WO2022017160A1 - 用于摄像模组的线路板组件、摄像模组及终端设备 - Google Patents

用于摄像模组的线路板组件、摄像模组及终端设备 Download PDF

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Publication number
WO2022017160A1
WO2022017160A1 PCT/CN2021/104244 CN2021104244W WO2022017160A1 WO 2022017160 A1 WO2022017160 A1 WO 2022017160A1 CN 2021104244 W CN2021104244 W CN 2021104244W WO 2022017160 A1 WO2022017160 A1 WO 2022017160A1
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WIPO (PCT)
Prior art keywords
circuit board
camera module
present application
photosensitive chip
board assembly
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2021/104244
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English (en)
French (fr)
Inventor
何艳宁
蒋泽娇
邓传奇
李刚
刘旭辉
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ningbo Sunny Opotech Co Ltd
Original Assignee
Ningbo Sunny Opotech Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ningbo Sunny Opotech Co Ltd filed Critical Ningbo Sunny Opotech Co Ltd
Priority to CN202180048623.4A priority Critical patent/CN115843432A/zh
Publication of WO2022017160A1 publication Critical patent/WO2022017160A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/60—Control of cameras or camera modules
    • H04N23/68—Control of cameras or camera modules for stable pick-up of the scene, e.g. compensating for camera body vibrations
    • H04N23/682—Vibration or motion blur correction
    • H04N23/685—Vibration or motion blur correction performed by mechanical compensation
    • H04N23/687—Vibration or motion blur correction performed by mechanical compensation by shifting the lens or sensor position
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/60—Control of cameras or camera modules

Definitions

  • the present application belongs to the field of camera modules, and in particular relates to a circuit board assembly for a camera module, a camera module and a terminal device.
  • any innovation that can attract users to replace new phones will be quickly adopted by mobile phone manufacturers. This is particularly evident in the dual cameras and full screen. Focusing on the goal of a better camera experience, the camera function of mobile phones has undergone various innovations such as pixel upgrade, optical image stabilization, large aperture, telephoto lens, optical zoom, multi-lens design, and dual cameras. Among them, optical zoom and dual cameras are more advanced. protrude. The optical zoom capability of the periscope camera is strong, and it has quickly become the standard configuration of mobile phones of major brands.
  • a periscope camera refers to an assembled camera with the lens perpendicular to the plane of the phone, and its biggest advantage is that it can achieve high-magnification optical zoom.
  • Zooming is to change the focal length, so as to obtain different wide and narrow field of view, different sizes of images and different scene ranges.
  • digital zooming is to increase the area of each pixel in the picture through the processor in the digital camera, so as to achieve the purpose of magnification; optical zooming relies on the movement of the lens in the lens ( Change the distance between the lenses), and then change the focal length of the lens to achieve zoom.
  • Optical zoom can be divided into two types: internal zoom and external zoom.
  • Internal zoom means that the distance between the front and rear lenses remains unchanged, and the lens group in between moves the zoom back and forth.
  • the simple understanding is that the zoom is done in the fuselage, and the appearance of the camera has not changed.
  • the external zoom is to move the zoom through the front lens group and the rear lens group, similar to a telescopic lens.
  • Smartphones commonly use digital zoom. This method is obviously detrimental to the image quality.
  • Another method is supersampling technology, the specific process of which is to "concentrate” a 41-megapixel image into a 5-megapixel image, and every 8 pixels are integrated into a "super pixel”.
  • the mobile phone displays the image at the level of 5 million pixels.
  • the degree of "oversampling” will be reduced until a "super pixel” is restored to a normal pixel, thus indirectly achieving the effect of lossless zoom. This is a more "violent and direct” solution that is also relatively niche.
  • the principle of the "periscope structure" is to arrange the lens groups horizontally, and with the help of a special optical prism, the light is refracted into the lens group to achieve imaging. Simply put, the long-channel telephoto lens required for 10x zoom is placed vertically and horizontally, and then the light from the picture is refracted to the image sensor of the telephoto lens through a special optical prism to achieve an optical zoom effect, thereby solving the problem of the lens module. thickness issue.
  • the present application aims to provide a circuit board assembly for a camera module, a driving device is arranged on the back of the circuit board, and the photosensitive chip is indirectly driven to move by driving the circuit board to move, thereby realizing chip anti-shake.
  • a circuit board assembly for a camera module comprising:
  • a circuit board driving device includes a movable part and a fixed part, wherein the movable part is connected with the circuit board and drives the circuit board to move.
  • the circuit board driving device includes: a MEMS driving device.
  • the MEMS driving device includes: at least one first actuator for driving the circuit board to translate, and the first actuator includes a comb-shaped actuator.
  • the MEMS driving device further includes: at least one second actuator for driving the circuit board to rotate, and the second actuator includes a sector-shaped actuator.
  • the MEMS actuating device includes:
  • Four second actuators are arranged in the middle position of the bottom surface of the circuit board, and are used to drive the circuit board to rotate.
  • the circuit board includes:
  • a first circuit board including a hard circuit board
  • bent second circuit board including a flexible printed circuit board, connected to the first circuit board
  • One end of the connector is connected with the second circuit board, and the other end is connected with the external power supply device.
  • connection between the movable part and the first circuit board includes welding or bonding.
  • the bent second circuit board includes: a hollow structure disposed between the lines arranged on the bent second circuit board.
  • the circuit board includes:
  • the second flexible printed circuit board is integrally formed with the first flexible printed circuit board
  • the reinforcing plate is connected with the bottom surface of the first flexible printed circuit board to provide rigid support for it.
  • the circuit board assembly further includes:
  • the photosensitive chip is arranged on the upper surface of the circuit board.
  • the photosensitive chip and the circuit board are connected by electrical connecting wires.
  • the circuit board assembly further includes:
  • the support base is connected with the photosensitive chip and the circuit board, the support base is formed by a molding process, and the electrical connection wire is molded in the inside thereof.
  • the circuit board assembly further includes:
  • the optical filter is arranged on the support base, and the photosensitive chip is accommodated in the inner space formed by the circuit board, the support base and the optical filter.
  • a camera module comprising:
  • the lens assembly is arranged above the photosensitive chip of the circuit board assembly.
  • the camera module further includes:
  • the base is connected with the fixing part of the circuit board driving device.
  • the lens assembly includes a lens, and a lens carrier or a motor, and the lens carrier or motor is connected to the base.
  • a terminal device including the above camera module.
  • a method for reducing the driving resistance of the above circuit board comprising: hollowing out positions on the second circuit board where no lines are laid;
  • a MEMS driving device is arranged on the back of the hard circuit board, and the position adjustment of the photosensitive chip in different directions is indirectly driven by driving the circuit board to move, so as to realize the camera module during the shooting process. Shake correction to replace traditional motor anti-shake.
  • the circuit board assembly provided by the present application adopts a flexible printed circuit board that is bent and hollowed out to reserve sufficient space for the movement of the circuit board to ensure the effective movement of the circuit board. conduct.
  • FIG. 1 shows a schematic diagram of a photosensitive assembly of a camera module.
  • FIG. 2 shows a schematic structural diagram of a circuit board assembly according to an exemplary embodiment of the present application.
  • FIG. 3 shows a schematic structural diagram of a MEMS driving device according to an exemplary embodiment of the present application.
  • FIG. 4 shows a schematic diagram of a circuit board assembly connection according to an exemplary embodiment of the present application.
  • FIG. 5 shows an enlarged schematic diagram of a connection part of a circuit board driving assembly according to an exemplary embodiment of the present application.
  • FIG. 6 shows a schematic diagram of the movement of a circuit board assembly according to an exemplary embodiment of the present application.
  • FIG. 7 shows a flowchart of a method for forming a second circuit board according to an exemplary embodiment of the present application.
  • FIG. 8A shows a schematic diagram 1 of a bending process of a flexible printed circuit board according to an exemplary embodiment of the present application.
  • FIG. 8B shows a second schematic diagram of a bending process of a flexible printed circuit board according to an exemplary embodiment of the present application.
