WO2022008787A1 - Injection molding method with a film insert - Google Patents

Injection molding method with a film insert Download PDF

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Publication number
WO2022008787A1
WO2022008787A1 PCT/FI2020/050490 FI2020050490W WO2022008787A1 WO 2022008787 A1 WO2022008787 A1 WO 2022008787A1 FI 2020050490 W FI2020050490 W FI 2020050490W WO 2022008787 A1 WO2022008787 A1 WO 2022008787A1
Authority
WO
WIPO (PCT)
Prior art keywords
injection molding
film insert
mold
molding method
connector
Prior art date
Application number
PCT/FI2020/050490
Other languages
French (fr)
Inventor
Markus Tuomikoski
Sami Ihme
Timo KURKELA
Original Assignee
Teknologian Tutkimuskeskus Vtt Oy
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Teknologian Tutkimuskeskus Vtt Oy filed Critical Teknologian Tutkimuskeskus Vtt Oy
Priority to PCT/FI2020/050490 priority Critical patent/WO2022008787A1/en
Publication of WO2022008787A1 publication Critical patent/WO2022008787A1/en

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14467—Joining articles or parts of a single article
    • B29C45/14508—Joining juxtaposed sheet-like articles, e.g. for making trim panels
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14065—Positioning or centering articles in the mould
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14778—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles the article consisting of a material with particular properties, e.g. porous, brittle
    • B29C45/14811—Multilayered articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/26—Moulds
    • B29C45/27—Sprue channels ; Runner channels or runner nozzles
    • B29C45/2701—Details not specific to hot or cold runner channels
    • B29C45/2708—Gates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14065—Positioning or centering articles in the mould
    • B29C2045/14139—Positioning or centering articles in the mould positioning inserts having a part extending into a positioning cavity outside the mould cavity
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C2045/1486—Details, accessories and auxiliary operations
    • B29C2045/14942—Floating inserts, e.g. injecting simultaneously onto both sides of an insert through a pair of opposed gates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/26—Moulds
    • B29C45/27—Sprue channels ; Runner channels or runner nozzles
    • B29C45/2701—Details not specific to hot or cold runner channels
    • B29C45/2708—Gates
    • B29C2045/2714—Gates elongated, e.g. film-like, annular
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
    • B29L2031/3475—Displays, monitors, TV-sets, computer screens
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
    • B29L2031/36—Plugs, connectors, or parts thereof

