WO2021233410A1

WO2021233410A1 - Computing device

Info

Publication number: WO2021233410A1
Application number: PCT/CN2021/095102
Authority: WO
Inventors: 张少华; 张楠赓
Original assignee: 北京嘉楠捷思信息技术有限公司
Priority date: 2020-05-22
Filing date: 2021-05-21
Publication date: 2021-11-25
Also published as: EP4155868A1; JP2023525659A; US20230085383A1; CA3167375A1; AU2021273879B2; AU2021273879A1

Abstract

Disclosed is a computing device, comprising a frame, a computing module, a control module, a power source module and a heat dissipation module, wherein the computing module is arranged in the frame and comprises a power source interface; the power source module comprises a power source connection end, and also comprises a connection box connected to the frame; the power source interface extends from the frame into the connection box; the power source connection end extends into the connection box; and the power source interface and the power source connection end are in connection in the connection box by means of a conducting bar. The computing device of the present invention is provided with a sealable connection box, and a power source and a power source wire of a computing board are connected in the connection box, thus, various power source connection wires are sealed inside the connection box and are prevented from being exposed, such that not only are the safety and aesthetics improved, but also, the connection box is arranged at the top end of a device, so as to facilitate operations. The frame of the present invention is an integrally formed aluminium frame that does not need mounting, and is low in cost and high in strength.

Description

Computing equipment

Technical field

The present invention relates to the technical field of data computing, in particular to a computing device with higher security.

Background technique

A computing device is an electronic device used for high-speed computing, for example, an electronic device used to run a specific algorithm and communicate with a remote server to obtain a corresponding virtual currency. The progress of the existing industry has promoted the development of automation and intelligence, including computing equipment, and various replacement products have emerged one after another. However, existing computing devices still have many designs with exposed connecting wires, which not only affects safety, but also affects appearance.

Invention Disclosure

The purpose of the present invention is to provide a computing device with higher security.

In order to achieve the above objectives, the computing device of the present invention includes a frame, a computing module, a control module, a power supply module, and a heat dissipation module. Outside the frame, the computing module includes a power interface, the power module includes a power connection end, and is characterized in that it further includes a connection box arranged on the frame and the top of the power module, and the power interface is connected from the frame. The top end of the body penetrates the connection box, the power connection end penetrates the connection box, and the power interface and the power connection end are conducted in the connection box through a conductive bar.

In an embodiment of the foregoing computing device, the computing module includes a signal interface, the control module includes a signal connection terminal, the control module is disposed in the connection box, and the signal interface and the signal connection terminal are connected to each other. The connection box is connected by a signal line.

In an embodiment of the foregoing computing device, the connection box includes an upper cover and a bottom cover, and the upper cover is closed on the bottom cover to close the connection box.

In an embodiment of the foregoing computing device, the frame body is an integrally formed aluminum profile piece.

In an embodiment of the foregoing computing device, the frame body includes a first side wall, a second side wall, a top wall, and a bottom wall, and the first side wall and the second side wall are supported on the top wall and the bottom wall. Between the walls.

In an embodiment of the foregoing computing device, the outside of the first side wall includes a power supply slideway arranged horizontally, the power supply module bracket is connected to the first side wall through the power supply slideway, and the power supply module hangs Connected to the power module bracket.

In an embodiment of the foregoing computing device, the bottom wall includes a computing board bottom slideway disposed transversely, and the computing module slides into or out of the frame through the computing board bottom slideway. .

In an embodiment of the foregoing computing device, the computing module includes a heat sink, and the heat sink has a groove that matches with the bottom slideway of the computing board.

In an embodiment of the foregoing computing device, the top wall includes a gap disposed horizontally, and the power interface of the computing module protrudes above the frame through the gap and extends into the connection box. The signal interface of the computing module protrudes above the frame through the gap and extends into the connection box.

In an embodiment of the foregoing computing device, the top wall includes a computing board top slideway corresponding to the bottom slideway of the computing board, and the computing board top slideway is extruded by the side aluminum profile of the gap form.

