WO2021244153A1 - 客户前置设备 - Google Patents

客户前置设备 Download PDF

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Publication number
WO2021244153A1
WO2021244153A1 PCT/CN2021/087413 CN2021087413W WO2021244153A1 WO 2021244153 A1 WO2021244153 A1 WO 2021244153A1 CN 2021087413 W CN2021087413 W CN 2021087413W WO 2021244153 A1 WO2021244153 A1 WO 2021244153A1
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WO
WIPO (PCT)
Prior art keywords
radiator
heat sink
customer front
end equipment
circuit board
Prior art date
Application number
PCT/CN2021/087413
Other languages
English (en)
French (fr)
Inventor
揭骏仁
Original Assignee
Oppo广东移动通信有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oppo广东移动通信有限公司 filed Critical Oppo广东移动通信有限公司
Publication of WO2021244153A1 publication Critical patent/WO2021244153A1/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/02—Arrangements for de-icing; Arrangements for drying-out ; Arrangements for cooling; Arrangements for preventing corrosion
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/52—Means for reducing coupling between antennas; Means for reducing coupling between an antenna and another structure

Definitions

  • This application relates to the field of electronic technology, in particular to a customer front-end device.
  • CPE Customer Premise Equipment
  • CPE Customer Premise Equipment
  • 4G or 5G signal that converts into Wi-Fi signals.
  • CPE can be widely used for wireless network access in rural areas, towns, hospitals, units, factories, communities, etc., which can save the cost of laying wired networks.
  • CPE can re-relay the base station signal. It turns the received signal into a Wi-Fi signal and provides it to nearby devices. Compared with smart phones, notebooks and other terminal devices, CPE antennas have stronger gain and higher power, and its signal transmission and reception capabilities are more powerful than smart phones. Therefore, in some places where the smart phone has no signal, the CPE may have the signal. CPE can turn operator network signals into Wi-Fi signals, and more devices such as smart phones, ipads, laptops, etc. can use CPE to access the Internet.
  • the embodiment of the present application provides a customer front-end equipment, which can reduce the space occupied by the antenna in the customer front-end equipment and reduce the volume of the customer front-end equipment.
  • the embodiment of the application discloses a customer front-end device, including:
  • a heat sink the heat sink includes a base plate and a plurality of heat sinks, the plurality of heat sinks are arranged on the base plate at intervals, and the base plate is made of metal;
  • the radiator is electrically connected to the heat sink, and the radiator and the heat sink are used together to radiate radio frequency signals.
  • Figure 1 is a schematic structural diagram of a customer front-end device provided by an embodiment of the application.
  • FIG. 2 is a schematic diagram of the first structure of the heat sink, the circuit board and the radiator in the customer front-end equipment provided by an embodiment of the application.
  • FIG. 3 is a schematic diagram of the structure of the cooperation between the heat sink and the circuit board in the customer front-end equipment provided by an embodiment of the application.
  • FIG. 4 is a schematic diagram of the exploded structure of the circuit board and the heat sink in FIG. 3.
  • FIG. 5 is a schematic diagram of a second structure in which the heat sink, the circuit board and the radiator in the customer front-end equipment provided by an embodiment of the application are matched.
  • FIG. 6 is a schematic diagram of the structure of the metal parts and the connecting parts in the customer front-end equipment provided by an embodiment of the application.
  • FIG. 7 is a schematic diagram of the structure of the radiator in FIG. 5.
  • FIG. 8 is a third structural schematic diagram of the cooperation of the radiator, the circuit board and the radiator in the customer front-end equipment provided by an embodiment of the application.
  • FIG. 9 is a fourth structural schematic diagram of the cooperation of the heat sink, the circuit board and the radiator in the customer front-end equipment provided by the embodiment of the application.
  • FIG. 10 is a fifth structural schematic diagram of the cooperation of the heat sink, the circuit board and the radiator in the customer front-end equipment provided by an embodiment of the application.
  • FIG. 11 is a sixth structural schematic diagram of the cooperation of the heat sink, the circuit board and the radiator in the customer front-end equipment provided by an embodiment of the application.
  • FIG. 1 is a schematic structural diagram of a customer front-end device provided by an embodiment of this application.
  • Figure 2 is a customer front-end device provided by an embodiment of this application.
  • the first structure diagram of the middle radiator, the circuit board and the radiator; the customer front equipment 100 includes: a housing 10, a radiator 20, a circuit board 30 and a radiator 40, a radiator 20, a circuit board 30 and a radiator 40 are all arranged in the housing 10.
  • the housing 10 includes a first surface 11 and a second surface 12 opposite to each other.
  • the area of the second surface 12 is larger than that of the first surface 11.
  • the contact area between the shell 10 and the supporting object helps to improve the stability of the fixing of the shell 10 and the supporting object.
  • the housing 10 can be made of non-metallic materials, such as glass, plastic, plastic, etc. Since the housing 10 is made of non-metallic materials, the performance of the antenna in the housing 10 will not be affected.
  • the shape of the housing 10 may be a truncated cone shape, and the shape of the housing 10 may also be a square or a cylindrical shape.
  • the embodiment of the present application does not limit the shape of the housing 10.
  • the heat sink 20 is disposed on the circuit board 30, and the heat sink 20 abuts the circuit board 30 to diffuse the heat generated by the circuit board 30 of the customer premise equipment 100.
  • the heat sink 20 can be connected to the circuit board 30 by screws, and the heat sink 20 can also be connected to the circuit board 30 by means of clamping, bonding or the like. Qualify.
  • the material of the heat sink 20 is a metal material, such as metal copper, metal silver, metal aluminum, etc.
  • the heat sink 20 is made of metal material.
  • the metal material has a high thermal conductivity, which can improve the heat dissipation function of the heat sink 20; on the other hand,
  • the metal heat sink 20 can be multiplexed as a part of the antenna, which can radiate radio frequency signals.
  • the embodiment of the present application adopts metal aluminum, which can not only reduce the weight of the radiator 20, but also can achieve a good heat dissipation effect.
  • FIG. 3 is a schematic diagram of the structure of the heat sink and the circuit board provided by an embodiment of the application.
