WO2022016984A1 - 光学胶带、显示面板和光学胶带制备方法 - Google Patents

光学胶带、显示面板和光学胶带制备方法 Download PDF

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Publication number
WO2022016984A1
WO2022016984A1 PCT/CN2021/095634 CN2021095634W WO2022016984A1 WO 2022016984 A1 WO2022016984 A1 WO 2022016984A1 CN 2021095634 W CN2021095634 W CN 2021095634W WO 2022016984 A1 WO2022016984 A1 WO 2022016984A1
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WO
WIPO (PCT)
Prior art keywords
optical tape
layer
buffer layer
filler
opening
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Ceased
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PCT/CN2021/095634
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English (en)
French (fr)
Inventor
田雨宸
米建松
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Kunshan Govisionox Optoelectronics Co Ltd
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Kunshan Govisionox Optoelectronics Co Ltd
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Publication of WO2022016984A1 publication Critical patent/WO2022016984A1/zh
Priority to US17/867,096 priority Critical patent/US20220348796A1/en
Anticipated expiration legal-status Critical
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/29—Laminated material
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/318—Applications of adhesives in processes or use of adhesives in the form of films or foils for the production of liquid crystal displays
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
    • C09J2301/12—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
    • C09J2301/124—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present on both sides of the carrier, e.g. double-sided adhesive tape
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
    • C09J2301/16—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the structure of the carrier layer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2400/00—Presence of inorganic and organic materials
    • C09J2400/10—Presence of inorganic materials
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2400/00—Presence of inorganic and organic materials
    • C09J2400/10—Presence of inorganic materials
    • C09J2400/12—Ceramic
    • C09J2400/123—Ceramic in the substrate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2400/00—Presence of inorganic and organic materials
    • C09J2400/10—Presence of inorganic materials
    • C09J2400/16—Metal
    • C09J2400/163—Metal in the substrate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2400/00—Presence of inorganic and organic materials
    • C09J2400/20—Presence of organic materials
    • C09J2400/24—Presence of a foam
    • C09J2400/243—Presence of a foam in the substrate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2467/00—Presence of polyester
    • C09J2467/006—Presence of polyester in the substrate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2479/00—Presence of polyamine or polyimide
    • C09J2479/08—Presence of polyamine or polyimide polyimide
    • C09J2479/086—Presence of polyamine or polyimide polyimide in the substrate

Definitions

  • the present application relates to the field of display technology, in particular to an optical tape, a display panel and a method for preparing the optical tape.
  • a fingerprint hole fingerprint on display, FOD
  • FOD fingerprint on display
  • the embodiments of the present application are devoted to providing an optical tape, a display panel using the optical tape, and a method for preparing the optical tape, which solve the uneven color, uneven depth and obvious boundaries of the above-mentioned fingerprint holes during the preparation process. And other issues.
  • an embodiment of the present application provides an optical tape for use in a fingerprint identification area, comprising: a first buffer layer; and an opening corresponding to the fingerprint identification area and penetrating the first buffer layer layer; wherein the opening is filled with a peelable filler, and the filler includes a second buffer layer.
  • an embodiment of the present application provides a display panel, comprising: an array substrate, with pixel units disposed on one side of the array substrate; and an optical tape, the optical tape is located on the array substrate away from all One side of the pixel unit, wherein the optical tape comprises the optical tape according to any one of the above.
  • an embodiment of the present application provides a method for preparing an optical tape, which is used for preparing an optical tape for a fingerprint identification area, including: preparing a first buffer layer; preparing a first buffer layer corresponding to the fingerprint identification area an opening through the first buffer layer; wherein the opening is filled with a detachable filler, and the filler includes a second buffer layer.
  • the embodiments of the present application provide an optical tape, a display panel, and a method for preparing the optical tape.
  • the filler includes a second buffer layer, and the use of the second buffer layer can realize that the same pressure, light and temperature conditions have the same or similar effects on the opening and other positions of the optical tape during the preparation process, thereby avoiding the need for
  • the phenomenon of uneven color, uneven depth and obvious boundary of the fingerprint hole corresponding to the opening improves the product yield, and after the preparation is completed, the filler in the opening is peeled off to ensure the function of the fingerprint hole to capture fingerprints.
  • FIG. 1 is a schematic structural diagram of an optical tape according to an embodiment of the present application, wherein the openings are filled with a second buffer layer, a second heat dissipation layer, and a second adhesive layer.
  • FIG. 2 is a schematic structural diagram of an optical tape according to another embodiment of the present application, wherein only the second buffer layer and the second adhesive layer are filled in the opening.
  • FIG. 3 is a schematic flowchart of a method for preparing an optical tape according to an embodiment of the present application.
  • the mask plate includes opening regions and shielding regions adjacent to the opening regions.
  • FIG. 1 is a schematic structural diagram of an optical tape according to an embodiment of the present application, wherein the openings are filled with a second buffer layer, a second heat dissipation layer, and a second adhesive layer.
