WO2021248848A1

WO2021248848A1 - Method for manufacturing perforated copper coil for shielded cathode plate

Info

Publication number: WO2021248848A1
Application number: PCT/CN2020/132524
Authority: WO
Inventors: 江泱; 杨帅国
Original assignee: 九江德福科技股份有限公司
Priority date: 2020-06-12
Filing date: 2020-11-28
Publication date: 2021-12-16
Also published as: CN111850628A

Abstract

A method for manufacturing perforated copper coil for a shielded cathode plate. The method comprises the following steps: imprinting a shielding point on a separator according to an expected distribution mode, attaching the separator to a cathode plate to be processed, and tearing off the separator after a material is formed to obtain the shielding point; adding a hot acid copper electrolyte to an electrolyzer, adding a prepared additive solution, turning on mechanical stirring, slowly stirring to keep the temperature in the electrolyzer uniform; mounting an anode plate and the shielded cathode plate in the electrolyzer, keeping the anode and cathode plates parallel, adjusting a stirring speed, turning on a constant-current rectifying machine, and timing; adjusting a current, and turning off the constant-current rectifying machine after timing is completed to obtain a cathode plate plated with copper foil; and performing passivation processing on the cathode plate plated with copper foil, cleaning, drying by blowing, and peeling off perforated copper coil from the cathode plate. According to the method, cation transmission of the shielding point is hindered, and naturally grown perforated copper foil is obtained, thereby avoiding cumbersome steps of later machining and the resulting mechanical property defects.

Description

Manufacturing method of perforated copper foil for shielding cathode plate

Technical field

The present invention relates to the technical field of copper foil manufacturing, in particular to a method for manufacturing a perforated copper foil for shielding a cathode plate.

Background technique

[Corrected in accordance with Rule 9.2 14.12.2020]
In recent years, the development of power batteries has been vigorously promoted by new energy vehicles, product technology has continued to improve, and the requirements for substrates have also been continuously improved. As the negative electrode carrier material of power batteries, the technical requirements of lithium battery copper foil are also constantly improving. With the increasing production capacity of domestic lithium battery copper foil in recent years, the competition in the copper foil market has become increasingly fierce. However, the high-end lithium battery copper foil products on the market have been in short supply and are monopolized by a few overseas or overseas background companies such as Japan.

For general lithium battery copper foil, the thickness of the negative electrode material on both sides of the copper foil is inconsistent, which will reduce the efficiency of the electrochemical reaction of the positive and negative electrodes, and cause a decrease in capacitance. In order to avoid this situation, the perforated copper foil is convenient for double-sided precision coating to ensure that the coating amount on both sides is equal. In addition, the perforated copper foil can effectively reduce the surface density of the copper foil, and has the same effect of reducing the thickness of the copper foil.

The current copper foil drilling method usually adopts mechanical processing or laser drilling. Through the perforated copper foil process of setting shielding points on the cathode plate, the increase in the process steps of copper foil production is avoided, and the possibility of copper foil defects caused by subsequent processing and performance degradation is reduced.

Summary of the invention

In view of the above-mentioned technical problems in the related art, the present invention proposes a method for manufacturing a perforated copper foil for shielding a cathode plate, which can overcome the above-mentioned shortcomings of the prior art.

In order to achieve the above technical objectives, the technical solution of the present invention is achieved as follows:

A manufacturing method of perforated copper foil for shielding a cathode plate, the method comprising the following steps:

S1. Mark the shielding points on the diaphragm according to the expected distribution, stick the diaphragm on the electrode plate to be processed, apply the shielding material, and tear off the diaphragm after the material is formed to obtain the shielding point;

S2. Put the hot acid copper electrolyte into the electrolytic tank, add the prepared additive solution, turn on the mechanical stirring, and slowly stir to keep the temperature in the tank uniform;

S3. Install the anode plate and the shielded cathode plate in the electrolytic cell, fix them through the groove on the wall of the electrolytic cell and the base at the bottom, keep the two plates parallel, adjust the stirring rate, turn on the constant current rectifier, and start timing ；

S4. Adjust the current. After the timing is over, turn off the constant current rectifier to obtain a cathode plate coated with copper foil;

S5. Passivate the cathode plate coated with copper foil, wash and blow dry, and peel off the perforated copper foil from the cathode plate.

Further, in the step S1, the electrode plate is a cathode plate.

Further, in the step S1, the shielding points are uniformly distributed shielding points.

Further, the size of the shielding points is Φ0.3mm, and the distribution spacing is 0.8mm.

Further, in the step S2, the temperature is controlled at 50-55°C, wherein the most suitable temperature range is 51-54°C.

Further, the distance between the cathode plate and the anode plate is 2 cm.

Further, the current is 50A, and the electroplating time is 80s.

The beneficial effects of the present invention: through this method, the transmission of cations at the shielding point is hindered, and naturally-grown perforated copper foil is obtained, which avoids the cumbersome steps of later mechanical processing and the mechanical performance defects caused thereby.

Description of the drawings

In order to explain the embodiments of the present invention or the technical solutions in the prior art more clearly, the drawings needed in the embodiments will be briefly introduced below. Obviously, the drawings in the following description are only some of the present invention. Embodiments, for those of ordinary skill in the art, without creative work, other drawings can be obtained based on these drawings.

