WO2021261254A1

WO2021261254A1 - Cutting device and cutting method

Info

Publication number: WO2021261254A1
Application number: PCT/JP2021/021959
Authority: WO
Inventors: 高之芦田
Original assignee: パナソニック株式会社
Priority date: 2020-06-22
Filing date: 2021-06-09
Publication date: 2021-12-30
Also published as: JP2023102796A

Abstract

A cutting device 1 comprises: a laser radiation unit 4 that radiates a laser beam L onto an electrode plate 6 to cut the same; an information acquisition unit 40 that acquires information pertaining to a focal position of the laser beam L; a position displacement unit 42 that displaces the focal position; and a control unit 44 that controls the position displacement unit 42 on the basis of the information acquired by the information acquisition unit 40.

Description

Cutting device and cutting method

This disclosure relates to a cutting device and a cutting method.

In recent years, with the spread of electric vehicles (EVs), hybrid vehicles (HVs), plug-in hybrid vehicles (PHVs), etc., shipments of in-vehicle secondary batteries are increasing. In particular, shipments of lithium-ion secondary batteries are increasing. Further, secondary batteries are becoming widespread not only for in-vehicle use but also as a power source for mobile terminals such as notebook personal computers. Regarding such a secondary battery, for example, Patent Document 1 discloses an apparatus for cutting an electrode plate with a laser beam while continuously transporting an electrode plate used for the secondary battery by a roll-to-roll method.

International Publication No. 2017/11010

By cutting the electrode plate with laser light, the cutting quality can be improved. On the other hand, there is always a demand for battery quality improvement. Therefore, further improvement is required for the cutting quality of the electrode plate.

This disclosure has been made in view of these circumstances, and one of the purposes thereof is to provide a technique for improving the cutting quality of the electrode plate.

One aspect of the present disclosure is a cutting device. This cutting device has a laser irradiation unit that irradiates an electrode plate with laser light to perform cutting processing, an information acquisition unit that acquires information about the focal position of the laser beam, a position displacement unit that displaces the focal position, and information acquisition. It includes a control unit that controls the position / displacement unit based on the information acquired by the unit.

Another aspect of the present disclosure is a cutting method. This cutting method includes irradiating the electrode plate with a laser beam to perform cutting processing, acquiring information on the focal position of the laser beam, and displacing the focal position based on the acquired information.

Any combination of the above components and the conversion of the expressions of the present disclosure between methods, devices, systems, etc. are also effective as aspects of the present disclosure.

According to the present disclosure, the cutting quality of the electrode plate can be improved.

It is a perspective view which shows typically the cutting apparatus which concerns on embodiment. It is a schematic diagram for demonstrating the focal position adjustment mechanism provided in the cutting apparatus. It is a schematic diagram which shows an example of the image generated by the image pickup apparatus.

Hereinafter, the present disclosure will be described with reference to the drawings based on the preferred embodiments. The embodiments are not limited to the present disclosure, but are exemplary, and all the features and combinations thereof described in the embodiments are not necessarily essential to the present disclosure. The same or equivalent components, members, and processes shown in the drawings shall be designated by the same reference numerals, and duplicate description thereof will be omitted as appropriate. In addition, the scale and shape of each part shown in each figure are set for convenience in order to facilitate explanation, and are not limitedly interpreted unless otherwise specified. In addition, when terms such as "first" and "second" are used in the present specification or claims, these terms do not represent any order or importance unless otherwise specified, and have a certain structure. Is to distinguish between and other configurations. In addition, some of the members that are not important for explaining the embodiment in each drawing are omitted and displayed.

FIG. 1 is a perspective view schematically showing the cutting device 1 according to the embodiment. FIG. 1 mainly illustrates the shape of the electrode plate 6 and how the electrode plate 6 is cut. Therefore, in FIG. 1, the illustration of the laser irradiation unit 4 is simplified, and the information acquisition unit 40, the position displacement unit 42, and the control unit 44 that constitute the focal position adjustment mechanism described later are omitted.

The cutting device 1 includes a transport unit 2 and a laser irradiation unit 4. The transport unit 2 is a mechanism for transporting the electrode plate 6. The transport speed of the electrode plate 6 is, for example, 1 m / min to 100 m / min. The laser irradiation unit 4 is a mechanism for irradiating the electrode plate 6 with the laser beam L to cut the electrode plate 6. In the present embodiment, the direction in which the electrode plate 6 flows at the position where the electrode plate 6 is cut by the laser irradiation unit 4 is defined as the transport direction A of the electrode plate 6. For example, the transport direction A is downward in the vertical direction.

