WO2022014919A1

WO2022014919A1 - Electronic device comprising antenna

Info

Publication number: WO2022014919A1
Application number: PCT/KR2021/008396
Authority: WO
Inventors: 김승순; 장준원
Original assignee: 삼성전자 주식회사
Priority date: 2020-07-13
Filing date: 2021-07-02
Publication date: 2022-01-20
Also published as: KR20220008036A

Abstract

Disclosed is an electronic device comprising an antenna. An electronic device according to one embodiment of the present disclosure comprises: an antenna module including a plurality of antenna elements, and a radio frequency integrated circuit (RFIC) for processing signals in a first frequency band that are transmitted or received through the plurality of antenna elements; and a wireless communication circuit electrically connected to the antenna module, wherein the RFIC can include: a first electrical path formed between a first antenna element among the plurality of antenna elements and the wireless communication circuit; a first phase shifter disposed on the first electrical path, and configured to shift the phase of a signal transmitted from the wireless communication circuit to the first antenna element; and a length varying element which is branched from a first point of the first electrical path so as to be connected between the first point of the first electrical path and a ground and which changes the electrical length of the first electrical path.

Description

Electronic device comprising an antenna

Various embodiments of the present disclosure relate to an electronic device including an antenna.

BACKGROUND With the development of information and communication technology and semiconductor technology, the dissemination of electronic devices is rapidly increasing. These electronic devices do not stay in their own domains but tend to provide various functions by convergence.

Recently, the number of electronic devices providing wireless communication services to exchange information with and process information with external electronic devices is increasing. The electronic device may transmit or receive various types of information such as text, image, video, or voice by using a wireless communication service.

An electronic device capable of wireless communication may include at least one antenna to support various frequencies of various wireless communication services (eg, LTE, mmWave, Wi-Fi, NFC, or Bluetooth).

Existing electronic devices may include a module-type antenna (hereinafter, referred to as an “antenna module”) in order to support a millimeter wave (mmWave) frequency band. The antenna module may have an input impedance value fixed by a communication circuit, a power amplifier, a low noise amplifier, a divider, a phase converter, and/or a switch constituting the antenna module.

An impedance value for impedance matching may be different according to a frequency band supported by the antenna module. However, when the impedance value of the input terminal of the antenna module is fixed as described above, impedance matching is not performed according to the frequency band of the RF signal transmitted and/or received from the antenna module, so that the radiation performance of the antenna module may be deteriorated.

In addition, when the impedance value of the input terminal of the antenna module is fixed as described above, noise may be generated according to the occurrence of a specified event (eg, camera operation, charging of an electronic device), and the generated noise is generated by the antenna module. radiation performance.

In addition, when the antenna module is disposed in a mechanical structure inside the electronic device, the impedance value of the antenna module may be changed according to the arrangement position of the antenna module, and the radiation performance of the antenna module may be deteriorated due to the change of the impedance value. have. However, when the impedance value of the input terminal of the antenna module is fixed as described above, it is difficult to prevent deterioration of the radiation performance of the antenna module except by changing the position at which the antenna module is disposed.

Accordingly, various embodiments of the present disclosure provide an electronic device capable of changing an input impedance value by changing an electrical length between an antenna and a wireless communication circuit.

An electronic device according to an embodiment of the present disclosure includes a plurality of antenna elements and a radio frequency integrated circuit (RFIC) for processing a signal of a first frequency band transmitted or received through the plurality of antenna elements. An antenna module comprising: and a wireless communication circuit electrically connected to the antenna module, wherein the RFIC includes: a first electrical path formed between a first antenna element of the plurality of antenna elements and the wireless communication circuit; a first phase converter disposed on a first electrical path and configured to transform a phase of a signal transmitted from the wireless communication circuit to the first antenna element and branching at a first point in the first electrical path, the first electrical It may include a variable-length element connected between the first point of the path and the ground, and changing the electrical length of the first electrical path.

An electronic device according to another embodiment of the present disclosure includes an antenna module including a plurality of antenna elements and a radio frequency integrated circuit (RFIC) for processing a signal of a first frequency band transmitted or received through the plurality of antenna elements and a wireless communication circuit electrically connected to the antenna module, wherein the RFIC is an electrical path formed between the wireless communication circuit and the antenna module, the electrical path being branched from a first point of the electrical path A first path connected to a first antenna element, a second path branched from the first point of the electrical path and connected to a second antenna element, a second path branched from the first point of the electrical path and connected to a third antenna element and a fourth path branched from the first point of the electrical path and connected to a fourth antenna element, disposed at the first point of the electrical path, and transmitted through the electrical path a combiner and divider configured to combine or distribute a first phase transformer disposed on the first path and configured to transform a phase of a signal transmitted from the wireless communication circuitry to the first antenna element, on the second path a second phase converter disposed in, and configured to transform a phase of a signal transmitted from the wireless communication circuitry to the second antenna element, disposed on the third path, from the wireless communication circuitry to the third antenna element a third phase transformer configured to transform a phase of a transmitted signal, a fourth phase transformer disposed on the fourth path and configured to transform a phase of a signal transmitted from the wireless communication circuitry to the fourth antenna element; and It may include a variable-length element branched from the second point of the electrical path and connected between the second point of the electrical path and the ground, and configured to change the electrical length of the electrical path.

The electronic device according to various embodiments of the present disclosure may change an input impedance value by changing an electrical length of an electrical path between an antenna and a wireless communication circuit.

The electronic device according to various embodiments of the present disclosure may reduce noise due to interference and improve antenna performance (eg, radiation performance) by changing the input impedance value.

1 is a block diagram of an electronic device in a network environment according to various embodiments of the present disclosure;

2 is a block diagram of an electronic device in a network environment including a plurality of cellular networks, according to various embodiments of the present disclosure;

3A is a perspective view illustrating a front surface of an electronic device according to an exemplary embodiment.

3B is a perspective view illustrating a rear surface of the electronic device of FIG. 3A .

4 is a perspective view of an electronic device according to another exemplary embodiment.

5A is a perspective view illustrating an electronic device in a closed state, according to another exemplary embodiment.

5B is a perspective view illustrating an electronic device in an open state, according to another exemplary embodiment.

6A is a diagram illustrating an electrical connection relationship between components of an electronic device, according to an exemplary embodiment.

6B is a diagram illustrating an electrical connection relationship between components of an electronic device, according to another exemplary embodiment.

7A is a graph illustrating a change in a resonance frequency of an antenna module according to a change in an electrical length of an electrical path between an antenna of an electronic device and a wireless communication circuit according to an exemplary embodiment.

7B is a graph illustrating a change in a resonance frequency of an antenna module according to a change in an electrical length of an electrical path between an antenna of an electronic device and a wireless communication circuit according to another exemplary embodiment.

8 is a graph illustrating a gain change of an antenna module according to a change in an electrical length of an electrical path between an antenna of an electronic device and a wireless communication circuit according to an exemplary embodiment.

9 is a diagram illustrating an electrical connection relationship between components of an electronic device, according to an exemplary embodiment.

10 is a flowchart illustrating an operation of controlling a variable-length element of an electronic device according to an exemplary embodiment.

11 is a flowchart illustrating an operation of controlling a variable-length element of an electronic device according to another exemplary embodiment.

12 is a flowchart illustrating an operation of controlling a variable-length element of an electronic device according to another exemplary embodiment.

13 is a flowchart illustrating an operation of controlling a variable-length element of an electronic device according to another exemplary embodiment.

1 is a block diagram of an electronic device in a network environment, according to various embodiments of the present disclosure;

Referring to FIG. 1 , in a network environment 100 , an electronic device 101 communicates with an electronic device 102 through a first network 198 (eg, a short-range wireless communication network) or a second network 199 . It may communicate with the electronic device 104 or the server 108 through (eg, a long-distance wireless communication network). According to an embodiment, the electronic device 101 may communicate with the electronic device 104 through the server 108 . According to an embodiment, the electronic device 101 includes a processor 120 , a memory 130 , an input module 150 , a sound output module 155 , a display module 160 , an audio module 170 , and a sensor module ( 176), interface 177, connection terminal 178, haptic module 179, camera module 180, power management module 188, battery 189, communication module 190, subscriber identification module 196 , or an antenna module 197 may be included. In some embodiments, at least one of these components (eg, the connection terminal 178 ) may be omitted or one or more other components may be added to the electronic device 101 . In some embodiments, some of these components (eg, sensor module 176 , camera module 180 , or antenna module 197 ) are integrated into one component (eg, display module 160 ). can be

The processor 120, for example, executes software (eg, a program 140) to execute at least one other component (eg, a hardware or software component) of the electronic device 101 connected to the processor 120 . It can control and perform various data processing or operations. According to one embodiment, as at least part of data processing or operation, the processor 120 converts commands or data received from other components (eg, the sensor module 176 or the communication module 190 ) to the volatile memory 132 . may be stored in the volatile memory 132 , and may process commands or data stored in the volatile memory 132 , and store the result data in the non-volatile memory 134 . According to an embodiment, the processor 120 is the main processor 121 (eg, a central processing unit or an application processor) or a secondary processor 123 (eg, a graphic processing unit, a neural network processing unit) a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor). For example, when the electronic device 101 includes the main processor 121 and the sub-processor 123 , the sub-processor 123 may use less power than the main processor 121 or may be set to be specialized for a specified function. can The auxiliary processor 123 may be implemented separately from or as a part of the main processor 121 .

The auxiliary processor 123 is, for example, on behalf of the main processor 121 while the main processor 121 is in an inactive (eg, sleep) state, or the main processor 121 is active (eg, executing an application). ), together with the main processor 121, at least one of the components of the electronic device 101 (eg, the display module 160, the sensor module 176, or the communication module 190) It is possible to control at least some of the related functions or states. According to an embodiment, the coprocessor 123 (eg, an image signal processor or a communication processor) may be implemented as part of another functionally related component (eg, the camera module 180 or the communication module 190). have. According to an embodiment, the auxiliary processor 123 (eg, a neural network processing device) may include a hardware structure specialized for processing an artificial intelligence model. Artificial intelligence models can be created through machine learning. Such learning may be performed, for example, in the electronic device 101 itself on which artificial intelligence is performed, or may be performed through a separate server (eg, the server 108). The learning algorithm may include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but in the above example not limited The artificial intelligence model may include a plurality of artificial neural network layers. Artificial neural networks include deep neural networks (DNNs), convolutional neural networks (CNNs), recurrent neural networks (RNNs), restricted boltzmann machines (RBMs), deep belief networks (DBNs), bidirectional recurrent deep neural networks (BRDNNs), It may be one of deep Q-networks or a combination of two or more of the above, but is not limited to the above example. The artificial intelligence model may include, in addition to, or alternatively, a software structure in addition to the hardware structure.

The memory 130 may store various data used by at least one component of the electronic device 101 (eg, the processor 120 or the sensor module 176 ). The data may include, for example, input data or output data for software (eg, the program 140 ) and instructions related thereto. The memory 130 may include a volatile memory 132 or a non-volatile memory 134 .

The program 140 may be stored as software in the memory 130 , and may include, for example, an operating system 142 , middleware 144 , or an application 146 .

The input module 150 may receive a command or data to be used in a component (eg, the processor 120 ) of the electronic device 101 from the outside (eg, a user) of the electronic device 101 . The input module 150 may include, for example, a microphone, a mouse, a keyboard, a key (eg, a button), or a digital pen (eg, a stylus pen).

The sound output module 155 may output a sound signal to the outside of the electronic device 101 . The sound output module 155 may include, for example, a speaker or a receiver. The speaker can be used for general purposes such as multimedia playback or recording playback. The receiver may be used to receive an incoming call. According to one embodiment, the receiver may be implemented separately from or as part of the speaker.

The display module 160 may visually provide information to the outside (eg, a user) of the electronic device 101 . The display module 160 may include, for example, a control circuit for controlling a display, a hologram device, or a projector and a corresponding device. According to an embodiment, the display module 160 may include a touch sensor configured to sense a touch or a pressure sensor configured to measure the intensity of a force generated by the touch.

The audio module 170 may convert a sound into an electric signal or, conversely, convert an electric signal into a sound. According to an embodiment, the audio module 170 acquires a sound through the input module 150 or an external electronic device (eg, a sound output module 155 ) directly or wirelessly connected to the electronic device 101 . A sound may be output through the electronic device 102 (eg, a speaker or headphones).

The sensor module 176 detects an operating state (eg, power or temperature) of the electronic device 101 or an external environmental state (eg, user state), and generates an electrical signal or data value corresponding to the sensed state. can do. According to one embodiment, the sensor module 176 may include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, It may include a temperature sensor, a humidity sensor, or an illuminance sensor.

The interface 177 may support one or more designated protocols that may be used by the electronic device 101 to directly or wirelessly connect with an external electronic device (eg, the electronic device 102 ). According to an embodiment, the interface 177 may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

The connection terminal 178 may include a connector through which the electronic device 101 can be physically connected to an external electronic device (eg, the electronic device 102 ). According to an embodiment, the connection terminal 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (eg, a headphone connector).

