WO2022011877A1

WO2022011877A1 - Transfer device and transfer method

Info

Publication number: WO2022011877A1
Application number: PCT/CN2020/123250
Authority: WO
Inventors: 卢马才
Original assignee: 深圳市华星光电半导体显示技术有限公司
Priority date: 2020-07-17
Filing date: 2020-10-23
Publication date: 2022-01-20
Also published as: CN111863694B; CN111863694A

Abstract

A transfer device and a transfer method. The transfer device comprises a substrate (100) and at least one transfer head (200) provided on the substrate (100). The transfer head (200) comprises an adsorption device (220) and a magnetic field generation device (210); the magnetic field generation device (210) is used for generating a magnetic field to attract magnetic particles (501) to form a contact layer (500) in the adsorption area (222); the adsorption device (220) attracts Micro LEDs (400) to the surface of the contact layer (500).

Description

Transfer device and transfer method

This application claims the priority of the Chinese patent application with the application number 202010691445.4 and the invention title "Transfer Device and Transfer Method" filed with the China Patent Office on July 17, 2020, the entire contents of which are incorporated into this application by reference.

technical field

The present application relates to the field of display technology, and in particular, to a transfer device and a transfer method.

Background technique

In the micro-LED display manufacturing process, it is a very critical step to transfer the Micro LED from the intermediate carrier plate to the TFT substrate for bonding between the Micro LED and the TFT substrate. In addition, for Micro LEDs that are abnormally lit after bonding on the TFT substrate, the abnormal Micro LEDs need to be removed at a fixed point.

Therefore, efficient Micro LED transfer tools are required to perform transfer reliably, accurately, quickly and inexpensively. However, the existing Micro Due to their respective defects, the LED transfer head cannot transfer Micro LEDs in a reliable, fixed-point, fast and cheap manner.

For example, in the traditional electrostatic transfer head, the distance between the electrostatic transfer head and the suctioned target seriously affects the size of its suction force. 1 is a schematic structural diagram of a conventional electrostatic transfer head. As shown in FIG. 1 , when the electrostatic transfer head 200 in FIG. 1 is used to absorb the Micro LED 200 , the electrostatic force between the electrostatic transfer head 200 and the Micro LED 200 and the gap between the two The square of the distance is inversely proportional.

Therefore, there is an urgent need to provide a transfer device and transfer method with high reliability and precision and low cost to solve the above problems.

technical problem

In order to solve the above technical problems, the present application provides a transfer device and a transfer method, wherein the transfer head of the transfer device makes the Micro All LEDs can be fully contacted by magnetic particles, which can overcome the problem that the distance between the suction head and the suctioned target in the traditional electrostatic transfer head seriously affects the size of the suction force.

technical solutions

In order to achieve the above purpose, the transfer device and transfer method described in the present application adopt the following technical solutions.

The application provides a transfer device, comprising a substrate and at least one transfer head disposed on the substrate, the transfer head including: an adsorption device and a magnetic field generating device, wherein: the adsorption device is disposed on the substrate On a surface of the substrate and on the surface away from the substrate, an adsorption area is included, and the adsorption device is at least used for: The LED is adsorbed on the adsorption area, or, the Micro LED is released; the magnetic field generating device is disposed between the adsorption device and the substrate and is configured to generate a magnetic field to at least: change a preset distance range The magnetic particles inside are adsorbed on the adsorption area to form a contact layer with a preset structure, so that the contact layer and the Micro LED contacts, or, releases said magnetic particles from said contact layer;

In addition, the magnetic field generating device includes at least one electromagnetic circuit layer, the electromagnetic circuit layer includes a first dielectric layer and at least one electromagnetic coil coated on the first dielectric layer, and the electromagnetic coil is configured to receiving an independent electromagnetic signal and generating a magnetic field according to the electromagnetic signal; the adsorption device includes at least one electrostatic circuit layer, and the electrostatic circuit layer includes: at least one electrostatic electrode, which is arranged on the side of the magnetic field generating device away from the substrate. one side; and, a second dielectric layer disposed on a side of the electrostatic electrodes facing away from the substrate and covering the electrostatic electrodes, wherein each of the electrostatic electrodes is configured to receive an independent electrostatic signal and The electrical signal is generated to act on the Micro The electrostatic force of the LED.

Further, the electromagnetic circuit layers in two adjacent transferred magnetic field generating devices are respectively the same layer and are respectively continuous through the first dielectric layer, so as to constitute a magnetic field generating device layer.

