WO2021196193A1 - Lidar and self-driving device - Google Patents

Lidar and self-driving device Download PDF

Info

Publication number
WO2021196193A1
WO2021196193A1 PCT/CN2020/083290 CN2020083290W WO2021196193A1 WO 2021196193 A1 WO2021196193 A1 WO 2021196193A1 CN 2020083290 W CN2020083290 W CN 2020083290W WO 2021196193 A1 WO2021196193 A1 WO 2021196193A1
Authority
WO
WIPO (PCT)
Prior art keywords
laser
array detector
echo
outgoing
laser light
Prior art date
Application number
PCT/CN2020/083290
Other languages
French (fr)
Chinese (zh)
Inventor
马丁昽
Original Assignee
深圳市速腾聚创科技有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 深圳市速腾聚创科技有限公司 filed Critical 深圳市速腾聚创科技有限公司
Priority to PCT/CN2020/083290 priority Critical patent/WO2021196193A1/en
Priority to CN202080005842.XA priority patent/CN113227827A/en
Publication of WO2021196193A1 publication Critical patent/WO2021196193A1/en

Links

Images

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01SRADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
    • G01S7/00Details of systems according to groups G01S13/00, G01S15/00, G01S17/00
    • G01S7/48Details of systems according to groups G01S13/00, G01S15/00, G01S17/00 of systems according to group G01S17/00
    • G01S7/481Constructional features, e.g. arrangements of optical elements

