WO2021193114A1

WO2021193114A1 - Film formation device

Info

Publication number: WO2021193114A1
Application number: PCT/JP2021/009855
Authority: WO
Inventors: 幸一関戸
Original assignee: 東京エレクトロン株式会社
Priority date: 2020-03-23
Filing date: 2021-03-11
Publication date: 2021-09-30
Also published as: CN115298354A; KR20220152310A; JP2021147693A

Abstract

Provided is a technique for preventing the misconnection of a solid raw material container in a film formation device.　A film formation device is provided, which comprises: a solid raw material container in which a solid raw material for forming a film is contained; a plurality of terminals which are mechanically connected to the solid raw material container and of which the electrical state can be altered; and a control unit in which the electrical state of the plurality of terminals is detected and the type of the solid raw material is determined on the basis of the detected electrical state.

Description

Film deposition equipment

This disclosure relates to a film forming apparatus.

A connector device having a connector that relays a signal connection between a plurality of electric devices, and is installed corresponding to at least one connector that connects to another electric device via a connection cable and the at least one connector. , It is determined whether or not the input signal input from the connector is an appropriate input signal, and the determination result is output, and when the input signal is an appropriate input signal, the input signal is output. A connection that holds at least one connection detector and connection information of the connector that has already been connected, and generates connection guidance information regarding the connection that the user should make next based on the connection information and the determination result. A technique for a connector device including a guidance unit and an output unit that provides the connection guidance information to a user is disclosed.

Japanese Unexamined Patent Publication No. 2006-17888889

The present disclosure provides a technique capable of suppressing erroneous connection of a solid raw material container in a film forming apparatus.

According to one aspect of the present disclosure, a solid raw material container for accommodating a solid raw material for film formation, and a plurality of terminals mechanically connected to the solid raw material container and capable of changing the electrical state. Provided is a film forming apparatus including a control unit that detects an electrical state of the plurality of terminals and determines the type of the solid raw material based on the detected electrical state.

According to one aspect, it is possible to suppress erroneous connection of the solid raw material container in the film forming apparatus.

It is a block diagram which shows an example of the structure of the film forming apparatus 100 of an embodiment. It is a figure which shows the connector 120A. It is a figure which shows the connector 120A. It is a figure which shows the connector 120B. It is a figure which shows the connection state of a connector 120A, a cable 130, a

connector

140A, 140B, and an I / O board 150. It is a figure which shows the connection state of a connector 120A, a cable 130, a

connector

140A, 140B, and an I / O board 150. It is a figure which shows the exemplary cross-sectional structure of the film forming apparatus 100.

Hereinafter, the mode for carrying out the present disclosure will be described with reference to the drawings. In the present specification and the drawings, substantially the same configuration may be designated by the same reference numerals to omit duplicate explanations.

<Embodiment>
FIG. 1 is a block diagram showing an example of the configuration of the film forming apparatus 100 of the embodiment. The film forming apparatus 100 has, as main components, a raw material storage unit 110,

connectors

120A and 120B, a cable 130,

connectors

140A and 140B, an I / O (Input / Output) board 150, an MC (Module Controller) 160, and a valve 170. , And the alarm unit 180.

In the following, the

connectors

120A and 120B will be described with reference to FIGS. 2A, 2B, and 2C in addition to FIG. 2A and 2B are diagrams showing the connector 120A, and FIG. 2C is a diagram showing the connector 120B.

In addition, EC (Equipment Controller) 200 is connected to MC160. The EC200 is a controller that comprehensively controls the film forming apparatus 100 and the film forming apparatus other than the film forming apparatus 100, and is located above the MC160. The film forming apparatus 100 and EC200 constitute a film forming system. The MC160 and EC200 are, for example, computers including a CPU (Central Processing Unit), a RAM (Random Access Memory), a ROM (Read Only Memory), an HDD (Hard Disk Drive), an input / output interface, a user interface, an internal bus, and the like. Realized by. The user interface is, for example, a keyboard, a mouse, a display, and the like. Further, FIG. 1 shows the memory 201 of the EC200. The memory 201 is realized by a ROM as an example.

The raw material storage unit 110 is a space for storing one or more raw material containers (ampoules), and in FIG. 1, the raw material container 111 is arranged in the raw material storage unit 110. The raw material container 111 is, for example, an example of a solid raw material container for accommodating a solid raw material. The solid raw material is, for example, tungsten pentachloride (WCl ₅ ) or tungsten hexachloride (WCl ₆ ). Tungsten hexachloride (WCl ₅ ) and tungsten hexachloride (WCl ₆ ) are solids at room temperature at atmospheric pressure.

The raw material gas delivery pipe 111A is connected to the raw material container 111. The raw material gas delivery pipe 111A connects the raw material container 111 and the chamber of the film forming apparatus 100, and is provided with a valve 170. Further, the raw material container 111 is provided with a heater (not shown), and the solid raw material is sublimated by heating and supplied to the chamber as a raw material gas.