Further, the transfer device includes a plurality of the transfer heads arranged in an array on the substrate; the transfer device further includes a plurality of blocking dams, and the blocking dams are arranged between the adjacent transfer heads and At least for defining the adsorption zone of the transfer head.

In a preferred embodiment, the electromagnetic circuit layers in the magnetic field generating devices of two adjacent transfer heads are respectively the same layer and are respectively continuous through the first dielectric layer, so as to form a magnetic field generating device layer; the The blocking dam is arranged on the surface of the magnetic field generating device layer facing away from the substrate and is located between the adjacent adsorption devices, and the blocking dam is at least used to separate the adsorption areas of the adjacent adsorption units.

Further, the electrostatic circuit layer includes two electrostatic electrodes on the same layer and arranged at intervals, and the electrostatic electrodes are respectively configured with electrostatic signals of different polarities.

Further, the magnetic particles are nano-magnetic particles, and the nano-magnetic particles include a magnetic inner core and an insulating shell, wherein: the material of the magnetic inner core is at least one _{of Fe 2} O ₃ , Fe ₃ O _{4 , Co or Ni} ; The material of the insulating shell is at least one _{of SiN x} , SiO _x or SiON _{x .}

Further, the size range of the magnetic particles is 5nm-10um.

Further, the thickness of the contact layer ranges from 100nm to 50um.

The application provides a transfer device, comprising a substrate and at least one transfer head disposed on the substrate, the transfer head including: an adsorption device and a magnetic field generating device, wherein: the adsorption device is disposed on the substrate On a surface of the substrate and on the surface away from the substrate, an adsorption area is included, and the adsorption device is at least used for: The LED is adsorbed on the adsorption area, or, the Micro LED is released; the magnetic field generating device is disposed between the adsorption device and the substrate and is configured to generate a magnetic field to at least: change a preset distance range The magnetic particles inside are adsorbed on the adsorption area to form a contact layer with a preset structure, so that the contact layer and the Micro The LED contacts, or alternatively, releases the magnetic particles from the contact layer.

Further, the magnetic field generating device includes at least one electromagnetic circuit layer, and the electromagnetic circuit layer includes a first dielectric layer and at least one electromagnetic coil coated on the first dielectric layer; the electromagnetic coil is configured as receiving an independent electromagnetic signal and generating a magnetic field according to the electromagnetic signal; a first dielectric layer, the first dielectric layer is arranged to cover or half-cover the electromagnetic coil.

Further, the first dielectric layer is at least one _{of SiN x} , SiO _x or SiON _{x .}

In a preferred embodiment, each of the electromagnetic circuit layers in two adjacent transferred magnetic field generating devices are in the same layer and are respectively continuous through the first dielectric layer, so as to form a magnetic field generating device layer; the barrier The dam is arranged on the surface of the magnetic field generating device layer facing away from the substrate and is located between the adjacent adsorption devices, and the blocking dam is at least used to separate the adsorption areas of the adjacent adsorption units.

Further, the adsorption device includes at least one electrostatic circuit layer, and the electrostatic circuit layer includes: at least one electrostatic electrode disposed on a side of the magnetic field generating device away from the substrate; and a second dielectric layer disposed on on the side of the electrostatic electrode away from the substrate and covering the electrostatic electrode; wherein each electrostatic electrode is configured to receive an independent electrostatic signal and generate an action on the Micro according to the electric signal The electrostatic force of the LED.

Further, the material of the second dielectric layer is at least one _{of SiN x} , SiO _x or SiON _{x .}

Further, the size range of the magnetic particles is 5nm-10um.

Further, the thickness of the contact layer ranges from 100nm to 50um.

The present application provides a transfer method, comprising the following steps:

S0, provide a transfer device, the transfer device: a substrate and at least one transfer head arranged on the substrate, the transfer head includes: an adsorption device and a magnetic field generating device, and: the adsorption device is arranged in A surface of the substrate and a surface away from the substrate include an adsorption area, and the adsorption device is at least used for: attaching the Micro The LED is adsorbed on the adsorption area, or, the Micro LED is released; the magnetic field generating device is disposed between the adsorption device and the substrate and is configured to generate a magnetic field to at least: change a preset distance range The magnetic particles inside are adsorbed on the adsorption area to form a contact layer with a preset structure, so that the contact layer and the Micro Contact the LED, or release the magnetic particles from the contact layer; S1, turn on the magnetic field generating device, and make the transfer head close to the first carrier substrate loaded with the magnetic particles, so that the transfer head absorbs the magnetic particles, so as to A contact layer with a preset structure is formed on the suction area; S2, the transfer head is brought close to the second carrier substrate loaded with the Micro LED, and the suction device is turned on to transfer the Micro LED The LED is adsorbed on the contact layer; S3, the Micro is adsorbed The transfer head of the LED is aligned with a pre-installed position on a third substrate, and the adsorption device is adjusted, and the Micro LED is released at the pre-installed position; and, S4, the magnetic field generating device is adjusted so that all The magnetic particles are reset and enter the next transfer operation.