Definitions

  • the embodiment of the present invention relates to the field of radar technology, in particular to a laser radar and automatic driving equipment.
  • Lidar is a radar system that uses lasers to detect the position and speed of the target object. Its working principle is that the transmitting module first transmits the outgoing laser to the target for detection, and then the receiving module receives the feedback reflected from the target object. Wave laser, after processing the received echo laser, the relevant information of the target object, such as distance, azimuth, height, speed, posture, and even shape parameters, can be obtained.
  • An implementation form of the receiving module is an array detector, which is composed of a plurality of detection pixels arranged in an array to form an array detector. With the improvement of the detection resolution requirement, the pixel size on the unit area pixel in the array detector is getting smaller and smaller. If the receiving lens remains the same, it is necessary to increase the power of the signal light source or increase the size of the receiving surface of the array detector. Increasing the size of the receiving surface will directly affect the design difficulty of the receiving lens, increase the cost of the array detector itself, and increase the overall size of the lidar product.
  • the main purpose of the embodiments of the present invention is to provide a lidar and automatic driving equipment, which can reduce the required light source without increasing the size of the receiving surface of the array detector and ensuring the detection resolution.
  • the peak power is lower, the emission energy is reduced, and the detection range can be increased when the emission energy is the same.
  • a technical solution adopted by the embodiment of the present invention is to provide a laser radar, the laser radar includes a transmission drive system, a laser transceiver system, and a control and signal processing system;
  • the laser transceiver system includes a transmitting module, a deflection mechanism, and a receiving module; the receiving module includes an array detector;
  • the emitting module is used for emitting outgoing laser
  • the deflection mechanism is used to receive the outgoing laser light, reflect the outgoing laser light and shoot it into the detection area of the array detector, and make the outgoing laser light traverse all the detections of the array detector in a scanning manner Area; the deflection mechanism is also used to receive the echo laser and reflect the echo laser to the receiving module, wherein the echo laser is the outgoing laser reflected by the object in the detection area For the later returning laser, the imaging size of the echo laser on the array detector in a single scan is smaller than the overall pixel size of the array detector;
  • the receiving module is used to receive the echo laser
  • the emission driving system is used to drive the emission module
  • the control and signal processing system is used for controlling the emission driving system to drive the emission module, and controlling the receiving module to receive the echo laser.
  • the receiving module is configured to simultaneously turn on all the pixels corresponding to the first area in the array detector to receive back when the outgoing laser scans the first area in the detection area Wave laser to detect the first area.
  • the array detector includes m*n pixels that can be individually switched on and off, and both m and n are integers greater than 1.
  • the deflection mechanism is a MEMS micromirror, a reflecting mirror or a transmissive prism.
  • the deflection mechanism includes a mirror, a first rotating shaft, and a second rotating shaft;
  • the mirror surface is used to rotate around the first rotation axis so that the emitted laser light scans the detection area of the array detector in a horizontal direction; the mirror surface is also used to rotate around the second rotation axis so that the emitted laser light Scanning the detection area of the array detector in a vertical direction; the mirror is also used to receive the echo laser and reflect the echo laser to the receiving module;
  • the size of the echo laser imaging on the array detector in the horizontal direction and the vertical direction is smaller than the size of the overall pixel of the array detector in the corresponding direction.
  • the deflection mechanism includes a mirror surface and a rotating shaft
  • the mirror surface is used to rotate around the rotation axis, so that the outgoing laser light scans the detection area of the array detector in a first direction; the mirror surface is also used to receive the echo laser light and reflect the echo laser light Shot back to the receiving module;
  • the size of the echo laser on the array detector in the first direction is smaller than the size of the overall pixel of the array detector in the first direction, and the echo laser on the array detector
  • the size of the imaging in the second direction is equal to or greater than the size of the overall pixel of the array detector in the second direction;
  • the first direction is a horizontal direction and the second direction is a vertical direction; alternatively, the first direction is a vertical direction and the second direction is a horizontal direction.
  • the deflection mechanism includes a mirror surface and a rotating shaft
  • the emitting module includes at least two emitting components, each emitting component includes a laser emitting unit and a emitting optical unit, the laser emitting unit is used to emit the first outgoing laser, and the emitting optical unit is used for collimation.
  • the first outgoing laser, and the collimated first outgoing laser is incident on the two-dimensional MEMS micromirror; the outgoing laser is composed of all the first outgoing lasers, and the first outgoing laser is along Arranged in the first direction; the mirror is used to rotate around the axis of rotation, so that the outgoing laser scans the detection area of the array detector in the second direction; the mirror is also used to receive the first echo laser and The first echo laser light is reflected and then directed to the receiving module, wherein the first echo laser light is the laser light that returns after the first outgoing laser light is reflected by an object in the detection area, and the echo The laser is composed of all the first echo lasers;
  • the size of the imaging of the first echo laser on the array detector in the first direction and the second direction is smaller than the size of the overall pixel of the array detector in the corresponding direction;
  • the size of the imaging on the array detector in the first direction is equal to or larger than the size of the entire pixel of the array detector in the first direction;
  • the first direction is a horizontal direction and the second direction is a vertical direction; alternatively, the first direction is a vertical direction and the second direction is a horizontal direction.
  • the at least two emitting components sequentially emit the first outgoing laser light in a sequence.
  • the transmitting module includes three transmitting components.
  • the echo laser is a circular spot
  • the imaging of the echo laser on the array detector is located in a single pixel of the array detector.
  • the echo laser is a circular spot, and the imaging of the echo laser on the array detector exceeds a single pixel of the array detector, but does not exceed the adjacent single pixel. Pixel.
  • the imaging of the echo laser on the array detector is located within 1/2 of the pixel of the array detector, and a single pixel of the array detector is used according to the output laser In the scanning sequence, the echo laser light is received in the first pixel area and the second pixel area respectively.
  • the imaging of the echo laser on the array detector is located within 1/4 pixel of the array detector, and the single pixel detected by the array is used for scanning according to the emitted laser light.
  • the echo laser is received in the first pixel area, the second pixel area, the third pixel area, and the fourth pixel area in sequence.
  • the emitting module includes a laser emitting unit and a emitting optical unit;
  • the laser emitting unit is used to emit outgoing laser
  • the emission optical unit is used for collimating the emitted laser light, and incident the collimated emitted laser light to the deflection mechanism.
  • the receiving module further includes a receiving optical unit
  • the receiving optical unit is used to converge the echo laser, and shoot the collected echo laser to the array detector;
  • the array detector is used to receive the echo laser.
  • An embodiment of the present invention also provides an automatic driving device, including a driving device body and the above-mentioned lidar, and the lidar is installed on the driving device body.
  • the beneficial effects of the embodiments of the present invention are: on the basis of the existing conventional detectors, the outgoing laser is shaped to make the outgoing laser spot be a spot spot, a block spot or a line spot, and a deflection mechanism is added, and a traversal is adopted.
  • the scanning method completes the detection of the detection area. Due to the use of spot, block or line spots, the peak power of the required light source and the emission energy can be reduced without increasing the size of the receiving surface of the array detector and ensuring the detection resolution.
  • the emission energy can be increased when the emission energy is the same Detection distance. Compared with the prior art, it is necessary to increase the size of the receiving surface of the array detector to meet the high resolution requirements.
  • the embodiment of the present invention reduces the size of the image surface of the array detector, thereby reducing the size of the array detector. In the case of surface size, the number of pixels can be increased, and the detection resolution can be improved.
  • Figure 1 shows a structural block diagram of a lidar provided by an embodiment of the present invention
  • FIG. 2 shows a structural block diagram of a lidar provided by another embodiment of the present invention.
  • Figure 3a shows a schematic diagram of scanning a block of light spots in an embodiment of the present invention
  • Figure 3b shows a schematic diagram of scanning a line spot in an embodiment of the present invention
  • Fig. 3c shows a schematic diagram of scanning a spot light spot in an embodiment of the present invention
  • FIG. 4a shows a schematic diagram of a laser transceiver system according to an embodiment of the present invention adopting a two-dimensional MEMS micromirror, a spot light spot, and a horizontal scanning first;
  • 4b shows a schematic diagram of the laser transceiver system according to an embodiment of the present invention adopting a two-dimensional MEMS micromirror, a spot light spot, and vertical scanning first;
  • Fig. 5a shows a schematic diagram of a laser transceiver system according to an embodiment of the present invention adopting a two-dimensional MEMS micromirror and a 1/2-point spot;
  • Figure 5b shows a schematic diagram of a single pixel of the array detector divided into two pixel regions in an embodiment of the present invention
  • FIG. 5c shows a schematic diagram of a laser transceiver system according to another embodiment of the present invention adopting a two-dimensional MEMS micromirror and a 1/2-point spot;
  • Fig. 6a shows a schematic diagram of a laser transceiver system according to an embodiment of the present invention adopting a two-dimensional MEMS micromirror and a 1/4 point spot;
  • Figure 6b shows a schematic diagram of a single pixel of the array detector divided into four pixel regions in an embodiment of the present invention
  • FIG. 7a shows a schematic diagram of a laser transceiver system according to an embodiment of the present invention adopting a two-dimensional MEMS micromirror, a small area light spot, and a horizontal scanning first;
  • FIG. 7b shows a schematic diagram of the laser transceiver system according to an embodiment of the present invention adopting a two-dimensional MEMS micromirror, a small area light spot, and vertical scanning first;
  • FIG. 8a shows a schematic diagram of a laser transceiver system according to an embodiment of the present invention adopting a two-dimensional MEMS micromirror, a short-line light spot, and a horizontal scanning first;
  • FIG. 8b shows a schematic diagram of the laser transceiver system according to an embodiment of the present invention adopting a two-dimensional MEMS micromirror, a short-line light spot, and vertical scanning first;
  • FIG. 8c shows a schematic diagram of a laser transceiver system according to another embodiment of the present invention using a two-dimensional MEMS micromirror, a 1/4 short-line light spot, and a horizontal scan first;
  • FIG. 9a shows a schematic diagram of a laser transceiver system according to an embodiment of the present invention adopting a one-dimensional MEMS micromirror, a long-line light spot, and a horizontal scanning first;
  • FIG. 9b shows a schematic diagram of the laser transceiver system according to an embodiment of the present invention adopting a one-dimensional MEMS micro-mirror, a long-line light spot, and vertical scanning first;
  • FIG. 9c shows a schematic diagram of a laser transceiver system according to another embodiment of the present invention using a one-dimensional MEMS micromirror, a 1/4 long-line light spot, and a horizontal scan first;
  • FIG. 10a shows a schematic diagram of a laser transceiver system according to an embodiment of the present invention using a one-dimensional MEMS micromirror, a large area light spot, and lateral scanning first;
  • FIG. 10b shows a schematic diagram of a laser transceiver system according to an embodiment of the present invention adopting a one-dimensional MEMS micromirror, a large area light spot, and vertical scanning first;
  • FIG. 11a shows a schematic diagram of a laser transceiver system according to an embodiment of the present invention adopting a one-dimensional MEMS micromirror, a line spot, a plurality of emitters, and a horizontal scanning first;
  • FIG. 11b shows a schematic diagram of the laser transceiver system according to an embodiment of the present invention adopting a one-dimensional MEMS micromirror, a line spot, a plurality of emitters, and a vertical scanning first;
  • Fig. 12a shows a schematic diagram of a partial optical path of a laser radar according to an embodiment of the present invention using an optical deflection module
  • FIG. 12b shows a schematic diagram of a partial optical path of a laser radar using an optical deflection module according to another embodiment of the present invention
  • Figure 13a shows a schematic diagram of the optical path of a lidar according to another embodiment of the present invention.
  • Figure 13b shows a schematic diagram of the optical path of a lidar according to still another embodiment of the present invention.
  • FIG. 14 shows a schematic diagram of a partial optical path of a lidar according to another embodiment of the present invention.
  • FIG. 15a shows a schematic diagram of a partial light path of a laser radar according to an embodiment of the present invention including an optical shaping module
  • 15b shows a schematic diagram of a partial light path of a laser radar including an optical shaping module according to another embodiment of the present invention
  • Fig. 15c shows a schematic diagram of the deflection mechanism and the optical shaping module in Fig. 15b;
  • Figure 16a shows a schematic structural diagram of an automatic driving device provided by an embodiment of the present invention
  • Fig. 16b shows a schematic structural diagram of an automatic driving device provided by another embodiment of the present invention.
  • Lidar 100 emission drive system 1, laser transceiver system 2, control and signal processing system 3, emission module 21, emission assembly 210, laser emission unit 211, emission optical unit 212, lens 213, optical deflection module 214, optical shaping Module 215, mirror 216, receiving module 22, receiving optical unit 221, array detector 222, deflection mechanism 23, two-dimensional MEMS micromirror 23a, one-dimensional MEMS micromirror 23b, rotation axis x, first rotation axis x1, second The shaft x2, the automatic driving device 200, and the driving device body 201.
  • the terms “installed”, “connected”, “connected”, “fixed” and other terms should be understood in a broad sense, for example, it can be a fixed connection or a detachable connection. , Or integrated; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the internal communication of two components or the interaction relationship between two components.
  • installed can be a fixed connection or a detachable connection. , Or integrated; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the internal communication of two components or the interaction relationship between two components.
  • the “on” or “under” of the first feature on the second feature may be in direct contact with the first and second features, or the first and second features may be indirectly through an intermediary. touch.
  • the “above”, “above” and “above” of the first feature on the second feature may mean that the first feature is directly above or diagonally above the second feature, or it simply means that the level of the first feature is higher than that of the second feature.
  • the “below”, “below” and “below” of the second feature of the first feature may mean that the first feature is directly below or obliquely below the second feature, or it simply means that the level of the first feature is smaller than the second feature.
  • the emission light source covers the entire detection field of view through the emission beam shaping system, which requires high peak power of the signal light source, and the signal light received by a single pixel is limited, which is only suitable for detection in close-range occasions. .
  • the detection angle resolution With the increasing requirements for the detection angle resolution, it is difficult to meet the needs of long-distance detection, so the detection range is limited.
  • the resolution of the entire array detector is limited by the pixel distribution and number of the array device itself, and increasing the corresponding number of pixels will cause the image surface to increase, and when the peak power of the signal light source remains unchanged, the single pixel will be reduced.
  • the detection energy value increases the cost and reduces the yield, and is not conducive to the miniaturization of the product.
  • an embodiment of the present invention provides a laser radar 100, which includes a transmission drive system 1, a laser transceiver system 2, and a control and signal processing system 3.
  • the laser transceiver system 2 includes a transmitting module 21, a receiving module 22 and a deflection mechanism 23.
  • the emitting module 21 is used for emitting outgoing laser light.
  • the deflection mechanism 23 is used to receive the outgoing laser and reflect the outgoing laser to the detection area of the receiving module 22, and make the outgoing laser traverse all the detection areas of the receiving module 22 in a scanning manner.
  • the deflection mechanism 23 is also used to receive The echo laser reflects the echo laser and shoots it toward the receiving module 22.
  • the echo laser is the laser returned after the outgoing laser is reflected by an object in the detection area.
  • the receiving module 22 is used for receiving echo laser light.
  • the emission driving system 1 is used to drive the emission module 21.
  • the control and signal processing system 3 is used for controlling the transmitting driving system 1 to drive the transmitting module 21 and controlling the receiving module 22 to receive the echo laser.
  • the emission module 21 includes a laser emission unit 211 and an emission optical unit 212.
  • the laser emission unit 211 is used to emit the emitted laser light
  • the emission optical unit 212 is used to shape the emitted laser light and incident the shaped emitted laser light.
  • the reshaped light spot may be a point light spot, a line light spot or a block light spot, which is reflected by the deflection mechanism 23 and then enters a local detection area, that is, a part of the detection area.
  • the laser emitting unit 211 may be various types of signal light sources, such as laser diode (LD), vertical cavity surface emitting laser (VCSEL), edge emitting laser (Edge Emitting Laser, EEL), light emitting Diode (Light Emitting Diode, LED) optical fiber and other devices.
  • LD laser diode
  • VCSEL vertical cavity surface emitting laser
  • EEL Edge emitting laser
  • LED light emitting Diode
  • the transmitting optical unit 212 can adopt a lens and a lens group, an optical fiber and a ball lens group, a separate ball lens group, a cylindrical lens group, a slow-axis-collimator lens (Slow-Axis-Collimator LENS, SAC LENS), and fast-axis collimation.
  • Mirror Fast-Axis-Collimator LENS
  • micro lens array micro lens array
  • DOE diffractive optical elements
  • Diffuser diffuser
  • the laser emitting unit 211 adopts EEL
  • FAC and SAC can be used to respectively perform fast and slow axis collimation and shaping of the emitted laser.
  • the laser emitting unit 211 adopts an array arrangement device such as a VCSEL array, a lens can be used for shaping. If the laser emitting unit 211 adopts a signal light source arranged in a non-array arrangement, a collimating lens and a micro lens (or a micro cylindrical lens) can be used to shape the emitted laser light.
  • the receiving module 22 includes a receiving optical unit 221 and an array detector 222.
  • the receiving optical unit 221 is used for condensing the echo laser and shooting the collected echo laser to the array detector 222; the array detector 222 is used for receiving the echo laser.
  • the receiving optical unit 221 may adopt a ball lens, a ball lens group, a cylindrical lens group, or the like.
  • the array detector 222 can use an avalanche photodiode (APD) array, a silicon photomultiplier (SiPM), a multi-pixel photon counter (MPPC) array, and a photomultiplier tube.
  • APD avalanche photodiode
  • SiPM silicon photomultiplier
  • MPPC multi-pixel photon counter
  • the array detector 222 may be a surface array detector, which has m*n pixels that can be individually controlled on and off, and both m and n are integers greater than one.
  • the control and signal processing system 3 may adopt a Field Programmable Gate Array (FPGA), and the FPGA is connected to the emission driving system 1 to perform emission control of the emitted laser.
  • the FPGA is also connected to the clock pin, data pin, and control pin of the receiving module 22 respectively to control the receiving and controlling of the echo laser.
  • the deflection mechanism 23 is used to receive the shaped outgoing laser, reflect the outgoing laser, and shoot it toward the local detection area of the array detector 222, and perform deflection so that the outgoing laser traverses all the detection areas of the array detector 222 in a scanning manner.
  • the deflection mechanism 23 is also used for receiving the echo laser and reflecting the echo laser and shooting it towards the receiving module 22.
  • the echo laser is the laser returning after the outgoing laser is reflected by the object in the detection area.
  • the spot size of the outgoing laser is the same as the spot size of the echo laser.
  • the spot size of the emitted laser is controlled by beam shaping, so that the imaging size of the echo laser of a single scan on the array detector 222 is smaller than the overall pixel size of the array detector 222, that is, smaller than the receiving surface of the array detector 222.
  • the receiving module 22 is used to simultaneously turn on all the pixels corresponding to the first area in the array detector 222 to receive the echo laser to detect the first area when the outgoing laser scans the first area in the detection area. For example, when the outgoing laser is incident on the first pixel in the detection area, the array detector 222 turns on the first pixel for detection. At this time, other pixels are in the off state, and then the outgoing laser is incident on the second pixel. Then the array detector 222 turns on the second pixel for detection, and at this time turns off the detection of the first pixel... and so on, the dynamic detection of each pixel is performed in turn.
  • the array detector 222 turns on the multiple pixels corresponding to it for detection.
  • the array detector can also turn on all the pixels at the same time, but since the detection area corresponding to some pixels is not scanned by the emitted laser at the same time, this method will increase the power consumption and the loss of the array detector 222.
  • the spot of the emitted laser can be a block spot (small area spot) with a small diffusion angle; as shown in Figure 3b, it can also be a line spot; correspondingly, the spot of the echo laser can also be a block spot or a line.
  • the light spot as shown in FIG. 3c, can also be a point light spot (the light spot is located in a single pixel).
  • the collimated outgoing laser is deflected by the deflection mechanism 23 to be within the detection range of one or some pixels in the detection area of the array detector 222, and the array detector 222 turns on the corresponding pixels to start ranging, and you can get The distance value of the corresponding position.
  • the detection area of all the pixels of the entire array detector 222 is traversed to obtain the distance value of each position, thereby obtaining the 3D point cloud data of the entire detection area.
  • the embodiment of the present invention reshapes the outgoing laser to make the outgoing laser spot a point spot, block spot or line spot, and adds a deflection mechanism to complete the detection of the detection area by means of traversal scanning. . Due to the use of spot, block or line spots, the peak power of the required light source and the emission energy can be reduced without increasing the size of the receiving surface of the array detector and ensuring the detection resolution.
  • the emission energy can be increased when the emission energy is the same Compared with the prior art, it is necessary to increase the size of the receiving surface of the array detector to meet the high-resolution requirements.
  • the embodiment of the present invention reduces the size of the image surface of the array detector, thereby reducing the size of the array detector. In the case of the same image size, the number of pixels can be increased, and the detection resolution can be improved.
  • the deflection mechanism 23 can use a MEMS micromirror, a reflecting mirror, a transmission prism, etc., to realize scanning of the detection area.
  • both the outgoing laser and the echo laser are circular spot spots, and the imaging of the echo laser on the array detector 222 is located in a single pixel of the array detector 222.
  • the deflection mechanism is a two-dimensional MEMS micromirror 23a
  • the two-dimensional MEMS micromirror 23a includes a mirror surface, a first rotation axis x1, and a second rotation axis x2.
  • the spot size of the outgoing laser and the echo laser is a point spot.
  • the mirror is used to rotate around the first rotation axis x1, so that the emitted laser light scans the detection area of the array detector 222 in the horizontal direction.
  • the mirror surface is also used to rotate around the second rotation axis x2, so that the emitted laser light scans the detection area of the array detector 222 in the vertical direction.
  • the mirror is also used to receive the echo laser and reflect the echo laser to the receiving module 22.
  • the specific scanning process is as follows: the mirror rotates in the first direction around the first rotation axis x1, so that the outgoing laser scans the detection area of the array detector 222 to the right in the horizontal direction; when the outgoing laser completes the first horizontal scan, the mirror rotates around the second
  • the shaft x2 rotates in the second direction, so that the outgoing laser scans the detection area of the array detector 222 downward in the vertical direction.
  • the outgoing laser only needs to scan to the position of the second row of pixels with its spot in the vertical direction to complete the vertical direction.
  • the mirror rotates in the third direction around the first axis of rotation x1, so that the emitted laser scans the detection area of the array detector 222 to the left in the horizontal direction, and the third direction is the opposite direction of the first direction;
  • the mirror rotates in the second direction around the second rotation axis x2, so that the outgoing laser scans the detection area of the array detector 222 downward in the vertical direction.
  • the outgoing laser only needs to scan until its spot is in the vertical direction.
  • the position of the third row of pixels in the vertical direction is the second vertical scan; after the second vertical scan is completed, the mirror rotates in the first direction around the first axis of rotation x1...and scans back and forth in this way until the traversal is completed.
  • the outgoing laser can also scan to the left in the horizontal direction at the beginning.
  • the divergence angle of the outgoing laser collimated may be slightly larger than the angular resolution of the array detector 222, that is, the imaging of the echo laser on the array detector 222 slightly exceeds that of the array detector 222.
  • this method will affect the photoelectric efficiency of the system, and the influencing factor is about divergence angle/angle resolution.
  • the collimated outgoing laser beam is deflected by the two-dimensional MEMS micromirror 23a to the detection range of a certain pixel in the detection area of the array detector 222, and the signal light source shapes the divergence angle of the beam (that is, collimation).
  • the divergence angle of the subsequent emitted laser light is smaller than the angular resolution of a single pixel, and a larger light energy utilization rate is achieved.
  • the array detector 222 synchronously turns on its corresponding pixel to start ranging, and then the distance value of the corresponding position can be obtained. Through the scanning of the two-dimensional MEMS micromirror 23a, the detection area of all the pixels of the entire array detector 222 is traversed to obtain the distance value of each position, thereby obtaining the 3D point cloud data of the entire detection area.
  • the current array detector 222 is on the order of 100,000 pixels.
  • the required laser energy can be reduced by 10 5 orders of magnitude when testing the same distance.
  • the cost of the signal light source is reduced and the reliability is improved.
  • the size of the image surface of the array detector 222 can be compressed to meet the miniaturization requirements of products.
  • the imaging of the echo laser on the array detector 222 is located within 1/2 of the pixel of the array detector 222, and a single pixel of the array detector 222 is used according to the output
  • the laser scanning sequence receives the echo laser in the first pixel area and the second pixel area (please refer to Figure 5b).
  • the scanning method is similar to the scanning method of the embodiment in FIG. 4a. The difference is that, as shown in FIG. When scanning in the horizontal direction within each pixel first, to complete the scanning of each row of pixels, it is necessary to scan once in the horizontal direction, once in the vertical direction, and once again in the horizontal direction. That is, it needs to scan twice in the horizontal direction to complete the scanning of each row of pixels. As shown in FIG.
  • the laser emitting unit 211 needs to emit twice, and the pixels of the corresponding array detector 222 perform coordinated work twice simultaneously, and finally the effect of increasing the resolution by two times can be achieved.
  • the spot of the echo laser is imaged on the left half (or upper half) of the pixel, at this time the angle of the two-dimensional MEMS micromirror 23a is ⁇ 1 ; at t 2 At time, the spot of the echo laser is imaged on the right half (or lower half) of the pixel, and the angle of the two-dimensional MEMS micromirror 23a is ⁇ 2 ; then the azimuth angles of the objects detected at t1 and t2 can be determined by ⁇ 1 and ⁇ 2 are determined.
  • the angle of the two-dimensional MEMS micromirror 23a can be directly read from the MEMS.
  • the read angle of the two-dimensional MEMS micromirror 23a is around the first axis of rotation.
  • the deflection angle of x1 when the spot of the echo laser is imaged on the upper and lower parts of the pixel, the read angle of the two-dimensional MEMS micromirror 23a is the deflection angle around the second rotation axis x2.
  • this embodiment can detect whether the target object is located in the first pixel area or the second pixel area of the pixel, and the angular resolution is doubled. It can be understood that the imaging size of the echo laser on the array detector 222 can be further reduced, and the corresponding detection times of a single pixel can be further increased, thereby further improving the angular resolution of the detection.
  • the imaging of the echo laser on the array detector 222 is located within 1/4 of the pixel of the array detector 222, and a single pixel of the array detector 222 is used according to the output
  • the laser scanning sequence receives the echo laser in the first pixel area, the second pixel area, the third pixel area, and the fourth pixel area (please refer to Figure 6b).
  • the scanning method is similar to the scanning method of the embodiment in FIG. 4a, and the difference is that to complete the scanning of each row of pixels, it is necessary to scan once in the horizontal direction, once in the vertical direction, and once again in the horizontal direction. That is, it needs to scan twice in the horizontal direction to complete the scanning of each row of pixels.
  • the laser emitting unit 211 needs to be fired four times, and the pixels of the corresponding array detector 222 perform four times of coordinated work simultaneously, which can detect that the target object is located in the first pixel area and the second pixel area of the pixel.
  • the pixel area, the third pixel area or the fourth pixel area can finally achieve the effect of increasing the resolution by four times.
  • the above method can effectively improve the angular resolution of the array detector 222 and achieve the purpose of identifying smaller objects. Without increasing other costs.
  • the corresponding horizontal angle of view of a single pixel is between 0 and 0.2°, and the vertical angle of view is also between 0 and 0.2°; after scanning a single pixel twice in the horizontal direction, the deflection is added.
  • the angle of the mechanism that is, the angle of the two-dimensional MEMS micromirror 23a, so that it can be known that the detection object is within the field of view angle of 0 ⁇ 0.1° or the field of view angle of 0.1 ⁇ 0.2°, so the resolution is increased by two times; After the pixel has been scanned four times in the horizontal and vertical directions, the angle of the deflection mechanism, that is, the angle of the two-dimensional MEMS micromirror 23a, is added, so that it can be known that the detection object is located at a horizontal field of view angle of 0 ⁇ 0.1° and a vertical field of view.
  • the angle of view is 0 ⁇ 0.1°, or the horizontal angle of view is 0.1 ⁇ 0.2°, the vertical angle of view is 0 ⁇ 0.1°, the horizontal angle of view is 0 ⁇ 0.1°, the vertical angle of view is 0.1 ⁇ 0.2°, or horizontal
  • the field of view is within 0.1-0.2°, and the vertical field of view is within 0.1-0.2°, so the resolution is increased by four times.
  • the above-mentioned resolution increase is not limited to four times, and higher resolution can also be achieved.
  • the deflection mechanism is a two-dimensional MEMS micromirror 23a
  • the two-dimensional MEMS micromirror 23a includes a mirror surface, a first rotation axis x1, and a second rotation axis x2.
  • the spot of the outgoing laser is a small area spot, that is, the size of the echo laser imaging on the array detector 222 in the horizontal and vertical directions is smaller than the size of the overall pixel of the array detector 222 in the corresponding direction, but both are larger than The size of a single pixel on the receiving surface of the array detector 222 in the corresponding direction.
  • the mirror is used to rotate around the first rotation axis x1, so that the emitted laser light scans the detection area of the array detector 222 in the horizontal direction.
  • the mirror surface is also used to rotate around the second rotation axis x2, so that the emitted laser light scans the detection area of the array detector 222 in the vertical direction.
  • the mirror is also used to receive the echo laser and reflect the echo laser to the receiving module 22.
  • the specific scanning process is as follows: the mirror rotates in the first direction around the first rotation axis x1, so that the outgoing laser scans the detection area of the array detector 222 to the right in the horizontal direction; when the outgoing laser completes the first horizontal scan, the mirror rotates around the second The shaft x2 rotates in the second direction to move the outgoing laser downward in the vertical direction to the position of the second horizontal scan, then the first vertical scan is completed; the mirror rotates in the third direction around the first shaft x1, so that The outgoing laser scans the detection area of the array detector 222 to the left in the horizontal direction, and the third direction is the opposite direction of the first direction; when the outgoing laser completes the second horizontal scan, the mirror rotates in the second direction around the second rotation axis x2 , The outgoing laser is moved down in the vertical direction to the position of the third horizontal scan, then the second vertical scan is completed; the mirror rotates in the first direction around the first rotation axis x1...and scans back and forth in this way until the traversal
  • the deflection mechanism is a two-dimensional MEMS micromirror 23a
  • the two-dimensional MEMS micromirror 23a includes a mirror surface, a first rotation axis x1, and a second rotation axis x2.
  • the spot of the outgoing laser is a short vertical spot, that is, the size of the echo laser on the array detector 222 in the horizontal direction is less than or equal to the size of a single pixel on the receiving surface of the array detector 222 in the corresponding direction (the In the figure, it is equal to), the size of the echo laser on the array detector 222 in the vertical direction is larger than the size of a single pixel on the receiving surface of the array detector 222 in the corresponding direction, but the echo laser on the array detector The size of the image on the 222 in the vertical direction is smaller than the size of the overall pixel of the array detector 222 in the vertical direction.
  • the mirror is used to rotate around the first rotation axis x1, so that the emitted laser light scans the detection area of the array detector 222 in the horizontal direction.
  • the mirror surface is also used to rotate around the second rotation axis x2, so that the emitted laser light scans the detection area of the array detector 222 in the vertical direction.
  • the mirror is also used to receive the echo laser and reflect the echo laser to the receiving module 22.
  • the specific scanning process is as follows: the mirror rotates in the first direction around the first rotation axis x1, so that the outgoing laser scans the detection area of the array detector 222 to the right in the horizontal direction; when the outgoing laser completes the first horizontal scan, the mirror rotates around the second The shaft x2 rotates in the second direction to move the outgoing laser downward in the vertical direction to the position of the second horizontal scan, then the first vertical scan is completed; the mirror rotates in the third direction around the first shaft x1, so that The outgoing laser scans the detection area of the array detector 222 to the left in the horizontal direction, and the third direction is the opposite direction of the first direction; when the outgoing laser completes the second horizontal scan, the mirror rotates in the second direction around the second rotation axis x2 , The outgoing laser is moved down in the vertical direction to the position of the third horizontal scan.
  • the light spot can also be a short-line light spot in the transverse direction, that is, the size of the echo laser imaging on the array detector 222 in the vertical direction is less than or equal to the receiving of the array detector 222.
  • the size of the single pixel of the surface in the corresponding direction, the size of the echo laser on the array detector 222 in the horizontal direction is larger than the size of the single pixel on the receiving surface of the array detector 222 in the corresponding direction, but the echo laser
  • the size of the image on the array detector 222 in the horizontal direction is smaller than the size of the entire pixel of the array detector 222 in the horizontal direction.
  • the horizontal line spot can be scanned in the first vertical direction first, and then the spot is moved to the second vertical scanning position by horizontal scanning, and then the second vertical scanning is performed.
  • the difference from the above-mentioned embodiment (2) is that in this embodiment, a linear spot is adopted, and the area of a single detection is narrower than that in the embodiment (2), and the emission energy can be reduced, thereby reducing the power of the laser emitting unit 211.
  • the total detection time required is longer than that of the second embodiment. If the length of the line spot in the horizontal or vertical direction is set reasonably, the total detection time can be kept within an acceptable range.
  • the size of the echo laser on the array detector 222 in the horizontal direction is smaller than that of a single pixel on the receiving surface of the array detector 222.
  • the size of the corresponding direction for example, the size of the echo laser imaging on the array detector 222 in the horizontal direction is only 1/4 of the size of a single pixel on the receiving surface of the array detector 222 in the corresponding direction.
  • the deflection mechanism is a one-dimensional MEMS micromirror 23b
  • the one-dimensional MEMS micromirror 23b includes a mirror surface and a rotation axis x.
  • the spot of the outgoing laser is a vertical long-line spot, that is, the size of the echo laser on the array detector 222 in the horizontal direction is less than or equal to the size of a single pixel on the receiving surface of the array detector 222 in the corresponding direction.
  • the vertical size of the imaging of the wave laser on the array detector 222 is greater than or equal to the size of the overall pixel of the array detector 222 in the vertical direction.
  • the mirror is used to rotate around the rotation axis x, so that the emitted laser light scans the detection area of the array detector 222 in the horizontal direction.
  • the mirror is also used to receive the echo laser and reflect the echo laser to the receiving module 22.
  • the specific scanning process is: the mirror rotates in the first direction around the rotation axis x, so that the emitted laser scans the detection area of the array detector 222 to the right in the horizontal direction until it traverses the entire detection area of the array detector 222. Since the spot of the outgoing laser is a long-line spot, the size of the echo laser on the array detector 222 in the vertical direction covers the entire receiving surface of the array detector 222, so one scan in the horizontal direction can complete the entire array detector 222 Traversal of the detection area.
  • the light spot can also be a horizontal long-line light spot, that is, the size of the echo laser imaging on the array detector 222 in the vertical direction is less than or equal to that of the array detector 222.
  • the size of a single pixel of the surface in the corresponding direction, and the size of the echo laser imaged on the array detector 222 in the horizontal direction is greater than or equal to the size of the entire pixel of the array detector 222 in the horizontal direction.
  • the horizontal line spot scans in the vertical direction when scanning.
  • the difference from Fig. 9a is that the size of the echo laser imaging on the array detector 222 in the horizontal direction is smaller than that of a single pixel on the receiving surface of the array detector 222.
  • the size of the corresponding direction for example, the size of the echo laser imaging on the array detector 222 in the horizontal direction is only 1/4 of the size of a single pixel on the receiving surface of the array detector 222 in the corresponding direction.
  • the deflection mechanism is a one-dimensional MEMS micromirror 23b
  • the one-dimensional MEMS micromirror 23b includes a mirror surface and a rotation axis x.
  • the spot of the outgoing laser is a large vertical spot, that is, the size of the echo laser imaging on the array detector 222 in the horizontal direction is smaller than the size of the overall pixel of the array detector 222 in the horizontal direction, but larger than that of the array detector.
  • the size of a single pixel on the receiving surface of 222 in the corresponding direction, and the size of the echo laser imaging on the array detector 222 in the vertical direction is greater than or equal to the size of the overall pixel of the array detector 222 in the vertical direction.
  • the mirror is used to rotate around the rotation axis x, so that the emitted laser light scans the detection area of the array detector 222 in the horizontal direction.
  • the mirror is also used to receive the echo laser and reflect the echo laser to the receiving module 22.
  • the specific scanning process is: the mirror rotates in the first direction around the rotation axis x, so that the emitted laser scans the detection area of the array detector 222 to the right in the horizontal direction until it traverses the entire detection area of the array detector 222. Since the spot of the outgoing laser is a large area spot, the size of the echo laser on the array detector 222 in the vertical direction covers the entire receiving surface of the array detector 222, so one scan in the horizontal direction can complete the entire array detector 222 traversal of the detection area.
  • the light spot can also be a lateral large-area light spot, that is, the imaging of the echo laser on the array detector 222 in the vertical direction is smaller than that of the array detector 222.
  • the size of the overall pixel in the vertical direction, but larger than the size of a single pixel on the receiving surface of the array detector 222 in the corresponding direction, the size of the echo laser imaging on the array detector 222 in the horizontal direction is greater than or equal to that of the array detector
  • the horizontal line spot scans in the vertical direction when scanning.
  • the deflection mechanism is a one-dimensional MEMS micromirror 23b
  • the one-dimensional MEMS micromirror 23b includes a mirror surface and a rotation axis x.
  • the emitting module includes three emitting components 210.
  • Each emitting component 210 includes a laser emitting unit 211 and a emitting optical unit 212.
  • the laser emitting unit 211 is used to emit the first outgoing laser
  • the emitting optical unit 212 is used to collimate the first
  • the laser light is emitted, and the collimated first emitted laser light is incident on the one-dimensional MEMS micromirror 23b.
  • the outgoing laser is composed of all the first outgoing lasers, and the first outgoing lasers are arranged in the vertical direction.
  • the spot size of the first outgoing laser after collimation is smaller than the receiving surface of the array detector 222, and all the spots of the first outgoing laser are combined into a long-line spot, that is, the imaging of the first echo laser on the array detector 222 is horizontal
  • the size in the direction and the vertical direction are both smaller than the size of the overall pixel of the array detector 222 in the corresponding direction; the size of the echo laser imaging on the array detector 222 in the vertical direction is equal to or larger than the overall image of the array detector 222
  • the mirror surface is used to rotate around the rotation axis, so that the emitted laser light scans the detection area of the array detector 222 in a horizontal direction.
  • the mirror is also used to receive the first echo laser light and reflect the first echo laser light to the receiving module 22, where the first echo laser light is the laser light that returns after the first outgoing laser light is reflected by the object in the detection area.
  • the wave laser is composed of all the first echo lasers.
  • the specific scanning process is: the mirror rotates in the first direction around the rotation axis x, so that the emitted laser scans the detection area of the array detector 222 to the right in the horizontal direction until it traverses the entire detection area of the array detector 222. Since the spot of the outgoing laser is a long-line spot, the imaging of the echo laser on the array detector 222 in the vertical direction covers the entire receiving surface of the array detector 222, so one scan in the horizontal direction can complete the detection of the entire array detector 222 The traversal of the area.
  • a polling and emitting manner of the three emitting components 210 can be adopted. For example, first the first launching component 210 launches, then the second launching component 210 launches, and finally the third launching component 210 launches, and again it is the first launching component 210 to launch...and so on in sequence until the entire array is traversed The detection area of the detector 222.
  • the combined light spot may also be a horizontal long-line light spot, that is, the image of the combined echo laser on the array detector 222 in the vertical direction is less than or equal to The size of a single pixel on the receiving surface of the array detector 222 in the corresponding direction, and the size of the combined echo laser imaging on the array detector 222 in the horizontal direction is greater than or equal to the overall pixel size of the array detector 222 in the horizontal direction size of.
  • the horizontal line spot scans in the vertical direction when scanning.
  • the transmitting module may also include two, four, five, six, etc. multiple transmitting components 210, the size of the echo laser on the array detector 222 in the vertical or horizontal direction It is equal to or larger than the size of the overall pixel of the array detector 222 in the corresponding direction.
  • the light spots of all the first outgoing lasers can be combined into a large area light spot, that is, the size of the echo laser on the array detector 222 in the horizontal direction is larger than that of a single receiving surface of the array detector 222.
  • the size of the pixel in the corresponding direction but is smaller than the size of the overall pixel of the array detector 222 in the horizontal direction, and the sum of the dimensions of the echo laser imaging on the array detector 222 in the vertical direction is greater than or equal to the array detector 222 The size of the overall pixel in the vertical direction.
  • the emitted laser is shaped by the emitting optical unit 212 to form a spot spot, a line spot or a block spot.
  • the following methods can also be used:
  • the emission module 21 includes a laser emission unit 211, an emission optical unit 212, and an optical deflection module 214.
  • the optical deflection module 214 includes a plurality of devices arranged along a first direction. The deflection unit.
  • the laser emitting unit 211 is used to emit the emitted laser light to the emitting optical unit 212 along the first direction.
  • the emitting optical unit 212 collimates the emitted laser light and then enters the optical deflection module 214.
  • Each deflection unit in the optical deflection module 214 is used to make The preset ratio of the emitted laser light is deflected and then emitted.
  • the laser radar 100 further includes a deflection mechanism 23, which is used to receive the emitted laser light and reflect the emitted laser light to the detection area of the array detector 222, so that the emitted laser light scans the entire detection area.
  • the deflection mechanism 23 can be a device capable of realizing light scanning, such as a MEMS micromirror, a reflecting mirror or a transmissive prism.
  • the linear light spot incident on the detection area covers the entire detection area in the second direction. Therefore, the deflection mechanism 23 can adopt a one-dimensional MEMS micromirror 23b, and scan in one direction through the one-dimensional MEMS micromirror 23b. If the line spot covers only part of the detection area in the second direction, a two-dimensional MEMS micromirror needs to be used to complete scanning in both directions.
  • the deflection unit adopts plane mirrors, and each plane mirror is used to deflect a preset proportion of the outgoing laser light and emit it.
  • the preset ratio of the emitted laser light reflected by each plane mirror can be the same or different.
  • each flat mirror has the same or different transmission/reflection ratio, so that the emitted laser light is reflected from each flat mirror according to a preset fixed ratio.
  • the prepared plane mirror has a fixed transmission/reflection ratio.
  • the transmission/reflection ratio of each flat mirror is pre-calculated according to actual application requirements, and the corresponding flat mirror is selected or prepared according to the determined transmission/reflection ratio, so that the energy of the outgoing laser reflected by each flat mirror is the same or approximately same.
  • the transmittance of the first plane mirror is 80% and the reflectivity is 20%, the energy of the emitted laser light reflected by the first plane mirror is 20% of the total energy of the emitted laser; the second plane mirror The transmittance is 75% and the reflectivity is 25%.
  • the emitted laser energy reflected by each flat mirror is about 20% of the total emitted laser energy.
  • the energy of the emitted laser reflected by the plane mirror that is incident on the region of interest in the detection area after being deflected may also be greater than that of the emitted laser reflected by other plane mirrors.
  • energy For example, there are 5 plane mirrors in total, and the central area is the region of interest.
  • the energy of the outgoing laser reflected by the 3 plane mirrors in the detection center needs to be greater than the energy of the outgoing laser reflected by the other two plane mirrors; the transmittance of the first plane mirror is 90% , The reflectivity is 10%, the energy of the outgoing laser reflected by the first plane mirror is 10% of the total energy of the outgoing laser; the transmittance of the second plane mirror is 71%, and the reflectivity is 29%, then it will pass through the second plane mirror.
  • the energy of the emitted laser light reflected by the three plane mirrors in the detection center area needs to be greater than the energy of the emitted laser light reflected by the remaining two plane mirrors.
  • the transmittance/reflectance of the plane mirror can be changed according to the actual situation. After determining the transmittance/reflectance of each plane mirror, select or prepare the corresponding plane mirror to meet the actual detection requirements.
  • all the flat mirrors may be 45 degrees, so that the emitted laser light is uniformly distributed in a stripe shape.
  • a larger area of the deflection mechanism 23 is required to receive the emitted laser light reflected by all the plane mirrors. Therefore, the placement angle of the plane mirror can be changed to change the deflection direction, so that the outgoing laser light passing through the plane mirror can converge, thereby reducing the size of the deflection mechanism 23.
  • the angles between the plurality of plane mirrors and the outgoing laser light emitted by the laser emitting unit 211 are sequentially reduced along the first direction, so that the outgoing laser light passing through each plane mirror is converged toward the center direction.
  • the deflection mechanism 23 is just at the focal position where the outgoing laser light converges. When the deflection mechanism 23 is at this position, the size of the deflection mechanism 23 can be minimized. Of course, the deflection mechanism 23 may also be located at a non-focus position, such as the position shown in FIG. 13b. At this time, the size of the deflection mechanism 23 is larger than that in FIG. 13a.
  • a lens 213 is also used to condense the outgoing laser light deflected by each flat mirror and make it incident.
  • the deflection mechanism 23 There is an optical path gap between the outgoing laser beams collimated by the emission optical unit 212, which will cause the light spot reflected by the deflection mechanism 23 to not be a continuous line light spot, and there is a blind spot in the detection.
  • a lens 213 is arranged on the light path of the outgoing laser reflected by the plane mirror to converge the light beam, so that the light spot incident on the deflection mechanism 23 is a continuous linear light spot without gaps, so the light spot reflected by the deflection mechanism 23 is also a continuous linear light spot without gaps. , Avoid detecting blind spots.
  • the spot of the outgoing laser in the above embodiment is a line spot
  • the situation of shaping the line spot will be described:
  • the laser radar 100 may also be provided with an optical shaping module 215 between the transmitting optical unit 212 and the deflection mechanism 23.
  • the laser emitting unit 211 uses a laser 2112.
  • the laser emitting unit 211 is used to emit the emitted laser light to the emitting optical unit 212, which is collimated into a line spot by the emitting optical unit 212 and then incident to the optical shaping module 215.
  • the optical shaping module 215 is used to converge and emit the laser light.
  • the deflection mechanism 23 is used to receive the outgoing laser light and reflect the outgoing laser light to be directed into the detection area of the array detector 222.
  • the deflection mechanism 23 is also used to scan the outgoing laser light in a linear spot to traverse the entire detection area.
  • the optical shaping module 215 may adopt a cylindrical lens or a micro-cylindrical lens array.
  • the deflection mechanism 23 can be a device capable of realizing light scanning, such as a MEMS micromirror, a reflecting mirror or a transmissive prism.
  • the line spot covers the entire detection area in the vertical direction.
  • the deflection mechanism 23 can adopt a one-dimensional MEMS micromirror 23b, and scan in one direction through the one-dimensional MEMS micromirror 23b. If the linear spot only covers part of the detection area in the vertical direction, a two-dimensional MEMS micromirror is required.
  • a reflective module can also be provided in the optical path. For example, in this embodiment, a reflective mirror 216 is provided between the transmitting optical unit 212 and the optical shaping module 215.
  • an optical shaping module 215 is arranged between the emitting optical unit 212 and the deflection mechanism 23.
  • the optical shaping module 215 condenses the emitted laser light and then enters the deflection mechanism 23, so that the spot of the emitted laser light reflected by the deflection mechanism 23 is continuous and non-continuous. Line spots in the gap avoid detection blind spots.
  • the position of the optical shaping module 215 can also be adjusted. As shown in FIG. 15b, in another embodiment, the optical shaping module 215 is disposed on the light path of the outgoing laser reflected by the deflection mechanism 23.
  • the laser emission unit 211 is used to emit the emitted laser light to the emission optical unit 212, which is collimated into a line spot by the emission optical unit 212 and then enters the deflection mechanism 23; the deflection mechanism 23 is used to receive the emitted laser light and reflect it to the optical shaping module 215;
  • the optical shaping module 215 is used to shape the outgoing laser into a continuous line spot without gaps and then project into the detection area of the array detector 222; the deflection mechanism 23 is also used to scan the line spot to traverse the entire detection area.
  • the optical shaping module 215 is a cylindrical mirror or a micro-cylindrical lens array.
  • the cross section of the optical shaping module 215 in the rotation plane of the deflection mechanism 23 is arc-shaped and symmetrical around the deflection mechanism 23, as shown in FIG. 15c.
  • the deflection mechanism 23 can be a device capable of realizing light scanning, such as a MEMS micromirror, a reflecting mirror or a transmissive prism.
  • the line spot covers the entire detection area in the vertical direction. Therefore, the deflection mechanism 23 can adopt a one-dimensional MEMS micromirror 23b, and scan in one direction through the one-dimensional MEMS micromirror 23b. If the linear spot only covers part of the detection area in the vertical direction, a two-dimensional MEMS micromirror is required.
  • the optical shaping module 215 is arranged on the light path of the outgoing laser reflected by the deflection mechanism 23, and the optical shaping module 215 shapes the outgoing laser reflected by the deflection mechanism 23 into a continuous line spot with no gaps and then sends it to the array detector 222 for detection. Area, the final outgoing laser spot is a continuous line spot with no gaps to avoid detection blind spots.
  • an embodiment of the present invention proposes an automatic driving device 200 that includes the lidar 100 in the above-mentioned embodiment.
  • the automatic driving device 200 can be a car, an airplane, a boat, or other related to the use of lidar for intelligence.
  • the automatic driving device 200 includes a driving device body 201 and the lidar 100 in the above embodiment, and the lidar 100 is installed on the driving device body 201.
  • the automatic driving device 200 is an unmanned car, and the lidar 100 is installed on the side of the car body.
  • the automatic driving device 200 is also an unmanned car, and the lidar 100 is installed on the roof of the car.