The haptic module 179 may convert an electrical signal into a mechanical stimulus (eg, vibration or movement) or an electrical stimulus that the user can perceive through tactile or kinesthetic sense. According to an embodiment, the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

The camera module 180 may capture still images and moving images. According to an embodiment, the camera module 180 may include one or more lenses, image sensors, image signal processors, or flashes.

The power management module 188 may manage power supplied to the electronic device 101 . According to an embodiment, the power management module 188 may be implemented as, for example, at least a part of a power management integrated circuit (PMIC).

The battery 189 may supply power to at least one component of the electronic device 101 . According to one embodiment, battery 189 may include, for example, a non-rechargeable primary cell, a rechargeable secondary cell, or a fuel cell.

The communication module 190 is a direct (eg, wired) communication channel or a wireless communication channel between the electronic device 101 and an external electronic device (eg, the electronic device 102, the electronic device 104, or the server 108). It can support establishment and communication performance through the established communication channel. The communication module 190 may include one or more communication processors that operate independently of the processor 120 (eg, an application processor) and support direct (eg, wired) communication or wireless communication. According to one embodiment, the communication module 190 is a wireless communication module 192 (eg, a cellular communication module, a short-range communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 194 (eg, : It may include a LAN (local area network) communication module, or a power line communication module). A corresponding communication module among these communication modules is a first network 198 (eg, a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network 199 (eg, legacy It may communicate with the external electronic device 104 through a cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (eg, a telecommunication network such as a LAN or a WAN). These various types of communication modules may be integrated into one component (eg, a single chip) or may be implemented as a plurality of components (eg, multiple chips) separate from each other. The wireless communication module 192 uses the subscriber information (eg, International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module 196 within a communication network such as the first network 198 or the second network 199 . The electronic device 101 may be identified or authenticated.

The wireless communication module 192 may support a 5G network after a 4G network and a next-generation communication technology, for example, a new radio access technology (NR). NR access technology includes high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and access to multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency) -latency communications)). The wireless communication module 192 may support a high frequency band (eg, mmWave band) to achieve a high data rate, for example. The wireless communication module 192 includes various technologies for securing performance in a high-frequency band, for example, beamforming, massive multiple-input and multiple-output (MIMO), all-dimensional multiplexing. It may support technologies such as full dimensional MIMO (FD-MIMO), an array antenna, analog beam-forming, or a large scale antenna. The wireless communication module 192 may support various requirements specified in the electronic device 101 , an external electronic device (eg, the electronic device 104 ), or a network system (eg, the second network 199 ). According to an embodiment, the wireless communication module 192 may include a peak data rate (eg, 20 Gbps or more) for realizing eMBB, loss coverage (eg, 164 dB or less) for realizing mMTC, or U-plane latency for realizing URLLC ( Example: downlink (DL) and uplink (UL) each 0.5 ms or less, or round trip 1 ms or less).

The antenna module 197 may transmit or receive a signal or power to the outside (eg, an external electronic device). According to an embodiment, the antenna module 197 may include an antenna including a conductor formed on a substrate (eg, a PCB) or a radiator formed of a conductive pattern. According to an embodiment, the antenna module 197 may include a plurality of antennas (eg, an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network such as the first network 198 or the second network 199 is connected from the plurality of antennas by, for example, the communication module 190 . can be selected. A signal or power may be transmitted or received between the communication module 190 and an external electronic device through the selected at least one antenna. According to some embodiments, other components (eg, a radio frequency integrated circuit (RFIC)) other than the radiator may be additionally formed as a part of the antenna module 197 .

According to various embodiments, the antenna module 197 may form a mmWave antenna module. According to one embodiment, the mmWave antenna module comprises a printed circuit board, an RFIC disposed on or adjacent to a first side (eg, underside) of the printed circuit board and capable of supporting a designated high frequency band (eg, mmWave band); and a plurality of antennas (eg, an array antenna) disposed on or adjacent to a second side (eg, top or side) of the printed circuit board and capable of transmitting or receiving a signal of the designated high frequency band. have.

At least some of the components are connected to each other through a communication method between peripheral devices (eg, a bus, general purpose input and output (GPIO), serial peripheral interface (SPI), or mobile industry processor interface (MIPI)) and a signal ( eg commands or data) can be exchanged with each other.

According to an embodiment, the command or data may be transmitted or received between the electronic device 101 and the external electronic device 104 through the server 108 connected to the second network 199 . Each of the external

electronic devices

102 or 104 may be the same as or different from the electronic device 101 . According to an embodiment, all or part of the operations executed in the electronic device 101 may be executed in one or more external

electronic devices

102 , 104 , or the server 108 . For example, when the electronic device 101 is to perform a function or service automatically or in response to a request from a user or other device, the electronic device 101 may perform the function or service itself instead of executing the function or service itself. Alternatively or additionally, one or more external electronic devices may be requested to perform at least a part of the function or the service. One or more external electronic devices that have received the request may execute at least a part of the requested function or service, or an additional function or service related to the request, and transmit a result of the execution to the electronic device 101 . The electronic device 101 may process the result as it is or additionally and provide it as at least a part of a response to the request. For this, for example, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used. The electronic device 101 may provide an ultra-low latency service using, for example, distributed computing or mobile edge computing. In another embodiment, the external electronic device 104 may include an Internet of things (IoT) device. Server 108 may be an intelligent server using machine learning and/or neural networks. According to an embodiment, the external electronic device 104 or the server 108 may be included in the second network 199 . The electronic device 101 may be applied to an intelligent service (eg, smart home, smart city, smart car, or health care) based on 5G communication technology and IoT-related technology.

Referring to FIG. 2 , the electronic device 101 (eg, the electronic device 101 of FIG. 1 ) includes a first communication processor 212 , a second communication processor 214 , and a first radio frequency integrated circuit (RFIC) ( 222), second RFIC 224, third RFIC 226, fourth RFIC 228, first radio frequency front end (RFEE) 232, second RFFE 234, first antenna module 242 ), a second antenna module 244 , and an antenna 248 . The electronic device 101 may further include a processor 120 and a memory 130 . The second network 199 may include a first cellular network 292 and a second cellular network 294 . According to another embodiment, the electronic device 101 may further include at least one component among the components illustrated in FIG. 1 , and the second network 199 may further include at least one other network. According to one embodiment, a first communication processor 212 , a second communication processor 214 , a first RFIC 222 , a second RFIC 224 , a fourth RFIC 228 , a first RFFE 232 , and the second RFFE 234 may form at least a part of the wireless communication module 192 . According to another embodiment, the fourth RFIC 228 may be omitted or may be included as a part of the third RFIC 226 .

The first communication processor 212 may support establishment of a communication channel of a band to be used for wireless communication with the first cellular network 292 and legacy network communication through the established communication channel. According to various embodiments, the first cellular network may be a legacy network including a second generation (2G), 3G, 4G, or long term evolution (LTE) network. The second communication processor 214 establishes a communication channel corresponding to a designated band (eg, about 6 GHz to about 60 GHz) among bands to be used for wireless communication with the second cellular network 294 , and a 5G network through the established communication channel communication can be supported. According to various embodiments, the second cellular network 294 may be a 5G network defined by 3GPP. Additionally, according to an embodiment, the first communication processor 212 or the second communication processor 214 corresponds to another designated band (eg, about 6 GHz or less) among bands to be used for wireless communication with the second cellular network 294 . 5G network communication through the establishment of a communication channel and the established communication channel can be supported. According to one embodiment, the first communication processor 212 and the second communication processor 214 may be implemented in a single chip or a single package. According to various embodiments, the first communication processor 212 or the second communication processor 214 may be formed in a single chip or a single package with the processor 120 , the co-processor 123 , or the communication module 190 . have.

According to one embodiment, the first communication processor 212 and the second communication processor 214 are directly or indirectly connected to each other by an interface (not shown), so as to provide data or control signals in either or both directions. may provide or receive

The first RFIC 222, when transmitting, transmits a baseband signal generated by the first communication processor 212 from about 700 MHz to about 700 MHz used for the first cellular network 292 (eg, a legacy network). It can be converted to a radio frequency (RF) signal of 3 GHz. Upon reception, an RF signal is obtained from a first cellular network 292 (eg, a legacy network) via an antenna (eg, a first antenna module 242), and an RFFE (eg, a first RFFE 232) It can be preprocessed through The first RFIC 222 may convert the preprocessed RF signal into a baseband signal to be processed by the first communication processor 212 .

The second RFIC 224, when transmitting, uses the baseband signal generated by the first communication processor 212 or the second communication processor 214 to the second cellular network 294 (eg, a 5G network). It can be converted into an RF signal (hereinafter, 5G Sub6 RF signal) of the Sub6 band (eg, about 6 GHz or less). Upon reception, a 5G Sub6 RF signal is obtained from a second cellular network 294 (eg, 5G network) via an antenna (eg, second antenna module 244 ), and an RFFE (eg, second RFFE 234 ) ) can be preprocessed. The second RFIC 224 may convert the preprocessed 5G Sub6 RF signal into a baseband signal to be processed by a corresponding one of the first communication processor 212 or the second communication processor 214 .

The third RFIC 226 transmits the baseband signal generated by the second communication processor 214 to the 5G Above6 band (eg, about 6 GHz to about 60 GHz) to be used in the second cellular network 294 (eg, 5G network). It can be converted into an RF signal (hereinafter referred to as 5G Above6 RF signal). Upon reception, a 5G Above6 RF signal may be obtained from the second cellular network 294 (eg, 5G network) via an antenna (eg, antenna 248 ) and pre-processed via a third RFFE 236 . The third RFIC 226 may convert the preprocessed 5G Above6 RF signal into a baseband signal to be processed by the second communication processor 214 . According to one embodiment, the third RFFE 236 may be formed as part of the third RFIC 226 .

According to an embodiment, the electronic device 101 may include the fourth RFIC 228 separately from or as at least a part of the third RFIC 226 . In this case, the fourth RFIC 228 converts the baseband signal generated by the second communication processor 214 into an RF signal (hereinafter, IF signal) of an intermediate frequency band (eg, about 9 GHz to about 11 GHz). After conversion, the IF signal may be transmitted to the third RFIC 226 . The third RFIC 226 may convert the IF signal into a 5G Above6 RF signal. Upon reception, a 5G Above6 RF signal may be received from the second cellular network 294 (eg, 5G network) via an antenna (eg, antenna 248 ) and converted to an IF signal by a third RFIC 226 . have. The fourth RFIC 228 may convert the IF signal into a baseband signal for processing by the second communication processor 214 .

According to one embodiment, the first RFIC 222 and the second RFIC 224 may be implemented as at least a part of a single chip or a single package. According to an embodiment, the first RFFE 232 and the second RFFE 234 may be implemented as at least a part of a single chip or a single package. According to an example, at least one antenna module of the first antenna module 242 or the second antenna module 244 may be omitted or may be combined with another antenna module to process RF signals of a plurality of corresponding bands.

According to an embodiment, the third RFIC 226 and the antenna 248 may be disposed on the same substrate to form the third antenna module 246 . For example, the wireless communication module 192 or the processor 120 may be disposed on the first substrate (eg, main PCB). In this case, the third RFIC 226 is located in a partial area (eg, the bottom surface) of the second substrate (eg, sub PCB) separate from the first substrate, and the antenna 248 is located in another partial region (eg, the top surface). is disposed, the third antenna module 246 may be formed. By disposing the third RFIC 226 and the antenna 248 on the same substrate, it is possible to reduce the length of the transmission line therebetween. This, for example, can reduce loss (eg, attenuation) of a signal in a high-frequency band (eg, about 6 GHz to about 60 GHz) used for 5G network communication by the transmission line. Accordingly, the electronic device 101 may improve the quality or speed of communication with the second cellular network 294 (eg, a 5G network).

According to an embodiment, the antenna 248 may be formed as an antenna array including a plurality of antenna elements that can be used for beamforming. In this case, the third RFIC 226 may include, for example, as a part of the third RFFE 236 , a plurality of phase shifters 238 corresponding to a plurality of antenna elements. During transmission, each of the plurality of phase shifters 238 may transform the phase of a 5G Above6 RF signal to be transmitted to the outside of the electronic device 101 (eg, a base station of a 5G network) through a corresponding antenna element. . Upon reception, each of the plurality of phase shifters 238 may convert the phase of the 5G Above6 RF signal received from the outside through a corresponding antenna element into the same or substantially the same phase. This enables transmission or reception through beamforming between the electronic device 101 and the outside.

The second cellular network 294 (eg, 5G network) may be operated independently (eg, Stand-Alone (SA)) or connected to the first cellular network 292 (eg, legacy network). Example: Non-Stand Alone (NSA)). For example, the 5G network may have only an access network (eg, a 5G radio access network (RAN) or a next generation RAN (NG RAN)), and may not have a core network (eg, a next generation core (NGC)). In this case, after accessing the access network of the 5G network, the electronic device 101 may access an external network (eg, the Internet) under the control of a core network (eg, evolved packed core (EPC)) of the legacy network. Protocol information for communication with a legacy network (eg, LTE protocol information) or protocol information for communication with a 5G network (eg, New Radio (NR) protocol information) is stored in the memory 130, and other components (eg, a processor 120 , the first communication processor 212 , or the second communication processor 214 ).

