WO2021244220A1

WO2021244220A1 - Heat dissipation assembly, heat dissipation structure and heat dissipation method therefor, and electronic device and apparatus

Info

Publication number: WO2021244220A1
Application number: PCT/CN2021/092415
Authority: WO
Inventors: 孙权
Original assignee: 中兴通讯股份有限公司
Priority date: 2020-06-04
Filing date: 2021-05-08
Publication date: 2021-12-09
Also published as: CN113765496A

Abstract

A heat dissipation assembly (100), a heat dissipation structure and a heat dissipation method therefor, and an electronic device and an apparatus. The heat dissipation assembly (100) comprises an acoustic wave oscillator (110) used for emitting acoustic waves; and an oscillating film (120) provided on a transmission path of the acoustic waves emitted by the acoustic wave oscillator (110), wherein the acoustic waves emitted by the acoustic wave oscillator (110) drive the oscillating film (120) to vibrate, to make the air flow around the oscillating film (120).

Description

Heat dissipation component, heat dissipation structure, heat dissipation method, electronic equipment and device

Cross-references to related applications

This application is filed based on a Chinese patent application with an application number of 202010499460.9 and an application date of June 4, 2020, and claims the priority of the Chinese patent application. The entire content of the Chinese patent application is hereby incorporated by reference into this application.

Technical field

The embodiments of the present invention relate to, but are not limited to, the field of heat dissipation technology, and in particular, to a heat dissipation component, a heat dissipation structure, an electronic device, a heat dissipation device, a heat dissipation method, an electronic device, and a computer-readable storage medium.

Background technique

Highly integrated electronic products have a tighter structure and close stack of internal devices. As the internal heat sources such as chip devices continue to heat up, the air inside the electronic product will not flow automatically, which will cause the temperature at the location of the device to continue to rise high. In related technologies, the heat dissipation of electronic products is conducted by using technical means such as heat dissipation film, heat dissipation glue, heat dissipation frame, fan, water cooling tube, etc., but this will increase the thickness of the product, and the heat conduction effect will be over time. The passage gradually decreases, and the heat dissipation effect is not good.

Summary of the invention

The following is an overview of the topics detailed in this article. This summary is not intended to limit the scope of protection of the claims.

In the first aspect, embodiments of the present invention provide a heat dissipation component, a heat dissipation structure, an electronic device, a heat dissipation device, a heat dissipation method, an electronic device, and a computer-readable storage medium.

In the second aspect, an embodiment of the present invention provides a heat dissipation assembly, including:

A sonic oscillator configured to emit sound waves; and

The oscillating membrane is arranged on the transmission path of the sound wave emitted by the sound wave oscillator; and

Wherein, the sound waves emitted by the acoustic wave oscillator drive the oscillating membrane to vibrate, so that the air near the oscillating membrane flows.

In the third aspect, an embodiment of the present invention provides a heat dissipation structure, including:

The heat dissipation assembly as described in the second aspect above; and

The air duct, the heat dissipation component is arranged in the air duct.

In a fourth aspect, an embodiment of the present invention also provides an electronic device, including:

The heat dissipation assembly described in the second aspect above and the heat dissipation structure described in the third aspect above.

In a fifth aspect, an embodiment of the present invention also provides an electronic device, including:

case;

The electronic device is arranged in the housing, and the electronic device generates heat in the working state; and

In the heat dissipation assembly described in the second aspect above, the heat dissipation assembly is disposed in the housing and is configured to flow air in the housing to dissipate heat from the electronic device.

In a sixth aspect, an embodiment of the present invention also provides a heat dissipation device, which is applied to an electronic device, and the electronic device is provided with the heat dissipation component as described in the second aspect or the heat dissipation structure as described in the third aspect; wherein , The heat dissipation device includes:

The detection component is configured to detect the temperature value of the target object; and

The control component is electrically connected with the heat dissipation component and the detection component, respectively.

In a seventh aspect, an embodiment of the present invention also provides a heat dissipation method, which is applied to a heat dissipation device, and the heat dissipation device is provided with the heat dissipation assembly, detection component, and control component as described in the second aspect above, and the control components are respectively It is electrically connected to the heat dissipation assembly and the detection component; wherein the heat dissipation method includes:

Obtain the temperature value of the target object; and

When the temperature value of the target object exceeds the preset temperature value, the heat dissipation component is controlled to dissipate heat to the target object.

