WO2022010112A1 - Procédé pour la commande d'un réfrigérateur ayant un élément peltier, et réfrigérateur l'utilisant - Google Patents

Procédé pour la commande d'un réfrigérateur ayant un élément peltier, et réfrigérateur l'utilisant Download PDF

Info

Publication number
WO2022010112A1
WO2022010112A1 PCT/KR2021/007203 KR2021007203W WO2022010112A1 WO 2022010112 A1 WO2022010112 A1 WO 2022010112A1 KR 2021007203 W KR2021007203 W KR 2021007203W WO 2022010112 A1 WO2022010112 A1 WO 2022010112A1
Authority
WO
WIPO (PCT)
Prior art keywords
temperature
refrigerator
target
internal temperature
cooling
Prior art date
Application number
PCT/KR2021/007203
Other languages
English (en)
Korean (ko)
Inventor
조성호
박영민
Original Assignee
삼성전자주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 삼성전자주식회사 filed Critical 삼성전자주식회사
Publication of WO2022010112A1 publication Critical patent/WO2022010112A1/fr

Links

Images

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
    • F25D15/00—Devices not covered by group F25D11/00 or F25D13/00, e.g. non-self-contained movable devices
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B21/00—Machines, plants or systems, using electric or magnetic effects
    • F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
    • F25D29/00—Arrangement or mounting of control or safety devices
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
    • F25D29/00—Arrangement or mounting of control or safety devices
    • F25D29/005—Mounting of control devices
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D21/00—Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
    • F25D2700/00—Means for sensing or measuring; Sensors therefor
    • F25D2700/12—Sensors measuring the inside temperature
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D21/00—Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
    • F28D2021/0019—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
    • F28D2021/0028—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for for cooling heat generating elements, e.g. for cooling electronic components or electric devices
    • F28D2021/0029—Heat sinks
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
    • Y02B30/00—Energy efficient heating, ventilation or air conditioning [HVAC]
    • Y02B30/56—Heat recovery units