  • the heat sink 20 includes a substrate 21 and a plurality of radiating fins 22, and the plurality of radiating fins 22 are arranged on the substrate 21 at intervals.
  • the plurality of heat sinks 22 may be arranged on the same side of the substrate 21 at intervals, or may be arranged on different sides of the substrate 21 at intervals.
  • a plurality of heat dissipation fins 22 are arranged on the same side of the substrate 21 at intervals, the side of the substrate 21 where the heat dissipation fins 22 is not provided abuts against the circuit board 30.
  • the heat of the circuit board 30 can be transferred to the substrate 21, and the substrate 21 can transfer the heat to a plurality of heat sinks 22, so that the purpose of heat dissipation can be achieved through the plurality of heat sinks 22.
  • the circuit board 30 can be electrically connected to the heat sink 22 located on one side of the substrate 21, so that the circuit board 30 directly transfers the generated heat to the On the multiple heat sinks 22 connected to the circuit board 30, the multiple heat sinks 22 connected to the circuit board 30 sequentially transfer heat to the substrate 21 and the heat sink 22 on the side away from the circuit board 30, thereby achieving the purpose of heat dissipation.
  • the lengths of the heat sinks 22 on both sides of the substrate 21 may be the same or different.
  • the length of the heat sink 22 close to the circuit board 30 is smaller than the distance The length of the heat sink 22 of the circuit board 30.
  • both the substrate 21 and the heat sink 22 are made of metallic materials, for example, metallic copper, metallic silver, metallic aluminum, and the like.
  • FIG. 4 is a schematic diagram of the exploded structure of the heat sink and the circuit board in FIG. 3.
  • the substrate 21 is provided with a plurality of bumps 211 on the side facing the circuit board 30, and the plurality of bumps 211 are arranged on the substrate 21 at intervals.
  • the substrate 21 abuts against the circuit board 30 through the bumps 211, so that the substrate 21 and the circuit board 30 A gap is formed therebetween, and the circuit board 30 can not only dissipate heat through the heat sink 20, but also the heat of the circuit board 30 can be dissipated through the gap, so that the heat dissipation effect of the circuit board 30 can be improved.
  • the substrate 21 abuts the circuit board 30 through the bumps 211, which can reduce the contact area between the substrate 21 and the circuit board 30, thereby increasing the clearance area of the circuit board 30, which is equivalent to increasing the space required for installing electronic components.
  • the bump 211 can be integrally formed with the substrate 21, and the bump 211 can also be connected to the substrate 21 by means of clamping, welding, screws, etc.
  • the embodiment of the present application does not limit the fixing method of the bump 211 and the substrate 21, and others can be The manner in which the bumps 211 are connected to the substrate 21 are all within the protection scope of the embodiments of the present application.
  • each heat sink 22 may have a strip-shaped structure, and the heat sinks 22 may also be of a plate-shaped structure.
  • the height of each heat sink 22 can be the same or different. For example, there can be 9 radiating fins 22, the two radiating fins 22 located on the outermost side of all radiating fins 22 are arranged at the same height, and the height of the two radiating fins 22 adjacent to the outermost two radiating fins 22 among all the radiating fins 22 It is greater than the height of the outermost heat sink 22, and the remaining five heat sinks 22 are located in the middle of all heat sinks 22.
  • the five heat sinks 22 are arranged at the same height, and the five heat sinks 22 can be defined as a middle heat sink group. The height of the middle radiating fin group is greater than the height of the two adjacent radiating fins 22.
  • each heat sink 22 may be the same or different.
  • the length of the two outermost heat sinks 22 is smaller than the length of the remaining heat sinks 22.
  • At least one heat sink 22 is located in the same row, for example, two heat sinks 22 are located in the same row, and the two heat sinks 22 are arranged at intervals.
  • each heat sink 22 has the same angle with the substrate 21, and the angle may be greater than 0 degrees and less than 180 degrees.
  • each heat sink The fins 22 are perpendicular to the substrate 21, which can reduce the space occupied by multiple heat sinks 22 and help reduce the volume of the customer's front-end device 100.
  • the circuit board 30 may be a flexible circuit board.
  • the circuit board 30 serves as the main board of the customer's front-end equipment 100.
  • the circuit board 30 is provided with electronic components such as radio frequency modules and control circuits.
  • the circuit board 30 is provided with The grounding point 31 and the feeding point 32 are used for electrical connection with the radiator 40 to realize the grounding of the radiator 40, and the feeding point 32 is used for electrical connection with the radiator 40 to realize the circuit board 30
  • the radio frequency module of the radiator 40 feeds power, so that the radiator 40 transmits different radio frequency signals, such as 4G radio frequency signals, 5G radio frequency signals, and so on.
  • Figure 5 is a second structural schematic diagram of the cooperation of the radiator, circuit board and radiator in the customer front-end equipment provided by an embodiment of the application. Schematic diagram of the structure of the metal parts and connectors in the equipment.
  • the radiator 40 is disposed on the radiator 20.
  • the radiator 40 is electrically connected to the heat sink 22.
  • the radiator 40 and the heat sink 22 are used to radiate radio frequency signals.
  • the radiator 40 serves as the radiator of the antenna.
  • the length of the additional radiator 40 can be shortened, so that the design of a small antenna can be realized, and the space required for the additional installation of the antenna can be saved. Small customer front-end equipment volume.
  • the radiator 40 is disposed on the heat sink 22, that is, the radiator 40 is electrically connected to a heat sink 22, and the radiator 40 is connected to the end of the heat sink 22 away from the substrate 21, so that the radiator 40 is located above the heat sink 22,
  • the distance between the radiator 40 and the circuit board 30 can be increased, the influence of the electronic components of the circuit board 30 on the radiator 40 can be reduced, and the communication performance of the customer front-end device 100 can be improved.
  • the radiator 40 may also be electrically connected to two adjacently arranged heat sinks 22, and the two adjacently arranged heat sinks 22 of the heat sink 20 are both used as part of the radiator 40, which can further shorten the additional radiation.
