WO2021251594A1 - Dispositif électronique comprenant un boîtier - Google Patents

Dispositif électronique comprenant un boîtier Download PDF

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Publication number
WO2021251594A1
WO2021251594A1 PCT/KR2021/002868 KR2021002868W WO2021251594A1 WO 2021251594 A1 WO2021251594 A1 WO 2021251594A1 KR 2021002868 W KR2021002868 W KR 2021002868W WO 2021251594 A1 WO2021251594 A1 WO 2021251594A1
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WO
WIPO (PCT)
Prior art keywords
electronic device
particles
housing
module
length
Prior art date
Application number
PCT/KR2021/002868
Other languages
English (en)
Korean (ko)
Inventor
황한규
권기범
박진형
김영일
조성호
라토르프런비르싱
홍인국
Original Assignee
삼성전자 주식회사
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Filing date
Publication date
Application filed by 삼성전자 주식회사 filed Critical 삼성전자 주식회사
Publication of WO2021251594A1 publication Critical patent/WO2021251594A1/fr

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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/0279—Improving the user comfort or ergonomics
    • H04M1/0283—Improving the user comfort or ergonomics for providing a decorative aspect, e.g. customization of casings, exchangeable faceplate
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/0017—Casings, cabinets or drawers for electric apparatus with operator interface units
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/0086—Casings, cabinets or drawers for electric apparatus portable, e.g. battery operated apparatus
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/02—Details
    • H05K5/03—Covers

Definitions

  • Various embodiments relate to an electronic device including a housing.
  • the housing of the electronic device may include a bottom portion and a sidewall extending from an edge of the bottom portion in a height direction of the housing.
  • Various components of the electronic device may be disposed in a space provided by the bottom portion and the sidewall of the housing.
  • a laser process may be used to implement various textures on the outer surface of the housing.
  • a pattern having different textures may be formed on the exterior of the housing by forming a deposition film on the outer surface of the injected housing, and peeling off the deposition film through laser processing.
  • peeling and/or carbonization of the surface of the deposited film may occur due to laser processing. This phenomenon may cause a decrease in yield, and material cost may also increase due to the decrease in yield. In addition, uneven processing marks of the laser process on the surface of the housing may deteriorate the design aesthetics of the housing.
  • An electronic device provides a method for implementing various textures on an outer surface of a housing of the electronic device.
  • the electronic device includes a display forming at least a portion of a front surface of the electronic device, a bottom portion forming a rear surface of the electronic device, and extending from the bottom portion toward the display and the electronic device a housing comprising a side wall defining at least a portion of a side of a first portion comprising first particles of The first part may have a color different from that of the second part by the first particles being more disorderly oriented than the second particles.
  • An electronic device includes a substantially transparent window, a display disposed under the window, and a housing disposed under the display, wherein the housing includes a bottom forming a rear surface of the electronic device. portion), a side wall extending from an edge of the bottom portion toward the display, a first portion comprising first particles having an aspect ratio (length/width) of a first size, and a first portion smaller than the first size a second portion comprising second particles having an aspect ratio of two sizes, wherein the first particles are more disorderly oriented than the second particles, the first portion having a different color than the second portion;
  • the first portion may be exposed to the outside of the housing along a circumference of the sidewall.
  • An electronic device may provide a housing in which various textures are implemented.
  • the electronic device may provide an injection product including a deep part having a color different from that of the surface layer by using particles having different aspect ratios, and different textures through the surface layer and the deep part exposed by processing the surface layer It is possible to provide a housing having a.
  • the electronic device may reduce manufacturing costs by providing a housing in which various textures are implemented using one type of resin without deposition and laser processes.
  • FIG 1 illustrates an electronic device according to an embodiment.
  • FIG. 2 is an exploded perspective view of an electronic device according to an exemplary embodiment
  • 3A is a perspective view of a housing according to an exemplary embodiment
  • FIG. 3B illustrates cross-sections A-A' and B-B' of FIG. 3A according to an embodiment.
  • 3C illustrates region C of FIG. 3A according to one embodiment.
  • FIG. 4 shows a mold according to an embodiment.
  • FIG. 5 is a diagram illustrating a behavior of a resin in a cavity, according to an embodiment.
  • FIG. 6 is a photomicrograph of a cross-section of a housing including metal oxide powder, according to an embodiment.
  • FIG. 7 illustrates a cross-section of a housing in which resin is injected through a gate, according to an embodiment.
  • FIG. 8 shows a tool mark of a housing, according to an embodiment.
  • FIG. 9A illustrates a housing, according to an embodiment.
  • FIG. 9B illustrates a housing, according to one embodiment.
  • FIG. 10 is a block diagram of an electronic device in a network environment according to an embodiment.
  • FIG 1 illustrates an electronic device 101 according to an embodiment.
  • an electronic device 101 may include a window 102 , a display 160 , a housing 110 , and a first bracket 120 .
  • the window 102 of the electronic device 101 may be substantially transparent.
  • the window 102 may form at least a portion of the front surface 101A of the electronic device 101 .
  • Window 102 may be formed by glass and/or polymer including various coating layers.
  • the display 160 may be disposed below the window 102 .
  • Display 160 may be visually exposed through at least a portion of window 102 .
  • the edge of the display 160 may be formed to have substantially the same shape as an adjacent outer shape of the window 102 .
  • the distance between the perimeter of the display 160 and the perimeter of the window 102 may be substantially the same.
  • the display 160 may be disposed adjacent to or coupled to a touch sensing circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and/or a digitizer that detects a magnetic field type stylus pen. .
  • the display 160 may include an opening 162 . At least one of an audio module, a sensor module, a camera module, and/or a light emitting device (not shown) may be disposed in the opening 162 . In another embodiment, at least one of the audio module, the sensor module, the camera module, the fingerprint sensor, and/or the light emitting device is disposed on the rear surface of the screen display area of the display 160 rather than the opening 162 . can be
  • the audio module may include a receiver for a call that is distinct from the speaker hole 104 .
  • the sensor module may generate an electrical signal or data value corresponding to an internal operating state of the electronic device 101 or an external environmental state.
  • the sensor module may include, for example, a proximity sensor and/or a fingerprint sensor.
  • the fingerprint sensor may be disposed on the rear surface 101B of the electronic device 101 instead of the opening 162 of the display 160 or the rear surface of the display 160 .