The electronic device according to various embodiments disclosed in this document may have various types of devices. The electronic device may include, for example, a portable communication device (eg, a smart phone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a home appliance device. The electronic device according to the embodiment of the present document is not limited to the above-described devices.

The various embodiments of this document and terms used therein are not intended to limit the technical features described in this document to specific embodiments, but it should be understood to include various modifications, equivalents, or substitutions of the embodiments. In connection with the description of the drawings, like reference numerals may be used for similar or related components. The singular form of the noun corresponding to the item may include one or more of the item, unless the relevant context clearly dictates otherwise. As used herein, "A or B", "at least one of A and B", "at least one of A or B", "A, B or C", "at least one of A, B and C", and "A , B, or C" each may include any one of the items listed together in the corresponding one of the phrases, or all possible combinations thereof. Terms such as "first", "second", or "first" or "second" may be used simply to distinguish the element from other elements in question, and may refer to elements in other aspects (e.g., importance or order) is not limited. It is said that one (eg, first) component is "coupled" or "connected" to another (eg, second) component, with or without the terms "functionally" or "communicatively". When referenced, it means that one component can be connected to the other component directly (eg by wire), wirelessly, or through a third component.

The term “module” used in various embodiments of this document may include a unit implemented in hardware, software, or firmware, and is interchangeable with terms such as, for example, logic, logic block, component, or circuit. can be used as A module may be an integrally formed part or a minimum unit or a part of the part that performs one or more functions. For example, according to an embodiment, the module may be implemented in the form of an application-specific integrated circuit (ASIC).

According to various embodiments of the present document, one or more instructions stored in a storage medium (eg, internal memory 136 or external memory 138) readable by a machine (eg, electronic device 101) may be implemented as software (eg, the program 140) including For example, a processor (eg, processor 120 ) of a device (eg, electronic device 101 ) may call at least one command among one or more commands stored from a storage medium and execute it. This makes it possible for the device to be operated to perform at least one function according to the called at least one command. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The device-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' only means that the storage medium is a tangible device and does not include a signal (eg, electromagnetic wave), and this term is used in cases where data is semi-permanently stored in the storage medium and It does not distinguish between temporary storage cases.

According to an embodiment, the method according to various embodiments disclosed in this document may be included and provided in a computer program product. Computer program products may be traded between sellers and buyers as commodities. The computer program product is distributed in the form of a machine-readable storage medium (eg compact disc read only memory (CD-ROM)), or via an application store (eg Play Store ^TM ) or on two user devices ( It can be distributed (eg downloaded or uploaded) directly between smartphones (eg: smartphones) and online. In the case of online distribution, at least a part of the computer program product may be temporarily stored or temporarily generated in a machine-readable storage medium such as a memory of a server of a manufacturer, a server of an application store, or a relay server.

According to various embodiments, each component (eg, module or program) of the above-described components may include a singular or a plurality of entities, and some of the plurality of entities may be separately disposed in other components. have. According to various embodiments, one or more components or operations among the above-described corresponding components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (eg, a module or a program) may be integrated into one component. In this case, the integrated component may perform one or more functions of each component of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. . According to various embodiments, operations performed by a module, program, or other component are executed sequentially, in parallel, repeatedly, or heuristically, or one or more of the operations are executed in a different order, or omitted. or one or more other operations may be added.

3A is a perspective view illustrating a front surface of an electronic device according to an exemplary embodiment, and FIG. 3B is a perspective view illustrating a rear surface of the electronic device of FIG. 3A .

Referring to FIGS. 3A and 3B , the electronic device 300 (eg, the electronic device 101 of FIGS. 1 and 2 ) according to an embodiment has a first surface (or front surface) 310A and a second surface ( or a rear surface) 310B, and a housing 310 including a side surface (or sidewall) 310C surrounding a space between the first surface 310A and the second surface 310B. In another embodiment (not shown), the housing may refer to a structure that forms part of the first surface 310A, the second surface 310B, and the side surface 310C of FIGS. 3A and 3B .

According to one embodiment, the first surface 310A may be formed by a front plate 302 (eg, a glass plate including various coating layers, or a polymer plate) at least a portion of which is substantially transparent. According to an embodiment, the front plate 302 may include a curved portion extending seamlessly from the first surface 310A toward the rear plate 311 at at least one side edge portion.

According to an embodiment, the second surface 310B may be formed by a substantially opaque back plate 311 . The back plate 311 may be formed, for example, by coated or tinted glass, ceramic, polymer, metal (eg, aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the foregoing. can According to an embodiment, the rear plate 311 may include a curved portion that extends seamlessly from the second surface 310B toward the front plate 302 at at least one end.

According to one embodiment, side 310C engages front plate 302 and back plate 311 and includes a side bezel structure (or “side member or sidewall”) 318 comprising a metal and/or polymer. can be formed by In some embodiments, the back plate 311 and the side bezel structure 318 are integrally formed and may include the same material (eg, a metal material such as aluminum).

According to an embodiment, the electronic device 300 includes a display 301 , an audio module 303 , a sensor module (not shown),

camera modules

305 , 312 , 313 , 306 , a key input device 317 , and At least one of the connector holes 308 may be included. In some embodiments, the electronic device 300 may omit at least one of the components (eg, the key input device 317 ) or additionally include other components. For example, the electronic device 300 may include a sensor module (not shown). For example, within the area provided by the front plate 302 , a sensor such as a proximity sensor or an illuminance sensor may be integrated into the display 301 , or disposed adjacent to the display 301 . In some embodiments, the electronic device 300 may further include a light emitting element, and the light emitting element may be disposed at a position adjacent to the display 301 within an area provided by the front plate 302 . The light emitting device may provide, for example, state information of the electronic device 300 in the form of light. In another embodiment, the light emitting device may provide, for example, a light source that is interlocked with the operation of the camera module 305 . The light emitting element may include, for example, an LED, an IR LED, and a xenon lamp.

The display 301 may be viewed outside of the electronic device 300 through, for example, a substantial portion of the front plate 302 . In some embodiments, an edge of the display 301 may be formed to be substantially identical to an adjacent outer shape (eg, a curved surface) of the front plate 302 . In another embodiment (not shown), in order to expand the area to which the display 301 is exposed, the distance between the periphery of the display 301 and the periphery of the front plate 302 may be substantially the same. In another embodiment (not shown), a recess or an opening is formed in a part of the screen display area of the display 301 and another electronic component aligned with the recess or the opening, for example, , the camera module 305 may include a proximity sensor or an illuminance sensor (not shown).

In another embodiment (not shown), at least one of a camera module (eg, 312 and 313 ), a fingerprint sensor, and a flash (eg, 306 ) may be included on the rear surface of the screen display area of the display 301 . . In another embodiment (not shown), the display 301 is coupled to or adjacent to a touch sensing circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and/or a digitizer that detects a magnetic field type stylus pen. can be placed.

The audio module 303 may include a microphone hole and a speaker hole. In the microphone hole, a microphone for acquiring an external sound may be disposed therein, and in some embodiments, a plurality of microphones may be disposed to detect the direction of the sound. In some embodiments, the speaker hole and the microphone hole may be implemented as a single hole 303 , or a speaker may be included without a speaker hole (eg, a piezo speaker). The speaker hole may include an external speaker hole and a receiver hole 314 for a call.

By including a sensor module (not shown), the electronic device 300 may generate an electrical signal or data value corresponding to an internal operating state or an external environmental state. The sensor module may include, for example, a proximity sensor disposed on the first side 310A of the housing 310 , a fingerprint sensor integrated into or disposed adjacent to the display 301 , and/or a second side of the housing 310 . A biometric sensor (eg, an HRM sensor) disposed on the second surface 310B may be further included. The electronic device 300 includes a sensor module not shown, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, It may further include at least one of a humidity sensor and an illuminance sensor.

The

camera modules

305 , 312 , 313 , and 306 are a first camera module 305 disposed on the first surface 310A of the electronic device 300 , and a second camera module disposed on the second surface 310B of the electronic device 300 . 312 , 313 , and/or flash 306 . The above-described

camera modules

305 , 312 , 313 may include one or more lenses, an image sensor, and/or an image signal processor. Flash 306 may include, for example, a light emitting diode or a xenon lamp. In some embodiments, two or more lenses (infrared cameras, wide angle and telephoto lenses) and image sensors may be disposed on one side of the electronic device 300 .

The key input device 317 may be disposed on the side surface 310C of the housing 310 . In another embodiment, the electronic device 300 may not include some or all of the above-mentioned key input devices 317 and the not included key input devices 317 are displayed on the display 301 in a different form (eg, : soft key). In some embodiments, the key input device may include at least a portion of a fingerprint sensor (not shown) disposed on the second surface 310B of the housing 310 .

The connector hole 308 may accommodate a connector for transmitting/receiving power and/or data to/from an external electronic device, and/or a connector for transmitting/receiving an audio signal to/from an external electronic device. For example, the connector hole 308 may include a USB connector or an earphone jack.

Referring to FIG. 4 , an electronic device 400 (eg, the electronic device 101 of FIG. 1 ) according to another exemplary embodiment includes a foldable housing 402 and a foldable portion covering a foldable portion of the foldable housing 402 . A flexible display or foldable display 403 (hereinafter, abbreviated as “display” 403) disposed in the space formed by the hinge cover 404 and the foldable housing 402. may include In the present disclosure, the surface on which the display 403 is disposed is defined as the first surface or the front surface of the electronic device 400 , and the surface facing the first surface or the front surface is defined as the second surface or the rear surface of the electronic device 400 . to be defined as In addition, a surface surrounding the space between the front surface and the rear surface is defined as the third surface or the side surface of the electronic device 400 .

According to an embodiment, the foldable housing 402 may include a first housing structure 402a, a second housing structure 402b, a first rear cover 402c, and a second rear cover 402d. . In one example, the first housing structure 402a and the first rear cover 402c may be integrally formed, and the second housing structure 402b and the second rear cover 402d may be integrally formed.

In one example, the first housing structure 402a and the second housing structure 402b may be disposed on both sides about the folding axis (axis A), and may have an overall symmetrical shape with respect to the folding axis (axis A). . In another example, the first housing structure 402a and the second housing structure 402b may determine whether the electronic device 400 is in an unfolded state (“unfolded state” or “flat state”), a folded state (“folded state”). ) or an intermediate state, the angle or distance between each other may vary. In another example, the first housing structure 402a and the second housing structure 402b may together form a recess for receiving the display 403 , and the display 403 may be disposed in the recess described above. have. At least a portion of the above-described first housing structure 402a and second housing structure 402b may be formed of a metallic material or a non-metallic material having a size selected to support the display 403 .

In one example, the first rear cover 402c may be disposed on one side of the folding axis (A-axis) of the rear surface of the electronic device 400 . For example, the first back cover 402c may have a substantially rectangular periphery, and the periphery described above may be surrounded by the first housing structure 402a. In another example, the second rear cover 402d may be disposed on the other side of the folding axis (A axis) of the rear surface of the electronic device 400 , and an edge thereof may be surrounded by the second housing structure 402b. .

In one example, the first back cover 402c and the second back cover 402d may have a substantially symmetrical shape with respect to the folding axis (A axis). However, the shapes of the first back cover 402c and the second back cover 402d are not limited to mutually symmetrical shapes, and in another embodiment, the electronic device 400 may have various shapes of the first back cover 402c ) and a second rear cover 402d. In another embodiment, the first rear cover 402c may be integrally formed with the first housing structure 402a, and the second rear cover 402d may be integrally formed with the second housing structure 402b. have.

In one example, the first back cover 402c , the second back cover 402d , the first housing structure 402a , and the second housing structure 402b are the various components (eg, printing) of the electronic device 400 . circuit boards and/or batteries) may form a space in which they may be placed. In an embodiment, one or more components may be disposed or visually exposed on the rear surface of the electronic device 400 . For example, at least a portion of the sub-display 405 may be visually exposed through at least one area of the first rear cover 402c. In another embodiment, one or more components or sensors may be visually exposed through at least one area of the second rear cover 402d. The above-described sensor may include, for example, a proximity sensor and/or a rear camera, but is not limited thereto.