  • the size of the body 40 in turn, can realize the design of a small antenna, can further reduce the space occupied by the additional antenna in the customer front device 100, and help reduce the volume of the customer front device 100.
  • the radiator 40 may be disposed at one end of the heat sink 22 away from the substrate, and two ends of the radiator 40 are connected to a heat sink 22 respectively. Arranging the radiator 40 between two adjacent heat sinks 22 not only saves the space occupied by the radiator 40, but also avoids the influence of the heat sink 22 on the radiator 40, thereby improving antenna performance.
  • the customer front-end device 100 further includes a metal piece 50, and the radiator 40 is connected to the heat sink 22 through the metal piece 50.
  • the metal member 50 may be a metal strip or a metal sheet. The arrangement of the metal piece 50 can avoid damaging the radiator 40, and the metal piece 50 can also increase the length of the antenna, which can reduce the length of the additional radiator 40.
  • one end of the metal piece 50 is welded to the radiator 40, and the other end of the metal piece 50 is fixed to the heat sink 22 by screws. It is understandable that the metal piece 50 may also be connected to the heat sink 22 by means of clamping, welding, etc. The embodiment of the present application does not limit the connection manner of the metal piece 50 to the heat sink 22 and the radiator 40.
  • the customer front-end equipment 100 further includes a connecting piece 60, one end of the connecting piece 60 is connected to the metal piece 50, and the other end of the connecting piece 60 is connected to the heat sink 22.
  • the connector 60 includes a first part 61, a second part 62 and a third part 63. One end of the second part 62 is connected to the first part 61, and the other end is connected to the third part 63.
  • the first part 61 There is a first included angle with the second part 62, and a second included angle between the second part 62 and the third part 63, wherein the first included angle is greater than or equal to 90 degrees and less than 180 degrees, and the second included angle It is an included angle greater than 0 degrees and less than or equal to 90 degrees.
  • the first included angle is preferably 120 degrees, and the second included angle is 90. Since the radiator 40 is connected to the heat sink 22 through the first part 61, the second part 62 and the third part 63 of the connecting member 60, it can increase The length of the antenna can further shorten the length of the additional radiator 40 and save the space required for the additional radiator 40. In addition, since the connecting piece 60 is not straight, the structure of the connecting piece 60 can be compactly arranged, thereby saving the space occupied by the connecting piece 60 and further reducing the volume of the customer front device 100.
  • the end of the first part 61 away from the second part 62 is connected to the metal piece 50, and the end of the third part 63 away from the second part 62 is connected to the heat sink 22.
  • the second part 62 is perpendicular to the substrate 21, and the end of the second part 62 away from the third part 63 protrudes from all the heat sinks 22, so that the radiator 40 is located above all the heat sinks 22, which can further improve the radiator.
  • the distance between 40 and the circuit board 30 can further reduce the interference of the electronic components on the circuit board 30 to the radiator 40.
  • the third part 63 of the connecting piece 60 is provided with a mounting hole 631, and the mounting hole 631 is used to cooperate with the positioning hole of the heat sink 22 described below, so as to realize a fixed connection between the third part 63 of the connecting piece 60 and the heat sink 22.
  • the mounting hole 631 may be a threaded hole, and the third part 63 of the connecting member 60 may be matched with the mounting hole 631 by a screw to realize a fixed connection between the connecting member 60 and the heat sink 22.
  • the metal part 50 can be fixed to the first part 61 by welding. It is understandable that the metal part 50 can also be fixed to the first part 61 by screws, clamps, etc. The embodiment of the present application does not fix the metal part 50 and the first part 61. Qualify.
  • the third part 63 of the connecting piece 60 is fixed to the heat sink 22 by screws. It can be understood that the third part 63 of the connecting piece 60 can also be fixed to the heat sink 22 by welding, clamping, etc. The embodiment of the application does not correspond to the connecting piece.
  • the fixing method of 60 and the third part 63 is limited.
  • the connecting member 60 is made of metal materials, for example, metal copper, metal silver, metal aluminum and the like.
  • a fixing portion 221 is further provided on the heat sink 22.
  • a positioning hole (not shown) is provided on the upper part, and the positioning hole (not shown) is matched with the above-mentioned mounting hole 631, so that the third part 63 of the connecting piece 60 can be firmly fixed to the end of the heat sink 22, thereby achieving The radiator 40 is firmly fixed to the heat sink 22.
  • FIG. 7 is a schematic diagram of the structure of the radiator in FIG. 5;
  • the radiator 40 includes a first radiating element 41 and a second radiating element 42.
  • the second radiating element 42 is arranged opposite to the first radiating element 41, wherein the heat dissipation
  • the sheet 22 can be connected to the first radiating element 41 or the second radiating element 42.
  • the radiator 40 includes a grounding terminal 43 and a feeding terminal 44.
  • the grounding terminal 43 is electrically connected to the grounding point 31 of the circuit board 30 to realize the grounding of the radiator 40.
  • the feeding terminal 44 is electrically connected to the feeding point 32 of the circuit board 30. It is connected to realize the circuit board 30 feeding the radiator 40.
  • the ground terminal 43 of the radiator 40 may be disposed on the first radiating element 41 or the second radiating element 42.
  • the grounding terminal 43 can be arranged on the first radiating element 41 of the radiator 40
  • the feeding terminal 44 can be arranged on the second radiating element 42 of the radiator 40
  • the grounding terminal 43 can be electrically connected to the grounding point 31 of the circuit board 30 through a cable.
  • the feeding end 44 may also be electrically connected to the feeding point 32 of the circuit board 30 through a cable.
  • the first radiating element 41 may be connected to the heat sink 22 through a metal piece 50, and it can be understood that the second radiating element 42 may also be connected to the heat sink 22 through a metal piece 50.
  • FIG. 8 is a third structural diagram of the cooperation of the heat sink, the circuit board, and the radiator of the customer front device provided by an embodiment of the application.
  • the customer front-end equipment 100 may include one radiator 40, or two radiators 40, two radiators 40, such as a first radiator 40a and a second radiator 40b, a first radiator 40a and a second radiator 40b are respectively arranged on the two outermost radiating fins 22 of the radiator 20.