beneficial effect

The transfer device and transfer method described in this application can adsorb magnetic particles on the adsorption area of the transfer head to form a contact layer by adding a magnetic field generating device, so that the Micro All LEDs can be fully contacted by magnetic particles, which can overcome the problem that the distance between the transfer head and the target to be sucked in the traditional electrostatic transfer head seriously affects the size of the adsorption force; With the coordination, the adsorption electric field and magnetic particles can cooperate with the Micro The LED is adsorbed, so that the Micro LED can be efficiently and fixed-pointed from the carrier substrate; by controlling the electromagnetic signal provided to the magnetic field generating device, the number and shape of the magnetic particles can be adjusted to reset, and then the thickness and shape of the contact layer can be adjusted. Guaranteed Micro The LED is in full contact with the magnetic particles.

Description of drawings

FIG. 1 is a schematic structural diagram of a conventional electrostatic transfer head.

FIG. 2 is a schematic diagram of a first embodiment of the transfer device described in this application.

FIG. 3 is a schematic diagram of a second embodiment of the transfer device described in the present application.

4A-4D are schematic diagrams of a working process of an embodiment of the transfer device described in the present application.

Embodiments of the present invention

The present application provides a transfer device and transfer method. In order to make the purpose, technical solution and effect of the present application more clear and definite, the present application will be further described in detail below with reference to the accompanying drawings and examples. It should be understood that the specific embodiments described herein are only used to explain the present application, but not to limit the present application.

FIG. 2 is a schematic diagram of a first embodiment of the transfer device according to the application, and FIG. 3 is a schematic diagram of a second embodiment of the transfer device according to the application. As shown in FIG. 2 and FIG. 3 , the present application provides a transfer device, the transfer device includes: a substrate 100 , at least one transfer head 200 disposed on the substrate 100 , and a transfer head 200 located between adjacent transfer heads 200 . The barrier dam 300 between.

As shown in FIG. 2 , the transfer head 200 includes: a magnetic field generating device 210 and an adsorption device 220 . The adsorption device 220 is disposed on a surface of the substrate 100 and includes an adsorption area 222 on the surface away from the substrate 100 . being adsorbed on the adsorption area 222, or releasing the Micro LED 400; the magnetic field generating device 210 is disposed between the adsorption device 220 and the substrate 100 and is configured to generate a magnetic field to at least: Magnetic particles 501 within a distance range are adsorbed on the adsorption area 222 to form a contact layer 500 with a predetermined structure, so that the contact layer 500 is in contact with the Micro LED 400 adsorbed on the adsorption area 222, or , the magnetic particles 501 are released from the contact layer 500 .

Specifically, the magnetic field generating device 210 can also enable the magnetic particles 501 to adsorb the Micro LED 400 through the magnetic field.

Obviously, in the transfer head 200 of the present application, by adding a magnetic field generating device 210, the magnetic particles 501 can be adsorbed on the adsorption area 222 to form the contact layer 500, so that the contact layer 500 and the Micro LEDs 400 in different terrains can be It can be fully contacted, and then it can overcome the problem that the distance between the transfer head and the target to be sucked in the traditional electrostatic transfer head seriously affects the size of the electrostatic adsorption force. The purpose of efficient spot suction of LED400 from its carrier substrate.

As shown in FIG. 2 , the substrate 100 is used to carry the adsorption device 220 or/and the magnetic field generating device 210 . For example, in this embodiment, the magnetic field generating device 210 and the adsorption device 220 are sequentially stacked on a surface of the substrate 100 .

In specific implementations, the substrate 100 may be formed of various materials such as silicon, ceramics, and polymers.

As shown in FIG. 2 , the magnetic field generating device 210 is disposed on the substrate 100 , and the magnetic field generating device 210 is configured to generate an adsorption force on the magnetic particles 501 within a preset distance range, so as to control the magnetic particles 501 covers the adsorption area 222 .