The

connectors

120A and 120B are connected to each other in the raw material storage unit 110. The connector 120A is an example of the first connector, and the connector 120B is an example of the second connector. The connector 120A is connected to the wire 125A attached to the raw material container 111, and the connector 120B is connected to the cable 130.

More specifically, the connector 120A and the wire 125A have a configuration as shown in FIG. 2A, the connector 120A is fixed to one end of the wire 125A, and the connector 120A is provided with a removable lid 126A. The connector 120A and the wire 125A are only fixed and not electrically connected. The wire 125A is provided for attaching the connector 120A to the raw material container 111. Here, it is a prerequisite for performing the film forming process that the connector 120A is attached to the raw material container 111 with the wire 125A and the connector 120A is connected to the connector 120B.

As shown in FIG. 2B, the connector 120A has a substantially cylindrical base portion 121A, a plurality of hole portions 122A, a plurality of terminals 123A, and a bolt portion 124A. The plurality of holes 122A penetrate the base 121A, and a plurality of terminals 123A are provided inside each of the holes 122A. Further, the bolt portion 124A is provided on the outer side in the radial direction of the base portion 121A, and a screw is formed on the inner peripheral surface. The bolt portion 124A is rotatably attached to the base portion 121A.

The plurality of terminals 123A are examples of a plurality of terminals and a plurality of first terminals, and are female terminals into which the pin terminal 123B of the connector 120B can be inserted and removed. Regarding the terminal 123A, only the terminal 123A on the front side in FIG. 2B is shown by a broken line. The connector 120A is a female connector.

An identifier is assigned to each terminal 123A. The identifier is, for example, an identification number. The plurality of terminals 123A are insulated from each other, but are configured so that any two can be short-circuited on the other surface (the back surface that cannot be seen in FIG. 2B) of the base 121A. The remaining unshorted terminals 123A remain electrically isolated from each other and open.

The fact that the terminal 123A is insulated and that it is short-circuited is an example of the electrical state of the terminal 123A, and that the terminal 123A has a configuration that can short-circuit any two terminals means that the terminal 123A is electrically connected. This is an example of having a configuration in which the target state can be changed.

To short-circuit the two terminals 123A, for example, on the other surface of the base 121A (the back surface that cannot be seen in FIG. 2B), the two terminals 123A are connected and made conductive by wiring or the like having pin terminals at both ends. You can do it. Further, the number of terminals 123A to be short-circuited may be at least two, and three or more terminals 123A may be short-circuited so as to be electrically connected to each other. Further, each group including at least two terminals 123A may be short-circuited.

Here, as an example, a mode in which two terminals 123A out of a plurality of terminals 123A are short-circuited will be described. The combination of the identification numbers of the two short-circuited terminals 123A is used to distinguish the types of solid raw materials contained in the raw material container 111. That is, the combination of the identification numbers of the two short-circuited terminals 123A differs depending on the type of the solid raw material contained in the raw material container 111, and is a unique combination.

Therefore, the connector 120A attached to the raw material container 111 containing tungsten hexachloride (WCl ₅ ) and the connector 120A attached to the raw material container 111 containing tungsten hexachloride (WCl ₆ ) are short-circuited. The combination of the identification numbers of the terminals 123A is different.

As shown in FIG. 2C, the connector 120B has a base portion 121B, a protruding portion 122B, and a plurality of pin terminals 123B. The plurality of pin terminals 123B are examples of the plurality of second terminals. The base portion 121B is, for example, a thin rectangular plate-shaped member, and a plurality of pin terminals 123B are inserted into a plurality of through holes provided in the center. The number of the plurality of pin terminals 123B is equal to the number of the plurality of terminals 123A. Further, a cylindrical protruding portion 122B is provided on one surface of the base portion 121B, and a screw portion 122B1 is formed on the outer peripheral surface of the protruding portion 122B.

In order to connect

such connectors

120A and 120B, a positioning convex portion provided on the outer peripheral surface of the base portion 121A and a positioning concave portion provided on the inner peripheral surface of the protruding portion 122B are engaged with each other. In this state, the plurality of pin terminals 123B are inserted into the plurality of holes 122A of the connector 120A. Then, with the plurality of terminals 123A and the plurality of pin terminals 123B connected to each other, the

connectors

120A and 120B are fixed to each other by engaging the bolt portion 124A with the screw portion 122B1 of the protrusion 122B.

One end of the cable 130 is connected to the connector 120B, and the other end is connected to the connector 140A. The cable 130 has a plurality of wires for connecting the plurality of pin terminals 123B and the plurality of terminals (not shown) of the connector 140A.

