WO2022022004A1 - 拾音装置减震结构及拾音设备 - Google Patents

拾音装置减震结构及拾音设备 Download PDF

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Publication number
WO2022022004A1
WO2022022004A1 PCT/CN2021/093606 CN2021093606W WO2022022004A1 WO 2022022004 A1 WO2022022004 A1 WO 2022022004A1 CN 2021093606 W CN2021093606 W CN 2021093606W WO 2022022004 A1 WO2022022004 A1 WO 2022022004A1
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WO
WIPO (PCT)
Prior art keywords
pickup device
shock
sound pickup
sound
hole
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2021/093606
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English (en)
French (fr)
Inventor
孙海涛
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Beijing ByteDance Network Technology Co Ltd
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Beijing ByteDance Network Technology Co Ltd
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Publication date
Application filed by Beijing ByteDance Network Technology Co Ltd filed Critical Beijing ByteDance Network Technology Co Ltd
Priority to US17/928,904 priority Critical patent/US12160702B2/en
Publication of WO2022022004A1 publication Critical patent/WO2022022004A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/20—Arrangements for obtaining desired frequency or directional characteristics
    • H04R1/22—Arrangements for obtaining desired frequency or directional characteristics for obtaining desired frequency characteristic only 
    • H04R1/28—Transducer mountings or enclosures modified by provision of mechanical or acoustic impedances, e.g. resonator, damping means
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/08—Mouthpieces; Microphones; Attachments therefor
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/20—Arrangements for obtaining desired frequency or directional characteristics
    • H04R1/22—Arrangements for obtaining desired frequency or directional characteristics for obtaining desired frequency characteristic only 
    • H04R1/28—Transducer mountings or enclosures modified by provision of mechanical or acoustic impedances, e.g. resonator, damping means
    • H04R1/2869—Reduction of undesired resonances, i.e. standing waves within enclosure, or of undesired vibrations, i.e. of the enclosure itself
    • H04R1/2876—Reduction of undesired resonances, i.e. standing waves within enclosure, or of undesired vibrations, i.e. of the enclosure itself by means of damping material, e.g. as cladding
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/20—Arrangements for obtaining desired frequency or directional characteristics
    • H04R1/32—Arrangements for obtaining desired frequency or directional characteristics for obtaining desired directional characteristic only
    • H04R1/40—Arrangements for obtaining desired frequency or directional characteristics for obtaining desired directional characteristic only by combining a number of identical transducers
    • H04R1/406—Arrangements for obtaining desired frequency or directional characteristics for obtaining desired directional characteristic only by combining a number of identical transducers microphones
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R2201/00—Details of transducers, loudspeakers or microphones covered by H04R1/00 but not provided for in any of its subgroups
    • H04R2201/40—Details of arrangements for obtaining desired directional characteristic by combining a number of identical transducers covered by H04R1/40 but not provided for in any of its subgroups
    • H04R2201/403—Linear arrays of transducers

Definitions

  • the present application relates to the technical field of sound pickup devices, and in particular, the present application relates to a shock absorption structure of a sound pickup device and a sound pickup device.
  • an embodiment of the present application provides a shock absorption structure for a sound pickup device, including:
  • a casing including a side wall and a peripheral wall connected to the side wall;
  • the circuit board is fixedly connected with the housing, and is surrounded by the side wall and the surrounding wall to form a cavity;
  • At least one pickup device is located in the cavity and is electrically connected to the circuit board;
  • the first shock absorbing layer is arranged between the side wall and the sound pickup device
  • the second sound-collecting hole in the side wall, the hole in the first shock-absorbing layer communicate with the first sound-collecting hole provided by the sound pickup device.
  • the shock-absorbing structure of the sound pickup device further includes at least one sealing member, and the sealing member is arranged between the first shock-absorbing layer and the sound pickup device, and is used to cover the sound pickup device;
  • the holes of the sealing element are communicated with the holes in the first shock absorbing layer and the first sound pickup holes provided by the sound pickup device.
  • the center line of the first sound-collecting hole, the hole in the first shock-absorbing layer, the hole of the sealing member, and the center line of the second sound-collecting hole are located on the same straight line.
  • the center points of each second sound-collecting hole are located on the same horizontal line.
  • At least one mounting hole is respectively provided on both sides of each first sound pickup hole, and the center point of the mounting hole and the center point of the first sound pickup hole are located on the same straight line;
  • Fasteners are arranged in the installation holes, and the fasteners are used to fix the connection between the circuit board and the casing.
  • a side of the circuit board away from the sound pickup device is provided with a screw, which is used to connect the circuit board to the sound pickup device.
  • the sealing member includes a silicone sleeve, and the silicone sleeve is sleeved on the pickup device.
  • the shock-absorbing structure of the sound pickup device further includes a second shock-absorbing layer disposed between the peripheral wall and the sealing member.
  • the second sound pickup hole gradually extends to the inside of the side wall, so that the end away from the first shock absorbing layer is The diameter is larger than the diameter near the end of the first shock absorption layer;
  • the diameter of the hole in the first shock-absorbing layer and the diameter of the hole in the seal are both smaller than or equal to the diameter of the second sound-collecting hole near the end of the first shock-absorbing layer, and the diameter of the first sound-collecting hole is smaller than or equal to the first shock-absorbing layer The diameter of the channel or the channel of the seal.
