WO2021261488A1 - Feuille de câblage - Google Patents

Feuille de câblage Download PDF

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Publication number
WO2021261488A1
WO2021261488A1 PCT/JP2021/023605 JP2021023605W WO2021261488A1 WO 2021261488 A1 WO2021261488 A1 WO 2021261488A1 JP 2021023605 W JP2021023605 W JP 2021023605W WO 2021261488 A1 WO2021261488 A1 WO 2021261488A1
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WO
WIPO (PCT)
Prior art keywords
cured product
wiring sheet
product layer
sheet
linear body
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PCT/JP2021/023605
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English (en)
Japanese (ja)
Inventor
孝至 森岡
雅春 伊藤
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リンテック株式会社
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Priority to JP2022532497A priority Critical patent/JP7345658B2/ja
Publication of WO2021261488A1 publication Critical patent/WO2021261488A1/fr

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/02—Physical, chemical or physicochemical properties
    • B32B7/025—Electric or magnetic properties
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/20—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater

Definitions

  • the present invention relates to a wiring sheet.
  • a sheet-shaped conductive member having a pseudo-sheet structure in which a plurality of conductive linear bodies are arranged at intervals (hereinafter, also referred to as "conductive sheet") is used for a heating element of a heating device, a material for a textile that generates heat, and a display. It may be used as a member of various articles such as a protective film (crush prevention film).
  • a sheet used for the use of a heating element for example, Patent Document 1 describes a conductive sheet having a pseudo-sheet structure in which a plurality of linear bodies extending in one direction are arranged at intervals. By providing a pair of electrodes at both ends of the plurality of linear bodies, a wiring sheet that can be used as a heating element can be obtained.
  • This wiring sheet is required to be thin or highly breathable depending on the application.
  • the wiring sheet described in Patent Document 1 forms a pseudo-sheet structure on the base material.
  • the base material needs to have a certain thickness, so that there is a limit to reducing the thickness. Further, there is also a problem that the air permeability of the wiring sheet is lowered due to the fact that this base material blocks air.
  • An object of the present invention is to provide a wiring sheet having a sufficiently thin thickness, self-supporting property and high air permeability.
  • the wiring sheet according to one aspect of the present invention includes a pseudo-sheet structure in which a plurality of conductive linear bodies are arranged at intervals, a first cured product layer covering the conductive linear bodies, and the conductive linear body.
  • the first cured product layer is composed of a cured product of the agent, and the region corresponding to at least a part of the region in which the conductive linear body of the pseudo-sheet structure does not exist in the plan view of the wiring sheet. It is characterized in that a gap is provided.
  • the area ratio of the voids is 15% or more with respect to 100% of the entire surface of the pseudo-sheet structure in the plan view of the wiring sheet.
  • the first cured product layer, the pseudo-sheet structure, the electrodes, and the second cured product layer are provided in this order in the thickness direction of the wiring sheet. It is preferable that it is.
  • the process film is laminated on at least one surface of the surface having the first cured product layer and the surface having the second cured product layer. preferable.
  • the conductive linear body has a wavy shape in a plan view of the wiring sheet.
  • the first cured product layer is made of a cured product of a curable adhesive, and the storage elastic modulus of the first cured product layer at 23 ° C. is 5.0 ⁇ . It is preferably 10 6 Pa or more.
  • the thickness of the first cured product layer is preferably 5 ⁇ m or more and 50 ⁇ m or less.
  • the first step film is optionally laminated on the surface having the first cured product layer
  • the second step film is optionally laminated on the surface having the second cured product layer.
  • the total thickness of the first step film, the first cured product layer, the pseudo-sheet structure, the electrodes, the second cured product layer, and the layers other than the second step film in the wiring sheet is the total thickness. It is preferably 10 ⁇ m or less.
  • the wiring sheet 100 includes a pseudo-sheet structure 2, a first cured product layer 3, a pair of electrodes 4, and a second cured product layer 5. ing. Specifically, the first cured product layer 3, the pseudo-sheet structure 2, the electrode 4, and the second cured product layer 5 are provided in this order in the thickness direction of the wiring sheet 100. One of the electrodes 4 is electrically connected to the conductive linear body 21 in the pseudo-sheet structure 2. The first cured product layer 3 and the second cured product layer 5 are each made of a cured product of a curable adhesive. Further, the first cured product layer 3 is provided with a gap in a region corresponding to at least a part of a region in which the conductive linear body 21 of the pseudo-sheet structure 2 does not exist in the plan view of the wiring sheet 100. There is.
  • the electrode 4 is connected to all the conductive linear bodies 21, so that at least the connection thereof.
  • the first cured product layer 3 is also connected to the second cured product layer 5 (see FIGS. 1 and 2). Therefore, it is easy to maintain the surface shape of the wiring sheet 100 while having high air permeability.
  • the first cured product layer 3 and the second cured product layer 5 are familiar with the conductive linear body 21 and the electrode 4 constituting the pseudo-sheet structure 2 before curing, and have independence after curing.
  • the wiring sheet 100 as a whole has at least the first cured product layer 3 and the second cured product layer 5, the independence can be ensured, so that the thickness of the wiring sheet 100 can be reduced. can. Further, when the conductive linear body 21 and the electrode 4 are in direct contact with each other, contact pressure is applied to the contact portion from both sides by the first cured product layer 3 and the second cured product layer 5, so that the conductor is conductive. Good electrical contact between the sex line 21 and the electrode 4 is maintained. Further, it is easy to adjust the flexibility of the first cured product layer 3 according to the degree of curing of the first cured product layer 3 to impart flexibility or extensibility to the wiring sheet 100 as a whole.
  • Wiring sheet 100 from the viewpoint of breathability, JIS-L1096: In the Frazier test described in 2010, the amount of air is preferably at 350cm 3 / (cm 2 ⁇ s ) or more, 450cm 3 / (cm 2 ⁇ It is more preferably s) or more and 2000 cm 3 / (cm 2 ⁇ s) or less, and further preferably 600 cm 3 / (cm 2 ⁇ s) or more and 1000 cm 3 / (cm 2 ⁇ s) or less.
  • the pseudo-sheet structure 2 is a structure in which a plurality of conductive linear bodies 21 which are linear by themselves are arranged at intervals from each other so as to form a surface shape as a whole.
  • the surface shape may be a flat surface or a curved surface.
  • the pseudo-sheet structure 2 can take both flat and curved shapes by bending and stretching.
  • the conductive linear body 21 is linear in the plan view of the wiring sheet 100.
  • the pseudo-sheet structure 2 has a structure in which a plurality of conductive linear bodies 21 are arranged in a direction orthogonal to the axial direction of the conductive linear body 21.
  • the conductive linear body 21 preferably has a wavy shape in the plan view of the wiring sheet 100.
  • the conductive linear body 21 may have a wave shape such as a sine wave, a rectangular wave, a triangular wave, or a sawtooth wave. If the pseudo-sheet structure 2 has such a structure, it is easy to extend the wiring sheet 100 in the axial direction of the conductive linear body 21, and the conductive linear body 21 at the time of extension can be easily extended. It is possible to suppress disconnection. When the conductive linear body 21 is stretched, the conductive linear body 21 has a sinusoidal wave shape from the viewpoint that the deformation in each portion of the conductive linear body 21 becomes uniform. Is preferable.
  • the volume resistivity of the conductive linear body 21 is preferably 1.0 ⁇ 10 -9 ⁇ ⁇ m or more and 1.0 ⁇ 10 -3 ⁇ ⁇ m or less, preferably 1.0 ⁇ 10 -8 ⁇ ⁇ m. It is more preferably 1.0 ⁇ 10 -4 ⁇ ⁇ m or less.
  • the measurement of the volume resistivity of the conductive linear body 21 is as follows. Silver paste is applied to both ends of the conductive linear body 21, the resistance of the portion having a length of 40 mm between the ends is measured, and the resistance value of the conductive linear body 21 is obtained.
  • the cross-sectional area (unit: m 2 ) of the conductive linear body 21 is multiplied by the above resistance value, and the obtained value is divided by the above measured length (0.04 m) to form a conductive linear body.
  • the volume resistivity of the body 21 is calculated. Further, if necessary, the conductive linear body 21 can be taken out from the wiring sheet 100 and the volume resistivity can be measured.