  • the first radiator 40a and the second radiator 40b may or may not be arranged oppositely.
  • the first radiator 40a is arranged on the radiator 20.
  • the second radiator 40b is arranged at the right end of the radiator 20, or both the first radiator 40a and the second radiator 40b are arranged at the left or right end of the radiator 20.
  • radiators 20 there may be one or two radiators 20.
  • FIG. 9 is a fourth structural schematic diagram of the cooperation of the heat sink, the circuit board, and the radiator of the customer front device provided by the embodiment of the application.
  • the first radiator 20a and the second radiator 20b are respectively arranged on different sides of the circuit board 30 of the customer's front-end equipment. That is, the first heat sink 20 a is provided on one side of the circuit board 30, and the second heat sink 20 b is provided on the other side of the circuit board 30.
  • the first heat sink 20a and the second heat sink 20b may be arranged relative to the circuit board 30, such as the first heat sink 20a and the second heat sink 20b being symmetrically arranged relative to the circuit board 30.
  • the first heat sink 20a includes a first substrate 21a and a plurality of first heat sinks 22a.
  • the plurality of first heat sinks 22a are arranged on the first substrate 21a at intervals
  • the second heat sink 20b includes a second substrate 21b and a plurality of second heat sinks.
  • the fins 22b and a plurality of second heat dissipation fins 22b are arranged on the second substrate 21b at intervals.
  • the circuit board 30 is generally provided with circuit structures on both sides.
  • heat sinks 20 are provided on both sides of the circuit board 30, and the two heat sinks 20 can respectively abut against two opposite surfaces of the circuit board 30. Therefore, the purpose of heat dissipation can be realized from the two sides of the circuit board 30, and the heat dissipation efficiency can be improved.
  • the first radiator 40a and the second radiator 40b can be arranged on the same radiator 20, that is, two radiators 40 may be provided on the first radiator 20a or the second radiator 20b. Both the first radiator 40a and the second radiator 40b may be disposed on the outermost heat sink 22.
  • the first radiator 40a and the second radiator 40b may be arranged oppositely.
  • the first radiator 40a and the second radiator 40b may not be arranged oppositely.
  • the first radiator 40a and the second radiator 40b are both arranged opposite to each other.
  • the first radiator 40a and the second radiator 40b can also be arranged at the right end of the first radiator 20a or the second radiator 20b, or the first radiator 20a or the second radiator 20b
  • the radiator 40a and the second radiator 40b are both arranged in the middle of the first radiator 20a or the second radiator 20b; or alternatively, the first radiator 40a is arranged at the left end of the first radiator 20a, and the second radiator 40b is arranged At the right end of the second radiator 20b.
  • FIG. 10 is a fifth structural schematic diagram of the cooperation of the heat sink, the circuit board, and the radiator of the customer front device provided by the embodiment of the application. It can be understood that the two radiators 40 may also be disposed on different heat sinks 20, for example, the first radiator 40a is disposed on the first heat sink 20a, and the second radiator 40b is disposed on the second heat sink 20b.
  • the two radiators 40 may be arranged symmetrically with respect to the circuit board 30.
  • the first radiator 40a may be arranged at the left end of the first heat sink 20a
  • the second radiator 40b may be arranged at the left end of the second heat sink 20b
  • a radiator 40a may be arranged at the right end of the first heat sink 20a
  • a second radiator 40b may be arranged at the right end of the second heat sink 20b.
  • the two radiators 40 can be arranged asymmetrically with respect to the circuit board 30.
  • the first radiator 40a is arranged at the left end of the first heat sink 20a
  • the second radiator 40b is arranged at the right end of the second heat sink 20b.
  • the isolation between the two radiators 40 can be improved, the interference between the antennas can be reduced, and the antenna performance can be improved.
  • FIG. 11 is a sixth structural diagram of the cooperation of the heat sink, the circuit board, and the radiator of the customer front device provided by the embodiment of the application.
  • the number of radiators 40 is four, four radiators 40 can be arranged on two radiators 20, of which two radiators 40 are arranged on the same radiator 20, and the other two radiators 40 are arranged on the other radiator. On the radiator 20.
  • the four radiators 40 can be defined as a first radiator 40a, a second radiator 40b, a third radiator 40c, and a fourth radiator 40d, where the first radiator 40a and the second radiator 40b can be Located on both sides of the first heat sink 20a, the third radiator 40b and the fourth radiator 40d may be located on both sides of the second heat sink 20b.
  • the first radiator 40a and the second radiator 40b may be located at the same end position of the first radiator 20a, and the third radiator 40c and the fourth radiator 40d may be located at the same end position of the second radiator 20b.
  • the two radiators 40 on the first radiator 20 a and the two radiators 40 on the second radiator 20 b may be symmetrically arranged with respect to the circuit board 30.
  • the first radiator 40 a and the third radiator 40 c are arranged symmetrically with respect to the circuit board 30, and the second radiator 40 b and the fourth radiator 40 d are arranged symmetrically with respect to the circuit board 30.
  • the embodiment of the present application directly multiplexes the heat sink 22 of the radiator 20 as a part of the antenna, which can reduce the size of the additional radiator 40, and can realize that the length of the radiator 40 is a quarter of the wavelength of the radio frequency signal, for example, The length of the radiator 40 is less than 108 mm. It can be seen that under the condition that the basic performance of the antenna is not much different, the embodiment of the present application can greatly save the size of the radiator 40, so as to reduce the overall volume of the customer's front-end equipment, and can also increase the mutual relationship between the radiators 40. Or you can place more radiators to further improve the antenna’s radiation performance.