  • the materials for making the first shock absorbing layer and the second shock absorbing layer include at least one of polyurethane, silicone and rubber.
  • an embodiment of the present application provides a sound pickup device, including the sound pickup device damping structure provided in the first aspect.
  • FIG. 1 is a schematic structural diagram of a shock absorption structure of a sound pickup device provided by an embodiment of the application;
  • FIG. 2 is a schematic structural diagram of another vibration damping structure of a sound pickup device according to an embodiment of the present application.
  • the microphone Since most of the devices with voice interaction function on the existing market directly connect the microphone to the structure and hardware of the device, the microphone is greatly affected by the device. In particular, when the device is running, the vibration of the device will propagate to the microphone. Affects the pickup accuracy and recognition accuracy of the microphone.
  • the conventional shock-absorbing structure of the existing microphones cannot avoid the problem of sound pickup resonance of the microphones, thereby affecting the user experience.
  • the present application proposes a sound-absorbing device shock-absorbing structure and a sound-picking device, which are used to solve the technical problem of sound-picking resonance in a device with a voice interaction function in the prior art.
  • the circuit board, the side wall and the surrounding wall of the casing form a cavity for accommodating the pickup device, and a shock absorbing layer is arranged between the pickup device and the side wall.
  • a shock absorbing layer is arranged between the pickup device and the side wall.
  • the second sound pickup hole in the side wall, the hole in the first shock-absorbing layer and the first sound pickup hole provided by the pickup device are connected, so that the mechanical vibration transmitted from the casing to the pickup device is reduced, and the mechanical vibration transmitted to the pickup device is reduced.
  • the vibration of the equipment affects the pickup accuracy and recognition accuracy of the pickup device.
  • FIG. 1 a schematic structural diagram of the shock-absorbing structure for a sound pickup device includes: a casing, and the casing includes a side wall 11 and a side wall connected to the side wall 11 .
  • the layer 50 is arranged between the side wall 11 and the sound pickup device 30;
  • the first sound pickup holes 31 provided in the sound pickup device 30 communicate with each other.
  • the circuit board, the side wall and the surrounding wall of the casing form a cavity for accommodating the pickup device, and a shock absorbing layer is arranged between the pickup device and the side wall.
  • a shock absorbing layer is arranged between the pickup device and the side wall.
  • the second sound pickup hole in the side wall, the hole in the first shock-absorbing layer and the first sound pickup hole provided by the pickup device are connected, so that the mechanical vibration transmitted from the casing to the pickup device is reduced, and the mechanical vibration transmitted to the pickup device is reduced.
  • the vibration of the equipment affects the pickup accuracy and recognition accuracy of the pickup device.
  • a cavity is formed by the circuit board 20 enclosed with the side wall 11 and the peripheral wall 12 of the casing.
  • the pickup device 30 is arranged in the cavity, and is connected with the circuit board 20
  • the circuit board 20 , the side wall 11 and the peripheral wall 12 can well isolate the bad influence on the pickup device 30 from the outside world. Therefore, the cavity can effectively protect the pickup device 30 located therein.
  • a first shock absorbing layer 50 is arranged between the pickup device 30 and the side wall 11 , and the first shock absorbing layer 50 fills the cavity between the pickup device 30 and the side wall 11 , which can relieve the housing side wall 11 and the sound pickup device 30 .
  • the transmission of mechanical vibration between the two parts reduces the influence of equipment vibration on the sound pickup accuracy and recognition accuracy of the pickup device 30; at the same time, the first shock absorbing layer 50 fills the space between the pickup device 30 and the side wall 11.
  • the device When the device is impacted by an external force , can effectively buffer the side wall 11 and the peripheral wall 12 to achieve the purpose of protecting the pickup device 30 .
  • the shock-absorbing structure of the sound pickup device further includes at least one sealing member 40 .
  • the sealing member 40 is disposed between the first shock-absorbing layer 50 and the sound pickup device 30 and is used to cover the sound pickup device 30 .
  • the hole 41 of the sealing member 40 is in communication with the hole 51 in the first shock absorption layer 50 and the first sound pickup hole 31 provided by the pickup device 30 to ensure that the sound emitted by the pickup device 30 can be transmitted normally and the outside sound can be normally picked up by the pickup.
  • the sound pickup device 30 is identified, so as to prevent the sealing member 40, the first shock absorption layer 50, etc. from blocking the sound transmission between the sound pickup device 30 and the outside world.
  • the sealing member 40 between the first shock absorption layer 50 and the sound pickup device 30 for covering the sound pickup device 30 , the sound pickup device 30 is covered with the sealing member 40 , even if the sound pickup device is damped
  • the installation and disassembly of the structure can further alleviate the transmission of mechanical vibration between the housing side wall 11 and the pickup device 30 , and further reduce the influence of equipment vibration on the pickup accuracy and recognition accuracy of the pickup device 30 .
  • the number of the sealing members 40 matches the number of the sound pickup devices 30 .
  • the centerlines of the first sound collecting hole 31 , the hole 51 in the first shock absorbing layer, the hole 41 of the sealing member 40 and the second sound collecting hole 13 are located on the same straight line.
