WO2021223209A1

WO2021223209A1 - Circuit board, camera module and electronic device

Info

Publication number: WO2021223209A1
Application number: PCT/CN2020/089146
Authority: WO
Inventors: 黄日荣
Original assignee: 欧菲影像技术（广州）有限公司
Priority date: 2020-05-08
Filing date: 2020-05-08
Publication date: 2021-11-11

Abstract

A circuit board (1), comprising: a first printed circuit board (11), which has a bearing surface (111) and a mounting surface (112) arranged opposite each other, and a first through hole (115) penetrating through the bearing surface (111) to the mounting surface (112), wherein a first bonding pad (113) and a second bonding pad (114) are arranged on the mounting surface (112), and the first bonding pad (113) is electrically connected to the second bonding pad (114); and a second printed circuit board (12), which has a connecting surface (121) and a bottom surface (122) arranged opposite each other, and a second through hole (126) penetrating through the connecting surface (121) to the bottom surface (122), wherein the connecting surface (121) is connected to the mounting surface (112), a third bonding pad (123) is arranged on the connecting surface (121), the third bonding pad (123) is electrically connected to the first bonding pad (113), and a fourth bonding pad (124) electrically connected to the third bonding pad (123) is arranged on the bottom surface (122), and the second through hole (126) is in communication with the first through hole (115), and the second bonding pad (114) is exposed from the second through hole (126), so as to be electrically connected to a photosensitive chip (2).

Description

Circuit board, camera module and electronic equipment

Technical field

The present invention relates to the technical field of cameras, in particular to a circuit board, a camera module and electronic equipment.

Background technique

The camera module usually includes a circuit board and a photosensitive chip arranged on the circuit board. During assembly, the photosensitive chip can be arranged on the circuit board in a flip-chip manner, that is, a step hole penetrating the circuit board is provided on the circuit board, and the photosensitive chip is installed On the stepped surface of the stepped hole, the stepped surface of the stepped hole is provided with a first pad, the photosensitive surface of the photosensitive chip is provided with a second pad, the photosensitive surface is connected to the stepped surface, and the first pad is connected to the second pad. The two pads are electrically connected.

Although printed circuit board manufacturers in the market can prepare stepped holes on the printed circuit board by etching or other methods, it is difficult to prepare the first pad on the stepped surface of the stepped hole. Therefore, the existing methods used to realize the flip chip of the photosensitive chip The circuit boards are made of HTCC (HTCC is the abbreviation of High-Temperature Co-fired Ceramic, and the Chinese name is High-Temperature Co-fired Ceramic) substrates prepared by a sintering process. However, the price of the HTCC substrate is very expensive, which restricts the popularization of the photosensitive chip flip-chip assembly technology in the camera module industry.

Summary of the invention

Based on this, it is necessary to provide a circuit board, a camera module, and an electronic device for the problem that the flip-chip assembly technology of the photosensitive chip cannot be widely used in the camera module industry because the HTCC substrate is very expensive.

A circuit board is used to electrically connect with the photosensitive chip of a camera module. The circuit board includes: a first printed circuit board having a carrying surface and a mounting surface arranged opposite to each other, and a first printed circuit board is provided on the mounting surface. A pad and a second pad, the first pad and the second pad are electrically connected; the first printed circuit board is also provided with a first through hole, and the first through hole is formed by the The carrying surface penetrates to the mounting surface; the second printed circuit board is arranged on the mounting surface, the second printed circuit board has a connecting surface and a bottom surface arranged opposite to each other, and the connecting surface is opposite to the mounting surface The connection surface is provided with a third pad, the third pad is electrically connected to the first pad, the bottom surface is provided with a fourth pad, the fourth pad and the The third pad is electrically connected; wherein, the second printed circuit board is further provided with a second through hole, the second through hole penetrates from the connection surface to the bottom surface, and the second through hole Communicating with the first through hole; the second pad is exposed from the second through hole so as to be electrically connected to the photosensitive chip.