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Abstract

一种客户前置设备，包括散热器，所述散热器包括金属基板和多个散热片，多个所述散热片间隔设置于所述基板；以及辐射体，所述辐射体与所述散热片电连接，所述辐射体与所述散热片共同用于辐射射频信号。

Description

客户前置设备
本申请要求于2020年06月02日提交中国专利局、申请号为202010491371.X、发明名称为“客户前置设备”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本申请涉及电子技术领域，特别涉及一种客户前置设备。
背景技术
CPE(Customer Premise Equipment，客户前置设备)是一种接收移动信号并以无线Wi-Fi信号转发出来的移动信号接入设备，它也是一种将高速4G或者5G信号转换成Wi-Fi信号的设备，可支持同时上网的移动终端数量也较多。CPE可大量应用于农村，城镇，医院，单位，工厂，小区等无线网络接入，能节省铺设有线网络的费用。
在距离比较远，或者障碍物比较多的情况下，基站信号覆盖会容易出现信号盲点。在这些盲点角落，终端设备诸如智能手机无法收到基站信号。CPE可以对基站信号进行二次中继，它把接收到的信号变成Wi-Fi信号，提供给身边的设备使用。相比于智能手机，笔记本等终端设备，CPE天线增益更强，功率更高，它的信号收发能力比智能手机更为强大。所以，有些地方智能手机没有信号，CPE可能就有信号。CPE可以把运营商网络信号变成Wi-Fi信号，更多的设备如智能手机、ipad、笔记本电脑等都可以借助CPE进行上网。
发明内容
本申请实施例提供一种客户前置设备，可以减小天线在客户前置设备的占用空间，以及减小客户前置设备的体积。
本申请实施例公开一种客户前置设备，包括：
散热器，所述散热器包括基板和多个散热片，多个所述散热片间隔设置于所述基板，所述基板的材质为金属；以及
辐射体，所述辐射体与所述散热片电连接，所述辐射体与所述散热片共同用于辐射射频信号。
附图说明
为了更清楚地说明本申请实施例中的技术方案，下面将对实施例描述中所需要使用的附图作简单地介绍。显而易见地，下面描述中的附图仅仅是本申请的一些实施例，对于本领域技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1为本申请实施例提供的客户前置设备的结构示意图。
图2为本申请实施例提供的客户前置设备中散热器、电路板与辐射体配合的第一种结构示意图。
图3为本申请实施例提供的客户前置设备中散热器与电路板配合的结构示意图。
图4为图3中电路板与散热器的分解结构示意图。
图5为本申请实施例提供的客户前置设备中散热器、电路板与辐射体配合的第二种结构示意图。
图6为本申请实施例提供的客户前置设备中金属件与连接件的结构示意图。
图7为图5中辐射体的结构示意图。
图8为本申请实施例提供的客户前置设备中散热器、电路板与辐射体配合的第三种结构示意图。
图9为本申请实施例提供的客户前置设备中散热器、电路板与辐射体配合的第四种结构示意图。
图10为本申请实施例提供的客户前置设备中散热器、电路板与辐射体配合的第五种结构示意图。
图11为本申请实施例提供的客户前置设备中散热器、电路板与辐射体配合的第六种结构示意图。
具体实施方式
下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行清楚、完整地描述。显然，所描述的实施例仅仅是本申请一部分实施例，而不是全部的实施例。基于本申请中的实施例，本领域技术人员在没有作出创造性劳动前提下所获得的所有其他实施例，都属于本申请保护的范围。
本申请实施例提供一种客户前置设备，请参阅图1和图2，图1为本申请实 施例提供的客户前置设备的结构示意图，图2为本申请实施例提供的客户前置设备中散热器、电路板与辐射体配合的第一种结构示意图；客户前置设备100包括：壳体10、散热器20、电路板30以及辐射体40，散热器20、电路板30以及辐射体40均设置于壳体10内。
壳体10包括相对设置的第一面11和第二面12，其中，第二面12的面积大于第一面11的面积，当壳体10的第二面12与支撑物体固定时，可以增加壳体10与支撑物体连接的接触面积，有助于提高壳体10与支撑物体固定的稳定性。
其中，壳体10可以采用非金属材料制作，例如，玻璃、塑胶、塑料等，由于壳体10采用非金属材料制作，不会影响壳体10内的天线性能。
壳体10的形状可以为圆台形，壳体10的形状也可以为方形或圆柱形，本申请实施例不对壳体10的形状进行限定。
如图2所示，散热器20设置于电路板30上，且散热器20与电路板30相抵接，以扩散客户前置设备100的电路板30所产生的热量。
其中，散热器20可以通过螺钉连接于电路板30上，散热器20也可以通过卡接、粘接等方式连接于电路板30上，本申请实施例不对散热器20与电路板30的连接方式进行限定。
散热器20的材质为金属材质，诸如金属铜、金属银、金属铝等，散热器20采用金属材质，一方面，金属材质的导热系数高，可以提高散热器20的散热功能；另一方面，可以将金属材质的散热器20复用为天线的一部分，能够辐射射频信号。本申请实施例采用金属铝，不仅可以减轻散热器20的重量，而且，也可以起到很好的散热效果。
请参阅图3，图3为本申请实施例提供的散热器与电路板配合的结构示意图。散热器20包括基板21和多个散热片22，多个散热片22间隔设置于基板21。
其中，多个散热片22可以间隔设置于基板21的同一侧，也可以间隔设置于基板21的不同侧。当多个散热片22间隔设置于基板21的同一侧时，基板21未设置散热片22的一面与电路板30相抵接。电路板30的热量可传递到基板21上，基板21可将热量传递到多个散热片22上，从而可以通过多个散热片22实现散热的目的。
可以理解的，当多个散热片22间隔设置于基板21的不同侧时，电路板30 可以与位于基板21一侧的散热片22电连接，以实现电路板30将产生的热量直接传递至与电路板30连接的多个散热片22上，与电路板30连接的多个散热片22将热量依次传递给基板21以及远离电路板30一侧的散热片22，从而实现散热的目的。