  • FIG. 9 shows a perspective view of a camera module according to an exemplary embodiment of the present application.
  • FIG. 10 shows a side view of a camera module according to an example embodiment of the present application.
  • FIG. 11 shows a schematic structural diagram of a package body of a photosensitive component of a camera module according to an exemplary embodiment of the present application.
  • FIG. 12 shows a partial schematic diagram of a camera module according to an exemplary embodiment of the present application.
  • FIG. 13 shows a schematic diagram of the composition of a terminal device according to an exemplary embodiment of the present application.
  • Example embodiments are described more fully below with reference to the accompanying drawings. Example embodiments, however, can be embodied in various forms and should not be construed as limited to the embodiments set forth herein. These embodiments are provided so that this application will be thorough and complete, and will fully convey the concept of example embodiments to those skilled in the art.
  • the same reference numerals in the drawings denote the same or similar parts, and thus their repeated descriptions will be omitted.
  • the current mainstream anti-shake method is motor anti-shake.
  • the principle is to equip the lens with a corresponding drive motor, and the motor drives the lens to move in different directions to correct the slight jitter of the module and improve the image quality.
  • the original plastic lens is gradually replaced by glass lens, which increases the weight of the lens, and the driving force provided by the motor is insufficient, which affects the accuracy of anti-shake.
  • the motor not only provides limited driving force, but also has a complex design structure and high manufacturing cost, so it cannot meet the market demand.
  • Micro PTZ anti-shake is a new anti-shake technology.
  • the micro pan/tilt needs to add a driving device to the module as a whole, so that the height of the module increases, thereby increasing the thickness of the mobile phone, so there are certain limitations.
  • Chip anti-shake is another new anti-shake technology, which requires small driving force and large stroke, which can effectively solve the problems of motor anti-shake and gimbal anti-shake.
  • the present application proposes a circuit board assembly structure for a camera module, which can realize a chip anti-shake function.
  • FIG. 1 shows a schematic diagram of a photosensitive assembly of a camera module.
  • the photosensitive component 1000 of the camera module may include a circuit board 1100 , a photosensitive chip 1200 , a support base 1300 and a filter 1400 , wherein the photosensitive chip 1200 is fixed on the upper surface of the circuit board 1100 ,
  • the photosensitive chip 1200 and the circuit board 1100 are electrically connected through an electrical connection wire 1500 (eg, gold wire), so as to realize power supply and signal transmission during the operation of the photosensitive chip 1200 .
  • the support base 1300 is fixed on the circuit board 1100 , accommodates the photosensitive chip 1200 in the inner space thereof, and molds the electrical connection wires 1500 therein.
  • the filter 1400 is mounted on the top of the support base 1300 .
  • the main function of the filter 1400 is to filter out stray light and effectively improve the quality of imaging.
  • the photosensitive chip 1200 is accommodated in the inner space composed of the circuit board 1100 , the support base 1300 and the filter 1400 .
  • the wiring board 1100 may include a first wiring board 1110 , a second wiring board 1120 and a connector 1130 .
  • the first wiring board 1110 may be a rigid wiring board.
  • the second wiring board 1120 may be a flexible printed wiring board.
  • the first circuit board 1110 is connected to the photosensitive chip 1200 and is disposed on the back side of the photosensitive chip 1200; the second circuit board 1120 and the connector 1130 are used to connect the first circuit board 1110 with the external motherboard, and are the first circuit board 1110 and the camera module photosensitive assembly 1200 provide working power.
  • the packaging method for the photosensitive component shown in FIG. 1 is a molding process.
  • the electrical connection lines 1500 connecting the photosensitive chip 1200 and the circuit board 1100 and some other electronic components are molded inside by the molding method, and the shape of the molding part is directly molded into the support seat 1300 suitable for installing the filter. , and install the filter 1400 on the support base 1300 .
  • This packaging method can reduce the height of the module and effectively reduce the weight of the camera module, but the present application is not limited to this.
  • the present application proposes a chip anti-shake method in which the photosensitive chip is indirectly driven to move by driving the circuit board to move.
  • the relative position of the photosensitive chip and the circuit board remains unchanged, and a driving device is installed under the circuit board, so that the driving device directly drives the circuit board to move. Since the photosensitive chip is fixed on the circuit board, driving the circuit board to move is equivalent to driving the photosensitive chip to move.
  • This driving method can not only effectively drive the photosensitive chip to move, but also prevent chip damage and circuit damage that may occur during the movement of the photosensitive chip.
  • the photosensitive chip is small in size and high in manufacturing cost, and it is easy to damage the chip when it is affected by external force. Therefore, compared with the chip anti-shake method that directly drives the photosensitive chip to move, the chip anti-shake method that indirectly drives the photosensitive chip to move by driving the circuit board to move can not only avoid the photosensitive chip that may occur in the process of directly driving the photosensitive chip. It can also avoid problems such as poor power supply caused by damage to the connection point of the electrical connection line between the photosensitive core and the circuit board.
  • FIG. 2 shows a schematic structural diagram of a circuit board assembly according to an exemplary embodiment of the present application.
  • the present application provides a circuit board assembly 200 for a camera module, as shown in FIG. 2 .
  • the circuit board assembly 200 also includes a circuit board driving device 240 .
  • the first wiring board 1110 may be a rigid wiring board
  • the second wiring board 1120 may be a flexible printed wiring board.
  • both the first circuit board 1110 and the second circuit board 1120 may be flexible printed circuit boards, and both may be integrally formed.
  • a reinforcing plate may be provided on the back of the flexible first circuit board 1110 .
  • the reinforcing plate may be a steel plate structure, and is connected to the first circuit board 1110 to provide rigid support for it.
  • the circuit board driving device 240 includes a movable part 241 and a fixed part 242 .
  • the circuit board driving device 240 may use a mature MEMS actuator, and the movable part 241 and the fixed part 242 are connected by an elastic member, and the whole is an independent component.
  • the structure of the actuator is well known to those skilled in the art, and will not be repeated in this application.
  • the movable part 241 can be displaced due to electrostatic action.
  • the movable part 241 is connected to the first circuit board 1110 , for example, can be disposed under the first circuit board 1110 and be fixed thereto.
  • the movable portion 241 and the first circuit board 1110 can be fixed by bonding or welding.
  • the specific fixing method can be set according to the actual situation, which is not particularly limited in this application.
  • the circuit board assembly 200 may further include a base 250 connected with the fixing portion 242 to provide support for the circuit board device.
  • the base 250 may also serve as a component of the camera module.
  • the camera module includes a lens assembly, a photosensitive assembly and a base.
  • Lens assemblies include lenses, lens carriers, or motors.
  • the fixing portion 242 in the circuit board assembly 200 is connected to the base 250 .
  • the lens carrier or motor is connected to the base 250 and accommodates the photosensitive component inside.
  • Disposing the circuit board driving device 240 on the back of the first circuit board 1110 can also enhance the strength of the first circuit board 1110 and prevent the photosensitive chip from warping.
  • large chips have also become a trend.
  • the increase in the area of the photosensitive chip will make the warpage of the periphery more significant. Setting the driving structure in this way can not only effectively drive the first circuit board 1110 to move, but also enhance the strength of the circuit board and prevent the periphery of the photosensitive chip from warping.
  • the circuit board driving device 240 may be a MEMS driving device, or other driving devices capable of electrostatic driving, but the present application is not limited thereto.
  • the movable part and the fixed part of the MEMS drive device move due to the action of electrostatic force, it will drive the circuit board fixed with it to move accordingly, so as to adjust the position of the photosensitive chip, and then realize the camera module Shake correction during photography.
  • the gyroscope in the mobile terminal detects the shaking situation, and sends the shaking information to the control center.
  • the control center calculates the position of the photosensitive chip that needs to be corrected and outputs motion commands.
  • the MEMS driving device is driven according to the motion command sent by the control center.
  • FIG. 3 shows a schematic structural diagram of a MEMS driving device according to an exemplary embodiment of the present application.
  • the specific form of the MEMS driving device 240 may be at least one first actuator 2401 and/or at least one second actuator 2402 .
