WO2021209290A1 - Electric assembly with cooling circuit - Google Patents

Electric assembly with cooling circuit Download PDF

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Publication number
WO2021209290A1
WO2021209290A1 PCT/EP2021/059001 EP2021059001W WO2021209290A1 WO 2021209290 A1 WO2021209290 A1 WO 2021209290A1 EP 2021059001 W EP2021059001 W EP 2021059001W WO 2021209290 A1 WO2021209290 A1 WO 2021209290A1
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WO
WIPO (PCT)
Prior art keywords
tube
housing
electronic assembly
cooling circuit
electronic
Prior art date
Application number
PCT/EP2021/059001
Other languages
French (fr)
Inventor
Keyu Chen
Philippe Mercier
Charles DUMEZ
Matthieu Treguer
Franck TRAVAGLI
David DUMONTAGNE
Jean-Noel GILLION
Original Assignee
Valeo Equipements Electriques Moteur
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Valeo Equipements Electriques Moteur filed Critical Valeo Equipements Electriques Moteur
Priority to CN202180028833.7A priority Critical patent/CN115399084A/en
Priority to EP21716447.4A priority patent/EP4136943A1/en
Publication of WO2021209290A1 publication Critical patent/WO2021209290A1/en

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/20927—Liquid coolant without phase change
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H05K7/20254—Cold plates transferring heat from heat source to coolant