其中，当多个散热片22间隔设置于基板21的不同侧时，位于基板21两侧的散热片22的长度可以相同，也可以不同，例如，靠近电路板30的散热片22的长度小于背离电路板30的散热片22的长度。
需要说明的是，基板21和散热片22均采用金属材料制作，例如，金属铜、金属银、金属铝等。
请参阅图4，图4为图3中散热器与电路板的分解结构示意图。其中，基板21朝向电路板30的一面设有多个凸块211，多个凸块211间隔设置于基板21，基板21通过凸块211与电路板30抵接，可以使基板21与电路板30之间形成间隙，电路板30不仅可以通过散热器20进行散热，而且，电路板30的热量也可以通过该间隙进行散热，从而可以提高电路板30的散热效果。
并且，基板21通过凸块211与电路板30抵接，可以缩小基板21与电路板30的接触面积，从而可以增加电路板30的净空区域，相当于增加了设置电子元件所需的空间。
其中，凸块211可以与基板21一体成型，凸块211也可以通过卡接、焊接、螺钉等方式连接于基板21，本申请实施例不对凸块211与基板21的固定方式进行限定，其他可以实现凸块211与基板21连接的方式均是本申请实施例保护的范围。
请再次参阅图3和图4，其中，多个散热片22可以为条形结构，散热片22也可以为板状结构。每个散热片22的高度可以相同，也可以不同。诸如散热片22可以为9条，位于所有散热片22最外侧的两个散热片22等高设置，所有散热片22中与最外侧的两个散热片22相邻的两个散热片22的高度大于最外侧的散热片22的高度，其余五个散热片22位于所有散热片22的中间位置，该五个散热片22等高设置，可以将该五个散热片22定义为中间散热片组，中间散热片组的高度均大于与其相邻的两个散热片22的高度。
可以理解的，每个散热片22的长度可以相同，也可以不同，诸如，最外侧 的两个散热片22的长度小于其余散热片22的长度。
可以理解的，至少一个散热片22位于同一列，例如两个散热片22位于同一列，且两个散热片22间隔设置。
其中，多个散热片22之间相互平行，例如，每一个散热片22均与基板21之间具有相同的角度，该角度可以为大于0度以及小于180度，本申请实施例中每一个散热片22均与基板21相互垂直，可以缩小多个散热片22的占用空间，有助于减小客户前置设备100的体积。
如图4所示，电路板30可以为柔性电路板，电路板30作为客户前置设备100的主板，电路板30上设有射频模块、控制电路等电子元件，例如，电路板30上设有接地点31和馈电点32，所述接地点31用于与辐射体40电连接，以实现辐射体40接地，所述馈电点32用于与辐射体40电连接，以实现电路板30的射频模块向辐射体40馈电，实现辐射体40传输不同的射频信号，例如传输4G射频信号、5G射频信号等。
请参阅图5和图6，图5为本申请实施例提供的客户前置设备中散热器、电路板与辐射体配合的第二种结构示意图，图6为本申请实施例提供的客户前置设备中金属件与连接件的结构示意图。辐射体40设置于散热器20，辐射体40与散热片22电连接，辐射体40与散热片22共同用于辐射射频信号，其中，辐射体40作为天线的辐射体，通过将散热片22复用为天线的一部分，可以缩短额外设置辐射体40的长度，从而可以实现小型天线的设计，节省额外设置天线所需的空间，进而，可以在满足客户前置设备的通信性能的基础上，减小客户前置设备的体积。
其中，辐射体40设置于散热片22上，即辐射体40与一个散热片22电连接，辐射体40连接于散热片22远离基板21的一端，以使辐射体40位于散热片22的上方，可以提高辐射体40与电路板30之间的距离，降低电路板30的电子元件对辐射体40的影响，有助于提高客户前置设备100的通信性能。
可以理解的，辐射体40也可以与两个相邻设置的散热片22电连接，将散热器20的两个相邻设置的散热片22均作为辐射体40的一部分，可以进一步缩短额外设置辐射体40的尺寸，进而，可以实现小型天线的设计，可以进一步减小额外设置天线在客户前置设备100内所占用的空间，有助于减小客户前置设备100 的体积。
当两个相邻设置的散热片22作为辐射体40的一部分时，辐射体40可以设置于散热片22远离基板的一端，且辐射体40的两端分别连接一个散热片22。将辐射体40设置于两个相邻散热片22之间，不仅可以节省辐射体40的占用空间，而且，也可以避免散热片22对辐射体40的影响，从而可以提高天线性能。
可以理解的，为了方便辐射体40与散热片22的连接，客户前置设备100还包括金属件50，辐射体40通过金属件50与散热片22连接。其中，金属件50可以为金属条，也可以为金属片。金属件50的设置可以避免损坏辐射体40，而且，金属件50也可以起到增加天线长度的作用，可以减少额外设置辐射体40的长度。
其中，金属件50一端与辐射体40焊接，金属件50的另一端通过螺钉固定于散热片22。可以理解的，金属件50也可以通过卡接、焊接等方式与散热片22连接，本申请实施例不对金属件50与散热片22和辐射体40的连接方式进行限定。
可以理解的，为了更好的固定金属件50，客户前置设备100还包括连接件60，连接件60一端与金属件50连接，连接件60的另一端与散热片22连接。
如图6所示，其中，连接件60包括第一部分61、第二部分62和第三部分63，第二部分62的一端与第一部分61连接，另一端与第三部分63连接，第一部分61与第二部分62之间具有第一夹角，第二部分62与第三部分63之间具有第二夹角，其中，第一夹角为大于等于90度以及小于180度，第二夹角为大于0度以及小于等于90度的夹角。
本申请实施例优选第一夹角为120度，第二夹角为90，由于辐射体40通过连接件60的第一部分61、第二部分62和第三部分63连接于散热片22，可以增加天线的长度，可以进一步缩短额外设置辐射体40的长度，节省额外设置辐射体40所需的空间。并且，由于连接件60不是直条状，可以使连接件60的结构紧凑设置，从而可以节省连接件60的占用空间，进一步减少客户前置设备100的体积。
