WO2022017206A1 - 一种半宽节点和电子设备 - Google Patents

一种半宽节点和电子设备 Download PDF

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Publication number
WO2022017206A1
WO2022017206A1 PCT/CN2021/105630 CN2021105630W WO2022017206A1 WO 2022017206 A1 WO2022017206 A1 WO 2022017206A1 CN 2021105630 W CN2021105630 W CN 2021105630W WO 2022017206 A1 WO2022017206 A1 WO 2022017206A1
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WO
WIPO (PCT)
Prior art keywords
width
node
electronic device
width node
along
Prior art date
Application number
PCT/CN2021/105630
Other languages
English (en)
French (fr)
Inventor
李敏
牛元君
李安
周海浩
刘志泉
Original Assignee
华为技术有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 华为技术有限公司 filed Critical 华为技术有限公司
Priority to BR112023001038A priority Critical patent/BR112023001038A2/pt
Priority to EP21847426.0A priority patent/EP4175429A4/en
Publication of WO2022017206A1 publication Critical patent/WO2022017206A1/zh

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1485—Servers; Data center rooms, e.g. 19-inch computer racks
    • H05K7/1488—Cabinets therefor, e.g. chassis or racks or mechanical interfaces between blades and support structures
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1485—Servers; Data center rooms, e.g. 19-inch computer racks
    • H05K7/1487—Blade assemblies, e.g. blade cases or inner arrangements within a blade
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1485—Servers; Data center rooms, e.g. 19-inch computer racks
    • H05K7/1488—Cabinets therefor, e.g. chassis or racks or mechanical interfaces between blades and support structures
    • H05K7/1489—Cabinets therefor, e.g. chassis or racks or mechanical interfaces between blades and support structures characterized by the mounting of blades therein, e.g. brackets, rails, trays

Definitions

  • the present application relates to the technical field of electronic equipment, and in particular, to a half-width node and electronic equipment.
  • a server usually includes a frame and nodes arranged in the frame. When the server has more functions, there are usually more nodes. Therefore, many servers include a frame and multiple pluggable nodes mounted on the frame. Power supply and signal interconnection between multiple nodes is achieved through a backplane, and heat dissipation components are used to dissipate heat from the multiple nodes.
  • Nodes are divided into full-width nodes and half-width nodes according to different installation forms or sizes.
  • a full-width node means that the width of the node is roughly the same as the width of the server frame, and only one full-width node can be installed on each layer of the server;
  • half-width node means that the width of the node is roughly half the width of the server frame, and the server Two half-width nodes can be installed per layer.
  • Half-width nodes are more flexible than full-width nodes, so they are the most commonly used node form in current server settings.
  • the width of the circuit board when using the half-width node is less than half the width of the circuit board when using the full-width node. That is, when the frame size is given, the capacity of two half-width nodes to accommodate the placement electronics is weaker than the capacity of one full-width node to accommodate placement of the electronics. Therefore, when a half-width node is used, the integration of the server is greatly reduced, which also becomes a bottleneck in the use of half-width nodes.
  • the present application provides a half-width node and an electronic device, so as to increase the overall size of the node installed in the electronic device and improve the integration degree of the electronic device.
  • the present application provides a half-width node
  • the half-width node includes a handle bar and a circuit board
  • the circuit board is fixed to the handle bar
  • the handle bar and the circuit board are arranged in a first direction, so that the half-width node is The wide node mounts to the frame of the electronic device.
  • the above-mentioned half-width node includes a first part and a second part.
  • the first part includes a part of the handle strip and a part of the circuit board
  • the second part includes another part of the handle strip and another part of the circuit board.
  • the first part and the second part pass through the half-width node along the first direction, and the height of the first part along the second direction is smaller than the height of the second part along the second direction.
  • the above-mentioned first direction is the insertion direction when the half-width node is used
  • the second direction is the direction perpendicular to the surface of the circuit board.
  • the first parts of the adjacent half-width nodes can be partially overlapped, so that the width of the half-width nodes along the third direction can be designed to be larger, and the third direction is perpendicular to the first part. direction and the second direction. It is beneficial to increase the number of electronic devices that can be accommodated by the half-width node, improve the hardware capability of the half-width node, and further improve the integration degree of electronic devices.
  • the height of the first portion of the half-width node along the second direction may be less than half of the height of the second portion along the second direction.
  • the first part also needs to have a support structure, and along the second direction, the support structure occupies a certain height.
  • the heights of the electronic devices arranged on the circuit board are different.
  • the electronic device with a higher height along the second direction is arranged in the second area, and the electronic device with a lower height along the second direction is arranged in the first area. In order to make the first regions of two adjacent half-width nodes overlap.
  • the width W1 of the first part of the half-width node along the third direction and the width W of the half-width node along the third direction satisfy: 5% ⁇ W ⁇ W1 ⁇ 20% ⁇ W. Therefore, while two adjacent half-width nodes can have a certain overlapping area, the size of the second part of the half-width nodes can also be sufficient to set up electronic devices with a higher height.
  • the present application further provides an electronic device including a frame and the half-width node in any of the above technical solutions.
  • the frame includes at least one row of slots, each row of slots includes two parallel slots, and the half-width nodes are installed in the slots.
  • the half-width nodes installed in the two side-by-side slots are defined as a first half-width node and a second half-width node, respectively.
  • the first portion of the first half-width node and the first portion of the second half-width node overlap along the second direction.
  • the sum of the widths of the first half-width node and the second half-width node in the two side-by-side slots along the third direction is greater than the width of the full-width node installed under the same conditions, which is beneficial to increase the capacity of the half-width node. increase the number of electronic devices and improve the integration of electronic devices.
  • the frame is also fixed with an S-shaped bracket, and the S-shaped bracket is located between two parallel slots, so that the first part of the half-width node can be installed on the S-shaped bracket.
  • the S-shaped bracket may have an installation slot, and along the second direction, every two installation slots correspond to one slot position, and the directions of the adjacent two installation slots are opposite to respectively install the first half-width node and the second half-width node. wide node.