  • the electronic device 101 includes a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor. It may further include at least one of.
  • the housing 110 may include at least a portion of the side surface 101C and the rear surface 101B of the electronic device 101 .
  • the housing 110 may be formed of glass, ceramic, polymer, or a combination of at least two of the above materials.
  • the first bracket 120 may be disposed between the window 102 and the housing 110 . At least a portion of the first bracket 120 may be accommodated in the housing 110 , and a portion in which the first bracket 120 is accommodated in the housing 110 may not be visible from the outside of the electronic device 101 .
  • the first bracket 120 may support various components (eg, a battery) of the electronic device 101 .
  • the first bracket 120 may include a metal (eg, aluminum) and/or a polymer.
  • the electronic device 101 includes a speaker hole 104 , a microphone hole 103 , a connector hole 108 , a key input device 117 , a camera module 114 , and/or a flash 113 .
  • a speaker hole 104 the electronic device 101 includes a speaker hole 104 , a microphone hole 103 , a connector hole 108 , a key input device 117 , a camera module 114 , and/or a flash 113 .
  • ) may include at least one of.
  • a microphone for acquiring an external sound may be disposed inside the microphone hole 103, and in some embodiments, a plurality of microphones may be disposed to detect the direction of the sound.
  • the speaker hole 104 may be disposed on the side surface 101C of the electronic device 101 .
  • the speaker hole 104 may be implemented as a single hole with the microphone hole 103 or may include a speaker in which the hole is omitted (eg, a piezo speaker).
  • the connector hole 108 may accommodate a connector (eg, a USB connector) for transmitting and receiving at least one of power, data, and/or audio signals to and from an external electronic device.
  • a connector eg, a USB connector
  • the key input device 117 may be disposed on the side surface 110C of the housing 110 .
  • the electronic device 101 may not include some or all of the key input devices 117 , and the not included key input devices 117 may be implemented in other forms, such as soft keys, on the display 160 .
  • the key input device 117 may include a sensor module (eg, an HRM sensor, a fingerprint sensor).
  • the camera module 114 may be disposed on the rear surface 101B of the housing 110 .
  • the camera module 114 may be inserted into an opening formed in the rear surface 101B of the housing 110 , and a part of the camera module 114 may be disposed to protrude from the housing 110 .
  • the camera module 114 may include one or more lenses (eg, wide-angle and telephoto lenses, etc.), an image sensor, and/or an image signal processor.
  • the flash 113 may include a light emitting diode or a xenon lamp.
  • the flash 113 may provide a light source in association with the operation of the camera module 114 , or may provide a light source regardless of the operation of the camera module 114 .
  • FIG. 2 is an exploded perspective view of an electronic device 101 according to an exemplary embodiment.
  • the electronic device 101 includes a window 102 , a display 160 , a first bracket 120 , a battery 210 , a printed circuit board (PCB) 230 , and a second bracket 220 . , and/or may include at least one of the housing 110 .
  • PCB printed circuit board
  • the window 102 may be disposed on the display 160 (eg, in the direction 1).
  • the window 102 may further include a light blocking film 202 for covering a non-display area of the display 160 visible through the window 102 and a portion of the first bracket 120 .
  • the display 160 may be disposed between the window 102 and the first bracket 120 .
  • the display 160 may be electrically connected to the PCB 230 by a flexible printed circuit board (not shown).
  • the first bracket 120 may be disposed between the display 160 and the PCB 230 .
  • the first bracket 120 may support various components of the electronic device 101 or provide a space for accommodating the components of the electronic device 101 .
  • the first bracket 120 disposed below the display 160 (eg, in the direction of 2) may support the display 160 .
  • the first bracket 120 may provide a seating space 121 capable of accommodating the battery 210 .
  • At least a portion of the first bracket 120 may be operated as an antenna radiator for transmitting and receiving a wireless communication signal. At least a portion of the first bracket 120 used as the antenna radiator may include metal.
  • the battery 210 may be accommodated in the seating space 121 of the first bracket 120 .
  • the battery 210 may store power required for the electronic device 101 .
  • Battery 210 may include, for example, a non-rechargeable primary cell, a rechargeable secondary cell, or a fuel cell.
  • the battery 210 may be integrally disposed inside the electronic device 101 , or may be disposed to be detachably attached from the electronic device 101 .
  • the PCB 230 may be disposed between the first bracket 120 and the second bracket 220 .
  • the PCB 230 may be supported by the first bracket 120 and/or the second bracket 220 .
  • the PCB 230 may be equipped with a processor, a memory, and an interface.
  • the processor may include, for example, one or more of a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor hub processor, or a communication processor.
  • Memory may include, for example, volatile memory or non-volatile memory.
  • the interface may include, for example, at least one of a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, and/or an audio interface.
  • HDMI high definition multimedia interface
  • USB universal serial bus
  • SD card interface Secure Digital Card interface
  • the interface may, for example, electrically or physically connect the electronic device 101 to an external electronic device, and may include a USB connector, an SD card/MMC connector, or an audio connector.
  • the PCB 230 may provide an electrical connection path between various components of the electronic device 101 .
  • the camera module 114 , the battery 210 , the display 160 , and the processor are each directly or indirectly electrically connected to the PCB 230 , and the processor is electrically connected to the PCB 230 . It may be operatively connected to the camera module 114 , the battery 210 , and the display 160 through the connection path.
  • the PCB 230 includes a first PCB 231 , a second PCB 232 , and a flexible printed circuit board (FPCB) 233 connecting the first PCB 231 and the second PCB 232 . ) may be included. In another embodiment, unlike shown, the PCB 230 may be integrally formed without being separated into the first PCB 231 and the second PCB 232 .
  • FPCB flexible printed circuit board
  • the second bracket 220 may be disposed between the PCB 230 and the housing 110 .
  • the second bracket 220 may be accommodated in a space formed by the housing 110 .
  • the second bracket 220 may include a metal and/or a non-metal (eg, a polymer).
  • the housing 110 may be disposed under the second bracket 220 (eg, in the direction of 2). In an embodiment, the housing 110 may be physically coupled to the first bracket 120 and/or the second bracket 220 .
  • the housing 110 may be coupled to the first bracket 120 and/or the second bracket 220 by at least one coupling member (eg, a screw) not shown.