Definitions

  • the present invention relates to the cooling of an electronic assembly of the electric motor of an electric or hybrid motor vehicle.
  • the electronic assembly comprises at least one power module, the temperature of which rises during its operation.
  • This temperature increase creates significant damage to the power module itself and to the other elements of the electronic assembly.
  • the cooling circuit is commonly formed by a tube in which a cooling fluid circulates.
  • This duct is placed in a slot of the groove, duct or trough type placed as close as possible to the elements to be cooled. Maintaining the tube in the housing is achieved in several ways. For example, the tube is held in place by overmolding or brazing. However, these techniques are difficult to achieve.
  • Another way to keep the tube in the housing is to glue it. It is then necessary to use a large amount of glue, which increases the cost of manufacturing the system.
  • Another retaining technique consists of inserting the tube by pressure into the housing. However, the air remaining between the tube and the housing decreases heat exchange, and therefore the efficiency of the system.
  • the object of the present invention is therefore to alleviate one or more of the drawbacks of the devices of the prior art by proposing a cooling system in which the tube in which the cooling liquid circulates is arranged in a housing so as to optimize the heat exchanges while at the same time. limiting costs and manufacturing difficulties.
  • the present invention provides an electronic assembly comprising an electronic system and a cooling circuit in which a cooling fluid circulates, the cooling circuit being formed by a tube arranged in a housing in contact with at least part of the electronic system, the circuit tube cooling being a tube pressure inserted into the housing, a thermally conductive material being disposed between the tube and the housing.
  • the pressure insertion allows the tube to be positioned as close as possible to the surface of the housing and thus limits the amount of thermal conductive material used.
  • the housing is a groove formed in the foundry of the electronic assembly.
  • the housing is dimensionally stable. It is therefore the tube which is deformed to be inserted and is then mechanically blocked.
  • the size of the housing is adapted to the size of the tube so that pressure must be exerted on the tube to insert it into the housing.
  • a thermally conductive material is placed between the tube and the housing.
  • the tube of the cooling circuit is traversed by a cooling fluid
  • the tube of the cooling circuit is made of aluminum.
  • the electronic system comprises at least one power module.
  • the invention also relates to a method of manufacturing an electronic assembly according to the invention comprising:
  • the pressing tool is formed from several pressing elements, the inner face of which has a shape complementary to the outer face of the tube.
  • FIG. 1 is a schematic representation of a sectional view of an electronic assembly according to the invention
  • FIG. 2 is a schematic representation of a sectional view of part of an electronic assembly before insertion of the tube according to the invention
  • FIG. B is a schematic representation of a sectional view of part of an electronic assembly after insertion of the tube according to the invention
  • FIG. 4 is an elevational representation of part of the electronic assembly according to the invention.
  • FIG. 5 is a schematic representation of the method according to the invention.
  • the [Fig. 1] illustrates an electronic assembly 1 comprising an electronic system 3 with a cooling circuit 8 according to the invention.
  • the electronic assembly is the electronic assembly of the electric motor of an electric or hybrid motor vehicle.
  • the electronic system 3 comprises at least one power module 3.
  • the electronic system 1 comprises power electronics components.
  • the electronic system 3 comprises components of the control electronics.