Definitions

  • the present disclosure relates to a refrigerator using a Peltier element as a cooling device, and more particularly, to a method for controlling a refrigerator having a Peltier element and a refrigerator using the same.
  • a refrigerator is a device that cools food or stores it at a low temperature to prevent spoilage or deterioration of food.
  • Such a refrigerator includes an accommodating space capable of accommodating food and a cooling device for cooling the accommodating space.
  • a cooling device may be classified into a refrigeration cycle device using a refrigeration cycle and a Peltier cooling device using a Peltier element according to a method of generating cold air.
  • the refrigeration cycle device is a method of obtaining cold air by circulating a refrigerant along a closed circuit composed of a compressor, a condenser, an expansion mechanism, and an evaporator.
  • the Peltier cooling device is a method of obtaining cold air using the Peltier effect.
  • the Peltier effect refers to a phenomenon in which when a potential difference is applied to both sides of an object, heat flows along with an electric current, so that one side is heated and the other side is cooled.
  • the refrigeration cycle device is more efficient than the Peltier cooling device, but has a disadvantage in that the noise is large when the compressor is driven.
  • the Peltier cooling device is less efficient than the refrigeration cycle device, but has the advantage of low noise. Therefore, the Peltier cooling device may be used in a cooling device of a central processing unit (CPU), a temperature control seat of a vehicle, a small refrigerator, and the like.
  • CPU central processing unit
  • the Peltier cooling device may be used in a cooling device of a central processing unit (CPU), a temperature control seat of a vehicle, a small refrigerator, and the like.
  • the Peltier cooling device When the temperature of the receiving space of the refrigerator reaches the target temperature, the Peltier cooling device turns off the power applied to the Peltier cooling device, and when the temperature of the receiving space rises above the target temperature, it is controlled to apply power again to the Peltier cooling device. .
  • the present disclosure is devised in view of the above problems, and relates to a control method of a refrigerator capable of rapidly cooling the internal temperature of a refrigerator using a Peltier element to a target temperature and maintaining the target temperature.
  • the present disclosure relates to a refrigerator using a Peltier device using the control method as described above.
  • a method of controlling a refrigerator including a Peltier device includes: measuring an internal temperature of the refrigerator with a first temperature sensor; determining whether the internal temperature of the refrigerator is higher than a first target control temperature; applying a first voltage to the Peltier device when the internal temperature of the refrigerator is higher than or equal to the first target control temperature; and applying a second voltage to the Peltier device when the internal temperature of the refrigerator is lower than the first target control temperature.
  • the cooling sink of the Peltier device The second voltage applied to the Peltier device may be controlled by PID control (Proportional Integral Derivative Control) using the cooling sink temperature and the cooling sink target temperature measured by the installed second temperature sensor.
  • the first target control temperature may be higher than the target temperature in the refrigerator by the first spare temperature.
  • the cooling sink target temperature may be corrected according to the internal temperature of the refrigerator measured by the first temperature sensor.
  • the method of correcting the target temperature of the cooling sink may include: measuring an internal temperature of the refrigerator with the first temperature sensor at regular time intervals; determining whether the currently measured interior temperature is the same as the previous interior temperature measured before the predetermined time; maintaining the cooling sink target temperature without correction when the internal temperature of the refrigerator is the same as the previous internal temperature; if the internal temperature of the refrigerator is not the same as the previous internal temperature, determining whether the internal temperature of the refrigerator is lower than the previous internal temperature; if the internal temperature of the refrigerator is lower than the previous internal temperature, determining whether the internal temperature of the refrigerator is lower than a temperature obtained by subtracting a second spare temperature from a target internal temperature of the refrigerator; raising the cooling sink target temperature by a correction temperature when the internal temperature of the refrigerator is lower than a temperature obtained by subtracting the second spare temperature from the target temperature in the refrigerator; and maintaining the cooling sink target temperature without correction when the internal temperature of the refrigerator is greater than or equal to a temperature obtained by subtracting the second spare temperature from the target internal temperature.
  • control method of a refrigerator includes determining whether the internal temperature of the refrigerator is the same as or higher than the previous internal temperature, and is higher than a temperature obtained by adding the second spare temperature to the target internal temperature of the refrigerator. step; lowering the cooling sink target temperature by the corrected temperature when the internal temperature of the refrigerator is higher than the temperature obtained by adding the second spare temperature to the target internal temperature; and maintaining the cooling sink target temperature without correction when the internal temperature of the refrigerator is less than or equal to the temperature obtained by adding the second spare temperature to the target internal temperature.
  • the predetermined time may be 10 minutes.
  • the second marginal temperature may be 0.3°C.
  • the correction temperature may be 0.3°C.
  • the cooling sink target temperature may be set as a temperature obtained by subtracting the subtracted temperature from the internal target temperature, and the subtracted temperature may be 3°C.
  • the first voltage may be a full duty voltage
  • the second voltage may be lower than the first voltage
  • a refrigerator includes: a main body including an accommodation space; a cooling device installed in the main body and supplying cold air to the accommodation space; a first temperature sensor installed in the accommodation space; and a processor for controlling the cooling device, wherein the cooling device includes: a Peltier element; a cooling sink installed on the low-temperature surface of the Peltier element; a cooling fan installed above the cooling sink and supplying air cooled by the cooling sink to the accommodating space; a second temperature sensor installed in the cooling sink; a heat sink installed on the high-temperature surface of the Peltier element; a heat dissipation fan installed under the heat sink and dissipating heat from the heat sink to the outside of the body; and a power control unit configured to control the voltage supplied to the Peltier device, wherein the processor is configured to include, when the internal temperature of the accommodating space measured by the first temperature sensor is higher than or equal to the first target control temperature, the power control unit to supply a first voltage to the Peltier element by controlling When supplying, the second voltage may
  • the processor may correct the cooling sink target temperature according to the internal temperature measured by the first temperature sensor.
  • the processor corrects the target temperature of the cooling sink
  • the internal temperature of the refrigerator is measured with the first temperature sensor at regular time intervals, and the currently measured internal temperature is the same as the previous internal temperature measured before the predetermined time. and if the internal temperature of the refrigerator is the same as the previous internal temperature, the cooling sink target temperature is maintained without correction; it is determined whether the refrigerator is low, and if the interior temperature of the refrigerator is lower than the previous interior temperature, it is determined whether the interior temperature is lower than a target interior temperature minus a second spare temperature; If it is lower than the temperature obtained by subtracting the spare temperature, the cooling sink target temperature is raised by the corrected temperature. If the inner temperature of the refrigerator is greater than or equal to the temperature obtained by subtracting the second spare temperature from the target temperature in the refrigerator, the cooling sink target temperature is corrected You can keep it without