Definitions

  • the present invention relates to a plastic injection molding method for manufacturing structures comprising electronic film component.
  • Electronic plastic components comprising electric conductive parts embedded in side the plastic portion of part are typically cast at two casting stages with injection casting.
  • This so called 2K or ‘two-shot’ injection molding also allows the use of two different polymers for example with different properties, colors or levels of hardness to be processed into one end product in one injection molding process.
  • One of the major advantages of the 2K injection molding is that the polymer to be injected is still hot and has not shrunk yet, which virtually excludes the risk of burrs being formed on the second polymer component. In addition, the surface is still 'vir- ginally' clean, enabling good molecular adhesion between the portions.
  • Another sig nificant advantage of 2K injection molding is the cycle time gained, the constant process and the fact that manual insertion is not required, thus avoiding the risk of damaging the first polymer component.
  • 2K injection molding typically requires two cavities in the mold for the polymer(s), and turning of the mold when changing the polymer to be injection molded. This causes the mold costs to increase and additional process steps in the injection molding. Further, the 2K injection molding method is difficult to implement for components comprising flexible electronics.
  • the present invention provides a solution for injection molding of a component com prising two sides with embedded conductive film insert and with flexible electronics at least partially embedded in the component with a single injection molding phase or step. This allows for simpler mold structure and faster manufacturing process of the components.
  • the conductive film insert is utilized for dividing the flow of the polymer material in the injection molding to different sides of the film insert in order to obtain full and seamless embedding of the film insert inside the polymer material. This enhances the mechanical durability of the manufactured component especially in relation of flex-to-flex and flex-to-rigid interconnections within the man ufactured component.
  • an injection mold is prepared, which mold comprises a mold space for injection molding of a polymer material, into which mold space a portion of at least one electrical component is inserted before the injection molding in a single molding phase, wherein the mold space is equipped with an electrically conductive film insert, which film insert is electrically connected to the at least one electrical component, and wherein the side edge of the film insert divides the flow of injected polymer material on both sides of the film insert during the injection molding phase.
  • Suitable polymer material for the injection molding of the present invention include polymer-based thermoplastic and thermoplastic elastomer resins, for example.
  • additional support for the film insert is provided within the mold space for keeping the film insert at its place during the injection molding of the polymer material.
  • This additional support is preferably provided with support pins connected to the surfaces of the said mold space and extending through the film insert.
  • the injection molding is implemented via cold runner.
  • Another option is to use a hot runner that allows controlling of the temperature of the injected polymer material.
  • a connector piece is inserted in the mold space and electrically connected to the film insert before injection molding phase.
  • the connector piece is preferably an USB connector, which is preferably embedded inside the injection molded portion of the component with the exception of its connector surface via which surface a mating USB plug is in serted in the connector.
  • the connector piece may be connected to the conductive film insert with an electrically conductive adhesive, for example.
  • the connector piece may alternatively be any other connector having size that fits inside the piece to be cast, being panel mountable, and having flat surface to be set against the core used for fixing and supporting the connector piece in the mold.
  • the connector piece should preferably also have sufficiently sealed outer surface so that the melt polymer material does not penetrate inside the connector piece during cast ing or the core used in fixing and supporting the connector piece in the mold must also cover at least the electrical contact surfaces of the connector piece.
  • These al ternative connector pieces include FFC connectors (Flat Flexible Cable), all forms of USB connectors, FIDMI connectors, any female/male sockets of rectangular con nectors, for example.
  • the conductive film insert is plastic film with printed conductive material.
  • the conduc tive film insert may be formed of a 125 pm thick polyethylene terephthalate (PET) foil with screen printed silver ink.
  • the electrical component is an OLED display.
  • the electrical component can be a solar module, a thin film battery, a printed circuit board or a sensor node, for exam ple.
  • Figures 1A and 1 B show schematically an embodiment of an injection molded structure of the invention manufactured with a method of the invention
  • Figures 2A and 2B show schematically an equipped mold for the injection molding method of the invention.
  • Figures 1 A and 1 B show schematically an embodiment of an injection molded struc ture 1 of the invention, which comprises an injection molded portion 2, an electrical component 3, which in this embodiment is an OLED display, a connector piece 4, which in this embodiment is an USB connector, and an electrically conductive film insert 5.
  • the electrically conductive film insert 5 connects electrically the connector piece 4 to the electrical component 3, and is completely embedded inside the injection molded portion 2 of the structure 1. Further, the connector piece 4, with the excep tion of its connecting surface, and the portion of the electrical component 3 contain ing the connection area between the electrical component and the film insert 5, are also located inside the injection molded portion 2 of the structure 1 .
  • the electrically conductive film insert 5 is formed in this embodiment from a 125 pm thick polyethylene terephthalate (PET) foil with screen printed silver ink.
  • PET polyethylene terephthalate
  • the connector piece 4 is fixed to the film insert 5 with electrically conductive adhe sive.
  • the electrical component 3 is fixed to the film insert 5 for example also with electrically conductive adhesive.
  • the injection molded portion 2 which is injection molded in single molding stage, provides enhanced environmental protection and mechanical dura bility for the connections between the film insert 5 and the electrical component 3, and between the film insert 5 and the connector piece 4.
  • FIGS 2A and 2B show schematically an equipped mold 11 for injection molding of the structure shown in figures 2A and 2B.
  • the mold 11 comprises a mold space 12 for injection molding of the injection molded portion 2 of figures 1A and 1 B, to which mold space the polymer is injected via cold runner 13.
  • the electrical component 3 and the connector piece 4 are fixed to the electrically conductive film insert 5, and the thus formed entity is placed in the mold 11 .
  • the connector piece 4 is fixed and supported with connector support core 14 via the contact surface of the connector piece.
  • the connector support core 14 preferably also extends inside the connector piece 4 and fills it or at least covers the electrical contact surfaces of the connector piece, so that the injected melt polymer material cannot penetrate inside the connector piece and cover the electrical contact surfaces during the casting.
  • the film insert 5 is supported in the area of the mold space 12 with pins 15a-15c in order to keep the film insert at its place in the mold during the injection molding phase.
  • the mold 11 is closed and the injection molding phase is carried out, during which injection molding phase the film insert 5 divides the polymer material flow from the cold runner 13 on both sides of the film insert 5 within the mold space 12.
  • the injection molding is carried out until the mold space 12 is filled in order to form the injection molded portion 2 as shown in figures 1A and 1 B.
  • a ready end product is obtained, which in this case is the injection molded structure 1 shown in figures 1A and 1 B.