  • the center lines of the first sound pickup hole 31 , the hole 51 in the first shock absorbing layer, the hole 41 of the sealing member 40 and the second sound pickup hole 13 are arranged On the same straight line, the loss of the external sound in the process of transmitting the sound to the pickup device 30 can be effectively avoided, the efficiency of the external sound being transmitted to the pickup device 30 is improved, the sound pickup accuracy and recognition accuracy of the pickup device 30 are further improved, and the user is improved. user experience.
  • the center points of each second sound collecting hole 13 are located on the same horizontal line.
  • the number of the second sound pickup holes 13 provided on the housing matches the number of the first sound pickup holes 31 provided on the sound pickup device 30 , That is, each sound pickup device 30 corresponds to a second sound pickup hole 13 .
  • the centers are all set on the same horizontal line. Therefore, in order to correspond to the first sound-collecting holes 31, the center points of the second sound-collecting holes 13 on the housing of the shock-absorbing structure of the sound-collecting device are located on the same horizontal line.
  • At least one mounting hole 32 is respectively provided on both sides of each first sound pickup hole 31 , and the center point of the mounting hole 32 is the same as the center of the first sound pickup hole 31 .
  • the points are located on the same straight line; the mounting holes 32 are provided with fasteners, and the fasteners are used to fix the connection between the circuit board 20 and the housing.
  • At least one installation hole 32 is respectively provided on both sides of the first sound pickup hole 31 , and fasteners are arranged in the installation hole 32 .
  • the fixed connection between the circuit board 20 and the casing is completed by the fasteners, which further ensures the stability of the connection between the casing and the circuit board 20 in the shock absorption structure of the pickup device, thereby preventing the casing and the circuit board 20 when the equipment vibrates. Vibration caused by loose connections.
  • the mounting holes 32 are arranged close to the pickup device 30, so that the housing and the circuit board 20 near the pickup device 30 can be further pressed and fastened, so that the pickup device 30 is not affected by the vibration of the equipment as much as possible. Further, the center point of the installation hole 32 and the center point of the first sound pickup hole 31 are located on the same straight line, which can ensure the uniformity of the force of each sound pickup device 30 in the linear direction.
  • the fasteners may be components such as screws, staples, etc., which are used for fixed connection.
  • an adhesive can also be provided in the mounting hole 32, and the adhesive can be used to fix the connection, which can improve the sealing performance of the connection, and prevent external dust from entering the interior of the shock-absorbing structure of the pickup device.
  • a side of the circuit board 20 away from the sound pickup device 30 is provided with a screw 21 for connecting the circuit board 20 to the sound pickup device 30 .
  • the screw 21 is used to connect the pickup device 30 to the circuit board 20 .
  • the circuit board 20 is fixedly connected with the pickup device 30. Compared with methods such as bonding and welding, the stability of the connection between the circuit board 20 and the pickup device 30 is improved, and the connection between the circuit board 20 and the pickup device 30 is facilitated during maintenance. Disassembly and installation.
  • the sealing member 40 includes a silicone sleeve, and the silicone sleeve is sleeved on the pickup device 30 .
  • the sealing member 40 includes a silicone sleeve, and the silicone sleeve is provided with a groove matching the shape of the pickup device 30 , so that the silicone sleeve is sleeved on the pickup device 30 . Since the silicone sleeve has a certain elasticity, while sealing the pickup device 30 , it can absorb and slow down the mechanical vibration transmitted by the first shock absorbing layer 50 , thereby isolating the mechanical vibration of the side wall 11 from being transmitted to the pickup device 30 , thereby further improving the sound pickup device 30 Pickup accuracy and recognition accuracy.
  • the shock absorbing structure of the sound pickup device further includes a second shock absorbing layer 60 , and the second shock absorbing layer 60 is disposed between the peripheral wall 12 and the sealing member 40 .
  • a second damping layer 60 is also provided between the peripheral wall 12 and the sealing member 40 .
  • the mechanical vibration transmitted by the peripheral wall 12 can be absorbed and slowed by the second shock absorbing layer 60 , and the sound pickup device 30 can be effectively protected from mechanical vibration propagated longitudinally along the casing peripheral wall 12 , thereby improving the anti-resonance performance of the sound pickup device’s shock absorbing structure. , to avoid the vibration of the device from affecting the pickup accuracy and recognition accuracy of the pickup device when the pickup device is running, thereby improving the experience of the pickup device.
  • the second sound-collecting hole 13 in the direction from the end of the second sound-collecting hole 13 close to the first shock-absorbing layer 50 to the end far from the first shock-absorbing layer 50 , gradually moves toward the inside of the side wall 11 . extend, so that the diameter of one end away from the first shock absorbing layer 50 is larger than the diameter of the end close to the first shock absorbing layer 50; the diameter of the hole 51 in the first shock absorbing layer and the diameter of the hole 41 of the seal 40 are both smaller than or equal to the second The diameter of one end of the sound collecting hole 13 close to the first shock absorbing layer 50 is smaller than or equal to the diameter of the hole 51 in the first shock absorbing layer or the hole 41 of the sealing member 40 .
