WO2021221347A1 - Dispositif électronique comprenant une carte de circuit imprimé souple comprenant un élément de connexion - Google Patents

Dispositif électronique comprenant une carte de circuit imprimé souple comprenant un élément de connexion Download PDF

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Publication number
WO2021221347A1
WO2021221347A1 PCT/KR2021/004536 KR2021004536W WO2021221347A1 WO 2021221347 A1 WO2021221347 A1 WO 2021221347A1 KR 2021004536 W KR2021004536 W KR 2021004536W WO 2021221347 A1 WO2021221347 A1 WO 2021221347A1
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WO
WIPO (PCT)
Prior art keywords
circuit board
electronic device
battery
region
disposed
Prior art date
Application number
PCT/KR2021/004536
Other languages
English (en)
Korean (ko)
Inventor
박진우
박은수
이상태
이지우
Original Assignee
삼성전자 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 삼성전자 주식회사 filed Critical 삼성전자 주식회사
Publication of WO2021221347A1 publication Critical patent/WO2021221347A1/fr

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/145—Arrangements wherein electric components are disposed between and simultaneously connected to two planar printed circuit boards, e.g. Cordwood modules
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components
    • H04M1/0262—Details of the structure or mounting of specific components for a battery compartment
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components
    • H04M1/0266—Details of the structure or mounting of specific components for a display module assembly
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026—Details of the structure or mounting of specific components
    • H04M1/0277—Details of the structure or mounting of specific components for a printed circuit board assembly
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/028—Bending or folding regions of flexible printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/0017—Casings, cabinets or drawers for electric apparatus with operator interface units
    • H05K5/0018—Casings, cabinets or drawers for electric apparatus with operator interface units having an electronic display
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/0086—Casings, cabinets or drawers for electric apparatus portable, e.g. battery operated apparatus
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2499/00—Aspects covered by H04R or H04S not otherwise provided for in their subgroups
    • H04R2499/10—General applications
    • H04R2499/11—Transducers incorporated or for use in hand-held devices, e.g. mobile phones, PDA's, camera's

Definitions

  • the circuit board may include a rigid circuit board and/or a flexible circuit board.
  • the flexible circuit board may be formed using a relatively flexible material compared to the rigid circuit board. Since the flexible circuit board can be flexibly bent, a plurality of electrical elements can be efficiently connected to each other within a limited space.
  • an object of the present disclosure is to provide an electronic device including a flexible circuit board for connecting a plurality of circuit boards inside the electronic device.
  • FIG. 2 is a rear perspective view of an electronic device according to an exemplary embodiment.
  • FIG. 3 is an exploded perspective view of an electronic device according to an exemplary embodiment
  • FIG. 4 is a diagram illustrating a flexible circuit board according to an exemplary embodiment.
  • FIG. 5 is a diagram illustrating an internal structure of an electronic device including a flexible circuit board, according to an exemplary embodiment.
  • FIG. 6 is a view showing the inside of an electronic device including a flexible circuit board according to an exemplary embodiment, and is a view taken along a cross section AA′ of FIG. 5 .
  • FIG. 7 is a view for explaining an effect of a flexible circuit board according to an exemplary embodiment.
  • FIG. 8 is a view showing the inside of an electronic device including a flexible circuit board according to an exemplary embodiment, and is a view taken along the line A-A′ of FIG. 5 .
  • FIG. 9 is a view showing the inside of an electronic device including a flexible circuit board according to an embodiment, and is a view taken along a cross section B-B′ of FIG. 5 .
  • FIG. 10 is a cross-sectional view illustrating an internal structure of an electronic device according to an exemplary embodiment.
  • FIG. 11 is a diagram illustrating a flexible circuit board according to another exemplary embodiment.
  • FIG. 12 is a diagram illustrating an internal structure of an electronic device according to another exemplary embodiment.
  • an electronic device 100 includes a first surface (or front surface) 110A, a second surface (or rear surface) 110B, and a first surface 110A. and a housing 110 including a side surface 110C surrounding the space between the second surfaces 110B.
  • the back plate 111 and the side bezel structure 118 are integrally formed and may include the same material (eg, a metal material such as aluminum).