  • the electronic system 3 is distributed over a support 2.
  • the support 2 is formed by the foundry. More precisely, the support is a part of the foundry.
  • the cooling circuit 8 is formed by a tube 5 arranged in a housing 6 in contact with at least part of the electronic system 3. Housing 6 cannot be deformed.
  • the housing 6 is formed in the foundry 2 of the electronic assembly 1.
  • the housing 6 is a groove formed in the foundry 2. This groove has the shape of an open channel or chute.
  • the size of the housing 6 is matched to the size of the tube 5 so that pressure must be exerted on the tube 5 to insert it into the housing 6. More specifically, the diameter of the housing 6 is smaller than that of the tube. tube 5. The tube having a tendency to want to resume its original shape is thus mechanically blocked in the housing after its insertion.
  • the housing 6 is arranged so as to be in contact with at least part of the electronic system 3. For example, as illustrated [Fig. 4], the housing is arranged around the electronic system.
  • the cooling circuit 8 is thus arranged so as to allow cooling of the electronic components and more particularly of the power module 3.
  • the tube 5 of the cooling circuit is made of aluminum.
  • the tube has a diameter of 10 mm and a length of 50 mm.
  • a thermally conductive material 4 is placed between the tube 5 and the housing 6. More precisely, after insertion into the housing 6, a space remains between the outer surface 52 of the tube 5 and the surface 61du. housing 6. This space is filled with air, which does not allow optimized heat exchange between the fluid circulating in the tube and the electronic system to be cooled. It is this space that is filled with thermal conductive material.
  • the fact that the tube is pressed by insertion into the housing and yet mechanically blocked limits the amount of thermal conductive material to be used, unlike the system of the prior art where the use of glue is done. without pressure insertion of the tube into the housing.
  • the tube is simply glued, and it could have been obvious that this technique makes it possible to limit the quantity since the tube is not mechanically blocked and it is possible to keep it as close as possible to the surface of the tube. lodging.
  • the insertion by pressure makes it possible to position the tube as close as possible to the surface of the housing and thus limits the quantity of thermal conductive material used.
  • the thermally conductive material 4 is glue.
  • the tube 5 of the cooling circuit is traversed by a cooling fluid.
  • the cooling fluid is water.
  • the cooling fluid is a water-glycol mixture.
  • the invention also relates to the method 100 for inserting the tube of the cooling circuit into the housing.
  • a housing 6 is created in the foundry 2.
  • the creation of this housing 6 is carried out in a conventional manner.
  • the tube 5 is positioned 30 at the entrance of the housing [Fig. 2], then is inserted [Fig. 3] by force in the housing 6 over its entire length with a pressing tool 7.
  • the pressing force exerted is 6000N.
  • the pressing tool 7 is formed from several pressing elements 7.
  • the pressing elements 7 are positioned along the tube 5 so as to allow, when they press on the tube 5, the total insertion of the tube 5 into the housing 6.
  • the total insertion relates to the length of the tube 5, c 'that is to say that the tube 5 is inserted into the housing 6 over its entire length.
  • the number of pressing elements 7 is defined as a function of the length of the tube 5 to be pressed into the housing 6.
  • These pressing elements 7 have for example the shape of a cube, the inner face 71 of which has a shape complementary to the outer face 51 of the tube 5.
  • the inner face 71 is the face in contact with the tube 5.
  • the pressing elements 7 have any shape allowing them to be positioned correctly and so as to guide the tube 5 in the housing 6 and allow its insertion. total in housing 6.