  • the optical tape is used in the fingerprint identification area, including a first buffer layer 11 and an opening 2; the opening 2 is correspondingly arranged at the fingerprint identification area and penetrates the first buffer layer 11;
  • the releasable filler 3 is filled, and the filler 3 includes the second buffer layer 31 .
  • the display panel is usually provided with a film layer for buffering external stress on the non-light-emitting side of the array substrate layer, and the film layer for buffering external stress usually adopts optical tape.
  • the composite film layer can achieve the function of buffering external stress, and other materials in the composite film layer can also achieve other required functions, such as setting a material or film layer with thermal conductivity, just To achieve thermal conductivity.
  • the composite film layer can achieve the function of buffering external stress, and other materials in the composite film layer can also achieve other required functions, such as setting a material or film layer with thermal conductivity, just To achieve thermal conductivity.
  • the fingerprint hole is arranged on the non-light-emitting side of the display panel to avoid the fingerprint hole occupying the screen area, and optical tape is used as a buffer film
  • the optical tape needs to be provided with a through hole at the position corresponding to the fingerprint hole, so as to ensure that the light on the user's finger passes through the through hole to reach the fingerprint recording module to realize fingerprint recognition, and the optical tape with the opening is set on the display module.
  • the preparation process of the group because there is no other film layer at the opening of the optical tape, and other film layer materials are included in other positions of the optical tape, and different film layer materials respond differently to pressure, light and temperature, that is, during the preparation process.
  • the opening position of the optical tape has different properties from other positions, resulting in uneven color brightness or depth between the opening position of the optical tape and other positions after the display panel is prepared, and even at the edge of the opening. A clear boundary appears, which eventually leads to an increase in the defective rate of the product.
  • the embodiment of the present application provides an optical tape structure
  • the optical tape includes a first buffer layer 11, and the first buffer layer 11 can be used to realize the functions of the optical tape to absorb and relieve external stress;
  • the optical tape corresponds to the fingerprint identification area
  • the opening 2 of the first buffer layer 11 of the optical tape is arranged at the position of the optical tape, the fingerprint recognition function can be realized through the opening 2, and the filler 3 that can be peeled off is filled in the opening 2, and the filler 3 includes the second buffer layer. 31.
  • the material of the second buffer layer 31 can be the same as or similar to that of the first buffer layer 11, and the same pressure, light and temperature conditions can be achieved by using the filler 3 to have the same or similar effects on the opening 2 and other positions of the optical tape, thereby To avoid the different conditions in the preparation process, the display effect of the opening 2 and other positions of the optical tape is different (ie, the phenomenon of uneven color, uneven depth and obvious boundaries).
  • the first buffer layer 11 may include foam, and the foam can absorb and relieve external stress, thereby reducing the influence of external stress on the array substrate.
  • the second buffer layer 31 includes a flexible material such as polyethylene terephthalate or foam, and the same pressure, The effect of light and temperature conditions on opening 2 is consistent with other locations on the optical tape.
  • specific materials of the first buffer layer 11 and the second buffer layer 31 may be selected according to the requirements of the actual application scenario.
  • the second buffer layer 31 may also include black polyimide (PI) or other non-ferrous materials.
  • PI black polyimide
  • the light-transmitting material only needs to ensure that the materials of the first buffer layer 11 and the second buffer layer 31 are the same or similar and have the function of relieving external stress.
  • the specific material is not limited.
  • An optical adhesive tape provided by an embodiment of the present application, by arranging an opening through the first buffer layer of the optical adhesive tape at a position corresponding to the fingerprint identification area of the optical adhesive tape, and filling the opening with a detachable filler, the filler Including a second buffer layer, the use of the second buffer layer can realize that the same pressure, light and temperature conditions have the same or similar effects on the opening and other positions of the optical tape during the preparation process, thereby avoiding the fingerprint identification corresponding to the opening
  • the phenomenon of uneven color, uneven depth and obvious boundary in the area improves the product yield, and after the preparation is completed, the filler in the opening is peeled off to ensure the function of the fingerprint hole to capture fingerprints.
  • the optical tape may include a first heat dissipation layer 12 laminated with the first buffer layer 11 .
  • the first heat dissipation layer 12 can be used to realize the heat dissipation function of the optical tape to the array substrate.
  • the first heat dissipation layer 12 may include a material with better thermal conductivity, for example, the first heat dissipation layer 12 may be copper foil or the like. The rigidity of the copper foil can be used to provide a certain support to the array substrate.
  • the specific material of the first heat dissipation layer 12 may be selected according to the requirements of the actual application scenario, as long as the heat conduction function of the first heat dissipation layer 12 is ensured, and the specific material of the first heat dissipation layer 12 is not required in the embodiment of the present application. limited.
  • a gap 21 may be left between the filler 3 and the inner wall of the opening 2 .
  • the width d of the gap 21 may include 0.1 mm to 0.2 mm.
  • the specific width of the gap 21 may be selected according to the requirements of the actual application scenario, as long as the selected width of the gap 21 can ensure the simple peeling of the filler 3 , and the specific width of the gap 21 in this embodiment of the present application does not limited.