The connector 140A is connected to the connector 140B provided on the I / O board 150. The

connectors

140A and 140B each have the same number of terminals as the wiring included in the cable 130, and have a configuration in which predetermined terminals are connected to each other in a state of being aligned with each other like the

connectors

120A and 120B. .. Therefore, each terminal of the connector 140B is connected to each terminal 123A of the connector 120A via the connector 140A, the cable 130, and the connector 120B. The connector 120B, the cable 130, the

connectors

140A and 140B, the I / O board 150, and the cable 155 are examples of electrical connection portions that electrically connect a plurality of terminals 123A and MC160.

The I / O board 150 is provided with a connector 140B and an FPGA (Field Programmable Gate Array) 151. The FPGA 151 is connected to the connector 140B via the wiring of the I / O board 150 and is connected to the MC160 via the cable 155. The FPGA 151 reads the voltage value of each terminal of the connector 140B and detects the connection state (whether or not it is short-circuited) of each terminal 123A of the connector 120A.

The FPGA 151 detects the connection state of a plurality of terminals 123A of the connector 120A via the

connectors

140A and 140B, the cable 130, and the connector 120B, and generates I / O data representing the combination of the short-circuited terminals 123A. The FPGA 151 transmits the I / O data to the MC160. The processing unit that performs such processing is not limited to FPGA 151, and various processing units can be used.

The MC160 is an example of a control unit, and controls each part (for example, a valve, a power supply, a heater, a pump, etc.) of the film forming apparatus 100 according to a film forming process recipe (processing recipe). Further, the MC 160 is connected to the FPGA 151 provided on the I / O board 150 via the serial interface cable 155 as an example, and is connected to the EC 200 via a LAN (Local Area Network) cable 205 as an example. Has been done.

MC160 determines the type of connector 120A based on the I / O data acquired from FPGA 151. The MC160 determines the type of the connector 120A by reading the reference data stored in the memory 201 of the EC200 and comparing the reference data with the I / O data at the time of determination.

The valve 170 is provided in the raw material gas delivery pipe 111A that connects the raw material container 111 and the processing container (not shown). The opening / closing (blocking) of the valve 170 is switched by the MC160. The valve 170 is held in a closed state when no film formation is performed. Further, the valve 170 is held in a closed state by the MC 160 when the connector 120A of the raw material container 111 containing the solid raw material different from the solid raw material originally used for the film forming process is connected to the connector 120B. .. This is because if the raw material container 111 containing the solid raw material that is not originally used is erroneously connected to the raw material gas delivery pipe 111A, a lot defect may cause a huge economic loss.

The alarm unit 180 is operated by the MC 160 when the connector 120A of the raw material container 111 containing the solid raw material different from the solid raw material originally used for the film forming process is connected to the connector 120B. The alarm unit 180 may be any device that can notify the operator (user) of the film forming apparatus 100 that an abnormal situation has occurred, and as an example, an alarm device that issues an alarm, a display of MC160 or EC200, or the like. A device that displays an alarm message.

FIG. 3 is a diagram showing a connection state of the connector 120A, the cable 130, the

connectors

140A, 140B, and the I / O board 150 for detecting the raw material container 111 containing the _{tungsten pentoxide (WCl 5).} FIG. 4 is a diagram showing a connection state of the connector 120A, the cable 130, the

connectors

140A, 140B, and the I / O board 150 for detecting the raw material container 111 containing the _{tungsten hexachloride (WCl 6).}

3 and 4 show the connection state of the terminal 123A, the pin terminal 123B, the wiring of the cable 130, the terminals of the

connectors

140A and 140B, and the I / O board 150 from the left side to the right side. In FIGS. 3 and 4, FPGA 151 is omitted.

Here, as an example, it is assumed that there are 28 terminals 123A of the connector 120A, and the identification numbers of the terminals 123A are from 1 to 28. Further, since there are 28 terminals each for the terminals 123A, the pin terminals 123B, the wiring of the cable 130, and the

connectors

140A, 140B, the wiring of the terminals 123A, the pin terminal 123B, the cable 130, and the connector 140A, It will be described that the terminal of 140B has an identification number from 1 to 28. It is assumed that the terminals 123A, the pin terminals 123B, the wiring of the cable 130, and the terminals of the

connectors

140A and 140B have the same identification number and are connected to each other.

Further, in order to distinguish between the raw material container 111 containing tungsten pentachloride (WCl ₅ ) and the raw material container 111 containing tungsten hexachloride (WCl ₆ ), the identification numbers are 5, 6, 17, and 18 as an example. The four terminals 123A of the above are used, and the terminals 123A of other identification numbers are not used. Therefore, in FIGS. 3 and 4, only the

identification numbers

5, 6, 17, and 18 are shown for the wiring of the cable 130, the terminals of the

connectors

140A and 140B, and the I / O board 150, and the identification numbers are 1 to 4, 7 to 16, 19 to 28 are described as Not Connected.