  • the S-shaped bracket can realize the overlapping installation structure of the first part of the first half-width node and the second half-width node, and is also beneficial to improve the stability of the installation of the half-width node.
  • the above-mentioned S-shaped bracket includes card slots corresponding to the slots one-to-one.
  • the handle bar of the half-width node has a wrench, and the wrench can be clamped in the above-mentioned slot to lock the half-width node in the slot of the frame.
  • a slideway for installing the half-width node is also provided, and the first part of the half-width node has a sliding structure adapted to the above-mentioned slideway, so as to facilitate the sliding assembly of the half-width node on the S-shaped bracket. inside the bracket.
  • the S-shaped bracket can be integrated with the frame, that is, the frame with the S-shaped bracket is directly prepared.
  • the above-mentioned S-shaped bracket can also be detachably mounted on the frame, for example, by screws.
  • the S-shaped bracket can be prepared first, and after the slideway and other structures that the S-shaped bracket needs to be installed are installed, the S-shaped bracket can be installed on the frame, which is also convenient for maintaining the S-shaped bracket.
  • the above-mentioned S-shaped bracket can also be welded to the frame, or the S-shaped bracket can be prepared first, and then the S-shaped bracket can be installed on the frame.
  • the above-mentioned circuit board is provided with a plurality of electronic devices.
  • the first half-width node and the second half-width node are installed, along the second direction, the first half-width node can have the orientation of one side of the electronic device, which is different from the second half-width node.
  • the side of the wide node with the electronics is oriented opposite.
  • the first half-width node has the first part with the side of the electronic device facing the second half-width node
  • the second half-width node has the first part with the side of the electronic device facing the first half-width node. That is to say, the first half-width node and the second half-width node are inserted forward and backward, so as to fully utilize the space of the slot along the second direction, and improve the integration degree of the electronic device.
  • the structures of the first half-width node and the second half-width node may be the same, which means that the specifications of the first half-width node and the second half-width node may be the same, but the specific electronic devices included in the half-width node may be the same Or different, can be designed according to actual product requirements.
  • This solution can fabricate half-width nodes of the same specification, thereby facilitating the simplification of the fabrication process of the half-width nodes.
  • the types of electronic devices in the embodiments of the present application are not specifically limited, and may be computing devices, network devices, or storage devices, and the technical solutions in the embodiments of the present application are all applicable.
  • FIG. 1 is a schematic structural diagram of an electronic device in the prior art
  • FIG. 2 is a schematic structural diagram of an electronic device in an embodiment of the application.
  • FIG. 3 is a schematic top-view structure diagram of a half-width node in an embodiment of the present application.
  • FIG. 4 is a schematic cross-sectional structure diagram of a half-width node in an embodiment of the present application.
  • FIG. 5 is a schematic diagram of an installation structure of a half-width node in an embodiment of the present application.
  • FIG. 6 is a schematic structural diagram of a framework in an embodiment of the application.
  • FIG. 7 is a schematic structural diagram of the cooperation of the half-width node and the S-shaped bracket according to the embodiment of the present application.
  • FIG. 8 is a schematic diagram of an installation structure of a half-width node in an embodiment of the present application.
  • the half-width node provided by the embodiments of the present application can be applied to any electronic device that requires a half-width node, and the electronic device may specifically be a computing device (such as a server), a network device (such as a switch), and a storage device (such as a storage array).
  • the above electronic device may include a frame and half-width nodes arranged in the frame, and two half-width nodes may be installed in each row in the frame.
  • the above-mentioned half-width node includes a circuit board on which a plurality of electronic devices are arranged, and each half-width node is electrically connected through a backplane to realize the function of the electronic device.
  • the hardware capability of the half-width node directly affects the integration degree of electronic devices. As the functions of electronic devices become more and more abundant, improving the integration degree is an important goal of electronic devices at present.
  • the electronic device in the prior art includes a frame 1 and a half-width node 2.
  • the middle of the frame 1 includes a rectangular bracket 11
  • the half-width node 2 is installed between the rectangular bracket 11 and the frame 1 .
  • the rectangular support 11 occupies a certain space in the width direction of the frame 1, so the size of the half-width node 2 is designed to be smaller.
  • the width of the two half-width nodes 2 is significantly smaller than the width of a full-width node.
  • each half-width node 2 is relatively small, and the number of electronic devices 23 that can be accommodated and arranged is also relatively low, the hardware capability is poor, and the integration degree of electronic devices is relatively high.
  • the present application provides a half-width node and an electronic device, so as to increase the size of the half-width node 2, increase the number of electronic devices 23 that can be accommodated in the half-width node 2, and improve the integration degree of the electronic device.
  • references in this specification to "one embodiment” or “a particular embodiment” or the like mean that a particular feature, structure, or characteristic described in connection with the embodiment is included in one or more embodiments of the present application.
  • the terms “including”, “including”, “having” and variations thereof mean “including but not limited to” unless specifically emphasized otherwise.
  • FIG. 2 is a schematic structural diagram of an electronic device in an embodiment of the present application. Please refer to FIG. 2.
  • the electronic device in an embodiment of the present application includes a frame 1 and a half-width node 2 installed in the frame 1, wherein the frame 1 includes at least A row of slots 12 , each row of slots 12 includes two slots 12 , and the half-width nodes 2 are installed in the slots 12 .
  • FIG. 3 is a schematic top-view structure diagram of a half-width node in an embodiment of the application
  • FIG. 4 is a schematic cross-sectional structure diagram of a half-width node in an embodiment of the application
  • FIG. 5 is an installation structure of a half-width node in an embodiment of the application Schematic.
  • the half-width node 2 in the embodiment of the present application includes a handle bar 21 and a circuit board 22 fixed on the handle bar 21
  • an electronic device 23 is disposed on the circuit board 22 , such as a central processing unit
  • the structure of the device CPU, memory stick and hard disk can be realized.