  • the housing 110 may be coupled to the first bracket 120 and/or the second bracket 220 by an adhesive member (eg, an adhesive tape or an adhesive solution) not shown.
  • 3A is a perspective view of a housing 110 according to an exemplary embodiment.
  • FIG. 3B illustrates cross-sections A-A' and B-B' of FIG. 3A according to an embodiment.
  • 3C illustrates region C of FIG. 3A according to one embodiment.
  • the housing 110 may include a bottom portion 310 and a sidewall 320 .
  • the bottom portion 310 may include a substantially flat area.
  • the bottom portion 310 may form the rear surface (eg, the rear surface 101B of Fig. 1 ) of the electronic device 101.
  • the bottom portion 310 may extend from the center of the housing 110 toward the outside of the center.
  • the bottom part 310 may extend along the xy plane from the center of the housing 110.
  • the bottom part 310 may have various design changes other than the illustrated shape.
  • a portion of the bottom portion 310 may include a substantially flat area and a curved area extending from an edge of the flat area toward the sidewall 320.
  • the bottom portion The entirety of the 310 may be formed as a curved surface, in this case, the curved surface of the bottom portion 310 may be less than that of the sidewall 320 .
  • the sidewall 320 may extend from the edge of the bottom part 310 in the height direction of the housing 110 .
  • the sidewall 320 may extend from the edge of the bottom part 310 in the -z-axis direction.
  • the sidewall 320 may extend from the bottom 310 toward the display of the electronic device 101 (eg, the display 160 of FIG. 2 ).
  • the sidewall 320 may form at least a portion of a side surface (eg, the side surface 101C of FIG. 1 ) of the electronic device 101 .
  • the sidewall 320 may include a curved surface.
  • the sidewall 320 may be bent at the edge of the bottom portion 310 to extend in the -z-axis direction, and the sidewall 320 may smoothly extend from the bottom portion 310 .
  • the bottom 310 and the sidewall 320 of the housing 110 may be integrally formed through an injection process.
  • the housing 110 may provide a space in which components of the electronic device 101 can be accommodated by the bottom 310 and the sidewall 320 bent and extended from the bottom 310 . .
  • the bottom portion 310 may include an opening 312 .
  • the camera module 114 and the flash 113 may be disposed, but is not limited thereto.
  • the housing 110 may include a first portion 111 and a second portion 112 .
  • the first portion 111 may be positioned or formed in a designated area of the housing 110 .
  • the first portion 111 may form a designated area among the side surfaces ( 101C of FIG. 1 ) of the electronic device 101 formed by the sidewall 320 .
  • the designated area formed by the first portion 111 may extend along the circumference of the sidewall 320 of the housing 110 .
  • the width t of the first portion 111 may be substantially the same over the entire first portion 111 .
  • the width t of the first part 111 is not limited by the illustrated example.
  • the first portion 111 may include portions having different widths (t) than illustrated. The width t of the first part 111 may be changed in various designs according to an injection process and/or a post-injection processing process.
  • the first portion 111 may be formed in the center of the sidewall 320 based on the height direction (z-axis direction) of the sidewall 320 .
  • the first portion 111 may be spaced apart from the end 322 of the sidewall 320 by a height h.
  • the present invention is not limited thereto.
  • the first portion 111 may include an end 322 of the sidewall 320 (eg, the housing 110 of FIG. 9B ).
  • the first portion 111 is formed on the sidewall 320 differently from the illustration, but may be formed on the boundary between the sidewall 320 and the bottom portion 310 .
  • the first portion 111 may be disposed between the second portions 112 .
  • the first portion 111 may include a portion of the edge of the sidewall 320 .
  • the second portion 112 may include a portion of an edge of the bottom portion 310 and an edge of the sidewall 320 .
  • the first portion 111 may be a portion in which the deep portion ( 501 in FIG. 7 ) is exposed to the outside of the housing 110 .
  • the second portion 112 may be a portion in which the surface layer ( 502 of FIG. 7 ) is exposed to the outside of the housing 110 .
  • the first portion 111 may have a different color and/or texture from the second portion 112 .
  • the first portion 111 may include first particles having a needle-like shape having a first length.
  • the first particles may include, for example, metal oxide powder to be described later.
  • the second portion 112 may include needle-shaped second particles having a second length shorter than the first length.
  • the second particles may include pearl particles to be described later.
  • the first portion 111 may have a designated color and/or texture different from that of the second portion 112 as the first particles are oriented more disorderly than the second particles.
  • the first portion 111 and the second portion 112 may have a gradation color.
  • the color and/or texture of each of the first part 111 and the second part 112 may vary depending on the raw material added to the injection process of the housing 110 and the post-injection processing process of the housing 110 .
  • FIG. 4 illustrates a mold 400 according to an embodiment.
  • FIG. 5 is a diagram illustrating a behavior of a resin in a cavity, according to an embodiment.
  • FIG. 6 is a micrograph of a cross-section of the housing 110 including metal oxide powder, according to an embodiment.
  • FIG. 7 illustrates a cross-section of the housing 110 in which the resin is injected through the gate 403, according to an embodiment.
  • FIG. 8 illustrates a tool mark of the housing 110 , according to an embodiment.
  • the housing 110 may be manufactured through an injection process using a mold 400 .
  • the mold 400 may include a sprue 401 , a runner 402 , a gate 403 , and a cavity 404 .
  • the melted raw material may flow into the sprue 401 of the mold 400 through the nozzle, and pass through the runner 402 and the gate 403 to the cavity 404 having the shape of the housing 110 .
  • ) can be injected into the space of
  • defects such as weld lines and/or flow lines may occur during the injection process.
  • the mold 400 may have a single fan gate structure in which an inlet through which the resin is injected into the cavity 404 is expanded.
  • the openings (eg, the opening 312 of FIG. 3A ) of the housing 110 that may cause the weld line may be formed through separate processing after injection and painting processes.
  • the mold 400 may have various design changes.
  • the mold 400 may further include a flange shape in order to smoothly remove gas generated during the injection process and improve the quality of the appearance of the injection product.
  • the raw material input in the injection process may include at least one of a resin material, a colorant, pearl particles, and/or a metal oxide powder.