Fig. 1 is a flow chart of a method for manufacturing a perforated copper foil for shielding a cathode plate according to an embodiment of the present invention.

detailed description

The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art fall within the protection scope of the present invention.

As shown in FIG. 1, a method for manufacturing a perforated copper foil for shielding a cathode plate according to an embodiment of the present invention includes the following steps:

S3. Install the anode plate and the shielded cathode plate in the electrolytic cell, fix them by the groove on the wall of the electrolytic cell and the base at the bottom, keep the two plates in parallel, adjust the stirring rate, turn on the constant current rectifier, and start timing ；

In a specific embodiment of the present invention, in the step S1, the electrode plate is a cathode plate.

In a specific embodiment of the present invention, in the step S1, the shielding points are uniformly distributed shielding points.

In a specific embodiment of the present invention, the size of the shielding points is 0.3 mm, and the distribution pitch is 0.8 mm.

In a specific embodiment of the present invention, in the step S2, the temperature is controlled at 50-55°C, wherein the most suitable temperature range is 51-54°C.

In a specific embodiment of the present invention, the distance between the cathode plate and the anode plate is 2 cm.

In a specific embodiment of the present invention, the current is 50A, and the electroplating time is 80s.

In order to facilitate the understanding of the above-mentioned technical solution of the present invention, the above-mentioned technical solution of the present invention will be described in detail below.

Production of cathode plate with shielding point:

Take a general cathode plate, and cut out a diaphragm of a suitable size according to the electroplating area of the cathode plate. According to the expected shielding point distribution shown in Figure 2, cut out holes on the diaphragm with a size of Ф0.3mm and a distribution pitch of 0.8mm. Stick the diaphragm on the cathode plate, coat the shielding material, and air dry for 5-10 days under natural conditions. After confirming that the shielding material is formed, peel off the diaphragm and air dry again for 2-3 days to obtain a cathode plate with shielding points.

Installation of the electrolysis pilot system:

Put the hot acid copper electrolyte into the electrolytic cell, and add the prepared additive solution. Turn on the mechanical stirring and stir slowly to keep the temperature in the tank uniform. Install the anode plate and the cathode plate with shielding points in the electrolytic cell, and fix them through the groove on the wall of the electrolytic cell and the base at the bottom. The two polar plates are kept parallel with a distance of 2 cm.

Preparation of perforated copper foil:

Turn on the mechanical stirring to the maximum, turn on the constant current rectifier, heat the electrolyte temperature to 50-55°C, adjust the current to 50A, and perform the electrolysis operation. After 80 seconds, the power was turned off to obtain a small test sample of perforated copper foil attached to the cathode plate. The perforated copper foil sample and the cathode plate were immersed in the passivation solution for passivation treatment. The sample was peeled off, dried, and the morphology of the holes on the sample was observed under an electron microscope.

In summary, with the help of the above technical solution of the present invention, through this method, the transmission of cations at the shielding point is hindered, and a naturally grown perforated copper foil is obtained, which avoids the cumbersome steps of later mechanical processing and the mechanical performance defects caused thereby. .

The foregoing descriptions are only preferred embodiments of the present invention and are not intended to limit the present invention. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the present invention. Within the scope of protection.

Claims

A manufacturing method of perforated copper foil for shielding a cathode plate is characterized in that it comprises the following steps:

S1: Mark the shielding points on the diaphragm according to the expected distribution, stick the diaphragm on the electrode plate to be processed, apply the shielding material, and tear off the diaphragm after the material is formed to obtain the shielding point;

S2: Put the hot acid copper electrolyte into the electrolytic tank, add the prepared additive solution, turn on the mechanical stirring, and slowly stir to keep the temperature in the tank uniform;

S3: Install the anode plate and the shielded cathode plate in the electrolytic cell, fix them through the groove on the wall of the electrolytic cell and the base at the bottom, keep the two plates parallel, adjust the stirring rate, turn on the constant current rectifier, and start timing ；

S4: Adjust the current. After the timing is over, turn off the constant current rectifier to obtain a cathode plate coated with copper foil;

S5: Passivate the cathode plate coated with copper foil, wash and blow dry, and peel off the perforated copper foil from the cathode plate.
The manufacturing method of perforated copper foil for shielding the cathode plate according to claim 1, wherein in the step S1, the electrode plate is a cathode plate.
The manufacturing method of perforated copper foil for shielding the cathode plate according to claim 1, wherein in the step S1, the shielding points are uniformly distributed shielding points.
The manufacturing method of perforated copper foil for shielding cathode plates according to claim 1 or 3, characterized in that the size of the shielding points is Φ0.3mm, and the distribution pitch is 0.8mm.
The manufacturing method of perforated copper foil for shielding cathode plates according to claim 1, characterized in that, in the step S2, the temperature is controlled at 50-55°C, wherein the most suitable temperature range is 51 -54°C.
The manufacturing method of perforated copper foil for shielding the cathode plate according to claim 1, wherein the distance between the cathode plate and the anode plate is 2 cm.
The manufacturing method of perforated copper foil for shielding the cathode plate according to claim 1, wherein the current is 50A, and the electroplating time is 80s.