  • the half-width node 2 When the half-width node 2 is installed on the frame 1, insert the circuit board 22 into the slot 12 of the frame 1, the insertion direction of the half-width node 2 is the first direction X, and the direction perpendicular to the surface of the circuit board 22 is the second direction Y.
  • the half-width node 2 includes a first portion 24 and a second portion 25 , the first portion 24 and the second portion 25 penetrate the half-width node 2 along the first direction X, and the height of the first portion 24 along the second direction Y is smaller than that of the second portion 24 .
  • the height of the portion 25 along the second direction Y In the figure, the dotted line is used as a schematic line to distinguish the first part 24 and the second part 25.
  • the handle bar 21 includes both the part located at the first part 24 and the part located at the second part 25 ;
  • the circuit board 22 includes both the part located at the first part 24 and the part located at the second part 25 .
  • the first part 24 includes a part of the handle bar 21 and also a part of the circuit board 22
  • the second part 25 includes another part of the handle bar and also another part of the circuit board 22 .
  • half-width node 2 When installing the above-mentioned half-width node 2 to the frame 1 of the electronic device, one half-width node 2 can be installed in each slot 12, and then two half-width nodes 2 are installed in each row of slots 12 of the frame 1.
  • the half-width nodes 2 located in the two parallel slots 12 are respectively a first half-width node 26 and a second half-width node 27 .
  • the first portion 24 of the first half-width node 26 faces the second half-width node 27
  • the first portion 24 of the second half-width node 27 faces the first half-width node 26
  • the first portion of the first half-width node 26 24 and the first portion 24 of the second half-width node 27 at least partially overlap in the second direction Y.
  • the half-width node 2 since the height of the first portion 24 of the half-width node 2 along the second direction Y is smaller than the height of the second portion 25 along the second direction Y, the half-width node 2 is installed in the side-by-side slot 12 when the half-width node 2 is installed. , the first portions 24 of the two half-width nodes 2 side by side may at least partially overlap. Please refer to FIG.
  • the third direction Z is the width direction of the half-width node 2 , then the first half-width node 26 and the second half-width node 26 27 In the third direction Z, a section of area can be shared, and the sum of the width of the side-by-side first half-width nodes 26 along the third direction Z and the width of the second half-width node 27 along the third direction Z can be larger than the frame 1 can be installed.
  • the width of the first half-width node 26 along the third direction Z is L1
  • the width of the second half-width node 27 along the third direction Z is L2.
  • the width of the three directions Z is L, then, L1+L2>L. Therefore, compared with the prior art, the electronic device in this solution adopts the structure of the half-width node 2, and when the size of the frame 1 remains unchanged, the sum of the widths of the two half-width nodes 2 is not only not smaller than the full-width node 3
  • the width is larger than the width of the full-width node 3. Therefore, the half-width node 2 in this solution can accommodate and set many electronic devices 23, and the hardware capability is relatively strong, which is beneficial to improve the integration degree of the electronic device.
  • the electronic device 23 with a higher height along the second direction Y can be selected to be arranged on the second part 25.
  • the electronic device 23 with a lower height along the second direction Y is disposed in the first part 24; that is, the height of the electronic device 23 in the first part 24 of the half-width node 2 along the second direction Y is smaller than that of the second part 25
  • the height of the electronic device 23 along the second direction Y After each device is arranged according to the height, it does not affect its work.
  • the electronic device 23 can be electrically connected according to the function by using the wiring of the circuit board 22 . Therefore, the height of the first portion 24 along the second direction Y is smaller than the height of the second portion 25 along the second direction Y.
  • the heights of all the electronic devices 23 of the first part 24 along the second direction Y are not required to be smaller than the heights of all the electronic devices 23 of the second part 25 along the second direction Y.
  • the height of the highest electronic device 23 of the first part 24 is smaller than the height of the highest electronic device 23 of the second part 25 .
  • the height of the individual electronic devices 23 in the second portion 25 is also allowed to be smaller than the height of the individual electronic devices 23 in the first portion 24 .
  • the height of the first portion 24 along the second direction Y may be less than half of the height of the second portion 25 along the second direction Y.
  • the side corresponding to the first part 24 needs to have a structure for supporting the half-width node 2, such as the S-shaped bracket 13, the frame 1 needs to occupy a certain space in the second direction Y.
  • the sum of the heights occupied by the first half-width node 26 and the second half-width node 27 on the first part 24 along the second direction Y It is not greater than the height of the second portion 25 of the half-width node 2 along the second direction Y.
  • the size of the slot 12 is designed based on the height of the second portion 25, and each half-width node 2 is installed, which can increase the installation density of the half-width node 2 and improve the integration of electronic equipment.
  • the width W1 of the first part 24 of the half-width node 2 along the third direction Z can be satisfied with the width W of the half-width node 2 along the third direction Z : 5% ⁇ W ⁇ W1 ⁇ 20% ⁇ W.
  • the width of the first portion 24 of the half-width node 2 along the third direction Z accounts for 5% to 20% of the total width of the half-width node 2, and may be 6%, 7%, 8%, 10%, 12%, 15% in particular , 17%, 18%, or 19%, etc., the ratio is not specifically limited, and two adjacent half-width nodes 2 can have more overlapping areas.
  • the area of the second part 25 is sufficient for arranging high-height electronic devices to meet the functions of the electronic equipment.
  • FIG. 6 is a schematic structural diagram of the frame in the embodiment of the application. Please refer to FIG. 6.
  • an S-shaped bracket 13 is provided in the middle of the frame 1 along the third direction Z, and the S-shaped bracket 13 is located in parallel Between the two slots 12 , the first part 24 of the half-width node 2 is installed.
  • the S-shaped bracket 13 and the side wall of the edge of the frame 1 form a slot 12 .
  • the S-shaped bracket 13 has two installation slots 131 corresponding to each row of slots 12 , and the two installation slots 131 face the slots 12 on both sides respectively.
  • the above-mentioned installation groove 131 is matched with the first part 24 , and the first part 24 extends into the above-mentioned installation groove 131 .