In an eighth aspect, an embodiment of the present invention also provides an electronic device, including: a memory, a processor, and a computer program stored in the memory and capable of running on the processor. The processor executes the computer program as described above. The heat dissipation method described in the seventh aspect.

In a ninth aspect, an embodiment of the present invention also provides a computer-readable storage medium that stores computer-executable instructions. When the computer-executable instructions are executed by a processor, the processor executes the above-mentioned seventh aspect. The heat dissipation method described.

Other features and advantages of the present invention will be described in the following description, and partly become obvious from the description, or understood by implementing the present invention. The purpose and other advantages of the present invention can be realized and obtained through the structures specifically pointed out in the specification, claims and drawings.

Description of the drawings

The accompanying drawings are used to provide a further understanding of the technical solution of the present invention, and constitute a part of the specification. Together with the embodiments of the present invention, they are used to explain the technical solution of the present invention, and do not constitute a limitation to the technical solution of the present invention.

Fig. 1A is a schematic diagram of a heat dissipation assembly provided by an embodiment of the present invention;

FIG. 1B is a schematic diagram of a heat dissipation component provided by another embodiment of the present invention;

2A is a schematic diagram of a heat dissipation structure provided by an embodiment of the present invention;

2B is a schematic diagram of a heat dissipation structure provided by another embodiment of the present invention;

3A is a schematic diagram of an electronic device provided by an embodiment of the present invention;

3B is a schematic diagram of an electronic device provided by another embodiment of the present invention;

3C is a schematic diagram of an electronic device provided by another embodiment of the present invention;

FIG. 3D is a schematic diagram of an electronic device provided by another embodiment of the present invention;

Figure 4 is a schematic diagram of a heat dissipation device provided by an embodiment of the present invention;

FIG. 5A is a flowchart of a heat dissipation method according to an embodiment of the present invention; and

FIG. 5B is a flowchart of a heat dissipation method according to another embodiment of the present invention.

detailed description

In order to make the objectives, technical solutions, and advantages of the present invention clearer, the following further describes the present invention in detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, but not used to limit the present invention.

It should be noted that although functional modules are divided in the schematic diagram of the device, and the logical sequence is shown in the flowchart, in some cases, it can be executed in a different order from the module division in the device or in the sequence in the flowchart. Steps shown or described.

The present invention provides a heat dissipation component, a heat dissipation structure, an electronic device, a heat dissipation device, a heat dissipation method, an electronic device, and a computer-readable storage medium, including an acoustic wave oscillator and an oscillating film, wherein the acoustic wave oscillator is configured to emit sound waves and oscillate The membrane is arranged on the transmission path of the sound wave emitted by the acoustic wave oscillator, and the sound wave emitted by the acoustic wave oscillator drives the oscillating membrane to vibrate, so that the air near the oscillating membrane flows. According to the solution provided by the embodiments of the present invention, the acoustic wave oscillator is used to drive the oscillating film to vibrate to accelerate the air flow on the surface of the target object inside the electronic device, thereby quickly removing heat from the surface of the target object, and achieving the effect of reducing the surface temperature of the target object . In addition, because the overall structure is simple and the space occupied is small, it can be flexibly laid out according to the internal structure of the electronic device and the location of the target object, and its power consumption is low and the interference to the electronic device is small.

The embodiments of the present invention will be further described below in conjunction with the accompanying drawings.

As shown in FIG. 1A, FIG. 1A is a schematic diagram of a heat dissipation assembly 100 provided by an embodiment of the present invention. In the example of FIG. 1, the heat dissipation assembly 100 includes an acoustic wave oscillator 110 and an oscillating film 120, wherein the acoustic wave oscillator 110 is configured to emit sound waves, and the oscillating film 120 is disposed on the transmission path of the sound waves emitted by the acoustic wave oscillator 110, The sound wave emitted by the acoustic wave oscillator 110 drives the oscillating membrane 120 to vibrate, so that the air near the oscillating membrane 120 flows. The overall structure of the heat dissipation assembly 100 is simple, the size is small, and the space occupied is small. Therefore, it can be flexibly arranged inside the electronic device 300 to dissipate heat at the location where the target object is located. Among them, the target object refers to a heating device, such as a chip. In addition, the acoustic wave oscillator 110 has low power consumption during operation, and the sound wave emitted by the acoustic wave oscillator 110 drives the oscillating membrane 120 to vibrate, and there is no electromagnetic radiation, so the interference to the electronic device 300 is small.