Abstract

The present invention relates to an electronic assembly (1) comprising an electronic system (3) and a cooling circuit (8) wherethrough a coolant fluid circulates, the coolant fluid (8) being formed by a tube (5) arranged in a housing (6) in contact with at least one portion of the electronic system (3), characterised in that the tube (5) of the cooling circuit (8) is a tube (5) pressed into the housing (6), a thermally conductive material (4) being arranged between the tube (5) and the housing.

Description

Description Description
Titre de l'invention : Ensemble électronique avec circuit de refroidissement La présente invention concerne le refroidissement d'un ensemble électronique du moteur électrique d'un véhicule automobile électrique ou hybride. Title of the invention: Electronic assembly with cooling circuit The present invention relates to the cooling of an electronic assembly of the electric motor of an electric or hybrid motor vehicle.
L'ensemble électronique comporte au moins un module de puissance dont la température s'élève lors de son fonctionnement. The electronic assembly comprises at least one power module, the temperature of which rises during its operation.
Cette augmentation de température crée des dommages importants au niveau du module de puissance lui-même et au niveau des autres éléments de l'ensemble électronique. This temperature increase creates significant damage to the power module itself and to the other elements of the electronic assembly.
Pour limiter ces effets thermiques, il est connu d'utiliser un circuit de refroidissement de l'ensemble électronique. To limit these thermal effects, it is known practice to use a cooling circuit for the electronic assembly.
Le circuit de refroidissement est communément formé par un tube dans lequel circule un fluide de refroidissement. Ce conduit est disposé dans un logement du type rainure, conduit ou goulotte disposé au plus proche des éléments à refroidir. Le maintien du tube dans le logement est réalisé de plusieurs façons. Par exemple, le maintien du tube est réalisé par surmoulage ou brasage. Cependant ces techniques sont difficiles à réaliser.The cooling circuit is commonly formed by a tube in which a cooling fluid circulates. This duct is placed in a slot of the groove, duct or trough type placed as close as possible to the elements to be cooled. Maintaining the tube in the housing is achieved in several ways. For example, the tube is held in place by overmolding or brazing. However, these techniques are difficult to achieve.
Une autre façon de maintenir le tube dans le logement est de le coller. Il est nécessaire alors d'utiliser une grande quantité de colle ce qui augmente le coût de fabrication du système. Une autre technique de maintien consiste à insérer par pression le tube dans le logement. Cependant, l'air restant entre le tube et le logement diminue les échanges thermiques, et par conséquent l'efficacité du système. Another way to keep the tube in the housing is to glue it. It is then necessary to use a large amount of glue, which increases the cost of manufacturing the system. Another retaining technique consists of inserting the tube by pressure into the housing. However, the air remaining between the tube and the housing decreases heat exchange, and therefore the efficiency of the system.
La présente invention a donc pour objet de pallier un ou plusieurs des inconvénients des dispositifs de l'art antérieur en proposant un système de refroidissement dont le tube dans lequel circule le liquide refroidissement est disposé dans un logement de façon à optimiser les échanges thermiques tout en limitant les coûts et difficultés de fabrication. Pour cela la présente invention propose un ensemble électronique comportant un système électronique et un circuit de refroidissement dans lequel circule un fluide de refroidissement, le circuit de refroidissement étant formé par un tube disposé dans un logement en contact avec au moins une partie du système électronique, le tube du circuit de refroidissement étant un tube inséré par pression dans le logement, un matériau conducteur thermique étant disposé entre le tube et le logement. The object of the present invention is therefore to alleviate one or more of the drawbacks of the devices of the prior art by proposing a cooling system in which the tube in which the cooling liquid circulates is arranged in a housing so as to optimize the heat exchanges while at the same time. limiting costs and manufacturing difficulties. For this, the present invention provides an electronic assembly comprising an electronic system and a cooling circuit in which a cooling fluid circulates, the cooling circuit being formed by a tube arranged in a housing in contact with at least part of the electronic system, the circuit tube cooling being a tube pressure inserted into the housing, a thermally conductive material being disposed between the tube and the housing.
L'insertion par pression permet de positionner le tube au plus proche de la surface du logement et limite ainsi la quantité de matériau conducteur thermique utilisé. The pressure insertion allows the tube to be positioned as close as possible to the surface of the housing and thus limits the amount of thermal conductive material used.