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Radar, Positioning & Navigation (AREA)
  • Remote Sensing (AREA)
  • Optical Radar Systems And Details Thereof (AREA)

Abstract

A lidar (100) and a self-driving device (200). The lidar (100) comprises an emitting drive system (1), a laser light transceiver system (2) and a control and signal processing system (3); the laser light transceiver system (2) comprises an emitting module (21), a deflection mechanism (23) and a receiving module (22); the receiving module (22) comprises an array detector (222); the emitting module (21) is used to emit outgoing laser light; the deflection mechanism (23) is used to receive the outgoing laser light and reflect the outgoing laser light into a detection region of the array detector (222), and enabling the outgoing laser light to traverse all of the detection regions of the array detector (222) in a scanning manner; the deflection mechanism (23) is also used to receive echo laser light and reflect the echo laser light to the receiving module (22), wherein the echo laser light is laser light returned after the outgoing laser light is reflected by an object in the detection region, and the size of the image of the echo laser light for the single scanning on the array detector (222) is smaller than the size of the entire picture element of the array detector (222), which can reduce the emitting energy, and can increase the detection distance when the emitting energy is the same.

Description

激光雷达及自动驾驶设备Lidar and autonomous driving equipment 技术领域Technical field
本发明实施例涉及雷达技术领域,特别是涉及一种激光雷达及自动驾驶设备。The embodiment of the present invention relates to the field of radar technology, in particular to a laser radar and automatic driving equipment.
背景技术Background technique
激光雷达是使用激光来探测目标物体的位置、速度等特征量的雷达系统,其工作原理是发射模组先向目标发射用于探测的出射激光,然后接收模组接收从目标物体反射回来的回波激光,处理接收到的回波激光后可获得目标物体的有关信息,例如距离、方位、高度、速度、姿态、甚至形状等参数。Lidar is a radar system that uses lasers to detect the position and speed of the target object. Its working principle is that the transmitting module first transmits the outgoing laser to the target for detection, and then the receiving module receives the feedback reflected from the target object. Wave laser, after processing the received echo laser, the relevant information of the target object, such as distance, azimuth, height, speed, posture, and even shape parameters, can be obtained.
接收模组的一种实现形式为阵列探测器,由多个探测像元以阵列的方式排布组成阵列探测器。随着探测分辨率要求的提升,阵列探测器中单位面积像元上的像素尺寸越来越小。若接收镜头不变,则需要增加发射信号光源的功率,或者增加阵列探测器的接收面尺寸。而增加接收面尺寸将直接影响接收镜头的设计难度,增加阵列探测器的本身成本,以及增大激光雷达产品的整体尺寸。An implementation form of the receiving module is an array detector, which is composed of a plurality of detection pixels arranged in an array to form an array detector. With the improvement of the detection resolution requirement, the pixel size on the unit area pixel in the array detector is getting smaller and smaller. If the receiving lens remains the same, it is necessary to increase the power of the signal light source or increase the size of the receiving surface of the array detector. Increasing the size of the receiving surface will directly affect the design difficulty of the receiving lens, increase the cost of the array detector itself, and increase the overall size of the lidar product.
发明内容Summary of the invention
针对现有技术的上述缺陷,本发明实施例的主要目的在于提供一种激光雷达及自动驾驶设备,可以在不增加阵列探测器的接收面尺寸且保证探测分辨率的基础上,降低所需光源的峰值功率,降低发射能量,在发射能量相同时可以提高探测距离。In view of the above-mentioned defects in the prior art, the main purpose of the embodiments of the present invention is to provide a lidar and automatic driving equipment, which can reduce the required light source without increasing the size of the receiving surface of the array detector and ensuring the detection resolution. The peak power is lower, the emission energy is reduced, and the detection range can be increased when the emission energy is the same.
本发明实施例采用的一个技术方案是:提供一种激光雷达,所述激光雷达包括发射驱动系统、激光收发系统和控制与信号处理系统;A technical solution adopted by the embodiment of the present invention is to provide a laser radar, the laser radar includes a transmission drive system, a laser transceiver system, and a control and signal processing system;
所述激光收发系统包括发射模组、偏转机构和接收模组;所述接收模组包括阵列探测器;The laser transceiver system includes a transmitting module, a deflection mechanism, and a receiving module; the receiving module includes an array detector;
所述发射模组用于发射出射激光;The emitting module is used for emitting outgoing laser;
所述偏转机构用于接收所述出射激光并将所述出射激光反射后射向所述阵列探测器的探测区域内,并使所述出射激光以扫描的方式遍历所述阵列探测器的所有探测区域;所述偏转机构还用于接收回波激光并将所述回波激光反射后射向所述接收模组,其中所述回波激光为所述出射激光被所述探测区域内的物体反射后返回的激光,单次扫描的所述回波激光在所述阵列探测器上的成像的尺寸小于所述阵列探测器的整体像元尺寸;The deflection mechanism is used to receive the outgoing laser light, reflect the outgoing laser light and shoot it into the detection area of the array detector, and make the outgoing laser light traverse all the detections of the array detector in a scanning manner Area; the deflection mechanism is also used to receive the echo laser and reflect the echo laser to the receiving module, wherein the echo laser is the outgoing laser reflected by the object in the detection area For the later returning laser, the imaging size of the echo laser on the array detector in a single scan is smaller than the overall pixel size of the array detector;
所述接收模组用于接收所述回波激光;The receiving module is used to receive the echo laser;
所述发射驱动系统用于驱动所述发射模组;The emission driving system is used to drive the emission module;
所述控制与信号处理系统用于控制所述发射驱动系统驱动所述发射模组,以及控制所述接收模组接收所述回波激光。The control and signal processing system is used for controlling the emission driving system to drive the emission module, and controlling the receiving module to receive the echo laser.
可选的,所述接收模组用于在所述出射激光扫描所述探测区域中的第一区域时,同步开启所述阵列探测器中对应于所述第一区域的所有像元以接收回波激光,对所述第一区域进行探测。Optionally, the receiving module is configured to simultaneously turn on all the pixels corresponding to the first area in the array detector to receive back when the outgoing laser scans the first area in the detection area Wave laser to detect the first area.
可选的,所述阵列探测器包括m*n个可单独控制开关的像元,所述m和n均为大于1的整数。Optionally, the array detector includes m*n pixels that can be individually switched on and off, and both m and n are integers greater than 1.
可选的,所述偏转机构为MEMS微镜、反射镜或透射棱镜。Optionally, the deflection mechanism is a MEMS micromirror, a reflecting mirror or a transmissive prism.
可选的,所述偏转机构包括镜面、第一转轴和第二转轴;Optionally, the deflection mechanism includes a mirror, a first rotating shaft, and a second rotating shaft;
所述镜面用于绕所述第一转轴转动,使所述出射激光沿水平方向扫描所述阵列探测器的探测区域;所述镜面还用于绕所述第二转轴转动,使所述出射激光沿竖直方向扫描所述阵列探测器的探测区域;所述镜面还用于接收所述回波激光并将所述回波激光反射后射向所述接收模组;The mirror surface is used to rotate around the first rotation axis so that the emitted laser light scans the detection area of the array detector in a horizontal direction; the mirror surface is also used to rotate around the second rotation axis so that the emitted laser light Scanning the detection area of the array detector in a vertical direction; the mirror is also used to receive the echo laser and reflect the echo laser to the receiving module;
所述回波激光在所述阵列探测器上的成像在水平方向和竖直方向的尺寸均小于所述阵列探测器的整体像元在相应方向的尺寸。The size of the echo laser imaging on the array detector in the horizontal direction and the vertical direction is smaller than the size of the overall pixel of the array detector in the corresponding direction.
可选的,所述偏转机构包括镜面和转轴;Optionally, the deflection mechanism includes a mirror surface and a rotating shaft;
所述镜面用于绕所述转轴转动,使所述出射激光沿第一方向扫描所述阵列探测器的探测区域;所述镜面还用于接收所述回波激光并将所述回波激光反射后射向所述接收模组;The mirror surface is used to rotate around the rotation axis, so that the outgoing laser light scans the detection area of the array detector in a first direction; the mirror surface is also used to receive the echo laser light and reflect the echo laser light Shot back to the receiving module;
所述回波激光在所述阵列探测器上的成像在第一方向的尺寸小于所述阵列探测器的整体像元在第一方向的尺寸,所述回波激光在所述阵列探测器上的成像在第二方向的尺寸等于或大于所述阵列探测器的整体像元在第二方向的尺寸;The size of the echo laser on the array detector in the first direction is smaller than the size of the overall pixel of the array detector in the first direction, and the echo laser on the array detector The size of the imaging in the second direction is equal to or greater than the size of the overall pixel of the array detector in the second direction;
所述第一方向为水平方向,所述第二方向为竖直方向;或者,所述第一方向为竖直方向,所述第二方向为水平方向。The first direction is a horizontal direction and the second direction is a vertical direction; alternatively, the first direction is a vertical direction and the second direction is a horizontal direction.
可选的,所述偏转机构包括镜面和转轴;Optionally, the deflection mechanism includes a mirror surface and a rotating shaft;
所述发射模组包括至少两个发射组件,每个发射组件包括一个激光发射单元和一个发射光学单元,所述激光发射单元用于发射第一出射激光,所述发射光学单元用于准直所述第一出射激光,并将准直后的所述第一出射激光入射到所述二维MEMS微镜;所述出射激光由所有的所述第一出射激光组成,所述第一出射激光 沿第一方向排布;所述镜面用于绕所述转轴转动,使所述出射激光沿第二方向扫描所述阵列探测器的探测区域;所述镜面还用于接收第一回波激光并将所述第一回波激光反射后射向所述接收模组,其中所述第一回波激光为所述第一出射激光被所述探测区域内的物体反射后返回的激光,所述回波激光由所有的所述第一回波激光组成;The emitting module includes at least two emitting components, each emitting component includes a laser emitting unit and a emitting optical unit, the laser emitting unit is used to emit the first outgoing laser, and the emitting optical unit is used for collimation. The first outgoing laser, and the collimated first outgoing laser is incident on the two-dimensional MEMS micromirror; the outgoing laser is composed of all the first outgoing lasers, and the first outgoing laser is along Arranged in the first direction; the mirror is used to rotate around the axis of rotation, so that the outgoing laser scans the detection area of the array detector in the second direction; the mirror is also used to receive the first echo laser and The first echo laser light is reflected and then directed to the receiving module, wherein the first echo laser light is the laser light that returns after the first outgoing laser light is reflected by an object in the detection area, and the echo The laser is composed of all the first echo lasers;
所述第一回波激光在所述阵列探测器上的成像在第一方向和第二方向的尺寸均小于所述阵列探测器的整体像元在相应方向的尺寸;所述回波激光在所述阵列探测器上的成像在第一方向的尺寸等于或大于所述阵列探测器的整体像元在第一方向的尺寸;The size of the imaging of the first echo laser on the array detector in the first direction and the second direction is smaller than the size of the overall pixel of the array detector in the corresponding direction; The size of the imaging on the array detector in the first direction is equal to or larger than the size of the entire pixel of the array detector in the first direction;
所述第一方向为水平方向,所述第二方向为竖直方向;或者,所述第一方向为竖直方向,所述第二方向为水平方向。The first direction is a horizontal direction and the second direction is a vertical direction; alternatively, the first direction is a vertical direction and the second direction is a horizontal direction.
可选的,所述至少两个发射组件按照先后顺序依次进行第一出射激光的发射。Optionally, the at least two emitting components sequentially emit the first outgoing laser light in a sequence.
可选的,所述发射模组包括三个发射组件。Optionally, the transmitting module includes three transmitting components.
可选的,所述回波激光为圆形光斑,所述回波激光在所述阵列探测器上的成像位于所述阵列探测器的单个像元内。Optionally, the echo laser is a circular spot, and the imaging of the echo laser on the array detector is located in a single pixel of the array detector.
可选的,所述回波激光为圆形光斑,所述回波激光在所述阵列探测器上的成像超出所述阵列探测器的单个像元,但不超出与该单个像元相邻的像元。Optionally, the echo laser is a circular spot, and the imaging of the echo laser on the array detector exceeds a single pixel of the array detector, but does not exceed the adjacent single pixel. Pixel.
可选的,所述回波激光在所述阵列探测器上的成像位于所述阵列探测器的1/2个像元内,所述阵列探测器的单个像元用于根据所述出射激光的扫描顺序在第一像元区和第二像元区分别接收所述回波激光。Optionally, the imaging of the echo laser on the array detector is located within 1/2 of the pixel of the array detector, and a single pixel of the array detector is used according to the output laser In the scanning sequence, the echo laser light is received in the first pixel area and the second pixel area respectively.
可选的,所述回波激光在所述阵列探测器上的成像位于所述阵列探测器的1/4个像元内,所述阵列探测的单个像元用于根据所述出射激光的扫描顺序在第一像元区、第二像元区、第三像元区和第四像元区分别接收所述回波激光。Optionally, the imaging of the echo laser on the array detector is located within 1/4 pixel of the array detector, and the single pixel detected by the array is used for scanning according to the emitted laser light. The echo laser is received in the first pixel area, the second pixel area, the third pixel area, and the fourth pixel area in sequence.
可选的,所述发射模组包括激光发射单元和发射光学单元;Optionally, the emitting module includes a laser emitting unit and a emitting optical unit;
激光发射单元用于发射出射激光;The laser emitting unit is used to emit outgoing laser;
发射光学单元用于准直出射激光,并将准直后的出射激光入射到偏转机构。The emission optical unit is used for collimating the emitted laser light, and incident the collimated emitted laser light to the deflection mechanism.
可选的,所述接收模组还包括接收光学单元;Optionally, the receiving module further includes a receiving optical unit;
所述接收光学单元用于会聚回波激光,并将会聚后的所述回波激光射向所述阵列探测器;The receiving optical unit is used to converge the echo laser, and shoot the collected echo laser to the array detector;
所述阵列探测器用于接收所述回波激光。The array detector is used to receive the echo laser.
本发明实施例还提供了一种自动驾驶设备,包括驾驶设备本体以及如上所述的激光雷达,所述激光雷达安装于所述驾驶设备本体。An embodiment of the present invention also provides an automatic driving device, including a driving device body and the above-mentioned lidar, and the lidar is installed on the driving device body.
本发明实施例的有益效果是:本发明实施例在现有常规的探测器基础上,通过出射激光进行整形,使出射激光光斑为点光斑、块光斑或者线光斑,并增加偏转机构,采用遍历扫描的方式完成探测区域的探测。由于采用点光斑、块光斑或者线光斑,可以在不增加阵列探测器的接收面尺寸且保证探测分辨率的基础上,降低所需光源的峰值功率,降低发射能量,在发射能量相同时可以提高探测距离。相比现有技术需要增加阵列探测器的接收面尺寸才能满足高分辨率要求,本发明实施例减小了阵列探测器的像面尺寸,从而减小了阵列探测器的尺寸,在相同的像面尺寸的情况下可以提高其像元数量,提高探测分辨率。The beneficial effects of the embodiments of the present invention are: on the basis of the existing conventional detectors, the outgoing laser is shaped to make the outgoing laser spot be a spot spot, a block spot or a line spot, and a deflection mechanism is added, and a traversal is adopted. The scanning method completes the detection of the detection area. Due to the use of spot, block or line spots, the peak power of the required light source and the emission energy can be reduced without increasing the size of the receiving surface of the array detector and ensuring the detection resolution. The emission energy can be increased when the emission energy is the same Detection distance. Compared with the prior art, it is necessary to increase the size of the receiving surface of the array detector to meet the high resolution requirements. The embodiment of the present invention reduces the size of the image surface of the array detector, thereby reducing the size of the array detector. In the case of surface size, the number of pixels can be increased, and the detection resolution can be improved.
附图说明Description of the drawings
一个或多个实施例通过与之对应的附图中的图片进行示例性说明,这些示例性说明并不构成对实施例的限定,附图中具有相同参考数字标号的元件表示为类似的元件,除非有特别申明,附图中的图不构成比例限制。One or more embodiments are exemplified by the pictures in the corresponding drawings. These exemplified descriptions do not constitute a limitation on the embodiments. The elements with the same reference numerals in the drawings are denoted as similar elements. Unless otherwise stated, the figures in the attached drawings do not constitute a scale limitation.
图1示出了本发明实施例提供的激光雷达的结构框图;Figure 1 shows a structural block diagram of a lidar provided by an embodiment of the present invention;
图2示出了本发明另一实施例提供的激光雷达的结构框图;Figure 2 shows a structural block diagram of a lidar provided by another embodiment of the present invention;
图3a示出了本发明实施例中块光斑的扫描示意图;Figure 3a shows a schematic diagram of scanning a block of light spots in an embodiment of the present invention;
图3b示出了本发明实施例中线光斑的扫描示意图;Figure 3b shows a schematic diagram of scanning a line spot in an embodiment of the present invention;
图3c示出了本发明实施例中点光斑的扫描示意图;Fig. 3c shows a schematic diagram of scanning a spot light spot in an embodiment of the present invention;
图4a示出了本发明实施例的激光收发系统采用二维MEMS微镜、点光斑、先横向扫描的示意图;FIG. 4a shows a schematic diagram of a laser transceiver system according to an embodiment of the present invention adopting a two-dimensional MEMS micromirror, a spot light spot, and a horizontal scanning first;
图4b示出了本发明实施例的激光收发系统采用二维MEMS微镜、点光斑、先竖向扫描的示意图;4b shows a schematic diagram of the laser transceiver system according to an embodiment of the present invention adopting a two-dimensional MEMS micromirror, a spot light spot, and vertical scanning first;
图5a示出了本发明实施例的激光收发系统采用二维MEMS微镜、1/2点光斑的示意图;Fig. 5a shows a schematic diagram of a laser transceiver system according to an embodiment of the present invention adopting a two-dimensional MEMS micromirror and a 1/2-point spot;
图5b示出了本发明实施例中阵列探测器的单个像元分为两个像元区的示意图;Figure 5b shows a schematic diagram of a single pixel of the array detector divided into two pixel regions in an embodiment of the present invention;
图5c示出了本发明另一实施例的激光收发系统采用二维MEMS微镜、1/2点光斑的示意图;FIG. 5c shows a schematic diagram of a laser transceiver system according to another embodiment of the present invention adopting a two-dimensional MEMS micromirror and a 1/2-point spot;
图6a示出了本发明实施例的激光收发系统采用二维MEMS微镜、1/4点光斑的示意图;Fig. 6a shows a schematic diagram of a laser transceiver system according to an embodiment of the present invention adopting a two-dimensional MEMS micromirror and a 1/4 point spot;
图6b示出了本发明实施例中阵列探测器的单个像元分为四个像元区的示意图;Figure 6b shows a schematic diagram of a single pixel of the array detector divided into four pixel regions in an embodiment of the present invention;
图7a示出了本发明实施例的激光收发系统采用二维MEMS微镜、小区域光斑、先横向扫描的示意图;FIG. 7a shows a schematic diagram of a laser transceiver system according to an embodiment of the present invention adopting a two-dimensional MEMS micromirror, a small area light spot, and a horizontal scanning first;
图7b示出了本发明实施例的激光收发系统采用二维MEMS微镜、小区域光斑、先竖向扫描的示意图;FIG. 7b shows a schematic diagram of the laser transceiver system according to an embodiment of the present invention adopting a two-dimensional MEMS micromirror, a small area light spot, and vertical scanning first;
图8a示出了本发明实施例的激光收发系统采用二维MEMS微镜、短线光斑、先横向扫描的示意图;FIG. 8a shows a schematic diagram of a laser transceiver system according to an embodiment of the present invention adopting a two-dimensional MEMS micromirror, a short-line light spot, and a horizontal scanning first;
图8b示出了本发明实施例的激光收发系统采用二维MEMS微镜、短线光斑、先竖向扫描的示意图;FIG. 8b shows a schematic diagram of the laser transceiver system according to an embodiment of the present invention adopting a two-dimensional MEMS micromirror, a short-line light spot, and vertical scanning first;
图8c示出了本发明另一实施例的激光收发系统采用二维MEMS微镜、1/4短线光斑、先横向扫描的示意图;FIG. 8c shows a schematic diagram of a laser transceiver system according to another embodiment of the present invention using a two-dimensional MEMS micromirror, a 1/4 short-line light spot, and a horizontal scan first;
图9a示出了本发明实施例的激光收发系统采用一维MEMS微镜、长线光斑、先横向扫描的示意图;FIG. 9a shows a schematic diagram of a laser transceiver system according to an embodiment of the present invention adopting a one-dimensional MEMS micromirror, a long-line light spot, and a horizontal scanning first;
图9b示出了本发明实施例的激光收发系统采用一维MEMS微镜、长线光斑、先竖向扫描的示意图;FIG. 9b shows a schematic diagram of the laser transceiver system according to an embodiment of the present invention adopting a one-dimensional MEMS micro-mirror, a long-line light spot, and vertical scanning first;
图9c示出了本发明另一实施例的激光收发系统采用一维MEMS微镜、1/4长线光斑、先横向扫描的示意图;FIG. 9c shows a schematic diagram of a laser transceiver system according to another embodiment of the present invention using a one-dimensional MEMS micromirror, a 1/4 long-line light spot, and a horizontal scan first;
图10a示出了本发明实施例的激光收发系统采用一维MEMS微镜、大区域光斑、先横向扫描的示意图;FIG. 10a shows a schematic diagram of a laser transceiver system according to an embodiment of the present invention using a one-dimensional MEMS micromirror, a large area light spot, and lateral scanning first;
图10b示出了本发明实施例的激光收发系统采用一维MEMS微镜、大区域光斑、先竖向扫描的示意图;FIG. 10b shows a schematic diagram of a laser transceiver system according to an embodiment of the present invention adopting a one-dimensional MEMS micromirror, a large area light spot, and vertical scanning first;
图11a示出了本发明实施例的激光收发系统采用一维MEMS微镜、线光斑、多个发射拼合、先横向扫描的示意图;FIG. 11a shows a schematic diagram of a laser transceiver system according to an embodiment of the present invention adopting a one-dimensional MEMS micromirror, a line spot, a plurality of emitters, and a horizontal scanning first;
图11b示出了本发明实施例的激光收发系统采用一维MEMS微镜、线光斑、多个发射拼合、先竖向扫描的示意图;FIG. 11b shows a schematic diagram of the laser transceiver system according to an embodiment of the present invention adopting a one-dimensional MEMS micromirror, a line spot, a plurality of emitters, and a vertical scanning first;
图12a示出了本发明实施例的激光雷达采用光学偏转模块的局部光路示意图;Fig. 12a shows a schematic diagram of a partial optical path of a laser radar according to an embodiment of the present invention using an optical deflection module;
图12b示出了本发明另一实施例的激光雷达采用光学偏转模块的局部光路示意图;FIG. 12b shows a schematic diagram of a partial optical path of a laser radar using an optical deflection module according to another embodiment of the present invention;
图13a示出了本发明另一实施例的激光雷达的光路示意图;Figure 13a shows a schematic diagram of the optical path of a lidar according to another embodiment of the present invention;
图13b示出了本发明再一实施例的激光雷达的光路示意图;Figure 13b shows a schematic diagram of the optical path of a lidar according to still another embodiment of the present invention;
图14示出了本发明又一实施例的激光雷达的局部光路示意图;FIG. 14 shows a schematic diagram of a partial optical path of a lidar according to another embodiment of the present invention;
图15a示出了本发明实施例的激光雷达包括光学整形模块的局部光路示意图;FIG. 15a shows a schematic diagram of a partial light path of a laser radar according to an embodiment of the present invention including an optical shaping module;
图15b示出了本发明另一实施例的激光雷达包括光学整形模块的局部光路示意图;15b shows a schematic diagram of a partial light path of a laser radar including an optical shaping module according to another embodiment of the present invention;
图15c示出了图15b中偏转机构和光学整形模块的示意图;Fig. 15c shows a schematic diagram of the deflection mechanism and the optical shaping module in Fig. 15b;
图16a示出了本发明实施例提供的自动驾驶设备的结构示意图;Figure 16a shows a schematic structural diagram of an automatic driving device provided by an embodiment of the present invention;
图16b示出了本发明另一实施例提供的自动驾驶设备的结构示意图。Fig. 16b shows a schematic structural diagram of an automatic driving device provided by another embodiment of the present invention.
具体实施方式中的附图标号如下:The reference signs in the specific implementation are as follows:
激光雷达100,发射驱动系统1,激光收发系统2,控制与信号处理系统3,发射模组21,发射组件210,激光发射单元211,发射光学单元212,透镜213,光学偏转模块214,光学整形模块215,反射镜216,接收模组22,接收光学单元221,阵列探测器222,偏转机构23,二维MEMS微镜23a,一维MEMS微镜23b,转轴x,第一转轴x1,第二转轴x2,自动驾驶设备200,驾驶设备本体201。 Lidar 100, emission drive system 1, laser transceiver system 2, control and signal processing system 3, emission module 21, emission assembly 210, laser emission unit 211, emission optical unit 212, lens 213, optical deflection module 214, optical shaping Module 215, mirror 216, receiving module 22, receiving optical unit 221, array detector 222, deflection mechanism 23, two-dimensional MEMS micromirror 23a, one-dimensional MEMS micromirror 23b, rotation axis x, first rotation axis x1, second The shaft x2, the automatic driving device 200, and the driving device body 201.
具体实施方式Detailed ways
下面将结合附图对本发明技术方案的实施例进行详细的描述。以下实施例仅用于更加清楚地说明本发明的技术方案,因此只作为示例,而不能以此来限制本发明的保护范围。The embodiments of the technical solution of the present invention will be described in detail below in conjunction with the accompanying drawings. The following embodiments are only used to illustrate the technical solutions of the present invention more clearly, and therefore are only used as examples, and cannot be used to limit the protection scope of the present invention.
需要注意的是,除非另有说明,本发明使用的技术术语或者科学术语应当为本发明所属领域技术人员所理解的通常意义。It should be noted that, unless otherwise specified, the technical terms or scientific terms used in the present invention should have the usual meanings understood by those skilled in the art to which the present invention belongs.