As shown in FIG. 3, in the _{connector 120A attached to the raw material container 111 of tungsten pentachloride (WCl 5} ), the terminals 123A having the

identification numbers

5 and 17 are short-circuited, and the terminals 123A having the

identification numbers

6 and 18 are not short-circuited (the terminals 123A having the

identification numbers

6 and 18 are not short-circuited). Open). Therefore, FIG. 3 shows a state in which terminals 123A having

identification numbers

5 and 17 are connected, and terminals 123A having

identification numbers

6 and 18 are described as Not Connected.

Further, as shown in FIG. 4, in the _{connector 120A attached to the raw material container 111 of tungsten hexachloride (WCl 6} ), the terminals 123A having the

identification numbers

6 and 18 are short-circuited, and the terminals 123A having the

identification numbers

5 and 17 are short-circuited. Do not (open). Therefore, FIG. 4 shows a state in which terminals 123A having

identification numbers

6 and 18 are connected, and terminals 123A having

identification numbers

5 and 17 are described as Not Connected.

The FPGA 151 provided on the I / O board 150 determines the connector 140B when discriminating between the raw material container 111 containing _{tungsten pentachloride (WCl 5} ) and the raw material container 111 containing tungsten hexachloride (WCl _6). Of the 28 terminals, only the voltage values of the terminals whose identification numbers are 5, 6, 17, and 18 are detected.

In FIGS. 3 and 4, the voltage values of the terminals of the connectors 140B of the

identification numbers

5, 17, 6, and 18 are A1, B1, A2, and B2, respectively. The FPGA 151 detects the voltage values A1, B1, A2, and B2 and creates I / O data.

As shown in FIG. 3, when the terminals 123A having the

identification numbers

5 and 17 are short-circuited and the terminals 123A having the

identification numbers

6 and 18 are not short-circuited (opened), the current flows through the following path. The current flows from the power supply (+ 24V) of the identification number 5 of the I / O board 150 to the

connectors

140A and 140B of the identification number 5, the wiring of the cable 130, the pin terminal 123B, and the terminal 123A. Then, the current passes from the terminal 123A of the identification number 5 of the connector 120A to the terminal 123A of the identification number 17, passes through the pin terminal 123B of the identification number 17, the wiring of the cable 130, the

connectors

140A and 140B, and the I / O board 150. It flows through the resistor R of the identification number 17 to the ground (GND).

Further, at this time, since the terminals 123A having the

identification numbers

6 and 18 are open, the power supply (+ 24V) of the identification number 6 of the I / O board 150, the resistor R of the identification number 18, and the ground (GND) are used. No current flows between and.

Therefore, the voltage values A1 and B1 of the connector 140B detected by the FPGA 151 provided on the I / O board 150 become the voltage values V1 and V2 when a current flows, respectively, and the voltage values A2 and B2 are the currents. It becomes + 24V, 0V when is not flowing.

Further, as shown in FIG. 4, when the terminals 123A having the

identification numbers

6 and 18 are short-circuited and the terminals 123A having the

identification numbers

5 and 17 are not short-circuited (opened), the current flows through the following path. .. The current flows from the power supply (+ 24V) of the identification number 6 of the I / O board 150 to the

connectors

140A and 140B of the identification number 6, the wiring of the cable 130, the pin terminal 123B, and the terminal 123A. Then, the current passes from the terminal 123A of the identification number 6 of the connector 120A to the terminal 123A of the identification number 18, passes through the pin terminal 123B of the identification number 18, the wiring of the cable 130, the

connectors

140A and 140B, and the I / O board 150. It flows through the resistor R of the identification number 18 to the ground (GND).

Further, at this time, since the terminals 123A having the

identification numbers

5 and 17 are open, the power supply (+ 24V) of the identification number 5 of the I / O board 150, the resistor R of the identification number 17, and the ground (GND) are used. No current flows between and.

Therefore, the voltage values A2 and B2 of the connector 140B detected by the FPGA 151 provided on the I / O board 150 are the voltage values V1 and V2 when a current flows, respectively, and the voltage values A1 and B1 are respectively. , + 24V, 0V when no current is flowing.

The FPGA 151 creates 2-bit I / O data as an example based on the voltage values A1, B1, A2, and B2. When the voltage values A1, B1, A2, and B2 are V1, V2, 24V, and 0V, the FPGA 151 creates 2-bit I / O data '01', and the voltage values A1, B1, A2, and B2 are 24V. In the case of 0V, V1 and V2, 2-bit I / O data '10' is created. The I / O data '01' indicates that the terminals 123A of the

identification numbers

5 and 17 are short-circuited, and the I / O data '10' indicates that the terminals 123A of the

identification numbers

6 and 18 are short-circuited. show. The FPGA 151 creates I / O data '01' from the connection state of each terminal 123A of the connector 120 attached to the raw material container 111 of _{tungsten hexachloride (WCl 5} ), and puts it in _{the raw material container 111 of tungsten hexachloride (WCl 6} ). I / O data '10' is created from the connection state of each terminal 123A of the attached connector 120.