Selon un mode de réalisation de l'invention, le logement est une rainure formée dans la fonderie de l'ensemble électronique. According to one embodiment of the invention, the housing is a groove formed in the foundry of the electronic assembly.
Selon un mode de réalisation de l'invention, le logement est indéformable. C'est donc le tube qui est déformé pour être inséré et est ensuite bloqué mécaniquement. According to one embodiment of the invention, the housing is dimensionally stable. It is therefore the tube which is deformed to be inserted and is then mechanically blocked.
Selon un mode de réalisation de l'invention, la taille du logement est adaptée à la taille du tube de façon à ce qu'une pression doive être exercée sur le tube pour l'insérer dans le logement. According to one embodiment of the invention, the size of the housing is adapted to the size of the tube so that pressure must be exerted on the tube to insert it into the housing.
Selon un mode de réalisation de l'invention, un matériau conducteur thermique est disposé entre le tube et le logement. According to one embodiment of the invention, a thermally conductive material is placed between the tube and the housing.
Selon un mode de réalisation de l'invention, le tube du circuit de refroidissement est parcouru par un fluide de refroidissement According to one embodiment of the invention, the tube of the cooling circuit is traversed by a cooling fluid
Selon un mode de réalisation de l'invention, le tube du circuit de refroidissement est en aluminium. According to one embodiment of the invention, the tube of the cooling circuit is made of aluminum.
Selon un mode de réalisation de l'invention, le système électronique comprend au moins un module de puissance. According to one embodiment of the invention, the electronic system comprises at least one power module.
L'invention concerne également un procédé de fabrication d'un ensemble électronique selon l'invention consistant à : The invention also relates to a method of manufacturing an electronic assembly according to the invention comprising:
Créer un logement dans la fonderie, Create housing in the foundry,
Disposer le matériau conducteur thermique dans le logement, Place the thermally conductive material in the housing,
Positionner le tube au-dessus du logement avec un d'outils de pressage, Position the tube above the housing with a pressing tool,
Insérer par pression le tube dans le logement avec l'outils de pressage. Press the tube into the housing with the pressing tool.
Selon un mode de réalisation de l'invention, l'outil de pressage est formé de plusieurs éléments de pressage dont la face interne à une forme complémentaire de la face externe du tube. D'autres buts, caractéristiques et avantages de l'invention seront mieux compris et apparaîtront plus clairement à la lecture de la description faite, ci-après, en se référant aux figures annexées, données à titre d'exemple et dans lesquelles: According to one embodiment of the invention, the pressing tool is formed from several pressing elements, the inner face of which has a shape complementary to the outer face of the tube. Other aims, characteristics and advantages of the invention will be better understood and will appear more clearly on reading the description given below, with reference to the appended figures, given by way of example and in which:
- la [Fig. 1] est une représentation schématique d'une vue en coupe d'un ensemble électronique selon l'invention, - the [Fig. 1] is a schematic representation of a sectional view of an electronic assembly according to the invention,
- la [Fig. 2] est une représentation schématique d'une vue en coupe d'une partie d'un ensemble électronique avant insertion du tube selon l'invention, - the [Fig. 2] is a schematic representation of a sectional view of part of an electronic assembly before insertion of the tube according to the invention,
- la [Fig. B] est une représentation schématique d'une vue en coupe d'une partie d'un ensemble électronique après insertion du tube selon l'invention, - the [Fig. B] is a schematic representation of a sectional view of part of an electronic assembly after insertion of the tube according to the invention,
- la [Fig. 4] est une représentation en élévation d'une partie de l'ensemble électronique selon l'invention, - the [Fig. 4] is an elevational representation of part of the electronic assembly according to the invention,
- la [Fig. 5] est une représentation schématique du procédé selon l'invention.- the [Fig. 5] is a schematic representation of the method according to the invention.
La [Fig. 1] illustre un ensemble 1 électronique comportant un système 3 électronique avec un circuit 8 de refroidissement selon l'invention. L'ensemble électronique est l'ensemble électronique du moteur électrique d'un véhicule automobile électrique ou hybride Le système 3 électronique comprend au moins un module 3 de puissance. The [Fig. 1] illustrates an electronic assembly 1 comprising an electronic system 3 with a cooling circuit 8 according to the invention. The electronic assembly is the electronic assembly of the electric motor of an electric or hybrid motor vehicle. The electronic system 3 comprises at least one power module 3.