  • the optical tape may further include a release film 13 , the release film 13 is located on the side of the first buffer layer 11 away from the first heat dissipation layer 12 , and the release film 13 covers the filler 3 .
  • Release film refers to a film that can be peeled off from the surface. The release film is not sticky or slightly sticky after contact with a specific material under limited conditions. The main functions of the release film are isolation, filling, protection, and ease of use. stripped. By arranging the release film 13, the optical tape can be isolated from the outside world, and when the optical tape is attached to the array substrate, only after peeling off the release film 13, the optical tape can be attached to the array substrate, and the operation is simple .
  • the optical tape may further include a first adhesive layer 14 , and the first adhesive layer 14 is disposed between the release film 13 and the first buffer layer 11 .
  • the first adhesive layer 14 can be used to realize the bonding between the optical tape and the array substrate, and the release film 13 can be used to isolate and protect the optical tape before the bonding.
  • the first adhesive layer 14 may include double-sided adhesive, such as optical adhesive, etc.
  • the specific material of the first adhesive layer 14 may be selected according to the requirements of the actual application scenario, such as optical adhesive, water adhesive, etc. etc., as long as the first adhesive layer 14 can ensure the bonding between the optical tape and the array substrate, the embodiment of the present application does not limit the specific material of the first adhesive layer 14 .
  • the optical tape may further include a protective film 15 , the protective film 15 is located on the side of the first heat dissipation layer 12 away from the first buffer layer 11 , and the protective film 15 covers the filler 3 .
  • the protective film 15 By providing the protective film 15 , other film layers of the optical tape and the filler 3 can be protected by the protective film 15 .
  • the optical tape may further include a first thermal conductive layer 16 , and the first thermal conductive layer 16 is located between the first buffer layer 11 and the first heat dissipation layer 12 .
  • the first thermally conductive layer 16 may include a PI layer or a graphite layer.
  • the thermal conductivity of graphite can be used to cooperate with the first heat dissipation layer 12 to separate the array substrate and the first buffer layer.
  • the heat of the layer 11 is transferred to the first heat dissipation layer 12 through the first thermal conductive layer 16, thereby further improving the heat dissipation effect; the flexibility of PI (polyimide) can improve the module bonding indentation and other defects, and due to the graphite
  • the layer is usually a lamellar structure, and there will be phenomena such as delamination and chipping.
  • the PI layer is used to wrap the graphite to avoid the problem of delamination and chipping of the graphite after the reliability test.
  • the first buffer layer 11 and the first heat dissipation layer 12 it is possible to select whether other film layers are arranged between the first buffer layer 11 and the first heat dissipation layer 12 and the specific materials of the film layers, such as the first buffer layer 11 and the first heat dissipation layer 12 according to the requirements of the actual application scenario.
  • the film layer between them only needs to meet the heat dissipation requirements.
  • the embodiment of the present application does not limit the specific film layer between the first buffer layer 11 and the first heat dissipation layer 12 and the specific material of the film layer.
  • the filler 3 may include a second adhesive layer 32 , and the second adhesive layer 32 is located between the second buffer layer 31 and the protective film 15 .
  • the protective film 15 can be peeled off to realize the joint peeling and the sticking filling of the protective film 15 3, so that the peeling of the filler 3 is simply realized, and the preparation of the fingerprint hole is realized.
  • the specific material of the second adhesive layer 32 can be selected according to the requirements of the actual application scenario, such as optical adhesive, water adhesive, etc., as long as the second adhesive layer 32 can ensure that the filler 3 can be attached when the protective film 15 is peeled off It can be peeled off, and the embodiment of the present application does not limit the specific material of the second adhesive layer 32 .
  • the filler 3 may include a second heat dissipation layer 33 , and the second heat dissipation layer 33 is located between the second buffer layer 31 and the second adhesive layer 32 .
  • the second heat dissipation layer 33 may include a material with better thermal conductivity, for example, the second heat dissipation layer 33 may be copper foil, etc. By arranging the copper foil, not only the heat conduction and The heat dissipation function can also use the rigidity of the copper foil to provide a certain support for the opening 2 .
  • the specific material of the second heat dissipation layer 33 may be selected according to the requirements of the actual application scenario, as long as the selected material of the second heat dissipation layer 33 can ensure the heat conduction function of the second heat dissipation layer 33, the embodiment of the present application
  • the specific material of the second heat dissipation layer 33 is not limited.
  • the filler 3 may further include a second thermally conductive layer 34 .
  • the second thermally conductive layer 34 may include a PI layer or a graphite layer.
  • the optical tape may include a release film 13 , a first adhesive layer 14 , and a first buffer layer 11 that are stacked in sequence along the direction of the side close to the array substrate and the side away from the array substrate.
  • the first heat dissipation layer 12, the protective film 15, and the corresponding filler 3 along the direction of the side close to the array substrate and the side away from the array substrate may sequentially include a second buffer layer 31, a second heat dissipation layer 33, a second buffer layer 31, a second heat dissipation layer 33, a second Adhesive layer 32 .