Abstract

Injection molding method, in which method an injection mold (11) is prepared, which mold comprises mold space (12) for injection molding of a polymer material, into which mold space a portion of at least one electrical component (3) is inserted before the injection molding in a single molding phase, wherein the mold space (12) is equipped with an electrically conductive film insert (5), which film insert is electrically connected to the at least one electrical component (3), and wherein the side edge of the film insert (5) divides the flow of injected polymer material on both sides of the film insert during the injection molding phase.

Description

INJECTION MOLDING METHOD WITH A FILM INSERT
The present invention relates to a plastic injection molding method for manufacturing structures comprising electronic film component.
Electronic plastic components comprising electric conductive parts embedded in side the plastic portion of part are typically cast at two casting stages with injection casting. This so called 2K or ‘two-shot’ injection molding also allows the use of two different polymers for example with different properties, colors or levels of hardness to be processed into one end product in one injection molding process.
One of the major advantages of the 2K injection molding is that the polymer to be injected is still hot and has not shrunk yet, which virtually excludes the risk of burrs being formed on the second polymer component. In addition, the surface is still 'vir- ginally' clean, enabling good molecular adhesion between the portions. Another sig nificant advantage of 2K injection molding is the cycle time gained, the constant process and the fact that manual insertion is not required, thus avoiding the risk of damaging the first polymer component.
2K injection molding, however, typically requires two cavities in the mold for the polymer(s), and turning of the mold when changing the polymer to be injection molded. This causes the mold costs to increase and additional process steps in the injection molding. Further, the 2K injection molding method is difficult to implement for components comprising flexible electronics.
The present invention provides a solution for injection molding of a component com prising two sides with embedded conductive film insert and with flexible electronics at least partially embedded in the component with a single injection molding phase or step. This allows for simpler mold structure and faster manufacturing process of the components.
In the present invention the conductive film insert is utilized for dividing the flow of the polymer material in the injection molding to different sides of the film insert in order to obtain full and seamless embedding of the film insert inside the polymer material. This enhances the mechanical durability of the manufactured component especially in relation of flex-to-flex and flex-to-rigid interconnections within the man ufactured component.
In the injection molding method of the invention an injection mold is prepared, which mold comprises a mold space for injection molding of a polymer material, into which mold space a portion of at least one electrical component is inserted before the injection molding in a single molding phase, wherein the mold space is equipped with an electrically conductive film insert, which film insert is electrically connected to the at least one electrical component, and wherein the side edge of the film insert divides the flow of injected polymer material on both sides of the film insert during the injection molding phase.
Suitable polymer material for the injection molding of the present invention include polymer-based thermoplastic and thermoplastic elastomer resins, for example.
In an embodiment of the injection molding method of the invention additional support for the film insert is provided within the mold space for keeping the film insert at its place during the injection molding of the polymer material. This additional support is preferably provided with support pins connected to the surfaces of the said mold space and extending through the film insert.
In an embodiment of the injection molding method of the invention the injection molding is implemented via cold runner. Another option is to use a hot runner that allows controlling of the temperature of the injected polymer material.
In an embodiment of the injection molding method of the invention a connector piece is inserted in the mold space and electrically connected to the film insert before injection molding phase. The connector piece is preferably an USB connector, which is preferably embedded inside the injection molded portion of the component with the exception of its connector surface via which surface a mating USB plug is in serted in the connector. The connector piece may be connected to the conductive film insert with an electrically conductive adhesive, for example.