  • the shape of the cross section of the conductive linear body 21 is not particularly limited and may be polygonal, flat, elliptical, circular or the like, but from the viewpoint of compatibility with the adhesive or the like, elliptical or circular. Is preferable.
  • the thickness (diameter) D (see FIG. 2) of the conductive linear body 21 is preferably 5 ⁇ m or more and 75 ⁇ m or less.
  • the diameter D of the conductive linear body 21 shall be 8 ⁇ m or more and 60 ⁇ m or less from the viewpoint of suppressing an increase in sheet resistance and improving heat generation efficiency and dielectric breakdown resistance when the wiring sheet 100 is used as a heating element.
  • the major axis is in the same range as the diameter D described above.
  • the diameter D of the conductive linear body 21 is the diameter D of the conductive linear body 21 at five randomly selected points by observing the conductive linear body 21 of the pseudo-sheet structure 2 using a digital microscope. Is measured and used as the average value.
  • the distance L (see FIG. 2) between the conductive linear bodies 21 is preferably 0.3 mm or more and 25 mm or less, more preferably 0.5 mm or more and 18 mm or less, and 0.8 mm or more and 15 mm or less. Is even more preferable.
  • the conductive linear bodies 21 are densely packed to some extent, so that the resistance of the pseudo-sheet structure can be maintained low. Further, it is possible to improve the function of the wiring sheet 100, such as making the distribution of the temperature rise uniform when the wiring sheet 100 is used as a heating element.
  • the distance between the two adjacent conductive linear bodies 21 is measured by observing the conductive linear body 21 of the pseudo-sheet structure 2 using a digital microscope.
  • the distance between the two adjacent conductive linear bodies 21 is the length along the direction in which the conductive linear bodies 21 are arranged, and the two conductive linear bodies 21 face each other.
  • the length between the parts is an average value of the intervals between all the adjacent conductive linear bodies 21 when the arrangement of the conductive linear bodies 21 is unequally spaced.
  • the conductive linear body 21 is not particularly limited, but is preferably a linear body containing a metal wire (hereinafter, also referred to as “metal wire linear body”). Since the metal wire has high electrical conductivity, high handleability, and versatility, it is possible to reduce the resistance value of the pseudo-sheet structure 2 by applying the metal wire wire as the conductive wire 21. be. Further, since the metal wire has high thermal conductivity, when the wiring sheet 100 (pseudo-sheet structure 2) is applied as a heating element, rapid heat generation is likely to be realized. Further, as described above, it is easy to obtain a linear body having a small diameter. Examples of the conductive linear body 21 include a linear body containing carbon nanotubes and a linear body having a conductive coating on the yarn, in addition to the metal wire linear body.
  • the metal wire linear body may be a linear body made of one metal wire, or may be a linear body obtained by twisting a plurality of metal wires.
  • the metal wire includes metals such as copper, aluminum, tungsten, iron, molybdenum, nickel, titanium, silver and gold, or alloys containing two or more kinds of metals (for example, steel such as stainless steel and carbon steel, brass and phosphorus). Wires containing bronze, zirconium-copper alloys, beryllium copper, iron-nickel, nichrome, nickel-titanium, cantal, hasteroy, renium tungsten, etc.) can be mentioned. Further, as described later, it may be plated, or the surface may be coated with a carbon material or polymer described later. In particular, a wire containing tungsten, molybdenum, and one or more metals selected from alloys containing these is preferable from the viewpoint of forming the conductive linear body 21 having a low volume resistivity.
  • the wiring sheet 100 When the wiring sheet 100 is used as a sheet-shaped heater, if the conductive linear body 21 and the electrode 4 are in direct contact with each other, the wiring sheet 100 increases in contact resistance (resistance of the connection portion). Increased resistance may be a problem.
  • the conductive linear body 21 is a metal wire, and the metal wire is provided on a core wire made of a first metal and outside the core wire. It has a metal film made of a second metal different from the first metal, and the volume resistance of the first metal is 3.0 ⁇ 10 -6 [ ⁇ ⁇ cm] or more 5.0 ⁇ 10 -4. It is preferably [ ⁇ ⁇ cm] or less, and the standard electrode potential of the second metal is +0.34 V or more.
  • volume resistivity RM1 The volume resistivity of the first metal (hereinafter, also referred to as “volume resistivity RM1 ”) is 3.0 ⁇ 10 -6 [ ⁇ ⁇ cm] or more and 5.0 ⁇ 10 -4 [ ⁇ ⁇ cm] or less. It is preferable to have.
  • Second standard electrode potential of the metal (hereinafter, referred to as "standard electrode potential E M2") is preferably at least + 0.34 V.
  • the resistance of the connection portion between the metal wire and the electrode 4 can be reduced when the metal wire 4 is attached to the electrode 4 to generate heat. That is, according to such a configuration, it is possible to achieve a balance between the heat generation function as a heating element and the suppression of the formation of an oxide film on the surface of the metal wire.
  • the core wire is made of the first metal.
  • the first metal is a concept including an alloy.
  • the main component of the core wire is brass (first metal) which is an alloy.
  • First metal volume resistivity R M1 is, 3.0 ⁇ and at 10 -6 [ ⁇ ⁇ cm] or more 5.0 ⁇ 10 -4 [ ⁇ ⁇ cm ] or less, 3.5 ⁇ 10 -6 [ ⁇ ⁇ Cm] or more and preferably 1.5 ⁇ 10 -4 [ ⁇ ⁇ cm] or less, 4.0 ⁇ 10 -6 [ ⁇ ⁇ cm] or more and 9.0 ⁇ 10 -5 [ ⁇ ⁇ cm] or less It is more preferable to have.
  • the metal wire is likely to generate heat.
  • the first metal of the volume resistivity R M1 is at 3.0 ⁇ 10 -6 [ ⁇ ⁇ cm ] or more, the metal wire is likely to generate heat.
  • the first metal of the volume resistivity R M1 is at 5.0 ⁇ 10 -4 [ ⁇ ⁇ cm ] or less, the resistance between the electrodes when heat is generated is attached to the electrode tends to decrease. Therefore, the applied voltage required to obtain the same current can be reduced, and the safety of the finally obtained heat generating device is excellent.
  • R M1 is a known value at 25 ° C., Chemical Handbook (Fundamentals) Revised 4th Edition: is a value according to (Editor Chemical Society of Japan). The value of the Chemical Handbook volume resistivity of the alloy not listed in R M1 is a value alloy manufacturer disclosed.
  • EM1 standard electrode potentials of the metals that can be used as the first metal
  • EM1 most of the standard electrode potentials of the metals that can be used as the first metal
  • E M1 is less than +0.34V.
  • the use of the first metal standard electrode potential E M1 is less than + 0.34 V, as described above, the standard electrode potential E M2 of the second metal is in a predetermined range, An oxide film is less likely to form on the surface of the metal wire due to changes over time after manufacturing.
  • the standard electrode potential EM1 of the first metal is a material-specific value and is a known value.
  • the standard electrode potential EM1 of the first metal is determined by the following method. However, when the first metal is tungsten, the standard electrode potential of tungsten is estimated as follows. Since the potential when tungsten oxide (WO 2 ) is generated from tungsten (W) when water is present in the system is -0.12 V, the standard electrode potential of tungsten is less than +0.34 V. It is presumed to be. For alloys, the metal component with a small standard electrode potential is first corroded and ionized, so even a small amount of metal component with a small standard electrode potential is significantly lower than the metal component with a large standard electrode potential. Tends to show electrode potential.
  • the standard electrode potential of copper is +0.34
  • the standard electrode potential of zinc is -0.76V.
  • the standard electrode potential is set to less than +0.34V because it is attracted to the standard electrode potential side of zinc.
  • the core wire is not particularly limited as long as it is made of the first metal.
  • the first metal e.g., tungsten (5.7 ⁇ 10 -6), iron (6.5 ⁇ 10 -6), molybdenum (5.2 ⁇ 10 -6), nickel (6.8 ⁇ 10 - 6 ) and metals such as titanium (4.2 ⁇ 10-5).
  • the numerical value in parentheses is the volume resistivity of each metal (unit: ⁇ ⁇ cm).
  • Examples of the first metal include stainless steel (7.3 ⁇ 10-5 ), brass (7 ⁇ 10-6 ), phosphor bronze (7.8 ⁇ 10-6 ), and beryllium copper (7.7).