在本发明的描述中,需要理解的是,术语“中心”、“纵向”、“横向”、“长度”、“宽度”、“厚度”、“上”、“下”、“前”、“后”、“左”、“右”、“垂直”、“水平”、“顶”、“底”“内”、“外”、“顺时针”、“逆时针”、“轴向”、“径向”、“周向”等指示的方位或位置关系为基于附图所示的方位或位置关系,仅是为了便于描述本发明和简化描述,而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作,因此不能理解为对本发明的限制。In the description of the present invention, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", " Back", "Left", "Right", "Vertical", "Horizontal", "Top", "Bottom", "Inner", "Outer", "Clockwise", "Counterclockwise", "Axial", " The orientation or positional relationship indicated by "radial", "circumferential", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present invention and simplifying the description, and does not indicate or imply that the indicated device or element must be It has a specific orientation, is constructed and operated in a specific orientation, and therefore cannot be understood as a limitation to the present invention.
此外,术语“第一”、“第二”等仅用于描述目的,而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。在本发明的描述中,“多个”、“若干”的含义是两个以上(含两个),除非另有明确具体的限定。In addition, the terms "first", "second", etc. are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features. In the description of the present invention, "plurality" and "several" mean two or more (including two), unless otherwise specifically defined.
在本发明中,除非另有明确的规定和限定,术语“安装”、“相连”、“连接”、“固定”等术语应做广义理解,例如,可以是固定连接,也可以是可拆卸连接,或成一体;可以是机械连接,也可以是电连接;可以是直接相连,也可以通过中间媒介间接相连,可以是两个元件内部的连通或两个元件的相互作用关系。对于本领域的普通技术人员而言,可以根据具体情况理解上述术语在本发明中的具体含义。In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and other terms should be understood in a broad sense, for example, it can be a fixed connection or a detachable connection. , Or integrated; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the internal communication of two components or the interaction relationship between two components. For those of ordinary skill in the art, the specific meanings of the above-mentioned terms in the present invention can be understood according to specific situations.
在本发明中,除非另有明确的规定和限定,第一特征在第二特征“上”或“下”可以是第一和第二特征直接接触,或第一和第二特征通过中间媒介间接接触。而且,第一特征在第二特征“之上”、“上方”和“上面”可是第一特征在第二特征正上方或斜上方,或仅仅表示第一特征水平高度高于第二特征。第一特征在第二特征“之下”、“下方”和“下面”可以是第一特征在第二特征正下方或斜下方,或仅仅表示第一特征水平高度小于第二特征。In the present invention, unless expressly stipulated and defined otherwise, the “on” or “under” of the first feature on the second feature may be in direct contact with the first and second features, or the first and second features may be indirectly through an intermediary. touch. Moreover, the "above", "above" and "above" of the first feature on the second feature may mean that the first feature is directly above or diagonally above the second feature, or it simply means that the level of the first feature is higher than that of the second feature. The “below”, “below” and “below” of the second feature of the first feature may mean that the first feature is directly below or obliquely below the second feature, or it simply means that the level of the first feature is smaller than the second feature.
常规的阵列探测器中发射光源通过发射光束整形系统使照明视场覆盖整个探测视场,其对信号光源的峰值功率要求较高,单个像元接收的信号光有限,仅适合近距离场合的探测。随着探测角分辨率的要求越来越高,难以满足远距离探测的需求,因此探测距离受限。且整个阵列探测器的分辨率受限于阵列器件本身的像元分布和数量,而增加相应的像元数量将导致像面增大,在信号光源的峰值功率不变时,将降低单个像元的探测能量值,增加成本以及降低成品率,且不利于产品的小型化。In the conventional array detector, the emission light source covers the entire detection field of view through the emission beam shaping system, which requires high peak power of the signal light source, and the signal light received by a single pixel is limited, which is only suitable for detection in close-range occasions. . With the increasing requirements for the detection angle resolution, it is difficult to meet the needs of long-distance detection, so the detection range is limited. And the resolution of the entire array detector is limited by the pixel distribution and number of the array device itself, and increasing the corresponding number of pixels will cause the image surface to increase, and when the peak power of the signal light source remains unchanged, the single pixel will be reduced. The detection energy value increases the cost and reduces the yield, and is not conducive to the miniaturization of the product.
如图1所示,本发明实施例提供了一种激光雷达100,其包括发射驱动系统1、激光收发系统2和控制与信号处理系统3。其中,激光收发系统2包括发射模组21、接收模组22和偏转机构23。发射模组21用于发射出射激光。偏转机构23用于接收出射激光并将出射激光反射后射向接收模组22的探测区域内,并使出射激光以扫描的方式遍历接收模组22的所有探测区域,偏转机构23还用于接收回波激光并将回波激光反射后射向接收模组22,回波激光为出射激光被探测区域内的物体反射后返回的激光。接收模组22用于接收回波激光。发射驱动系统1用于驱动发射模组21。控制与信号处理系统3用于控制发射驱动系统1驱动发射模组21,以及控制接收模组22接收回波激光。As shown in FIG. 1, an embodiment of the present invention provides a laser radar 100, which includes a transmission drive system 1, a laser transceiver system 2, and a control and signal processing system 3. Among them, the laser transceiver system 2 includes a transmitting module 21, a receiving module 22 and a deflection mechanism 23. The emitting module 21 is used for emitting outgoing laser light. The deflection mechanism 23 is used to receive the outgoing laser and reflect the outgoing laser to the detection area of the receiving module 22, and make the outgoing laser traverse all the detection areas of the receiving module 22 in a scanning manner. The deflection mechanism 23 is also used to receive The echo laser reflects the echo laser and shoots it toward the receiving module 22. The echo laser is the laser returned after the outgoing laser is reflected by an object in the detection area. The receiving module 22 is used for receiving echo laser light. The emission driving system 1 is used to drive the emission module 21. The control and signal processing system 3 is used for controlling the transmitting driving system 1 to drive the transmitting module 21 and controlling the receiving module 22 to receive the echo laser.
如图2所示,发射模组21包括激光发射单元211和发射光学单元212,激光发射单元211用于发射出射激光,发射光学单元212用于对出射激光整形,并将整形后的出射激光入射到偏转机构23。整形后的光斑可以为点光斑、线光斑或块光斑,经偏转机构23反射后入射至局部探测区域,也即探测区域的一部分。激光发射单元211可以为各种类型的信号光源,例如激光二极管(Laser Diode,LD)、垂直腔面发射激光器(Vertical Cavity Surface Emitting Laser,VCSEL)、边发射激光器(Edge Emitting Laser,EEL)、发光二极管(Light Emitting Diode,LED)光纤等器件。As shown in FIG. 2, the emission module 21 includes a laser emission unit 211 and an emission optical unit 212. The laser emission unit 211 is used to emit the emitted laser light, and the emission optical unit 212 is used to shape the emitted laser light and incident the shaped emitted laser light. To the deflection mechanism 23. The reshaped light spot may be a point light spot, a line light spot or a block light spot, which is reflected by the deflection mechanism 23 and then enters a local detection area, that is, a part of the detection area. The laser emitting unit 211 may be various types of signal light sources, such as laser diode (LD), vertical cavity surface emitting laser (VCSEL), edge emitting laser (Edge Emitting Laser, EEL), light emitting Diode (Light Emitting Diode, LED) optical fiber and other devices.
发射光学单元212可以采用透镜和透镜组、光纤和球透镜组、单独的球透镜组、柱面透镜组、慢轴准直器镜(Slow-Axis-Collimator LENS,SAC LENS)、快轴准直器镜(Fast-Axis-Collimator LENS)、微透镜阵列、衍射光学元件(Diffractive Optical Elements,DOE)、扩散器(Diffuser)等。例如,若激光发射单元211采用EEL,则可以采用FAC和SAC分别对出射激光进行快慢轴准直整形。若激光发射单元211采用VCSEL阵列等阵列排布器件,则可以采用透镜进行整形。若激光发射单元211采用非阵列排布的信号光源,则可以采用准直透镜和微透镜(或微柱面镜)组合的方式进行出射激光的整形。The transmitting optical unit 212 can adopt a lens and a lens group, an optical fiber and a ball lens group, a separate ball lens group, a cylindrical lens group, a slow-axis-collimator lens (Slow-Axis-Collimator LENS, SAC LENS), and fast-axis collimation. Mirror (Fast-Axis-Collimator LENS), micro lens array, diffractive optical elements (DOE), diffuser (Diffuser), etc. For example, if the laser emitting unit 211 adopts EEL, FAC and SAC can be used to respectively perform fast and slow axis collimation and shaping of the emitted laser. If the laser emitting unit 211 adopts an array arrangement device such as a VCSEL array, a lens can be used for shaping. If the laser emitting unit 211 adopts a signal light source arranged in a non-array arrangement, a collimating lens and a micro lens (or a micro cylindrical lens) can be used to shape the emitted laser light.
接收模组22包括接收光学单元221和阵列探测器222。接收光学单元221用于会聚回波激光,并将会聚后的回波激光射向阵列探测器222;阵列探测器222用于接收回波激光。接收光学单元221可以采用球透镜、球透镜组或柱透镜组等。阵列探测器222可以采用雪崩光电二极管(Avalanche Photo Diode,APD)阵列、硅光电倍增管(Silicon photomultiplier,SiPM)、多像素光子计数器(Multi-Pixel Photon Counter,MPPC)阵列、光电倍增管(photomultiplier tube,PMT)阵列、单光子雪崩二极管(single-photon avalanche diode,SPAD)阵列、快速电荷耦合元件(Charge-coupled Device,CCD)和互补金属氧化物半导体(Complementary Metal Oxide Semiconductor,CMOS)等可以组成阵列接收的器件。阵列探测器222可以采用面阵探测器,其具有m*n个可单独控制开关的像元,m和n均为大于1的整数。The receiving module 22 includes a receiving optical unit 221 and an array detector 222. The receiving optical unit 221 is used for condensing the echo laser and shooting the collected echo laser to the array detector 222; the array detector 222 is used for receiving the echo laser. The receiving optical unit 221 may adopt a ball lens, a ball lens group, a cylindrical lens group, or the like. The array detector 222 can use an avalanche photodiode (APD) array, a silicon photomultiplier (SiPM), a multi-pixel photon counter (MPPC) array, and a photomultiplier tube. , PMT) array, single-photon avalanche diode (SPAD) array, fast charge-coupled device (CCD) and complementary metal oxide semiconductor (Complementary Metal Oxide Semiconductor, CMOS), etc. can form an array The receiving device. The array detector 222 may be a surface array detector, which has m*n pixels that can be individually controlled on and off, and both m and n are integers greater than one.
控制与信号处理系统3可采用现场可编程门阵列(Field Programmable Gate Array,FPGA),FPGA与发射驱动系统1连接,进行出射激光的发射控制。FPGA还分别与接收模组22的时钟引脚、数据引脚和控制引脚连接,进行回波激光的接收控制。The control and signal processing system 3 may adopt a Field Programmable Gate Array (FPGA), and the FPGA is connected to the emission driving system 1 to perform emission control of the emitted laser. The FPGA is also connected to the clock pin, data pin, and control pin of the receiving module 22 respectively to control the receiving and controlling of the echo laser.
偏转机构23用于接收整形后的出射激光并将出射激光反射后射向阵列探测器222的局部探测区域内,并进行偏转使出射激光以扫描的方式遍历阵列探测器222的所有探测区域。偏转机构23还用于接收回波激光并将回波激光反射后射向接收模组22,回波激光为出射激光被探测区域内的物体反射后返回的激光。其中,出射激光的光斑尺寸与回波激光的光斑尺寸相同。通过光束整形控制出射激光的光斑尺寸,使单次扫描的回波激光在阵列探测器222上的成像的尺寸小于阵列探测器222的整体像元尺寸,也即小于阵列探测器222的接收面。The deflection mechanism 23 is used to receive the shaped outgoing laser, reflect the outgoing laser, and shoot it toward the local detection area of the array detector 222, and perform deflection so that the outgoing laser traverses all the detection areas of the array detector 222 in a scanning manner. The deflection mechanism 23 is also used for receiving the echo laser and reflecting the echo laser and shooting it towards the receiving module 22. The echo laser is the laser returning after the outgoing laser is reflected by the object in the detection area. Among them, the spot size of the outgoing laser is the same as the spot size of the echo laser. The spot size of the emitted laser is controlled by beam shaping, so that the imaging size of the echo laser of a single scan on the array detector 222 is smaller than the overall pixel size of the array detector 222, that is, smaller than the receiving surface of the array detector 222.
接收模组22用于在出射激光扫描探测区域中的第一区域时,同步开启阵列探测器222中对应于第一区域的所有像元以接收回波激光,对第一区域进行探测。例如,出射激光入射至探测区域中第一个像元时,阵列探测器222开启第一个像元进行探测,此时其他像元处于关闭状态,随后,出射激光入射至第二个像元,则阵列探测器222开启第二个像元进行探测,此时将关闭第一个像元的探测……如此依次进行每个像元的动态 探测。当然,当出射激光入射至探测区域的多个像元时,则阵列探测器222开启与之对应的多个像元进行探测。当然,阵列探测器也可以同时将所有像元均打开,但由于同一时刻有些像元对应的探测区域并未被出射激光扫描,因此该方式会增加耗电量和阵列探测器222的损耗。The receiving module 22 is used to simultaneously turn on all the pixels corresponding to the first area in the array detector 222 to receive the echo laser to detect the first area when the outgoing laser scans the first area in the detection area. For example, when the outgoing laser is incident on the first pixel in the detection area, the array detector 222 turns on the first pixel for detection. At this time, other pixels are in the off state, and then the outgoing laser is incident on the second pixel. Then the array detector 222 turns on the second pixel for detection, and at this time turns off the detection of the first pixel... and so on, the dynamic detection of each pixel is performed in turn. Of course, when the emitted laser light is incident on multiple pixels in the detection area, the array detector 222 turns on the multiple pixels corresponding to it for detection. Of course, the array detector can also turn on all the pixels at the same time, but since the detection area corresponding to some pixels is not scanned by the emitted laser at the same time, this method will increase the power consumption and the loss of the array detector 222.
如图3a所示,出射激光的光斑可以为小扩散角的块光斑(小区域光斑);如图3b所示,还可以为线光斑;相应的,回波激光的光斑也为块光斑或线光斑,如图3c所示,还可以为点光斑(光斑位于单个像元内)。准直后的出射激光通过偏转机构23偏转到阵列探测器222探测区域内的某个或某些像元的探测范围之内,阵列探测器222同步开启其相应像元开始测距,即可得到相应位置的距离值。通过偏转机构23的扫描,遍历整个阵列探测器222的所有像元的探测区域,得到每个位置的距离值,从而获得整个探测区域的3D点云数据。As shown in Figure 3a, the spot of the emitted laser can be a block spot (small area spot) with a small diffusion angle; as shown in Figure 3b, it can also be a line spot; correspondingly, the spot of the echo laser can also be a block spot or a line. The light spot, as shown in FIG. 3c, can also be a point light spot (the light spot is located in a single pixel). The collimated outgoing laser is deflected by the deflection mechanism 23 to be within the detection range of one or some pixels in the detection area of the array detector 222, and the array detector 222 turns on the corresponding pixels to start ranging, and you can get The distance value of the corresponding position. Through the scanning of the deflection mechanism 23, the detection area of all the pixels of the entire array detector 222 is traversed to obtain the distance value of each position, thereby obtaining the 3D point cloud data of the entire detection area.
本发明实施例在现有常规的探测器基础上,通过对出射激光进行整形,使出射激光光斑为点光斑、块光斑或者线光斑,并增加偏转机构,采用遍历扫描的方式完成探测区域的探测。由于采用点光斑、块光斑或者线光斑,可以在不增加阵列探测器的接收面尺寸且保证探测分辨率的基础上,降低所需光源的峰值功率,降低发射能量,在发射能量相同时可以提高探测距离,相比现有技术需要增加阵列探测器的接收面尺寸才能满足高分辨率要求,本发明实施例减小了阵列探测器的像面尺寸,从而减小了阵列探测器的尺寸,在相同的像面尺寸的情况下可以提高其像元数量,提高探测分辨率。On the basis of the existing conventional detectors, the embodiment of the present invention reshapes the outgoing laser to make the outgoing laser spot a point spot, block spot or line spot, and adds a deflection mechanism to complete the detection of the detection area by means of traversal scanning. . Due to the use of spot, block or line spots, the peak power of the required light source and the emission energy can be reduced without increasing the size of the receiving surface of the array detector and ensuring the detection resolution. The emission energy can be increased when the emission energy is the same Compared with the prior art, it is necessary to increase the size of the receiving surface of the array detector to meet the high-resolution requirements. The embodiment of the present invention reduces the size of the image surface of the array detector, thereby reducing the size of the array detector. In the case of the same image size, the number of pixels can be increased, and the detection resolution can be improved.
偏转机构23可以采用MEMS微镜、反射镜或透射棱镜等,实现对探测区域的扫描。The deflection mechanism 23 can use a MEMS micromirror, a reflecting mirror, a transmission prism, etc., to realize scanning of the detection area.
下面对采用不同出射激光的光斑的几个实施例进行进一步说明:The following further describes several embodiments of using different light spots for emitting laser light:
(一)采用二维MEMS微镜、点光斑(1) Using two-dimensional MEMS micro-mirror, point light spot
本实施例中,出射激光和回波激光均为圆形的点光斑,回波激光在阵列探测器222上的成像位于阵列探测器222的单个像元内。In this embodiment, both the outgoing laser and the echo laser are circular spot spots, and the imaging of the echo laser on the array detector 222 is located in a single pixel of the array detector 222.
如图4a所示,偏转机构为二维MEMS微镜23a,二维MEMS微镜23a包括镜面、第一转轴x1和第二转轴x2。出射激光和回波激光的光斑为点光斑,通过控制出射激光的光斑尺寸(即控制出射激光的发散角),从而控制回波激光的光斑尺寸,使回波激光在阵列探测器222上的成像位于阵列探测器222的单个像元内,且覆盖单个像元的大部分感应区域。镜面用于绕第一转轴x1转动,使出射激光沿水平方向扫描阵列探测器222的探测区域。镜面还用于绕第二转轴x2转动,使出射激光沿竖直方向扫描阵列探测器222的探测区域。镜面还用于接收回波激光并将回波激光反射后射向接收模组22。As shown in FIG. 4a, the deflection mechanism is a two-dimensional MEMS micromirror 23a, and the two-dimensional MEMS micromirror 23a includes a mirror surface, a first rotation axis x1, and a second rotation axis x2. The spot size of the outgoing laser and the echo laser is a point spot. By controlling the spot size of the outgoing laser (that is, controlling the divergence angle of the outgoing laser), the spot size of the echo laser is controlled, so that the echo laser is imaged on the array detector 222 It is located in a single pixel of the array detector 222 and covers most of the sensing area of the single pixel. The mirror is used to rotate around the first rotation axis x1, so that the emitted laser light scans the detection area of the array detector 222 in the horizontal direction. The mirror surface is also used to rotate around the second rotation axis x2, so that the emitted laser light scans the detection area of the array detector 222 in the vertical direction. The mirror is also used to receive the echo laser and reflect the echo laser to the receiving module 22.
具体扫描过程为:镜面绕第一转轴x1向第一方向转动,使出射激光沿水平方向向右扫描阵列探测器222的探测区域;当出射激光完成横向的第一次扫描后,镜面绕第二转轴x2向第二方向转动,使出射激光沿竖直方向向下扫描阵列探测器222的探测区域,出射激光只需扫描到其光斑在竖直方向的第二行像元位置,即完成竖向的第一次扫描;随后,镜面绕第一转轴x1向第三方向转动,使出射激光沿水平方向向左扫描阵列探测器222的探测区域,第三方向为第一方向的相反方向;当出射激光完成横向的第二次扫描后,镜面绕第二转轴x2向第二方向转动,使出射激光沿竖直方向向下扫描阵列探测器222的探测区域,出射激光只需扫描到其光斑在竖直方向的第三行像元位置,即完成竖向的第二次扫描;完成竖向的第二次扫描后,镜面绕第一转轴x1向第一方向转动……如此往复扫描,直至遍历完整个阵列探测器222的探测区域。当然,出射激光最开始也可以沿水平方向向左扫描。The specific scanning process is as follows: the mirror rotates in the first direction around the first rotation axis x1, so that the outgoing laser scans the detection area of the array detector 222 to the right in the horizontal direction; when the outgoing laser completes the first horizontal scan, the mirror rotates around the second The shaft x2 rotates in the second direction, so that the outgoing laser scans the detection area of the array detector 222 downward in the vertical direction. The outgoing laser only needs to scan to the position of the second row of pixels with its spot in the vertical direction to complete the vertical direction. Then, the mirror rotates in the third direction around the first axis of rotation x1, so that the emitted laser scans the detection area of the array detector 222 to the left in the horizontal direction, and the third direction is the opposite direction of the first direction; After the laser completes the second horizontal scan, the mirror rotates in the second direction around the second rotation axis x2, so that the outgoing laser scans the detection area of the array detector 222 downward in the vertical direction. The outgoing laser only needs to scan until its spot is in the vertical direction. The position of the third row of pixels in the vertical direction is the second vertical scan; after the second vertical scan is completed, the mirror rotates in the first direction around the first axis of rotation x1...and scans back and forth in this way until the traversal is completed The detection area of the entire array detector 222. Of course, the outgoing laser can also scan to the left in the horizontal direction at the beginning.
可以理解的是,如图4b所示,扫描时也可以先进行竖直方向的扫描,然后通过水平方向的扫描使光斑移动到第二个竖直扫描位置后,再进行第二次的竖直方向的扫描。It is understandable that, as shown in Figure 4b, when scanning, you can also scan in the vertical direction first, and then move the light spot to the second vertical scan position by scanning in the horizontal direction, and then perform a second vertical scan. The direction of the scan.
可以理解的是,在另一些实施例中,出射激光准直后的发散角可以略大于阵列探测器222的角度分辨率,也即回波激光在阵列探测器222上的成像略超出阵列探测器(222)的单个像元,但不超出与该单个像元相邻的像元。但是该方式将影响系统的光电效率,影响因子约为发散角/角度分辨率。It is understandable that in other embodiments, the divergence angle of the outgoing laser collimated may be slightly larger than the angular resolution of the array detector 222, that is, the imaging of the echo laser on the array detector 222 slightly exceeds that of the array detector 222. A single pixel of (222), but not beyond the pixel adjacent to the single pixel. However, this method will affect the photoelectric efficiency of the system, and the influencing factor is about divergence angle/angle resolution.
上述实施例中,准直后的出射激光通过二维MEMS微镜23a偏转到阵列探测器222探测区域内的某个像元的探测范围之内,信号光源整形光束的发散角(也即准直后的出射激光的发散角)小于单个像元的角度分辨率,实现较大的光能利用率。阵列探测器222同步开启其相应像元开始测距,即可得到相应位置的距离值。通过二维MEMS微镜23a的扫描,遍历整个阵列探测器222的所有像元的探测区域,得到每个位置的距离值,从而获得整个探测区域的3D点云数据。In the above embodiment, the collimated outgoing laser beam is deflected by the two-dimensional MEMS micromirror 23a to the detection range of a certain pixel in the detection area of the array detector 222, and the signal light source shapes the divergence angle of the beam (that is, collimation). The divergence angle of the subsequent emitted laser light is smaller than the angular resolution of a single pixel, and a larger light energy utilization rate is achieved. The array detector 222 synchronously turns on its corresponding pixel to start ranging, and then the distance value of the corresponding position can be obtained. Through the scanning of the two-dimensional MEMS micromirror 23a, the detection area of all the pixels of the entire array detector 222 is traversed to obtain the distance value of each position, thereby obtaining the 3D point cloud data of the entire detection area.
现在的阵列探测器222大约为10万像素量级,通过上述实施例,采用同样的接收光学单元221和阵列探测器222,在测试相同的距离时,所需的激光能量可以下降10 5数量级,降低了信号光源的成本,提高了可靠性。采用上述实施例,可以压缩阵列探测器222的像面尺寸,满足产品的微型化要求。 The current array detector 222 is on the order of 100,000 pixels. Through the above embodiment, using the same receiving optical unit 221 and array detector 222, the required laser energy can be reduced by 10 5 orders of magnitude when testing the same distance. The cost of the signal light source is reduced and the reliability is improved. By adopting the above-mentioned embodiment, the size of the image surface of the array detector 222 can be compressed to meet the miniaturization requirements of products.
如图5a所示,在另一实施例中,回波激光在阵列探测器222上的成像位于阵列探测器222的1/2个像元内,阵列探测器222的单个像元用于根据出射激光的扫描顺序在第一像元区和第二像元区(请参考图5b)分 别接收回波激光。扫描方式和上述图4a实施例的扫描方式类似,与之区别之处在于,如图5a所示,当回波激光在阵列探测器222上的成像位于阵列探测器222的竖直方向上的半个像元内且首先进行水平方向的扫描时,完成每一行像元的扫描,需要横向扫描一次,竖向扫描一次,再横向扫描一次。也即水平方向需要扫描两次才能完成每一行像元的扫描。再如图5c所示,当回波激光在阵列探测器222上的成像位于阵列探测器222的水平方向上的半个像元内且首先进行水平方向的扫描时,完成每一行像元的扫描,和上述图4a实施例类似仅需横向扫描一次。As shown in Fig. 5a, in another embodiment, the imaging of the echo laser on the array detector 222 is located within 1/2 of the pixel of the array detector 222, and a single pixel of the array detector 222 is used according to the output The laser scanning sequence receives the echo laser in the first pixel area and the second pixel area (please refer to Figure 5b). The scanning method is similar to the scanning method of the embodiment in FIG. 4a. The difference is that, as shown in FIG. When scanning in the horizontal direction within each pixel first, to complete the scanning of each row of pixels, it is necessary to scan once in the horizontal direction, once in the vertical direction, and once again in the horizontal direction. That is, it needs to scan twice in the horizontal direction to complete the scanning of each row of pixels. As shown in FIG. 5c, when the echo laser imaging on the array detector 222 is located in half of the pixel in the horizontal direction of the array detector 222 and the horizontal scanning is performed first, the scanning of each row of pixels is completed , Similar to the embodiment in FIG. 4a, only one horizontal scan is required.