As shown in FIG. 2 , the magnetic field generating device 210 includes at least one electromagnetic circuit layer 211 , and the electromagnetic circuit layer 211 includes a first dielectric layer 2111 and at least one electromagnetic circuit disposed in the first dielectric layer 2111 . Coils 2112, each of the electromagnetic coils 2112 is configured to receive an independent electromagnetic signal and generate a magnetic field acting on the magnetic particle 501 according to the electromagnetic signal.

By configuring each electromagnetic coil 2112 with an independent electromagnetic signal, each electromagnetic coil 2112 and the magnetic field generating device 210 can be individually controlled, which can be used to perform the transfer of a single Micro LED 400 or multiple Micro LEDs 400 transfer.

In a preferred embodiment, each of the electromagnetic circuit layers 211 in the adjacent magnetic field generating devices 210 are on the same layer and continuous through the first dielectric layer 2111 to form a magnetic field generating device layer. For example, those skilled in the art can understand that each of the first dielectric layers 2111 of the plurality of transfer heads 200 is fabricated in a whole layer, and the electromagnetic coils 2112 are distributed on the first dielectric layers 2111 and the transfer head of each layer. The above-mentioned magnetic field generating device layer can be formed in the corresponding region of the head 200 .

For example, as shown in FIG. 2 , in this embodiment, the magnetic field generating devices 210 of the plurality of transfer heads 200 all include three layers of electromagnetic circuit layers 211 sequentially stacked on the substrate 100 , and the corresponding The electromagnetic circuit layers 211 of the layers are respectively the same layer and continuous with each other.

It should be pointed out that FIG. 2 is only a schematic structure of the magnetic field generating device 210 described in the present application. The present application does not make any changes to the number of stacked layers or the stacked structure of the electromagnetic circuit 211 in the magnetic field generating device 210 , the thickness, material or structure of the first dielectric layer 2111 , or the material, structure or layout of the electromagnetic coil 2112 . As long as the specific configuration of the electromagnetic circuit 211 , the first dielectric layer 2111 or the electromagnetic coil 2112 in the magnetic field generating device 210 is appropriate, it can be used for the adsorption or release of the magnetic particles 501 and the formation of the contact layer 500 . For example, in the transfer device, the number of layers 211 of the electromagnetic circuit, the thickness of the first dielectric layer 2111 or the arrangement of the electromagnetic coils 2112 in the different transfer heads 200 may be different.

Specifically, the first dielectric layer 2111 is at least one _{of SiN x} , SiO _x or SiON _{x .} For example, in this embodiment, SiON _{x is} selected as the first dielectric layer 2111 .

Specifically, the electromagnetic coil 2112 is a metal coil such as copper or aluminum. In a specific implementation, the electromagnetic coil 2112 adopts a coil with a spiral structure.

It should be noted that, FIG. 2 only schematically shows the layout structure, material or shape of the electromagnetic coil 2112 . During specific implementation, the layout structure, material or shape of the electromagnetic coil 2112 can also be flexibly set according to actual conditions.

Specifically, the electromagnetic signal is a current signal. By applying a current signal to the electromagnetic coil 2112 , the electromagnetic coil 2112 generates a magnetic field acting on the magnetic particles 501 .

In specific implementation, controlling the current signal provided to the electromagnetic coil 2112 can adjust the strength or direction of the magnetic field generated by the electromagnetic coil 2112 , and then adjust the attached quantity, stacking shape or reset of the magnetic particles 501 . That is, by controlling the current signal passed through the electromagnetic coil 2112, the structure of the contact layer 500 formed by the attachment of the magnetic particles 501 can be controlled.

As shown in FIG. 2 , the magnetic particles 501 within the predetermined distance range can be adsorbed on the adsorption area 222 under the action of the magnetic field generated by the magnetic field generating device 210 to form a magnetic field with a predetermined structure. Contact layer 500 . Specifically, when the magnetic particles 501 are disposed toward the adsorption area 222 of the transfer head 200 and are within the action range of the magnetic field generated by the magnetic field generating device 210 , the magnetic particles 501 can be in the range of the magnetic field. The contact layer 500 covering the adsorption area 222 is formed by being held on the adsorption area 222 under the action of adsorption.

