WO2021224548A1 - Procédé de fabrication d'un appareil électronique et appareil électronique - Google Patents

Procédé de fabrication d'un appareil électronique et appareil électronique Download PDF

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Publication number
WO2021224548A1
WO2021224548A1 PCT/FI2021/050327 FI2021050327W WO2021224548A1 WO 2021224548 A1 WO2021224548 A1 WO 2021224548A1 FI 2021050327 W FI2021050327 W FI 2021050327W WO 2021224548 A1 WO2021224548 A1 WO 2021224548A1
Authority
WO
WIPO (PCT)
Prior art keywords
flexible film
circuit
electronic apparatus
printed
layer
Prior art date
Application number
PCT/FI2021/050327
Other languages
English (en)
Inventor
Terho Kololuoma
Mikko HIETALA
Tuomas HAPPONEN
Original Assignee
Teknologian Tutkimuskeskus Vtt Oy
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Teknologian Tutkimuskeskus Vtt Oy filed Critical Teknologian Tutkimuskeskus Vtt Oy
Publication of WO2021224548A1 publication Critical patent/WO2021224548A1/fr

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4697—Manufacturing multilayer circuits having cavities, e.g. for mounting components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
    • H05K3/4635—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating flexible circuit boards using additional insulating adhesive materials between the boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
    • H05K1/186—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit manufactured by mounting on or connecting to patterned circuits before or during embedding
    • H05K1/187—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit manufactured by mounting on or connecting to patterned circuits before or during embedding the patterned circuits being prefabricated circuits, which are not yet attached to a permanent insulating substrate, e.g. on a temporary carrier
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/063—Lamination of preperforated insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1545—Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path