  • the resin material is, for example, polyethylene (PE), polypropylene (PP), polystyrene (PS), polyphenylene ether (PPE), polyphenylene sulfide (PPS), polycarbonate (PC) , polyvinyl chloride (PVC), polyamide (PA), acrylonitrile-butadiene-styrene copolymer (ABS), and/or combinations thereof.
  • PE polyethylene
  • PP polypropylene
  • PS polystyrene
  • PPE polyphenylene ether
  • PPS polyphenylene sulfide
  • PC polycarbonate
  • PVC polyvinyl chloride
  • PA acrylonitrile-butadiene-styrene copolymer
  • ABS acrylonitrile-butadiene-styrene copolymer
  • the colorant is for implementing a color in the resin, and may include various dyes or pigments.
  • the particle shape of the colorant may have the shape of a sphere or a hexahedron.
  • the pearl particles are for implementing a high-grade color such as a pearl effect on the housing 110 , and may include mica and/or silicate minerals.
  • the pearl particles may have a size of about 10 ⁇ m or more and 30 ⁇ m or less, and an aspect ratio of 1 or more and 2 or less.
  • the aspect ratio may be defined as a ratio (length/width) of the length and width of the particle.
  • the metal oxide powder is to implement a color and/or texture different from the color and/or texture implemented in the colorant and pearl particles, and azurite (Cu 3 (CO 3 ) 2 (OH) 2 ), oxidation It may include at least one of aluminum (Al 2 O 3 ), copper oxide (CuSO 4 ), and/or zinc oxide (ZnO).
  • the shape of the metal oxide powder may be a two-dimensional needle shape.
  • the metal oxide powder may have a length of 50 ⁇ m or more and 300 ⁇ m or less.
  • the metal oxide powder may have an aspect ratio of 70 or more and 100 or less. However, the metal oxide powder may have an aspect ratio of 10 or more and 30 or less as it is input into the injection molding apparatus, heated and pulverized.
  • the metal oxide powder may have a longer length than the pearl particles.
  • the metal oxide powder may have a first length, and the pearl particles may have a second length shorter than the first length.
  • raw materials having different aspect ratios may exhibit different behaviors in dispersibility and orientation within the injection product during the injection process of the housing 110 .
  • the resin injected into the space within the cavity 404 may exhibit a behavior of the fractional flow 510 .
  • the resin of the surface layer 502 (or solidified layer) that is relatively close to the cavity 404 plane has a higher shear force than the deep part 501 (or fluidized bed) corresponding to the center of the space within the cavity 404, It can cool faster.
  • the resin of the deep portion 501 is subjected to a lower shear force than the surface layer 502 , and may be cooled more slowly.
  • the additive of particles having no aspect ratio may be uniformly dispersed in the extrudate without distinction of the deep portion 501 or the surface layer 502 .
  • Particles having an aspect ratio (or having an aspect ratio greater than 1) are oriented (or aligned) according to the flow direction of the resin in the surface layer 502 , and are less affected by the flow of resin than the surface layer 502 in the deep part 501 . Therefore, it can be oriented randomly.
  • the aspect ratio of the particles added to the resin increases, the degree of disorder in which the particles are oriented may increase, and may be dispersed in a manner centralized to the center of the deep portion 501 in the resin layer.
  • a layer in which particles are randomly oriented such as the deep portion 501
  • a layer in which particles are oriented in a constant direction such as the surface layer 502
  • a non-oriented layer is defined as a “non-oriented layer”.
  • the degree of disorder may mean a distribution of an angle at which particles are oriented. For example, assuming that the flow direction of the resin is a reference angle, since the particles of the surface layer 502 are generally oriented in the flow direction of the resin, the orientation angle of the particles may be mostly the same as the flow direction of the resin. Since the particles of the deep part 501 are each oriented at an angle different from the flow direction of the resin, the orientation angle range of the particles of the deep part 501 may be formed in a wider range than that of the surface layer 502 .
  • the metal oxide powder particles 601 have a larger aspect ratio than other additives 602 (eg, pearl powder), they may be concentrated and distributed in the deep portion 501 , An alignment layer may be formed in the deep portion 501 .
  • the alignment layer may not be formed in the deep portion 501 of pearl particles having a small particle size and not a large aspect ratio (eg, 1 or more and 2 or less).
  • the thickness d of the surface layer 502 may be, for example, 0.4 mm.
  • the present invention is not limited thereto, and the thickness d of the surface layer 502 may vary depending on the temperature of the cavity, the temperature of the injection product, the injection rate of the resin, and the cooling rate of the resin.
  • a resin may be injected through the gate 403 to form an injection molded product in the shape of a housing 110 having a deep portion 501 and a surface layer 502 . Since the phenomenon of separation into the deep portion 501 and the surface layer 502 occurs while the molten resin is solidified, it may not occur in the gate 403 having a relatively high temperature, and the distance from the gate 403 may increase. It may be more serious.
  • an alignment layer made of metal oxide powder may be formed in the deep portion 501 of the housing 110 .
  • the colorant and pearl particles may be evenly dispersed in the deep portion 501 and the surface layer 502 .
  • the deep part 501 may have a color and/or texture different from that of the surface layer 502 .
  • the metal oxide includes azurite (Cu 3 (CO 3 ) 2 (OH) 2 )
  • the deep part 501 may have a navy blue color
  • copper oxide (Cu 2 O) In the case of including zinc oxide (ZnO), it may have a light gray color, and when aluminum oxide (Al 2 O 3 ) is included, it may have a dark gray color.
  • the color may vary depending on the aspect ratio and size of the metal oxide powder, and may also vary depending on the composition ratio of the materials.
  • the deep portion 501 since the deep portion 501 is formed of metal oxide powder, it may have a texture (eg, metal texture) different from that of the surface layer 502 in which a color is realized by pigment and pearl particles.
  • the housing 110 may not include glass fibers and carbon fibers. Since the glass fiber and the carbon fiber have a needle-like shape and have an aspect ratio of 20 to 200, an alignment layer can be formed like a metal oxide powder. However, since glass fibers have a translucent milky-like color and carbon fibers have a colored (eg, black) color, there is a limit to the colors that can be implemented. In addition, when mixed with the metal oxide powder, the color may not be naturally mixed with the color realized by the metal oxide powder, and the color displayed by the glass fiber and the carbon fiber may be formed like a stain.