The MC 160 controls the opening / closing (blocking) of the valve 170 and operates the alarm unit 180 based on the film formation parameters and the I / O data. The film forming parameter represents the type of solid raw material used according to the type of film forming process. As an example, the film forming parameter indicates that tungsten pentachloride (WCl ₅ ) is used in the case of the film forming process (1), and tungsten hexachloride (WCl ₆ ) in the case of the film forming process (2). Will be used. Data representing such film formation parameters are stored in the memory 201 of the EC200. Here, the film forming apparatus 100 performs any one of the film forming processes (1) and (2), and the memory 201 has any one of the film forming processes (1) and (2). It is assumed that the data representing the film formation parameters of the above is stored.

In addition, reference data is stored in the memory 201 of the EC200. The reference data is 2-bit data having the same value as the I / O data obtained by the connection state (whether or not it is short-circuited) of the terminal 123A of the connector 120 attached to the raw material container 111. Since the film forming apparatus 100 performs any one of the film forming processes (1) and (2), the reference data stored in the memory 201 is the film forming process (1) performed by the film forming apparatus 100. And the same value as the I / O data obtained by the connection state (whether or not it is short-circuited) of the terminal 123A of the connector 120 attached to the raw material container 111 containing the solid raw material used in any one of (2). Have.

When the film forming apparatus 100 performs the film forming process (1), the reference data stored in the memory 201 is '01'. Further, when the film forming apparatus 100 performs the film forming process (2), the reference data stored in the memory 201 is '10'.

The MC160 reads out the film forming parameters and the reference data for the film forming apparatus 100 from the memory 201. When the MC 160 acquires the I / O data from the FPGA 151, it compares it with the reference data read from the memory 201, and opens the valve 170 if they match. As a result, the raw material gas obtained by sublimating the solid raw material is supplied to the chamber.

Further, if the I / O data acquired from the FPGA 151 and the reference data read from the memory 201 do not match, the MC 160 holds the valve 170 in the closed state and operates the alarm unit 180.

As described above, in the film forming apparatus 100, the connector 120B at one end of the cable 130 is connected to the connector 120A attached to the raw material container 111, and the connector 140A at the other end of the cable 130 is provided on the I / O board 150. Connect to connector 140B. Then, in order to discriminate the types of the two types of solid raw materials, as an example, the four terminals 123A of the

identification numbers

5, 17, 6, and 18 of the 28 terminals 123A are used, and the

identification numbers

5, 17 are used. , 6, 18 of the four terminals 123A, two terminals 123A are short-circuited with a unique combination according to the type of solid raw material.

Further, the FPGA 151 provided on the I / O board 150 creates I / O data based on the voltage values A1, B1, A2, and B2 of the terminals of the connectors 140B of the

identification numbers

5, 17, 6, and 18, and creates I / O data based on the MC160. To transmit to. Then, the MC 160 reads the film formation parameter and the reference data from the memory 201, and if the reference data and the I / O data acquired from the FPGA 151 do not match, the valve 170 is held in the closed state and an alarm is given. The unit 180 is operated.

Therefore, it is possible to prevent the raw material container 111 containing the solid raw material that is not originally used from being erroneously connected to the raw material gas delivery pipe 111A.

Therefore, it is possible to provide a film forming apparatus 100 capable of suppressing erroneous connection of the raw material container 111.

Further, in the MC160, when the connector 120A and the connector 120B are disconnected, or when the connector 140A and the connector 140B are disconnected, the space between the terminals 123A having the

identification numbers

5 and 17 is open and the identification number is identified. It is determined that the area between the terminals 123A having the

numbers

6 and 18 is open. As a result, when the electrical state between the terminals 123A having the identification numbers 5 and 17 (electrical connection state) and the electrical state between the terminals 123A having the

identification numbers

6 and 18 are normally connected. Judging that it is different from the electrical state, the interlock control of the film forming apparatus 100 is started. To start the interlock control is, for example, to execute a control for operating the alarm unit 180, a control for stopping the film forming process, and the like. As a result, a fail safe operation and a fool proof operation are realized.

Further, instead of directly detecting that the raw material gas delivery pipe 111A is erroneously connected, the connector 120A newly attached to the raw material container 111, the cable 130 having the connector 120B and the connector 140A at both ends, and the cable 130. An erroneous connection of the raw material container 111 is detected by using the connector 140B provided on the I / O board 150.