  • the side bezel structure 118 when viewed from the side of the electronic device 100 , is on the side (eg, on the side) not including the first regions 110D or the second regions 110E as described above. : has a first thickness (or width) on the short side), and has a second thickness that is thinner than the first thickness on the side side (eg, long side) including the first regions 110D or the second regions 110E can
  • the electronic device 100 includes the display 101 , the audio modules 103 , 104 , and 107 , and a sensor module (not shown, for example, disposed under the display 101 , or on the display 101 ).
  • a sensor module (not shown, for example, disposed under the display 101 , or on the display 101 ).
  • the electronic device 100 may omit at least one of the components (eg, the key input device 117 or the light emitting device) or additionally include other components.
  • a recess or opening is formed in a part of the screen display areas 110A and 110D of the display 101, and the audio module is aligned with the recess or the opening.
  • the recess may be the same as a notch or may correspond to a notch.
  • At least a portion of the sensor module and/or at least a portion of the key input device 117 may include the side surface 110C (eg, the first regions 110D and/or the second region 110E). ) can be placed in
  • the audio modules 103 , 104 , and 107 may include microphone holes 103 , 104 and a speaker hole 107 .
  • a microphone for acquiring an external sound may be disposed therein, and in some embodiments, a plurality of microphones may be disposed to detect the direction of the sound.
  • the speaker hole 107 may include an external speaker hole 107 and a call receiver hole (not shown).
  • the speaker hole 107 and the microphone holes 103 and 104 may be implemented as one hole.
  • the microphone hole 104 may be disposed under the display 101 or mounted on the display 101 (Under Display).
  • the electronic device 100 may include a speaker communicating with the speaker hole 107 .
  • the speaker may include a piezo speaker in which the speaker hole 107 is omitted.
  • the second sensor module may include a TOF camera for distance measurement.
  • the fourth sensor module 138 may be disposed below the screen display areas 110A and 110D.
  • the fourth sensor module may be disposed in the recess 139 formed on the rear surface of the display 101 .
  • the fourth sensor module 138 is not exposed to the screen display areas 110A and 110D, and may form a sensing area in at least a portion of the screen display areas 110A and 110D.
  • the fingerprint sensor may be disposed on the second surface 110B as well as the first surface 110A (eg, the screen display areas 110A and 110D) of the housing 110 .
  • the camera modules 105 and 112 include a first camera module 105 (eg, a punch hole camera) exposed to the first surface 110A of the electronic device 100 , and a second surface 110B exposed to the second surface 110B of the electronic device 100 .
  • 2 may include a camera module 112 , and/or a flash 113 .
  • the first camera module 105 may be exposed through a portion of the screen display area 110D of the first surface 110A.
  • the first camera module 105 may be exposed as a portion of the screen display area 110D through an opening (not shown) formed in a portion of the display 101 .
  • the camera modules 105 and 112 may include one or more lenses, an image sensor, and/or an image signal processor.
  • the flash 113 may include, for example, a light emitting diode or a xenon lamp.
  • two or more lenses (infrared cameras, wide-angle and telephoto lenses) and image sensors may be disposed on one side of the electronic device 100 .
  • the light emitting device may be disposed, for example, on the first surface 110A of the housing 110 .
  • the light emitting device may provide, for example, state information of the electronic device 100 in the form of light.
  • the light emitting device may provide, for example, a light source that is interlocked with the operation of the first camera module 105 .
  • the light emitting element may comprise, for example, an LED, an IR LED and/or a xenon lamp.
  • the connector hole 108 includes a first connector hole 108 capable of receiving a connector (eg, a USB connector) for transmitting and receiving power and/or data to and from an external electronic device, and/or an external electronic device and audio It may include a second connector hole (not shown) (eg, earphone jack) capable of accommodating a connector for transmitting and receiving a signal.
  • a connector eg, a USB connector
  • second connector hole eg, earphone jack
  • FIG. 3 is an exploded perspective view of an electronic device according to an exemplary embodiment
  • the electronic device 100 may omit at least one of the components (eg, the first support structure 142 or the rear case 160 ) or additionally include other components. At least one of the components of the electronic device 100 may be the same as or similar to at least one of the components of the electronic device 100 of FIG. 1 or 2 , and overlapping descriptions will be omitted below.