  • the processor may be further configured to: if the internal temperature of the refrigerator is higher than or equal to the previous internal temperature, determine whether the internal temperature of the refrigerator is higher than a temperature obtained by adding the second spare temperature to the target internal temperature, wherein the internal temperature of the refrigerator is the target internal temperature If the temperature is higher than the temperature obtained by adding the second spare temperature to , the cooling sink target temperature is lowered by the corrected temperature.
  • the target temperature can be maintained without correction.
  • the internal temperature of the refrigerator using the Peltier element can be rapidly cooled to the internal target temperature. , it can be kept constant at the target temperature inside the furnace.
  • FIG. 1 is a cross-sectional view showing a refrigerator according to an embodiment of the present disclosure
  • FIG. 2 is a perspective view illustrating a cooling device used in a refrigerator according to an embodiment of the present disclosure
  • FIG. 3 is a view showing a second temperature sensor installed in the cooling sink of the cooling device according to an embodiment of the present disclosure
  • FIG. 4 is a functional block diagram of a refrigerator according to an embodiment of the present disclosure.
  • FIG. 5 is a flowchart illustrating a control method of a refrigerator according to an embodiment of the present disclosure
  • FIG. 6 is a flowchart illustrating a method of correcting a target temperature of a cooling sink in a method of controlling a refrigerator according to an embodiment of the present disclosure
  • FIG. 7 is a graph illustrating changes over time of a refrigerator temperature, a cooling sink temperature, and a cooling sink target temperature controlled by the refrigerator control method according to an embodiment of the present disclosure
  • expressions such as “have,” “may have,” “include,” or “may include” indicate the presence of a corresponding characteristic (eg, a numerical value, function, operation, or component such as a part). and does not exclude the presence of additional features.
  • a component eg, a first component
  • another component eg, a second component
  • an element may be directly connected to another element or may be connected through another element (eg, a third element).
  • a “module” or “unit” performs at least one function or operation, and may be implemented as hardware or software, or a combination of hardware and software.
  • a plurality of “modules” or a plurality of “units” are integrated into at least one module and implemented with at least one processor (not shown) except for “modules” or “units” that need to be implemented with specific hardware.
  • the term user may refer to a person who uses an electronic device or a device (eg, an artificial intelligence electronic device) using the electronic device.
  • a device eg, an artificial intelligence electronic device
  • FIG. 1 is a cross-sectional view illustrating a refrigerator according to an embodiment of the present disclosure.
  • a refrigerator 1 may include a body 10 , a cooling device 20 , and a processor 80 .
  • the refrigerator 1 shown in FIG. 1 is a wine refrigerator capable of storing a plurality of wine bottles.
  • this is only an example, and the refrigerator 1 to which the present disclosure can be applied is not limited to a wine refrigerator.
  • the body 10 is formed in a rectangular parallelepiped shape, and may include an accommodation space 11 capable of storing food.
  • a door 12 capable of opening and closing the accommodation space 11 may be installed on the front surface of the main body 10 .
  • the interior of the body 10 is formed to accommodate a plurality of wine bottles.
  • the main body 10 may be provided with a cooling passage 13 for guiding the low-temperature air cooled by the cooling device 20 to the accommodation space 11 .
  • the cooling passage 13 may be formed to communicate the cooling apparatus chamber 15 in which the cooling apparatus 20 is installed and the accommodation space 11 .
  • the air in the accommodating space 11 flows into the cooling device chamber 15 in which the cooling device 20 is installed, is cooled by the cooling device 20 , and then again passes through the cooling passage 13 to the receiving space 11 . ) can be released.
  • the outlet 13a of the cooling passage 13 may be provided on the inner surface of the main body 10 .
  • the first temperature sensor 71 may be installed in the accommodation space 11 of the main body 10 .
  • the first temperature sensor 71 may be installed on the inner surface of the main body 10 , that is, the inner surface of the main body 10 forming the accommodation space 11 .
  • the first temperature sensor 71 may be installed on the inner surface of the body 10 in which the outlet 13a of the cooling channel 13 is formed so as to be adjacent to the outlet 13a of the cooling channel 13 .
  • the first temperature sensor 71 is formed to measure the temperature of the accommodation space 11 of the main body 10 , that is, the temperature inside the refrigerator.
  • the first temperature sensor 71 may transmit the measured internal temperature data to the processor 80 . That is, the processor 80 may determine the internal temperature of the refrigerator from the signal output from the first temperature sensor 71 .
  • the cooling device 20 is installed in the main body 10 , and is formed to supply cold air to the accommodation space 11 of the main body 10 . After cooling the air in the receiving space 11 of the main body 10 by using the Peltier element 21 , the cooling device 20 is formed to discharge the cooled air into the receiving space 11 .
  • the cooling device 20 may be installed at the lower portion of the main body 10 , that is, in the cooling device chamber 15 provided below the accommodation space.
  • FIG. 2 is a perspective view illustrating a cooling device installed in a refrigerator according to an exemplary embodiment of the present disclosure.
  • the cooling device 20 may include a Peltier element 21 , a cooling sink 30 , and a heat sink 50 .
  • the Peltier element 21 may include a low temperature portion and a high temperature portion, and a temperature difference between the low temperature portion and the high temperature portion may be determined according to a voltage applied to the Peltier element 21 .
  • the Peltier element 21 may be installed such that the low temperature part faces upward and the high temperature part faces downward.
  • the circumference of the Peltier element 21 may be insulated with a heat insulating member 23 as shown in FIG. 1 .
  • the Peltier element 21 and the heat insulating member 23 divide and isolate the cooling device chamber 15 into a low temperature chamber 16 and a high temperature chamber 17 . Accordingly, the high temperature portion of the Peltier element 21 does not affect the low temperature portion of the Peltier element 21 .
  • the cooling sink 30 is installed so as to be in contact with or adjacent to the exposed surface of the low-temperature portion of the Peltier element 21, that is, the low-temperature surface. Accordingly, the cooling sink 30 is installed on the upper side of the Peltier element (21). That is, the cooling sink 30 is installed in the low temperature chamber 16 of the cooling apparatus chamber 15 .
  • the cooling sink 30 may include a cooling plate 31 and cooling fins 32 .
  • the cooling plate 31 may be installed to be in contact with the Peltier element 21 .
  • the cooling plate 31 may be in contact with the low-temperature portion of the Peltier element 21 to transfer the heat of the low-temperature portion of the Peltier element 21 to the cooling fins 32 .
  • the cooling plate 31 may be formed of a material having high thermal conductivity.
  • the cooling plate 31 may be formed in a substantially rectangular shape.
  • the cooling fins 32 may be installed to contact the cooling plate 31 .
  • the cooling fins 32 may be formed to protrude from one surface of the cooling plate 31 .