The electrode plate 6 of the present embodiment is a strip-shaped member long in the transport direction A, and has a structure in which a plurality of unit electrode plates 8 are connected. For example, the electrode plate 6 has a structure in which the unit electrode plates 8 are arranged in two rows and a plurality of columns. The unit electrode plates 8 are finally separated from each other. Then, the unit electrode plate 8 of the positive electrode and the unit electrode plate 8 of the negative electrode are alternately laminated with the separator interposed therebetween to form a laminated electrode body. That is, the electrode plate 6 is used for the laminated electrode body. Not limited to this, the electrode plate 6 may be used for a wound electrode body. The obtained electrode body is used for a rechargeable secondary battery such as a lithium ion battery, a nickel-hydrogen battery, a nickel-cadmium battery, a capacitor such as an electric double layer capacitor, and the like.

Each unit electrode plate 8 has a structure in which an electrode active material layer is laminated on a current collector plate. In the case of a general lithium ion secondary battery, the current collector plate is made of aluminum foil or the like if it is a positive electrode, and copper foil or the like if it is a negative electrode. Further, in the case of a general lithium ion secondary battery, the electrode active material is lithium cobalt oxide, lithium iron phosphate or the like for the positive electrode, and graphite or the like for the negative electrode. A tab portion 10 is provided on each unit electrode plate 8 in a state after the electrode plate 6 has been cut by the laser irradiation portion 4. The tab portion 10 projects from the current collector plate of the unit electrode plate 8 in the width direction B of the electrode plate 6. The width direction B is a direction orthogonal to the transport direction A.

The electrode plate 6 has a coated portion 12 of the electrode active material and a non-coated portion 14 of the electrode active material. The coating portion 12 of the electrode active material is arranged at the central portion in the width direction B of the electrode plate 6. The coating portion 12 corresponds to the electrode active material layer. The coating unit 12 is obtained by applying an electrode slurry containing an electrode active material to the surface of a plate material constituting a current collector plate using a known coating device. The non-applied portions 14 of the electrode active material are arranged at both ends of the electrode plate 6 in the width direction B. The non-applied portion 14 is a portion where the plate material constituting the current collector plate is exposed, and becomes a tab portion 10 by cutting.

The transport unit 2 continuously transports the electrode plate 6 to a position facing the laser irradiation unit 4 by a feed roll (not shown). The cutting device 1 of the present embodiment includes two laser irradiation units 4 arranged in the width direction B. On the other hand, the laser irradiation unit 4 irradiates the non-applied portion 14 on one end side of the electrode plate 6 being conveyed with the laser beam L. The other laser irradiation unit 4 irradiates the non-applied portion 14 on the other end side of the electrode plate 6 being conveyed with the laser beam L. As a result, the non-applied portions 14 on both sides are cut to form a plurality of tab portions 10 arranged at predetermined intervals in the transport direction A.

When the electrode plates 6 are arranged with the negative electrode plates, a part of the coating portion 12 can also be cut during the cutting process by the laser irradiation unit 4. Further, when the electrode plate 6 is an array of positive electrode plates, a protective layer (not shown) for protecting the coated portion 12 may be provided at the boundary between the coated portion 12 and the non-coated portion 14. .. The protective layer is, for example, an oxide layer of a metal constituting a current collector plate. In this case, a part of the protective layer may be cut in addition to the non-coated portion 14 during the cutting process by the laser irradiation unit 4. Alternatively, in addition to the non-coated portion 14, a part of the coated portion 12 and a part of the protective layer may be cut.

The transport unit 2 has a chamber 16. The chamber 16 suppresses spatter and fume generated by the cutting process with the laser beam L from adhering to the electrode plate 6 and the cutting device 1 and floating in the atmosphere. The chamber 16 may be omitted.

The electrode plate 6 that has been cut by the laser irradiation unit 4 is divided into a product unit 18 and a waste material unit 20. The product unit 18 includes a plurality of continuous unit electrode plates 8 and a plurality of tab units 10. Each tab portion 10 is provided on a one-to-one basis with respect to each unit electrode plate 8. The waste material portion 20 is a portion of the non-coated portion 14 that does not remain on the product portion 18 side as a tab portion 10. The product unit 18 is conveyed to the line of the next process. The waste material unit 20 is transported in a direction different from that of the product unit 18 and is separated from the product unit 18.

