WO2021228162A1

WO2021228162A1 - Printed object and printing method therefor

Info

Publication number: WO2021228162A1
Application number: PCT/CN2021/093445
Authority: WO
Inventors: 卢伊丝; 陈捷; 车弘毅; 朱光; 史卓鹤
Original assignee: 清锋（北京）科技有限公司
Priority date: 2020-05-13
Filing date: 2021-05-12
Publication date: 2021-11-18
Also published as: TW202210276A; TWI767704B

Abstract

A printed object and a printing method therefor. The printed object comprises: a first part (110), a second part (120), and an adhesive layer (130) located between the first part (110) and the second part (120), at least one of the first part (110), the second part (120), and the adhesive layer (130) comprising a dual curing material.

Description

Printed piece and printing method thereof

cross reference

This application claims the priority of the Chinese application 202010436000.1 filed on May 21, 2020 and the U.S. application 63/024,511 filed on May 13, 2020, all of which are incorporated herein by reference.

Technical field

This application relates to the field of 3D printing technology, and in particular to a print and a printing method thereof.

Background technique

3D printing technology is a rapid prototyping technology, which is based on digital model files, using powdered metal, resin or plastic and other bondable materials to construct objects by printing layer by layer. 3D printing technology is usually realized by using a 3D printer.

In 3D printing technology (such as light curing printing), if the product is too large, the structure is more complicated, or the material of each part is different, it may be necessary to print multiple parts separately, and then pass the multiple parts through the adhesive Combine it. How to more stably combine multiple parts printed separately is a technical problem to be solved urgently in this field.

Summary of the invention

One aspect of this specification provides a print, which includes a first part, a second part, and an adhesive layer located between the first part and the second part; the first part, the second part, and the adhesive At least one of the laminates includes a dual curing material.

In some embodiments, the first part and the adhesive layer both include a dual-curing material; the adhesive layer includes a dual-curing material component and the first part includes a dual-curing material component At least part of the same; or, the second part and the adhesive layer both include a dual-curing material, and the dual-curing material included in the adhesive layer has a composition that is different from the dual-curing material included in the second part. The components are at least partially the same.

In some embodiments, the first part, the second part, and the adhesive layer all include a dual-curing material, the adhesive layer includes a dual-curing material component, and the first part includes a dual-curing material. The composition of the curing material and the composition of the dual curing material included in the second part are at least partially the same.

In some embodiments, the first part and the second part both include a dual curing material, and the components of the dual curing material contained in the first part are at least partially at least partially same.

In some embodiments, the stiffness of the first part is different from the stiffness of the second part.

In some embodiments, the light transmittance of the first part and/or the second part is greater than 20%.

In some embodiments, the first part and/or the second part includes a light-transmitting material; or, the first part and/or the second part includes a hollow structure.

In some embodiments, the thickness of the adhesive layer in a cured state is 1 mm-5 mm.

In some embodiments, the first part includes a shoe midsole, and the second part includes a shoe outsole; the lower surface of the shoe midsole is connected to the upper surface of the shoe outsole; the adhesive layer is located at Between the lower surface of the shoe midsole and the upper surface of the shoe sole.

In some embodiments, the first part includes a midsole, the second part includes a reinforcement, the rigidity of the reinforcement is greater than the rigidity of the second midsole; the reinforcement is embedded in the shoe In the sole, or, the reinforcing member is provided on the surface of the midsole of the shoe.

In some embodiments, the stiffness of the reinforcement is 5%-300% greater than the stiffness of the bottom of the shoe.

In some embodiments, the reinforcement includes a dual curing material and a fiber material.

In some embodiments, the shoe midsole includes a forefoot, an arch, and a heel that are sequentially arranged from front to back, and the reinforcement is provided on the forefoot, the arch and the heel. At least one of the heels.

In some embodiments, the thickness of the reinforcement after curing is 0.05 mm-2 mm.

In some embodiments, the forefoot portion, the arch portion and/or the heel portion are provided with mounting grooves, and the mounting grooves are used for mounting the reinforcement member.

In some embodiments, the line connecting the center of gravity of the reinforcement member and the center of gravity of the midsole is parallel to the thickness direction of the midsole.

In some embodiments, the reinforcing member includes a plurality of through holes, and each of the through holes penetrates the reinforcing member along the thickness direction of the midsole.

In some embodiments, the reinforcement includes a support portion and a side wing portion connected to the support portion; the support portion is provided on the upper or lower surface of the shoe midsole, and the side wing portion is connected to the shoe The side edges of the midsole.

In some embodiments, the supporting part is located on the upper surface or the lower surface of the arch part.

In some embodiments, the reinforcing member includes an upper top portion, a lower bottom portion, and a connecting portion, and one end of the upper top portion and one end of the lower bottom portion are connected by the connecting portion; the upper top portion, the lower bottom portion, and the connecting portion At least one of them is connected to the midsole of the shoe.

In some embodiments, the upper top portion, the lower bottom portion, and the connecting portion are all embedded in the heel portion.

In some embodiments, the connecting portion is located at the front end of the heel portion, the upper top portion is located at the upper end of the heel portion, and the lower bottom portion is located at the lower end of the heel portion.

In some embodiments, the reinforcing member further includes an extension part; the extension part is located on the upper surface or the lower surface of the arch part; or the extension part is embedded in the arch part.

In some embodiments, the reinforcing member includes a first arc-shaped part and a second arc-shaped part, the first arc-shaped part and the second arc-shaped part are respectively embedded in the left and right sides of the heel part, and The inner arc surface of the first arc-shaped portion and the inner arc surface of the second arc-shaped portion are arranged opposite to each other.

In some embodiments, the print includes a pillow.

Another aspect of this specification also provides a printing method of a print, which includes the following steps: providing at least one of a first part and a second part; and setting an adhesive on the first part and/or the second part Layer; curing the first part and/or the second part and the adhesive layer.

In some embodiments, the providing at least one of the first part and the second part includes: making at least one of the first part and the second part by a first curing process in a dual curing molding manner.

In some embodiments, the first part and the second part are produced by a first re-curing process in a dual-curing molding manner.

In some embodiments, one of the first part and the second part is made by the first re-curing process of the dual curing molding method, and the first part and the second part are made by other printing methods. The other one.

In some embodiments, the providing at least one of the first part and the second part includes: making the first part and the second part by other printing methods; The curing process of the second part and the adhesive layer includes: curing the adhesive layer and the first part and the second part through a dual curing process to realize the first part and the The second part of the connection.

In some embodiments, the providing at least one of the first part and the second part includes: manufacturing one of the first part and the second part using a first recuring process based on a dual curing material; Wherein, a part of the components of the dual curing material can be cured after the first recuring treatment; the other of the first part and the second part is made; the first part and/or the first part The second part is provided with an adhesive layer, including: coating an adhesive layer on the bonding place of the first part and the second part, and bonding the first part and the second part to obtain a combined body The curing process of the first part and/or the second part and the adhesive layer includes: subjecting the combination to a second recuring process to obtain a print; wherein, the double Another part of the curing material can be cured after the second curing process.

In some embodiments, the manufacturing the other of the first part and the second part includes: manufacturing the first part and the second part using a first recuring process based on a dual curing material The other one in the section.

In some embodiments, the first recuring treatment operation includes a photocuring treatment.

In some embodiments, the second recuring process includes any one of thermal curing process, light curing process and moisture curing process.

In some embodiments, the thermal curing temperature is 80°C-160°C.

In some embodiments, the adhesive layer includes a dual curing material.

In some embodiments, the attaching the first part and the second part to obtain a combined body includes: attaching the first part and the second part; attaching the attached first part to the second part; One part and the second part are subjected to a first recuring treatment to cure a part of the components of the adhesive layer to obtain an assembly.

In some embodiments, the first part and/or the second part includes a light-transmitting structure; or, the first part and/or the second part includes a hollow structure; the first part after being bonded Performing a first re-curing treatment with the second part to cure a part of the components of the adhesive layer includes: irradiating the adhesive layer with light through the light-transmitting structure or the hollow structure, so that A part of the components of the adhesive layer is cured.

In some embodiments, subjecting the combined body to a second re-curing treatment includes: putting the combined body into a mold, and subjecting the combined body placed in the mold to a second re-curing treatment.

Description of the drawings

This application will be further described in the form of exemplary embodiments, and these exemplary embodiments will be described in detail with the accompanying drawings. These embodiments are not restrictive. In these embodiments, the same number represents the same structure, in which:

Fig. 1 is a schematic structural diagram of a 3D printed part according to some embodiments of the present application;

Figure 2a is a schematic diagram of a disassembled structure of a shoe midsole and a shoe outsole according to some embodiments of the present application;

Figure 2b is a schematic diagram of the connection structure between the shoe midsole and the shoe outsole according to some embodiments of the present application;

Fig. 2c is a schematic diagram of the structure of a shoe midsole, a shoe outsole and an adhesive layer according to some embodiments of the present application;

Figure 3a is a schematic view of the structure of a shoe midsole and a reinforcement according to some embodiments of the present application;

Fig. 3b is a schematic structural diagram of a mounting groove of a shoe midsole according to some embodiments of the present application;

Figure 3c is a schematic diagram of the structure of a shoe midsole and a reinforcement according to some embodiments of the present application;

Figure 3d is a schematic diagram of the structure of a shoe midsole and a reinforcement according to some embodiments of the present application;

Figure 3e is a schematic view of the structure of a shoe midsole and a reinforcement according to some embodiments of the present application;

Figure 3f is a schematic diagram of the structure of a shoe midsole and a reinforcement according to some embodiments of the present application;

Figure 3g is a schematic diagram of the structure of a shoe midsole and a reinforcement according to some embodiments of the present application;

Figure 3h is a schematic diagram of the structure of a shoe midsole and a reinforcement according to some embodiments of the present application;

Fig. 4a is a schematic diagram of a three-dimensional structure of a shoe midsole and a reinforcement according to other embodiments of the present application;

Fig. 4b is a schematic structural diagram of a reinforcing member according to other embodiments of the present application;

Fig. 4c is a schematic diagram of the structure of a reinforcement according to other embodiments of the present application;

Fig. 4d is a schematic diagram of the structure of a reinforcement according to other embodiments of the present application;

Fig. 4e is a schematic structural diagram of a reinforcing member according to other embodiments of the present application;

Fig. 5a is a schematic diagram of a three-dimensional structure of a shoe midsole and a reinforcement according to other embodiments of the present application;

Fig. 5b is a schematic structural diagram of a reinforcing member according to still other embodiments of the present application;

Fig. 5c is a schematic structural diagram of a reinforcing member according to still other embodiments of the present application;

Fig. 5d is a schematic structural diagram of a reinforcement according to still other embodiments of the present application;

Fig. 6 is a schematic diagram of a three-dimensional structure of a shoe midsole and a reinforcement according to still other embodiments of the present application;

Fig. 7 is a flowchart of a 3D printing method according to some embodiments of the present application.

Detailed ways

In order to more clearly describe the technical solutions of the embodiments of the present application, the following will briefly introduce the drawings that need to be used in the description of the embodiments. Obviously, the drawings in the following description are only some examples or embodiments of the application. For those of ordinary skill in the art, without creative work, the application can be applied to the application according to these drawings. Other similar scenarios. Unless it is obvious from the language environment or otherwise stated, the same reference numerals in the figures represent the same structure or operation.

It should be understood that the “system”, “device”, “unit” and/or “module” used herein is a method for distinguishing different components, elements, parts, parts, or assemblies of different levels. However, if other words can achieve the same purpose, the words can be replaced by other expressions.

As shown in the present application and claims, unless the context clearly indicates exceptions, the words "a", "an", "an" and/or "the" do not specifically refer to the singular, but may also include the plural. Generally speaking, the terms "including" and "including" only suggest that the clearly identified steps and elements are included, and these steps and elements do not constitute an exclusive list, and the method or device may also include other steps or elements.

In this application, a flowchart is used to illustrate the operations performed by the system according to the embodiment of the application. It should be understood that the preceding or following operations are not necessarily performed precisely in order. Instead, the steps can be processed in reverse order or at the same time. At the same time, you can also add other operations to these processes, or remove a step or several operations from these processes.

3D printing technology is widely used in various fields. For example, 3D printing technology can be used to produce shoe soles, whole shoes, pillows and other daily necessities. For another example, 3D printing technology can be used to produce desktop ornaments, models and other handicrafts. In some embodiments, 3D printing methods such as fused deposition molding, laser sintering molding, and light curing molding may be used to print the product. In some embodiments, the light-curing molding technology may include dual-curing technology molding and single-curing molding technology.

Fused deposition molding is a molding method in which filamentous materials (such as thermoplastics, wax or metal fuses) are extruded from a heated nozzle, and the melt is deposited at a fixed rate according to the predetermined trajectory of each layer of the part. Laser sintering molding is a molding technology that uses laser as a heat source to sinter powder compacts.

Stereo Lithography Appearance (Stereo Lithography Appearance, SLA or SL) is a molding technology that uses a laser with a specific wavelength and intensity to focus on the surface of a photocurable material to quickly cure the photocurable material. It mainly uses liquid printing materials as raw materials, and photo-curing molding uses the characteristics of liquid printing materials to quickly solidify under the irradiation of a laser beam of a specific wavelength and intensity to achieve the printing of objects. Generally, ultraviolet light is used as the light source, and the printing material is irradiated with a specific wavelength of ultraviolet light (250nm-400nm) to cause polymerization reaction and complete curing. The step of light curing printing can be as follows: first layer the three-dimensional model in one direction to obtain the contour information or image information of each layer, and then irradiate the light pattern on the printing material through the light source, and the printing material in the raw material is affected by After the light is irradiated, a polymerization reaction (light curing) occurs to form a cured layer. After the curing of the light pattern of this layer is completed, the next layer is cured, and the iteration is repeated, and finally a complete print is formed. Light-curing 3D printing can be widely used in a variety of fields depending on the printing materials used. At present, digital light processing technology (DLP technology) is also applied to light curing printing to improve its printing accuracy. The hollow lattice structure printed by elastic photosensitive resin has good mechanical properties and can be applied to shoe midsoles (especially sports shoes). The photosensitive resin with good abrasion resistance can print shoe outsoles and use light curing to print shoe soles. The manufactured shoes not only bring a good wearing experience to users, but also eliminate the high-consumption mold opening stage in production, so light-curing printed shoes have a good market prospect.

Single curing molding may refer to a curing molding method in which final molding can be achieved only by light curing. Dual curing molding may be a combination of two curing molding methods, for example, it may be a combination of light curing molding and other curing molding methods (such as light curing molding, thermal curing molding, moisture curing molding, etc.). Dual-curing molding is a curing molding method that uses dual-curing materials to achieve final molding based on dual-curing treatment. The dual-curing material used in dual-curing molding can be preliminarily molded after the first-curing treatment (such as light-curing treatment) to form a printing intermediate, and the printing intermediate contains uncured components. After the second-stage curing process is performed on the printing intermediate, the uncured components of the printing intermediate can be cured to form the final print.

