WO2021218781A1 - 一种耳机通信系统 - Google Patents

一种耳机通信系统 Download PDF

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Publication number
WO2021218781A1
WO2021218781A1 PCT/CN2021/089094 CN2021089094W WO2021218781A1 WO 2021218781 A1 WO2021218781 A1 WO 2021218781A1 CN 2021089094 W CN2021089094 W CN 2021089094W WO 2021218781 A1 WO2021218781 A1 WO 2021218781A1
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WO
WIPO (PCT)
Prior art keywords
assembly
bone conduction
earhook
communication system
headset
Prior art date
Application number
PCT/CN2021/089094
Other languages
English (en)
French (fr)
Inventor
石县委
陈迁
吴中奇
游芬
Original Assignee
深圳市韶音科技有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from CN202020725564.2U external-priority patent/CN211880592U/zh
Priority claimed from CN202020718180.8U external-priority patent/CN211880588U/zh
Application filed by 深圳市韶音科技有限公司 filed Critical 深圳市韶音科技有限公司
Priority to CN202180014754.0A priority Critical patent/CN115516872A/zh
Publication of WO2021218781A1 publication Critical patent/WO2021218781A1/zh
Priority to US17/816,707 priority patent/US20220377451A1/en

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    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00Details of transducers, loudspeakers or microphones
    • H04R1/10Earpieces; Attachments therefor ; Earphones; Monophonic headphones
    • H04R1/1041Mechanical or electronic switches, or control elements
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04BTRANSMISSION
    • H04B1/00Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
    • H04B1/38Transceivers, i.e. devices in which transmitter and receiver form a structural unit and in which at least one part is used for functions of transmitting and receiving
    • H04B1/3827Portable transceivers
    • H04B1/385Transceivers carried on the body, e.g. in helmets
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04BTRANSMISSION
    • H04B1/00Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
    • H04B1/38Transceivers, i.e. devices in which transmitter and receiver form a structural unit and in which at least one part is used for functions of transmitting and receiving
    • H04B1/3827Portable transceivers
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04MTELEPHONIC COMMUNICATION
    • H04M1/00Substation equipment, e.g. for use by subscribers
    • H04M1/60Substation equipment, e.g. for use by subscribers including speech amplifiers
    • H04M1/6033Substation equipment, e.g. for use by subscribers including speech amplifiers for providing handsfree use or a loudspeaker mode in telephone sets
    • H04M1/6041Portable telephones adapted for handsfree use
    • H04M1/6058Portable telephones adapted for handsfree use involving the use of a headset accessory device connected to the portable telephone
    • H04M1/6066Portable telephones adapted for handsfree use involving the use of a headset accessory device connected to the portable telephone including a wireless connection
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00Details of transducers, loudspeakers or microphones
    • H04R1/08Mouthpieces; Microphones; Attachments therefor
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00Details of transducers, loudspeakers or microphones
    • H04R1/10Earpieces; Attachments therefor ; Earphones; Monophonic headphones
    • H04R1/1008Earpieces of the supra-aural or circum-aural type
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00Details of transducers, loudspeakers or microphones
    • H04R1/10Earpieces; Attachments therefor ; Earphones; Monophonic headphones
    • H04R1/105Earpiece supports, e.g. ear hooks
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00Details of transducers, loudspeakers or microphones
    • H04R1/10Earpieces; Attachments therefor ; Earphones; Monophonic headphones
    • H04R1/1058Manufacture or assembly
    • H04R1/1066Constructional aspects of the interconnection between earpiece and earpiece support
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00Details of transducers, loudspeakers or microphones
    • H04R1/10Earpieces; Attachments therefor ; Earphones; Monophonic headphones
    • H04R1/1058Manufacture or assembly
    • H04R1/1075Mountings of transducers in earphones or headphones
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R5/00Stereophonic arrangements
    • H04R5/033Headphones for stereophonic communication
    • H04R5/0335Earpiece support, e.g. headbands or neckrests
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04WWIRELESS COMMUNICATION NETWORKS
    • H04W76/00Connection management
    • H04W76/10Connection setup
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04BTRANSMISSION
    • H04B1/00Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
    • H04B1/38Transceivers, i.e. devices in which transmitter and receiver form a structural unit and in which at least one part is used for functions of transmitting and receiving
    • H04B1/3827Portable transceivers
    • H04B1/385Transceivers carried on the body, e.g. in helmets
    • H04B2001/3866Transceivers carried on the body, e.g. in helmets carried on the head
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04MTELEPHONIC COMMUNICATION
    • H04M2250/00Details of telephonic subscriber devices
    • H04M2250/02Details of telephonic subscriber devices including a Bluetooth interface
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2201/00Details of transducers, loudspeakers or microphones covered by H04R1/00 but not provided for in any of its subgroups
    • H04R2201/10Details of earpieces, attachments therefor, earphones or monophonic headphones covered by H04R1/10 but not provided for in any of its subgroups
    • H04R2201/107Monophonic and stereophonic headphones with microphone for two-way hands free communication
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2420/00Details of connection covered by H04R, not provided for in its groups
    • H04R2420/07Applications of wireless loudspeakers or wireless microphones
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2460/00Details of hearing devices, i.e. of ear- or headphones covered by H04R1/10 or H04R5/033 but not provided for in any of their subgroups, or of hearing aids covered by H04R25/00 but not provided for in any of its subgroups
    • H04R2460/13Hearing devices using bone conduction transducers

Definitions

  • This specification relates to the field of headset communication technology, and in particular to a headset communication system.
  • the headset communication system includes: a bone conduction headset, including a first Bluetooth module; an intercom device, including a first external interface; an external communication module, including a second external interface and a second Bluetooth module, the external communication module is detachably set On the intercom device and coupled to the intercom device through the first external interface and the second external interface; wherein the bone conduction headset and the intercom device pass through the first Bluetooth module Perform Bluetooth pairing with the second Bluetooth module to establish a Bluetooth connection.
  • Fig. 2 is a schematic block diagram of a circuit of a headset communication system according to some embodiments of the present application
  • FIG. 4 is an exploded schematic diagram of the overall structure of bone conduction earphones according to some embodiments of the present application.
  • Fig. 8 is an exploded schematic diagram of the structure of the ear hook assembly of the bone conduction earphone according to some embodiments of the present application;
  • Fig. 9 is an exploded schematic diagram of the structure of the ear hook assembly of the bone conduction earphone according to some embodiments of the present application.
  • FIG. 10 is a schematic structural diagram of a first earhook shell and a second earhook shell in a bone conduction earphone according to some embodiments of the present application;
  • Fig. 15 is a schematic structural diagram of an earhook assembly of a bone conduction earphone according to some embodiments of the present application.
  • Bone conduction headphones convert audio into mechanical vibrations of different frequencies, using human bones as a medium for transmitting mechanical vibrations, and then transmitting sound waves to the auditory nerve, so that the user can receive sound without passing through the external auditory canal and tympanic membrane of the ear.
  • the bone conduction headset 1 may have a Bluetooth function.
  • the bone conduction headset 1 may include a first Bluetooth module 101.
  • the first Bluetooth module 101 may include a control main chip, which has a micro control unit and a Bluetooth transceiver unit, and the Bluetooth transceiver unit is connected with a wireless transmission antenna.
  • the first Bluetooth module 101 can be used to implement a Bluetooth communication function.
  • the intercom device is usually directly held and performs sound pickup or playback functions. There may be situations in which it is not convenient to hold or carry the intercom device during high-altitude operations or transportation.
  • the bone conduction headset 1 can be effectively wirelessly connected with the intercom device 2 through Bluetooth communication.
  • the external communication module 3 is used as the bone conduction headset 1 and the intercom device 2 for Bluetooth communication. Medium.
  • the intercom device 2 may include a first external interface 201. That is, the intercom device 2 may be provided with a first external interface 201 for expanding the functions of the intercom device 2, and different functions can be realized by connecting different external modules.
  • the external modules may include external communication modules, storage modules, fault detection modules, and power detection modules.
  • the external communication module can be used as a Bluetooth communication medium between the bone conduction headset 1 and the intercom device 2, the storage module can store the information of the intercom device 2, and the fault monitoring module and power monitoring module can ensure the stable operation of the terminal.
  • the first external interface 201 can also be used for programming the intercom device 2 by an external terminal.
  • the first external interface 201 may include a plurality of contacts (shown in FIG. 1 but not marked) arranged at intervals, for example, 7 contacts.
  • the external communication module 3 may include a second external interface 301 and a second Bluetooth module 302.
  • the external communication module 3 is detachably disposed on the intercom device 2, for example, the external communication module 3 is fixed to the intercom device 2 in a snap connection manner.
  • the second external interface 301 may have the same number of contacts as the first external interface 201.
  • the external communication module 3 is coupled to the intercom device 2 through the first external interface 201 and the second external interface 301.
  • the intercom device 2 can realize the Bluetooth function through the external communication module 3.
  • the intercom device 2 can establish a Bluetooth connection with the bone conduction headset 1 through the external communication module 3.
  • the bone conduction headset 1 can be used to control the intercom device 2, for example, the bone conduction headset 1 can be used to listen to the audio received by the intercom device 2.
  • the intercom device 2 can also control the bone conduction earphone 1.
  • the bone conduction earphone 1 when the bone conduction earphone 1 is not worn, if the bone conduction earphone 1 is used for sound pickup or voice playback, it may result in the inability to effectively pick up the sound or the user cannot hear the sound transmitted by the bone conduction earphone 1.
  • the voice can be picked up and/or played through the intercom device 2 at this time, so that the played voice can be heard and/or effectively picked up.
  • the bone conduction earphone 1 can be used for sound pickup and/or voice playback, so that it is convenient for the user to send a voice or hear the played voice.
  • the sensing of the wearing mode or the activation of the device can be performed by the sensor.
  • the bone conduction earphone 1 further includes a sensor assembly 17 for detecting whether the bone conduction earphone 1 is worn. In some embodiments, when the bone conduction earphone 1 is worn, the bone conduction earphone 1 can be controlled to pick up and/or voice broadcast; when the bone conduction earphone 1 is not worn, the intercom device 2 can be controlled to pick up and/or sound. Or voice broadcast.
  • the sensor component 17 for sensing whether to wear the bone conduction headset 1 may be one or more of an acceleration sensor, a gravity sensor, a gyroscope sensor, a touch sensor, a distance sensor, and a contact sensor.
  • a gyroscope sensor and an acceleration sensor can be set in the bone conduction headset 1, and the device can be activated according to the actual situation by detecting the wearing condition or wearing posture of the user.
  • the sensor component 17 includes, for example, an optical sensor, which detects whether it is worn by transmitting and/or receiving corresponding light signals.
  • the optical sensor can be a low beam sensor, which can emit corresponding light signals. When the bone conduction earphone 1 is worn, it will reflect the light signal to produce emitted light. When the bone conduction earphone 1 is not worn, it does not produce reflected light.
  • the low beam sensor It is possible to detect whether the bone conduction earphone 1 is worn or perform distance measurement by receiving the reflected light.
  • the low beam sensor may be an infrared low beam sensor. It should be noted that in other embodiments, different sensors and different sensor combinations can be selected according to actual conditions, which is not limited here.
  • the bone conduction headset 1 and the intercom device 2 of the intercom device 2 are controlled to pick up and/or play voice, and the bone conduction headset The bone conduction headset 1 in 1 and the intercom device 2 is not used for sound pickup and/or voice playback. That is, when the bone conduction earphone 1 is not worn, the communication system uses the microphone of the intercom device 2 to pick up sound and/or the speaker to perform voice playback.
  • the bone conduction headset 1 and the intercom device 2 can exchange Bluetooth addresses through near field communication between the first NFC module 102 and the second NFC module 303, so that the first Bluetooth module 101 and the second Bluetooth module 302 perform Bluetooth Pair to establish a Bluetooth connection.
  • Bluetooth addresses there can be the following ways:
  • the other staff member can also "touch and connect" the bone conduction headset 1 and the intercom device 2, and then use the intercom device 2 and the bone conduction headset 1.
  • the composed communication system forms a working logic of “independent” and “shared” coexistence. What is independent is that everyone can use their own bone conduction headset 1, and the shared intercom device 2.
  • the bone conduction headset 1 can also be used to identify individuals, so that multiple people can use the same intercom device 2, which can realize fast switching, and can also realize the functions of attendance check-in and personal identification.
  • the two ends of the bone conduction headset 1 that are adjacent to the left ear and the right ear may include a first NFC module 102 and a first Bluetooth module 101, respectively, and the two first Bluetooth modules 101 at both ends may pass through TWS (True Wireless Stereo) Establish a connection.
  • TWS Truste Wireless Stereo
  • the first NFC module 102 and the second NFC module 303 at either end of the left ear and the right ear can be used to communicate, so as to realize the communication between the left ear and the right ear.
  • the bone conduction earphone further includes an earhook assembly 12.
  • the earhook assembly is provided with a transmission device at a position close to the base of the wearer's ears when worn.
  • the window of the optical signal of the optical sensor optionally, the window may be arranged in a racetrack shape.