Next, the focal position adjusting mechanism included in the cutting device 1 will be described. FIG. 2 is a schematic diagram for explaining a focal position adjusting mechanism included in the cutting device 1.

The laser irradiation unit 4 has an incident unit 22, a scanning unit 24, and a condensing unit 26. The laser beam L oscillated by the laser oscillator 100 is incident on the incident portion 22. For example, the laser oscillator 100 is a known fiber laser oscillator, and is connected to one end of the incident portion 22 via a fiber cable 28. The type of the laser oscillator 100 is not particularly limited and can be appropriately selected. Further, a collimating lens 30 is provided inside the incident portion 22. The laser beam L incident from one end of the incident portion 22 is adjusted to a parallel state by the collimated lens 30 and travels to the other end side. The other end of the incident portion 22 is connected to the scanning portion 24. The laser beam L that has passed through the collimating lens 30 and becomes parallel light travels from the other end of the incident portion 22 into the scanning portion 24.

The scanning unit 24 is a mechanism for scanning the electrode plate 6 with the laser beam L. The scanning unit 24 is composed of, for example, a known galvano scanner. The scanning unit 24 has an X-axis mirror 32 and a Y-axis mirror 34. The scanning unit 24 reflects the laser beam L incident from the incident unit 22 by each mirror and emits it toward the electrode plate 6. The X-axis mirror 32 is supported by an X-axis motor (not shown) and can rotate in the X-axis direction. The Y-axis mirror 34 is supported by a Y-axis motor (not shown) and can rotate in the Y-axis direction. The scanning unit 24 reflects the laser beam L in the order of the Y-axis mirror 34 and the X-axis mirror 32, and rotates each mirror to scan the laser beam L on the XY plane, that is, on the electrode plate 6. Can be done. The laser beam L may be reflected in the order of the X-axis mirror 32 and the Y-axis mirror 34. The drive of the scanning unit 24 is controlled by the control unit 44, which will be described later. The drive of the scanning unit 24 may be controlled by a control unit different from the control unit 44.

A condensing unit 26 is connected to the emission port of the laser beam L in the scanning unit 24. Therefore, the light collecting unit 26 is interposed between the scanning unit 24 and the electrode plate 6. The light collecting unit 26 collects the laser beam L emitted from the scanning unit 24 on the electrode plate 6. The light collecting unit 26 has a group lens 36 composed of a plurality of lenses and a protective glass 38. The set lens 36 is, for example, an fθ lens. The protective glass 38 is interposed between the assembled lens 36 and the electrode plate 6 to protect the assembled lens 36 from spatter, fume, and the like generated by the cutting process with the laser beam L.

The laser beam L emitted from the scanning unit 24 passes through the condensing unit 26 and reaches the electrode plate 6. The condensing unit 26 has a focal point F, and the laser beam L is focused on the focal point F by the condensing unit 26. In the initial adjustment of the cutting device 1, the focal position of the light collecting unit 26 is adjusted to a position (initial position) suitable for cutting the electrode plate 6. However, if the irradiation of the laser beam L is continued, the optical member that transmits the laser beam L is heated, and the so-called thermal lens effect may cause a shift in the focal position (focus shift). Generally, the focal position approaches the laser irradiation unit 4 by the focal shift.

Examples of the optical member capable of generating the focal shift include the collimating lens 30, the assembled lens 36, and the protective glass 38. In particular, foreign matter such as spatter and fume easily adheres to the protective glass 38, and the laser beam L is absorbed by the foreign matter and the temperature tends to rise locally. Therefore, the protective glass 38 tends to cause a focus shift. Further, the set lens 36 has a structure in which a plurality of lenses are combined. Therefore, the set lens 36 is also likely to cause a focus shift.

When the focus shift occurs, the irradiation diameter of the laser beam L to the electrode plate 6 becomes large, which may cause deterioration of cutting quality. The cutting quality includes the smoothness of the cut surface, the shape, the presence or absence of thermal deformation, and the like. Deterioration of cutting quality can lead to the generation of burrs in the cut portion. The burr generated on the electrode plate causes a short circuit, which deteriorates the quality of the secondary battery.

Generally, in the cutting process of the electrode plate 6, when the cutting process of one electrode plate 6 is completed, the work of installing the next electrode plate 6 in the cutting device 1 is carried out. Since the irradiation of the laser beam L is stopped during the work, it is expected that each optical member heated by the laser beam L is cooled and the focal position returns to the initial position. However, in recent years, there has been a demand for improvement in production lead time and throughput of secondary batteries. Therefore, there is a tendency that the time required for installing the electrode plate 6 is shortened and the length of the electrode plate 6 itself is lengthened. In this case, it is expected that each optical member will not be sufficiently cooled and the focus shift will be more likely to occur.