  • the injection-completed housing 110 may remove the gate 403 and process the surface layer 502 to expose the deep portion 501 to the outside.
  • the housing 110 may be processed to expose the deep portion 501 to the outside.
  • the deep portion 501 may be exposed to the outside.
  • the process of removing the gate 403 may be performed together with processing for exposing the deep portion 501 or may be performed separately.
  • CNC machining may be used to expose the deep portion 501 .
  • a tool mark that is a trace of the tool passing may be formed.
  • a tool mark 810 may be formed on the first portion 111 of the housing 110 .
  • the tool marks may extend in a direction substantially perpendicular to the longitudinal direction of the first part 111 (eg, the z-axis direction of FIG. 3A ), and may be arranged at regular intervals along the longitudinal direction of the first part 111 . have.
  • laser processing marks may be formed on the housing in which the deposition film is peeled off through laser processing. Since laser processing is performed through a thermal reaction by a partially scanned laser beam, the size and/or spacing of circular processing marks may not be uniform.
  • FIG. 9A shows a housing 110 , according to an embodiment.
  • FIG. 9B shows a housing 110 , according to an embodiment.
  • various patterns may be formed on the housing 110 according to a processing process for exposing the deep portion 501 .
  • the deep portion 501 may be processed to be partially exposed.
  • the first portion 111-1 to which the deep portion 501 is exposed may be separated by the other second portion 112-1.
  • the first part 111-1 may be separated by the second part 112-1 at at least one place.
  • a strip having a stripe pattern surrounding the sidewall 320 of the housing 110 may be formed by the first portion 111-1 and the second portion 112-1.
  • the pattern by the first part 111-1 and the second part 112-1 may have various design changes.
  • the lengths of the first parts 111-1 separated from each other may be different, respectively, and the lengths of the second parts 112-1 separating the first parts 111-1 may also be different from each other.
  • the lengths of the first portions 111-1 may be substantially the same as each other, and the lengths of the second portions 112-1 may also be substantially equal to each other.
  • the first portion 111 of the housing 110 may be formed by processing along the circumference of the sidewall 320 of the housing 110 .
  • a band-shaped pattern surrounding the housing 110 may be formed by the first part 111 having a color and/or texture different from that of the second part 112 .
  • the first portion 111 of the housing 110 may be a portion in which the deep portion 501 is exposed to the outside.
  • the second portion 112 of the housing 110 may be part of the surface layer 502 .
  • the width t of the first part 111 may vary depending on the degree of processing the injected housing 110 , and according to the processing position, the first The height h of the portion 111 may also vary.
  • the first portion 111 when processing the housing 110 as shown in the dotted line 1 of FIG. 7 , the first portion 111 is the end portion 322 of the side wall 320 like the housing 110 shown in FIG. 3C . ) can be spaced apart from the height (h).
  • the first part 111 is the end 322 of the side wall 320 . may include
  • the height h of the first portion 111 may vary depending on the position of the gate 403 .
  • the first portion 111 may correspond to the position of the gate 403 .
  • the electronic device (eg, the electronic device 101 of FIG. 2 ) according to an embodiment includes a display (eg, the display of FIG. 2 ) that forms at least a part of the front surface (eg, the front surface 101A of FIG. 1 ) of the electronic device 160), and a bottom portion (eg, bottom 310 in FIG. 3A) forming a rear surface (eg, rear surface 101B of FIG. 1) of the electronic device and the display from the bottom
  • a housing eg, FIG. 3A
  • FIG. 3A that includes a side wall (eg, sidewall 320 of FIG. 3A ) extending toward and forming at least a portion of a side surface (eg, side 101C of FIG.
  • the housing forms a designated area of at least a portion of the side surface formed by the side wall, and has a first length of needle-shaped first particles (eg, FIG. 6 ) 601) of a first portion (eg, the first portion 111 in FIG. 3A ) and a second forming at least a portion of the side surface and a portion of the rear surface, the second length having a second length shorter than the first length a second portion (eg, second portion 112 in FIG. 3A ) comprising particles (eg, 602 in FIG. 6 ), wherein the first portion comprises: wherein the first particles are greater than the second particles By being randomly oriented, it may have a color different from that of the second portion.
  • the first particles may include metal oxide powder.
  • the metal oxide powder is azurite (Cu 3 (CO 3 ) 2 (OH) 2 ), aluminum oxide (Al 2 O 3 ), copper oxide (CuSO 4 ), or zinc oxide (ZnO) ) may include at least one of.
  • the second particles may include pearl particles.
  • the pearl particles may include at least one of mica and silicate minerals.
  • the designated area may extend to a designated width along the circumference of the sidewall.
  • the designated area may extend along the circumference of the sidewall and be separated by the second part (eg, the second part 112-1 of FIG. 9A ).
  • a tool mark (eg, 810 of FIG. 8 ) may be formed in the designated area.
  • the housing may not include glass fibers and carbon fibers.
  • the first length may be greater than or equal to 50um and less than or equal to 300um.
  • the first particles may have an aspect ratio (length/width) of 10 or more and 30 or less.
  • the second length may be 10 ⁇ m or more and 30 ⁇ m or less.
  • the second particles may have an aspect ratio (length/width) of 1 or more and 2 or less.
  • the housing may include an opening (eg, the opening 312 of FIG. 3A ) formed in the bottom.
  • the housing may include a pigment having a spherical or hexahedral particle shape.
  • the electronic device (eg, the electronic device 101 of FIG. 2 ) according to an embodiment includes a substantially transparent window (eg, the window 102 of FIG. 2 ) and a display (eg, the display of FIG. 2 ) disposed below the window. display 160), and a housing disposed under the display (eg, housing 110 of FIG. 3A ), wherein the housing includes a rear surface of the electronic device (eg, rear surface 101B of FIG. 1 ).
  • a bottom portion eg, the bottom portion 310 of FIG. 3A
  • a side wall extending from an edge of the bottom portion toward the display (eg, the sidewall 320 of FIG. 3A ), the second A first portion (eg, first portion 111 in FIG.
  • first particles eg, 601 in FIG. 6
  • second portion eg, second portion 112 in FIG. 3A
  • second particles eg, 602 in FIG. 6
  • the particles may be oriented more disorderly than the particles, the first portion may have a different color than the second portion, and the first portion may be exposed to the outside of the housing along a perimeter of the sidewall.