  • the S-shaped bracket 13 can be used to realize the overlapping installation of the first parts 24 of the two parallel half-width nodes 2, and the reliability is high.
  • the width of the installation groove 131 along the third direction Z is not greater than the width of the first part 24 of the half-width node 2 along the third direction Z, so that the first part 24 can be installed to the installation groove 131 along the third direction bottom of Z.
  • the width of the installation groove 131 along the third direction Z may be no greater than 5 mm from the width of the first portion 24 of the half-width node 2 along the third direction Z. Therefore, the compactness of the structure of the electronic device can be improved, and the first parts 24 of the adjacent half-width nodes 2 can be overlapped as much as possible, so as to improve the integration degree of the electronic device.
  • the installation groove 131 of the above-mentioned S-shaped bracket 13 is also provided with a slideway that is slidably adapted to the half-width node 2.
  • the half-width node 2 also has a sliding structure adapted to the above-mentioned slideway.
  • the side walls of the edge of the frame 1 may also have slideways, and both sides of the half-width node 2 are installed in the slot 12 through a sliding structure, so as to facilitate installation and maintenance of the half-width node 2 .
  • FIG. 7 is a schematic diagram of the structure of the half-width node and the S-shaped bracket according to the embodiment of the application.
  • the handle bar 21 of the half-width node 2 has a wrench 211
  • the S-shaped bracket 13 has a slot corresponding to each slot 12.
  • the wrench 211 is clamped to the slot 132 of the S-shaped bracket 13 to fix the half-width node 2 to the frame 1 and improve the installation reliability of the half-width node 2 .
  • connection method between the above-mentioned S-shaped bracket 13 and the frame 1 is not specifically limited.
  • the S-shaped bracket 13 and the frame 1 can be integrally formed to directly prepare the frame 1 and the S-shaped bracket 13. .
  • the S-shaped bracket 13 can be mounted on the frame 1 through screws.
  • the S-shaped bracket 13 can include a sheet metal support, and structures such as slideways can be installed on the sheet metal support of the S-shaped bracket 13, so that the preparation of the S-shaped bracket 13 is completed first, and then the S-shaped bracket 13 is assembled with screws. 13 is mounted on frame 1. Not only can the preparation process of the frame 1 and the S-shaped bracket 13 be simplified, but also the detachable installation of the S-shaped bracket 13 can be realized. When the S-shaped bracket 13 needs to be maintained, the S-shaped bracket 13 can be disassembled and repaired or replaced, which is convenient for maintenance. operate.
  • the S-shaped bracket 13 can also be welded to the frame 1, or the S-shaped bracket 13 can include a sheet metal support, and the slideway and other structures can be installed on the sheet metal support of the S-shaped bracket 13, thereby The preparation of the S-shaped bracket 13 is completed first, and then the S-shaped bracket 13 is welded to the frame 1 .
  • This solution is also beneficial to simplify the manufacturing process of the frame 1 and the S-shaped bracket 13 .
  • FIG. 8 is a schematic diagram of the installation structure of the half-width node in the embodiment of the application.
  • a plurality of electronic devices 23 are arranged on the circuit board 22 of the half-width node 2.
  • the first half-width node 26 has the side with the electronic device 23 oriented opposite to the second half-width node 27 with the side with the electronic device 23 . That is, the first half-width node 26 and the second half-width node 27 perform positive and negative insertion.
  • the side of the first half-width node 26 with the electronic device 23 can face the direction of the first part 24 of the second half-width node 27,
  • the second half-width node 27 has a direction of one side of the electronic device 23 toward the first portion 24 of the first half-width node 26 .
  • first half-width node 26 and the second half-width node 27 may be the same, and here specifically refer to the first half-width node 26 and the second half-width node 27
  • the specifications are the same.
  • the overall structure and shape of the first half-width node 26 and the second half-width node 27 are the same, but the specific electronic devices 23 set at the half-width nodes may be the same, or the specific electronic devices 23 set at the half-width nodes may also have certain differences , to achieve different functions.
  • the first half-width node 26 and the second half-width node 27 in this solution can be installed in either of the two slots 12 arranged side by side.
  • the first half-width node 26 is taken as an example, and the direction shown in the figure is used for description.
  • the first half-width node 26 can be installed in the slot 12 on the left side, and the electronic device 23 in the first half-width node 26 is located below the circuit board 22 along the second direction Y at this time.
  • the first half-width node 26 can be installed in the right slot 12.
  • the first half-width node 26 needs to be turned over so that the first half-width node 26 is turned over.
  • the electronic device 23 in the half-width node 26 is located above the circuit board 22 along the second direction Y.
  • the first half-width node 26 becomes the second half-width node 27 shown in the figure. Therefore, the first half-width node 26
  • the structures of the half-width node 26 and the second half-width node 27 may be the same.
  • the half-width node 2 of the same specification can be produced without distinguishing the half-width node 2 installed in the left slot 12 or the right slot 12, which is beneficial to simplify the half-width node 2.