  • the window please refer to the related description in FIG. 9 of the present application, which will not be repeated here.
  • the bone conduction earphone may include two speaker assemblies 11, two earhook assemblies 12, a rear hanger assembly 13 connected between the two earhook assemblies 12, and a battery.
  • the two speaker assemblies 11 are respectively connected to two earhook assemblies 12, and the earhook assembly 12 is connected between the rear hanger assembly 13 and the speaker assembly 11.
  • the ear hook assembly 12 may be formed with a receiving space 120, wherein the receiving space 120 of one ear hook assembly 12 is used for accommodating the battery assembly 14, and the receiving space 120 of the other ear hook assembly 12 is used for accommodating the control circuit assembly 15.
  • the battery assembly 14 is used to supply power to the bone conduction earphone 1
  • the control circuit assembly 15 is used to control the work of the bone conduction earphone 1 and implement corresponding operations.
  • the number of microphones of the sound pickup component 162 is greater than or equal to 2, and the microphones can be arranged at intervals.
  • one microphone is located at the end of the sound pickup assembly 162 away from the speaker assembly 11, and the other microphones may be located on the side where the sound pickup assembly 162 is connected to the end. It is convenient for multiple microphones to work together, which can reduce noise and improve the quality of pickup.
  • the bone conduction earphone 1 can convert audio into mechanical vibration, that is, when the speaker assembly 11 plays corresponding audio, the audio frequency corresponding to the audio frequency will cause the speaker 113 to generate corresponding vibration.
  • the elastic connecting rod 161 may be configured such that the vibration of the voice frequency band generated by the speaker assembly 11 is transmitted from one end of the elastic connecting rod 161 to the other end of the elastic connecting rod 161, and the average amplitude attenuation rate is not less than a preset value.
  • Attenuation rate threshold For example, the average amplitude attenuation rate is not less than 35%.
  • the above-mentioned average amplitude attenuation rate is not less than 45%.
  • the average amplitude attenuation rate is not less than 50%.
  • the average amplitude attenuation rate is not less than 55%.
  • the aforementioned amplitude attenuation rate is not less than 60%.
  • the aforementioned amplitude attenuation rate is not less than 70%.
  • the elastic connecting rod 161 is set to make the speaker assembly 11
  • the average amplitude attenuation rate of the vibration in the voice frequency band generated from one end of the elastic connecting rod 161 to the other end of the elastic connecting rod 161 is not less than the preset attenuation rate threshold (for example, 35%), so the elastic connecting rod 161
  • vibration can be effectively absorbed, reducing the amplitude of vibration transmitted from one end of the elastic connecting rod 161 to the other end, thereby reducing the vibration of the pickup assembly 162 caused by the vibration of the speaker assembly 11, which can effectively
  • the influence of the vibration of the speaker assembly 11 on the sound pickup effect of the sound pickup assembly 162 is reduced, and the sound pickup quality is improved.
  • Fig. 5 is a schematic diagram showing a structural disassembly of a stick microphone assembly in a bone conduction earphone according to some embodiments of the present application.
  • the elastic connecting rod 161 may include a rod elastic metal wire 1611 and a connecting portion 1612 connected to both ends of the rod elastic metal wire 1611. That is, the two ends of the elastic metal wire 1611 of the stick are respectively connected with a plug-in part 1612.
  • One of the plug-in parts 1612 is used to plug and cooperate with the sound pickup assembly 162.
  • the other plug-in part 1612 is used for plug-in cooperation with the speaker assembly 11.
  • the plug-in structures of the two plug-in parts 1612 may be the same or different, and are respectively adapted to the corresponding plug-in structures of the sound pickup assembly 162 and the speaker assembly 11.
  • the elastic modulus of the rod elastic metal wire 1611 may be 70-90 GPa.
  • the elastic modulus of the rod elastic metal wire 1611 is 75-85 GPa.
  • the elastic modulus of the rod elastic metal wire 1611 is 80-84 Gpa.
  • the elastic modulus of the rod elastic metal wire 1611 is 81-83 Gpa.
  • the material of the rod elastic metal wire 1611 may be spring steel, titanium, other metal or non-metal materials.
  • the elastic connecting rod 161 may include a stick elastic coating 1613 covering the outer circumference of the stick elastic metal wire 1611, and the elastic modulus of the stick elastic coating 1613 is 0.5-2 Gpa .
  • the elastic modulus of the sticky elastic coating 1613 is 0.8-1.5 Gpa.
  • the elastic modulus of the sticky elastic coating 1613 is 1.2-1.4 Gpa.
  • the stick elastic coating 1613 can further cover a part of the connecting portion 1612, thereby protecting the stick elastic metal wire 1611 and the connecting portion 1612.
  • the material of the elastic coating 1613 of the stick microphone can be silica gel, rubber, plastic, and the like.
  • the rod elastic coating 1613 may be provided with a wire channel along its length direction, and the wire channel may be arranged side by side with the rod elastic metal wire 1611 and spaced apart.
  • the connector portion 1612 may be provided with a buried wire groove connecting the wire channel, and the wire group used to connect the pickup assembly 162 can enter the wire channel through the buried wire groove of the adjacent connector portion 1612, and then pass through another wire channel.
  • the insertion portion 1612 enters into the speaker assembly 11.
  • the vibration transmitted by the stick elastic metal wire 1611 can be transmitted to the outside. Further absorption forms the effect of synergistic vibration absorption between the inside and the outside, which can greatly improve the vibration absorption effect of the stick and microphone assembly 16, effectively reduce the vibration transmitted to the sound pickup assembly 162, and improve the sound pickup quality.
  • Fig. 6 is an exploded schematic diagram of the structure of the speaker assembly in the bone conduction earphone according to some embodiments of the present application.
  • the speaker assembly 11 may include a first speaker housing 111, a second speaker housing 112, a speaker 113, a rotating member 114 and a pressing member 115.
  • the first speaker housing 111 and the second speaker housing 112 are mated and connected to form a receiving space 110 for accommodating the speaker 113.
  • the first speaker housing 111 can be mated with one end of the elastic connecting rod 161.
  • the microphone assembly 16 can be configured to be able to rotate relative to the first speaker housing 111.
  • the speaker assembly 11 may include a rotating member 114.
  • the first speaker housing 111 may be provided with a first through hole 1110.
  • the rotating member 114 is rotatably inserted into the first through hole 1110, and the plug-in portion 1612 can be mated with the rotating member 114 so that the wand microphone assembly 16 can rotate relative to the first speaker housing 111.
  • the first speaker housing 111 may be provided with a second through hole 1111 spaced apart from the first through hole 1110.
  • the second through hole 1111 is used for the ear-hook assembly 12 to perform plug-in fitting, so as to connect the speaker assembly 11 and the ear-hook assembly 12.
  • the first through hole 1110 and the second through hole 1111 both communicate with the receiving space 110.
  • the first speaker housing 111 may include a bottom wall 1112 and a side wall 1113 that are connected to each other.
  • the side wall 1113 surrounds and connects to the bottom wall 1112
  • the second speaker housing 112 is disposed on the side of the side wall 1113 away from the bottom wall 1112 to form a receiving space 110 for accommodating the speaker 113.
  • the first through hole 1110 is formed in the bottom wall 1112
  • the second through hole 1111 is formed in the side wall 1113.
  • the first through hole 1110 may be formed on a side of the bottom wall 1112 adjacent to the second through hole 1111 so that the first through hole 1110 and the second through hole 1111 are adjacent.
  • the bottom wall 1112 has a first protrusion 1114 protruding away from the receiving space 110, a first through hole 1110 is formed in the first protrusion 1114, and the side wall 1113 has a second protrusion 1115 protruding away from the receiving space 110,
  • the second through hole 1111 is formed in the second convex portion 1115.
  • the convex direction of the first convex portion 1114 and the convex direction of the second convex portion 1115 are perpendicular to each other, and the first convex portion 1114 and the second convex portion 1115 are arcuately formed. ⁇ Shape connection.
  • the rotating member 114 is embedded in the first through hole 1110 of the first convex portion 1114.
  • the first convex portion 1114 has a corresponding height so that the rotation of the microphone assembly 16 will not be interfered by the first speaker housing 111.
  • the protrusion directions of the first convex portion 1114 and the second convex portion 1115 are perpendicular to each other, which can also reduce the possibility of mutual interference between the ear hook assembly 12 and the stick and microphone assembly 16.
  • the sound pickup assembly 162 can be connected to other related components on the bone conduction earphone 1 through a corresponding wire set, such as the battery assembly 14 or the control circuit assembly 15, for transmitting the acquired audio signals to the related components Perform subsequent processing.
  • the wire set of the stick component 16 can pass through the stick elastic coating 1613 of the elastic connecting rod 161 and be led out through the connecting portion 1612.
  • the wire group of the stick microphone assembly 16 can be inserted into the first speaker housing 111 after passing through the plug-in part 1612.
  • the wire set of the stick and microphone assembly 16 may pass through the first through hole 1110 and pass through the receiving space 110 into the second through hole 1111.
  • the wire group of the stick microphone assembly 16 can further pass through the ear hook assembly 12 from the second through hole 1111 into the accommodating space 120 in order to be electrically connected to the battery assembly 14 or the control circuit assembly 15.
  • the stick-mic assembly 16 can rotate relative to the first speaker housing 111, which will cause the wire set of the stick-mic assembly 16 to move, which may restrict the rotation of the stick-mic assembly 16 due to improper movement of the wire set.
  • the wire set may also transmit the vibration of the speaker assembly 11 to the sound pickup assembly 162, thereby affecting the sound pickup effect of the sound pickup assembly 162, and may also affect the electrical connection stability.
  • Fig. 7 is another exploded schematic diagram of the structure of the speaker assembly in the bone conduction earphone according to some embodiments of the present application.
  • the speaker assembly 11 may include a pressing member 115 for pressing the wire group of the microphone assembly 16.
  • the pressing member 115 may be disposed in the accommodating space 110 and cover the first through hole 1110 for pressing the wire group of the stick and microphone assembly 16 passing through the first through hole 1110 to the second through hole 1111.
  • the movable space of the wire group of the stick microphone assembly 16 can be restricted, the shaking or movement of the wire group can be reduced, and the vibration generated by the vibration of the speaker assembly 11 and the vibration transmitted to the sound pickup assembly 162 can be reduced.
  • the sound pickup effect of the component 162 can also improve electrical stability.
  • the pressing of the pressing member 115 can also reduce the friction between the wire assembly and the first speaker housing 111, thereby protecting the wire assembly.
  • the receiving space 110 is formed after the first speaker housing 111 and the second speaker housing 112 are mated and connected.
  • the receiving space 110 is marked at the first speaker housing 111 in FIG. 7 for ease of understanding and description.
  • the rotating member 114 is inserted into the first through hole 1110, the first through hole 1110 is occupied by the rotating member 114. Therefore, the first through hole 1110 is marked at the rotating member 114 in FIG. 7 for ease of understanding. And description.
  • the hard cover 1151 is a steel sheet, and the elastic body 1152 is foam.
  • the hard cover 1151 can also be made of other materials, such as plastics, ceramics, etc., and the elastic body 1152 can also be made of other materials, such as silica gel, fibers, and the like.
  • the vibration of the wire group due to the vibration of the speaker assembly 11 can be reduced, and the stability of the wire group during the rotation of the microphone assembly 16 can also be enhanced.
  • It can also protect the wire group of the stick microphone assembly 16.
  • the rotation of the stick and microphone assembly 16 also needs to have good stability, that is, the matching structure of the rotating member 114 and the first through hole 1110 has a greater effect on the rotation stability of the stick and microphone assembly 16.
  • FIG. 8 is an exploded schematic view of the structure of the ear hook assembly of the bone conduction earphone according to some embodiments of the present application
  • FIG. 9 is another exploded view of the structure of the ear hook assembly of the bone conduction headset according to some embodiments of the present application .
  • the accommodating space 120 of one of the ear-hook assemblies 12 is used to house the battery assembly 14, such as the ear-hook assembly 12 shown in FIG. 8.
  • the accommodating space 120 of the other ear hook assembly 12 is used for accommodating the control circuit component 15, such as the ear hook assembly 12 shown in FIG. 9.
  • the battery assembly 14 may include a battery casing (not labeled) and a battery cell (not shown) disposed in the battery casing, and the battery cell is used to store power.
  • the first NFC module 102 mentioned in the above-mentioned embodiment of the earphone communication system of the present application can be attached to the battery assembly 14, for example, attached to the battery casing. In this way, the volume of the bone conduction earphone 1 can be reduced, and the first NFC module 102 can also be reduced. A situation of electromagnetic interference or signal interference between the NFC module 102 and the control circuit assembly 15.
  • the control circuit component 15 may include a circuit board 151, a power interface 152, a button 153, an antenna 154, and the like.
  • the first Bluetooth module 101 shown in FIG. 2 may be integrated in the control circuit assembly 15.
  • the control circuit assembly 15 may also integrate other circuits and components.
  • the first Bluetooth module 101 may be integrated on the circuit board 151.