Definitions

  • the present disclosure relates to printed electronics, and more particularly to a method and an apparatus using printed and assembled components for a functional circuit assembly.
  • printed electronics is used herein to refer to processes where electronic components, systems or devices are created by patterning conductive traces as well as required passive and active electronic components directly on a suitable substrate.
  • Printed electronics is a rapidly growing technology and is becoming invaluable to several industries including healthcare, aerospace, media, and transit.
  • An interesting branch of printed electronics is hybrid integrated electronics where discrete electronic components are assembled on printed electronic circuitry. A challenge is, however, that due to abrading forces, mechanical reliability of the discrete components in printed hybrid systems is not yet adequate.
  • the overmolding stage indeed protects the functional circuitry but is a stop and go process with tens of seconds stroke time, which is quite unsuitable for a running web. Also, the area of the system to be overmolded is limited.
  • An object of the present disclosure is to provide a method and a structure for an apparatus manufactured by that method so as to improve yield of hybrid integrated systems that are robust against abrasion and exposure to chemical substances.
  • the disclosure is based on the idea of creating the electronic apparatus as a laminate, that includes three layers.
  • a middle layer in the composite system is a perforated film, holes of which are adjusted to incorporate the discrete components that protrude from the printed circuit structure and would otherwise be subjected to abrasive forces.
  • the outer layers close the holes and provide a protective member over printed and assembled elements of the electronic apparatus.
  • An advantage of the method and apparatus of the disclosure is that electrically active parts of the functional circuitry of the electronic apparatus are nested within protective materials of the three flexible films, and the structure is thus very robust against mechanical impacts and chemical substances.
  • the structure can be manufactured in consecutive and/or parallel roll-to-roll compliant processes, which means that a significantly improved throughput can be achieved with the disclosed method.
  • the flow chart of Figure 1 illustrates stages of an exemplary method for manufacturing an electronic apparatus
  • Figure 2 shows a schematic representation of an exemplary implementation of the method of Figure 1 in a roll-to-roll process
  • Figure 3A shows a top view of a multiple-layer composite film and Figure 3B shows a side view of the composite taken along line A-A of figure 3A.
  • the flow chart of Figure 1 illustrates stages of an exemplary method for manufacturing an electronic apparatus.
  • the term electronic apparatus refers here to a device that includes one or more physical components arranged to control and direct an electric current in a predefined manner.
  • the disclosed method begins by printing a circuit structure on a first flexible film of electrically insulating or dielectric material (stage 100).
  • the first flexible film refers herein to a layer of insulating or dielectric material that forms a substrate, a base material for one side of the thin printed circuit structure.
  • elasticity of the insulating or dielectric material is selected so that in the selected layer thickness, the flexible film forms a body that can elastically deform under an applied force and then return to its original size and shape when said force is removed.
  • the flexibility is adjusted to enable using the film in roll-to-roll processes wherein flexible material is continuously rolled from a reel, processed, and after the process re-reeled in or forward.
  • Substrate layer thicknesses in printed electronics typically vary between 25 to 250 millimetres.
  • Applicable layer materials include, for example, plastics (basically polymers such as polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polycarbonate (PC), polyimide (PI), thermoplastic polyurethane (TPU)), papers (coated and uncoated) fabrics, or other material configurations that provide the required elasticity for roll-to-roll processing and resistivity of the order of 10 10 Witi or more, advantageously of the order of 10 15 Witi to 10 15 Witi.
  • plastics basic polymers such as polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polycarbonate (PC), polyimide (PI), thermoplastic polyurethane (TPU)
  • papers coated and uncoated
  • Printing of the circuit structure refers to creating patterns of material on the first flexible film by means of printing equipment such as screen printing, flexography, gravure, offset lithography, and inkjet, or some other deposition method that enables deposition of solution-based materials into predefined patterns on a surface.
  • the printed circuit structures may include one or more material layers applied successively on top of each other to form organic semiconductors, inorganic semiconductors, metallic conductors, nanoparticles, and nanotubes, for example. When a selected printing method is used in roll-to-roll processing, very high volumes of low-cost components can be produced.
  • the next stage relates to the concept of printed hybrid systems, where a first circuit assembly is created by assembling one or more circuit components to predefined positions of the printed circuit structure (stage 102).
  • Circuit components refer herein to electrical components, like chips or surface mounted devices that can be attached to physical contact with the printed circuit structure so that the joint operation of the printed circuit structure and the assembled components implements a common function.
  • the printed circuit structure forms a pattern that defines routes for electric currents of the electronic apparatus, and when assembled into electrical contact in predefined positions of the printed circuit structure, the circuit components become functional parts of the first circuit assembly thereby created.
  • Examples of circuit assemblies, which can be produced as printed hybrid systems include LED foils, sensor arrays, energy-harvesting modules and wireless communication systems.
  • a second flexible film is attached on the first flexible film (104).
  • This second flexible film includes perforations that match with the predefined positions of the circuit components of the first circuit assembly. This means that after the attachment, the circuit components of the first circuit assembly are incorporated in the perforations of the second flexible film. It is clear that the design of the functional circuit assembly is accurately known so that perforations can be made to the second flexible film in a separate process so that after an initial alignment, the first flexible film and the second flexible film can be attached to each other also in a roll-to-roll process. The perforation can also be made in a roll-to-roll process. Attachment between the first flexible film and the second flexible film can apply various different methods suitable for fastening at least partially compliant surfaces to each other. For example, heat seal layers, extrusion coatings, pressure sensitive adhesives, UV coating, etc. can be used to provide required binding between the two films.
  • the thickness of the second flexible film is adjusted to be greater than the height of the highest circuit component in the first circuit assembly, so that all circuit components are fully protected inside the material of the second flexible film.
  • a third flexible film of insulating or dielectric material is attached on the second flexible film (stage 106).
  • the third flexible film covers and thus closes the perforations and creates a continuous protective membrane against direct mechanical impacts and exposure to chemical substances.
  • the third flexible film may be of the same material or of some other material than the first flexible film and the method of attachment to the second flexible film can be the same as or different than the one used with the first flexible film.
  • Elasticity of the insulating or dielectric materials of each of the three flexible films is selected so that flexibility of the package enables rolling the package with reels of roll-to-roll processes.
  • a film layer outermost on the reel (typically the third flexible film) is configured to be more resilient to stretching deformations than the inner film layers.
  • the first flexible film may be of PET and the third flexible film, which becomes the outermost film layer may be of TPU.
  • the attachment of the second flexible film to the first flexible film and the attachment of the third flexible film to the other side of the second flexible film can be done in separate process steps or all three layers can be attached together in one shared process step. Notwithstanding these variations, the resulting element is, however, a multiple-layer composite element including the layer of the first flexible film, the layer of the third flexible film and the layer of the second flexible film between them, and the first circuit assembly nested within the layers, as described above.
  • the second flexible film is a pressure sensitive adhesive tape, like a commercially available acrylic foam tape (e.g. VHBTM of 3M) typically used for bonding painted and unpainted, metals, higher surface energy plastics and glass.
  • the pressure sensitive adhesive tape can be used provide a bonding layer that activates under pressure between the first flexible film and the third flexible film and attaches the structural layer into a tight laminate composite.
  • Figure 2 shows a schematic representation of an exemplary implementation of the method of Figure 1 in a roll-to-roll process. This example is based on use of adhesive film and a two-staged attachment process but, as already stated, other layer materials and process stage variations are included in the scope of the claims.
  • the lowest line illustrates progress of the first flexible film, the arrows 100, 102 representing the printing and assembling process stages of Figure 1 , continuously repeated for each successive circuit assembly of a manufactured electronic apparatus.
  • the second line illustrates progress of the second flexible film
  • the arrow 200 illustrates a stage of perforating the second flexible film to comply with the pattern of the circuit assemblies so that when the first flexible film and the second flexible film are attached together, the circuit components of the circuit assembly fit into the perforated holes in the second flexible film and remain protected within the walls of the perforated holes.
  • the half-arrow illustrates a stage of removing a protective film from the adhesive surface of pressure sensitive adhesive tape, applied if such removable film is necessary to enable reeling of the adhesive tape before its attachment to the first flexible film.
  • the arrow 104 illustrates the first attachment process stage of Figure 1. In Figure 2, the arrow 104 is shown separately, but the attachment can be implemented by pressing the films against each other by means of the opposite rotating reels, as well. Such two opposite transferring reels of the roll-to-roll process can then provide a pressure that is adequate to induce the adhesive effect of the adhesive tape.
  • the third line illustrates progress of the third flexible film
  • the arrow 106 represents the second attachment stage of Figure 1.
  • the attachment can be implemented by pressing the films against each other by means of the opposite rotating reels, as well.
  • Arrow 202 illustrates a further process stage where successive electronic apparatuses are physically separated from each other. Such singulation of devices can be done by, for example, lasering (outline cutting) or die-cutting (mechanical tool).
  • Figure 3A shows a top view of a multiple-layer composite film before the device singulation in stage 202 of Figure 2.
  • the film is in a form of a roll-to-roll process enabling web and boundaries to be cut to separate electronic apparatuses from each other are shown with dashed lines.
  • An exemplary circuit assembly 300 inside the laminated structure is also shown with dashed lines.
  • the circuit assembly is as far as possible securely closed within the tightly fastened protective layers. However, it is often necessary to provide an interface that extends to a boundary of the electronic apparatus, or even beyond it, to provide outside access for input/output for the function of the electronic apparatus.
  • Figure 3B shows a side view of the composite film taken along line A-A of figure 3A.
  • Figure 3B illustrates an example structure for a laminated electronic apparatus produced by means of the method described in Figure 1.
  • the structure includes a first layer 310 that includes a first flexible film of electrically insulating or dielectric material.
  • the structure includes also a second layer 312, which includes a circuit assembly 318, 320 and a second flexible film 316 of insulating or dielectric material.
  • the circuit assembly includes a printed circuit structure 318 printed on the first flexible layer 310, and one or more circuit components 320 assembled on the printed circuit structure 318.
  • the circuit components 320 are incorporated in perforated holes 322 of the second flexible film 316.
  • the structure includes also a third layer 314 that includes a third flexible film of electrically insulating or dielectric material.
  • the third flexible film of the third layer 314 is attached to the second flexible film 316 and creates a protective member that closes the structure from one side of the second layer 312.
  • the first flexible film of the first layer 310 does the same in the other side so that the circuit components 320 of the circuit assembly remain protected from abrasive forces and harmful chemical substances from outside.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)