Light-curing molding technology (single-curing molding technology or dual-curing molding technology) is widely used due to its high printing accuracy and high processing efficiency. In some embodiments, the light-curing molding can be completed based on a single-curable material (such as light-curing resin) in a liquid state or a mixed solid-liquid state. A single curing material refers to a material that can undergo a curing reaction as a whole through a single curing treatment, and the single curing treatment may be a light curing treatment, a thermal curing treatment, and the like. In other embodiments, the light-curing molding can also be completed based on a dual-curing material in a liquid state or a mixed solid-liquid state.

The dual-curing material may refer to a material that is completely cured after undergoing a dual-curing treatment. For example, after the dual curing material undergoes the first curing process, the dual curing material can be initially cured to form a printing intermediate. Some of the components of the printing intermediate formed after the first re-curing treatment are still in an uncured or incompletely cured state (for example, liquid state, solid-liquid mixed state), so that the printing intermediate (or a part of it) is not finally formed, At this time, the printed intermediate is softer and may be deformed more easily. After the printing intermediate obtained after the first curing treatment is further subjected to the second curing treatment, the hardness of the printing intermediate can be hardened, and finally a printed article with a fixed shape is formed. In some embodiments, dual curing materials are also referred to as dual curing resins.

In some embodiments, the dual cure material may include a first component and a second component. The first component can be cured after the first re-curing treatment, while the second component is in an uncured state after the first re-curing treatment, and the second component can be cured after the second re-curing treatment. In some embodiments, the first component may include a photocurable resin monomer, oligomer, and/or prepolymer component. In some embodiments, the second component may be a component that remains uncured after the completion of the photocuring step. The uncured component can be further cured in a second recuring process (e.g. thermal curing, light curing, moisture curing, etc.) after the first recuring process (e.g. photocuring process) step. In some embodiments, the dual curing material may further include a third component, and the third component may be a photoinitiator. In some embodiments, the photoinitiator may be benzoin ether, dialkylacetophenone, hydroxyalkyl ketone, acyl phosphine oxide, amino ketone, benzophenone, thioxanthone, 1,2 diketone, 1, 7,7-Trimethyl-bicyclo[2.2.1]heptane-2,3-dione, bis2,6-difluoro-3-pyrrolephenyl titanocene. In some embodiments, the photoinitiator used in the present invention is benzoyl phosphine oxide, including TPO, 819, TEPO, 819DW, onium salt, halonium salt, oxoiodonium salt, selenium salt, sulfonium salt, sulfonium oxide salt , Diazonium salt, metallocene salt, isoquinoline salt, phosphonium salt, bell salt, tropylium salt, dialkylphenacylsulfonium salt, thiopyrylium salt, diaryl One or more mixtures of iodonium salt, triarylsulfonium salt, sulfonium antimonate, ferrocene, bis(cyclopentadienyl iron) arene compound, pyridinium salt, and pyridinium salt.

In some embodiments, the first component may include monomers, oligomers, and/or prepolymers. The monomers of the first component include acrylate, methacrylate, olefin, N-vinyl, acrylamide, methacrylamide, styrene, epoxy, mercaptan, 1,3-diene, halogenated Vinyl, acrylonitrile, vinyl ester, maleimide, vinyl ether, olefin (such as methoxyethylene, 4-methoxystyrene, styrene, 2-methylprop-1-ene, 1, 3-butadiene, etc.), vinyl ether, N-vinyl carbazole, lactone, lactam, cyclic ether (for example, epoxide), cyclic acetal, cyclic siloxane, and containing one or more Oligomers and/or prepolymers of the aforementioned monomers. In some embodiments, the first component is a polyurethane prepolymer.

In some embodiments, the second component may include monomers, oligomers, and/or prepolymers. The monomer, oligomer and/or prepolymer of the second component contains epoxy/amine, epoxy/hydroxy, oxetane/amine, oxetane/alcohol, isocyanate/hydroxy, Isocyanate/amine, isocyanate/carboxylic acid, cyanate ester, acid anhydride/amine, amine/carboxylic acid, amine/ester, hydroxyl/carboxylic acid, hydroxyl/acid chloride, amine/acid chloride, vinyl/Si-H, Si- Cl/hydroxyl, Si-Cl/amine, hydroxyl/aldehyde, amine/aldehyde, methylol or alkoxymethylamide/alcohol, aminoplast, alkyne/azide, click chemistry reactive group, olefin/ Sulfur, olefin/thiol, alkyne/thiol, hydroxyl/halide, isocyanate/water, Si-OH/hydroxyl, Si-OH/water, Si-OH/Si-H, Si-OH/Si-OH, Reactive end groups of one or more combinations of perfluorovinyl groups, diene/dienophiles, olefin metathesis polymerization groups, Ziegler Natta-catalyzed olefin polymerization groups, and ring-opening polymerization groups .

The dual-curing material may be a resin material having a dual-component dual-curing mechanism disclosed in US patents US 9,598,606, US 9,453,142, US 9,982,164, US 9,676,963, and US 10,155,882, and the disclosures of the above patents are all incorporated herein by reference. In some embodiments, the first component is a reactive blocked polyurethane prepolymer, and the second component contains groups that can react with isocyanate groups in the polyurethane prepolymer, so that the first component is behind The chain extension reaction occurs during the curing reaction. Examples of the second component may include, but are not limited to, one of diols, polyols, diamines, polyamines, and imines. In some preferred embodiments, the second component is an imine compound, such as the resin material with a dual-component dual-curing mechanism disclosed in PCT/CN2020/095715. The disclosure of the PCT application is incorporated herein by reference. .

The size of the product printed by light-curing molding (single-curing molding and dual-curing molding) is generally not larger than the size of the molding table of the light-curing printer. The size of the product printed by light-curing molding will be greatly affected by the light-curing printer. The size limit. In some embodiments, in order to print a product with a larger size by light curing, it may be necessary to divide the product into multiple parts and then print them separately, and then apply glue between the parts to bond the parts together. stand up. However, the connection method of directly applying glue may make the connection stability between the various parts poor. At the same time, the use of glue is not conducive to environmental protection.

The embodiment of the present application provides a print and a printing method thereof. The print may include a first part and a second part, and the first part and the second part are connected by an adhesive layer. By making the first part, the second part, and/or the adhesive layer include a dual-curing material, through this arrangement, the dual curing properties of the first part, the second part and/or the adhesive layer can make the first part and the second part The connection is stronger. In some embodiments, the printed part may be a 3D printed part or a 4D printed part. In some embodiments, the printed part may be a sole, a whole shoe, a pillow, or other objects that require multiple parts to be printed separately, and then the multiple parts are combined. The printing method provided in the embodiments of the present application is suitable for printing soles, whole shoes, pillows, or other scenes where multiple parts need to be printed separately.

Fig. 1 is a schematic structural diagram of a print according to some embodiments of the present application. As shown in FIG. 1, the print includes a first part 110, a second part 120, and an adhesive layer 130 between the first part 110 and the second part 120. The adhesive layer 130 is used to bond the first part 110 and the second part 120. At least one of the first part 110, the second part 120 and the adhesive layer 130 may include a dual curing material. A part of the dual-curing material (the first component as described above) can be cured after the first re-curing treatment, and the other part of the dual-curing material (the second component as described above) can be cured in the first Cured after double curing treatment. The printed product in one or more embodiments of this specification refers to the final printed product. For example, the print shown in FIG. 1 refers to the print after the second curing process.

In some embodiments, the shapes of the first part 110 and the second part 120 may be the same or different. First, in some embodiments, the materials of the first part 110 and the second part 120 may be the same or different.

In some embodiments, the print may include at least one other part. For example, the print also includes the third part. For example, the print also includes the third part and the fourth part. In some embodiments, at least one other part of the print may be connected to the first part 110 and the second part 120 according to the design requirements of the print. For example, an adhesive layer 130 may be provided between the second part 120 and the third part, and an adhesive layer 130 may be provided between the third part and the fourth part. For another example, an adhesive layer 130 may be provided between the first part 110 and the third part, and an adhesive layer 130 may also be provided between the first part 110 and the fourth part.

In some embodiments, the first part 110, the second part 120, and/or the adhesive layer 130 may include a dual curing material, which may include the following situations: among the first part 110, the second part 120, and the adhesive layer 130, there may be only The first part 110 includes a dual-curing material; it may be that only the adhesive layer 130 includes a dual-curing material; it may be that only the second part 120 includes a dual-curing material; it may be that the first portion 110 and the adhesive layer 130 include a dual-curing material; The part 110 and the second part 120 include a dual-curing material; the adhesive layer 130 and the second part 120 may include a dual-curing material; or the first part 110, the second part 120 and the adhesive layer 130 all include a dual-curing material. In some embodiments, when one or more of the first part 110, the second part 120, and the adhesive layer 130 does not include a dual curing material, the first part 110, the second part 120, and the adhesive layer 130 do not include a dual curing material. The part of the curing material may include a single curing material (such as a photocurable resin). The photocurable resin mainly includes photocurable monomers, oligomers and/or prepolymer components. For specific descriptions of the photocurable resin monomer components and photocurable oligomer components, please refer to the relevant content above.

In some embodiments, the first re-curing process may include a photo-curing process, and the second re-curing process may include any one of a thermal curing process, a photo-curing process, and a moisture curing process. Among them, the photo-curing treatment may be to use light (such as ultraviolet light or visible light) to irradiate the dual-curing material. The heat curing treatment may be heat treatment of the dual curing material. In some embodiments, the thermal curing treatment may be to place the dual curing material in a preset temperature environment for a preset time. In some embodiments, the preset ambient temperature of the thermal curing process may be 80°C-160°C. For example, the preset ambient temperature of the thermal curing process may be 80°C, 100°C, 112°C, 160°C, and so on. In some embodiments, the time of the thermal curing treatment may be 2-24 hours. For example, the time of the thermal curing treatment may be 2 hours, 8 hours, 18 hours, or the like. In some embodiments, moisture curing may be to place the dual curing material in a preset humidity environment for a preset time. In some embodiments, the relative humidity of the moisture curing treatment may be 50%-95%. For example, the relative humidity of the moisture curing treatment can be 50%, 80%, 95%, and so on. In some embodiments, the time of the moisture curing treatment may be 2-24 hours. For example, the time of the moisture curing treatment may be 4 hours, 6 hours, 15 hours, or the like. In some embodiments, when the first part 110 and/or the second part 120 includes a dual-curing material and the adhesive layer 130 does not include a dual-curing material (for example, when the adhesive layer 130 includes a single-curing material), the dual-curing material may be included. The parts of the cured material (the first part 110 and/or the second part 120) undergo a first re-curing treatment (such as a light curing process), so that a part of the dual-curing material is cured to form a printing intermediate, and then on the printing intermediate The position for connection is coated with an adhesive layer 130. Then, the first part 110, the second part 120 and the adhesive layer 130 are jointly subjected to a second re-curing treatment (such as thermal curing treatment, light curing treatment or moisture curing treatment). In other embodiments, the first part 110 and/or the second part 120 includes a dual-curing material, and the adhesive layer 130 also includes a dual-curing material. The laminated layer 130 is subjected to a first re-curing treatment, and then the first part 110, the second part 120 and the adhesive layer 130 are jointly subjected to a second re-curing treatment. In the above two embodiments, the adhesive layer 130 is used to connect the printing intermediates obtained after the first re-curing treatment (it can be two printing intermediates, or one printing intermediate and a finished part) , The printing intermediate and the adhesive layer 130 can be cured together, and the process of the two together curing can make the connection of the first part 110 and the second part 120 through the adhesive layer 130 more stable.

In some embodiments, if only the adhesive layer 130 includes a dual-curing material, the adhesive layer 130 may be applied to the joint between the first part 110 and the second part 120, and then the adhesive layer 130 (or the adhesive layer 130 , The first part 110 and the second part 120) are subjected to a first re-curing treatment (such as photo-curing treatment), and then the first part 110, the second part 120 and the adhesive layer 130 are jointly subjected to a second re-curing treatment (such as a photo-curing treatment) , Heat curing treatment or moisture curing treatment). In other embodiments, if only the adhesive layer 130 includes a dual curing material, the adhesive layer 130 (or adhesive layer 130. The first part 110 and the second part 120 are subjected to a first re-curing treatment (such as a photo-curing treatment), and then the adhesive layer 130 is separately subjected to a second re-curing treatment (such as a photo-curing treatment).

In some embodiments, the photocurable monomer, oligomer and/or prepolymer component in the dual curing material can undergo polymerization reaction under the catalysis of a photoinitiator due to light radiation during the photocuring process. . Liquid photocurable monomers, oligomers and/or prepolymer components can be initially cured to form a printing intermediate (cured by photocurable monomers, oligomers and/or prepolymer components , Which contains uncured ingredients). Since the printing intermediate contains uncured components, the uncured components not only make the surface of the printed intermediate have viscosity but also make the entire printed intermediate soft, which facilitates secondary plasticity. Therefore, based on this performance of the printing intermediate, the first part 110 and the second part 120 can be more stably bonded together by the adhesive layer 130.

By providing the first part 110, at least one of the second part 120 and the adhesive layer 130 may include a dual curing material. Compared with single-cured materials, double-cured materials have more diverse molecular chain connection methods and tighter connections after curing, and the bonding effect is better. In addition, if the adhesive layer 130 includes a dual-curing material, it can be ensured that the first part 110 and the second part 120 can be better bonded.

In addition, if glue is used as an adhesive, it may be difficult to recycle the glue during the recycling process of printed parts, resulting in damage to the environment. Compared with using glue as an adhesive, if the above-mentioned dual-curing material or single-curing material is used as an adhesive, the first part 110 and the second part 120 are bonded through the adhesive layer 130 based on the dual-curing process. Together, the printed parts can be easily recycled and processed, which is conducive to environmental protection. In some embodiments, when the print includes two parts (for example, the first part 110 and the second part 120) or multiple parts (for example, the first part 110, the second part 120, the third part, and the fourth part), the printing At least two of the various parts of the piece include materials with the same or completely the same components. The adhesive layer and at least one of the respective parts include partially or completely the same material. In some embodiments, when the print includes the first part 110, the second part 120, the third part, the fourth part, and the adhesive layer 130, among the first part 110, the second part 120, the third part, and the fourth part At least two of the materials include completely or partially identical materials. In some embodiments, the adhesive layer and at least one of the first portion 110, the second portion 120, the third portion, and the fourth portion include materials that are completely or partially the same in composition. The materials of the first part 110, the second part 120 and the adhesive layer 130 are taken as an example for description.