  • the sensor assembly 17 can also be integrated on the circuit board 151.
  • the first earhook housing 121 may form a window 1200 for transmitting the optical signal of the optical sensor.
  • the window 1200 may be disposed adjacent to the connecting member 122, so that the window 1200 is close to the position of the user's adjacent ear root when the bone conduction earphone 1 is worn.
  • the window may also be provided in the rear hanging assembly 13 or other positions.
  • the sensor component 17 is an acceleration sensor, it can also be arranged in the containing space 120.
  • the window 1200 is arranged in a racetrack shape. It should be noted that in some other embodiments, the shape and style of the window 1200 can be adjusted according to the actual situation according to the form of the sensor assembly 17, for example, to avoid the sensor When contaminated or moisture or dust enters the bone conduction earphone 1, and the sensor assembly 17 is an optical sensor, a structure such as glass may be provided on the window 1200. As another example, when the sensor assembly 17 is a contact sensor, the window 1200 may be set to other shapes according to the shape of the contact portion.
  • the earhook assembly 12 is used to accommodate the battery assembly 14 or the control circuit assembly 15 and related wiring, etc., which is often the place where the bone conduction earphone 1 has a larger volume.
  • the design of the relevant buckle position and buckle structure in the ear hook assembly 12 will affect the volume of the entire ear hook assembly 12.
  • this embodiment provides the following housing structure of the ear hook assembly.
  • FIG. 10 is a structural diagram of the first earhook shell and the second earhook shell in the bone conduction earphone according to some embodiments of the present application
  • FIG. 11 is the bone conduction earphone according to some embodiments of the present application
  • FIG. 12 is a schematic cross-sectional structural view of FIG. 3 with BB as a cutting line.
  • the first ear hook shell 121 may be formed with a first slot 1211 and a second slot 1212 spaced apart, and the second ear hook shell 123 can be formed with spaced apart first grooves 1211 and 1212.
  • the first card block 1231 and the second card block 1232, the first card slot 1211 and the first card block 1231 can be snap-fitted, and the second card slot 1212 and the second card block 1232 can be snap-fitted to make the first ear hook shell
  • the body 121 and the second ear hook shell 123 can be snap-fitted.
  • the accommodating space 120 may have a length direction and a thickness direction that are perpendicular to each other.
  • the length direction refers to the length direction of the containing space 120
  • the thickness direction refers to the thickness direction of the containing space 120.
  • the first ear hook shell 121 and the second ear hook shell 123 are spliced with each other along a splicing direction perpendicular to the length direction and the thickness direction, thereby forming the accommodating space 120.
  • the first ear hook housing 121 has a first sub-accommodating space 1210
  • the second ear hook housing 123 has a second sub-accommodating space 1230.
  • first locking block 1231 and the second locking block 1232 are spaced apart in the length direction, and the protruding directions of the two are the same, and the two are facing the same direction, so that the first locking block 1231 and the second locking block 1232 can be It can be respectively inserted into the first slot 1211 and the second slot 1212 along the same direction.
  • the first locking block 1231 can be inserted into the first slot 1211, and the second locking block 1232 can be inserted into the second slot 1212 to restrict the first ear hook housing 121 and The relative movement of the second ear hook shell 123 in the splicing direction and the thickness direction.
  • the splicing edge 1201 of the first earhook housing 121 and the splicing edge 1202 of the second earhook housing 123 may fit with each other to restrict the first earhook housing 121 and the second earhook housing 123 Relative movement in the length direction.
  • the splicing of the first earhook shell 121 and the second earhook shell 123 may mean that the splicing edge 1201 of the first earhook shell 121 and the splicing edge 1202 of the second earhook shell 123 are substantially Touch and connect.
  • the shape of the splicing edge 1201 of the first earhook shell 121 and the splicing edge 1202 of the second earhook shell 123 are compatible, and the two can fit or complement each other to form a stable matching structure, which can restrict the two in Relative movement in the length direction.
  • the first blocking block 1231 and the second blocking block 1232 respectively protrude in opposite directions, which will inevitably lead to the first blocking block 1231 and the second blocking block 1232.
  • the additional space occupied by the block 1231 and the second clamping block 1232 is increased.
  • the first clamping slot 1211 and the second clamping block 1212 also need to be increased in the length direction.
  • the second card block 1232 so that the first card block 1231 and the second card block 1232 and the first card slot 1211 and the second card slot 1212 fit in the same direction, because the first card block 1231 and the second card slot 1212
  • the extension direction of the blocks 1232 is the same, which can reduce the additional volume occupied by the first block 1231 and the second block 1232, thereby reducing the first block 1231 and the second block 1232 and the first slot 1211 and the second block.
  • the volume occupied by the fitting of the slot 1212 can effectively reduce the volume of the earhook assembly 12.
  • the splicing edge 1201 of the first earhook shell 121 and the splicing edge 1202 of the second earhook shell 123 are mutually connected. It fits, there is no need to provide additional structures such as buckles, protrusions, etc., so that the structure of the ear hook assembly 12 is more compact and the volume of the ear hook assembly 12 can also be reduced.
  • the cooperation of the first locking block 1231 and the second locking block 1232 with the first slot 1211 and the second slot 1212 can limit the displacement in the splicing direction and the thickness direction, and the length direction can be limited by the fit of the splicing edges 1201 and 1202. In this way, the splicing of the first earhook shell 121 and the second earhook shell 123 can be more stable, and the structure can be more reliable.
  • the first slot 1211 and the second slot 1212 may be respectively located on both sides of the first ear hook housing 121 along the length direction, and the opening direction of the first slot 1211 faces In the accommodating space 120, the opening direction of the second slot 1212 is away from the accommodating space 120. That is, the opening direction of the first slot 1211 faces the first sub-accommodating space 1210, and the opening direction of the second slot 1212 is away from the first sub-accommodating space 1210.
  • the first slot 1211 is opened on the side of the first earhook shell 121 close to the connecting part 122
  • the second slot 1212 is opened on the side of the first earhook shell 121 away from the connecting part 122.
  • the first blocking block 1231 and the second blocking block 1232 may be respectively located on both sides of the second ear hook housing 123 along the length direction, and the extension direction of the first blocking block 1231 is away from The extending direction of the first slot 1211 and the second slot 1232 faces the first slot 1211. That is, the extending direction of the first locking block 1231 is away from the second sub-accommodating space 1230, and the extending direction of the second locking block 1232 faces the second sub-accommodating space 1230.
  • the first blocking block 1231 is disposed on the side of the second earhook shell 123 close to the connecting part 122
  • the second blocking block 1232 is disposed on the side of the second earhook shell 123 away from the connecting part 122. Since the second block 1232 protrudes and extends into the accommodating space 120, it does not need to take up extra space compared to the protruding extension of the accommodating space 120, which can save corresponding space.
  • the second card slot 1212 is mated Located at the front of the extension direction of the second block 1232, the two are embedded and matched, which can also reduce the volume of the ear hook assembly 12.
  • Fig. 13 is another structural schematic diagram of the first earhook housing and the second earhook housing in the bone conduction earphone according to some embodiments of the present application.
  • the first earhook shell 121 may be provided with an outer hole section 1215 and an inner hole section 1216 communicating with each other in a direction from outside the receiving space 120 to the inside of the receiving space 120. That is, the opening direction of the outer hole section 1215 faces away from the accommodating space 120, the opening direction of the inner hole section 1216 faces the accommodating space 120, and the outer hole section 1215 and the inner hole section 1216 are connected.
  • a filler 1217 is filled in the outer hole section 1215.
  • the filling member 1217 is, for example, a rubber member, such as a hard rubber. After the outer hole section 1215 is filled and blocked, the inner hole section 1216 can be used as the first slot 1211.
  • the opening direction of the inner hole section 1216 faces the accommodating space 120 and can be matched with the first block 1231.
  • the projections of the second block 1232 and the power jack 1233 on the first reference plane perpendicular to the length direction overlap with each other.
  • overlapping each other includes partial overlap (that is, the overlapped part is a part of the projection of the second card block 1232, and is also a part of the projection of the power jack 1233), and also includes full overlap (that is, the second card block 1232 The projection completely falls into the projection of the power jack 1233).
  • the projection of the second block 1232 on the first reference surface is within the projection of the power jack 1233 on the first reference surface, that is, the projection of the two The projection ranges all overlap. Setting the positions of the second locking block 1232 and the power jack 1233 in this way can make the structure of the second ear hook housing 123 compact without affecting the installation of the power interface 152 and reduce the volume of the ear hook assembly 12.
  • the projections of the second block 1232 and the power jack 1233 on the second reference plane perpendicular to the splicing direction overlap with each other.
  • the overlap with each other here also includes partial overlap and full overlap.
  • the projection of the second block 1232 on the second reference plane is also located within the projection of the power jack 1233 on the second reference plane, that is, both The projection ranges of are also all overlapped.
  • the second card block 1232 and the power jack 1233 can be arranged more compactly both in the splicing direction and the length direction, which can greatly save the space occupied by the power jack 1233 and the second card block 1232.
  • the structure compactness of the ear hook assembly 12 is improved.
  • bone conduction earphones 1 in the production and manufacturing fields such as industry has great requirements for the control experience of the bone conduction earphones 1.
  • the power jack 1233 is opened in the part of the second earhook housing 123 away from the connecting part 122.
  • the operating experience of the bone conduction headset 1 can be improved for the following reasons:
  • the button holes 1235 are small and the arrangement is too compact, which will cause the wearer's control experience to decline, and it is very easy to cause misoperation.
  • the power jack 1233 is not provided on the bottom of the housing, but a power jack 1233 is provided on the side of the housing. Then the size of the key holes 1235 can be designed to be larger, and the arrangement of each other can be looser. It is convenient for the user to operate and reduces the occurrence of misoperation.
  • the platform area connecting the second clamping block 1232 that is, the second clamping block 1232 can be regarded as extending from the platform area to the second sub-accommodating space 1230), which will squeeze the connection of the first ear hook shell 121
  • the space of the jack 1218 will further affect the mating fit between the ear hook assembly 12 and the rear hook assembly 13, and the second block 1232 needs to occupy additional space, which will make the first ear hook shell 121 and the second ear hook
  • the splicing of the hanging shell 123 in the splicing direction occupies a large space and is not compact enough. Therefore, in this embodiment, the power jack 1233 is arranged at the bottom of the second ear hanging shell 123 and arranged in the above-mentioned projection relationship.
  • the structural relationship between the second clamping block 1232 and the power jack 1233 makes the second ear hook housing 123 more compact in the splicing direction.
  • the second clamping block 1232 extends toward the accommodating space 120, which eliminates the need to occupy additional space. Furthermore, the volume of the earhook housing 12 can be miniaturized.
  • the stable splicing structure between the first earhook shell 121 and the second earhook shell 123 can protect the battery assembly 14 and the control circuit assembly 15 in the accommodating space 120.
  • the wires in the bone conduction earphone 1 are routed between the speaker assembly 11 and the earhook assembly 12, and the stability of the wiring is related to the reliability of the bone conduction assembly.
  • the ear hook assembly 12 may be provided with a corresponding wire clamping structure to ensure the stability of the wires when the wire group passes through the ear hook assembly 12. For details, please refer to the following description.
  • the connecting member 122 may include an ear-hook elastic metal wire 1221 and a joint portion 1222 connected to one end of the ear-hook elastic metal wire 1221.
  • the connecting member 122 may also include an ear-hook elastic coating 1223 at least covering the outer circumference of the ear-hook elastic metal wire 1221 (as shown in FIG. 10).
  • the earhook elastic metal wire 1221 can further cover the first earhook shell 121.
  • the joint portion 1222 is used for mating with the speaker assembly 11.
  • the other end of the ear hook elastic metal wire 1221 is connected to the first ear hook shell 121.
  • FIG. 14 is an exploded schematic diagram of the structure of the back-hanging component of the bone conduction earphone according to some embodiments of the present application
  • FIG. 15 is a schematic diagram of the structure of the ear-hook assembly of the bone conduction earphone according to some embodiments of the present application.
  • the rear suspension assembly 13 may include a rear suspension elastic metal wire 131, a rear suspension elastic coating 132 covering the rear suspension elastic metal wire 131, and a rear suspension elastic metal wire. 131 Inserting parts 133 at both ends. The back-hanging elastic coating 132 can also cover at least part of the insertion portion 133.
  • the insertion portion 133 is used for mating and mating with the earhook assembly 12.
  • the side of the first earhook shell 121 away from the connecting member 122 is provided with a jack 1218 communicating with the receiving space 120.
  • the socket 1218 and the second card slot 1212 are arranged adjacent to each other.
  • the insertion portion 133 can be mated with the socket 1218.
  • At least one insertion portion 133 is provided with two sets of slots 1331 spaced apart in its length direction. That is, at least one insertion portion 133 is provided with two sets of slots 1331 spaced apart in the length direction of the insertion portion 133, and each set of slots 1331 includes at least one slot 1331.
  • the rear-hanging elastic metal wire 131 is inserted into the insertion portion 133 through one end of the insertion portion 133.