On the other hand, the cutting device 1 of the present embodiment includes a focal position adjusting mechanism. The focal position adjusting mechanism includes an information acquisition unit 40, a position displacement unit 42, and a control unit 44.

The information acquisition unit 40 acquires information regarding the focal position of the laser beam L. The information acquisition unit 40 of the present embodiment acquires information regarding the width dimension M of the irradiation mark 46 of the laser beam L formed on the electrode plate 6 as information regarding the focal position. Further, the information acquisition unit 40 of the present embodiment has an image pickup device 48 that captures an image of the irradiation mark 46, and acquires an image IMG of the irradiation mark 46 as information regarding the width dimension M of the irradiation mark 46. FIG. 3 is a schematic diagram showing an example of an image IMG generated by the image pickup apparatus 48. The irradiation marks 46 are burnt by the irradiation of the laser beam L in each of the vanishing portion 46a, which is interposed between the product section 18 and the waste material section 20 and burned down by the irradiation of the laser beam L, and the product section 18 and the waste material section 20. The burnt mark portion 46b is included. When the focal point shift occurs, the width dimension M of the irradiation mark 46, that is, the burn width gradually increases. Therefore, the focal position of the laser beam L or the displacement amount of the focal position can be grasped from the width dimension M of the irradiation mark 46.

The information acquisition unit 40 sends the image IMG generated by the image pickup apparatus 48 to the control unit 44 as information regarding the focal position. The information acquisition unit 40 may acquire the focal position itself or the displacement amount of the focal position itself as information regarding the focal position by calculation. The amount of displacement of the focal position has a correlation with the amount of heat input to each optical member. Therefore, the displacement amount can be estimated by calculation based on the output intensity of the laser beam L, the irradiation time, and the like. Further, by adding the obtained displacement amount to the initial position, the focal position can be estimated by calculation. Further, the information acquisition unit 40 may include a reflectance measuring device for measuring the light reflectance in the region including the irradiation mark 46 on the electrode plate 6. The light reflectance of the irradiation mark 46 is lower than the light reflectance of the region where the laser beam L is not irradiated in the coated portion 12 and the non-coated portion 14. Therefore, the width of the irradiation mark 46 can be estimated based on the change in the measured light reflectance. That is, the information regarding the focal position and the information regarding the width dimension M of the irradiation mark 46 may be the light reflectance of the region including the irradiation mark 46 on the electrode plate 6, or the amount of change thereof.

The position displacement portion 42 is a mechanism for displacing the focal position. The position displacement portion 42 of the present embodiment is composed of a uniaxial slider. The position displacement unit 42 includes a rail 50 that extends in the direction in which the laser irradiation unit 4 and the chamber 16 are aligned and to which the laser irradiation unit 4 is connected, a motor 52 that moves the laser irradiation unit 4 along the rail 50, and the like. The position displacement unit 42 of the present embodiment displaces the entire laser irradiation unit 4, that is, the incident unit 22, the scanning unit 24, and the condensing unit 26 with respect to the electrode plate 6. As a result, the focal position can be displaced with respect to the electrode plate 6. The position displacement unit 42 may displace only the light collection unit 26.

The control unit 44 controls the position displacement unit 42 based on the information acquired by the information acquisition unit 40. The control unit 44 is realized by elements and circuits such as a computer CPU and memory as a hardware configuration, and is realized by a computer program or the like as a software configuration, but in FIG. 2, it is realized by their cooperation. It is drawn as a functional block. It is well understood by those skilled in the art that this functional block can be realized in various ways by a combination of hardware and software.

When the information acquisition unit 40 generates the image IMG of the irradiation mark 46, the control unit 44 can calculate the width dimension M of the irradiation mark 46 by performing known image processing on the image IMG. For example, the control unit 44 may measure the width dimension M of a predetermined one place in the irradiation mark 46 in the image IMG and set the value as the width dimension M of the irradiation mark 46, or measure the width dimension M of a plurality of places. Then, the average value may be used as the width dimension M of the irradiation mark 46.