In some embodiments, the adhesive layer 130 and the first portion 110 both include a dual-curing material, and the dual-curing material included in the adhesive layer 130 is at least partially the same as the dual-curing material included in the first portion 110. In some embodiments, the dual curing material included in the adhesive layer 130 and the dual curing material included in the first part 110 may each include the first component, the second component, and the third component as described above. The specific substance of the dual curing material included in the adhesive layer 130 and the first component of the dual curing material included in the first part 110 may be the same. The specific substance of the second component in the curing material may be the same; the specific substance of the third component in the dual curing material included in the adhesive layer 130 and the third component in the dual curing material included in the first part 110 may also be the same.

In some embodiments, the composition of the dual curing material included in the adhesive layer 130 is exactly the same as the composition of the dual curing material included in the first part 110. In some embodiments, the dual curing material included in the adhesive layer 130 has the same specific substance as the first component in the dual curing material included in the first part 110, and the dual curing material included in the adhesive layer 130 is the same as the first component. The specific substance of the second component of the dual curing material contained in the part 110 is the same, and the specific substance of the second component of the dual curing material contained in the adhesive layer 130 is the same as the third component of the dual curing material contained in the first part 110.

In other embodiments, the adhesive layer 130 and the second part 120 both include dual-curing materials, and the dual-curing material components included in the adhesive layer 130 and the dual-curing material components included in the second portion 120 are at least partially same. In some embodiments, the dual curing material included in the adhesive layer 130 and the dual curing material included in the second part 120 may each include the first component, the second component, and the third component described above. The specific substance of the first component in the dual curing material included in the adhesive layer 130 and the dual curing material included in the second part 120 may be the same, and the dual curing material included in the adhesive layer 130 is the same as that contained in the second part 120 The specific substance of the second component of the dual-curing material in the dual-curing material may be the same; the dual-curing material included in the adhesive layer 130 and the specific substance of the third component in the dual-curing material included in the second part 120 may also be the same.

In some embodiments, the composition of the dual curing material included in the adhesive layer 130 is exactly the same as the composition of the dual curing material included in the second part 120. In some embodiments, the dual-curing material included in the adhesive layer 130 has the same specific substance as the first component in the dual-curing material included in the second part 120, and the dual-curing material included in the adhesive layer 130 is the same as The specific substance of the second component in the dual curing material contained in the second part 120 is the same, and the specific substance of the second component in the dual curing material contained in the adhesive layer 130 is the same as the specific substance of the third component in the dual curing material contained in the second part 120 It's also the same.

The composition of the dual-curing material included in the adhesive layer 130 is at least partially the same as the composition of the dual-curing material included in the first part 110, or the composition of the dual-curing material included in the adhesive layer 130 is at least partially the same as the second part. The components of the dual curing materials included in 120 are at least partially the same, which can simplify the production process of the adhesive layer 130, facilitate the production and production of printed parts, and improve processing efficiency. In addition, if the composition of the dual-curing material included in the adhesive layer 130 is exactly the same as the composition of the dual-curing material included in the first part 110 and/or the second part 120, there is no need to separately manufacture the adhesive layer 130, and the production process is reduced. And after the prints are discarded, there is no need to separately process the adhesive layer 130, which facilitates the recycling of the prints, which is beneficial to the protection of the environment.

In some embodiments, the composition of the dual curing material contained in the first part 110 is at least partially the same as the composition of the dual curing material contained in the second part 120. In some embodiments, the dual curing material included in the first part 110 and the dual curing material included in the second part 120 may both include the first component, the second component, and the third component described above. The specific substance of the first component in the dual curing material included in the first part 110 and the dual curing material included in the second part 120 may be the same. The dual curing material included in the first part 110 and the dual curing material included in the second part 120 The specific substance of the second component in the curing material may be the same; the specific substance of the third component in the dual curing material included in the first part 110 and the third component of the dual curing material included in the second part 120 may also be the same.

In some embodiments, the composition of the dual curing material included in the first part 110 is exactly the same as the composition of the dual curing material included in the second part 120. In some embodiments, the dual-curing material included in the first part 110 has the same specific substance as the first component in the dual-curing material included in the second part 120, and the dual-curing material included in the first part 110 is the same as the second part. The specific substance of the second component of the dual curing material contained in the part 120 is the same, and the specific substance of the third component of the dual curing material contained in the first part 110 is the same as that of the third component of the dual curing material contained in the second part 120.

Through the arrangement that the components of the dual curing material contained in the first part 110 and the dual curing material contained in the second part 120 are at least partially the same, the dual curing material included in the first part 110 and the dual curing material included in the second part 120 can be Production based on the same or part of the same components can make prints easier to produce and make, and improve processing efficiency. In addition, if the composition of the dual-curing material included in the first part 110 is exactly the same as the composition of the dual-curing material included in the second part 120, there is no need to separately process the first part 110 and the second part 120 after the print is discarded. , It is convenient to recycle the printed parts, which is conducive to the protection of the environment.

In some embodiments, the first part 110, the second part 120, and the adhesive layer 130 all include a dual-curing material, the adhesive layer 130 includes a dual-curing material component, and the first part 110 includes a dual-curing material component. And the components of the dual curing material included in the second part 120 are at least partially the same. In some embodiments, the dual curing material included in the first part 110, the dual curing material included in the second part 120, and the dual curing material included in the adhesive layer 130 may all include the first group described above. Points, the second component and the third component. The specific substance of the first component in the dual curing material included in the first part 110, the dual curing material included in the second part 120, and the dual curing material included in the adhesive layer 130 may be the same, and the first part 110 includes The specific substance of the second component in the dual curing material contained in the second part 120, the dual curing material contained in the second part 120, and the dual curing material contained in the adhesive layer 130 may be the same; the dual curing material contained in the first part 110, the second component The specific substance of the third component in the dual curing material contained in the second part 120 and the dual curing material contained in the adhesive layer 130 may also be the same.

In some embodiments, the first part 110, the second part 120, and the adhesive layer 130 all include a dual-curing material, the adhesive layer 130 includes a dual-curing material component, and the first part 110 includes a dual-curing material component. And the components of the dual curing material included in the second part 120 are completely the same. In some embodiments, the specific substance of the first component of the dual curing material included in the first part 110, the dual curing material included in the second part 120, and the dual curing material included in the adhesive layer 130 are the same. And the second component of the dual curing material included in the first part 110, the dual curing material included in the second part 120, and the dual curing material included in the adhesive layer 130 are the same, and the first part 110 includes The specific substances of the third component in the dual curing material of the dual curing material, the dual curing material contained in the second part 120, and the dual curing material contained in the adhesive layer 130 are also the same.

The components of the dual-curing material included in the adhesive layer 130, the components of the dual-curing material included in the first portion 110, and the components of the dual-curing material included in the second portion 120 are at least partially the same, and the first portion 110 includes The dual-curing material, the dual-curing material included in the second part 120, and the dual-curing material included in the adhesive layer 130 may be made based on the same or partially the same components, which can facilitate the production and manufacture of printed parts and improve processing efficiency. In addition, if the composition of the dual-curing material included in the adhesive layer 130 is exactly the same as the composition of the dual-curing material included in the first part 110 and/or the second part 120, there is no need to separate the first part 110 after the print is discarded. , The second part 120 and the adhesive layer 130 are processed, which facilitates the recycling of printed parts, and is beneficial to the protection of the environment.

When the first part 110, the second part 120, and the adhesive layer 130 all include dual curing materials, the formulations of the first part 110, the second part 120, and the adhesive layer 130 may all be the same, so that the printing of the three The body has the same physical properties (such as elastic modulus, stiffness, etc.). Alternatively, the formulations of any two of the first part 110, the second part 120 and the adhesive layer 130 can be the same, so that the printing intermediates of the two with the same formulation have the same physical properties (such as elastic modulus, Stiffness, etc.). Or, the formulations of the first part 110, the second part 120, and the adhesive layer 130 may all be different, so that the printed bodies of the three have different physical properties (such as elastic modulus, stiffness, etc.).

In some embodiments, the first component includes a polyurethane prepolymer, and the second component includes a group that can react with isocyanate groups in the polyurethane prepolymer, so that the first component will occur during the second curing process. The chain extension reaction generates a three-dimensional network of polyurethane (meth)acrylate polymers. The three-dimensional network of the above polymer may include a copolymer, a polymer blend, an interpenetrating polymer network, a semi-interpenetrating polymer network, or a sequential interpenetrating polymer network.

In some embodiments, at least one of the parts of the print may have a certain light transmittance. For example, at least one of the first part 110 and the second part 120 has a certain light transmittance. Wherein, the first part or the second part having a certain light transmittance can be understood as the first part or the second part can allow a certain light to pass through to varying degrees (for example, completely or partially). The degree to which the first part or the second part allows light to pass through can be expressed by the light transmittance. The greater the light transmittance, it means that more light is allowed to pass through; the lower the light transmittance is, it means that less light is allowed to pass through. In some embodiments, one of the first part 110 and the second part 120 may allow light to pass through (completely or partially), while the other does not allow light to pass through. In other embodiments, both the first part and the second part may allow light to pass through (completely or partially).

When the adhesive layer 130 includes a dual-curing material or a single-curing material (such as a photocurable resin), the first portion 110 and/or the second portion 120 that can allow light to pass through allows the light to irradiate the adhesive layer 130, thereby The adhesive layer 130 is subjected to a photocuring process.

In some embodiments, the light transmittance of the first part 110 may be greater than 20%. For example, the light transmittance of the first part 110 may be 20%, 50%, 80%, or the like. In some embodiments, the light transmittance of the first part 110 may be greater than 60%. In some embodiments, the light transmittance of the first part 110 may be 90%-95%. In some embodiments, the light transmittance of the second part 120 may be similar to the light transmittance of the first part 110. In some embodiments, the light transmittance of the first part 110 and the second part 120 may be the same. For example, the light transmittance of the first part 110 and the second part 120 may both be 80%. In other embodiments, the light transmittance of the first part 110 and the second part 120 may be different, for example, the light transmittance of the first part 110 may be 20%, and the light transmittance of the second part 120 may be 90%.

In some embodiments, in order to meet the above-mentioned light transmittance requirement, the first part 110 may include a light-transmitting material, so that light can pass through the light-transmitting material and irradiate the adhesive layer 130. The light-transmitting material may include a light-curing resin. In other embodiments, in order to meet the above-mentioned light transmittance requirement, the first part 110 may include a hollow structure, so that light can directly pass through the hollow structure and irradiate the adhesive layer 130. The hollowing rate can be understood as the ratio of the volume of the hollowed-out part of the first part 110 to the total volume of the hollowed-out structure. In some embodiments, the hollow structure may be a hollow grid composed of a plurality of pillars. The size of the hollow grid, the shape of the hollow grid, and the size of the pillars can all be set according to the light transmission requirements and usage requirements of the printed parts. For example, when the first part 110 needs to shield less light, the size of the hollow grid may be larger, the shape of the hollow grid may be a cube and/or the pillars may be thinner. For another example, when the first part 110 needs to be harder, the size of the hollow grid may be smaller, the shape of the hollow grid may be triangular prisms and/or the pillars may be thicker. In other embodiments, the hollow structure may also be other hollow structures, such as through-hole structures. In some embodiments, the second part 120 may adopt a light-transmitting material or a hollow structure similar to the first part 110. For details, please refer to the relevant description of the light-transmitting material and the hollow structure of the first part 110.

In some embodiments, when both the first part 110 and the second part 120 allow light to pass through, the first part 110 may include a light-transmitting material, the second part 120 may include a hollow structure, and the first part 110 may include a hollow structure, and the second part 120 may include a hollow structure. The portion 120 includes a light-transmitting material, or both the first portion 110 and the second portion 120 include a light-transmitting material, or both the first portion 110 and the second portion 120 include a hollow structure. In addition, when the first part 110 and the second part 120 both include a hollow structure, the hollow rate of the first part and the second part may be the same or different.

In some embodiments, the thickness of the adhesive layer 130 in the uncured state may be 0.5 mm-10 mm. In some embodiments, the thickness of the adhesive layer 130 in the uncured state may be 1 mm-5 mm. For example, the thickness of the adhesive layer 130 may be 1 mm, 2 mm, 3.5 mm, 5 mm, or the like. By limiting the thickness of the adhesive layer 130 to the above range, it can be ensured that the adhesive layer 130 adheres to the first part 110 and the second part 120 more firmly.

In some embodiments, the stiffness of the first part 110 is the same as the stiffness of the second part 120. In other embodiments, the rigidity of the first part 110 is different from the rigidity of the second part 120. For example, the stiffness of the first portion 110 may be greater than the stiffness of the second portion 120, or the stiffness of the first portion 110 may be less than the stiffness of the second portion 120. In some embodiments, the stiffness of the first part 110 is 30N/mm-1190N/mm. In some embodiments, the stiffness of the first part 110 may be 35N/mm-66N/mm. In some embodiments, the stiffness of the first part 110 may be 490N/mm-1186N/mm. In other embodiments, the rigidity of the second part 120 is greater than the rigidity of the first part 110.

In some embodiments, the print may include a shoe sole. In some embodiments, the first part may include a midsole and the second part may include an outsole. In some embodiments, the first part may include a midsole and the second part may include an insole. In some embodiments, the print may include a third part and a fourth part. For example, the first part may include the outsole, the second part may include the midsole, the third part may include the insole, and the fourth part may Including insoles. In some embodiments, the first part may include a midsole and the second part may include a reinforcement. In still other embodiments, the print is a whole shoe, the first part may include the upper and the second part may include the sole; or the print may include the third and fourth parts, and the first part may include a part of the upper ( For example, the upper part), the second part may include another part of the upper (for example, the forefoot part), the third part may include a part of the sole (for example, the midsole), and the fourth part may include another part of the sole (for example, Outsole). The first part and the second part are exemplarily introduced below by taking shoe soles as an example.

