WO2022000852A1 - Capteur de vibrations - Google Patents

Capteur de vibrations Download PDF

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Publication number
WO2022000852A1
WO2022000852A1 PCT/CN2020/121263 CN2020121263W WO2022000852A1 WO 2022000852 A1 WO2022000852 A1 WO 2022000852A1 CN 2020121263 W CN2020121263 W CN 2020121263W WO 2022000852 A1 WO2022000852 A1 WO 2022000852A1
Authority
WO
WIPO (PCT)
Prior art keywords
cavity
circuit board
diaphragm
vibration sensor
hole
Prior art date
Application number
PCT/CN2020/121263
Other languages
English (en)
Chinese (zh)
Inventor
曾鹏
王凯
Original Assignee
瑞声声学科技(深圳)有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 瑞声声学科技(深圳)有限公司 filed Critical 瑞声声学科技(深圳)有限公司
Publication of WO2022000852A1 publication Critical patent/WO2022000852A1/fr

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Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/04—Microphones

Definitions

  • the utility model relates to the field of acoustic-electrical conversion, in particular to a vibration sensor used for bone conduction electronic products.
  • Vibration sensors are used to convert vibration signals into electrical signals.
  • Existing MEMS vibration sensors include a diaphragm assembly as a vibration sensing device and a MEMS microphone as a vibration detection device that converts vibration signals into electrical signals.
  • the vibration sensing device and the vibration detection device are integrated together, and because the MEMS microphone adopts piezoelectric or capacitive sensing, it can only be sensed under the condition of direct pressure contact, making it sensitive to low-frequency vibration less than 500Hz, but not sensitive to low-frequency vibration.
  • the high-frequency vibration greater than 1KHz has poor response, and it has better performance in the field of audio equipment.
  • the purpose of the utility model is to provide a vibration sensor with high sensitivity and good reliability.
  • the utility model provides a vibration sensor, which includes:
  • circuit board encloses a resonant cavity, and one side of the circuit board is provided with a through hole passing through it;
  • the casing cover is fixed on the circuit board and covers the through hole, and the casing and the circuit board together form a receiving cavity;
  • a MEMS microphone the MEMS microphone is accommodated in the accommodating cavity and is electrically connected to the circuit board, the MEMS microphone comprises a base fixed on the circuit board and having a back cavity, and is supported on the base away from a first diaphragm and a back plate at one end of the through hole; the base surrounds the through hole and makes the back cavity communicate with the through hole; the first diaphragm and the back plate are spaced apart forming a capacitive structure; and,
  • the diaphragm assembly is accommodated in the resonant cavity, and the resonant cavity is divided into a first cavity and a second cavity, and the first cavity is communicated with the back cavity through the through hole;
  • the casing is provided with a first pressure relief hole therethrough, the diaphragm assembly is provided with a second pressure relief hole therethrough, and the first cavity passes through the second pressure relief hole and the second pressure relief hole. cavity communication;
  • the diaphragm assembly vibrates and changes the air pressure in the resonant cavity.
  • the vibration sensor further includes an ASIC chip, and the ASIC chip is accommodated in the accommodating cavity and is electrically connected to the MEMS microphone.
  • the casing is provided with a first pressure relief hole passing through it, and the first pressure relief hole communicates the receiving cavity with the outside world;
  • the diaphragm assembly is provided with a second pressure relief hole passing through it. , the second pressure relief hole communicates the first cavity and the second cavity.
  • the casing includes a casing plate spaced apart from the circuit board and a side plate that is bent and extended toward the circuit board from a peripheral edge of the casing plate and fixed to the circuit board.
  • the pressing hole penetrates the outer shell plate.
  • the diaphragm assembly includes a gasket fixed on the circuit board and arranged around the through hole, and a second diaphragm fixed on the side of the gasket away from the through hole, the gasket, The second diaphragm and the circuit board together form the first cavity, and the second pressure relief hole penetrates the second diaphragm.
  • the diaphragm assembly further includes a mass block fixedly connected to the second diaphragm; the mass block is attached to a side of the second diaphragm close to the first cavity and/or the The second diaphragm is close to one side of the second cavity.