  • a first thermal conductive layer 16 may be included between the first buffer layer 11 and the first heat dissipation layer 12 .
  • the second buffer layer 31 in the filler 3 and the second A second heat-conducting layer 34 is included between the heat-dissipating layers 33 .
  • FIG. 2 is a schematic structural diagram of an optical tape according to another embodiment of the present application, wherein only the second buffer layer and the second adhesive layer are filled in the opening.
  • the optical tape includes a first buffer layer 11; an opening 2 passing through the first buffer layer 11 is provided at the position of the optical tape corresponding to the fingerprint identification area; wherein, the opening 2 is filled with a detachable filler 3,
  • the filler 3 includes the second buffer layer 31 .
  • the optical tape may further include any one or more of the release film 13 , the first heat dissipation layer 12 , the first adhesive layer 14 , the protective film 15 , and the first heat conduction layer 16 in the above embodiments
  • the filler may further include a second adhesive layer 32 disposed between the second buffer layer 31 and the protective film 15 .
  • the second buffer layer 31 is filled in the opening 2 and the second adhesive layer 32 that adheres the second buffer layer 31 and the protective film 15 can be filled, so that the opening 2 can be the same as other positions of the optical tape.
  • the display effect is consistent under different pressure, light and temperature conditions, so as to avoid the phenomenon of uneven color, uneven depth and obvious boundary, and peel off the filler 3 by peeling off the protective film 15.
  • An embodiment of the present application also provides a display panel, including: an array substrate, on which pixel units are arranged on one side; and an optical tape, where the optical tape is located on a side of the array substrate away from the pixel units, wherein the optical tape includes any of the above An optical tape of the kind described.
  • an opening through the first buffer layer of the optical tape is provided at a position of the optical tape corresponding to the fingerprint identification area, and a detachable filler is filled in the opening, and the filler Including a second buffer layer, the use of the second buffer layer can realize that the same pressure, light and temperature conditions have the same or similar effects on the opening and other positions of the optical tape during the preparation process, thereby avoiding the fingerprint identification corresponding to the opening.