Fig. 2a is a schematic diagram of the disassembled structure of a shoe midsole and a shoe outsole according to some embodiments of the present application, and Fig. 2b is a schematic diagram of a connection structure of the shoe midsole and the shoe outsole according to some embodiments of the present application. As shown in Figures 2a and 2b, the first part may include a midsole 210, and the second part may include an outsole 220. The lower surface of the midsole 210 may be connected to the upper surface of the outsole 220. In some embodiments, the sole may include components such as the outsole 220, the midsole 210, the insole, and the insole. The above-mentioned components may follow the thickness direction of the sole (the direction indicated by the arrow in Figure 2a) from bottom to top. Set in order. Among them, the outsole 220 may also be referred to as an outsole, that is, the outermost layer on the sole that directly contacts the ground, and the midsole 210 may refer to an intermediate structural layer provided on the upper surface of the outsole 220. The upper surface of the midsole 210 may also be provided with an insole, an insole, and the like. Fig. 2c is a schematic diagram showing the structure of a shoe midsole, a shoe outsole, and an adhesive layer according to some embodiments of the present application. As shown in Fig. 2c, the adhesive layer 230 may be located on the lower surface of the shoe midsole 210 and the shoe outsole. Between the upper surface of 220. For example only, the dual-curing material may be coated on the lower surface of the midsole 210 and/or the upper surface of the outsole 220, so that the dual-curing material can form the adhesive layer 230 after curing.

In some embodiments, as shown in FIGS. 2a and 2b, the midsole 210 may have an upper surface, a lower surface, and a side surface. The upper surface and the lower surface are connected by the side surface, and the midsole 210 and/or the outsole 210 220 may include dual curing materials. In some embodiments, the outsole 220 and/or the midsole 210 may transmit light. In some embodiments, before the shoe outsole 220 is attached to the shoe midsole 210, the shoe outsole 220 may be a bendable sheet structure. When the shoe outsole 220 is attached, the center of the shoe outsole 220 may cover the shoe midsole 210. The bottom surface and the edge portion of the shoe can be bent to cover all or part of the side surface of the midsole 210.

In some embodiments, the shoe midsole 210 and/or the shoe outsole 220 includes a dual curing material, and a printing intermediate (such as the printing intermediate and/or the printing intermediate of the shoe midsole 210 and/or the part including the dual curing material) can be prepared by photocuring. Or the printed intermediate of the shoe outsole 220). The print intermediate contains uncured components. In some embodiments, when the shoe outsole 220 and the shoe midsole 210 are assembled, an adhesive layer 230 may be coated at the joint between the two (at this time, the adhesive layer 230 may be in an uncured state in a liquid state or a mixed solid-liquid state. ), the uncured components in the printing intermediate and the coated uncured adhesive layer 230 are cured together to achieve adhesion. The adhesive layer 230 can bond the outsole 220 and the midsole 210.

When at least one of the adhesive layer 230, the shoe midsole 210 and the shoe outsole 220 includes a dual-curing material, after the first re-curing treatment, the uncured component facilitates the adhesion of the shoe midsole 210 and the shoe outsole 220 . Subsequently, the adhesive layer 230, the shoe midsole 210 and the shoe outsole 220 are subjected to a second curing process, which can cure the uncured components in the dual curing material to form the final print, and complete the shoe midsole 210 and the shoe at the same time. The adhesion of the outsole 220. Taking the shoe midsole 210 and the adhesive layer 230 including a dual curing material, and the shoe outsole 220 including a single curing material as an example, during the second curing process, the dual curing material of the shoe midsole 210 is uncured The uncured components in the dual curing material of the components and the adhesive layer 230 can be cured and can undergo a curing reaction to form a copolymer, a polymer blend, an interpenetrating polymer network, a semi-interpenetrating polymer network, or a sequential interpenetrating polymer network; The uncured component in the dual-cured material of the shoe midsole 210 and/or the uncured component in the dual-cured material of the adhesive layer 230 can undergo a curing reaction with the single-cured material of the shoe outsole 220 to form a copolymer or blend and polymerize Material, interpenetrating polymer network, semi-interpenetrating polymer network or sequential interpenetrating polymer network. Therefore, the first part and the second part can be adhered tightly and stably.

In some embodiments, the stiffness of the midsole 210 may be 35N/mm-66N/mm. In some embodiments, the stiffness of the midsole 210 may be 490N/mm-1186N/mm. In some embodiments, the stiffness of the outsole 220 may be greater than the stiffness of the midsole 210.

In some embodiments, the midsole 210 may include a hollow structure (such as a hollow mesh). In some embodiments, the hollow structure includes a plurality of interconnected units (each grid can be understood as a unit), each unit can include a plurality of connecting columns, and adjacent units can be connected to each other by sharing the connecting columns. . In some embodiments, the multiple units included in the hollow structure may be in the shape of a prism, a pyramid, a tetrahedron, a hexahedron, an octahedron, a hexahedron, an icosahedron, and the like. In other embodiments, the multiple units included in the hollow structure may also have irregular shapes. In some embodiments, the shapes and sizes of different units may be the same. In other embodiments, the shapes and sizes of different units may be different. By providing the hollow structure, the shoe midsole 210 can have good mechanical properties, and its resilience performance and shock absorption performance are better than those of ordinary foam shoe midsoles.

In some embodiments, the shoe outsole 220 may be an integrated structure. For example, the integrated shoe outsole 220 may be printed by light curing printing or other 3D printing methods. The shape of the outsole 220 may be consistent with the shape of the lower surface of the midsole 210. In the process of fitting the shoe outsole 220 with the shoe midsole 210, the shoe midsole 210 may be placed in the center of the shoe outsole 220 so that the shoe outsole 220 completely covers the lower surface of the shoe midsole 210.

In other embodiments, the shape of the outsole 220 may be similar to the shape of the lower surface of the midsole 210, but the size of the outsole 220 may be larger than the size of the midsole 210. In the process of fitting the shoe outsole 220 to the shoe midsole 210, the shoe midsole 210 can be placed in the central part of the shoe outsole 220 so that the central part of the shoe outsole 220 covers the lower surface of the shoe midsole 210 , And bend the edge portion of the shoe sole 220 to cover the side of the shoe midsole 210.

The shape and structure of the shoe outsole 220 can be different according to different functions required by the shoe. For example, the outsole 220 may have a continuous surface and completely cover the lower surface of the midsole 210; for another example, the outsole 22012 may have holes, and the outsole 220 may only cover a part of the lower surface of the midsole 210.

In some embodiments, the shoe outsole 220 may include multiple sub-parts, and each sub-part may have multiple shapes. For example, the shape of the sub-portion may be a sheet shape; for another example, the shape of the sub-portion may be a strip shape. The functions of different subsections can be different. For example, a sheet-shaped sub-part may be used to cover the lower surface of the midsole 210, and a strip-shaped sub-part may be used to cover the side surface of the midsole 210. Depending on the function required by the shoe, the sub-part can be a complete and continuous continuous surface, or it can be provided with holes. Multiple sub-parts with different shapes or functions may be separately manufactured and connected together, so that the structural design of the outsole will not be affected by the manufacturing process.

In some embodiments, when assembling the shoe outsole 220 and the shoe midsole 210, you can choose to coat the adhesive layer 230 on a continuous surface, which is not only convenient for operation, but also can prevent the uncured adhesive layer 230 material from flowing into The midsole 210 and/or the outsole 220 are in the gap. In some embodiments, the adhesive layer 230 may be coated on the outsole 220, and then the outsole 220 may be attached to the midsole 210.

Sole design is critical to the overall performance of the footwear. The ideal sole should provide support and cushioning for the wearer's foot, and protect the foot from impact by damping during the wearer's activities. In addition, the ideal sole should provide good rebound to provide better elasticity and reduce energy loss during dynamic movement of the foot. But buffering and rebounding can sometimes be contradictory. Taking the design of shoe midsole as an example, cushioning is to reduce the speed at which the midsole responds to the impact force. It measures how fast the midsole can rebound after receiving the impact energy. In addition, shoe soles that can provide good cushioning properties are often made of flexible and elastic materials. Such shoe soles are easily deformed during the wearer's movement, leading to instability. Shoe manufacturers have been working hard to research new materials and new sole structures to improve the performance of shoes. The recent additive manufacturing technology has also explored new methods, which make the midsole of the shoe have various lattice structures, so that the midsole of the shoe has the above-mentioned ideal performance.

In order to solve the above problems, in some embodiments, a rigid layer may be used on the sole (such as on the midsole). For example, a rigid layer is provided on the outsole of the footwear product to improve the stability and balance of the footwear product. The surface of the outsole can be equipped with one or more carbon fiber boards as a rigid layer. Alternatively, one or more carbon fiber panels can be inserted into the outsole as a rigid layer. The use of carbon fiber board can improve the performance of footwear products, but this solution also has its limitations. First of all, carbon fiber boards are expensive. Secondly, the laying of carbon fiber boards involves the use of chemical adhesives, which increases the difficulty of recycling and is not conducive to environmental protection.

Fig. 3a is a schematic diagram of the structure of a shoe midsole and a reinforcement according to some embodiments of the present application. In other embodiments, as shown in FIG. 3 a, the first part may include a midsole 310, and the second part may include a reinforcement 320. The reinforcement 320 may be added to the midsole 310 (embedded in the midsole 310 or connected to the surface of the midsole 310), and has a volume smaller than that of the midsole 310, and has a stiffness greater than that of the midsole 310. , Used to improve the performance (such as elasticity, stability, cushioning performance) of the shoe midsole 310. In some embodiments, the stiffness of the reinforcement 320 may be greater than the stiffness of the midsole 310. In some embodiments, the reinforcing member 320 may be embedded in the midsole 310, or the reinforcing member 320 may also be provided on the surface (such as the upper surface, the lower surface or the side edge) of the midsole 310. In this embodiment, the reinforcing member 320 can play a role in improving the elasticity of the midsole 310, improving the cushioning performance of the midsole 310, improving the toughness of a specific part of the midsole 310, and improving the supporting force of the midsole 310. . The structure and shape of the reinforcement 320 (such as whether a through hole is provided) and the shape can be set according to actual use requirements. For example, the structure and shape of the reinforcement 320 can be determined according to the position of the designed reinforcement 320. For another example, The structure, shape, and weight of the reinforcement 320 may be determined according to the design center of gravity position and the design weight of the reinforcement 320. The design center of gravity position and design weight of the reinforcement 320 may be determined based on the use requirements of the midsole 310. For example, when the midsole 310 is used to make the sole of a sports shoe, the design reinforcement 320 is designed to be lighter in weight. For the description of the structure and shape of the reinforcement 320, please refer to the relevant content below.

In some embodiments, at least one of the midsole 310, the reinforcement 320, and the adhesive layer may include a dual curing material. In some embodiments, the midsole 310 and/or the reinforcement 320 includes a dual curing material. Compared with the above-mentioned technical solution of embedding carbon fiber board, by adopting dual curing materials and using dual curing treatment, after the midsole 310 and the reinforcement 320 are manufactured separately, the midsole 310 and the reinforcement 320 can be easily and stably assembled. Assemble it.

In addition, the midsole 310 provided with the reinforcement 320 not only has a good cushioning function provided by the relatively more flexible and elastic midsole 310, but also can provide additional energy return and stability by the reinforcement 320.

In some embodiments, the stiffness of the reinforcement 320 may be 5%-300% greater than the stiffness of the midsole 310, that is, the stiffness of the reinforcement 320 minus the stiffness of the midsole 310 is divided by the stiffness of the midsole 310. The value obtained after the stiffness of the bottom 310 is in the range of 5%-300%. In some embodiments, the stiffness of the midsole 310 may be 35N/mm-66N/mm. In some embodiments, the stiffness of the midsole 310 may be 490N/mm-1186N/mm. In some embodiments, the stiffness of the reinforcement 320 may be greater than the stiffness of the midsole 310.

In some embodiments, in order to increase the rigidity of the reinforcement member 320, the reinforcement member 320 may include a dual curing material and a fiber material. For the description of the dual-curing material included in the reinforcement 320, please refer to the relevant content of the dual-curing material above. In some embodiments, the fiber material included in the reinforcement 320 may include carbon fiber, glass fiber, SiC fiber, C fiber, Si3N4 fiber, B fiber, B (W core) fiber, SiC (W core) fiber, SiC (C Core) fiber, Al2O3 fiber, polymer fiber, etc.

In some embodiments, the midsole 310 may include a forefoot portion 311, an arch portion 312, and a heel portion 313 that are sequentially connected from front to back. Understandably, when the user puts on the shoes made of the shoe midsole 310, the forefoot of the user's foot can correspond to the position of the forefoot part 311, and the arch of the user's foot can correspond to the position of the arch part 312. The heel of the user's foot may correspond to the position of the heel 313. In some embodiments, the reinforcing member 320 may be provided at any position on the upper surface or the lower surface of the midsole 310. In other embodiments, the reinforcing member 320 may be embedded in any position of the midsole 310 of the shoe. In some embodiments, the reinforcement 320 may be provided in the front area of the midsole 310. The front area may refer to the area of the first 1/3 of the midsole of the shoe. In other embodiments, the reinforcement member 320 may be provided in the rear area of the midsole 310. The rear area may refer to the area of the rear 1/3 of the midsole of the shoe. In some embodiments, the reinforcing member 320 is provided on the forefoot portion 311, the arch portion 312 and/or the heel portion 313. That is to say, any one or both of the forefoot portion 311, the arch portion 312, and the heel portion 313 may be provided with a reinforcing member 320, or the forefoot portion 311, the arch portion 312, and the heel portion 313 may all be provided with reinforcements 320. There is a reinforcement 320.

In some embodiments, the thickness of the reinforcement 320 after curing may be 0.05 mm-2 mm. When the reinforcing member 320 includes a dual curing material, the thickness after curing may be the thickness after the second curing process. When the reinforcing member 320 includes a single-cured material, the cured thickness may be the thickness of the reinforcing member after curing and molding. For example, when the reinforcement includes a photo-curable resin, the cured thickness may be the thickness of the photo-curable resin after curing and molding into the reinforcement 320. By setting the reinforcing member 320 within the above-mentioned thickness range, the reinforcing member 320 can improve the elasticity of the midsole 310, improve the cushioning performance of the midsole 310, improve the toughness of specific parts of the midsole 310, and improve the shoe midsole 310. The supporting force of the sole 310 also ensures that the reinforcing member 320 will not excessively affect the size and structure of the midsole 310.

In some embodiments, the shape of the cross-section of the reinforcing member 320 perpendicular to the thickness direction of the midsole 310 (the thickness direction in FIG. 3a is the direction perpendicular to the paper) may be the same as the shape of the midsole 310 perpendicular to the thickness direction. The shape of the cross-section is similar. The size of the reinforcement 320 along the cross section perpendicular to the thickness direction of the midsole 310 may be smaller than the size of the midsole 310 along the cross section perpendicular to the thickness direction. In some embodiments, the reinforcement member 320 may include a sub-forefoot portion 321, a sub-arch portion 322, and a sub-heel portion 323 that are sequentially connected from front to back. When the reinforcement 320 is installed on the midsole 310, the sub-forefoot portion 321 may be located on the forefoot portion 311 of the midsole 310, and the sub-arch portion 322 may be located on the arch portion 312 of the midsole 310. The heel 323 may be located on the heel 313 of the midsole 310.