  • the first actuator 2401 can realize position adjustment in the X and Y directions of the horizontal plane, that is, translation.
  • the second actuator 2402 can achieve rotational position adjustment along an axis perpendicular to the X, Y plane.
  • the first actuator 2401 may be a comb-shaped structure
  • the second actuator 2402 may be a fan-shaped structure.
  • Both the first actuator 2401 and the second actuator 2402 include a movable part 241 and a fixed part 242 .
  • the sector-shaped second actuator 2402 makes the movable part rotate by a certain angle, and the magnitude of the rotation angle matches the voltage difference.
  • the comb-shaped first actuator 2401 makes the movable part translate along the positive and negative directions of the X and Y axes, thereby driving the circuit board to adjust the horizontal vibration, and then realize the position adjustment of the chip.
  • the number of the first actuator 2401 and the number of the second actuator 2402 is four.
  • the four second actuators 2402 are arranged in the middle position of the back side of the first circuit board 1110 , and the four first actuators 2401 are arranged around the back side of the first circuit board 1110 .
  • the arrangement shown in FIG. 3 can achieve a better driving effect, but the number and arrangement positions of the first actuators 2401 and the second actuators 2402 can be set according to actual requirements, and the present application is not limited thereto.
  • FIG. 4 shows a schematic diagram 1 of connection of circuit board components according to an exemplary embodiment of the present application.
  • the first circuit board 1110 is connected to the photosensitive chip 1200 and is disposed below the photosensitive chip 1200 .
  • the movable portion 241 of the circuit board driving device 240 is connected to the first circuit board 1110 and disposed below the first circuit board 1110 .
  • the fixing part 242 of the circuit board driving device 240 is fixed on the base 250 .
  • the base 250 can be used as a part of the circuit board assembly 200 or as a structure of the camera module. Corresponding lines are directly arranged inside the base 250 to energize the MEMS driving device.
  • the manufacturing process of the base 250 may be a lamination process for manufacturing a circuit board, which will not be repeated in this application.
  • the current in the first circuit board 1110 is provided by the second circuit board 1120 extending out of the base 250 .
  • the second circuit board 1120 is connected to the first circuit board 1110 through the base 250 .
  • the connector 1130 is fixed on one end of the second circuit board 1120 , directly mounted on the main board of the device, and connected to the power supply device on the main board, so as to power on the first circuit board 1110 .
  • the first wiring board 1110 may be a rigid wiring board
  • the second wiring board 1120 may be a flexible printed wiring board.
  • both the first circuit board 1110 and the second circuit board 1120 may be flexible printed circuit boards, and both may be integrally formed.
  • a reinforcing plate may be provided on the bottom surface of the flexible first circuit board 1110 to be connected with it to provide rigid support.
  • FIG. 5 shows an enlarged schematic diagram of a connection part of a circuit board driving assembly according to an exemplary embodiment of the present application.
  • the MEMS driving device 240 includes a movable part 241 and a fixed part 242 .
  • the movable part 241 is connected with the first circuit board 1110 .
  • the fixing part 242 and the base 250 are connected together.
  • the movable part 241 and the fixed part 242 move relative to each other, thereby driving the first circuit board 1110 to move relative to the base 250 .
  • the photosensitive chip 1200 and the first circuit board 1110 are fixed together, and are electrically connected through electrical connection wires 1500 .
  • the movement of the first circuit board 1110 also drives the photosensitive chip 1200 to move relative to each other, so as to realize the relative adjustment of the position of the chip.
  • FIG. 6 shows a schematic diagram of the movement of a circuit board assembly according to an exemplary embodiment of the present application.
  • one end of the second circuit board 1120 is connected to the first circuit board 1110 , and the other end is fixed on the main board of the device, and the fixed positions of the connector 1130 and the main board will not move. Therefore, when the first circuit board 1110 is moved under the driving of the circuit board driving device 240, the connection between the second circuit board 1120 and the first circuit board 1110 is frequently subjected to force, causing the second circuit board 1120 to be connected to the first circuit board 1110. A tear or partial tear occurs at the connection of the circuit board 1110. In severe cases, the connection between the connector 1130 and the motherboard may be affected, and the fixed place between the motherboard and the connector 1130 may also have poor contact, resulting in poor power supply. The normal operation of the module is affected. Work.
  • the present application adopts a second circuit board 1120 that has undergone a bending process. After the second circuit board 1120 is bent, the movable range of the first circuit board 1110 can be reserved. When the first circuit board 1110 moves frequently, since a sufficient range of motion is reserved, the movement of the first circuit board 1110 will not affect the connection at the connector 1130, thereby avoiding problems such as tearing caused by frequent movement.
  • the part of the second circuit board 1120 where no lines are arranged may be hollowed out.
  • Using the hollow structure 1121 in the middle of the second circuit board 1120 (as shown in FIG. 8 ) can effectively reduce the force on the second circuit board 1120 during the movement of the module, especially when the circuit board assembly 200 is in the direction of the optical axis When rotating and adjusting, the effect is better and more obvious.
  • FIG. 7 shows a flowchart of a method for reducing driving resistance of a circuit board according to an exemplary embodiment of the present application.
  • FIG. 8A shows a schematic diagram 1 of a bending process of a flexible printed circuit board according to an exemplary embodiment of the present application.
  • FIG. 8B shows a second schematic diagram of a bending process of a flexible printed circuit board according to an exemplary embodiment of the present application.
  • the present application provides a method for reducing the driving resistance of a circuit board, including:
  • step S710 hollowing processing is performed on the position on the second circuit board where the circuit is not laid out.
  • the part of the second circuit board that is not laid out in the middle can be hollowed out, which can effectively reduce the force of the second circuit board on it during the movement of the module, especially when the circuit board assembly is rotated and adjusted around the optical axis, the effect is more effective. Good obvious.
  • step S720 bending processing is performed on the second circuit board. After hollowing out, the second circuit board is then bent. First, the head of the second circuit board is pressed down and limited by a limit jig. As shown in FIG. 8A , during the bending process of the flexible second circuit board 1120 , the head of the flexible second circuit board 1120 needs to be fixed, and the head is limited by a limiting jig. Then, two sides of the second circuit board are hot-pressed by using a set of hot-pressing heads respectively. As shown in FIG. 8B , after the head is fixed, a set of hot pressing heads 222 arranged on both sides of the second circuit board 1120 are used to perform hot pressing on the second circuit board 1120 .
  • the material of the second circuit board 1120 may be an FPC soft board. Through continuous high temperature and down pressure, the shape of the FPC soft board is fixed and a bend is formed.
  • FIG. 9 shows a perspective view of a camera module according to an exemplary embodiment of the present application.
  • FIG. 10 shows a side view of a camera module according to an example embodiment of the present application.
  • a camera module 2000 includes a lens assembly 2100 and a photosensitive assembly package 2200 .
  • Lens assembly 2100 includes a lens 2110 , a lens carrier or motor 2120 .
  • the photosensitive component package 2200 includes a photosensitive component and a base 250 .
  • the lens assembly 2100 is connected to the photosensitive assembly package 2200, for example, the lens carrier 2120 of the lens assembly 2100 and the base in the photosensitive assembly package 2200 are connected together by welding or gluing; the second circuit board of the circuit board assembly 1120 and connector 1130 pass through base 250 to connect to an external motherboard. After the connector 1130 is connected to the power supply device on the main board, the circuit board assembly provides current to realize the circuit energization.
  • FIG. 11 shows a schematic structural diagram of a package body of a photosensitive component of a camera module according to an exemplary embodiment of the present application.
  • the photosensitive component package 2200 of the camera module includes a photosensitive component 1000 and a base 250 .
  • the photosensitive assembly 1000 includes a circuit board assembly 200 , a photosensitive chip 1200 , a support base 1300 and a filter 1400 .
  • the circuit board assembly 200 includes a first circuit board 1110 , a second circuit board (not shown in the figure), a connector (not shown in the figure), and a circuit board driving device 240 .
  • the circuit board driving device 240 includes a movable part 241 and a fixed part 242 .