  • the bracket 140 is formed from the frame structure 141 forming the surface (eg, a part of the side surface 110C of FIG. 1 ) of the electronic device 100 , and the electronic device 100 from the frame structure 141 . ) may include a first support structure 142 extending inwardly.
  • the first support structure 142 may be located inside the electronic device 100 and connected to the frame structure 141 , or may be formed integrally with the frame structure 141 .
  • the first support structure 142 may be formed of, for example, a metal material and/or a non-metal (eg, polymer) material.
  • the first support structure 142 may be disposed inside the electronic device 100 and connected to the bracket 140 , or may be integrally formed with the bracket 140 .
  • the display 130 may be coupled to one surface and at least one of the first printed circuit board 151 or the second printed circuit board 152 may be coupled to the other surface.
  • At least one of the first printed circuit board 151 or the second printed circuit board 152 may be equipped with a processor, a memory, and/or an interface.
  • the processor may include, for example, one or more of a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor hub processor, or a communication processor.
  • Memory may include, for example, volatile memory or non-volatile memory.
  • the battery 159 is a device for supplying power to at least one component of the electronic device 100 and may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. . At least a portion of the battery 159 may be disposed, for example, substantially coplanar with at least one of the first printed circuit board 151 or the second printed circuit board 152 . The battery 159 may be integrally disposed inside the electronic device 100 , or may be disposed detachably from the electronic device 100 .
  • the antenna 170 may be disposed between the rear plate 180 and the battery 159 .
  • the antenna 170 may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and/or a magnetic secure transmission (MST) antenna.
  • the antenna 170 may, for example, perform short-range communication with an external device or wirelessly transmit/receive power required for charging.
  • an antenna structure may be formed by a part of the bracket 140 and/or the first support structure 142 or a combination thereof.
  • the camera module 112 may be disposed inside the housing 110 so that the lens is exposed to the camera area 110H of the rear surface 110B of the electronic device 100 .
  • the camera module 112 may be disposed on the first printed circuit board 151 .
  • FIG. 4 is a diagram illustrating a flexible circuit board of an electronic device according to an exemplary embodiment.
  • the electronic device 100 may include a flexible circuit board 400 and an external interface member 440 connected to the flexible circuit board 400 .
  • the flexible circuit board 400 may include a main region 410 , a first branch region 420 , and a second branch region 430 .
  • the main region 410 may include a conductive pattern connected to the first connector 401 .
  • the first branch region 420 may include a portion of the conductive pattern included in the main region 410 .
  • the second branch region 430 may include at least a portion of the conductive pattern included in the main region 410 that is not included in the first branch region 420 .
  • the flexible circuit board 400 may be formed to be flexible such that at least a part thereof is bendable.
  • the flexible circuit board 400 is configured to electrically connect components (eg, the first printed circuit board 151 and the second printed circuit board 152 of FIG. 3 ) included in the electronic device 100 to each other. can be
  • the electronic device 100 may include a housing 110 and a plurality of components disposed inside the housing 100 .
  • the plurality of components may include a main circuit board 200 (eg, the first printed circuit board 151 of FIG. 3 ), a sub circuit board 300 (eg, the second printed circuit board 152 of FIG. 3 ). ), a battery 159 , a speaker module 500 , and a flexible circuit board 400 .
  • the flexible circuit board 400 may be disposed inside the housing 110 .
  • the flexible circuit board 400 may be electrically connected to a plurality of components.
  • the flexible circuit board 400 may transmit electrical and/or electronic signals between the main circuit board 200 , the sub circuit board 300 , and the external interface member 440 .
  • the first connector 401 , the second connector 403 , and the external interface member 440 may be connected to the flexible circuit board 400 .
  • the external interface member 440 may be disposed on one surface of the housing 110 of the electronic device 100 .
  • at least a portion of the external interface member 440 may be exposed to the outside through an opening formed in the electronic device 100 .
  • at least a portion of the pins 441 included in the external interface member 400 may be exposed to the outside through the opening.
  • the electronic device 100 when the USB cable is coupled to the external interface member 440 through an opening, the electronic device 100 performs communication to exchange information with another electronic device (not shown) through the USB cable. can do.
  • the electronic device 100 may support a DeX (Desktop Experience, DeX, hereinafter 'DEX') function.