In an embodiment of the foregoing computing device, the computing module is a plurality of computing modules arranged in parallel, and the conductive row is connected to the plurality of computing modules in sequence.

In an embodiment of the foregoing computing device, the heat dissipation module includes a first fan and a second fan, the frame is hollowed out at the front and rear ends, and the first fan and the second fan are respectively connected to the front end of the frame. And the rear end to block the front and rear ends of the frame.

The present invention also provides a computing device, including a frame, a computing module, a control module, a power supply module, and a heat dissipation module. The computing module is disposed in the frame and includes a power interface, and the power supply module includes a power connection end, It also includes a connection box connected to the frame, the power interface penetrates the connection box from the frame, the power connection end penetrates the connection box, the power interface and the connection box The power connection end is conducted in the connection box through a conductive bar, and the connection box includes an inlet and outlet connected to the frame body.

In an embodiment of the foregoing computing device, the frame includes an entry and exit side for the computing module to slide out or slide in as a whole, and the connection box is provided on the entry and exit side or is set on a different side of the frame. On the other side of the entry and exit side.

In an embodiment of the foregoing computing device, the power supply module, the control module, and the heat dissipation module are disposed in the frame, or at least one of the power supply module, the control module, and the heat dissipation module It is formed as a part of the frame.

The following describes the present invention in detail with reference to the accompanying drawings and specific embodiments, but it is not intended to limit the present invention.

Brief description of the drawings

FIG. 1 is a three-dimensional structural diagram of an embodiment of a computing device of the present invention.

Figure 2 is an exploded view of Figure 1.

Fig. 3 is a three-dimensional structural diagram of an embodiment of the computing device of the present invention when the upper cover of the connection box is opened.

4 is a three-dimensional structural diagram of an embodiment of the computing device of the present invention with the upper cover plate of the connection box removed.

FIG. 5 is a three-dimensional structural diagram of a frame of an embodiment of the computing device of the present invention.

FIG. 6 is a three-dimensional structural diagram of the computing module of an embodiment of the computing device of the present invention connected to the frame.

FIG. 7 is a three-dimensional structural diagram of an embodiment of the computing device of the present invention.

FIG. 8 is a three-dimensional structural diagram of the computing module of an embodiment of the computing device of the present invention connected to the frame.

Wherein, the reference number

100: frame

110: The first side wall

111: Power slide

120: second side wall

130: top wall

131: Gap

132: Calculation board top slide

140: bottom wall

141: Calculate the slide at the bottom of the board

200: calculation module

210: power interface

220: signal interface

230: heat sink

231: Groove

232: Groove

240: Computing board

300: control module

310: signal connection end

400: power module

410: Power connection terminal

500: cooling module

510: The first fan

520: The second fan

600: Connection box

600S: entrance and exit

610: Upper cover

620: bottom cover

700: Conductive row

800: Power module bracket

900: signal line

X: horizontal

S1, S2, S3, S4: side

The best way to implement the invention

The technical solutions of the present invention will be described in detail below with reference to the drawings and specific embodiments to further understand the objectives, solutions and effects of the present invention, but not as a limitation of the protection scope of the appended claims of the present invention.

References in the specification to "embodiment", "another embodiment", "this embodiment", etc. mean that the described embodiment may include specific features, structures or characteristics, but not every embodiment must include These specific features, structures or characteristics. In addition, such expressions do not refer to the same embodiment. Further, when describing specific features, structures or characteristics in conjunction with embodiments, whether there is a clear description or not, it has been shown that combining such features, structures or characteristics into other embodiments is within the knowledge of those skilled in the art. .

In the specification and subsequent claims, certain words are used to refer to specific components or parts. Those of ordinary skill in the art should understand that technical users or manufacturers may refer to the same component or part by different terms or terms. This specification and the subsequent claims do not use differences in names as a way to distinguish components or parts, but use differences in functions of components or parts as a criterion for distinguishing. The "including" and "including" mentioned in the entire specification and the subsequent claims are open-ended terms, so they should be interpreted as "including but not limited to". In addition, the term "connection" here includes any direct and indirect means of connection.