  • the cooling fins 32 may be located above the cooling plate 31 . At least a part of the cooling fins 32 may be located in the low-temperature chamber 16 in the cooling device chamber 15 , and heat exchange with the air in the low-temperature chamber 16 to cool the air.
  • a plurality of cooling fins 32 may be formed to increase the heat exchange area with air.
  • the cooling fins 32 are formed in a rectangular shape and are vertically spaced apart from the upper surface of the cooling plate 31 at regular intervals. Accordingly, the air introduced into the low temperature chamber 16 by the cooling fan 40 may exchange heat while flowing between the plurality of cooling fins 32 .
  • the air supplied to the cooling sink 30 may be guided by the plurality of cooling fins 32 and introduced into the cooling passage 13 .
  • the heat sink 50 is installed so as to be in contact with or adjacent to the exposed surface of the high-temperature portion of the Peltier element 21, that is, the high-temperature surface. Accordingly, the heat sink 50 is installed on the lower side of the Peltier element (21). Accordingly, the cooling sink 30 is installed closer to the accommodation space 11 of the body 10 than the heat sink 50 .
  • the cooling device 20 may include a cooling fan 40 circulating air in the accommodation space 11 and a heat dissipation fan 60 circulating external air.
  • the cooling fan 40 is installed above the cooling sink 30 , and is formed to circulate the air in the accommodation space 11 through the cooling sink 30 . That is, the cooling fan 40 is installed above the cooling sink 30 in the low temperature chamber 16 .
  • the air in the accommodation space 11 is sucked into the low temperature chamber 16 of the cooling device chamber 15 by the cooling fan 40 , passes through the cooling sink 30 , and then again along the cooling passage 13 . It may be discharged into the accommodation space 11 . Accordingly, the cooling fan 40 circulates air in the accommodation space 11 of the main body 10 to lower the temperature of the accommodation space 11 .
  • An inlet 41 communicating with the accommodating space 11 is provided on the upper portion of the cooling fan 40 , that is, on the upper surface of the cooling device chamber 15 . Accordingly, when the cooling fan 40 operates, the air in the accommodation space 11 may be introduced into the low temperature chamber 16 of the cooling device chamber 15 through the inlet 41 .
  • the cooling fan 40 is formed to supply the air of the accommodation space 11 to the cooling sink 30 . Accordingly, when the cooling fan 40 operates, the air in the accommodation space 11 flows into the low temperature chamber 16 and is supplied to the plurality of cooling fins 32 of the cooling sink 30 .
  • the air introduced by the cooling fan 40 exchanges heat with the plurality of cooling fins 32 while moving along the plurality of cooling fins 32 to lower the temperature and flow into the cooling passage 13 .
  • the cold air introduced into the cooling passage 13 is discharged to the receiving space 11 of the main body 10 through the outlet 13a.
  • a second temperature sensor 72 may be installed in the cooling sink 30 .
  • FIG 3 is a diagram illustrating a second temperature sensor installed in a cooling sink of a cooling device according to an embodiment of the present disclosure.
  • the second temperature sensor 72 may be installed on top of the plurality of cooling fins 32 .
  • the second temperature sensor 72 is formed to measure the temperature of the cooling sink 30 .
  • the second temperature sensor 72 may transmit the measured temperature data of the cooling sink 30 to the PID control unit 82 . That is, the PID control unit 82 may determine the temperature of the cooling sink 30 from the signal output from the second temperature sensor 72 .
  • the heat sink 50 is installed so as to be in contact with or adjacent to the exposed surface of the high-temperature portion of the Peltier element 21, that is, the high-temperature surface. Accordingly, the heat sink 50 is installed on the lower side of the Peltier element (21). That is, the heat sink 50 is installed in the high temperature chamber 17 of the cooling device chamber 15 .
  • a heat dissipation block 55 is installed between the heat dissipation sink 50 and the Peltier element 21 .
  • One end of the heat dissipation block 55 is in contact with the high-temperature surface of the Peltier element 21 , and the other end is installed to contact the heat dissipation sink 50 .
  • the heat sink 50 may be installed to directly contact the high temperature surface of the Peltier element 21 .
  • the heat sink 50 may include a heat sink 51 and a heat radiation fin 52 .
  • the heat sink 51 may be installed to be in contact with the Peltier element 21 .
  • the heat sink 51 may be in contact with the high temperature portion of the Peltier element 21 to transfer the heat of the high temperature portion of the Peltier element 21 to the heat radiation fins 52 .
  • the heat sink 51 may be formed of a material having high thermal conductivity.
  • the heat sink 51 may be formed in a substantially rectangular shape.
  • the heat dissipation fins 52 may be installed to contact the heat dissipation plate 51 .
  • the heat dissipation fin 52 may be formed to protrude from one surface of the heat dissipation plate 51 .
  • the heat dissipation fin 52 may be located under the heat dissipation plate 51 . At least a portion of the heat dissipation fins 52 may be located in the high temperature chamber 17 in the cooling device chamber 15 , and heat exchange with external air introduced into the high temperature chamber 17 to cool the heat dissipation fins 52 .
  • a plurality of heat dissipation fins 52 may be formed in order to increase a heat exchange area with external air.
  • the heat dissipation fins 52 are formed in a rectangular shape and are vertically spaced apart from the bottom surface of the heat dissipation plate 51 at regular intervals. Accordingly, the external air introduced by the heat dissipation fan 60 may exchange heat with the plurality of heat dissipation fins 52 while flowing between the plurality of heat dissipation fins 52 .
  • the external air supplied to the heat sink 50 may be guided by the plurality of heat radiation fins 52 to be discharged to the outside of the high temperature chamber 17 .
  • the heat dissipation fan 60 is installed under the heat sink 50 , and is formed to circulate air outside the refrigerator 1 through the heat sink 50 . That is, the heat dissipation fan 60 is installed below the heat sink 50 in the high temperature chamber 17 of the cooling device chamber 15 .
  • the heat dissipation fan 60 may lower the temperature of the heat dissipation sink 50 by sucking the outside air. That is, the heat dissipation fan 60 may lower the temperature of the high temperature portion of the Peltier element 21 by using external air.
  • An inlet 17a and an outlet 17b communicating with the outside are provided on one side of the heat dissipation fan 60 , that is, a side surface of the high temperature chamber 17 of the cooling device chamber 15 .
  • the heat dissipation fan 60 is formed to supply external air to the heat sink 50 . Accordingly, when the heat dissipation fan 60 operates, external air flows into the high temperature chamber 17 and is supplied to the plurality of heat dissipation fins 52 of the heat dissipation sink 50 .
  • the external air introduced into the high temperature chamber 17 by the heat dissipation fan 60 exchanges heat with the plurality of heat dissipation fins 52 while moving along the plurality of heat dissipation fins 52 to lower the temperature of the plurality of heat dissipation fins 52 .
  • Air heated by heat exchange with the plurality of heat dissipation fins 52 is discharged to the outside of the high temperature chamber 17 through the outlet 17b.
  • the heat dissipation fan 60 may radiate heat from the heat sink 50 , that is, the high temperature portion of the Peltier element 21 , to the outside of the cooling device chamber 15 , that is, to the outside of the main body 10 .
  • FIG. 4 is a functional block diagram of a refrigerator according to an embodiment of the present disclosure.
  • the refrigerator 1 includes a processor 80 , a power control unit 81 , a PID control unit 82 , a Peltier element 21 , a first temperature sensor 71 , A second temperature sensor 72 may be included.
  • the processor 80 is configured to control the cooling device 20 .
  • the processor 80 may control the cooling device 20 to lower the temperature of the accommodating space 11 of the refrigerator 1 to a target temperature inside the refrigerator 1 and keep it constant.