  • the first size may be 10 or more and 30 or less, and the second size may be 1 or more and 2 or less.
  • the first particles are azurite (Cu 3 (CO 3 ) 2 (OH) 2 ), aluminum oxide (Al 2 O 3 ), copper oxide (CuSO 4 ), or zinc oxide (ZnO) may include at least one of
  • the second particles may include at least one of mica and silicate minerals.
  • the first portion exposed to the outside may be separated from at least one portion by the second portion (eg, the second portion 112-1 of FIG. 9A ).
  • FIG. 10 is a block diagram of an electronic device 1001 in a network environment 1000 according to various embodiments of the present disclosure.
  • the electronic device 1001 communicates with the electronic device 1002 through a first network 1098 (eg, a short-range wireless communication network) or a second network 1099 . It may communicate with the electronic device 1004 or the server 1008 through (eg, a long-distance wireless communication network). According to an embodiment, the electronic device 1001 may communicate with the electronic device 1004 through the server 1008 .
  • the electronic device 1001 includes a processor 1020 , a memory 1030 , an input module 1050 , a sound output module 1055 , a display module 1060 , an audio module 1070 , and a sensor module ( 1076), interface 1077, connection terminal 1078, haptic module 1079, camera module 1080, power management module 1088, battery 1089, communication module 1090, subscriber identification module 1096 , or an antenna module 1097 .
  • at least one of these components eg, the connection terminal 1078
  • some of these components are integrated into one component (eg, display module 1060 ). can be
  • the processor 1020 for example, executes software (eg, a program 1040) to execute at least one other component (eg, a hardware or software component) of the electronic device 1001 connected to the processor 1020. It can control and perform various data processing or operations. According to one embodiment, as at least part of data processing or computation, the processor 1020 converts commands or data received from other components (eg, the sensor module 1076 or the communication module 1090) to the volatile memory 1032 . may be stored in , process commands or data stored in the volatile memory 1032 , and store the result data in the non-volatile memory 1034 .
  • software eg, a program 1040
  • the processor 1020 converts commands or data received from other components (eg, the sensor module 1076 or the communication module 1090) to the volatile memory 1032 .
  • the volatile memory 1032 may be stored in , process commands or data stored in the volatile memory 1032 , and store the result data in the non-volatile memory 1034 .
  • the processor 1020 is the main processor 1021 (eg, central processing unit or application processor) or the auxiliary processor 1023 (eg, graphic processing unit, neural network processing unit) a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor).
  • the main processor 1021 e.g, central processing unit or application processor
  • the auxiliary processor 1023 e.g, graphic processing unit, neural network processing unit
  • NPU neural processing unit
  • an image signal processor e.g., a sensor hub processor
  • a communication processor e.g., a communication processor
  • the coprocessor 1023 may, for example, act on behalf of the main processor 1021 while the main processor 1021 is in an inactive (eg, sleep) state, or when the main processor 1021 is active (eg, executing an application). ), together with the main processor 1021, at least one of the components of the electronic device 1001 (eg, the display module 1060, the sensor module 1076, or the communication module 1090) It is possible to control at least some of the related functions or states.
  • coprocessor 1023 eg, image signal processor or communication processor
  • may be implemented as part of another functionally related component eg, camera module 1080 or communication module 1090. have.
  • the auxiliary processor 1023 may include a hardware structure specialized for processing an artificial intelligence model.
  • Artificial intelligence models can be created through machine learning. Such learning may be performed, for example, in the electronic device 1001 itself on which artificial intelligence is performed, or may be performed through a separate server (eg, server 1008).
  • the learning algorithm may include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but in the above example not limited
  • the artificial intelligence model may include a plurality of artificial neural network layers.
  • Artificial neural networks include deep neural networks (DNNs), convolutional neural networks (CNNs), recurrent neural networks (RNNs), restricted boltzmann machines (RBMs), deep belief networks (DBNs), bidirectional recurrent deep neural networks (BRDNNs), It may be one of deep Q-networks or a combination of two or more of the above, but is not limited to the above example.
  • the artificial intelligence model may include, in addition to, or alternatively, a software structure in addition to the hardware structure.
  • the memory 1030 may store various data used by at least one component of the electronic device 1001 (eg, the processor 1020 or the sensor module 1076 ).
  • the data may include, for example, input data or output data for software (eg, the program 1040 ) and instructions related thereto.
  • the memory 1030 may include a volatile memory 1032 or a non-volatile memory 1034 .
  • the program 1040 may be stored as software in the memory 1030 , and may include, for example, an operating system 1042 , middleware 1044 , or an application 1046 .
  • the input module 1050 may receive a command or data to be used in a component (eg, the processor 1020 ) of the electronic device 1001 from the outside (eg, a user) of the electronic device 1001 .
  • the input module 1050 may include, for example, a microphone, a mouse, a keyboard, a key (eg, a button), or a digital pen (eg, a stylus pen).
  • the sound output module 1055 may output a sound signal to the outside of the electronic device 1001 .
  • the sound output module 1055 may include, for example, a speaker or a receiver.
  • the speaker can be used for general purposes such as multimedia playback or recording playback.
  • the receiver may be used to receive an incoming call. According to one embodiment, the receiver may be implemented separately from or as part of the speaker.
  • the display module 1060 may visually provide information to the outside (eg, a user) of the electronic device 1001 .
  • the display module 1060 may include, for example, a control circuit for controlling a display, a hologram device, or a projector and a corresponding device.
  • the display module 1060 may include a touch sensor configured to sense a touch or a pressure sensor configured to measure the intensity of a force generated by the touch.
  • the audio module 1070 may convert a sound into an electric signal or, conversely, convert an electric signal into a sound. According to an embodiment, the audio module 1070 acquires a sound through the input module 1050 or an external electronic device (eg, a sound output module 1055 ) directly or wirelessly connected to the electronic device 1001 .
  • the electronic device 1002) eg, a speaker or headphones
  • the sensor module 1076 detects an operating state (eg, power or temperature) of the electronic device 1001 or an external environmental state (eg, a user state), and generates an electrical signal or data value corresponding to the sensed state. can do.
  • the sensor module 1076 may include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, It may include a temperature sensor, a humidity sensor, or an illuminance sensor.