  • the mass blocks located on the same side of the second diaphragm include a plurality of mass block units spaced apart from each other.
  • the diaphragm assembly further includes a mass block wrapped and fixed by the second diaphragm.
  • the second diaphragm includes two second diaphragms fixed on the spacer and stacked on each other, and the mass block is sandwiched and wrapped between the two second diaphragms.
  • the orthographic projection area of the first diaphragm on the circuit board along the vibration direction is smaller than the orthographic projection area of the second diaphragm on the circuit board along the vibration direction.
  • a resonant cavity is formed by the circuit board, a through hole is provided on one side of the circuit board, and a diaphragm assembly is arranged in the resonant cavity to separate the resonant cavity into a shape.
  • a first cavity and a second cavity; the housing and the circuit board are arranged to jointly enclose a receiving cavity, and a MEMS microphone is arranged in the receiving cavity, and the MEMS microphone includes a base fixed on the circuit board and having a back cavity.
  • the base surrounds the through hole and makes the back cavity communicate with the through hole; the through hole connects the first cavity with the through hole The back cavity is communicated.
  • Fig. 1 is the three-dimensional structure schematic diagram of the vibration sensor of the present invention
  • Fig. 2 is the partial three-dimensional structure exploded schematic diagram of the vibration sensor of the present invention
  • FIG. 3 is a cross-sectional view of the first embodiment of the vibration sensor of the present invention along the line A-A in FIG. 1;
  • FIG. 4 is a schematic structural diagram of the second embodiment of the fixing method of the mass block and the second diaphragm of the vibration sensor in FIG. 3;
  • FIG. 5 is a schematic structural diagram of the third embodiment of the fixing method of the mass block and the second diaphragm of the vibration sensor in FIG. 3;
  • FIG. 6 is a schematic structural diagram of another embodiment after the structure of the mass block in FIG. 5 is changed;
  • FIG. 7 is a schematic structural diagram of a fourth embodiment of the way of fixing the mass block and the second diaphragm in the vibration sensor in FIG. 3 .
  • the present invention provides a vibration sensor 100 , which includes a circuit board 1 , a housing 2 , a MEMS microphone 3 and a diaphragm assembly 4 .
  • the circuit board 1 encloses a resonant cavity 10 , and one side of the circuit board 1 is provided with a through hole 11 extending therethrough.
  • the circuit board 1 is designed to be a hollow integral molding structure, and the resonant cavity 10 is formed inside; or, the circuit board 1 includes a two-layer structure of an upper-layer circuit board 12 and a lower-layer circuit board 13 arranged at intervals from each other , and a spacer 14 is arranged between the upper circuit board 12 and the lower circuit board 13 .
  • the upper circuit board 12 and the lower circuit board 13 are respectively fixed on opposite sides of the spacer 14 and together form the resonant cavity 10 .
  • the casing 2 is covered and fixed on the circuit board 1 and covers the through hole 11 , and the casing 2 and the circuit board 1 together enclose a receiving cavity 20 . That is, the through hole 11 communicates with the receiving cavity 20 .
  • the casing 2 includes a casing plate 21 opposite to the circuit board 1 at intervals, and a casing plate 21 that is bent and extended toward the circuit board 1 from the periphery of the casing plate 21 and is fixed to the circuit board 1 . side panel 22.
  • the MEMS (Microelectro Mechanical Systems) microphone 3 that is, a micro-electromechanical system microphone, which is accommodated in the accommodation cavity 20 and is electrically connected to the circuit board 1 .
  • the MEMS microphone 3 includes a base 31 fixed on the circuit board 1 and having a back cavity 30 , a first diaphragm 32 and a back plate 33 supported on an end of the base 31 away from the through hole 11 .
  • the first diaphragm 32 and the back plate 33 are spaced apart to form a capacitance structure.
  • the capacitance generated by the MEMS microphone 3 can be changed, thereby Realize changes in electrical signals.
  • the base 31 surrounds the through hole 11 and makes the back cavity 30 communicate with the through hole 11 .
  • the diaphragm assembly 4 is accommodated in the resonant cavity 10 and divides the resonant cavity 10 into a first cavity 101 and a second cavity 102 , and the first cavity 101 is connected to the back cavity through the through hole 11 . 30 connections.