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Abstract

本申请提供了一种半宽节点和电子设备，电子设备包括并列的两个槽位，半宽节点安装于槽位内。上述半宽节点包括第一部和第二部，第一部和第二部沿第一方向贯穿半宽节点，且沿第三方向并排设置于与两个槽位内，分别为第一半宽节点和第二半宽节点。上述第一部沿第二方向的高度小于第二部沿第二方向的高度，以使得第一半宽节点的第一部与第二半宽节点的第一部，沿第二方向能够至少交叠一部分。上述第一方向为半宽节点使用时的插入方向，第二方向为垂直于电路板表面的方向，第三方向垂直于第一方向和第二方向。该方案可以使半宽节点沿第三方向的宽度设计的较大，增加半宽节点可容纳设置的电子器件的数量，进而提高电子设备的集成度。

Description

一种半宽节点和电子设备 技术领域
本申请涉及电子设备技术领域，尤其涉及到一种半宽节点和电子设备。
背景技术
服务器作为一种常用的电子设备，通常包括框架和设置于框架内的节点，当服务器的功能较多时，通常设置的节点也较多。因此，很多服务器包括框架和安装于框架的多个可插拔节点，多个节点间通过背板实现供电和信号的互连，再利用散热组件对上述多个节点进行散热。
节点根据安装形式或者尺寸的不同，分为全宽节点和半宽节点。其中，全宽节点指的是节点的宽度与服务器框架的宽度大致相同，服务器每层只能安装一个全宽节点；半宽节点指的是节点的宽度与服务器框架的宽度的一半大致相同，服务器每层可以安装两个半宽节点。
半宽节点相对全宽节点灵活性更好，因此，是目前服务器设置中常选的一种节点形式。但是，当前的半宽节点服务器中，当框架尺寸一定时，使用半宽节点时电路板的宽度小于使用全宽节点时电路板的宽度的一半。也就是说，当框架尺寸一定时，两个半宽节点可容纳设置电子器件的能力，弱于一个全宽节点可容纳设置电子器件的能力。因此，当采用半宽节点时，服务器的集成度大大降低，这也成为了半宽节点使用中的一个瓶颈。
发明内容
本申请提供了一种半宽节点和电子设备，以增加电子设备内安装的节点的总尺寸，提高电子设备的集成度。
第一方面，本申请提供了一种半宽节点，该半宽节点包括拉手条和电路板，上述电路板固定于拉手条，且拉手条和电路板沿第一方向排布，以便于使半宽节点安装至电子设备的框架。上述半宽节点包括第一部和第二部，具体可以为：第一部包括拉手条的一部分和电路板的一部分，第二部包括拉手条的另一部分和电路板的另一部分。上述第一部和第二部沿第一方向贯穿半宽节点，第一部沿第二方向的高度小于第二部沿第二方向的高度。上述第一方向为半宽节点使用时的插入方向，第二方向为垂直于电路板表面的方向。该半宽节点在安装时，可以使相邻的半宽节点的第一部具有部分交叠，从而使半宽节点沿第三方向的宽度可以设计的较大，该第三方向垂直于第一方向和第二方向。有利于增加半宽节点可容纳设置的电子器件的数量，提高半宽节点的硬件能力，进而提高电子设备的集成度。
在具体设计上述半宽节点时，可以使半宽节点的第一部沿第二方向的高度，小于第二部沿第二方向的高度的一半。安装半宽节点时，第一部也需要具有支撑结构，则沿第二方向，支撑结构占据了一定的高度。通过设计第一部沿第二方向的高度小于第二部沿第二方向的高度的一半，则可以使第一部安装至支撑结构，使两个半宽节点的第一部交叠安装后，两个半宽节点第一部所在的区域的高度，不大于第二部所在的区域的高度，从而安装时，每排半宽节点能够以第二部沿第二方向的高度为基准，以提高电子设备沿第二方向的集成度。
电路板上设置的电子器件的高度不同，在具体设置时，将沿第二方向的高度较高的电子器件设置于第二区域，沿第二方向高度较低的电子器件设置于第一区域，以便于使相邻的两 个半宽节点的第一区域能够交叠。
在可能的实现方式中，上述半宽节点的第一部沿第三方向的宽度W1，与半宽节点沿第三方向的宽度W满足：5％·W≤W1≤20％·W。从而可以使相邻的两个半宽节点具有一定的交叠区域的同时，也可以使半宽节点的第二部的尺寸足够设置高度较高的电子器件。
第二方面，本申请还提供了一种电子设备，该电子设备包括框架和上述任一技术方案中的半宽节点。上述框架包括至少一排槽位，每排槽位包括两个并列的槽位，上述半宽节点安装于槽位内。为了便于描述，定义上述两个并排的槽位内安装的半宽节点分别为第一半宽节点和第二半宽节点。沿第二方向，上述第一半宽节点的第一部和第二半宽节点的第一部沿第二方向交叠。从而两个并排的槽位内的第一半宽节点和第二半宽节点沿第三方向的宽度之和，大于同等情况下安装的全宽节点的宽度，有利于增加半宽节点可容纳设置的电子器件的数量，提高电子设备的集成度。
为了安装上述半宽节点，框架还固定有S型支架，上述S型支架位于并联的两个槽位之间，以使半宽节点的第一部能够安装于S型支架。该S型支架可以具有安装槽，且沿第二方向上，每两个安装槽与一个槽位相对应，相邻的两个安装槽的朝向相反，以分别安装第一半宽节点和第二半宽节点。S型支架可以实现第一半宽节点和第二半宽节点的第一部的交叠安装结构，也有利于提高半宽节点安装的稳定性。
上述S型支架包括与槽位一一对应的卡槽。半宽节点的拉手条具有扳手，上述扳手能够卡接于上述卡槽内，以将半宽节点锁定于框架的槽位内。
上述S型支架的安装槽内，还设置有用于安装半宽节点的滑道，半宽节点的第一部具有与上述滑道适配的滑动结构，从而便于将半宽节点滑动装配于S型支架内。
具体设置上述S型支架时，上述S型支架可以与框架为一体结构，即直接制备出具有S型支架的框架。或者，上述S型支架还可以可拆卸安装于框架，例如通过螺钉安装于框架。该方案中，可以先制备S型支架，并将S型支架需要安装的滑道等结构安装完成后，将S型支架再安装于框架，也便于维护S型支架。或者，上述S型支架还可以焊接于框架，也可以先制备S型支架，再将S型支架安装于框架。