  • the processor 80 may be implemented as a digital signal processor (DSP), a microprocessor, or a time controller (TCON) for processing a digital signal.
  • DSP digital signal processor
  • TCON time controller
  • the processor 80 is not limited thereto.
  • CPU central processing unit
  • MCU micro controller unit
  • MPU micro processing unit
  • AP application processor
  • GPU graphics-processing unit
  • CP communication processor
  • ARM processor At least one of a communication processor (CP) and an ARM processor may be included, or may be defined by a corresponding term.
  • processor 80 may be implemented as a system on chip (SoC), large scale integration (LSI), or a field programmable gate array (FPGA) having a built-in processing algorithm.
  • SoC system on chip
  • LSI large scale integration
  • FPGA field programmable gate array
  • processor 80 may perform various functions by executing computer executable instructions stored in the memory 83 .
  • the processor 80 may control the power control unit 81 to adjust the voltage of the power supplied to the Peltier element 21 .
  • the processor 80 may control the voltage supplied to the Peltier element 21 by controlling the power control unit 81 based on the internal temperature input from the first temperature sensor 71 .
  • the processor Reference numeral 80 controls the power control unit 81 to supply a first voltage V1, for example, a full duty voltage to the Peltier element 21 . That is, when the internal temperature T1 is equal to or higher than the first target control temperature, the processor may control the power control unit to apply a full-duty voltage to the Peltier device.
  • the processor 80 may supply the second voltage V2 to the Peltier element 21 .
  • the processor 80 may control the second voltage V2 through the PID control unit 82 to be PID controlled (Proportional Integral Derivative Control) according to the temperature of the cooling sink 30 .
  • the power control unit 81 is formed to control the voltage of the power supplied to the Peltier element (21).
  • the power control unit 81 may adjust the voltage supplied to the Peltier element 21 according to a signal from the processor 80 .
  • the power control unit 81 may adjust the voltage supplied to the Peltier element 21 according to the signal of the PID control unit 82 .
  • the PID control unit 82 controls the power supply control unit 81 using the temperature T2 of the cooling sink 30 measured by the second temperature sensor 72 to PID control the voltage of the power supplied to the Peltier element 21 . can be adjusted
  • the PID control unit 82 is formed to control the voltage applied to the Peltier element 21 using the following equation.
  • the proportional term (P) acts as a control proportional to the magnitude of the error value in the current state.
  • the integral term (I) acts to eliminate the steady-state error.
  • the derivative term (D) acts to reduce overshoot and improve stability by braking the sudden change in the output value.
  • control parameters Kp, Ki, and Kd of the proportional term, the integral term, and the differential term can be tuned through an experimental method.
  • the PID control unit 82 is illustrated as being formed separately from the processor 80 , but as another example, the PID control unit 82 may be formed integrally with the processor 80 . In other words, the processor 80 may be formed to perform PID control.
  • the processor 80 controls the power controller 81 to control the Peltier element 21) may be supplied with a second voltage V2.
  • the processor 80 may PID control the second voltage V2 using the PID controller 82 and the second temperature sensor 72 .
  • the processor 80 uses the temperature T2 and the target cooling sink temperature Ts of the cooling sink 30 measured by the PID control unit 82 with the second temperature sensor 72 to the Peltier element 21 ), the second voltage V2 applied to it may be controlled by PID control.
  • the processor 80 controls the power control unit 81 to control the power supply control unit 81 when the internal temperature T1 of the accommodating space 11 measured by the first temperature sensor 71 is higher than or equal to the first target control temperature Tt1.
  • a first voltage is supplied to the Peltier element 21, and when the internal temperature T1 is lower than the first target control temperature Tt1, the power control unit 81 is controlled to supply the second voltage to the Peltier element 21.
  • the processor 80 converts the second voltage to PID control using the temperature T2 of the cooling sink 30 measured by the second temperature sensor 72 and the target temperature Ts of the cooling sink. can be controlled
  • the processor 80 may correct the cooling sink target temperature Ts for PID control according to the internal temperature T1 measured by the first temperature sensor 71 .
  • the processor 80 when correcting the cooling sink target temperature Ts, the processor 80 measures the internal temperature T1 of the refrigerator with the first temperature sensor 71 at regular time intervals, and the currently measured internal temperature T1 It is determined whether is the same as the previous internal temperature Tc measured before a predetermined time, and if the internal temperature T1 is the same as the previous internal temperature Tc, the cooling sink target temperature may be maintained without correction.
  • the processor 80 determines whether the inside temperature T1 is lower than the previous inside temperature Tc, and the inside temperature T1 is the previous inside temperature ( Tc), it may be determined whether the internal temperature T1 is lower than a temperature obtained by subtracting the second spare temperature c from the target internal temperature Tt.
  • the processor 80 increases the cooling sink target temperature Ts by the correction temperature d, and increases the internal temperature of the refrigerator If T1 is greater than or equal to the temperature obtained by subtracting the second spare temperature c from the target internal temperature Tt, the cooling sink target temperature Ts may be maintained without correction.
  • the processor 80 determines whether the internal temperature T1 is higher than the target internal temperature Tt plus the second spare temperature c. can
  • the processor 80 lowers the cooling sink target temperature Ts by the correction temperature d, and the internal temperature ( When T1) is less than or equal to the temperature obtained by adding the second spare temperature c to the internal target temperature Tt, the cooling sink target temperature Ts may be maintained without correction.
  • the memory 83 may store data, programs, etc. necessary for the processor to control the cooling device.
  • the memory may store the internal target temperature Tt, the cooling sink target temperature Ts, and the like.
  • the memory 83 may be implemented as an internal memory such as a ROM (eg, electrically erasable programmable read-only memory (EEPROM)) included in the processor 80 , a RAM, or the like. Alternatively, it may be implemented as a memory separate from the processor 80 .
  • ROM read-only memory
  • EEPROM electrically erasable programmable read-only memory
  • the power supply unit 84 is formed to apply power to the Peltier element 21 through the power control unit 81 .
  • the power supply unit 84 is formed to supply power to the cooling fan 40 and the heat dissipation fan 60 .
  • the cooling fan 40 and the heat dissipation fan 60 may be controlled on/off by the processor 80 .
  • FIG. 5 is a flowchart illustrating a method for controlling a refrigerator according to an embodiment of the present disclosure.
  • the method for controlling a refrigerator includes the steps of measuring the internal temperature T1 of the refrigerator 1 with a first temperature sensor 71 ( S10 ), and the internal temperature T1 of the refrigerator 1 . is higher than the first target control temperature Tt1 ( S11 ), and when the internal temperature T1 is higher than or equal to the first target control temperature Tt1 ( T1 ⁇ Tt1 ), the first In the step of supplying the voltage V1 ( S13 ), and when the internal temperature T1 is lower than the first target control temperature Tt1 ( T1 ⁇ Tt1 ), the second voltage V2 is supplied to the Peltier element 21 . It may include a step (S14) of doing.
  • the processor 80 first measures the internal temperature T1 of the refrigerator 1 using the first temperature sensor 71 installed in the accommodation space 11 of the main body 10 ( S10 ). Specifically, the processor 80 recognizes the internal temperature T1 of the refrigerator 1 from the signal output from the first temperature sensor 71 .