  • the first metal is preferably tungsten, molybdenum, nickel, or brass, and more preferably tungsten or molybdenum.
  • Brass is an alloy of copper and zinc, and is usually an alloy containing 60% or more and 95% or less of copper and 5% or more and 40% or less of zinc in terms of mass ratio.
  • the volume resistivity RM1 is preferable because it shows a low value while exceeding 3.0 ⁇ 10 -6 ⁇ ⁇ cm.
  • the metal film consists of a second metal.
  • the second metal is different from the first metal.
  • the second metal like the first metal, is a concept that includes alloys.
  • Second metal standard electrode potential E M2 of, + 0.34 V or more is preferably + 0.5V or more, more preferably + 0.7 V or more, more preferably + 1.0V or more ..
  • the upper limit of the standard electrode potential EM2 of the second metal is preferably +2.0 V or less, and more preferably + 1.6 V or less. If it is the second standard electrode potential E M2 metals + 0.34 V or higher, the resistance value increase of the wiring sheet 100 is less likely to occur.
  • a metal wire of the core wire is standard electrode potential E M2 coated with high gold, preventing formation of the oxide film, and neither is the connecting portion of the resistance between the metal wire and the electrode is improved.
  • the standard electrode potential EM2 of the second metal is a material-specific value.
  • the second volume resistivity R M2 of the metal, 2.0 ⁇ 10 -5 is preferably less than [ ⁇ ⁇ cm], more preferably less than 1.5 ⁇ 10 -5 [ ⁇ ⁇ cm ] , 3.0 ⁇ 10-6 [ ⁇ ⁇ cm], more preferably less than.
  • the lower limit of the second metal of the volume resistivity R M2 is preferably not 1.0 ⁇ 10 -6 [ ⁇ ⁇ cm ] or more.
  • Second volume resistivity R M2 of the metal is a known value at 25 ° C., Chemical Handbook (Fundamentals) Revised 4th Edition: is a value according to (Editor Chemical Society of Japan). The value of the Chemical Handbook volume resistivity R M2 alloys not listed are values alloy manufacturer disclosed.
  • Metal coating is made from a second metal, the standard electrode potential E M2 of the second metal is equal to + 0.34 V or higher is not particularly limited.
  • the second metal include gold, platinum, palladium, silver, copper and the like, as well as alloys and the like.
  • the alloy include alloys containing at least two metals selected from the group consisting of gold, platinum, palladium, silver, and copper.
  • the second metal consists of a group consisting of gold, platinum, palladium, silver and copper and the alloys mentioned above (an alloy containing at least two metals selected from the group consisting of gold, platinum, palladium, silver and copper). It is preferably at least one selected, and more preferably at least one selected from the group consisting of gold, platinum, palladium, and silver and the alloys.
  • the thickness of the metal film is preferably 0.01 ⁇ m or more and 3 ⁇ m or less, and more preferably 0.02 ⁇ m or more and 1 ⁇ m or less, from the viewpoint of reducing the resistance of the connection portion between the metal wire and the electrode. It is more preferably 0.03 ⁇ m or more and 0.7 ⁇ m or less.
  • the thickness of the metal film is measured, for example, by observing the cross section of the metal wire using an electron microscope (for example, manufactured by ZEISS, product number Cross Beam 550, etc.).
  • the metal wire may have an intermediate layer between the core wire and the metal film. Since the metal wire has an intermediate layer, it is possible to suppress the diffusion of the metal contained in the core wire. Since the core wire is protected by the intermediate layer, the characteristics of the core wire (volume resistivity, etc.) can be easily maintained.
  • the intermediate layer can be formed in the same manner as the metal film. Examples of the intermediate layer include a nickel layer, a nickel alloy layer, a tin layer, a tin alloy layer, a copper alloy layer, a niobium layer, a niobium alloy layer, a titanium layer, a titanium alloy layer, a molybdenum layer, a molybdenum alloy layer, a tungsten layer, and tungsten.
  • Examples thereof include a layer of a metal different from the second metal, such as an alloy layer, a palladium alloy layer, and a platinum alloy layer.
  • the thickness of the intermediate layer is preferably 0.01 ⁇ m or more and 1 ⁇ m or less, more preferably 0.02 ⁇ m or more and 1 ⁇ m or less, and further preferably 0.03 ⁇ m or more and 0.7 ⁇ m or less.
  • Examples of the metal wire include a metal wire coated with a carbon material.
  • the metal wire When the metal wire is coated with a carbon material, the metallic luster is reduced and it becomes easy to make the presence of the metal wire inconspicuous. Further, when the metal wire is covered with a carbon material, metal corrosion is suppressed.
  • Examples of the carbon material for coating the metal wire include amorphous carbon (for example, carbon black, activated carbon, hard carbon, soft carbon, mesoporous carbon, carbon fiber, etc.), graphite, fullerene, graphene, carbon nanotubes, and the like.
  • the carbon nanotube linear body is, for example, a carbon nanotube forest (a growth body in which a plurality of carbon nanotubes are grown on a substrate so as to be oriented in a direction perpendicular to the substrate, and is referred to as an “array”. It is obtained by pulling out carbon nanotubes in the form of a sheet from the end portion of (also), bundling the pulled out carbon nanotube sheets, and then twisting the bundle of carbon nanotubes. In such a manufacturing method, a ribbon-shaped carbon nanotube linear body is obtained when no twist is applied during twisting, and a filamentous linear body is obtained when twist is applied.
  • the ribbon-shaped carbon nanotube linear body is a linear body in which the carbon nanotubes do not have a twisted structure.
  • a carbon nanotube linear body can also be obtained by spinning or the like from a dispersion liquid of carbon nanotubes.
  • the production of the carbon nanotube linear body by spinning can be performed, for example, by the method disclosed in US Patent Application Publication No. 2013/0251619 (Japanese Patent Laid-Open No. 2012-126635).
  • From the viewpoint of obtaining uniform diameter of the carbon nanotube wire it is desirable to use the filamentous carbon nanotube wire, and from the viewpoint of obtaining a high-purity carbon nanotube wire, the carbon nanotube sheet is twisted. It is preferable to obtain a filamentous carbon nanotube linear body.
  • the carbon nanotube linear body may be a linear body in which two or more carbon nanotube linear bodies are woven together. Further, the carbon nanotube linear body may be a linear body in which carbon nanotubes and other conductive materials are composited (hereinafter, also referred to as “composite linear body”).
  • the composite linear body for example, (1) a carbon nanotube linear body in which carbon nanotubes are pulled out in a sheet shape from the end of the carbon nanotube forest, the drawn carbon nanotube sheets are bundled, and then the bundle of carbon nanotubes is twisted.
  • the composite linear body of (2) when twisting the bundle of carbon nanotubes, a metal may be supported on the carbon nanotubes in the same manner as in the composite linear body of (1).
  • the composite linear body of (3) is a composite linear body when two linear bodies are knitted, but at least one linear body of a single metal or a linear body of a metal alloy or a composite.
  • a linear body three or more of a carbon nanotube linear body, a linear body of a single metal, a linear body of a metal alloy, or a composite linear body may be knitted.
  • the metal of the composite linear body include simple metals such as gold, silver, copper, iron, aluminum, nickel, chromium, tin, and zinc, and alloys containing at least one of these single metals (copper-nickel-. Phosphorus alloys, copper-iron-phosphorus-zinc alloys, etc.) can be mentioned.
  • the conductive linear body 21 may be a linear body having a conductive coating on the yarn.
  • the yarn include yarn spun from a resin such as nylon and polyester.
  • the conductive coating include coatings of metals, conductive polymers, carbon materials and the like.
  • the conductive coating can be formed by plating, vapor deposition, or the like.
  • a linear body having a conductive coating on the thread can improve the conductivity of the linear body while maintaining the flexibility of the thread. That is, it becomes easy to reduce the resistance of the pseudo-seat structure 2.
  • the first cured product layer 3 is made of a cured product of a curable adhesive and is a layer that covers the conductive linear body 21.
  • the pseudo-sheet structure 2 can be fixed by maintaining the surface shape by the first cured product layer 3. That is, the pseudo-sheet structure 2 is supported by the first cured product layer 3. Further, on the surface of the first cured product layer 3, a region not in contact with the individual conductive linear bodies 21 included in the pseudo-sheet structure 2, and at least one of the electrode 4 and the second cured product layer 5. These can be fixed by adhering the electrodes.
