 교차부를 포함하는 도전성 시트층을 포함하는 전자 장치. A first bending portion disposed under the flexible display and corresponding to the first folding area and including a first pattern, a second bending portion corresponding to the second folding area and including a second pattern, and the crossover An electronic device comprising: a conductive sheet layer having an intersection corresponding to the region and comprising a third pattern.
PCT/KR2021/008982 2020-08-05 2021-07-13 Foldable electronic device WO2022030789A1 (en)

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