According to an embodiment, the electronic device 400 may further include a hinge cover 404 . In one example, the hinge cover 404 may be disposed between the first housing structure 402a and the second housing structure 402b to cover an internal component (eg, a hinge structure). In one example, the hinge cover 404 includes a first housing structure 402a and a second housing structure 402b according to a state (a flat state or a folded state) of the electronic device 400 . It may be covered by a portion of or exposed to the outside For example, when the electronic device 400 is in an unfolded state, the hinge cover 404 may include the first housing structure 402a and the second housing structure 402b. As another example, when the electronic device 400 is in a folded state (eg, a fully folded state), the hinge cover 404 may include the first housing structure 402a and It may be exposed to the outside between the second housing structures 402b As another example, the middle of the first housing structure 402a and the second housing structure 402b folded with a certain angle In the intermediate state, the hinge cover 404 may be partially exposed to the outside between the first housing structure 402a and the second housing structure 402b However, in this case, the exposed area is fully folded In one example, the hinge cover 404 may include a curved surface for protecting the internal configuration of the electronic device 400, but is not limited thereto.

In one example, the display 403 may be disposed on a space formed by the foldable housing 402 . For example, the display 403 is seated on a recess formed by the first housing structure 402a and/or the second housing structure 402b of the foldable housing 402, and the electronic device ( 400) can make up most of the front surface. Accordingly, the front surface of the electronic device 400 may include the display 403 and a partial area of the first housing structure 402a and a partial area of the second housing structure 402b adjacent to the display 403 . In another example, the rear surface of the electronic device 400 includes a first back cover 402c, a partial region of the first housing structure 402a adjacent to the first back cover 402c, a second back cover 402d, and a second A partial region of the second housing structure 402b adjacent to the rear cover 402d may be included.

In one example, the display 403 may refer to a display in which at least a portion of the area can be deformed into a flat surface or a curved surface. According to an embodiment, the display 403 includes a folding area 403c, a first area 403a disposed on one side (eg, one side in the -x direction in FIG. 4 ) with respect to the folding area 403c, and the other side ( For example, the second region 403b (one side in the +x direction of FIG. 4 ) may be included.

The division of regions of the display 403 illustrated in FIG. 4 is exemplary, and the display 403 may be divided into a plurality of regions (eg, two, four, or four or more) according to a structure or function. In one example, in the embodiment shown in FIG. 4 , the region of the display 403 may be divided by the folding region 403c extending parallel to the +y-axis or the folding axis (A-axis), but in another embodiment ( In the display 403 (not shown), regions may be divided based on another folding area (eg, a folding area parallel to the +x axis) or another folding axis (eg, a folding axis parallel to the +x axis).

In one example, when the electronic device 400 is in a flat state, the first housing structure 402a and the second housing structure 402b may be disposed to form an angle of 180° and face the same direction. . In another example, the surface of the first area 403a and the surface of the second area 403b of the display 403 form 180° with each other and face the same direction (eg, the front direction of the electronic device 400 ). can Also, the folding area 403c may form the same plane as the first area 403a and the second area 403b.

In another example, when the electronic device 400 is in a folded state (not shown), the first housing structure 402a and the second housing structure 402b may be disposed to face each other. The surface of the first area 403a and the surface of the second area 403b of the display 403 form a narrow angle (eg, between 0° and 10°) and may face each other. At least a portion of the folding area 403c may be formed of a curved surface having a predetermined curvature.

In another example, when the electronic device 400 is in a folded state, the first housing structure 402a and the second housing structure 402b may be disposed at a certain angle to each other. . The surface of the first area 403a and the surface of the second area 403b of the display 403 may form an angle greater than that in the folded state and smaller than that of the unfolded state. At least a portion of the folding region 403c may be formed of a curved surface having a predetermined curvature, and the curvature in this case may be smaller than that in a folded state.

5A is a perspective view illustrating an electronic device in a closed state according to another embodiment, and FIG. 5B is a perspective view illustrating an electronic device in an open state according to another embodiment. to be.

5A and 5B , an electronic device 500 (eg, the electronic device 101 of FIG. 1 ) according to another embodiment includes a housing 510 and/or a flexible display 520 . (hereinafter, “display” for short).

According to an embodiment, the housing 510 may include a first structure 511 and/or a second structure 512 that is movably assembled (or coupled) to the first structure 511 . In one example, the second structure 512 may slide within a specified range with respect to the first structure 511 . For example, the second structure 512 may move away from the first structure 511 by sliding in the first direction (eg, the +y direction of FIGS. 5A and 5B ) with respect to the first structure 511 . . As another example, the first structure 511 may be moved closer to the first structure 511 by sliding in a second direction opposite to the first direction (eg, the -y direction of FIGS. 5A and 5B ). In one example, when the second structure 512 moves away from the first structure 511 by sliding movement of the second structure 512 in the first direction, the housing 510 may be expanded. In another example, when the second structure 512 approaches the first structure 511 by sliding movement of the second structure 512 in the second direction, the housing 510 may be reduced.

In the present disclosure, a state in which the second structure 512 is maximally separated from the first structure 511 (or "spaced apart") is defined as an "open state" (or "open state"), and the second structure 512 ) is defined as a "closed state" (or "closed state") as a state (or adjacent state) that is maximally close to the first structure 511, and the expressions "open state" and "closed state" are the same hereafter can be used for meaning.

In one embodiment, the first structure 511 includes a first sidewall 511a, a second sidewall 511b, a third sidewall 511c, a fourth sidewall 511d, and/or a back plate (not shown). and at least one area on the side surface and/or at least one area on the rear surface of the electronic device 500 may be formed.

In one example, the first sidewall 511a may form a side surface facing the second direction (eg, the -y direction of FIGS. 5A and 5B ) of the electronic device 500 . In another example, the second sidewall 511b forms a part of a side surface facing the third direction (eg, the +x direction of FIGS. 5A and 5B ) of the electronic device 500 , and the third sidewall 511c is the electronic device 500 . A portion of a side surface of the device 500 that faces a fourth direction opposite to the third direction (eg, the -x direction of FIGS. 5A and 5B ) may be formed. In another example, the fourth sidewall 511d may form at least one region of the side facing the first direction (eg, the +y direction of FIGS. 5A and 5B ) opposite to the second direction of the electronic device 500 . can For example, the first sidewall 511a may be disposed to face the fourth sidewall 511d, and the second sidewall 511b may be disposed to face the third sidewall 511c. As another example, the second sidewall 511b may include one end of the first sidewall 511a (eg, one end in the +x direction in FIGS. 5A and 5B ) and/or one end of the fourth sidewall 511d (eg, FIG. 5A , FIG. 5A , It is connected to one end in the +x direction of FIG. 5B ), and the third sidewall 511c is the other end of the first sidewall 511a (eg, one end in the -x direction in FIGS. 5A and 5B ) and/or a fourth sidewall ( 511d) (eg, one end in the -x direction of FIGS. 5A and 5B ).

In another example, the rear plate may form the rear surface of the electronic device 500 facing the sixth direction (eg, the -z direction of FIGS. 5A and 5B ). In one example, the first structure 511 by the first sidewall 511a , the second sidewall 511b , the third sidewall 511c , the fourth sidewall 511d and/or the back plate of the first structure 511 . ) may have an internal space formed therein, and the second structure 512 may be accommodated in the aforementioned internal space. For example, the first sidewall 511a, the second sidewall 511b, the third sidewall 511c, the fourth sidewall 511d, and/or the rear plate of the first structure 511 may be integrally formed. , but is not limited thereto.

In one embodiment, the second structure 512 may include a fifth sidewall 512a , a sixth sidewall 512b , a seventh sidewall 512c , and/or a support plate 513 .

In one example, the fifth sidewall 512a of the second structure 512 may form a portion of a side surface facing the first direction (eg, the +y direction of FIGS. 5A and 5B ) of the electronic device 500 . . The fifth sidewall 512a may form, for example, a side surface facing the first direction of the electronic device 500 together with the fourth sidewall of the first structure 511 .

In another example, the sixth sidewall 512b forms a portion of a side surface facing the third direction (eg, the +x direction of FIGS. 5A and 5B ) of the electronic device 500 , and the seventh sidewall 512c is the electronic device 500 . It may form a part of the side surface facing the fourth direction (eg, the -x direction of FIGS. 5A and 5B ) of the device 500 .

In another example, the support plate 513 may include a first surface 513a facing a fifth direction (eg, a +z direction in FIGS. 5A and 5B ) and/or a sixth direction facing the fifth direction opposite to the fifth direction. It may include two surfaces 513b. For example, at least a partial area of the display 520 may be disposed on the first surface 513a of the support plate 513 , and the second surface 513b of the support plate 513 is the electronic device 500 . It may form part of the back surface.

In one example, the second structure 512 is formed by a first sidewall 511a , a second sidewall 511b , a third sidewall 511c , a fourth sidewall and/or a back plate of the first structure 511 . As it is accommodated in the inner space of the second structure 512 , a portion of the sixth sidewall 512b and/or the seventh sidewall 512c of the second structure 512 is obscured by the first structure 511 to the outside of the electronic device 500 . may not be acknowledged in In one example, the fifth sidewall 512a, the sixth sidewall 512b, the seventh sidewall 512c, and/or the support plate 513 of the second structure 512 may be integrally formed, but are limited thereto. it is not

In one example, the second structure 512 may slide based on the first structure 511 within a predetermined range. As an example, the second structure 512 may slide in a first direction with respect to the first structure 511 , and the first structure 511 of the first structure 511 may slide by the sliding movement of the second structure 512 . The distance between the sidewall 511a and the fifth sidewall 512a of the second structure 512 may increase. As another example, the second structure 512 may slide in a second direction opposite to the first direction with respect to the first structure 511 , and by the above-described sliding movement of the second structure 512 , the first structure 512 . The distance between the first sidewall 511a of the structure 511 and the fifth sidewall 512a of the second structure 512 may be close.

In one example, when the electronic device 500 is in a closed state, the distance between the first sidewall 511a of the first structure 511 and the fifth sidewall 512a of the second structure 512 may be the shortest. In another example, when the electronic device 500 is in an open state, the distance between the first sidewall 511a and the fifth sidewall 512a of the second structure 512 may be the longest.

In the electronic device 500 according to an embodiment, the lengths of the first sidewall 511a and the fourth sidewall 511d of the first structure 511 are greater than the lengths of the second sidewall 511b and the third sidewall 511c. It may be formed into a long structure. For example, the electronic device 500 may be formed to have a structure in which the length of a side surface parallel to the +x direction or the -x direction is longer than the length of the side surface parallel to the +y direction or the -y direction. However, the structure of the electronic device 500 is not limited to the above-described embodiment.

According to an embodiment, the display 520 may have a flexible characteristic so that some shapes and structures can be deformed, and the front surface of the electronic device 500 (eg, the +z direction of FIGS. 5A and 5B ) It may form at least a part of the one surface facing toward In one example, the display 520 is disposed on at least one region of the outer circumferential surface of the second structure 512 , and when the second structure 512 slides with respect to the first structure 511 , the second structure 512 . You can slide with

In an embodiment, the display 520 may include a flat region 520a and/or a rolling region 520b. In one example, the flat area 520a of the display 520 is disposed on the first surface 513a of the support plate 513 of the second structure 512 , so that the electronic device 500 is in a state (eg, a closed state). Alternatively, it may mean an area that is always visible outside the electronic device 500 irrespective of the open state). In another example, the rolling area 520b of the display 520 may mean an area selectively viewed outside the electronic device 500 according to the state of the electronic device 500 . The flat area 520a of the display 520 is, for example, at least at one side edge portion (eg, an end in the +y direction of FIGS. 5A and 5B ), a fourth sidewall of the first structure 511 . It may include a curved portion that is curved toward 511d and extends seamlessly. In one example, the rolling region 520b of the display 520 is accommodated in the inner space of the first structure 511 when the electronic device 500 is in a closed state, so that it is not visible from the outside of the electronic device 500 . can

In another example, when the electronic device 500 is switched from the closed state to the open state, the rolling area 520b of the display 520 is moved inside the first structure 511 by sliding movement of the second structure 512 . It may be withdrawn from space to the outside of the electronic device 500 . When the electronic device 500 is switched from the closed state to the open state, as the rolling area 520b is drawn out of the electronic device 500 , the entire display 520 viewed from the outside of the electronic device 500 is area can be increased. For example, when the electronic device 500 is in a closed state, the area of the display 520 viewed from the outside of the electronic device 500 may be _{the first area A 1 .} On the other hand, when the electronic device 500 is in an open state, the area of the display 520 viewed from the outside of the electronic device 500 may be a second area A _{2 that} _{is larger than the first area A 1 .}

In another example, when the electronic device 500 is switched from an open state to a closed state, the rolling area 520b of the display 520 is moved by sliding movement of the second structure 512 of the first structure 511 . It may be introduced into the interior space. When the electronic device 500 is switched from the open state to the closed state, as the rolling region 520b is introduced into the inner space of the first structure 511 , the display 520 viewed from the outside of the electronic device 500 . The total area of can be reduced.

According to an embodiment, the electronic device 500 may provide a screen of the display 520 having a size corresponding to an externally viewed area of the electronic device 500 . For example, when the electronic device 500 is in a closed state, the electronic device 500 displays a screen having _{an area corresponding to the size of the flat area 520a of the display 520 (eg, A 1 in FIG. 5A ).} can provide As another example, when the electronic device 500 is in an open state, the electronic device 500 has an area corresponding to the sum of the partial areas of the flat area 520a and the rolling area 520b of the display 520 (eg, in FIG. A _{screen having A 2} ) of 5b may be provided.