Since the incorrect connection of the raw material container 111 is determined by using the voltage value based on the unique combination of the two short-circuited terminals 123A of the connector 120A, the determination accuracy is very high.

Therefore, it is possible to provide a highly reliable film forming apparatus 100 capable of discriminating erroneous connection of the raw material container 111 with extremely high accuracy.

Further, when the raw material container 111 is erroneously connected, the valve 170 is held in the closed state, so that it is possible to suppress the supply of the raw material gas different from the original to the chamber. If the wrong source gas is supplied to the chamber, defective lots can result in enormous economic losses, which can be suppressed.

Further, in the case of a liquid raw material or a gas raw material, the raw material can be added to the raw material container, but in the case of a solid raw material, the raw material cannot be added, so the raw material container 111 must be replaced. Human error may occur during replacement. When film formation is performed using a solid raw material in this way, it is possible to provide a film forming apparatus 100 having extremely high utility value.

In the above, the film forming apparatus 100 performs any one of the film forming treatments (1) and (2), and accommodates any one of _{tungsten pentachloride (WCl 5} ) and tungsten hexachloride (WCl _6). The mode in which the raw material container 111 to be connected to the raw material gas delivery pipe 111A has been described. However, the film forming apparatus 100 has two raw material gas delivery pipes 111A, and switches between a raw material container 111 containing _{tungsten pentachloride (WCl 5} ) and a raw material container 111 containing tungsten hexachloride (WCl _6). May be used.

In this case, the memory 201 contains the film forming parameters of both the film forming processes (1) and (2), _{the raw material container 111 containing the tungsten pentoxide (WCl 5} ), and the tungsten hexachloride (WCl ₆ ). It suffices to store the reference data corresponding to the raw material container 111 that houses the material. Then, the MC160 may read out the reference data about the solid raw material represented by the film forming parameters of the film forming process (1) or (2) to be executed from now on, and determine whether or not it matches the I / O data acquired from the FPGA 151. .. For example, when the solid raw material represented by the film formation parameter is tungsten pentachloride (WCl ₅ ), the MC160 reads the reference data '01' and determines whether it matches the I / O data acquired from the FPGA 151. Just do it. Further, when the solid raw material represented by the film formation parameter is tungsten hexachloride (WCl ₆ ), the MC160 reads out the reference data '10' and determines whether or not it matches the I / O data acquired from the FPGA 151. Just do it.

Further, in the above, the mode in which the FPGA 151 creates I / O data based on the voltage values A1, B1, A2, and B2 has been described, but instead of the voltage values A1, B1, A2, and B2, the current value or the resistance value. May be used.

Further, in the above, a mode for discriminating between two types of solid raw materials has been described using _{tungsten pentachloride (WCl 5} ) and tungsten hexachloride (WCl _{6) as solid raw materials.} However, the solid raw material is not limited to these two types.

Further, in the above, as a configuration in which the connection state of the plurality of terminals 123A can be changed, a configuration in which the plurality of terminals 123A are short-circuited has been described. It is not limited. For example, the connection state of the plurality of terminals 123A may be changed by connecting resistors having different resistance values between the plurality of terminals 123A.

Further, in the above, the configuration in which the connection state of the plurality of terminals 123A can be changed is described as the configuration in which the terminal 123A can change the electrical state, but the configuration in which the electrical state can be changed is such a configuration. It is not limited to. For example, the capacitance may be changeable.

Further, in the above, the mode in which the above-mentioned technique for suppressing the erroneous connection of the raw material container 111 is applied to the film forming apparatus 100 has been described. May be applied to.

Finally, an example of a film forming apparatus 100 capable of forming a tungsten film will be described with reference to FIG. FIG. 5 is a diagram showing an exemplary cross-sectional configuration of the film forming apparatus 100.

The film forming apparatus 100 has a substantially cylindrical chamber 1 that is airtightly configured, and a susceptor 2 for horizontally supporting the wafer W as a substrate to be processed is contained therein in an exhaust chamber described later. It is arranged in a state of being supported by a cylindrical support member 3 extending from the bottom to the lower center thereof. The susceptor 2 is made of ceramics such as AlN. Further, a heater 5 is embedded in the susceptor 2, and a heater power supply 6 is connected to the heater 5. On the other hand, a thermocouple 7 is provided near the upper surface of the susceptor 2, and the signal of the thermocouple 7 is transmitted to the heater controller 8. Then, the heater controller 8 transmits a command to the heater power supply 6 in response to the signal of the thermocouple 7, controls the heating of the heater 5, and controls the wafer W to a predetermined temperature. The susceptor 2 is provided with three wafer elevating pins (not shown) so as to be recessed from the surface of the susceptor 2, and is in a state of protruding from the surface of the susceptor 2 when the wafer W is conveyed. Be made. Further, the susceptor 2 can be raised and lowered by an elevating mechanism (not shown).

