WO2021189818A1 - Temperature measurement device for flowing working medium in micro-channel and calculation method for thickness of thermal insulation layer - Google Patents

Temperature measurement device for flowing working medium in micro-channel and calculation method for thickness of thermal insulation layer Download PDF

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WO2021189818A1
WO2021189818A1 PCT/CN2020/120947 CN2020120947W WO2021189818A1 WO 2021189818 A1 WO2021189818 A1 WO 2021189818A1 CN 2020120947 W CN2020120947 W CN 2020120947W WO 2021189818 A1 WO2021189818 A1 WO 2021189818A1
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Prior art keywords
microchannel
insulation layer
temperature
thermocouple
thermal insulation
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PCT/CN2020/120947
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French (fr)
Chinese (zh)
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刘纳
孟祥丰
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青岛理工大学
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    • GPHYSICS
    • G01MEASURING; TESTING
    • G01DMEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
    • G01D21/00Measuring or testing not otherwise provided for
    • G01D21/02Measuring two or more variables by means not covered by a single other subclass

Definitions

  • the invention belongs to the field of physical measurement, and specifically relates to a temperature measuring device for a flowing working fluid in a microchannel and a method for calculating the thickness of an insulating layer.
  • Micro-channel heat exchanger refers to a heat exchanger with a channel equivalent diameter of 10-2000 ⁇ m.
  • micro-channel heat exchangers have a broad range of applications in the fields of chip heat dissipation, aerospace, HVAC, fuel cells, natural gas liquefaction, etc. due to their high heat exchange efficiency, compact structure, and easy modularization. Application prospects.
  • Non-contact temperature measurement methods such as infrared temperature measurement, whose measurement accuracy cannot meet the requirements
  • the purpose of the present invention is to provide a temperature measuring device for a flowing working fluid in a microchannel and a method for calculating the thickness of an insulating layer. problem.
  • the technical solution of the present invention provides a temperature measuring device for flowing working fluid in a microchannel, including:
  • the thermal insulation layer arranged on the outer side of the microchannel measurement section
  • the outer protective layer covering the outer side of the thermal insulation layer
  • Thermocouple used to measure the temperature of the measurement section of the microchannel
  • thermocouple the temperature display terminal connected to the thermocouple
  • thermocouple is arranged between the thermal insulation layer and the microchannel, and the thermocouple is attached to the surface of the temperature measurement section of the microchannel; the inner side of the thermal insulation layer is closely attached to the microchannel, and the thermocouple is completely wrapped in the thermal insulation Layer
  • the outer diameter d2 of the thermal insulation layer is greater than or equal to the length L of the temperature measuring section of the microchannel.
  • the thermal insulation layer is made of nano-silica aerogel; the thermal insulation layer is cylindrical.
  • thermocouple is welded to the microchannel temperature measuring section; the thermocouple is directly in contact with the thermal insulation layer.
  • thermocouple is fixed to the temperature measurement section of the microchannel through a thermocouple patch; the outer layer of the thermocouple is covered with a thermocouple patch; the outside of the thermocouple patch is covered with an insulation layer .
  • the technical solution of the present invention also provides a method for calculating the thickness of the insulation layer, which includes the following steps:
  • the thickness of the thermal insulation layer is determined according to the difference between the temperature of the fluid in the microchannel and the temperature of the outer surface of the microchannel.
  • the heat dissipation per unit length is composed of the sum of the convective heat exchange and the radiative heat exchange between the outer surface of the outer protective layer and the environment.
  • the difference ⁇ t between the temperature of the fluid in the microchannel and the temperature of the outer surface of the microchannel is calculated to be less than 0.5°C.
  • the outer surface of the microchannel is also the outer surface of the thermal insulation layer.
  • an insulating layer is used to compensate for the temperature loss caused by the heat dissipation of the microchannel, and the temperature of the flowing working fluid in the microchannel can be indirectly measured by measuring the outside of the microchannel, which solves the problem of the traditional temperature measurement method. The problem that the temperature measuring element cannot extend into the microchannel.
  • thermocouple with high measurement accuracy is used. Compared with non-contact temperature measurement methods such as infrared temperature measurement, the temperature measurement accuracy is high, and the requirement for temperature measurement accuracy in the microchannel heat exchange test is solved. .
  • the adopted temperature measurement method has no requirement on the material of the microchannel, has a wide application range, has a simple overall structure, low cost, and reliable performance.
  • Figure 1 is a perspective view of the present invention according to one or more embodiments
  • Figure 2 is a radial cross-sectional view of the present invention according to one or more embodiments
  • Figure 3 is an axial cross-sectional view of the present invention according to one or more embodiments
  • Fig. 4 is a graph of operating conditions according to one or more embodiments of the present invention.
  • Fig. 5 is an error diagram under an 85mm thick insulation layer according to one or more embodiments of the present invention.
  • the purpose of the present invention is to provide a temperature measuring device for the flowing working fluid in the microchannel and a method for calculating the thickness of the insulation layer, which can solve the current problems in the channel.
  • the temperature measurement method has insufficient problems, which will be described below in conjunction with the embodiments and the drawings of the specification.
  • a temperature measuring device for a flowing working fluid in a microchannel includes a thermocouple 5, an insulation layer 2 and an outer protective layer 3.
  • the thermocouple 5 is used for pasting Attached to the surface of the microchannel temperature measuring section 1, the thermal insulation layer 2 is wrapped on the outside of the microchannel temperature measurement section and the thermocouple 5, and the outer sheath 3 is wound on the outside of the thermal insulation layer 2; wherein, the outer diameter d2 of the thermal insulation layer 2 is greater than or equal to The length L of the temperature measuring section 1 of the microchannel.
  • the temperature measurement device of this embodiment is applied to measure the temperature of the flowing medium in the microchannel.
  • the heat is forcibly blocked in the thermal insulation layer 2 of the microchannel measurement section for indirect measurement.
  • the temperature of the flowing working fluid in the microchannel due to the physical properties of the microchannel, it can conduct heat quickly, so the pipe wall of the microchannel can be used as a heat-conducting element to guide the heat of the flowing working fluid inside the microchannel to the outside of the microchannel for measurement.
  • the temperature obtained in this way is less likely to destroy the flow state of the internal flowing working fluid than in the prior art, and the temperature measurement of the thermocouple 5 is more accurate than the infrared temperature measurement.