  • the phenomenon of uneven color, uneven depth and obvious boundary in the area improves the product yield, and after the preparation is completed, the filler in the opening is peeled off to ensure the function of the fingerprint hole to capture fingerprints.
  • FIG. 3 is a schematic flowchart of a method for preparing an optical tape according to an embodiment of the present application. As shown in FIG. 3 , the method for preparing an optical tape provided in the embodiment of the present application is used for preparing an optical tape for a fingerprint identification area, including the following steps.
  • Step S10 preparing a first buffer layer.
  • Step S20 preparing an opening through the first buffer layer corresponding to the fingerprint identification area.
  • the opening is filled with a detachable filler, and the filler includes a second buffer layer.
  • the first buffer layer is first prepared, and then the openings penetrating the first buffer layer are prepared at the corresponding fingerprint identification area.
  • an opening through the first buffer layer of the optical tape is prepared at a position of the optical tape corresponding to the fingerprint identification area, and a releasable filler is filled in the opening, and the filler Including a second buffer layer, the use of the second buffer layer can realize that the same pressure, light and temperature conditions have the same or similar effects on the opening and other positions of the optical tape during the preparation process, thereby avoiding the fingerprint identification corresponding to the opening.
  • the optical tape method provided by the embodiments of the present application improves the product yield and ensures the function of fingerprint holes to capture fingerprints.

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Adhesive Tapes (AREA)
  • Laminated Bodies (AREA)

Abstract

本申请实施例提供了一种光学胶带、显示面板和光学胶带制备方法，该光学胶带包括第一缓冲层和开孔，开孔对应指纹识别区处设置且贯穿第一缓冲层，开孔内填充可脱落的填充物，该填充物包括第二缓冲层。

Description

光学胶带、显示面板和光学胶带制备方法 技术领域
本申请涉及显示技术领域，具体涉及一种光学胶带、显示面板和光学胶带制备方法。
发明背景
在柔性显示面板中，贴合指纹模组需在复合胶带、柔性电路板等材料上开指纹孔(fingerprint on display，简称FOD)，指纹孔处由于膜材差异，在受到外界压力或者光照和温度的影响下，会出现颜色不均、深浅不均及明显边界，导致产品显示不良。
发明内容
有鉴于此，本申请实施例致力于提供一种光学胶带以及使用该光学胶带的显示面板和光学胶带制备方法，解决了上述指纹孔在制备过程中出现的颜色不均、深浅不均及明显边界等问题。
根据本申请的一方面，本申请一实施例提供的一种光学胶带，用于指纹识别区，包括：第一缓冲层；开孔，对应所述指纹识别区处设置且贯穿所述第一缓冲层；其中，所述开孔内填充可脱落的填充物，所述填充物包括第二缓冲层。
根据本申请的另一方面，本申请一实施例提供的一种显示面板，包括：阵列基板，所述阵列基板一侧设置像素单元；以及光学胶带，所述光学胶带位于所述阵列基板远离所述像素单元的一侧，其中，所述光学胶带包括如上述任一项所述的光学胶带。