In the prior art, the reasons for the high cost of using HTCC substrates are mainly due to the following factors: 1. The HTCC substrate sintering manufacturing process is complex, and molds must be designed and manufactured first, and the mold design and manufacturing cycle is not only very long (3-4 Months), and the mold costs are particularly expensive; 2. HTCC substrate manufacturing cycle is also very long, each batch of substrate interaction cycle takes at least 1-2 months, because the new product development phase requires the delivery period of the camera module samples Within 1-2 months, it is difficult to meet this fast-paced demand with HTCC substrates. In the present invention, the circuit board is assembled by the first printed circuit board and the second printed circuit board, which is actually still a printed circuit board, so the arrangement of this embodiment can be realized by a printed circuit board. Flip chip assembly of photosensitive chip. In addition, the production of printed circuit boards does not require mold molding, has a short production cycle and low cost, which is conducive to the popular use of the photosensitive chip flip-chip assembly technology in the camera module industry.

A camera module includes: a circuit board, the circuit board is as described above; a photosensitive chip, the photosensitive chip is arranged on the mounting surface and is located in the second through hole, wherein the photosensitive chip The photosensitive surface is connected to the mounting surface, a fifth pad is provided on the photosensitive surface, and the fifth pad is electrically connected to the second pad.

An electronic device includes the above-mentioned camera module.

The details of one or more embodiments of the present invention are set forth in the following drawings and description. Other features, objects and advantages of the present invention will become apparent from the description, drawings and claims.

Description of the drawings

In order to better describe and illustrate the embodiments and/or examples of those inventions disclosed herein, one or more drawings may be referred to. The additional details or examples used to describe the drawings should not be considered as limiting the scope of any of the disclosed inventions, the currently described embodiments and/or examples, and the best mode of these inventions currently understood.

1 is a schematic diagram of a cross-sectional structure of a camera module provided by a first embodiment of the present invention;

Fig. 2 is a partial enlarged schematic diagram of area A in Fig. 1;

3 is a schematic diagram of the circuit board structure of the camera module provided by the second embodiment of the present invention;

Fig. 4 is a partial enlarged schematic diagram of area B in Fig. 3;

5 is a schematic diagram of the structure of the circuit board of the camera module provided by the third embodiment of the present invention;

Fig. 6 is a partial enlarged schematic diagram of area C in Fig. 5;

7 is a schematic front view of the mounting surface of the first printed circuit board provided by the third embodiment of the present invention;

8 is a schematic front view of the connecting surface of the second printed circuit board provided by the third embodiment of the present invention;

9 is a schematic front view of the bottom surface of the second printed circuit board provided by the third embodiment of the present invention.

Detailed ways

In order to make the above-mentioned objects, features and advantages of the present invention more obvious and understandable, the specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings. In the following description, many specific details are explained in order to fully understand the present invention. However, the present invention can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without departing from the connotation of the present invention. Therefore, the present invention is not limited by the specific implementation disclosed below.

It should be noted that when an element is referred to as being "fixed to" another element, it can be directly on the other element or a central element may also be present. When an element is considered to be "connected" to another element, it can be directly connected to the other element or an intermediate element may be present at the same time.

Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the technical field of the present invention. The terms used in the specification of the present invention herein are only for the purpose of describing specific embodiments, and are not intended to limit the present invention.

As shown in FIG. 1, in this embodiment, the camera module 100 includes a circuit board 1, a photosensitive chip 2 and a lens module 3. In this embodiment, the photosensitive chip 2 and the lens module 3 are both arranged on the circuit board 1, and in the optical axis direction of the lens module 3, the lens module 3, the circuit board 1 and the photosensitive chip 2 are arranged in sequence. In addition, the photosensitive chip 2 is opposite to the lens module 3 and is used to receive light projected from the lens module 3 for imaging. In this embodiment, the substrate 1 has an object side 1a and an image side 1b arranged opposite to each other, and a receiving cavity 1c penetrating from the object side 1a to the image side 1b, the photosensitive chip 2 is arranged in the receiving cavity 1c, and the lens module 3 is arranged On the object side 1a, the light projected from the lens module 3 first enters the accommodating cavity 1c, and then propagates to the photosensitive chip 2.