  • the conductive linear body 21 and the electrode 4 are in direct contact with each other, when a non-curable adhesive layer is used instead of the first cured product layer 3, the inside of the wiring sheet 100 is used. Due to the deformation in the thickness direction, the conductive linear body 21 may move and be separated from the electrode 4, resulting in an increase in resistance value. Therefore, in order to maintain the contact between the conductive linear body 21 and the electrode 4, it is necessary to apply a contact pressure to the conductive linear body 21 and the electrode 4. On the other hand, if the first cured product layer 3 as in the present embodiment is used, the conductive linear body 21 can be fixed, the contact between the conductive linear body 21 and the electrode 4 is stabilized, and the resistance value increases. It can be less likely to occur.
  • the first cured product layer 3 is provided with voids in a region corresponding to at least a part of a region in which the conductive linear body 21 of the pseudo-sheet structure 2 does not exist in the plan view of the wiring sheet 100. It is necessary. Since air can pass through this gap, high air permeability in the wiring sheet 100 can be achieved. As shown in FIG. 1, the first cured product layer 3 may be composed of the first cured product strip 31. Further, it is preferable that the first cured product strips 31 are arranged at intervals. By doing so, the voids can be provided in the first cured product layer 3 in the plan view of the wiring sheet 100.
  • the area ratio (porosity) of the voids provided in the first cured product layer 3 is preferably 15% or more with respect to 100% of the entire surface of the pseudo-sheet structure 2 in the plan view of the wiring sheet 100. It is more preferably 25% or more, and even more preferably 35% or more. When this area ratio is 15% or more, the air permeability of the wiring sheet 100 can be further improved.
  • the upper limit of the porosity is preferably about 75% or less so that the conductive linear body 21 can be easily supported.
  • the plurality of first cured product strips 31 are arranged in the same direction as the direction in which the conductive linear body 21 extends.
  • the intervals between the adjacent first cured product strips 31 may be regular intervals or irregular intervals.
  • the first cured product layer 3 may have a structure in which the first cured product strips 31 are arranged in a stripe shape.
  • the first cured product strip 31 may be straight or wavy in the plan view of the wiring sheet 100.
  • the first cured product strip 31 may have a wave shape such as a sine wave, a square wave, a triangular wave, and a sawtooth wave.
  • the conductive linear body 21 provided on the first cured product strip 31 may be one alone or two or more. Further, the number of the conductive linear bodies 21 provided in the first cured product strip 31 may be the same number or different for each first cured product strip 31.
  • Storage modulus at 23 ° C. of the first cured layer 3 is preferably at 5.0 ⁇ 10 6 Pa or more. If the storage elastic modulus is 5.0 ⁇ 10 6 Pa or more, it can improve the strength of the wiring sheet 100 can be more reliably ensured independence of the wiring sheet 100. Further, it is easy to suppress an increase in the resistance value of the wiring sheet 100 when the conductive linear body 21 and the electrode 4 are in direct contact with each other. From the viewpoint of the independence and flexibility of the wiring sheet 100, the storage elastic modulus of the first cured product layer 3 at 23 ° C. is more preferably 5.0 ⁇ 10 6 Pa or more and 1.0 ⁇ 10 10 Pa or less. , 0.8 ⁇ 10 7 Pa or more and 8.0 ⁇ 10 9 Pa or less is more preferable, and 1.0 ⁇ 10 7 Pa or more and 5.0 ⁇ 10 9 Pa or less is particularly preferable.
  • the thickness of the first cured product layer 3 is preferably smaller than the diameter D of the conductive linear body 21.
  • the thickness of the first cured product layer 3 is preferably 0.95 times or less the diameter D of the conductive linear body 21, and 0.9 times or less the diameter D of the conductive linear body 21. Is more preferable.
  • the thickness of the first cured product layer 3 is preferably 5 ⁇ m or more and 50 ⁇ m or less, more preferably 8 ⁇ m or more and 45 ⁇ m or less, and further preferably 12 ⁇ m or more and less than 40 ⁇ m.
  • curable adhesive examples include a thermosetting adhesive that cures by heat, an energy ray-curable adhesive, and the like.
  • examples of the energy ray include ultraviolet rays, visible energy rays, infrared rays, and electron beams.
  • energy ray curing includes heat curing by heating using energy rays.
  • the thermosetting adhesive preferably contains a thermosetting resin.
  • the thermosetting resin is not particularly limited, and specifically, an epoxy resin, a phenol resin, a melamine resin, a urea resin, a polyester resin, a urethane resin, an acrylic resin, a benzoxazine resin, a phenoxy resin, an amine-based compound, and the like. Examples thereof include acid anhydride-based compounds. These can be used alone or in combination of two or more.
  • an epoxy resin from the viewpoint of being suitable for curing using an imidazole-based curing catalyst, it is preferable to use an epoxy resin, a phenol resin, a melamine resin, a urea resin, an amine-based compound, and an acid anhydride-based compound, and it is particularly excellent.
  • an aromatic epoxy resin or an alicyclic epoxy resin such as an alicyclic epoxy resin is preferable from the viewpoint of increasing the storage elastic modulus of the cured product layer.
  • Epoxy resins with flexible segments such as oxyalkylene chains tend to reduce the storage modulus of the cured product layer.
  • the energy ray-curable adhesive preferably contains an energy ray-curable resin.
  • the energy ray-curable resin include compounds having at least one polymerizable double bond in the molecule, and acrylate compounds having a (meth) acryloyl group are preferable.
  • acrylate-based compound examples include chain aliphatic skeleton-containing (meth) acrylates (dicyclopentadiene diacrylate, trimethylolpropanetri (meth) acrylate, tetramethylolmethanetetra (meth) acrylate, and pentaerythritol tri (meth) acrylate.
  • chain aliphatic skeleton-containing (meth) acrylates dicyclopentadiene diacrylate, trimethylolpropanetri (meth) acrylate, tetramethylolmethanetetra (meth) acrylate, and pentaerythritol tri (meth) acrylate.
  • Pentaerythritol tetra (meth) acrylate dipentaerythritol monohydroxypenta (meth) acrylate, dipentaerythritol hexa (meth) acrylate, 1,4-butylene glycol di (meth) acrylate, and 1,6-hexanediol di ( (Meta) acrylate, etc.), Cyclic aliphatic skeleton-containing (meth) acrylate (dicyclopentanyldi (meth) acrylate, etc.), Polyalkylene glycol (meth) acrylate (polyethylene glycol di (meth) acrylate, etc.), Oligoester (meth) ) Acrylate, urethane (meth) acrylate oligomer, epoxy-modified (meth) acrylate, polyether (meth) acrylate other than polyalkylene glycol (meth) acrylate, itaconic acid oligomer
  • the weight average molecular weight (Mw) of the energy ray-curable resin is preferably 100 or more and 30,000 or less, and more preferably 300 or more and 10,000 or less.
  • the energy ray curable resin contained in the adhesive may be only one type or two or more types. When there are two or more types of energy ray curable resins, their combinations and ratios can be arbitrarily selected.
  • thermosetting resin When using an energy ray curable resin or a thermosetting resin, it is preferable to use a photopolymerization initiator, a thermosetting initiator, or the like.
  • a photopolymerization initiator, a thermal polymerization initiator and the like the polymerization reaction of the curable resin can be easily started, and the curing reaction can be easily controlled.
  • photopolymerization initiator examples include benzophenone, acetophenone, benzoin, benzoinmethyl ether, benzoin ethyl ether, benzoin isopropyl ether, benzoin isobutyl ether, benzoin benzoic acid, methyl benzoin benzoate, benzoin dimethyl ketal, 2,4-diethylthioxanthone, 1 -Hydroxycyclohexylphenylketone, benzyldiphenylsulfide, tetramethylthium monosulfide, azobisisobutyronitrile, 2-chloranthraquinone, diphenyl (2,4,6-trimethylbenzoyl) phosphine oxide, and bis (2,4)
  • photoradical polymerization initiators such as 6-trimethylbenzoyl) -phenyl-phosphinoxide.
  • examples of the photopolymerization initiator include a photocationic polymerization initiator in addition to the photoradical polymerization initiator.
  • the photocationic polymerization initiator is a compound that generates a cationic species when irradiated with active energy rays to initiate a curing reaction of a cationically curable compound, and is a cation portion that absorbs active energy rays and a source of acid. It consists of an anion part.