It should be noted that, in the description of the present invention, if the terms "horizontal", "longitudinal", "upper", "lower", "front", "rear", "left", "right", "vertical" appear "," "horizontal", "top", "bottom", "inner", "outer", etc. indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, only for the convenience of describing the present invention and simplifying the description It does not indicate or imply that the pointed device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation of the present invention. In order to facilitate clear description, the terms "first", "second", "third", "fourth" and the like mentioned in this article are used to refer to an element, region, or part that is the same or similar to another element or region. 、Parts are distinguished, but not used to limit specific elements, regions, and parts.

As shown in FIG. 1 and FIG. 2, FIG. 1 and FIG. 2 are respectively a three-dimensional structure diagram and an exploded view of an embodiment of the computing device of the present invention. The computing device of the present invention includes a frame body 100, a calculation module 200, a control module 300, a power supply module 400, and a heat dissipation module 500. The calculation module 200 is arranged in the frame body 100, and the power supply module 400, the control module 300 and the heat dissipation module 500 are connected to the frame. In detail, the power module 400 is hooked on the side of the frame 100, the heat dissipation module 500 is connected to the front and rear ends or one of the ends of the frame 100, and the control module 300 is arranged on the upper side of the frame 100. Inside the box.

The computing device of the present invention further includes a connection box 600, and the connection box 600 is disposed on the upper side of the frame body 100 and the power module 400.

Preferably, the upper part of the frame body 100 is flush with the upper part of the power module 400 to facilitate the setting of the connection box 600.

Preferably, as shown in FIG. 1, the left and right sides S1, S2 of the connection box 600 are flush with the left side of the frame 100 and the right side of the power module 400, respectively, and the front and back sides S3, S2 of the connection box 600 are flush with each other. S4 is flush with the front and rear sides of the power module 400 respectively, and the overall structure of the computing device is regular.

As shown in FIGS. 2 and 3, FIG. 3 is a three-dimensional structural diagram of an embodiment of the computing device of the present invention with the upper cover of the connection box opened. The control module 300 is disposed in the connection box 600 of the frame 400. The computing module 200 includes a power interface 210, which penetrates into the connection box 600 from the top of the frame 100. The power module 400 includes a power connection terminal 410, which penetrates into the connection box 600 on the upper side. The power connection terminal 410 of the power module 400 and the power interface 210 of the computing module 200 are connected in the connection box 600 through the conductive bar 700.

As shown in Figs. 3 and 4, Fig. 4 is a three-dimensional structure diagram of a computing device of an embodiment of the present invention with the upper cover plate of the connection box removed to show the signal connection structure of the control module and the computing module. The connection box 600 includes an inlet and outlet 600S, and the inlet and outlet 600S are in communication with the frame body 100. As shown in FIG. When necessary, it is only necessary to disassemble the conductive bar 700 and the related signal wires, and then the computing module 200 can be pulled out of the frame 100, without disassembling other frame structures such as the connection box 600. As shown in FIGS. 2 to 4, the computing module 200 includes a signal interface 220, which penetrates into the connection box 600 from the top of the frame 100. The control module 300 includes a signal connection terminal 310 which penetrates into the connection box 600 on the upper side. The signal connection terminal 310 of the signal module 300 and the signal interface 220 of the computing module 200 are connected in the connection box 600 through the signal line 900.

The computing device of the present invention connects the control board and the control interface of the control board and the computing board in the connection box by setting a sealable connection box, and connects the power supply and the power supply of the computing board in the connection box to avoid power lines and signals. The exposed wires not only improve the safety and aesthetics, but also the connection box is arranged on the top of the device for easy operation.

As shown in FIG. 2, the connection box 600 includes an upper cover 610 and a bottom cover 620, and the upper cover 610 is closed on the bottom cover 620 to close the connection box 600.

As shown in FIG. 5, FIG. 5 is a three-dimensional structural diagram of a housing of an embodiment of a computing device of the present invention. The frame body 100 of the computing device of the present invention is an integrally formed aluminum profile, which has low manufacturing cost, no installation, and high strength. The frame body 100 includes a first side wall 110, a second side wall 120, a top wall 130 and a bottom wall 140, and the first side wall 110 and the second side wall 120 are supported between the top wall 130 and the bottom wall 140.