上述实施例中,在单个像元区域内,激光发射单元211需要发射两次,相应的阵列探测器222的像元同步进行两次的协同工作,最终可以达到分辨率提高两倍的效果。以单个像元为例:在t 1时刻,回波激光的光斑成像在该像元的左半部分(或上半部分),此时二维MEMS微镜23a的角度为α 1;在t 2时刻,回波激光的光斑成像在该像元的右半部分(或下半部分),二维MEMS微镜23a的角度为α 2;则t1时刻和t2时刻探测的物体的方位角可分别由α 1、α 2确定。其中,二维MEMS微镜23a的角度可以直接从MEMS中读取,当回波激光的光斑成像在像元的左右两部分时,读取的二维MEMS微镜23a的角度为绕第一转轴x1的偏转角度,当回波激光的光斑成像在像元的上下两部分时,读取的二维MEMS微镜23a的角度为绕第二转轴x2的偏转角度。相比单个像元仅扫描一次的情况,本实施例可以探测出目标物体位于像元的第一像元区还是第二像元区,角分辨率提高了一倍。可以理解的是,回波激光在阵列探测器222上的成像的尺寸还可以进一步减小,相应的单个像元的探测次数进一步增加,从而进一步提高探测的角分辨率。 In the above-mentioned embodiment, in a single pixel area, the laser emitting unit 211 needs to emit twice, and the pixels of the corresponding array detector 222 perform coordinated work twice simultaneously, and finally the effect of increasing the resolution by two times can be achieved. Take a single pixel as an example: at t 1 , the spot of the echo laser is imaged on the left half (or upper half) of the pixel, at this time the angle of the two-dimensional MEMS micromirror 23a is α 1 ; at t 2 At time, the spot of the echo laser is imaged on the right half (or lower half) of the pixel, and the angle of the two-dimensional MEMS micromirror 23a is α 2 ; then the azimuth angles of the objects detected at t1 and t2 can be determined by α 1 and α 2 are determined. Among them, the angle of the two-dimensional MEMS micromirror 23a can be directly read from the MEMS. When the spot of the echo laser is imaged on the left and right parts of the pixel, the read angle of the two-dimensional MEMS micromirror 23a is around the first axis of rotation. The deflection angle of x1, when the spot of the echo laser is imaged on the upper and lower parts of the pixel, the read angle of the two-dimensional MEMS micromirror 23a is the deflection angle around the second rotation axis x2. Compared with the case where a single pixel is scanned only once, this embodiment can detect whether the target object is located in the first pixel area or the second pixel area of the pixel, and the angular resolution is doubled. It can be understood that the imaging size of the echo laser on the array detector 222 can be further reduced, and the corresponding detection times of a single pixel can be further increased, thereby further improving the angular resolution of the detection.
如图6a所示,在另一实施例中,回波激光在阵列探测器222上的成像位于阵列探测器222的1/4个像元内,阵列探测器222的单个像元用于根据出射激光的扫描顺序在第一像元区、第二像元区、第三像元区和第四像元区(请参考图6b)分别接收回波激光。扫描方式和上述图4a实施例扫描方式类似,与之区别之处在于,完成每一行像元的扫描,需要横向扫描一次,竖向扫描一次,再横向扫描一次。也即水平方向需要扫描两次才能完成每一行像元的扫描。在单个像元区域内,激光发射单元211需要发射四次,相应的阵列探测器222的像元同步进行四次的协同工作,可以探测出目标物体位于像元的第一像元区、第二像元区、第三像元区还是第四像元区,最终可以达到分辨率提高四倍的效果。As shown in Fig. 6a, in another embodiment, the imaging of the echo laser on the array detector 222 is located within 1/4 of the pixel of the array detector 222, and a single pixel of the array detector 222 is used according to the output The laser scanning sequence receives the echo laser in the first pixel area, the second pixel area, the third pixel area, and the fourth pixel area (please refer to Figure 6b). The scanning method is similar to the scanning method of the embodiment in FIG. 4a, and the difference is that to complete the scanning of each row of pixels, it is necessary to scan once in the horizontal direction, once in the vertical direction, and once again in the horizontal direction. That is, it needs to scan twice in the horizontal direction to complete the scanning of each row of pixels. In a single pixel area, the laser emitting unit 211 needs to be fired four times, and the pixels of the corresponding array detector 222 perform four times of coordinated work simultaneously, which can detect that the target object is located in the first pixel area and the second pixel area of the pixel. The pixel area, the third pixel area or the fourth pixel area can finally achieve the effect of increasing the resolution by four times.
在上述回波激光在阵列探测器222上的成像位于阵列探测器222的1/2个像元内或者位于阵列探测器222的1/4个像元内的实施例中,由于单个像元进行了两次或四次探测,因此,在采用同样的接收光学单元221和阵列探测器222的情况下,上述方式可以有效的提升阵列探测器222的角度分辨率,达到识别更小物体的目的,而不用增加其他的成本。例如,单个像元的对应的水平视场角在0~0.2°之间,竖直视场角也在0~0.2°之间;对单个像元进行水平方向的两次扫描后,加入了偏转机构的角度,即二维MEMS微镜23a的角度,从而可以得知探测物体位于0~0.1°的视场角还是0.1~0.2°的视场角内,因此分辨率提高了两倍;对单个像元进行水平方向和竖直方向共四次扫描后,加入了偏转机构的角度,即二维MEMS微镜23a的角度,从而可以得知探测物体位于水平视场角0~0.1°、竖直视场角0~0.1°,还是水平视场角0.1~0.2°、竖直视场角0~0.1°,还是水平视场角0~0.1°、竖直视场角0.1~0.2°,还是水平视场角0.1~0.2°、竖直视场角0.1~0.2°内,因此分辨率提高了四倍。在分辨率要求不变的情况下,选择使用分辨率更低的阵列器件,增加单像元的感光面积,能提高测距性能,降低成本。上述分辨率提升的倍数不限于四倍,还可以实现更高的分辨率,当满足出射激光的发散角小于相应倍率的阵列器件的原始分辨率时,回波激光在阵列探测器222上的成像越小,单像素可以提升的倍率越高。In the above-mentioned embodiment where the echo laser imaging on the array detector 222 is located in 1/2 pixel of the array detector 222 or located in 1/4 pixel of the array detector 222, since a single pixel performs Therefore, when the same receiving optical unit 221 and array detector 222 are used, the above method can effectively improve the angular resolution of the array detector 222 and achieve the purpose of identifying smaller objects. Without increasing other costs. For example, the corresponding horizontal angle of view of a single pixel is between 0 and 0.2°, and the vertical angle of view is also between 0 and 0.2°; after scanning a single pixel twice in the horizontal direction, the deflection is added. The angle of the mechanism, that is, the angle of the two-dimensional MEMS micromirror 23a, so that it can be known that the detection object is within the field of view angle of 0~0.1° or the field of view angle of 0.1~0.2°, so the resolution is increased by two times; After the pixel has been scanned four times in the horizontal and vertical directions, the angle of the deflection mechanism, that is, the angle of the two-dimensional MEMS micromirror 23a, is added, so that it can be known that the detection object is located at a horizontal field of view angle of 0~0.1° and a vertical field of view. The angle of view is 0~0.1°, or the horizontal angle of view is 0.1~0.2°, the vertical angle of view is 0~0.1°, the horizontal angle of view is 0~0.1°, the vertical angle of view is 0.1~0.2°, or horizontal The field of view is within 0.1-0.2°, and the vertical field of view is within 0.1-0.2°, so the resolution is increased by four times. Under the condition that the resolution requirement remains unchanged, choose to use a lower resolution array device to increase the photosensitive area of a single pixel, which can improve the ranging performance and reduce the cost. The above-mentioned resolution increase is not limited to four times, and higher resolution can also be achieved. When the divergence angle of the emitted laser is less than the original resolution of the array device with the corresponding magnification, the imaging of the echo laser on the array detector 222 The smaller the size, the higher the magnification that a single pixel can increase.
(二)采用二维MEMS微镜和小区域光斑扫描(2) Using two-dimensional MEMS micromirror and small area spot scanning
如图7a所示,本实施例中,偏转机构为二维MEMS微镜23a,二维MEMS微镜23a包括镜面、第一转轴x1和第二转轴x2。出射激光的光斑为小区域光斑,也即回波激光在阵列探测器222上的成像在水平方向和竖直方向的尺寸均小于阵列探测器222的整体像元在相应方向的尺寸,但均大于阵列探测器222的接收面的单个像元在相应方向的尺寸。镜面用于绕第一转轴x1转动,使出射激光沿水平方向扫描阵列探测器222的探测区域。镜面还用于绕第二转轴x2转动,使出射激光沿竖直方向扫描阵列探测器222的探测区域。镜面还用于接收回波激光并将回波激光反射后射向接收模组22。As shown in FIG. 7a, in this embodiment, the deflection mechanism is a two-dimensional MEMS micromirror 23a, and the two-dimensional MEMS micromirror 23a includes a mirror surface, a first rotation axis x1, and a second rotation axis x2. The spot of the outgoing laser is a small area spot, that is, the size of the echo laser imaging on the array detector 222 in the horizontal and vertical directions is smaller than the size of the overall pixel of the array detector 222 in the corresponding direction, but both are larger than The size of a single pixel on the receiving surface of the array detector 222 in the corresponding direction. The mirror is used to rotate around the first rotation axis x1, so that the emitted laser light scans the detection area of the array detector 222 in the horizontal direction. The mirror surface is also used to rotate around the second rotation axis x2, so that the emitted laser light scans the detection area of the array detector 222 in the vertical direction. The mirror is also used to receive the echo laser and reflect the echo laser to the receiving module 22.
具体扫描过程为:镜面绕第一转轴x1向第一方向转动,使出射激光沿水平方向向右扫描阵列探测器222的探测区域;当出射激光完成横向的第一次扫描后,镜面绕第二转轴x2向第二方向转动,使出射激光沿竖直方向向下移动到第二次横向扫描的位置,则完成竖向的第一次扫描;镜面绕第一转轴x1向第三方向转动,使出射激光沿水平方向向左扫描阵列探测器222的探测区域,第三方向为第一方向的相反方向;当出射激光完成横向的第二次扫描后,镜面绕第二转轴x2向第二方向转动,使出射激光沿竖直方向向下移动到第三次横向扫描的位置,则完成竖向的第二次扫描;镜面绕第一转轴x1向第一方向转动……如此往复扫描,直至遍历完 整个阵列探测器222的探测区域。The specific scanning process is as follows: the mirror rotates in the first direction around the first rotation axis x1, so that the outgoing laser scans the detection area of the array detector 222 to the right in the horizontal direction; when the outgoing laser completes the first horizontal scan, the mirror rotates around the second The shaft x2 rotates in the second direction to move the outgoing laser downward in the vertical direction to the position of the second horizontal scan, then the first vertical scan is completed; the mirror rotates in the third direction around the first shaft x1, so that The outgoing laser scans the detection area of the array detector 222 to the left in the horizontal direction, and the third direction is the opposite direction of the first direction; when the outgoing laser completes the second horizontal scan, the mirror rotates in the second direction around the second rotation axis x2 , The outgoing laser is moved down in the vertical direction to the position of the third horizontal scan, then the second vertical scan is completed; the mirror rotates in the first direction around the first rotation axis x1...and scans back and forth in this way until the traversal is completed The detection area of the entire array detector 222.
可以理解的是,如图7b所示,扫描时也可以先进行竖直方向的扫描,然后通过水平方向的扫描使光斑移动到第二个竖直扫描位置后,再进行第二次的竖直方向的扫描。It is understandable that, as shown in Figure 7b, when scanning, you can also scan in the vertical direction first, and then move the light spot to the second vertical scanning position by scanning in the horizontal direction, and then perform a second vertical scan. The direction of the scan.
(三)采用二维MEMS微镜和短线光斑扫描(3) Using two-dimensional MEMS micromirror and short-line spot scanning
如图8a所示,本实施例中,偏转机构为二维MEMS微镜23a,二维MEMS微镜23a包括镜面、第一转轴x1和第二转轴x2。出射激光的光斑为竖向的短线光斑,也即回波激光在阵列探测器222上的成像在水平方向的尺寸小于或等于阵列探测器222的接收面的单个像元在相应方向的尺寸(该图中为等于),在回波激光在阵列探测器222上的成像在竖直方向的尺寸大于阵列探测器222的接收面的单个像元在相应方向的尺寸,但是回波激光在阵列探测器222上的成像在竖直方向的尺寸小于阵列探测器222的整体像元在竖直方向的尺寸。镜面用于绕第一转轴x1转动,使出射激光沿水平方向扫描阵列探测器222的探测区域。镜面还用于绕第二转轴x2转动,使出射激光沿竖直方向扫描阵列探测器222的探测区域。镜面还用于接收回波激光并将回波激光反射后射向接收模组22。As shown in FIG. 8a, in this embodiment, the deflection mechanism is a two-dimensional MEMS micromirror 23a, and the two-dimensional MEMS micromirror 23a includes a mirror surface, a first rotation axis x1, and a second rotation axis x2. The spot of the outgoing laser is a short vertical spot, that is, the size of the echo laser on the array detector 222 in the horizontal direction is less than or equal to the size of a single pixel on the receiving surface of the array detector 222 in the corresponding direction (the In the figure, it is equal to), the size of the echo laser on the array detector 222 in the vertical direction is larger than the size of a single pixel on the receiving surface of the array detector 222 in the corresponding direction, but the echo laser on the array detector The size of the image on the 222 in the vertical direction is smaller than the size of the overall pixel of the array detector 222 in the vertical direction. The mirror is used to rotate around the first rotation axis x1, so that the emitted laser light scans the detection area of the array detector 222 in the horizontal direction. The mirror surface is also used to rotate around the second rotation axis x2, so that the emitted laser light scans the detection area of the array detector 222 in the vertical direction. The mirror is also used to receive the echo laser and reflect the echo laser to the receiving module 22.
具体扫描过程为:镜面绕第一转轴x1向第一方向转动,使出射激光沿水平方向向右扫描阵列探测器222的探测区域;当出射激光完成横向的第一次扫描后,镜面绕第二转轴x2向第二方向转动,使出射激光沿竖直方向向下移动到第二次横向扫描的位置,则完成竖向的第一次扫描;镜面绕第一转轴x1向第三方向转动,使出射激光沿水平方向向左扫描阵列探测器222的探测区域,第三方向为第一方向的相反方向;当出射激光完成横向的第二次扫描后,镜面绕第二转轴x2向第二方向转动,使出射激光沿竖直方向向下移动到第三次横向扫描的位置扫描阵列探测器222的探测区域,则完成竖向的第二次扫描;镜面绕第一转轴x1向第一方向转动……如此往复扫描,直至遍历完整个阵列探测器222的探测区域。The specific scanning process is as follows: the mirror rotates in the first direction around the first rotation axis x1, so that the outgoing laser scans the detection area of the array detector 222 to the right in the horizontal direction; when the outgoing laser completes the first horizontal scan, the mirror rotates around the second The shaft x2 rotates in the second direction to move the outgoing laser downward in the vertical direction to the position of the second horizontal scan, then the first vertical scan is completed; the mirror rotates in the third direction around the first shaft x1, so that The outgoing laser scans the detection area of the array detector 222 to the left in the horizontal direction, and the third direction is the opposite direction of the first direction; when the outgoing laser completes the second horizontal scan, the mirror rotates in the second direction around the second rotation axis x2 , The outgoing laser is moved down in the vertical direction to the position of the third horizontal scan. Scanning the detection area of the array detector 222, then the second vertical scan is completed; the mirror rotates in the first direction around the first rotation axis x1... ...Scan back and forth in this way until the detection area of the entire array detector 222 is traversed.
在另一实施例中,如图8b所示,光斑还可以是横向的短线光斑,也即回波激光在阵列探测器222上的成像在竖直方向的尺寸小于或等于阵列探测器222的接收面的单个像元在相应方向的尺寸,在回波激光在阵列探测器222上的成像在水平方向的尺寸大于阵列探测器222的接收面的单个像元在相应方向的尺寸,但是回波激光在阵列探测器222上的成像在水平方向的尺寸小于阵列探测器222的整体像元在水平方向的尺寸。横向线光斑在扫描时可以先进行第一个竖直方向的扫描,然后通过水平方向的扫描使光斑移动到第二个竖直扫描位置后,再进行第二次的竖直方向的扫描。In another embodiment, as shown in FIG. 8b, the light spot can also be a short-line light spot in the transverse direction, that is, the size of the echo laser imaging on the array detector 222 in the vertical direction is less than or equal to the receiving of the array detector 222. The size of the single pixel of the surface in the corresponding direction, the size of the echo laser on the array detector 222 in the horizontal direction is larger than the size of the single pixel on the receiving surface of the array detector 222 in the corresponding direction, but the echo laser The size of the image on the array detector 222 in the horizontal direction is smaller than the size of the entire pixel of the array detector 222 in the horizontal direction. The horizontal line spot can be scanned in the first vertical direction first, and then the spot is moved to the second vertical scanning position by horizontal scanning, and then the second vertical scanning is performed.
与上述实施例(二)的区别在于,本实施例中采用线光斑,单次探测的区域较实施例(二)窄,可以降低发射能量,从而降低激光发射单元211的功率。需要的总探测时间较实施例(二)长,若合理设置线光斑在水平方向或者竖直方向的长度,可以使总探测时间保持在可以接受的范围内。The difference from the above-mentioned embodiment (2) is that in this embodiment, a linear spot is adopted, and the area of a single detection is narrower than that in the embodiment (2), and the emission energy can be reduced, thereby reducing the power of the laser emitting unit 211. The total detection time required is longer than that of the second embodiment. If the length of the line spot in the horizontal or vertical direction is set reasonably, the total detection time can be kept within an acceptable range.
如图8c所示,在另一实施例中,与图8a中不同的是,回波激光在阵列探测器222上的成像在水平方向的尺寸小于阵列探测器222的接收面的单个像元在相应方向的尺寸,例如回波激光在阵列探测器222上的成像在水平方向的尺寸仅为阵列探测器222的接收面的单个像元在相应方向的尺寸的1/4。根据对图6的描述可知,由于单个像元进行了四次探测,因此,在采用同样的接收光学单元221和阵列探测器222的情况下,与图8a的实施例相比,该方式可以有效的提升阵列探测器222的角度分辨率,最终可以达到分辨率提高四倍的效果,达到识别更小物体的目的,而不用增加其他的成本。As shown in Fig. 8c, in another embodiment, unlike Fig. 8a, the size of the echo laser on the array detector 222 in the horizontal direction is smaller than that of a single pixel on the receiving surface of the array detector 222. The size of the corresponding direction, for example, the size of the echo laser imaging on the array detector 222 in the horizontal direction is only 1/4 of the size of a single pixel on the receiving surface of the array detector 222 in the corresponding direction. According to the description of FIG. 6, it can be seen that since a single pixel has been detected four times, when the same receiving optical unit 221 and array detector 222 are used, compared with the embodiment of FIG. 8a, this method can be effective. By increasing the angular resolution of the array detector 222, the effect of increasing the resolution by four times can finally be achieved, achieving the purpose of identifying smaller objects without increasing other costs.
(四)采用一维MEMS微镜和长线光斑扫描(4) Using one-dimensional MEMS micro-mirror and long-line spot scanning
如图9a所示,偏转机构为一维MEMS微镜23b,一维MEMS微镜23b包括镜面和转轴x。出射激光的光斑为竖向的长线光斑,也即回波激光在阵列探测器222上的成像在水平方向的尺寸小于或等于阵列探测器222的接收面的单个像元在相应方向的尺寸,回波激光在阵列探测器222上的成像在竖直方向的尺寸大于或等于阵列探测器222的整体像元在竖直方向的尺寸。镜面用于绕转轴x转动,使出射激光沿水平方向扫描阵列探测器222的探测区域。镜面还用于接收回波激光并将回波激光反射后射向接收模组22。As shown in FIG. 9a, the deflection mechanism is a one-dimensional MEMS micromirror 23b, and the one-dimensional MEMS micromirror 23b includes a mirror surface and a rotation axis x. The spot of the outgoing laser is a vertical long-line spot, that is, the size of the echo laser on the array detector 222 in the horizontal direction is less than or equal to the size of a single pixel on the receiving surface of the array detector 222 in the corresponding direction. The vertical size of the imaging of the wave laser on the array detector 222 is greater than or equal to the size of the overall pixel of the array detector 222 in the vertical direction. The mirror is used to rotate around the rotation axis x, so that the emitted laser light scans the detection area of the array detector 222 in the horizontal direction. The mirror is also used to receive the echo laser and reflect the echo laser to the receiving module 22.
具体扫描过程为:镜面绕转轴x向第一方向转动,使出射激光沿水平方向向右扫描阵列探测器222的探测区域,直至遍历完整个阵列探测器222的探测区域。由于出射激光的光斑为长线光斑,回波激光在阵列探测器222上的成像在竖直方向的尺寸覆盖整个阵列探测器222的接收面,因此水平方向的一次扫描即可完成整个阵列探测器222探测区域的遍历。The specific scanning process is: the mirror rotates in the first direction around the rotation axis x, so that the emitted laser scans the detection area of the array detector 222 to the right in the horizontal direction until it traverses the entire detection area of the array detector 222. Since the spot of the outgoing laser is a long-line spot, the size of the echo laser on the array detector 222 in the vertical direction covers the entire receiving surface of the array detector 222, so one scan in the horizontal direction can complete the entire array detector 222 Traversal of the detection area.
在另一实施例中,如图9b所示,光斑还可以是横向的长线光斑,也即回波激光在阵列探测器222上的成像在竖直方向的尺寸小于或等于阵列探测器222的接收面的单个像元在相应方向的尺寸,回波激光在阵列探测器222上的成像在水平方向的尺寸大于或等于阵列探测器222的整体像元在水平方向的尺寸。横向线光斑在扫描时是进行竖直方向的扫描。In another embodiment, as shown in FIG. 9b, the light spot can also be a horizontal long-line light spot, that is, the size of the echo laser imaging on the array detector 222 in the vertical direction is less than or equal to that of the array detector 222. The size of a single pixel of the surface in the corresponding direction, and the size of the echo laser imaged on the array detector 222 in the horizontal direction is greater than or equal to the size of the entire pixel of the array detector 222 in the horizontal direction. The horizontal line spot scans in the vertical direction when scanning.
如图9c所示,在另一实施例中,与图9a中不同的是,回波激光在阵列探测器222上的成像在水平方向 的尺寸小于阵列探测器222的接收面的单个像元在相应方向的尺寸,例如回波激光在阵列探测器222上的成像在水平方向的尺寸仅为阵列探测器222的接收面的单个像元在相应方向的尺寸的1/4。根据对图6a的描述可知,由于单个像元进行了四次探测,因此,在采用同样的接收光学单元221和阵列探测器222的情况下,与图9a的实施例相比,该方式可以有效的提升阵列探测器222的角度分辨率,最终可以达到分辨率提高四倍的效果,达到识别更小物体的目的,而不用增加其他的成本。As shown in Fig. 9c, in another embodiment, the difference from Fig. 9a is that the size of the echo laser imaging on the array detector 222 in the horizontal direction is smaller than that of a single pixel on the receiving surface of the array detector 222. The size of the corresponding direction, for example, the size of the echo laser imaging on the array detector 222 in the horizontal direction is only 1/4 of the size of a single pixel on the receiving surface of the array detector 222 in the corresponding direction. According to the description of FIG. 6a, since a single pixel has been detected four times, when the same receiving optical unit 221 and array detector 222 are used, compared with the embodiment of FIG. 9a, this method can be effective By increasing the angular resolution of the array detector 222, the effect of increasing the resolution by four times can finally be achieved, achieving the purpose of identifying smaller objects without increasing other costs.
(五)采用一维MEMS微镜和大区域光斑扫描(5) Using one-dimensional MEMS micromirror and large-area spot scanning
如图10a所示,偏转机构为一维MEMS微镜23b,一维MEMS微镜23b包括镜面和转轴x。出射激光的光斑为竖向的大区域光斑,也即回波激光在阵列探测器222上的成像在水平方向的尺寸小于阵列探测器222的整体像元在水平方向的尺寸,但是大于阵列探测器222的接收面的单个像元在相应方向的尺寸,回波激光在阵列探测器222上的成像在竖直方向的尺寸大于或等于阵列探测器222的整体像元在竖直方向的尺寸。镜面用于绕转轴x转动,使出射激光沿水平方向扫描阵列探测器222的探测区域。镜面还用于接收回波激光并将回波激光反射后射向接收模组22。As shown in FIG. 10a, the deflection mechanism is a one-dimensional MEMS micromirror 23b, and the one-dimensional MEMS micromirror 23b includes a mirror surface and a rotation axis x. The spot of the outgoing laser is a large vertical spot, that is, the size of the echo laser imaging on the array detector 222 in the horizontal direction is smaller than the size of the overall pixel of the array detector 222 in the horizontal direction, but larger than that of the array detector. The size of a single pixel on the receiving surface of 222 in the corresponding direction, and the size of the echo laser imaging on the array detector 222 in the vertical direction is greater than or equal to the size of the overall pixel of the array detector 222 in the vertical direction. The mirror is used to rotate around the rotation axis x, so that the emitted laser light scans the detection area of the array detector 222 in the horizontal direction. The mirror is also used to receive the echo laser and reflect the echo laser to the receiving module 22.
具体扫描过程为:镜面绕转轴x向第一方向转动,使出射激光沿水平方向向右扫描阵列探测器222的探测区域,直至遍历完整个阵列探测器222的探测区域。由于出射激光的光斑为大区域光斑,回波激光在阵列探测器222上的成像在竖直方向的尺寸覆盖整个阵列探测器222的接收面,因此水平方向的一次扫描即可完成整个阵列探测器222探测区域的遍历。The specific scanning process is: the mirror rotates in the first direction around the rotation axis x, so that the emitted laser scans the detection area of the array detector 222 to the right in the horizontal direction until it traverses the entire detection area of the array detector 222. Since the spot of the outgoing laser is a large area spot, the size of the echo laser on the array detector 222 in the vertical direction covers the entire receiving surface of the array detector 222, so one scan in the horizontal direction can complete the entire array detector 222 traversal of the detection area.
与上述实施例(四)的区别在于,本实施例中采用大区域光斑,单次探测的区域较实施例(四)宽,发射能量较大,提高了激光发射单元211的功率。The difference from the above-mentioned embodiment (4) is that in this embodiment, a large-area spot is used, and the single detection area is wider than that in the embodiment (4), and the emission energy is larger, which increases the power of the laser emitting unit 211.
在另一实施例中,如图10b所示,光斑还可以是横向的大区域光斑,也即也即回波激光在阵列探测器222上的成像在竖直方向的尺寸小于阵列探测器222的整体像元在竖直方向的尺寸,但是大于阵列探测器222的接收面的单个像元在相应方向的尺寸,回波激光在阵列探测器222上的成像在水平方向的尺寸大于或等于阵列探测器222的整体像元在水平方向的尺寸。横向线光斑在扫描时是进行竖直方向的扫描。In another embodiment, as shown in FIG. 10b, the light spot can also be a lateral large-area light spot, that is, the imaging of the echo laser on the array detector 222 in the vertical direction is smaller than that of the array detector 222. The size of the overall pixel in the vertical direction, but larger than the size of a single pixel on the receiving surface of the array detector 222 in the corresponding direction, the size of the echo laser imaging on the array detector 222 in the horizontal direction is greater than or equal to that of the array detector The size of the overall pixel of the detector 222 in the horizontal direction. The horizontal line spot scans in the vertical direction when scanning.
(六)采用一维MEMS微镜、线光斑、多个发射拼合扫描(6) Using one-dimensional MEMS micro-mirror, line spot, and multiple emission stitching scanning