  • the temperature measurement system of the present invention does not require any personnel to participate.
  • the temperature can be obtained and output by the temperature measuring device in real time, which improves the timeliness of temperature detection.
  • multiple devices described in this embodiment can be set on the microchannel to detect the temperature at different locations and record these temperatures; After the fluid working fluid inside is replaced, the temperature at each detection point can be continuously detected, and these temperatures can be compared with the above-mentioned temperatures.
  • the use method can be performed through the server without manual judgment.
  • Figures 1 to 3 show the positional relationship between the thermal insulation layer 2, the thermocouple 5 and the thermocouple 5 patch 4.
  • the position of the thermocouple 5 is fixed.
  • the thermal insulation in this embodiment Layer 2 is cylindrical.
  • the central axis of the thermal insulation layer 2 coincides with the central axis of the microchannel; when a section of microchannel is equipped with multiple temperature measuring devices, multiple temperature measuring devices They are independent of each other to comply with the principle of rapid heat exchange in microchannels.
  • detection points a and b can be set at two different positions of the microchannel, and the distance between detection points a and b is greater than L, so that the liquid working medium is For heat loss after a certain distance, the parameters of the temperature measuring devices set at detection points a and b are exactly the same, and the measured temperatures are recorded separately.
  • the detection points a and b can be set at two different positions of the microchannel, and the distance between the detection points a and b is greater than L, so that the liquid After a certain distance, the temperature measurement device parameters set at detection points a and b are exactly the same. After using the A mobile working fluid for testing, record the measured temperatures at points a and b respectively; Then replace the B flowing working fluid to perform a yes test, and record the measured temperatures at points a and b respectively.
  • the thermal insulation layer 2 in this embodiment is made of nano-silica aerogel and nano-silica aerogel.
  • the composition of nano-silica aerogel is Similar to glass, it begins to melt above 1200 degrees Celsius.
  • the thermal conductivity and refractive index are also very low, so the silica aerogel material used in this embodiment can ensure the heat preservation effect.
  • the aerogel material when used for heat preservation, it is necessary to customize the shape of the silica aerogel to be cylindrical.
  • silica aerogel when silica aerogel is used as a thermal insulation material, it essentially relies on its internal nano-grid-like cavities to prevent thermal insulation, so it maintains its original state and can ensure the physical properties of the internal voids. Shape to avoid affecting its thermal insulation performance.
  • the thermocouple 5 is welded or adhered to the surface of the temperature measuring section 1 of the microchannel.
  • the microchannel is made of non-metallic material.
  • the metal microchannel is attached by spot welding; regardless of the attachment method, in order to achieve measurement accuracy, it is required that the thermoelectrode must be firmly attached to the outer surface of the microchannel.
  • thermocouple 5 converts the temperature signal into a thermoelectromotive force signal, which is converted into the temperature of the measured medium through an electrical instrument (secondary instrument) or a server, so the thermocouple 5 in this embodiment is also connected to an electrical instrument or server , To visually display and record the temperature.
  • thermocouple 5 in this embodiment needs to be close to the surface of the microchannel, so it uses a fixtureless thermocouple 5 to be close to the surface of the microchannel.
  • the thermocouple 5 is connected to an electrical instrument or server through a lead wire.
  • thermocouple 5 is located between the insulation layer 2 and the microchannel. Therefore, the lead wires need to be led out from the end of the insulation layer 2 or pass through the insulation layer 2.
  • the outer protective layer 3 adopts aluminum foil tape, which can reflect the heat radiated by the thermal insulation layer 2.
  • thermocouple 5 adopts one or more of S, B, E, K, R, J, and T models.
  • This embodiment discloses a method for calculating the thickness of the thermal insulation layer 2, which includes the following steps:
  • the thickness of the thermal insulation layer 2 is determined according to the difference between the temperature of the fluid in the microchannel and the temperature of the outer surface of the microchannel.
  • the heat dissipation per unit length is composed of the sum of the convective heat exchange and radiation heat exchange between the outer surface of the outer protective layer 3 and the environment.
  • the difference ⁇ t between the temperature of the fluid in the microchannel and the temperature of the outer surface of the microchannel is calculated to be less than 0.5°C.
  • the outer surface of the microchannel is also the outer surface of the thermal insulation layer 2.
  • the heat dissipation per unit length is composed of the sum of the convective heat exchange and radiation heat exchange between the outer surface of the outer protective layer 3 and the environment.
  • Q is the heat exchanged between the solid surface and the fluid per unit area in a unit time, called the heat flux density, in W/m 2 ;
  • t w and t fa are the temperature of solid surface and fluid, respectively, in K;
  • ⁇ d 3 is the wall surface area per unit length, in m 2 ;
  • Q is the heat transfer amount on area A per unit time, unit W;
  • h 0 is called the surface convective heat transfer coefficient, the unit is W/(m 2 ⁇ K).
  • C 0 is the mass specific heat of the flowing medium in the barrel
  • is the emissivity
  • d 1 is the outer diameter of the microchannel
  • d 2 is the outer diameter of the insulation layer 2
  • d 3 is the outer diameter of the outer sheath 3
  • h i is the convective heat transfer coefficient between the fluid in the microchannel and the wall
  • d i is the inner diameter of the microchannel
  • is the thermal conductivity of each layer of material.
  • the outer surface temperature t w1 of the microchannel can be calculated by the following formula.
  • the size of ⁇ t is mainly determined by the thickness of the insulation layer 2 ⁇ 2, and the thickness of the insulation layer 2 is calculated as follows:
  • ⁇ t By adjusting the thickness of the thermal insulation layer 2, ⁇ t can be reduced to an acceptable range.
  • the measurement error of the thermocouple 5 for temperature measurement is 0.5 °C, so reducing ⁇ t to below 0.5 °C can meet the accuracy requirements .
  • a micro-channel aluminum tube with an inner diameter of 0.5 mm is taken as an example, and the measurement errors of several typical working conditions as shown in Fig. 4 are calculated as a function of the insulation thickness, and under the insulation thickness of 85 mm, the different fluids shown in Fig. 5 Temperature measurement error. It can be seen that the temperature measurement method of the present invention can have higher measurement accuracy in a larger temperature measurement range.