  • At least one of the main circuit board 200 and the sub circuit board 300 may be formed using a rigid material to mount various electric devices or electronic components.
  • the flexible circuit board 500 may be formed using a material that can be bent relatively flexibly. Since the flexible circuit board 400 may be bent, it may be positioned within a limited space inside the electronic device 100 to connect the main circuit board 200 , the sub circuit board 300 , and the external interface member 440 .
  • FIG. 6 is a view showing the inside of an electronic device including a flexible circuit board according to an exemplary embodiment, and is a view taken along a cross section AA′ of FIG. 5 .
  • the electronic device may include a main circuit board 200 , a battery 159 , and a flexible circuit board 400 .
  • the main circuit board 200 may include a first main circuit board 210 , a second main circuit board 220 , and an interposer 201 .
  • the interposer 201 may be electrically and/or physically formed between the first main circuit board 210 and the second main circuit board ( 220) can be connected.
  • the flexible circuit board 400 may include a main region 410 , a first branch region 420 , a bending portion 421 , and a refractive region 422 .
  • the main region 410 extends from the main region 410 to a first branch region 420 and a second branch region (not shown) (eg, the second branch region 430 in FIG. 5 ).
  • a branching portion 411 may be included.
  • the branching portion 411 may be formed in the main region 410 to face at least a portion of the first surface 1593 of the battery 159 .
  • the main region 410 may have an attachment member 202 coupled to one end thereof.
  • the attachment member 202 may include a reinforcing plate including a SUS frame.
  • the first branch region 420 may include a bending portion 421 and a refractive region 422 .
  • the bending portion 421 may be formed to be bent in a direction surrounding the battery 159 .
  • the bending portion 421 may include a portion bent in a direction perpendicular to a direction in which the first branch region 420 extends to face the first surface 1593 of the battery 159 .
  • the bending portion 421 may be positioned between the main region 410 and the refractive region 422 .
  • the bending portion 421 may have one side connected to the main region 410 and the other side connected to the refraction region 422 .
  • the refractive region 422 may be disposed to face the second side surface 1592 of the battery 159 .
  • the size of the refractive region 422 may be designed to correspond to the size of the second side 1592 of the battery 159 (eg, the height or thickness of the battery 159 ).
  • the flexible circuit board 400 faces the first surface 1593 of the battery 159 from the main region 410 and extends in the X direction and includes an upper battery extension region 424 and an upper battery extension region. It may include a refractive region 422 extending from 424 in the -Y direction.
  • the flexible circuit board 400 may include a bending portion 421 connecting the battery upper extension region 424 extending in the X direction and the refraction region 422 extending in the -Y direction.
  • the bending portion 421 may include a flexible portion that is bent so that at least a portion of the flexible circuit board 400 is changed in an extending direction.
  • a portion of the first branch region 420 of the flexible circuit board 400 that is disposed to face the second side surface 1592 of the battery 159 may be defined as the refraction region 422 .
  • the size (or height) of the refractive region 422 of the flexible circuit board 400 may correspond to the size (eg, the thickness of the battery) of the second side surface 1592 of the battery 159 .
  • the refractive region 422 may extend from the bending portion 421 .
  • the refractive region 422 may be disposed to face the second side 1592 perpendicular to the first side 1593 of the battery 159 .
  • the flexible circuit board 400 since the flexible circuit board 400 includes the bending portion 421 , it may be disposed in a narrow space inside the electronic device. According to an embodiment, since the flexible circuit board 400 includes the bendable bending portion 421 , the electronic device may include a component disposed therein (eg: a battery 159 ) or a speaker module (eg, FIG. More space can be allocated to the speaker module 500) of 5).
  • a component disposed therein eg: a battery 159
  • a speaker module eg, FIG. More space can be allocated to the speaker module 500 of 5).
  • FIG. 7 is a view for explaining an effect of a flexible circuit board according to an exemplary embodiment.
  • the flexible circuit board 400 may be designed according to the size (or length) of the battery 159 .
  • the electronic device may include a relatively large battery 159 in order to supply high-capacity power to the electronic device.
  • the size (or length) of the first branch region 420 or the main region 410 may be designed to increase in correspondence thereto.
  • the size of the refractive region 422 may be designed to relatively increase accordingly.