  • the movable part 241 is connected to the first circuit board 1110 and is disposed on the lower surface of the first circuit board 1110 .
  • the fixing portion 242 is connected to the base 250 and is disposed on the upper surface of the base 250 .
  • the photosensitive chip 1200 is connected to the first circuit board 1110 and disposed on the first circuit board 1110 .
  • the photosensitive chip 1200 is fixed on the first circuit board 1110 , and the photosensitive chip 1200 and the first circuit board 1110 are electrically connected through electrical connection wires 1500 (eg, gold wires) to realize power supply and signal transmission during the operation of the photosensitive chip 1200 .
  • the support base 1300 is fixed on the first circuit board 1110, accommodates the photosensitive chip 1200 in the inner space thereof, and molds the electrical connection wires 1500 in the inner space thereof.
  • the filter 1400 is mounted on the top of the support base 1300 .
  • the main function of the filter 1400 is to filter out stray light and effectively improve the quality of imaging. Therefore, the photosensitive chip 1200 is accommodated in the inner space composed of the circuit board 1100 , the support base 1300 and the filter 1400 , which can effectively protect the normal operation of the photosensitive chip.
  • the packaging method for the photosensitive component shown in FIG. 11 is a molding process.
  • the electrical connection lines 1500 connecting the photosensitive chip 1200 and the first circuit board 1110 and the electronic components 1600 are molded inside by the molding method, and the molded shape is directly molded into the support seat 1300 suitable for installing the filter. , and install the filter 1400 on the support base 1300 .
  • This packaging method can reduce the height of the module and effectively reduce the weight of the camera module, but the present application is not limited to this.
  • the circuit board driving device 240 After the circuit board driving device 240 is energized between the movable part 241 and the fixed part 242 , the movable part 241 can be displaced relative to the fixed part 242 due to static electricity, thereby driving the first circuit board 1110 to move. Since the photosensitive chip 1200 is fixedly connected with the first circuit board 1110 , the photosensitive chip 1200 can be indirectly driven to move, thereby realizing chip anti-shake.
  • FIG. 12 shows a partial schematic diagram of a camera module according to an exemplary embodiment of the present application.
  • the lens assembly 2100 of the camera module 2000 is mounted on the photosensitive assembly package 2200 .
  • the lens assembly 2100 is used to capture and focus the target object to be photographed to be transmitted to the photosensitive chip 1200 .
  • Lens assembly 2100 includes a lens 2110 , a lens carrier or motor 2120 .
  • the motor 2120 drives the lens 2110 to move, and realizes the automatic focusing function during the shooting process.
  • the lens carrier or the motor 2120 is mounted on the base 250 and is fixed to the base 250 by bonding or welding.
  • the relative positions of the photosensitive chip 1200 and the first circuit board 1110 remain unchanged.
  • a circuit board driving device 240 is installed under the first circuit board 1110 . After the movable part 241 and the fixed part 242 of the circuit board driving device 240 are energized, the movable part 241 is displaced relative to the fixed part 242 due to electrostatic action, thereby driving the first circuit board 1110 to move, and indirectly driving the photosensitive chip to move. Therefore, according to the anti-shake requirements of the camera module, the chip anti-shake can be realized by controlling the circuit board driving device, and the imaging quality of the camera module can be improved.
  • FIG. 13 shows a schematic diagram of the composition of a terminal device according to an exemplary embodiment of the present application.
  • the present application further provides a terminal device 3000 , which includes the above-mentioned camera module.
  • the terminal device 3000 may include: at least one processor 3001 , at least one network interface 3004 , user interface 3003 , memory 3005 , and at least one communication bus 3002 .
  • the communication bus 3002 is used to realize the connection communication between these components.
  • the user interface 3003 may include a display screen (Display) and the above-mentioned camera module 2000 (Camera), and the optional user interface 3003 may also include a standard wired interface and a wireless interface.
  • the network interface 3004 may optionally include a standard wired interface and a wireless interface (eg, a WI-FI interface).
  • the processor 3001 may include one or more processing cores.
  • the processor 3001 uses various interfaces and lines to connect various parts of the entire terminal device 3000, and executes by running or executing the instructions, programs, code sets or instruction sets stored in the memory 3005, and calling the data stored in the memory 3005.
  • the processor 3001 may adopt at least one of digital signal processing (Digital Signal Processing, DSP), field-programmable gate array (Field-Programmable Gate Array, FPGA), and programmable logic array (Programmable Logic Array, PLA).
  • DSP Digital Signal Processing
  • FPGA Field-Programmable Gate Array
  • PLA programmable logic array
  • the processor 3001 may integrate one or a combination of a central processing unit (Central Processing Unit, CPU), a graphics processing unit (Graphics Processing Unit, GPU), a modem, and the like.
  • CPU Central Processing Unit
  • GPU Graphics Processing Unit
  • the CPU mainly handles the operating system, user interface, and application programs
  • the GPU is used to render and draw the content that needs to be displayed on the display screen
  • the modem is used to handle wireless communication. It can be understood that, the above-mentioned modem may not be integrated into the processor 3001, and is implemented by a single chip.
  • the memory 3005 may include random access memory (Random Access Memory, RAM), or may include read-only memory (Read-Only Memory).
  • the memory 1005 includes a non-transitory computer-readable storage medium.
  • Memory 3005 may be used to store instructions, programs, codes, sets of codes, or sets of instructions.
  • the memory 3005 may include a stored program area and a stored data area, wherein the stored program area may store instructions for implementing an operating system, instructions for at least one function (such as a touch function, a sound playback function, an image playback function, etc.), Instructions and the like used to implement the above method embodiments; the storage data area may store the data and the like involved in the above method embodiments.
  • the memory 3005 can optionally also be at least one storage device located away from the aforementioned processor 3001 .
  • the memory 3005 as a computer storage medium may include an operating system, a network communication module, a user interface module, and a video image processing application program.
  • the application provides a circuit board assembly for a camera module.
  • a MEMS driving device is arranged on the back of the hard circuit board, and the position adjustment of the photosensitive chip in different directions is indirectly driven by driving the circuit board to move, so as to realize the shooting process of the camera module Shake correction in , to replace the traditional motor anti-shake.
  • the circuit board assembly provided by the present application adopts a flexible printed circuit board that is bent and hollowed out to reserve sufficient space for the movement of the circuit board to ensure the effective movement of the circuit board. conduct.
  • the anti-shake solution provided by this application the anti-shake structure is changed from the original driving lens movement to the driving chip movement to achieve anti-shake, which can realize anti-shake with a larger stroke, improve the anti-shake ability, and adapt to the current high-power zoom module. development trend.