Then, the control unit 44 controls the position displacement unit 42 according to the width dimension M of the irradiation mark 46. As described above, when the focal shift occurs, the width dimension M of the irradiation mark 46 gradually expands. That is, the width dimension M of the irradiation mark 46 and the focal position of the laser beam L have a correlation. Therefore, the control unit 44 holds in advance a conversion table in which the width dimension M of the irradiation mark 46 and the focal position of the laser beam L are associated with each other. By using this conversion table, the control unit 44 can grasp the current focal position based on the width dimension M of the irradiation mark 46 obtained from the image IMG. The conversion table may correspond the width dimension M of the irradiation mark 46 with the displacement amount of the focal position. Further, the focal position may be grasped as the distance between the laser irradiation unit 4 (for example, the condensing unit 26) and the electrode plate 6.

The control unit 44 controls the motor 52 of the position displacement unit 42 so that the focal position approaches the initial position. Preferably, the control unit 44 matches the focal position with the initial position. As described above, when the focus shift occurs, the focus position is displaced in the direction approaching the laser irradiation unit 4. Therefore, the control unit 44 controls the position displacement unit 42 so that the laser irradiation unit 4 comes closer to the electrode plate 6. As a result, the deviation of the focal position can be suppressed, and the cutting quality of the electrode plate 6 can be improved. Further, the control unit 44 acquires an image IMG of the portion that has been cut after adjusting the focal position from the information acquisition unit 40, and controls the position displacement unit 42 based on the image IMG to control the irradiation mark 46. It is possible to execute feedback control that makes the width dimension M of the constant constant.

As described above, the cutting device 1 according to the present embodiment has information regarding the laser irradiation unit 4 that irradiates the electrode plate 6 with the laser beam L to perform cutting processing, and the information regarding the focal position of the laser beam L. The acquisition unit 40 includes a position displacement unit 42 that displaces the focal position of the laser beam L, and a control unit 44 that controls the position displacement unit 42 based on the information regarding the focal position acquired by the information acquisition unit 40. As a result, even if a focal shift occurs during the cutting process of the electrode plate 6, the focal position of the laser beam L can be adjusted according to the shift amount of the focal point F. As a result, the cutting quality of the electrode plate 6 can be improved, and the quality of the battery can be improved.

Further, the information acquisition unit 40 of the present embodiment acquires information regarding the width dimension M of the irradiation mark 46 of the laser beam L formed on the electrode plate 6 as information regarding the focal position. Then, the control unit 44 controls the position displacement unit 42 according to the width dimension M of the irradiation mark 46. That is, the cutting device 1 measures the change in the width dimension M of the irradiation mark 46 during cutting of the electrode plate 6 with the laser beam L, and adjusts the focal position in real time according to the measurement result.

As described above, the information regarding the focal position may be the focal position obtained by calculation or the displacement amount of the focal position. However, there are many external factors that affect the displacement of the focal position, such as the adhesion of foreign matter to the optical member, and it is very difficult to accurately calculate the focal position and its displacement amount. Further, directly detecting the focal point F of the laser beam L can also lead to complicated structure and high cost of the cutting device 1. On the other hand, by using the width dimension M of the irradiation mark 46 as the information regarding the focal position, the focal position can be grasped more easily. Therefore, the cutting quality of the electrode plate 6 can be improved more easily.

Further, the information acquisition unit 40 of the present embodiment has an image pickup device 48 that captures an image of the irradiation mark 46, and acquires an image IMG of the irradiation mark 46 as information regarding the width dimension M of the irradiation mark 46. By adjusting the focal position of the laser beam L using the image IMG of the irradiation mark 46, the cutting quality of the electrode plate 6 can be improved more easily. Further, in general, the cutting device 1 is provided with a camera for in-line inspection of the dimensions and appearance of the electrode plate 6. Therefore, the camera can be used as the image pickup device 48. Therefore, it is possible to suppress the complexity and cost increase of the structure of the cutting device 1 by providing the focal position adjusting mechanism.

Further, the laser irradiation unit 4 of the present embodiment includes an incident unit 22 on which the laser light L oscillated by the laser oscillator 100 is incident, and a scanning unit 24 that scans the electrode plate 6 with the laser light L incident on the incident unit 22. It also has a condensing unit 26 that condenses the laser beam L emitted from the scanning unit 24 on the electrode plate 6. Then, the position displacement unit 42 displaces the focal position by displacing the entire laser irradiation unit 4.