In some embodiments, the distance between the center of gravity of the reinforcement 320 and the center of gravity of the midsole 310 is less than 1 mm. In some embodiments, the line connecting the center of gravity of the reinforcement 320 and the center of gravity of the midsole 310 is parallel to the thickness direction. In some embodiments, the center of gravity of the reinforcement 320 coincides with the center of gravity of the midsole 310. If the position of the center of gravity of the reinforcing member 320 deviates too much from the position of the center of gravity of the shoe midsole 310, the wearing comfort of the shoe made of the shoe midsole 310 may be affected. The above three ways of setting the position of the center of gravity can all ensure the comfort of the shoe made of the midsole 310 after the reinforcement 320 is provided.

Fig. 3b is a schematic structural diagram of a mounting groove of a shoe midsole according to some embodiments of the present application. As shown in Fig. 3b, in some embodiments, a mounting groove 314 may be provided on the shoe midsole 310. 314 is used to install the reinforcement 320. In other words, the reinforcing member 320 may be embedded in the mounting groove 314. In some embodiments, the adhesive layer may be located between the inner wall of the mounting groove 314 and the reinforcing member 320. The mounting groove 314 may be provided on the forefoot portion 311, the arch portion 312 and/or the heel portion 313. The number of mounting grooves 314 may be one or more. For example, the number of the mounting grooves 314 may be three, and the three mounting grooves 314 may be provided on the forefoot portion 311, the arch portion 312, and the heel portion 313, respectively. For another example, the number of the installation grooves 314 may be two, and the two installation grooves may both be provided on the fore palm 311. In the embodiment shown in FIG. 3b, the mounting groove 314 is provided on the heel portion 313.

In some embodiments, the reinforcing member 320 may include a plurality of through holes 324, and each through hole 324 may be along the thickness direction of the reinforcing member 320 (the thickness direction in FIGS. 3c-3h is a direction perpendicular to the paper surface, the same The thickness direction of the midsole 310) penetrates the reinforcing member 320. Through the design of the position of the through hole 324, the position of the center of gravity of the reinforcing member 320 can also be adjusted to prevent the center of gravity of the reinforcing member 320 from deviating too much from the center of gravity of the midsole 310. In addition, by providing the through hole 324 on the reinforcing member 320, the weight of the reinforcing member 320 can be reduced. In other embodiments, other structural designs can also be used to reduce the weight of the reinforcement, for example, a hollow grid is provided on the reinforcement, and the thickness of the reinforcement 320 is reduced.

In some embodiments, the plurality of through holes 324 may be located at a plurality of different positions of the reinforcement member 320. For example, at least one through hole 324 may be provided on the forefoot part, the arch part and the heel part of the reinforcement member 320. For another example, at least one through hole 324 may be provided on any one or both of the forefoot portion 321, the arch portion 322 and the heel portion 323 of the reinforcing member 320. Figures 3c-3h are schematic diagrams of the shoe midsole and reinforcement according to some embodiments of the present application. Figures 3c-3h show a situation where the reinforcement includes a sub-forefoot portion 321, a sub-arch portion 322, and a sub-heel portion 323. . As shown in FIG. 3c, both the forefoot portion 321 and the heel portion 323 of the reinforcing member 320 are provided with a through hole 324. As shown in FIG. 3d, the forefoot portion 321, the arch portion 322 and the heel portion 323 of the reinforcing member 320 are all provided with a through hole 324.

In some embodiments, the reinforcing member 320 may also be provided with a notch 325, the notch 325 may penetrate the reinforcing member 320 along the thickness direction of the reinforcing member 320 (the same as the thickness direction of the midsole 310), and the notch 325 may be located in the reinforcing member 320. On the side edges. As shown in Figure 3e, the forefoot part 321 is provided with a through hole 324, the arch part 322 is provided with two through holes 324, the heel part 323 is provided with a notch 325, and the opening of the notch 325 faces the shoe The back side of the midsole 310. As shown in FIG. 3f, the sub-forefoot portion 321 is provided with a plurality of through holes 324, and the shape and size of each through hole 324 are different. Two through holes 324 are provided on the sub-arch portion 322, a notch 325 is provided on the sub-heel portion 323, and the opening of the notch 325 faces the rear side of the midsole 310. As shown in Figures 3g and 3h, the forefoot portion 321 and the heel portion 323 of the reinforcement member 320 are both provided with a through hole 324, the forefoot portion 321 is also provided with a notch 325, and the opening of the notch 325 faces the midsole. The front side of 310. The difference between the reinforcing member 320 shown in FIG. 3g and FIG. 3h is that the shape of the through hole 324 and the shape of the notch 325 are different. 3c-3h are only examples of the reinforcing member 320 having through holes 324, and the number, shape, and arrangement positions of the through holes can also be in various situations, which are not further limited in this application.

Fig. 4a is a schematic structural diagram of a shoe midsole 410 and a reinforcing member 420 according to other embodiments of the present application. As shown in FIG. 4a, in some embodiments, the reinforcing member 420 may include a supporting portion 421 and a side wing portion 422. The support portion 421 may be used to support the foot, and the side wing portion 422 may be used to make the connection between the support portion 421 and the midsole 410 more stable. The supporting portion 421 may be provided on the surface (for example, the upper surface or the lower surface) of the midsole 410, and the side wing portion 422 is connected to the side edge of the midsole 410.

In some embodiments, the midsole 410 may include a central part and an edge part, and the edge part may be arranged around the central part. In the sole composed of the midsole 410 and the outsole, the central part may be perpendicular to the thickness direction of the midsole 410, and the edge part may be at a certain angle with the central part (such as 90°, 120°, 150°, etc.). In some embodiments, the central portion and the edge portion of the midsole 410 are flush in the thickness direction (the direction shown by the arrow in FIG. 4a), and the side flap 422 may cover the outer edge of the midsole 410. In other embodiments, the size of the central portion of the midsole 410 in the thickness direction is smaller than the size of the edge portion in the thickness direction. The inner edge of the midsole. In some embodiments, when the side wing portion 422 covers the inner edge of the midsole, the uppermost position of the side wing portion 422 may be lower than the uppermost position of the inner edge of the midsole 410. By providing the side wings 422 that can wrap the side edges of the midsole 410, the connection between the midsole 410 and the reinforcement 420 can be made more stable.

In some embodiments, when the shoe midsole 410 is combined with a shoe outsole, an insole and other components to form a shoe sole, if the support portion 421 of the reinforcing member 420 is located on the upper surface of the shoe midsole 410, part of the lower surface of the shoe insole It can be attached to the upper surface of the reinforcement 420, and the upper surface of the outsole can be attached to the lower surface of the midsole 410; if the support portion 421 of the reinforcement 420 is located on the lower surface of the midsole 410, the shoe insole A portion of the lower surface of the shoe midsole 410 may be attached to the upper surface of the shoe sole 410, and a portion of the upper surface of the shoe sole may attach to the lower surface of the reinforcing member 420.

In some embodiments, the thickness of the support portion 421 and the side wing portion 422 may be the same. In other embodiments, the thickness of the support portion 421 and the side wing portion 422 may be different.

In some embodiments, the number of side wing portions 422 may be one. In some embodiments, the number of side wing portions 422 may be more than two, for example, the number of side wing portions 422 may be 2, 3, 5, and so on. In the embodiment shown in FIG. 4a, the number of side wing portions 422 is two. In addition, FIG. 4a shows that two side wings 422 respectively cover the inner edge of the midsole 410.

4b-4e are structural schematic diagrams of reinforcement members according to other embodiments of the present application. The reinforcement members 420 in FIGS. 4b-4e all include a support portion 421 and a side wing portion 422, the difference lies in the shape of the support portion 421, and The shape of the side wing portion 422 is different. In addition to the shapes of the support portion 421 and the side wing portion 422 shown in the respective figures of FIGS. 4b-4e, the support portion 421 and the side wing portion 422 may also be provided in other shapes. In some embodiments, the shape of the support part 421 and the side wing part 422 may also be designed based on the user's foot type, the user's walking or exercise requirements, and so on.

In some embodiments, the supporting portion 421 may cover the upper surface or the lower surface of the arch portion 412 (as shown in FIG. 4a) of the midsole 410. Since the width of the arch portion 412 on the plane perpendicular to the thickness direction is generally small, it is prone to twisting. By arranging the reinforcement 420 (supporting portion 421) on the arch portion 412, the arch portion can be effectively prevented from twisting and the shoe can be improved. The stability of the midsole 410. In some embodiments, the support portion 421 may cover part or all of the upper surface of the forefoot portion 411 (as shown in FIG. 4a) of the midsole 410; or the support portion 421 may cover the forefoot of the midsole 410 Part 411 (as shown in FIG. 4a) is part or all of the lower surface. In some embodiments, the support portion 421 may cover part or all of the upper surface of the heel portion 413 (as shown in FIG. 4a) of the midsole 410, or the support portion 421 may cover the heel portion 413 of the midsole 410 Part or all of the area of the lower surface.

Fig. 5a is a schematic diagram of a three-dimensional structure of a shoe midsole and a reinforcement according to other embodiments of the present application. In some embodiments, as shown in FIG. 5 a, the reinforcing member 520 may include an upper top portion 521, a lower bottom portion 523 and a connecting portion 522. The connecting portion 522 may be used to connect the upper top 521 and the lower bottom 523, and the upper top 521 and the lower bottom 523 may respectively support the upper side and the lower side of the midsole 510. One end of the upper top portion 521 and one end of the lower bottom portion may be connected by a connecting portion 522. In some embodiments, the reinforcement 520 may be U-shaped. In other embodiments, the reinforcing member 520 may be Z-shaped.

In some embodiments, as shown in FIG. 5a, the upper top portion 521, the lower bottom portion 523, and the connecting portion 522 may all be embedded in the heel portion 513 of the midsole. By arranging the upper top 521, the lower bottom 523 and the connecting portion 522 in the heel 513 of the midsole 510, the cushioning performance and stability performance of the heel 513 can be enhanced. In some embodiments, the connecting portion 522 may be located at the front end of the heel portion 513, the upper top portion 521 may be located at the upper end of the heel portion 513, and the lower bottom portion 523 may be located at the lower end of the heel portion 513, which can further improve the cushioning performance of the heel portion 513. Stable performance.

In some embodiments, as shown in FIGS. 5b and 5c, a supporting structure 524 may be provided between the upper top portion 521 and the lower bottom portion 523 to increase the stability of the reinforcing member 520. As shown in FIGS. 5b and 5c, the supporting structure 524 may include a plurality of supporting plates, and the plurality of supporting plates may be connected in sequence, and the angle between two adjacent supporting plates may have an angle. In some embodiments, the degree of the included angle between two adjacent support plates may be 30°-150°, for example, the degree of the included angle between two adjacent support plates may be 30°60° , 90°110°, 150°, etc. The two adjacent supporting plates and the upper top 521, and the two adjacent supporting plates and the lower bottom 523 can all form a triangle, which can make the structure of the reinforcement 520 more stable.

In some embodiments, as shown in FIG. 5d, the reinforcing member 520 may further include an extension portion 525 located on the upper or lower surface of the arch portion 512 (shown in FIG. 5a); or, the extension portion 525 is embedded Inside the arch of the foot 512. That is, when the reinforcing member 520 is located in the heel portion 513, the extension portion 525 may be formed by extending one of the upper top portion 521, the lower bottom portion 523, and the connecting portion 522 forward (in the direction shown by the arrow in FIG. 5d). . In some embodiments, when the reinforcement 520 is located at the forefoot portion 511 (shown in FIG. 5a) or the arch portion 512, the extension portion 525 may also be extended forward from the upper top portion 521, the lower bottom portion 523 or the connecting portion 522 or Extend backwards. The extension 525 can increase the contact area between the reinforcement 520 and the midsole 510, and can help ensure the stability of the midsole 510. For example, when the reinforcing member 520 is provided on the heel portion 513, the extension portion 525 extends to the arch portion 512, which can enhance the stability of the arch portion 512, so that the arch portion 512 is not easily twisted, thereby ensuring the stability of the midsole 510 sex.

FIG. 6 is a schematic diagram of a three-dimensional structure of a shoe midsole 610 and a reinforcing member 620 according to still other embodiments of the present application. As shown in FIG. 6, in some embodiments, the reinforcing member 620 may include a first arc-shaped portion 621 and a second arc-shaped portion 622. The first arc-shaped part 621 and the second arc-shaped part 622 may be embedded in the left and right sides of the heel 613 of the midsole 610, respectively. The inner arc surface of the first arc-shaped portion 621 and the inner arc surface of the second arc-shaped portion 622 are arranged opposite to each other. In other embodiments, the first arc-shaped portion 621 and the second arc-shaped portion 622 may also be embedded in the front side and the back side of the heel portion 613 of the midsole 610, respectively. In some embodiments, the reinforcing member 620 may only include the first arc-shaped portion 621 or the second arc-shaped portion 622.

It is understandable that the reinforcement shown in FIGS. 5a-5d and FIG. 6 can all be embedded in the mounting groove 314 at the heel portion 313 shown in FIG. 3b. The aforementioned midsoles provided with reinforcements can be further combined with other structures of the soles (such as outsoles, insoles, insoles, etc.) to form a complete sole.

In some embodiments, the print may include a pillow. The first part can be a part of the pillow, and the second part can be another part of the pillow. In other embodiments, the pillow can be split into three or four parts. Hereinafter, the printing steps of the pillow are described by taking the example that the first part, the second part, and the adhesive layer of the pillow each include a dual-curing material. Wherein, the first part and/or the second part of the pillow may include a hollow structure. The shape, structure and size of the first part and the second part of the pillow can be the same or different.

The embodiment of the present application also provides a printing method, which can be used to print the prints described above. As shown in FIG. 7 and in conjunction with FIG. 1, the process 700 of the printing method may include the following steps:

Step 710: Provide at least one of the first part and the second part.

In step 710, at least one of the first part 110 and the second part 120 is provided. It may be that only one of the first part 110 and the second part 120 is provided, or both of the first part 110 and the second part 120 are provided. Providing at least one of the first part 110 and the second part 120 may be to obtain the first part 110 and/or the second part 120 that has been manufactured, or to manufacture the first part 110 and/or the second part 120. The first part 110 and the second part 120 can be provided in the same way or differently. For example, one of the first part 110 and the second part 120 may be manufactured, and the other of the first part 110 and the second part 120 may be obtained and already manufactured. When the first part 110 and the second part 120 are both manufactured, the method of manufacturing the first part 110 and the method of manufacturing the second part 120 may be the same or different. In some embodiments, the method of manufacturing at least one of the first part 110 and the second part 120 may be injection molding, thermocompression molding, 3D printing, or the like. Just as an example, 3D printing may include fused deposition molding, laser sintering molding, light curing molding and other methods.