In an embodiment, there is a certain gap between the oscillating membrane 120 and the acoustic wave oscillator 110 to facilitate a larger amplitude space when the oscillating membrane 120 oscillates, which is not specifically limited in this embodiment.

It should be noted that the sound waves emitted by the acoustic wave oscillator 110 include but are not limited to ultrasonic waves and infrasound waves, which are not specifically limited in this embodiment.

In one embodiment, the acoustic wave oscillator 110 is used to drive the oscillating membrane 120 to vibrate to accelerate the air flow on the surface of the target object inside the electronic device 300, thereby quickly removing heat from the surface of the target object, and achieving the effect of reducing the surface temperature of the target object .

In an embodiment, the acoustic wave oscillator 110 includes a transducing component configured to convert electrical energy into mechanical energy and a vibrating surface configured to emit sound waves, and the oscillating membrane 120 is disposed in front of the vibrating surface. Specifically, the acoustic wave oscillator 110 includes a transducing component and a vibrating surface. After the transducing component is powered on, the electrical energy is converted into mechanical energy to drive the vibrating surface to emit sound waves. Since the oscillating membrane 120 is arranged in front of the vibrating surface, The sound waves emitted by the acoustic wave oscillator 110 can drive the oscillating membrane 120 to vibrate, so that the air near the oscillating membrane can flow. Compared with the prior art, the magnetic field that interacts with the magnet is used to drive the diaphragm to vibrate when the electromagnetic coil is energized, the heat dissipation assembly 100 of this embodiment has lower power consumption during operation, and uses the sound waves emitted by the acoustic wave oscillator 110 The oscillating membrane 120 is driven to vibrate, and there is no electromagnetic radiation, so the interference to the electronic device 300 is small.

In one embodiment, a plurality of acoustic wave oscillators 110 are included, and the plurality of acoustic wave oscillators 110 form an array of acoustic wave oscillators. In this embodiment, a plurality of acoustic wave oscillators 110 can be arranged side by side to form an array of acoustic wave oscillators, and the sound waves emitted by the acoustic wave oscillators 110 drive their corresponding oscillating membranes 120 to vibrate, so as to further make the air near the oscillating membrane 120 flow. accelerate.

In an embodiment, the number of the oscillating film 120 is one, and the oscillating film 120 is disposed on the transmission path of the sound waves emitted by the acoustic wave oscillator array. In this embodiment, the acoustic wave oscillator array corresponds to an oscillating membrane 120, and the sound waves emitted by the acoustic wave oscillator array drive the oscillating membrane 120 to vibrate. As the vibration of the oscillating membrane 120 is intensified, the air flow near the oscillating membrane 120 is accelerated.

In one embodiment, the sound waves emitted by the acoustic wave oscillator 110 are ultrasonic waves. Ultrasound is a sound wave with a frequency higher than 20000 Hz. It has good directivity, strong reflection ability, and is easy to obtain concentrated sound energy. Since the lower limit of ultrasonic frequency exceeds the upper limit of human hearing, it will not produce noise to humans.

In one embodiment, as shown in FIG. 1B, the heat dissipation assembly 100 further includes a cavity 130, and the cavity includes an air outlet 131; the acoustic wave oscillator 110 and the oscillating membrane 120 are arranged in the cavity 130. When the sound wave emitted by the acoustic wave oscillator 110 drives the oscillating membrane 120 to vibrate, the flowing air concentrates and accelerates out of the air outlet 131, and the accelerated air quickly removes heat from the surface of the target object, achieving the effect of reducing the surface temperature of the target object.

In one embodiment, one side of the oscillating membrane 120 faces the air outlet 131 and the other side of the oscillating membrane 120 faces the acoustic wave oscillator 110. That is, the oscillating membrane 120 is facing the air outlet 131, and the air outlet 131 is on the transmission path of the sound wave emitted by the acoustic wave oscillator 110. When the sound wave emitted by the acoustic wave oscillator 110 drives the oscillating membrane 120 to vibrate, it is more conducive to the concentration of flowing air. The air flowing out from the air outlet 131 accelerates, and the accelerated air quickly takes away the heat from the surface of the target object, so as to achieve the effect of reducing the surface temperature of the target object.