The connector piece may alternatively be any other connector having size that fits inside the piece to be cast, being panel mountable, and having flat surface to be set against the core used for fixing and supporting the connector piece in the mold. The connector piece should preferably also have sufficiently sealed outer surface so that the melt polymer material does not penetrate inside the connector piece during cast ing or the core used in fixing and supporting the connector piece in the mold must also cover at least the electrical contact surfaces of the connector piece. These al ternative connector pieces include FFC connectors (Flat Flexible Cable), all forms of USB connectors, FIDMI connectors, any female/male sockets of rectangular con nectors, for example. In an embodiment of the injection molding method of the invention the conductive film insert is plastic film with printed conductive material. For example, the conduc tive film insert may be formed of a 125 pm thick polyethylene terephthalate (PET) foil with screen printed silver ink.
In an embodiment of the injection molding method of the invention the electrical component is an OLED display. Alternatively, the electrical component can be a solar module, a thin film battery, a printed circuit board or a sensor node, for exam ple.
More precisely the features defining an injection molding method in accordance with the present invention are presented in claim 1 . Dependent claims present advanta geous features and embodiments of the invention.
Exemplifying embodiment of the invention and its advantages are explained in greater detail below in the sense of example and with reference to accompanying drawings, where
Figures 1A and 1 B show schematically an embodiment of an injection molded structure of the invention manufactured with a method of the invention, and
Figures 2A and 2B show schematically an equipped mold for the injection molding method of the invention.
Figures 1 A and 1 B show schematically an embodiment of an injection molded struc ture 1 of the invention, which comprises an injection molded portion 2, an electrical component 3, which in this embodiment is an OLED display, a connector piece 4, which in this embodiment is an USB connector, and an electrically conductive film insert 5.
The electrically conductive film insert 5 connects electrically the connector piece 4 to the electrical component 3, and is completely embedded inside the injection molded portion 2 of the structure 1. Further, the connector piece 4, with the excep tion of its connecting surface, and the portion of the electrical component 3 contain ing the connection area between the electrical component and the film insert 5, are also located inside the injection molded portion 2 of the structure 1 .
The electrically conductive film insert 5 is formed in this embodiment from a 125 pm thick polyethylene terephthalate (PET) foil with screen printed silver ink. The connector piece 4 is fixed to the film insert 5 with electrically conductive adhe sive. The electrical component 3 is fixed to the film insert 5 for example also with electrically conductive adhesive.
In this embodiment the injection molded portion 2, which is injection molded in single molding stage, provides enhanced environmental protection and mechanical dura bility for the connections between the film insert 5 and the electrical component 3, and between the film insert 5 and the connector piece 4.
Figures 2A and 2B show schematically an equipped mold 11 for injection molding of the structure shown in figures 2A and 2B.
The mold 11 comprises a mold space 12 for injection molding of the injection molded portion 2 of figures 1A and 1 B, to which mold space the polymer is injected via cold runner 13.
Before the injection molding, the electrical component 3 and the connector piece 4 are fixed to the electrically conductive film insert 5, and the thus formed entity is placed in the mold 11 . In the mold 11 , the connector piece 4 is fixed and supported with connector support core 14 via the contact surface of the connector piece. The connector support core 14 preferably also extends inside the connector piece 4 and fills it or at least covers the electrical contact surfaces of the connector piece, so that the injected melt polymer material cannot penetrate inside the connector piece and cover the electrical contact surfaces during the casting. The film insert 5 is supported in the area of the mold space 12 with pins 15a-15c in order to keep the film insert at its place in the mold during the injection molding phase.
Once these preparatory steps are done, the mold 11 is closed and the injection molding phase is carried out, during which injection molding phase the film insert 5 divides the polymer material flow from the cold runner 13 on both sides of the film insert 5 within the mold space 12. The injection molding is carried out until the mold space 12 is filled in order to form the injection molded portion 2 as shown in figures 1A and 1 B.
After the injection molding phase, a ready end product is obtained, which in this case is the injection molded structure 1 shown in figures 1A and 1 B.
The specific exemplifying embodiment of the invention shown in figures and dis cussed above should not be construed as limiting. A person skilled in the art can amend and modify the embodiment described in many evident ways within the scope of the attached claims. Thus, the invention is not limited merely to the em bodiment described above.