As shown in Figure 1, in this embodiment, the circuit board 1 includes a first printed circuit board 11 and a second printed circuit board 12, the first printed circuit board 11 and the second printed circuit board 12 are stacked, and the two are electrically Sexually connected together.

As shown in FIG. 1, the first printed circuit board 11 has a carrying surface 111 and a mounting surface 112 opposite to each other. The carrying surface 111 is the object side 1 a of the substrate 1, and the second printed circuit board 12 is arranged on the mounting surface 112. In addition, a first pad 113 and a second pad 114 are provided on the mounting surface 112, the first pad 113 and the second pad 114 are spaced apart on the mounting surface 112, and the first pad 113 and the second pad 114 It is electrically connected, where the first pad 113 and the second pad 114 can be electrically connected by copper leads or the like provided on the mounting surface 112. In addition, the first printed circuit board 11 is further provided with a first through hole 115, and the first through hole 115 penetrates from the carrying surface 111 to the mounting surface 112.

As shown in FIG. 1, the second printed circuit board 12 has a connecting surface 121 and a bottom surface 122 opposite to each other. The connecting surface 121 is connected to the mounting surface 112, and the bottom surface 122 is the image side surface 1 b of the substrate 1. In addition, a third pad 123 is provided on the connecting surface 121, a fourth pad 124 is provided on the bottom surface 122, and the first pad 113 and the second pad 114 are electrically connected. Specifically, the second printed circuit board 12 is provided with a via hole 125 penetrating from the connection surface 121 to the bottom surface 122, the via hole 125 is filled with the conductor 13, and both ends of the conductor 13 are connected to the third pad 123 respectively. It is electrically connected to the fourth pad 124, thereby achieving electrical connection between the third pad 123 and the fourth pad 124. Wherein, in this embodiment, the conductor 13 can be made of a metal material with good conductivity such as copper, aluminum, silver, etc. During production, the conductor 13 can be formed by solidifying conductive paste such as silver paste or copper paste. It is understandable that, in some embodiments, the conductor 13 may also be other electrical connections. For example, the conductor 13 may be a copper wire or the like.

As shown in FIG. 1, in this embodiment, the second printed circuit board 12 is further provided with a second through hole 126, and the second through hole 126 penetrates from the connecting surface 121 to the bottom surface 122. After the second printed circuit board 12 and the first printed circuit board 11 are assembled together, the second through hole 126 communicates with the first through hole 115 to form a receiving cavity 1 c, and the second pad 114 can be exposed from the second through hole 126. Specifically, in this embodiment, the second pad 114 is opposite to the second through hole 126 and can be completely exposed from the second through hole 126. In addition, in this embodiment, after the second printed circuit board 12 and the first printed circuit board 11 are assembled together, the first pad 113 and the third pad 123 are electrically connected. One pad 113 is electrically connected, and the fourth pad 124 and the third pad 123 are electrically connected. Therefore, after the second printed circuit board 12 and the first printed circuit board 11 are assembled together, the fourth pad 124 and the first printed circuit board 11 can be realized. Electrical connection of the two pads 114.

In this embodiment, the first through hole 115 and the second through hole 126 are coaxially arranged, and the aperture of the first through hole 115 is smaller than the aperture of the second through hole 126. Wherein, the first through hole 115 and the second through hole 126 may be any one or any combination of round holes, square holes, etc.