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Abstract

本申请提供了一种用于摄像模组的线路板组件、摄像模组及终端设备。其中，所述线路板组件包括：线路板；线路板驱动装置，包括可动部和固定部，所示可动部与所述线路板相连，驱动所述线路板移动。在硬质线路板背面设置MEMS驱动装置，通过驱动线路板移动进而间接驱动感光芯片不同方位的位置调整，从而实现摄像模组拍摄过程中的抖动矫正。

Description

用于摄像模组的线路板组件、摄像模组及终端设备 技术领域
本申请属于摄像模组领域，具体地涉及一种用于摄像模组的线路板组件、摄像模组及终端设备。
背景技术
在手机进入存量市场之后，任何能吸引用户更换新机的创新都会被手机厂商迅速采用。这一点在双摄像头和全面屏方面体现得特别明显。围绕更好的拍照体验这个目标，手机摄像功能经历了像素升级、光学防抖、大光圈、长焦镜头、光学变焦、多透镜设计、双摄像头等多种创新，其中以光学变焦和双摄像头较为突出。潜望式摄像头的光学变焦能力实力强劲，很快成为各大品牌手机的标配。
潜望式摄像头是指将镜头与手机平面垂直放置的组装摄像头，其最大的优势是可以实现高倍数的光学变焦。变焦就是改变焦距，从而得到不同宽窄的视场角、不同大小的影像和不同的景物范围。变焦通常有数码变焦和光学变焦两种方式，其中数码变焦是通过数码相机内的处理器，把图片内的每个像素面积增大，从而达到放大目的；光学变焦是依靠镜头中镜片的移动(改变镜片之间的距离)，进而改变镜头的焦距，实现变焦。
光学变焦可以分为内变焦和外变焦两类方案。内变焦指前后镜片之间的距离不变，由之间的镜片组前后移动变焦。简单理解就是变焦在机身内完成，摄像头外观没有变化。而外变焦则是通过前镜片组和后镜片组移动变焦，类似于伸缩式镜头。
智能手机普遍采用的是数码变焦。这种方法显然是对成像画质有损的。另一种方法是超采样技术，其具体过程是将4100万像素的图像“浓缩”为500万像素的图像，每8个像素点被整合成一个“超级像素点”。拍摄时，手机以500万像素级别显示图像，当放大图像时，“过采样” 程度就会减小，直到一个“超级像素点”还原成普通像素点为止，从而间接达到无损变焦的效果。这是一种比较“暴力直接”、同时也比较小众的解决方案。
双摄甚至三摄手机的出现，为智能手机的变焦带来了新的方向，也是目前主流的变焦方案：采用不同焦距的摄像头，当变焦达到该焦段时，切换摄像头，其他过程仍以数码变焦来代替。这是一种混合的变焦方案，优缺点都很明显。优点是：达到固定的变焦倍数时，对成像画质是无损的。目前市面上最高已经有五倍的变焦。缺点是：首先只有固定倍数时成像画质无损，其他情况下成像画质仍然是有损的；其次，手机摄像头的增加影响美观，也影响机身内部空间的设计，因此不可能无限增加。
变焦倍数越高，镜头就越长，智能手机的厚度显然承载不了10倍变焦的镜头长度。智能手机的厚度不够，但宽度是够的。所以将镜头通道横向布置可以解决此问题。“潜望式结构”的原理就是将镜片组横向排列，借助特殊的光学棱镜，让光折射入镜头组，实现成像。简单说就是将10倍变焦需要的长通道的长焦镜头垂直横置摆放，再通过特制的光学棱镜，让画面光线折射到长焦镜头的图像传感器，达到光学变焦效果，从而解决镜头模组的厚度问题。
根据以上的分析，高倍变焦的摄像模组越来越受欢迎，但是随之而来的还有抖动问题。变焦的倍数越大，对防抖的要求就越高，尤其是在暗光拍摄和微距拍摄的过程中，由于需要长时间的曝光，轻微的抖动都会对成像质量产生巨大的影响。因此，需要一种可靠的防抖技术，来有效地应对高倍变焦模组出现的抖动问题，提升高倍变焦模组的成像质量。
发明内容
本申请旨在提供一种用于摄像模组的线路板组件，在线路板的背面设置驱动装置，通过驱动线路板移动间接驱动感光芯片移动，从而实现芯片防抖。
根据本申请的第一方面，提供一种用于摄像模组的线路板组件，包括：
线路板；
线路板驱动装置，包括可动部和固定部，所示可动部与所述线路板相连，驱动所述线路板移动。
根据本申请的一些实施例，所述线路板驱动装置，包括：MEMS驱动装置。
根据本申请的一些实施例，所述MEMS驱动装置包括：至少一个第一致动器，用于驱动所述线路板平移，所述第一致动器包括梳形致动器。
根据本申请的一些实施例，所述MEMS驱动装置，还包括：至少一个第二致动器，用于驱动所述线路板旋转，所述第二致动器包括扇形致动器。
根据本申请的一些实施例，所述MEMS驱动装置包括：
四个第一致动器，分别设置于所述线路板底面的四周，用于驱动所述线路板平移；
四个第二致动器，设置于所述线路板底面的中间位置，用于驱动所述线路板旋转。
根据本申请的一些实施例，所述线路板包括：
第一线路板，包括硬质线路板；
弯折的第二线路板，包括柔性印刷线路板，与所述第一线路板相连；
连接器，一端与所述第二线路板相连，另一端与外部供电装置相连。
根据本申请的一些实施例，所述可动部与所述第一线路板的连接方式包括：焊接或粘接。
根据本申请的一些实施例，所述弯折的第二线路板包括：镂空结构，设置于所述弯折的第二线路板上布设的线路之间。
根据本申请的一些实施例，所述线路板包括：
第一柔性印刷线路板；
第二柔性印刷线路板，与第一柔性印刷线路板一体成型；
补强板，与所述第一柔性印刷线路板的底面相连，为其提供刚性支撑。
根据本申请的一些实施例，所述线路板组件，还包括：
感光芯片，设置于所述线路板的上表面。
根据本申请的一些实施例，所述感光芯片与所述线路板通过电连接线连接。
根据本申请的一些实施例，所述线路板组件，还包括：
支撑座，与所述感光芯片和所述线路板相连，所述支撑座采用模塑工艺成型，将所述电连接线模塑在其内部。
根据本申请的一些实施例，所述线路板组件，还包括：
滤光片，设置于所述支撑座上，所述感光芯片被容纳于所述线路板、所述支撑座和所述滤光片组成的内部空间。
根据本申请的第二方面，提供一种摄像模组，包括：
如上所述的线路板组件；
镜头组件，设置在所述线路板组件的所述感光芯片上方。
根据本申请的一些实施例，所述摄像模组还包括：
基座，与所述线路板驱动装置的固定部相连。
根据本申请的一些实施例，所述镜头组件包括：镜头、以及镜头载体或者马达，所述镜头载体或马达与所述基座相连。
根据本申请的第三方面，提供一种终端设备，包括如上所述的摄像模组。
根据本申请的第四方面，提供一种减小上述线路板驱动阻力的方法，包括：对第二线路板上未布设线路的位置进行镂空处理；
对所述第二线路板进行弯折处理。
本申请提供的用于摄像模组的线路板组件，在硬质线路板背面设置MEMS驱动装置，通过驱动线路板移动进而间接驱动感光芯片不同方位的位置调整，从而实现摄像模组拍摄过程中的抖动矫正，以替代传统的马达防抖。此外，为了减小连接器在线路板移动过程中产生的阻力，本申请提供的线路板组件采用弯折镂空的柔性印刷线路板，为线路板移动预留充足的空间，保证线路板移动的有效进行。
本申请的附加方面和优点将在下面的描述中部分给出，部分将从下面的描述中变得明显，或通过本申请的实践了解到。
附图说明
为了更清楚地说明本申请实施例中的技术方案，下面将对实施例描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图 仅仅是本申请的一些实施例。
图1示出摄像模组感光组件示意图。
图2示出根据本申请示例实施例的线路板组件结构示意图。
图3示出根据本申请示例实施例的MEMS驱动装置结构示意图。
图4示出根据本申请示例实施例的线路板组件连接示意图。
图5示出根据本申请示例实施例的线路板驱动组件连接局部放大示意图。
图6示出根据本申请示例实施例的线路板组件移动示意图。
图7示出根据本申请示例实施例的第二线路板的成型方法流程图。
图8A示出根据本申请示例实施例的柔性印刷线路板弯折过程示意图一。
图8B示出根据本申请示例实施例的柔性印刷线路板弯折过程示意图二。
图9示出根据本申请示例实施例的摄像模组立体图。
图10示出根据本申请示例实施例的摄像模组侧视图。
图11示出根据本申请示例实施例的摄像模组感光组件封装体结构示意图。
图12示出根据本申请示例实施例的摄像模组局部示意图。
图13示出根据本申请示例实施例的终端设备组成示意图。