Abstract

A temperature measurement device for a flowing working medium in a micro-channel, comprising a thermal insulation layer (2) provided at the outer side of a micro-channel measurement section (1); an outer protective layer (3) wrapping the outer side of the thermal insulation layer (2); a thermocouple (5) used for measuring the temperature of the micro-channel measurement section (1); and a temperature display terminal connected to the thermocouple (5), wherein the thermocouple (5) is provided between the thermal insulation layer (2) and a micro-channel, and is attached to the surface of the micro-channel temperature measurement section (1); the inner side of the thermal insulation layer (2) is tightly attached to the micro-channel, the thermocouple (5) is completely wrapped in the thermal insulation layer (2); and the outer diameter d2 of the thermal insulation layer (2) is greater than or equal to the length L of the micro-channel temperature measurement section (1). The problem that the existing methods for measuring the temperature in the micro-channel have defects can be solved. Further disclosed is a calculation method for the thickness of the thermal insulation layer (2).

Description

一种微通道内流动工质的测温装置及保温层厚度计算方法Temperature measuring device for flowing working fluid in microchannel and calculation method of insulation layer thickness 技术领域Technical field
本发明属于物理测量领域,具体的,涉及一种微通道内流动工质的测温装置及保温层厚度计算方法。The invention belongs to the field of physical measurement, and specifically relates to a temperature measuring device for a flowing working fluid in a microchannel and a method for calculating the thickness of an insulating layer.
背景技术Background technique
这里的陈述仅提供与本发明相关的背景技术,而不必然地构成现有技术。The statements here only provide background art related to the present invention, and do not necessarily constitute prior art.
微通道换热器系指通道当量直径在10~2000μm的换热器。作为一种新兴的换热技术,微通道换热器凭借其换热高效、结构紧凑、便于实现模块化等优点,在芯片散热、航空航天、暖通空调、燃料电池、天然气液化等领域有广阔的应用前景。Micro-channel heat exchanger refers to a heat exchanger with a channel equivalent diameter of 10-2000μm. As an emerging heat exchange technology, micro-channel heat exchangers have a broad range of applications in the fields of chip heat dissipation, aerospace, HVAC, fuel cells, natural gas liquefaction, etc. due to their high heat exchange efficiency, compact structure, and easy modularization. Application prospects.
但是,目前微通道换热器的研发和应用还存在诸多问题,尚需要进行大量的微通道流动、换热的基础性研究。在基础试验研究中,通道内工质温度参数测量的准确性是决定试验成败的关键。受通道尺寸的限制,传统的测温方式无法满足微通道内工质温度的测量,主要体现在以下几点:However, there are still many problems in the development and application of microchannel heat exchangers, and a lot of basic research on microchannel flow and heat exchange is still needed. In basic experimental research, the accuracy of measuring the temperature parameters of the working fluid in the channel is the key to the success or failure of the experiment. Limited by the size of the channel, the traditional temperature measurement method cannot meet the measurement of the working fluid temperature in the microchannel, which is mainly reflected in the following points:
(1)传统测温方式需要将测温元件伸入到流体中,这会对工质的流态产生扰动。(1) The traditional temperature measurement method needs to extend the temperature measurement element into the fluid, which will disturb the flow state of the working fluid.
(2)红外测温等非接触测温方式,其测量精度无法满足需求;(2) Non-contact temperature measurement methods such as infrared temperature measurement, whose measurement accuracy cannot meet the requirements;
(3)对于微通道试验,受通道直径限制,测温元件难以伸入到流体中。(3) For the microchannel test, limited by the diameter of the channel, it is difficult for the temperature measuring element to penetrate into the fluid.
发明内容Summary of the invention
针对现有技术存在的不足,本发明的目的是提供一种微通道内流动工质的测温装置及保温层厚度计算方法,该装置可以解决目前对为通道内进行测温的方法存在不足的问题。In view of the shortcomings of the prior art, the purpose of the present invention is to provide a temperature measuring device for a flowing working fluid in a microchannel and a method for calculating the thickness of an insulating layer. problem.
为了实现上述目的,本发明是通过如下的技术方案来实现:In order to achieve the above objectives, the present invention is achieved through the following technical solutions:
第一方面,本发明的技术方案提供了一微通道内流动工质的测温装置,包括,In the first aspect, the technical solution of the present invention provides a temperature measuring device for flowing working fluid in a microchannel, including:
设置于微通道测量段外侧的保温层;The thermal insulation layer arranged on the outer side of the microchannel measurement section;
包覆于保温层外侧的外护层;The outer protective layer covering the outer side of the thermal insulation layer;
用于测量微通道测量段温度的热电偶;Thermocouple used to measure the temperature of the measurement section of the microchannel;
以及,连接于热电偶的温度显示终端;And, the temperature display terminal connected to the thermocouple;
其中,热电偶设于保温层和微通道之间,热电偶贴附在微通道测温段表面;所述保温层的内侧与微通道紧密贴合,且所述热电偶完全包裹于所述保温层内;Wherein, a thermocouple is arranged between the thermal insulation layer and the microchannel, and the thermocouple is attached to the surface of the temperature measurement section of the microchannel; the inner side of the thermal insulation layer is closely attached to the microchannel, and the thermocouple is completely wrapped in the thermal insulation Layer
所述保温层的外径d2大于等于微通道测温段的长度L。The outer diameter d2 of the thermal insulation layer is greater than or equal to the length L of the temperature measuring section of the microchannel.
作为进一步的技术方案,所述保温层采用纳米二氧化硅气凝胶材质;所述保温层呈圆柱形。As a further technical solution, the thermal insulation layer is made of nano-silica aerogel; the thermal insulation layer is cylindrical.
作为进一步的技术方案,所述热电偶焊接于所述微通道测温段;所述热电偶直接与所述保温层接触。As a further technical solution, the thermocouple is welded to the microchannel temperature measuring section; the thermocouple is directly in contact with the thermal insulation layer.
作为进一步的技术方案,所述热电偶通过热电偶贴片粘接固定于所述微通道测温段;所述热电偶的外层包覆热电偶贴片;热电偶贴片外侧包覆保温层。As a further technical solution, the thermocouple is fixed to the temperature measurement section of the microchannel through a thermocouple patch; the outer layer of the thermocouple is covered with a thermocouple patch; the outside of the thermocouple patch is covered with an insulation layer .