  • Examples of the photocationic polymerization initiator include sulfonium salt compounds, iodonium salt compounds, phosphonium salt compounds, ammonium salt compounds, antimonate compounds, diazonium salt compounds, selenium salt compounds, and oxonium salt compounds. , And bromine salt compounds and the like.
  • a sulfonium salt-based compound is preferable, and an aromatic sulfonium salt-based compound having an aromatic group is more preferable from the viewpoint of excellent compatibility with the component (A) and excellent storage stability of the obtained adhesive. ..
  • sulfonium salt-based compound examples include triphenylsulfonium hexafluorophosphate, triphenylsulfonium hexafluoroantimonate, triphenylsulfonium tetrakis (pentafluorophenyl) borate, and 4,4'-bis [diphenylsulfonio] diphenylsulfide-bishexafluoro.
  • the iodonium salt compounds include diphenyliodonium tetrakis (pentafluorophenyl) borate, diphenyliodonium hexafluorophosphate, diphenyliodonium hexafluoroantimonate, di (4-nonylphenyl) iodonium hexafluorophosphate, and (tricumyl) iodonium tetrakis (penta). Fluorophenyl) borate and the like.
  • Examples of the phosphonium salt-based compound include tri-n-butyl (2,5-dihydroxyphenyl) phosphonium bromide, hexadecyltributylphosphonium chloride and the like.
  • ammonium salt compound examples include benzyltrimethylammonium chloride, phenyltributylammonium chloride, benzyltrimethylammonium bromide and the like.
  • antimony acid compounds examples include triphenylsulfonium hexafluoroantimonate, p- (phenylthio) phenyldiphenylsulfonium hexafluoroantimonate, 4-chlorphenyldiphenylsulfonium hexafluoroantimonate, and bis [4- (diphenylsulfonio). Phenyl] Examples thereof include sulfide bishexafluoroantimonate and diallyl iodonium hexafluoroantimonate.
  • a commercially available product can be used as the photocationic polymerization initiator.
  • Commercially available products include Cyracure UVI-6970, Cyracure UVI-6974, Cyracure UVI-6990, Cyracure UVI-950 (all manufactured by Union Carbide), Irga Cure 250, Irga Cure 261 and Irga Cure 264 (above, Ciba Specialty Chemicals).
  • thermal polymerization initiator examples include hydrogen peroxide, peroxodisulfate (ammonium peroxodisulfate, sodium peroxodisulfate, potassium peroxodisulfate, etc.), and azo compound (2,2'-azobis (2-amidinopropane) di.
  • thermal polymerization initiator examples include thermal cationic polymerization initiators in addition to the above-mentioned thermal radical polymerization initiators.
  • the thermal cationic polymerization initiator is a compound that can generate a cationic species that initiates polymerization by heating.
  • examples of the thermal cationic polymerization initiator include sulfonium salts, quaternary ammonium salts, phosphonium salts, diazonium salts, iodonium salts and the like.
  • a sulfonium salt is preferable from the viewpoints of easy availability and easy acquisition of a sealing material having better adhesiveness and transparency.
  • sulfonium salt examples include triphenylsulfonium tetrafluoroborate, triphenylsulfonium hexafluoroantimonate, triphenylsulfonium hexafluoroalcinate, tris (4-methoxyphenyl) sulfonium hexafluoroalcinate, and diphenyl (4-phenylthiophenyl). Examples thereof include sulfonium hexafluoroalcinate.
  • a commercially available product can also be used as the sulfonium salt.
  • Commercially available products include Adeka Opton SP-150, Adeka Opton SP-170, Adeka Opton CP-66, Adeka Opton CP-77 (all manufactured by ADEKA), Sun Aid SI-60L, Sun Aid SI-80L, Sun Aid SI-100L, and Sun Aid SI-.
  • Examples of the quaternary ammonium salt include tetrabutylammonium tetrafluoroborate, tetrabutylammonium hexafluorophosphate, tetrabutylammonium hydrogensulfate, tetraethylammonium tetrafluoroborate, tetraethylammonium p-toluenesulfonate, N, N-dimethyl-N-.
  • Benzylanilinium hexafluoroantimonate N, N-dimethyl-N-benzylanilinium tetrafluoroborate, N, N-dimethyl-N-benzylpyridinium hexafluoroantimonate, N, N-diethyl-N-benzyltrifluoromethanesulfonate , N, N-dimethyl-N- (4-methoxybenzyl) pyridinium hexafluoroantimonate, N, N-diethyl-N- (4-methoxybenzyl) toluidinium hexafluoroantimonate and the like. .
  • Examples of the phosphonium salt include ethyltriphenylphosphonium hexafluoroantimonate and tetrabutylphosphonium hexafluoroantimonate.
  • Examples of the diazonium salt include AMERICURE (manufactured by American Can) and ULTRASET (manufactured by ADEKA).
  • Examples of the iodonium salt include diphenyliodonium hexafluoroalcinate, bis (4-chlorophenyl) iodonium hexafluoroalcinate, bis (4-bromophenyl) iodonium hexafluoroalcinate, and phenyl (4-methoxyphenyl) iodonium hexafluoroalcinate. Can be mentioned.
  • UV-9310C manufactured by Toshiba Silicone
  • Photoinitiator 2074 manufactured by Rhone-Poulenc
  • UVE series products manufactured by General Electric
  • FC series products Minnesota Mining and Manufacturing
  • polymerization initiators can be used alone or in combination of two or more.
  • the amount used shall be 0.1 part by mass or more and 100 parts by mass or less with respect to 100 parts by mass of the energy ray curable resin or the thermosetting resin. Is preferable, and it is more preferably 1 part by mass or more and 100 parts by mass or less, and particularly preferably 1 part by mass or more and 10 parts by mass or less.
  • thermosetting resin When a thermosetting resin is used, a curing catalyst such as an imidazole-based curing catalyst may be used.
  • the adhesive may contain a polymer component together with the energy ray curable resin or the thermosetting resin in order to facilitate the maintenance of the sheet shape before curing.
  • the polymer used as the polymer component include phenoxy resin, polyolefin resin or a modified product thereof, polyamide-imide resin, polyimide resin, rubber resin, acrylic resin and the like.
  • These polymer components can be used alone or in combination of two or more.
  • the total amount of the energy ray-curable resin and the thermosetting resin contained in the adhesive is a polymer from the viewpoint of adjusting the storage elasticity of the cured product layer to the above-mentioned range. It is preferably 15 parts by mass or more and 300 parts by mass or less, and preferably 20 parts by mass or more and 200 parts by mass or less with respect to 100 parts by mass of the component. Further, when the adhesive contains an energy ray curable resin or a thermosetting resin and does not contain a polymer component, the storage elastic modulus of the cured product layer tends to be too high.
  • the adhesive may contain a filler.
  • a thermally conductive filler When a thermally conductive filler is used, uniform heat generation is likely to be obtained when the wiring sheet 100 is used as a heating element. Further, by using the conductive filler, it can play a role of assisting the conductivity of the pseudo-sheet structure 2.
  • the adhesive does not contain the filler or the amount of the filler used is reduced, it is possible to prevent the first cured product layer 3 from having an excessively high storage elastic modulus at 23 ° C.
  • Fillers include, for example, inorganic powders (eg, powders such as silica, alumina, talc, calcium carbonate, titanium white, red iron oxide, silicon carbide, and boron nitride), spherical beads of inorganic powder, single crystal fibers, and Examples include glass fiber. Among these, silica filler and alumina filler are preferable. The filler may be used alone or in combination of two or more.
  • inorganic powders eg, powders such as silica, alumina, talc, calcium carbonate, titanium white, red iron oxide, silicon carbide, and boron nitride
  • silica filler and alumina filler are preferable.
  • the filler may be used alone or in combination of two or more.
  • the adhesive may contain other components.
  • Other components include, for example, organic solvents, coupling agents, flame retardants, tackifiers, ultraviolet absorbers, antioxidants, preservatives, fungicides, plasticizers, defoamers, wettability adjusters and the like. Well-known additives are mentioned.
  • the electrode 4 is used to supply an electric current to the conductive linear body 21.
  • the electrodes 4 are electrically connected to and arranged at both ends of the conductive linear body 21. It is preferable that the electrode 4 is in direct contact with the conductive linear body 21 by being fixed by the first cured product layer 3 and the second cured product layer 5. As a result, the electrode 4 can be easily electrically connected to the conductive linear body 21 without using solder, silver paste, or the like.