  • the second sound pickup hole 13 in the direction from the outside of the shock absorbing structure of the sound pickup device to the inside of the sound pickup device shock absorbing structure, the second sound pickup hole 13 , the hole 51 in the first shock absorbing layer, the seal
  • the hole 41 of the component 40 and the apertures of the first sound pickup hole 31 gradually become smaller, and at the same time, the cross-sectional shape of the second sound pickup hole 13 is a horn-like shape, so that the external sound can enter the sound pickup device.
  • the efficiency is improved, the efficiency of conducting external sound to the sound pickup device 30 is improved, and the sound pickup accuracy and recognition accuracy of the sound pickup device 30 are improved, thereby improving the user experience.
  • the materials for making the first shock absorbing layer 50 and the second shock absorbing layer 60 include at least one of polyurethane, silicone and rubber.
  • the materials for the first shock absorbing layer 50 and the second shock absorbing layer 60 can be made of materials with good elastic shock absorbing properties such as polyurethane, silicone and rubber, or a combination of the above materials can be used to make the first shock absorbing layer.
  • a shock absorbing layer 50 or a second shock absorbing layer 60 can be made of materials with good elastic shock absorbing properties such as polyurethane, silicone and rubber, or a combination of the above materials can be used to make the first shock absorbing layer.
  • a shock absorbing layer 50 or a second shock absorbing layer 60 can be made of materials with good elastic shock absorbing properties such as polyurethane, silicone and rubber, or a combination of the above materials can be used to make the first shock absorbing layer.
  • a shock absorbing layer 50 or a second shock absorbing layer 60 can be made of materials with good elastic shock absorbing properties such as polyurethane, silicone and rubber, or a combination of the above materials can be used to make the first shock absorbing layer.
  • the embodiments of the present application provide a sound pickup device, which includes the shock absorption structure of the sound pickup device provided by the above embodiments.
  • the pickup device since the circuit board of the shock absorption structure of the pickup device is surrounded by the side wall and the surrounding wall of the casing to form a cavity for accommodating the pickup device, the pickup device is covered with a sealing member, and the sound pickup device is covered with a sealing member.
  • a shock-absorbing layer is arranged between the seal and the side wall, so that the mechanical vibration transmitted from the casing to the pickup device is reduced, and the vibration of the equipment during the operation of the pickup device is prevented from affecting the pickup accuracy and recognition accuracy of the pickup device, thereby improving the performance of the pickup device. The experience of using the pickup device.
  • the circuit board and the side wall and surrounding walls of the housing form a cavity for accommodating the pickup device, and a shock absorbing device is provided between the pickup device and the side wall. layer, and the second sound pickup hole in the side wall, the hole in the first shock absorption layer and the first sound pickup hole provided by the pickup device are connected, so that the mechanical vibration transmitted from the casing to the pickup device is reduced, avoiding the operation of the equipment. , the vibration of the equipment affects the pickup accuracy and recognition accuracy of the pickup device.
  • At least one mounting hole 32 is respectively provided on both sides of the first pickup hole 31, and fasteners are arranged in the mounting hole 32,
  • the firmware completes the fixed connection between the circuit board 20 and the casing, which further ensures the stability of the connection between the casing and the circuit board 20 in the shock-absorbing structure of the pickup device, thereby preventing the damage between the casing and the circuit board 20 when the device vibrates. Loose connections cause vibrations.
  • the mounting hole 32 is arranged close to the pickup device 30, so that the housing and the circuit board 20 near the pickup device 30 can be further pressed and fastened, so as to prevent the pickup device 30 from being as large as possible. Affected by device vibration. Further, the center point of the installation hole 32 and the center point of the first sound pickup hole 31 are located on the same straight line, which can ensure the uniformity of the force of each sound pickup device 30 in the linear direction.
  • first and second are only used for descriptive purposes, and should not be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as “first” or “second” may expressly or implicitly include one or more of that feature. In the description of this application, unless stated otherwise, "plurality" means two or more.
  • the terms “installed”, “connected” and “connected” should be understood in a broad sense, for example, it may be a fixed connection or a detachable connection Connection, or integral connection; it can be directly connected, or indirectly connected through an intermediate medium, and it can be the internal communication of two elements.
  • installed should be understood in a broad sense, for example, it may be a fixed connection or a detachable connection Connection, or integral connection; it can be directly connected, or indirectly connected through an intermediate medium, and it can be the internal communication of two elements.