By using the contact layer 500 formed by stacking the magnetic particles 501, the shape and thickness of the contact layer 500 can be adjusted by a magnetic field, so as to ensure that the Micro LED 400 and the adsorption head 100 are fully contacted, and also ensure that the adsorption device 220 is in contact with each other. The Micro LED400 has a strong adsorption effect.

As shown in FIG. 2 , the contact layer 500 covers the side of the adsorption area 222 that is away from the substrate 100 , so as to be used for contacting with the Micro Devices adsorbed on the adsorption area 222 . LED400 contacts. In addition, the contact layer 500 is composed of the magnetic particles 501 that are adsorbed and held on the adsorption region 222 under the action of the magnetic field generating device 210 .

As mentioned above, in a specific implementation, the number or shape of stacking of the magnetic particles 501 in the adsorption area 222 can be controlled by controlling the electromagnetic signal connected to the magnetic field generating device 210 , thereby controlling the contact The topography or thickness of layer 500 varies.

Specifically, the thickness of the contact layer 500 ranges from 100nm to 50um. The thickness of the contact layer 500 is controlled within the above-mentioned range to ensure the close adhesion effect and strong adsorption force of the transfer head 200 on the Micro LED 400 .

Specifically, the magnetic particles 501 are nano-magnetic particles, and the nano-magnetic particles include a magnetic core and an insulating shell. Wherein, the material of the magnetic core _{is at least one of Fe 2} O ₃ , Fe ₃ O ₄ , Co, or Ni. The material of the insulating shell is SiO _x . In other embodiments, the material forming the magnetic core may also be nickel oxide or cobalt oxide. The insulating shell is made of silicon nitride or a composite of silicon oxide and silicon nitride.

Specifically, the size of the magnetic particles 501 ranges from 5nm to 10um. By controlling the size of the magnetic particles 501 within a certain range, the topographic structure or thickness variation of the contact layer 500 can be controlled more precisely, thereby realizing the transfer head 200 and each uneven Micro Full contact of LED400.

As shown in FIG. 2 , the adsorption device 220 is disposed on the surface of the magnetic field generating device 210 away from the substrate 100 , and the adsorption device 220 has an adsorption area 222 on the surface away from the substrate 100 , The adsorption device 220 is configured to adsorb the Micro LEDs 400 within a preset distance range to the adsorption area 222 or release the Micro LEDs 400 . It should be noted that the present application does not specifically limit the preset distance range here, as long as the transfer head 200 can adsorb the Micro LED 400 to the adsorption area 222 thereof.

As shown in FIG. 2 , the adsorption device 220 includes: at least one electrostatic circuit layer 221 , and the electrostatic circuit layer 221 includes one or more electrostatic electrodes 2212 and a second dielectric layer 2211 . Wherein the second dielectric layer 2211 is disposed on the side of the electrostatic electrode 2212 away from the substrate 100 and covers the electrostatic electrode 2212, wherein the electrostatic electrode 2212 is configured to receive an independent electrostatic signal and according to the electrostatic Signal generation acts on the Micro The electrostatic force of LED400.

By configuring each of the electrostatic electrodes 2212 with an independent electrostatic signal, each electrostatic electrode 2212 and each of the adsorption devices 220 can be individually controlled, which can be used to perform the transfer of a single Micro LED 400 or multiple Micro LEDs 400 transfer.

Specifically, the electrostatic circuit layer 221 includes two electrostatic electrodes 2212 on the same layer and spaced apart, and the two electrostatic electrodes 2212 are respectively configured with electrostatic signals of different polarities. For example, as shown in FIG. 2 , in this embodiment, the electrostatic circuit layers 221 of different transfer heads 200 are respectively configured to include one or two electrostatic electrodes 2212 .

Specifically, the material of the electrostatic electrode 2212 is copper or aluminum. In other embodiments, the material of the electrostatic electrode 2212 may also be nickel or silver.

Specifically, the electrostatic electrode 2212 may have a single-layer structure or a stacked-layer structure, which is not limited in this embodiment of the present application. It should be noted that, FIG. 2 is described by taking an example that the electrostatic electrode has a single-layer structure.

Specifically, the second dielectric layer 2111 is at least one of SiNx, SiOx or SiONx. For example, in this embodiment, SiONx is selected as the second dielectric layer 2111 .