第二方面,本发明的技术方案还提供了一种保温层厚度计算方法,包括以下步骤:In the second aspect, the technical solution of the present invention also provides a method for calculating the thickness of the insulation layer, which includes the following steps:
通过计算,确定微通道测温段的单位长度散热量;Through calculation, determine the heat dissipation per unit length of the microchannel temperature measurement section;
通过测量,确定微通道外表面温度;Determine the temperature of the outer surface of the microchannel through measurement;
通过计算,确定微通道内表面温度;Determine the inner surface temperature of the microchannel through calculation;
根据微通道内流体温度与微通道外表面温度的差值确定保温层的厚度。The thickness of the thermal insulation layer is determined according to the difference between the temperature of the fluid in the microchannel and the temperature of the outer surface of the microchannel.
作为进一步的技术方案,在确定微通道测温段的单位长度散热量时,单位长度散热量由外护层外表面与环境的对流换热和辐射换热之和构成。As a further technical solution, when determining the heat dissipation per unit length of the microchannel temperature measurement section, the heat dissipation per unit length is composed of the sum of the convective heat exchange and the radiative heat exchange between the outer surface of the outer protective layer and the environment.
作为进一步的技术方案,计算微通道内流体温度与微通道外表面温度的差值Δt小于0.5℃。As a further technical solution, the difference Δt between the temperature of the fluid in the microchannel and the temperature of the outer surface of the microchannel is calculated to be less than 0.5°C.
作为进一步的技术方案,所述微通道外表面也即保温层外表面。As a further technical solution, the outer surface of the microchannel is also the outer surface of the thermal insulation layer.
上述本发明的实施例的有益效果如下:The beneficial effects of the above-mentioned embodiments of the present invention are as follows:
1)本发明提供的技术方案中,采用保温层弥补微通道散热造成的温度损失,通过对微通道外侧进行测量即可间接测量微通道内的流动工质的温度,解决了传统测温方法中测温元件无法伸入到微通道内的难题。1) In the technical solution provided by the present invention, an insulating layer is used to compensate for the temperature loss caused by the heat dissipation of the microchannel, and the temperature of the flowing working fluid in the microchannel can be indirectly measured by measuring the outside of the microchannel, which solves the problem of the traditional temperature measurement method. The problem that the temperature measuring element cannot extend into the microchannel.
2)本发明提供的技术方案中,采用测量精度高的热电偶,与红外测温等非接触测温方法相比,测温精度高,解决了微通道换热试验中对测温精度的需求。2) In the technical solution provided by the present invention, a thermocouple with high measurement accuracy is used. Compared with non-contact temperature measurement methods such as infrared temperature measurement, the temperature measurement accuracy is high, and the requirement for temperature measurement accuracy in the microchannel heat exchange test is solved. .
3)本发明提供的技术方案中,所采用的测温方法对微通道材质无要求,适用范围广,整体结构简单,成本低,性能可靠。3) In the technical scheme provided by the present invention, the adopted temperature measurement method has no requirement on the material of the microchannel, has a wide application range, has a simple overall structure, low cost, and reliable performance.
附图说明Description of the drawings
构成本发明的一部分的说明书附图用来提供对本发明的进一步理解,本发明的示意性实施例及其说明用于解释本发明,并不构成对本发明的不当限定。The drawings of the specification forming a part of the present invention are used to provide a further understanding of the present invention. The exemplary embodiments and descriptions of the present invention are used to explain the present invention, and do not constitute an improper limitation of the present invention.
图1是本发明根据一个或多个实施方式的透视图,Figure 1 is a perspective view of the present invention according to one or more embodiments,
图2是本发明根据一个或多个实施方式的径向剖面图,Figure 2 is a radial cross-sectional view of the present invention according to one or more embodiments,
图3是本发明根据一个或多个实施方式的轴向剖面图,Figure 3 is an axial cross-sectional view of the present invention according to one or more embodiments,
图4是本发明根据一个或多个实施方式的工况曲线图,Fig. 4 is a graph of operating conditions according to one or more embodiments of the present invention,
图5是本发明根据一个或多个实施方式的85mm厚保温层下的误差图。Fig. 5 is an error diagram under an 85mm thick insulation layer according to one or more embodiments of the present invention.
图中:1-微通道测温段,2-保温层,3-外护层,4-热电偶贴片,5-热电偶。In the picture: 1-microchannel temperature measurement section, 2- insulation layer, 3- outer protective layer, 4-thermocouple patch, 5-thermocouple.
为显示各部位位置而夸大了互相间间距或尺寸,示意图仅作示意使用。In order to show the position of each part, the distance or size between each other is exaggerated, and the schematic diagram is only for illustration.
具体实施方式Detailed ways
应该指出,以下详细说明都是例示性的,旨在对本发明提供进一步的说明。除非另有指明,本发明使用的所有技术和科学术语具有与本发明所属技术领域的普通技术人员通常理解的相同含义。It should be noted that the following detailed descriptions are all illustrative and are intended to provide further descriptions of the present invention. Unless otherwise specified, all technical and scientific terms used in the present invention have the same meaning as commonly understood by those of ordinary skill in the technical field to which the present invention belongs.
需要注意的是,这里所使用的术语仅是为了描述具体实施方式,而非意图限制根据本发明的示例性实施方式。如在这里所使用的,除非本发明另外明确指出,否则单数形式也意图包括复数形式,此外,还应当理解的是,当在本说明书中使用术语“包含”和/或“包括”时,其指明存在特征、步骤、操作、器件、组件和/或它们的组合;It should be noted that the terms used here are only for describing specific embodiments, and are not intended to limit the exemplary embodiments according to the present invention. As used herein, unless the present invention clearly indicates otherwise, the singular form is also intended to include the plural form. In addition, it should also be understood that when the terms "comprising" and/or "including" are used in this specification, they Indicate the existence of features, steps, operations, devices, components, and/or combinations thereof;
为了方便叙述,本发明中如果出现“上”、“下”、“左”“右”字样,仅表示与附图本身的上、下、左、右方向一致,并不对结构起限定作用,仅仅是为了便于描述本发明和简化描述,而不是指示或暗示所指的设备或元件必须具有特定的方位,以特定的方位构造和操作,因此不能理解为对本发明的限制。For the convenience of description, if the words "up", "down", "left" and "right" appear in the present invention, they only indicate that they are consistent with the up, down, left, and right directions of the drawings themselves, and do not limit the structure, but only It is for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation of the present invention.