Various embodiments will be described below for the specific structure of the heat dissipation structure 200.

As shown in FIG. 2A, FIG. 2A is a schematic diagram of a heat dissipation structure 200 provided by an embodiment of the present invention.

The heat dissipation structure 200 includes a heat dissipation assembly 100 and an air duct 210, and the heat dissipation assembly 100 is disposed in the air duct 210.

In one embodiment, the air duct 210 is designed as a dedicated heat dissipation channel for the target object that needs heat dissipation, so as to control the flow path and flow volume of the air to achieve targeted heat dissipation. The heat dissipation assembly 100 is arranged in the air duct 210. When the sound wave emitted by the sonic oscillator 110 drives the oscillating membrane 120 to vibrate and causes air to flow in the air duct 210, the heat from the surface of the target object is quickly taken away by the flowing air. Achieve the effect of reducing the surface temperature of the target object.

In an embodiment, as shown in FIG. 2B, the air duct 210 includes a first air inlet 211 and at least one first air outlet 212, and the heat dissipation assembly 100 is disposed at the first air inlet 211. In this embodiment, the air duct 210 may be designed with a first air outlet 212 or a plurality of first air outlets 212 according to heat dissipation requirements, and the heat dissipation assembly 100 may be disposed at the first air inlet 211. It should be pointed out that the path along which the air duct 210 travels may have a single target object requiring heat dissipation, or there may be multiple target objects requiring heat dissipation.

In an embodiment, the heat dissipation structure 200 further includes an adjustment mechanism connected to the heat dissipation assembly 100, and the adjustment mechanism is configured to adjust the direction or position of the heat dissipation assembly 100. For multiple target objects in different orientations that require heat dissipation, an adjustment mechanism is used to adjust the direction or position of the heat dissipation assembly 100, so that the heat dissipation assembly 100 can sequentially dissipate heat for the target objects in different orientations according to the control requirements, making the heat dissipation more reasonable.

In an embodiment, the adjustment mechanism includes a rotating component, the rotating component is connected to the heat dissipation component 100, and the rotating component drives the heat dissipation component 100 to rotate. For multiple target objects that need heat dissipation in different directions, each target object is designed with a corresponding air duct 210, and the heat dissipation assembly 100 is driven to rotate through the rotating assembly, so that the heat dissipation assembly 100 can be docked to the corresponding air duct 210. So as to dissipate heat from target objects in different directions.

In addition, an embodiment of the present invention also provides an electronic device, which includes a heat dissipation assembly 100 or a heat dissipation structure 200.

In one embodiment, the acoustic wave oscillator 110 is used to make the air vibrate, which drives the oscillating membrane 120 in front of the sonic oscillator 110. The oscillating membrane 120 vibrates regularly. The air on both sides of the oscillating membrane 120 is perpendicular to the oscillating membrane 120. The air inside the electronic device 300 is compressed, causing the air inside the electronic device 300 to fluctuate laterally, and the air inside the electronic device 300 is compressed to cause the air to flow faster. The air inside the electronic device 300 accelerates to flow away from the surface of the target object, thereby cooling the electronic device 300 Effect.

As shown in FIG. 3A, FIG. 3A is a schematic structural diagram of an electronic device 300 according to an embodiment of the present invention.

The electronic device 300 includes a housing 310 and a heat dissipation assembly 100; the electronic device 314 is arranged in the housing 310, and the electronic device 314 generates heat in the working state; the heat dissipation assembly 100 is arranged in the housing 310 and is configured to make the housing 310 The air flows to dissipate the heat of the electronic device 314.

In one embodiment, the sound waves emitted by the acoustic wave oscillator 110 drive the oscillating membrane 120 to vibrate, so that the air near the oscillating membrane 120 flows. The flowing air will quickly take away the heat from the surface of the electronic device 314, thereby reducing the surface of the electronic device 314. The effect of temperature.

It should be pointed out that the electronic device 300 includes, but is not limited to, mobile phones, client terminal equipment CPEs, notebook computers, tablet computers, smart wearable devices, smart home appliances, and in-vehicle systems and other highly integrated electronic consumer products.

Various embodiments will be described below for the specific structure of the electronic device 300.