A circular hole 1b is formed in the top wall 1a of the chamber 1, and the shower head 10 is fitted so as to project from the hole 1b into the chamber 1. _{The shower head 10 is for discharging WCl 6} gas, which is a film-forming raw material gas supplied from the gas supply mechanism 30 described later, into the chamber 1. In the upper part of the shower head 10, a first introduction path 11 for introducing _{WCl 6} gas and N ₂ gas as a purge gas, and a second introduction path 12 for introducing _{H 2} _{gas as a reducing gas and N 2} gas as a purge gas. And are provided.

Spaces

13 and 14 are provided in two upper and lower stages inside the shower head 10. A first introduction path 11 is connected to the upper space 13, and a first gas discharge path 15 extends from the space 13 to the bottom surface of the shower head 10. A second introduction path 12 is connected to the lower space 14, and a second gas discharge path 16 extends from the space 14 to the bottom surface of the shower head 10. That is, in the shower head 10, WCl ₆ _{gas as a film-forming raw material gas and H 2} gas as a reducing gas are independently discharged from the

discharge paths

15 and 16, respectively.

The bottom wall of the chamber 1 is provided with an exhaust chamber 21 that projects downward. An exhaust pipe 22 is connected to the side surface of the exhaust chamber 21, and an exhaust device 23 having a vacuum pump, a pressure control valve, or the like is connected to the exhaust pipe 22. By operating the exhaust device 23, it is possible to bring the inside of the chamber 1 into a predetermined decompression state.

The side wall of the chamber 1 is provided with an carry-in / out port 24 for carrying in / out the wafer W and a gate valve 25 for opening / closing the carry-in / out port 24. Further, a heater 26 is provided on the wall portion of the chamber 1, so that the temperature of the inner wall of the chamber 1 can be controlled during the film forming process.

The gas supply mechanism 30 has a raw material container 111 for accommodating _{WCl 6} , which is a film-forming raw material. WCl ₆ in the normal temperature is solid, WCl ₆ in the raw material container 111 is tungsten chloride as tungsten raw material is accommodated as a solid. A heater 31a is provided around the raw material container 111 to heat the film-forming raw material in the raw material container 111 to an appropriate temperature to sublimate _{WCl 6.} _{WCl 5} can also be used as the tungsten chloride. Even if WCl ₅ is used, the behavior is almost the same as _{that of WCl 6.}

A carrier gas pipe 32 for supplying _{N 2} gas, which is a carrier gas, is inserted into the raw material container 111 from above. N ₂ gas supply source 33 is connected to the carrier gas pipe 32. Further, the carrier gas pipe 32 is interposed with a mass flow controller 34 as a flow rate controller and valves 35 before and after the mass flow controller 34. Further, a raw material gas delivery pipe 111A serving as a raw material gas line is inserted into the raw material container 111 from above, and the other end of the raw material gas delivery pipe 111A is connected to the first introduction path 11 of the shower head 10. There is. A valve 37 is interposed in the raw material gas delivery pipe 111A. The raw material gas delivery pipe 111A is provided with a heater 38 for preventing condensation of _{WCl 6} gas, which is a film-forming raw material gas. _{Then, the WCl 6} gas sublimated in the raw material container 111 is _{conveyed by the N 2} gas (carrier N ₂ ) as the carrier gas, and is conveyed into the shower head 10 via the raw material gas delivery pipe 111A and the first introduction path 11. Be supplied. Further, the raw material gas delivery pipe 111A is, _{N 2} gas supply source 71 is connected for supplying the _{N 2} gas as a purge gas through a pipe 74 (the purge _{N 2).} A mass flow controller 72 as a flow rate controller and valves 73 before and after the mass flow controller 72 are interposed in the pipe 74. N ₂ gas from the N ₂ gas supply source 71 is used as a purge gas of the source gas line side.

The carrier gas pipe 32 and the raw material gas delivery pipe 111A are connected by a bypass pipe 48, and a valve 49 is interposed in the bypass pipe 48.

Valves

35a and 37a are interposed on the downstream side of the pipe 48 connection portion in the carrier gas pipe 32 and the raw material gas delivery pipe 111A, respectively. Then, the valve 35a, by opening the valve 49 closes the 37a, the _{N 2} gas from the _{N 2} gas supply source 33, a carrier gas pipe 32, through the bypass pipe 48, is possible to purge the feed gas delivery pipe 111A It is possible. As the carrier gas and the purge gas is not limited to N ₂ gas, it may be another inert gas such as Ar gas.