术语解释部分:本发明中的术语“安装”、“相连”、“连接”、“固定”等术语应做广义理解,例如,可以是固定连接,也可以是可拆卸连接,或为一体;可以是机械连接,也可以是电连接,可以是直接连接,也可以是通过中间媒介间接相连,可以是两个元件内部连接,或者两个元件的相互作用关系,对于本领域的普通技术人员而言,可以根据具体情况理解上述术语在本发明的具体含义。Term explanation part: The terms "installed", "connected", "connected", "fixed" and other terms in the present invention should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or a whole; It can be a mechanical connection, an electrical connection, a direct connection, or an indirect connection through an intermediate medium, an internal connection between two components, or an interaction relationship between two components. For those of ordinary skill in the art The specific meaning of the above terms in the present invention can be understood according to the specific situation.
正如背景技术所介绍的,针对现有技术存在的不足,本发明的目的是提供一种微通道内流动工质的测温装置及保温层厚度计算方法,该装置可以解决目前对 为通道内进行测温的方法存在不足的问题,以下结合实施例和说明书附图进行说明。As described in the background art, in view of the shortcomings of the prior art, the purpose of the present invention is to provide a temperature measuring device for the flowing working fluid in the microchannel and a method for calculating the thickness of the insulation layer, which can solve the current problems in the channel. The temperature measurement method has insufficient problems, which will be described below in conjunction with the embodiments and the drawings of the specification.
实施例1Example 1
本发明的一种典型的实施方式中,如图1所示,一种微通道内流动工质的测温装置,包括热电偶5、保温层2和外护层3,热电偶5用于贴附在微通道测温段1表面,保温层2包裹在微通道测温段和热电偶5外侧,外护层3缠绕在保温层2外侧;其中,所述保温层2的外径d2大于等于微通道测温段1的长度L。In a typical implementation of the present invention, as shown in FIG. 1, a temperature measuring device for a flowing working fluid in a microchannel includes a thermocouple 5, an insulation layer 2 and an outer protective layer 3. The thermocouple 5 is used for pasting Attached to the surface of the microchannel temperature measuring section 1, the thermal insulation layer 2 is wrapped on the outside of the microchannel temperature measurement section and the thermocouple 5, and the outer sheath 3 is wound on the outside of the thermal insulation layer 2; wherein, the outer diameter d2 of the thermal insulation layer 2 is greater than or equal to The length L of the temperature measuring section 1 of the microchannel.
本实施例的温度测量装置应用于测量微通道内流动介质的温度,通过在微通道测量段上设置保温层2,强制将热量封堵在的微通道测量段的保温层2内,以间接测量微通道内的流动工质的温度;由于微通道的物理性质,其可以快速导热,因此微通道的管道壁可以作为导热元件,将其内部的流动工质的热量引到微通道外部进行测量,这样得到的温度要比现有技术不易破环其内部流动工质的流动状态,而且热电偶5测温相较于的红外线测温更为精确,此外,本发明温度测量系统无需任何人员参与,可实时由测温装置获取温度并输出,提高了温度检测的及时性。The temperature measurement device of this embodiment is applied to measure the temperature of the flowing medium in the microchannel. By setting the thermal insulation layer 2 on the microchannel measurement section, the heat is forcibly blocked in the thermal insulation layer 2 of the microchannel measurement section for indirect measurement. The temperature of the flowing working fluid in the microchannel; due to the physical properties of the microchannel, it can conduct heat quickly, so the pipe wall of the microchannel can be used as a heat-conducting element to guide the heat of the flowing working fluid inside the microchannel to the outside of the microchannel for measurement. The temperature obtained in this way is less likely to destroy the flow state of the internal flowing working fluid than in the prior art, and the temperature measurement of the thermocouple 5 is more accurate than the infrared temperature measurement. In addition, the temperature measurement system of the present invention does not require any personnel to participate. The temperature can be obtained and output by the temperature measuring device in real time, which improves the timeliness of temperature detection.
本实施例在具体使用时,在微通道开始测量温度时,可通过在微通道上设置多个本实施例所述的装置,在不同的地点检测温度,并将这些温度记录;然后在微通道内的流动工质更换后,还可不断检测每个检测点处的温度,并将这些温度与上述温度相比较。所述的使用方法可以通过服务器进行,无需人工判断。In the specific use of this embodiment, when the microchannel starts to measure the temperature, multiple devices described in this embodiment can be set on the microchannel to detect the temperature at different locations and record these temperatures; After the fluid working fluid inside is replaced, the temperature at each detection point can be continuously detected, and these temperatures can be compared with the above-mentioned temperatures. The use method can be performed through the server without manual judgment.
图1~图3示出了保温层2、热电偶5与热电偶5贴片4间的位置关系,为了便于保温,热电偶5的位置是固定不变的,另外,本实施例中的保温层2呈圆柱形,为了保证保温层2能够紧密贴合微通道,保温层2的中轴线与微通道的中轴线重合;当一段微通道安装多个的测温装置时,多个测温装置分别独立,以符合微通道快速换热的原理。Figures 1 to 3 show the positional relationship between the thermal insulation layer 2, the thermocouple 5 and the thermocouple 5 patch 4. In order to facilitate thermal insulation, the position of the thermocouple 5 is fixed. In addition, the thermal insulation in this embodiment Layer 2 is cylindrical. In order to ensure that the thermal insulation layer 2 can closely fit the microchannel, the central axis of the thermal insulation layer 2 coincides with the central axis of the microchannel; when a section of microchannel is equipped with multiple temperature measuring devices, multiple temperature measuring devices They are independent of each other to comply with the principle of rapid heat exchange in microchannels.
例如,为了判断同一微通道上不同位置的温度的不同,可在该微通道的两个不同位置设置检测点a和b,检测点a和b之间的距离大于L,以使液态工质在经过一定的距离之后的产生热量损耗,检测点a和b处设置的测温装置参数完全相同,对其测量的温度分别记录。For example, in order to judge the difference in temperature at different positions on the same microchannel, detection points a and b can be set at two different positions of the microchannel, and the distance between detection points a and b is greater than L, so that the liquid working medium is For heat loss after a certain distance, the parameters of the temperature measuring devices set at detection points a and b are exactly the same, and the measured temperatures are recorded separately.