根据本申请的另一方面，本申请一实施例提供的一种光学胶带制备方法，用于制备用于指纹识别区的光学胶带，包括：制备第一缓冲层；对应所述指纹识别区处制备贯穿所述第一缓冲层的开孔；其中，所述开孔内填充可脱落的填充物，所述填充物包括第二缓冲层。
本申请实施例提供的一种光学胶带、显示面板和光学胶带制备方法，通过在光学胶带对于指纹识别区处设置贯穿光学胶带的第一缓冲层的开孔，并且在开孔内填充可脱落的填充物，该填充物包括第二缓冲层，利用第二缓冲层可以实现在制备过程中，相同的压力、光照和温度条件对开孔处与光学胶带其他位置的影响相同或相似，从而避免了开孔对应的指纹孔出现的颜色不均、深浅不均及明显边界的现象，提高了产品良率，并且在制备完成后将开孔内的填充物剥离，以保证指纹孔录取指纹的功能。
附图简要说明
图1所示为本申请一实施例提供的一种光学胶带的结构示意图，其中，开孔内填充有第二缓冲层、第二散热层、第二胶层。
图2所示为本申请另一实施例提供的一种光学胶带的结构示意图，其中开孔内仅填充第二缓冲层以及第二胶层。
图3所示为本申请一实施例提供的光学胶带制备方法的流程示意图。
实施本发明的方式
下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅是本申请一部分实施例，而不是全部的实施例。基于本申请中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。
众所周知，掩膜板包括开口区与开口区相邻的遮挡区。在掩膜板的实际制备过程中，通常需要将掩膜板网面按照预定焊接线的位置焊接到掩膜板框架上，在完成焊接后，沿着焊接线边缘外围预定距离将缓冲区域切除。
此外，在示例性实施例中，因为相同的参考标记表示具有相同结构的相同部件或相同方法的相同步骤，如果示例性地描述了一实施例，则在其他示例性实施例中仅描述与已描述实施例不同的结构或方法。
图1所示为本申请一实施例提供的一种光学胶带的结构示意图，其中，开孔内填充有第二缓冲层、第二散热层、第二胶层。如图1所示，该光学胶带用于指纹识别区，包括第一缓冲层11和开孔2；开孔2对应设置在指纹识别区处且贯穿第一缓冲层11；其中，开孔2内填充可脱落的填充物3，填充物3包括第二缓冲层31。显示面板通常会在阵列基板层的非发光侧设置用于缓冲外界应力的膜层，而该缓冲外界应力的膜层通常会采用光学胶带，通过将具有缓冲外界应力的材料和其他功能材料层叠设置以形成一个组合膜层，该组合膜层可以实现缓冲外界应力的功能，并且该组合膜层中的其他材料还可以实现其他所需要的功能，例如设置具有导热性能的材料或膜层，即可实现导热功能。随着指纹识别技术的不断发展，越来越多的显示面板(例如手机等)上都设置了指纹识别结构，为了实现指纹识别，就需要在显示面板上预留出指纹孔来录取用户指纹。其中，指纹孔的形状可以是圆形、方形或椭圆形等。为了实现显示屏体最大化，现在越来越多的显示面板都采用屏下指纹识别，即指纹孔设置于显示面板的非发光侧，以避免指纹孔占用屏体面积，使用光学胶带作为缓冲膜层的显示面板，其光学胶带就需要对应指纹孔的位置处设置通孔，以保证用户手指上的光线通过该通孔到达指纹录取模块实现指纹识别，而设置了开孔的光学胶带在显示模组的制备过程中，由于光 学胶带的开孔处无其他膜层，而光学胶带的其他位置处包括其他膜层材料，并且不同膜层材料对于压力、光照和温度的反应不同，即在制备过程中光学胶带的开孔位置与其他位置所呈现出来的性质不同，从而导致显示面板在制备完成后，光学胶带的开孔位置与其他位置的颜色亮度或深浅不均匀，甚至在开孔的边缘会出现明显的边界，最终导致产品的不良率提高。
为了解决上述问题，本申请实施例提供一种光学胶带结构，该光学胶带包括第一缓冲层11，利用第一缓冲层11可以实现光学胶带吸收和缓解外界应力的功能；光学胶带对应指纹识别区的位置处设置贯穿光学胶带的第一缓冲层11的开孔2，通过开孔2可以实现指纹识别功能，并且在开孔2内填充可以脱落的填充物3，填充物3包括第二缓冲层31，第二缓冲层31可以与第一缓冲层11的材质相同或相近，利用填充物3可以实现相同的压力、光照和温度条件对开孔2与光学胶带其他位置的影响相同或相似，从而避免制备过程中的不同条件而导致开孔2处与光学胶带其他位置的显示效果不同(即出现颜色不均、深浅不均及明显边界的现象)。
在一实施例中，第一缓冲层11可以包括泡棉，利用泡棉可以实现吸收和缓解外界应力，从而降低外界应力对阵列基板的影响。在一实施例中，第二缓冲层31包括聚对苯二甲酸乙二醇酯或泡棉等柔性材质，利用聚对苯二甲酸乙二醇酯或泡棉等柔性材质可以实现相同的压力、光照和温度条件对于开孔2处与光学胶带其他位置的影响一致性。本申请实施例可以根据实际应用场景的需求而选取第一缓冲层11和第二缓冲层31的具体材质，例如第二缓冲层31也可以包括黑色聚酰亚胺(Polyimide,PI)或者其他不透光的材质，只要保证第一缓冲层11和第二缓冲层31的材质相同或相近且具备缓解外界应力的功能即可，本申请实施例对于第一缓冲层11和第二缓冲层31的具体材质不做限定。
本申请实施例提供的一种光学胶带，通过在光学胶带对应指纹识别区的位置处设置贯穿光学胶带的第一缓冲层的开孔，并且在开孔内填充可脱落的填充物，该填充物包括第二缓冲层，利用第二缓冲层可以实现在制备过程中，相同的压力、光照和温度条件对开孔处与光学胶带其他位置的影响相同或相似，从而避免了开孔对应的指纹识别区出现的颜色不均、深浅不均及明显边界的现象，提高了产品良率，并且在制备完成后将开孔内的填充物剥离，以保证指纹孔录取指纹的功能。
在一实施例中，如图1所示，光学胶带可以包括与第一缓冲层11层叠设置的第一散热层12。通过设置第一散热层12，可以利用第一散热层12实现光学胶带对阵列基板的散热功能。
在一实施例中，第一散热层12可以包括导热性能较好的材料，例如第一散热层12可以是铜箔等，通过设置铜箔，不仅可以实现对阵列基板的导热和散热功能，还能利用铜箔的刚性特性对阵列基板提供一定的支撑作用。本申请实施例可以根 据实际应用场景的需求而选取第一散热层12的具体材质，只要保证第一散热层12的导热功能即可，本申请实施例对于第一散热层12的具体材质不做限定。