The laser light emitted from the scanning unit 24 is parallel light. Therefore, the focal position can also be displaced by displacing only the condensing portion 26 with respect to the electrode plate 6. However, in order to prevent foreign matter from entering the laser irradiation unit 4, it is desirable that the incident unit 22, the scanning unit 24, and the light collecting unit 26 are airtightly connected to each other. Therefore, when only the condensing unit 26 is displaced, it is necessary to separately take measures against the entry of foreign matter into the connection portion between the scanning unit 24 and the condensing unit 26, which may complicate the structure of the laser irradiation unit 4. On the other hand, by setting the displacement target of the position displacement unit 42 to the entire laser irradiation unit 4, the focal position can be displaced without complicating the structure of the laser irradiation unit 4.

Further, the cutting device 1 of the present embodiment includes a transport unit 2 for transporting the electrode plate 6. The electrode plate 6 has a long strip shape in the transport direction A, and the electrode active material coating portion 12 arranged at the center of the width direction B orthogonal to the transport direction A in the electrode plate 6 and the width direction B in the electrode plate 6 It has a non-coated portion 14 of the electrode active material arranged at the end portion of the. The laser irradiation unit 4 cuts at least the non-applied portion 14 to form a plurality of tab portions 10 arranged at predetermined intervals in the transport direction A. As a result, the high-quality tab portion 10 can be stably formed.

The embodiment of the present disclosure has been described in detail above. The embodiments described above are merely specific examples of carrying out the present disclosure. The content of the embodiments does not limit the technical scope of the present disclosure, and many designs such as changes, additions, deletions, etc. of components are made without departing from the ideas of the present disclosure defined in the claims. It can be changed. The new embodiment with the design change has the effects of the combined embodiment and the modification. In the above-described embodiment, the contents that can be changed in design are emphasized by adding notations such as "in the present embodiment" and "in the present embodiment". Design changes are allowed even if there is no content. Any combination of the above components is also valid as an aspect of the present disclosure. The hatching attached to the cross section of the drawing does not limit the material of the object to which the hatching is attached.

The cutting device 1 may be an individualized unit electrode plate 8 from the electrode plate 6. The electrode plate 6 may be a stack of a unit electrode plate 8 and a separator. The structure of the laser irradiation unit 4 and the position displacement unit 42 is not particularly limited as long as the focal position can be adjusted.

The invention according to the above-described embodiment may be specified by the items described below.
[Item 1]
The electrode plate (6) is irradiated with laser light (L) to perform cutting processing.
Obtain information about the focal position of the laser beam (L) and
Including shifting the focal position based on the acquired information,
Cutting method.

This disclosure can be used for cutting devices and cutting methods.

1 cutting device, 2 transport part, 4 laser irradiation part, 6 electrode plate, 10 tab part, 12 coating part, 14 non-coating part, 22 incident part, 24 scanning part, 26 condensing part, 40 information acquisition part, 42 position Displacement unit, 44 control unit, 46 irradiation marks, 48 image pickup device, 100 laser oscillator.

Claims

A laser irradiation unit that irradiates the electrode plate with laser light to perform cutting processing,
An information acquisition unit that acquires information about the focal position of the laser beam, and
The position displacement part that displaces the focal position and
A control unit that controls the position displacement unit based on the information acquired by the information acquisition unit is provided.
Cutting device.
The information acquisition unit acquires information on the width dimension of the irradiation mark of the laser beam formed on the electrode plate as information on the focal position.
The control unit controls the position displacement unit according to the width dimension of the irradiation mark.
The cutting device according to claim 1.
The information acquisition unit has an image pickup device that captures the irradiation mark, and acquires an image of the irradiation mark as information regarding the width dimension of the irradiation mark.
The cutting device according to claim 2.
The laser irradiation unit is
The incident part where the laser beam oscillated by the laser oscillator is incident and
A scanning unit that scans the electrode plate with the laser beam incident on the incident portion, and a scanning unit.
It has a condensing unit that condenses the laser light emitted from the scanning unit on the electrode plate.
The position displacement portion displaces the focal position by displacing the entire laser irradiation portion.
The cutting device according to any one of claims 1 to 3.
The cutting device includes a transport unit for transporting the electrode plate.
The electrode plate has a long strip in the transport direction, and has a coating portion of an electrode active material arranged at the center of the electrode plate in the width direction orthogonal to the transport direction, and an end portion in the electrode plate in the width direction. With a non-coated portion of the electrode active material, which is arranged in
The laser irradiation unit cuts at least the non-applied portion to form a plurality of tab portions arranged at predetermined intervals in the transport direction.
The cutting device according to any one of claims 1 to 4.
The electrode plate is irradiated with laser light to cut it,
Obtaining information about the focal position of the laser beam,
Including displacement of the focal position based on the acquired information,
Cutting method.