  • the processor 80 determines whether the measured internal temperature T1 is higher than the first target control temperature Tt1 ( S11 ).
  • the first target control temperature Tt1 may be stored in the memory 83 .
  • the first spare temperature a may be 0.7°C.
  • the target internal temperature Tt refers to the temperature of the accommodation space 11 of the refrigerator body 10 that the processor 80 wants to maintain. That is, the processor 80 may control the cooling device 20 so that the temperature of the accommodating space 11 of the refrigerator 1 maintains the target internal temperature Tt.
  • the processor 80 supplies the first voltage V1 to the Peltier element 21 ( S13 ).
  • the processor 80 controls the power control unit 81 to control the Peltier device.
  • the first voltage is supplied to (21). That is, when the internal temperature T1 is equal to or higher than the first target control temperature Tt1 , the power control unit 81 supplies the first voltage to the Peltier element 21 .
  • the first voltage may be a full-duty voltage that can be applied by the power supply unit 84 . Then, the internal temperature T1 of the refrigerator 1 may drop below the first target control temperature Tt1 within a short time.
  • the processor 80 supplies the second voltage V2 to the Peltier element 21 ( S14 ).
  • the processor 80 controls the PID controller 82 to power
  • the controller 81 supplies the second voltage to the Peltier element 21 . That is, when the internal temperature T1 is lower than the first target control temperature, the power control unit 81 supplies the second voltage to the Peltier element 21 .
  • the second voltage V2 may be lower than the first voltage V1 .
  • the second voltage V2 may be PID-controlled by the PID control unit 82 .
  • the PID control unit 82 uses the cooling sink temperature (T2) and the cooling sink target temperature (Ts) measured by the second temperature sensor 72 installed in the cooling sink 30 of the Peltier element 21 to control the The two voltages V2 can be controlled by PID control.
  • the PID control unit 82 determines whether the time to correct the cooling sink target temperature Ts has elapsed (S15).
  • the PID control unit 82 uses the second temperature sensor 72 to control the temperature of the cooling sink 30 of the Peltier element 21, that is, the cooling sink temperature ( T2) is measured (S16).
  • the second temperature sensor 72 is installed at the upper end of the cooling sink 30 located on the upper side of the Peltier element 21 , it is possible to measure the temperature of the cooling sink 30 . Specifically, the PID control unit 82 recognizes the temperature of the cooling sink 30 from the signal output from the second temperature sensor 72 .
  • the PID controller 82 calculates the difference between the cooling sink temperature T2 and the cooling sink target temperature Ts (S17).
  • the PID control unit 82 controls the second voltage V2 supplied to the Peltier element 21 by using the difference between the cooling sink temperature T2 and the cooling sink target temperature Ts to PID control the cooling sink 30 .
  • the temperature T2 reaches the cooling sink target temperature Ts to maintain the cooling sink target temperature Ts.
  • the cooling sink target temperature Ts refers to the temperature of the cooling sink 30 to be reached by controlling the Peltier element 21 .
  • the cooling sink target temperature Ts is set to be lower than the internal target temperature Tt.
  • the subtracted temperature b may be appropriately determined according to the cooling passage 13 of the main body 10 , the configuration of the cooling device 20 , and the like.
  • the subtracted temperature b may be 3°C.
  • the cooling sink target temperature Ts may be set to be 3°C lower than the internal target temperature Tt.
  • the cooling sink target temperature Ts may be stored in the memory 83 together with the internal target temperature Tt. Accordingly, the PID control unit 82 calculates the difference between the cooling sink target temperature Ts read from the memory 83 and the cooling sink temperature T2 measured by the second temperature sensor 72 and inputs it to the Peltier element 21 . It is possible to PID control the applied voltage.
  • the PID control unit 82 causes the processor 80 to correct the cooling sink target temperature Ts (S20).
  • a method for the processor 80 to correct the cooling sink target temperature Ts will be described in detail with reference to FIG. 6 .
  • FIG. 6 is a flowchart illustrating a method of correcting a target temperature of a cooling sink in a method of controlling a refrigerator according to an exemplary embodiment of the present disclosure.
  • the processor 80 measures the internal temperature T1 of the refrigerator with the first temperature sensor 71 at a predetermined time interval ⁇ t ( S21 ).
  • the processor 80 may measure the temperature of the accommodating space 11 of the main body 10 , that is, the internal temperature T1 of the main body 10 through the first temperature sensor 71 at 10-minute intervals.
  • the processor 80 stores the first measured internal temperature T1 in the memory 83 as the previous internal temperature Tc. That is, the previous internal temperature Tc refers to the internal temperature T1 measured before a predetermined time ⁇ t.
  • the processor 80 measures the internal temperature T1 of the refrigerator with the first temperature sensor 71 .
  • the processor 80 determines whether the currently measured internal temperature T1 is the same as the internal temperature Tc measured before a predetermined time ⁇ t, that is, the previous internal temperature Tc stored in the memory 83 ( S22 ). ).
  • the processor 80 maintains the cooling sink target temperature Ts without correcting it (S23).
  • the processor 80 determines whether the measured internal temperature T1 is lower than the previous internal temperature Tc (S24).
  • the processor 80 determines whether the measured internal temperature T1 is lower than the second target control temperature Tt2 ( S25).
  • the second spare temperature c may be 0.3°C.
  • the processor 80 performs a correction to increase the cooling sink target temperature Ts by a predetermined temperature ( S26).
  • the processor 80 stores the data in the memory 83 .
  • a correction is performed to increase the stored cooling sink target temperature Ts by a predetermined temperature, that is, the correction temperature d, and the stored cooling sink target temperature Ts is stored in the memory 83 again. That is, the corrected cooling sink target temperature Ts is set higher than the cooling sink target temperature Ts before the correction by the correction temperature d.
  • the correction temperature d may be appropriately determined according to the performance of the cooling device 20 .
  • the correction temperature d may be set to 0.3°C.
  • the correction temperature (d) may be set to be the same as the second spare temperature (c).
  • the processor 80 controls the memory 83
  • the cooling sink target temperature (Ts) stored in the is maintained as it is without correction (S27).
  • the processor 80 determines whether the measured internal temperature T1 is higher than the third target control temperature Tt3 ( S28 ).
  • the processor 80 sets the cooling sink target temperature Ts. A correction is performed to lower the temperature by a certain amount (S29).
  • the processor 80 sends the data to the memory 83.
  • a correction is performed by lowering the stored cooling sink target temperature Ts by a predetermined temperature, that is, the correction temperature d, and the stored cooling sink target temperature Ts is stored in the memory 83 again. That is, the corrected cooling sink target temperature Ts is set lower than the cooling sink target temperature Ts before the correction by the correction temperature d.
  • the processor 80 controls the cooling stored in the memory 83 .
  • the sink target temperature Ts is not corrected and is maintained as it is (S27).
  • the processor 80 determines that the measured internal temperature T1 is less than or equal to the temperature obtained by adding the second spare temperature c to the internal target temperature Tt, that is, the third target control temperature Tt3, the processor 80 The cooling sink target temperature Ts stored in the memory 83 is maintained without being updated.
  • FIG. 7 is a graph illustrating changes over time of a refrigerator interior temperature, a cooling sink temperature, and a cooling sink target temperature controlled by the refrigerator control method according to an exemplary embodiment of the present disclosure.