Selon un mode de réalisation de l'invention, le système 1 électronique comprend des composants de l'électronique de puissance. Selon un autre mode de réalisation de l'invention, le système 3 électronique comprend des composants de l'électronique de commande. According to one embodiment of the invention, the electronic system 1 comprises power electronics components. According to another embodiment of the invention, the electronic system 3 comprises components of the control electronics.
Le système 3 électronique est réparti sur un support 2. Selon un mode de réalisation de l'invention, le support 2 est formé par la fonderie. Plus précisément, le support est une partie de la fonderie. The electronic system 3 is distributed over a support 2. According to one embodiment of the invention, the support 2 is formed by the foundry. More precisely, the support is a part of the foundry.
Le circuit 8 de refroidissement est formé par un tube 5 disposé dans un logement 6 en contact avec au moins une partie du système 3 électronique. Le logement 6 est indéformable. Le logement 6 est formé dans la fonderie 2 de l'ensemble 1 électronique. Le logement 6 est une rainure formée dans la fonderie 2. Cette rainure à la forme d'un canal ouvert ou goulotte. The cooling circuit 8 is formed by a tube 5 arranged in a housing 6 in contact with at least part of the electronic system 3. Housing 6 cannot be deformed. The housing 6 is formed in the foundry 2 of the electronic assembly 1. The housing 6 is a groove formed in the foundry 2. This groove has the shape of an open channel or chute.
La taille du logement 6 est adaptée à la taille du tube 5 de façon à ce qu'une pression doive être exercée sur le tube 5 pour l'insérer dans le logement 6. Plus précisément, le diamètre du logement 6 est inférieur à celui du tube 5. Le tube ayant tendance à vouloir reprendre sa forme originale est ainsi bloqué mécaniquement dans le logement après son insertion. The size of the housing 6 is matched to the size of the tube 5 so that pressure must be exerted on the tube 5 to insert it into the housing 6. More specifically, the diameter of the housing 6 is smaller than that of the tube. tube 5. The tube having a tendency to want to resume its original shape is thus mechanically blocked in the housing after its insertion.
Le logement 6 est disposé de façon à être en contact avec au moins une partie du système 3 électronique. Par exemple, comme illustré [Fig. 4], le logement est disposé autour du système électronique. The housing 6 is arranged so as to be in contact with at least part of the electronic system 3. For example, as illustrated [Fig. 4], the housing is arranged around the electronic system.
Le circuit 8 de refroidissement est ainsi disposé de façon à permettre le refroidissement des composants électroniques et plus particulièrement du module 3 de puissance. The cooling circuit 8 is thus arranged so as to allow cooling of the electronic components and more particularly of the power module 3.
Le tube 5 du circuit de refroidissement est en aluminium. Par exemple, le tube a un diamètre de 10 mm et une longueur de 50 mm. The tube 5 of the cooling circuit is made of aluminum. For example, the tube has a diameter of 10 mm and a length of 50 mm.
Dans le cadre de l'invention, un matériau 4 conducteur thermique est disposé entre le tube 5 et le logement 6. Plus précisément, après insertion dans le logement 6, il reste un espace entre la surface extérieure 52 du tube 5 et la surface 61du logement 6. Cette espace est rempli d'air, ce qui ne permet pas un échange thermique optimisé entre le fluide circulant dans le tube et le système électronique à refroidir. C'est cet espace qui est rempli de matériau conducteur thermique. In the context of the invention, a thermally conductive material 4 is placed between the tube 5 and the housing 6. More precisely, after insertion into the housing 6, a space remains between the outer surface 52 of the tube 5 and the surface 61du. housing 6. This space is filled with air, which does not allow optimized heat exchange between the fluid circulating in the tube and the electronic system to be cooled. It is this space that is filled with thermal conductive material.
En effet, de façon étonnante, le fait que le tube soit pressé par insertion dans le logement et pourtant bloqué mécaniquement, limite la quantité de matériau conducteur thermique à utiliser, contrairement au système de l'art antérieur ou l'utilisation de colle se fait sans insertion par pression du tube dans le logement. Dans l'art antérieur le tube est simplement collé, et il aurait pu être évident que cette technique permette de limiter la quantité puisque le tube n'est pas bloqué mécaniquement et qu'il est possible de le maintenir au plus proche de la surface du logement. Ainsi finalement, l'insertion par pression permet de positionner le tube au plus proche de la surface du logement et limite ainsi la quantité de matériau conducteur thermique utilisé. Indeed, surprisingly, the fact that the tube is pressed by insertion into the housing and yet mechanically blocked, limits the amount of thermal conductive material to be used, unlike the system of the prior art where the use of glue is done. without pressure insertion of the tube into the housing. In the prior art, the tube is simply glued, and it could have been obvious that this technique makes it possible to limit the quantity since the tube is not mechanically blocked and it is possible to keep it as close as possible to the surface of the tube. lodging. Thus finally, the insertion by pressure makes it possible to position the tube as close as possible to the surface of the housing and thus limits the quantity of thermal conductive material used.