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Health & Medical Sciences (AREA)
  • Otolaryngology (AREA)
  • Casings For Electric Apparatus (AREA)
  • Fittings On The Vehicle Exterior For Carrying Loads, And Devices For Holding Or Mounting Articles (AREA)

Abstract

本申请实施例提供一种拾音装置减震结构及拾音设备。在该拾音装置减震结构中，电路板(20)与壳体的侧壁(11)及周壁(12)围合形成容纳拾音器件(30)的容腔，通过在拾音器件(30)与侧壁(11)之间设置第一减震层(50)，且侧壁(11)中的第二拾音孔(13)、第一减震层(50)中的孔道(51)和拾音器件(30)设置的第一拾音孔(31)连通，使得壳体传导至拾音器件(30)的机械振动减少，避免了设备运行时，设备的振动影响到拾音器件(30)的拾音精度和识别精度。

Description

拾音装置减震结构及拾音设备
本申请要求于2020年7月29日递交的中国专利申请第202010746676.0号的优先权，该中国专利申请的全文以引入的方式并入以作为本申请的一部分。
技术领域
本申请涉及拾音器件技术领域，具体而言，本申请涉及一种拾音装置减震结构及拾音设备。
背景技术
随着智能终端技术的发展，市场上出现了越来越多的具有语音交互功能的设备，语音交互功能需要通过麦克风接收用户发出的语音信息。现有市场上的具有语音交互功能的设备多是直接将麦克风与设备的结构硬件连接。
发明内容
第一个方面，本申请实施例提供了一种拾音装置减震结构，包括：
壳体，包括侧壁以及和侧壁连接的周壁；
电路板，与壳体固定连接，并与侧壁和周壁围合形成容腔；
至少一个拾音器件，位于容腔内，并与电路板电连接；
第一减震层，设置于侧壁与拾音器件之间；
侧壁中的第二拾音孔、第一减震层中的孔道和拾音器件设置的第一拾音孔连通。
可选地，拾音装置减震结构还包括至少一个密封件，密封件设置于第一减震层与拾音器件之间，用于覆盖拾音器件；
密封件的孔道与第一减震层中的孔道以及拾音器件设置的第一拾音孔连通。
可选的，第一拾音孔、第一减震层中的孔道、密封件的孔道以及第二拾音孔的中心线位于同一直线上。
可选的，在壳体上设置有至少两个第二拾音孔时，各个第二拾音孔的中心点位于同一水平线上。
可选的，每个第一拾音孔的两侧分别设置有至少一个安装孔，安装孔的中心点与第一拾音孔的中心点位于同一直线上；
安装孔内设置有紧固件，紧固件用于固定连接电路板与壳体。
可选的，电路板远离拾音器件的一侧设置有螺钉，用于使所述电路板与所述拾音器件连接。
可选的，密封件包括硅胶套，硅胶套套设于拾音器件。
可选的，拾音装置减震结构还包括第二减震层，设置于周壁与密封件之间。
可选的，在第二拾音孔靠近第一减震层一端到远离第一减震层一端的方向上，第二拾 音孔逐渐向侧壁的内部延伸，使得远离第一减震层一端的直径大于靠近第一减震层一端的直径；
第一减震层中孔道的直径与密封件的孔道的直径均小于或等于第二拾音孔靠近第一减震层一端的直径，第一拾音孔的直径小于或等于第一减震层中孔道或密封件的孔道的直径。
可选的，第一减震层和第二减震层的制作材料包括聚氨酯、硅胶和橡胶中的至少一种。
第二个方面，本申请实施例提供了一种拾音设备，包括上述第一方面所提供的拾音装置减震结构。
附图说明
本申请上述的和/或附加的方面和优点从下面结合附图对实施例的描述中将变得明显和容易理解，其中：
图1为本申请实施例提供的一种拾音装置减震结构的结构示意图；
图2为本申请实施例提供的另一种拾音装置减震结构的结构示意图。
附图标记说明：
11-侧壁；12-周壁；13-第二拾音孔；
20-电路板；21-螺钉；
30-拾音器件；31-第一拾音孔；32-安装孔；
40-密封件；41-密封件40的孔道；
50-第一减震层；51-第一减震层50的孔道；
60-第二减震层。
具体实施方式
下面详细描述本申请，本申请的实施例的示例在附图中示出，其中自始至终相同或类似的标号表示相同或类似的部件或具有相同或类似功能的部件。此外，如果已知技术的详细描述对于示出的本申请的特征是不必要的，则将其省略。下面通过参考附图描述的实施例是示例性的，仅用于解释本申请，而不能解释为对本申请的限制。
本技术领域技术人员可以理解，除非另外定义，这里使用的所有术语(包括技术术语和科学术语)，具有与本申请所属领域中的普通技术人员的一般理解相同的意义。还应该理解的是，诸如通用字典中定义的那些术语，应该被理解为具有与现有技术的上下文中的意义一致的意义，并且除非像这里一样被特定定义，否则不会用理想化或过于正式的含义来解释。