As shown in FIG. 1, in this embodiment, the lens module 3 is disposed on the bearing surface 111 of the first printed circuit board 11 and opposite to the first through hole 115, and the photosensitive chip 2 is disposed in the second through hole 126, The photosensitive surface 21 of the photosensitive chip 2 is opposite to the lens module 3. Wherein, a fifth pad 22 is provided on the photosensitive surface 21, and the fifth pad 22 is electrically connected to the second pad 114, so that the fifth pad 22 and the fourth pad 124 can be electrically connected. In actual use, the fourth bonding pad 124 is used to electrically connect with the external circuit, thereby realizing the electrical connection between the photosensitive chip 2 and the external circuit. Wherein, the external circuit may be a circuit including a corresponding controller. In this case, the controller may perform corresponding processing on the imaging of the photosensitive chip 2. In addition, in this embodiment, a corresponding circuit may also be provided on the bearing surface 111 of the first printed circuit board 11, and the circuit may be used for electrical connection with corresponding electronic components.

The circuit board 1 in this embodiment can meet the flip-chip assembly requirements of the photosensitive chip 2, that is, the circuit board 1 in this embodiment can be replaced with an HTCC ceramic substrate, and the circuit board 1 is composed of a first printed circuit board 11 and a second printed circuit board. When the printed circuit board 12 is assembled, it is actually still a printed circuit board, so through the arrangement of this embodiment, the flip-chip assembly of the photosensitive chip 2 can be realized by using the printed circuit board. In addition, the production of printed circuit boards does not require mold molding, has a shorter production cycle and lower cost, which is conducive to the popular use of the photosensitive chip 2 flip-chip assembly technology in the camera module industry.

In addition, the temperature of the HTCC substrate is relatively high during firing, so the materials used for the corresponding conductive lines on the HTCC substrate are mainly tungsten, molybdenum, manganese, etc., which have a high melting point but poor conductivity, which makes the HTCC substrate consume a lot of power. The circuit board 1 in this embodiment does not need to be fired during preparation, and the corresponding conductive lines on the circuit board 1 can be made of copper, aluminum and other materials. Compared with the HTCC substrate, the circuit board 1 provided in this embodiment can Reduce power consumption.

In this embodiment, there are multiple first pads 113, second pads 114, third pads 123, fourth pads 124, and fifth pads 22, wherein each fifth pad 22 There is a fourth pad 124 that is electrically connected to it. In addition, in this embodiment, these pads can be made of metal materials with good conductivity, such as copper, aluminum, and silver.

As shown in FIG. 1, in this embodiment, an anisotropic conductive adhesive film 14 is provided between the first printed circuit board 11 and the second printed circuit board 12, so that the first printed circuit board 14 is printed by the anisotropic conductive adhesive film 14. The circuit board 11 and the second printed circuit board 12 are physically connected together, and at the same time, the electrical connection between the first pad 113 and the third pad 123 can also be achieved through the anisotropic conductive adhesive film 14, that is, the first pad 113 An anisotropic conductive adhesive film 14 is also provided between the third pad 123 and the third pad 123, which can make the production and assembly of the circuit board 1 easier and more convenient. In this embodiment, the photosensitive chip 2 and the first printed circuit board 11 can also be physically connected by an anisotropic conductive adhesive film. In this case, the second pad 114 can also be realized by an anisotropic conductive adhesive film. The electrical connection with the fifth pad 22 makes the production and assembly of the camera module 100 easier and more convenient.

It is understandable that in other embodiments, the first pad 113 and the third pad 123, and the second pad 114 and the fifth pad may also be electrically connected together in other ways, such as soldering, metal balls Connection and gold wire connection, etc. In addition, when the first pad 113 and the third pad 123 are electrically connected in other ways, the above-mentioned anisotropic conductive adhesive film 14 can be replaced with other connection layers to improve the first printed circuit board 11 and the second printed circuit board. The strength of the connection between the boards 12, for example, the connection layer may be an epoxy resin layer or the like.