例如,为了判断同一微通道内不同流动工质的温度的不同,可在该微通道 的两个不同位置设置检测点a和b,检测点a和b之间的距离大于L,以使液态工质在经过一定的距离之后的产生热量损耗,检测点a和b处设置的测温装置参数完全相同,使用A流动工质进行测试后,对其测量的a、b两点的温度分别记录;然后更换B流动工质进行是测试,并对其测量的a、b两点的温度分别记录。For example, in order to judge the temperature difference of different working fluids in the same microchannel, the detection points a and b can be set at two different positions of the microchannel, and the distance between the detection points a and b is greater than L, so that the liquid After a certain distance, the temperature measurement device parameters set at detection points a and b are exactly the same. After using the A mobile working fluid for testing, record the measured temperatures at points a and b respectively; Then replace the B flowing working fluid to perform a yes test, and record the measured temperatures at points a and b respectively.
更加详细的是,本实施例中的保温层2采用纳米二氧化硅气凝胶材质,纳米二氧化硅气凝胶材质,本领域技术人员可以理解的是,纳米二氧化硅气凝胶的成分与玻璃相似,其在1200摄氏度以上开始融化。导热性和折射率也很低,因此本实施例中使用二氧化硅气凝胶材质能够的确保保温效果。In more detail, the thermal insulation layer 2 in this embodiment is made of nano-silica aerogel and nano-silica aerogel. Those skilled in the art can understand that the composition of nano-silica aerogel is Similar to glass, it begins to melt above 1200 degrees Celsius. The thermal conductivity and refractive index are also very low, so the silica aerogel material used in this embodiment can ensure the heat preservation effect.
更进一步的,在使用气凝胶材料进行保温时,需要定制二氧化硅气凝胶的外形形状为圆柱形。本领域技术人员可以理解的是,二氧化硅气凝胶作为保温材料使用时,本质上依靠其内部纳米网格状空洞进阻隔热量,因此保持其原始状态,可以的保证其内部的空洞的物理形态,避免影响其保温性能。Furthermore, when the aerogel material is used for heat preservation, it is necessary to customize the shape of the silica aerogel to be cylindrical. Those skilled in the art can understand that when silica aerogel is used as a thermal insulation material, it essentially relies on its internal nano-grid-like cavities to prevent thermal insulation, so it maintains its original state and can ensure the physical properties of the internal voids. Shape to avoid affecting its thermal insulation performance.
根据微通道的不同材质,所述热电偶5焊接或粘接于微通道测温段1表面,本实施例中,微通道采用的是非金属材质微通道,可采用耐高温胶带粘贴方式,在其他实施例中,对于金属材质微通道,采用点焊方式贴附;无论何种贴附方式,为达到测量精度,都要求热电极必须牢固贴合在微通道外表面。According to the different materials of the microchannel, the thermocouple 5 is welded or adhered to the surface of the temperature measuring section 1 of the microchannel. In this embodiment, the microchannel is made of non-metallic material. In the embodiment, the metal microchannel is attached by spot welding; regardless of the attachment method, in order to achieve measurement accuracy, it is required that the thermoelectrode must be firmly attached to the outer surface of the microchannel.
更进一步的,热电偶5把温度信号转换成热电动势信号,通过电气仪表(二次仪表)或者服务器转换成被测介质的温度,因此本实施例中的热电偶5还连接于电气仪表或者服务器,以直观显示、记录温度。Furthermore, the thermocouple 5 converts the temperature signal into a thermoelectromotive force signal, which is converted into the temperature of the measured medium through an electrical instrument (secondary instrument) or a server, so the thermocouple 5 in this embodiment is also connected to an electrical instrument or server , To visually display and record the temperature.
可以理解的是,本实施例中的热电偶5需要紧贴微通道的表面,因此其使用无固定装置式热电偶5紧贴于微通道表面。热电偶5通过引线连接电气仪表或服务器。It is understandable that the thermocouple 5 in this embodiment needs to be close to the surface of the microchannel, so it uses a fixtureless thermocouple 5 to be close to the surface of the microchannel. The thermocouple 5 is connected to an electrical instrument or server through a lead wire.
由于热电偶5位于保温层2和微通道之间。因此引线需要由保温层2的端部引出,或者穿过保温层2。Because the thermocouple 5 is located between the insulation layer 2 and the microchannel. Therefore, the lead wires need to be led out from the end of the insulation layer 2 or pass through the insulation layer 2.
所述外护层3采用铝箔胶带,其可以反射的保温层2发散的热量。The outer protective layer 3 adopts aluminum foil tape, which can reflect the heat radiated by the thermal insulation layer 2.
所述热电偶5采用S、B、E、K、R、J、T型号中的一种或几种。The thermocouple 5 adopts one or more of S, B, E, K, R, J, and T models.
实施例2Example 2
本实施例公开了一种保温层2厚度计算方法,包括以下步骤:This embodiment discloses a method for calculating the thickness of the thermal insulation layer 2, which includes the following steps:
通过计算,确定微通道测温段1的单位长度散热量;Through calculation, determine the heat dissipation per unit length of the microchannel temperature measurement section 1;
通过测量,确定微通道外表面温度;Determine the temperature of the outer surface of the microchannel through measurement;
通过计算,确定微通道内表面温度;Determine the inner surface temperature of the microchannel through calculation;
根据微通道内流体温度与微通道外表面温度的差值确定保温层2的厚度。The thickness of the thermal insulation layer 2 is determined according to the difference between the temperature of the fluid in the microchannel and the temperature of the outer surface of the microchannel.
在确定微通道测温段1的单位长度散热量时,单位长度散热量由外护层3外表面与环境的对流换热和辐射换热之和构成。When determining the heat dissipation per unit length of the microchannel temperature measuring section 1, the heat dissipation per unit length is composed of the sum of the convective heat exchange and radiation heat exchange between the outer surface of the outer protective layer 3 and the environment.
计算微通道内流体温度与微通道外表面温度的差值Δt小于0.5℃。The difference Δt between the temperature of the fluid in the microchannel and the temperature of the outer surface of the microchannel is calculated to be less than 0.5°C.
所述微通道外表面也即保温层2外表面。The outer surface of the microchannel is also the outer surface of the thermal insulation layer 2.
下面以一个具体的计算过程阐述上述计算过程:The following is a specific calculation process to illustrate the above calculation process:
(1)对于如图1所示的圆筒形结构,其单位长度散热量由外护层3外表面与环境的对流换热和辐射换热之和构成。(1) For the cylindrical structure shown in Fig. 1, the heat dissipation per unit length is composed of the sum of the convective heat exchange and radiation heat exchange between the outer surface of the outer protective layer 3 and the environment.