In one embodiment, the heat dissipation assembly 100 is arranged close to the electronic device 314. In this way, the sound wave emitted by the acoustic wave oscillator 110 drives the oscillating membrane 120 to vibrate, so that the air flow of the electronic device 314 near the oscillating membrane 120 is accelerated. The heat on the surface of the device 314 is quickly taken away, achieving the effect of reducing the surface temperature of the electronic device 314.

In one embodiment, as shown in FIG. 3B, the housing 310 includes a second air inlet 311 and at least one second air outlet 312, the heat dissipation assembly 100 is disposed at the second air inlet 311, and the heat dissipation assembly 100 makes the second air inlet An air flow duct 313 is formed between 311 and the second air outlet 312, and the air flow duct 313 covers the electronic device 314. In this embodiment, the heat dissipation assembly 100 is arranged at the second air inlet 311, when the sound wave emitted by the acoustic wave oscillator 110 drives the oscillating membrane 120 to vibrate, and causes air to flow between the second air inlet 311 and the second air outlet 312 The air flow channel 313 formed in between flows in, and the heat on the surface of the electronic device 314 is quickly taken away and transferred out of the housing 310 through the flowing air, so as to achieve the effect of reducing the surface temperature of the electronic device 314.

In one embodiment, it includes two or more electronic devices 314, and the two or more electronic devices 314 are distributed on the air flow duct 313. When the sound wave emitted by the acoustic wave oscillator 110 drives the oscillating membrane 120 to vibrate, the air is in the first place. The air flow in the air passage 313 formed between the second air inlet 311 and the second air outlet 312 flows, and the heat on the surface of the multiple electronic devices 314 is quickly taken away by the flowing air, so as to achieve the effect of reducing the surface temperature of the multiple electronic devices 314 .

In one embodiment, as shown in FIG. 3C, two or more electronic devices 314 are included, and the two or more electronic devices 314 are respectively disposed in different positions in the housing 310; the electronic device 300 further includes an adjustment mechanism connected to the heat dissipation assembly 100 315. The adjustment mechanism 315 is configured to control the direction or position of the heat dissipation assembly 100. In this embodiment, since the multiple electronic devices 314 are in different positions in the housing 310, the adjustment mechanism 315 is used to adjust the direction or position of the heat dissipating assembly 100, so that the heat dissipating assembly 100 can sequentially adjust the positions of the heat dissipating assembly 100 according to the control requirements. The electronic device 314 performs heat dissipation, which makes the heat dissipation more reasonable.

In one embodiment, as shown in FIG. 3D, it further includes two or more first air ducts 320 corresponding to the electronic device 314, and the adjustment mechanism 315 controls the direction or position of the heat dissipation assembly 100 to be connected to the first air duct 320. For a plurality of electronic devices 314 in different directions, each electronic device 314 is designed with a corresponding first air duct 320, and the heat dissipation assembly 100 is driven to rotate through the adjustment mechanism 315, so that the heat dissipation assembly 100 can be docked to the corresponding first air duct. The air duct 320 dissipates heat from target objects in different directions.

In an embodiment, the electronic device 300 is a mobile terminal, and the mobile terminal includes but is not limited to a mobile phone.

As shown in FIG. 4, FIG. 4 is a schematic diagram of a heat dissipation device 400 provided by an embodiment of the present invention.

The heat dissipation device 400 is applied to electronic equipment, and the electronic equipment is provided with a heat dissipation component 100 or a heat dissipation structure 200. The heat dissipation device 400 includes a detection component 410 and a control component 420, wherein the detection component 410 is configured to detect the temperature value of the target object, and the control component 420 is electrically connected to the heat dissipation component 100 and the detection component 410, respectively.

In one embodiment, the heat dissipation device 400 detects the temperature value of the electronic device inside the electronic device through the detection component 410, and the control component 420 controls the heat dissipation assembly 100 to turn on or off according to the detected temperature value of the electronic device. When the heat dissipation assembly 100 is activated, the sound wave emitted by the acoustic wave oscillator 110 drives the oscillating membrane 120 to vibrate, so that the air near the oscillating membrane 120 flows, and the flowing air will quickly take away the heat from the surface of the electronic device to reduce the surface temperature of the electronic device. Effect. The detection component 410 may be a temperature sensor, and the control component 420 may be a single-chip microcomputer or a Field Programmable Gate Array (PFGA) chip, which is not specifically limited in this embodiment.