  • the vibration component 4 vibrates and makes the air pressure in the resonant cavity 10. make a difference.
  • the change in air pressure causes the vibration of the first diaphragm 32 of the MEMS microphone 3 , which changes the distance between the first diaphragm 32 and the back plate 33 , that is, changes the capacitance generated by the MEMS microphone 3 . , so as to convert the vibration signal into an electrical signal, and transmit the converted electrical signal to the circuit board 1, so that the MEMS microphone 3 converts the external input vibration signal or pressure signal into an electrical signal, and realizes the conversion of the vibration signal into an electrical signal.
  • the side of the circuit board 1 and/or the casing 2 of the vibration sensor 100 is attached to the neck, and when a person speaks, the bone conduction transmits the vibration signal, so as to realize the above transformation process.
  • the MEMS microphone 3 detects the external input vibration signal through the internal air pressure change caused by the vibration of the diaphragm assembly 4, so that the MEMS microphone 3 can ensure the accurate detection of the air pressure change to the greatest extent, especially for high frequencies greater than 1KHz.
  • the vibration also has an accurate response, which effectively improves the sensitivity and reliability of the vibration sensor 100 .
  • the performance of the MEMS microphone 3 is relatively stable under different temperature conditions, its sensitivity is basically not affected by factors such as temperature, vibration, temperature and time, and the reliability is good and the stability is high. Because the MEMS microphone 3 can be subjected to high temperature reflow soldering at 260° C. and the performance is not affected, the basic performance with high accuracy can still be achieved without the audio debugging process after assembly.
  • the vibration sensor further includes an ASIC (Application Specific Integrated Circuit) chip 5 , and the ASIC chip 5 is accommodated in the accommodation cavity 20 and It is electrically connected with the MEMS microphone 3 .
  • the ASIC chip 5 provides an external bias for the MEMS microphone 3, and an effective bias will enable the MEMS microphone 3 to maintain stable acoustic sensitivity and electrical parameters in the entire operating temperature range, and can also support different sensitivities
  • the microphone structure design is more flexible and reliable.
  • the casing 2 is provided with a first pressure relief hole 23 penetrating the casing 2 .
  • the first pressure relief hole 23 is one and is provided through the casing plate 21 .
  • the setting of the first pressure relief hole 23 plays a role of positioning and balancing the air pressure, so that the vibration sensor 100 can be accurately installed in a specific position of the mobile device.
  • the shell plate 21 is attached and fixed to the interior of the mobile device through surface assembly technology, and the first pressure relief hole 23 is blocked to seal the accommodating cavity 20, which effectively avoids electromagnetic and radio frequency interference with external air conduction.
  • the acoustic signal interferes, thereby improving the high-frequency characteristic of the bone conduction sensitivity and frequency characteristic of the vibration sensor 100 .
  • the position and number of the first pressure relief holes 23 are not limited to this, and the principles are the same.
  • the diaphragm assembly 4 is provided with a second pressure relief hole 40 therethrough, and the second pressure relief hole 40 communicates the first cavity 101 and the second cavity 102 to balance all the The air pressures of the second cavity 102 and the first cavity 101 are balanced, that is, the air pressures of the second cavity 102 and the back cavity 30 are balanced.
  • the diaphragm assembly 4 includes a gasket 41 fixed on the circuit board 1 and disposed around the through hole 11 and a second diaphragm fixed on the side of the gasket 41 away from the through hole 11 42.
  • the spacer 41 , the second diaphragm 42 and the circuit board 1 together form the first cavity 101 . That is, the spacer 41 is used to space the second diaphragm 42 from the circuit board 1 to provide a vibration space.
  • the spacer 41 can also be integrally formed with the second diaphragm 42 .
  • the second pressure relief hole 40 is disposed through the second diaphragm 42 .
  • the position of the second pressure relief hole 40 is not limited to this, and the principle is the same.
  • the diaphragm assembly 4 further includes a mass block 43 fixedly connected to the second diaphragm 42 .
  • the mass block 43 is attached to the side of the second diaphragm 42 close to the first cavity 101 and/or the side of the second diaphragm 42 close to the second cavity 102 .