  • the X-axis represents time (t) (minutes), and the Y-axis represents temperature (T) (°C).
  • the upper graph in FIG. 7 shows the change with time of the internal temperature T1 of the accommodating space 11 of the main body 10 measured by the first temperature sensor 71 .
  • the line 1 indicates the internal temperature T1 of the storage space 11 measured by the first temperature sensor 71
  • the line 2 indicates the target internal temperature Tt of the storage space 11 .
  • the lower graph in FIG. 7 shows the change with time of the temperature T2 of the cooling sink 30 of the cooling device 20 measured by the second temperature sensor 72 .
  • Line 3 represents the temperature T2 of the cooling sink 30 measured by the second temperature sensor 72
  • line 4 represents the target cooling sink temperature Ts.
  • the first voltage is applied to the Peltier element 21 until the internal temperature T1 reaches the first target control temperature Tt1 .
  • the first voltage may be a full-duty voltage that the power control unit 82 may apply.
  • the processor 80 stores the internal temperature T1 of P1 as the previous internal temperature Tc in the memory 83 .
  • the processor 80 After reaching the first target control temperature Tt1 , after a predetermined time ⁇ t, for example, 10 minutes have elapsed, at P2 , the processor 80 measures the internal temperature T1 of the refrigerator with the first temperature sensor 71 . and compare it with the previous internal temperature (Tc) (the internal temperature of P1).
  • the internal temperature T1 of the refrigerator at P2 is lower than the previous internal temperature Tc, but is higher than the temperature obtained by subtracting the second spare temperature c from the target internal temperature Tt, that is, higher than the second target control temperature Tt2.
  • the cooling sink target temperature Ts of the cooling sink 30 is maintained without correction.
  • the processor 80 updates the previous internal temperature Tc stored in the memory 83 to the internal temperature T1 of P2.
  • the processor 80 measures the internal temperature T1 with the first temperature sensor 71 and compares it with the previous internal temperature Tc (the internal temperature of P2).
  • the processor Reference numeral 80 corrects the cooling sink target temperature Ts of the cooling sink 30 .
  • the cooling sink target temperature Ts stored in the memory 83 is updated as a temperature obtained by subtracting the correction temperature d from the existing cooling sink target temperature Ts. Then, the cooling sink target temperature Ts from P3 is lower than the cooling sink target temperature Ts between P1 and P3 by the correction temperature.
  • the processor 80 updates the previous internal temperature Tc stored in the memory 83 to the internal temperature T1 of P3.
  • the processor 80 measures the internal temperature T1 with the first temperature sensor 71 and compares it with the previous internal temperature Tc (the internal temperature of P3).
  • the internal temperature T1 of the refrigerator at P4 is lower than the previous internal temperature Tc, but is higher than the temperature obtained by subtracting the second spare temperature c from the target internal temperature Tt, that is, higher than the second target control temperature Tt2.
  • the cooling sink target temperature Ts of the cooling sink 30 is maintained without correction.
  • the processor 80 updates the previous internal temperature Tc stored in the memory 83 to the internal temperature T1 of P4.
  • the processor 80 measures the internal temperature T1 with the first temperature sensor 71 and compares it with the previous internal temperature Tc (the internal temperature of P4).
  • the processor Reference numeral 80 corrects the cooling sink target temperature Ts of the cooling sink 30 .
  • the cooling sink target temperature Ts stored in the memory 83 is updated to a temperature obtained by adding the correction temperature d to the existing cooling sink target temperature Ts. Then, the cooling sink target temperature Ts from P5 is higher than the cooling sink target temperature Ts between P3-P5 by the correction temperature.
  • the processor 80 updates the previous internal temperature Tc stored in the memory 83 to the internal temperature T1 of P5.
  • the processor 80 measures the internal temperature T1 with the first temperature sensor 71 and compares it with the previous internal temperature Tc (the internal temperature of P5).
  • the processor 80 Since the internal temperature T1 of the refrigerator at P6 is lower than the previous internal temperature Tc and is lower than the temperature obtained by subtracting the second spare temperature c from the target internal temperature Tt, the processor 80 operates the cooling sink 30 . Correct the cooling sink target temperature (Ts).
  • the cooling sink target temperature Ts stored in the memory 83 is updated to a temperature obtained by adding the correction temperature d to the existing cooling sink target temperature Ts. Then, the cooling sink target temperature Ts from P6 is higher than the cooling sink target temperature Ts between P5 and P6 by the correction temperature d.
  • the processor 80 updates the previous internal temperature Tc stored in the memory 83 to the internal temperature T1 of P6.
  • the processor 80 measures the internal temperature T1 with the first temperature sensor 71 and compares it with the previous internal temperature Tc (the internal temperature of P6).
  • the processor 80 Since the internal temperature T1 of the refrigerator at P7 is higher than the previous internal temperature Tc and is higher than the temperature obtained by subtracting the second spare temperature c from the target internal temperature Tt, the processor 80 operates the cooling sink 30 .
  • the cooling sink target temperature (Ts) is left uncorrected.
  • the processor 80 updates the previous internal temperature Tc stored in the memory 83 to the internal temperature T1 of P7.
  • the internal temperature of the refrigerator is rapidly cooled to the internal target temperature and is constantly maintained at the internal target temperature.
  • various embodiments of the present disclosure described above may be performed through an embedded server provided in the electronic device (refrigerator) or an external server of the electronic device (refrigerator).
  • the various embodiments described above may be implemented as software including instructions stored in a machine-readable storage medium (eg, a computer).
  • the device is a device capable of calling a stored command from a storage medium and operating according to the called command, and may include an electronic device (refrigerator) according to the disclosed embodiments.
  • the processor may perform a function corresponding to the instruction by using other components directly or under the control of the processor.
  • Instructions may include code generated or executed by a compiler or interpreter.
  • the device-readable storage medium may be provided in the form of a non-transitory storage medium.
  • 'non-transitory' means that the storage medium does not include a signal and is tangible, and does not distinguish that data is semi-permanently or temporarily stored in the storage medium.
  • the method according to the various embodiments described above may be included in a computer program product and provided.
  • Computer program products may be traded between sellers and buyers as commodities.
  • the computer program product may be distributed in the form of a machine-readable storage medium (eg, compact disc read only memory (CD-ROM)) or online through an application store (eg, Play StoreTM).
  • an application store eg, Play StoreTM
  • at least a portion of the computer program product may be temporarily stored or temporarily generated in a storage medium such as a memory of a server of a manufacturer, a server of an application store, or a relay server.
  • each of the components may be composed of a single or a plurality of entities, and some sub-components of the aforementioned sub-components may be omitted, or other sub-components may be omitted. Components may be further included in various embodiments.
  • some components eg, a module or a program
  • operations performed by a module, program, or other component may be sequentially, parallel, repetitively or heuristically executed, or at least some operations may be executed in a different order, omitted, or other operations may be added.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Combustion & Propulsion (AREA)
  • Devices That Are Associated With Refrigeration Equipment (AREA)