  • An electronic device may have an internal space of a limited size.
  • a plurality of components eg, a battery 159 and a speaker module (not shown) (speaker module of FIG. 5 )
  • the flexible circuit board 400 may be efficiently disposed in an internal space of an electronic device having a limited size.
  • FIG. 8 is a view showing the inside of an electronic device including a flexible circuit board according to an exemplary embodiment, and is a view taken along the line A-A′ of FIG. 5 .
  • the first branch region 420 may include a bending portion 421 and a refractive region 422 .
  • the first branching region 420 is connected to the portion 411 from which the first end 4201 is branched, and the second end 4202 is electrically and/or connected to the external interface member 440 . It can be physically connected. For example, at least a portion of the first branch region 420 may be formed to face the first surface 1593 of the battery 159 .
  • the bending portion 421 may be formed on both sides of the refraction region 422 disposed between the battery 159 and the speaker module 500 , respectively.
  • the bending portion 421 may include a portion bent in a direction surrounding the battery 159 .
  • the bending portion 421 may include a portion bent in a direction surrounding the speaker lower enclosure 520 .
  • at least a portion of the speaker lower enclosure 520 may physically contact at least a portion of the external interface member 440 . When the external interface member 440 comes into contact with at least a portion of the speaker lower enclosure 520 , the external interface member 440 may be fixed to minimize movement of the external interface member 440 .
  • the sub circuit board 300 may include a connection circuit 310 .
  • the sub circuit board 300 may be connected to at least a portion of the bracket 140 .
  • the connection circuit 310 may be disposed between the speaker upper enclosure 510 and the sub circuit board 300 .
  • the speaker module 500 may include a speaker upper enclosure 510 , a speaker lower enclosure 520 , and a speaker core 530 .
  • the speaker upper enclosure 510 may further include at least one laser direct structure (LDS) antenna 540 .
  • the speaker upper enclosure 510 may be connected to the speaker lower enclosure 520 to include a speaker core 530 and a resonance space therein.
  • LDS laser direct structure
  • the speaker lower enclosure 520 may be connected to at least a portion of the bracket 140 .
  • An external interface member 440 may be disposed between the speaker lower enclosure 520 and the stiffener 121 .
  • the stiffener 121 may be disposed under the flexible circuit board to reinforce the relatively thin flexible circuit board.
  • the stiffener 121 may be disposed to be connected to at least a portion of the external interface member 440 in order to prevent damage that may occur to a surrounding structure (eg, a bracket) when the external interface member 440 moves. have.
  • the speaker core 530 may include a magnetic material (eg, a magnet), a coil 531 (coil), and a yoke 532 (yoke).
  • the speaker ⁇ core 530 may amplify the vibration generated by using the magnetic material and the coil 531 in the resonance space.
  • the speaker module 500 may include a resonant volume (Speaker Volume, 550). For example, the resonance characteristics of the sound pressure and the audio frequency of the speaker module 500 may be adjusted using the resonance volume.
  • FIG. 10 is a cross-sectional view illustrating an internal structure of an electronic device according to an exemplary embodiment.
  • the frame structure 1401 may be connected to the front plate 120 and the rear plate 180 .
  • the frame structure 1401 may be coupled to the front plate 120 and the rear plate 180 .
  • the front plate 120 and the rear plate 180 may be respectively seated on the frame structure 1401 .
  • an opening 149 penetrating the frame structure 1401 may be formed in the frame structure 1401 .
  • At least a portion of the external interface member 440 may be disposed inside the opening 149 .
  • the external interface member 440 may be electrically connected to another external electronic device through the opening 149 .
  • the speaker module 500 may include enclosures 510 and 520 and a speaker core 530 disposed inside the enclosures 510 and 520 .
  • the enclosures 510 and 520 may include an upper enclosure 510 and a lower enclosure 520 .
  • the upper enclosure 510 may further include at least one laser direct structure (LDS) antenna 540 .
  • LDS laser direct structure
  • the bending portion 421 of the flexible circuit board 400 may be bent from the edge of the first side 1593 of the battery 159 toward the first side 140a of the plate structure 1402 .
  • the bending portion 421 of the flexible circuit board 400 may be bent from the refractive region 422 toward the opening 149 .