In an embodiment, in response to the temperature value of the target object exceeding the preset temperature value, the control component 420 controls the heat dissipation assembly 100 to dissipate heat to the target object. Among them, the preset temperature value is a default or settable safety range temperature value. If the detection component 410 detects that the temperature value of the electronic device exceeds the preset temperature value, the control component 420 will control the heat dissipation assembly 100 to start, and the sound wave emitted by the sonic oscillator 110 drives the oscillating membrane 120 to vibrate, so that the air near the oscillating membrane 120 flows. The flowing air will quickly take away the heat from the surface of the electronic device, achieving the effect of reducing the surface temperature of the electronic device. When the detection component 410 detects that the temperature of the electronic device drops below the preset temperature value, the control component 420 will turn off the heat dissipation assembly 100, the acoustic wave oscillator 110 will stop working, and the oscillating membrane 120 will also stop oscillating. The whole process is realized inside the electronic device. Real-time dynamic adjustment of electronic device temperature.

As shown in FIG. 5A, FIG. 5A is a flowchart of a heat dissipation method provided by an embodiment of the present invention.

The heat dissipation method is applied to a heat dissipation device, and the heat dissipation device is provided with the heat dissipation component, the detection component and the control component as described above, and the control component is electrically connected with the heat dissipation component and the detection component respectively.

The heat dissipation method includes but is not limited to the following steps:

Step S510: Obtain the temperature value of the target object;

Step S520: When the temperature value of the target object exceeds the preset temperature value, the heat dissipation component is controlled to dissipate heat to the target object.

In one embodiment, the control component obtains the temperature value of the target object through the detection component, and when the temperature value of the target object exceeds a preset temperature value, the control component controls the heat dissipation component to dissipate heat to the target object. Among them, the preset temperature value is a default or settable safety range temperature value. If the detection component detects that the temperature value of the electronic device exceeds the preset temperature value, the control component will control the heat dissipation component to start, and the sound wave emitted by the acoustic wave oscillator will drive the oscillating membrane to vibrate, so that the air near the oscillating membrane will flow, and the flowing air will cause the electrons to flow. The heat on the surface of the device is quickly taken away, achieving the effect of reducing the surface temperature of the electronic device. When the detection component detects that the temperature value of the electronic device has dropped below the preset temperature value, the control component will control the heat dissipation component to enter the standby state, the acoustic wave oscillator will stop working, and the oscillating film will stop oscillating. The whole process realizes the internal electronic device of the electronic device. Real-time dynamic adjustment of temperature.

In addition, as shown in FIG. 5B, another embodiment of the present application also provides a heat dissipation method. The heat dissipation method is applied to a heat dissipation device, and the heat dissipation device is also provided with an adjusting component connected to the heat dissipation component. This embodiment is another embodiment of the detailed process of step S520 in the above embodiment, and this step S520 includes but is not limited to:

In step S521, when the temperature value of the target object exceeds the preset temperature value, the adjustment component is controlled to adjust the direction or position of the heat dissipation component to dissipate the heat of the target object.

It is worth noting that step S521 in this embodiment is a further limitation of step S520 in the foregoing embodiment. In step S521 in this embodiment, when there are multiple electronic devices located in different positions inside the electronic device, the direction or position of the heat dissipation assembly is adjusted by adopting adjustment components, so that the heat dissipation assembly can sequentially control the electronic devices at different positions according to the control requirements. Perform heat dissipation to make the heat dissipation more reasonable.

In one embodiment, the adjustment mechanism is a rotating component, the rotating component is connected to the heat dissipation component, and the rotating component drives the heat dissipation component to rotate. For multiple target objects that need heat dissipation in different directions, each target object is designed with a corresponding air duct. The rotating component drives the heat dissipation component to rotate, so that the heat dissipation component can be docked to the corresponding air duct for different directions. The target object for heat dissipation.

In addition, an embodiment of the present invention also provides an electronic device, which includes a memory, a processor, and a computer program stored on the memory and running on the processor.

The processor and the memory can be connected by a bus or in other ways.