Abstract

L'invention concerne un procédé pour la commande d'un réfrigérateur comprenant un élément Peltier, qui comprend les étapes consistant à : mesurer la température interne d'un réfrigérateur en utilisant un premier capteur de température ; déterminer si la température interne est supérieure à une première température de commande cible ; appliquer une première tension à un élément Peltier si la température interne est supérieure ou égale à la première température de commande cible ; et appliquer une seconde tension à l'élément Peltier si la température interne est inférieure à la première température de commande cible, dans lequel, à l'étape d'application d'une seconde tension à un élément Peltier, la seconde tension appliquée à l'élément Peltier est commandée par une commande proportionnelle intégrale dérivée (PID) en utilisant une température cible de drain thermique et une température de drain thermique mesurée avec un second capteur de température ménagé dans un drain thermique de l'élément Peltier.
PCT/KR2021/007203 2020-07-08 2021-06-09 Procédé pour la commande d'un réfrigérateur ayant un élément peltier, et réfrigérateur l'utilisant WO2022010112A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2020-0084054 2020-07-08
KR1020200084054A KR20220006285A (ko) 2020-07-08 2020-07-08 펠티어 소자를 구비한 냉장고의 제어방법 및 이를 사용하는 냉장고

Publications (1)

Publication Number Publication Date
WO2022010112A1 true WO2022010112A1 (fr) 2022-01-13

Family

ID=79553314

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2021/007203 WO2022010112A1 (fr) 2020-07-08 2021-06-09 Procédé pour la commande d'un réfrigérateur ayant un élément peltier, et réfrigérateur l'utilisant

Country Status (2)

Country Link
KR (1) KR20220006285A (fr)
WO (1) WO2022010112A1 (fr)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1182864A (zh) * 1996-11-18 1998-05-27 萨墨福尼克斯株式会社 热电式冰箱
KR100209696B1 (ko) * 1997-06-30 1999-07-15 구자홍 열전모듈 냉장고의 소비전력 감쇄방법
JP2001289550A (ja) * 2000-04-03 2001-10-19 Matsushita Refrig Co Ltd 熱電モジュール式電気冷蔵庫
KR100425239B1 (ko) * 2001-12-04 2004-04-06 하가전자 주식회사 열전소자를 사용한 저장고 [냉장고 또는 온장고]의고내온도 제어장치
KR20180105573A (ko) * 2017-03-15 2018-09-28 엘지전자 주식회사 냉장고

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1182864A (zh) * 1996-11-18 1998-05-27 萨墨福尼克斯株式会社 热电式冰箱
KR100209696B1 (ko) * 1997-06-30 1999-07-15 구자홍 열전모듈 냉장고의 소비전력 감쇄방법
JP2001289550A (ja) * 2000-04-03 2001-10-19 Matsushita Refrig Co Ltd 熱電モジュール式電気冷蔵庫
KR100425239B1 (ko) * 2001-12-04 2004-04-06 하가전자 주식회사 열전소자를 사용한 저장고 [냉장고 또는 온장고]의고내온도 제어장치
KR20180105573A (ko) * 2017-03-15 2018-09-28 엘지전자 주식회사 냉장고

Also Published As

Publication number Publication date
KR20220006285A (ko) 2022-01-17

Similar Documents

Publication Publication Date Title
WO2019190113A1 (fr) Réfrigérateur et son procédé de commande
WO2019190114A1 (fr) Réfrigérateur et son procédé de commande
WO2017039234A1 (fr) Réfrigérateur
WO2019172532A1 (fr) Réfrigérateur et son procédé de commande
WO2018120715A1 (fr) Procédé et dispositif de commande de climatiseur, et climatiseur associé
AU2018295869B2 (en) Refrigerator and method of controlling the same
WO2020011019A1 (fr) Procédé de commande d'une électrovanne de détente, climatiseur, climatiseur et support d'informations lisible par ordinateur
WO2017164711A1 (fr) Procédé de commande pour réfrigérateur
WO2017164710A1 (fr) Procédé de commande pour réfrigérateur
WO2020042689A1 (fr) Procédé de commande de climatiseur, climatiseur, et support de stockage lisible par ordinateur
WO2017164712A1 (fr) Réfrigérateur et son procédé de commande
WO2018174432A1 (fr) Réfrigérateur
WO2020111688A1 (fr) Réfrigérateur et procédé de commande associé
WO2022010112A1 (fr) Procédé pour la commande d'un réfrigérateur ayant un élément peltier, et réfrigérateur l'utilisant
WO2020111680A1 (fr) Réfrigérateur et son procédé de commande
WO2020027596A1 (fr) Procédé de commande de réfrigérateur
WO2021256677A1 (fr) Appareil électronique et son procédé de commande
WO2017105047A1 (fr) Réfrigérateur et son procédé de commande
AU2018286352B2 (en) Refrigerator and method of controlling the same
WO2021256692A1 (fr) Réfrigérateur et son procédé de commande
AU2018295870B2 (en) Refrigerator and method of controlling the same
EP4090896A1 (fr) Réfrigérateur
WO2022270772A1 (fr) Réfrigérateur
AU2016316427B2 (en) Refrigerator
WO2019164115A1 (fr) Réfrigérateur et son procédé de commande

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 21838305

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 21838305

Country of ref document: EP

Kind code of ref document: A1