上述电路板设置有多个电子器件，在安装第一半宽节点和第二半宽节点时，沿第二方向，可以使第一半宽节点具有电子器件的一侧的朝向，与第二半宽节点具有电子器件的一侧的朝向相反。具体的，使第一半宽节点具有电子器件的一侧朝向第二半宽节点的第一部，第二半宽节点具有电子器件的一侧朝向第一半宽节点的第一部。也就是说第一半宽节点和第二半宽节点进行正反插，以充分的利用槽位沿第二方向的空间，提高电子设备的集成度。
上述第一半宽节点和第二半宽节点的结构可以相同，此处指的是第一半宽节点和第二半宽节点的规格可以相同，但是半宽节点包含的具体的电子器件可能相同或不同，可以根据实际产品需求设计。该方案可以制备相同规格的半宽节点，从而有利于简化半宽节点的制作工艺。
本申请实施例中的电子设备的类型不做具体限制，可以为计算设备、网络设备或者存储设备，都适用本申请实施例中的技术方案。
附图说明
图1为现有技术中电子设备的一种结构示意图；
图2为本申请实施例中电子设备的一种结构示意图；
图3为本申请实施例中半宽节点的俯视结构示意图；
图4为本申请实施例中半宽节点的一种剖面结构示意图；
图5为本申请实施例中半宽节点的一种安装结构示意图；
图6为本申请实施例中框架的一种结构示意图；
图7为本申请实施例半宽节点与S型支架配合的结构示意图；
图8为本申请实施例中半宽节点的一种安装结构示意图。
附图标记：
1-框架；                                   11-矩形支架；
12-槽位；                                  13-S型支架；
131-安装槽；                               132-卡槽；
2-半宽节点；                               21-拉手条；
211-扳手；                                 22-电路板；
23-电子器件；                              24-第一部；
25-第二部；                                26-第一半宽节点；
27-第二半宽节点；                          3-全宽节点。
具体实施方式
为了使本申请的目的、技术方案和优点更加清楚，下面将结合附图对本申请作进一步地详细描述。
为了方便理解本申请实施例提供的半宽节点以及电子设备，下面首先介绍一下其应用场景。
本申请实施例提供的半宽节点可以应用于任何需要半宽节点的电子设备中，电子设备具体可以为计算设备(如服务器)、网络设备(如交换机)和存储设备(如存储阵列)等。上述电子设备可以包括框架和设置于框架内的半宽节点，框架内每排可以安装两个半宽节点。上述半宽节点包括电路板，电路板上设置有多个电子器件，各个半宽节点通过背板电连接，以实现电子设备的功能。半宽节点的硬件能力则直接影响了电子设备的集成度，而随着电子设备的功能越来越丰富，提高集成度是目前电子设备较为重要的一个目标。
图1为现有技术中电子设备的一种结构示意图，如图所示，现有技术中电子设备包括框架1和半宽节点2，为了安装上述半宽节点2，框架1中部包括矩形支架11，半宽节点2安装于矩形支架11和框架1之间。现有技术中，矩形支架11占据了框架1宽度方向的一定空间，则半宽节点2的尺寸设计的较小。在框架1尺寸一定的情况下，两个半宽节点2的宽度明显小于一个全宽节点的宽度。因此，现有技术中，每个半宽节点2的尺寸较小，可容纳设置的电子器件23也就较少，硬件能力较差，电子设备的集成度较高。为此本申请提供了一种半宽节点和电子设备，以提高半宽节点2的尺寸，增加半宽节点2可容纳设置的电子器件23的数量，提高电子设备的集成度。
以下实施例中所使用的术语只是为了描述特定实施例的目的，而并非旨在作为对本申请的限制。如在本申请的说明书和所附权利要求书中所使用的那样，单数表达形式“一个”、“一种”、“所述”、“上述”、“该”和“这一”旨在也包括例如“一个或多个”这种表达形式，除非其上下文中明确地有相反指示。
在本说明书中描述的参考“一个实施例”或“具体的实施例”等意味着在本申请的一个或多个实施例中包括结合该实施例描述的特定特征、结构或特点。术语“包括”、“包含”、“具 有”及它们的变形都意味着“包括但不限于”，除非是以其他方式另外特别强调。
图2为本申请实施例中电子设备的一种结构示意图，请参考图2，本申请实施例中的电子设备包括框架1和安装于框架1内的半宽节点2，其中，框架1包括至少一排槽位12，每排槽位12包括两个槽位12，上述半宽节点2安装于槽位12内。
图3为本申请实施例中半宽节点的俯视结构示意图，图4为本申请实施例中半宽节点的一种剖面结构示意图，图5为本申请实施例中半宽节点的一种安装结构示意图。请结合图3、图4和图5，本申请实施例中的半宽节点2包括拉手条21，以及固定于拉手条21的电路板22，电路板22上设置有电子器件23，例如中央处理器CPU、内存条和硬盘等结构，以实现电子设备的功能。半宽节点2安装于框架1时，将电路板22插入框架1的槽位12，该半宽节点2的插入方向为第一方向X，此外，垂直于电路板22表面的方向为第二方向Y。半宽节点2包括第一部24和第二部25，第一部24和第二部25沿第一方向X贯穿半宽节点2，且第一部24沿第二方向Y的高度小于第二部25沿第二方向Y的高度。图中以虚线作为区分第一部24与第二部25的示意线，实际产品中，并不一定存在明确的分隔线，仅仅从沿第二方向Y的高度上区分出第一部24和第二部25。如图所示，拉手条21既包括位于第一部24的部分，也包括位于第二部25的部分；电路板22既包括位于第一部24的部分，也包括位于第二部25的部分。也就是说上述第一部24包括拉手条21的一部分，也包括电路板22的一部分，第二部25包括拉手条的另一部分，也包括电路板22的另一部分。将上述半宽节点2安装至电子设备的框架1时，可以在每个槽位12安装一个半宽节点2，则框架1的每排槽位12安装两个半宽节点2，为了便于描述，位于并列的两个槽位12内的半宽节点2分别为第一半宽节点26和第二半宽节点27。上述第一半宽节点26的第一部24朝向第二半宽节点27，第二半宽节点27的第一部24朝向第一半宽节点26，且第一半宽节点26的第一部24与第二半宽节点27的第一部24沿第二方向Y上至少部分交叠。