具体实施方式
下面将参考附图更全面地描述示例实施例。然而，示例实施例能以多种形式实施，且不应被理解为限于在此阐述的实施例。提供这些实施例是为使得本申请更全面和完整，并将示例实施例的构思全面地传达给本领域的技术人员。在图中相同的附图标记表示相同或类似的部分，因而将省略对它们的重复描述。
此外，所描述的特征、结构或特性可以以任何合适的方式结合在一个或更多实施例中。在下面的描述中，提供许多具体细节从而给出对本申请的实施例的充分理解。然而，本领域技术人员将意识到，可以实践本申请的技术方案而没有特定细节中的一个或更多，或者可以采用其它 的方法、组元、装置、步骤等。在其它情况下，不详细示出或描述公知方法、装置、实现或者操作以避免模糊本申请的各方面。
应理解，虽然本文中可能使用术语第一、第二等来描述各种组件，但这些组件不应受这些术语限制。这些术语乃用以区分一组件与另一组件。因此，下文论述的第一组件可称为第二组件而不偏离本申请概念的教示。如本文中所使用，术语“及/或”包括相关联的列出项目中的任一个及一或多者的所有组合。
本领域技术人员可以理解，附图只是示例实施例的示意图，可能不是按比例的。附图中的模块或流程并不一定是实施本申请所必须的，因此不能用于限制本申请的保护范围。
不管是常规模组，还是高倍的潜望变焦模组，变焦倍数越大，成像画面抖动就越明显，照片就容易模糊。随着变焦倍数的增加，对镜头模组的防抖要求也相应的提高。
目前主流的防抖方式为马达防抖，其原理为给镜头配备相应的驱动马达，马达驱动镜头向不同方向移动，以矫正模组的细微抖动，提升成像质量。但是随着镜头品质的提升，原有的塑料镜片被玻璃镜片逐渐取代，使得镜头的重量增加，马达提供的驱动力不足，影响防抖的精度。马达不仅提供的驱动力有限，同时设计结构比较复杂、制造成本高，因此无法满足市场需求。
微型云台防抖是一种新型防抖技术。但是，微型云台需要给模组整体增加驱动装置，使得模组的高度增加，从而增加手机的厚度，因此也存在一定的局限性。
芯片防抖是另一种新型防抖技术，其需要的驱动力小且行程大，可以有效地解决马达防抖和云台防抖存在的问题。本申请提出一种用于摄像模组的线路板组件结构，可以实现芯片防抖功能。
以下将结合附图，对本申请的技术方案进行详细说明。
图1示出摄像模组感光组件示意图。
如图1所示，根据示例实施例的摄像模组的感光组件1000可包括线路板1100、感光芯片1200、支撑座1300和滤光片1400，其中感光芯片1200固定在线路板1100的上表面，并通过电连接线1500(例如金线)将感光芯 片1200和线路板1100导通，以实现感光芯片1200工作过程中的供电和信号传递。支撑座1300固定在所述线路板1100上，将感光芯片1200容纳于其内部空间，并将电连接线1500模塑在其内部。支撑座1300顶部安装滤光片1400。滤光片1400的主要作用是滤除杂光，有效提升成像的质量。由此，感光芯片1200被容纳于线路板1100、支撑座1300和滤光片1400组成的内部空间中。
根据示例实施例，线路板1100可包括第一线路板1110、第二线路板1120和连接器1130。第一线路板1110可以是硬质线路板。第二线路板1120可以是柔性印刷线路板。其中，第一线路板1110与感光芯片1200相连，设置于感光芯片1200的背侧；第二线路板1120和连接器1130用于将第一线路板1110与外部主板相连，并为第一线路板1110和摄像模组感光组件1200提供工作电源。
感光组件的封装方式有多种，图1中所示感光组件的封装方式为模塑工艺。利用模塑的方法将连接感光芯片1200和线路板1100的电连接线1500以及其他一些电子元件模塑在内部，同时将模塑部的外形直接模塑成适于安装滤光片的支撑座1300，将滤光片1400安装在支撑座1300上。此封装方式可以降低模组的高度、有效的减轻摄像模组的重量，但本申请不限于此。
为了改善摄像模组的成像质量，本申请提出一种通过驱动线路板移动而间接驱动感光芯片移动的芯片防抖方式。感光芯片和线路板的相对位置保持不变，在线路板下面加装驱动装置，使得驱动装置直接驱动线路板移动。由于感光芯片固定在线路板上面，驱动线路板移动相当于驱动感光芯片移动。此种驱动方式不仅可以有效的驱动感光芯片移动，还可以防止感光芯片在移动过程中可能出现的芯片受损和电路受损情况。
感光芯片体积较小、制造成本较高，受到外力的作用时很容易损坏芯片。因此，相对于直接驱动感光芯片移动的芯片防抖方式而言，通过驱动线路板移动而间接驱动感光芯片移动的芯片防抖方式，不仅可以避免直接驱动感光芯片的过程中可能出现的感光芯片受损问题，还可以避免感光芯与线路板的电连接线连接点受损而造成的通电不良等问题。
图2示出根据本申请示例实施例的线路板组件结构示意图。
为了实现上述芯片防抖方式，本申请提供一种用于摄像模组的线路板组件200，如图2所示。线路板组件200除了包括第一线路板1110、第二路板1120和连接器1130之外，还包括线路板驱动装置240。
根据本申请的示例实施例，第一线路板1110可以是硬质线路板，第二线路板1120可以是柔性印刷线路板。根据本申请的另一些实施例，第一线路板1110和第二线路板1120均可以是柔性印刷线路板，两者可以一体成型。柔性的第一线路板1110的背面可以设置补强板。所述补强板可以为钢板结构，与第一线路板1110相连、为其提供刚性支撑。
如图2所示，线路板驱动装置240包括可动部241和固定部242。根据本申请的一些实施例，线路板驱动装置240可以采用技术成熟的MEMS致动器，其可动部241和固定部242之间采用弹性部件进行连接，整体作为一个独立组件。关于致动器的结构为本领域技术人员所熟知，本申请不再赘述。
可动部241和固定部242之间通电后，因静电作用，可动部241可以产生位移。可动部241与第一线路板1110相连，例如可以设置于第一线路板1110的下方并与其进行固定。可动部241与第一线路板1110之间可以采用粘接的形式进行固定，也可以采用焊接的形式进行固定，具体的固定方式可以根据实际情况来设置，本申请对此没有特别限制。
根据本申请的示例实施例，线路板组件200还可以包括基座250，与所述固定部242相连，为所述线路板装置提供支撑。
根据本申请的另一些实施例，基座250也可以作为摄像模组的组成部分。摄像模组包括镜头组件、感光组件和基座。镜头组件包括镜头、镜头载体或者马达。在组装摄像模组时，线路板组件200中的固定部242与基座250相连。镜头载体或马达与基座250相连，将感光组件包容在其内部。
在第一线路板1110背面设置线路板驱动装置240还可以加强第一线路板1110的强度，防止感光芯片翘曲。随着摄像模组技术的发展以及像素的提升，大芯片也成为了一种趋势。但是感光芯片的面积增加会使得周边的翘曲更加显著。利用此种方式设置驱动结构，不仅可以有效的驱动第一线路板1110进行移动，还可以增强线路板的强度，防止感光芯片的周边出现翘曲。
根据本申请的一些实施例，线路板驱动装置240可以是MEMS驱动装置，也可以其他能够实现静电驱动的驱动装置，本申请不限于此。当MEMS驱动装置的可动部与固定部之间由于静电力的作用而发生移动的时候，会带动与其固定在一起的线路板进行相应的移动，从而调整感光芯片的位置，继而实现摄像模组拍照过程中的抖动矫正。
下面简述利用MEMS驱动装置实现芯片防抖的工作过程。根据一些实施例，摄像模组在拍摄过程中，移动终端中的陀螺仪检测到抖动情况，将抖动信息发送给控制中心。控制中心计算感光芯片需要矫正的位置并输出运动指令。MEMS驱动装置根据控制中心发送的运动指令进行驱动。基于本申请的技术方案，本领域技术人员容易实现上述控制过程，故在此不做详细阐述。
图3示出根据本申请示例实施例的MEMS驱动装置结构示意图。
如图3所示，MEMS驱动装置240的具体形式可以是至少一个第一致动器2401和/或至少一个第二致动器2402。第一致动器2401可以实现水平面X、Y方向上的位置调整，即平移。第二致动器2402可以实现沿垂直于X、Y平面轴线的旋转位置调整。