在一实施例中，如图1所示，填充物3与开孔2的内壁之间可以留有间隙21。通过在填充物3与开孔2的内壁之间留有间隙21，可以避免因填充物3填充开孔2过满而导致后续难以剥离填充物3，在保证开孔2处与光学胶带其他位置的显示一致性的同时，也要保证后续剥离填充物3的便利性，以放置额外增加制备难度。
在一实施例中，如图1所示，间隙21的宽度d可以包括0.1毫米-0.2毫米。通过设置一定宽度的间隙21，可以保证填充物3在后期能够简单的从开孔2内剥离，降低制备难度。本申请实施例可以根据实际应用场景的需求而选取间隙21的具体宽度，只要所选取的间隙21的宽度能够保证填充物3的简单剥离即可，本申请实施例对于间隙21的具体宽度不做限定。
在一实施例中，如图1所示，光学胶带还可以包括离型膜13，离型膜13位于第一缓冲层11远离第一散热层12的一侧，离型膜13覆盖填充物3。离型膜是指能从表面剥离的的薄膜，离型膜与特定的材料在有限的条件下接触后不具有粘性，或轻微的粘性，离型膜的主要作用有隔离、填充、保护、易于剥离。通过设置离型膜13，可以实现光学胶带与外界的隔离，并且光学胶带与阵列基板贴合时，只需要将该离型膜13剥离后，光学胶带即可与阵列基板进行贴合，操作简单。
在一实施例中，如图1所示，光学胶带还可以包括第一胶层14，第一胶层14设置于离型膜13与第一缓冲层11之间。通过设置第一胶层14，可以利用第一胶层14实现光学胶带与阵列基板之间的贴合，并且在贴合之前利用离型膜13隔离和保护光学胶带。
在一实施例中，第一胶层14可以包括双面胶，例如光学胶等，本申请实施例可以根据实际应用场景的需求而选取第一胶层14的具体材料，例如光学胶、水胶等，只要第一胶层14能够保证光学胶带与阵列基板之间的贴合即可，本申请实施例对于第一胶层14的具体材质不做限定。
在一实施例中，如图1所示，光学胶带可以还包括保护膜15，保护膜15位于第一散热层12远离第一缓冲层11的一侧，保护膜15覆盖填充物3。通过设置保护膜15，可以利用保护膜15对光学胶带的其他膜层以及填充物3进行保护。
在一实施例中，如图1所示，光学胶带还可以包括第一导热层16，第一导热层16位于第一缓冲层11与第一散热层12之间。在进一步的实施例中，第一导热层16可以包括PI层或石墨层。由于在贴合至阵列基板时，第一缓冲层11为靠近阵列基板的一侧，通过设置PI层或石墨层，可以利用石墨的导热性能与第一散热层12配合将阵列基板和第一缓冲层11的热量通过第一导热层16传递至第一散热层12，从而进一步提高散热效果；利用PI(聚酰亚胺)的柔性可以改善模组贴合压痕及其他一些不良，并且由于石墨层通常为片层结构，会出现分层掉碎屑等现 象，利用PI层对石墨进行包边处理，避免可靠性测试后石墨出现分层及掉屑问题。本申请实施例可以根据实际应用场景的需求而选取第一缓冲层11与第一散热层12之间是否设置其他膜层以及设置的膜层的具体材质，例如第一缓冲层11与第一散热层12之间可以不设置其他膜层，即第一缓冲层11与第一散热层12直接接触，也可以实现热量的快速传递，只要所选取的第一缓冲层11与第一散热层12之间的膜层能够满足散热需求即可，本申请实施例对于第一缓冲层11与第一散热层12之间的具体膜层以及膜层的具体材质不做限定。
在一实施例中，如图1所示，填充物3可以包括第二胶层32，第二胶层32位于第二缓冲层31与保护膜15之间。通过在第二缓冲层31与保护膜15直接设置第二胶层32，可以在完成阵列基板与光学胶带的贴合后，通过剥离保护膜15以实现连带的剥离与保护膜15粘黏的填充物3，从而简单的实现填充物3的剥离，实现指纹孔的制备。本申请实施例可以根据实际应用场景的需求而选取第二胶层32的具体材料，例如光学胶、水胶等，只要第二胶层32能够保证在剥离保护膜15时能够将填充物3连带剥离即可，本申请实施例对于第二胶层32的具体材质不做限定。
在一实施例中，如图1所示，填充物3可以包括第二散热层33，第二散热层33位于第二缓冲层31与第二胶层32之间。通过设置第二散热层33，可以保证在制备过程中相同的温度对于开孔2处和光学胶带其他位置的影响一致。在一实施例中，第二散热层33可以包括导热性能较好的材料，例如第二散热层33可以是铜箔等，通过设置铜箔，不仅可以实现制备过程中对开孔2的导热和散热功能，还能利用铜箔的刚性特性对开孔2提供一定的支撑作用。本申请实施例可以根据实际应用场景的需求而选取第二散热层33的具体材质，只要所选取的第二散热层33的材质能够保证第二散热层33的导热功能即可，本申请实施例对于第二散热层33的具体材质不做限定。
在一实施例中，如图1所示，填充物3还可以包括第二导热层34。在进一步的实施例中，第二导热层34可以包括PI层或石墨层。通过设置PI层或石墨层，可以实现开孔2处的填充物3与光学胶带其他位置的膜层结构一致，从而保证开孔2处和光学胶带其他位置处在制备过程中受到的压力、光照和温度的影响一致。本申请实施例可以根据实际应用场景的需求而选取是否设置第二导热层34，只要保证开孔2处和光学胶带其他位置处在制备过程中受到的压力、光照和温度的影响一致即可，本申请实施例对于是否设置第二导热层34不做限定。
在一实施例中，如图1所示，光学胶带沿靠近阵列基板一侧向远离阵列基板一侧的方向可以依次包括层叠设置的离型膜13、第一胶层14、第一缓冲层11、第一散热层12、保护膜15，对应的填充物3沿靠近阵列基板一侧向远离阵列基板一侧的方向可以依次包括层叠设置的第二缓冲层31、第二散热层33、第二胶层 32。通过设置填充物3的膜层与光学胶带其他位置的膜层相同或相似，仅仅是层叠顺序不同，可以保证在制备过程中，开孔2处与光学胶带其他位置处在相同的压力、光照和温度条件下的显示效果一致性，从而避免了颜色不均、深浅不均及明显边界的现象。在另一实施例中，如图1所示，第一缓冲层11和第一散热层12之间可以包括第一导热层16，对应的，填充物3中的第二缓冲层31与第二散热层33之间包括第二导热层34。