According to an embodiment, the electronic device 500 includes one of a key input device (not shown), a sensor module 504 , an

audio module

503 , 506 , and 507 , a camera module 505 , and/or a connector hole 508 . It may further include at least one or more. In another embodiment, the electronic device 500 may omit at least one (eg, a key input device) from among the above-described components or may additionally include other components.

In an embodiment, the key input device may be disposed on at least one side of the housing 510 , and the electronic device 500 may sense a user input through the key input device. For example, the key input device may be disposed on at least one region of the second sidewall 511b of the first structure 511 , but is not limited thereto. In another embodiment, the electronic device 500 may not include some or all of the key input devices, and the not included key input devices may be implemented in other forms such as soft keys on the display 520 .

In an embodiment, the electronic device 500 may include the sensor module 504 to generate an electrical signal or data value corresponding to an internal operating state or an external environmental state. For example, the sensor module 504 may include a distance sensor (eg, TOF sensor), a proximity sensor, a fingerprint sensor, and a biometric sensor (eg, a TOF sensor) for measuring a distance between the first structure 511 and the second structure 512 . HRM sensor), a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an infrared (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor. However, the type of the sensor module is not limited to the above-described example.

In one embodiment, the

audio module

503 , 506 , 507 may include a microphone hole 503 and/or a

speaker hole

506 , 507 . In the microphone hole 503, a microphone for acquiring an external sound may be disposed therein, and in some embodiments, a plurality of microphones may be disposed to sense the direction of the sound. The speaker holes 506 and 507 may include an external speaker hole 506 and/or a receiver hole 507 for a call. In some embodiments, the speaker holes 506 and 507 and the microphone hole 503 may be implemented as a single hole, or a speaker may be included without a speaker hole (eg, a piezo speaker).

In an embodiment, the camera module 505 may include at least one camera module 505 and/or a flash (not shown) disposed on the front and/or rear of the electronic device 500 . In one example, the at least one camera module 505 may include one or a plurality of lenses, an image sensor, and/or an image signal processor. In another example, the flash may include a light emitting diode or a xenon lamp. In some embodiments, two or more lenses (infrared camera, wide-angle and telephoto lenses) and image sensors may be disposed on one side of the electronic device 500 (eg, the rear side of the electronic device 500 ).

In an embodiment, the connector hole 508 may accommodate a connector for transmitting and receiving power and/or data to and from an external electronic device, and/or a connector for transmitting and receiving audio signals to and from an external electronic device. For example, the connector hole 508 may include a USB connector and/or an earphone jack disposed on at least one side of the electronic device 500 . In one embodiment, the USB connector and the earphone jack may be implemented as a single hole, and according to another embodiment, the electronic device 500 is an external electronic device (eg, the electronic device 102 of FIG. 1 , without a separate connector hole). 104)) and power and/or data, or an audio signal.

6A is a diagram illustrating an electrical connection relationship between components of an electronic device according to an exemplary embodiment, and FIG. 6B is a diagram illustrating an electrical connection relationship between components of an electronic device according to another exemplary embodiment.

Components shown in FIGS. 6A and/or 6B are an example of components of the electronic device 300 of FIGS. 3A and 3B , the electronic device 400 of FIG. 4 , and/or the electronic device 500 of FIG. 5 . , and repeated descriptions will be omitted below.

6A and 6B , an electronic device 600 (eg, the electronic device 300 of FIG. 3A , the electronic device 400 of FIG. 4 , and/or the electronic device 500 of FIG. 5 ) according to an embodiment ), the antenna module 700 (eg, the third antenna module 246 of FIG. 2 ), the wireless communication circuit 800 (eg, the wireless communication module 192 of FIGS. 1 and 2 ) and/or at least one of the processor 810 (eg, the processor 120 of FIGS. 1 and 2 ).

According to an embodiment, the antenna module 700 includes an antenna array 710 (eg, the antenna 248 of FIG. 2 ), a radio frequency integrate circuit (RFIC) 720 (eg, the third RFIC 226 of FIG. 2 ). )) and/or a power manage integrate circuit (PMIC) 730 . According to another embodiment (not shown), at least one of the above-described components of the antenna module 700 may be omitted or at least two components may be integrally formed, but is not limited thereto. In one example, the above-described antenna array 710 , RFIC 720 , and/or power management circuit 730 of the antenna module 700 may be disposed on a printed circuit board (not shown). For example, the antenna array 710 is disposed on a first side of the printed circuit board, and the RFIC 720 and/or the power management circuit 730 is on a second side facing away from the first side of the printed circuit board. may be disposed on, but is not limited thereto.

In one embodiment, the antenna array 710 may include a plurality of

antenna elements

711 , 712 , 713 , 714 arranged to form (or “beam forming”) a directional beam. have. In one example, the plurality of

antenna elements

711 , 712 , 713 , 714 are electrically connected to the wireless communication circuit 800 , and an antenna for transmitting and/or receiving a radio frequency (RF) signal of a first frequency band It can act as an emitter. For example, the plurality of

antenna elements

711 , 712 , 713 , and 714 may be electrically connected to the wireless communication circuit 800 through the RFIC 720 .

In one embodiment, the antenna array 710 may include a first antenna element 711 , a second antenna element 712 , a third antenna element 713 , and/or a fourth antenna element 714 . In one example, the first antenna element 711 , the second antenna element 712 , the third antenna element 713 , and/or the fourth antenna element 714 is a dipole antenna element or a patch antenna It may include at least one of the elements (patch antenna element). In another example, the first antenna element 711 , the second antenna element 712 , the third antenna element 713 , and/or the fourth antenna element 714 may be formed in substantially the same shape, but in the embodiment Accordingly, at least one antenna element may be formed in a shape different from that of other antenna elements.

In an embodiment, the RFIC 720 may process an RF signal of a first frequency band transmitted and/or received through the antenna array 710 . The first frequency band may be, for example, a millimeter wave (mmWave) frequency band (eg, about 28 GHz and/or about 39 GHz), but is not limited thereto. In one example, the RFIC 720, at the time of transmission, a signal (or "IF signal (intermediate frequency)") of an intermediate frequency band (eg, about 9 GHz to about 11 GHz) obtained from the wireless communication circuit 800 It can be up-converted to an RF signal of the first frequency band. In another example, the RFIC 720 may, upon reception, down-convert the RF signal of the first frequency band acquired through the antenna array 710 into a signal of an intermediate frequency band. The converted signal may be transmitted or transmitted to the wireless communication circuit 800 . According to another embodiment (not shown), when transmitting, the RFIC 720 transmits a baseband signal (or "BB (base band) signal") obtained from the at least one processor 810 to the RF of the first frequency band. It may be converted into a signal or, upon reception, an RF signal of the first frequency band received through the antenna array 710 may be converted into a baseband signal. The converted signal may be transmitted to at least one processor 810 .

In one embodiment, the RFIC 720 may include an electrical path L formed between the antenna array 710 and the wireless communication circuit 800 . The RFIC 720 may electrically connect the plurality of

antenna elements

711 , 712 , 713 , and 714 of the antenna array 710 through the above-described electrical path L . In one example, the electrical path L is a first path L ₁ , a second path L ₂ , a third path L ₃ and/or a fourth path L ₄ _{at the first point P 1 .} ) can be branched. For example, the first path L ₁ electrically connects the wireless communication circuit 800 and the first antenna element 711, and the second path L ₂ is the wireless communication circuit 800 and the second antenna. Element 712 may be electrically connected. As another example, the third path L ₃ electrically connects the wireless communication circuit 800 and the third antenna element 713 , and the fourth path L ₄ is the wireless communication circuit 800 and the fourth antenna element. (714) may be electrically connected.

In one embodiment, the RFIC 720 includes a mixer 721 , a combiner and divider 722 , at least one first switch 723 , at least one disposed on the electrical path L described above. A first phase shifter 724 , at least one power amplifier (PA) 725 , at least one lower noise amplifier (LNA) 726 , at least one second switch 727 and/or or at least one electrical connection member 728 . In another embodiment (not shown), the RFIC 720 may omit at least one of the above-described components or may additionally include another component (eg, a filter). For example, the at least one first phase shifter 724 is disposed in _{the 1-1 path L 11 , which} operates as an RF signal transmission path between the first antenna element 711 and the wireless communication circuit 800 . a phase shifter 724a and/or a phase shifter 724b disposed in _{a 1-2 th path L 12 , which} operates as an RF signal reception path between the first antenna element 711 and the wireless communication circuit 800 . can do.

In an embodiment, the mixer 721 is disposed on the electrical path L, and may convert a frequency band of a signal transmitted between the antenna array 710 and the wireless communication circuit 800 . In one example, the mixer 721 may convert a signal of an intermediate frequency band received from the wireless communication circuit 800 into a signal of a first frequency band. For example, the mixer 721 includes an I/Q signal (in-phase and quadrature signal) of an intermediate frequency band obtained from the wireless communication circuit 800 and an LO signal obtained from a local oscillator (not shown). (local oscillator signal) may be mixed to generate an RF signal of an intermediate frequency band and a first frequency band having a frequency higher than that of the LO signal. In another example, the mixer 721 may convert the RF signal of the first frequency band received from the antenna array 710 into an I/Q signal of the intermediate frequency band.

In one embodiment, the combiner and divider 722 may convert the transmit RF signal transmitted through the electrical path L into a plurality of signals. Alternatively, the combiner and divider 722 may combine a plurality of received RF signals into one received RF signal. For example, the combiner and divider 722 is _{disposed adjacent to the first point P 1} of the electrical path L during transmission, and transmits the transmit RF signal to the first path L ₁ , the second path ( L ₂ ), a third path L ₃ , and/or a fourth path L ₄ may be divided. As another example, combiner and divider 722 may include a plurality of receive RFs obtained from _{a first path L 1} , a second path L ₂ , a third path L ₃ , and/or a fourth path L _{4 .} Signals can be combined into one received RF signal.

In one embodiment, the at least one first switch 723 and/or the at least one second switch 727 may be disposed on the electrical path L. The at least one first switch 723 and/or the at least one second switch 727 may form one of a receiving path of an RF signal or a receiving path of an RF signal. For example, the at least one first switch 723 is a 1-1 switch 723a, a 1-2 switch 723b, a 1-3 switch 723c, and/or a 1-4 switch ( 723d). As another example, the at least one second switch 727 may include a 2-1 th switch 727a, a 2-2 th switch 727b, a 2-3 th switch 727c, and/or a 2-4 th switch 727d. ) may be included.

In one example, the first-first switch 723a and/or the second-first switch 727a may be located on _{the first path L 1 .} The 1-1 switch 723a and/or the 2-1 switch 727a may form a 1-1 path L ₁₁ and/or a 1-2 th path L ₁₂ . The 1-1 path L ₁₁ may operate as an RF signal transmission path between the first antenna element 711 and the wireless communication circuit 800 . The 1-2-th path L ₁₂ may operate as an RF signal reception path between the first antenna element 711 and the wireless communication circuit 800 .

In another example, the 1-2th switch 723b and/or the 2-2nd switch 727b may be located on _{the first path L 2 .} The 1-2 th switch 723b and/or the 2-2 th switch 727b may form a 2-1 th path L ₂₁ and/or a 2-2 _{th path L 22} . The second-first path L ₂₁ may operate as an RF signal transmission path between the two antenna elements 712 and the wireless communication circuit 800 . The second-second path L ₂₂ may operate as an RF signal reception path between the second antenna element 712 and the wireless communication circuit 800 .

In another example, the 1-3 th switch 723c and/or the 2-3 th switch 727c may be located on _{the third path L 3 .} The 1-3 th switch 723c and/or the 2-3 th switch 727c may form a 3-1 th path L ₃₁ and/or a 3-2 _{th path L 32} . The 3-1 th path L ₃₁ may operate as an RF signal transmission path between the third antenna element 713 and the wireless communication circuit 800 . The 3-2 path L ₃₂ may operate as an RF signal reception path between the third antenna element 713 and the wireless communication circuit 800 .

In another example, the 1-4th switch 723d and/or the 2-4th switch 727d may be located on _{the fourth path L 4 .} The 1-4 th switch 723d and/or the 2-4 th switch 727d may form a 4-1 th path L ₄₁ and/or a 4-2 _{th path L 42} . The 4-1 th path L ₄₁ may operate as an RF signal transmission path between the fourth antenna element 714 and the wireless communication circuit 800 . The 4-2 th path L ₄₂ may operate as an RF signal reception path between the fourth antenna element 714 and the wireless communication circuit 800 .