  • the bending portion 421 of the flexible circuit board 400 may be bent such that the extension portion 423 extends from the refractive region 422 between the first surface 140a of the plate structure 1402 and the speaker module 500 . .
  • FIG. 11 is a diagram illustrating an electronic device according to another embodiment.
  • a flexible circuit board (eg, the flexible circuit board 400 of FIG. 4 ) 1100 has a main area 1110 and a first branching area 1120 and a second branching area from the main area 1110 .
  • a first branching area 1120 extending from the area 1111 and distinct from the second branching area 1130 may be included.
  • the main area 1110 , the first branch area 1120 , and the second branch area 1130 may extend in different directions from the slit area 1111 .
  • a device configured to may mean that the device is “capable of” with other devices or parts.
  • a processor configured (or configured to perform) A, B, and C refers to a processor dedicated to performing the operations (eg, an embedded processor), or one stored in a memory device (eg, memory 130). By executing the above programs, it may mean a general-purpose processor (eg, CPU or AP) capable of performing corresponding operations.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Signal Processing (AREA)
  • Telephone Set Structure (AREA)

Abstract

Selon un mode de réalisation divulgué dans le présent document, un dispositif électronique peut comprendre : un boîtier ; une carte de circuit imprimé principale située à l'intérieur du boîtier ; une carte de sous-circuit agencée à l'intérieur du boîtier éloignée de la carte de circuit imprimé principale ; une batterie située entre la carte de circuit principale et la carte de sous-circuit, la batterie comprenant une première surface latérale faisant face à une carte principale et une seconde surface latérale opposée à la première et faisant face à une sous-carte ; un élément d'interface externe, dont au moins une partie est située sur une surface du boîtier et qui est destinée à connecter électriquement le dispositif électronique à un autre dispositif électronique ; et une carte de circuit imprimé souple qui est connectée à la carte de circuit imprimé principale. Selon un mode de réalisation, la carte de circuit imprimé souple comprend : une région principale connectée à la carte de circuit imprimé principale ; une première région de ramification reliée à l'élément d'interface externe à partir de la région principale ; et une seconde partie de ramification reliée à la carte de sous-circuit à partir de la région principale, la première partie de ramification pouvant comprendre une partie de courbure qui peut se courber de manière à faire face à la seconde surface latérale de la batterie. Divers autres modes de réalisation de la présente invention sont également possibles.
PCT/KR2021/004536 2020-04-29 2021-04-09 Dispositif électronique comprenant une carte de circuit imprimé souple comprenant un élément de connexion WO2021221347A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2020-0052506 2020-04-29
KR1020200052506A KR20210133645A (ko) 2020-04-29 2020-04-29 연결 부재를 구비하는 연성 회로 기판을 포함하는 전자 장치

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KR101086722B1 (ko) * 2009-11-18 2011-11-29 주식회사 다이아벨 모바일 어셈블리 및 이를 구비하는 전자기기
JP2015005538A (ja) * 2013-06-19 2015-01-08 京セラ株式会社 フレキシブル基板及びこれを具えた電子機器
KR20150044739A (ko) * 2013-10-17 2015-04-27 엘지전자 주식회사 이동 단말기
US20180084680A1 (en) * 2016-09-22 2018-03-22 Apple Inc. Thermal distribution assembly in an electronic device
KR20190020971A (ko) * 2017-08-22 2019-03-05 삼성전자주식회사 도전성 외관 부재를 가지는 전자 장치 및 이에 관한 누설 전류 검출 방법

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101086722B1 (ko) * 2009-11-18 2011-11-29 주식회사 다이아벨 모바일 어셈블리 및 이를 구비하는 전자기기
JP2015005538A (ja) * 2013-06-19 2015-01-08 京セラ株式会社 フレキシブル基板及びこれを具えた電子機器
KR20150044739A (ko) * 2013-10-17 2015-04-27 엘지전자 주식회사 이동 단말기
US20180084680A1 (en) * 2016-09-22 2018-03-22 Apple Inc. Thermal distribution assembly in an electronic device
KR20190020971A (ko) * 2017-08-22 2019-03-05 삼성전자주식회사 도전성 외관 부재를 가지는 전자 장치 및 이에 관한 누설 전류 검출 방법

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