So far, in the process of transferring the Micro LED 400 using a transfer head 200 : before the Micro LED 400 is adsorbed to the adsorption area 222 , the transfer head 200 can adsorb and control the magnetic particles 501 in the magnetic field by controlling the electromagnetic signal of the magnetic field generating device 210 in the transfer head 200 . The adsorption area 222 forms a contact layer 500 with a predetermined structure, so as to ensure that the Micro LED 400 to be adsorbed subsequently can fully contact the contact layer 500 . Based on the above process, the transfer head 200 can have a strong adsorption effect on the Micro LED 400 through the adsorption effect of the adsorption device 220 or/and the magnetic particles 501 in the contact layer 500 , so that the Micro LED 400 can be strongly adsorbed. The LED400 is efficiently fixed-point suction from the carrier substrate.

As shown in FIG. 2 , a plurality of blocking dams 300 are further provided on the substrate 100 , and the blocking dams 300 are located between the adjacent transfer heads 200 and are used to at least define the distance between the transfer heads 200 . Adsorption zone 222 .

For example, as shown in FIG. 2 , in this embodiment, the electromagnetic circuit layers 211 in the magnetic field generating devices 210 of two adjacent transfer heads 200 are respectively the same layer and continuous through the first dielectric layer 2111 respectively. , so as to form a magnetic field generating device layer, the blocking dam 300 is disposed on the side of the magnetic field generating device layer away from the substrate 100 and between the adjacent adsorption devices 220, so as to separate the adjacent adsorption devices 220. The adsorption regions 222 of the adsorption device 220 are separated.

It should be noted that, in order to be able to pick up multiple light-emitting diodes at the same time, the above-mentioned transfer device includes multiple transfer heads 200 . One or two of the transfer heads 200 are shown as an example for illustration. During specific implementation, the number and distribution of the transfer heads 200 may be set according to actual needs, which is not limited here.

FIG. 3 is a schematic diagram of a second embodiment of the transfer device described in the present application. Compared with the transfer device shown in FIG. 2 , the main difference of the transfer device shown in FIG. 3 is that, in the adsorption device 220 of the transfer head 200 , each of the electrostatic circuit layers 221 only includes an electrostatic electrode 2212 .

4A-4D are schematic diagrams of the working process of the transfer device described in this application. As shown in Figures 4A-4D, the present application also provides a transfer method based on the transfer device described in the present application, the transfer method comprising the following steps:

S0. Provide a copy of the transfer device described in the application;

S1, turning on the magnetic field generating device, and making the transfer head close to the first carrier substrate loaded with magnetic particles, so that the transfer head adsorbs the magnetic particles to form a contact layer with a preset structure on the adsorption area;

S2. Make the transfer head close to the second carrier substrate loaded with Micro LEDs, and turn on the suction device to transfer the Micro LEDs to the second carrier substrate. The LED is adsorbed on the contact layer;

S3. Align the transfer head on which the Micro LED is adsorbed with a preset position on a third substrate, and adjust the adsorption device. The LEDs are released in the preset safety positions; and,

S4. Adjust the magnetic field generating device to reset the magnetic particles and enter into the next transfer operation.

In step SO, the transfer device described in this application is first provided. For example, as shown in FIGS. 4A to 4D , in this embodiment, the transfer device shown in FIG. 3 is used. In other embodiments, the transfer device shown in FIG. 2 may be employed.

It should be noted that FIG. 2 and FIG. 3 are only schematic structural diagrams of the transfer device described in the present application. When implementing the transfer method described in this application, it is not limited to the transfer device shown in FIG. 2 and FIG. 3 .

As shown in FIG. 4A , in step S1 , the magnetic field generating device 210 of the transfer head 200 in the transfer device is controlled to be turned on, and the magnetic particles 501 are loaded on the adsorption area 220 of the transfer head 200 facing the carrier substrate 110 . The magnetic particle 501 is adsorbed to the adsorption area 220 to form a contact layer 500 with a predetermined thickness or a predetermined structure.

It should be understood that this is not limited to turning on all the electromagnetic circuit layers 211 in all the transfer heads 200 in the transfer device to simultaneously access electromagnetic signals. During specific implementation, the micro LED 400 to be transferred can be selectively turned on according to the specific terrain and terrain in the horizontal and/or vertical directions, so as to control the thickness or terrain of the contact layer 500 . In other words, according to the actual position or terrain of the Micro LED 400 to be transferred, some or all of all electromagnetic circuit layers 211 in the transfer head 200 corresponding to the Micro LED 400 to be transferred are selectively turned on or controlled.