Selon un mode de réalisation de l'invention, le matériau 4 conducteur thermique est de la colle. According to one embodiment of the invention, the thermally conductive material 4 is glue.
Le tube 5 du circuit de refroidissement est parcouru par un fluide de refroidissement. Selon un mode de réalisation de l'invention, le fluide de refroidissement est de l'eau. Selon un mode de réalisation de l'invention, le fluide de refroidissement est un mélange eau-glycol. The tube 5 of the cooling circuit is traversed by a cooling fluid. According to one embodiment of the invention, the cooling fluid is water. According to one embodiment of the invention, the cooling fluid is a water-glycol mixture.
L'invention concerne également le procédé 100 d'insertion du tube du circuit de refroidissement dans le logement. The invention also relates to the method 100 for inserting the tube of the cooling circuit into the housing.
Selon un mode de réalisation de l'invention, un logement 6 est créé 10 dans la fonderie 2. La création de ce logement 6 est réalisée de façon classique. According to one embodiment of the invention, a housing 6 is created in the foundry 2. The creation of this housing 6 is carried out in a conventional manner.
Le tube 5 est positionné 30 à l'entrée du logement [Fig. 2], puis est inséré [Fig. 3] en force dans le logement 6 sur toute sa longueur avec un outil 7 de pressage. The tube 5 is positioned 30 at the entrance of the housing [Fig. 2], then is inserted [Fig. 3] by force in the housing 6 over its entire length with a pressing tool 7.
Par exemple, la force de pression exercée est de 6000N. For example, the pressing force exerted is 6000N.
Selon un mode de réalisation de l'invention, l'outil 7 de pressage est formé de plusieurs éléments 7 de pressage. According to one embodiment of the invention, the pressing tool 7 is formed from several pressing elements 7.
Les éléments 7 de pressage sont positionnés le long du tube 5 de façon à permettre, lors de leur appuie sur le tube 5, l'insertion totale du tube 5 dans le logement 6. L'insertion totale concerne la longueur du tube 5, c'est-à-dire que le tube 5 est inséré dans le logement 6 sur toute sa longueur. Le nombre d'éléments 7 de pressage est défini en fonction de la longueur du tube 5 à presser dans le logement 6. Ces éléments 7 de pressages ont par exemple la forme d'un cube dont la face 71 interne à une forme complémentaire de la face externe 51 du tube 5. La face 71 interne est la face en contact avec le tube 5. Les éléments 7 de pressage ont toutes forme permettant de les positionner correctement et de façon à guider le tube 5 dans le logement 6 et permettre son insertion totale dans le logement 6. The pressing elements 7 are positioned along the tube 5 so as to allow, when they press on the tube 5, the total insertion of the tube 5 into the housing 6. The total insertion relates to the length of the tube 5, c 'that is to say that the tube 5 is inserted into the housing 6 over its entire length. The number of pressing elements 7 is defined as a function of the length of the tube 5 to be pressed into the housing 6. These pressing elements 7 have for example the shape of a cube, the inner face 71 of which has a shape complementary to the outer face 51 of the tube 5. The inner face 71 is the face in contact with the tube 5. The pressing elements 7 have any shape allowing them to be positioned correctly and so as to guide the tube 5 in the housing 6 and allow its insertion. total in housing 6.
Le procédé [Fig. 5] consiste ainsi à : The process [Fig. 5] thus consists of:
Créer 10 un logement dans la fonderie, Disposer 20 le matériau conducteur thermique dans le logement,Create 10 housing in the foundry, Place the thermal conductive material in the housing,
Positionner 30 le tube au-dessus du logement, Position the tube 30 above the housing,
Insérer 40 par pression le tube dans le logement avec les outils de pressage. Press 40 the tube into the housing with the pressing tools.
La portée de la présente invention ne se limite pas aux détails donnés ci-dessus et permet des modes de réalisation sous de nombreuses autres formes spécifiques sans s'éloigner du domaine d'application de l'invention. Par conséquent, les présents modes de réalisation doivent être considérés à titre d'illustration, et peuvent être modifiés sans toutefois sortir de la portée définie par les revendications. The scope of the present invention is not limited to the details given above and allows embodiments in many other specific forms without departing from the scope of the invention. Therefore, the present embodiments should be considered by way of illustration, and may be modified without, however, departing from the scope defined by the claims.