In one embodiment, the at least one first phase shifter 724 may be disposed on the electrical path L. The at least one first phase shifter 724 converts the phase of the transmitted RF signal transmitted from the wireless communication circuit 800 to the antenna array 710 , or is transmitted from the antenna array 710 to the wireless communication circuit 800 . It is possible to change the phase of the received RF signal. In one example, the at least one first phase shifter 724 is a 1-1 path (L ₁₁ ), a 1-2 _{th path (L 12} ), a 2-1 th path (L ₂₁ ), and a 2-2 th path in series on the path L ₂₂ , the 3-1 path L ₃₁ , the 3-2 path L ₃₂ , the 4-1 path L ₄₁ and/or the 4-2 path L ₄₂ . A series connection may be made to change the phase of the transmitted RF signal and/or the received RF signal. However, the present invention is not limited thereto.

In an embodiment, the at least one power amplifier 725 may amplify the power of the transmitted RF signal transmitted from the wireless communication circuit 800 to the antenna array 710 . In one example, the at least one power amplifier 725 is a 1-1 path (L ₁₁ ), a 2-1 path (L ₂₁ ), a 3-1 path (L ₃₁ ) and / or disposed in the 4-1 th path (L ₄₁ ), the power of the transmit RF signal input to the at least one power amplifier 725 may be amplified. In another example, the transmit RF signal amplified through the at least one power amplifier 725 is a first antenna element 711 , a second antenna element 712 , a third antenna element 713 , and/or a fourth antenna element (714).

In an embodiment, the at least one low-noise amplifier 726 may amplify the power of the received RF signal transmitted from the antenna array 710 to the wireless communication circuit 800 . In one example, the at least one low-noise amplifier 726 includes a 1-2 th path L ₁₂ , a 2-2 _{th path L 22} , a 3-2 th path L ₃₂ , and / or disposed in the 4-2 path L ₄₂ , input from the first antenna element 711 , the second antenna element 712 , the third antenna element 713 and/or the fourth antenna element 714 . It is possible to amplify the power of the received RF signal. In another example, the received RF signal amplified by the at least one low noise amplifier 726 may be delivered to the wireless communication circuit 800 via the mixer 721 , combiner and divider 722 .

In an embodiment, the at least one electrical connection member 728 may be electrically connected to the antenna array 710 to transmit a transmit RF signal transmitted through the electrical path L to the antenna array 710 . Alternatively, the at least one electrical connection member 728 may transmit the received RF signal obtained through the antenna array 710 to the electrical path L. In one example, the at least one electrical connection member 728 includes a first electrical connection member 728a, a second electrical connection member 728b, a third electrical connection member 728c, and/or a fourth electrical connection member ( 728d). The first electrical connection member 728a may electrically connect the first antenna element 711 and the first path L ₁ . The second electrical connection member 728b may electrically connect the second antenna element 712 and the second path L ₂ . The third electrical connection member 728c may electrically connect the third antenna element 713 and the third path L ₃ . The fourth electrical connection member 728d may electrically connect the fourth antenna element 714 and the fourth path L ₄ . The at least one electrical connection member 728 may include, for example, a transmission line (TL), but is not limited thereto. As another example, the at least one electrical connection member 728 may include at least one of a coaxial cable, a C-clip, or a printed circuit board (PCB) (eg, a flexible printed circuit board (FPCB)). may include

According to one embodiment, the RFIC 720 may include a variable length element 740 configured to change the electrical length of the electrical path (L). In one example, the variable-length element 740 may change the value of the input impedance (or “input impedance) input to the antenna array 710 by changing the electrical length of the electrical path L”.

In one example, an impedance value for impedance matching (or “impedance matching”) may be different according to a frequency band of an RF signal transmitted and/or received through the antenna array 710 . In the case of the antenna module that does not include the variable length element 740 , the input impedance value is fixed, so that radiation performance in a specific frequency band may be deteriorated. The electronic device 600 according to an embodiment may adjust the input impedance value by changing the electrical length of the electrical path L using the variable-length element 740 , and as a result, the radiation of the antenna module 700 . performance can be improved.

In one embodiment, the variable-length element 740 is branched at at least one point of the electrical path L to be connected (or “shunt connection”) between the electrical path L and the ground. can be

Referring to FIG. 6A , the variable-length element 740 is, in one example _{, branched at the second point P 2} between the mixer 721 and the combiner and distributor 722 of the electrical path L, the electrical path It may be connected between the second point P ₂ of (L) and the ground, but is not limited thereto.

In one embodiment, the processor 810 may be operatively coupled to the variable length element 740 . For example, the processor 810 may control the variable element 740 through the wireless communication circuit 800 . For example, the processor 810 may change the electrical length of the electrical path L of the variable element 740 by transmitting a control signal (eg, a control command) to the wireless communication circuit 800 .

Referring to FIG. 6B , the variable-length element 740 is, in another example, a first electrical connection member 728a and a second electrical connection member 728b positioned between the wireless communication circuit 800 and the antenna array 710 . , may be branched from one point of at least one of the third electrical connection member 728c and the fourth electrical connection member 728d to be connected between the aforementioned one point and the ground. Although not shown in the drawing, the variable-length element 740 is, in another example, the first path L ₁ , the second path L ₂ , the third path L _{3 of the electrical} path L, or It may be branched from one point of at least one of the fourth paths L _{4 and connected between the aforementioned one point and the ground.} For example, the variable length element 740 includes a 1-1 switch 723a, a 1-2 switch 723b, a 1-3 switch 723c, and/or a 1-4 switch 723d and It may be branched and connected at an adjacent point, but is not limited thereto.

According to an embodiment, the variable-length element 740 may include a fifth phase shifter. In one example, the fifth phase shifter is, unlike the at least one first phase shifter 724 connected in series on the electrical path L, at a point (eg, the second point P _{2 ) of the electrical path L.} )), the electrical length of the electrical path L may be changed by the operation of the fifth phase converter. For example, the electrical length of the electrical path L may be increased or decreased by the phase changing operation of the fifth phase converter. In another example, the fifth phase shifter may be a phase shifter having a relatively high resolution compared to the at least one first phase shifter 724 . For example, the at least one first phase shifter 724 may be a phase shifter having a first bit, and the fifth phase shifter may be a phase shifter having a second bit greater than the first bit. The electronic device 600 according to an embodiment can more precisely adjust the electrical length of the electrical path L through the fifth phase converter having a relatively high precision, and as a result, the input terminal impedance value is more precisely changed. The radiation performance of the antenna module 700 may be improved. The variable-length element 740 is not limited to the above-described embodiment, and according to another embodiment (not shown), the variable-length element 740 includes a variable capacitor capable of changing a capacitance value. may include

In another embodiment (not shown), the variable-length element 740 may be a phase shift circuit. For example, the variable-length element 740 may be a circuit formed of at least one of a capacitor, an inductor, and/or a diode, or a combination of two or more of the above.

In an embodiment, the power management circuit 730 may receive a voltage from the main PCB (not shown) to provide power required for various components of the antenna module 700 . For example, the power management circuit 730 may provide power to the RFIC 720 .

According to another embodiment (not shown), the antenna module 700 may further include at least one of a module interface (not shown) and/or a shielding member (not shown).

In an embodiment, the antenna module 700 may be electrically connected to another printed circuit board (eg, a main PCB) through a module interface. In one example, the module interface may include, but is not limited to, a coaxial cable connector, a board to board connector, an interposer, or a flexible printed circuit board (FPCB). In another example, the antenna module 700 may be electrically connected to the RFIC 720 and/or the power management circuit 730 to another printed circuit board (eg, a main PCB) of the electronic device 600 .

In one embodiment, the shielding member may electromagnetically shield the RFIC 720 and/or the power management circuit 730 of the antenna module 700 . For example, the shielding member may include a shield can, and may shield noise flowing into the antenna module 700 or shield noise generated in the antenna module 700 .

According to an embodiment, the wireless communication circuit 800 may be electrically connected to the antenna module 700 and/or at least one processor 810 . The wireless communication circuit 800 may transmit an RF signal to the antenna array 710 of the antenna module 700 or receive an RF signal from the antenna array 710 . In one example, the wireless communication circuit 800 may include an intermediate frequency integrated circuit (IFIC). For example, the IFIC of the wireless communication circuit 800 may convert a baseband signal obtained from the at least one processor 810 into an intermediate frequency band signal (or “IF signal”) during transmission. As another example, when receiving, the IFIC of the wireless communication circuit 800 converts an intermediate frequency band signal acquired through the antenna module 700 into a baseband signal, and converts the converted signal into at least one processor 810 . can be transmitted as

According to an embodiment, the at least one processor 810 may be electrically connected to the wireless communication circuit 800 to control overall communication (eg, wireless communication) of the electronic device 600 . For example, the at least one processor 810 may transmit an RF signal to the wireless communication circuit 800 or receive an RF signal from the wireless communication circuit 800 .

In an embodiment, the at least one processor 810 may be electrically connected to the variable-length element 740 of the antenna module 700 . In one example, the at least one processor 810 may control the electrical length of the electrical path L formed between the wireless communication circuit 800 and the antenna array 710 by controlling the variable-length element 740 . . For example, the at least one processor 810 may control the variable-length element 740 to increase the electrical length of the electrical path L or decrease the electrical length of the electrical path L. In another example, the at least one processor 810 may adjust the input impedance value input to the antenna array 710 by adjusting the electrical length of the electrical path L. The operation of controlling the variable length element 740 of the at least one processor 810 will be described later.

In one example, the at least one processor 810 may include, but is not limited to, a communication processor (CP) and/or an application processor (AP). According to another embodiment, the at least one processor 810 may be one processor in which a communication processor and an application processor are combined.

According to an embodiment, the electronic device 600 has an electrical length of the electrical path L formed between the wireless communication circuit 800 and the antenna array 710 of the antenna module 700 through the variable length element 740 . can be changed to adjust the input impedance value. Accordingly, the electronic device 600 may improve the performance of the antenna module 700 . Hereinafter, with reference to FIGS. 7A, 7B and/or 8 , an effect of improving the performance of the antenna module 700 according to the change in the electrical length of the electrical path L will be described.

7A is a graph illustrating a change in a resonance frequency of an antenna module according to a change in an electrical length of an electrical path between an antenna of an electronic device and a wireless communication circuit according to an exemplary embodiment, and FIG. 7B is an electronic device according to another exemplary embodiment; It is a graph showing the change in the resonance frequency of the antenna module according to the change in the electrical length of the electrical path between the antenna and the wireless communication circuit. 8 is a graph illustrating a gain change of an antenna module according to a change in an electrical length of an electrical path between an antenna of an electronic device and a wireless communication circuit according to an exemplary embodiment.

7A is a first antenna element (eg, the first antenna of FIGS. 6A and 6B ) according to the operation of the variable-length element (eg, the variable-length element 740 of FIGS. 6A and 6B ) in a frequency band of about 28 GHZ. element 711) shows the change in antenna gain.

Referring to FIG. 7A , according to an embodiment, an electronic device is formed between a first antenna element and a wireless communication circuit (eg, the wireless communication circuit 800 of FIGS. 6A and 6B ) using a variable-length element. As the length of the electrical path (eg, the first path L _{1 in} FIGS. 6A and 6B ) is changed, it can be confirmed that the radiation performance of the first antenna element and/or the resonant frequency of the first antenna element moves. . In one example, when the electrical length of the electrical path is not changed using the variable-length element, the resonant frequency of the first antenna element may be about 28 GHz, and the reflection coefficient of the first antenna element at the resonant frequency (eg: S(1,1)) may be about -18 dB. In another example, when the electrical length of the electrical path is changed by changing the phase of the variable-length element (eg, by changing in the order of 170°, 160°, 150°, 140°), the resonant frequency of the first antenna element is about It can be seen that 28 GHz is changed to about 27.5 GHz, about 25.5 GHz, and about 24.5 GHz, and the reflection coefficient of the first antenna element is also improved compared to when the electrical length of the electrical path is not changed.

7B shows a first antenna element, a second antenna element (eg, the second antenna element 712 of FIGS. 6A and 6B ), a third antenna element ( Example: shows the change in antenna gain of the third antenna element 713 of FIGS. 6A and 6B ) and/or the fourth antenna element (eg, the fourth antenna element 714 of FIGS. 6A and 6B ). 8 is a gain polar plot showing changes in antenna gain of the first antenna element, the second antenna element, the third antenna element, and/or the fourth antenna element according to the operation of the variable-length element in the frequency band of about 28 GHz; ) is indicated.

Referring to FIG. 7B , according to an embodiment, the electronic device uses a variable-length element to connect an antenna array (eg, a first antenna element, a second antenna element, a third antenna element, and/or a fourth antenna element) and As the length of the electrical path formed between the wireless communication circuits (eg, the electrical path L in FIGS. 6A and 6B ) is changed, it can be confirmed that the radiation performance of the antenna array and/or the resonance frequency of the antenna array are shifted. have. In one example, when the electrical length of the electrical path is not changed using the variable-length element, the resonant frequency of the antenna array may be about 29.5 GHz. The reflection coefficient (eg, S(1,1)) of the antenna array at the resonant frequency may be about -10 dB. In another example, when the electrical length of the electrical path is changed by changing the phase of the variable-length element (eg, changing in the order of 170°, 160°, 150°, 140°), the resonant frequency of the antenna array is about 29.5 GHz is changed from about 29 GHz to about 28.5 GHz, and it can be seen that the reflection coefficient of the antenna array is also improved compared to when the electrical length of the electrical path is not changed.