  • One set of slots 1331 is adjacent to the insertion portion 133, and the other set of slots 1331 is away from one end of the insertion portion 133.
  • the two sets of slots 1331 are divided into a first set of slots 1331 and a second set of slots 1331.
  • the first set of slots 1331 is away from one end of the insertion portion 133 and is used for snap-fitting with the ear hook assembly 12.
  • the first ear hook shell 121 is protrudingly provided with a clamping portion 12181.
  • a clamping portion 12181 is protrudingly provided in the receiving socket 1218 of the first earhook shell 121.
  • the insertion portion 133 is inserted into the socket 1218 and the clamping portion 12181 is inserted into the first set of slots 1331, thereby restricting the relative movement of the ear hook assembly 12 and the rear hook assembly 13.
  • the second slot 1331 is close to one end of the insertion portion 133 and is used for mold positioning. That is, the second set of slots 1331 is used to cooperate with the corresponding protruding structure on the mold, so as to accurately fix the insertion portion 133 at a certain position, and then other processes can be performed on it to improve the yield rate.
  • the second set of slots 1331 is used to position the insertion portion 133 and the rear-hanging elastic metal wire 131, and then the rear-hanging elastic coating 132 can be formed by injection molding.
  • the slot 1331 extends from the edge of the insertion portion 133 on both sides of the center axis toward the center axis direction.
  • Each group of slots 1331 includes two slots 1331, and the two slots 1331 of each group are arranged opposite to each other.
  • numbers describing the number of ingredients and attributes are used. It should be understood that such numbers are used in the description of the embodiments, although the numerical ranges and parameters used to confirm the breadth of the ranges in some embodiments of this specification are approximate values. In specific embodiments, the setting of such values is as accurate as possible within a feasible range.

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  • Signal Processing (AREA)
  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Manufacturing & Machinery (AREA)
  • Health & Medical Sciences (AREA)
  • Otolaryngology (AREA)
  • Circuit For Audible Band Transducer (AREA)
  • Telephone Function (AREA)

Abstract

本申请实施例公开了一种耳机通信系统,该耳机通信系统包括:骨传导耳机,包括第一蓝牙模块;对讲设备,包括第一外接接口;外接通信模块,包括第二外接接口和第二蓝牙模块,所述外接通信模块可拆卸地设置于所述对讲设备,并通过所述第一外接接口和所述第二外接接口耦接所述对讲设备;其中,所述骨传导耳机和所述对讲设备通过所述第一蓝牙模块和所述第二蓝牙模块进行蓝牙配对以建立蓝牙连接。

Description

一种耳机通信系统
交叉引用
本申请要求2020年4月30日提交的中国申请号202020725564.2的优先权和2020年4月30日提交的中国申请号为202020718180.8的优先权,全部内容通过引用并入本文。
技术领域
本说明书涉及耳机通信技术领域,特别涉及一种耳机通信系统。
背景技术
对讲设备在集群通信中起着非常重要的作用,用于群组成员中的联络,被广泛适用于民用、工业、警用以及其他领域内,但是对讲机的语音通信保密性不强,而且在外界环境较为嘈杂时,对对讲设备的语音通话造成较大的干扰,使用者难以听清通话内容,影响对讲机的使用质量,而且对讲设备的语音通信方式较为单一,限制了对讲设备的使用场景。
发明内容
本说明书实施例之一提供一种耳机通信系统。该耳机通信系统包括:骨传导耳机,包括第一蓝牙模块;对讲设备,包括第一外接接口;外接通信模块,包括第二外接接口和第二蓝牙模块,所述外接通信模块可拆卸地设置于所述对讲设备,并通过所述第一外接接口和所述第二外接接口耦接所述对讲设备;其中,所述骨传导耳机和所述对讲设备通过所述第一蓝牙模块和所述第二蓝牙模块进行蓝牙配对以建立蓝牙连接。
附图说明
本说明书将以示例性实施例的方式进一步说明,这些示例性实施例将通 过附图进行详细描述。这些实施例并非限制性的,在这些实施例中,相同的编号表示相同的结构,其中:
图1是根据本申请一些实施例所示的耳机通信系统的结构示意图;
图2是根据本申请一些实施例所示的耳机通信系统的电路示意框图;
图3是根据本申请一些实施例所示的骨传导耳机的整体结构俯视示意图;
图4是根据本申请一些实施例所示的骨传导耳机的整体结构爆炸示意图;
图5是根据本申请一些实施例所示的骨传导耳机中棍咪组件的结构拆解示意图;
图6是根据本申请一些实施例所示的骨传导耳机中扬声器组件的结构爆炸示意图;
图7是根据本申请一些实施例所示的骨传导耳机中扬声器组件的结构爆炸示意图;
图8是根据本申请一些实施例所示的骨传导耳机中耳挂组件的结构爆炸示意图;
图9是根据本申请一些实施例所示的骨传导耳机中耳挂组件的结构爆炸示意图;
图10是根据本申请一些实施例所示的骨传导耳机中第一耳挂壳体和第二耳挂壳体的结构示意图;
图11是根据本申请一些实施例所示的骨传导耳机中第一耳挂壳体和第二耳挂壳体的结构示意图;
图12是根据本申请一些实施例所示的图3中以B-B为剖切线的耳挂组件的截面结构示意图;
图13是根据本申请一些实施例所示的骨传导耳机中第一耳挂壳体和第二耳挂壳体的结构示意图;
图14是根据本申请一些实施例所示的骨传导耳机中后挂组件的结构爆炸示意图;
图15是根据本申请一些实施例所示的骨传导耳机中耳挂组件的结构示意图。
具体实施方式
为了更清楚地说明本说明书实施例的技术方案,下面将对实施例描述中所需要使用的附图作简单的介绍。显而易见地,下面描述中的附图仅仅是本说明书的一些示例或实施例,对于本领域的普通技术人员来讲,在不付出创造性劳动的前提下,还可以根据这些附图将本说明书应用于其它类似情景。除非从语言环境中显而易见或另做说明,图中相同标号代表相同结构或操作。
应当理解,本文使用的“系统”、“装置”、“单元”和/或“模块”是用于区分不同级别的不同组件、元件、部件、部分或装配的一种方法。然而,如果其他词语可实现相同的目的,则可通过其他表达来替换所述词语。
如本说明书和权利要求书中所示,除非上下文明确提示例外情形,“一”、“一个”、“一种”和/或“该”等词并非特指单数,也可包括复数。一般说来,术语“包括”与“包含”仅提示包括已明确标识的步骤和元素,而这些步骤和元素不构成一个排它性的罗列,方法或者设备也可能包含其它的步骤或元素。
本说明书中使用了流程图用来说明根据本说明书的实施例的系统所执行的操作。应当理解的是,前面或后面操作不一定按照顺序来精确地执行。相反,可以按照倒序或同时处理各个步骤。同时,也可以将其他操作添加到这些过程中,或从这些过程移除某一步或数步操作。
图1是根据本申请一些实施例所示的耳机通信系统的结构示意图;图2是根据本申请一些实施例所示的耳机通信系统的电路示意框图。
在一些实施例中,所述耳机通信系统可以包括骨传导耳机1、对讲设备2和外接通信模块3。
骨传导耳机将音频转化成不同频率的机械振动,以人的骨头作为传递机械振动的介质,进而将声波传递到听觉神经,如此可以使得使用者不通过耳朵的 外耳道和鼓膜也能够接收到声音。在一些实施例中,骨传导耳机1可以具备蓝牙功能。如图2所示,骨传导耳机1可以包括第一蓝牙模块101。第一蓝牙模块101可以包括控制主芯片,控制主芯片具有微型控制单元和蓝牙收发单元,蓝牙收发单元连接有无线传输天线。第一蓝牙模块101可以用于实现蓝牙通信功能。
对讲设备2,也即对讲机,是集群通信的终端设备,也可以作为移动通信中的无线通信设备。一般而言,对讲机是将音频的电信号通过其发射组件转换成射频载波信号,然后经过放大、滤波等方式通过天线发射出去,如此可以将使用者的声音传输出去。天线可以接收输入信号,经过相应的转换、滤波、放大以及混频等处理,形成音频信号,通过扬声器播放出来,进而可以使得使用者能够听到其他对讲设备所发送的音频。在一些实施例中,对讲设备可以是常见具备对讲功能的设备,在本说明书中不做限制。
在一些场景中,对讲设备通常直接手持并进行拾音或播放功能,可能存在如高空作业或搬运等双手操作时,不便于手持或携带对讲设备的情况,有鉴于此,本说明书的一些实施例中,通过蓝牙通讯使得骨传导耳机1能够和对讲设备2进行有效的无线连接,在一些实施例中,利用外接通信模块3作为骨传导耳机1和对讲设备2之间进行蓝牙通信的媒介。
在一些实施例中,对讲设备2可以包括第一外接接口201。也即,对讲设备2可以提供有第一外接接口201,用于扩展对讲设备2的功能,通过连接不同的外接模块可以实现不同的功能。例如,外接模块可以包括外接通信模块、存储模块、故障检测模块和电源检测模块等。外接通信模块可以作为骨传导耳机1和对讲设备2之间进行蓝牙通信的媒介,存储模块可以存储对讲设备2的信息,故障监测模块和电源监测模块可以保证终端的稳定运行。第一外接接口201还可以用于供外部终端对对讲设备2进行编程等。第一外接接口201可以包括多个间隔设置的触点(图1已示出,但未标注),例如为7个触点。
在一些实施例中,外接通信模块3可以包括第二外接接口301和第二蓝牙模块302。外接通信模块3可拆卸地设置于对讲设备2,例如外接通信模块3 以卡接的方式固定于对讲设备2。第二外接接口301也可以具备和第一外接接口201同样多的触点。外接通信模块3安装在对讲设备2时,第一外接接口201和第二外接接口301连接。外接通信模块3通过第一外接接口201和第二外接接口301耦接对讲设备2。对讲设备2可以通过外接通信模块3实现蓝牙功能。