其中，第一部分61远离第二部分62的一端与金属件50连接，第三部分63远离第二部分62的一端与散热片22连接。第二部分62与基板21垂直设置，并且，第二部分62远离第三部分63的一端凸出所有的散热片22设置，以使辐射体40位于所有散热片22的上方，可以进一步提高辐射体40与电路板30之间的距离， 从而，可以进一步降低电路板30上电子元件对辐射体40的干扰。
连接件60的第三部分63设有安装孔631，安装孔631用于与下述散热片22的定位孔相互配合，以实现连接件60的第三部分63与散热片22固定连接。
其中，安装孔631可以为螺纹孔，连接件60的第三部分63可以通过螺钉与安装孔631相配合，以实现连接件60与散热片22固定连接。
金属件50可以通过焊接的方式固定于第一部分61，可以理解的，金属件50也可以通过螺钉、卡接等固定于第一部分61，本申请实施例不对金属件50与第一部分61的固定方式进行限定。
连接件60的第三部分63通过螺钉固定于散热片22，可以理解的，连接件60的第三部分63也可以通过焊接、卡接等方式固定于散热片22，本申请实施例不对连接件60与第三部分63的固定方式进行限定。
需要说明的是，连接件60采用金属材料制作，例如，金属铜、金属银、金属铝等。
如图5所示，可以理解的，为了更好的固定辐射体40，散热片22上还设有固定部221，固定部221凸出散热片22远离基板21的端部，其中，固定部221上设有定位孔(图未示)，定位孔(图未示)与上述安装孔631相配合，可以实现连接件60的第三部分63牢固地固定于散热片22的端部，从而，实现辐射体40牢固地固定于散热片22。
请参阅图7，图7为图5中辐射体的结构示意图；辐射体40包括第一辐射阵子41和第二辐射阵子42，第二辐射阵子42与第一辐射阵子41相对设置，其中，散热片22可以连接于第一辐射阵子41或第二辐射阵子42。
其中，辐射体40包括接地端43和馈电端44，接地端43与电路板30的接地点31电连接，以实现辐射体40接地，馈电端44与电路板30的馈电点32电连接，以实现电路板30向辐射体40馈电。
辐射体40的接地端43可以设置于第一辐射阵子41或第二辐射阵子42。例如，接地端43可以设置于辐射体40的第一辐射阵子41，馈电端44设置于辐射体40的第二辐射阵子42，接地端43可以通过电缆与电路板30的接地点31电连接，馈电端44也可以通过电缆与电路板30的馈电点32电连接。
其中，第一辐射阵子41可以通过金属件50与散热片22连接，可以理解的， 第二辐射阵子42也可以通过金属件50与散热片22连接。
请参阅图8，图8为本申请实施例提供的客户前置设备的散热器、电路板、辐射体配合的第三种结构示意图。客户前置设备100可以包括一个辐射体40，也可以包括两个辐射体40，两个辐射体40，诸如第一辐射体40a和第二辐射体40b，第一辐射体40a和第二辐射体40b分别设置于散热器20最外侧的两个散热片22上，第一辐射体40a和第二辐射体40b可以相对设置，也可以不相对设置，例如，第一辐射体40a设置于散热器20的左端，第二辐射体40b设置于散热器20的右端，或者，第一辐射体40a和第二辐射体40b均设置于散热器20的左端或右端。
需要说明的是，散热器20可以为一个，也可以为两个。
请参阅图9，图9为本申请实施例提供的客户前置设备的散热器、电路板、辐射体配合的第四种结构示意图。散热器20为两个，诸如第一散热器20a和第二散热器20b，第一散热器20a和第二散热器20b分别设置在客户前置设备的电路板30的不同面。即第一散热器20a设置在电路板30的一面，第二散热器20b设置在电路板30的另一面。第一散热器20a和第二散热器20b可以相对于电路板30设置，诸如第一散热器20a和第二散热器20b相对于电路板30对称设置。第一散热器20a包括第一基板21a和多个第一散热片22a，多个第一散热片22a间隔设置于第一基板21a，第二散热器20b包括第二基板21b和多个第二散热片22b，多个第二散热片22b间隔设置于第二基板21b。
可以理解的是，电路板30一般两面均设置有电路结构，本申请实施例在电路板30的两面均设置散热器20，两个散热器20可以分别抵接到电路板30的两个相对面上，从而可以从电路板30的两个面实现散热的目的，可以提高散热效率。
辐射体40的数量为两个时，诸如，第一辐射体40a和第二辐射体40b，第一辐射体40a和第二辐射体40b可以设置在同一个散热器20上，即两个辐射体40可以设置在第一散热器20a或第二散热器20b上。第一辐射体40a和第二辐射体40b均可以设置在最外侧的散热片22上。
其中，第一辐射体40a和第二辐射体40b可以相对设置，当然，第一辐射体40a和第二辐射体40b也可以不相对设置，例如，第一辐射体40a和第二辐射体40b均可以设置于第一散热器20a或第二散热器20b的左端，第一辐射体40a和第 二辐射体40b也可以设置于第一散热器20a或第二散热器20b的右端，或者，第一辐射体40a和第二辐射体40b均设置于第一散热器20a或第二散热器20b的中部；又或者，第一辐射体40a设置于第一散热器20a的左端，第二辐射体40b设置于第二散热器20b的右端。
请参阅图10，图10为本申请实施例提供的客户前置设备的散热器、电路板、辐射体配合的第五种结构示意图。可以理解的是，两个辐射体40也可以设置在不同的散热器20上，诸如，第一辐射体40a设置于第一散热器20a，第二辐射体40b设置于第二散热器20b。
两个辐射体40可以相对电路板30对称设置，例如，第一辐射体40a可以设置于第一散热器20a的左端，第二辐射体40b可以设置于第二散热器20b的左端，或者，第一辐射体40a可以设置于第一散热器20a的右端，第二辐射体40b可以设置于第二散热器20b的右端。
可以理解的，两个辐射体40可以相对电路板30不对称设置，例如，第一辐射体40a设置于第一散热器20a的左端，第二辐射体40b设置于第二散热器20b的右端，可以提高两个辐射体40之间的隔离度，降低天线之间的干扰，从而可以提高天线性能。