  • the mass block 43 is attached to the side of the second diaphragm 42 close to the first cavity 101 .
  • the mass block 43 , the second diaphragm 42 and the spacer 41 are all located in the resonant cavity 10 of the circuit board 1 , which saves space and facilitates production.
  • the orthographic projection area of the first diaphragm 32 on the circuit board 1 along the vibration direction is smaller than the orthographic projection area of the second diaphragm 42 on the circuit board 1 along the vibration direction.
  • the contact area between the second diaphragm 42 and the gas in the resonant cavity 10 is larger, so that it can vibrate the gas better. Speaker-induced PCB noise results in lower vibration coupling, better acoustic performance, and ease of use.
  • FIG. 4 is a schematic structural diagram of the second embodiment of the fixing mode of the mass block and the second diaphragm of the vibration sensor in the embodiment of FIG. 3 .
  • the difference between the vibration sensor 200 of this embodiment is that the mass block 243 is attached to the side of the second diaphragm 242 close to the second cavity 2102 .
  • the modification of this embodiment reduces the occupation of the volume of the first cavity 2101 by the mass 243 , increases the volume of the first cavity 2101 , and further improves the sensitivity of the vibration sensor 200 .
  • the basis is the same as that of the above-mentioned embodiment shown in FIG. 1 , and details are not repeated here.
  • FIG. 5 is a schematic structural diagram of the third embodiment of the fixing method of the mass block and the second diaphragm of the vibration sensor in FIG. 3 .
  • the difference between the vibration sensor 300 of this embodiment is that the mass block 343 is attached to the side of the second diaphragm 342 close to the first cavity 3101 and the second diaphragm 342 is close to the second diaphragm 342 one side of cavity 3102. That is, the mass blocks 343 include two groups, which are respectively attached to opposite sides of the second diaphragm 342 .
  • This structural design further increases the inertia of the vibration component 34, thereby further improving the sensitivity.
  • the basis is the same as that of the above-mentioned embodiment shown in FIG. 1 , and details are not repeated here.
  • FIG. 6 is a schematic structural diagram of another embodiment after the structure of the mass block in FIG. 5 is changed.
  • the mass 443 located on the same side of the second diaphragm 442 includes a plurality of mass units 4431 spaced apart from each other.
  • This structure is also designed to increase the inertia of the diaphragm assembly 44 to further improve the sensitivity, and, compared with the embodiment shown in FIG. 5, this structure can also increase the compliance of the second diaphragm 442, so that the second diaphragm 442 can The membrane 442 is more susceptible to vibration, further increasing the sensitivity of the vibration sensor 400 .
  • the basis is the same as that of the above-mentioned embodiment shown in FIG. 3 , and details are not repeated here.
  • FIG. 7 is a schematic structural diagram of the fourth embodiment of the fixing method of the mass block and the diaphragm in FIG. 3 .
  • the main difference is that the mass block 543 is wrapped by the second diaphragm 542 to form a fixation.
  • the second diaphragm 542 includes two second sub-diaphragms 5421 fixed on the spacer 541 and stacked on each other, and the mass block 543 is sandwiched and wrapped around the two second sub-diaphragms Between 5421.
  • This structural design increases the fixing strength of the mass block 543 and further improves the reliability.
  • a resonant cavity is formed by the circuit board, a through hole is provided on one side of the circuit board, and a diaphragm assembly is arranged in the resonant cavity to separate the resonant cavity into a shape.
  • a first cavity and a second cavity; the housing and the circuit board are arranged to jointly enclose a receiving cavity, and a MEMS microphone is arranged in the receiving cavity, and the MEMS microphone includes a base fixed on the circuit board and having a back cavity.
  • the diaphragm assembly is accommodated in the resonant cavity of the circuit board, which saves space and facilitates production; and the MEMS microphone can better sense the vibration generated by the vibration assembly, and convert the induced vibration signal into an electrical signal, thereby It achieves better vibration response to both high-frequency vibration and low-frequency vibration transmitted by the resonant cavity, and effectively improves the sensitivity.
  • the basis is the same as that of the above-mentioned embodiment shown in FIG. 1 , and details are not repeated here.