Figure PCTCN2020120947-appb-000001
Figure PCTCN2020120947-appb-000001
式中,Q为单位面积的固体表面与流体之间在单位时间内交换的热量,称作热流密度,单位W/m 2In the formula, Q is the heat exchanged between the solid surface and the fluid per unit area in a unit time, called the heat flux density, in W/m 2 ;
t w、t fa分别为固体表面和流体的温度,单位K; t w and t fa are the temperature of solid surface and fluid, respectively, in K;
πd 3为单位长度壁面面积,单位m 2πd 3 is the wall surface area per unit length, in m 2 ;
Q为单位时间内面积A上的传热热量,单位W;Q is the heat transfer amount on area A per unit time, unit W;
h 0称为表面对流传热系数,单位W/(m 2·K)。 h 0 is called the surface convective heat transfer coefficient, the unit is W/(m 2 ·K).
C 0为桶内流动介质质量比热; C 0 is the mass specific heat of the flowing medium in the barrel;
ε为发射率;ε is the emissivity;
(2)对于实施例1中的圆筒结构,其传热量又可以由下式计算得到。(2) For the cylindrical structure in Example 1, the heat transfer amount can be calculated by the following formula.
Figure PCTCN2020120947-appb-000002
Figure PCTCN2020120947-appb-000002
d 1为微通道外径,d 2为保温层2外径,d 3为外护层3外径,h i为微通道内流体与壁面之间的对流换热系数,d i为微通道内径,λ为各层材料的导热系数。 d 1 is the outer diameter of the microchannel, d 2 is the outer diameter of the insulation layer 2, d 3 is the outer diameter of the outer sheath 3, h i is the convective heat transfer coefficient between the fluid in the microchannel and the wall, and d i is the inner diameter of the microchannel , Λ is the thermal conductivity of each layer of material.
(3)对于微通道外表面温度t w1,可由下式计算得到。 (3) The outer surface temperature t w1 of the microchannel can be calculated by the following formula.
Figure PCTCN2020120947-appb-000003
Figure PCTCN2020120947-appb-000003
(4)联立上述(1)、(2)、(3)式,可计算得到微通道内流体温度与微 通道外表面温度的差值:(4) Combining the above equations (1), (2), (3), the difference between the temperature of the fluid in the microchannel and the temperature of the outer surface of the microchannel can be calculated:
Δt=t fi-t w1 Δt=t fi -t w1
(5)对于一个确定的实施例,Δt的大小主要由保温层2厚度δ2决定,保温层2厚度的计算如下:(5) For a certain embodiment, the size of Δt is mainly determined by the thickness of the insulation layer 2 δ2, and the thickness of the insulation layer 2 is calculated as follows:
Figure PCTCN2020120947-appb-000004
Figure PCTCN2020120947-appb-000004
通过调整保温层2厚度,可使Δt减小至可接受范围内,对于常规的试验装置,测温用热电偶5测量误差为0.5℃,因此使Δt减小至0.5℃以下即可满足精度需求。By adjusting the thickness of the thermal insulation layer 2, Δt can be reduced to an acceptable range. For conventional test equipment, the measurement error of the thermocouple 5 for temperature measurement is 0.5 ℃, so reducing Δt to below 0.5 ℃ can meet the accuracy requirements .
本实施例以内径0.5mm微通道铝管为例,计算得到如图4所示的几种典型工况测量误差随保温厚度的变化曲线,以及85mm保温厚度下,如图5所示的不同流体温度的测量误差。可以看出,本发明的测温方法可以在较大的测温范围内具有较高的测量精度。In this embodiment, a micro-channel aluminum tube with an inner diameter of 0.5 mm is taken as an example, and the measurement errors of several typical working conditions as shown in Fig. 4 are calculated as a function of the insulation thickness, and under the insulation thickness of 85 mm, the different fluids shown in Fig. 5 Temperature measurement error. It can be seen that the temperature measurement method of the present invention can have higher measurement accuracy in a larger temperature measurement range.
以上所述仅为本发明的优选实施例而已,并不用于限制本发明,对于本领域的技术人员来说,本发明可以有各种更改和变化。凡在本发明的精神和原则之内,所作的任何修改、等同替换、改进等,均应包含在本发明的保护范围之内。The above descriptions are only preferred embodiments of the present invention and are not used to limit the present invention. For those skilled in the art, the present invention can have various modifications and changes. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims (10)

  1. 一种微通道内流动工质的测温装置,其特征在于,包括,A temperature measuring device for flowing working fluid in a microchannel, which is characterized in that it comprises:
    设置于微通道测量段外侧的保温层;The thermal insulation layer arranged on the outer side of the microchannel measurement section;
    包覆于保温层外侧的外护层;The outer protective layer covering the outer side of the thermal insulation layer;
    用于测量微通道测量段温度的热电偶;Thermocouple used to measure the temperature of the measurement section of the microchannel;
    以及,连接于热电偶的温度显示终端;And, the temperature display terminal connected to the thermocouple;
    其中,热电偶设于保温层和微通道之间,热电偶贴附在微通道测温段表面;所述保温层的内侧与微通道紧密贴合,且所述热电偶完全包裹于所述保温层内;Wherein, the thermocouple is arranged between the thermal insulation layer and the microchannel, and the thermocouple is attached to the surface of the temperature measurement section of the microchannel; the inner side of the thermal insulation layer is closely attached to the microchannel, and the thermocouple is completely wrapped in the thermal insulation Layer
    所述保温层的外径d2大于等于微通道测温段的长度L。The outer diameter d2 of the thermal insulation layer is greater than or equal to the length L of the temperature measuring section of the microchannel.
  2. 根据权利要求1所述的一种微通道内流动工质的测温装置,其特征在于,所述保温层采用纳米二氧化硅气凝胶材质;所述保温层呈圆柱形。The temperature measuring device for the flowing working fluid in the microchannel according to claim 1, wherein the thermal insulation layer is made of nano-silica aerogel; the thermal insulation layer is cylindrical.
  3. 根据权利要求1所述的一种微通道内流动工质的测温装置,其特征在于,所述热电偶焊接于所述微通道测温段;所述热电偶直接与所述保温层接触。The temperature measuring device for the flowing working fluid in the microchannel according to claim 1, wherein the thermocouple is welded to the temperature measuring section of the microchannel; the thermocouple is directly in contact with the thermal insulation layer.