  • the electrode 4 can be formed by using a known electrode material. Examples of the electrode material include a conductive paste (silver paste, etc.), a metal foil (copper foil, etc.), a metal wire, and the like.
  • the electrode 4 is a metal wire or a metal foil from the viewpoint that electrical connection with the conductive linear body 21 can be easily achieved by the contact pressure received from the first cured product layer 3 or the second cured product layer 5. It is preferably a metal wire or a metal foil having a thickness of 40 ⁇ m or less. According to the present embodiment, even when the electrode 4 comes into direct contact with the conductive linear body 21, the contact between the conductive linear body 21 and the electrode 4 is stabilized, and the resistance value increases. It can be difficult to do. Therefore, even when a metal wire or a metal foil having a thickness of 40 ⁇ m or less is used instead of a conductive paste having excellent contact resistance or a thick metal foil, the contact resistance between the conductive linear body 21 and the electrode 4 is used.
  • the electrode 4 is a metal wire
  • the metal wires are connected to each other, so that the connection is easy.
  • a thin metal foil having a thickness of 40 ⁇ m or less is preferable from the viewpoint of reducing the overall thickness of the wiring sheet 100 and reducing the step of the electrode forming portion.
  • the electrode material is a metal wire
  • the number of metal wires may be one, but it is preferably two or more.
  • the metal wire When the electrode 4 is a metal wire, the metal wire may be straight or wavy in the plan view of the wiring sheet 100. Further, the metal wire may have a wave shape such as a sine wave, a square wave, a triangular wave, and a sawtooth wave. If the electrode 4 has such a structure, it is easy to extend the wiring sheet 100 in the axial direction of the electrode 4, and it is possible to suppress disconnection of the electrode 4 at the time of extension. Similar to the conductive linear body 21, when the electrode 4 is a metal wire and has a wave shape in a plan view of the wiring sheet 100, it is preferable that the electrode 4 has a sine and cosine wave shape.
  • the metal of the metal foil or metal wire examples include metals such as copper, aluminum, tungsten, iron, molybdenum, nickel, titanium, silver and gold, or alloys containing two or more kinds of metals (for example, stainless steel and carbon steel). Examples include steel, brass, phosphor bronze, zirconium copper alloys, beryllium copper, iron nickel, nichrome, nickel titanium, cantal, hasterois, and renium tungsten). Further, the metal foil or the metal wire may be plated with tin, zinc, silver, gold, platinum, nickel, chromium, nickel-chromium alloy, solder or the like.
  • the metal foil or metal wire is a group consisting of gold, platinum, palladium, silver, and copper. It is preferably plated with a metal containing at least one metal selected from.
  • the width of the electrode 4 is preferably 3000 ⁇ m or less, more preferably 2000 ⁇ m or less, and further preferably 1500 ⁇ m or less in the plan view of the pseudo-sheet structure 2.
  • the width of the electrode 4 when two or more metal wires are used for the electrodes means the sum of the diameters of the metal wires. Further, the width of the electrode 4 when two or more metal foils are used for the electrodes means the sum of the widths of the metal foils.
  • the plurality of metal wires may be in direct contact with each other or may be electrically connected via the conductive linear body 21. When the electrode 4 is a single metal wire, the width of the electrode 4 is the diameter of the metal wire.
  • the ratio of the resistance value of the electrode 4 and the resistance value of the pseudo sheet structure 2 obtained by the calculation formula of "resistance value of the electrode 4 / resistance value of the pseudo sheet structure 2" is 0.0001 or more and 0.3 or less. It is preferably 0.0005 or more and 0.1 or less, more preferably.
  • the pseudo-sheet structure 2 needs to have some resistance in order to generate heat, while it is preferable that the electrode 4 allows current to flow as easily as possible. Therefore, a difference occurs between the resistance value of the electrode 4 and the resistance value of the pseudo-sheet structure 2. For this reason, when the ratio of the resistance values of the electrode 4 and the pseudo-sheet structure 2 becomes large, temperature unevenness tends to occur easily.
  • the resistance values of the electrode 4 and the pseudo-sheet structure 2 can be measured using a tester. First, the resistance value of the electrode 4 is measured, and then the resistance value of the pseudo-sheet structure 2 to which the electrode 4 is attached is measured. After that, the resistance values of the electrodes 4 and the pseudo-sheet structure 2 are calculated by subtracting the measured values of the electrodes 4 from the resistance values of the pseudo-sheet structure 2 to which the electrodes are attached. Further, if necessary, the electrode 4 can be taken out from the wiring sheet 100 and the resistance value can be measured.
  • the second cured product layer 5 is made of a cured product of a curable adhesive and is a layer that covers the electrode 4. Further, as described above, the second cured product layer 5 can fix the electrode 4 so as to be in direct contact with the conductive linear body 21. As shown in FIG. 1, the second cured product layer 5 is preferably formed so as to cover each of the pair of electrodes 4. By doing so, the second cured product layer 5 does not cover the entire surface of the pseudo-sheet structure 2 in the plan view of the wiring sheet 100. Therefore, the second cured product layer 5 does not block the voids provided in the first cured product layer 3 and does not affect the air permeability of the wiring sheet 100.
  • the second cured product layer 5 is formed so as to extend in the same direction as the direction in which the electrode 4 extends.
  • the second cured product layer 5 may be straight or wavy in the plan view of the wiring sheet 100. Further, the second cured product layer 5 may have a wave shape such as a sine wave, a square wave, a triangular wave, and a sawtooth wave.
  • Storage modulus at 23 ° C. of the second cured layer 5 is preferably 5.0 ⁇ 10 6 Pa or more. If the storage elastic modulus is 5.0 ⁇ 10 6 Pa or more, it can be more reliably ensured independence of the wiring sheet 100. Further, when the conductive linear body 21 and the electrode 4 are in direct contact with each other, the increase in the resistance value of the wiring sheet 100 is likely to be suppressed. From the viewpoint of the independence of the wiring sheet 100 and the like, the storage elastic modulus of the second cured product layer 5 at 23 ° C. is more preferably 5.0 ⁇ 10 6 Pa or more and 1.0 ⁇ 10 10 Pa or less, and is 0. It is more preferably 8.0 ⁇ 10 7 Pa or more and 8.0 ⁇ 10 9 Pa or less, and particularly preferably 1.0 ⁇ 10 7 Pa or more and 5.0 ⁇ 10 9 Pa or less.
  • the thickness of the second cured product layer 5 is not particularly limited, but is preferably 20 ⁇ m or more and 200 ⁇ m or less, more preferably 30 ⁇ m or more and 150 ⁇ m or less, and further preferably 40 ⁇ m or more and 100 ⁇ m or less. When the thickness of the second cured product layer 5 is within such a range, it becomes easier to secure the independence of the wiring sheet 100, and the second cured product layer 5 is the conductive linear body 21 and the electrode 4. It is also easy to prevent the contact between the two.
  • the same curable adhesive as that used in the first cured product layer 3 can be used.
  • the curable adhesive used for the second cured product layer 5 is preferably the same type as the curable adhesive used for the first cured product layer 3.
  • the adhesive used for the second cured product layer 5 is also thermosetting. Thereby, when the first cured product layer 3 and the second cured product layer 5 are obtained, the curing can be performed collectively by the thermosetting treatment.
  • both the adhesive used for the first cured product layer 3 and the adhesive used for the second cured product layer 5 are energy ray curable.
  • the wiring sheet 100 optionally has the first process film 1 in addition to the pseudo sheet structure 2, the first cured product layer 3, the electrode 4, and the second cured product layer 5, and optionally includes the second process film 6. Although it has (see FIG. 3), it may further have a layer such as an antistatic layer, an adhesion improving layer, and a base material in a modification described later.
  • the first process film 1 and the second process film 6 are peeled off at the time of use, but for the layers other than the peeled ones, the thickness of the other layers that are not peeled off from the viewpoint of thinning the wiring sheet 100. It is preferable that the total of is thin.
  • any arbitrary material other than the first process film 1, the pseudo sheet structure 2, the first cured product layer 3, the electrode 4, the second cured product layer 5, and the second process film 6 The total thickness of the layers is preferably as thin as possible, specifically 10 ⁇ m or less. The lower limit of the total thickness of such layers is 0 ⁇ m, in which case the wiring sheet 100 does not have such layers.