As shown in Figures 1 and 2, in this embodiment, the first printed circuit board 11 has a first fixing member 116, and the second printed circuit board 12 has a second fixing member 127. It is welded with the second fixing member 127 to realize the physical connection of the first printed circuit board 11 and the second printed circuit 12 together, thereby making the connection between the first printed circuit board 11 and the second printed circuit board 12 stronger.

Specifically, as shown in FIGS. 1 and 2, in this embodiment, the first printed circuit board 11 is provided with a perforation 117, the perforation 117 penetrates from the bearing surface 111 to the mounting surface 112, and the first fixing member 116 is provided in the perforation On the side wall of 117, the second fixing member 127 protrudes from the connecting surface 121 and passes through the through hole 117. When assembling, the second fixing member 127 is first inserted into the through hole 117, and then the first fixing member 116 and the second fixing member 127 are welded together by a soldering operation or the like. In addition, in this embodiment, the first fixing member 116 has an annular structure, the outer side of which is connected to the inner side of the perforated layer, the second fixing member 127 has a columnar structure, and the second fixing member is penetrated in the first fixing member 116. . In an actual product, the first fixing member 116 may be a metal layer such as copper or iron provided on the sidewall of the through hole 117 by means of electroplating or the like, and the second fixing member 127 may be a pin header made of copper or iron.

It is understandable that in some embodiments, the perforation 117 may also be provided on the second printed circuit board 12. At this time, the perforation 117 penetrates from the connecting surface 121 to the bottom surface 122, and the second fixing member 127 is provided on the side wall of the perforation 117. , The first fixing member 116 is disposed on the first printed circuit board 11 and protrudes from the bearing surface 111.

Of course, in other embodiments, the first printed circuit board 11 and the second printed circuit board 12 can also be welded together by other arrangements. For example, the first pad 113 and the third pad 123 can be directly welded together. In this case, the first pad 113 is equivalent to the first fixing member 116, and the third pad 123 is equivalent to the second fixing member 127. Through the soldering of the first pad 113 and the third pad 123, not only the electrical connection between the two can be realized, but also the fixed connection between the first printed circuit board 11 and the second printed circuit board 12 can be realized.

For another example, as shown in FIGS. 3 and 4, in the second embodiment provided by the present invention, at this time, the first fixing member 116 and the second fixing member 127 may also adopt another arrangement. In this embodiment, in addition to the bearing surface 111 and the mounting surface 112, the first printed circuit board 11 also has a side surface 118 respectively connected to the bearing surface 111 and the mounting surface 112, wherein the side surface 118 is provided with The concave structure 119 extends from the mounting surface 112 to the bearing surface 111, and the first fixing member 116 is disposed in the concave structure 119. In addition to the connecting surface 121 and the bottom surface 122, the second printed circuit board 12 also has an outer side surface 128, and the outer side surface 128 is connected to the connecting surface 121 and the bottom surface 122 respectively. Wherein, a groove structure 129 is provided on the outer side surface 128, the groove structure 129 extends from the connecting surface 121 to the bottom surface 122, and the second fixing member 127 is disposed in the groove structure 129. Wherein, the concave structure 119 and the groove structure 129 are opposite to each other to facilitate welding of the first fixing member 116 and the second fixing member 127 together. In this embodiment, the first fixing member 116 and the second fixing member 127 can be shielded by the arrangement of the concave structure 119 and the groove structure 129, which not only can effectively reduce the first fixing member 116 and the second fixing member 127 The probability of being hit by a foreign object improves the welding strength, and can also make the camera module 100 more beautiful.

In this embodiment, the first fixing member 116 may be a metal layer such as a copper layer disposed in the concave structure 119, and the second fixing member 127 may be a metal layer such as a copper layer disposed in the concave structure 129. The heat dissipation performance of the material is better, so the first fixing member 116 is arranged on the side surface 118 of the first printed circuit board 11, and the second fixing member 127 is arranged on the outer side 128 of the second printed circuit board 12, which is beneficial to the circuit board 1. Heat dissipation.