Claims

Claims
1. Injection molding method, in which method an injection mold (11 ) is pre-pared, which mold comprises mold space (12) for injection molding of a polymer material, into which mold space a portion of at least one electrical component (3) is inserted before the injection molding in a single molding phase, and the mold space (12) is equipped with an electrically conductive film insert (5), which film insert is electrically connected to the at least one electrical component, characterized in that the side edge of the film insert (5) divides the flow of injected polymer material on both sides of the film insert during the injection molding phase.
2. Injection molding method according to claim 1, wherein additional support
(15a-15c) for the film insert (5) is provided within the mold space (12) for keeping the film insert at its place during the injection molding of the polymer material.
3. Injection molding method according to claim 1 or 2, wherein the injection mold ing is implemented via a hot or cold runner.
4. Injection molding method according to any of claims 1-3, wherein connector piece (4) is inserted in the mold space (12) and electrically connected to the film insert (5) before injection molding phase.
5. Injection molding method according to claim 4, wherein the connector piece (4) is fixed to the mold (11) and supported therein with a connector support core (14), which extends inside the connector piece and covers at least the electrical contact surfaces inside the connector piece.
6. Injection molding method according to claim 4 or 5, wherein the connector piece (4) is an USB connector, a FFC connector or a FIDMI connector.
7. Injection molding method according to any of claims 1 -6, wherein the conduc- tive film insert (5) is a plastic film with printed conductive material.
8. Injection molding method according to any of claims 1 -7, wherein the electrical component (3) is an OLED display, a solar module, a thin film battery, a print-ed circuit board or a sensor node.
PCT/FI2020/050490 2020-07-09 2020-07-09 Injection molding method with a film insert WO2022008787A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PCT/FI2020/050490 WO2022008787A1 (en) 2020-07-09 2020-07-09 Injection molding method with a film insert

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/FI2020/050490 WO2022008787A1 (en) 2020-07-09 2020-07-09 Injection molding method with a film insert

Publications (1)

Publication Number Publication Date
WO2022008787A1 true WO2022008787A1 (en) 2022-01-13

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0521492A (en) * 1991-07-10 1993-01-29 Mitsubishi Kasei Corp Resin sealing molding method for electric and electronic component and mold used for the method
JPH11254476A (en) * 1998-03-13 1999-09-21 Mitsubishi Eng Plast Corp Production of resin-sealed molded product of electric/ electronic part
DE102012208478A1 (en) * 2012-05-21 2013-11-21 Magna Exteriors & Interiors Management Gmbh Transmission element for contactless transmission of energy and/or data, has specific coil for transferring energy and/or data, which is brought into close contact with another coil by which transmission serving components are enclosed
EP2695717A1 (en) * 2012-08-07 2014-02-12 Hosiden Corporation Device module and method of manufacturing the device module
US20140307404A1 (en) * 2006-06-20 2014-10-16 Robert Singleton Embedded electronic Device and Method for Manufacturing an Embedded Electronic Device

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0521492A (en) * 1991-07-10 1993-01-29 Mitsubishi Kasei Corp Resin sealing molding method for electric and electronic component and mold used for the method
JPH11254476A (en) * 1998-03-13 1999-09-21 Mitsubishi Eng Plast Corp Production of resin-sealed molded product of electric/ electronic part
US20140307404A1 (en) * 2006-06-20 2014-10-16 Robert Singleton Embedded electronic Device and Method for Manufacturing an Embedded Electronic Device
DE102012208478A1 (en) * 2012-05-21 2013-11-21 Magna Exteriors & Interiors Management Gmbh Transmission element for contactless transmission of energy and/or data, has specific coil for transferring energy and/or data, which is brought into close contact with another coil by which transmission serving components are enclosed
EP2695717A1 (en) * 2012-08-07 2014-02-12 Hosiden Corporation Device module and method of manufacturing the device module

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