如图11a所示,偏转机构为一维MEMS微镜23b,一维MEMS微镜23b包括镜面和转轴x。发射模组包括三个发射组件210,每个发射组件210包括一个激光发射单元211和一个发射光学单元212,激光发射单元211用于发射第一出射激光,发射光学单元212用于准直第一出射激光,并将准直后的第一出射激光入射到一维MEMS微镜23b。出射激光由所有的第一出射激光组成,第一出射激光沿竖直方向排布。准直后的第一出射激光的光斑尺寸小于阵列探测器222的接收面,所有第一出射激光的光斑拼合后为长线光斑,也即第一回波激光在阵列探测器222上的成像在水平方向和竖直方向的尺寸均小于阵列探测器222的整体像元在相应方向的尺寸;回波激光在阵列探测器222上的成像在竖直方向的尺寸等于或大于阵列探测器222的整体像元在竖直方向的尺寸。镜面用于绕转轴转动,使出射激光沿为水平方向扫描阵列探测器222的探测区域。镜面还用于接收第一回波激光并将第一回波激光反射后射向接收模组22,其中第一回波激光为第一出射激光被探测区域内的物体反射后返回的激光,回波激光由所有的第一回波激光组成。As shown in FIG. 11a, the deflection mechanism is a one-dimensional MEMS micromirror 23b, and the one-dimensional MEMS micromirror 23b includes a mirror surface and a rotation axis x. The emitting module includes three emitting components 210. Each emitting component 210 includes a laser emitting unit 211 and a emitting optical unit 212. The laser emitting unit 211 is used to emit the first outgoing laser, and the emitting optical unit 212 is used to collimate the first The laser light is emitted, and the collimated first emitted laser light is incident on the one-dimensional MEMS micromirror 23b. The outgoing laser is composed of all the first outgoing lasers, and the first outgoing lasers are arranged in the vertical direction. The spot size of the first outgoing laser after collimation is smaller than the receiving surface of the array detector 222, and all the spots of the first outgoing laser are combined into a long-line spot, that is, the imaging of the first echo laser on the array detector 222 is horizontal The size in the direction and the vertical direction are both smaller than the size of the overall pixel of the array detector 222 in the corresponding direction; the size of the echo laser imaging on the array detector 222 in the vertical direction is equal to or larger than the overall image of the array detector 222 The size of the element in the vertical direction. The mirror surface is used to rotate around the rotation axis, so that the emitted laser light scans the detection area of the array detector 222 in a horizontal direction. The mirror is also used to receive the first echo laser light and reflect the first echo laser light to the receiving module 22, where the first echo laser light is the laser light that returns after the first outgoing laser light is reflected by the object in the detection area. The wave laser is composed of all the first echo lasers.
具体扫描过程为:镜面绕转轴x向第一方向转动,使出射激光沿水平方向向右扫描阵列探测器222的探测区域,直至遍历完整个阵列探测器222的探测区域。由于出射激光的光斑为长线光斑,回波激光在阵列探测器222上的成像在竖直方向尺寸覆盖整个阵列探测器222的接收面,因此水平方向的一次扫描即可完成整个阵列探测器222探测区域的遍历。The specific scanning process is: the mirror rotates in the first direction around the rotation axis x, so that the emitted laser scans the detection area of the array detector 222 to the right in the horizontal direction until it traverses the entire detection area of the array detector 222. Since the spot of the outgoing laser is a long-line spot, the imaging of the echo laser on the array detector 222 in the vertical direction covers the entire receiving surface of the array detector 222, so one scan in the horizontal direction can complete the detection of the entire array detector 222 The traversal of the area.
为了降低三个发射组件210同时发射出射激光时互相之间的串扰,可以采用三个发射组件210轮询发射的方式。例如,首先第一个发射组件210发射,然后第二个发射组件210发射,最后第三个发射组件210发射,再次轮到第一个发射组件210发射……如此依次进行,直至遍历完整个阵列探测器222的探测区域。In order to reduce the crosstalk between the three emitting components 210 when emitting laser light at the same time, a polling and emitting manner of the three emitting components 210 can be adopted. For example, first the first launching component 210 launches, then the second launching component 210 launches, and finally the third launching component 210 launches, and again it is the first launching component 210 to launch...and so on in sequence until the entire array is traversed The detection area of the detector 222.
在另一实施例中,如图11b所示,拼合后的光斑还可以是横向的长线光斑,也即拼合后的回波激光在阵列探测器222上的成像在竖直方向的尺寸小于或等于阵列探测器222的接收面的单个像元在相应方向的尺寸,拼合后的回波激光在阵列探测器222上的成像在水平方向的尺寸大于或等于阵列探测器222的整体像元在水平方向的尺寸。横向线光斑在扫描时是进行竖直方向的扫描。In another embodiment, as shown in FIG. 11b, the combined light spot may also be a horizontal long-line light spot, that is, the image of the combined echo laser on the array detector 222 in the vertical direction is less than or equal to The size of a single pixel on the receiving surface of the array detector 222 in the corresponding direction, and the size of the combined echo laser imaging on the array detector 222 in the horizontal direction is greater than or equal to the overall pixel size of the array detector 222 in the horizontal direction size of. The horizontal line spot scans in the vertical direction when scanning.
在其他实施例中,发射模组还可以包括两个、四个、五个、六个等多个发射组件210,回波激光在阵列探测器222上的成像在竖直方向或水平方向的尺寸等于或大于阵列探测器222的整体像元在相应方向的尺寸。In other embodiments, the transmitting module may also include two, four, five, six, etc. multiple transmitting components 210, the size of the echo laser on the array detector 222 in the vertical or horizontal direction It is equal to or larger than the size of the overall pixel of the array detector 222 in the corresponding direction.
在其他实施例中,所有第一出射激光的光斑拼合后还可以为大区域光斑,也即回波激光在阵列探测器222上的成像在水平方向的尺寸大于阵列探测器222的接收面的单个像元在相应方向的尺寸,但是小于阵列探测器222的整体像元在水平方向的尺寸,回波激光在阵列探测器222上的成像在竖直方向的尺寸之和大于或等 于阵列探测器222的整体像元在竖直方向的尺寸。In other embodiments, the light spots of all the first outgoing lasers can be combined into a large area light spot, that is, the size of the echo laser on the array detector 222 in the horizontal direction is larger than that of a single receiving surface of the array detector 222. The size of the pixel in the corresponding direction, but is smaller than the size of the overall pixel of the array detector 222 in the horizontal direction, and the sum of the dimensions of the echo laser imaging on the array detector 222 in the vertical direction is greater than or equal to the array detector 222 The size of the overall pixel in the vertical direction.
以上实施例通过发射光学单元212对出射激光整形,形成点光斑、线光斑或块光斑。当需要使出射激光的光斑为线光斑时,还可以通过以下方式:In the above embodiment, the emitted laser is shaped by the emitting optical unit 212 to form a spot spot, a line spot or a block spot. When it is necessary to make the spot of the emitted laser light as a line spot, the following methods can also be used:
在图9a的基础上,请参考图12a,在一些实施例中,发射模组21包括激光发射单元211、发射光学单元212和光学偏转模块214,光学偏转模块214包括多个沿第一方向排列的偏转单元。激光发射单元211用于沿第一方向发射出射激光至发射光学单元212,发射光学单元212对出射激光进行准直后入射至光学偏转模块214,光学偏转模块214中的每个偏转单元用于使预设比例的出射激光偏转后出射。激光雷达100还包括偏转机构23,偏转机构23用于接收出射激光并将出射激光反射后射向阵列探测器222的探测区域内,使出射激光扫描遍历整个探测区域。偏转机构23可以采用MEMS微镜、反射镜或透射棱镜等可以实现光扫描的器件。本实施例中入射至探测区域的线光斑覆盖了第二方向的整个探测区域,因此偏转机构23可采用一维MEMS微镜23b,通过一维MEMS微镜23b完成一个方向上的扫描。若线光斑仅覆盖第二方向的部分探测区域,需采用二维MEMS微镜完成两个方向上的扫描。On the basis of FIG. 9a, please refer to FIG. 12a. In some embodiments, the emission module 21 includes a laser emission unit 211, an emission optical unit 212, and an optical deflection module 214. The optical deflection module 214 includes a plurality of devices arranged along a first direction. The deflection unit. The laser emitting unit 211 is used to emit the emitted laser light to the emitting optical unit 212 along the first direction. The emitting optical unit 212 collimates the emitted laser light and then enters the optical deflection module 214. Each deflection unit in the optical deflection module 214 is used to make The preset ratio of the emitted laser light is deflected and then emitted. The laser radar 100 further includes a deflection mechanism 23, which is used to receive the emitted laser light and reflect the emitted laser light to the detection area of the array detector 222, so that the emitted laser light scans the entire detection area. The deflection mechanism 23 can be a device capable of realizing light scanning, such as a MEMS micromirror, a reflecting mirror or a transmissive prism. In this embodiment, the linear light spot incident on the detection area covers the entire detection area in the second direction. Therefore, the deflection mechanism 23 can adopt a one-dimensional MEMS micromirror 23b, and scan in one direction through the one-dimensional MEMS micromirror 23b. If the line spot covers only part of the detection area in the second direction, a two-dimensional MEMS micromirror needs to be used to complete scanning in both directions.
偏转单元采用平面镜,每个平面镜用于使预设比例的出射激光偏转后出射。由每个平面镜反射的出射激光的预设比例可以相同也可以不同。The deflection unit adopts plane mirrors, and each plane mirror is used to deflect a preset proportion of the outgoing laser light and emit it. The preset ratio of the emitted laser light reflected by each plane mirror can be the same or different.
具体的,每个平面镜具有相同或不同的透射/反射比,从而使出射激光按照预设的固定比例从每个平面镜反射出去。制备好的平面镜具有固定不变的透射/反射比。在一些实施例中,根据实际应用需求预先计算好每个平面镜的透射/反射比,按照确定的透射/反射比选择或制备相应的平面镜,从而使每个平面镜反射的出射激光的能量相同或大致相同。例如,总共有5个平面镜;第一个平面镜的透射率为80%,反射率为20%,则通过第一个平面镜反射的出射激光的能量为出射激光总能量的20%;第二个平面镜的透射率为75%,反射率为25%,则通过第二个平面镜反射的出射激光的能量为出射激光总能量的80%*25%=20%;第三个平面镜的透射率为67%,反射率为33%,则通过第三个平面镜反射的出射激光的能量为出射激光总能量的80%*75%*33%=19.8%,约为20%;第四个平面镜的透射率为50%,反射率为50%,则通过第四个平面镜反射的出射激光的能量为出射激光总能量的80%*75%*67%*50%=20.1%,约为20%;第五个平面镜的透射率接近0%,反射率接近100%,则通过第五个平面镜反射的出射激光的能量为出射激光总能量的80%*75%*67%*50%*100%=20.1%,约为20%。通过选择上述平面镜,使每个平面镜反射的出射激光能量均约为出射激光总能量的20%。Specifically, each flat mirror has the same or different transmission/reflection ratio, so that the emitted laser light is reflected from each flat mirror according to a preset fixed ratio. The prepared plane mirror has a fixed transmission/reflection ratio. In some embodiments, the transmission/reflection ratio of each flat mirror is pre-calculated according to actual application requirements, and the corresponding flat mirror is selected or prepared according to the determined transmission/reflection ratio, so that the energy of the outgoing laser reflected by each flat mirror is the same or approximately same. For example, there are 5 plane mirrors in total; the transmittance of the first plane mirror is 80% and the reflectivity is 20%, the energy of the emitted laser light reflected by the first plane mirror is 20% of the total energy of the emitted laser; the second plane mirror The transmittance is 75% and the reflectivity is 25%. The energy of the emitted laser reflected by the second plane mirror is 80%*25%=20% of the total energy of the emitted laser; the transmittance of the third plane mirror is 67% , The reflectivity is 33%, the energy of the emitted laser reflected by the third plane mirror is 80%*75%*33%=19.8% of the total energy of the emitted laser, about 20%; the transmittance of the fourth plane mirror 50%, the reflectivity is 50%, the energy of the emitted laser reflected by the fourth plane mirror is 80%*75%*67%*50%=20.1%, which is about 20%; the fifth The transmittance of the plane mirror is close to 0% and the reflectivity is close to 100%. The energy of the emitted laser reflected by the fifth plane mirror is 80%*75%*67%*50%*100%=20.1% of the total energy of the emitted laser. About 20%. By selecting the above flat mirrors, the emitted laser energy reflected by each flat mirror is about 20% of the total emitted laser energy.
在其他实施例中,为了满足对感兴趣的高分辨率探测需求,将出射激光偏转后入射至探测区域中的感兴趣区域的平面镜反射的出射激光的能量还可以大于其他平面镜反射的出射激光的能量。例如,总共有5个平面镜,中心区域为感兴趣区域,探测中心区域的3个平面镜反射的出射激光能量需要大于其余两个平面镜反射的出射激光的能量;第一个平面镜的透射率为90%,反射率为10%,则通过第一个平面镜反射的出射激光的能量为出射激光总能量的10%;第二个平面镜的透射率为71%,反射率为29%,则通过第二个平面镜反射的出射激光的能量为出射激光总能量的90%*29%=26.1%;第三个平面镜的透射率为58%,反射率为42%,则通过第三个平面镜反射的出射激光的能量为出射激光总能量的90%*71%*42%=26.8%;第四个平面镜的透射率为28%,反射率为72%,则通过第四个平面镜反射的出射激光的能量为出射激光总能量的90%*71%*58%*72%=26.7%;第五个平面镜的透射率为0%,反射率接近100%,则通过第五个平面镜反射的出射激光的能量为出射激光总能量的90%*71%*58%*28%*100%=10.4%。通过选择上述平面镜,使探测中心区域的3个平面镜反射的出射激光能量需要大于其余两个平面镜反射的出射激光的能量。平面镜的透过率/反射比可以根据实际情况更改,确定好每个平面镜的透射/反射比后,再选择或制备相应的平面镜,以满足实际的探测需求。In other embodiments, in order to meet the demand for high-resolution detection of interest, the energy of the emitted laser reflected by the plane mirror that is incident on the region of interest in the detection area after being deflected may also be greater than that of the emitted laser reflected by other plane mirrors. energy. For example, there are 5 plane mirrors in total, and the central area is the region of interest. The energy of the outgoing laser reflected by the 3 plane mirrors in the detection center needs to be greater than the energy of the outgoing laser reflected by the other two plane mirrors; the transmittance of the first plane mirror is 90% , The reflectivity is 10%, the energy of the outgoing laser reflected by the first plane mirror is 10% of the total energy of the outgoing laser; the transmittance of the second plane mirror is 71%, and the reflectivity is 29%, then it will pass through the second plane mirror. The energy of the outgoing laser reflected by the plane mirror is 90%*29%=26.1% of the total energy of the outgoing laser; the transmittance of the third plane mirror is 58%, and the reflectivity is 42%. The energy is 90%*71%*42%=26.8% of the total energy of the emitted laser; the transmittance of the fourth plane mirror is 28%, the reflectivity is 72%, and the energy of the emitted laser reflected by the fourth plane mirror is the emission 90%*71%*58%*72%=26.7% of the total laser energy; the transmittance of the fifth plane mirror is 0%, and the reflectivity is close to 100%, then the energy of the emitted laser reflected by the fifth plane mirror is the emission 90%*71%*58%*28%*100% of the total laser energy = 10.4%. By selecting the above-mentioned plane mirrors, the energy of the emitted laser light reflected by the three plane mirrors in the detection center area needs to be greater than the energy of the emitted laser light reflected by the remaining two plane mirrors. The transmittance/reflectance of the plane mirror can be changed according to the actual situation. After determining the transmittance/reflectance of each plane mirror, select or prepare the corresponding plane mirror to meet the actual detection requirements.
关于平面镜的角度,可以是所有的平面镜均呈45度,使出射激光均匀条形分布。但此种情况下降需要设置面积较大的偏转机构23,才能接收所有平面镜反射的出射激光。因此,平面镜的放置角度可以进行更改,以改变偏转方向,使经过平面镜的出射激光可以会聚到一起,从而减小偏转机构23的尺寸。例如,如图12b所示,多个平面镜与激光发射单元211发射的出射激光的夹角沿第一方向依次减小,使经过每个平面镜的出射激光朝中心方向会聚。Regarding the angle of the flat mirrors, all the flat mirrors may be 45 degrees, so that the emitted laser light is uniformly distributed in a stripe shape. However, in this case, a larger area of the deflection mechanism 23 is required to receive the emitted laser light reflected by all the plane mirrors. Therefore, the placement angle of the plane mirror can be changed to change the deflection direction, so that the outgoing laser light passing through the plane mirror can converge, thereby reducing the size of the deflection mechanism 23. For example, as shown in FIG. 12b, the angles between the plurality of plane mirrors and the outgoing laser light emitted by the laser emitting unit 211 are sequentially reduced along the first direction, so that the outgoing laser light passing through each plane mirror is converged toward the center direction.
如图13a所示,偏转机构23刚好位于出射激光会聚的焦点位置。当偏转机构23位于该位置时,可以使偏转机构23的尺寸做到最小化。当然,偏转机构23还可以位于非焦点位置,例如图13b所示的位置,此时偏转机构23的尺寸比图13a中的尺寸大。As shown in Fig. 13a, the deflection mechanism 23 is just at the focal position where the outgoing laser light converges. When the deflection mechanism 23 is at this position, the size of the deflection mechanism 23 can be minimized. Of course, the deflection mechanism 23 may also be located at a non-focus position, such as the position shown in FIG. 13b. At this time, the size of the deflection mechanism 23 is larger than that in FIG. 13a.
如图14所示,在另一实施例中,除了采用发射光学单元212对激光发射单元211发射的出射激光进行准直以外,还采用透镜213会聚每个平面镜偏转后的出射激光并使其入射至偏转机构23。经过发射光学单元212 准直后的出射激光光束之间具有光路间隙,将导致经过偏转机构23反射后的光斑并非为连续的线光斑,探测存在盲区。通过在平面镜反射的出射激光光路上设置透镜213对光束进行会聚,使入射至偏转机构23的光斑为连续无间隙的线光斑,因此经过偏转机构23反射后的光斑也为连续无间隙的线光斑,避免探测盲区。As shown in FIG. 14, in another embodiment, in addition to collimating the outgoing laser light emitted by the laser emitting unit 211 by the emitting optical unit 212, a lens 213 is also used to condense the outgoing laser light deflected by each flat mirror and make it incident. To the deflection mechanism 23. There is an optical path gap between the outgoing laser beams collimated by the emission optical unit 212, which will cause the light spot reflected by the deflection mechanism 23 to not be a continuous line light spot, and there is a blind spot in the detection. A lens 213 is arranged on the light path of the outgoing laser reflected by the plane mirror to converge the light beam, so that the light spot incident on the deflection mechanism 23 is a continuous linear light spot without gaps, so the light spot reflected by the deflection mechanism 23 is also a continuous linear light spot without gaps. , Avoid detecting blind spots.
下面,对上述实施例中出射激光的光斑为线光斑时,对该线光斑进行整形的情况进行说明:Hereinafter, when the spot of the outgoing laser in the above embodiment is a line spot, the situation of shaping the line spot will be described:
经激光发射单元211准直后的出射激光光束之间具有光路间隙,将导致经过偏转机构23反射后的光斑并非为连续的线光斑,探测存在盲区。因此,如图15a所示,在一些实施例中,该激光雷达100还可以在发射光学单元212和偏转机构23之间设置光学整形模块215。激光发射单元211采用激光器2112,激光发射单元211用于发射出射激光至发射光学单元212,经发射光学单元212准直为线光斑后入射至光学整形模块215,光学整形模块215用于会聚出射激光并使其入射至偏转机构23。偏转机构23用于接收出射激光并将出射激光反射后射向阵列探测器222的探测区域内,偏转机构23还用于使呈线光斑的出射激光扫描遍历整个探测区域。光学整形模块215可以采用柱面镜或微柱面镜阵列。偏转机构23可以采用MEMS微镜、反射镜或透射棱镜等可以实现光扫描的器件。本实施例中线光斑覆盖了竖直方向的整个探测区域,因此偏转机构23可采用一维MEMS微镜23b,通过一维MEMS微镜23b完成一个方向的扫描。若线光斑仅覆盖竖直方向的部分探测区域,需采用二维MEMS微镜。为了缩小产品尺寸,还可以在光路中设置反射模块,例如本实施例在发射光学单元212和光学整形模块215之间设置了反射镜216。There is an optical path gap between the outgoing laser beams collimated by the laser emitting unit 211, which will cause the spot reflected by the deflection mechanism 23 to not be a continuous line spot, and there is a blind spot in the detection. Therefore, as shown in FIG. 15a, in some embodiments, the laser radar 100 may also be provided with an optical shaping module 215 between the transmitting optical unit 212 and the deflection mechanism 23. The laser emitting unit 211 uses a laser 2112. The laser emitting unit 211 is used to emit the emitted laser light to the emitting optical unit 212, which is collimated into a line spot by the emitting optical unit 212 and then incident to the optical shaping module 215. The optical shaping module 215 is used to converge and emit the laser light. And make it incident on the deflection mechanism 23. The deflection mechanism 23 is used to receive the outgoing laser light and reflect the outgoing laser light to be directed into the detection area of the array detector 222. The deflection mechanism 23 is also used to scan the outgoing laser light in a linear spot to traverse the entire detection area. The optical shaping module 215 may adopt a cylindrical lens or a micro-cylindrical lens array. The deflection mechanism 23 can be a device capable of realizing light scanning, such as a MEMS micromirror, a reflecting mirror or a transmissive prism. In this embodiment, the line spot covers the entire detection area in the vertical direction. Therefore, the deflection mechanism 23 can adopt a one-dimensional MEMS micromirror 23b, and scan in one direction through the one-dimensional MEMS micromirror 23b. If the linear spot only covers part of the detection area in the vertical direction, a two-dimensional MEMS micromirror is required. In order to reduce the size of the product, a reflective module can also be provided in the optical path. For example, in this embodiment, a reflective mirror 216 is provided between the transmitting optical unit 212 and the optical shaping module 215.
本实施例通过在发射光学单元212和偏转机构23之间设置光学整形模块215,光学整形模块215会聚出射激光后入射至偏转机构23,使经过偏转机构23反射的出射激光的光斑为连续的无间隙的线光斑,避免探测盲区。In this embodiment, an optical shaping module 215 is arranged between the emitting optical unit 212 and the deflection mechanism 23. The optical shaping module 215 condenses the emitted laser light and then enters the deflection mechanism 23, so that the spot of the emitted laser light reflected by the deflection mechanism 23 is continuous and non-continuous. Line spots in the gap avoid detection blind spots.
光学整形模块215的位置还可以进行调整。如图15b所示,在另一实施例中,光学整形模块215设置于偏转机构23反射的出射激光光路上。激光发射单元211用于发射出射激光至发射光学单元212,经发射光学单元212准直为线光斑后入射至偏转机构23;偏转机构23用于接收出射激光并将其反射至光学整形模块215;光学整形模块215用于将出射激光整形为连续的无间隙的线光斑后射向阵列探测器222的探测区域内;偏转机构23还用于使线光斑扫描遍历整个探测区域。光学整形模块215为柱面镜或微柱面镜阵列,例如光学整形模块215在偏转机构23的旋转平面内的横截面呈弧形且绕偏转机构23对称,如图15c所示。偏转机构23可以采用MEMS微镜、反射镜或透射棱镜等可以实现光扫描的器件。本实施例中线光斑覆盖了竖直方向的整个探测区域,因此偏转机构23可采用一维MEMS微镜23b,通过一维MEMS微镜23b完成一个方向的扫描。若线光斑仅覆盖竖直方向的部分探测区域,需采用二维MEMS微镜。The position of the optical shaping module 215 can also be adjusted. As shown in FIG. 15b, in another embodiment, the optical shaping module 215 is disposed on the light path of the outgoing laser reflected by the deflection mechanism 23. The laser emission unit 211 is used to emit the emitted laser light to the emission optical unit 212, which is collimated into a line spot by the emission optical unit 212 and then enters the deflection mechanism 23; the deflection mechanism 23 is used to receive the emitted laser light and reflect it to the optical shaping module 215; The optical shaping module 215 is used to shape the outgoing laser into a continuous line spot without gaps and then project into the detection area of the array detector 222; the deflection mechanism 23 is also used to scan the line spot to traverse the entire detection area. The optical shaping module 215 is a cylindrical mirror or a micro-cylindrical lens array. For example, the cross section of the optical shaping module 215 in the rotation plane of the deflection mechanism 23 is arc-shaped and symmetrical around the deflection mechanism 23, as shown in FIG. 15c. The deflection mechanism 23 can be a device capable of realizing light scanning, such as a MEMS micromirror, a reflecting mirror or a transmissive prism. In this embodiment, the line spot covers the entire detection area in the vertical direction. Therefore, the deflection mechanism 23 can adopt a one-dimensional MEMS micromirror 23b, and scan in one direction through the one-dimensional MEMS micromirror 23b. If the linear spot only covers part of the detection area in the vertical direction, a two-dimensional MEMS micromirror is required.
本实施例将光学整形模块215设置于偏转机构23反射的出射激光光路上,光学整形模块215将偏转机构23反射的出射激光整形为连续的无间隙的线光斑后射向阵列探测器222的探测区域,最终出射的出射激光的光斑为连续的无间隙的线光斑,避免探测盲区。In this embodiment, the optical shaping module 215 is arranged on the light path of the outgoing laser reflected by the deflection mechanism 23, and the optical shaping module 215 shapes the outgoing laser reflected by the deflection mechanism 23 into a continuous line spot with no gaps and then sends it to the array detector 222 for detection. Area, the final outgoing laser spot is a continuous line spot with no gaps to avoid detection blind spots.
基于上述激光雷达100,本发明实施例提出了一种包含上述实施例中的激光雷达100的自动驾驶设备200,该自动驾驶设备200可以是汽车、飞机、船以及其他涉及到使用激光雷达进行智能感应和探测的设备,该自动驾驶设备200包括驾驶设备本体201以及如上实施例的激光雷达100,激光雷达100安装于驾驶设备本体201。Based on the above-mentioned lidar 100, an embodiment of the present invention proposes an automatic driving device 200 that includes the lidar 100 in the above-mentioned embodiment. The automatic driving device 200 can be a car, an airplane, a boat, or other related to the use of lidar for intelligence. A device for sensing and detection. The automatic driving device 200 includes a driving device body 201 and the lidar 100 in the above embodiment, and the lidar 100 is installed on the driving device body 201.
如图16a所示,该自动驾驶设备200为无人驾驶汽车,激光雷达100安装于汽车的车身侧面。如图16b所示,该自动驾驶设备200同样为无人驾驶汽车,激光雷达100安装于汽车的车顶。As shown in FIG. 16a, the automatic driving device 200 is an unmanned car, and the lidar 100 is installed on the side of the car body. As shown in FIG. 16b, the automatic driving device 200 is also an unmanned car, and the lidar 100 is installed on the roof of the car.
最后应说明的是:以上各实施例仅用以说明本发明的技术方案,而非对其限制;尽管参照前述各实施例对本发明进行了详细的说明,本领域的普通技术人员应当理解:其依然可以对前述各实施例所记载的技术方案进行修改,或者对其中部分或者全部技术特征进行等同替换;而这些修改或者替换,并不使相应技术方案的本质脱离本发明各实施例技术方案的范围,其均应涵盖在本发明的权利要求和说明书的范围当中。尤其是,只要不存在结构冲突,各个实施例中所提到的各项技术特征均可以任意方式组合起来。本发明并不局限于文中公开的特定实施例,而是包括落入权利要求的范围内的所有技术方案。Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, not to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that: The technical solutions recorded in the foregoing embodiments can still be modified, or some or all of the technical features can be equivalently replaced; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the technical solutions of the embodiments of the present invention. The scope shall be included in the scope of the claims and specification of the present invention. In particular, as long as there is no structural conflict, the various technical features mentioned in the various embodiments can be combined in any manner. The present invention is not limited to the specific embodiments disclosed in the text, but includes all technical solutions falling within the scope of the claims.