  • the interface 1077 may support one or more specified protocols that may be used for the electronic device 1001 to directly or wirelessly connect with an external electronic device (eg, the electronic device 1002 ).
  • the interface 1077 may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.
  • HDMI high definition multimedia interface
  • USB universal serial bus
  • SD card interface Secure Digital Card
  • connection terminal 1078 may include a connector through which the electronic device 1001 can be physically connected to an external electronic device (eg, the electronic device 1002 ).
  • the connection terminal 1078 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (eg, a headphone connector).
  • the haptic module 1079 may convert an electrical signal into a mechanical stimulus (eg, vibration or movement) or an electrical stimulus that the user can perceive through tactile or kinesthetic sense.
  • the haptic module 1079 may include, for example, a motor, a piezoelectric element, or an electrical stimulation device.
  • the camera module 1080 may capture still images and moving images. According to one embodiment, the camera module 1080 may include one or more lenses, image sensors, image signal processors, or flashes.
  • the power management module 1088 may manage power supplied to the electronic device 1001 .
  • the power management module 1088 may be implemented as, for example, at least a part of a power management integrated circuit (PMIC).
  • PMIC power management integrated circuit
  • the battery 1089 may supply power to at least one component of the electronic device 1001 .
  • battery 1089 may include, for example, a non-rechargeable primary cell, a rechargeable secondary cell, or a fuel cell.
  • the communication module 1090 is a direct (eg, wired) communication channel or a wireless communication channel between the electronic device 1001 and an external electronic device (eg, the electronic device 1002, the electronic device 1004, or the server 1008). It can support establishment and communication performance through the established communication channel.
  • the communication module 1090 may include one or more communication processors that operate independently of the processor 1020 (eg, an application processor) and support direct (eg, wired) communication or wireless communication.
  • the communication module 1090 may include a wireless communication module 1092 (eg, a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 1094 (eg, : It may include a LAN (local area network) communication module, or a power line communication module).
  • a wireless communication module 1092 eg, a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module
  • GNSS global navigation satellite system
  • wired communication module 1094 eg, : It may include a LAN (local area network) communication module, or a power line communication module.
  • a corresponding communication module among these communication modules is a first network 1098 (eg, a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network 1099 (eg, legacy It may communicate with the external electronic device 1004 through a cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (eg, a telecommunication network such as a LAN or a WAN).
  • a first network 1098 eg, a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)
  • a second network 1099 eg, legacy It may communicate with the external electronic device 1004 through a cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (eg, a telecommunication network such as a LAN or a WAN).
  • These various types of communication modules
  • the wireless communication module 1092 uses subscriber information (eg, International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module 1096 within a communication network, such as the first network 1098 or the second network 1099 .
  • subscriber information eg, International Mobile Subscriber Identifier (IMSI)
  • IMSI International Mobile Subscriber Identifier
  • the electronic device 1001 may be identified or authenticated.
  • the wireless communication module 1092 may support a 5G network after a 4G network and a next-generation communication technology, for example, a new radio access technology (NR).
  • NR access technology includes high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and access to multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency) -latency communications)).
  • eMBB enhanced mobile broadband
  • mMTC massive machine type communications
  • URLLC ultra-reliable and low-latency
  • the wireless communication module 1092 may support a high frequency band (eg, mmWave band) to achieve a high data rate, for example.
  • a high frequency band eg, mmWave band
  • the wireless communication module 1092 uses various technologies for securing performance in a high-frequency band, for example, beamforming, massive multiple-input and multiple-output (MIMO), all-dimensional multiplexing. It may support technologies such as full dimensional MIMO (FD-MIMO), an array antenna, analog beam-forming, or a large scale antenna.
  • the wireless communication module 1092 may support various requirements specified in the electronic device 1001 , an external electronic device (eg, the electronic device 1004 ), or a network system (eg, the second network 1099 ).
  • the wireless communication module 1092 includes a peak data rate (eg, 20 Gbps or more) for realizing eMBB, loss coverage (eg, 164 dB or less) for realizing mMTC, or U-plane latency for realizing URLLC ( Example: downlink (DL) and uplink (UL) each 0.5 ms or less, or round trip 1 ms or less).
  • a peak data rate eg, 20 Gbps or more
  • loss coverage eg, 164 dB or less
  • U-plane latency for realizing URLLC
  • the antenna module 1097 may transmit or receive a signal or power to the outside (eg, an external electronic device).
  • the antenna module 1097 may include an antenna including a conductor formed on a substrate (eg, a PCB) or a radiator formed of a conductive pattern.
  • the antenna module 1097 may include a plurality of antennas (eg, an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network such as the first network 1098 or the second network 1099 is connected from the plurality of antennas by, for example, the communication module 1090 . can be selected. A signal or power may be transmitted or received between the communication module 1090 and an external electronic device through the selected at least one antenna.
  • other components eg, a radio frequency integrated circuit (RFIC)
  • RFIC radio frequency integrated circuit
  • the antenna module 1097 may form a mmWave antenna module.
  • the mmWave antenna module comprises a printed circuit board, an RFIC disposed on or adjacent to a first side (eg, bottom side) of the printed circuit board and capable of supporting a designated high frequency band (eg, mmWave band); and a plurality of antennas (eg, an array antenna) disposed on or adjacent to a second side (eg, top or side) of the printed circuit board and capable of transmitting or receiving signals of the designated high frequency band. can do.
  • peripheral devices eg, a bus, general purpose input and output (GPIO), serial peripheral interface (SPI), or mobile industry processor interface (MIPI)
  • GPIO general purpose input and output
  • SPI serial peripheral interface
  • MIPI mobile industry processor interface
  • a command or data may be transmitted or received between the electronic device 1001 and the external electronic device 1004 through the server 1008 connected to the second network 1099 .
  • Each of the external electronic devices 1002 and 1004 may be the same as or different from the electronic device 1001 .
  • all or a part of operations executed in the electronic device 1001 may be executed in one or more external electronic devices 1002 , 1004 , or 1008 . For example, when the electronic device 1001 needs to perform a function or service automatically or in response to a request from a user or other device, the electronic device 1001 performs the function or service by itself instead of executing the function or service itself.
  • one or more external electronic devices may be requested to perform at least a part of the function or the service.
  • One or more external electronic devices that have received the request may execute at least a part of the requested function or service, or an additional function or service related to the request, and transmit a result of the execution to the electronic device 1001 .