  • the wiring sheet 100 has independence even when the layer such as the base material is thin or does not have such a layer.
  • the method for manufacturing the wiring sheet 100 according to the present embodiment is not particularly limited.
  • the wiring sheet 100 can be manufactured, for example, by the following steps. First, as a first step, as shown in FIG. 3A, a thermosetting adhesive for forming the first cured product layer 3 is applied onto the first step film 1 to form a coating film. However, the adhesive coating film is formed in a striped shape so that the first cured product layer 3 is composed of a plurality of first cured product strips 31. Next, the coating film is dried to prepare an adhesive layer 3'consisting of a plurality of first adhesive strips 31'.
  • the first process film 1 is a film that is required when the wiring sheet 100 is manufactured, but is unnecessary after the wiring sheet 100 is manufactured and can be peeled off.
  • the first step film 1 usually includes a release base material and a release layer.
  • the peelable base material include a paper base material, a laminated paper obtained by laminating a thermoplastic resin (for example, polyethylene, etc.) on a paper base material, a plastic film, and the like.
  • the paper base material include glassine paper, coated paper, cast coated paper and the like.
  • plastic film examples include a polyester film (for example, polyethylene terephthalate, polybutylene terephthalate, polyethylene naphthalate, etc.), a polyolefin film (for example, polypropylene, polyethylene, etc.) and the like.
  • release agent examples include olefin-based resins, rubber-based elastomers (for example, butadiene-based resins, isoprene-based resins, etc.), long-chain alkyl-based resins, alkyd-based resins, fluorine-based resins, silicone-based resins, and the like. ..
  • the release layer is not particularly limited.
  • the release layer preferably includes a release base material and a release layer formed by applying a release agent on the release base material.
  • the release layer may be provided with the release layer on only one side of the release base material, or may be provided with the release layer on both sides of the release base material.
  • the thickness of the plastic film is preferably 4 ⁇ m or more and 200 ⁇ m or less, and more preferably 10 ⁇ m or more and 125 ⁇ m or less.
  • the thickness of the release layer is not particularly limited.
  • the thickness of the release layer is preferably 0.01 ⁇ m or more and 2.0 ⁇ m or less, and more preferably 0.03 ⁇ m or more and 1.0 ⁇ m or less. preferable.
  • the conductive linear bodies 21 are arranged and arranged on the plurality of first adhesive strips 31'to form the pseudo-sheet structure 2. ..
  • the plurality of first adhesive strips 31 are rotated while rotating the drum member. 'Wrap the conductive linear body 21 on it.
  • the pseudo-sheet structure 2 is formed and arranged on the plurality of first adhesive strips 31'. In this way, a sheet-like member in which the pseudo-sheet structure 2 is formed on the plurality of first adhesive strips 31'formed on the first step film 1 can be obtained.
  • an electrode forming tape including the electrode 4, the second adhesive strip 5', and the second step film 6 is provided with a pseudo-sheet structure of a sheet-like member. It is attached to both ends of the conductive linear body 21 in the body 2.
  • the second adhesive strip 5' is a strip-shaped coating film made of a thermosetting adhesive for forming the second cured product layer 5.
  • the second process film 6 the same film as that of the first process film 1 can be used.
  • the curable adhesive is cured by heat treatment to form the first cured product layer 3 and the second cured product layer 5.
  • the curing conditions differ depending on the curable adhesive used, but for example, the curing temperature is preferably 50 ° C. or higher and 200 ° C. or lower, and the curing time is 1 minute or longer and 180 minutes or shorter. preferable.
  • the non-curable adhesive is softened in the fourth step. Therefore, the electrical connection between the conductive linear body 21 and the electrode 4 may be impaired.
  • both the first cured product layer 3 and the second cured product layer 5 are thermosetting, both layers are cured and do not soften in the fourth step, so that such a problem can be prevented. Further, as in the modification described later, one of the first cured product layer 3 and the second cured product layer 5 has a curability different from that of a heat-curable adhesive such as an energy ray-curable adhesive. Even when an adhesive is used, the above problem can be prevented by pre-curing the energy ray-curable adhesive before the fourth step. After that, as shown in FIG. 3D, the first process film 1 and the second process film 6 can be peeled off to prepare the wiring sheet 100.
  • a heat-curable adhesive such as an energy ray-curable adhesive
  • the wiring sheet 100 has the first-step film 1 and the second-step film 6 peeled off, but the wiring sheet 100 is not limited thereto.
  • the wiring sheet 100 may be stored in a state before the first process film 1 and the second process film 6 are peeled off. That is, the wiring sheet 100 has at least one of the first process film 1 and the second process film 6 on at least one surface of the surface of the first cured product layer 3 and the surface of the second cured product layer 5. May be laminated. Then, if the first process film 1 and the second process film 6 are peeled off before use, the handleability of the wiring sheet 100 can be improved by the time of use.
  • the wiring sheet 100 may have a base material.
  • the base material a resin film or a metal foil can be used, but from the viewpoint of breathability or elasticity of the wiring sheet 100, the base material may be a non-woven fabric, cloth, mesh or the like.
  • the thickness of the base material is usually more than 10 ⁇ m, but in order to make the wiring sheet 100 thinner, the base material is preferably as thin as about 30 ⁇ m or less. If a substrate having a thickness of 10 ⁇ m or less is available, such a substrate may be used. Further, in order to easily obtain the air permeability of the wiring sheet 100, it is preferable that the base material has an opening. The opening may be provided at least in a region corresponding to the voids provided in the first cured product layer 3.
  • the base material since the first cured product layer 3 and the second cured product layer 5 have lost their adhesiveness after curing, the base material has a plurality of through holes on the entire surface like a mesh. However, foreign matter is unlikely to adhere to the first cured product layer 3 and the second cured product layer 5 exposed from the through holes.
  • the first cured product layer 3, the pseudo-sheet structure 2, the electrode 4, and the second cured product layer 5 are provided in this order in the thickness direction of the wiring sheet 100.
  • the second cured product layer 5, the first cured product layer 3, the electrode 4, and the pseudo-sheet structure 2 may be provided in this order in the thickness direction of the wiring sheet 100.
  • thermosetting adhesive is used for the first adhesive strip 31'and the second adhesive strip 5', and the thermosetting adhesives are thermally cured to obtain each cured product layer for wiring.
  • the sheet is produced, other curable compositions such as an energy ray curable adhesive may be used.
  • the energy ray-curable adhesive may be cured by irradiating the energy ray-curable adhesive with energy rays such as ultraviolet rays by a known method.
  • the wiring sheet 100 Since the wiring sheet 100 has unprecedented features such as flexibility and uniform heat generation, it is preferable to use it as a heating element (sheet-shaped heater).
  • a heating element sheet-shaped heater
  • examples of the use of the heating element include defogger (defrosting) for window glass, defroster (defrosting), and the like.
  • heaters have been used to control the temperature of batteries in electric vehicles, and thin heaters are suitable for individual temperature control of laminated cells. It can also be used as a flat cable for wiring electric signals.
  • An adhesive was obtained by blending parts by mass (solid content ratio) and toluene as a diluting solvent.
  • Example 1 (Making an adhesive sheet with a pseudo sheet structure)
  • the adhesive obtained in Preparation Example 1 was applied onto the release film (trade name: SP-PET382150 (manufactured by Lintec Corporation)) so that the coated portion (5 mm) and the uncoated portion (5 mm) alternated.
  • the release film (trade name: SP-PET382150 (manufactured by Lintec Corporation)
  • an adhesive layer composed of a plurality of first adhesive strips having a thickness of 22 ⁇ m after drying was formed (the shape is a straight strip (see FIG. 3A)).
  • a release film (trade name: SP-PET381130 (manufactured by Lintec Corporation)) was attached to the formed adhesive layer to prepare a first adhesive sheet.
  • a gold-plated tungsten wire (diameter 25 ⁇ m, manufacturer name: manufactured by Tokusai Co., Ltd., product name: Au (0.1) -TWG, hereinafter referred to as “wire”) was prepared.
  • the release film of the first adhesive sheet (trade name: SP-PET381130 (manufactured by Lintec Corporation)) is peeled off, the surface of the first adhesive strip is turned outward, and the drum member having a rubber outer peripheral surface is wrinkled.