Claims (16)

  1. 一种激光雷达(100),其特征在于,所述激光雷达(100)包括发射驱动系统(1)、激光收发系统(2)和控制与信号处理系统(3);A lidar (100), characterized in that the lidar (100) includes a transmission drive system (1), a laser transceiver system (2), and a control and signal processing system (3);
    所述激光收发系统(2)包括发射模组(21)、偏转机构(23)和接收模组(22);所述接收模组(22)包括阵列探测器(222);The laser transceiver system (2) includes a transmitting module (21), a deflection mechanism (23) and a receiving module (22); the receiving module (22) includes an array detector (222);
    所述发射模组(21)包括激光发射单元(211)和发射光学单元(212),所述激光发射单元(211)用于发射出射激光,所述发射光学单元(212)用于对所述出射激光整形,并将整形后的所述出射激光入射到所述偏转机构(23);The emitting module (21) includes a laser emitting unit (211) and a emitting optical unit (212). The laser emitting unit (211) is used for emitting laser light, and the emitting optical unit (212) is used for Shaping the outgoing laser, and incident the shaped outgoing laser to the deflection mechanism (23);
    所述偏转机构(23)用于接收整形后的所述出射激光并将所述出射激光反射后射向所述阵列探测器(222)的局部探测区域内,并进行偏转使所述出射激光以扫描的方式遍历所述阵列探测器(222)的所有探测区域;所述偏转机构(23)还用于接收回波激光并将所述回波激光反射后射向所述接收模组(22),其中所述回波激光为所述出射激光被所述探测区域内的物体反射后返回的激光;The deflection mechanism (23) is used to receive the shaped outgoing laser, reflect the outgoing laser, and shoot it toward the local detection area of the array detector (222), and perform deflection to make the outgoing laser light The scanning mode traverses all the detection areas of the array detector (222); the deflection mechanism (23) is also used to receive the echo laser and reflect the echo laser to the receiving module (22) , Wherein the echo laser light is the laser light that returns after the outgoing laser light is reflected by the object in the detection area;
    所述接收模组(22)用于接收所述回波激光;The receiving module (22) is used to receive the echo laser;
    所述发射驱动系统(1)用于驱动所述发射模组(21);The emission driving system (1) is used to drive the emission module (21);
    所述控制与信号处理系统(3)用于控制所述发射驱动系统(1)驱动所述发射模组(21),以及控制所述接收模组(22)接收所述回波激光。The control and signal processing system (3) is used for controlling the transmitting driving system (1) to drive the transmitting module (21), and controlling the receiving module (22) to receive the echo laser.
  2. 如权利要求1所述的激光雷达(100),其特征在于,所述接收模组(22)用于在所述出射激光扫描所述探测区域中的第一区域时,同步开启所述阵列探测器(222)中对应于所述第一区域的所有像元以接收回波激光,对所述第一区域进行探测。The lidar (100) according to claim 1, wherein the receiving module (22) is used to synchronously turn on the array detection when the outgoing laser scans the first area in the detection area. All the pixels in the device (222) corresponding to the first area receive echo laser light to detect the first area.
  3. 如权利要求2所述的激光雷达(100),其特征在于,所述阵列探测器(222)包括m*n个可单独控制开关的像元,所述m和n均为大于1的整数。The lidar (100) according to claim 2, wherein the array detector (222) comprises m*n pixels that can be individually controlled on and off, and both m and n are integers greater than 1.
  4. 如权利要求1-3任一项所述的激光雷达(100),其特征在于,所述偏转机构(23)为MEMS微镜、反射镜或透射棱镜。The lidar (100) according to any one of claims 1 to 3, wherein the deflection mechanism (23) is a MEMS micromirror, a reflecting mirror or a transmissive prism.
  5. 如权利要求1-3任一项所述的激光雷达(100),其特征在于,所述偏转机构(23)包括镜面、第一转轴(x1)和第二转轴(x2);The lidar (100) according to any one of claims 1 to 3, wherein the deflection mechanism (23) comprises a mirror, a first rotating shaft (x1) and a second rotating shaft (x2);
    所述镜面用于绕所述第一转轴(x1)转动,使所述出射激光沿水平方向扫描所述阵列探测器(222)的探测区域;所述镜面还用于绕所述第二转轴(x2)转动,使所述出射激光沿竖直方向扫描所述阵列探测器(222)的探测区域;所述镜面还用于接收所述回波激光并将所述回波激光反射后射向所述接收模组(22);The mirror surface is used to rotate around the first rotation axis (x1), so that the outgoing laser scans the detection area of the array detector (222) in a horizontal direction; the mirror surface is also used to rotate around the second rotation axis ( x2) Rotate, so that the outgoing laser scans the detection area of the array detector (222) in the vertical direction; the mirror is also used to receive the echo laser and reflect the echo laser to the laser The receiving module (22);
    所述回波激光在所述阵列探测器(222)上的成像在水平方向和竖直方向的尺寸均小于所述阵列探测器(222)的整体像元在相应方向的尺寸。The size of the echo laser imaging on the array detector (222) in the horizontal direction and the vertical direction is smaller than the size of the overall pixel of the array detector (222) in the corresponding direction.
  6. 如权利要求1-3任一项所述的激光雷达(100),其特征在于,所述偏转机构(23)包括镜面和转轴(x);The lidar (100) according to any one of claims 1-3, wherein the deflection mechanism (23) comprises a mirror surface and a rotating shaft (x);
    所述镜面用于绕所述转轴(x)转动,使所述出射激光沿第一方向扫描所述阵列探测器(222)的探测区域;所述镜面还用于接收所述回波激光并将所述回波激光反射后射向所述接收模组(22);The mirror is used to rotate around the rotation axis (x), so that the outgoing laser scans the detection area of the array detector (222) in a first direction; the mirror is also used to receive the echo laser and The echo laser is reflected and directed toward the receiving module (22);
    所述回波激光在所述阵列探测器(222)上的成像在第一方向的尺寸小于所述阵列探测器(222)的整体像元在第一方向的尺寸,所述回波激光在所述阵列探测器(222)上的成像在第二方向的尺寸等于或大于所述阵列探测器(222)的整体像元在第二方向的尺寸;The size of the echo laser imaging on the array detector (222) in the first direction is smaller than the size of the overall pixel of the array detector (222) in the first direction, and the echo laser is in the first direction. The size of the imaging on the array detector (222) in the second direction is equal to or greater than the size of the overall pixel of the array detector (222) in the second direction;
    所述第一方向为水平方向,所述第二方向为竖直方向;或者,所述第一方向为竖直方向,所述第二方向为水平方向。The first direction is a horizontal direction and the second direction is a vertical direction; alternatively, the first direction is a vertical direction and the second direction is a horizontal direction.
  7. 如权利要求1-3任一项所述的激光雷达(100),其特征在于,所述偏转机构(23)包括镜面和转轴(x);The lidar (100) according to any one of claims 1-3, wherein the deflection mechanism (23) comprises a mirror surface and a rotating shaft (x);
    所述发射模组(21)包括至少两个发射组件(210),每个发射组件(210)包括一个激光发射单元(211)和一个发射光学单元(212),所述激光发射单元(211)用于发射第一出射激光,所述发射光学单元(212)用于准直所述第一出射激光,并将准直后的所述第一出射激光入射到所述二维MEMS微镜(23a);所述出射激光由所有的所述第一出射激光组成,所述第一出射激光沿第一方向排布;所述镜面用于绕所述转轴(x)转动,使所述出射激光沿第二方向扫描所述阵列探测器(222)的探测区域;所述镜面还用于接收第一回波激光并将所述第一回波激光反射后射向所述接收模组(22),其中所述第一回波激光为所述第一出射激光被所述探测区域内的物体反射后返回的激光,所述回波激光由所有的所述第一回波激光组成;The emitting module (21) includes at least two emitting components (210), each emitting component (210) includes a laser emitting unit (211) and a emitting optical unit (212), the laser emitting unit (211) Used to emit a first outgoing laser, the emitting optical unit (212) is used to collimate the first outgoing laser, and the collimated first outgoing laser is incident on the two-dimensional MEMS micromirror (23a) ); The outgoing laser is composed of all the first outgoing lasers, and the first outgoing lasers are arranged in a first direction; the mirror is used to rotate around the rotation axis (x) so that the outgoing lasers are along Scan the detection area of the array detector (222) in the second direction; the mirror is also used to receive the first echo laser and reflect the first echo laser to the receiving module (22), The first echo laser light is the laser light that returns after the first outgoing laser light is reflected by the object in the detection area, and the echo laser light is composed of all the first echo laser light;
    所述第一回波激光在所述阵列探测器(222)上的成像在第一方向和第二方向的尺寸均小于所述阵列探测器(222)的整体像元在相应方向的尺寸;所述回波激光在所述阵列探测器(222)上的成像在第一方向的尺寸等于或大于所述阵列探测器(222)的整体像元在第一方向的尺寸;The size of the imaging of the first echo laser on the array detector (222) in the first direction and the second direction is smaller than the size of the overall pixel of the array detector (222) in the corresponding direction; The size of the echo laser imaging on the array detector (222) in the first direction is equal to or greater than the size of the overall pixel of the array detector (222) in the first direction;
    所述第一方向为水平方向,所述第二方向为竖直方向;或者,所述第一方向为竖直方向,所述第二方向为水平方向。The first direction is a horizontal direction and the second direction is a vertical direction; alternatively, the first direction is a vertical direction and the second direction is a horizontal direction.
  8. 如权利要求7所述的激光雷达(100),其特征在于,所述至少两个发射组件(210)按照先后顺序依次进行第一出射激光的发射。The lidar (100) according to claim 7, wherein the at least two emitting components (210) sequentially emit the first outgoing laser light in a sequence.
  9. 如权利要求7或8所述的激光雷达(100),其特征在于,所述发射模组(21)包括三个发射组件(210)。The lidar (100) according to claim 7 or 8, characterized in that the transmitting module (21) comprises three transmitting components (210).
  10. 如权利要求1-3任一项所述的激光雷达(100),其特征在于,所述回波激光为圆形光斑,所述回波激光在所述阵列探测器(222)上的成像位于所述阵列探测器(222)的单个像元内。The laser radar (100) according to any one of claims 1-3, wherein the echo laser is a circular spot, and the imaging of the echo laser on the array detector (222) is located at Within a single pixel of the array detector (222).
  11. 如权利要求1-3任一项所述的激光雷达(100),其特征在于,所述回波激光为圆形光斑,所述回波激光在所述阵列探测器(222)上的成像超出所述阵列探测器(222)的单个像元,但不超出与该单个像元相邻的像元。The laser radar (100) according to any one of claims 1-3, wherein the echo laser is a circular spot, and the imaging of the echo laser on the array detector (222) exceeds The single pixel of the array detector (222), but does not exceed the pixel adjacent to the single pixel.
  12. 如权利要求10所述的激光雷达(100),其特征在于,所述回波激光在所述阵列探测器(222)上的成像位于所述阵列探测器(222)的1/2个像元内,所述阵列探测器(222)的单个像元用于根据所述出射激光的扫描顺序在第一像元区和第二像元区分别接收所述回波激光。The lidar (100) according to claim 10, characterized in that the imaging of the echo laser on the array detector (222) is located at 1/2 pixel of the array detector (222) Inside, a single pixel of the array detector (222) is used to receive the echo laser light in the first pixel area and the second pixel area according to the scanning sequence of the emitted laser light.
  13. 如权利要求10所述的激光雷达(100),其特征在于,所述回波激光在所述阵列探测器(222)上的成像位于所述阵列探测器(222)的1/4个像元内,所述阵列探测器(222)的单个像元用于根据所述出射激光的扫描顺序在第一像元区、第二像元区、第三像元区和第四像元区分别接收所述回波激光。The lidar (100) according to claim 10, characterized in that the imaging of the echo laser on the array detector (222) is located at 1/4 pixel of the array detector (222) Inside, the single pixel of the array detector (222) is used to receive the first pixel area, the second pixel area, the third pixel area, and the fourth pixel area according to the scanning sequence of the emitted laser light. The echo laser.
  14. 如权利要求1-13任一项所述的激光雷达(100),其特征在于,所述发射模组(21)包括激光发射单元(211)和发射光学单元(212);The lidar (100) according to any one of claims 1-13, wherein the transmitting module (21) comprises a laser transmitting unit (211) and a transmitting optical unit (212);
    激光发射单元(211)用于发射出射激光;The laser emitting unit (211) is used for emitting outgoing laser;
    发射光学单元(212)用于准直出射激光,并将准直后的出射激光入射到偏转机构(23)。The emitting optical unit (212) is used for collimating the emitted laser light, and incident the collimated emitted laser light to the deflection mechanism (23).
  15. 如权利要求1-13任一项所述的激光雷达(100),其特征在于,所述接收模组(22)还包括接收光学单元(221);The lidar (100) according to any one of claims 1-13, wherein the receiving module (22) further comprises a receiving optical unit (221);
    所述接收光学单元(221)用于会聚回波激光,并将会聚后的所述回波激光射向所述阵列探测器(222);The receiving optical unit (221) is used to converge the echo laser, and shoot the collected echo laser to the array detector (222);
    所述阵列探测器(222)用于接收所述回波激光。The array detector (222) is used to receive the echo laser.
  16. 一种自动驾驶设备(200),其特征在于,包括驾驶设备本体(201)以及如权利要求1-15任一项所述的激光雷达(100),所述激光雷达(100)安装于所述驾驶设备本体(201)。An automatic driving device (200), characterized by comprising a driving device body (201) and the lidar (100) according to any one of claims 1-15, and the lidar (100) is installed on the Driving equipment body (201).
PCT/CN2020/083290 2020-04-03 2020-04-03 Lidar and self-driving device WO2021196193A1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
PCT/CN2020/083290 WO2021196193A1 (en) 2020-04-03 2020-04-03 Lidar and self-driving device
CN202080005842.XA CN113227827A (en) 2020-04-03 2020-04-03 Laser radar and autopilot device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2020/083290 WO2021196193A1 (en) 2020-04-03 2020-04-03 Lidar and self-driving device