In some embodiments, providing at least one of the first part 110 and the second part 120 includes: making at least one of the first part 110 and the second part 120 through a first recuring process in a dual curing molding manner one. The dual-curing molding method may include a first re-curing treatment and a second re-curing treatment. In step 710, the first re-curing treatment may include a photo-curing treatment. The second curing process may include any one or more of photo curing process, thermal curing process and moisture curing process. It is understandable that at least one of the first part 110 and the second part 120 is produced by the first recuring process of the dual curing molding method. The first part 110 can be produced by the first recuring process, or the first part 110 can be produced by the first The second part 120 is produced by the recuring treatment, and the first part 110 and the second part 120 can also be produced by the first recuring treatment.

In some embodiments, one of the first part 110 and the second part 120 can be produced by the first recuring process of the double curing molding method, and the other of the first part 110 and the second part 120 can be produced by other printing methods. . In some embodiments, other printing methods may be 3D printing methods such as fused deposition molding and laser sintering molding. In other embodiments, the other of the first part 110 and the second part 120 may be manufactured by injection molding, hot press molding, or the like.

In some embodiments, the first part 110 and the second part 120 may both be made by other printing methods. For specific instructions on other printing methods, please refer to the relevant content above. In other embodiments, both the first part 110 and the second part 120 can be manufactured by injection molding, thermocompression molding, or the like.

In some embodiments, step 710 may include the following steps: based on a dual curing material, using a first recuring process to make one of the first part 110 and the second part 120; making the first part 110 and the second part 120 The other one. In this embodiment, at least one of the first part 110 and the second part 120 may include a dual curing material. Wherein, a part of the components of the dual-curing material can be cured after the first re-curing treatment. For a detailed description of the dual-curing material, please refer to the relevant content above.

In some embodiments, the step of fabricating the other of the first portion 110 and the second portion 120 may include: fabricating the other of the first portion 110 and the second portion 120 based on a dual curing material, using a first recuring process operation . That is, the first part 110 and the second part 120 may each include a dual curing material.

In some embodiments, the first part 110 and/or the second part 120 may include a single-layer curing material. For the description of the single-layer curing material, please refer to the relevant content above.

In some embodiments, step 710 may further include cleaning the surface of the first part 110 and/or the second part 120, such as washing with water, and using a centrifuge to make the surface of the first part 110 and/or the second part 120 undesirable. The curing component is separated from the surface of the first part 110 and/or the second part 120 to ensure the connection effect of the first part 110 and the second part 120.

In step 720, an adhesive layer 130 is provided on the first part 110 and/or the second part 120.

In step 720, the adhesive layer 130 may be provided only on the first part 110, or the adhesive layer 130 may be provided only on the second part 120, or the adhesive layer may be provided on both the first part 110 and the second part 120. 130. In some embodiments, the adhesive layer 130 may include a dual-cured material, and in other embodiments, the adhesive layer 130 may include a single-cured material.

In some embodiments, the adhesive layer 130 may be coated on the joint between the first part 110 and the second part 120. The joint of the first part 110 and the second part 120 can be understood as the position where the first part 110 and the second part 120 contact each other when they are connected. The adhesive layer 130 may be coated on the first part 110 for contact with the second part 120, and the adhesive layer 130 may also be coated on the second part 120 for contact with the first part 110.

In step 730, the first part 110 and/or the second part 120 and the adhesive layer 130 are cured.

In step 730, the first part 110 and the adhesive layer 130 may be cured, or the second part 120 and the adhesive layer 130 may be cured, or the first part 110, the second part 120 and the adhesive layer 130 may be cured. The three layers 130 are cured. The curing treatment in step 730 may be the first re-curing treatment in a dual-curing molding mode. The curing treatment in step 730 may also be a second-stage curing treatment in a dual-curing molding manner.

In some embodiments, when the first part 110 and the second part 120 are made by other printing methods, at this time, the first part 110 and the second part 120 may not include dual curing materials, and the adhesive layer 130 includes dual curing materials. , Curing the first part 110 and/or the second part 120 and the adhesive layer 130 may include the following steps: curing the adhesive layer 130 and the first part 110 and the second part 120 through a dual curing molding method to achieve The first part 110 and the second part 120 are connected. The curing process of the adhesive layer 130 and the first part 110 and the second part 120 through the dual curing process can be performed by first performing a first curing process (such as a photocuring process) on the above three, and then performing a second curing process on the above three. Curing treatment (such as light curing treatment, thermal curing treatment or moisture curing treatment). In some embodiments, when the first re-curing process is a photo-curing process, only the first re-curing process may be performed on the adhesive layer 130. In some embodiments, when the first recuring process and the second recuring process are both photocuring processes, only the first recuring process and the second recuring process may be performed on the adhesive layer 130.

In some embodiments, when at least one of the first part 110 and the second part 120 includes a dual curing material, step 730 may further include the following steps: attaching the first part 110 to the second part 120 to obtain a combined body; The combined body is subjected to a second curing process to obtain a print. Among them, another part of the dual curing material can be cured after the second curing treatment. The first part 110 and the second part 120 in the assembly may be in a state of being attached together (at this time, the adhesive layer may be in an uncured state, for example, the dual curing material as the adhesive layer is in an uncured state), also It may be in a state of being bonded together (in this case, the bonding layer may be in a partially cured state, for example, a part of the dual curing material as the bonding layer may be in an uncured state). For the specific method of obtaining the combination, please refer to the relevant content below. In some embodiments, when the assembly is subjected to the second re-curing treatment, the first part 110 and the second part 120 are kept in a state of being attached, and the first part 110 and the second part 120 can be bonded after the second re-curing treatment. The layers 130 are connected.

In some embodiments, the adhesive layer 130 may include a dual curing material. In some embodiments, when the adhesive layer 130 includes a dual curing material, the step of attaching the first part 110 and the second part 120 to obtain a combined body may further include the following sub-steps: combining the first part 110 and the second part 120 Laminating; the first part 110 and the second part 120 after being bonded are subjected to a first re-curing treatment to cure a part of the components of the adhesive layer 130 to form an assembly. Performing the first recuring treatment on the bonded first part 110 and the second part 120 may be subjecting the bonded first part 110 and the second part 120 to a photocuring process. After curing a part of the components of the adhesive layer 130, the first part 110 and the second part 120 can be initially connected.

In some embodiments, the first portion 110 and/or the second portion 120 may include a light-transmitting structure; or, the first portion 110 and/or the second portion 120 may include a hollow structure. In step 720, the step of subjecting the bonded first part 110 and the second part 120 to a first recuring treatment to cure a part of the components of the adhesive layer 130 may further include: bonding the adhesive through a light-transmitting material or a hollow structure. The laminated layer 130 is irradiated with light to cure a part of the components of the adhesive layer 130. For specific descriptions of light-transmitting materials and hollow structures, please refer to the relevant content above. Since the first part 110 and/or the second part 120 includes a light-transmitting material or a hollow structure that can allow light to pass through, the adhesive layer 130 can be irradiated with light (such as ultraviolet light), so that the adhesive layer 130 is photocured .

In some embodiments, at least one of the first portion 110, the second portion 120, and the adhesive layer 130 includes a dual curing material. A part of the dual-curing material may be subjected to a first re-curing treatment in step 710 (when the first part 110 and/or the second part 120 includes a dual-curing material), or in step 730 (when the adhesive layer 130 includes a dual-curing material) Material) Carry out the first re-curing treatment. Among them, another part of the dual curing material can be cured after the second curing treatment.

In some embodiments, the first re-curing treatment may include a photo-curing treatment. In some embodiments, the second curing treatment may include light curing treatment, thermal curing treatment, moisture curing treatment, and the like. For related descriptions of light curing, heat curing and moisture curing, please refer to the relevant content above. In some embodiments, when the second recuring process is a thermal curing process, the temperature of the thermal curing process is 80°C-160°C. For example, the temperature of the thermal curing treatment may be 80°C, 100°C, 116°C, 148°C, or the like. In some embodiments, the temperature of the thermal curing treatment may be 2 hours, 12 hours, 18 hours, 24 hours, and so on. For further instructions on light curing and moisture curing, please refer to the relevant content above.

In some embodiments, when only one of the first part 110 and the second part 120 includes a dual-curing material, the printing method may include the following steps (taking the first part 110 including a dual-curing material as an example): Based on the dual-curing material, use The first re-curing process produces the first part 110 (part of the first part 110 is cured, and the other part is uncured); the second part 120 is obtained (which can be produced by the method described above or directly obtained The second part of the finished product 120); the adhesive layer 130 is applied to the bonding place of the first part 110 and the second part 120; the first part 110 and the second part 120 are bonded together to form a composite body; A double curing process is performed to cure the adhesive layer 130 and another part of the first part 110 to form a printed article.

In some embodiments, when one of the first part 110 and the second part 120 includes a dual-curing material, and the adhesive layer 130 also includes a dual-curing material, the printing method may include the following steps (taking the first part 110 including the dual-curing material as Example): Based on the dual-curing material, use the first re-curing process to make the first part 110 (one part of the first part 110 is cured, while the other part is uncured); obtain the second part 120; in the first part 110 and the first part 110 Coat the adhesive layer 130 where the two parts 120 are attached; attach the first part 110 to the second part 120; perform the first re-curing treatment on the adhesive layer 130 (such as through the light-transmitting material or hollowing out as described above) The structure irradiates the adhesive layer 130 with light), so that a part of the components of the adhesive layer 130 is cured to form an assembly; the assembly is subjected to a second re-curing treatment so that the other part of the adhesive layer 130 is combined with Another part of the first part 110 is cured to form a print. In this embodiment, obtaining the second part 120 may be manufactured by the above-mentioned injection molding, fused deposition molding, laser sintering molding, light curing molding and other methods, or may be or directly obtain the second part of the finished product. Two parts 120.

In some embodiments, when the first part 110, the second part 120, and the adhesive layer 130 all include dual curing materials, the printing method is similar to the printing method when the first part 110 and the adhesive layer 130 include dual curing materials. The only difference is that the second part 120 can be made based on a dual-curing material using a first-curing process.

In some embodiments, when only the adhesive layer 130 includes a dual curing material, the printing method may include the following steps: manufacturing by the above-mentioned injection molding, fused deposition molding, laser sintering molding, light curing molding, etc. The first part 110 or the second part 120, or directly obtain the first part 110 and the second part 120 of the finished product; coat the adhesive layer 130 at the joint of the first part 110 and the second part 120; the first part 110 It is attached to the second part 120; the adhesive layer 130 is subjected to a first re-curing treatment (such as light-irradiating the adhesive layer 130 through the light-transmitting material or hollow structure described above), so that the adhesive layer 130 is A part of the components are cured to form an assembly; the assembly is subjected to a second recuring treatment to cure another part of the adhesive layer 130 and the other part of the first part 110 to form a print.

In some embodiments, the above-mentioned printing method can be used to print shoe soles. With reference to Figures 2a, 2b, and 2c, printing shoe soles can be performed according to the following steps:

Step a1. Design the three-dimensional model of the shoe midsole 210 and the three-dimensional model of the shoe outsole 220, and perform slicing processing on the three-dimensional model of the shoe midsole 210 and the shoe outsole 220 to obtain the light pattern data for photocuring. Configure the dual-curing material required for the photo-curing process. The dual-curing mechanism resin may include a component that can be photo-cured and a component that cannot be photo-cured. Recuring materials, etc.) can transmit light.

In some embodiments, in step a1, the three-dimensional model of the midsole 210 and the three-dimensional model of the outsole 220 may be such that the outsole 220 at least partially covers the lower surface of the midsole 210. In some embodiments, the material used to print the midsole 210 may be light-transmissive.

Step b1. The dual curing material is added to the light curing printing device, the light pattern data is imported into the light curing printing device, and the printing intermediate is prepared by the light curing printing device, and the printing intermediate contains uncured components.

In some embodiments, in step b1, the above-mentioned printing intermediate may be the printing intermediate of the shoe midsole 210 and/or the printing intermediate of the shoe sole 220.

Step c1. The printing intermediate in step b1 is subjected to a cleaning process, which is used to remove the uncured resin remaining on the surface of the printing intermediate.

Step d1. Coating an uncured dual curing material as an adhesive layer 230 on the printing intermediate in step b1.

In step d1, when the printing intermediate includes the printing intermediate of the shoe midsole 210 and the printing intermediate of the shoe outsole 220, one of the printing intermediates of the shoe midsole 210 and the printing intermediate of the shoe outsole 220 may be used. The uncured dual-curing material can also be coated with an uncured dual-curing material, and an uncured dual-curing material can also be coated on both the printing intermediate of the shoe midsole 210 and the printed intermediate of the shoe outsole 220. In other embodiments, when the printing intermediate only includes the printing intermediate of the shoe midsole 210, an uncured dual curing material may also be coated on the shoe outsole 220. In still other embodiments, when the printing intermediate only includes the printing intermediate of the shoe outsole 220, an uncured dual curing material may also be coated on the shoe midsole 210.

Step e1. Fit the shoe midsole 210 (or the printed intermediate of the shoe midsole 210) with the shoe outsole 220 (or the printed intermediate of the shoe outsole 220), and maintain the state of the two being stuck together and pass through. The light material irradiates the dual-cured material used as the adhesive layer 230. During the lighting process, the uncured dual-cured material coated in step d1 is photo-cured, and the adhesive layer 230 formed by the dual-cured material is photocured. Contains uncured ingredients;

Step f1. Keep the shoe midsole 210 (or the printed intermediate of the shoe midsole 210) and the shoe outsole 220 (or the printed intermediate of the shoe outsole 220) in a state of being attached to each other, and perform the second curing process, printing the intermediate, and The uncured components in the adhesive layer 230 are bonded to each other after the second curing process to form a shoe sole.

In some embodiments, the shape of each section of the outsole 220 perpendicular to the thickness direction of the outsole 220 has little difference. Therefore, the printing intermediate of the shoe outsole 220 or the shoe outsole 220 can be carried out by light-curing 2D printing. The difference between light-curing 2D printing and light-curing 3D printing is that the light pattern of each layer of light-curing 3D printing is possible It will change. After the printing of one layer is completed, the printed material needs to be pulled away from the molding interface to a certain space before the next layer is printed. Light-curing 2D printing does not need to pull the printed material from the molding interface, and can be directly on the light-curing molding surface One or several cured layers are formed to obtain 3D printed objects. The light-curing 2D printing method is suitable for printing with thinner thickness and larger flat area. The printing method of the shoe outsole 220 may be manufactured by a light curing 3D printing method, or may be manufactured by a light curing 2D printing method. In the same way, the shoe midsole 210 may be prepared by light-curing 3D printing, or may be prepared by light-curing 2D printing.