The first side wall 110, the second side wall 120, the top wall 130 and the bottom wall 140 form the four side walls of the frame body 100. The frame body 100 is hollowed out at the front and rear ends. With reference to FIG. 2, the heat dissipation module 500 includes a first fan 510 and a first fan 510. Two fans 520, the first fan 510 and the second fan 520 are respectively connected to the front and rear ends of the frame 200 to block the front and rear ends of the frame 200.

Wherein, the outside of the first side wall 110 includes a power slide 111 arranged along the transverse direction X. With reference to FIG. 2, the power module bracket 800 is connected to the first side wall 110 through the power slide 111, and the power module 400 is hooked to the power module On the stand 800.

With reference to FIGS. 5 and 6, FIG. 6 is a three-dimensional structural diagram of a computing module of an embodiment of the computing device of the present invention connected to the frame. The bottom wall 140 includes a calculation board bottom slide 141 arranged along the transverse direction X, and the calculation module 200 slides into or out of the frame 100 through the calculation board bottom slide 141.

The computing module 200 includes a heat sink 230 and a computing board 240, and the heat sink 230 is attached to the computing board 240 to dissipate heat from the computing board 240. The heat sink 230 can be attached to one or both sides of the computing board 240. In this embodiment, the heat sink 230 is attached to both sides of the computing board 240, that is, the computing board 240 is sandwiched between the two heat sinks 230. Wherein, the bottom of the heat sink 230 has a groove 231 that cooperates with the bottom slide 141 of the computing board. The groove 231 and the bottom slide 141 of the computing board cooperate with each other to realize the computing module 200 enters or moves out of the frame 100. In addition, positioning and fixing structures are provided at both ends of the sliding track. The positioning and fixing structures are, for example, positioning bars and positioning protrusions, which can also be used as heat dissipation modules.

The groove 231 may be provided only at the bottom of one of the heat sinks 230, or may be provided at the bottom of both heat sinks 230.

In the present invention, the slideway is arranged on the heat sink, that is, supported and slid by the heat sink, which can effectively prevent the calculation board from being deformed and damaged.

The top wall 130 includes a notch 131 arranged in the transverse direction. The power interface 210 and the signal interface 220 on the computing board 240 of the computing module 200 protrude above the frame 100 through the notch 131. As shown in FIG. 2, the connection box 600 is connected to the frame. At the top of the body 100, the power interface 210 and the signal interface 220 are located in the connection box 600.

The top wall 131 includes a computing board top slide 132 corresponding to the computing board bottom slide 141 on the bottom wall 140, and the computing board top slide 132 is formed by extruding the side aluminum profile of the gap 131. Correspondingly, the top end of the heat sink 230 has a groove 232 that matches with the sliding track 132 on the top of the computing board. The top slide and the bottom slide work together to ensure accurate and stable sliding.

The azimuth or positional relationship indicated by the "top" or "upper side" above is based on the azimuth or positional relationship shown in the drawings, which also includes the outermost end of the side, as shown in FIG. 7 for the computing device of the present invention In the three-dimensional structural diagram of an embodiment, that is, when the computing device shown in FIG. 1 is placed on its side, the connection box 600 is disposed on one side of the frame 100. As shown in FIG. 8, the computing module of an embodiment of the computing device of the present invention is connected to the three-dimensional structure diagram inside the frame, and the computing module 200 enters and exits from the top of the frame 100. At the same time, in order to simplify the chassis structure, the control module 300, the power supply module 400, and the heat dissipation module 500 may all be arranged in the frame body 100 to improve the integrity and cleanliness of the frame structure.

2 and 6 again, the computing module 200 is a plurality of computing modules arranged in parallel along the lateral direction X, the control module 300 includes a plurality of control connection terminals, and each control connection terminal is connected to the signal interface of each computing module 200 respectively. The parallel conductive row 700 is connected to a plurality of computing modules 200 in sequence, so that each computing module 200 is connected to the power module 400.