根据本申请的示例实施例，第一致动器2401可以是梳形结构，第二致动器2402可以是扇形结构。第一致动器2401和第二致动器2402均包括可动部241和固定部242。扇形的第二致动器2402在静电力的驱使下，使得可动部旋转一定角度，旋转角度的大小与电压差相匹配。梳形的第一致动器2401在静电力的驱使下，使得可动部沿着X、Y轴正负方向进行平移，从而带动线路板进行水平方向抖动的调整，继而实现芯片的位置调整。
参见图3，在本申请的实例实施例中，第一致动器2401和第二致动器2402数量均为4个。其中4个第二致动器2402布置在第一线路板1110背侧的中间位置，4个第一致动器2401布置在第一线路板1110背侧的四周。图3中所示的布置方案可以达到较佳的驱动效果，但是第一致动器2401和第二致动器2402数量以及布置的位置可以根据实际需求进行设置，本申请不限于此。
图4示出根据本申请示例实施例的线路板组件连接示意图一。
如图4所示，上述线路板组件200用于摄像模组时，第一线路板1110 与感光芯片1200相连，设置于感光芯片1200下方。线路板驱动装置240的可动部241与第一线路板1110相连，设置于第一线路板1110下方。线路板驱动装置240的固定部242固定在基座250上。基座250可以作为线路板组件200的一部分，也可以作为摄像模组的结构组成。基座250内部直接设置相应的线路，为MEMS驱动装置通电。基座250的制作工艺可以是制作线路板的层压工艺，本申请不再赘述。
第一线路板1110中的电流由延伸出基座250外部的第二线路板1120提供。第二线路板1120穿过基座250与第一线路板1110相连。连接器1130固定于第二线路板1120的一端，直接安装在设备的主板上面，并与主板上面的供电装置接通，以实现第一线路板1110的通电。
根据本申请的示例实施例，第一线路板1110可以是硬质线路板，第二线路板1120可以是柔性印刷线路板。根据本申请的另一些实施例，第一线路板1110和第二线路板1120均可以是柔性印刷线路板，两者可以一体成型。柔性的第一线路板1110的底面可以设置补强板，与其相连、为其提供刚性支撑。
图5示出根据本申请示例实施例的线路板驱动组件连接局部放大示意图。
如图5所示，MEMS驱动装置240包括可动部241和固定部242。可动部241与第一线路板1110连接在一起。固定部242和基座250连接在一起。MEMS驱动装置240通电后，由于静电力的作用，可动部241与固定部242发生相对运动，从而带动第一线路板1110相对于基座250发生移动。感光芯片1200和第一线路板1110固定在一起，并通过电连接线1500进行电连接。第一线路板1110发生移动同时也会带动感光芯片1200发生相对运动，以实现芯片位置的相对调整。
图6示出根据本申请示例实施例的线路板组件移动示意图。
如图6所示，第二线路板1120一端与第一线路板1110相连，另一端固定在设备的主板上面，连接器1130和主板的固定位置不会发生移动。因此当第一线路板1110在线路板驱动装置240的驱动下发生移动的时候，第二线路板1120和第一线路板1110连接处由于频繁受力的原因，会使得第二线路板1120与第一线路板1110连接处出现撕裂或者部分撕裂等情况，严重时 可能会影响连接器1130与主板的连接，使得主板与连接器1130固定处也出现接触不良，导致通电不良影响模组的正常工作。
因此，为了进一步减少第二线路板1120对第一线路板1110移动产生的阻力，本申请采用一种经过弯折处理的第二线路板1120。第二线路板1120经过弯折处理后，可以预留出第一线路板1110的活动范围。当第一线路板1110频繁移动时，由于预留了足够了的活动范围，第一线路板1110移动不会影响连接器1130处的连接，从而避免因频繁移动出现的撕裂等问题。
此外，为了进一步减小第二线路板1120对第一线路板1110移动产生的阻力，根据本申请的一些实施例，还可以将第二线路板1120中没有布设线路的部分镂空。利用第二线路板1120中间的镂空结构1121(如图8中所示)，可以有效减少模组运动过程中第二线路板1120对其的作用力，尤其是线路板组件200绕着光轴方向旋转调整时，效果更佳明显。
图7示出根据本申请示例实施例的减小线路板驱动阻力的方法流程图。
图8A示出根据本申请示例实施例的柔性印刷线路板弯折过程示意图一。
图8B示出根据本申请示例实施例的柔性印刷线路板弯折过程示意图二。
如图7所示，本申请提供了一种减小线路板驱动阻力的方法，包括：
在步骤S710，对第二线路板上未布设线路的位置进行镂空处理。例如，可以将第二线路板中间没有布设线路的部分镂空，可以有效减少模组运动过程中第二线路板对其的作用力，尤其是线路板组件绕着光轴方向旋转调整时，效果更佳明显。
在步骤S720，对所述第二线路板进行弯折处理。经过镂空处理后，再对第二线路板进行弯折处理。首先，采用限位治具对所述第二线路板头部进行下压限位。如图8A所示，柔性的第二线路板1120在弯折过程为，需要将其头部固定，并通过限位治具对头部进行限位。然后，分别使用一组热压头对所述第二线路板两侧进行热压。如图8B所示，头部固定后，布置于第二线路板1120两侧的一组热压头222，对第二线路板1120进行热压成型。第二线路板1120的材料可以是FPC软板。通过持续的高温和下压力使得FPC软板形状固定，形成弯折。
图9示出根据本申请示例实施例的摄像模组立体图。
图10示出根据本申请示例实施例的摄像模组侧视图。
根据本申请的第二方面，提供一种摄像模组2000。摄像模组2000包括镜头组件2100和感光组件封装体2200。镜头组件2100包括镜头2110、镜头载体或者马达2120。感光组件封装体2200包括感光组件和基座250。其中，镜头组件2100与感光组件封装体2200相连，例如镜头组件2100的镜头载体2120与感光组件封装体2200中的基座通过焊接或胶接的方式连接在一起；线路板组件的第二线路板1120和连接器1130穿过基座250，与外部主板相连。连接器1130与主板上面的供电装置接通后，线路板组件提供电流，实现线路通电。
图11示出根据本申请示例实施例的摄像模组感光组件封装体结构示意图。
如图11所示，摄像模组感光组件封装体2200包括感光组件1000和基座250。感光组件1000包括线路板组件200、感光芯片1200、支撑座1300和滤光片1400。线路板组件200包括第一线路板1110、第二路板(图中未示)、连接器(图中未示)以及线路板驱动装置240。线路板驱动装置240包括可动部241和固定部242。
可动部241与第一线路板1110相连，设置于第一线路板1110的下表面。固定部242与基座250相连，设置于基座250的上表面。感光芯片1200与第一线路板1110相连，设置于第一线路板1110上。感光芯片1200固定在第一线路板1110上，并通过电连接线1500(例如金线)将感光芯片1200和第一线路板1110导通，以实现感光芯片1200工作过程中的供电和信号传递。支撑座1300固定在第一线路板1110上，将感光芯片1200容纳于其内部空间，并将电连接线1500模塑在其内部。支撑座1300顶部安装滤光片1400。滤光片1400的主要作用是滤除杂光，有效提升成像的质量。由此，感光芯片1200被容纳于线路板1100、支撑座1300和滤光片1400组成的内部空间中，可以有效的保护感光芯片的正常工作。
感光组件的封装方式有多种，图11中所示的感光组件的封装方式为模塑工艺。利用模塑的方法将连接感光芯片1200和第一线路板1110的电连接线1500以及电子元件1600模塑在内部，同时将模塑的外形直接模塑成 适于安装滤光片的支撑座1300，将滤光片1400安装在支撑座1300上。此封装方式可以降低模组的高度、有效的减轻摄像模组的重量，但本申请不限于此。
线路板驱动装置240可动部241和固定部242之间通电后，因静电作用，可动部241可以相对于固定部242发生位移，从而驱动第一线路板1110移动。由于感光芯片1200与第一线路板1110固定相连，可间接带动感光芯片1200移动，从而实现芯片防抖。
图12示出根据本申请示例实施例的摄像模组局部示意图。
如图12所示，所述摄像模组2000的镜头组件2100，安装在感光组件封装体2200上。镜头组件2100用于捕捉并聚焦待拍摄的目标物以传递给感光芯片1200。镜头组件2100包括镜头2110、镜头载体或者马达2120。