请参阅图11，图11为本申请实施例提供的客户前置设备的散热器、电路板、辐射体配合的第六种结构示意图。诸如辐射体40的数量为四个，四个辐射体40可以设置在两个散热器20上，其中两个辐射体40设置在同一个散热器20上，另外两个辐射体40设置在另一个散热器20上。
本申请实施例可以将四个辐射体40定义为第一辐射体40a、第二辐射体40b、第三辐射体40c和第四辐射体40d，其中第一辐射体40a和第二辐射体40b可以位于第一散热器20a的两侧，第三辐射体40b和第四辐射体40d可以位于第二散热器20b的两侧。第一辐射体40a和第二辐射体40b可以位于第一散热器20a同一端部位置，第三辐射体40c和第四辐射体40d可以位于第二散热器20b同一端部位置。第一散热器20a上的两个辐射体40和第二散热器20b上的两个辐射体40相对于电路板30可以对称设置。诸如第一辐射体40a和第三辐射体40c相对于电路板30对称设置，第二辐射体40b和第四辐射体40d相对于电路板30对称设置。
本申请实施例直接将散热器20的散热片22复用为天线的一部分，可以减小 额外设置辐射体40的尺寸，可以实现辐射体40的长度为射频信号波长的四分之一，例如，辐射体40的长度小于108毫米。由此可见，在天线基本性能相差不大的情况下，本申请实施例可以大大节省辐射体40的尺寸，以减小客户前置设备的整体体积，而且还可以提高各个辐射体40相互之间的隔离度，或者可以摆放更多的辐射体，以进一步提高天线的辐射性能。
以上对本申请实施例提供的客户前置设备进行了详细介绍。本文中应用了具体个例对本申请的原理及实施方式进行了阐述，以上实施例的说明只是用于帮助理解本申请。同时，对于本领域的技术人员，依据本申请的思想，在具体实施方式及应用范围上均会有改变之处，综上所述，本说明书内容不应理解为对本申请的限制。

Claims (20)

  1. 一种客户前置设备，包括：
    散热器，所述散热器包括基板和多个散热片，多个所述散热片间隔设置于所述基板，所述基板的材质为金属；以及
    辐射体，所述辐射体与所述散热片电连接，所述辐射体与所述散热片共同用于辐射射频信号。
  2. 根据权利要求1所述的客户前置设备，其中，所述辐射体包括：
    第一辐射阵子；以及
    第二辐射阵子，所述第二辐射阵子与所述第一辐射阵子相对设置；其中，所述散热片与所述第一辐射阵子或所述第二辐射阵子电连接。
  3. 根据权利要求2所述的客户前置设备，其中，所述辐射体还包括接地端，所述接地端设置于所述第一辐射阵子或所述第二辐射阵子。
  4. 根据权利要求3所述的客户前置设备，其中，所述辐射体还包括馈电端，所述接地端设置于所述第一辐射阵子，所述馈电端设置于所述第二辐射阵子。
  5. 根据权利要求4所述的客户前置设备，其中，所述客户前置设备还包括：
    电路板，所述电路板设有接地点和馈电点，所述接地点与所述接地端电连接，所述馈电点与所述馈电端电连接。
  6. 根据权利要求5所述的客户前置设备，其中，所述电路板与所述基板连接，且所述电路板和所述散热片分别设置于所述基板的不同面。
  7. 根据权利要求5所述的客户前置设备，其中，所述基板朝向所述电路板的一面设有多个凸块，多个所述凸块间隔设置于所述基板，所述基板通过所述凸块与所述电路板抵接。
  8. 根据权利要求2所述的客户前置设备，其中，所述客户前置设备还包括：
    金属件，所述第一辐射阵子或所述第二辐射阵子通过所述金属件与所述散热片电连接。
  9. 根据权利要求8所述的客户前置设备，其中，所述客户前置设备还包 括：
    连接件，所述连接件的一端与所述金属件连接，所述连接件的另一端与所述散热片连接。
  10. 根据权利要求9所述的客户前置设备，其中，所述连接件包括：
    第一部分；
    第二部分，所述第二部分的一端与所述第一部分连接，所述第二部分与所述第一部分之间具有第一夹角；及
    第三部分，所述第三部分与所述第二部分的另一端连接，所述第三部分与所述第二部分之间具有第二夹角；其中，
    所述第一夹角大于等于九十度且小于一百八十度，所述第二夹角大于零度且小于等于九十度。
  11. 根据权利要求10所述的客户前置设备，其中，所述第一夹角为一百二十度，所述第二夹角为九十度。
  12. 根据权利要求10所述的客户前置设备，其中，所述第一部分远离所述第二部分的一端与所述金属件连接，所述第三部分远离所述第二部分的一端与所述散热片连接，所述第二部分远离所述第三部分的一端凸出于每一所述散热片。
  13. 根据权利要求8所述的客户前置设备，其中，所述散热片设有固定部，所述固定部凸出所述散热片远离所述基板的端部，所述金属件与所述固定部连接。
  14. 根据权利要求1所述的客户前置设备，其中，所述多个散热片中最外侧的散热片的长度小于其余散热片的长度。
  15. 根据权利要求1所述的客户前置设备，其中，多个所述散热片相互平行设置，且每一所述散热片均与所述基板相互垂直设置。
  16. 根据权利要求1所述的客户前置设备，其中，所述客户前置设备包括两个辐射体，所述散热器最外侧的两个所述散热片分别与一个所述辐射体电连接。
  17. 根据权利要求1所述的客户前置设备，其中，所述辐射体包括第一辐射体、第二辐射体、第三辐射体和第四辐射体，所述散热器包括第一散热器和 第二散热器，所述第一辐射体和所述第二辐射体位于所述第一散热器的两侧，所述第三辐射体和所述第四辐射体位于所述第二散热器的两侧。
  18. 根据权利要求17所述的客户前置设备，其中，所述客户前置设备还包括电路板；所述第一辐射体和所述第三辐射体相对应所述电路板对称设置，所述第二辐射体和所述第四辐射体相对应所述电路板对称设置。
  19. 根据权利要求5所述的客户前置设备，其中，所述散热器包括第一散热器和第二散热器，所述第一散热器和所述第二散热器分别设置于所述电路板的不同面；其中，所述第一散热器和所述第二散热器均设置至少一个所述辐射体。
  20. 根据权利要求19所述的客户前置设备，其中，所述第一散热器和所述第二散热器相对应所述电路板对称设置。
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