如图2所示,对讲设备2可以通过外接通信模块3和骨传导耳机1建立蓝牙连接。在对讲设备2和骨传导耳机1通过外接通信模块3建立起蓝牙连接后,可以使用骨传导耳机1控制对讲设备2,例如可以使用骨传导耳机1接听对讲设备2所接收到的音频,也可以使用骨传导耳机1的麦克风发送相应的语音,还可以控制对讲设备2的其他功能。当然,对讲设备2也可以控制骨传导耳机1。
在一些实施例中,在骨传导耳机1未被佩戴时,如果通过骨传导耳机1进行拾音或者语音播放,可能会导致无法有效地拾音或者使用者无法听到骨传导耳机1所传输的语音,此时可以通过对讲设备2进行拾音和/或语音播放,进而使得播放的语音能够被听到和/或有效地拾音。在骨传导耳机1被佩戴时,则可以通过骨传导耳机1进行拾音和/或语音播放,如此便于使用者发送语音或者听到播放的语音。为了能够根据实际使用情况对设备功能进行切换,在一些实施例中,可以通过传感器进行佩戴方式的感应或设备激活等。
在一些实施例中,骨传导耳机1还包括传感器组件17,用于检测骨传导耳机1是否被佩戴。在一些实施例中,骨传导耳机1在被佩戴时,可以控制骨传导耳机1进行拾音和/或语音播报;骨传导耳机1在未佩戴时,可以控制对讲设备2进行拾音和/或语音播报。
在一些实施例中,用于感应是否佩戴骨传导耳机1的传感器组件17可以是加速度传感器、重力传感器、陀螺仪传感器、触摸传感器、距离传感器和接触传感器中的一个或多个。例如,可以在骨传导耳机1内设置陀螺仪传感器和加速度传感器,通过检测用户佩戴情况或佩戴姿势,根据实际情况选择激活设备。
在一些实施例中,具体的,传感器组件17例如包括光学传感器,通过发 射和/或接受相应的光信号来检测是否被佩戴。光学传感器可以是近光传感器,可以发射相应光信号,在骨传导耳机1被佩戴时会对光信号进行反射产生发射光,在骨传导耳机1未被佩戴时就不产生反射光,近光传感器可以通过是否接收反射光来检测骨传导耳机1是否被佩戴或者进行测距。在一些实施例中,近光传感器可以是红外近光传感器,需要说明的是,在其他实施例中根据实际情况还可以选择不同的传感器和不同传感器的组合方式,在此不做限制。
在一些实施例中,进一步的,骨传导耳机1和对讲设备2处于蓝牙连接状态下,在传感器组件17检测到骨传导耳机1被佩戴时,控制骨传导耳机1和对讲设备2中的骨传导耳机1用于进行拾音和/或语音播放,而骨传导耳机1和对讲设备2中的对讲设备2不用于进行拾音和/或语音播放。也即,在骨传导耳机1被佩戴时,通信系统是通过骨传导耳机1的麦克风工作进行拾音和/或扬声器工作进行语音播放。在一些实施例中,在传感器组件17检测到骨传导耳机1未被佩戴时,控制骨传导耳机1和对讲设备2中的对讲设备2进行拾音和/或语音播放,而骨传导耳机1和对讲设备2中的骨传导耳机1不用于进行拾音和/或语音播放。也即,在骨传导耳机1未被佩戴时,通信系统是通过对讲设备2的麦克风工作进行拾音和/或扬声器工作进行语音播放。
在一些实施例中,在传感器组件17检测到骨传导耳机1未被佩戴时,骨传导耳机1和对讲设备2可以同时拾音,对讲设备2进行语音播放。在一些实施例中,在传感器组件17检测到骨传导耳机1被佩戴时,骨传导耳机1和对讲设备2可以同时拾音,骨传导耳机1进行语音播放。通过传感器组件17检测骨传导耳机1是否被佩戴,进而便于通信系统实现上述自动切换,避免语音信息被遗漏,可以适应不同的使用场景,提高工作效率。
在一些实施例中,为了便于骨传导耳机和对讲设备2快速地进行蓝牙连接,可以在骨传导耳机1和对讲设备2之间快速地交换蓝牙地址,以便于快速进行配对。如图2所示,骨传导耳机1可以具有NFC近场通信功能,具体可以包括第一NFC模块102,可以用于实现近场通信功能。而外接通信模块3还可 以包括第二NFC模块303,可以使得对讲设备2可以实现近场通信。
在一些其他实施例中,骨传导耳机还可以具有ZigBee通信模块。例如,对讲设备2将请求配对的信号发送到骨传导耳机1,响应于接收到的配对请求信息,骨传导耳机1将个人识别码请求信息发送到对讲设备2,以进行与骨传导耳机1的配对。
在一些实施例中,个人识别码由用户输入到对讲设备2,将所输入的个人识别码发送骨传导耳机1,检查骨传导耳机1所接收到的个人识别码是否与存储在骨传导耳机中的个人识别码对应。如果所接收到的个人识别码不与其存储在骨传导耳机中的个人识别码对应,则骨传导耳机1将个人识别码请求信息重新发送到对讲设备2。如果所接收到的个人识别码与存储在骨传导耳机中的个人识别码对应,则骨传导耳机1与对讲设备2完成配对。
在一些实施例中,骨传导耳机1和对讲设备2可以通过第一NFC模块102和第二NFC模块303的近场通信交换蓝牙地址,使得第一蓝牙模块101和第二蓝牙模块302进行蓝牙配对以建立蓝牙连接。对于上述交换蓝牙地址而言,可以有以下方式:
第一种方式:骨传导耳机1将蓝牙地址发送给对讲设备2,可以节省对讲设备2搜索和选择骨传导耳机1的时间。也即,第一NFC模块102可以存储或者获取第一蓝牙模块101的蓝牙地址。第一NFC模块102和第二NFC模块303进行近场通信时,第一NFC模块102可以将蓝牙地址发送给第二NFC模块303,进而使得外接通信模块3可以获取到第一蓝牙模块101的蓝牙地址,实现蓝牙地址交换,进而可以进行快速配对和连接。
第二种方式:对讲设备2将蓝牙地址发送给骨传导耳机1,可以节省骨传导耳机1搜索和选择对讲设备2的时间。也即,第二NFC模块303可以存储或者获取第二蓝牙模块302的蓝牙地址。第一NFC模块102和第二NFC模块303进行近场通信时,第二NFC模块303可以将第二蓝牙模块302的蓝牙地址发送给第一NFC模块102,进而使得骨传导耳机1可以获取到第二蓝牙模块302的 蓝牙地址,实现蓝牙地址交换,进而可以进行快速配对和连接。
第三种方式:对讲设备2和骨传导耳机1均主动发送彼此的蓝牙地址,节省彼此之间进行搜索和选择的时间,实现快速配对和连接。也即,第一NFC模块102可以存储或者获取第一蓝牙模块101的蓝牙地址,第二NFC模块303可以存储或者获取第二蓝牙模块302的蓝牙地址。第一NFC模块10和第二NFC模块303进行近场通信时,第一NFC模块102和第二NFC模块303交换彼此的蓝牙地址,实现蓝牙地址的交换。
对讲设备2通过外接通信模块3的第二NFC模块303和骨传导耳机1的第一NFC模块102实现快速的蓝牙连接,如此可以使得对讲设备2可以快速匹配不同的骨传导耳机1。以工业现场作业为例,不同的工作人员配置不同的骨传导耳机1,比如两个工作人员可以共用一台对讲设备2,该两个工作人员在轮班时可以交替使用共用的对讲设备2,通过骨传导耳机1可以快速连接对讲设备2。在一个工作人员在值班时,使用其的骨传导耳机1和对讲设备2实现“一碰即连”,进而可以使用对讲设备2和骨传导耳机1组成的通信系统。在该工作人员下班,另一个工作人员开始值班时,该另一个工作人员同样也可以将骨传导耳机1和对讲设备2“一碰即连”,进而使用对讲设备2和骨传导耳机1组成的通信系统,形成“独立”和“共用”并存的作业逻辑,独立的是每个人可以使用自个的骨传导耳机1,共用的是对讲设备2。本实施例的通信系统,还可以将骨传导耳机1标识个人,进而可以多人使用同一台对讲设备2,可以实现快速切换,还可以实现考勤打卡、识别个人身份等作用。
对讲设备2和骨传导耳机1通过NFC近场通信的方式快速进行蓝牙配对进而建立蓝牙连接,骨传导耳机1被佩戴时能够释放使用者的双耳,通过骨传导的方式传递声音,能够减少周围环境的噪声对声音传输的影响,提升语音通信的质量,而且通过骨传导耳机1来播放对讲设备2所接收到的音频信号或者通过骨传导耳机1来拾取声音经对讲设备2传输至其他对讲设备2,能够避免传统对讲外放的方式,更加能够保护隐私,此外对于工厂车间等应用场景而言,使用 者在使用骨传导耳机1进行对讲通信的同时也能够注意到周围环境的变化,能够保证使用者的安全。
对于骨传导耳机1而言,第一NFC模块102可以为无源型NFC模块。第一NFC模块102可以存储有第一蓝牙模块101的蓝牙地址,可以向第二NFC模块303发送第一蓝牙模块101的蓝牙地址。当然,第一NFC模块102也可以是有源型NFC模块,可以发送第一蓝牙模块101的蓝牙地址,也可以接收到第二NFC模块303所发送过来的第二蓝牙模块302的蓝牙地址。同理,第二NFC模块303也可是无源型NFC模块,也可以是有源型NFC模块。
在一些实施例中,第一NFC模块102可以贴设于骨传导耳机1的电池组件上,如此安装方便且结构简单,还能够节省空间。在需要和对讲设备2进行蓝牙连接时,将骨传导耳机1的电池组件对应的位置靠近对讲设备2上的外接通信模块3,即可快速地进行蓝牙配对。
在一些实施例中,骨传导耳机1的靠接左耳和右耳的两端可以分别包括一个第一NFC模块102和一个第一蓝牙模块101,两端的两个第一蓝牙模块101可以通过TWS(True Wireless Stereo)建立连接。在实际进行配对过程中,可以通过所述靠接左耳和右耳的两端的任意一端的第一NFC模块102与第二NFC模块303进行通讯,从而实现所述靠接左耳和右耳的两端的任意一端的第一蓝牙模块101和第二蓝牙模块302的快速配对。
图3是根据本申请一些实施例所示的骨传导耳机的整体结构俯视示意图,图4是根据本申请一些实施例所示的骨传导耳机的整体结构爆炸示意图。
在一些实施例中,如图3所示,骨传导耳机还包括耳挂组件12,以传感器组件17包括光学传感器为例,耳挂组件在佩戴时靠近佩戴者耳根的位置上开设有透射所述光学传感器的光信号的窗口,可选地,窗口可以呈跑道形设置。关于窗口的详细说明可参见本申请图9的相关描述,此处不做赘述。
在一些实施例中,如图3和图4所示,骨传导耳机可以包括两个扬声器组件11、两个耳挂组件12、连接于两个耳挂组件12之间的后挂组件13、电池 组件14和控制电路组件15。
在一些实施例中,两个扬声器组件11分别对应连接两个耳挂组件12,耳挂组件12连接于后挂组件13和扬声器组件11之间。耳挂组件12可以形成有容纳空间120,其中一个耳挂组件12的容纳空间120用于容纳电池组件14,另一个耳挂组件12的容纳空间120用于容纳控制电路组件15。电池组件14用于给骨传导耳机1进行供电,控制电路组件15用于控制骨传导耳机1的工作和实现相应的操作。
在一些实施例中,骨传导耳机1包括棍咪组件16,用于拾取声音。棍咪组件16可转动地连接扬声器组件11。棍咪组件16可以包括弹性连接杆161和拾音组件162。棍咪组件16的数量可以为一个,其连接两个扬声器组件11中的一个,例如棍咪组件16可以连接与电池组件14所对应的扬声器组件11。当然,在其他一些实施例中,每个扬声器组件11均可以连接一个棍咪组件16。如图4所示,弹性连接杆161的一端连接扬声器组件11。弹性连接杆161的另一端连接拾音组件162。拾音组件162可以具有一个或者多个麦克风。例如,拾音组件162的麦克风数量大于或者等于2个,麦克风之间可以间隔设置。例如,一个麦克风位于拾音组件162远离扬声器组件11的端部,其他麦克风可以位于拾音组件162与端部连接的侧面。便于多个麦克风之间协同工作,能够起到降噪以及提升拾音质量等作用。骨传导耳机1能够将音频转化成机械振动,也即,扬声器组件11在播放相应的音频时,该音频对应的语音频段时会使得扬声器113产生相应的振动。在一些实施例中,弹性连接杆161可以设置成使得扬声器组件11所产生的语音频段的振动从弹性连接杆161的一端传递到弹性连接杆161的另一端时的平均振幅衰减率不小于预设衰减率阈值。例如,所述均振幅衰减率不小于35%。又例如,上述平均振幅衰减率不小于45%。再例如,平均振幅衰减率不小于50%。再例如,平均振幅衰减率不小于55%。再例如,上述振幅衰减率不小于60%。再例如,上述振幅衰减率不小于70%。
在实际的使用中,骨传导耳机1的扬声器组件11所产生的机械振动会对 棍咪组件16的拾音效果造成不良影响,如回声等,为此,将弹性连接杆161设置成使得扬声器组件11所产生的语音频段的振动从弹性连接杆161的一端传递到弹性连接杆161的另一端时的平均振幅衰减率不小于所述预设衰减率阈值(例如35%),如此弹性连接杆161在振动传递的过程中可以有效地吸收振动,减少经弹性连接杆161的一端传递到另一端的振动幅度,进而减少了扬声器组件11所产生的振动而导致的拾音组件162的振动,能够有效地降低扬声器组件11的振动对拾音组件162的拾音效果的影响,提升拾音质量。
图5是根据本申请一些实施例所示的骨传导耳机中棍咪组件的结构拆解示意图。