本技术领域技术人员可以理解，除非特意声明，这里使用的单数形式“一”、“一个”、“所述”和“该”也可包括复数形式。应该进一步理解的是，本申请的说明书中使用的措辞“包括”是指存在所述特征、整数、步骤、操作、元件和/或组件，但是并不排除存在或添加一个或多个其他特征、整数、步骤、操作、元件、组件和/或它们的组。应该理解，当我们称元件被“连接”或“耦接”到另一元件时，它可以直接连接或耦接到其他元件，或 者也可以存在中间元件。此外，这里使用的“连接”或“耦接”可以包括无线连接或无线耦接。这里使用的措辞“和/或”包括一个或更多个相关联的列出项的全部或任一单元和全部组合。
由于现有市场上的具有语音交互功能的设备多是直接将麦克风与设备的结构硬件连接，这使得麦克风受设备的影响比较大，特别是，设备运行时，设备的振动会传播到麦克风就会影响麦克风的拾音精度和识别精度。现有麦克风的常规减震结构已经不能避免麦克风出现拾音谐振的问题，从而影响用户的使用体验。
本申请针对现有方式的缺点，提出一种拾音装置减震结构及拾音设备，用以解决现有技术存在具有语音交互功能的设备中麦克风出现拾音谐振的技术问题。
本申请实施例提供的技术方案带来的有益技术效果包括：
在本申请实施例提供的一种拾音装置减震结构中，电路板与壳体的侧壁及周壁围合形成容纳拾音器件的容腔，通过在拾音器件与侧壁之间设置减震层，且侧壁中的第二拾音孔、第一减震层中的孔道和拾音器件设置的第一拾音孔连通，使得壳体传导至拾音器件的机械振动减少，避免了设备运行时，设备的振动影响到拾音器件的拾音精度和识别精度。
本申请附加的方面和优点将在下面的描述中部分给出，这些将从下面的描述中变得明显，或通过本申请的实践了解到。
下面以具体地实施例对本申请的技术方案以及本申请的技术方案如何解决上述技术问题进行详细说明。
本申请实施例提供了一种拾音装置减震结构，该拾音装置减震结构的结构示意图如图1所示，包括：壳体，壳体包括侧壁11以及和与侧壁11连接的周壁12；电路板20，与壳体固定连接，并与侧壁11和周壁12围合形成容腔；至少一个拾音器件30，位于容腔内，并与电路板20电连接；第一减震层50，设置于侧壁11与拾音器件30之间；拾音器件30设置有第一拾音孔31，侧壁11中的第二拾音孔13、第一减震层50中的孔道51和拾音器件30设置的第一拾音孔31连通。
在本申请实施例提供的一种拾音装置减震结构中，电路板与壳体的侧壁及周壁围合形成容纳拾音器件的容腔，通过在拾音器件与侧壁之间设置减震层，且侧壁中的第二拾音孔、第一减震层中的孔道和拾音器件设置的第一拾音孔连通，使得壳体传导至拾音器件的机械振动减少，避免了设备运行时，设备的振动影响到拾音器件的拾音精度和识别精度。
具体的，本申请实施例提供的拾音装置减震结构，通过电路板20与壳体的侧壁11及周壁12围合形成容腔，拾音器件30设置于容腔内，并与电路板20电连接，电路板20、侧壁11及周壁12可以很好地隔绝外界对拾音器件30的不良影响，因此，容腔可有效保护位于其中的拾音器件30。拾音器件30与侧壁11之间设置有第一减震层50，通过第一减震层50填充拾音器件30与侧壁11之间的容腔，可以缓解壳体侧壁11与拾音器件30之间机械振动的传播，降低了设备振动对拾音器件30的拾音精度和识别精度的影响；同时，第一减震层50填充拾音器件30与侧壁11之间，当设备受到外力撞击时，可以有效缓冲侧壁11和周壁12，达到保护拾音器件30的目的。
在本申请的一个实施例中，拾音装置减震结构还包括至少一个密封件40，密封件40设置于第一减震层50与拾音器件30之间，用于覆盖拾音器件30。密封件40的孔道41与第一减震层50中的孔道51和拾音器件30设置的第一拾音孔31连通，以确保拾音器件30发出的声音可以正常传播以及外界的声音可以正常被拾音器件30所识别，避免密封件40、第一减震层50等阻挡拾音器件30与外界之间的声音传播。
需要说明的是，通过在第一减震层50与拾音器件30之间设置用于覆盖拾音器件30的密封件40，使得拾音器件30上罩设有密封件40，即便于拾音装置减震结构的安装与拆卸，又可以进一步缓解壳体侧壁11与拾音器件30之间机械振动的传播，进一步降低了设备振动对拾音器件30的拾音精度和识别精度的影响。本申请实施例中，密封件40的数量与拾音器件30的数量相匹配。
在本申请的一个实施例中，第一拾音孔31、第一减震层中的孔道51、密封件40的孔道41以及第二拾音孔13的中心线位于同一直线上。
本申请实施例提供的拾音装置减震结构中，通过将第一拾音孔31、第一减震层中的孔道51、密封件40的孔道41以及第二拾音孔13的中心线设置于同一直线上，可有效避免外界声音在传导至拾音器件30的过程中发生的损耗，提高外界声音传导至拾音器件30的效率，进一步提高拾音器件30的拾音精度和识别精度，从而提高用户的使用体验。
在本申请的一个实施例中，在壳体上设置有至少两个第二拾音孔13时，各个第二拾音孔13的中心点位于同一水平线上。
需要说明的是，本申请实施例提供的拾音装置减震结构中，壳体上设置的第二拾音孔13的数量与拾音器件30上设置的第一拾音孔31的数量相匹配，即每个拾音器件30对应有一个第二拾音孔13。为了保障多个拾音器件30的拾音效果，实际生产应用中，如图2所示，为拾音装置减震结构去除壳体的结构示意图，多个拾音器件30的第一拾音孔31的中心均设置于同一水平直线上，因此，为了与第一拾音孔31相对应，拾音装置减震结构的壳体上的各个第二拾音孔13的中心点位于同一水平线上。