  • the first adhesive sheet was wrapped around so that there was no such thing. Both ends of the first adhesive sheet in the circumferential direction of the drum member were fixed to the surface of the drum member with double-sided tape.
  • Wires wound around the bobbin were prepared for the number of first adhesive strips.
  • the wire was attached to the surface of each first adhesive strip in the adhesive sheet located near the end of the drum member, and then the wire was wound up by the drum member while being unwound. By rotating the drum member once, the wire was wound around the first adhesive strip.
  • a plurality of wires were provided on the surface of the adhesive sheet to form a pseudo-sheet structure in which the plurality of wires were installed at equal intervals.
  • the drum member was rotated while vibrating in the direction of the drum axis so that the wound wire formed a wavy shape.
  • the wires were evenly spaced and the spacing was 10 mm.
  • the wire and the adhesive sheet were cut in parallel with the axial direction of the drum member. Further, this was cut into a rectangle of 200 mm ⁇ 150 mm (the direction in which the wire extends is the long side direction) to prepare an adhesive sheet with a pseudo-sheet structure (see FIG. 3B). As described above, an adhesive sheet with a pseudo-sheet structure was obtained. That is, an adhesive sheet with a pseudo-sheet structure in which 15 wires were arranged was obtained. The amplitude of the wave shape of the wire was 2.5 mm, and the wavelength was 10 mm.
  • the adhesive obtained in Preparation Example 1 was applied onto a release film (trade name: SP-PET382150 (manufactured by Lintec Corporation)) and dried to form a second adhesive layer having a thickness of 60 ⁇ m after drying. ..
  • a release film (trade name: SP-PET381130 (manufactured by Lintec Corporation) was attached to the formed second adhesive layer to prepare a second adhesive sheet.
  • a gold-plated copper wire (diameter 150 ⁇ m, manufacturer name: manufactured by Tokusai Co., Ltd., product name: C1100-HAUP) was prepared as an electrode.
  • the release film of the second adhesive sheet (trade name: SP-PET381130 (manufactured by Lintec Corporation)) was peeled off, and the second adhesive sheet was wrapped around the drum member having a rubber outer peripheral surface so as not to wrinkle. Both ends of the second adhesive sheet in the circumferential direction were fixed with double-sided tape.
  • the gold-plated copper wire wound around the bobbin is attached to the surface of the second adhesive layer located near the end of the drum member, and then the gold-plated copper wire is unwound by the drum member while being unwound, and the drum member is gradually wound up.
  • the drum member was rotated while vibrating in the axial direction of the drum member so that the wound gold-plated copper wire formed a wavy shape.
  • a plurality of gold-plated copper wires were provided on the surface of the second adhesive sheet, and the plurality of gold-plated copper wires were installed at equal intervals.
  • the distance between the gold-plated copper wires was 2.5 mm.
  • the wave-shaped amplitude of the gold-plated copper wire was 3 mm, and the wavelength was 20 mm.
  • the second adhesive sheet on which the gold-plated copper wire was installed was cut in parallel with the drum shaft.
  • the second adhesive sheet on which the gold-plated copper wire was installed was cut into a 220 mm ⁇ 10 mm rectangle with the direction in which the gold-plated copper wire extended as the long side direction, and four gold-plated copper wires were installed. An adhesive sheet with electrodes was produced. As a result, the second adhesive layer was also formed into a band-like shape, and the second adhesive layer was formed into a band-like body.
  • the distance between the closest pair of adhesive sheets with electrodes is 150 mm because the direction in which the wire of the pseudo-sheet structure extends and the direction in which the gold-plated copper wire extends are orthogonal to each other.
  • the gold-plated copper wire and the wire were attached to both ends of the wire of the adhesive sheet with the pseudo-sheet structure in contact with each other (see FIG. 3C).
  • a vacuum laminator manufactured by Nikko Materials Co., Ltd., product name: V130
  • a curing reaction was carried out under the conditions of 110 ° C., 0.5 MPa, and 50 minutes, and the first adhesive strip and the second adhesive were bonded.
  • the agent strip was cured to form a first cured product layer and a second cured product layer.
  • the release film as the process film was peeled off to prepare a wiring sheet (see FIG. 3D).
  • a base material made of polyester thermal bond non-woven fabric with a basis weight of 40 g / m 2 is arranged with holes of ⁇ 4 mm at a pitch of 10 mm from the center of the holes in a round hole parallel shape, and the opening rate is about 13%.
  • the adhesive was applied to form a strip-shaped adhesive layer composed of a plurality of adhesive strips (the shape is the same as in Example 1 and is a straight strip). After drying, the prepared non-woven fabric substrate and the band-shaped adhesive layer were bonded to each other to prepare an adhesive sheet on which the band-shaped adhesive layer was formed. At this time, a strip-shaped adhesive layer having a width of 5 mm was formed in the portion between the rows where the holes were lined up.
  • a tungsten wire (diameter 25 ⁇ m, manufacturer name: manufactured by Tokusai Co., Ltd., product name: TWG-CS, hereinafter referred to as “wire”) was prepared.
  • the release sheet of the adhesive sheet was peeled off, the surface of the band-shaped adhesive layer was turned outward, and the adhesive sheet was wrapped around the rubber drum member so that the outer peripheral surface was not wrinkled. Both ends of the adhesive sheet in the circumferential direction of the drum member were fixed to the surface of the drum member with double-sided tape. Wires wound around the bobbin were prepared for the number of adhesive strips. The wire was attached to the surface of each band-shaped adhesive layer in the adhesive sheet located near the end of the drum member, and then the wire was wound up by the drum member while being unwound. By rotating the drum member once, the wire was wound around the band-shaped adhesive layer.
  • Example 1 As shown in Table 1, in Example 1, it was found that the area ratio (porosity) of the voids provided in the first cured product layer was 50%, and the air permeability was high. Further, in Example 1, since the cured product layer obtained by curing the curable adhesive is used, it has self-supporting property even without a support such as a non-woven fabric. Therefore, the total thickness of the wiring sheet can be reduced. It was also found that the change in resistance value was small. On the other hand, in Comparative Example 1, it was found that the non-woven fabric base material had a low pore opening rate of 13% and was inferior in air permeability.

Landscapes

  • Laminated Bodies (AREA)

Abstract

La présente invention concerne une feuille de câblage (100) comprenant une structure de pseudo-feuille (2) dans laquelle une pluralité de corps linéaires électroconducteurs (21) sont agencés à des intervalles, une première couche de produit durci (3) recouvrant les corps linéaires électroconducteurs (21), une paire d'électrodes (4) électriquement connectées aux corps linéaires électroconducteurs (21), et une seconde couche de produit durci (5) recouvrant les électrodes (4), la première couche de produit durci (3) et la seconde couche de produit durci (5) comprenant chacune un produit durci d'un adhésif durcissable ; et, dans une vue en plan de la feuille de câblage (100), des espaces étant ménagés dans la première couche de produit durci (3) dans des régions correspondant à au moins une partie des régions dans la structure de pseudo-feuille (2) dépourvues des corps linéaires électroconducteurs (21).
PCT/JP2021/023605 2020-06-23 2021-06-22 Feuille de câblage WO2021261488A1 (fr)

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003297532A (ja) * 2002-04-08 2003-10-17 Matsushita Electric Ind Co Ltd 面状発熱体
JP2004173821A (ja) * 2002-11-26 2004-06-24 Matsushita Electric Ind Co Ltd シートヒータ
WO2012144586A1 (fr) * 2011-04-20 2012-10-26 宇部興産株式会社 Élément chauffant tubulaire en spirale
JP2018039226A (ja) * 2016-09-09 2018-03-15 リンテック株式会社 氷雪付着防止シート

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3846584A4 (fr) 2018-08-29 2022-05-25 Lintec Corporation Article doté d'une feuille conductrice et son procédé de fabrication

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003297532A (ja) * 2002-04-08 2003-10-17 Matsushita Electric Ind Co Ltd 面状発熱体
JP2004173821A (ja) * 2002-11-26 2004-06-24 Matsushita Electric Ind Co Ltd シートヒータ
WO2012144586A1 (fr) * 2011-04-20 2012-10-26 宇部興産株式会社 Élément chauffant tubulaire en spirale
JP2018039226A (ja) * 2016-09-09 2018-03-15 リンテック株式会社 氷雪付着防止シート

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