  • the electronic device 1001 may process the result as it is or additionally and provide it as at least a part of a response to the request.
  • cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used.
  • the electronic device 1001 may provide an ultra-low latency service using, for example, distributed computing or mobile edge computing.
  • the external electronic device 1004 may include an Internet of things (IoT) device.
  • IoT Internet of things
  • Server 1008 may be an intelligent server using machine learning and/or neural networks.
  • the external electronic device 1004 or the server 1008 may be included in the second network 1099 .
  • the electronic device 1001 may be applied to an intelligent service (eg, smart home, smart city, smart car, or health care) based on 5G communication technology and IoT-related technology.
  • the electronic device may have various types of devices.
  • the electronic device may include, for example, a portable communication device (eg, a smart phone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a home appliance device.
  • a portable communication device eg, a smart phone
  • a computer device e.g., a smart phone
  • a portable multimedia device e.g., a portable medical device
  • a camera e.g., a portable medical device
  • a camera e.g., a portable medical device
  • a camera e.g., a portable medical device
  • a wearable device e.g., a smart bracelet
  • a home appliance device e.g., a home appliance
  • first, second, or first or second may be used simply to distinguish the element from other elements in question, and may refer to elements in other aspects (e.g., importance or order) is not limited. It is said that one (eg, first) component is “coupled” or “connected” to another (eg, second) component, with or without the terms “functionally” or “communicatively”. When referenced, it means that one component can be connected to the other component directly (eg by wire), wirelessly, or through a third component.
  • module used in various embodiments of this document may include a unit implemented in hardware, software, or firmware, and is, for example, interchangeable with terms such as logic, logic block, component, or circuit.
  • a module may be an integrally formed part or a minimum unit or a part of the part that performs one or more functions.
  • the module may be implemented in the form of an application-specific integrated circuit (ASIC).
  • ASIC application-specific integrated circuit
  • Various embodiments of the present document include one or more instructions stored in a storage medium (eg, internal memory 1036 or external memory 1038) readable by a machine (eg, electronic device 1001). may be implemented as software (eg, the program 1040) including
  • a processor eg, processor 1020
  • a device eg, electronic device 1001
  • the one or more instructions may include code generated by a compiler or code executable by an interpreter.
  • the device-readable storage medium may be provided in the form of a non-transitory storage medium.
  • 'non-transitory' only means that the storage medium is a tangible device and does not include a signal (eg, electromagnetic wave), and this term is used in cases where data is semi-permanently stored in the storage medium and It does not distinguish between temporary storage cases.
  • a signal eg, electromagnetic wave
  • the method according to various embodiments disclosed in this document may be provided as included in a computer program product.
  • Computer program products may be traded between sellers and buyers as commodities.
  • the computer program product is distributed in the form of a machine-readable storage medium (eg compact disc read only memory (CD-ROM)), or via an application store (eg Play Store TM ) or on two user devices ( It can be distributed (eg downloaded or uploaded) directly between smartphones (eg: smartphones) and online.
  • a part of the computer program product may be temporarily stored or temporarily created in a machine-readable storage medium such as a memory of a server of a manufacturer, a server of an application store, or a relay server.
  • each component (eg, module or program) of the above-described components may include a singular or a plurality of entities, and some of the plurality of entities may be separately disposed in other components. have.
  • one or more components or operations among the above-described corresponding components may be omitted, or one or more other components or operations may be added.
  • a plurality of components eg, a module or a program
  • the integrated component may perform one or more functions of each component of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. .
  • operations performed by a module, program, or other component are executed sequentially, in parallel, repeatedly, or heuristically, or one or more of the operations are executed in a different order, or omitted. or one or more other operations may be added.

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Abstract

Un dispositif électronique selon un mode de réalisation comprend un boîtier comprenant : un affichage formant au moins une partie de la surface avant du dispositif électronique ; une partie inférieure formant la surface arrière du dispositif électronique ; et une paroi latérale s'étendant à partir de la partie inférieure vers l'affichage et formant au moins une partie de la surface latérale du dispositif électronique, le boîtier comprenant : une première partie formant une zone désignée dans au moins une partie de la surface latérale formée par la paroi latérale, et comprenant des premières particules en forme d'aiguilles comprenant une première longueur ; et une seconde partie formant au moins une partie de la surface latérale et une partie de la surface arrière et comprenant des secondes particules comprenant une seconde longueur plus courte que la première longueur, et les premières particules sont orientées de manière désordonnée à la différence des secondes particules, de sorte que la première partie puisse avoir une couleur différente de celle de la seconde partie.
PCT/KR2021/002868 2020-06-09 2021-03-09 Dispositif électronique comprenant un boîtier WO2021251594A1 (fr)

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100681568B1 (ko) * 2002-03-19 2007-02-09 미쓰비시덴키 가부시키가이샤 카메라 부착 휴대 전화 장치 및 카메라용 조명 장치
KR20140134670A (ko) * 2012-03-09 2014-11-24 아사히 가라스 가부시키가이샤 유리 세라믹스체, 적층체, 휴대형 전자 기기용 하우징 및 휴대형 전자 기기
US20150173222A1 (en) * 2013-12-17 2015-06-18 Apple Inc. Color-matched polymer materials and method for forming the same
KR101850388B1 (ko) * 2011-06-07 2018-04-19 엘지전자 주식회사 이동 단말기
US20190256409A1 (en) * 2018-02-20 2019-08-22 Apple Inc. Surface glass with embedded ceramic particles

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100681568B1 (ko) * 2002-03-19 2007-02-09 미쓰비시덴키 가부시키가이샤 카메라 부착 휴대 전화 장치 및 카메라용 조명 장치
KR101850388B1 (ko) * 2011-06-07 2018-04-19 엘지전자 주식회사 이동 단말기
KR20140134670A (ko) * 2012-03-09 2014-11-24 아사히 가라스 가부시키가이샤 유리 세라믹스체, 적층체, 휴대형 전자 기기용 하우징 및 휴대형 전자 기기
US20150173222A1 (en) * 2013-12-17 2015-06-18 Apple Inc. Color-matched polymer materials and method for forming the same
US20190256409A1 (en) * 2018-02-20 2019-08-22 Apple Inc. Surface glass with embedded ceramic particles

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