In some embodiments, the materials used to make prints can include two types of photocurable materials, one is traditional light curing materials (such as light curing resins), and the other is dual curing materials (such as dual curing resins). . Among them, the traditional light-curable resin can be light-cured. After the resin with dual curing mechanism is photocured, it also has a component that is still uncured after the photocuring step, and the uncured component can be further cured in the post-curing step (such as the second curing process) after the photocuring step. .

In some embodiments, the midsole 210, the outsole 220, and the adhesive layer 230 all include dual curing materials, and the method of printing the sole may include the following steps:

Step a2. Design a three-dimensional model of the shoe midsole 210 and a three-dimensional model of the shoe outsole 220, and slice the three-dimensional model of the shoe midsole 210 and the shoe outsole 220 to obtain light pattern data for photocuring printing. The dual-curing material required for light-curing printing is configured, wherein the dual-curing material used for printing the shoe outsole 220 and/or the shoe midsole 210 can transmit light.

In some embodiments, in step a2, the three-dimensional model of the shoe midsole 210 and the three-dimensional model of the shoe outsole 220 may be such that the central part of the shoe outsole 220 can cover the lower surface of the shoe outsole 210, and the shoe outsole 220 The edge portion of the shoe can be bent to cover the side surface of the midsole 210. The dual-curing material used to print the shoe outsole 220 and/or the shoe midsole 210 can transmit light. It can be the dual-cured material used to print the shoe midsole 210. The cured material can transmit light, and it can also be a dual-cured material used to print the outsole 220 and the midsole 210 of the shoe, and both can transmit light.

Step b2. Add the dual curing material to the light curing printing device, import the light pattern data into the light curing printing device, and print the printing intermediate of the shoe midsole 210 and the printing intermediate of the shoe outsole 220 through the light curing printing device. The dual-curing materials all contain uncured components after the photocuring treatment (the uncured components need to be cured by further light, heating, humidification and other conditions).

In some embodiments, the light-curing printing device may include a light-curing 3D printing device and/or a light-curing 2D printing device. In some embodiments, the printing intermediate of the shoe midsole 210 is printed by a light curing 3D printing device, and the printing intermediate of the shoe outsole 220 is printed by a light curing 2D printing device. In some embodiments, the printing intermediate of the shoe outsole 220 is printed by a light curing 3D printing device, and the printing intermediate of the shoe midsole 210 is printed by a light curing 2D printing device. In some embodiments, the printing intermediate of the shoe outsole 220 and the printing intermediate of the shoe midsole 210 are printed by a light curing 3D printing device. In some embodiments, the printing intermediate of the shoe outsole 220 and the printing intermediate of the shoe midsole 210 are printed by a light curing 2D printing device. In some embodiments, the components of the dual curing material included in the midsole 210 and the outsole 220 and the content of each component can be adjusted according to the performance requirements of the midsole 210 and the outsole 220.

Step c2. The printing intermediate (including the printing intermediate of the shoe midsole 210 and the printing intermediate of the shoe outsole 220) in step b is subjected to a cleaning process, which is to remove uncured components on the surface of the printing intermediate.

Step d2. Coating a dual-curing material as the adhesive layer 230 on the upper surface of the printed intermediate of the shoe outsole 220.

In some embodiments, the thickness of the dual curing material as the adhesive layer 230 is 1 mm-5 mm. In some embodiments, the lower surface of the printed intermediate of the shoe midsole 210 may be coated with a dual curing material as the adhesive layer 230. In some embodiments, both the upper surface of the printed intermediate of the shoe outsole 220 and the upper surface of the printed intermediate of the shoe outsole 220 may be coated with a dual curing material as the adhesive layer 230.

Step e2. Attach the printed intermediate of the shoe midsole 210 and the printed intermediate of the shoe outsole 220 to maintain the state that the printed intermediate of the shoe midsole 210 and the printed intermediate of the shoe outsole 220 are attached to each other, and proceed to the first Re-curing treatment to obtain a combined body.

In some embodiments, the printed intermediate of the shoe midsole 210 and the printed intermediate of the shoe outsole 220 are attached to each other, so that the intermediate print of the shoe outsole 220 can cover the bottom and sides of the intermediate print of the shoe midsole 210. In some embodiments, the first re-curing treatment may be to irradiate the dual-curing material as the adhesive layer 230 with light (such as ultraviolet light), and the light may pass through the light-permeable dual-curing material to make the adhesive layer 230 The dual curing material undergoes photocuring, and the adhesive layer 230 contains uncured components after photocuring.

Step f2. Perform a second curing treatment on the combined body to form a shoe sole.

In some embodiments, the uncured components in the printed intermediate of the shoe midsole 210 and the printed intermediate of the shoe outsole 220 and the uncured components contained in the adhesive layer 230 are cured after the second curing process. React to bond to each other. In some embodiments, the second re-curing treatment in step f2 may be heating, the heating time is 6-12 hours, and the heating temperature is 80°C-160°C.

In some embodiments, the midsole 210 and the adhesive layer 230 include a dual curing material, and the outsole 220 includes a single curing material (such as a photocurable resin). Printing shoe soles can follow the steps below:

Step a3. Design the three-dimensional model of the shoe midsole 210 and the three-dimensional model of the shoe outsole 220, and perform slicing processing on the three-dimensional model of the shoe midsole 210 and the shoe outsole 220 respectively to obtain light pattern data for photocuring printing. Two materials required for light-curing printing are respectively configured, and the two materials are dual-curing materials and single-curing materials (such as light-curable resins).

In some embodiments, in step a3, the three-dimensional model of the shoe midsole 210 and the three-dimensional model of the shoe outsole 220 are such that the central part of the shoe outsole 220 can cover the lower surface of the shoe outsole 210. The edge portion can be bent to cover the side surface of the midsole 210. In some embodiments, the single-cured material included in the shoe outsole 220 can transmit light. In other embodiments, the dual curing material included in the shoe midsole 210 can transmit light. In still other embodiments, the single-cured material included in the outsole 220 and the dual-cured material included in the midsole 210 can both transmit light.

Step b3. Add the dual curing material to the light curing printing device, import the light pattern data of the shoe midsole 210 into the light curing printing device, and print out the printing intermediate of the shoe midsole 210; add the single curing material to the light curing In the printing device, the light pattern data of the shoe sole 220 is imported into the light curing printing device to print the shoe sole 220; the printing intermediate of the shoe midsole 210 contains uncured components.

In some embodiments, the light-curing printing device may include a light-curing 3D printing device and/or a light-curing 2D printing device. In some embodiments, the printing intermediate of the shoe midsole 210 is printed by a light curing 3D printing device, and the shoe outsole 220 is printed by a light curing 2D printing device. In some embodiments, the outsole 220 is printed by a light-curing 3D printing device, and the printing intermediate of the midsole 210 is printed by a light-curing 2D printing device. In some embodiments, the printing intermediates of the outsole 220 and the midsole 210 are printed by a light curing 3D printing device. In some embodiments, the printing intermediates of the outsole 220 and the midsole 210 are printed by a light-curing 2D printing device.

Step c3. The printing intermediate of the shoe midsole 210 in step b3 is subjected to a cleaning process, which is to remove the remaining uncured components on the surface thereof.

Step d3. Coating a dual-curing material as the adhesive layer 230 on the upper surface of the shoe outsole 220.

In some embodiments, the thickness of the dual curing material as the adhesive layer 230 is 1 mm-5 mm. In some embodiments, the lower surface of the printed intermediate of the shoe midsole 210 may be coated with a dual curing material as the adhesive layer 230. In some embodiments, both the upper surface of the shoe outsole 220 and the lower surface of the printed intermediate of the shoe midsole 210 may be coated with a dual curing material as the adhesive layer 230.

Step e3. Attach the printed intermediate of the shoe midsole 210 to the shoe outsole 220, maintain the state of the printed intermediate of the shoe midsole 210 and the shoe outsole 220, and perform the first curing process to obtain the assembly .

In some embodiments, the printed intermediate body of the shoe midsole 210 and the shoe outsole 220 fit together, so that the shoe outsole 220 can cover the bottom surface and the side surface of the printed intermediate body of the shoe midsole 210. In some embodiments, the first re-curing treatment may be to irradiate the dual-curing material as the adhesive layer 230 with light (such as ultraviolet light), and the light may pass through the light-transmissive dual-curing material (and/or single-curing). Material) makes the dual curing material of the adhesive layer 230 undergo photocuring, and the adhesive layer 230 contains uncured components after photocuring.

Step f3. Perform a second curing treatment on the combined body to form a shoe sole.

In some embodiments, the uncured component of the printing intermediate of the shoe midsole 210 and the uncured component contained in the adhesive layer 230 undergo a curing reaction after the second curing treatment to bond to each other and at the same time. Shoe outsole 220. In some embodiments, the second re-curing treatment in step f3 may be heating, the heating time is 6-12 hours, and the heating temperature is 80°C-160°C.

In some embodiments, the outsole 220 and the adhesive layer 230 include dual-curing materials, and the midsole 210 includes a single-curable material (such as photocurable resin), and printing the sole can be performed as follows:

Step a4. Design the three-dimensional model of the shoe midsole 210 and the three-dimensional model of the shoe outsole 220, and perform slice processing on the three-dimensional model of the shoe midsole 210 and the shoe outsole 220 respectively to obtain light pattern data for photocuring printing. Two materials required for light-curing printing are respectively configured, and the two materials are dual-curing materials and single-curing materials (such as light-curable resins).

In some embodiments, in step a4, the three-dimensional model of the shoe midsole 210 and the three-dimensional model of the shoe outsole 220 are such that the central part of the shoe outsole 220 can cover the lower surface of the shoe outsole 210. The edge portion can be bent to cover the side surface of the midsole 210. In some embodiments, the single-cured material included in the midsole 210 can transmit light. In other embodiments, the dual curing material included in the shoe outsole 220 can transmit light. In still other embodiments, both the single-cured material included in the midsole 210 and the dual-cured material included in the outsole 220 can transmit light.

Step b4. Add the dual curing material to the light curing printing device, import the light pattern data of the shoe outsole 220 into the light curing printing device, and print out the printing intermediate of the shoe outsole 220; add the single curing material to the light curing device In the printing device, the light pattern data of the shoe midsole 210 is imported into the light curing printing device to print the shoe midsole 210; the printing intermediate of the shoe outsole 220 contains uncured components.

In some embodiments, the light-curing printing device may include a light-curing 3D printing device and/or a light-curing 2D printing device. In some embodiments, the shoe midsole 210 is printed by a light curing 3D printing device, and the printing intermediate of the shoe outsole 220 is printed by a light curing 2D printing device. In some embodiments, the printing intermediate of the outsole 220 is printed by a light-curing 3D printing device, and the midsole 210 is printed by a light-curing 2D printing device. In some embodiments, the printing intermediate of the outsole 220 and the midsole 210 are printed by a light curing 3D printing device. In some embodiments, the printing intermediate of the outsole 220 and the midsole 210 are printed by a light-curing 2D printing device.

Step c4. The printing intermediate of the shoe outsole 220 in step b4 is subjected to a cleaning process, which is to remove the remaining uncured components on the surface thereof.

Step d4. Coating a dual-curing material as the adhesive layer 230 on the upper surface of the printed intermediate of the shoe outsole 220.

In some embodiments, the thickness of the dual curing material as the adhesive layer 230 is 1 mm-5 mm. In some embodiments, the lower surface of the midsole 210 may be coated with a dual-curing material as the adhesive layer 230. In some embodiments, both the upper surface of the printed intermediate of the shoe outsole 220 and the lower surface of the shoe midsole 210 may be coated with a dual curing material as the adhesive layer 230.

Step e4. Bonding the printed intermediates of the shoe midsole 210 and the shoe outsole 220 to maintain the state of being attached to the printed intermediates of the shoe midsole 210 and the shoe outsole 220, and perform the first curing process to obtain a combined body.

In some embodiments, the printed intermediate body of the shoe midsole 210 and the shoe outsole 220 are attached to each other, so that the printed intermediate body of the shoe outsole 220 can cover the bottom and sides of the shoe midsole 210. In some embodiments, the first re-curing treatment may be to irradiate the dual-curing material as the adhesive layer 230 with light (such as ultraviolet light), and the light may pass through the light-transmissive dual-curing material (and/or single-curing). Material) makes the dual curing material of the adhesive layer 230 undergo photocuring, and the adhesive layer 230 contains uncured components after photocuring.

Step f4. Perform a second curing treatment on the combined body to form a shoe sole.

In some embodiments, the uncured component of the printing intermediate of the shoe outsole 220 and the uncured component contained in the adhesive layer 230 undergo a curing reaction after the second curing treatment to bond to each other and at the same time. Shoe midsole 210. In some embodiments, the second re-curing treatment in step f4 may be heating, the heating time is 6-12 hours, and the heating temperature is 80°C-160°C.

In the above three embodiments, the adhesive layer 230 includes a dual-curing material, so in the step of printing shoe soles, the adhesive layer 230 undergoes the first re-curing treatment (such as light) in steps e1, e2, e3, and e4. Curing process), and then in steps f1, f2, f3, and f4, a second re-curing process (such as a thermal curing process) is performed. The adhesive layer 230 formed by the dual-curing material is completely cured and the outsole 220 and the midsole 210 are respectively Gluing.

In some embodiments, the adhesive layer 230 has exactly the same composition as the dual curing material included in at least one of the shoe outsole 220 and the shoe midsole 210, which not only improves the adhesive effect after the second curing treatment. , And can avoid factors such as texture difference, color difference and other factors affecting the overall appearance of the sole, and it is easy to recycle, which is beneficial to environmental protection. In some embodiments, the components of the dual curing material included in the adhesive layer 230, the shoe outsole 220, and the shoe midsole 210 are completely the same, and the dual curing material may be transparent. Since the shoe outsole 220 (and/or the shoe midsole 210) is transparent and has high light transmittance, this not only improves the adhesion effect of the adhesive layer 230 after the first curing treatment (such as light curing), but also makes The overall appearance of the sole is more personalized.

In some embodiments, when the adhesive force is sufficient, the adhesive layer 230 may include a single-curing material, and the curing process of the single-curing material may be the same as the first curing process or the second curing process of the dual curing material. The processing is the same.

In some embodiments, the adhesive layer 230 may be a light-curable resin. In the step of printing the sole, the adhesive layer 230 may be light-cured in steps e1, e2, e3, and e4, and the light-curable resin is completely cured. The adhesive layer 230 is bonded to the outsole 220 and the midsole 210 respectively.