图2所示为本申请另一实施例提供的一种光学胶带的结构示意图，其中开孔内仅填充第二缓冲层以及第二胶层。如图2所示，光学胶带包括第一缓冲层11；光学胶带对应指纹识别区的位置处设置贯穿第一缓冲层11的开孔2；其中，开孔2内填充可脱落的填充物3，填充物3包括第二缓冲层31。在进一步的实施例中，光学胶带还可以包括上述实施例中的离型膜13、第一散热层12、第一胶层14、保护膜15、第一导热层16中的任一种或多种的组合，填充物还可以包括设置于第二缓冲层31与保护膜15之间的第二胶层32。本申请实施例通过在开孔2内仅填充第二缓冲层31以及粘黏第二缓冲层31和保护膜15的第二胶层32，可以实现开孔2处与光学胶带其他位置处在相同的压力、光照和温度条件下的显示效果一致性，从而避免了颜色不均、深浅不均及明显边界的现象，并且通过剥离保护膜15连带的剥离填充物3。
本申请一实施例还提供了一种显示面板，包括：阵列基板，阵列基板一侧设置像素单元；以及光学胶带，光学胶带位于阵列基板远离像素单元的一侧，其中，光学胶带包括如上述任一项所述的光学胶带。本申请实施例提供的一种显示面板，通过在光学胶带对应指纹识别区的位置处设置贯穿光学胶带的第一缓冲层的开孔，并且在开孔内填充可脱落的填充物，该填充物包括第二缓冲层，利用第二缓冲层可以实现在制备过程中，相同的压力、光照和温度条件对开孔处与光学胶带其他位置的影响相同或相似，从而避免了开孔对应的指纹识别区出现的颜色不均、深浅不均及明显边界的现象，提高了产品良率，并且在制备完成后将开孔内的填充物剥离，以保证指纹孔录取指纹的功能。
图3所示为本申请一实施例提供的光学胶带制备方法的流程示意图。如图3所示，本申请实施例提供的光学胶带制备方法，用于制备用于指纹识别区的光学胶带，包括如下步骤。
步骤S10：制备第一缓冲层。
步骤S20：对应指纹识别区处制备贯穿第一缓冲层的开孔。
其中，开孔内填充可脱落的填充物，填充物包括第二缓冲层。
在实际应用过程中，首先制备第一缓冲层，然后在对应指纹识别区处制备贯穿第一缓冲层的开孔。
本申请实施例提供的光学胶带制备方法，通过在光学胶带对应指纹识别区的 位置处制备贯穿光学胶带的第一缓冲层的开孔，并且在开孔内填充可脱落的填充物，该填充物包括第二缓冲层，利用第二缓冲层可以实现在制备过程中，相同的压力、光照和温度条件对开孔处与光学胶带其他位置的影响相同或相似，从而避免了开孔对应的指纹识别区出现的颜色不均、深浅不均及明显边界的现象。因此，与相关技术中的光学胶带制备方法相比，本申请实施例提供的光学胶带方法提高了产品良率，并且保证了指纹孔录取指纹的功能。
以上所述仅为本申请的较佳实施例而已，并不用以限制本申请，凡在本申请的精神和原则之内，所作的任何修改、等同替换等，均应包含在本申请的保护范围之内。

Claims (20)

  1. 一种光学胶带，用于指纹识别区，包括：
    第一缓冲层；
    开孔，对应所述指纹识别区处设置且贯穿所述第一缓冲层；
    其中，所述开孔内填充可脱落的填充物，所述填充物包括第二缓冲层。
  2. 根据权利要求1所述的光学胶带，其中，所述填充物与所述开孔的内壁之间留有间隙。
  3. 根据权利要求2所述的光学胶带，其中，所述间隙宽度包括0.1毫米-0.2毫米。
  4. 根据权利要求1所述的光学胶带，其中，所述第二缓冲层与所述第一缓冲层的材质相同。
  5. 根据权利要求1所述的光学胶带，其中，所述第一缓冲层包括泡棉，所述第二缓冲层包括聚对苯二甲酸乙二醇酯或泡棉。
  6. 根据权利要求1所述的光学胶带，其中，所述光学胶带包括与所述第一缓冲层层叠设置的第一散热层。
  7. 根据权利要求6所述的光学胶带，其中，所述第一散热层包括铜箔。
  8. 根据权利要求6所述的光学胶带，还包括离型膜，位于所述第一缓冲层远离所述第一散热层的一侧，所述离型膜覆盖所述填充物。
  9. 根据权利要求8所述的光学胶带，还包括第一胶层，设置于所述离型膜与所述第一缓冲层之间。
  10. 根据权利要求9所述的光学胶带，其中，所述第一胶层包括双面胶。
  11. 根据权利要求6所述的光学胶带，其中，还包括保护膜，位于所述第一散热层远离所述第一缓冲层的一侧，所述保护膜覆盖所述填充物。
  12. 根据权利要求6所述的光学胶带，其中，还包括第一导热层，所述第一导热层位于所述第一缓冲层与所述第一散热层之间。
  13. 根据权利要求12所述的光学胶带，其中，所述第一导热层包括PI层或石墨层。
  14. 根据权利要求11所述的光学胶带，其中，所述填充物包括第二胶层，所述第二胶层位于所述第二缓冲层与所述保护膜之间。
  15. 根据权利要求14所述的光学胶带，其中，所述填充物包括第二散热层，所述第二散热层位于所述第二缓冲层与所述第二胶层之间。
  16. 根据权利要求15所述的光学胶带，其中，所述第二散热层包括铜箔。
  17. 根据权利要求1所述的光学胶带，其中，所述填充物还包括第二导热层。
  18. 根据权利要求17所述的光学胶带，其中，所述第二导热层包括PI层或 石墨层。
  19. 一种显示面板，包括：
    阵列基板，所述阵列基板一侧设置像素单元；以及
    光学胶带，所述光学胶带位于所述阵列基板远离所述像素单元的一侧，其中，所述光学胶带包括如上述权利要求1-18中任一项所述的光学胶带。
  20. 一种光学胶带制备方法，用于制备用于指纹识别区的光学胶带，包括：
    制备第一缓冲层；
    对应所述指纹识别区处制备贯穿所述第一缓冲层的开孔；
    其中，所述开孔内填充可脱落的填充物，所述填充物包括第二缓冲层。
PCT/CN2021/095634 2020-07-24 2021-05-25 光学胶带、显示面板和光学胶带制备方法 Ceased WO2022016984A1 (zh)

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