  4. 根据权利要求1所述的一种微通道内流动工质的测温装置,其特征在于,所述热电偶通过热电偶贴片粘接固定于所述微通道测温段;所述热电偶的外侧包覆热电偶贴片,热电偶贴片外侧包覆保温层。The temperature measuring device for the flowing working fluid in the microchannel according to claim 1, wherein the thermocouple is fixed to the temperature measuring section of the microchannel through a thermocouple patch; The thermocouple patch is covered on the outside, and the thermocouple patch is covered with an insulation layer.
  5. 根据权利要求1所述的一种微通道内流动工质的测温装置,其特征在于,所述热电偶包括多个,多个热电偶分布于微通道测温段表面。The temperature measuring device for a flowing working fluid in a microchannel according to claim 1, wherein the thermocouple comprises a plurality of thermocouples distributed on the surface of the temperature measuring section of the microchannel.
  6. 根据权利要求5所述的一种微通道内流动工质的测温装置,其特征在于,所述保温层包括多个,每个热电偶的外侧均包覆一个保温层。A temperature measuring device for a flowing working fluid in a microchannel according to claim 5, wherein the heat preservation layer comprises a plurality of heat preservation layers, and the outer side of each thermocouple is covered with a heat preservation layer.
  7. 根据权利要求1所述的一种微通道内流动工质的测温装置,其特征在于,所述外护层采用铝箔胶带。The temperature measuring device for the flowing working fluid in the microchannel according to claim 1, wherein the outer protective layer is made of aluminum foil tape.
  8. 一种保温层厚度计算方法,其特征在于,包括以下步骤:A method for calculating the thickness of an insulation layer is characterized in that it comprises the following steps:
    通过计算,确定微通道测温段的单位长度散热量;Through calculation, determine the heat dissipation per unit length of the microchannel temperature measurement section;
    通过测量,确定微通道外表面温度;Determine the temperature of the outer surface of the microchannel through measurement;
    通过计算,确定微通道内表面温度;Determine the inner surface temperature of the microchannel through calculation;
    根据保温层外表面温度与微通道外表面温度的差值确定保温层的厚度。The thickness of the insulation layer is determined according to the difference between the temperature of the outer surface of the insulation layer and the temperature of the outer surface of the microchannel.
  9. 如权利要求8所述的一种保温层厚度计算方法,其特征在于,在确定微通道测温段的单位长度散热量时,单位长度散热量由外护层外表面与环境的对流换热和辐射换热之和构成。The method for calculating the thickness of the thermal insulation layer according to claim 8, wherein when determining the heat dissipation per unit length of the microchannel temperature measuring section, the heat dissipation per unit length is determined by the convective heat transfer between the outer surface of the outer protective layer and the environment. The sum of radiation heat transfer.
  10. 根据权利要求8所述的一种保温层厚度计算方法,其特征在于,所述保温层外表面温度与微通道外表面温度的差值Δt小于0.5℃。The method for calculating the thickness of an insulation layer according to claim 8, wherein the difference Δt between the temperature of the outer surface of the insulation layer and the temperature of the outer surface of the microchannel is less than 0.5°C.
PCT/CN2020/120947 2020-03-26 2020-10-14 Temperature measurement device for flowing working medium in micro-channel and calculation method for thickness of thermal insulation layer WO2021189818A1 (en)

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Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111272229A (en) * 2020-03-26 2020-06-12 青岛理工大学 Temperature measuring device for flowing working medium in microchannel and thickness calculation method for heat-insulating layer
CN116108640B (en) * 2022-12-28 2023-09-19 南京苏夏设计集团股份有限公司 Steam pipe network temperature drop calculation method, storage medium and equipment

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103292923A (en) * 2013-06-07 2013-09-11 华陆工程科技有限责任公司 Novel temperature measuring method for materials in rotary furnace
CN104931525A (en) * 2015-05-19 2015-09-23 缪文韬 Real-time online distributive monitoring method and system of efficiency of insulating layer
CN204831595U (en) * 2015-07-02 2015-12-02 中国石油天然气股份有限公司 SMD temperature transmitter of digital display
CN106248728A (en) * 2016-07-26 2016-12-21 中国核动力研究设计院 Experiment of Thermophysics thermal balance environment automaton and control method thereof
US20170191879A1 (en) * 2015-12-30 2017-07-06 Applied Electronic Materials, LLC Temperature sensors with integrated sensing components
CN109506796A (en) * 2018-12-19 2019-03-22 武汉理工光科股份有限公司 Pipeline contactless temperature-measuring system out of the station based on narrowband technology of Internet of things
CN109974869A (en) * 2017-12-27 2019-07-05 核动力运行研究所 A kind of metal outer wall temperature measurement device
CN110578848A (en) * 2019-09-16 2019-12-17 中国化学工程第六建设有限公司 Electric tracing step-by-step installation construction method for chemical pipeline
CN111272229A (en) * 2020-03-26 2020-06-12 青岛理工大学 Temperature measuring device for flowing working medium in microchannel and thickness calculation method for heat-insulating layer

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103292923A (en) * 2013-06-07 2013-09-11 华陆工程科技有限责任公司 Novel temperature measuring method for materials in rotary furnace
CN104931525A (en) * 2015-05-19 2015-09-23 缪文韬 Real-time online distributive monitoring method and system of efficiency of insulating layer
CN204831595U (en) * 2015-07-02 2015-12-02 中国石油天然气股份有限公司 SMD temperature transmitter of digital display
US20170191879A1 (en) * 2015-12-30 2017-07-06 Applied Electronic Materials, LLC Temperature sensors with integrated sensing components
CN106248728A (en) * 2016-07-26 2016-12-21 中国核动力研究设计院 Experiment of Thermophysics thermal balance environment automaton and control method thereof
CN109974869A (en) * 2017-12-27 2019-07-05 核动力运行研究所 A kind of metal outer wall temperature measurement device
CN109506796A (en) * 2018-12-19 2019-03-22 武汉理工光科股份有限公司 Pipeline contactless temperature-measuring system out of the station based on narrowband technology of Internet of things
CN110578848A (en) * 2019-09-16 2019-12-17 中国化学工程第六建设有限公司 Electric tracing step-by-step installation construction method for chemical pipeline
CN111272229A (en) * 2020-03-26 2020-06-12 青岛理工大学 Temperature measuring device for flowing working medium in microchannel and thickness calculation method for heat-insulating layer

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