Publications (1)

Publication Number Publication Date
WO2021196193A1 true WO2021196193A1 (en) 2021-10-07

Family

ID=77086008

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2020/083290 WO2021196193A1 (en) 2020-04-03 2020-04-03 Lidar and self-driving device

Country Status (2)

Country Link
CN (1) CN113227827A (en)
WO (1) WO2021196193A1 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116400325A (en) * 2022-09-14 2023-07-07 苏州睿新微系统技术有限公司 Light emitting assembly and laser radar
WO2023142991A1 (en) * 2022-01-27 2023-08-03 华为技术有限公司 Lidar and device having detection function
TWI831234B (en) * 2022-06-06 2024-02-01 遠創智慧股份有限公司 Methods for detecting and classifying objects, and related systems

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113721256A (en) * 2021-09-24 2021-11-30 探维科技(北京)有限公司 Angle splicing laser radar system
CN116953668A (en) * 2022-04-14 2023-10-27 上海禾赛科技有限公司 Laser radar transceiver and laser radar
CN116047470B (en) * 2023-01-28 2023-06-02 深圳煜炜光学科技有限公司 Semi-solid laser radar and control method thereof

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9234964B2 (en) * 2012-06-14 2016-01-12 Electronics And Telecommunications Research Institute Laser radar system and method for acquiring 3-D image of target
CN108152830A (en) * 2017-12-26 2018-06-12 苏州镭图光电科技有限公司 A kind of laser radar scanning imaging system and its measuring method
CN207833020U (en) * 2017-12-26 2018-09-07 苏州镭图光电科技有限公司 A kind of laser radar scanning imaging system
CN109870825A (en) * 2017-12-01 2019-06-11 北京万集科技股份有限公司 A kind of colimated light system and laser radar based on MEMS galvanometer
CN110488247A (en) * 2019-08-20 2019-11-22 中国科学院苏州纳米技术与纳米仿生研究所 A kind of two dimension MEMS scanning galvanometer laser radar system
CN110824458A (en) * 2019-11-06 2020-02-21 中科融合感知智能研究院(苏州工业园区)有限公司 Large-range scanning coaxial MEMS laser radar optical system
CN210123470U (en) * 2018-12-27 2020-03-03 北京经纬恒润科技有限公司 Laser scanning radar
CN110873868A (en) * 2018-08-31 2020-03-10 探维科技(北京)有限公司 Laser radar system based on MEMS scanning mirror
CN110873867A (en) * 2018-08-31 2020-03-10 探维科技(北京)有限公司 Laser radar system based on MEMS scanning mirror

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10571574B1 (en) * 2016-02-15 2020-02-25 Red Creamery, LLC Hybrid LADAR with co-planar scanning and imaging field-of-view
CN110850387A (en) * 2018-08-20 2020-02-28 宁波舜宇车载光学技术有限公司 Line scanning laser radar system and application thereof

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9234964B2 (en) * 2012-06-14 2016-01-12 Electronics And Telecommunications Research Institute Laser radar system and method for acquiring 3-D image of target
CN109870825A (en) * 2017-12-01 2019-06-11 北京万集科技股份有限公司 A kind of colimated light system and laser radar based on MEMS galvanometer
CN108152830A (en) * 2017-12-26 2018-06-12 苏州镭图光电科技有限公司 A kind of laser radar scanning imaging system and its measuring method
CN207833020U (en) * 2017-12-26 2018-09-07 苏州镭图光电科技有限公司 A kind of laser radar scanning imaging system
CN110873868A (en) * 2018-08-31 2020-03-10 探维科技(北京)有限公司 Laser radar system based on MEMS scanning mirror
CN110873867A (en) * 2018-08-31 2020-03-10 探维科技(北京)有限公司 Laser radar system based on MEMS scanning mirror
CN210123470U (en) * 2018-12-27 2020-03-03 北京经纬恒润科技有限公司 Laser scanning radar
CN110488247A (en) * 2019-08-20 2019-11-22 中国科学院苏州纳米技术与纳米仿生研究所 A kind of two dimension MEMS scanning galvanometer laser radar system
CN110824458A (en) * 2019-11-06 2020-02-21 中科融合感知智能研究院(苏州工业园区)有限公司 Large-range scanning coaxial MEMS laser radar optical system

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023142991A1 (en) * 2022-01-27 2023-08-03 华为技术有限公司 Lidar and device having detection function
TWI831234B (en) * 2022-06-06 2024-02-01 遠創智慧股份有限公司 Methods for detecting and classifying objects, and related systems
CN116400325A (en) * 2022-09-14 2023-07-07 苏州睿新微系统技术有限公司 Light emitting assembly and laser radar
CN116400325B (en) * 2022-09-14 2024-01-26 苏州睿新微系统技术有限公司 Light emitting assembly and laser radar

Also Published As

Publication number Publication date
CN113227827A (en) 2021-08-06

Similar Documents

Publication Publication Date Title
WO2021196193A1 (en) Lidar and self-driving device
US10989794B2 (en) Scanning optical system and radar
US20220128667A1 (en) Multi-beam laser radar and self-moving vehicle
WO2021035428A1 (en) Laser radar and automatic driving equipment
JP7019894B2 (en) How to detect objects and sensor systems
WO2020187103A1 (en) Prism and multi-beam lidar system
WO2021196194A1 (en) Laser emitting-and-receiving system, laser radar and automatic driving apparatus
US20230035528A1 (en) Lidar and automated driving device
WO2023040376A1 (en) Laser radar
JP6856784B2 (en) Solid-state photodetection and range-finding (LIDAR) systems, systems and methods for improving solid-state light detection and range-finding (LIDAR) resolution.
WO2020164221A1 (en) Transceiver device and laser radar
US20240061114A1 (en) Optical detection device, driving vehicle, laser radar and detection method
WO2021035427A1 (en) Lidar and autonomous driving device
CN111366907B (en) MEMS three-dimensional laser radar system
CN111308444A (en) Laser radar system
CN108226952A (en) A kind of laser scanning imaging system
CN210142188U (en) Prism and multi-line laser radar system
WO2023207009A1 (en) Lidar
CN219285418U (en) Laser radar
US20230243932A1 (en) Optical waveguide device used in laser detection and ranging system
US20220260677A1 (en) Laser radar and method for performing detection by using the same
CN218727982U (en) Light path structure and mixed solid-state laser radar
CN218158324U (en) Laser radar
WO2024113328A1 (en) Detection method, array detector, array transmitter, detection apparatus and terminal
WO2023077864A1 (en) Variable field of view scanning system and method therefor

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 20928731

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

32PN Ep: public notification in the ep bulletin as address of the adressee cannot be established

Free format text: NOTING OF LOSS OF RIGHTS PURSUANT TO RULE 112(1) EPC (EPO FORM 1205A DATED 16/01/2023)

122 Ep: pct application non-entry in european phase

Ref document number: 20928731

Country of ref document: EP

Kind code of ref document: A1