在一些实施例中,如图5所示,弹性连接杆161可以包括棍咪弹性金属丝1611以及连接于棍咪弹性金属丝1611两端的接插部1612。也即棍咪弹性金属丝1611的两端各自连接有一个接插部1612。其中一个接插部1612用于与拾音组件162接插配合。另一个接插部1612用于和扬声器组件11接插配合。两个接插部1612的接插结构可以相同也可以不同,分别与拾音组件162和扬声器组件11相应的接插结构相适配。
在一些实施例中,棍咪弹性金属丝1611的弹性模量可以为70-90GPa。可选为,棍咪弹性金属丝1611的弹性模量为75-85GPa。可选为,棍咪弹性金属丝1611的弹性模量为80-84Gpa。可选为,棍咪弹性金属丝1611的弹性模量为81-83Gpa。棍咪弹性金属丝1611的材料可以为弹簧钢、钛、其他金属或非金属材料。通过设置棍咪弹性金属丝1611的弹性模量为70-90GPa,可以使得棍咪弹性金属丝1611具有良好地吸收振动的能力,可以满足棍咪组件16的吸振能力的要求,进而可以提高拾音组件162的拾音质量。
在一些实施例中,如图5所示,弹性连接杆161可以包括包覆于棍咪弹性金属丝1611外周的棍咪弹性覆层1613,棍咪弹性覆层1613的弹性模量为0.5-2Gpa。可选为,棍咪弹性覆层1613的弹性模量为0.8-1.5Gpa。可选为,棍咪弹性覆层1613的弹性模量为1.2-1.4Gpa。棍咪弹性覆层1613可以进一步覆盖部分 接插部1612,进而可以保护棍咪弹性金属丝1611和接插部1612。棍咪弹性覆层1613的材料可以为硅胶、橡胶、塑胶等。可选地,棍咪弹性覆层1613沿其长度方向可以开设有导线通道,导线通道可以和棍咪弹性金属丝1611并列间隔设置。接插部1612可以开设有连通导线通道的埋线槽,用于连接拾音组件162的导线组可以经相邻的接插部1612的埋线槽进入到导线通道内,进而再经另一个接插部1612进入到扬声器组件11内。
通过将棍咪弹性覆层1613的弹性模量设置为0.5-2Gpa,而且由于棍咪弹性覆层1613包覆在棍咪弹性金属丝1611外,可以将棍咪弹性金属丝1611所往外传递的振动进一步吸收,形成了内外协同吸振的效果,能够较大地提升棍咪组件16的吸振效果,有效地减少传递到拾音组件162的振动,提升拾音质量。
图6是根据本申请一些实施例所示的骨传导耳机中扬声器组件的结构一爆炸示意图。在一些实施例中,如图6所示,扬声器组件11可以包括第一扬声器壳体111、第二扬声器壳体112、扬声器113、转动件114以及压持件115。第一扬声器壳体111和第二扬声器壳体112配合连接,以形成用于容纳扬声器113的收容空间110。
第一扬声器壳体111可以与弹性连接杆161的一端接插配合。为了便于调节棍咪组件16的拾音位置,可以设置棍咪组件16能够相对于第一扬声器壳体111进行转动。在一些实施例中,扬声器组件11可以包括转动件114。第一扬声器壳体111可以开设有第一通孔1110。转动件114可转动地插设于第一通孔1110内,接插部1612可以与转动件114接插配合,以使得棍咪组件16可以相对于第一扬声器壳体111转动。
在一些实施例中,第一扬声器壳体111可以开设有与第一通孔1110间隔设置的第二通孔1111。第二通孔1111用于供耳挂组件12进行接插配合,进而使得扬声器组件11和耳挂组件12连接。其中,第一通孔1110和第二通孔1111均连通收容空间110。
具体地,第一扬声器壳体111可以包括相互连接的底壁1112和侧壁1113。 侧壁1113环绕连接底壁1112,第二扬声器壳体112盖设于侧壁1113远离底壁1112的一侧,以形成用于容纳扬声器113的收容空间110。第一通孔1110形成于底壁1112,第二通孔1111形成于侧壁1113。第一通孔1110可以形成于底壁1112邻近第二通孔1111的一侧,以使得第一通孔1110和第二通孔1111相邻。具体地,底壁1112具有背离收容空间110凸起的第一凸部1114,第一通孔1110形成于第一凸部1114,侧壁1113具有背离收容空间110凸起的第二凸部1115,第二通孔1111形成于第二凸部1115,第一凸部1114的凸起方向和第二凸部1115的凸起方向相互垂直,且第一凸部1114和第二凸部1115之间弧形连接。
通过底壁1112设置的第一凸部1114和侧壁1113设置的第二凸部1115,两者的凸起方向相互垂直且弧形连接,能够增强第一扬声器壳体111的结构强度和结构稳定性,而且转动件114嵌入到第一凸部1114的第一通孔1110内,第一凸部1114具有相应的高度可以使得棍咪组件16的转动不会受到第一扬声器壳体111的干扰,第一凸部1114和第二凸部1115的凸起方向相互垂直也可以减少耳挂组件12和棍咪组件16之间产生相互干涉的可能。
在本实施例中,拾音组件162可以通过相应的导线组连接骨传导耳机1上的其他相关部件,例如电池组件14或者控制电路组件15,用于将所获取的音频信号传输至相关部件上进行后续的处理。棍咪组件16的导线组可以穿过弹性连接杆161的棍咪弹性覆层1613,并经接插部1612引出。棍咪组件16的导线组可以经接插部1612穿出后进入到第一扬声器壳体111内。在一些实施例中,棍咪组件16的导线组可以穿入第一通孔1110,并经收容空间110穿至第二通孔1111内。棍咪组件16的导线组可以进一步从第二通孔1111依次穿经耳挂组件12进入到容纳空间120内,电性连接电池组件14或者控制电路组件15。
在实际的使用中,棍咪组件16能够相对于第一扬声器壳体111转动,会使得棍咪组件16的导线组移动,如此可能会由于导线组的不当移动而限制棍咪组件16的转动,而且导线组也可能会将扬声器组件11的振动传递到拾音组件162,进而影响拾音组件162的拾音效果,而且还可能影响电连接稳定性,为此, 本申请发明人提出下述方案,以改善上述技术问题。
图7是根据本申请一些实施例所示的骨传导耳机中扬声器组件的结构另一爆炸示意图。在一些实施例中,如图7所示,扬声器组件11可以包括压持件115,用于压持棍咪组件16的导线组。具体地,压持件115可以设置于收容空间110内且覆盖第一通孔1110,以用于压持经第一通孔1110穿引至第二通孔1111的棍咪组件16的导线组。如此,可以限制棍咪组件16的导线组的活动空间,减少导线组的晃动或者移动,进而能够减少由于扬声器组件11的振动而产生的振动和传递到拾音组件162的振动,提到拾音组件162的拾音效果,也能够提升电性稳定性,此外,压持件115的压持也可以减少导线组和第一扬声器壳体111的摩擦,进而可以保护导线组。收容空间110是第一扬声器壳体111和第二扬声器壳体112配合连接之后所形成的,在图7中将收容空间110标注在第一扬声器壳体111处,仅是为了便于理解和说明。此外,由于转动件114插置于第一通孔1110内,第一通孔1110被转动件114占据,因此,在图7中将第一通孔1110标注在转动件114处,也是为了便于理解和说明。
在一些实施例中,压持件115可以包括层叠设置的硬质盖板1151和弹性体1152。硬质盖板1151相较于弹性体1152远离第一通孔1110,弹性体1152用于接触棍咪组件16的导线组,硬质盖板1151的硬度大于弹性体1152的硬度。硬质盖板1151通过压持弹性体1152接触导线组,由于硬质盖板1151的硬度比弹性体1152的硬度大,硬度较大的硬质盖板1151可以保证了压持导线组的刚度,而硬度较小的弹性体1152可以提高对导线组移动或者振动的吸收,减少导线组的振动,起到缓冲和保护的作用。
具体地,第一扬声器壳体111在第一通孔1110的外围设置有往收容空间110内凸出的多个凸柱1117。多个凸柱1117可以间隔设置于第一通孔1110的外围。硬质盖板1151可以固定于多个凸柱1117,弹性体1152可以设置于多个凸柱1117之间。例如,凸柱1117的数量为三个。通过设置于第一通孔1110外围的多个凸柱1117固定硬质盖板1151,进而将弹性体1152压持棍咪组件16的 导线组,可以提高硬质盖板1151的稳定性,进而可以提高弹性体1152跟导线组接触的稳定性。
可选地,硬质盖板1151为钢片,弹性体1152为泡棉。硬质盖板1151也可以是其他材料,比如塑料、陶瓷等,弹性体1152也可以是其他材料、比如硅胶、纤维等。
基于上述描述,通过设置压持件115压持棍咪组件16的导线组,可以减少导线组由于扬声器组件11的振动而产生的振动,也可以增强棍咪组件16在转动过程导线组的稳定性,也能够保护棍咪组件16的导线组。此外,棍咪组件16的转动也需要具备良好的稳定性,也即转动件114和第一通孔1110的配合结构对棍咪组件16的转动稳定性起到较大作用。
图8是根据本申请一些实施例所示的骨传导耳机中耳挂组件的结构一爆炸示意图,图9是根据本申请一些实施例所示的骨传导耳机中耳挂组件的结构另一爆炸示意图。
在一些实施例中,如图8和图9所示,耳挂组件12可以包括第一耳挂壳体121、连接部件122以及第二耳挂壳体123。连接部件122的一端可以连接第一耳挂壳体121。连接部件122的另一端连接扬声器113。例如,连接部件122的另一端插置于第一扬声器壳体111的第二通孔1111内,以和扬声器组件11接插配合。第一耳挂壳体121和第二耳挂壳体123可以配合连接,以形成收容电池组件14或者控制电路组件15的容纳空间120。在本实施例中,其中一个耳挂组件12的容纳空间120用于收容电池组件14,如图8所示的耳挂组件12。另一个耳挂组件12的容纳空间120用于收容控制电路组件15,如图9所示的耳挂组件12。
在一些实施例中,如图8所示,电池组件14可以包括电池壳体(未标注)和设置于电池壳体内的电芯(图未示),电芯用于存储电量。上述本申请耳机通信系统实施例中所提及的第一NFC模块102可以贴设于电池组件14上,例如贴设于电池壳体上,如此可以减小骨传导耳机1的体积,也减少第一NFC模块 102与控制电路组件15之间的电磁干扰或者信号干扰等情况。
在一些实施例中,如图9所示,控制电路组件15可以包括电路板151、电源接口152、按键153、天线154等。如图2所示的第一蓝牙模块101可以集成于控制电路组件15。控制电路组件15还可以集成有其他的电路以及元件。例如,第一蓝牙模块101可以集成于电路板151上。传感器组件17也可以集成于电路板151上。
在一些实施例中,如图9所示,以传感器组件17包括光学传感器为例,第一耳挂壳体121可以形成用于透射光学传感器的光信号的窗口1200。窗口1200可以邻近连接部件122设置,以使得骨传导耳机1在被佩戴时窗口1200贴近使用者的邻近耳朵根部的位置。此外,在一些实施例中,窗口还可以设置在后挂组件13或其他位置。在一些实施例中,若传感器组件17为加速度传感器时,还可以将其设置在容纳空间120内。
在一些实施例中,窗口1200呈跑道形设置,需要说明的是,在一些其他实施例中,根据传感器组件17的形式,窗口1200的形状和样式还可根据实际情况进行调整,如为了避免传感器被污染或水气、灰尘进入骨传导耳机1中,传感器组件17为光学类传感器时,可以在窗口1200上设置玻璃等结构。另一个示例,当传感器组件17为接触传感器时,窗口1200可以根据接触部的形状设置为其他形状。
可选地,连接部件122的中轴线的延长线和窗口1200的长轴相交,如图9中示意性示出大致的相交关系。通过设置连接部件122的中轴线的延长线和窗口1200的长轴相交,可以使得窗口1200能够有效地贴近使用者邻近耳朵根部的位置,进而可以保证传感器组件7的灵敏性和检测的有效性。具体地,用于容纳控制电路组件15的耳挂组件12的第一耳挂壳体121可以形成上述窗口1200。
骨传导耳机1的发展趋势会朝向轻便化、体积小型化,而耳挂组件12用于容纳电池组件14或者控制电路组件15以及相关的走线等,往往是骨传导耳机1体积较大的地方,而耳挂组件12中的相关扣位、卡扣结构的设计会影响整 个耳挂组件12的体积。为了减少耳挂组件12的体积,本实施例提供了如下耳挂组件的壳体结构。
在一些实施例中,骨传导耳机1可以包括两个扬声器组件11和两个耳挂组件12,每个扬声器组件11和两个耳挂组件12单独组成用于佩戴的耳机左耳和耳机右耳,具体的,电池组件14和控制电路组件15可以分别设置于两个耳挂组件围成的容纳空间120内。在一些实施例中,如图2中所述,两个第一蓝牙模块101可以分别设于两容纳空间120内,并通过TWS建立连接。需要说明的是,在上述实施例中,可以通过耳挂组件保持与用户耳部的固定,因此可以无需耳挂组件12,此外,骨传导耳机1还可以包括耳挂组件12,但由于两个第一蓝牙模块101通过TWS连接,因此耳挂组件内无需走线。
图10是根据本申请一些实施例所示的骨传导耳机中第一耳挂壳体和第二耳挂壳体的一结构示意图,图11是根据本申请一些实施例所示的骨传导耳机中第一耳挂壳体和第二耳挂壳体的另一结构示意图,图12是图3中以B-B为剖切线的截面结构示意图。