As shown in FIG. 4B , in step S2, the transfer device obtained in step S1 with the contact layer 500 formed thereon is brought close to the side of the second carrier substrate 120 carrying the Micro LED 400 within a preset distance, and controlled to turn on The corresponding adsorption device 210 . During this process, the transfer head 200 utilizes the adsorption effect of the adsorption device 210 on the Micro LED 400 to adsorb the Micro LED 400 to the contact layer 500 , so that the Micro LED 400 is in contact with the contact layer 500 and maintained on the contact layer 500 .

Similarly, it is not limited to connect all the adsorption devices in all the transfer heads 200 or all the electrostatic circuit layers 221 in the transfer apparatus with electromagnetic signals. During specific implementation, it can be selectively turned on according to the horizontal arrangement of the Micro LEDs 400 to be transferred and the specific terrain and terrain in the vertical height direction, so as to control the adsorption area of the transfer device or the size of the adsorption effect of the corresponding transfer head 200 .

As shown in FIG. 4C and FIG. 4D , the transfer device with the Micro LED 400 adsorbed in the above step S2 is controlled to be close to the third carrier substrate 130 having a preset installation position, and the Micro LED held on the transfer device is controlled. The LED 400 is aligned with the preset installation position; then, the adsorption device 220 is controlled to release the Micro LED held on the transfer device to the preset installation position.

For the specific implementation of the above operations, reference may be made to the foregoing embodiments, and details are not described herein again.

It can be understood that for those of ordinary skill in the art, equivalent replacements or changes can be made according to the technical solutions and inventive concepts of the present application, and all these changes or replacements should belong to the protection scope of the appended claims of the present application.

Claims

A transfer device includes a substrate and at least one transfer head disposed on the substrate, wherein the transfer head includes: an adsorption device and a magnetic field generating device,

The adsorption device is arranged on a surface of the substrate and includes an adsorption area on the surface away from the substrate, and the adsorption device is at least used for: adsorbing Micro LEDs within a preset distance range to the adsorption area , or, release the Micro LED;

The magnetic field generating device is arranged between the adsorption device and the substrate, and is configured to generate a magnetic field to at least be used for: adsorbing magnetic particles within a preset distance range on the adsorption area to form a magnetic field with a predetermined distance. Setting a structured contact layer, so that the contact layer is in contact with the Micro LED adsorbed on the adsorption area, or the magnetic particles are released from the contact layer;

In addition, the magnetic field generating device includes at least one electromagnetic circuit layer, the electromagnetic circuit layer includes a first dielectric layer and at least one electromagnetic coil coated on the first dielectric layer; the electromagnetic coil is configured as receiving an independent electromagnetic signal and generating a magnetic field according to the electromagnetic signal;

The adsorption device includes at least one electrostatic circuit layer, and the electrostatic circuit layer includes: at least one electrostatic electrode disposed on the side of the magnetic field generating device away from the substrate; and a second dielectric layer disposed on the The electrostatic electrode has a side away from the substrate and covers the electrostatic electrode; each electrostatic electrode is configured to receive an independent electrostatic signal and generate an electrostatic force acting on the Micro LED according to the electrical signal.
The transfer device according to claim 1, wherein the electromagnetic circuit layers in two adjacent transferred magnetic field generating devices are respectively the same layer and are respectively continuous through the first dielectric layer, so as to constitute a magnetic field generating device Floor.
The transfer apparatus of claim 1, wherein the transfer apparatus comprises a plurality of the transfer heads arranged in an array on the substrate;

The transfer device further includes a plurality of blocking dams, the blocking dams are arranged between the adjacent transfer heads and are used to at least define the adsorption area of the transfer heads.
The transfer device according to claim 1, wherein the electrostatic circuit layer comprises two electrostatic electrodes on the same layer and arranged at intervals, and the electrostatic electrodes are respectively configured with electrostatic signals of different polarities.
The transfer device of claim 1, wherein the magnetic particles are nano-magnetic particles, the nano-magnetic particles include a magnetic inner core and an insulating outer shell, and:

The material of the magnetic core is at least one of Fe2O3, Fe3O4, Co or Ni;

The material of the insulating shell is at least one of SiNx, SiOx or SiONx.
The transfer device of claim 1, wherein the size of the magnetic particles ranges from 5 nm to 10 um.
The transfer device of claim 1, wherein the thickness of the contact layer ranges from 100 nm to 50 um.
A transfer device, comprising a substrate and at least one transfer head disposed on the substrate, wherein the transfer head comprises: an adsorption device and a magnetic field generating device, and:

The adsorption device is arranged on a surface of the substrate and includes an adsorption area on the surface away from the substrate, and the adsorption device is at least used for: adsorbing Micro LEDs within a preset distance range to the adsorption area , or, release the Micro LED;

The magnetic field generating device is disposed between the adsorption device and the substrate, and is configured to generate a magnetic field for at least: attracting magnetic particles within a predetermined distance range to the adsorption area to form a magnetic field with a predetermined distance. A structured contact layer is provided, so that the contact layer is in contact with the Micro LED adsorbed on the adsorption area, or the magnetic particles are released from the contact layer.
The transfer device of claim 8, wherein the magnetic field generating device comprises at least one electromagnetic circuit layer, and the electromagnetic circuit layer comprises a first dielectric layer and at least one layer covering the first dielectric layer. Electromagnetic coil;

The electromagnetic coil is configured to receive independent electromagnetic signals and generate a magnetic field based on the electromagnetic signals.
The transfer device according to claim 9, wherein the electromagnetic circuit layers in two adjacent transferred magnetic field generating devices are respectively the same layer and are respectively continuous through the first dielectric layer, so as to constitute a magnetic field generating device Floor.
The transfer device of claim 9, wherein the first dielectric layer is at least one of SiNx, SiOx, or SiONx.
The transfer apparatus of claim 8, wherein the transfer apparatus comprises a plurality of the transfer heads arranged in an array on the substrate;

The transfer device further includes a plurality of blocking dams, the blocking dams are arranged between the adjacent transfer heads and are used to at least define the adsorption area of the transfer heads.
The transfer device according to claim 8, wherein the adsorption device comprises at least one electrostatic circuit layer, and the electrostatic circuit layer comprises:

at least one electrostatic electrode disposed on the side of the magnetic field generating device away from the substrate; and,

a second dielectric layer, disposed on the side of the electrostatic electrode away from the substrate and covering the electrostatic electrode;

And, each of the electrostatic electrodes is configured to receive an independent electrostatic signal and generate an electrostatic force acting on the Micro LED according to the electrical signal.
The transfer device according to claim 13 , wherein the electrostatic circuit layer comprises two electrostatic electrodes on the same layer and arranged at intervals, and the electrostatic electrodes are respectively configured with electrostatic signals of different polarities.
The transfer device of claim 13, wherein the material of the second dielectric layer is at least one of SiNx, SiOx or SiONx.
The transfer device according to claim 8, wherein the magnetic particles are nano-magnetic particles, and the nano-magnetic particles comprise a magnetic inner core and an insulating outer shell, wherein:

The material of the magnetic core is at least one of Fe2O3, Fe3O4, Co or Ni;

The material of the insulating shell is at least one of SiNx, SiOx or SiONx.
The transfer device of claim 8, wherein the size of the magnetic particles ranges from 5 nm to 10 um.
The transfer device of claim 8, wherein the thickness of the contact layer ranges from 100 nm to 50 um.
A transfer method comprising the following steps:

S0. Provide a transfer device, the transfer device: a substrate and at least one transfer head disposed on the substrate, the transfer head comprising: an adsorption device and a magnetic field generating device, and:

The adsorption device is arranged on a surface of the substrate and includes an adsorption area on the surface away from the substrate, and the adsorption device is at least used for: adsorbing Micro LEDs within a preset distance range to the adsorption area , or, release the Micro LED;

The magnetic field generating device is arranged between the adsorption device and the substrate, and is configured to generate a magnetic field to at least be used for: adsorbing magnetic particles within a preset distance range on the adsorption area to form a magnetic field with a predetermined distance. Setting a structured contact layer, so that the contact layer is in contact with the Micro LED adsorbed on the adsorption area, or the magnetic particles are released from the contact layer;

S1, turning on the magnetic field generating device, and making the transfer head close to the first carrier substrate loaded with magnetic particles, so that the transfer head adsorbs the magnetic particles, so as to form a contact layer with a preset structure on the adsorption area;

S2, bringing the transfer head close to the second carrier substrate loaded with the Micro LED, and turning on the adsorption device to adsorb the Micro LED to the contact layer;

S3. Align the transfer head on which the Micro LED is adsorbed with a predetermined mounting position on a third substrate, and adjust the adsorption device, and the Micro LED is released at the predetermined mounting position; and,

S4. Adjust the magnetic field generating device to reset the magnetic particles and enter into the next transfer operation.