Abstract

La divulgation concerne un procédé de fabrication d'un appareil électronique comprenant une première couche (310) comprenant un premier film souple d'un matériau électriquement isolant ou diélectrique ; une deuxième couche (312) comprenant un ensemble circuit (318, 320) comprenant une structure de circuit imprimé (318) imprimée sur le premier film souple, des composants de circuit (320) assemblés sur la structure de circuit imprimé et un deuxième film souple (316) d'un matériau isolant ou diélectrique, les composants de circuit étant incorporés dans des trous perforés (322) du deuxième film souple ; et une troisième couche (314) comprenant un troisième film souple de matériau électriquement isolant ou diélectrique.
PCT/FI2021/050327 2020-05-04 2021-05-03 Procédé de fabrication d'un appareil électronique et appareil électronique WO2021224548A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FI20205451A FI20205451A (fi) 2020-05-04 2020-05-04 Menetelmä elektronisen laitteen valmistamiseksi ja elektroninen laite
FI20205451 2020-05-04

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WO2021224548A1 true WO2021224548A1 (fr) 2021-11-11

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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5433819A (en) * 1993-05-26 1995-07-18 Pressac, Inc. Method of making circuit boards
EP0929208A2 (fr) * 1998-01-13 1999-07-14 Ford Motor Company Assemblage de circuits flexibles chimiquement gravés ayant des couches conductrices multiples et son procédé de fabrication
WO2015064549A1 (fr) * 2013-10-28 2015-05-07 住友電気工業株式会社 Câble plat et procédé de fabrication associé

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5433819A (en) * 1993-05-26 1995-07-18 Pressac, Inc. Method of making circuit boards
EP0929208A2 (fr) * 1998-01-13 1999-07-14 Ford Motor Company Assemblage de circuits flexibles chimiquement gravés ayant des couches conductrices multiples et son procédé de fabrication
WO2015064549A1 (fr) * 2013-10-28 2015-05-07 住友電気工業株式会社 Câble plat et procédé de fabrication associé

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
NANOSENSORS, BIOSENSORS, AND INFO-TECH SENSORS AND SYSTEMS, vol. 2012, March 2012 (2012-03-01), pages 83440G
PENTTI KARIOJA ET AL.: "Printed hybrid systems", PROC. SPIE, vol. 8344

Also Published As

Publication number Publication date
FI20205451A1 (en) 2021-11-05
FI20205451A (fi) 2021-11-05

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