In some embodiments, the adhesive layer 230 may be a thermosetting resin. In the step of printing the sole, the light operation in steps e1, e2, e3, and e4 may be omitted, and the second re-curing process is directly performed, and the light-curing resin The fully cured adhesive layer 230 is respectively adhered to the outsole 220 and the midsole 210.

In some embodiments, the outsole 220 and/or the midsole 210 may be made of a light-transmitting material, and light can be irradiated to the adhesive layer 230 through the light-transmitting material. In some embodiments, the light transmittance of the outsole 220 and/or the midsole 210 made of a light-transmitting material is greater than 20%. In some embodiments, the light transmittance of the outsole 220 and/or the midsole 210 made of a light-transmitting material is greater than 60%. In some embodiments, the light transmittance of the outsole 220 and/or the midsole 210 made of a light-transmitting material is 90%-95%. During the above steps e1, e2, e3, and e4, light (such as ultraviolet light) may be used to irradiate the dual curing material as the adhesive layer 230 for 5s-10s. In some embodiments, if the light transmittance of the shoe outsole 220 and/or the shoe midsole 210 made of light-transmitting material is low, the light time can be appropriately increased (such as 15s, 20s, etc.), so that it can be used as a sticky material. The dual curing material of the laminated layer 230 can be fully photocured.

In some embodiments, in the above steps e1, e2, e3, and e4, the outsole 220 and the midsole 210 can be kept in contact with each other during the second curing process through a mold. In some embodiments, the mold can be provided with grooves that match the shape and size of the shoe sole (such as shoe outsole 220, shoe midsole 210). In steps d1, d2, d3, and d4, the shoe can be large After the sole 220 and the shoe midsole 210 are fitted together, they are fitted into the groove together, and then the shoe outsole 220 and the shoe midsole 210 placed in the mold are subjected to a second curing process together.

In some embodiments, in the above steps e1, e2, e3, and e4, the first re-curing treatment (light curing) can be implemented by an ultraviolet light box. The irradiation time of photocuring can be 5s-15s.

In some embodiments, in the above steps f1, f2, f3, and f4, the second re-curing treatment may include one or more operations such as heating, radiation, humidification, etc., which may be specifically based on the non-photocuring group in the dual-curing material. The characteristics of the parts to choose the specific operation of the second curing treatment.

In some embodiments, the dual cure material includes acrylate, benzophenone (photoinitiator), and thermoplastic polyurethane elastomer rubber (TPU). In some embodiments, for this kind of dual curing material, the operation of the second curing treatment may be heating (ie, thermal curing treatment). In some embodiments, the heating time may be 6-12 hours. In some embodiments, the heating temperature may be 80°C-160°C.

In some embodiments, in the steps c1, c2, c3, and c4, the cleaning process may include using a centrifuge, a spin dryer, or the like to remove uncured components on the surface of the printing intermediate.

In some embodiments, when the print is a pillow, the pillow can be printed according to the following steps: based on a dual curing material, using a first curing process (such as a light curing process) to print out the first part 110 of the pillow; based on a dual curing material , Use the second curing process (such as light curing process) to print out the second part 120 of the pillow; apply an adhesive layer 130 where the first part 110 and the second part 120 are attached, and connect the first part 110 to the second part 120 The two parts 120 are bonded together; the adhesive layer 130 is irradiated with light through the hollow structure (such as using an ultraviolet lamp), so that the adhesive layer 130 is initially cured (including uncured components); the bonded first part 110 Perform a second re-curing treatment with the second part 120 (for example, put it in an oven for thermal curing treatment), so that the first part 110 and the second part 120 are connected stably to obtain a pillow. In some embodiments, the bonded first part 110 and the second part 120 may be put into a mold, and then the first part 110 and the second part 120 in the mold may be put into an oven for thermal curing. In some embodiments, the first part 110 may be located above the second part 120 so that the first part 110 and the second part 120 can be adhered more closely under the gravity of the first part 110. In some embodiments, the temperature of the thermal curing treatment may be 120° C., and the time of the thermal curing treatment may be 8 hours.

The basic concepts have been described above. Obviously, for those skilled in the art, the above detailed disclosure is only an example, and does not constitute a limitation to the application. Although it is not explicitly stated here, those skilled in the art may make various modifications, improvements and amendments to this application. Such modifications, improvements, and corrections are suggested in this application, so such modifications, improvements, and corrections still belong to the spirit and scope of the exemplary embodiments of this application.

At the same time, this application uses specific words to describe the embodiments of the application. For example, "one embodiment", "an embodiment", and/or "some embodiments" mean a certain feature, structure, or characteristic related to at least one embodiment of the present application. Therefore, it should be emphasized and noted that “one embodiment” or “one embodiment” or “an alternative embodiment” mentioned twice or more in different positions in this specification does not necessarily refer to the same embodiment. . In addition, some features, structures, or characteristics in one or more embodiments of the present application can be appropriately combined.

In addition, unless explicitly stated in the claims, the order of processing elements and sequences, the use of numbers and letters, or the use of other names in this application are not used to limit the order of the procedures and methods of this application. Although the foregoing disclosure uses various examples to discuss some embodiments of the invention that are currently considered useful, it should be understood that such details are only for illustrative purposes, and the appended claims are not limited to the disclosed embodiments. On the contrary, the rights The requirements are intended to cover all modifications and equivalent combinations that conform to the essence and scope of the embodiments of the present application. For example, although the system components described above can be implemented by hardware devices, they can also be implemented only by software solutions, such as installing the described system on an existing server or mobile device.

For the same reason, it should be noted that, in order to simplify the expression disclosed in this application and help the understanding of one or more embodiments of the invention, in the foregoing description of the embodiments of this application, multiple features are sometimes combined into one embodiment. In the drawings or its description. However, this method of disclosure does not mean that the subject of the application requires more features than those mentioned in the claims. In fact, the features of the embodiment are less than all the features of the single embodiment disclosed above.

In some embodiments, numbers describing the number of ingredients and attributes are used. It should be understood that such numbers used in the description of the embodiments use the modifier "about", "approximately" or "substantially" in some examples. Retouch. Unless otherwise stated, "approximately", "approximately" or "substantially" indicate that the number is allowed to vary by ±20%. Correspondingly, in some embodiments, the numerical parameters used in the description and claims are approximate values, and the approximate values can be changed according to the required characteristics of individual embodiments. In some embodiments, the numerical parameter should consider the prescribed effective digits and adopt the method of general digit retention. Although the numerical ranges and parameters used to confirm the breadth of the ranges in some embodiments of the present application are approximate values, in specific embodiments, the setting of such numerical values is as accurate as possible within the feasible range.

For each patent, patent application, patent application publication and other materials cited in this application, such as articles, books, specifications, publications, documents, etc., the entire contents are hereby incorporated into this application as a reference. The application history documents that are inconsistent or conflicting with the content of this application are excluded, and documents that restrict the broadest scope of the claims of this application (currently or later attached to this application) are also excluded. It should be noted that if there is any inconsistency or conflict between the description, definition, and/or use of terms in the attached materials of this application and the content of this application, the description, definition and/or use of terms in this application shall prevail .

Finally, it should be understood that the embodiments described in this application are only used to illustrate the principles of the embodiments of this application. Other variations may also fall within the scope of this application. Therefore, as an example and not a limitation, the alternative configuration of the embodiment of the present application can be regarded as consistent with the teaching of the present application. Accordingly, the embodiments of the present application are not limited to the embodiments explicitly introduced and described in the present application.

Claims

A print, characterized by comprising a first part, a second part, and an adhesive layer located between the first part and the second part;

At least one of the first part, the second part, and the adhesive layer includes a dual curing material.
The print of claim 1, wherein the first part and the adhesive layer both comprise a dual-curing material; the dual-curing material included in the adhesive layer is composed of a dual-curing material component and the first part. The components of the included dual-curing materials are at least partially the same;

Alternatively, both the second part and the adhesive layer include dual curing materials, and the dual curing material components included in the adhesive layer and the dual curing material components included in the second part are at least partially same.
The print according to claim 1, wherein the first part, the second part and the adhesive layer all comprise a dual-curing material, and the adhesive layer includes a dual-curing material component The components of the dual curing material included in the first part and the components of the dual curing material included in the second part are at least partially the same.
The print according to claim 1, wherein the first part and the second part both comprise a dual-curing material, and the components of the dual-curing material contained in the first part are the same as those contained in the second part. The components of the dual cure material are at least partially the same.
5. The print of claim 1, wherein the rigidity of the first part is different from the rigidity of the second part.
5. The print according to claim 1, wherein the light transmittance of the first part and/or the second part is greater than 20%.
8. The print according to claim 6, wherein the first part and/or the second part comprises a light-transmitting material; or, the first part and/or the second part comprises a hollow structure.
The print according to claim 1, wherein the thickness of the adhesive layer in a cured state is 1mm-5mm.
The print according to claim 1, wherein the first part comprises a shoe midsole, and the second part comprises a shoe outsole; the lower surface of the shoe midsole and the upper surface of the shoe outsole Connected; the adhesive layer is located between the lower surface of the shoe midsole and the upper surface of the shoe outsole.
5. The print according to claim 1, wherein the first part includes a midsole, and the second part includes a reinforcement, and the rigidity of the reinforcement is greater than the rigidity of the midsole;

The reinforcement is embedded in the midsole, or the reinforcement is provided on the surface of the midsole.
9. The print of claim 10, wherein the stiffness of the reinforcing member is 5% to 300% greater than the stiffness of the bottom of the shoe.
9. The print of claim 10, wherein the reinforcement includes a dual curing material and a fiber material.
The print according to claim 10, wherein the shoe midsole comprises a forefoot, an arch and a heel which are arranged in sequence from front to back, and the reinforcement is provided on the forefoot, At least one of the arch part and the heel part.
9. The printed article according to claim 10, wherein the thickness of the reinforcing member after curing is 0.05mm-2mm.
The print according to claim 13, wherein the forefoot portion, the arch portion and/or the heel portion are provided with mounting grooves, and the mounting grooves are used for mounting the reinforcement Pieces.
11. The print according to claim 10, wherein the line connecting the center of gravity of the reinforcing member and the center of gravity of the shoe midsole is parallel to the thickness direction of the shoe midsole.
10. The print according to claim 10, wherein the reinforcing member comprises a plurality of through holes, and each of the through holes penetrates the reinforcing member along the thickness direction of the shoe midsole.
15. The print of claim 13, wherein the reinforcing member comprises a supporting part and a side wing part connected to the supporting part;

The supporting portion is provided on the upper surface or the lower surface of the shoe midsole, the side wing portion and the side edge of the shoe midsole.
The print according to claim 18, wherein the supporting part is located on the upper surface or the lower surface of the arch part.
The print according to claim 13, wherein the reinforcing member includes an upper top portion, a lower bottom portion and a connecting portion, and one end of the upper top portion and one end of the lower bottom portion are connected by the connecting portion; At least one of the upper top part, the lower bottom part and the connecting part is connected with the shoe midsole.
22. The print according to claim 20, wherein the upper top portion, the lower bottom portion and the connecting portion are all embedded in the heel portion.
22. The print of claim 21, wherein the connecting portion is located at the front end of the heel portion, the upper top portion is located at the upper end of the heel portion, and the lower bottom portion is located at the lower end of the heel portion.
The print of claim 20, wherein:

The reinforcing member further includes an extension part;

The extension part is located on the upper surface or the lower surface of the arch part; or the extension part is embedded in the arch part.
The print according to claim 13, wherein the reinforcing member comprises a first arc-shaped part and a second arc-shaped part, and the first arc-shaped part and the second arc-shaped part are respectively embedded in the The left and right sides of the heel part, and the inner arc surface of the first arc-shaped part and the inner arc surface of the second arc-shaped part are arranged opposite to each other.
5. The print of claim 1, wherein the print includes a pillow.
A method for printing a print, which is characterized in that it comprises the following steps:

Provide at least one of the first part and the second part;

Providing an adhesive layer on the first part and/or the second part;

The first part and/or the second part and the adhesive layer are cured.
The printing method according to claim 26, wherein said providing at least one of the first part and the second part comprises:

At least one of the first part and the second part is produced through a first re-curing process in a dual-curing molding manner.
27. The printing method according to claim 27, wherein the first recuring process of the dual curing process to produce at least one of the first part and the second part comprises:

The first part and the second part are produced by a first heavy curing process in a dual curing molding manner.
27. The printing method of claim 27, wherein the first recuring process in a dual curing molding method is used to produce at least one of the first part and the second part, comprising:

One of the first part and the second part is made by a first re-curing process in a dual-curing molding method, and the other of the first part and the second part is made by using other printing methods.
The printing method according to claim 26, wherein said providing at least one of the first part and the second part comprises: making the first part and the second part by other printing methods;

The curing treatment of the first part and/or the second part and the adhesive layer includes: performing a dual curing molding method on the adhesive layer and the first part and the second part Curing treatment to realize the connection of the first part and the second part.
The printing method according to claim 26, wherein said providing at least one of the first part and the second part comprises:

Based on the dual-curing material, one of the first part and the second part is made using a first-recuring treatment; wherein a part of the components of the dual-curing material can be cured after the first-recuring treatment;

Making the other of the first part and the second part;

The curing treatment of the first part and/or the second part and the adhesive layer includes:

Attaching the first part and the second part to obtain a combined body;

The combination is subjected to a second re-curing treatment to obtain a printed article; wherein, another part of the dual-curing material can be cured after the second re-curing treatment.
The printing method according to claim 31, wherein said making the other of said first part and said second part comprises:

Based on the dual-curing material, the other of the first part and the second part is made using a first double-curing treatment operation.
The printing method according to claim 31, wherein the first re-curing treatment operation includes a photo-curing treatment.
The printing method according to claim 31, wherein the second re-curing treatment includes any one of a thermal curing treatment, a light curing treatment, and a moisture curing treatment.
The printing method according to claim 34, wherein the thermal curing temperature is 80°C-160°C.
The printing method of claim 35, wherein the adhesive layer comprises a dual curing material.
36. The printing method of claim 36, wherein the affixing the first part and the second part to obtain a combined body comprises:

Attaching the first part to the second part;

The first part and the second part after being bonded are subjected to a first recuring treatment to cure a part of the components of the adhesive layer to obtain an assembly.
The printing method according to claim 37, wherein the first part and/or the second part comprises a light-transmitting structure; or, the first part and/or the second part comprises a hollow structure;

The first part and the second part after being bonded are subjected to a first re-curing treatment to cure a part of the components of the adhesive layer, including:

The adhesive layer is irradiated with light through the light-transmitting structure or the hollow structure, so that a part of the components of the adhesive layer is cured.
The printing method according to claim 31, wherein the second re-curing process of the combined body comprises:

The combined body is put into a mold, and the combined body placed in the mold is subjected to a second re-curing treatment.