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
  • Micromachines (AREA)

Abstract

Le présent modèle d'utilité concerne un capteur de vibrations. Le capteur de vibrations comprend : une carte de circuit imprimé ayant une cavité résonnante, un côté de la carte de circuit imprimé étant muni d'un trou traversant pénétrant à travers la carte de circuit imprimé ; un boîtier, le boîtier étant fixé à la carte de circuit imprimé de manière à la recouvrir et recouvrant le trou traversant, et le boîtier et la carte de circuit imprimé définissant conjointement une cavité de logement ; un microphone MEMS logé dans la cavité de logement et connecté électriquement à la carte de circuit imprimé, le microphone MEMS comprenant une base fixée à la carte de circuit imprimé et ayant une cavité arrière, un premier diaphragme supporté à l'extrémité de la base éloignée de la carte de circuit imprimé, et une carte d'électrode arrière, dans lequel la base entoure le trou traversant et permet à la cavité arrière et au trou traversant de communiquer, et le premier diaphragme est espacé de la carte d'électrode arrière pour former une structure de condensateur ; et un ensemble de membrane qui est logé dans la cavité résonante et divise la cavité résonante en une première cavité et une seconde cavité, la première cavité et la cavité arrière étant mises en communication au moyen du trou traversant. Lorsqu'un signal de vibration ou de pression est introduit depuis le côté de la carte de circuit imprimé éloigné de la cavité résonnante, la membrane vibre et fait varier la pression de l'air dans la cavité résonnante. Par rapport à l'art apparenté, le capteur de vibrations du présent modèle d'utilité présente une plus grande sensibilité et une meilleure fiabilité.
PCT/CN2020/121263 2020-06-30 2020-10-15 Capteur de vibrations WO2022000852A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN202021263190.3 2020-06-30
CN202021263190.3U CN218679382U (zh) 2020-06-30 2020-06-30 振动传感器

Publications (1)

Publication Number Publication Date
WO2022000852A1 true WO2022000852A1 (fr) 2022-01-06

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PCT/CN2020/121263 WO2022000852A1 (fr) 2020-06-30 2020-10-15 Capteur de vibrations

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CN (1) CN218679382U (fr)
WO (1) WO2022000852A1 (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114501253A (zh) * 2022-01-25 2022-05-13 青岛歌尔智能传感器有限公司 振动传感器及电子设备
WO2023164905A1 (fr) * 2022-03-03 2023-09-07 上海禹点电子科技有限公司 Siège de véhicule à moteur ayant une fonction d'ajustement de rythme et module ayant une fonction d'ajustement de rythme

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117459867A (zh) * 2023-12-07 2024-01-26 瑞声光电科技(常州)有限公司 麦克风

Citations (5)

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Publication number Priority date Publication date Assignee Title
US20170156002A1 (en) * 2015-12-01 2017-06-01 Apple Inc. Integrated mems microphone and vibration sensor
CN108513241A (zh) * 2018-06-29 2018-09-07 歌尔股份有限公司 振动传感器和音频设备
CN209314103U (zh) * 2019-03-27 2019-08-27 歌尔科技有限公司 振动传感器和音频设备
CN209659621U (zh) * 2019-03-27 2019-11-19 歌尔科技有限公司 振动传感器和音频设备
CN111131988A (zh) * 2019-12-30 2020-05-08 歌尔股份有限公司 振动传感器和音频设备

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20170156002A1 (en) * 2015-12-01 2017-06-01 Apple Inc. Integrated mems microphone and vibration sensor
CN108513241A (zh) * 2018-06-29 2018-09-07 歌尔股份有限公司 振动传感器和音频设备
CN209314103U (zh) * 2019-03-27 2019-08-27 歌尔科技有限公司 振动传感器和音频设备
CN209659621U (zh) * 2019-03-27 2019-11-19 歌尔科技有限公司 振动传感器和音频设备
CN111131988A (zh) * 2019-12-30 2020-05-08 歌尔股份有限公司 振动传感器和音频设备

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114501253A (zh) * 2022-01-25 2022-05-13 青岛歌尔智能传感器有限公司 振动传感器及电子设备
CN114501253B (zh) * 2022-01-25 2023-10-03 青岛歌尔智能传感器有限公司 振动传感器及电子设备
WO2023164905A1 (fr) * 2022-03-03 2023-09-07 上海禹点电子科技有限公司 Siège de véhicule à moteur ayant une fonction d'ajustement de rythme et module ayant une fonction d'ajustement de rythme

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