马达2120驱动镜头2110移动，实现拍摄过程中的自动对焦功能。镜头载体或者马达2120安装于基座250上，与基座250之间通过粘接或者焊接方式进行固定。感光芯片1200和第一线路板1110的相对位置保持不变。在第一线路板1110下面加装线路板驱动装置240。线路板驱动装置240的可动部241和固定部242之间通电后，由于静电作用，可动部241相对于固定部242产生位移，从而驱动第一线路板1110移动，间接驱动感光芯片移动。由此，根据摄像模组的防抖要求，可通过控制线路板驱动装置来实现芯片防抖，改善摄像模组的成像质量。
图13示出根据本申请示例实施例的终端设备组成示意图。
此外，如图13所示，本申请还提供一种终端设备3000，包括如上所述的摄像模组。
参见图13，所述终端设备3000可以包括：至少一个处理器3001，至少一个网络接口3004，用户接口3003，存储器3005，至少一个通信总线3002。
其中，通信总线3002用于实现这些组件之间的连接通信。
其中，用户接口3003可以包括显示屏(Display)、上述摄像模组2000(Camera)，可选用户接口3003还可以包括标准的有线接口、无线接口。
其中，网络接口3004可选的可以包括标准的有线接口、无线接口(如WI-FI接口)。
其中，处理器3001可以包括一个或者多个处理核心。处理器3001利用各种接口和线路连接整个终端设备3000内的各个部分，通过运行或执行存储在存储器3005内的指令、程序、代码集或指令集，以及调用存储在存储器3005内的数据，执行终端设备3000的各种功能和处理数据。可选的，处理器3001可以采用数字信号处理(Digital Signal Processing，DSP)、现场可编程门阵列(Field-Programmable Gate Array，FPGA)、可编程逻辑阵列(Programmable Logic Array，PLA)中的至少一种硬件形式来实现。处理器3001可集成中央处理器(Central Processing Unit，CPU)、图像处理器(Graphics Processing Unit，GPU)和调制解调器等中的一种或几种的组合。其中，CPU主要处理操作系统、用户界面和应用程序等；GPU用于负责显示屏所需要显示的内容的渲染和绘制；调制解调器用于处理无线通信。可以理解的是，上述调制解调器也可以不集成到处理器3001中，单独通过一块芯片进行实现。
其中，存储器3005可以包括随机存储器(Random Access Memory，RAM)，也可以包括只读存储器(Read-Only Memory)。可选的，该存储器1005包括非瞬时性计算机可读介质(non-transitory computer-readable storage medium)。存储器3005可用于存储指令、程序、代码、代码集或指令集。存储器3005可包括存储程序区和存储数据区，其中，存储程序区可存储用于实现操作系统的指令、用于至少一个功能的指令(比如触控功能、声音播放功能、图像播放功能等)、用于实现上述各个方法实施例的指令等；存储数据区可存储上面各个方法实施例中涉及到的数据等。存储器3005可选的还可以是至少一个位于远离前述处理器3001的存储装置。如图13所示，作为一种计算机存储介质的存储器3005中可以包括操作系统、网络通信模块、用户接口模块以及视频图像处理应用程序。
本申请提供了一种用于摄像模组的线路板组件，在硬质线路板背面设置MEMS驱动装置，通过驱动线路板移动进而间接驱动感光芯片不同方位的位置调整，从而实现摄像模组拍摄过程中的抖动矫正，以替代传统的马达防抖。此外，为了减小连接器在线路板移动过程中产生的阻力，本申请提供的线路板组件采用弯折镂空的柔性印刷线路板，为线路板移动预留充足的空间，保证线路板移动的有效进行。本申请提供的防抖解决思路，将 防抖结构由原来的驱动镜头移动转为驱动芯片运动实现防抖，可以实现更大行程的防抖，提升防抖的能力，适应目前高倍变焦模组的发展趋势。
显然，上述实施例仅是为清楚地说明本申请所作的举例，而并非对实施方式的限定。对于所属领域的普通技术人员来说，在上述说明的基础上还可以做出其它不同形式的变化或变动。这里无需也无法对所有的实施方式予以穷举。而由此所引申出的显而易见的变化或变动仍处于本申请的保护范围之中。

Claims (18)

  1. 一种用于摄像模组的线路板组件，其特征在于，包括：
    线路板；
    线路板驱动装置，包括可动部和固定部，所示可动部与所述线路板相连，驱动所述线路板移动。
  2. 根据权利要求1所述的线路板组件，其特征在于，所述线路板驱动装置，包括：
    MEMS驱动装置。
  3. 根据权利要2所述的线路板组件，其特征在于，所述MEMS驱动装置包括：
    至少一个第一致动器，用于驱动所述线路板平移，所述第一致动器包括梳形致动器。
  4. 根据权利要3所述的线路板组件，其特征在于，所述MEMS驱动装置，还包括：
    至少一个第二致动器，用于驱动所述线路板旋转，所述第二致动器包括扇形致动器。
  5. 根据权利要2所述的线路板组件，其特征在于，所述MEMS驱动装置包括：
    四个第一致动器，分别设置于所述线路板底面的四周，用于驱动所述线路板平移；
    四个第二致动器，设置于所述线路板底面的中间位置，用于驱动所述线路板旋转。
  6. 根据权利要求1所述的线路板组件，其特征在于，所述线路板包括：
    第一线路板，包括硬质线路板；
    弯折的第二线路板，包括柔性印刷线路板，与所述第一线路板相连；
    连接器，一端与所述第二线路板相连，另一端与外部供电装置相连。
  7. 根据权利要求6所述的线路板组件，其特征在于，所述可动部与所述第一线路板的连接方式包括：
    焊接或粘接。
  8. 根据权利要求6所述的线路板组件，其特征在于，所述弯折的第二线路板包括：
    镂空结构，设置于所述弯折的第二线路板上布设的线路之间。
  9. 根据权利要求1所述的线路板组件，其特征在于，所述线路板包括：
    第一柔性印刷线路板；
    第二柔性印刷线路板，与第一柔性印刷线路板一体成型；
    补强板，与所述第一柔性印刷线路板的底面相连，为其提供刚性支撑。
  10. 根据权利要求1-9所述的线路板组件，其特征在于，还包括：
    感光芯片，设置于所述线路板的上表面。
  11. 根据权利要求10所述的线路板组件，其特征在于，所述感光芯片与所述线路板通过电连接线连接。
  12. 根据权利要求11所述的线路板组件，其特征在于，还包括：
    支撑座，固定在所述线路板上，将所述感光芯片容纳于其内部空间，所述支撑座采用模塑工艺成型，将所述电连接线模塑在其内部。
  13. 根据权利要求12所述的线路板组件，其特征在于，还包括：
    滤光片，设置于所述支撑座上，所述感光芯片被容纳于所述线路板、所述支撑座和所述滤光片组成的内部空间。
  14. 一种摄像模组，其特征在于，包括：
    如权利要求10-13中任一项所述的线路板组件；
    镜头组件，设置在所述线路板组件的所述感光芯片上方。
  15. 根据权利要求14所述的摄像模组，其特征在于，还包括：
    基座，与所述线路板驱动装置的固定部相连。
  16. 根据权利要求15所述的摄像模组，其特征在于，所述镜头组件包括：
    镜头、以及镜头载体或者马达，所述镜头载体或马达与所述基座相连。
  17. 一种终端设备，其特征在于，包括权利要求14-16中任一项所述的摄像模组。
  18. 一种减小权利要求6中所述线路板驱动阻力的方法，其特征在于，包括：
    对第二线路板上未布设线路的位置进行镂空处理；
    对所述第二线路板进行弯折处理。
PCT/CN2021/104244 2020-07-20 2021-07-02 用于摄像模组的线路板组件、摄像模组及终端设备 Ceased WO2022017160A1 (zh)

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