As a non-transitory computer-readable storage medium, the memory can be used to store non-transitory software programs and non-transitory computer-executable programs. In addition, the memory may include a high-speed random access memory, and may also include a non-transitory memory, such as at least one magnetic disk storage device, a flash memory device, or other non-transitory solid-state storage devices. In some embodiments, the memory may optionally include a memory remotely arranged with respect to the processor, and these remote memories may be connected to the processor through a network. Examples of the aforementioned networks include, but are not limited to, the Internet, corporate intranets, local area networks, mobile communication networks, and combinations thereof.

The non-transitory software programs and instructions required to implement the heat dissipation method applied to the electronic device in the foregoing embodiment, or the non-transitory software programs and instructions required to implement the heat dissipation method applied to the server in the foregoing embodiment, are stored in the memory When executed by the processor, the heat dissipation method applied to the electronic device in the above embodiment is executed, for example, the method steps S510 to S520 in FIG. 5A and the method steps S510 to S521 in FIG. 5B described above are executed.

In addition, an embodiment of the present invention also provides a computer-readable storage medium that stores computer-executable instructions, and the computer-executable instructions are executed by a processor or a controller, for example, by the aforementioned The execution of a processor in the embodiment of the electronic device may cause the processor to execute the heat dissipation method in the embodiment, for example, to execute the method steps S510 to S520 in FIG. 5A and the method steps S510 to S521 in FIG. 5B described above. .

The embodiment of the present invention includes: an acoustic wave oscillator and an oscillating membrane, where the acoustic wave oscillator is used to emit sound waves, the oscillating membrane is arranged on the transmission path of the sound waves emitted by the sonic oscillator, and the sound waves emitted by the sonic oscillator drive the oscillating membrane to vibrate to Allow the air near the oscillating membrane to flow. According to the solution provided by the embodiments of the present invention, the acoustic wave oscillator is used to drive the oscillating film to vibrate to accelerate the air flow on the surface of the target object inside the electronic device, thereby quickly removing heat from the surface of the target object, and achieving the effect of reducing the surface temperature of the target object . In addition, because the overall structure is simple and the space occupied is small, it can be flexibly laid out according to the internal structure of the electronic device and the location of the target object, and its power consumption is low and the interference to the electronic device is small.

A person of ordinary skill in the art can understand that all or some of the steps and systems in the methods disclosed above can be implemented as software, firmware, hardware, and appropriate combinations thereof. Certain physical components or all physical components can be implemented as software executed by a processor, such as a central processing unit, a digital signal processor, or a microprocessor, or as hardware, or as an integrated circuit, such as an application specific integrated circuit . Such software may be distributed on a computer-readable medium, and the computer-readable medium may include a computer storage medium (or a non-transitory medium) and a communication medium (or a transitory medium). As is well known by those of ordinary skill in the art, the term computer storage medium includes volatile and non-volatile data implemented in any method or technology for storing information (such as computer-readable instructions, data structures, program modules, or other data). Sexual, removable and non-removable media. Computer storage media include but are not limited to RAM, ROM, EEPROM, flash memory or other storage technologies, CD-ROM, digital versatile disk (DVD) or other optical disk storage, magnetic cassettes, magnetic tapes, magnetic disk storage or other magnetic storage devices, or Any other medium used to store desired information and that can be accessed by a computer. In addition, as is well known to those of ordinary skill in the art, communication media usually contain computer-readable instructions, data structures, program modules, or other data in a modulated data signal such as carrier waves or other transmission mechanisms, and may include any information delivery media. .

The above is a specific description of the implementation of the present invention, but the present invention is not limited to the above-mentioned embodiments. Those skilled in the art can make various equivalent modifications or substitutions without departing from the spirit of the present invention. These are equivalent. Variations or replacements of are included within the scope defined by the claims of the present invention.

Claims

A heat dissipation component, including:

A sonic oscillator configured to emit sound waves; and

The oscillating membrane is arranged on the transmission path of the sound wave emitted by the sound wave oscillator; and

Wherein, the sound waves emitted by the acoustic wave oscillator drive the oscillating membrane to vibrate, so that the air near the oscillating membrane flows.
The heat dissipation assembly according to claim 1, wherein:

The acoustic wave oscillator includes a transducing member and a vibrating surface, wherein the transducing member is configured to convert electrical energy into mechanical energy, the vibrating surface is configured to emit sound waves, and the oscillating membrane is disposed on the generating surface. The front of the vibration surface.
The heat dissipation assembly according to claim 1, comprising a plurality of said acoustic wave oscillators, wherein the plurality of said acoustic wave oscillators form an array of acoustic wave oscillators.
3. The heat dissipation assembly according to claim 3, wherein the number of the oscillating film is one, and the oscillating film is arranged on the transmission path of the sound wave emitted by the acoustic wave oscillator array.
The heat dissipation assembly according to any one of claims 1 to 4, wherein:

The sound waves emitted by the sound wave oscillator are ultrasonic waves.
The heat dissipation assembly according to any one of claims 1 to 4, further comprising:

A cavity, the cavity includes an air outlet; and

Wherein, the acoustic wave oscillator and the oscillating membrane are arranged in the cavity.
7. The heat dissipation assembly according to claim 6, wherein one side of the oscillating membrane faces the wind outlet, and the other side of the oscillating membrane faces the acoustic wave oscillator.
A heat dissipation structure, including:

The heat dissipation assembly according to any one of claims 1 to 7; and

The air duct, the heat dissipation component is arranged in the air duct.
8. The heat dissipation structure according to claim 8, wherein the heat dissipation structure further comprises an adjustment mechanism connected to the heat dissipation assembly, and the adjustment mechanism is configured to adjust the direction or position of the heat dissipation assembly.
9. The heat dissipation structure according to claim 9, wherein the adjustment mechanism comprises a rotating assembly connected to the heat dissipation assembly, and the rotating assembly drives the heat dissipation assembly to rotate.
An electronic device including:

case;

The electronic device is arranged in the housing, and the electronic device generates heat in the working state; and

7. The heat dissipation assembly according to any one of claims 1 to 7, the heat dissipation assembly is disposed in the casing and is configured to flow air in the casing to dissipate heat from the electronic device.
The electronic device according to claim 11, wherein the housing includes a second air inlet and at least one second air outlet, the heat dissipation component is disposed at the second air inlet, and the heat dissipation component makes the second air inlet An air flow duct is formed between the air inlet and the second air outlet, and the air flow duct covers the electronic device.
The electronic device according to claim 12, characterized in that it comprises more than two electronic devices, and the two or more electronic devices are distributed on the air flow duct, or are respectively arranged in the housing Different positions;

The electronic device further includes an adjustment mechanism connected to the heat dissipation assembly, and the adjustment mechanism is used to control the direction or position of the heat dissipation assembly.
The electronic device according to claim 13, further comprising two or more first air ducts respectively corresponding to the electronic device, wherein the adjustment mechanism controls the direction or position of the heat dissipation component to be connected to the first air duct .
A heat dissipation device applied to electronic equipment, and the electronic equipment is provided with the heat dissipation component according to any one of claims 1 to 7 or the heat dissipation structure according to any one of claims 8 to 10; Wherein, the heat dissipation device includes:

The detection component is configured to detect the temperature value of the target object; and

The control component is electrically connected with the heat dissipation component and the detection component, respectively.
The heat dissipation device according to claim 15, wherein:

In response to the temperature value of the target object exceeding the preset temperature value, the control component controls the heat dissipation assembly to dissipate heat to the target object.
A heat dissipation method is applied to a heat dissipation device, and the heat dissipation device is provided with the heat dissipation assembly, the detection part and the control part according to any one of claims 1 to 7, the control part and the heat dissipation assembly respectively Electrically connected to the detection component; wherein the heat dissipation method includes:

Obtain the temperature value of the target object; and

When the temperature value of the target object exceeds the preset temperature value, the heat dissipation component is controlled to dissipate heat to the target object.
The heat dissipation method according to claim 17, wherein the heat dissipation device is further provided with an adjusting component connected to the heat dissipation component; wherein, when the temperature value of the target object exceeds a preset temperature value, the control The heat dissipation component to dissipate the target object includes:

When the temperature value of the target object exceeds the preset temperature value, the adjustment component is controlled to adjust the direction or position of the heat dissipation component to dissipate heat of the target object.
An electronic device, comprising: a memory, a processor, and a computer program stored on the memory and running on the processor, wherein the processor executes the computer program according to any one of claims 17 to 18 The heat dissipation method described.
A computer-readable storage medium storing computer-executable instructions. When the computer-executable instructions are executed by a processor, the processor executes the heat dissipation method according to any one of claims 17 to 18.