Referring to FIG. 8 , according to an embodiment, it is confirmed that the antenna gain of the antenna array is improved as the electronic device uses a variable length element to change the length of an electrical path formed between the antenna array and the wireless communication circuit. can In one example, when the electrical length of the electrical path is not changed using the variable length element, the antenna gain of the beam pattern of the antenna array oriented in the 90° direction may be about 3.6998 dB. On the other hand, when the electrical length of the electrical path is changed by changing the phase of the variable-length element (eg, changing in the order of 170°, 160°, 150), the antenna gain of the beam pattern of the antenna array facing the 90° direction is about It can be improved up to 6.6668 dB. That is, it can be confirmed that the antenna gain of the antenna array can be improved by about 3 dB by changing the electrical length of the electrical path through the variable length element.

Referring to FIGS. 7A, 7B and/or 8 , the electronic device according to an embodiment controls the variable-length element to change the electrical length of the electrical path between the wireless communication circuit and the antenna array, thereby resonating the antenna array. It can be confirmed that the frequency can be shifted or the performance of the antenna array (eg, radiation performance) can be improved.

Referring to FIG. 9 , an electronic device 600 (eg, the electronic device 600 of FIGS. 6A and 6B ) according to an embodiment includes an antenna array 710 (eg, the antenna array 710 of FIG. 6A ). , RFIC 720 (eg, RFIC 720 of FIG. 6A ), power management circuit 730 (eg, power management circuit 730 of FIG. 6A ), and variable length element 740 (eg, FIG. 6A , FIG. 6A ) An antenna module 700 (eg, the antenna module 700 of FIG. 6A ), a switch circuit 750 , and a wireless communication circuit 800 (eg, the wireless communication of FIG. 6A ) including the variable-length element 740 of 6b ) circuit 800) and/or at least one processor 810 (eg, at least one processor 810 of FIG. 6A ). The electronic device 600 according to an embodiment may be an electronic device to which a switch circuit 750 is added in the electronic device 600 of FIGS. 6A and/or 6B , and a redundant description will be omitted below.

According to an embodiment, the switch circuit 750 may be electrically connected to the variable-length element 740 . The above-described switch circuit 750 may selectively connect the variable-length element 740 to the ground or electrically open it. For example, depending on the electrical connection state of the switch circuit 750 , the variable-length element 740 may be connected to the ground or may be in an electrically open state. In one example, the variable length element 740 according to the electrical connection state of the switch circuit 750, an electrical path (L) formed between the antenna array 710 and the wireless communication circuit 800 (eg, Fig. 6a, The electrical length of the electrical path L of FIG. 6B may be changed. For example, as the variable-length element 740 is selectively connected to the ground or electrically opened, the electrical length of the electrical path L may be changed. According to an embodiment, the electronic device 600 may change the electrical length of the electrical path L by controlling the electrical connection state of the variable-length element 740 and/or the switch circuit 750 , and accordingly, the antenna array An input impedance value input to 710 may be changed. The above-described electronic device 600 may improve the performance of the antenna module 700 and reduce the generation of interference signals by changing the input impedance value through the variable length element 740 and/or the switch circuit 750 . .

In an embodiment, the switch circuit 750 may be electrically connected to at least one processor 810 , and the at least one processor 810 may control an electrical connection state of the switch circuit 750 . For example, the at least one processor 810 may control the electrical connection state of the switch circuit 750 so that the variable-length element 740 is connected to the ground. As another example, the at least one processor 810 may control the electrical connection state of the switch circuit 750 so that the variable-length element 740 is in an electrically open state.

According to another embodiment (not shown), the switch circuit 750 may be electrically connected to the wireless communication circuit 800 , and the wireless communication circuit 800 may control the electrical connection state of the switch circuit 750 . .

10 is a flowchart illustrating an operation of controlling a variable-length element of an electronic device according to an exemplary embodiment. Hereinafter, the control operation of FIG. 10 will be described with reference to the configuration shown in FIGS. 6A and/or 6B.

Referring to FIG. 10 , in operation 1001 , at least one processor 810 (eg, FIGS. 6A and 6B ) of an electronic device 600 (eg, the electronic device 600 of FIGS. 6A and 6B ) according to an embodiment. At least one processor 810 of 6b) is to check or monitor a frequency band of an RF signal transmitted and/or received through the antenna module 700 (eg, the antenna module 700 of FIGS. 6A and 6B). can In one example, the at least one processor 810 uses a wireless communication circuit 800 electrically connected to the at least one processor 810 (eg, the wireless communication circuit 800 of FIGS. 6A and 6B ), A frequency band of an RF signal transmitted and/or received through the antenna module 700 may be detected.

In operation 1002, the at least one processor 810 of the electronic device 600 according to an embodiment, based on the frequency band of the RF signal checked or monitored in operation 1001, the variable length element 740 (eg, FIG. The variable-length element 740 of FIGS. 6A and 6B may be controlled. Depending on the frequency band of the RF signal transmitted and/or received by the antenna module 700, an impedance value capable of achieving optimal performance (eg, radiation performance) may be different. In one example, the at least one processor 810 controls an electrical path ( The electrical length of L) (eg, the electrical path L of FIGS. 6A and 6B ) can be adjusted. For example, the at least one processor 810 may increase or decrease the electrical length of the electrical path L to adjust the input impedance value according to the sensed RF signal. The electronic device 600 according to an embodiment may improve the radiation performance of the antenna module 700 for transmitting and/or receiving RF signals of various frequency bands through operations 1001 and/or 1002 described above. .

11 is a flowchart illustrating an operation of controlling a variable-length element of an electronic device according to another exemplary embodiment. Hereinafter, the control operation of FIG. 11 will be described with reference to the configuration shown in FIGS. 6A and/or 6B.

Referring to FIG. 11 , in operation 1101 , at least one processor 810 (eg, FIGS. 6A and 6B ) of an electronic device 600 (eg, the electronic device 600 of FIGS. 6A and 6B ) according to an embodiment. At least one processor 810 of 6b may detect whether a specified event has occurred. In one example, when a specific event (eg, charging of the electronic device 600 ) occurs in the electronic device 600 , noise may be generated during the event generation process. In another example, interference between the noise generated in the event generation process and the RF signal of a specific frequency band transmitted and/or received through the antenna module 700 (eg, FIGS. 6A and 6B ) occurs, so that the specific frequency band Radiation performance of the antenna module 700 may be reduced. According to an embodiment, in operation 1101 , the at least one processor 810 may detect whether a specified event that may cause deterioration of the radiation performance of the antenna module 700 has occurred. The designated event may mean that a situation related to the electronic device is issued or an operation is performed by a component of the electronic device. The processor 810 may detect that a specified event has occurred to perform an operation to control other components, or may detect whether a specified event has occurred using a sensor included in the electronic device. For example, the specified event is a carrier aggregation (carrier aggregation) performed, a camera (eg, the camera module (305, 306, 312, 313) in FIGS. 3A and 3B) driving, an audio module (eg, FIGS. 3A and 3B) Driving the audio module 303 of 3b), receiving a user input for a display (eg, the display 301 of FIG. 3A ), charging the electronic device 600, executing a specified application, or a sensor (eg, the sensor module of FIG. 1 ) (176)) may include at least one of the driving, but is not limited thereto. As another example, the designated event may include a state change of the electronic device 600 . A state change of the electronic device 600 may indicate that the electronic device 600 (eg, the electronic device 400 of FIG. 4 ) (or “foldable electronic device”) is converted from a folded state to an unfolded state, or is folded from an unfolded state. and/or electronic device 600 (eg, electronic device 500 of FIGS. 5A-5B ) (or "rollable or slideable electronic device") when transitioned to a closed state (eg, electronic device of FIG. 5A ). It may include a case in which the device 500 is switched to an open state (eg, the electronic device 500 of FIG. 5B ) or is switched from an open state to a closed state.

In operation 1102, the at least one processor 810 of the electronic device 600 according to an embodiment performs the variable-length element 740 (eg, FIG. 6A ) based on the determination that the specified event in operation 1101 has occurred. , the variable-length element 740 of FIG. 6B may be controlled. In one example, the at least one processor 810 controls the variable-length element 740 based on the occurrence of a specified event, thereby controlling the electrical path L between the wireless communication circuit 800 and the antenna module 700 (eg, : The electrical length of the electrical path (L) of FIGS. 6A and 6B can be adjusted. For example, when a state change of the electronic device 600 occurs, the at least one processor 810 may increase or decrease the electrical length of the electrical path L to adjust the input impedance value. As another example, the at least one processor 810 may increase or decrease the electrical length of the electrical path L to adjust the input impedance value based on the execution of a specified application.

The electronic device 600 according to an embodiment may reduce performance degradation of the antenna module 700 due to noise generated in the process of generating a specified event through operations 1101 and/or 1102 described above.

12 is a flowchart illustrating an operation of controlling a variable-length element of an electronic device according to another exemplary embodiment. Hereinafter, the control operation of FIG. 12 will be described with reference to the configuration shown in FIGS. 6A and/or 6B.

According to an embodiment, the electronic device 600 (eg, the electronic device 600 of FIGS. 6A and 6B ) transmits and/or receives an RF signal of a first frequency band to the antenna module 700 (eg, FIG. 6B ). 6a, 6b antenna module 700) and / or transmits an RF signal of the second frequency band and / or antenna (eg, the first antenna module 242, the second antenna module 244 of Figure 2, or a third antenna module 246). In one example, the first frequency band may overlap at least a portion of the second frequency band or may be substantially the same. In another example, the antenna module 700 and the aforementioned antenna (eg, the first antenna module 242 , the second antenna module 244 , or the third antenna module 246 of FIG. 2 ) simultaneously communicate (eg: When performing wireless communication) (or "performing E-UTRAN New Radio Dual connectivity (ENDC)"), the RF signal of the first frequency band transmitted and/or received through the antenna module 700 and the transmission and / or interference may occur between the received RF signals of the second frequency band. When the antenna module 700 and the antenna simultaneously communicate, the electronic device 600 according to an embodiment adjusts an input impedance value, so that the antenna module 700 uses an RF signal transmitted and/or received from the antenna. ) can reduce the radiation performance degradation.

According to various embodiments, when the antenna module 700 and the antenna (eg, the antenna module 197 of FIG. 1 ) (eg, WiFi, GPS, NFC, or bluetooth) perform communication (eg, wireless communication) at the same time , by adjusting the input impedance value, it is possible to reduce radiation performance degradation of the antenna module 700 due to the RF signal transmitted and/or received from the antenna.

Referring to FIG. 12 , in operation 1201 , at least one processor 810 (eg, at least one processor 810 of FIGS. 6A and 6B ) of the electronic device 600 according to an embodiment performs a second frequency It may be determined whether an antenna for transmitting and/or receiving an RF signal of a band operates. In one example, the radiation performance of the antenna module 700 for transmitting and/or receiving the RF signal of the first frequency band may be deteriorated by the operation of the antenna for transmitting and/or receiving the RF signal of the second frequency band. , the at least one processor 810 may determine whether the antenna operates.

In operation 1202 , the at least one processor 810 of the electronic device 600 according to an embodiment performs the variable length element 740 (eg, FIG. 6A ) based on the determination that the antenna is operating or communicating in operation 1201 . , the variable-length element 740 of FIG. 6B may be controlled. In one example, the at least one processor 810 controls the variable length element 740 during the operation of the antenna, thereby providing an electrical path L between the wireless communication circuit 800 and the antenna module 700 (eg, FIG. The electrical length of the electrical path (L) of FIGS. 6A and 6B can be adjusted. For example, the at least one processor 810 may increase or decrease the electrical length of the electrical path L by controlling the variable-length element 740 . In another example, the at least one processor 810 may adjust the impedance value of the input terminal of the antenna module 700 by controlling the electrical length of the electrical path L during the operation of the antenna.

The electronic device 600 according to an embodiment transmits and/or transmits the RF signal of the second frequency band transmitted and/or received by the antenna and the antenna module 700 through the operation 1201 and/or operation 1202 described above. Interference between the received RF signals of the first frequency band may be reduced. Accordingly, the electronic device 600 may reduce radiation performance degradation of the antenna module 700 due to other antenna operations.

13 is a flowchart illustrating an operation of controlling a variable-length element of an electronic device according to another exemplary embodiment. Hereinafter, the control operation of FIG. 13 will be described with reference to the configuration shown in FIGS. 6A and/or 6B.