在本申请的一个实施例中，如图2所示，每个第一拾音孔31的两侧分别设置有至少一个安装孔32，安装孔32的中心点与第一拾音孔31的中心点位于同一直线上；安装孔32内设置有紧固件，紧固件用于固定连接电路板20与壳体。
需要说明的是，本申请实施例提供的拾音装置减震结构中，通过在第一拾音孔31的两侧分别设置有至少一个安装孔32，并通过在安装孔32内设置紧固件，通过紧固件完成电路板20与壳体的固定连接，进一步保障了拾音装置减震结构中壳体与电路板20连接的稳定性，进而避免当设备振动时，壳体与电路板20之间因连接松动导致振动现象。而且，安装孔32靠近拾音器件30设置，从而可以进一步压迫紧固拾音器件30附近的壳体与电路板20，避免拾音器件30尽可能不受到设备振动的影响。进一步的，安装孔32的中心点与第一拾音孔31的中心点位于同一直线上，这样设置可以保障在线性方向上，各个拾音器件30的受力的均匀性。
本技术领域人员理解的是，本申请实施例提供的拾音装置减震结构中，紧固件可以是 螺钉、卡钉等用于固定连接的零器件。需要进一步说明的是，还可以在安装孔32内设置粘结剂，通过粘结剂固定连接，可以提高连接处的密封性，避免外界灰尘进入到拾音装置减震结构的内部之中。
在本申请的一个实施例中，电路板20远离拾音器件30的一侧设置有螺钉21，用于使电路板20与拾音器件30连接。
由于拾音器件30的体积较大，具有一定的重量，为了避免设备晃动或撞击过程中，拾音器件30与电路板20分离，本申请实施例提供的拾音装置减震结构中，通过螺钉21将电路板20与拾音器件30固定连接，相较于粘结、焊接等方式，即提高了电路板20与拾音器件30之间连接的稳定性，又便于维修过程中电路板20与拾音器件30的拆卸与安装。
在本申请的一个实施例中，密封件40包括硅胶套，硅胶套套设于拾音器件30。
本申请实施例提供的拾音装置减震结构中，密封件40包括硅胶套，硅胶套设置有与拾音器件30形状相匹配的凹槽，从而使得硅胶套套设于拾音器件30上。由于硅胶套具有一定的弹性，在密封拾音器件30的同时，可以吸收减缓第一减震层50传导的机械振动，进而隔绝侧壁11的机械振动传导至拾音器件30，进一步提高了拾音器件30的拾音精度和识别精度。
在本申请的一个实施例中，拾音装置减震结构还包括第二减震层60，第二减震层60设置于周壁12与密封件40之间。
本申请实施例提供的拾音装置减震结构中，在周壁12与密封件40之间也设置有第二减震层60。这样设置，可以通过第二减震层60吸收减缓周壁12传导的机械振动，有效保障拾音器件30免受到沿壳体周壁12纵向传播的机械振动，从而提高了拾音装置减震结构防谐振性能，避免了拾音设备运行时，设备的振动影响到拾音器件的拾音精度和识别精度，从而提高了拾音设备的使用体验。
在本申请的一个实施例中，在第二拾音孔13靠近第一减震层50一端到远离第一减震层50一端的方向上，第二拾音孔13逐渐向侧壁11的内部延伸，使得远离第一减震层50一端的直径大于靠近第一减震层50一端的直径；第一减震层中孔道51的直径与密封件40的孔道41的直径均小于或等于第二拾音孔13靠近第一减震层50一端的直径，第一拾音孔13的直径小于或等于第一减震层中孔道51或密封件40的孔道41的直径。
需要说明的是，如图1所示，在从拾音装置减震结构的外部到拾音装置减震结构内部的方向上，第二拾音孔13、第一减震层中孔道51、密封件40的孔道41和第一拾音孔31的孔径逐渐变小，同时，第二拾音孔13的截面形状为喇叭状，这样设置，可以提高外界声音进入到拾音装置减震结构内部的效率，提高外界声音传导至拾音器件30的效率，提高拾音器件30的拾音精度和识别精度，从而提高用户的使用体验。
在本申请的一个实施例中，第一减震层50和第二减震层60的制作材料包括聚氨酯、硅胶和橡胶中的至少一种。
需要说明的是，第一减震层50和第二减震层60的制作材料可以采用聚氨酯、硅胶以及橡胶等具有很好弹性减震性能的材料制成，也可是采用上述材料组合制成第一减震层50 或第二减震层60。
根据本申请的构思，本申请实施例提供了一种拾音设备，包括上述各个实施例所提供的拾音装置减震结构。
在本申请实施例提供的拾音设备中，由于拾音装置减震结构的电路板与壳体的侧壁及周壁围合形成容纳拾音器件的容腔，拾音器件上覆盖有密封件，通过在密封件与侧壁之间设置减震层，使得壳体传导至拾音器件的机械振动减少，避免了拾音设备运行时，设备的振动影响到拾音器件的拾音精度和识别精度，从而提高了拾音设备的使用体验。
应用本申请实施例，至少能够实现如下有益效果：
1、本申请实施例提供的一种拾音装置减震结构中，电路板与壳体的侧壁及周壁围合形成容纳拾音器件的容腔，通过在拾音器件与侧壁之间设置减震层，且侧壁中的第二拾音孔、第一减震层中的孔道和拾音器件设置的第一拾音孔连通，使得壳体传导至拾音器件的机械振动减少，避免了设备运行时，设备的振动影响到拾音器件的拾音精度和识别精度。