该方案中，由于半宽节点2的第一部24沿第二方向Y的高度小于第二部25沿第二方向Y的高度，因此，在将半宽节点2安装至并排设置的槽位12时，可以使并排的两个半宽节点2的第一部24至少部分交叠。请参考图5，定义第三方向Z垂直于第一方向X和第二方向Y，也即第三方向Z为半宽节点2的宽度方向，则第一半宽节点26和第二半宽节点27在第三方向Z可以共用一段区域，并排的第一半宽节点26沿第三方向Z的宽度与第二半宽节点27沿第三方向Z的宽度之和，可以大于框架1能够安装的全宽节点3的宽度。如图所示，第一半宽节点26沿第三方向Z的宽度为L1，第二半宽节点27沿第三方向Z的宽度为L2，同等情况下，可安装的全宽节点3沿第三方向Z的宽度为L，则，L1+L2＞L。因此，与现有技术相比，该方案中电子设备采用半宽节点2的结构，在框架1的尺寸不变的情况下，两个半宽节点2的宽度之和不仅没有小于全宽节点3的宽度，反而大于全宽节点3的宽度。因此，该方案中的半宽节点2可以容纳设置的电子器件23较多，硬件能力较强，有利于提高电子设备的集成度。
具体在半宽节点2的电路板22设置电子器件23时，由于电子器件23沿第二方向Y的高度不同，因此可以选择沿第二方向Y高度较高的电子器件23设置于第二部25，沿第二方向Y高度较低的电子器件23设置于第一部24；也就是说，半宽节点2的第一部24的电子器件23沿第二方向Y的高度，小于第二部25的电子器件23沿第二方向Y的高度。各个器件按照高度布局后，并不影响其工作，具体可以利用电路板22走线使电子器件23按照功能进行电连接。以使第一部24沿第二方向Y的高度，小于第二部25沿第二方向Y的高度。
值得说明的是，本申请实施例中，并非需要第一部24所有的电子器件23沿第二方向Y 的高度都小于，第二部25的所有的电子器件23沿第二方向Y的高度。为了便于描述，以下简称“沿第二方向Y的高度”为“高度”。本申请实施例只需要保证：第一部24的最高的电子器件23的高度，小于第二部25的最高的电子器件23的高度。也允许第二部25中的个别电子器件23的高度，小于第一部24的个别电子器件23的高度。
在具体设计半宽节点2时，可以使第一部24沿第二方向Y的高度小于第二部25沿第二方向Y的高度的一半。由于半宽节点2安装时，对应于第一部24的一侧需要具有支撑半宽节点2的结构，例如S型支架13，上述框架1在第二方向Y需要占用一定的空间。该方案中，为了提高电子设备的集成度，可以在半宽节点2安装后，第一半宽节点26和第二半宽节点27在第一部24沿第二方向Y占用的高度之和，不大于半宽节点2第二部25沿第二方向Y的高度。该方案中，沿第二方向Y，以第二部25的高度为基准设计槽位12的尺寸，安装各个半宽节点2，可以提高半宽节点2安装的密度，提高电子设备的集成度。
请继续参考图3，在具体设置上述半宽节点2时，可以使半宽节点2的第一部24沿第三方向Z的宽度W1，与半宽节点2沿第三方向Z的宽度W满足：5％·W≤W1≤20％·W。半宽节点2的第一部24沿第三方向Z的宽度占半宽节点2总宽度的5％～20％，具体可以为6％、7％、8％、10％、12％、15％、17％、18％或者19％等，比例不做具体限制，可以使相邻的两个半宽节点2具有较多的交叠区域。此外，第二部25的面积足够用于设置高度较高的电子器件，以满足电子设备的功能。
图6为本申请实施例中框架的一种结构示意图，请参考图6，一种实施例中，框架1沿第三方向Z的中部设置有S型支架13，该S型支架13位于并列的两个槽位12之间，用于安装半宽节点2的第一部24。上述S型支架13与框架1边缘的侧壁形成槽位12，半宽节点2的第一部24安装于S型支架13，第二部25安装于框架1边缘的侧壁。S型支架13对应每排槽位12具有两个安装槽131，两个安装槽131分别朝向两侧的槽位12。上述安装槽131与第一部24适配，第一部24伸入上述安装槽131内。该方案中，利用S型支架13可以实现并列的两个半宽节点2的第一部24的交叠安装，且可靠性较高。
具体实施例中，上述安装槽131沿第三方向Z的宽度不大于半宽节点2第一部24沿第三方向Z的宽度，以使第一部24可以安装至安装槽131沿第三方向Z的底部。具体可以使安装槽131沿第三方向Z的宽度，比半宽节点2的第一部24沿第三方向Z的宽度相差不大于5毫米。从而可以使电子设备结构的紧凑性较好，使相邻的半宽节点2的第一部24尽量交叠较多，以提高电子设备的集成度。
为了安装半宽节点2，上述S型支架13的安装槽131内还设置有与半宽节点2滑动适配的滑道，相应的，半宽节点2也具有与上述滑道适配的滑动结构。上述框架1边缘的侧壁也可以具有滑道，则半宽节点2的两侧均通过滑动结构安装于槽位12内，以便于安装和维护半宽节点2。
图7为本申请实施例半宽节点与S型支架配合的结构示意图，如图所示，上述半宽节点2的拉手条21具有扳手211，S型支架13对应每个槽位12具有卡槽132，则半宽节点2安装至槽位12时，扳手211卡接于S型支架13的卡槽132，以将半宽节点2固定于框架1，提高半宽节点2安装的可靠性。
上述S型支架13与框架1之间的连接方式不做具体限制，可选的实施例中，可以使S型支架13与框架1为一体成型结构，以直接制备完成框架1和S型支架13。