Of course, the present invention can also have various other embodiments. Without departing from the spirit and essence of the present invention, those skilled in the art can make various corresponding changes and modifications according to the present invention, but these corresponding All changes and deformations shall belong to the protection scope of the appended claims of the present invention.

Industrial applicability

The computing device of the present invention connects the power supply and the power supply of the computing board in the connection box by setting a sealable connection box, so that each power supply connection is enclosed in the connection box to avoid being exposed, which not only improves safety and aesthetics, but also And easy to operate. The connection box includes an entrance and exit connecting the frame body, and the computing module can be slid out or into the frame body through the entrance and exit as a whole, without disassembling the connection box and other frame structures, and maintenance and repair are time-saving and labor-saving.

Claims

A computing device includes a frame, a computing module, a control module, a power supply module, and a heat dissipation module. The calculation module is arranged in the frame, and the power supply module, the control module, and the heat dissipation module are connected outside the frame. The computing module includes a power interface, the power module includes a power connection end, and is characterized in that it also includes a connection box arranged on the top of the frame and the power module, and the power interface penetrates from the top of the frame. In the connection box, the power connection end penetrates into the connection box, and the power interface and the power connection end are conducted in the connection box through a conductive bar.
The computing device according to claim 1, wherein the computing module includes a signal interface, the control module includes a signal connection terminal, the control module is disposed in the connection box, and the signal interface is connected to the The signal connection end is connected in the connection box through a signal line.
The computing device according to claim 1, wherein the connection box comprises an upper cover and a bottom cover, and the upper cover is closed on the bottom cover to close the connection box.
The computing device according to claim 2, wherein the frame body is an integrally formed aluminum profile piece.
The computing device according to claim 4, wherein the frame body comprises a first side wall, a second side wall, a top wall and a bottom wall, and the first side wall and the second side wall are supported by the Between the top wall and the bottom wall.
The computing device according to claim 5, wherein the outside of the first side wall comprises a power supply slideway arranged laterally, and the power supply module bracket is connected to the first side wall through the power supply slideway, and The power module is hung on the power module bracket.
The computing device according to claim 5, wherein the bottom wall comprises a calculation board bottom slideway arranged laterally, and the calculation module slides into the frame or from the bottom slideway through the calculation board The box slides out.
8. The computing device according to claim 7, wherein the computing module comprises a heat sink, and the heat sink has a groove that matches with the bottom slideway of the computing board.
The computing device according to claim 7, wherein the top wall includes a gap disposed laterally, and the power interface of the computing module protrudes above the frame through the gap and extends into the connection box Inside, the signal interface of the computing module protrudes above the frame through the gap and extends into the connection box.
The computing device according to claim 9, wherein the top wall includes a computing board top slideway corresponding to the bottom slideway of the computing board, and the computing board top slideway is formed by the side of the gap. The aluminum profile is formed by extrusion.
The computing device according to any one of claims 1 to 10, wherein the computing module is a plurality of computing modules arranged in parallel, and the conductive row is connected to the plurality of computing modules in sequence.
The computing device according to any one of claims 1 to 10, wherein the heat dissipation module comprises a first fan and a second fan, the frame has a hollow front and rear ends, and the first fan and the second fan The front and rear ends of the frame are respectively connected to block the front and rear ends of the frame.
A computing device includes a frame, a calculation module, a control module, a power supply module, and a heat dissipation module. The calculation module is arranged in the frame and includes a power interface. The power supply module includes a power connection end, and is characterized in that: It includes a connection box connected to the frame, the power interface penetrates the connection box from the frame, the power connection end penetrates the connection box, the power interface and the power supply The connecting end is conducted in the connecting box through the conductive bar, and the connecting box includes an inlet and outlet connected to the frame body.
The computing device according to claim 13, wherein the frame includes an entry and exit side for the computing module to slide out or slide in as a whole, and the connection box is provided on the entry and exit side or on the frame. The body is different from the other side of the entry and exit side.
The computing device according to claim 13, wherein the power supply module, the control module, and the heat dissipation module are disposed in the frame, or the power supply module, the control module, and the heat dissipation module At least one of them is formed as a part of the frame.