2、本申请实施例提供的拾音装置减震结构中，通过在第一拾音孔31的两侧分别设置有至少一个安装孔32，并通过在安装孔32内设置紧固件，通过紧固件完成电路板20与壳体的固定连接，进一步保障了拾音装置减震结构中壳体与电路板20连接的稳定性，进而避免当设备振动时，壳体与电路板20之间因连接松动导致振动现象。
3、本申请实施例提供的拾音装置减震结构中，安装孔32靠近拾音器件30设置，从而可以进一步压迫紧固拾音器件30附近的壳体与电路板20，避免拾音器件30尽可能不受到设备振动的影响。进一步的，安装孔32的中心点与第一拾音孔31的中心点位于同一直线上，这样设置可以保障在线性方向上，各个拾音器件30的受力的均匀性。
在本申请的描述中，需要理解的是，术语“中心”、“上”、“下”、“前”、“后”、“左”、“右”、“竖直”、“水平”、“顶”、“底”、“内”、“外”等指示的方位或位置关系为基于附图所示的方位或位置关系，仅是为了便于描述本申请和简化描述，而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作，因此不能理解为对本申请的限制。
术语“第一”、“第二”仅用于描述目的，而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此，限定有“第一”、“第二”的特征可以明示或者隐含地包括一个或者更多个该特征。在本申请的描述中，除非另有说明，“多个”的含义是两个或两个以上。
在本申请的描述中，需要说明的是，除非另有明确的规定和限定，术语“安装”、“相连”、“连接”应做广义理解，例如，可以是固定连接，也可以是可拆卸连接，或一体地连接；可以是直接相连，也可以通过中间媒介间接相连，可以是两个元件内部的连通。对于本领域的普通技术人员而言，可以具体情况理解上述术语在本申请中的具体含义。
在本说明书的描述中，具体特征、结构、材料或者特点可以在任何的一个或多个实施例或示例中以合适的方式结合。
以上所述仅是本申请的部分实施方式，应当指出，对于本技术领域的普通技术人员来 说，在不脱离本申请原理的前提下，还可以做出若干改进和润饰，这些改进和润饰也应视为本申请的保护范围。

Claims (11)

  1. 一种拾音装置减震结构，包括：
    壳体，包括侧壁以及和所述侧壁连接的周壁；
    电路板，与所述周壁固定连接，并与所述侧壁和所述周壁围合形成容腔；
    至少一个拾音器件，位于所述容腔内，并与所述电路板电连接；以及
    第一减震层，设置于所述侧壁与所述拾音器件之间；
    其中，所述侧壁中的第二拾音孔、所述第一减震层中的孔道和所述拾音器件设置的第一拾音孔连通。
  2. 根据权利要求1所述的拾音装置减震结构，还包括：
    至少一个密封件，所述密封件设置于所述第一减震层与所述拾音器件之间，用于覆盖所述拾音器件；
    其中，所述密封件的孔道与所述第一减震层中的孔道以及所述拾音器件设置的第一拾音孔连通。
  3. 根据权利要求2所述的拾音装置减震结构，其中，所述第一拾音孔、所述第一减震层中的孔道、所述密封件的孔道以及所述第二拾音孔的中心线位于同一直线上。
  4. 根据权利要求1～3任一项所述的拾音装置减震结构，其中，在所述侧壁上设置有至少两个所述第二拾音孔时，各个所述第二拾音孔的中心点位于同一水平线上。
  5. 根据权利要求1～4任一项所述的拾音装置减震结构，其中，每个所述第一拾音孔的两侧分别设置有至少一个安装孔，所述安装孔的中心点与所述第一拾音孔的中心点位于同一直线上；
    其中，所述安装孔内设置有紧固件，所述紧固件用于固定连接所述电路板与所述壳体。
  6. 根据权利要求1～5任一项所述的拾音装置减震结构，其中，所述电路板远离所述拾音器件的一侧设置有螺钉，用于使所述电路板与所述拾音器件连接。
  7. 根据权利要求2或3所述的拾音装置减震结构，其中，所述密封件包括硅胶套，所述硅胶套套设于所述拾音器件。
  8. 根据权利要求2、3以及7中任一项所述的拾音装置减震结构，还包括第二减震层，其中，所述第二减震层设置于所述周壁与所述密封件之间。
  9. 根据权利要求2、3、7以及8中任一项所述的拾音装置减震结构，其中，在所述第二拾音孔靠近所述第一减震层一端到远离所述第一减震层一端的方向上，所述第二拾音孔逐渐向所述侧壁的内部延伸，使得远离所述第一减震层一端的直径大于靠近所述第一减震层一端的直径；
    所述第一减震层中孔道的直径与所述密封件的孔道的直径均小于或等于所述第二拾音孔靠近所述第一减震层一端的直径，所述第一拾音孔的直径小于或等于所述第一减震层中孔道或所述密封件的孔道的直径。
  10. 根据权利要求8所述的拾音装置减震结构，其中，所述第一减震层和所述第二减 震层的制作材料包括聚氨酯、硅胶和橡胶中的至少一种。
  11. 一种拾音设备，包括权利要求1-10中任一项所述的拾音装置减震结构。
PCT/CN2021/093606 2020-07-29 2021-05-13 拾音装置减震结构及拾音设备 Ceased WO2022022004A1 (zh)

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