另一种可选实施例中，可以使S型支架13通过螺钉安装于框架1。该方案中，可以使S型支架13包括钣金支撑件，将滑道等结构安装于S型支架13的钣金支撑件，从而先完成S 型支架13的制备，之后利用螺钉将S型支架13安装于框架1。不仅可以简化框架1和S型支架13的制备工艺，还可以实现S型支架13的可拆卸安装，当需要维护S型支架13时，可以将S型支架13拆卸后进行维修或者更换，便于维护操作。
再一种实施例中，还可以使S型支架13焊接于框架1，也可以使S型支架13包括钣金支撑件，将滑道等结构安装于S型支架13的钣金支撑件，从而先完成S型支架13的制备，之后将S型支架13焊接于框架1。该方案也有利于简化框架1和S型支架13的制备工艺。
图8为本申请实施例中半宽节点安装结构示意图，结合图8和图5，半宽节点2的电路板22上设置有多个电子器件23，并列安装的两个半宽节点2中，沿第二方向Y，第一半宽节点26具有电子器件23一侧的朝向与第二半宽节点27具有电子器件23一侧的朝向相反。也就是第一半宽节点26与第二半宽节点27进行正反插。如图所示，当并列安装的两个半宽节点2正反插时，可以使第一半宽节点26具有电子器件23的一侧朝向第二半宽节点27的第一部24的方向，第二半宽节点27具有电子器件23的一侧朝向第一半宽节点26的第一部24的方向。该方案可以充分利用框架1的槽位12在第二方向Y的高度空间，提高电子设备的集成度。
请继续参考图2、图5结合图8，上述第一半宽节点26和第二半宽节点27的结构可以相同，此处具体指的是第一半宽节点26和第二半宽节点27规格相同。第一半宽节点26和第二半宽节点27的整体结构和形状相同，但是半宽节点设置的具体电子器件23可以相同，或者，半宽节点设置的具体电子器件23也可以具有一定的差异，以实现不同的功能。该方案中的第一半宽节点26和第二半宽节点27可以安装在并排设置的两个槽位12中的任一个。下面以第一半宽节点26为例，以图中展示的方向来进行说明。第一半宽节点26可以安装于左侧的槽位12，此时第一半宽节点26中的电子器件23位于电路板22沿第二方向Y的下方。将第一半宽节点26从左侧的槽位12取出后，可以将该第一半宽节点26安装至右侧的槽位12，此时需要将第一半宽节点26进行翻转，使第一半宽节点26中的电子器件23位于电路板22沿第二方向Y的上方，此时第一半宽节点26也就成为了图中所示的第二半宽节点27，所以，第一半宽节点26和第二半宽节点27的结构可以相同。该方案中，在制备半宽节点2的过程中，可以制作相同规格的半宽节点2，而无需区分安装于左侧槽位12或者右侧槽位12的半宽节点2，有利于简化半宽节点的制作过程。
以上，仅为本申请的具体实施方式，但本申请的保护范围并不局限于此，任何熟悉本技术领域的技术人员在本申请揭露的技术范围内，可轻易想到变化或替换，都应涵盖在本申请的保护范围之内。因此，本申请的保护范围应以权利要求的保护范围为准。

Claims (13)

  1. 一种半宽节点，其特征在于，包括拉手条和固定于所述拉手条的电路板，所述拉手条与所述电路板沿第一方向排布；
    所述半宽节点包括第一部和第二部，所述第一部和所述第二部分别沿所述第一方向贯穿所述半宽节点，所述第一部包括部分所述电路板，所述第二部包括另一部分所述电路板；所述第一部沿第二方向的高度小于所述第二部沿所述第二方向的高度；
    所述第一方向为所述半宽节点使用时的插入方向，所述第二方向为垂直于所述电路板表面的方向。
  2. 根据权利要求1所述的半宽节点，其特征在于，所述第一部沿所述第二方向的高度，小于所述第二部沿所述第二方向的高度的一半。
  3. 根据权利要求1或2所述的半宽节点，其特征在于，所述电路板设置有多个电子器件，所述第一部的所述电子器件沿所述第二方向的高度，小于所述第二部的所述电子器件沿所述第二方向的高度。
  4. 根据权利要求1或2所述的半宽节点，其特征在于，所述第一部沿第三方向的宽度W1，与所述半宽节点沿第三方向的宽度W满足：5％·W≤W1≤20％·W；
    所述第三方向垂直于所述第一方向和所述第二方向。
  5. 一种电子设备，其特征在于，包括框架和至少两个如权利要求1～4任一项所述的半宽节点，其中：
    所述框架包括至少一排槽位，每排槽位包括两个并列的槽位，所述半宽节点安装于所述槽位，位于并列的两个所述槽位内的半宽节点分别为第一半宽节点和第二半宽节点，沿第二方向，所述第一半宽节点的所述第一部与所述第二半宽节点的所述第一部至少部分交叠。
  6. 根据权利要求5所述的电子设备，其特征在于，所述框架固定有S型支架，所述S型支架位于并列的两个槽位之间，所述半宽节点的第一部安装于所述S型支架。
  7. 根据权利要求6所述的电子设备，其特征在于，所述S型支架包括与所述槽位一一对应的卡槽，所述半宽节点的拉手条包括扳手，所述扳手卡接于所述卡槽。
  8. 根据权利要求6所述的电子设备，其特征在于，所述S型支架设置有与半宽节点滑动适配的滑道，所述第一部滑动安装于所述滑道。
  9. 根据权利要求6所述的电子设备，其特征在于，所述框架与所述S型支架为一体结构。
  10. 根据权利要求6所述的电子设备，其特征在于，所述S型支架螺钉安装于所述框架，或者，所述S型支架焊接于所述框架。
  11. 根据权利要求5所述的电子设备，其特征在于，所述电路板设置有多个电子器件，沿第二方向，所述第一半宽节点具有电子器件一侧朝向所述第二半宽节点的第一部，所述第二半宽节点具有电子器件一侧朝向所述第一半宽节点的第一部。
  12. 根据权利要求5所述的电子设备，其特征在于，所述第一半宽节点与所述第二半宽节点的结构相同。
  13. 根据权利要求5～12任一项所述的电子设备，其特征在于，所述电子设备包括计算设备、网络设备和存储设备。
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