In actual production, the concave structure 119 may extend to the bearing surface 111, that is, the concave structure 119 penetrates from the mounting surface 112 to the bearing surface 111, so that a larger area of the first fixing can be provided on the first printed circuit board 11. Piece 116, thereby further improving the heat dissipation effect. Similarly, the groove structure 129 may extend to the bottom surface 122, that is, the groove structure 129 penetrates from the connecting surface 121 to the bottom surface 122, so that a larger area of the second fixing member 127 can be provided on the second printed circuit board 12, thereby Further improve the heat dissipation effect.

It is understandable that in other embodiments, only the outer side 128 of the second fixing member 127 may be arranged in the groove structure 129, and the first fixing member 116 is not arranged in the concave structure 119, as shown in FIG. 5 and As shown in FIG. 6, in this embodiment, the groove structure 129 penetrates from the connecting surface 121 to the bottom surface 122, the second fixing member 127 completely covers the side wall of the concave structure 129, and the first fixing member 116 is disposed on the mounting surface 112 , And opposite to the groove structure 129. Among them, in this embodiment, the projection of the second printed circuit board 12 on the mounting surface 112 is located in the mounting surface 112, so that the second printed circuit board 12 can be shielded by the first printed circuit board 11, which not only can effectively reduce The probability of the first fixing member 116 and the second fixing member 127 being impacted by foreign objects improves the welding strength and can also make the camera module 100 more beautiful. Wherein, as shown in FIG. 5, in this embodiment, the number of groove structures 129 is 4, which are respectively disposed on opposite sides of the second printed circuit board 12. At this time, the number of second fixing members 127 is also For four. Of course, in actual production, the numbers of the groove structure 129, the second fixing member 127, and the first fixing member 116 may also be other values. For example, as shown in FIGS. 7 to 9, at this time, the number of the groove structure 129, the second fixing member 127, and the first fixing member 116 are all 10.

In addition, in this embodiment, the first fixing member 116 may be several of the plurality of first pads 113, that is, the first fixing member 116 is also a first pad 113. It is understandable that the first pad The number of 113 is greater than the number of the first fixing member 116, that is, the first fixing member 116 is only a part of the first bonding pad 113, and not all the first bonding pads 113 are used as the first fixing member 116. In actual products, only those first pads 113 opposite to the groove structure 129 can be used as the first fixing member 116. In this embodiment, the first fixing member 116 can also be used to electrically connect to the ground, that is, the fourth pad 124 electrically connected to the first fixing member 116 is electrically connected to the ground, thereby improving the circuit board. The antistatic performance of 1 and the anti-electromagnetic interference ability of the electronic components on the circuit board 1.

Of course, in other embodiments, only the first fixing member 116 may be disposed in the concave structure 119, and the second fixing member 127 is not disposed in the groove structure 129. In this case, the second fixing member 127 may be disposed in the connection面121上.

This embodiment also provides an electronic device that uses the camera module 100 described in any of the foregoing embodiments. Among them, the electronic device may be a terminal product such as a mobile phone and a tablet computer.

The technical features of the above-mentioned embodiments can be combined arbitrarily. In order to make the description concise, all possible combinations of the various technical features in the above-mentioned embodiments are not described. However, as long as there is no contradiction in the combination of these technical features, All should be considered as the scope of this specification.

The above-mentioned embodiments only express several implementation modes of the present invention, and their description is relatively specific and detailed, but they should not be understood as a limitation on the scope of the invention patent. It should be pointed out that for those of ordinary skill in the art, without departing from the concept of the present invention, several modifications and improvements can be made, and these all fall within the protection scope of the present invention. Therefore, the protection scope of the patent of the present invention should be subject to the appended claims.