在一些实施例中,如图10所示,第一耳挂壳体121可以形成有间隔设置的第一卡槽1211和第二卡槽1212,第二耳挂壳体123可以形成有间隔设置的第一卡块1231和第二卡块1232,第一卡槽1211和第一卡块1231可以卡接配合,第二卡槽1212和第二卡块1232卡接配合,进而使得第一耳挂壳体121和第二耳挂壳体123可以卡接配合。
在一些实施例中,容纳空间120可以具有相互垂直的长度方向和厚度方向。本实施例下述内容,若无特殊注明,长度方向均指容纳空间120的长度方向,厚度方向均指容纳空间120的厚度方向。
如图10和图11所示,第一耳挂壳体121和第二耳挂壳体123沿垂直于长度方向和厚度方向的拼接方向彼此拼接,进而形成容纳空间120。例如,第一耳挂壳体121具有第一子容纳空间1210,第二耳挂壳体123具有第二子容纳空间1230,第一耳挂壳体121和第二耳挂壳体123拼接后,第一子容纳空间1210 和第二子容纳空间1230组合成容纳空间120。
在一些实施例中,第一耳挂壳体121沿长度方向间隔可以形成有开口方向相同的第一卡槽1211和第二卡槽1212。也即,第一卡槽1211和第二卡槽1212的开口所朝向的方向是相同的。第二耳挂壳体123沿长度方向凸出设置有延伸方向相同的第一卡块1231和第二卡块1232。也即,第一卡块1231和第二卡块1232在长度方向上间隔设置,且两者的凸出方向相同,进而两者朝向同一方向,可以使得第一卡块1231和第二卡块1232可以沿同一方向分别嵌入到第一卡槽1211和第二卡槽1212内。
在一些实施例中,如图12所示,第一卡块1231可以嵌入第一卡槽1211内,第二卡块1232可以嵌入第二卡槽1212内,以限制第一耳挂壳体121和第二耳挂壳体123在拼接方向和厚度方向上的相对移动。
在一些实施例中,第一耳挂壳体121的拼接边缘1201和第二耳挂壳体123的拼接边缘1202可以彼此契合,以限制第一耳挂壳体121和第二耳挂壳体123在长度方向相对移动。在本实施例中,第一耳挂壳体121和第二耳挂壳体123拼接可以是指第一耳挂壳体121的拼接边缘1201和第二耳挂壳体123的拼接边缘1202大致上接触且连接。其中,第一耳挂壳体121的拼接边缘1201可以是指第一耳挂壳体121朝向第二耳挂壳体123一侧的边缘,用于和第二耳挂壳体123进行拼接,如图10所示的拼接边缘1201。同理,第二耳挂壳体123的拼接边缘1202可以是指第二耳挂壳体123朝向第一耳挂壳体121一侧的边缘,用于和第一耳挂壳体121进行拼接,如图11所示的拼接边缘1202。例如,第一耳挂壳体121的拼接边缘1201和第二耳挂壳体123的拼接边缘1202的形状相适应,两者能够契合或者互补,进而形成一个稳定的配合结构,可以限制两者在长度方向上的相对移动。
在一些实施例中,对于第一卡块1231和第二卡块1232的延伸方向相反而言,第一卡块1231和第二卡块1232分别向相反的方向凸出,必然会导致第一卡块1231和第二卡块1232额外占用的空间增大,第一卡槽1211和第二卡槽 1212为了能够使得第一卡块1231和第二卡块1232能够嵌入,也需要在长度方向上增大距离,以能够罩住第一卡块1231和第二卡块1232,而本实施例通过设置开口方向相同的第一卡槽1211和第二卡槽1212以及延伸方向相同的第一卡块1231和第二卡块1232,如此可以使得第一卡块1231和第二卡块1232与第一卡槽1211和第二卡槽1212的配合方向是相同的,由于第一卡块1231和第二卡块1232的延伸方向相同,可以减少第一卡块1231和第二卡块1232所额外占用的体积,进而可以减小第一卡块1231和第二卡块1232和第一卡槽1211和第二卡槽1212配合的所占据的体积,如此可以有效地减小耳挂组件12的体积,此外,利用第一耳挂壳体121的拼接边缘1201和第二耳挂壳体123的拼接边缘1202彼此契合,可以无需设置额外的卡扣、凸起等结构,如此使得耳挂组件12结构更紧凑且也可以减小耳挂组件12的体积。同时,通过第一卡块1231和第二卡块1232与第一卡槽1211和第二卡槽1212的配合能够限制拼接方向和厚度方向的位移,通过拼接边缘1201、1202的契合能够限制长度方向的位移,如此能够使得第一耳挂壳体121和第二耳挂壳体123的拼接更稳定,结构更可靠。
在一些实施例中,如图10所示,第一卡槽1211和第二卡槽1212可以分别位于第一耳挂壳体121沿长度方向上的两侧,第一卡槽1211的开口方向朝向容纳空间120,第二卡槽1212的开口方向背离容纳空间120。也即,第一卡槽1211的开口方向朝向第一子容纳空间1210,第二卡槽1212的开口方向背离第一子容纳空间1210。可选地,第一卡槽1211开设于第一耳挂壳体121靠近连接部件122的一侧,第二卡槽1212开设于第一耳挂壳体121远离连接部件122的一侧。
在一些实施例中,如图11所示,第一卡块1231和第二卡块1232可以分别位于第二耳挂壳体123沿长度方向上的两侧,第一卡块1231的延伸方向背离第一卡槽1211,第二卡块1232的延伸方向朝向第一卡槽1211内。也即,第一卡块1231的延伸方向背离第二子容纳空间1230,第二卡块1232的延伸方向朝向第二子容纳空间1230。相应地,第一卡块1231设置于第二耳挂壳体123靠近 连接部件122的一侧,第二卡块1232设置于第二耳挂壳体123远离连接部件122的一侧。由于第二卡块1232向容纳空间120内凸出延伸,相对于向容纳空间120外凸出延伸而言,不需要占据额外的空间,能够节省了相应的空间,第二卡槽1212在配合时位于第二卡块1232延伸方向的前方,两者嵌入配合,也能够减小耳挂组件12的体积。
在一些实施例中,第一耳挂壳体121的拼接边缘1201设置有第一止挡部1213,第二耳挂壳体123的拼接边缘1202设置有第二止挡部1234,第一止挡部1213和第二止挡部1234彼此契合,以限制第一耳挂壳体121和第二耳挂壳体123在长度方向上的相对移动。例如,第一止挡部1213为第一耳挂壳体121的拼接边缘1201所形成的开口部,第二止挡部1234为第二耳挂壳体123的拼接边缘1202形成的凸出部,开口部和凸出部的外形相适应,能够彼此契合,进而使得第一耳挂壳体121的拼接边缘1201和第二耳挂壳体123的拼接边缘1202可以互补,以限制两者在长度方向的相对移动。
第一卡槽1211的开口方向朝向容纳空间120的,如果直接第一子容纳空间1210内形成第一卡槽1211,在利用相应模具形成第一子容纳空间1210和第一卡槽1211的过程中,形成第一子容纳空间1210的拔模方向和形成第一卡槽1211的拔模方向可能相互干扰,由于的第一卡槽1211的拔模方向是在第一子容纳空间1210内,还可以与其他结构的拔模方向产生冲突,给生产上带来较大的困难。
图13是根据本申请一些实施例所示的骨传导耳机中第一耳挂壳体和第二耳挂壳体的又一结构示意图。在一些实施例中,如图13所示,第一耳挂壳体121可以开设有从容纳空间120外到容纳空间120内的方向上彼此连通的外侧孔段1215和内侧孔段1216。也即,外侧孔段1215的开口方向背向容纳空间120,内侧孔段1216的开口方向朝向容纳空间120,外侧孔段1215和内侧孔段1216连通。外侧孔段1215内填设有填充件1217。填充件1217例如是橡胶件,例如是硬胶。外侧孔段1215被填充封堵后,内侧孔段1216就可以作为第一卡槽1211, 内侧孔段1216的开口方向朝向容纳空间120,可以和第一卡块1231进行配合。
在实际的制造过程中,可以从第一耳挂壳体121外到第一耳挂壳体121内,依次形成有外侧孔段1215和内侧孔段1216,拔模方向不在第一子容纳空间1210内进行,而是在第一耳挂壳体121外,接着再使用填充件1217填充外侧孔段1215,使得剩下的内侧孔段1216可以作为第一卡槽1211,如此有效地减低制造难度和制造的复杂性,节省成本。
在一些实施例中,外侧孔段1215垂直于外侧孔段1215和内侧孔段1216的连通方向的横截面积大于内侧孔段1216垂直于外侧孔段1215和内侧孔段1216的连通方向的横截面积。由于外侧孔段1215相应的横截面积大于内侧孔段1216相应的横截面积,可以便于在外侧孔段1215内填设填充件1217,进而可以具有更好的封堵效果,进而更快速地形成第一卡槽1211。
在一些实施例中,如图10至图12所示,第二耳挂壳体123远离连接部件122的部分壳体开设有电源插孔1233。电源插孔1233连通容纳空间120,电源插孔1233用于容纳电源接口152。例如,第二耳挂壳体123也可以具有壳体底部和壳体侧部,壳体侧部环绕连接壳体底部,以形成第二子容纳空间1230。壳体侧部远离壳体底部的一侧边缘则作为与第一耳挂壳体121进行拼接的拼接边缘1202。电源插孔1233开设于壳体侧部,连通第二子容纳空间1230,也即连通容纳空间120。
在一些实施例中,如图12所示,第二卡块1232邻近电源插孔1233设置。也即,第二卡块1232凸出设置于第二耳挂壳体123远离连接部件122的部分壳体,且朝向容纳空间120内。在本实施例中,第二卡块1232相较于电源插孔1233更靠近容纳空间120。可以换言之,第二卡块1232相较于电源插孔1233更靠近连接部件122。
在一些实施例中,第二卡块1232和电源插孔1233在垂直于长度方向的第一基准面上的投影彼此重叠。在本实施例中,彼此重叠包括部分重叠(也即,重叠的部分是第二卡块1232投影的一部分,也是电源插孔1233投影的一部分), 也包括全部重叠(也即第二卡块1232的投影完全落入到电源插孔1233的投影内)。可选地,以垂直于长度方向的平面作为第一基准面,第二卡块1232在第一基准面上的投影位于电源插孔1233在第一基准面上的投影内,也即两者的投影范围全部重叠。如此设置第二卡块1232和电源插孔1233的位置,可以在不影响电源接口152的安装的情况下使得第二耳挂壳体123的结构紧凑,减小耳挂组件12的体积。
在一些实施例中,第二卡块1232和电源插孔1233在垂直于拼接方向的第二基准面上的投影彼此重叠。此处的彼此重叠也同样是包括部分重叠,也包括全部重叠。可选地,以垂直于拼接方向的平面作为第二基准面,第二卡块1232在第二基准面上的投影也位于电源插孔1233在第二基准面上的投影内,也即两者的投影范围也全部重叠。如此可以使得第二卡块1232和电源插孔1233无论是在拼接方向还是长度方向上结构安排都比较紧凑,能够较大化地节省电源插孔1233和第二卡块1232所占用的空间,以提升耳挂组件12的结构紧凑性。
此外,在工业等生产制造领域使用骨传导耳机1,对于骨传导耳机1的操控体验有极大的要求,将电源插孔1233开设于第二耳挂壳体123远离连接部件122的部分壳体可以提高骨传导耳机1的操作体验,原因如下:
骨传导耳机1一般会具有音量按键等,按照现有的常规手段,按键153等对应的按键孔1235和电源插孔1233一般会开设第二耳挂壳体123的壳体底部,也即第二耳挂壳体123远离第一耳挂壳体121的部分壳体。由于壳体底部的面积比较受限,因此按键孔1235和电源插孔1233之间比较紧凑,按键孔1235和电源插孔1233尽可能不多占地方。在工业等生产制造领域,佩戴者可能穿着工作服或者手套等,按键孔1235较小,排列太紧凑,会导致佩戴者的操控体验下降,极容易导致误操控。而本实施例不在壳体底部上开设电源插孔1233,而是在壳体侧部上开设电源插孔1233,那么按键孔1235的大小可以设计得较大,相互之间排列可以较为宽松,如此可以便于使用者进行操作,减少误操控的发生。
此外,基于上述电源插孔1233的设计,如果将第二卡块1232设置于第 二耳挂壳体123邻近电源插孔1233且朝向第一耳挂壳体121的顶部位置(如图11所示的连接第二卡块1232的平台区域,也即第二卡块1232可以视为从该平台区域往第二子容纳空间1230内延伸形成的),会挤压第一耳挂壳体121的接插孔1218的空间,进而会影响到耳挂组件12和后挂组件13之间的接插配合,第二卡块1232需要占据额外的空间,会使得第一耳挂壳体121和第二耳挂壳体123在拼接方向上的拼接占据较大的空间,不够紧凑,因此,本实施例通过将电源插孔1233设置于第二耳挂壳体123的壳体底部,以及以上述投影关系设置第二卡块1232和电源插孔1233之间结构关系,使得第二耳挂壳体123在拼接方向上结构更紧凑,第二卡块1232朝向容纳空间120内延伸,可以不用占据额外的空间,进而可以将耳挂壳体12的体积小型化。
基于上述详细描述,第一耳挂壳体121和第二耳挂壳体123之间稳定的拼接结构可以保护容纳空间120内的电池组件14和控制电路组件15。当然,为了能够减少骨传导耳机1的故障率,不仅需要保证结构的稳定性,也需要保证电气连接的稳定性。骨传导耳机1内到导线组在扬声器组件11、耳挂组件12之间走线,走线的稳定性关系到骨传导组件的可靠性。为了提高走线的可靠性,耳挂组件12可以设置相应的卡线结构,以在导线组穿过耳挂组件12时保证导线的稳定,具体可以参见如下描述。