The electronic device 600 (eg, the electronic device 600 of FIGS. 6A and 6B ) according to an embodiment includes a wireless antenna array 710 (eg, the antenna array 710 of FIGS. 6A and 6B ) and a wireless device. At least one agent disposed in an electrical path L (eg, the electrical path L of FIGS. 6A and 6B ) between the communication circuit 800 (eg, the wireless communication circuit 800 of FIGS. 6A and 6B ). One switch 723 and/or at least one second switch 727 may be included. For example, the electronic device 600 includes a first path formed between the wireless communication circuit 800 and the first antenna element 711 (eg, the first antenna element 711 of FIGS. 6A and 6B ). L ₁ ) disposed on the 1-1 switch 723a (eg, the 1-1 switch 723a of FIGS. 6A and 6B ) and/or the wireless communication circuit 800 and the second antenna element 712 ) A 1-2 switch 723b disposed on a _{second path L 2} formed between (eg, the second antenna element 712 of FIGS. 6A and 6B ) may be included. In one example, the 1-1 switch 723a may be disposed adjacent to the 1-2 th switch 723b, and an isolation between the 1-1 switch 723a and the 1-2 th switch 723b ( isolation) is not secured, the radiation performance of the antenna module 700 may be deteriorated by the operation of the 1-1 switch 723a and/or the 1-2 th switch 723b.

The electronic device 600 according to an embodiment adjusts the impedance value of the input terminal of the antenna module 700 based on the operation of the at least one first switch 723 and/or the at least one second switch 727 . By doing so, it is possible to reduce radiation performance degradation of the antenna module 700 due to the operation of the at least one first switch 723 and/or the at least one second switch 727 .

Referring to FIG. 13 , in operation 1301 , at least one processor 810 (eg, at least one processor 810 of FIGS. 6A and 6B ) of the electronic device 600 according to an embodiment includes at least one Whether the first switch 723 and/or the at least one second switch 727 operates may be checked or monitored.

In operation 1302 , the at least one processor 810 of the electronic device 600 according to an embodiment activates the at least one first switch 723 and/or the at least one second switch 727 in operation 1301 . Based on the determination that it operates, the variable-length element 740 (eg, the variable-length element 740 of FIGS. 6A and 6B ) may be controlled. In one example, the at least one processor 810 controls the variable-length element 740 based on the at least one first switch 723 and/or the at least one second switch 727, whereby the electrical path ( The electrical length of L) can be adjusted. For example, the at least one processor 810 increases the electrical length of the electrical path L based on the operation of the 1-1 switch 723a and/or the 1-2 switch 723b, or By reducing the electrical length, the input impedance value can be adjusted. As another example, the at least one processor 810 operates when the 1-1 switch 723a or the 1-2 switch 723b operates alone, and the 1-1 switch 723a and the 1-2 switch When the 723b operates simultaneously, the input impedance value can be adjusted differently.

In the electronic device 600 according to an embodiment, through operations 1301 and/or 1302 described above, the antenna by the operation of the at least one first switch 723 and/or the at least one second switch 727 It is possible to reduce performance degradation of the module 700 .

An electronic device (eg, the electronic device 101 of FIG. 1 , the electronic device 101 of FIG. 2 , the electronic device 101 of 3A and 3B , the electronic device 400 of FIG. 4 , and the electronic device of FIGS. 5A and 5B ) 500 , the electronic device 600 of FIGS. 6A, 6B, or 9 ) includes a plurality of antenna elements (eg, the

antenna elements

711 , 712 , 713 , 714 of FIGS. 6A , 6B or 9 ). ) and a radio frequency integrated circuit (RFIC) for processing a signal of a first frequency band transmitted or received through the plurality of antenna elements (eg, the RFIC 720 of FIGS. 6A, 6B or 9). A module (eg, the antenna module 700 of FIGS. 6A, 6B, or 9) and a wireless communication circuit electrically connected to the antenna module (eg, the wireless communication circuit 800 of FIGS. 6A, 6B or 9) may include

The RFIC includes a first electrical path formed between a first one of the plurality of antenna elements (eg, the antenna element 711 of FIGS. 6A, 6B or 9 ) and the wireless communication circuit, and the first electrical a first phase shifter disposed on a path and configured to transform a phase of a signal transmitted from the wireless communication circuitry to the first antenna element (eg, first phase shifter 724 of FIGS. 6A, 6B or 9 ) and a variable-length element (eg, in FIG. 6a, 6b, or 9 may include a variable-length element 740).

The variable-length element of the electronic device may include a fifth phase converter.

The first phase shifter may include a first bit phase shifter, and the fifth phase shifter may include a second bit phase shifter greater than the first bit.

The variable-length element of the electronic device may include a variable capacitor.

The RFIC of the electronic device is disposed on a first electrical path and is a mixer (eg, the mixer 721 of FIGS. 6A, 6B or 9 ) that converts a frequency band of a signal transmitted through the first electrical path. )) and a combiner and divider disposed on the first electrical path and configured to combine or distribute a signal transmitted through the first electrical path (eg, combiner and divider 722 of FIGS. 6A, 6B or 9 ) )) may be further included.

The electronic device further includes a switch circuit electrically connected to the variable-length element (eg, the switch circuit 750 of FIGS. 6A, 6B, or 9), wherein the switch circuit selects the variable-length element to the ground It can be configured to connect to

The electronic device may further include at least one processor (eg, the processor 810 of FIGS. 6A, 6B, or 9 ) electrically connected to the wireless communication circuit and the variable-length element.

At least one processor, using the wireless communication circuit, detects a frequency band of an RF signal transmitted or received by the antenna module, and based on the sensed frequency band of the RF signal, through the variable length element and may be configured to change the electrical length of the first electrical path.

The at least one processor may be configured to change an electrical length of the first electrical path through the variable-length element based on occurrence of a designated event.

The specified event may include at least one of performing carrier aggregation, driving a camera, driving an audio module, charging the electronic device, executing a specified application, driving a sensor, or receiving a user input.

The electronic device transmits or receives an RF signal of a second frequency band different from the first frequency band (eg, the first antenna module 242 , the second antenna module 244 of FIG. 2 , or the third antenna module) 246), wherein the at least one processor controls the operation of the antenna (eg, the first antenna module 242, the second antenna module 244, or the third antenna module 246 of FIG. 2). based on the variable length element may be configured to change the electrical length of the first electrical path.

The RFIC includes a first switch (a first switch 723 of FIG. 6A, FIG. 6B or FIG. 9 ) disposed on the first electrical path, and a second antenna element (eg, FIG. 6A ) of the plurality of antenna elements. _{A second electrical path (eg, a second path (L 2} ) of FIG. 6A, 6B or 9 ) formed between the second antenna element 712 of FIG. 6A, FIG. 6B or FIG. 9 and the wireless communication circuit, and A second switch (eg, the second switch 727 of FIGS. 6A, 6B, or 9 ) disposed on the second electrical path may be further included.

The at least one processor may be configured to change the electrical length of the first electrical path through the variable-length element based on operations of the first switch and the second switch.

The antenna module may further include a power management integrated circuit (eg, the power management circuit 730 of FIGS. 6A, 6B or 9 ) configured to supply power to the RFIC.

The plurality of antenna elements may include at least one of a patch antenna element and a dipole antenna element.

antenna elements

711 , 712 , 713 , 714 of FIGS. 6A , 6B or 9 ). ) and an RFIC (eg, RFIC 720 of FIGS. 6A, 6B, or 9) for processing a signal of a first frequency band transmitted or received through the plurality of antenna elements (eg, FIG. 6A ) , the antenna module 700 of FIG. 6B or FIG. 9) and a wireless communication circuit electrically connected to the antenna module (eg, the wireless communication circuit 800 of FIGS. 6A, 6B, or 9).

In the RFIC, an electrical path formed between the wireless communication circuit and the antenna module is branched from a first point of the electrical path to a first antenna element (eg, the antenna element of FIGS. 6A, 6B or 9 ) 711)) and a second path branched from the first point of the electrical path and connected to a second antenna element (eg, the antenna element 712 of FIGS. 6A, 6B or 9); a third path branched at the first point of the electrical path and connected to a third antenna element (eg, the antenna element 713 of FIG. 6A, FIG. 6B or FIG. 9) and branching at the first point of the electrical path and may include a fourth path connected to a fourth antenna element (eg, the antenna element 714 of FIGS. 6A, 6B, or 9 ).

An electronic device is disposed at the first point in the electrical path and configured to combine or distribute signals transmitted through the electrical path (eg, combiner and divider 722 in FIGS. 6A, 6B or 9 ). ), a first phase converter disposed on the first path and configured to transform a phase of a signal transmitted from the wireless communication circuit to the first antenna element (eg, the first phase converter of FIG. 6A, FIG. 6B or FIG. 9 ) phase shifter 724), a second phase shifter (eg, FIGS. 6A, 6B, second phase shifter 731 of FIG. 9 ), a third phase shifter disposed on the third path and configured to transform a phase of a signal transmitted from the wireless communication circuitry to the third antenna element (eg, FIG. third phase shifter 732 of FIGS. 6A, 6B, and 9 ), a fourth phase disposed on the fourth path and configured to transform a phase of a signal transmitted from the wireless communication circuitry to the fourth antenna element a converter (eg, the fourth phase shifter 733 of FIGS. 6A, 6B, and 9 ) and branched at a second point of the electrical path and connected between the second point of the electrical path and the ground, and It may include a variable-length element (eg, the variable-length element 740 of FIGS. 6A, 6B, or 9) for changing the electrical length.

The variable length element may include at least one of a phase converter and a variable capacitor.

The electronic device further includes a wireless communication circuit and at least one processor electrically connected to the variable-length element, wherein the at least one processor is configured to control the variable-length element to change an electrical length of the electrical path can be

The second point may be located between the wireless communication circuit and the combiner and splitter.

The second point may be located on at least one of the first path, the second path, the third path, and the fourth path.

In the specific embodiments of the present disclosure described above, elements included in the disclosure are expressed in the singular or plural according to the specific embodiments presented. However, the singular or plural expression is appropriately selected for the context presented for convenience of description, and the present disclosure is not limited to the singular or plural element, and even if the element is expressed in plural, it is composed of the singular or singular. Even an expressed component may be composed of a plurality of components.

Meanwhile, although specific embodiments have been described in the detailed description of the present disclosure, various modifications are possible without departing from the scope of the present disclosure. Therefore, the scope of the present disclosure should not be limited to the described embodiments and should be defined by the claims described below as well as the claims and equivalents.

Claims

In an electronic device,

An antenna module comprising: an antenna module including a plurality of antenna elements and a radio frequency integrated circuit (RFIC) for processing a signal of a first frequency band transmitted or received through the plurality of antenna elements; and

Including; a wireless communication circuit electrically connected to the antenna module;

The RFIC is

a first electrical path formed between a first one of the plurality of antenna elements and the wireless communication circuit;

a first phase converter disposed on the first electrical path and configured to transform a phase of a signal transmitted from the wireless communication circuitry to the first antenna element; and

A variable-length element branched from a first point of the first electrical path and connected between a first point of the first electrical path and a ground, and configured to change an electrical length of the first electrical path; including, electronic device.
The method according to claim 1,

The variable-length element includes a fifth phase shifter, the electronic device.
3. The method according to claim 2,

The first phase shifter comprises a first bit phase shifter,

The fifth phase shifter includes a second bit phase shifter that is greater than the first bit.
The method according to claim 1,

The variable length element includes a variable capacitor (variable capacitor), the electronic device.
The method according to claim 1,

The RFIC is

a mixer disposed on the first electrical path and converting a frequency band of a signal transmitted through the first electrical path; and

and a combiner and divider disposed on the first electrical path and configured to combine or distribute a signal transmitted through the first electrical path.
The method according to claim 1,

Further comprising; a switch circuit electrically connected to the variable-length element;

The switch circuit selectively connects the variable-length element to the ground.
The method according to claim 1,

The electronic device further comprising a; at least one processor electrically connected to the wireless communication circuit and the variable-length element.
8. The method of claim 7,

the at least one processor,

Using the wireless communication circuit to detect the frequency band of the RF signal transmitted or received by the antenna module,

and change the electrical length of the first electrical path through the variable-length element based on the sensed frequency band of the RF signal.
8. The method of claim 7,

the at least one processor,

and change the electrical length of the first electrical path through the variable length element based on a specified event occurrence.
10. The method of claim 9,

The specified event includes at least one of performing carrier aggregation, driving a camera, driving an audio module, charging the electronic device, executing a specified application, driving a sensor, or receiving a user input.
8. The method of claim 7,

Further comprising; an antenna for transmitting or receiving an RF signal of a second frequency band different from the first frequency band;

the at least one processor,

and change the electrical length of the first electrical path through the variable length element based on the operation of the antenna.
8. The method of claim 7,

The RFIC is

a first switch disposed on the first electrical path;

a second electrical path formed between a second one of the plurality of antenna elements and the wireless communication circuit; and

The electronic device further comprising; a second switch disposed on the second electrical path.
13. The method of claim 12,

the at least one processor,

and change the electrical length of the first electrical path through the variable-length element based on operations of the first switch and the second switch.
The method according to claim 1,

The antenna module further comprises a power management integrated circuit configured to supply power to the RFIC.
The method according to claim 1,

The plurality of antenna elements include at least one of a patch antenna element and a dipole antenna element.