Claims

A circuit board for flip-chip mounting of photosensitive chips, the circuit board comprising:

The first printed circuit board has a carrying surface and a mounting surface opposite to each other, a first pad and a second pad are provided on the mounting surface, and the first pad and the second pad are electrically connected Together; the first printed circuit board is also provided with a first through hole, the first through hole penetrates from the carrying surface to the mounting surface;

The second printed circuit board is arranged on the mounting surface, the second printed circuit board has a connecting surface and a bottom surface arranged opposite to each other, and the connecting surface is connected with the mounting surface; the connecting surface is provided with The third pad, the bottom surface is provided with a fourth pad, the third pad is electrically connected to the first pad, and the fourth pad is electrically connected to the third pad; The second printed circuit board is also provided with a second through hole, the second through hole penetrates from the connecting surface to the bottom surface, and the second through hole communicates with the first through hole; Two bonding pads are exposed from the second through hole so as to be electrically connected to the photosensitive chip.
The circuit board according to claim 1, wherein the first through hole and the second through hole are coaxially arranged, and the aperture of the first through hole is smaller than the aperture of the second through hole.
The circuit board according to claim 1, wherein the circuit board further comprises a connection layer disposed between the first printed circuit board and the second printed circuit board to connect the first printed circuit board The circuit board and the second printed circuit board are connected together.
The circuit board according to claim 3, wherein the connecting layer is an anisotropic conductive adhesive film, and the anisotropic conductive adhesive film is used to connect the first printed circuit board and the second printed circuit board. The circuit boards are physically connected together, and the anisotropic conductive adhesive film is also used to electrically connect the first pad and the third pad together.
The circuit board according to claim 1, wherein the first printed circuit board has a first fixing member, the second printed circuit board has a second fixing member, and the first fixing member is connected to the second fixing member. The second fixing member is welded together to physically connect the first printed circuit board and the second printed circuit board together.
The circuit board according to claim 5, wherein the first printed circuit board has a side surface, and the side surface is in contact with the carrying surface and the mounting surface; the side surface is provided with an inner surface. A concave structure, the concave structure extends from the mounting surface to the bearing surface, and the first fixing member is arranged in the concave structure.
The circuit board according to claim 5, wherein the second printed circuit board has an outer side surface, and the outer side surface is in contact with the connecting surface and the bottom surface; the outer side surface is provided with a groove Structure, the groove structure extends from the connecting surface to the bottom surface, and the second fixing member is arranged in the groove structure.
The circuit board according to claim 5, wherein the first fixing member is provided on the mounting surface;

The second printed circuit board has an outer side surface, and the outer side surface is connected to the connecting surface and the bottom surface; The bottom surface extends, and the second fixing member is disposed in the groove structure;

Wherein, the projection of the second printed circuit board on the mounting surface is located in the mounting surface, and the groove structure is opposite to the first fixing member.
8. The circuit board according to claim 8, wherein the number of the first pads is multiple, the first fixing member is a plurality of the first pads, and the first A fixing piece is used for electrical connection with the ground wire.
The circuit board according to claim 5, wherein the first printed circuit board is provided with a perforation, the perforation penetrates from the carrying surface to the mounting surface, and the first fixing member is provided on the mounting surface. On the side wall of the perforation, the second fixing member is arranged on the connecting surface and penetrates through the perforation.
The circuit board according to claim 5, wherein the second printed circuit board is provided with a perforation, the perforation penetrates from the connecting surface to the bottom surface, and the second fixing member is provided on the On the side wall of the perforation, the first fixing member is arranged on the mounting surface and penetrates through the perforation.
A camera module includes:

A circuit board, the circuit board according to any one of claims 1-11;

The photosensitive chip is arranged on the mounting surface and is located in the second through hole, wherein the photosensitive surface of the photosensitive chip is in contact with the mounting surface, and the photosensitive surface is provided with a Five bonding pads, the fifth bonding pad is electrically connected to the second bonding pad.
An electronic device comprising the camera module according to claim 12.