WO2021245766A9 - Intermittent electroplating method - Google Patents

Intermittent electroplating method Download PDF

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Publication number
WO2021245766A9
WO2021245766A9 PCT/JP2020/021687 JP2020021687W WO2021245766A9 WO 2021245766 A9 WO2021245766 A9 WO 2021245766A9 JP 2020021687 W JP2020021687 W JP 2020021687W WO 2021245766 A9 WO2021245766 A9 WO 2021245766A9
Authority
WO
WIPO (PCT)
Prior art keywords
intermittent electroplating
electroplating method
intermittent
micropores
electroplating
Prior art date
Application number
PCT/JP2020/021687
Other languages
French (fr)
Japanese (ja)
Other versions
WO2021245766A1 (en
Inventor
第造 今井
駿 杉岡
敏光 長尾
順一 片山
Original Assignee
奥野製薬工業株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 奥野製薬工業株式会社 filed Critical 奥野製薬工業株式会社
Priority to PCT/JP2020/021687 priority Critical patent/WO2021245766A1/en
Priority to PCT/JP2021/018329 priority patent/WO2021246133A1/en
Priority to CN202180039881.6A priority patent/CN115667592A/en
Priority to KR1020227044788A priority patent/KR20230018406A/en
Publication of WO2021245766A1 publication Critical patent/WO2021245766A1/en
Publication of WO2021245766A9 publication Critical patent/WO2021245766A9/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/12—Electroplating: Baths therefor from solutions of nickel or cobalt
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/30—Electroplating: Baths therefor from solutions of tin
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0614—Strips or foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/423—Plated through-holes or plated via connections characterised by electroplating method
    • H05K3/424—Plated through-holes or plated via connections characterised by electroplating method by direct electroplating

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electroplating And Plating Baths Therefor (AREA)

Abstract

The present invention provides technology for improving the filling properties of micropores in intermittent electroplating.　This intermittent electroplating method is for performing intermittent electroplating of a plated object having micropores and includes the use of a plating liquid containing polyvalent metal ions.
PCT/JP2020/021687 2020-06-02 2020-06-02 Intermittent electroplating method WO2021245766A1 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
PCT/JP2020/021687 WO2021245766A1 (en) 2020-06-02 2020-06-02 Intermittent electroplating method
PCT/JP2021/018329 WO2021246133A1 (en) 2020-06-02 2021-05-14 Intermittent electroplating method
CN202180039881.6A CN115667592A (en) 2020-06-02 2021-05-14 Intermittent electroplating method
KR1020227044788A KR20230018406A (en) 2020-06-02 2021-05-14 Intermittent electroplating method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2020/021687 WO2021245766A1 (en) 2020-06-02 2020-06-02 Intermittent electroplating method

Publications (2)

Publication Number Publication Date
WO2021245766A1 WO2021245766A1 (en) 2021-12-09
WO2021245766A9 true WO2021245766A9 (en) 2022-01-27

Family

ID=78830213

Family Applications (2)

Application Number Title Priority Date Filing Date
PCT/JP2020/021687 WO2021245766A1 (en) 2020-06-02 2020-06-02 Intermittent electroplating method
PCT/JP2021/018329 WO2021246133A1 (en) 2020-06-02 2021-05-14 Intermittent electroplating method

Family Applications After (1)

Application Number Title Priority Date Filing Date
PCT/JP2021/018329 WO2021246133A1 (en) 2020-06-02 2021-05-14 Intermittent electroplating method

Country Status (3)

Country Link
KR (1) KR20230018406A (en)
CN (1) CN115667592A (en)
WO (2) WO2021245766A1 (en)

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004059952A (en) * 2002-07-25 2004-02-26 Toppan Printing Co Ltd Method for electrolytically plating flexible multilayer interconnection substrate
DE10311575B4 (en) * 2003-03-10 2007-03-22 Atotech Deutschland Gmbh Process for the electrolytic metallization of workpieces with high aspect ratio holes
JP2005089799A (en) * 2003-09-16 2005-04-07 Toppan Printing Co Ltd Plating device
WO2007112971A2 (en) * 2006-03-30 2007-10-11 Atotech Deutschland Gmbh Electrolytic method for filling holes and cavities with metals
JP2008231550A (en) * 2007-03-23 2008-10-02 Toppan Printing Co Ltd Electrolytic plating apparatus and method of manufacturing wiring board
US20110056838A1 (en) * 2009-09-04 2011-03-10 Ibiden, Co., Ltd. Method of manufacturing printed wiring board
JP6948053B2 (en) * 2017-01-12 2021-10-13 上村工業株式会社 Filling plating system and filling plating method
JP6906237B2 (en) * 2018-12-12 2021-07-21 奥野製薬工業株式会社 Intermittent electroplating method

Also Published As

Publication number Publication date
CN115667592A (en) 2023-01-31
WO2021245766A1 (en) 2021-12-09
WO2021246133A1 (en) 2021-12-09
KR20230018406A (en) 2023-02-07

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