在一些实施例中,连接部件122可以包括耳挂弹性金属丝1221和连接于耳挂弹性金属丝1221一端的接头部1222。为了保护耳挂弹性金属丝1221,连接部件122也可以包括至少包覆于耳挂弹性金属丝1221的外周的耳挂弹性覆层1223(如图10所示)。当然,耳挂弹性金属丝1221还可以进一步包覆第一耳挂壳体121。接头部1222用于与扬声器组件11进行接插配合。耳挂弹性金属丝1221的另一端连接第一耳挂壳体121。
图14是根据本申请一些实施例所示的骨传导耳机中后挂组件的结构爆炸示意图,图15是根据本申请一些实施例所示的骨传导耳机中耳挂组件的结构示意图。
在一些实施例中,如图14所示,后挂组件13可以包括后挂弹性金属丝131、包覆在后挂弹性金属丝131上的后挂弹性覆层132以及设置于后挂弹性金属丝131两端的插置部133。后挂弹性覆层132还可以包覆至少部分插置部133。
在一些实施例中,插置部133用于与耳挂组件12接插配合。具体地,第一耳挂壳体121远离连接部件122的一侧开设有连通容纳空间120的接插孔1218。接插孔1218和第二卡槽1212相邻设置。插置部133可以和接插孔1218接插配合。至少一个插置部133在其长度方向上间隔开设有两组开槽1331。也即,至少一个插置部133在插置部133的长度方向上间隔开设有两组开槽1331,每组开槽1331包括至少一个开槽1331。后挂弹性金属丝131经插置部133的一端插置于插置部133内。一组开槽1331邻近插置部133,另一组开槽1331远离插置部133的一端。
在一些实施例中,插置部133从插置部133的一端到插置部133的另一端的方向上,依次开设有上述两组开槽1331。靠近插置部133的一端的开槽1331用于进行模具定位。远离插置部133的一端的开槽1331用于与第一耳挂壳体121进行卡接配合。
例如,两组开槽1331分为第一组开槽1331和第二组开槽1331,第一组开槽1331远离插置部133的一端,并用于和耳挂组件12进行卡接配合。如图14和18所示,第一耳挂壳体121凸出设置有卡接部12181。例如,第一耳挂壳体121的接插孔1218内凸出设置有卡接部12181。插置部133插接于接插孔1218内且卡接部12181嵌入第一组开槽1331内,进而限制耳挂组件12和后挂组件13的相对移动。
第二开槽1331靠近插置部133的一端,并用于进行模具定位。也即,第二组开槽1331用于和模具上相应的凸出结构进行配合,进而将插置部133精确地固定于某个位置,进而能够对其进行其他的工序,提升良品率。例如利用第二组开槽1331对插置部133和后挂弹性金属丝131进行定位,进而可以通过注塑方式形成后挂弹性覆层132。
可选地,开槽1331自插置部133位于其中轴线两侧的边缘往中轴线方向延伸设置。每组开槽1331包括两个开槽1331,每组的两个开槽1331相背设置。
上文已对基本概念做了描述,显然,对于本领域技术人员来说,上述详细披露仅仅作为示例,而并不构成对本说明书的限定。虽然此处并没有明确说明,本领域技术人员可能会对本说明书进行各种修改、改进和修正。该类修改、改进和修正在本说明书中被建议,所以该类修改、改进、修正仍属于本说明书示范实施例的精神和范围。
同时,本说明书使用了特定词语来描述本说明书的实施例。如“一个实施例”、“一实施例”、和/或“一些实施例”意指与本说明书至少一个实施例相关的某一特征、结构或特点。因此,应强调并注意的是,本说明书中在不同位置两次或多次提及的“一实施例”或“一个实施例”或“一个替代性实施例”并不一定是指同一实施例。此外,本说明书的一个或多个实施例中的某些特征、结构或特点可以进行适当的组合。
同理,应当注意的是,为了简化本说明书披露的表述,从而帮助对一个或多个发明实施例的理解,前文对本说明书实施例的描述中,有时会将多种特征归并至一个实施例、附图或对其的描述中。但是,这种披露方法并不意味着本说明书对象所需要的特征比权利要求中提及的特征多。实际上,实施例的特征要少于上述披露的单个实施例的全部特征。
一些实施例中使用了描述成分、属性数量的数字,应当理解的是,此类用于实施例描述的数字,尽管本说明书一些实施例中用于确认其范围广度的数值域和参数为近似值,在具体实施例中,此类数值的设定在可行范围内尽可能精确。
针对本说明书引用的每个专利、专利申请、专利申请公开物和其他材料,如文章、书籍、说明书、出版物、文档等,特此将其全部内容并入本说明书作为参考。与本说明书内容不一致或产生冲突的申请历史文件除外,对本说明书权利要求最广范围有限制的文件(当前或之后附加于本说明书中的)也除外。需要说明的是,如果本说明书附属材料中的描述、定义、和/或术语的使用与本说明书 所述内容有不一致或冲突的地方,以本说明书的描述、定义和/或术语的使用为准。
最后,应当理解的是,本说明书中所述实施例仅用以说明本说明书实施例的原则。其他的变形也可能属于本说明书的范围。因此,作为示例而非限制,本说明书实施例的替代配置可视为与本说明书的教导一致。相应地,本说明书的实施例不仅限于本说明书明确介绍和描述的实施例。

Claims (22)

  1. 一种耳机通信系统,其特征在于,包括:
    骨传导耳机,包括第一蓝牙模块;
    对讲设备,包括第一外接接口;
    外接通信模块,包括第二外接接口和第二蓝牙模块,所述外接通信模块可拆卸地设置于所述对讲设备,并通过所述第一外接接口和所述第二外接接口耦接所述对讲设备;其中,
    所述骨传导耳机和所述对讲设备通过所述第一蓝牙模块和所述第二蓝牙模块进行蓝牙配对以建立蓝牙连接。
  2. 根据权利要求1所述的耳机通信系统,其特征在于:
    所述骨传导耳机还包括传感器组件;
    所述传感器组件用于检测所述骨传导耳机是否被佩戴;在被佩戴时,控制所述骨传导耳机进行拾音和/或语音播放;在未被佩戴时,控制所述对讲设备进行拾音和/或语音播放。
  3. 根据权利要求2所述的耳机通信系统,其特征在于:
    所述骨传导耳机还包括耳挂组件;
    所述传感器组件包括光学传感器,其中,所述耳挂组件在佩戴时靠近佩戴者耳根的位置上开设有透射所述光学传感器的光信号的窗口。
  4. 根据权利要求3所述的耳机通信系统,其特征在于:
    所述窗口具有跑道型外轮廓。
  5. 根据权利要求1所述的耳机通信系统,其特征在于:
    所述骨传导耳机还包括第一NFC模块;
    所述外接通信模块还包括第二NFC模块,所述骨传导耳机和所述对讲设备 通过所述第一NFC模块和所述第二NFC模块交换蓝牙地址,使得所述第一蓝牙模块和所述第二蓝牙模块进行蓝牙配对以建立蓝牙连接。
  6. 根据权利要求5所述的耳机通信系统,其特征在于:
    所述第一NFC模块为无源型NFC模块;所述无源型NFC模块内储存有第一蓝牙模块的蓝牙地址。
  7. 根据权利要求5所述的耳机通信系统,其特征在于:
    所述骨传导耳机中的耳挂组件内围设有容纳空间;所述第一NFC模块设于所述容纳空间内。
  8. 根据权利要求1-7中任一项所述的耳机通信系统,其特征在于:
    所述骨传导耳机还包括扬声器组件、耳挂组件、电池组件和控制电路组件;
    所述扬声器组件与所述耳挂组件连接;
    所述耳挂组件内围设有容纳空间,所述容纳空间用于容纳所述电池组件和/或控制电路组件。
  9. 根据权利要求8所述的耳机通信系统,其特征在于:
    所述骨传导耳机包括两个扬声器组件和两个耳挂组件;
    所述骨传导耳机还包括后挂组件,所述后挂组件用于连接两个所述耳挂组件。
  10. 根据权利要求9所述的耳机通信系统,其特征在于:
    所述电池组件和所述控制电路组件分别设置于所述两个耳挂组件内的容纳空间内。
  11. 根据权利要求8所述的耳机通信系统,其特征在于:
    所述耳挂组件包括第一耳挂壳体、连接部件以及第二耳挂壳体,所述连接部件的一端连接所述第一耳挂壳体,所述连接部件的另一端连接所述扬声器组件,所述第一耳挂壳体和所述第二耳挂壳体配合连接,以形成所述容纳空间。
  12. 根据权利要求11所述的耳机通信系统,其特征在于:
    所述容纳空间具有相互垂直的长度方向和厚度方向,所述第一耳挂壳体和所述第二耳挂壳体沿垂直于所述长度方向和所述厚度方向的拼接方向彼此拼接以形成所述容纳空间,所述第一耳挂壳体沿所述长度方向间隔形成有开口方向相同的第一卡槽和第二卡槽,所述第二耳挂壳体沿所述长度方向上凸出设置有延伸方向相同的第一卡块和第二卡块,所述第一卡块嵌入所述第一卡槽内,所述第二卡块嵌入所述第二卡槽内,以限制所述第一耳挂壳体和所述第二耳挂壳体在所述拼接方向和所述厚度方向上的相对移动,所述第一耳挂壳体和所述第二耳挂壳体的拼接边缘彼此契合,以限制所述第一耳挂壳体和所述第二耳挂壳体在所述长度方向相对移动。
  13. 根据权利要求12所述的耳机通信系统,其特征在于:
    所述第一卡槽和所述第二卡槽位于所述第一耳挂壳体沿所述长度方向上的两侧,所述第一卡槽的开口方向朝向所述容纳空间,所述第二卡槽的开口方向背离所述容纳空间,所述第一卡块和所述第二卡块分别位于所述第二耳挂壳体沿所述长度方向上的两侧,所述第一卡块的延伸方向背离所述第一卡槽,所述第二卡块的延伸方向朝向所述第一卡槽内。
  14. 根据权利要求13所述的耳机通信系统,其特征在于:
    所述第一耳挂壳体的拼接边缘设置有第一止挡部,所述第二耳挂壳体的拼接边缘设置有第二止挡部,所述第一止挡部和所述第二止挡部彼此契合,以限制所述第一耳挂壳体和所述第二耳挂壳体在所述长度方向上的相对移动。
  15. 根据权利要求14所述的耳机通信系统,其特征在于:
    所述第一卡槽设置于所述第一耳挂壳体靠近所述连接部件的一侧,所述第二卡槽设置于所述第一耳挂壳体远离所述连接部件的一侧。
  16. 根据权利要求15所述的耳机通信系统,其特征在于:
    所述第一耳挂壳体开设有从所述容纳空间外到所述容纳空间内的方向上彼此连通的外侧孔段和内侧孔段,所述外侧孔段内填设有填充件,所述内侧孔段作为所述第一卡槽。
  17. 根据权利要求13-16中任一项所述的耳机通信系统,其特征在于:
    所述第二耳挂壳体远离所述连接部件的部分壳体开设有电源插孔,所述电源插孔连通所述容纳空间,所述电源插孔用于容纳电源接口,所述第二卡块邻近所述电源插孔设置,且所述第二卡块相较于所述电源插孔更靠近所述容纳空间,所述第二卡块和所述电源插孔在垂直于长度方向的第一基准面上的投影彼此重叠。
  18. 根据权利要求17所述的耳机通信系统,其特征在于:
    所述第二卡块和所述电源插孔在垂直于所述拼接方向的第二基准面上的投影彼此重叠。
  19. 根据权利要求8-18中任一项所述的耳机通信系统,其特征在于:
    所述骨传导耳机包括棍咪组件,所述棍咪组件可转动地连接所述扬声器组件,所述棍咪组件包括弹性连接杆和拾音组件,所述弹性连接杆的一端连接所述扬声器组件,所述弹性连接杆的另一端连接所述拾音组件,所述弹性连接杆设置成使得所述扬声器组件所产生的语音频段的振动从所述弹性连接杆的一端传递到所述弹性连接杆的另一端时的平均振幅衰减率不小于预设衰减率阈值。
  20. 根据权利要求19所述的耳机通信系统,其特征在于:
    所述弹性连接杆包括棍咪弹性金属丝以及连接于所述棍咪弹性金属丝两端的接插部,其中一个所述接插部用于与所述拾音组件接插配合,另一个所述接插部用于和所述扬声器组件接插配合,所述棍咪弹性金属丝的弹性模量为70-90GPa。
  21. 根据权利要求19或权利要求20所述的耳机通信系统,其特征在于:
    所述扬声器组件包括第一扬声器壳体、第二扬声器壳体、扬声器、转动件以及压持件,所述第一扬声器壳体和所述第二扬声器壳体配合连接,以形成用于收容所述扬声器的收容空间,所述第一扬声器壳体开设有间隔设置的第一通孔和第二通孔,所述转动件可转动地插设于所述第一通孔内,所述棍咪组件连接所述转动件,所述第一通孔和所述第二通孔均连通所述收容空间,以使得所述棍咪组件的导线组依次穿过所述第一通孔、所述收容空间以及所述第二通孔;所述压持件设置于所述收容空间内且覆盖所述第一通孔,以用于压持经所述第一通孔穿引至所述第二通孔的所述棍咪组件的导线组。
  22. 根据权利要求21所述的耳机通信系统,其特征在于:
    所述压持件包括层叠设置的硬质盖板和弹性体,所述硬质盖板相较于所述弹性体远离所述第一通孔,所述弹性体用于接触所述棍咪组件的导线组,所述硬质盖板的硬度大于所述弹性体的硬度。
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