The second inlet channel 12 of the shower head 10 is connected a pipe 40 which is a H ₂ gas line, the pipe 40 includes a H ₂ gas supply source 42 for supplying H ₂ gas as a reducing gas, _{N 2} gas supply source 61 for supplying _{N 2} gas (purge _{N 2)} as purge gas via the pipe 64 is connected. Further, the pipe 40 is interposed with a mass flow controller 44 as a flow rate controller and valves 45 before and after the mass flow controller 44, and the pipe 64 is interposed with a mass flow controller 62 as a flow rate controller and valves 63 before and after the mass flow controller 62. _{N 2} gas from the N ₂ gas supply source 61 is used as a purge gas of the _{H 2} gas line side. The reducing gas is _{not limited to H 2} gas, but SiH ₄ gas, B ₂ H ₆ gas, and NH ₃ gas can also be used. Two or more of H ₂ gas, SiH ₄ gas, B ₂ H ₆ gas, and NH ₃ gas may be supplied. Further, other reducing gases other than these, such as PH ₃ gas and SiH ₂ Cl ₂ gas, may be used.

The MC160 controls each component of the film forming apparatus 100, specifically, a valve, a power supply, a heater, a pump, and the like. Each component of the film forming apparatus 100 is electrically connected to the MC 160 and controlled. The user interface of the MC160 is a keyboard that allows the operator to input commands to manage each component of the film forming apparatus 100, a display that visualizes and displays the operating status of each component of the film forming apparatus, and the like. be. Further, in the memory of the MC 160, a control program for realizing various processes executed by the film forming apparatus 100 and a control for causing each component of the film forming apparatus 100 to execute a predetermined process according to the processing conditions. Programs (processing recipes) and various databases are stored. The memory of the MC160 is a ROM or an HDD.

When the MC160 calls a predetermined processing recipe from the memory and executes it according to an instruction from the user interface as necessary, the film forming apparatus 100 performs a desired film forming process under the control of the MC160.

Specifically, the MC 160 opens the gate valve 25, carries the wafer W into the chamber 1 by a transfer device (not shown) via the carry-in outlet 24, and puts the wafer W on the susceptor 2 heated to a predetermined temperature by the heater 5. Place it. After depressurizing to a predetermined degree of vacuum, a tungsten film is formed by a CVD (Chemical Vapor Deposition) method or an ALD (Atomic Layer Deposition) method. As the wafer W, for example, a wafer in which a barrier metal film (for example, TiN film or TiSiN film) is formed as a base film on the surface of a thermal oxide film or the surface of an interlayer insulating film having recesses such as trenches and holes can be used. can. The tungsten film can be easily formed by using a TiN film or a TiSiN film as a base film. However, the base film is not limited to this.

Although the embodiment of the film forming apparatus according to the present disclosure has been described above, the present disclosure is not limited to the above embodiment and the like. Within the scope of the claims, various changes, modifications, replacements, additions, deletions, and combinations are possible. Of course, they also belong to the technical scope of the present disclosure.

This international application claims priority based on Japanese Patent Application No. 2020-051463 filed on March 23, 2020, the entire contents of which are incorporated in this international application by reference here. Shall be.

100 Film forming equipment 110

Raw material storage

120A, 120B connector 160 MC
170 valve 180 alarm

Claims

A solid raw material container that houses a solid raw material for film formation,
With a plurality of terminals mechanically connected to the solid raw material container and capable of changing the electrical state,
A control unit that detects the electrical state of the plurality of terminals and determines the type of the solid raw material based on the detected electrical state.
Including a film forming apparatus.
Prior to the film forming process using the predetermined solid raw material, the control unit determines that the detected electrical state of the plurality of terminals of the plurality of terminals corresponds to the predetermined solid raw material. The film forming apparatus according to claim 1, which issues an alarm when the state is different from the electrical state.
When the detected electrical state of the plurality of terminals is different from the electrical state of the plurality of terminals corresponding to the predetermined solid raw material, the control unit further obtains the solid raw material container. The film forming apparatus according to claim 2, wherein the valve of the raw material supply line connected to is held in a closed state.
Prior to the film forming process using the predetermined solid raw material, the control unit determines that the detected electrical state of the plurality of terminals of the plurality of terminals corresponds to the predetermined solid raw material. The film forming apparatus according to claim 1, wherein the valve of the raw material supply line connected to the solid raw material container is held in a closed state when the state is different from the electrical state.
The control unit further issues an alarm when the detected electrical state of the plurality of terminals is different from the electrical state of the plurality of terminals corresponding to the predetermined solid raw material. The film forming apparatus according to claim 4.
The film forming apparatus according to any one of claims 1 to 5, wherein the electrical state of the plurality of terminals is a unique state corresponding to the type of the solid raw material.
The film forming apparatus according to any one of claims 1 to 6, wherein the electrical state of the plurality of terminals is a state in which at least two of the plurality of terminals are short-circuited.
The film forming apparatus according to any one of claims 1 to 7, further comprising an electrical connection unit that electrically connects the plurality of terminals and the control unit.