Claims

Revendications Claims
1. Ensemble (1) électronique comportant un système électronique (3) et un circuit (8) de refroidissement dans lequel circule un fluide de refroidissement, le circuit (8) de refroidissement étant formé par un tube (5) disposé dans un logement (6) en contact avec au moins une partie du système (3) électronique, caractérisé en ce que le tube (5) du circuit de refroidissement (8) est un tube (5) inséré par pression dans le logement (6), un matériau (4) conducteur thermique étant disposé entre le tube (5) et le logement (6). 1. Electronic assembly (1) comprising an electronic system (3) and a cooling circuit (8) in which a cooling fluid circulates, the cooling circuit (8) being formed by a tube (5) arranged in a housing ( 6) in contact with at least part of the electronic system (3), characterized in that the tube (5) of the cooling circuit (8) is a tube (5) inserted by pressure into the housing (6), a material (4) thermal conductor being disposed between the tube (5) and the housing (6).
2. Ensemble (1) électronique selon la revendication 1, dans lequel le logement (6) est une rainure formée dans la fonderie (2) de l'ensemble (1) électronique. 2. Electronic assembly (1) according to claim 1, wherein the housing (6) is a groove formed in the foundry (2) of the electronic assembly (1).
3. Ensemble (1) électronique selon une des revendication 1 à 2, dans lequel la taille du logement (6) indéformable est adaptée à la taille du tube (5) de façon à ce qu'une pression doive être exercée sur le tube (5) pour l'insérer dans le logement (6).3. Electronic assembly (1) according to one of claims 1 to 2, wherein the size of the housing (6) undeformable is adapted to the size of the tube (5) so that a pressure must be exerted on the tube ( 5) to insert it into the housing (6).
4. Ensemble (1) électronique selon une des revendication 1 à 3, dans lequel le tube (5) du circuit (8) de refroidissement est parcouru par un fluide de refroidissement4. Electronic assembly (1) according to one of claims 1 to 3, wherein the tube (5) of the cooling circuit (8) is traversed by a cooling fluid.
5. Ensemble (1) électronique selon une des revendication 1 à 4, dans lequel le tube (5) du circuit de refroidissement est en aluminium. 5. Electronic assembly (1) according to one of claims 1 to 4, wherein the tube (5) of the cooling circuit is made of aluminum.
6. Ensemble (1) électronique selon une des revendication 1 à 5, dans lequel le système (3) électronique comprend au moins un module (3) de puissance. 6. Electronic assembly (1) according to one of claims 1 to 5, wherein the electronic system (3) comprises at least one power module (3).
7. Procédé (100) de fabrication d'un ensemble électronique selon une des revendications là 6 consistant à : 7. A method (100) of manufacturing an electronic assembly according to one of claims 1 to 6 consisting of:
Créer (10) un logement (6) dans la fonderie (2), Create (10) a housing (6) in the foundry (2),
Disposer (20) le matériau (4) conducteur thermique dans le logement (6), Positionner (30) le tube (5) au-dessus du logement (6) avec un outils (7) de pressage, Insérer (40) par pression le tube (5) dans le logement (6) avec l'outils (7) de pressage. Place (20) the thermally conductive material (4) in the housing (6), Position (30) the tube (5) above the housing (6) with a pressing tool (7), Insert (40) by pressure the tube (5) in the housing (6) with the pressing tool (7).
8. Procédé (100) de fabrication d'un ensemble (1) électronique selon la revendication 7, dans lequel l'outil (7) de pressage est formé de plusieurs éléments de pressage dont la face (71) interne à une forme complémentaire de la face externe (51) du tube (5). 8. A method (100) of manufacturing an electronic assembly (1) according to claim 7, wherein the pressing tool (7) is formed from several pressing elements, the face (71) of which has an internal shape complementary to the outer face (51) of the tube (5).
PCT/EP2021/059001 2020-04-14 2021-04-07 Electric assembly with cooling circuit WO2021209290A1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN202180028833.7A CN115399084A (en) 2020-04-14 2021-04-07 Electronic assembly with cooling circuit
EP21716447.4A EP4136943A1 (en) 2020-04-14 2021-04-07 Electric assembly with cooling circuit

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FRFR2003738 2020-04-14
FR2003738A FR3109258B1 (en) 2020-04-14 2020-04-14 Electronic assembly with cooling circuit

Publications (1)

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WO2021209290A1 true WO2021209290A1 (en) 2021-10-21

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EP (1) EP4136943A1 (en)
CN (1) CN115399084A (en)
FR (1) FR3109258B1 (en)
WO (1) WO2021209290A1 (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2114116A1 (en) * 2008-04-29 2009-11-04 Agie Sa Hybrid cooling

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2114116A1 (en) * 2008-04-29 2009-11-04 Agie Sa Hybrid cooling

Also Published As

Publication number Publication date
FR3109258A1 (en) 2021-10-15
CN115399084A (en) 2022-11-25
EP4136943A1 (en) 2023-02-22
FR3109258B1 (en) 2023-04-14

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